Lead-type piezoelectric oscillator

Abstract

To provide a lead type piezoelectric oscillator which integrally mounts a surface mounting type piezoelectric oscillator and a surface mounting type electronic component to a lead terminal in an effective state, and improves characteristics.SOLUTION: A lead type piezoelectric oscillator 100 has a first lead terminal 1, a second lead terminal 2 and a third lead terminal 3 which are formed with pad parts and external connection parts, a surface mounting type piezoelectric oscillator 4 and a surface mounting type electronic component 5 which are conductively joined to the pad parts (first pad part 10, second pad part 20 and third pad part 30) of the lead terminal, and a resin package part 6 covering them. The surface mounting type piezoelectric oscillator and the surface mounting type electronic component are electrically connected to each other through the pad parts of the plurality of the lead terminals.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a lead-type piezoelectric oscillator comprising a surface-mounted piezoelectric oscillator having external terminals, a plurality of pad portions to which the external terminals of the surface-mounted piezoelectric oscillator are electrically and mechanically connected by a conductive bonding material, a plurality of lead terminals integrally formed with and electrically connected to any one of the pad portions, and a resin package portion that resin-seals the surface-mounted piezoelectric oscillator and the pad portions. [Background technology]

[0002] An example of a conventional lead-type piezoelectric oscillator is disclosed in Patent Document 1. That is, the patent document discloses a surface-mount type piezoelectric oscillator that is electrically and mechanically joined to a lead terminal made of a metal lead frame using a conductive bonding material such as solder, and is further mold-coated with a resin material (having a resin package portion).

[0003] Patent Document 1 discloses a lead-type piezoelectric oscillator in which the shape of the lead terminal is devised to reduce the influence of external noise. [Patent Document 1] JP 2017-85450 A DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0004] In a lead-type piezoelectric oscillator such as that in Patent Document 1, the characteristics of the single unit are already complete when the built-in surface-mounted piezoelectric oscillator is manufactured, and no consideration is usually given to removing noise components from an external power source through the lead terminals or improving the characteristics of the piezoelectric oscillator. Furthermore, when removing noise components from such an external power source or improving the characteristics of a piezoelectric oscillator in a finally completed lead-type piezoelectric oscillator, this is generally achieved by later mounting characteristic improvement parts on the external circuit and connecting it to the oscillation circuit. However, in a lead-type piezoelectric oscillator, the conductive path to the external circuit board is longer than in a surface-mounted piezoelectric oscillator, so there is a problem in that the effect of these characteristic improvements is smaller.

[0005] The present invention has been devised to solve these problems, and its object is to provide a lead-type piezoelectric oscillator with improved characteristics by effectively and integrally attaching a surface-mount type piezoelectric oscillator and a surface-mount type electronic component to a lead terminal. [Means for solving the problem]

[0006] In order to achieve the above object, as shown in claim 1 of the present invention, a surface mount type piezoelectric oscillator is provided, the surface mount type piezoelectric oscillator having a plurality of lead terminals each having a plurality of pads formed at one end and an external connection portion formed at the other end, and a plurality of external terminals formed on an outer surface thereof, with some of the plurality of pads being conductively joined to the plurality of external terminals, the surface mount type piezoelectric oscillator has a plurality of external terminals formed on its outer surface, and the surface mount type electronic component is electrically connected to the surface mount type piezoelectric oscillator by the plurality of external terminals being conductively joined to some of the plurality of pads, and a resin package portion is formed to cover the pads of the plurality of lead terminals, the surface mount type piezoelectric oscillator, and the surface mount type electronic component. The surface mount electronic component has a surface area smaller than that of the surface mount piezoelectric oscillator, and the plurality of pads include a main pad that is electrically conductively connected to a plurality of external terminals of the surface mount piezoelectric oscillator, a sub-pad that is electrically conductively connected to a plurality of external terminals of the surface mount electronic component, and a region that is formed between the main pad and the sub-pad and has a mechanical strength weaker than that of the main pad and the sub-pad. Become 1. A lead-type piezoelectric oscillator comprising:

[0007] With the above configuration, the external terminal of the surface mount type piezoelectric oscillator is conductively connected to a part of the pad portion of the lead terminal, and the external terminal of the surface mount type electronic component is conductively connected to a part of the pad portion of the lead terminal, so that the surface mount type electronic component can be electrically connected at a position very close to the surface mount type piezoelectric oscillator. Therefore, a closer electrical connection relationship with lower impedance can be obtained between the surface mount type piezoelectric oscillator and the surface mount type electronic component, resulting in a more effective configuration for improving the characteristics of the lead type piezoelectric oscillator. In addition, by creating a lead type piezoelectric oscillator using a general-purpose component that has characteristics guaranteed as a surface mount type piezoelectric oscillator, there is no need to reconstruct the characteristics as a piezoelectric oscillator, and it can be created small and inexpensively.

