Multilayer coil parts

Abstract

To provide a laminated coil component that mitigates stresses occurring to the inside of an element assembly, while suppressing the generation of cracks in an insulating layer when mounted in place.SOLUTION: The laminated coil component comprises an element assembly in which a plurality of insulating layers 15a-15c are laminated, a plurality of conductor layers that are laminated together with the plurality of insulating layers, and a plurality of external electrodes. At least some of the plurality of conductor layers are electrically connected so as to constitute a coil, and the plurality of conductor layers include a first outside conductor layer 21, a second outside conductor layer, and at least one inside conductor layer existing between the first outside conductor layer 21 and the second outside conductor layer in the lamination direction, with a gap layer 40 provided in at least one interface among all of first and second inside interfaces of the inside conductor layer. When the cross section of a first portion is seen that goes along the lamination direction and a direction orthogonal to the direction in which the first portion of the first outside conductor layer extends when seen from the lamination direction, no gap layers are formed in both first and second outside interfaces.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a multilayer coil component. [Background technology]

[0002] Patent Document 1 discloses a multilayer inductor formed by stacking a magnetic paste, which is made by mixing a binder with magnetic powder, and a conductive paste, and then firing the laminate formed, the multilayer inductor being characterized in that it has a gap between the conductor layer that forms the internal coil and the magnetic layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-219821 Summary of the Invention [Problem to be solved by the invention]

[0004] In the multilayer inductor described in Patent Document 1, since a gap is provided between the magnetic layers and the conductor layers in the lamination direction, the magnetic layers are not affected by stress from the conductor layers, that is, a stress relaxation effect is obtained. However, the inventors have found that when the multilayer inductor described in Patent Document 1 is mounted on a mounting target such as a board, an impact load applied to the multilayer inductor in the lamination direction may cause cracks to occur in the magnetic layers, starting from the gap that is provided between the conductor layers and the magnetic layers at the outermost positions in the lamination direction and overlaps with the external electrodes in the lamination direction.

[0005] The present invention has been made to solve the above problems, and has an object to provide a multilayer coil component that can reduce the occurrence of cracks in the insulating layer during mounting while mitigating stress generated inside the element body. [Means for solving the problem]

[0006] The laminated coil component of the present invention comprises an element body formed by laminating a plurality of insulating layers in a lamination direction, a plurality of conductor layers provided inside the element body and laminated together with the plurality of insulating layers in the lamination direction, and a plurality of external electrodes provided on a surface of the element body, wherein the element body has a first main surface and a second main surface opposed to each other in the lamination direction, and at least some of the plurality of conductor layers are electrically connected to form a coil electrically connected to the plurality of external electrodes, and the plurality of conductor layers are disposed on the first main surface side of the element body in the lamination direction. the first outer conductor layer being located at an outermost position, a second outer conductor layer being located at an outermost position on the second main surface side of the element body in the stacking direction, and at least one inner conductor layer being located between the first outer conductor layer and the second outer conductor layer in the stacking direction, and the multiple external electrodes include a first external electrode provided at least on the first main surface of the element body, and an internal conductor layer provided at least on the first main surface of the element body so as to be spaced from the first external electrode and not electrically connected to the first outer conductor layer in a direction along the first outer conductor layer. and a second external electrode, each of the inner conductor layers forming a first inner interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction and forming a second inner interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction, the first outer conductor layer forming a first outer interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction and forming a second outer interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction, The laminate has a first portion that overlaps a portion of the second external electrode that is provided on the first main surface of the element body when viewed from the stacking direction, and a gap layer is provided at at least one of all of the first inner interfaces and the second inner interfaces, and when viewing at least one cross section of the first portion of the first outer conductor layer along the stacking direction and a direction perpendicular to the extension direction of the first portion of the first outer conductor layer when viewed from the stacking direction, the gap layer is not provided at both the first outer interface and the second outer interface. Effect of the Invention

[0007] According to the present invention, it is possible to provide a multilayer coil component that can reduce the occurrence of cracks in the insulating layer during mounting while mitigating stress generated inside the element body. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view showing an example of a multilayer coil component according to the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing an example of a cross section along line a1-a2 of the multilayer coil component shown in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view showing an example of a cross section along line segment b1-b2 of the multilayer coil component shown in FIG. [Figure 4] FIG. 4 is a schematic plan view showing the laminated coil component shown in FIGS. 2 and 3 as seen through from the first main surface side of the element body. [Diagram 5] FIG. 5 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 6] FIG. 6 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 7] FIG. 7 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 8] FIG. 8 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 9] FIG. 9 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 10] FIG. 10 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 11]FIG. 11 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 12] FIG. 12 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 13] FIG. 13 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 14] FIG. 14 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 15] FIG. 15 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 16] FIG. 16 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 17] FIG. 17 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 18] FIG. 18 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 19] FIG. 19 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 20] FIG. 20 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 21] FIG. 21 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 22] FIG. 22 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 23]FIG. 23 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Figure 24] FIG. 24 is a schematic plan view showing a step of producing a laminate block in an example of a method for producing a laminated coil component of the present invention. [Diagram 25] FIG. 25 is a schematic plan view showing the laminated coil component of Example 1 as seen through from the first main surface side of the element body. [Figure 26] FIG. 26 is a schematic plan view showing the laminated coil component of Example 2 as seen through from the first main surface side of the element body. [Figure 27] FIG. 27 is a schematic plan view showing the laminated coil component of Example 3 as seen through from the first main surface side of the element body. [Figure 28] FIG. 28 is a schematic plan view showing the laminated coil component of Example 4 as seen through from the first main surface side of the element body. [Figure 29] FIG. 29 is a schematic plan view showing the laminated coil component of Comparative Example 1 as seen through from the first main surface side of the element body. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The laminated coil component of the present invention will be described below. Note that the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the gist of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0010] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and scale may differ from those of the actual product.

[0011] In this specification, terms indicating the relationship between elements (e.g., "parallel," "orthogonal," etc.) and terms indicating the shapes of elements not only mean the literal strict form, but also mean a range that is substantially equivalent, for example, a range that includes a difference of about a few percent.

