Coil component and manufacturing method thereof

Abstract

To provide a coil component having such a structure that a magnetic member is easily embedded in an inner diameter region of a spiral pattern.SOLUTION: A coil component 1 includes conductor layers 10 to 60 which are arranged between magnetic members M1 and M2 and include spirally wound spiral patterns SP1 to SP6, insulation resin layers 71 to 75 which are provided among the conductor layers 10 to 60, and a magnetic member M3 which is embedded in the inner diameter region of the spiral patterns SP1 to SP6. The insulation resin layers 71 to 75 have projection parts projecting to the inner diameter region. The projection part of the insulation resin layer 75 has a projection amount shorter than a projection amount of the projection part of at least the other insulation resin layer. Thereby, the magnetic member M3 is easily embedded in the inner diameter region from one end side in a coil axis direction. More magnetic members M3 can be embedded in the inner diameter region, which can enhance an inductance.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a coil component and a manufacturing method thereof, and more particularly to a coil component having a structure in which a magnetic member is embedded in an inner diameter region of a spiral pattern wound in a spiral shape, and a manufacturing method thereof. [Background technology]

[0002] As a coil component having a structure in which spiral patterns wound in a spiral shape are laminated, there is known the coil component described in Patent Document 1. The coil component described in Patent Document 1 has a structure in which a magnetic member is embedded in the inner diameter region of the spiral pattern, thereby increasing the inductance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-140202 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the coil component described in Patent Document 1, a part of the insulating resin layer protrudes into the inner diameter region of the spiral pattern, and there is a risk that such a protruding part may prevent the embedding of the magnetic member.

[0005] Therefore, an object of the present invention is to provide a coil component having a structure that allows a magnetic material to be easily embedded in the inner diameter region of a spiral pattern, and a manufacturing method thereof. [Means for solving the problem]

[0006] The coil component according to the present invention comprises first and second magnetic members, a plurality of conductor layers arranged between the first and second magnetic members, each of which includes a spiral pattern wound in a spiral shape, a plurality of insulating resin layers respectively provided between the plurality of conductor layers, and a third magnetic member embedded in an inner diameter region of the spiral pattern, wherein the plurality of insulating resin layers have first protrusions protruding into the inner diameter region, and the first protrusion of an insulating resin layer located at one end side in the coil axis direction among the plurality of insulating resin layers has a shorter protrusion amount than the first protrusion of at least one other insulating resin layer.

[0007] According to the present invention, since the first protruding portion of the insulating resin layer located at one end side in the coil axial direction is short, it is easy to embed the third magnetic member in the inner diameter region from the one end side in the coil axial direction. Moreover, since a larger amount of magnetic member can be embedded in the inner diameter region, it is possible to increase the inductance.

[0008] In the present invention, some of the first protrusions may protrude longer from one end side of the coil axis direction to the other end side. In this case, it is also easy to embed the third magnetic member in the inner diameter region from one end side of the coil axis direction. Moreover, since the protrusions near the other end side of the coil axis direction are relatively long, damage caused by removing the protrusions can be minimized.

[0009] In the present invention, the first protruding portion of the insulating resin layer located at the other end side in the coil axis direction among the plurality of insulating resin layers may have a shorter protruding amount than the first protruding portion of at least one other insulating resin layer, which allows a larger amount of magnetic material to be embedded in the inner diameter region, thereby further increasing the inductance.

[0010] The coil component according to the present invention further includes a fourth magnetic member located in the outer region of the spiral pattern, and the insulating resin layers further have second protruding portions protruding into the outer region, and the second protruding portion of the insulating resin layer located at one end side of the coil axis direction among the insulating resin layers may have a shorter protruding amount than the second protruding portion of at least one other insulating resin layer. This makes it easier to embed the fourth magnetic member in the outer region from one end side of the coil axis direction when manufacturing multiple coil components by multiple-cavity manufacturing. Moreover, since more magnetic members can be embedded in the outer region, it is also possible to increase the inductance.

[0011] The manufacturing method of a coil component according to the present invention is characterized by comprising the steps of alternately stacking a plurality of conductor layers and a plurality of insulating resin layers, including a spiral pattern wound in a spiral shape and a sacrificial pattern located in the inner diameter region of the spiral pattern, forming a space in the inner diameter region of the spiral pattern by removing the sacrificial pattern, removing a portion of a protruding portion made of the plurality of insulating resin layers protruding into the space, and embedding a magnetic material in the space.

