Multilayer Capacitor

Abstract

To provide a multilayer capacitor.SOLUTION: In one embodiment of the present invention, a multilayer capacitor includes a main body including a multilayer structure including a plurality of dielectric layers and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween, and external electrodes formed outside the main body and connected to the internal electrodes. The main body includes a first surface and a second surface facing each other in a first direction with the internal electrodes exposed, a third surface and a fourth surface facing each other in a second direction corresponding to a direction where the dielectric layers are stacked, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first and second directions. At least a part of the internal electrodes includes a first bottle neck structure in which an external region in the third direction is shorter in the first direction than an internal region, and a second bottle neck structure in which the external region in the first direction is shorter in the third direction than the internal region.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a multilayer capacitor. [Background technology]

[0002] A capacitor is an element that can store electricity, and basically works by placing two electrodes facing each other and applying a voltage to each electrode, which accumulates electricity. When a DC voltage is applied, current flows inside the capacitor as electricity is stored, but once the storage is complete, the current stops. On the other hand, when an AC voltage is applied, the polarity of the electrodes alternates and an AC current flows.

[0003] Depending on the type of insulator provided between the electrodes, such capacitors can be classified into various types, such as aluminum electrolytic capacitors in which electrodes are made of aluminum and a thin oxide film is provided between the aluminum electrodes, tantalum capacitors using tantalum as an electrode material, ceramic capacitors using a high dielectric constant dielectric such as barium titanium between the electrodes, multi-layer ceramic capacitors (MLCCs) using high dielectric constant ceramics as a multi-layer structure as a dielectric provided between the electrodes, and film capacitors using a polystyrene film as a dielectric between the electrodes.

[0004] Among them, multilayer ceramic capacitors have the advantages of being excellent in temperature characteristics and frequency characteristics and being possible to realize in a small size, and therefore in recent years have been widely applied in various fields such as high-frequency circuits. In recent years, in order to realize even smaller multilayer ceramic capacitors, attempts have been made to form thinner dielectric layers and internal electrodes.

[0005] Meanwhile, in recent years, in the field of multilayer capacitors, many attempts have been made to improve the moisture resistance reliability and reduce cracks caused by stresses that occur during mounting on a substrate. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a multilayer capacitor that can improve reliability against external influences (for example, moisture resistance reliability).

[0007] An object of the present invention is to provide a multilayer capacitor that reduces cracks during mounting on a substrate or the like and has improved structural stability. [Means for solving the problem]

[0008] As a method for solving the above-mentioned problems, the present invention proposes a new structure of a multilayer capacitor by way of example. Specifically, the multilayer capacitor includes a body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the dielectric layers sandwiched therebetween, and an external electrode formed outside the body and connected to the internal electrodes, the body includes a first surface and a second surface on which the plurality of internal electrodes are exposed and facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction which is a lamination direction of the plurality of dielectric layers, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first and second directions, and at least some of the plurality of internal electrodes include a first bottleneck structure in which an outer region in the third direction is shorter in length in the first direction than an inner region, and a second bottleneck structure in which the outer region in the first direction is shorter in length in the third direction than the inner region.

[0009] In one embodiment, the first and second bottleneck structures are connected to each other, and an outer surface of the first bottleneck structure and an outer surface of the second bottleneck structure may be discontinuous.

[0010] In one embodiment, the second bottleneck structure may be connected to the external electrode.

[0011] In one embodiment, the first bottleneck structure may be recessed into the main body in the first direction, and the second bottleneck structure may be recessed into the main body in the third direction.

[0012] In one embodiment, outer surfaces of the first and second bottleneck structures may include planes inclined relative to the first and third surfaces.

[0013] In an embodiment, the first bottleneck structure may have a shape in which a length in the first direction decreases toward an outer side of the body in the third direction.

[0014] In an embodiment, the second bottleneck structure may have a shape in which a length in the third direction decreases toward an outer side of the body in the first direction.

