Imprinting apparatus, imprinting method and method for manufacturing concave-convex structure

Abstract

To provide an imprint device, an imprint method, and a method for manufacturing an uneven structure, which can supply different resin materials in the same imprint device.SOLUTION: An imprint device 10 includes a base material transport unit 13 that horizontally transports a base material 40, a mold holding unit 18 for holding a mold 50, a first dispenser head 17A for discharging a first resin material to the base material 40 held by the base material transport unit 13, and a second dispenser head 17B for discharging a second resin material to the base material 40 held by the base material transport unit 13. The first dispenser head 17A and the second dispenser head 17B can move between standby positions P1b and P2b and discharge positions P1a and P2a, respectively, and the first dispenser head 17A and the second dispenser head 17B are movable independently of each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an imprint apparatus, an imprint method, and a method for manufacturing a concave-convex structure. [Background technology]

[0002] In recent years, a pattern formation technique using an imprint method has been attracting attention as a fine pattern formation technique to replace photolithography. The imprint method is a pattern formation technique that uses a mold having a fine uneven structure and transfers the uneven structure to a molded object at the same size to transfer the fine structure. For example, in an imprint method using a photocurable resin, droplets of the photocurable resin are supplied to the surface of a workpiece as the molded object, the mold having a desired uneven structure and the workpiece are brought close to each other to a predetermined distance to fill the uneven structure with the photocurable resin, and in this state, the photocurable resin is cured by irradiating light from the mold side, and then the mold is separated from the resin layer to form a pattern structure having an uneven structure (uneven pattern) in which the unevenness of the mold is inverted (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-41861 A Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional imprint devices are generally equipped with only one dispenser head, and are not designed to use multiple types of resin materials in the same imprint device. In recent years, however, there has been a demand for applying different resin materials in the same imprint device.

[0005] The present embodiment provides an imprinting apparatus, an imprinting method, and a method for manufacturing a concave-convex structure, which are capable of supplying different resin materials within the same imprinting apparatus. [Means for solving the problem]

[0006] The imprinting apparatus according to the present embodiment is an imprinting apparatus comprising: a substrate transporting section that holds a substrate and transports it horizontally; a mold holding section that holds a mold; a first dispenser head that ejects a first resin material onto the substrate held in the substrate transporting section; and a second dispenser head that ejects a second resin material onto the substrate held in the substrate transporting section, wherein the first dispenser head and the second dispenser head are each movable between a standby position and an ejection position, and the first dispenser head and the second dispenser head are movable independently of each other.

[0007] In the imprint apparatus according to this embodiment, the apparatus further includes an air flow forming unit that forms an air flow from one side to the other side, the first resin material is more volatile than the second resin material, and the ejection position of the first dispenser head does not have to be located upstream of the air flow relative to the ejection position of the second dispenser head.

[0008] In the imprint apparatus according to this embodiment, the first resin material may have a higher vapor pressure at room temperature than the second resin material at room temperature.

[0009] In the imprint apparatus according to this embodiment, a viscosity of the first resin material may be lower than a viscosity of the second resin material.

[0010] In the imprint apparatus according to this embodiment, a contact angle of the first resin material to the base material may be smaller than a contact angle of the second resin material to the base material.

[0011] In the imprint apparatus according to the present embodiment, the standby position of the first dispenser head and the standby position of the second dispenser head may be located on opposite sides with respect to a line of movement of the substrate transport section.

[0012] In the imprint apparatus according to this embodiment, the base material may be in a sheet form.

[0013] An imprinting method according to the present embodiment is an imprinting method comprising the steps of: holding a substrate by a substrate transport unit and transporting it horizontally; discharging droplets of a first resin material from a first dispenser head onto the substrate; spreading droplets of the first resin material between a mold and the substrate to form a first resin layer of the first resin material; hardening the first resin layer to obtain the first resin layer to which a surface shape of the mold has been transferred; discharging a second resin material from a second dispenser head onto the substrate; spreading droplets of the second resin material between the mold and the substrate to form a second resin layer of the second resin material; and hardening the second resin layer to obtain the second resin layer to which the surface shape of the mold has been transferred, wherein the first dispenser head and the second dispenser head are each movable between a standby position and a discharge position, and the first dispenser head and the second dispenser head are movable independently of each other.

[0014] In the imprinting method according to this embodiment, an air flow is formed flowing from one side to the other, the first resin material is more volatile than the second resin material, and the ejection position of the first dispenser head does not have to be located upstream of the air flow relative to the ejection position of the second dispenser head.

[0015] In the imprint method according to the present embodiment, the second resin layer may be formed to overlap the first resin layer.

[0016] In the imprint method according to the present embodiment, the first resin layer and the second resin layer may be formed side by side on the substrate.

[0017] In the imprint method according to the present embodiment, a mold for forming the first resin layer and a mold for forming the second resin layer may be different from each other.

[0018] In the imprint method according to the present embodiment, the standby position of the first dispenser head and the standby position of the second dispenser head may be located on opposite sides with respect to a line of movement of the substrate transport section.

[0019] In the imprinting method according to this embodiment, the base material may be in a sheet form.

[0020] A method for manufacturing a concave-convex structure according to the present embodiment includes the steps of: preparing a substrate having a substrate body and a mask layer formed on the substrate body; discharging droplets of a first resin material from a first dispenser head onto the mask layer of the substrate; spreading the droplets of the first resin material between a mold and the substrate to form a first resin layer of the first resin material; hardening the first resin layer to obtain the first resin layer to which the surface shape of the mold has been transferred; discharging a second resin material from a second dispenser head onto the first resin layer of the substrate; spreading the droplets of the second resin material between the mold and the substrate to form a second resin layer of the second resin material; and hardening the second resin layer. the step of dry etching the second resin layer until the first resin layer is exposed; the step of dry etching the first resin layer until the mask layer is exposed; the step of removing the mask layer that is not covered by the first resin layer and the second resin layer; the step of dry etching the base body using the remaining mask layer as a mask; and the step of removing the mask layer that remains on the base body, wherein the first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, and the first dispenser head and the second dispenser head are movable independently of each other. Effect of the Invention

[0021] According to this embodiment, different resin materials can be supplied within the same imprint apparatus. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a side view showing an imprint apparatus according to an embodiment. [Diagram 2] FIG. 2 is a plan view showing an imprint apparatus according to an embodiment. [Diagram 3] 3(a) and (b) are diagrams showing a method for comparing the volatility of resin materials. [Figure 4] 4(a)-(d) are side views showing a part of an imprint method according to an embodiment. [Diagram 5] 5(a)-(d) are side views showing a part of an imprint method according to an embodiment. [Figure 6] 6(a)-(h) are schematic cross-sectional views showing a method for manufacturing a concave-convex structure according to one embodiment. [Figure 7] 7(a)-(d) are side views showing a part of an imprint method according to a modified example. [Figure 8] 8(a)-(d) are side views showing a part of an imprint method according to a modified example. [Figure 9] FIG. 9 is a plan view showing an imprint apparatus according to a first modified example. [Figure 10] FIG. 10 is a side view showing an imprint apparatus according to a second modified example. [Figure 11] FIG. 11 is a plan view showing an imprint apparatus according to a second modified example. [Figure 12] FIG. 12 is a plan view showing an imprint apparatus according to a third modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, each embodiment will be described with reference to the drawings. The drawings are illustrative, and the characteristic parts may be exaggerated for the purpose of explanation, and may differ from the actual product. In addition, appropriate modifications can be made without departing from the technical concept. In the following drawings, the same parts are given the same reference numerals, and some detailed descriptions may be omitted.