[0012] According to the present invention, since a portion of the protruding portion made of the insulating resin layer is removed, it becomes easier to fill the space with the magnetic member. Effect of the Invention

[0013] As described above, according to the present invention, it is possible to provide a coil component having a structure that allows a magnetic material to be easily embedded in the inner diameter region of a spiral pattern, and a method for manufacturing the same. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic cross-sectional view for illustrating the structure of a coil component 1 according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic plan view of the conductor layer 10. As shown in FIG. [Diagram 3] FIG. 3 is a schematic plan view of the conductor layers 20 and 40. As shown in FIG. [Figure 4]FIG. 4 is a schematic plan view of the conductor layers 30 and 50. As shown in FIG. [Diagram 5] FIG. 5 is a schematic plan view of the conductor layer 60. As shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view for explaining the shape of the protrusions provided on the insulating resin layers 70 to 76. As shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view for explaining the shape of the protrusion according to the first modified example. [Figure 8] FIG. 8 is a schematic cross-sectional view for explaining the shape of the protrusion according to the second modified example. [Figure 9] FIG. 9 is a process diagram for explaining a method for manufacturing the coil device 1. As shown in FIG. [Figure 10] FIG. 10 is a process diagram for explaining a method for manufacturing the coil device 1. As shown in FIG. [Figure 11] FIG. 11 is a process diagram for explaining a manufacturing method of the coil device 1. As shown in FIG. [Figure 12] FIG. 12 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 13] FIG. 13 is a process diagram for explaining a method for manufacturing the coil device 1. As shown in FIG. [Figure 14] FIG. 14 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 15] FIG. 15 is a process diagram for explaining a manufacturing method of the coil device 1. As shown in FIG. [Figure 16] FIG. 16 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 17] FIG. 17 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 18] FIG. 18 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 19] FIG. 19 is a process diagram for explaining a manufacturing method of the coil device 1. [Figure 20] FIG. 20 is a process diagram for explaining a manufacturing method of the coil device 1. As shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0016] FIG. 1 is a schematic cross-sectional view for illustrating the structure of a coil component 1 according to an embodiment of the present invention.

[0017] The coil component 1 according to the first embodiment is a surface-mount type chip component, and includes magnetic members M1 to M4 and a coil pattern C embedded in the magnetic members M1 to M4, as shown in Fig. 1. The configuration of the coil pattern C will be described later, but in this embodiment it is made up of spiral patterns SP1 to SP6 wound in a spiral shape with multiple turns.

[0018] The magnetic members M1 to M4 are composite members containing a metal magnetic filler made of iron (Fe) or a permalloy-based material and a resin binder, and constitute a magnetic path for a magnetic flux generated by passing a current through the coil pattern C. As the resin binder, it is preferable to use a liquid or powder epoxy resin. The materials constituting the magnetic members M1 to M4 may be the same as each other or may be different from each other. Here, the magnetic member M1 is a portion that covers the coil pattern C from one side in the axial direction (the upper side shown in FIG. 1), the magnetic member M2 is a portion that covers the coil pattern C from the other side in the axial direction (the lower side shown in FIG. 1), the magnetic member M3 is a portion that is embedded in the inner diameter region of the coil pattern C, and the magnetic member M4 is a portion that is located in the outer region in the radial direction of the coil pattern C. The magnetic member M2 may be a magnetic substrate made of ferrite or the like.

[0019] As shown in FIG. 1, the insulating resin layers 70-76 and the conductor layers 10, 20, 30, 40, 50, 60 are alternately laminated in the axial direction. The planar shape of the conductor layer 10 is shown in FIG. 2, the planar shapes of the conductor layers 20, 40 are shown in FIG. 3, the planar shapes of the conductor layers 30, 50 are shown in FIG. 4, and the planar shape of the conductor layer 60 is shown in FIG. The conductor layers 10, 20, 30, 40, 50, 60 each have a spiral pattern SP1-SP6, and the upper or lower surfaces of the spiral patterns SP1-SP6 are covered with the insulating resin layers 70-76. The side surfaces of the spiral patterns SP1-SP6 are covered with parts of the insulating resin layers 71-76, respectively. Here, the upper and lower surfaces of the spiral patterns SP1-SP6 refer to surfaces that are approximately perpendicular to the coil axis, and the side surfaces of the spiral patterns SP1-SP6 refer to surfaces that are approximately perpendicular to the radial direction.