[0015] In an embodiment, the first bottleneck structure may be formed in both a region adjacent to the first surface and a region adjacent to the second surface of the internal electrode.

[0016] In one embodiment, the first bottleneck structure may have a portion formed in an area adjacent to the first surface and a portion formed in an area adjacent to the second surface that have different shapes.

[0017] In an embodiment, the second bottleneck structure may be formed in both a region adjacent to the fifth surface and a region adjacent to the sixth surface of the internal electrode.

[0018] In one embodiment, the first and second bottleneck structures may be connected to each other, and a connection portion thereof may overlap the external electrode in the third direction.

[0019] In an embodiment, the first bottleneck structure may have a flat portion in the internal electrode, the flat portion having a constant length in the third direction.

[0020] In one embodiment, the flat portion may be coupled to the second bottleneck structure.

[0021] In an embodiment, the flat portion may form an outermost surface of the internal electrode in the third direction.

[0022] In one embodiment, in the first bottleneck structure, when the length in the first direction connecting the flat portion and the second bottleneck structure is C and the length of the main body in the first direction is L, C / L can be 0.069 or more.

[0023] In one embodiment, when the length in the first direction connecting the flat portion and the second bottleneck structure in the first bottleneck structure is C and the length in the first direction of the second bottleneck structure is B, C>B may be satisfied.

[0024] In one embodiment, when the length of the first bottleneck structure in the third direction is D and the length of the main body in the third direction is W, D / W may be 0.013 or more. Effect of the Invention

[0025] The multilayer capacitor according to an embodiment of the present invention may have improved reliability against external influences (e.g., moisture resistance) and, in addition to this, may have reduced cracks during mounting on a substrate or the like, thereby improving structural stability. [Brief description of the drawings]

[0026] [Figure 1] 1 is a perspective view showing a schematic external view of a multilayer capacitor according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the multilayer capacitor taken along line II' of FIG. 1. [Diagram 3] 2 is a cross-sectional view of the multilayer capacitor of FIG. 1 taken along line II-II'. [Figure 4] In FIG. 3, one internal electrode is shown separately. [Diagram 5] 4 shows internal electrodes that can be used in modified examples. [Figure 6] 4 shows internal electrodes that can be used in modified examples. [Figure 7] 1 shows the configuration of a conductive pattern for forming an internal electrode as part of a process for manufacturing a multilayer capacitor according to an embodiment of the present invention. [Figure 8] 1 shows the configuration of a conductive pattern for forming an internal electrode as part of a process for manufacturing a multilayer capacitor according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer description.

[0028] In order to clearly explain the present invention, the drawings omit parts that are not relevant to the description, exaggerate the thickness to clearly show various layers and regions, and use the same reference numerals to refer to components that have the same function within the same concept. Furthermore, throughout the specification, the term "comprises" a certain component does not mean to exclude other components, but means that the other components can be further included, unless otherwise specified.

[0029] Fig. 1 is a perspective view showing a schematic appearance of a multilayer capacitor according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of the multilayer capacitor shown in Fig. 1 taken along line I-I'. Fig. 3 is a cross-sectional view of the multilayer capacitor shown in Fig. 1 taken along line II-II'. Fig. 4 shows one internal electrode separately from Fig. 3. Figs. 5 and 6 show internal electrodes that can be used in modified examples.

[0030] 1 to 3, a multilayer capacitor 100 according to an embodiment of the present invention includes a body 110 including a dielectric layer 111 and a plurality of internal electrodes 121, 122 stacked on either side of the dielectric layer 111, and external electrodes 131, 132, at least some of the internal electrodes 121, 122 having bottleneck structures 151, 152. In other words, at least some of the internal electrodes 121, 122 have the bottleneck structures 151, 152 formed therein.