[0024] In addition, terms such as "parallel," "orthogonal," and "same," which specify the shape, geometric conditions, and physical characteristics and their degree, as well as the length, angle, and physical characteristic values ​​used in this specification, are to be interpreted without being bound by strict meanings, including the range in which similar functions can be expected. Furthermore, in the drawings, the shapes of multiple parts that can be expected to have similar functions are regularly depicted for clarity, but the shapes of the parts may be different from each other within the range in which the functions can be expected without being bound by strict meanings. In addition, in the drawings, the boundary lines indicating the joint surfaces between members are shown as simple straight lines for convenience, but the shape of the boundary line is not limited to being a strict straight line, and is arbitrary within the range in which the desired joint performance can be expected.

[0025] [Imprint device] An imprint apparatus according to one embodiment will be described with reference to Figures 1 and 2. Figure 1 is a side view showing the imprint apparatus according to the present embodiment, and Figure 2 is a plan view of the imprint apparatus shown in Figure 1.

[0026] 1, an imprinting apparatus 10 according to the present embodiment includes a stage unit (substrate transport section) 13 that holds and transports a substrate 40 for imprinting in a horizontal direction, a mold holding section 18 that holds a mold 50, a first dispenser head 17A, and a second dispenser head 17B. The first dispenser head 17A is movable between a standby position P1b and a discharge position P1a, and the second dispenser head 17B is movable between a standby position P2b and a discharge position P2a. The first dispenser head 17A and the second dispenser head 17B are disposed spaced apart from each other in the horizontal direction (XY plane direction) and are movable independently of each other.

[0027] The stage unit 13 has a substrate holding section 23 that holds the substrate 40, and transports the substrate 40 in a horizontal direction. The first dispenser head 17A dispenses a first resin material onto the substrate 40 held by the substrate holding section 23. The second dispenser head 17B dispenses a second resin material onto the substrate 40 held by the substrate holding section 23.

[0028] Furthermore, the stage unit 13, the mold holding part 18, the first dispenser head 17A and the second dispenser head 17B are housed in a chamber 11. A stage base 12 is fixed in the chamber 11. Furthermore, the stage unit 13 is disposed on the stage base 12 in the chamber 11. A support part 14 is disposed in the chamber 11, and the support part 14 is disposed above the stage unit 13.

[0029] A leveling unit 15, an alignment camera 16, a second dispenser head 17B, a first dispenser head 17A, and a mold holding unit 18 are attached and fixed to the support unit 14. The mold holding unit 18 holds a mold 50. An airflow forming unit 19 is disposed in the chamber 11 to form an airflow F from one side to the other side (from the negative side in the X-axis direction to the positive side in the X-axis direction in this embodiment). An irradiation unit 21 is disposed above the mold holding unit 18 to irradiate light (e.g., ultraviolet light) toward the first resin material or the second resin material supplied on the substrate 40. A transfer unit 25 is disposed below the mold holding unit 18. The transfer unit 25 is an area where the mold 50 and the substrate 40 are located when the shape of the mold 50 is transferred to the first resin material or the second resin material on the substrate 40.

[0030] As shown in Fig. 2, the mold holding unit 18, the leveling unit 15, the alignment camera 16, the second dispenser head 17B, and the first dispenser head 17A are arranged in the chamber 11. The chamber 11 also has a loading area 20, which is an area where the substrate 40 is carried in and where the substrate 40 is held on the stage unit 13. A stock unit 24 for storing the substrate 40 may be provided in the chamber 11 on the upstream side of the air flow F from the mold holding unit 18. Note that some elements such as the stage base 12, the support unit 14, and the irradiation unit 21 are not shown in Fig. 2.

[0031] In this embodiment, the discharge position P1a of the first dispenser head 17A is located downstream of the air flow F with respect to the discharge position P2a of the second dispenser head 17B. The discharge position P1a of the first dispenser head 17A refers to a position where the first dispenser head 17A discharges the first resin material onto the substrate 40 while the first dispenser head 17A is stopped on the substrate 40. Similarly, the discharge position P2a of the second dispenser head 17B refers to a position where the second dispenser head 17B discharges the second resin material onto the substrate 40 while the second dispenser head 17B is stopped on the substrate 40. As a result, even if the first resin material discharged from the first dispenser head 17A is more volatile than the second resin material discharged from the second dispenser head 17B, as described later, the volatilized component is less likely to be carried to the transfer unit 25 side. As a result, it is possible to suppress contamination of various members present in the transfer unit 25 by the volatilized component.

[0032] Furthermore, alignment camera 16, leveling unit 15, second dispenser head 17B, first dispenser head 17A, and load area 20 are all located downstream of airflow F (positive side in the X-axis direction) with respect to mold holding unit 18. This prevents foreign matter such as particles generated in leveling unit 15, alignment camera 16, second dispenser head 17B, first dispenser head 17A, or load area 20 from being carried by airflow F to the mold 50 side, thereby preventing the foreign matter from adhering to mold 50.

[0033] In this specification, "component A is located on the downstream (upstream) side of the airflow with respect to component B" means that "a portion of component A located furthest on the upstream (downstream) side of the airflow is located downstream (upstream) of airflow F relative to a portion of component B located furthest on the downstream (upstream) side of the airflow."

[0034] 2, the discharge position P1a of the first dispenser head 17A is located downstream of the airflow F with respect to the discharge position P2a of the second dispenser head 17B, but is not limited thereto. The discharge position P1a of the first dispenser head 17A may not be located upstream of the airflow F with respect to the discharge position P2a of the second dispenser head 17B. That is, the discharge position P1a of the first dispenser head 17A and the discharge position P2a of the second dispenser head 17B may be located at the same position with respect to the flow direction of the airflow F. For example, in the example shown in FIG. 2, the X coordinate of the discharge position P1a of the first dispenser head 17A and the X coordinate of the discharge position P2a of the second dispenser head 17B may be the same.

[0035] 2, the mold holding part 18, the discharge position P2a of the second dispenser head 17B, the discharge position P1a of the first dispenser head 17A, and the load area 20 are arranged in this order when viewed from above. In this case, the mold holding part 18, the discharge position P2a of the second dispenser head 17B, the discharge position P1a of the first dispenser head 17A, and the load area 20 are arranged in a straight line in this order. As a result, the stage unit 13 moves in a direction toward the upstream of the air flow F during each process before the contact process described later, and does not pass under the mold 50. As a result, foreign matter such as particles is prevented from adhering to the mold 50 due to the influence of the stage unit 13.

[0036] Each element constituting the imprint apparatus 10 will be further described below.