[0020] The spiral patterns SP1 to SP6 are connected to each other through via holes formed in the insulating resin layers 71 to 75 to form one coil conductor. The conductor layers 10, 20, 30, 40, 50, and 60 are preferably made of copper (Cu). Of the insulating resin layers 70 to 76, at least the insulating resin layers 71 to 75 are made of a non-magnetic material. The insulating resin layer 70 located at the bottom layer and the insulating resin layer 76 located at the top layer may be magnetic.

[0021] The conductor layer 10 is a first conductor layer formed on the upper surface of the magnetic member M2 via an insulating resin layer 70, and has a spiral pattern SP1 wound in a spiral shape with about three turns, and two electrode patterns 11 and 12, as shown in FIG. 2. The lower surface of the spiral pattern SP1 is covered with the insulating resin layer 70, and the side and upper surfaces of the spiral pattern SP1 are covered with the insulating resin layer 71. As a result, the insulating resin layer 71 is interposed between the spiral pattern SP1 and the magnetic members M3 and M4. The electrode pattern 11 is connected to the outer circumferential end of the spiral pattern SP1. The electrode pattern 12 is provided independently of the spiral pattern SP1.

[0022] The conductor layer 20 is a second conductor layer formed on the upper surface of the conductor layer 10 via an insulating resin layer 71, and has a spiral pattern SP2 wound in a spiral shape with about three turns, and two electrode patterns 21, 22, as shown in Fig. 3. The lower surface of the spiral pattern SP2 is covered with the insulating resin layer 71, and the side and upper surfaces of the spiral pattern SP2 are covered with the insulating resin layer 72. As a result, the insulating resin layer 72 is interposed between the spiral pattern SP2 and the magnetic members M3, M4. The electrode patterns 21, 22 are both provided independently of the spiral pattern SP2.

[0023] The conductor layer 30 is a third conductor layer formed on the upper surface of the conductor layer 20 via an insulating resin layer 72, and has a spiral pattern SP3 wound in a spiral shape with about three turns, and two electrode patterns 31 and 32, as shown in Fig. 4. The lower surface of the spiral pattern SP3 is covered with the insulating resin layer 72, and the side and upper surfaces of the spiral pattern SP3 are covered with the insulating resin layer 73. As a result, the insulating resin layer 73 is interposed between the spiral pattern SP3 and the magnetic members M3 and M4. The electrode patterns 31 and 32 are both provided independently of the spiral pattern SP3.

[0024] The conductor layer 40 is a fourth conductor layer formed on the upper surface of the conductor layer 30 via an insulating resin layer 73, and has a spiral pattern SP4 wound in a spiral shape with about three turns, and two electrode patterns 41, 42, as shown in Fig. 3. The lower surface of the spiral pattern SP4 is covered with the insulating resin layer 73, and the side and upper surfaces of the spiral pattern SP4 are covered with the insulating resin layer 74. As a result, the insulating resin layer 74 is interposed between the spiral pattern SP4 and the magnetic members M3, M4. The electrode patterns 41, 42 are both provided independently of the spiral pattern SP4.

[0025] The conductor layer 50 is a fifth conductor layer formed on the upper surface of the conductor layer 40 via an insulating resin layer 74, and has a spiral pattern SP5 wound in a spiral shape with about three turns, and two electrode patterns 51, 52, as shown in Fig. 4. The lower surface of the spiral pattern SP5 is covered with the insulating resin layer 74, and the side and upper surfaces of the spiral pattern SP5 are covered with the insulating resin layer 75. As a result, the insulating resin layer 75 is interposed between the spiral pattern SP5 and the magnetic members M3, M4. The electrode patterns 51, 52 are both provided independently of the spiral pattern SP5.

[0026] The conductor layer 60 is a sixth conductor layer formed on the upper surface of the conductor layer 50 via an insulating resin layer 75, and has a spiral pattern SP6 wound in a spiral shape with about 2.5 turns, and two electrode patterns 61, 62, as shown in FIG. 5. The lower surface of the spiral pattern SP6 is covered with the insulating resin layer 75, and the side and upper surfaces of the spiral pattern SP6 are covered with the insulating resin layer 76. As a result, the insulating resin layer 76 is interposed between the spiral pattern SP6 and the magnetic members M3, M4. The electrode pattern 62 is connected to the outer circumferential end of the spiral pattern SP6. The electrode pattern 61 is provided independently of the spiral pattern SP6.