[0031] The body 110 includes a laminated structure in which a plurality of dielectric layers 111 are laminated, and can be obtained, for example, by stacking a plurality of green sheets and then sintering them. The plurality of dielectric layers 111 can have an integrated form by such a sintering process. The shape and dimensions of the body 110 and the number of laminated dielectric layers 111 are not limited to those shown in the present embodiment, and the body 110 can have a shape similar to a rectangular parallelepiped, for example, as shown in FIG. 1. The body 110 includes a first surface S1 and a second surface S2 on which the internal electrodes 121 and 122 are exposed, which face each other in a first direction (X direction), a third surface S3 and a fourth surface S4 which face each other in a second direction (Z direction) which is a stacking direction of the plurality of dielectric layers 111, and a fifth surface S5 and a sixth surface S6 which face each other in a third direction (Y direction) perpendicular to the first and second directions.

[0032] The dielectric layer 111 included in the body 110 includes a ceramic material having a high dielectric constant, for example, a BT series, i.e., barium titanate (BaTiO 3The dielectric layer 111 may include a ceramic material based on the ceramic material, but other materials known in the art may be used as long as they provide sufficient capacitance. The dielectric layer 111 may further include additives, organic solvents, plasticizers, binders, dispersants, and the like, in addition to the ceramic material as the main component, as necessary. The additives include metal components, which may be added in the form of metal oxides during the manufacturing process. An example of such a metal oxide additive is MnO. 2 , Dy 2 O 3 , BaO, MgO, Al 2 O 3 , SiO 2 , Cr 2 O 3 , and CaCO 3 The composition may include at least one of the following substances.

[0033] The plurality of internal electrodes 121, 122 are obtained by printing a paste containing a conductive metal on one surface of a ceramic green sheet to a predetermined thickness and then sintering the paste. In this case, the plurality of internal electrodes 121, 122 may include first and second internal electrodes 121, 122 exposed to a first surface S1 and a second surface S2 facing each other of the body 110 as shown in FIG. 2. In this case, the first and second internal electrodes 121, 122 may be connected to different external electrodes 131, 132 and may have different polarities when driven, and may be electrically isolated from each other by a dielectric layer 111 disposed therebetween. However, the number of the external electrodes 131, 132 and the method of connection with the internal electrodes 121, 122 may vary depending on the embodiment. Examples of main constituent materials of the internal electrodes 121, 122 include nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), etc., and alloys thereof may also be used.

[0034] The external electrodes 131, 132 may include first and second external electrodes 131, 132 formed outside the body 110 and connected to the first and second internal electrodes 121, 122, respectively. The first and second external electrodes 131, 132 may be formed by, for example, preparing a material containing a conductive metal as a paste and then applying the paste to the body 110. Examples of the conductive metal include nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof. At least one plating layer containing Ni, Sn, etc. may be formed on the electrode layer thus formed.

[0035] 3 and 4, in this embodiment, at least some of the internal electrodes 121, 122 have first and second bottleneck structures 151, 152. In the first bottleneck structure 151, an outer region in the third direction (Y direction) has a shorter length in the first direction (X direction) than an inner region. In the second bottleneck structure 152, an outer region in the first direction (X direction) has a shorter length in the third direction (X direction) than an inner region. In this case, the second bottleneck structure 152 can be connected to the external electrodes 131, 132, and FIG. 3 shows a form in which the second bottleneck structure 152 is connected to the first external electrode 131.

[0036] The moisture resistance reliability of the multilayer capacitor 100 can be improved by forming a plurality of bottleneck structures, i.e., the first and second bottleneck structures 151 and 152, in the internal electrodes 121 and 122. One of the reasons for this effect is believed to be that the distance between the corner A region of the body 110, which is easily permeated by moisture, and the internal electrodes 121 and 122 is increased from the conventional method. In this case, when the bottleneck structures 151 and 152 are formed in the internal electrodes 121 and 122, the capacitance may decrease, but the decrease in capacitance can be minimized by optimizing the shape of the first and second bottleneck structures 151 and 152. Details of this will be described later. Meanwhile, the bottleneck structures 151 and 152 of the above shape can also be formed in the second internal electrode 122, and the following description can also be applied to the second internal electrode 122.