[0008] Also, In a lead-type piezoelectric oscillator, the lead terminals constituting the pads, the surface-mounted piezoelectric oscillator conductively bonded to the lead terminals, and the surface-mounted electronic component are covered with resin, so that thermal stress may occur in the region inside the resin package when the resin package is formed. In the present invention, with the above configuration, even if thermal stress is transmitted from the main pad (region with relatively strong mechanical strength) to which the surface-mounted piezoelectric oscillator with a larger surface area is conductively bonded to the sub-pad (region with relatively weak mechanical strength) to which the surface-mounted electronic component with a smaller surface area is conductively bonded, an area of ​​the lead terminal with weaker mechanical strength than the main pad and the sub-pad is formed between the main pad and the sub-pad, so that such thermal stress can be alleviated and the relatively weak region of the sub-pad and the surface-mounted electronic component conductively bonded to this region can be protected. As a result, peeling of the conductive bonding material in the sub-pad to which the surface-mounted electronic component with a small bonding area is conductively bonded, or destruction of the conductively bonded surface-mounted electronic component can be prevented.

[0009] In addition, the claims of the present invention 2 As shown in the surface mount type piezoelectric oscillator has a plurality of lead terminals each having a plurality of pads at one end and an external connection portion at the other end, and a plurality of external terminals formed on an outer surface thereof, with some of the plurality of pads being conductively joined to the plurality of external terminals, the surface mount type piezoelectric oscillator has a surface mount type electronic component formed on its outer surface thereof, with some of the plurality of pads being conductively joined to the plurality of external terminals, and a resin package portion is formed to cover the pads of the plurality of lead terminals, the surface mount type piezoelectric oscillator, and the surface mount type electronic component;The surface mount electronic component has a smaller number of external terminals than the surface mount piezoelectric oscillator, and the pads include a main pad that is conductively connected to the external terminals of the surface mount piezoelectric oscillator, a sub-pad that is conductively connected to the external terminals of the surface mount electronic component and has a smaller number of pads than the main pad, and an area formed between the main pad and the sub-pad, the area having a mechanical strength weaker than the main pad and the sub-pad. Become 1. A lead-type piezoelectric oscillator comprising:

[0010] With the above configuration, the external terminal of the surface mount type piezoelectric oscillator is conductively connected to a part of the pad portion of the lead terminal, and the external terminal of the surface mount type electronic component is conductively connected to a part of the pad portion of the lead terminal, so that the surface mount type electronic component can be electrically connected at a position very close to the surface mount type piezoelectric oscillator. Therefore, a closer electrical connection relationship with lower impedance can be obtained between the surface mount type piezoelectric oscillator and the surface mount type electronic component, resulting in a more effective configuration for improving the characteristics of the lead type piezoelectric oscillator. In addition, by creating a lead type piezoelectric oscillator using a general-purpose component that has characteristics guaranteed as a surface mount type piezoelectric oscillator, there is no need to reconstruct the characteristics as a piezoelectric oscillator, and it can be created small and inexpensively.

[0011] Also, In a lead-type piezoelectric oscillator, the lead terminals constituting the pads, the surface-mounted piezoelectric oscillator conductively bonded to the lead terminals, and the surface-mounted electronic components are covered with resin, so that thermal stress may occur in the region inside the resin package when the resin package is formed. In the present invention, the above-mentioned configuration allows thermal stress to be transmitted from the main pad (region with relatively strong mechanical strength) to which the surface-mounted piezoelectric oscillator with more bonding points is conductively bonded to the sub-pad (region with relatively weak mechanical strength) to which the surface-mounted electronic components with fewer bonding points are conductively bonded. Since an area with weaker mechanical strength of the lead terminals than the main pad and the sub-pad is formed between the main pad and the sub-pad, such thermal stress can be alleviated, and the relatively weak area of ​​the sub-pad and the surface-mounted electronic components conductively bonded to this area can be protected. As a result, peeling of the conductive bonding material in the sub-pad to which the surface-mounted electronic components with fewer bonding points are conductively bonded, or destruction of the conductively bonded surface-mounted electronic components can be prevented.

[0012] In addition, the claims of the present invention 3 As shown in FIG. 1, the region of the lead terminal having weak mechanical strength may be constituted by a narrow portion having a narrower width on the main surface of the pad portion of the lead terminal.

[0013] In addition to the above-mentioned effects, the narrow portion of the pad can be easily processed and can function as a region with weak mechanical strength, which can reduce thermal stress and also function as a stress absorbing portion caused by mechanical deformation of the lead terminal.