[0027] The inner peripheral end of the spiral pattern SP1 and the inner peripheral end of the spiral pattern SP2 are connected via a via conductor 81 that is a part of the conductor layer 20 and is provided to penetrate the insulating resin layer 71. The outer peripheral end of the spiral pattern SP2 and the outer peripheral end of the spiral pattern SP3 are connected via a via conductor 82 that is a part of the conductor layer 30 and is provided to penetrate the insulating resin layer 72. The inner peripheral end of the spiral pattern SP3 and the inner peripheral end of the spiral pattern SP4 are connected via a via conductor 83 that is a part of the conductor layer 40 and is provided to penetrate the insulating resin layer 73. The outer peripheral end of the spiral pattern SP4 and the outer peripheral end of the spiral pattern SP5 are connected via a via conductor 84 that is a part of the conductor layer 50 and is provided to penetrate the insulating resin layer material 74. The inner peripheral end of the spiral pattern SP5 and the inner peripheral end of the spiral pattern SP6 are connected via a via conductor 85 that is a part of the conductor layer 60 and is provided to penetrate the insulating resin layer 75. As a result, the spiral patterns SP1 to SP6 are connected in series to form a coil conductor consisting of multiple turns. The electrode patterns 11, 21, 31, 41, 51, and 61 are exposed from the magnetic members M1 to M4 and are used as one external terminal. The electrode patterns 12, 22, 32, 42, 52, and 62 are exposed from the magnetic members M1 to M4 and are used as the other external terminal.

[0028] 1, at least some of the insulating resin layers 70 to 76 have protruding portions that protrude into the inner diameter region and the outer diameter region. The radial protruding amount of the protruding portions is not constant among the insulating resin layers 70 to 76, and some protruding portions have long lengths and some have short lengths.

[0029] FIG. 6 is a schematic cross-sectional view for explaining the shape of the protrusions provided on the insulating resin layers 70 to 76. As shown in FIG.

[0030] 6, the insulating resin layers 70 to 75 have protruding portions 70a to 75a protruding into the inner diameter region and the outer diameter region, respectively. Here, assuming that the protruding amounts in the radial direction of the protruding portions 71a to 75a are L1 to L5, respectively, L1>L2>L3>L4>L5 That is, the protrusion amounts L1 to L5 of the insulating resin layers 71 to 75 located between the two conductor layers gradually become shorter from the lower layer to the upper layer, and the protrusion amount of the protrusion 75a of the insulating resin layer 75 is the shortest. The protrusion amount L0 of the protrusion 70a of the insulating resin layer 70 located in the lowermost layer may be approximately the same as the protrusion amount L1 of the protrusion 71a of the insulating resin layer 71. In the example shown in FIG. 6, the insulating resin layer 76 located in the uppermost layer does not have a protrusion, but the insulating resin layer 76 may also have a protrusion. In addition, the protrusion amount of the spiral patterns SP1 to SP6 toward the inner diameter region and the protrusion amount of the spiral patterns SP1 to SP6 toward the outer region may be the same or different.

[0031] Fig. 7 is a schematic cross-sectional view for explaining the shape of the protrusion according to the first modified example. In the example shown in Fig. 7, no protrusion is provided on the insulating resin layers 74 and 75. In this way, it is not necessary for the protrusion to be present in some insulating resin layers located between two conductor layers.

[0032] Fig. 8 is a schematic cross-sectional view for explaining the shape of the protrusion according to the second modified example. In the example shown in Fig. 8, the protrusion amount L1 of the protrusion 71a provided on the insulating resin layer 71 is shortened and is shorter than at least the protrusion amount L2 of the protrusion 72a. Furthermore, no protrusion is provided on the insulating resin layer 70. In this manner, it is not essential that the protrusion amounts L1 to L5 gradually become shorter from the lower layer to the upper layer, and the protrusion amount L1 of the protrusion 71a may be shorter than the protrusion amount L2 of the protrusion 72a.

[0033] In this way, in the coil component 1 according to the present embodiment, the protrusion amounts L1 to L5 of the insulating resin layers 71 to 75 protruding into the inner diameter region and the outer diameter region of the spiral patterns SP1 to SP6 are partially shortened, and the volume of the magnetic members M3 and M4 filled in the inner diameter region and the outer diameter region is increased accordingly. This makes it possible to increase the inductance without increasing the chip size.

[0034] Next, a method for manufacturing the coil component 1 according to the present embodiment will be described.

[0035] 9 to 20 are process diagrams illustrating a manufacturing method of the coil component 1 according to this embodiment. The process diagrams shown in Fig. 9 to 20 show a cross section corresponding to one coil component 1, but in reality, a large number of coil components 1 can be produced simultaneously by using an aggregate substrate.