[0037] (Stage Unit 13) As shown in FIG. 1, the stage unit (substrate transport unit) 13 has a moving stage 22 that moves the stage unit 13 horizontally on the stage base 12, and a substrate holding unit (chuck) 23 that is provided on the moving stage 22 and holds a substrate 40 for imprinting. The moving stage 22 transports the substrate holding unit 23 along a moving line TL (see FIG. 2) that extends horizontally (in this case, the X direction) to position the substrate 40 at a predetermined position. The moving stage 22 adjusts the XY direction position of the substrate 40, and may also have a function of adjusting (correcting) the position in the θ (rotation around the Z axis) direction, a function of adjusting the position of the substrate 40 in the Z axis direction, and a function of adjusting the inclination of the substrate 40. The moving stage 22 and the substrate holding unit 23 are driven by the moving stage 22 and can move together in the horizontal direction. In the present embodiment, the substrate holding section 23 holds the substrate 40 using a holding mechanism that uses suction, but the present invention is not limited to this, and the substrate 40 may be held by, for example, a holding mechanism that uses mechanical clamping, a holding mechanism that uses static electricity, etc. The stage unit 13 may be provided with a reference mark, a mold side leveling sensor, a stage position measurement unit, etc., which are not shown.

[0038] (Base material 40) The substrate 40 for imprinting may be a flat substrate having a flat front surface and a flat back surface. Alternatively, the substrate 40 may be a mesa-shaped substrate having a convex step higher than the surroundings on a part of the front surface, or a concave shape cut by, for example, countersinking on a part of the back surface. The substrate 40 may be, for example, a transparent substrate made of glass such as quartz glass, silicate glass, calcium fluoride, magnesium fluoride, acrylic glass, or resin such as polycarbonate, polypropylene, polyethylene, or any of these laminated materials. In addition, metal substrates such as nickel, titanium, and aluminum, and semiconductor substrates such as silicon and gallium nitride can also be used as the substrate 40. Such a substrate 40 may be, for example, a replica blank for producing a replica of the mold 50, which is a master template. Alternatively, the substrate 40 may be an optical element, a magnetic recording medium, or the like.

[0039] (Leveling Section 15) The leveling unit 15 is configured by, for example, a leveling sensor such as a laser displacement sensor. The leveling unit 15 has a function of measuring the height (flatness) of the substrate 40 held by the substrate holding unit 23.

[0040] (Alignment Camera 16) The alignment camera 16 detects an alignment mark (not shown) provided on the substrate 40 to perform horizontal positioning of the substrate 40 on the stage unit 13. Specifically, the alignment camera 16 measures the alignment mark formed on the substrate 40 to obtain the horizontal positional deviation of the substrate 40 relative to the imprint apparatus 10. Then, based on the positional deviation of the substrate 40 relative to the imprint apparatus 10, the position of the substrate 40 is adjusted, for example, by the moving stage 22. The alignment camera 16 is provided at approximately the same position as the leveling unit 15, but is not limited thereto, and the alignment camera 16 may be provided at a position away from the leveling unit 15.

[0041] (First dispenser head 17A) The first dispenser head 17A ejects droplets 41 of a first resin material such as a photocurable resin on the substrate 40 held by the substrate holding unit 23 by inkjet printing. The first dispenser head 17A is, for example, an inkjet head. The first dispenser head 17A may be provided with a drive unit that enables the first dispenser head 17A to perform a desired operation, such as a horizontal operation, an ink supply unit to the first dispenser head 17A, and a control unit that controls the first dispenser head 17A, the drive unit, and the ink supply unit. In this case, the first dispenser head 17A can take an ejection position P1a (indicated by a two-dot chain line in FIG. 2) where the first resin material is ejected, and a standby position P1b (indicated by a solid line in FIG. 2) where the first dispenser head 17A waits until the first resin material is ejected. In this case, the first dispenser head 17A is movable in the Y direction between the ejection position P1a and the standby position P1b.

[0042] (Second dispenser head 17B) The second dispenser head 17B ejects droplets 41 of a second resin material such as a photocurable resin by inkjet printing onto the substrate 40 held by the substrate holder 23. The second dispenser head 17B is, for example, an inkjet head. The second dispenser head 17B may be provided with a drive unit that enables the second dispenser head 17B to perform a desired operation, such as a horizontal operation, an ink supply unit to the second dispenser head 17B, and a control unit that controls the second dispenser head 17B, the drive unit, and the ink supply unit. In this case, the second dispenser head 17B can take an ejection position P2a (indicated by a two-dot chain line in FIG. 2) where the second resin material is ejected, and a standby position P2b (indicated by a solid line in FIG. 2) where the second dispenser head 17B waits until the second resin material is ejected. In this case, the second dispenser head 17B is movable in the Y direction between the ejection position P2a and the standby position P2b.

[0043] (First resin material and second resin material) The first resin material and the second resin material are each made of, for example, a photocurable resin. The photocurable resin is generally composed of a base agent, an initiator, and a crosslinking agent, and further contains a release agent for suppressing adhesion to the mold 50 and an adhesive agent for improving adhesion to the substrate 40, as necessary. The photocurable resin used in this embodiment is not particularly limited, and can be appropriately selected from known photocurable resins according to the application, required characteristics, physical properties, etc. of the pattern structure manufactured by imprinting. For example, if the application of the pattern structure is for lithography, low etching resistance and viscosity and small residual film thickness are required, and if the application of the pattern structure is for an optical member, a specific refractive index and light transmittance are required. The photocurable resin can be appropriately selected according to these requirements. However, regardless of the application, it is required to have characteristics (viscosity, surface tension, etc.) that satisfy compatibility with the inkjet head to be used. Note that the viscosity, surface tension, etc. of the liquid that is compatible with the inkjet head differs depending on the structure, material, etc. of the inkjet head. Therefore, it is possible to appropriately adjust the viscosity, surface tension, etc. of the photocurable resin, or to appropriately select an inkjet head that is suitable for the photocurable resin used.

[0044] The first resin material and the second resin material may contain different kinds of components, may contain different amounts of components, or may have different properties. In this embodiment, the first resin material is used that is more volatile than the second resin material. Specifically, the vapor pressure of the first resin material at room temperature (25°C) may be higher than the vapor pressure of the second resin material at room temperature, so that the volatility of the first resin material may be higher than that of the second resin material. The viscosity of the first resin material may be lower than that of the second resin material. In this case, the first resin material spreads more thinly than the second resin material, so that the volatility is higher. Alternatively, the contact angle of the first resin material to the substrate 40 may be lower than the contact angle of the second resin material to the substrate 40. In this case, the first resin material spreads more thinly on the substrate 40 than the second resin material, so that the volatility is higher. Such volatility can be adjusted, for example, by appropriately setting the components and amounts of the main agent, initiator, and crosslinking agent described above.

[0045] The volatility of resin materials can be compared, for example, as follows. As shown in Fig. 3(a), equal amounts of multiple types of resin materials (three types in this case) Ra, Rb, and Rc are dropped onto the substrate 40, and then the substrate is left to stand. After a certain time has passed, the amounts of resin material remaining without volatilization are compared, and it can be determined that the smaller the remaining amount, the higher the volatility. For example, in the example shown in Fig. 3(b), it is considered that the resin material Ra has the highest volatility, followed by the resin material Rb, and the resin material Rc has the lowest volatility.

[0046] (ink receiving member 26) As shown in FIG. 2, ink receiving members 26 may be provided below the standby positions of the first dispenser head 17A and the second dispenser head 17B. The ink receiving members 26 receive droplets that are periodically pre-ejected (also called "flush") at the standby positions in order to maintain the ejection performance of the first dispenser head 17A and the second dispenser head 17B, and may be, for example, a bottomed container having an opening of a desired shape. In addition, the bottom of such a bottomed container may be provided with a porous body, which improves the droplet acceptance. There is no particular restriction on the porous body, so long as it is made of a material that is not dissolved or deteriorated by the components of the droplets, such as a known inorganic or organic porous body or cloth.