[0012] The laminated coil component of the present invention comprises an element body formed by laminating a plurality of insulating layers in a lamination direction, a plurality of conductor layers provided inside the element body and laminated together with the plurality of insulating layers in the lamination direction, and a plurality of external electrodes provided on a surface of the element body, wherein the element body has a first main surface and a second main surface opposed to each other in the lamination direction, and at least some of the plurality of conductor layers are electrically connected to form a coil electrically connected to the plurality of external electrodes, and the plurality of conductor layers are disposed on the first main surface side of the element body in the lamination direction. the first outer conductor layer being located at an outermost position, a second outer conductor layer being located at an outermost position on the second main surface side of the element body in the stacking direction, and at least one inner conductor layer being located between the first outer conductor layer and the second outer conductor layer in the stacking direction, and the multiple external electrodes include a first external electrode provided at least on the first main surface of the element body, and an internal conductor layer provided at least on the first main surface of the element body so as to be spaced from the first external electrode and not electrically connected to the first outer conductor layer in a direction along the first outer conductor layer. and a second external electrode, each of the inner conductor layers forming a first inner interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction and forming a second inner interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction, the first outer conductor layer forming a first outer interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction and forming a second outer interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction, The laminate has a first portion that overlaps a portion of the second external electrode that is provided on the first main surface of the element body when viewed from the stacking direction, and a gap layer is provided at at least one of all of the first inner interfaces and the second inner interfaces, and when viewing at least one cross section of the first portion of the first outer conductor layer along the stacking direction and a direction perpendicular to the extension direction of the first portion of the first outer conductor layer when viewed from the stacking direction, the gap layer is not provided at both the first outer interface and the second outer interface.

[0013] Fig. 1 is a perspective schematic diagram showing an example of a laminated coil component of the present invention. Fig. 2 is a cross-sectional schematic diagram showing an example of a cross section along a line segment a1-a2 of the laminated coil component shown in Fig. 1. Fig. 3 is a cross-sectional schematic diagram showing an example of a cross section along a line segment b1-b2 of the laminated coil component shown in Fig. 1.

[0014] The multilayer coil component 1 shown in FIGS. 1, 2, and 3 has an element body 10, a coil 20, a first external electrode 31, and a second external electrode 32.

[0015] In this specification, the length direction, height direction, and width direction are defined as directions L, T, and W, respectively, as shown in Fig. 1 etc. Here, the length direction L, height direction T, and width direction W are perpendicular to each other.

[0016] 1, the element body 10 has a first end face 11a and a second end face 11b facing in the length direction L, a first main face 12a and a second main face 12b facing in the height direction T, and a first side face 13a and a second side face 13b facing in the width direction W, and is, for example, a rectangular parallelepiped shape. In this specification, the rectangular parallelepiped shape may mean any shape that can be said to be substantially rectangular parallelepiped, and includes, for example, a substantially rectangular parallelepiped shape with rounded corners and ridges, as described below.

[0017] The first end face 11a and the second end face 11b of the element body 10 do not need to be strictly perpendicular to the length direction L. In addition, the first main surface 12a and the second main surface 12b of the element body 10 do not need to be strictly perpendicular to the height direction T. Furthermore, the first side surface 13a and the second side surface 13b of the element body 10 do not need to be strictly perpendicular to the width direction W.

[0018] In this specification, the height direction is defined as the vertical direction, the first main surface of the body is defined as the lower side, and the second main surface of the body is defined as the upper side; however, the directions are not limited to these directions and may be changed as appropriate depending on the state in which the multilayer coil component is installed.

[0019] 1, 2, and 3, the first main surface 12a of the element body 10 is a mounting surface that faces an object to be mounted (e.g., a substrate) when mounting the multilayer coil component 1. In the multilayer coil component 1, in order to make the mounting surface of the element body 10 easy to understand, markings may be applied to the mounting surface of the element body 10, here, the first main surface 12a of the element body 10.

[0020] It is preferable that the corners and ridges of the element body 10 are rounded. The corners of the element body 10 are portions where three faces of the element body 10 intersect. The ridges of the element body 10 are portions where two faces of the element body 10 intersect.

[0021] As shown in FIGS. 2 and 3, the element body 10 is formed by laminating a plurality of insulating layers in the lamination direction.

[0022] In the example shown in Figures 2 and 3, the base body 10 is formed by stacking a number of insulating layers in the height direction T, including insulating layer 15a, insulating layer 15b, insulating layer 15c, insulating layer 15d, insulating layer 15e, insulating layer 15f, insulating layer 15g, insulating layer 15h, and insulating layer 15i.

[0023] In the example shown in Figures 2 and 3, the base body 10 includes insulating layer 15a, insulating layer 15b, insulating layer 15c, insulating layer 15d, insulating layer 15e, insulating layer 15f, insulating layer 15g, insulating layer 15h, and insulating layer 15i, which are arranged in order in the height direction T from the first main surface 12a side toward the second main surface 12b side.

[0024] 2 and 3, the stacking direction of the multiple insulating layers is parallel to the height direction T. That is, in the example shown in Figures 2 and 3, the stacking direction of the multiple insulating layers is perpendicular to the first main surface 12a of the element body 10, which is the mounting surface.

[0025] In addition, although the boundaries between a plurality of insulating layers are shown in FIG. 2 and FIG. 3 for the convenience of explanation, in reality, these boundaries do not appear clearly.

[0026] Examples of materials constituting each of the insulating layers include magnetic ferrite materials and non-magnetic ferrite materials.

[0027] The magnetic ferrite material preferably contains Fe, Zn, Cu, and Ni. In this case, the magnetic ferrite material preferably contains, when the total amount is 100 mol%, Fe is 40 mol% or more and 49.5 mol% or less in terms of Fe2O3, Zn is 5 mol% or more and 35 mol% or less in terms of ZnO, Cu is 4 mol% or more and 12 mol% or less in terms of CuO, and Ni is the remainder in terms of NiO. In addition, the magnetic ferrite material may further contain additives such as Mn, Co, Sn, Bi, and Si, and may further contain inevitable impurities.

[0028] The non-magnetic ferrite material preferably contains Fe, Cu, and Zn. In this case, the non-magnetic ferrite material preferably contains, when the total amount is 100 mol%, Fe in Fe2O3 equivalent of 40 mol% or more and 49.5 mol% or less, Cu in CuO equivalent of 6 mol% or more and 12 mol% or less, and Zn in ZnO equivalent of the remainder. The non-magnetic ferrite material may further contain additives such as Mn, Co, Sn, Bi, Si, etc., and may further contain inevitable impurities.

[0029] The constituent materials of the insulating layers may be the same as each other, may be different from each other, or may be partially different from each other.

[0030] The thicknesses of the insulating layers (here, the dimensions in the height direction T) may be the same as each other, may be different from each other, or may be partially different.

[0031] 2 and 3, the coil 20 is configured by electrically connecting at least some of a plurality of conductor layers. The plurality of conductor layers are provided inside the element body 10, and are stacked together with a plurality of insulating layers in the stacking direction.

[0032] In the example shown in Figs. 2 and 3, the element body 10 is provided therein with a plurality of conductor layers including a first outer conductor layer 21, a second outer conductor layer 22, an inner conductor layer 23a, and an inner conductor layer 23b.

[0033] The first outer conductor layer 21 is present at the outermost position of the plurality of conductor layers on the first main surface 12a side of the element body 10 in the stacking direction (here, the height direction T).

[0034] The second outer conductor layer 22 is present at the outermost position of the plurality of conductor layers on the second main surface 12b side of the element body 10 in the stacking direction (here, the height direction T).