[0014] In addition, the claims of the present invention 4 As shown in FIG. 1, a rounded portion was formed in the corner of the narrow connecting portion of the lead terminal.

[0015] In addition to the above-mentioned effects, the above-mentioned configuration forms a rounded corner at the connection part of the narrow part of the lead terminal, which eliminates stress concentration at the corner due to mechanical deformation of the lead terminal, and reduces the occurrence of cracks and breakage of the lead terminal. As a result, it is possible to prevent the connection with the surface mount piezoelectric oscillator from being broken, which can lead to non-oscillation, and to prevent the resin package surrounding the lead terminal from being broken.

[0016] In addition, the claims of the present invention 5 As shown in FIG. 1, the surface mount electronic component may be a capacitor.

[0017] In addition to the above-mentioned advantageous effects, the above-mentioned configuration enables the capacitor to be mounted in close proximity to the surface mount type piezoelectric oscillator with the built-in IC, thereby improving the effectiveness of noise removal from the external power supply. Effect of the Invention

[0018] As described above, the present invention makes it possible to provide a lead-type piezoelectric oscillator with improved characteristics and higher reliability by effectively and integrally mounting a surface-mount type piezoelectric oscillator and a surface-mount type electronic component to a lead terminal. [Brief description of the drawings]

[0019] [Figure 1] 1 is a schematic diagram showing a state in which a lead-type piezoelectric oscillator according to an embodiment of the present invention is mounted on a wiring board; [Diagram 2] 1 is a schematic configuration diagram of a lead terminal according to an embodiment of the present invention; [Diagram 3] 1 is a schematic configuration diagram of a lead-type piezoelectric oscillator according to an embodiment of the present invention. [Figure 4] 1 is a schematic configuration diagram of a surface mount type piezoelectric oscillator according to an embodiment of the present invention. [Diagram 5] FIG. 4 is a schematic cross-sectional view taken along the line XX in FIG. 3 according to an embodiment of the present invention. [Figure 6] FIG. 11 is a schematic configuration diagram of a lead terminal according to another embodiment of the present invention. [Figure 7] FIG. 11 is a schematic configuration diagram of a lead terminal according to another embodiment of the present invention. BEST MODE FOR CARRYING OUT THEINVENTION

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a lead-type piezoelectric oscillator according to the present invention will be described with reference to the drawings.

[0021] 1 is a schematic diagram showing a state in which a lead-type piezoelectric oscillator 100 according to an embodiment of the present invention is mounted on a wiring board 7 (external circuit board), and the lead-type piezoelectric oscillator 100 is mounted on the wiring board 7 using solder (not shown). A wiring pattern (not shown) and through holes 71, 72 and 73 (through holes 71, 72, 73) are formed on the wiring board 7. The through holes 71, 72, 73 are through holes that have a plating layer (not shown) on their inner walls and penetrate both main surfaces of the wiring board 7.

[0022] In other words, the first external connection portion 15, the second external connection portion 25 and the third external connection portion 35 (hereinafter referred to as external connection portions 15, 25, 35) of the first lead terminal 1, the second lead terminal 2 and the third lead terminal 3 (hereinafter referred to as lead terminals 1, 2, 3) of the lead-type piezoelectric oscillator are inserted into the through holes 71, 72, 73 of the wiring board, and are electrically and mechanically joined to the plating layer of the inner walls using solder.

[0023] 2 is a schematic diagram of the lead terminals 1, 2, 3 according to the embodiment of the present invention. The lead terminals 1, 2, 3 have external connection parts 15, 25, 35 formed at the other end thereof to be inserted into through holes in an external circuit board, and extend from the other end in the same direction (in this embodiment, +Y-axis direction), with a first pad part 10, a second pad part 20, and a third pad part 30 (hereinafter referred to as pad parts 10, 20, 30) formed at one end thereof. Each pad part is plate-shaped and has a mounting surface (front and back main surfaces) that is an XY plane consisting of an X-axis and a Y-axis perpendicular to the X-axis.

[0024] In this embodiment, of the two ends of lead terminal 1, one end on the pad portion 10 side is a base end and the other end on the external connection portion 15 side is a tip end; of the two ends of lead terminal 2, one end on the pad portion 20 side is a base end and the other end on the external connection portion 25 side is a tip end; and of the two ends of lead terminal 3, one end on the pad portion 30 side is a base end and the other end on the external connection portion 35 side is a tip end.