[0047] (mold holding part 18) Mold holding unit 18 holds mold 50 with the surface of mold 50 having concave-convex pattern 51 facing the stage unit 13. This mold holding unit 18 holds mold 50 by, for example, a holding mechanism that uses suction, a holding mechanism that uses mechanical clamping, a holding mechanism that uses static electricity, or the like, and there are no particular limitations on the specific configuration of the holding mechanism.

[0048] A height control mechanism 31 is attached to the mold holding unit 18, which makes it possible to control or adjust the height direction (Z-axis direction) position of the mold 50. The height control mechanism 31 drives the mold 50 downward to press the mold 50 against the photocurable resin on the substrate 40. The height control mechanism 31 also drives the mold 50 upward to peel (release) the mold 50 from the photocurable resin on the substrate 40.

[0049] (Mold 50) The mold 50 has a fine concave-convex pattern 51 formed in the central region of its lower surface. The concave-convex pattern 51 is formed, for example, by electron beam lithography. The mold 50 is made of a material that transmits light from the irradiation unit 21, and can be, for example, quartz glass, silicate glass, calcium fluoride, magnesium fluoride, acrylic glass, or any laminate of these materials. The mold 50 also has a pattern surface on which the concave-convex pattern 51 to be transferred to the base material 40 is formed. The mold 50 is manufactured by applying an electron beam resist to the surface of a mold substrate, performing electron beam drawing on the electron beam resist to form a resist pattern, and etching the mold substrate using the resist pattern as an etching mask to form the concave-convex pattern 51. Although the concave-convex pattern 51 is shown in the figure, the height of the convex portion (depth of the concave portion), pitch, number, arrangement area (area occupied by the concave-convex pattern 51 relative to the main surface of the mold 50), and shape (line shape, dot shape (moth-eye shape), etc.) of the concave-convex pattern 51 are not particularly limited and can be appropriately set according to the substrate to be manufactured. In addition, the dimensions of the concave-convex pattern 51 are not particularly limited, but for example, the width of the convex portion is 40 nm or less, preferably 10 nm or more and 30 nm or less, and the interval between adjacent convex portions is 40 nm or less, preferably 10 nm or more and 30 nm or less. The surface of the mold 50 on the stage unit 13 side may be a flat surface that does not have the concave-convex pattern 51. In addition, when the substrate 40 is a replica blank for producing a replica template, the mold 50 may be a master template for producing a replica template.

[0050] (Irradiation unit 21) The irradiation unit 21 irradiates light onto the photocurable resin supplied (applied) onto the base material 40. As described below, in this embodiment, the first resin material and the second resin material supplied onto the base material 40 are photocurable resins, and therefore, the photocurable resins are cured by irradiation with light from the irradiation unit 21. Note that the mold holding unit 18 is provided with an opening that allows the light from the irradiation unit 21 to pass through.

[0051] (Air flow forming part 19) As described above, the airflow forming unit 19 forms an airflow F from one side to the other side (from the negative side in the X-axis direction to the positive side in the X-axis direction) in the chamber 11. This airflow is blown laterally into the mold holding unit 18. The airflow forming unit 19 is disposed in the chamber 11 on the opposite side of the mold holding unit 18 from the first dispenser head 17A and the second dispenser head 17B in plan view. The airflow forming unit 19 creates a good transfer environment in the chamber 11 free from the influence of foreign matter such as particles, and may, for example, send in an airflow F made of clean air. The clean air may be taken in from the outside, and it is preferable to use, for example, filtered outside air.

[0052] (Static eliminator 32) 1 and 2, a static eliminator 32 for eliminating static electricity from the mold 50 and the substrate 40 is provided in the chamber 11. The static eliminator 32 is for preventing the mold 50 and the substrate 40 from being charged and causing foreign matter to adhere to the mold 50 and the substrate 40. Such a static eliminator 32 is, for example, a soft X-ray ionizer, and specifically, may be one that irradiates soft X-rays (low-energy X-rays) to ionize and eliminate gas molecules in the chamber 11. When a soft X-ray ionizer is used, dust is not generated and stable static elimination performance can be obtained.

[0053] The static eliminator 32 is disposed at a position not downstream of the airflow F with respect to the mold holding unit 18. This allows ions generated by the static eliminator 32 to be swept downstream of the airflow F by the airflow F, so that the mold 50 and the substrate 40 can be effectively neutralized. Specifically, when the airflow F flows from the negative side in the X-axis direction to the positive side in the X-axis direction, it is preferable that the static eliminator 32 be disposed on the negative side in the X-axis direction with respect to the mold holding unit 18, or on the positive side or negative side in the Y-axis direction with respect to the mold holding unit 18. In FIG. 2, the static eliminator 32 is disposed on the negative side in the X-axis direction with respect to the mold holding unit 18.

[0054] [Imprint method] Next, an imprinting method for performing an imprinting process using the above-mentioned imprinting apparatus 10 will be described with reference to Figures 4(a)-(d) and 5(a)-(d). Figures 4(a)-(d) and 5(a)-(d) are side views showing a step of the imprinting method according to this embodiment. In Figures 4(a)-(d) and 5(a)-(d), the same parts as those in the embodiment shown in Figures 1 and 2 are denoted by the same reference numerals. In Figures 4(a)-(d) and 5(a)-(d), for the sake of convenience, some components such as the chamber 11, the leveling unit 15, the alignment camera 16, and the loading area 20 are omitted from the illustration.

[0055] Here, we will explain the case where a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable resin layer (second resin layer) 42B made of a second resin material are formed on top of each other on a single substrate 40.

[0056] First, with no substrate 40 mounted on the substrate holding part 23, the stage unit 13 is moved to the load area 20 (see FIGS. 1 and 2) (load area movement step). The stage unit 13 moves horizontally on the stage base 12 by driving the moving stage 22 (the same applies to the following steps). Next, in this load area 20, the substrate 40 is held on the substrate holding part 23 of the stage unit 13 (substrate holding step). In this case, the substrate 40 may be held by suction to the substrate holding part 23 by vacuum suction.

[0057] Next, the stage unit 13 is moved to the negative side in the X-axis direction to move the substrate 40 below the leveling section 15 (see FIGS. 1 and 2), and the height direction position of the substrate 40 is measured in the leveling section 15 (leveling step). Next, the stage unit 13 is moved to the negative side in the X-axis direction to move the substrate 40 below the alignment camera 16, and the horizontal position of the substrate 40 is adjusted using the alignment camera 16 (alignment step).

[0058] Next, the first dispenser head 17A is moved from the standby position P1b to the negative side in the Y-axis direction and stopped at the discharge position P1a (first dispenser head position moving step). Also, the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 below the first dispenser head 17A (dispenser position moving step).

[0059] 4(a), droplets 41 of a first resin material such as a photocurable resin are discharged from the first dispenser head 17A and supplied to the substrate 40 held by the substrate holding unit 23 (droplet supplying step). In this droplet supplying step, droplets 41 of the first resin material are discharged from the first dispenser head 17A and supplied to a desired area on the substrate 40 located below the first dispenser head 17A. Then, the first dispenser head 17A moves from the discharge position P1a to the positive side in the Y-axis direction and returns to the standby position P1b.