[0035] Therefore, of the first outer conductor layer 21 and the second outer conductor layer 22, the first outer conductor layer 21 is located on the mounting surface side of the element body 10, here, the first main surface 12a side of the element body 10, and the second outer conductor layer 22 is located on the side opposite the mounting surface of the element body 10, here, the second main surface 12b side of the element body 10. In other words, when the multilayer coil component 1 is mounted, the first outer conductor layer 21 is located closer to the mounting object in the stacking direction (here, the height direction T) than the second outer conductor layer 22.

[0036] Among the multiple conductor layers, the inner conductor layer 23a and the inner conductor layer 23b are present between the first outer conductor layer 21 and the second outer conductor layer 22 in the stacking direction (here, the height direction T).

[0037] 2 and 3, the inner conductor layer 23a and the inner conductor layer 23b are shown as the inner conductor layers present between the first outer conductor layer 21 and the second outer conductor layer 22 in the stacking direction (here, the height direction T), but in addition to the inner conductor layer 23a and the inner conductor layer 23b, at least one further inner conductor layer may be present. The number of inner conductor layers may be two or more, or may be one.

[0038] In the example shown in Figures 2 and 3, the first outer conductor layer 21, the second outer conductor layer 22, the inner conductor layer 23a, and the inner conductor layer 23b are stacked in the height direction T together with insulating layer 15a, insulating layer 15b, insulating layer 15c, insulating layer 15d, insulating layer 15e, insulating layer 15f, insulating layer 15g, insulating layer 15h, and insulating layer 15i.

[0039] In the example shown in Figures 2 and 3, the first outer conductor layer 21, the inner conductor layer 23a, the inner conductor layer 23b, and the second outer conductor layer 22 are stacked in order in the height direction T from the first main surface 12a side to the second main surface 12b side of the base body 10.

[0040] In the example shown in Figures 2 and 3, all of the conductor layers including the first outer conductor layer 21, the second outer conductor layer 22, the inner conductor layer 23a, and the inner conductor layer 23b are electrically connected to form the coil 20.

[0041] In the example shown in FIG. 3, the first outer conductor layer 21 and the inner conductor layer 23a are electrically connected via a connecting conductor 24a.

[0042] A land portion is provided on the first outer conductor layer 21, for example, at a position continuous with an end portion of the first outer conductor layer 21 and connected to at least the connecting conductor 24a. Also, a land portion is provided on the inner conductor layer 23a, for example, at a position continuous with an end portion of the inner conductor layer 23a and connected to at least the connecting conductor 24a.

[0043] In the example shown in FIG. 3, the second outer conductor layer 22 and the inner conductor layer 23b are electrically connected via a connecting conductor 24b.

[0044] A land portion is provided on the second outer conductor layer 22, for example, at a position continuous with an end portion of the second outer conductor layer 22 and connected to at least the connecting conductor 24b. Also, a land portion is provided on the inner conductor layer 23b, for example, at a position continuous with an end portion of the inner conductor layer 23b and connected to at least the connecting conductor 24b.

[0045] In this specification, the land portion is not included in the outer conductor layer and the inner conductor layer. The land portion indicates a range including a portion connected to the connecting conductor when viewed from the stacking direction (here, the height direction T) and having an area that is 120% of the area of ​​the portion connected to the connecting conductor.

[0046] 2 and 3, the stacking direction of the multiple conductor layers is parallel to the height direction T. That is, in the example shown in Figures 2 and 3, the stacking direction of the multiple conductor layers is perpendicular to the first main surface 12a of the element body 10, which is the mounting surface.

[0047] 2, the coil axis C of the coil 20 extends in the height direction T. That is, in the example shown in Fig. 2, the direction of the coil axis C of the coil 20 is perpendicular to the first main surface 12a of the element body 10, which is the mounting surface.

[0048] For the above reasons, in the example shown in Figures 2 and 3, the stacking direction of the multiple insulating layers, the stacking direction of the multiple conductor layers, and the direction of the coil axis C of the coil 20 are all along the same height direction T and are perpendicular to the first main surface 12a of the base body 10, which is the mounting surface.

[0049] When viewed from the stacking direction (here, height direction T), each conductor layer may have a shape consisting of only straight lines, may have a shape consisting of only curved lines, or may have a shape consisting of straight lines and curved lines. In other words, when viewed from the stacking direction (here, height direction T), coil 20 may have a shape consisting of only straight lines, may have a shape consisting of only curved lines, or may have a shape consisting of straight lines and curved lines. For example, when viewed from the stacking direction (here, height direction T), coil 20 may have a polygonal shape, a circular shape, or an elliptical shape, for example.

[0050] Examples of the material for each conductor layer include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0051] The thicknesses of the respective conductor layers (here, the dimension in the height direction T) may be the same as each other, may be different from each other, or may be partially different.

[0052] Examples of the material of each connecting conductor include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0053] The thicknesses of the respective connection conductors (here, the dimensions in the height direction T) may be the same as each other, may be different from each other, or may be partially different.

[0054] As shown in FIG. 2, the coil 20 is electrically connected to a first external electrode 31.

[0055] 2, the first outer conductor layer 21 constituting the coil 20 is electrically connected to the first external electrode 31 via a first extension conductor 25a located at one end of the first outer conductor layer 21. More specifically, in the example shown in Fig. 2, the first extension conductor 25a is exposed at the first end face 11a of the element body 10, and the first external electrode 31 is connected to the exposed portion of the first extension conductor 25a.

[0056] As shown in FIG. 2, the coil 20 is electrically connected to a second external electrode 32 .

[0057] 2, the second outer conductor layer 22 constituting the coil 20 is electrically connected to the second external electrode 32 via a second extension conductor 25b located at one end of the second outer conductor layer 22. More specifically, in the example shown in Fig. 2, the second extension conductor 25b is exposed at the second end face 11b of the element body 10, and the second external electrode 32 is connected to the exposed portion of the second extension conductor 25b.

[0058] In this specification, the lead conductor is included in the outer conductor layer and the inner conductor layer.

[0059] Examples of the constituent material of each of the lead conductors include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0060] The thicknesses of the respective lead conductors (here, the dimension in the height direction T) may be the same as each other, may be different from each other, or may be partially different.

[0061] As shown in Fig. 1, the first external electrode 31 is provided on the surface of the element body 10. More specifically, the first external electrode 31 is provided on at least the first main surface 12a of the element body 10. Furthermore, as shown in Fig. 1, the first external electrode 31 may be provided on the second main surface 12b of the element body 10 in addition to the first main surface 12a of the element body 10. In the example shown in Fig. 1, the first external electrode 31 extends from the first end surface 11a of the element body 10 over a portion of each of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0062] The arrangement of the first external electrode 31 is not limited to the arrangement shown in Fig. 1. For example, the first external electrode 31 may extend from a part of the first main surface 12a of the element body 10 to a part of each of the first end surface 11a, the first side surface 13a, and the second side surface 13b.