[0025] The pads 10, 20, 30 are portions where a surface mount type piezoelectric oscillator 4 and a surface mount type electronic component 5, which will be described later, are bonded and the surrounding portions (portions shown as region D0), and the widths (dimensions in the X-axis direction (+X-axis direction and -X-axis direction)) of the pads 10, 20, 30 are formed in a plate shape wider than the widths (dimensions in the X-axis direction (+X-axis direction and -X-axis direction)) W0 of the lead terminals 1, 2, 3. The surface mount type piezoelectric oscillator 4 and the surface mount type electronic component 5, which will be described later, are mounted on the plate-shaped mounting surfaces of the pads 10, 20, 30, and the pads 10, 20, 30, the surface mount type piezoelectric oscillator 4, and the surface mount type electronic component 5, which will be described later, are electrically connected to each other by a conductive bonding material H such as solder.

[0026] At the tip of the first pad 10, first main pad part one 11 and first main pad part two 12, which occupy a large surface area on the first pad part 10, are formed in parallel with a cutout part 14 between them. At a portion of the first pad 10 adjacent to the first external connection part 15, a first sub-pad part 13, which occupies a small surface area on the first pad part 10, is formed. In other words, the first main pad parts (first main pad part one 11 and first main pad part two 12) are formed to have a larger surface area than the first sub-pad part 13.

[0027] In this embodiment, between the first main pad portion (first main pad portion one 11 and first main pad portion two 12) which has the most connection points (two points) and the first sub-pad portion 13 which has the fewest connection points (one point), a narrow portion 16 which has a narrower width on the main surface of the pad portion is formed as an area where the mechanical strength of the first lead terminal 2 is weaker than that of first main pad portion two 12 and first sub-pad portion 13.

[0028] With the above configuration, the external terminals of the surface mount type piezoelectric oscillator 4 having a large number of external terminals are bonded to the first main pads (first main pad part 11 and first main pad part 2 12) with the conductive bonding material H, so that the mounting positioning of the surface mount type piezoelectric oscillator 4 on the lead terminal 1 is stable and a stronger fixation can be realized. Also, since an area where the external terminals of the surface mount type electronic component 5 having a small number of external terminals are bonded is formed in the first sub-pad part 13, it is easy to ensure the mounting area of ​​the surface mount type electronic component 5 without invading the mounting area of ​​the surface mount type piezoelectric oscillator 4 as the main component, and space saving of the mounting area can be realized. Furthermore, since a narrow width portion 16 is formed between the first main pad portion (first main pad portion-11 and first main pad portion-2 12) and the first sub-pad portion 13, even if thermal stress generated when forming the resin package portion 6 is transmitted from the first main pad portion (first main pad portion-11 and first main pad portion-2 12) to which the surface-mounted piezoelectric oscillator 4, which has more joining points, is conductively joined to the first sub-pad portion 13 to which the surface-mounted electronic component 5, which has fewer joining points, is conductively joined, the mutual stress between them can be alleviated.

[0029] In order to improve the relaxation performance of the stress transmitted to the lead terminal, it is desirable to set the dimension ratio T1 / W1, where the width of the main surface of the narrow portion 16 is W1 (see FIG. 2) and the thickness of the narrow portion 16 is T1 (see FIG. 5), within the range of 0.8 to 1.2. This reduces the aspect ratio of the main surface width and thickness of the narrow portion 16, and the cross-sectional shape of the narrow portion 16 approaches a square shape, so that the bending of the lead terminal is easily displaced not only in the thickness direction but also in the main surface direction, making it easier to relax the stress. In this embodiment, for example, the width W1 is set to 4.5 mm, the thickness T1 is set to 4 mm, and the dimension ratio is set to 0.88.

[0030] 6, the corners of the lead terminal 1 that are to be connected to the narrow width portion 16 may be formed with rounded portions 161R, 162R. The diameter of the rounded portions is, for example, about 0.1 to 0.2 mm. This configuration eliminates stress concentration at the corners due to mechanical deformation of the lead terminal 1, and reduces the occurrence of cracks and breakage of the lead terminal 1. The rounded portions may be formed not only at the corners that are to be connected to the narrow width portion 16, but also at all corners of the lead terminal 1. Instead of the rounded portions, C-faced portions may be formed so that the corners have a more obtuse angle.

[0031] A second main pad 21 is formed at the tip of the second pad 20 and is bonded to one of the four external terminals 40 of a surface mount type piezoelectric oscillator described later, and occupies a large surface area on the second pad 20. A second sub-pad 22 is formed at a portion of the second pad 20 adjacent to the second external connection portion 15, and is bonded to one of the two external terminals 50 of a surface mount type electronic component described later, and occupies a small surface area on the second pad 20. In other words, the second main pad 21 is formed to have a larger surface area than the second sub-pad 22.