[0060] 4(a)-(d) and 5(a)-(d), the first dispenser head 17A at the discharge position P1a and the second dispenser head 17B at the discharge position P2a are indicated by solid lines, and the first dispenser head 17A at the standby position P1b and the second dispenser head 17B at the standby position P2b are indicated by two-dot chain lines.

[0061] In this embodiment, an airflow F directed from one side (negative side in the X direction) to the other side (positive side in the X direction) is formed by the airflow forming unit 19. This prevents volatile components and mist from the droplets 41 of the first resin material discharged from the first dispenser head 17A onto the substrate 40 from diffusing toward the transfer unit 25 and adhering to the mold 50, etc.

[0062] Next, as shown in FIG. 4(b), the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 to below the mold 50 held by the mold holding part 18 (mold position moving step).

[0063] 4(c), the mold 50 and the substrate 40 are brought close to each other, so that droplets 41 of the first resin material are spread between the mold 50 and the substrate 40 to form a first photocurable resin layer 42A of the first resin material (contact step). In this contact step, the height control mechanism 31 lowers the mold holding part 18, so that the mold holding part 18 and the substrate holding part 23 are brought close to each other. As a result, droplets 41 of the first resin material are spread between the mold 50 and the substrate 40, so that the first photocurable resin layer 42A is formed.

[0064] Next, light is irradiated from the irradiating unit 21 to cure the first photocurable resin layer 42A. As a result, the concave-convex pattern 51 of the mold 50 is transferred to the first photocurable resin layer 42A (curing step). In this curing step, light is irradiated from the irradiating unit 21 located above the mold holding unit 18 while the mold holding unit 18 is in a lowered state. As a result, the first photocurable resin layer 42A is photocured to obtain the first photocurable resin layer 42A to which the surface shape of the concave-convex pattern 51 of the mold 50 is transferred.

[0065] 4(d), the first photocurable resin layer 42A is separated from the mold 50 (mold releasing step). In this mold releasing step, the height control mechanism 31 raises the mold holding part 18, thereby separating the first photocurable resin layer 42A from the mold 50. As a result, the first photocurable resin layer 42A having a concave-convex pattern structure is formed on the substrate 40.

[0066] Next, the mold 50 held by the mold holding unit 18 is replaced with another mold 50A (hereinafter, simply referred to as the mold 50A) having a shape different from that of the mold 50. In this case, the other mold 50A does not have the concave-convex pattern 51, but this is not limited thereto, and the other mold 50A may have a concave-convex pattern having a shape different from that of the mold 50.

[0067] Next, the second dispenser head 17B is moved from the standby position P2b to the negative side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Also, the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 below the second dispenser head 17B (dispenser position moving step).

[0068] 5(a), droplets 41 of a second resin material such as a photocurable resin are discharged from the second dispenser head 17B to the substrate 40 held by the substrate holder 23 (droplet supply step). In this droplet supply step, droplets 41 of the second resin material are discharged from the second dispenser head 17B to a desired area on the substrate 40 below the second dispenser head 17B. At this time, the droplets 41 of the second resin material are discharged onto the first photocurable resin layer 42A. After that, the second dispenser head 17B moves from the discharge position P2a to the positive side in the Y-axis direction and returns to the standby position P2b.

[0069] Next, as shown in FIG. 5(b), the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 to below the mold 50A held by the mold holding part 18 (mold position moving step).

[0070] 5(c), the mold 50A and the substrate 40 are brought close to each other, so that droplets 41 of the second resin material are spread between the mold 50A and the substrate 40 to form a second photocurable resin layer 42B of the second resin material (contact step). In this contact step, the height control mechanism 31 lowers the mold holding part 18, so that the mold holding part 18 and the substrate holding part 23 are brought close to each other. As a result, droplets 41 of the second resin material are spread between the mold 50A and the substrate 40, so that the second photocurable resin layer 42B is formed.

[0071] Next, light is irradiated from the irradiating unit 21 to harden the second photocurable resin layer 42B. As a result, the shape of the flat lower surface of the mold 50A is transferred to the second photocurable resin layer 42B (hardening step). In this hardening step, light is irradiated from the irradiating unit 21 located above the mold holding unit 18 while the mold holding unit 18 is in the lowered state. As a result, the second photocurable resin layer 42B is photocured to obtain the second photocurable resin layer 42B to which the surface shape of the flat lower surface of the mold 50A is transferred.

[0072] 5(d), the second photocurable resin layer 42B is separated from the mold 50A (mold releasing step). In this mold releasing step, the height control mechanism 31 raises the mold holding part 18 to separate the second photocurable resin layer 42B from the mold 50A. As a result, the second photocurable resin layer 42B having a flat upper surface is formed on the substrate 40 and on the first photocurable resin layer 42A.

[0073] 4(a)-(d) and 5(a)-(d), the first photocurable resin layer 42A made of the first resin material is formed on the substrate 40, and then the second photocurable resin layer 42B made of the second resin material is formed, but this is not limited thereto. The first photocurable resin layer 42A made of the first resin material may be formed after the second photocurable resin layer 42B made of the second resin material is formed.

[0074] As described above, in this embodiment, the imprint apparatus 10 includes the first dispenser head 17A and the second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B are movable independently of each other. This allows different resin materials (first resin material and second resin material) to be supplied to one substrate 40 within the same imprint apparatus 10. As a result, it is possible to form a plurality of resin layers (first photocurable resin layer 42A, second photocurable resin layer 42B) made of different resin materials (first resin material and second resin material) on the substrate 40 in a stacked manner.

[0075] In this embodiment, an airflow F is formed in the chamber 11 by the airflow forming unit 19, which flows from one side to the other side (from the negative side in the X-axis direction to the positive side in the X-axis direction). In this case, the first resin material is more volatile than the second resin material, and the first dispenser head 17A is located downstream of the airflow F relative to the second dispenser head 17B. This makes it difficult for the components of the first resin material, which are highly volatile, to be carried to the transfer unit 25. This makes it possible to suppress contamination of various members present in the transfer unit 25 by the volatilized components.

[0076] That is, the first resin material and the second resin material are supplied as droplets of a liquid amount of several pL to several tens of pL from the first dispenser head 17A and the second dispenser head 17B, respectively, by, for example, an inkjet method. Such a small amount of droplets is highly volatile, and the volatile components are easily transported to the transfer unit 25 side. In this embodiment, as described above, the first dispenser head 17A that ejects the more volatile first resin material is disposed downstream of the air flow F from the second dispenser head 17B that ejects the less volatile second resin material. This makes it possible to prevent the volatile components of the more volatile first resin material from moving to the transfer unit 25 side and diffusing to adhere to the mold 50, etc.

[0077] [Method of manufacturing concave-convex structure] Next, a method for manufacturing a concave-convex structure using the above-mentioned imprint method will be described.

[0078] 6(a), a substrate 40 is prepared. The substrate 40 has a substrate body 61 made of quartz glass or the like, and a mask layer 62, which is a metal layer made of chromium or the like, formed on the substrate body 61.