[0036] First, a support is prepared in which a metal foil 91 such as copper (Cu) is provided on the surface of a base material 90, and an insulating resin layer 70 and a seed layer S are formed on the surface of the metal foil 91 (FIG. 9). Next, a resist pattern R is formed on the surface of the seed layer S (FIG. 10). The resist pattern R is a negative pattern of the conductor layer 10. In this state, the seed layer S is grown by electrolytic plating to form the conductor layer 10 (FIG. 11). At this time, a sacrificial pattern VP3 is formed in the inner diameter region of the spiral pattern SP1, and a sacrificial pattern VP4 is formed in the outer region of the spiral pattern SP1.

[0037] Next, after the resist pattern R is peeled off, the seed layer S exposed in the peeled portion of the resist pattern R is removed by etching (FIG. 12). As a result, the spiral pattern SP1 and the sacrificial patterns VP3 and VP4 are electrically separated by the spiral slit SL. Next, the insulating resin layer 71 and the metal foil 92 are formed on the surface of the conductor layer 10 so as to fill the slit SL (FIG. 13). The insulating resin layer 71 and the metal foil 92 can be formed by a lamination method. Next, the metal foil 92 is patterned to remove the metal foil 92 from the portion overlapping with the sacrificial patterns VP3 and VP4, and then the sacrificial patterns VP3 and VP4 are exposed by blasting using the metal foil 92 as a mask (FIG. 14). Next, after removing the metal foil 92 (FIG. 15), an opening for forming the via conductor 81 (see FIG. 2) is formed in the insulating resin layer 71 by laser processing. Through the above steps, the formation of the conductor layer 10 and the insulating resin layer 71 is completed.

[0038] 9 to 15 are then repeated to sequentially form conductor layer 20, insulating resin layer 72, conductor layer 30, insulating resin layer 73, conductor layer 40, insulating resin layer 74, conductor layer 50, insulating resin layer 75, conductor layer 60, and insulating resin layer 76 (FIG. 16). In the conductor layers 20, 30, 40, 50, and 60, too, a sacrificial pattern VP3 is included in the inner diameter region of the spiral patterns SP2 to SP6, and a sacrificial pattern VP4 is included in the outer region of the spiral patterns SP2 to SP6. The sacrificial patterns VP3 and VP4 of the conductor layer 60 located at the top layer are exposed from an opening provided in the insulating resin layer 76.

[0039] In this state, wet etching is performed to remove the sacrificial patterns VP3, VP4 (FIG. 17). The spiral patterns SP1-SP6 are not etched as they are covered with the insulating resin layers 70-76. As a result, a space S3 is formed in the inner diameter region of the spiral patterns SP1-SP6, and a space S4 is formed in the outer region of the spiral patterns SP1-SP6. Furthermore, parts of the insulating resin layers 71-76 protrude into the spaces S3, S4. At this point, there is no substantial difference in the amount of protrusion of the insulating resin layers 71-76 into the spaces S3, S4.

[0040] Next, a laser beam 93 is applied to the insulating resin layer 70 exposed in the spaces S3 and S4 and the insulating resin layers 71-76 protruding into the spaces S3 and S4 to remove a part of the exposed part of the insulating resin layer 70 and a part of the protruding parts of the insulating resin layers 71-76 (FIG. 18). At this time, the laser processing may be performed with the upper surface of the insulating resin layer 76 covered with metal foil so as not to damage the upper surface of the insulating resin layer 76. Alternatively, blast processing may be performed instead of the laser processing.

[0041] At this time, it is ideal to remove all of the insulating resin layers 70-76 exposed or protruding into the spaces S3 and S4, but in order to remove all of the insulating resin layers 70-76 exposed or protruding into the spaces S3 and S4, not only is a long processing time required, but damage to the parts of the insulating resin layers 70-76 that should not be removed is also large. Therefore, instead of removing all of the insulating resin layers 70-76 exposed or protruding into the spaces S3 and S4, the protruding parts are partially removed under conditions such that the protruding amount of the insulating resin layer located at the upper layer is shorter, as explained using FIG. 6 and FIG. 7. Depending on the conditions, the protruding amount of the insulating resin layer 71 at the lower layer is also shortened, as explained using FIG. 8. This is because the laser beam 93 reflected by the metal foil 91 is irradiated to the protruding part of the insulating resin layer 71. In this manner, in this embodiment, the insulating resin layers 70-76 exposed or protruding into the spaces S3, S4 are partially removed by setting the conditions for the laser processing or blast processing so as not to cause significant damage to the portions of the insulating resin layers 70-76 that should not be removed.