[0032] In this embodiment, a narrow portion 23 having a narrower width on the main surface of the pad portion is formed between the second main pad portion 21 having a large surface area and the second sub-pad portion 22 having a small surface area, as a region where the mechanical strength of the second lead terminal 2 is weaker than that of the second main pad portion 21 and the second sub-pad portion 22.

[0033] With the above configuration, since the external terminal of the surface mount type piezoelectric oscillator 4 having a large surface area is bonded to the second main pad 21 having a large surface area by the conductive bonding material H, the mounting position of the surface mount type piezoelectric oscillator 4 on the lead terminal 1 is stable, and a more secure fixation can be realized. In addition, since the second sub-pad 22 having a small surface area has an area where the external terminal of the surface mount type electronic component 5 having a small surface area is bonded, it is easy to secure the mounting area of ​​the surface mount type electronic component 5 without invading the mounting area of ​​the surface mount type piezoelectric oscillator 4 as the main component, and space saving of the mounting area can be realized. In addition, since the narrow width portion 23 is formed between the second main pad 21 and the second sub-pad 22, even if thermal stress generated when forming the resin package portion 6 is transmitted from the second main pad 21 to which the surface mount type piezoelectric oscillator 4 having a larger surface area is conductively bonded to the second sub-pad 22 to which the surface mount type electronic component 5 having a small surface area is conductively bonded, the mutual stress can be alleviated.

[0034] 6, among the corners of the connection part of the narrow width part 23 of the lead terminal 2, the corners of the connection part of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the lead terminal 2 may be formed with R-processed parts 231R, 232R at the corners of the connection part of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 and the corners of the narrow width part 23 may be formed with C-processed parts at ...

[0035] A third main pad portion 31 having a large surface area relative to the third pad portion 30 is formed at the tip portion of the third pad portion 30 and is joined to one of the four external terminals 40 of the surface mount type piezoelectric oscillator described later.

[0036] In this embodiment, Cu (copper), 42 alloy (Ni (nickel) alloy), or the like is used as the base material of the lead terminals 1, 2, and 3. The surface of the base material is plated with an undercoat of Ni or the like, and then further plated with Ag (silver), Au (gold), or the like.

[0037] 3 and 5, in the lead type piezoelectric oscillator 100, the pads 10, 20, 30, the surface mount type piezoelectric oscillator 4, and the surface mount type electronic component 5 are resin-sealed in a resin package 6 formed using an insulating resin. Here, a portion of the base end side of each of the lead terminals 1, 2, 3 is also resin-sealed in the resin package 6. In this embodiment, the shape of the resin package 6 is a rectangular parallelepiped shape along the main surface of the pads of the lead terminals, but this is not limited thereto, and other shapes may be used as long as the pads 10, 20, 30, the surface mount type piezoelectric oscillator 4, and the surface mount type electronic component 5 can be resin-sealed.

[0038] The lead terminals 1, 2, and 3 are arranged adjacent to each other in the +X-axis direction. The lead terminal 1 extends from the first pad portion 10 in the -Y-axis direction, the lead terminal 2 extends from the second pad portion 20 in the -Y-axis direction, and the lead terminal 3 extends from the third pad portion 30 in the -Y-axis direction. That is, these lead terminals 1, 2, and 3 extend from the pad portions 10, 20, and 30 in the same direction, that is, in the -Y-axis direction. In this embodiment, the lead terminal 1 is a lead terminal for inputting a power supply voltage, the lead terminal 2 is an earth terminal for grounding, and the lead terminal 3 is a lead terminal for extracting an output frequency signal. The combination (extension state) of the lead terminals 1, 2, and 3 and the pad portions 10, 20, and 30 shown in this embodiment is merely an example, and can be arbitrarily changed according to the specifications of the lead-type piezoelectric oscillator 100, etc.

[0039] Furthermore, although not shown, the plating layers on the inner walls of the through holes 71, 72, 73 and the lead terminals 1, 2, 3 are electrically connected to each other using solder or the like.

[0040] When used as the surface mount type piezoelectric oscillator 4, the surface mount type piezoelectric oscillator can be used generally as a lead type piezoelectric oscillator, and the manufacturing costs of electronic components can be reduced.

[0041] In this embodiment, a case will be described in which a surface mount type crystal oscillator equipped with an electronic component element consisting of a crystal vibrating piece 54 is used as the surface mount type piezoelectric oscillator 4. Fig. 4 is a cross-sectional view showing an example of a surface mount type piezoelectric oscillator 4 according to an embodiment of the present invention, which includes a housing 14 composed of an insulating base 34 made of a ceramic multilayer substrate and a lid 24 covering the opening portion of a stepped recess 341.