[0079] Next, as shown in Fig. 6(b), a first photocurable resin layer (first resin layer) 42A made of a first resin material and having a predetermined concave-convex pattern is formed on the mask layer 62 of the substrate 40 using the mold 50 of the imprint apparatus 10 according to the present embodiment. The method of forming this first photocurable resin layer 42A can be performed in substantially the same manner as the steps shown in Figs. 4(a)-(d) described above.

[0080] 6(c), a second photocurable resin layer (second resin layer) 42B made of a second resin material and having a flat upper surface is formed on the first photocurable resin layer 42A using a mold 50A of the imprint apparatus 10 according to the present embodiment. The method of forming this second photocurable resin layer 42B can be performed in substantially the same manner as the steps shown in FIGS. 5(a)-(d) described above.

[0081] 6(d), the second photocurable resin layer 42B is etched by dry etching using a first etching gas until the first photocurable resin layer 42A is exposed on the surface. In this case, the etching rate of the first etching gas is higher for the second photocurable resin layer 42B than for the first photocurable resin layer 42A. Therefore, the second photocurable resin layer 42B is removed until it is recessed below the surface of the first photocurable resin layer 42A.

[0082] 6(e), the first photocurable resin layer 42A is etched by dry etching using a second etching gas until the mask layer 62 is exposed on the surface. In this case, the etching rate of the first photocurable resin layer 42A by the second etching gas is higher than that of the second photocurable resin layer 42B. Therefore, when the mask layer 62 is exposed, the second photocurable resin layer 42B remains on the first photocurable resin layer 42A.

[0083] 6(f), a part of the mask layer 62 is etched away by wet etching until the substrate body 61 is exposed on the surface. In this manner, the mask layer 62 that is not covered by the first photocurable resin layer 42A and the second photocurable resin layer 42B is removed. When the substrate body 61 is exposed on the surface, a convex portion is formed on the substrate body 61, in which the mask layer 62, the first photocurable resin layer 42A, and the second photocurable resin layer 42B are laminated.

[0084] 6(g), a third etching gas such as CHF3 gas is used to perform dry etching to etch the substrate body 61 using the remaining mask layer 62 as a mask. In this case, the portion of the substrate body 61 that is not covered by the mask layer 62 is etched into a concave shape. The first photocurable resin layer 42A and the second photocurable resin layer 42B are also etched away by the third etching gas, and the mask layer 62 is exposed on the surface. As a result, a concave-convex pattern is formed on the substrate body 61.

[0085] 6(h), the mask layer 62 remaining on the substrate body 61 is etched away by wet etching. In this manner, a concave-convex structure 60 made of the substrate body 61 having a concave-convex pattern is produced. Such a concave-convex structure 60 may be used, for example, as a replica mold, a device part, or the like.

[0086] [Modification of the imprint method] Next, a modified example of the imprint method for performing an imprint process using the above-mentioned imprint apparatus 10 will be described with reference to Figures 7(a)-(d) and 8(a)-(d). Figures 7(a)-(d) and 8(a)-(d) are side views showing a step of the imprint method according to this embodiment. In Figures 7(a)-(d) and 8(a)-(d), the same parts as those in the embodiment shown in Figures 1 to 6 are denoted by the same reference numerals.

[0087] In this modified example, a case will be described in which a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable resin layer (second resin layer) 42B made of a second resin material are formed side by side on a single substrate 40.

[0088] First, in the same manner as in the above-described embodiment, the load area movement step, the substrate holding step, the leveling step, the alignment step, the first dispenser head position movement step, and the dispenser position movement step are performed.

[0089] 7(a), droplets 41 of a first resin material such as a photocurable resin are discharged from the first dispenser head 17A and supplied to the substrate 40 held by the substrate holder 23 (droplet supplying step). In this droplet supplying step, droplets 41 of the first resin material are discharged from the first dispenser head 17A and supplied to a first region A1 on the substrate 40 located below the first dispenser head 17A. Then, the first dispenser head 17A moves from the discharge position P1a to the positive side in the Y-axis direction and returns to the standby position P1b.

[0090] Next, as shown in FIG. 7(b), the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 to below the mold 50 held by the mold holding part 18 (mold position moving step).

[0091] Next, as shown in FIG. 7(c), the mold 50 and the substrate 40 are brought close to each other, so that a droplet 41 of the first resin material is spread between the mold 50 and the first region A1 of the substrate 40 to form a first photocurable resin layer 42A of the first resin material (contact process).

[0092] Next, the first photocurable resin layer 42A is cured by irradiating it with light from the irradiating unit 21. As a result, the concave-convex pattern 51 of the mold 50 is transferred to the first photocurable resin layer 42A (curing step).

[0093] 7(d), the first photocurable resin layer 42A and the mold 50 are separated (mold releasing step). As a result, the first photocurable resin layer 42A having a concave-convex pattern structure is formed in the first region A1 on the substrate 40.

[0094] Next, the mold 50 held by the mold holding unit 18 is replaced with another mold 50A (hereinafter, simply referred to as the mold 50A) having a shape different from that of the mold 50. In this case, the other mold 50A has a concave-convex pattern having a shape different from that of the mold 50.

[0095] Next, the second dispenser head 17B is moved from the standby position P2b to the negative side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Also, the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 below the second dispenser head 17B (dispenser position moving step).

[0096] 8(a), droplets 41 of a second resin material such as a photocurable resin are discharged from the second dispenser head 17B to a second region A2 on the substrate 40 held by the substrate holding unit 23 (droplet supply step). The second region A2 is a region on the substrate 40 at a different position in the planar direction (XY plane direction) from the first region A1. After that, the second dispenser head 17B moves from the discharge position P2a to the positive side in the Y-axis direction and returns to the standby position P2b.

[0097] Next, as shown in FIG. 8(b), the stage unit 13 is moved to the negative side in the X-axis direction, thereby moving the substrate 40 to below the mold 50A held by the mold holding part 18 (mold position moving step).

[0098] Next, as shown in FIG. 8(c), the mold 50A and the substrate 40 are brought close to each other, so that droplets 41 of the second resin material are spread between the mold 50A and the second region A2 of the substrate 40 to form a second photocurable resin layer 42B of the second resin material (contact process).

[0099] Next, the second photocurable resin layer 42B is cured by irradiating it with light from the irradiating unit 21. As a result, the surface shape of the concave-convex pattern of the mold 50A is transferred to the second photocurable resin layer 42B (curing process).

[0100] 8(d), the second photocurable resin layer 42B is separated from the mold 50A (mold releasing step). As a result, the second photocurable resin layer 42B having a concave-convex pattern structure is formed on the second region A2 of the base material 40.

[0101] As described above, in this modification, the imprint apparatus 10 includes the first dispenser head 17A and the second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B are movable independently of each other. This allows different resin materials (first resin material and second resin material) to be supplied to one substrate 40 within the same imprint apparatus 10. As a result, it becomes possible to form a plurality of resin layers (first photocurable resin layer 42A, second photocurable resin layer 42B) made of different resin materials (first resin material and second resin material) side by side at different positions on the substrate 40.

[0102] [First Modification of Imprint Apparatus] Next, a first modified example of the imprinting apparatus will be described with reference to Fig. 9. Fig. 9 is a plan view showing the first modified example of the imprinting apparatus. In the modified example shown in Fig. 9, the positional relationship between the first dispenser head 17A and the second dispenser head 17B is different, and other configurations are substantially the same as those of the above-mentioned embodiment. In Fig. 9, the same parts as those in the embodiment shown in Figs. 1 to 8 are given the same reference numerals and detailed description thereof will be omitted.