[0063] As shown in Fig. 1, the second external electrode 32 is provided on the surface of the element body 10. More specifically, the second external electrode 32 is provided on at least the first main surface 12a of the element body 10. Furthermore, as shown in Fig. 1, the second external electrode 32 may be provided on the second main surface 12b of the element body 10, in addition to the first main surface 12a of the element body 10. In the example shown in Fig. 1, the second external electrode 32 extends from the second end face 11b of the element body 10 over a portion of each of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0064] The arrangement of the second external electrode 32 is not limited to the arrangement shown in Fig. 1. For example, the second external electrode 32 may extend from a part of the first main surface 12a of the element body 10 to a part of each of the second end surface 11b, the first side surface 13a, and the second side surface 13b.

[0065] As described above, the second external electrode 32 is provided so as to be separated from the first external electrode 31 (here, so as to be separated in the length direction L).

[0066] As described above, when the first external electrode 31 and the second external electrode 32 are provided on the first main surface 12a of the element body 10, which is the mounting surface, the mountability of the multilayer coil component 1 is likely to be improved.

[0067] As shown in FIG. 2, the second outer electrode 32 is not electrically connected to the first outer conductor layer 21 in the direction along the first outer conductor layer 21.

[0068] In the multilayer coil component 1, as long as the second external electrode 32 is electrically connected to the first external conductor layer 21 in a direction along the first external conductor layer 21, other connection modes between the conductor layers and the external electrodes are not particularly limited. In the example shown in FIG. 2, the connection mode is as follows.

[0069] In the example shown in FIG. 2, the first external electrode 31 is electrically connected to the first outer conductor layer 21 in a direction along the first outer conductor layer 21.

[0070] In the example shown in FIG. 2, the first external electrode 31 is not electrically connected to the second outer conductor layer 22 in the direction along the second outer conductor layer 22.

[0071] In the example shown in FIG. 2, the second external electrode 32 is electrically connected to the second outer conductor layer 22 in a direction along the second outer conductor layer 22 .

[0072] In this specification, the direction along the outer conductor layer includes the outer conductor layer and roughly corresponds to the direction in which a plane perpendicular to the stacking direction (here, the height direction T) extends (here, the direction including the length direction L and the width direction W).

[0073] The first external electrode 31 and the second external electrode 32 may each have a single-layer structure or a multi-layer structure.

[0074] When the first external electrode 31 and the second external electrode 32 each have a single-layer structure, examples of the constituent materials of each external electrode include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0075] When the first external electrode 31 and the second external electrode 32 each have a multi-layer structure, each external electrode may have, in order from the surface side of the base body 10, for example, a base electrode containing Ag, a Ni-plated electrode, and a Sn-plated electrode.

[0076] As shown in Figures 2 and 3, each inner conductor layer forms a first inner interface with an adjacent insulating layer on the first main surface 12a side of the element body 10 in the stacking direction (here, the height direction T), and forms a second inner interface with an adjacent insulating layer on the second main surface 12b side of the element body 10 in the stacking direction (here, the height direction T).

[0077] In this specification, the interface between a conductor layer and an insulating layer refers to the interface between the conductor layer and the insulating layer along a planar direction (here, a direction including the length direction L and the width direction W) perpendicular to the stacking direction (here, the height direction T).

[0078] As shown in FIGS. 2 and 3, a gap layer 40 is provided in at least one of all the first inner interfaces and all the second inner interfaces.

[0079] In the example shown in FIGS. 2 and 3, an air gap layer 40 is provided at a first inner interface between the inner conductor layer 23a and the insulating layer 15c, and at a first inner interface between the inner conductor layer 23b and the insulating layer 15e.

[0080] The air gap layer 40 may be provided at the second inner interface between the inner conductor layer 23a and an insulating layer other than the insulating layer 15c. The air gap layer 40 may be provided at the second inner interface between the inner conductor layer 23b and an insulating layer other than the insulating layer 15e.

[0081] In addition, although Figures 2 and 3 do not show any other inner conductor layers than the inner conductor layer 23a and the inner conductor layer 23b, if such other inner conductor layers are present, a gap layer 40 may be provided in at least one of the first inner interface and the second inner interface between the other inner conductor layer and the insulating layer.

[0082] As described above, it is sufficient that at least one of all the first inner interfaces and second inner interfaces is provided with the void layer 40. Furthermore, when looking at the interfaces at which the void layer 40 is provided among all the first inner interfaces and second inner interfaces, the void layer 40 may be provided over the entire interface or may be provided over a part of the interface.

[0083] It is preferable that the void layer 40 is provided in at least a part of each of the first inner interfaces and the second inner interfaces. For example, when there are a total of 10 first inner interfaces and second inner interfaces, it is preferable that the void layer 40 is provided in at least a part of each of the 10 interfaces. In this case, it is more preferable that the void layer 40 is provided in the entirety of at least one of the first inner interface and the second inner interface. More specifically, the void layer 40 may be provided in the entirety of one of the first inner interface and the second inner interface, or the void layer 40 may be provided in the entirety of both the first inner interface and the second inner interface.

[0084] In the multilayer coil component 1, a void layer 40 is provided in at least one of all the first inner interfaces and all the second inner interfaces, thereby reducing stress generated inside the base body 10 due to the difference in thermal shrinkage rate between the inner conductor layer and the insulating layer, etc.

[0085] When a conventional multilayer coil component such as the multilayer inductor described in Patent Document 1 is mounted on a mounting object such as a substrate, an impact load is applied to the multilayer coil component in the stacking direction. At this time, a gap is generated between the mounting surface of the element body and the mounting object by the thickness of the external electrodes, so that a stress due to the impact load is applied to the element body in a direction from a surface located opposite to the mounting surface in the stacking direction toward the mounting surface. When the stress due to the impact load is applied to the element body in this way, a different stress is applied in the opposite direction to the stress due to the impact load due to a reaction from the mounting object, particularly to the external electrodes present in the vicinity of the mounting surface of the element body and the insulating layer therearound. As described above, when two types of stress are applied to the multilayer coil component, a tensile stress is generated inside the element body, and as a result, the element body is distorted. At this time, the tensile stress is concentrated at the interface between the insulating layer constituting the mounting surface of the element body, between the conductor layer present at the outermost position on the mounting surface side in the stacking direction and the insulating layer, rather than the interface with the external electrodes, and at the interface with the gap layer overlapping the external electrodes in the stacking direction. If the tensile stress is greater than the strength of the insulating layer, cracks will occur in the insulating layer, starting from the void layer. In fact, when the distribution of tensile stress generated in the element body during mounting of the multilayer coil component was simulated using finite element analysis software "Femtet (registered trademark)" made by Murata Software Co., Ltd., it was confirmed that the tensile stress is distributed as described above in the insulating layer constituting the mounting surface of the element body.

[0086] In contrast to this, the multilayer coil component 1 has the following configuration.

[0087] As shown in Figures 2 and 3, the first outer conductor layer 21 forms a first outer interface with the adjacent insulating layer 15a on the first main surface 12a side of the element body 10 in the stacking direction (here, the height direction T), and forms a second outer interface with the adjacent insulating layer 15c on the second main surface 12b side of the element body 10 in the stacking direction (here, the height direction T).