[0042] In this surface mount type piezoelectric oscillator 4, the contact portion (outer periphery) of the base 34 and the lid 24 are joined by a sealing adhesive (not shown), and this joining hermetically seals the inside (cavity) of the housing 14.

[0043] The lid 24 is formed using a conductive material such as metal, and is electrically connected to the pad section 20 formed integrally with the grounding lead terminal 2, thereby eliminating noise. The lid 24 is not limited to a conductive material, and may be formed using an insulating material such as ceramic. Although not shown, the lid 24 and the pad section 20 are preferably electrically connected via a wiring pattern or wire formed on the housing 14.

[0044] The base 34 is provided with a stepped recess 341 as a cavity on one surface (the surface on the upper side of the drawing (hereinafter referred to as the upper side)).

[0045] Two steps are provided in the stepped recess 341. A quartz crystal vibrating piece 54 having a pair of excitation electrodes (not shown) formed on both main surfaces is placed on an upper step 342 (a step portion closest to the opening of the stepped recess 341) of the stepped recess 341, and an end of the quartz crystal vibrating piece 54 is supported by at least a part of the upper step 342.

[0046] A plurality of electrode pads (not shown) are provided on the upper step 342 of the stepped recess 341, and each excitation electrode of the quartz crystal vibrating piece 54 is bonded to the plurality of electrode pads using a conductive bonding material 741 and a conductive bonding material 742. The two conductive bonding materials 741, 742 are disposed at the same position in the cross-sectional view shown in Fig. 4, and are disposed on the front side of the paper (hereinafter referred to as the front side) and the rear side of the paper (hereinafter referred to as the rear side). The conductive bonding materials 741, 742 may be a resin adhesive, a metal bump, a plated bump, or the like.

[0047] An integrated circuit element 64 (IC) including an oscillator circuit such as a CMOS and an amplifier circuit is placed on a bottom surface 343 of the stepped recess 341. The integrated circuit element 64 has a plurality of external terminals (not shown), and the plurality of external terminals of the integrated circuit element 64 are wire-bonded to a plurality of electrode pads (not shown) provided on a lower step portion (a step portion provided closer to the bottom surface 343 than the upper step portion 342) 344 of the stepped recess 341, via a plurality of wires 84. Note that instead of wire bonding using the wires 84, flip chip bonding (FCB) using metal bumps may be used.

[0048] The surface mount type piezoelectric oscillator 4 shown in Fig. 4 has four external terminals 40 (see Fig. 3). These external terminals 40 are formed on the outer surface (the lower side of the paper (hereinafter referred to as the lower side)) of the base 34. For example, the external terminals 40 are divided into one electrically connected to an external terminal for inputting a power supply voltage of the integrated circuit element 64, one electrically connected to an external terminal for controlling the output of the integrated circuit element 64, one electrically connected to an external terminal for grounding the integrated circuit element 64, and one electrically connected to an external terminal for taking out an output signal from the integrated circuit element 64.

[0049] At least a portion of the excitation electrode of the quartz crystal vibrating piece 54 placed on the upper step 342 of the stepped recess 341 and at least a portion of the external terminal of the integrated circuit element 64 placed on the lower step 344 of the stepped recess 341 are electrically connected in accordance with the specifications of the surface mount type piezoelectric oscillator 4.

[0050] 3 and 4, the external terminals 40 of the surface mount type piezoelectric oscillator 4 are mounted facing (opposing) the mounting surfaces (one of the main surfaces) of the pads 10, 20, and 30. In this state, in the lead type piezoelectric oscillator 100, two of the external terminals 40 are fixed and connected to the surface of the pad 10 (first main pad 11 and first main pad 2 12), one of the external terminals 40 is fixed to the surface of the pad 20 (second main pad 21), and one of the external terminals 40 is fixed to the surface of the pad 30 (third main pad 31) using a conductive bonding material H such as solder.

[0051] The surface mount electronic component 5 has a smaller surface area than the surface mount piezoelectric oscillator 4, and is made of, for example, a chip capacitor, and has two external terminals 50 on the outer surfaces of both ends in the long side direction (see FIG. 3). In the lead type piezoelectric oscillator 100 shown in FIGS. 3 and 4, the external terminals 50 of the surface mount electronic component 5 are mounted facing (opposing) the mounting surfaces (one of the main surfaces) of the pads 10 and 20. In this state, in the lead type piezoelectric oscillator 100, one of the external terminals 50 is fixed and connected to the surface of the pad 10 (first sub-pad 13), and one of the external terminals 50 is fixed to the surface of the pad 20 (second sub-pad 22) using a conductive bonding material H such as solder.