[0037] As shown in the embodiment, the first and second bottleneck structures 151, 152 may be connected to each other, but in this case, the outer surface of the first bottleneck structure 151 and the outer surface of the second bottleneck structure 152 may be discontinuous. This means that the outer surfaces of the first and second bottleneck structures 151, 152 do not form one continuous surface, but the first and second bottleneck structures 151, 152 form separate bottleneck structures.

[0038] The first bottleneck structure 151 may have a shape recessed into the body 110 in a first direction (X direction). Similarly, the second bottleneck structure 152 may have a shape recessed into the body 110 in a third direction (Y direction). In other words, the first and second bottleneck structures 151 and 152 have a shape recessed into the body 110 rather than a shape in which the outer surface is convex outwardly of the body 110. With this shape, the distance between the corner A of the body 110 and the internal electrodes 121 and 122 can be increased within a range in which a reduction in capacitance is minimized, thereby improving the moisture resistance reliability, stress stability, and the like of the multilayer capacitor 100.

[0039] Meanwhile, in the embodiment of Fig. 3 and Fig. 4, the outer surfaces of the first and second bottleneck structures 151, 152 include a curved surface, but may be modified into other shapes as long as the shape of the bottleneck is maintained. For example, as shown in Fig. 5, the internal electrode 121' includes the first and second bottleneck structures 151, 152 having a deformed shape, and the outer surfaces of the first and second bottleneck structures 151, 152 include a flat surface, but the flat surface is inclined with respect to the first surface S1 and the third surface S3 of the main body. In this case, the gradients of the outer surfaces of the first and second bottleneck structures 151, 152 may be different from each other.

[0040] 3 and 4, the shapes of the first and second bottleneck structures 151, 152 will be described in more detail. First, the first bottleneck structure 151 may have a shape in which the length in the first direction (X direction) becomes shorter as it approaches the outside of the body 110 in the third direction (Y direction). Similarly, the second bottleneck structure 152 may have a shape in which the length in the third direction (Y direction) becomes shorter as it approaches the outside of the body 110 in the first direction (X direction). However, the first and second bottleneck structures 151, 152 do not have to gradually change in length in one direction, and there may be a section of constant length in some regions as long as the bottleneck structure is maintained overall.

[0041] Also, the first bottleneck structure 151 may be formed in both the region adjacent to the first surface S1 and the region adjacent to the second surface S2 in the internal electrodes 121 and 122. And, the second bottleneck structure 152 may be formed in both the region adjacent to the fifth surface S5 and the region adjacent to the sixth surface S6 in the internal electrodes 121 and 122. In this case, as in the illustrated embodiment, the first bottleneck structure 151 may have the same shape in the region adjacent to the first surface S1 and the region adjacent to the second surface S2. However, in the internal electrode 121'' of the example modified according to design needs as in the embodiment shown in FIG. 6, the first bottleneck structure 151 may have different shapes in the region adjacent to the first surface S1 and the region adjacent to the second surface S2, and this is also true for the second bottleneck structure 152. In general terms, this means that in FIG. 4, length C and length F may be different from each other, and similarly, length D and length E may be different from each other.

[0042] As described above, in this embodiment, a plurality of bottleneck structures 151, 152 are formed in the internal electrodes 121, 122 within a range that can sufficiently secure the capacitance, and size conditions of the first and second bottleneck structures 151, 152 can be determined for such a design. Specifically, the connection portion 121C where the first and second bottleneck structures 151, 152 are connected to each other can overlap with the external electrodes 131, 132 in the third direction (Y direction), and corresponds to the first external electrode 131 with reference to FIG. 3. In this case, the length C of the first bottleneck structure 151 can be longer than the length B of the second bottleneck structure 152. This condition is in consideration of the fact that if the length of the first bottleneck structure 151 is long enough not to overlap with the first external electrode 131, a decrease in capacitance may become significant.