[0103] 9, the standby position P1b of the first dispenser head 17A and the standby position P2b of the second dispenser head 17B are located on opposite sides with respect to the flow line TL of the stage unit 13. Specifically, the standby position P1b of the first dispenser head 17A is located on the negative side in the Y direction with respect to the flow line TL of the stage unit 13. The standby position P2b of the second dispenser head 17B is located on the positive side in the Y direction with respect to the flow line TL of the stage unit 13.

[0104] In this case, the standby position P1b of the first dispenser head 17A is separated from the standby position P2b of the second dispenser head 17B in a direction (Y direction) intersecting the flow line TL. Therefore, the volatilized components of the second resin material discharged from the second dispenser head 17B are not easily carried to the first dispenser head 17A side located downstream of the air flow F. This makes it possible to suppress contamination of the first dispenser head 17A by the volatilized components.

[0105] [Second Modification of Imprint Apparatus] Next, a second modified example of the imprinting apparatus will be described with reference to Figures 10 and 11. Figures 10 and 11 are plan views showing the second modified example of the imprinting apparatus. The modified example shown in Figures 10 and 11 differs mainly in that a sheet-shaped base material 40A is used, and other configurations are substantially the same as the above-mentioned embodiment. In Figures 10 and 11, the same parts as those in the embodiment shown in Figures 1 to 9 are given the same reference numerals and detailed description will be omitted.

[0106] 10 and 11, the imprinting apparatus 10 according to this modification includes a conveyor (substrate transport section) 13A, a mold holding section 18A, a first dispenser head 17A, and a second dispenser head 17B. The conveyor 13A holds a sheet-shaped substrate 40A for imprinting and transports it in the horizontal direction. The mold holding section 18A holds a roll-shaped mold 55. The first dispenser head 17A and the second dispenser head 17B are disposed spaced apart from each other in the horizontal direction (XY plane direction) and can move independently of each other.

[0107] The conveyor 13A conveys the sheet-shaped substrate 40A in a horizontal direction (in this case, the negative side of the X direction). The first dispenser head 17A dispenses a first resin material onto the substrate 40A held by the conveyor 13A. The second dispenser head 17B dispenses a second resin material onto the substrate 40A held by the conveyor 13A. The substrate 40A may be a transparent substrate made of resin such as polycarbonate, polypropylene, polyethylene, or any of these laminated materials. The substrate 40A is preferably in a sheet shape and flexible. Such a substrate 40A may be used to create an optical component, for example.

[0108] Moreover, the conveyor 13A, the mold holding unit 18A, the first dispenser head 17A, and the second dispenser head 17B are housed in a chamber 11. A support unit 14 is disposed in the chamber 11, and the support unit 14 is disposed above the conveyor 13A.

[0109] A leveling unit 15, an alignment camera 16, a second dispenser head 17B, a first dispenser head 17A, and a mold holding unit 18A are attached and fixed to the support unit 14. A mold 55 is held by the mold holding unit 18A. The mold 55 is cylindrical and may have a fine uneven pattern on its surface. The mold 55 rotates relative to the mold holding unit 18A to transfer the uneven pattern to the first resin material or the second resin material on the substrate 40A.

[0110] An airflow forming unit 19 is disposed in the chamber 11 to form an airflow F flowing from one side to the other (from the negative side in the X-axis direction to the positive side in the X-axis direction in this modified example). Furthermore, an irradiation unit 21 is provided between the mold holding unit 18A and the airflow forming unit 19. A transfer unit 25 is provided below the mold holding unit 18A. The transfer unit 25 is an area where the mold 55 and the substrate 40A are located when the shape of the mold 55 is transferred to the first resin material or the second resin material on the substrate 40A.

[0111] In this modification, the discharge position P1a of the first dispenser head 17A is located downstream of the airflow F with respect to the discharge position P2a of the second dispenser head 17B. As a result, even if the first resin material discharged from the first dispenser head 17A is more volatile than the second resin material discharged from the second dispenser head 17B, the volatilized components are less likely to be carried to the transfer unit 25. As a result, it is possible to suppress contamination of various members present in the transfer unit 25 by the volatilized components.

[0112] An imprint method for performing imprint processing using the imprint apparatus 10 shown in FIGS. 10 and 11 will be described.

[0113] First, the first dispenser head 17A is moved from the standby position P1b to the negative side in the Y-axis direction and stopped at the discharge position P1a (first dispenser head position moving step). Next, the first dispenser head 17A discharges and supplies droplets 46A of a first resin material such as a photocurable resin to the substrate 40A held by the conveyor 13A (droplet supply step). After that, the first dispenser head 17A returns from the discharge position P1a to the standby position P1b.

[0114] Next, the conveyor 13A moves the substrate 40A below the mold 55 held by the mold holding unit 18A (mold position moving step). Subsequently, the droplets 46A of the first resin material pass through the gap between the mold 55 and the substrate 40A, spreading the droplets 46A between the mold 55 and the substrate 40A to form a first photocurable resin layer 42A of the first resin material (contact step).

[0115] Next, the first photocurable resin layer 42A is cured by irradiating it with light from the irradiating unit 21. As a result, the concave-convex pattern of the mold 55 is transferred to the first photocurable resin layer 42A (curing step).

[0116] Next, the second dispenser head 17B is moved from the standby position P2b to the negative side in the Y-axis direction and stopped at the discharge position P2a (second dispenser head position moving step). Also, the conveyor 13A moves the substrate 40A below the second dispenser head 17B (dispenser position moving step).

[0117] Next, droplets 46B of a second resin material such as a photocurable resin are discharged from the second dispenser head 17B onto the substrate 40A held by the conveyor 13A (droplet supplying step). The area to which the droplets 46B are supplied is an area on the substrate 40A that is at a different position in the planar direction (XY plane direction) from the area to which the droplets 46A are supplied. After that, the second dispenser head 17B returns from the discharge position P2a to the standby position P2b.

[0118] Next, the conveyor 13A moves the substrate 40A below the mold 55 held by the mold holding unit 18A (mold position moving step). Subsequently, the droplets 46B of the second resin material pass through the gap between the mold 55 and the substrate 40A, spreading the droplets 46B of the second resin material between the mold 55 and the substrate 40A to form a second photocurable resin layer 42B of the second resin material (contact step).

[0119] Next, the second photocurable resin layer 42B is cured by irradiating it with light from the irradiating unit 21. As a result, the concave-convex pattern of the mold 55 is transferred to the second photocurable resin layer 42B (curing step).

[0120] As described above, in this modification, the imprint apparatus 10 includes the first dispenser head 17A and the second dispenser head 17B, and the first dispenser head 17A and the second dispenser head 17B are movable independently of each other. This allows different resin materials (first resin material and second resin material) to be supplied to one sheet-like substrate 40A within the same imprint apparatus 10. As a result, it is possible to form a plurality of resin layers (first photocurable resin layer 42A, second photocurable resin layer 42B) made of different resin materials (first resin material and second resin material) side by side at different positions on the sheet-like substrate 40A.

[0121] In this modification, a first photocurable resin layer (first resin layer) 42A made of a first resin material and a second photocurable resin layer (second resin layer) 42B made of a second resin material may be formed on one sheet-like substrate 40A by stacking them. In this modification, the mold 55 for forming the first photocurable resin layer 42A and the mold 55 for forming the second photocurable resin layer 42B may be the same as or different from each other.