[0088] FIG. 4 is a schematic plan view showing the laminated coil component shown in FIGS. 2 and 3 as seen through from the first main surface side of the element body.

[0089] 4 shows a see-through state of the first external electrode 31, the second external electrode 32, and the insulating layer 15a in order to focus on the first outer conductor layer 21 and the gap layer 40. In reality, when the multilayer coil component 1 is viewed from the first main surface 12a side of the element body 10, the insulating layer 15a is located in front of and overlaps the first outer conductor layer 21 and the gap layer 40, but the insulating layer 15a overlapping the first outer conductor layer 21 and the gap layer 40 is not shown in FIG.

[0090] 4, the first outer conductor layer 21 has a first portion 21a that overlaps a portion of the second outer electrode 32 provided on the first main surface 12a of the element body 10 when viewed in the stacking direction (here, the height direction T). In the example shown in Fig. 4, the first portion 21a of the first outer conductor layer 21 extends in the short side direction of the element body 10 (here, the width direction W).

[0091] A cross section along the length direction L and height direction T of the configuration shown in Fig. 4 is shown in Fig. 2. As shown in Fig. 2, when at least one cross section of the first portion 21a of the first outer conductor layer 21 is viewed along the stacking direction (height direction T in Fig. 2) and a direction (length direction L in Fig. 2) perpendicular to the direction in which the first portion 21a of the first outer conductor layer 21 extends (width direction W in Fig. 2) when viewed from the stacking direction (height direction T in Fig. 2), the air gap layer 40 is not provided at both the first outer interface (the interface between the first portion 21a of the first outer conductor layer 21 and the insulating layer 15a in Fig. 2) and the second outer interface (the interface between the first portion 21a of the first outer conductor layer 21 and the insulating layer 15c in Fig. 2).

[0092] In the multilayer coil component 1, when a cross section of the first portion 21a of the first outer conductor layer 21 is viewed along the stacking direction (height direction T in FIG. 2) and a direction (length direction L in FIG. 2) perpendicular to the direction in which the first portion 21a of the first outer conductor layer 21 extends (width direction W in FIG. 2) when viewed from the stacking direction (height direction T in FIG. 2), as long as there is at least one cross section in which the gap layer 40 is not provided at both the first outer interface and the second outer interface with respect to the first portion 21a of the first outer conductor layer 21, the arrangement of the gap layer 40 in other cross sections is not particularly limited, but in the examples shown in FIGS. 2 and 4, the arrangement is as follows.

[0093] 2 and 4, in the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, the gap layer 40 is not provided in at least a part of the region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). As a result, even if an impact load D is applied to the laminated coil component 1 in the stacking direction (here, the height direction T) as shown in FIG. 2 when the laminated coil component 1 is mounted, the tensile stress generated in the insulating layer 15a around the first portion 21a of the first outer conductor layer 21 is alleviated. Therefore, when the laminated coil component 1 is mounted, the occurrence of cracks in the insulating layer 15a around the first portion 21a of the first outer conductor layer 21 is suppressed.

[0094] 2 and 4, in the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, the gap layer 40 is not provided in at least a part of the region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This reduces the tensile stress generated in the insulating layer 15c around the first portion 21a of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15c around the first portion 21a of the first outer conductor layer 21 is suppressed when the laminated coil component 1 is mounted.

[0095] In this specification, a configuration in which no void layer is provided in at least a portion of the region overlapping the target portion (e.g., the first portion) of the outer conductor layer at the interface between the outer conductor layer and the insulating layer when viewed from the stacking direction (here, the height direction T) refers to a configuration in which there is at least one location at the interface between the target portion (e.g., the first portion) of the outer conductor layer and the insulating layer where no void layer is provided in the entire region extending from one end to the other end of the target portion (e.g., the first portion) of the outer conductor layer in a direction perpendicular to the direction in which the target portion (e.g., the first portion) of the outer conductor layer extends when viewed from the stacking direction (here, the height direction T).

[0096] 4, at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, it is preferable that the gap layer 40 is not provided in the entire region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This sufficiently relieves the tensile stress generated in the insulating layer 15a around the first portion 21a of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15a around the first portion 21a of the first outer conductor layer 21 is sufficiently suppressed when the laminated coil component 1 is mounted.

[0097] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, it is preferable that the gap layer 40 is not provided in the entire region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This sufficiently relieves the tensile stress generated in the insulating layer 15c around the first portion 21a of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15c around the first portion 21a of the first outer conductor layer 21 is sufficiently suppressed when the laminated coil component 1 is mounted.

[0098] For the above reasons, it is more preferable that at least one of the first outer interface and the second outer interface does not have the air gap layer 40 provided in the entire region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the first outer interface and the second outer interface, the air gap layer 40 does not have the entire region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T).

[0099] 4, the first outer conductor layer 21 may further have a second portion 21b overlapping a portion of the first external electrode 31 provided on the first main surface 12a of the element body 10 when viewed in the stacking direction (here, the height direction T). In the example shown in Fig. 4, a part of the second portion 21b of the first outer conductor layer 21 extends in the short side direction of the element body 10 (here, the width direction W).

[0100] 4, at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, it is preferable that the gap layer 40 is not provided in at least a part of the region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This reduces the tensile stress generated in the insulating layer 15a around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15a around the second portion 21b of the first outer conductor layer 21 is suppressed when the laminated coil component 1 is mounted.

[0101] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, it is preferable that the gap layer 40 is not provided in at least a part of the region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This reduces the tensile stress generated in the insulating layer 15c around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15c around the second portion 21b of the first outer conductor layer 21 is suppressed when the laminated coil component 1 is mounted.

[0102] For the above reasons, it is more preferable that at least one of the first outer interface and the second outer interface does not have the gap layer 40 in at least a part of the region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the first outer interface and the second outer interface, the gap layer 40 is not provided in at least a part of the region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T).

[0103] At the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, it is preferable that the gap layer 40 is not provided in the entire region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This sufficiently relaxes the tensile stress generated in the insulating layer 15a around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15a around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted is sufficiently suppressed.

[0104] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, it is preferable that the gap layer 40 is not provided in the entire region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). This sufficiently relieves the tensile stress generated in the insulating layer 15c around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15c around the second portion 21b of the first outer conductor layer 21 when the laminated coil component 1 is mounted is sufficiently suppressed.

[0105] For the above reasons, it is more preferable that at least one of the first outer interface and the second outer interface does not have the air gap layer 40 provided in the entire region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the first outer interface and the second outer interface, the air gap layer 40 does not have to be provided in the entire region overlapping with the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T).

[0106] In order to suppress the occurrence of cracks in the insulating layers 15a and 15c around the first portion 21a and the second portion 21b of the first outer conductor layer 21 when the multilayer coil component 1 is mounted, it is particularly preferable that no void layer 40 is provided in the entire area at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a that overlaps with the first portion 21a and the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction, and in the entire area at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c that overlaps with the first portion 21a and the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction.