[0042] Next, the magnetic members M3 and M4 are formed to fill the spaces S3 and S4, and the magnetic member M1 is formed to cover the insulating resin layer 76 (FIG. 19). The magnetic members M3 and M4 to be filled in the spaces S3 and S4 are pushed from the insulating resin layer 76 located in the upper layer to the insulating resin layer 70 located in the lower layer. As described with reference to FIGS. 6 to 8, the insulating resin layer located in the upper layer is processed so that the protruding amount is shorter. This makes it possible to efficiently fill the magnetic members M3 and M4, and also makes it difficult for voids where the magnetic members M3 and M4 do not exist to occur in the spaces S3 and S4. Next, the base material 90 and the metal foil 91 are removed (FIG. 20). Then, after forming the magnetic member M2 to cover the insulating resin layer 70, the coil component 1 according to the present embodiment shown in FIG. 1 is completed by dicing into individual pieces.

[0043] In this embodiment, after the spaces S3, S4 are formed by removing the sacrificial patterns VP3, VP4, the insulating resin layers 70-76 exposed or protruding into the spaces S3, S4 are partially removed before the magnetic members M3, M4 are embedded in the spaces S3, S4, so that the magnetic members M3, M4 can be embedded smoothly and the volume of the magnetic members M3, M4 increases due to the expansion of the spaces S3, S4. Moreover, the insulating resin layers 70-76 exposed or protruding into the spaces S3, S4 are only partially removed, so that the portions of the insulating resin layers 70-76 that should not be removed are not significantly damaged.

[0044] Although a preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention, and it goes without saying that these modifications are also included within the scope of the present invention. [Explanation of symbols]

[0045] 1 Coil parts 10,20,30,40,50,60 Conductor layers 11,12,21,22,31,32,41,42,51,52,61,62 Electrode pattern 70~76 Insulating resin layer 70a~75a Protruding part 81~85 Via conductor 90 Base material 91 Metal foil 92 Metal foil 93 Laser Beam C coil pattern M1~M4 Magnetic members R resist pattern S seed layer S3,S4 space SL Slit SP1~SP6 Spiral Pattern VP3, VP4 Sacrifice Pattern

Claims

1. First and second magnetic members; a plurality of conductor layers disposed between the first magnetic member and the second magnetic member, each of the conductor layers including a spiral pattern wound in a spiral shape; A plurality of insulating resin layers provided between the plurality of conductor layers, a third magnetic member embedded in an inner diameter region of the spiral pattern; The insulating resin layers each have a first protruding portion protruding into the inner diameter region, A coil component characterized in that the first protrusion of the insulating resin layer located at one end side in the coil axis direction among the plurality of insulating resin layers has a shorter protrusion amount than the first protrusion of the insulating resin layer located at the other end side in the coil axis direction among the plurality of insulating resin layers, thereby making the diameter of the inner diameter region in a region surrounded by the first protrusion of the insulating resin layer located at one end side larger than the diameter of the region surrounded by the first protrusion of the insulating resin layer located at the other end side.

2. 2 . The coil component according to claim 1 , wherein some of the first protrusions have an increased protrusion amount from one end side to the other end side in the coil axial direction.

3. A coil component as described in Claim 2, characterized in that the protrusion amount of the first protrusion portion of the insulating resin layer located on the one end side is shorter than the protrusion amount of the first protrusion portion of the insulating resin layer located second-furthest on the one end side in the coil axial direction among the plurality of insulating resin layers.

4. a fourth magnetic member located in an outer region of the spiral pattern, the insulating resin layers further have second protruding portions protruding into the outer region, The coil component according to any one of claims 1 to 3, characterized in that the second protrusion of an insulating resin layer located at one end side in the coil axis direction among the plurality of insulating resin layers has a shorter protrusion amount than the second protrusion of at least one other insulating resin layer.

5. A step of alternately laminating a plurality of conductor layers and a plurality of insulating resin layers, the conductor layers including a spiral pattern wound in a spiral shape and a sacrificial pattern located in an inner diameter region of the spiral pattern; forming a space in an inner diameter region of the spiral pattern by removing the sacrificial pattern; removing a part of the protruding portion made of the plurality of insulating resin layers protruding into the space; and embedding a magnetic member in the space.

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