[0043] As shown in the illustrated embodiment, the first bottleneck structure 151 may have flat portions P1 and P2 in the internal electrodes 121 and 122, each having a constant length in the third direction (Y direction). In this case, the flat portions P1 and P2 connected to the second bottleneck structure correspond to the first flat portion P1. The first flat portion P1 is disposed in an area connected to the second bottleneck structure 152, and may be used for the purpose of mitigating abrupt changes in shape that may occur on the outer surfaces of the internal electrodes 121 and 122. In addition, the flat portions P1 and P2 that form the outermost surfaces of the internal electrodes 121 and 122 in the third direction (Y direction) correspond to the second flat portion P2. The second flat portion P2 may be used for the purpose of obtaining a sufficient overlapping area between the internal electrodes 121 and 122, thereby contributing to an improvement in capacitance.

[0044] In this embodiment, the length conditions of the first and second bottleneck structures 151 and 152 may be selected within an optimal range in consideration of moisture resistance reliability, crack occurrence rate, capacitance characteristics, etc. Specifically, referring to FIG. 3 and FIG. 4, when the length in the first direction (X direction) connecting the first flat portion P1 and the second bottleneck structure 152 is C and the length in the first direction (X direction) of the main body 110 is L, C / L may be 0.069 or more. In addition, in relation to the relative length conditions of the first and second bottleneck structures 151 and 152, when the length in the first direction (X direction) of the second bottleneck structure 152 is B, C>B may be satisfied. This is because, as described above, if the length of the second bottleneck structure 152 is excessively increased, a large decrease in capacitance may occur.

[0045] As for the length condition of the first bottleneck structure 151 in the third direction (Y direction), when the length of the first bottleneck structure 151 in the third direction (Y direction) is D and the length of the main body 110 in the third direction (Y direction) is W, D / W can be 0.013 or more.

[0046] The inventors of the present invention measured the capacitance, crack occurrence rate, and moisture resistance reliability while changing the length conditions of the first and second bottleneck structures 151, 152 as follows. First, the following Table 1 shows the length conditions of the bottleneck parts adopted in the Ref. and Examples. Here, the Ref. sample is a case where each ratio value is 0, which corresponds to a structure having only the second bottleneck part without the first bottleneck part, and the internal electrodes other than the second bottleneck part have a rectangular shape when viewed from above.

[0047] [Table 1]

[0048] Table 2 below shows the results of an experiment conducted to see if cracks occurred on the exterior of the manufactured MLCC samples, mainly in the cover area of ​​the main body, before they were mounted on a board. The experiment confirmed that the defect rate was reduced in the embodiment that adopted the first bottleneck portion, compared to the case where the first bottleneck portion was not adopted (Ref.). In particular, when the above-mentioned C / L and D / W conditions were met, the defect rate was at the 0 level.

[0049] [Table 2]

[0050] Table 3 below shows the results of an experiment to see if cracks occurred due to stress caused by warping of the board after the manufactured MLCC samples were mounted on the board. Similar to the above experimental results, the mounting crack experiment also confirmed that the failure rate was reduced in the embodiment that adopted the first bottleneck part compared to the case where the first bottleneck part was not adopted (Ref.). In particular, when the above C / L and D / W conditions were met, the failure rate was at the 0 level.

[0051] [Table 3]

[0052] Table 4 below shows the results of an experiment to check for moisture resistance defects on manufactured MLCC samples. The resistance characteristics (IR) of the main body, especially the cover area, were measured, and resistance values ​​lower than the reference were treated as defective. The results of the moisture resistance defect experiment also confirmed that the defect rate was reduced in the embodiment in which the first bottleneck portion was used, compared to the case in which the first bottleneck portion was not used (Ref.). In particular, when the above-mentioned C / L and D / W conditions were met, the defect rate was at the 0 level.