[0107] 4, the first outer conductor layer 21 may have a first portion 21a overlapping a portion of the second external electrode 32 provided on the first main surface 12a of the element body 10 when viewed from the stacking direction (here, height direction T), a second portion 21b overlapping a portion of the first external electrode 31 provided on the first main surface 12a of the element body 10 when viewed from the stacking direction (here, height direction T), and a third portion 21c other than the first portion 21a and the second portion 21b. In the example shown in FIG 4, the third portion 21c of the first outer conductor layer 21 extends in the longitudinal direction of the element body 10 (here, length direction L).

[0108] 4, in the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, it is preferable that the gap layer 40 is not provided in the entire region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), the entire region overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), and a region of the region overlapping the third portion 21c of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) that has a length of 20% or more of the dimension F in the direction in which the third portion 21c of the first outer conductor layer 21 extends from each of the ends E1 and E2 on both sides of the first external electrode 31 side and the second external electrode 32 side. This sufficiently relaxes the tensile stress generated in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21 when the multilayer coil component 1 is mounted. Therefore, when the multilayer coil component 1 is mounted, the occurrence of cracks in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21 is sufficiently suppressed.

[0109] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, it is preferable that the gap layer 40 is not provided in the entire region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), the entire region overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), and a region of the region overlapping the third portion 21c of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) that has a length of 20% or more of the dimension in the extending direction of the third portion 21c of the first outer conductor layer 21 from each of the ends on both sides of the first external electrode 31 side and the second external electrode 32 side. This sufficiently relaxes the tensile stress generated in the insulating layer 15c around the first portion 21a and the second portion 21b of the first outer conductor layer 21 when the multilayer coil component 1 is mounted. Therefore, when the multilayer coil component 1 is mounted, the occurrence of cracks in the insulating layer 15c around the first portion 21a and the second portion 21b of the first outer conductor layer 21 is sufficiently suppressed.

[0110] For the above reasons, it is more preferable that at least one of the first outer interface and the second outer interface, no gap layer 40 is provided in the entire area overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), the entire area overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), and in an area of ​​the area overlapping the third portion 21c of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the extension direction of the third portion 21c of the first outer conductor layer 21 from each of the ends on both sides of the first external electrode 31 side and the second external electrode 32 side. In this case, it is further preferable that, at both the first outer interface and the second outer interface, no void layer 40 is provided in the entire area overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), the entire area overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), and in an area of ​​the area overlapping the third portion 21c of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the extension direction of the third portion 21c of the first outer conductor layer 21 from each of the ends on both sides of the first external electrode 31 side and the second external electrode 32 side.

[0111] It is preferable that the entire first outer interface between the first outer conductor layer 21 and the insulating layer 15a is free of the gap layer 40. This eliminates the locations where tensile stress concentrates in the insulating layer 15a around the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, when the laminated coil component 1 is mounted, the occurrence of cracks in the insulating layer 15a around the first outer conductor layer 21 is significantly suppressed.

[0112] Similarly, it is preferable that the entire second outer interface between the first outer conductor layer 21 and the insulating layer 15c is not provided with the air gap layer 40. This eliminates the locations where tensile stress concentrates in the insulating layer 15c around the first outer conductor layer 21 when the laminated coil component 1 is mounted. Therefore, the occurrence of cracks in the insulating layer 15c around the first outer conductor layer 21 when the laminated coil component 1 is mounted is significantly suppressed.

[0113] For the above reasons, it is more preferable that at least one of the first outer interface and the second outer interface is entirely free of the void layer 40. In this case, it is even more preferable that neither the first outer interface nor the second outer interface is entirely free of the void layer 40.

[0114] It is preferable that the area ratio of the void layer 40 to the first outer conductor layer 21 at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a is lower than the area ratio of the void layer 40 to the inner conductor layer at at least one interface among all the first inner interfaces and second inner interfaces between the inner conductor layer and the insulating layer (e.g., the first inner interface between the inner conductor layer 23a and the insulating layer 15c).

[0115] In the multilayer coil component 1, as described above, in the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, the void layer 40 is not provided in at least a part of the region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T), so the area ratio of the void layer 40 to the first outer conductor layer 21 in the first outer interface between the first outer conductor layer 21 and the insulating layer 15a is smaller than 100%. On the other hand, for example, when the void layer 40 is provided in the entire first inner interface between the inner conductor layer 23a and the insulating layer 15c, the area ratio of the void layer 40 to the inner conductor layer 23a in the first inner interface between the inner conductor layer 23a and the insulating layer 15c is 100%. In this case, the area ratio of the void layer 40 to the first outer conductor layer 21 at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a is lower than the area ratio of the void layer 40 to the inner conductor layer 23a at the first inner interface between the inner conductor layer 23a and the insulating layer 15c.

[0116] The area ratio of the gap layer 40 to the first outer conductor layer 21 at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a is less than 100%, preferably 50% or less, and particularly preferably 0%.

[0117] Similarly, it is preferable that the area ratio of the void layer 40 to the first outer conductor layer 21 at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c is lower than the area ratio of the void layer 40 to the inner conductor layer at at least one interface among all the first inner interfaces and second inner interfaces between the inner conductor layer and the insulating layer (e.g., the first inner interface between the inner conductor layer 23a and the insulating layer 15c).

[0118] The area ratio of the gap layer 40 to the first outer conductor layer 21 at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c is less than 100%, preferably 50% or less, and particularly preferably 0%.

[0119] From the above, it is more preferable that the area ratio of the void layer 40 to the first outer conductor layer 21 in at least one of the first outer interface and the second outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in at least one interface (for example, the first inner interface between the inner conductor layer 23a and the insulating layer 15c) among all the first inner interfaces and the second inner interfaces. In this case, it is even more preferable that the area ratio of the void layer 40 to the first outer conductor layer 21 in both the first outer interface and the second outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in at least one interface (for example, the first inner interface between the inner conductor layer 23a and the insulating layer 15c) among all the first inner interfaces and the second inner interfaces. Furthermore, it is particularly preferable that the area ratio of the void layer 40 to the first outer conductor layer 21 in both the first outer interface and the second outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in all the first inner interfaces and the second inner interfaces.

[0120] At the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, the area ratio of the void layer 40 to the region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is less than 100%, preferably 40% or less, more preferably 25% or less, and particularly preferably 0%.

[0121] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, the area ratio of the void layer 40 to the region overlapping with the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is less than 100%, preferably 40% or less, more preferably 25% or less, and particularly preferably 0%.

[0122] For the above reasons, at both the first outer interface and the second outer interface, the area ratio of the void layer 40 to the region overlapping the first portion 21a of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is less than 100%, preferably 40% or less, more preferably 25% or less, and particularly preferably 0%.