[0052] That is, in the chip capacitor (surface mount electronic component 5) of this embodiment, a portion electrically connected to an external terminal for inputting a power supply voltage of the integrated circuit element 64 of the surface mount piezoelectric oscillator 4 and a portion electrically connected to an external terminal for grounding the integrated circuit element 64 are connected in close proximity in parallel. Therefore, when functioning as a bypass capacitor, it is possible to effectively remove noise from an external power supply. Also, in the case of an IC using a CMOS oscillation circuit as in this embodiment, by interposing a bypass capacitor, even if the potential supplied to the IC changes suddenly, it can be compensated for by the charge stored in the bypass capacitor, so that abnormalities in the output waveform as an oscillator can be suppressed.

[0053] In the lead-type piezoelectric oscillator 100 shown in Figs. 1 and 3, two external terminals 40 (power supply terminal and output control terminal) are commonly connected to the surface of the pad section 10 to input a power supply voltage. In addition, one external terminal 40 (ground terminal) is connected to the surface of the pad section 20, and one external terminal 40 (output terminal) is connected to the surface of the pad section 30. As a result, the lead terminal 1 of the lead-type piezoelectric oscillator 100 functions as a power supply terminal, the lead terminal 2 of the lead-type piezoelectric oscillator 100 functions as a ground terminal, and the lead terminal 3 of the lead-type piezoelectric oscillator 100 functions as an output terminal. However, in the present invention, the number of the pad sections, the number of the lead terminals, and the connection state between the pad sections 10, 20, and 30 and the external terminals 40 are not limited to those shown in Figs. 2 and 3, and can be appropriately changed according to the specifications of the lead-type piezoelectric oscillator 100.

[0054] In addition, in this embodiment, a solder material that is inexpensive and can provide strong bonding is disclosed as the conductive bonding material H that electrically and mechanically bonds the pad portions 10, 20, 30 to the external terminal 40 or the external terminal 50, but the material is not limited to these and a conductive adhesive may be used, or an FCB using an Au bump may be used.

[0055] As shown in Fig. 2 and Fig. 3, each of the lead terminals 1, 2, and 3 has a narrow pitch portion (a portion indicated by region D1 in the figures) where the pitch between adjacent lead terminals is narrow, and a wide pitch portion (a portion indicated by region D3 in the figures) where the pitch between adjacent lead terminals is wide. The narrow pitch portion is disposed closer to the base end side (pad portion 10, 20, 30 side) of each of the lead terminals 1, 2, and 3 than the wide pitch portion. In the lead-type piezoelectric oscillator 100 shown in Fig. 1, in order to provide the narrow pitch portion and the wide pitch portion, the portion (a portion indicated by region D2 in the figures) disposed between the narrow pitch portion and the wide pitch portion in the lead terminals 1 and 3 is configured with an oblique portion that moves away from the lead terminal 2 from the base end side toward the tip end side.

[0056] The pitch of the lead terminals 1, 2, and 3 (the dimension of the gap between the lead terminals 1, 2, and 3 in the X-axis direction) is appropriately set in accordance with the specifications of the surface mount piezoelectric oscillator 4 mounted on the pad portions 10, 20, and 30 (e.g., the dimensions of the external shape and external terminals, etc.) and the specifications of the wiring board 7 (e.g., the spacing between each of the through holes 71 to 73, etc.).

[0057] According to an embodiment of the present invention, by effectively and integrally attaching a surface mount type piezoelectric oscillator 4 and a surface mount type electronic component 5 to lead terminals 1, 2, and 3, it is possible to provide a lead type piezoelectric oscillator 100 with improved characteristics and higher reliability.

[0058] In the above embodiment, the mechanically weak portion between the main pad portion and the sub-pad portion is constituted by the narrow portions 16, 23 where the width of the lead terminal is narrowed, but it may be constituted by a through hole or by a thin portion where the thickness of the lead terminal is partially thinned. Also, the narrow portions 16 and 23 are formed in correspondence with the portions close to the two external terminals 50, 50 of the surface mount electronic component 5, but it may be constituted by forming only one of them.

[0059] In the above embodiment, the surface mount type electronic component 5 is mounted on one surface mount type electronic component 5, but the present invention is not limited to this and can be applied to a surface mount type electronic component mounted on a plurality of surface mount type electronic components. Although a capacitor is used as an example of the surface mount type electronic component 5, the present invention can be applied to a surface mount type electronic component mounted on a plurality of surface mount type electronic components such as a resistor or a coil, as long as the surface mount type electronic component 5 can improve the characteristics of the surface mount type piezoelectric oscillator 4.