[0122] [Third Modification of Imprint Apparatus] Next, a third modified example of the imprinting apparatus will be described with reference to Fig. 12. Fig. 12 is a plan view showing the third modified example of the imprinting apparatus. The modified example shown in Fig. 12 differs in the positional relationship between the first dispenser head 17A and the second dispenser head 17B, and other configurations are substantially the same as the imprinting apparatus 10 according to the above-mentioned modified example 2. In Fig. 12, the same parts as those shown in Figs. 10 and 11 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0123] 12, the standby position P1b of the first dispenser head 17A and the standby position P2b of the second dispenser head 17B are located on opposite sides with respect to the flow line TL of the stage unit 13. Specifically, the standby position P1b of the first dispenser head 17A is located on the negative side of the Y direction with respect to the flow line TL of the stage unit 13, and the standby position P2b of the second dispenser head 17B is located on the positive side of the Y direction with respect to the flow line TL of the stage unit 13.

[0124] In this case, the standby position P1b of the first dispenser head 17A is separated from the standby position P2b of the second dispenser head 17B in a direction perpendicular to the flow line TL (Y direction). Therefore, the volatilized components of the second resin material discharged from the second dispenser head 17B are not easily carried to the first dispenser head 17A side located downstream of the air flow F. This makes it possible to suppress contamination of the first dispenser head 17A by the volatilized components.

[0125] The present disclosure is not limited to the above-described embodiments and modifications, and can be embodied by modifying the components without departing from the spirit of the present disclosure. In addition, various inventions can be formed by appropriately combining the multiple components disclosed in the above-described embodiments and modifications. Some components may be deleted from all the components shown in each embodiment and modification. [Explanation of symbols]

[0126] 10 Imprinting device 11. Chamber 12 Stage Base 13 Stage Unit 14 Support part 15 Leveling Section 16 Alignment Camera 17A 1st dispenser head 17B 2nd dispenser head 18 Mold holder 19 Air flow forming section 20 Load Regions 21 Irradiation unit 23 Base material holding part 24 Stock Section 25 Transcription section 26 Ink receiving member 40 Base material 41 droplet 50 Mold 51 Concave and Convex Pattern 60 Concave and convex structure

Claims

1. 1. An imprint apparatus, comprising: a substrate conveying section that holds the substrate and conveys it in a horizontal direction; A mold holding portion that holds the mold; a first dispenser head configured to dispense a first resin material onto the base material held by the base material conveying unit; a second dispenser head that dispenses a second resin material onto the base material held by the base material conveying unit, The first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, The first dispenser head and the second dispenser head are movable independently of each other; An airflow forming unit that forms an airflow from one side to the other side is further provided, An imprint apparatus, wherein the first resin material is more volatile than the second resin material, and the ejection position of the first dispenser head is not located upstream of the airflow relative to the ejection position of the second dispenser head.

2. The imprint apparatus according to claim 1 , wherein a vapor pressure of the first resin material at room temperature is higher than a vapor pressure of the second resin material at room temperature.

3. The imprint apparatus according to claim 1 , wherein the viscosity of the first resin material is lower than the viscosity of the second resin material.

4. The imprint apparatus according to claim 1 , wherein a contact angle of the first resin material to the base material is smaller than a contact angle of the second resin material to the base material.

5. 1. An imprint apparatus, comprising: a substrate conveying section that holds the substrate and conveys it in a horizontal direction; A mold holding portion that holds the mold; a first dispenser head configured to dispense a first resin material onto the base material held by the base material conveying unit; a second dispenser head that dispenses a second resin material onto the base material held by the base material conveying unit, The first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, The first dispenser head and the second dispenser head are movable independently of each other; An imprint apparatus, wherein the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides with respect to a flow line of the substrate transport unit.

6. The imprint apparatus according to claim 1 , wherein the base material is in a sheet form.

7. 1. An imprint method comprising the steps of: holding and transporting the substrate in a horizontal direction by a substrate transport unit; Discharging droplets of a first resin material from a first dispenser head onto the substrate; spreading droplets of the first resin material between the mold and the base material to form a first resin layer of the first resin material; a step of hardening the first resin layer to obtain the first resin layer to which the surface shape of the mold has been transferred; discharging a second resin material from a second dispenser head onto the base material; spreading droplets of the second resin material between the mold and the base material to form a second resin layer of the second resin material; and hardening the second resin layer to obtain the second resin layer to which the surface shape of the mold has been transferred. The first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, The first dispenser head and the second dispenser head are movable independently of each other; Airflow is created from one side to the other, An imprint method, wherein the first resin material is more volatile than the second resin material, and a discharge position of the first dispenser head is not located upstream of the airflow with respect to a discharge position of the second dispenser head.

8. The imprinting method described in Claim 7, wherein the second resin layer is formed on top of the first resin layer.

9. The imprint method according to claim 7 , wherein the first resin layer and the second resin layer are formed side by side on the base material.

10. An imprinting method described in any one of claims 7 to 9, wherein a mold for forming the first resin layer and a mold for forming the second resin layer are different from each other.

11. 1. An imprint method comprising the steps of: holding and transporting the substrate in a horizontal direction by a substrate transport unit; Discharging droplets of a first resin material from a first dispenser head onto the substrate; spreading droplets of the first resin material between the mold and the base material to form a first resin layer of the first resin material; a step of hardening the first resin layer to obtain the first resin layer to which the surface shape of the mold has been transferred; discharging a second resin material from a second dispenser head onto the base material; spreading droplets of the second resin material between the mold and the base material to form a second resin layer of the second resin material; and hardening the second resin layer to obtain the second resin layer to which the surface shape of the mold has been transferred. The first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, The first dispenser head and the second dispenser head are movable independently of each other; An imprint method, wherein the standby position of the first dispenser head and the standby position of the second dispenser head are located on opposite sides with respect to a line of movement of the substrate transport section.

12. The imprinting method according to claim 7 , wherein the base material is in a sheet form.

13. Providing a substrate having a substrate body and a mask layer formed on the substrate body; Discharging droplets of a first resin material from a first dispenser head onto the mask layer of the base material; spreading droplets of the first resin material between the mold and the base material to form a first resin layer of the first resin material; a step of hardening the first resin layer to obtain the first resin layer to which the surface shape of the mold has been transferred; discharging a second resin material onto the first resin layer from a second dispenser head onto the base material; spreading droplets of the second resin material between the mold and the base material to form a second resin layer of the second resin material; a step of hardening the second resin layer to obtain the second resin layer to which the surface shape of the mold has been transferred; dry etching the second resin layer until the first resin layer is exposed; dry etching the first resin layer until the mask layer is exposed; removing the mask layer that is not covered by the first resin layer and the second resin layer; dry etching the substrate body using the remaining mask layer as a mask; and removing the mask layer remaining on the substrate body. The first dispenser head and the second dispenser head are each movable between a standby position and a dispensing position, The first dispenser head and the second dispenser head are movable independently of each other; Airflow is created from one side to the other, A method for manufacturing a concave-convex structure, wherein the first resin material is more volatile than the second resin material, and the ejection position of the first dispenser head is not located upstream of the airflow relative to the ejection position of the second dispenser head.

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