[0123] At the first outer interface between the first outer conductor layer 21 and the insulating layer 15a, the area ratio of the void layer 40 to the region overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0124] Similarly, at the second outer interface between the first outer conductor layer 21 and the insulating layer 15c, the area ratio of the void layer 40 to the region overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0125] For the above reasons, at both the first outer interface and the second outer interface, the area ratio of the gap layer 40 to the region overlapping the second portion 21b of the first outer conductor layer 21 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0126] The various aspects of the interface between the first outer conductor layer 21 and the insulating layer described above preferably also apply to the interface between the second outer conductor layer 22 and the insulating layer, as described below.

[0127] The second outer conductor layer 22 may form a third outer interface between itself and an adjacent insulating layer 15g on the first main surface 12a side of the element body 10 in the stacking direction (here, the height direction T), and may form a fourth outer interface between itself and an adjacent insulating layer 15i on the second main surface 12b side of the element body 10 in the stacking direction (here, the height direction T).

[0128] The second outer conductor layer 22 may have a first portion that overlaps a portion of the first outer electrode 31 that is provided on the second main surface 12b of the element body 10 when viewed in the stacking direction (here, the height direction T).

[0129] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, it is preferable that no void layer 40 is provided in at least a portion of the area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0130] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, it is preferable that no void layer 40 is provided in at least a portion of the area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0131] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface does not have the gap layer 40 in at least a part of the region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the third outer interface and the fourth outer interface, the gap layer 40 is not provided in at least a part of the region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0132] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, it is preferable that no void layer 40 is provided in the entire area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0133] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, it is preferable that no void layer 40 is provided in the entire area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0134] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface does not have the air gap layer 40 provided in the entire region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the third outer interface and the fourth outer interface, the air gap layer 40 does not have the entire region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0135] The second outer conductor layer 22 may further have a second portion that overlaps a portion of the second external electrode 32 that is provided on the second main surface 12b of the element body 10 when viewed in the stacking direction (here, the height direction T).

[0136] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, it is preferable that no void layer 40 is provided in at least a portion of the area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0137] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, it is preferable that no void layer 40 is provided in at least a portion of the area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0138] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface does not have the air gap layer 40 in at least a part of the region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the third outer interface and the fourth outer interface, the air gap layer 40 is not provided in at least a part of the region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0139] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, it is preferable that no void layer 40 is provided in the entire area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0140] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, it is preferable that no void layer 40 is provided in the entire area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0141] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface does not have the air gap layer 40 provided in the entire region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T). In this case, it is even more preferable that at both the third outer interface and the fourth outer interface, the air gap layer 40 does not have the entire region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T).

[0142] It is particularly preferable that no void layer 40 is provided in the entire area at the third outer interface between the second outer conductor layer 22 and the insulating layer 15g that overlaps with the first and second portions of the second outer conductor layer 22 when viewed from the stacking direction, and in the entire area at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i that overlaps with the first and second portions of the second outer conductor layer 22 when viewed from the stacking direction.

[0143] The second outer conductor layer 22 may have a first portion overlapping a portion of the first external electrode 31 provided on the second main surface 12b of the element body 10 when viewed from the stacking direction (here, the height direction T), a second portion overlapping a portion of the second external electrode 32 provided on the second main surface 12b of the element body 10 when viewed from the stacking direction (here, the height direction T), and a third portion other than the first and second portions.

[0144] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, it is preferable that no gap layer 40 is provided in the entire region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), the entire region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), and in a region of the region overlapping the third portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the direction in which the third portion of the second outer conductor layer 22 extends from each of the ends on both sides of the first external electrode 31 and the second external electrode 32.

[0145] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, it is preferable that no gap layer 40 is provided in the entire region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), the entire region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), and in a region of the region overlapping the third portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the direction in which the third portion of the second outer conductor layer 22 extends from each of the ends on both sides of the first external electrode 31 and the second external electrode 32.

[0146] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface, no gap layer 40 is provided in the entire area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), the entire area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), and in an area of ​​the area overlapping the third portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the direction in which the third portion of the second outer conductor layer 22 extends from each of the ends on both sides of the first external electrode 31 and the second external electrode 32. In this case, it is further preferable that, at both the third outer interface and the fourth outer interface, no void layer 40 is provided in the entire area overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), the entire area overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T), and in an area of ​​the area overlapping the third portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) that extends over a length of 20% or more of the dimension in the direction in which the third portion of the second outer conductor layer 22 extends from each of the ends on both sides of the first external electrode 31 side and the second external electrode 32 side.

[0147] It is preferable that the air gap layer 40 is not provided over the entire third outer interface between the second outer conductor layer 22 and the insulating layer 15g.

[0148] Similarly, it is preferable that the gap layer 40 is not provided over the entire fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i.

[0149] For the above reasons, it is more preferable that at least one of the third outer interface and the fourth outer interface is entirely free of the void layer 40. In this case, it is even more preferable that the void layer 40 is entirely free of both the third outer interface and the fourth outer interface.

[0150] It is preferable that the area ratio of the void layer 40 to the second outer conductor layer 22 at the third outer interface between the second outer conductor layer 22 and the insulating layer 15g is lower than the area ratio of the void layer 40 to the inner conductor layer at at least one interface among all the first inner interfaces and second inner interfaces between the inner conductor layer and the insulating layer (e.g., the first inner interface between the inner conductor layer 23b and the insulating layer 15e).

[0151] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, the area ratio of the gap layer 40 to the second outer conductor layer 22 is preferably less than 100%, more preferably 50% or less, and particularly preferably 0%.

[0152] Similarly, it is preferable that the area ratio of the void layer 40 to the second outer conductor layer 22 at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i is lower than the area ratio of the void layer 40 to the inner conductor layer at at least one interface among all the first inner interfaces and second inner interfaces between the inner conductor layer and the insulating layer (e.g., the first inner interface between the inner conductor layer 23b and the insulating layer 15e).

[0153] At the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, the area ratio of the gap layer 40 to the second outer conductor layer 22 is preferably less than 100%, more preferably 50% or less, and particularly preferably 0%.

[0154] From the above, it is more preferable that the area ratio of the void layer 40 to the second outer conductor layer 22 in at least one of the third outer interface and the fourth outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in at least one interface (e.g., the first inner interface between the inner conductor layer 23b and the insulating layer 15e) among all the first inner interfaces and the second inner interfaces. In this case, it is even more preferable that the area ratio of the void layer 40 to the second outer conductor layer 22 in both the third outer interface and the fourth outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in at least one interface (e.g., the first inner interface between the inner conductor layer 23b and the insulating layer 15e) among all the first inner interfaces and the second inner interfaces. Furthermore, it is particularly preferable that the area ratio of the void layer 40 to the second outer conductor layer 22 in both the third outer interface and the fourth outer interface is lower than the area ratio of the void layer 40 to the inner conductor layer in all the first inner interfaces and the second inner interfaces.

[0155] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, the area ratio of the void layer 40 to the region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0156] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, the area ratio of the void layer 40 to the region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably less than 40%, even more preferably less than 25%, and particularly preferably 0%.