[0053] [Table 4]

[0054] Next, the capacitance was measured for Ref., Example 2, and Example 5, as shown in Table 5 below. Referring to the results in Table 5, it was confirmed that the decrease in capacitance was not significant in the Example employing multiple bottlenecks compared to Ref. having only one bottleneck, and sufficient capacitance was ensured.

[0055] [Table 5]

[0056] 7 and 8 show the shape of a conductive pattern for forming an internal electrode as part of a process for manufacturing a multilayer capacitor according to an embodiment of the present invention.

[0057] To form the body 110, a ceramic laminate is prepared by laminating the dielectric layer 111 and the internal electrodes 121 and 122. Here, the dielectric layer 111 is in a ceramic green sheet state before sintering. The ceramic green sheet can be produced by mixing ceramic powder, a binder, a solvent, etc. to produce a slurry, and then forming the slurry into a sheet having a thickness of several μm or less than 1 μm using a doctor blade method, etc. Then, the ceramic green sheet can be sintered to form the dielectric layer 111.

[0058] A conductive paste for an internal electrode may be applied on the ceramic green sheet to form a patterned internal electrode 121, and the internal electrode 121 may be formed by a screen printing method or a gravure printing method. The conductive paste for an internal electrode includes a conductive metal and an additive, and the additive may be at least one of a nonmetal and a metal oxide. The conductive metal may include nickel. The additive may include barium titanate or strontium titanate as a metal oxide.

[0059] 7 shows a form in which a conductive paste is applied to form the internal electrodes 121, and two internal electrodes 121 are connected to each other. In a state in which the dielectric layers and the conductive paste are laminated, the laminate is diced into individual components, thereby realizing the internal electrodes 121 having a plurality of bottleneck structures. Thereafter, the ceramic green sheet laminate is fired, and external electrodes are formed to be connected to the internal electrodes 121 later, thereby completing the multilayer capacitor.

[0060] 8 shows a conductive paste application state in which more internal electrodes 121 are connected. A first bottleneck structure is connected to the internal electrodes 121, and when cut into individual components, the first bottleneck structure may be exposed to the outside of the dielectric layer. A side margin portion may be formed to cover the side surface of the exposed internal electrode 121, and the side margin portion may be made of the same ceramic material as the dielectric layer 111.

[0061] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0062] 100 Multilayer Capacitor 110 Main unit 111 Dielectric layer 121, 122 Internal electrode 131, 132 External electrode 151, 152 Bottleneck structure

Claims

1. a main body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers interposed therebetween; an external electrode formed on the outside of the body and connected to the plurality of internal electrodes; the body includes a first surface and a second surface on which the internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a lamination direction of the dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first direction and the second direction, At least some of the internal electrodes include a first bottleneck structure in which an outer region in the third direction has a shorter length in the first direction than an inner region, and a second bottleneck structure in which the outer region in the first direction has a shorter length in the third direction than the inner region, The first bottleneck structure and the second bottleneck structure are separated from each other.

2. A body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; an external electrode formed on the outside of the body and connected to the plurality of internal electrodes; the body includes a first surface and a second surface on which the internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a lamination direction of the dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first direction and the second direction, At least some of the internal electrodes include a first bottleneck structure in which an outer region in the third direction has a shorter length in the first direction than an inner region, and a second bottleneck structure in which the outer region in the first direction has a shorter length in the third direction than the inner region, an outer surface of the first bottleneck structure and an outer surface of the second bottleneck structure include a plane inclined with respect to the first surface and the third surface, and a slope of the outer surface of the first bottleneck structure and the outer surface of the second bottleneck structure are different from each other.

3. A body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers in between; an external electrode formed on the outside of the body and connected to the plurality of internal electrodes; the body includes a first surface and a second surface on which the internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a lamination direction of the dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first direction and the second direction, At least some of the internal electrodes include a first bottleneck structure in which an outer region in the third direction has a shorter length in the first direction than an inner region, and a second bottleneck structure in which the outer region in the first direction has a shorter length in the third direction than the inner region, a length of the first bottleneck structure in the third direction being D and a length of the body in the third direction being W, where D / W is 0.013 or more;

4. A multilayer capacitor as described in any one of claims 1 to 3, wherein the first bottleneck structure has a flat portion in the multiple internal electrodes whose length in the third direction is constant.