[0060] In the above embodiment, the corners of the narrow portions of the lead terminals 1 and 2 are rounded, but as shown in FIG. 7, the corners of all the lead terminals 1, 2, and 3 may be rounded or chamfered. In the lead terminal 1 of this embodiment, no narrow portion is formed between the first main pad portion (first main pad portion 12) and the first sub-pad portion 13. In the present invention, even if only the narrow portion 23 of the lead terminal 2 is formed (a region with weak mechanical strength is formed only in one of the pair of lead terminals) as in this embodiment, it is possible to make it function as a stress absorbing portion that relieves thermal stress in the lead terminals 1 and 2 and absorbs stress due to mechanical deformation of the lead terminals.

[0061] The present invention can be embodied in various other forms without departing from its spirit, purpose, or main features. Therefore, the above-described embodiments are merely illustrative in all respects and should not be interpreted as being limited. The scope of the present invention is defined by the claims, and is not limited in any way by the text of the specification. Furthermore, all modifications and changes within the scope of the claims are within the scope of the present invention. [Industrial Applicability]

[0062] The present invention is applicable to a leaded piezoelectric vibration oscillator. [Explanation of symbols]

[0063] 1 First lead terminal 10 First pad section 11 First main pad part 12 First main pad part 13 First secondary pad section 14 Notch 15 First external connection part 2 Second lead terminal 20 Second pad section 21 Second main pad section 22 Second sub-pad section 25 Second external connection part 3 Third lead terminal 30 3rd pad section 31 Third main pad section 35 Third external connection part 4. Surface mount type piezoelectric oscillator 40 External terminal 5. Surface mount electronic components 50 External terminal 6 Resin package part 7 Wiring board 100 Lead type piezoelectric oscillator H Conductive bonding material

Claims

1. A plurality of lead terminals each having a plurality of pad portions formed at one end and an external connection portion formed at the other end; a surface mount type piezoelectric oscillator having a plurality of external terminals formed on an outer surface thereof, and a part of the plurality of pad portions and the plurality of external terminals being conductively connected to each other; a surface mount electronic component having a plurality of external terminals formed on an outer surface thereof, the surface mount electronic component being electrically connected to the surface mount piezoelectric oscillator by conductively joining some of the plurality of pad portions to the plurality of external terminals; a resin package portion is formed to cover the pad portions of the plurality of lead terminals, the surface mount type piezoelectric oscillator, and the surface mount type electronic component; The surface mount electronic component has a smaller surface area than the surface mount piezoelectric oscillator, The plurality of pad portions include a main pad portion that is electrically connected to a plurality of external terminals of the surface mount type piezoelectric oscillator; a sub-pad portion that is conductively connected to a plurality of external terminals of the surface mount electronic component; a region formed between the main pad portion and the sub-pad portion and having a mechanical strength weaker than that of the main pad portion and the sub-pad portion; 1. A lead-type piezoelectric oscillator comprising:

2. A plurality of lead terminals each having a plurality of pad portions formed at one end and an external connection portion formed at the other end; a surface mount type piezoelectric oscillator having a plurality of external terminals formed on an outer surface thereof, and a part of the plurality of pad portions and the plurality of external terminals being conductively connected to each other; a surface mount electronic component having a plurality of external terminals formed on an outer surface thereof, the surface mount electronic component being electrically connected to the surface mount piezoelectric oscillator by conductively joining some of the plurality of pad portions to the plurality of external terminals; a resin package portion is formed to cover the pad portions of the plurality of lead terminals, the surface mount type piezoelectric oscillator, and the surface mount type electronic component; The surface mount electronic component has fewer external terminals than the surface mount piezoelectric oscillator, The plurality of pad portions include a main pad portion that is electrically connected to a plurality of external terminals of the surface mount type piezoelectric oscillator; a sub-pad section that is conductively connected to a plurality of external terminals of the surface mount electronic component and has a smaller number of pad sections than the main pad section; a region formed between the main pad portion and the sub-pad portion and having a mechanical strength weaker than that of the main pad portion and the sub-pad portion; 1. A lead-type piezoelectric oscillator comprising:

3. A lead-type piezoelectric oscillator according to claim 1 or claim 2, The area of ​​the lead terminal that is mechanically weak is constituted by a narrow portion in which the width of the main surface of the pad portion of the lead terminal is narrowed.

1. A lead-type piezoelectric oscillator comprising:

4. A lead-type piezoelectric oscillator according to claim 3, A rounded corner is formed at the narrow connecting portion of the lead terminal.

1. A lead-type piezoelectric oscillator comprising:

5. A lead-type piezoelectric oscillator according to any one of claims 1 to 4, The surface mount electronic component is a capacitor.

1. A lead-type piezoelectric oscillator comprising:

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