5. A multilayer capacitor as described in claim 4, wherein the flat portion forms the outermost surface in the third direction of the multiple internal electrodes.

6. A multilayer capacitor as described in claim 5, wherein, in the first bottleneck structure, when the length in the first direction connecting the flat portion and the second bottleneck structure is C and the length in the first direction of the main body is L, C / L is 0.069 or more.

7. A body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers in between; an external electrode formed on the outside of the body and connected to the plurality of internal electrodes; the body includes a first surface and a second surface on which the internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a lamination direction of the dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first direction and the second direction, At least some of the internal electrodes include a first bottleneck structure in which an outer region in the third direction has a shorter length in the first direction than an inner region, and a second bottleneck structure in which the outer region in the first direction has a shorter length in the third direction than the inner region, the first bottleneck structure has flat portions in the plurality of internal electrodes, the flat portions having a constant length in the third direction; the flat portion forms an outermost surface of the plurality of internal electrodes in the third direction, a length in the first direction connecting the flat portion and the second bottleneck structure is C, and a length in the first direction of the body is L, where C / L is 0.069 or more.

8. A multilayer capacitor as described in any one of claims 4 to 7, wherein the flat portion is connected to the second bottleneck structure.

9. A multilayer capacitor as described in any one of claims 5 to 8, wherein, in the first bottleneck structure, when the length in the first direction connecting the flat portion and the second bottleneck structure is C and the length in the first direction of the second bottleneck structure is B, C>B.

10. A multilayer capacitor as described in claim 1 or any one of claims 3 to 9 without quoting claim 2, wherein the outer surfaces of the first bottleneck structure and the second bottleneck structure include planes inclined relative to the first surface and the third surface.

11. A multilayer capacitor as described in claim 1 or 2, or any one of claims 4 to 10 without citing claim 3, wherein when the length of the first bottleneck structure in the third direction is D and the length of the main body in the third direction is W, D / W is 0.013 or more.

12. The multilayer capacitor of claim 1, wherein the outer surface of the first bottleneck structure and the outer surface of the second bottleneck structure are discontinuous.

13. the first bottleneck structure and the second bottleneck structure are connected to each other; The multilayer capacitor according to claim 2 , wherein an outer surface of the first bottleneck structure and an outer surface of the second bottleneck structure are discontinuous.

14. The multilayer capacitor according to claim 1 , wherein the second bottleneck structure is connected to the external electrode.

15. 15. The multilayer capacitor of claim 1, wherein the first bottleneck structure is recessed into the body in the first direction, and the second bottleneck structure is recessed into the body in the third direction.

16. The multilayer capacitor of claim 1 , wherein the first bottleneck structure has a shape in which a length in the first direction decreases toward an outer side of the body in the third direction.

17. The multilayer capacitor of claim 1 , wherein the second bottleneck structure has a length in the third direction that decreases toward an outer side of the body in the first direction.

18. 18. The multilayer capacitor of claim 1, wherein the first bottleneck structure is formed in both a region adjacent to the first surface and a region adjacent to the second surface of the plurality of internal electrodes.

19. 20. The multilayer capacitor of claim 18, wherein the first bottleneck structure has a portion formed in a region adjacent to the first surface and a portion formed in a region adjacent to the second surface that are different in shape from each other.

20. 20. The multilayer capacitor of claim 1, wherein the second bottleneck structure is formed in both a region adjacent to the fifth surface and a region adjacent to a sixth surface of the plurality of internal electrodes.

21. The multilayer capacitor according to claim 2 , wherein the first bottleneck structure and the second bottleneck structure are connected to each other, and the connection portion overlaps with the external electrode in the third direction.

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