[0157] In view of the above, at both the third outer interface and the fourth outer interface, the area ratio of the gap layer 40 to the region overlapping the first portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0158] At the third outer interface between the second outer conductor layer 22 and the insulating layer 15g, the area ratio of the void layer 40 to the region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0159] Similarly, at the fourth outer interface between the second outer conductor layer 22 and the insulating layer 15i, the area ratio of the void layer 40 to the region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably less than 40%, even more preferably less than 25%, and particularly preferably 0%.

[0160] In view of the above, at both the third outer interface and the fourth outer interface, the area ratio of the gap layer 40 to the region overlapping the second portion of the second outer conductor layer 22 when viewed from the stacking direction (here, the height direction T) is preferably less than 100%, more preferably 40% or less, even more preferably 25% or less, and particularly preferably 0%.

[0161] The multilayer coil component 1 is manufactured, for example, by the following method.

[0162] <Preparing magnetic ferrite paste> First, Fe2O3, ZnO, CuO, and NiO are weighed out to obtain a predetermined composition. At this time, additives such as Mn, Co, Sn, Bi, and Si may be added. Next, these weighed materials are mixed and pulverized in a wet manner. The pulverized material obtained is then dried and pre-fired. The pre-fire temperature is, for example, 700°C or higher and 800°C or lower. In this manner, a powdered magnetic ferrite material is produced.

[0163] When the total amount of the magnetic ferrite material is taken as 100 mol%, it is preferable that the magnetic ferrite material contains Fe of 40 mol% or more and 49.5 mol% or less when calculated as Fe2O3, Zn of 5 mol% or more and 35 mol% or less when calculated as ZnO, Cu of 4 mol% or more and 12 mol% or less when calculated as CuO, and the remainder Ni when calculated as NiO.

[0164] Next, a solvent such as a ketone-based solvent, a resin such as polyvinyl acetal, a plasticizer such as an alkyd-based plasticizer, etc. are added in predetermined amounts to the magnetic ferrite material, and the mixture is kneaded using a planetary mixer or the like, and then dispersed using a three-roll mill or the like to prepare a magnetic ferrite paste.

[0165] <Preparing non-magnetic ferrite paste> First, Fe2O3, CuO, and ZnO are weighed out to obtain a predetermined composition. At this time, additives such as Mn, Co, Sn, Bi, and Si may be added. Next, these weighed materials are mixed and pulverized in a wet manner. The pulverized material obtained is then dried and pre-fired. The pre-fire temperature is, for example, 700°C or higher and 800°C or lower. In this manner, a powdered non-magnetic ferrite material is produced.

[0166] When the total amount of the nonmagnetic ferrite material is taken as 100 mol%, it is preferable that the nonmagnetic ferrite material contains Fe in an amount of 40 mol% or more and 49.5 mol% or less in an amount of Fe2O3, Cu in an amount of 6 mol% or more and 12 mol% or less in an amount of CuO, and Zn the remainder in an amount of ZnO.

[0167] Next, a solvent such as a ketone-based solvent, a resin such as polyvinyl acetal, a plasticizer such as an alkyd-based plasticizer, and other ingredients are added to the non-magnetic ferrite material in predetermined amounts, and the mixture is kneaded using a planetary mixer or the like, and then dispersed using a three-roll mill or the like to prepare a non-magnetic ferrite paste.

[0168] <Resin paste preparation process> A resin paste is prepared by mixing a resin such as an acrylic resin with a solvent such as dihydrotervinyl acetate.

[0169] <Process for preparing conductor paste> A conductor paste is prepared by adding predetermined amounts of a solvent such as eugenol, a resin such as ethyl cellulose, a dispersant, etc. to Ag powder, kneading the mixture using a planetary mixer or the like, and then dispersing the mixture using a three-roll mill or the like.

[0170] <Step of Producing Laminated Block> 5 to 24 are schematic plan views showing steps of producing a laminate block in an example of a method for producing a laminated coil component of the present invention.

[0171] A substrate (not shown) is prepared in which a thermal release sheet and a polyethylene terephthalate (PET) film are laminated in this order on the surface of a metal plate. Then, a magnetic ferrite paste is printed on the substrate to form a magnetic ferrite paste layer 115a as shown in Fig. 5. The magnetic ferrite paste layer 115a becomes the insulating layer 15a of the multilayer coil component 1 after firing, which will be described later.

[0172] Resin paste is printed at predetermined locations on the magnetic ferrite paste layer 115a to form a resin paste layer 140 as shown in Fig. 6. The resin paste layer 140 shown in Fig. 6 becomes the gap layer 40 provided at the first outer interface between the first outer conductor layer 21 and the insulating layer 15a in the multilayer coil component 1 after firing, which will be described later.

[0173] A conductor paste is printed at a predetermined position on the magnetic ferrite paste layer 115a to form a conductor paste layer 125a as shown in FIG. 7. The conductor paste layer 125a becomes a part of the first extension conductor 25a in the laminated coil component 1 after firing, which will be described later. By forming the conductor paste layer 125a in advance, the thickness of the first extension conductor 25a can be made larger than the thickness of the first outer conductor layer 21 other than the first extension conductor 25a in the laminated coil component 1 to be obtained later. In this way, if the first extension conductor 25a is formed thick in the laminated coil component 1 to be obtained later, the sealing property of the laminated coil component 1 is likely to be improved.

[0174] A conductive paste is printed on a portion of the magnetic ferrite paste layer 115a, the conductive paste layer 125a, and the resin paste layer 140, thereby forming a conductive paste layer 121 as shown in Fig. 8. A portion of the conductive paste layer 121 becomes the first outer conductor layer 21 of the multilayer coil component 1 after firing, which will be described later.

[0175] 9, a magnetic ferrite paste layer 115b is formed by printing the magnetic ferrite paste in an area where the conductive paste layer 121 is not formed. At this time, it is preferable to form the magnetic ferrite paste layer 115b to have a thickness equivalent to that of the conductive paste layer 121. The magnetic ferrite paste layer 115b becomes the insulating layer 15b in the multilayer coil component 1 after firing, which will be described later.

[0176] Conductive paste is printed near the tip of conductive paste layer 121 on the side opposite to conductive paste layer 125a (see FIG. 7), to form conductive paste layer 124a as shown in FIG. 10. In this case, it is preferable to make the dimension of conductive paste layer 124a smaller than the dimension of conductor paste layer 121 in the direction perpendicular to the direction in which conductor paste layer 121 extends. Conductive paste layer 124a becomes connecting conductor 24a in multilayer coil component 1 after firing, which will be described later.

[0177] A nonmagnetic ferrite paste is printed at a location overlapping a portion of the conductive paste layer 121 to form a nonmagnetic ferrite paste layer 115ca as shown in FIG. 11. At this time, the nonmagnetic ferrite paste layer 115ca is formed so that an opening is provided at the position where the conductive paste layer 124a is formed. The nonmagnetic ferrite paste layer 115ca becomes a part of the insulating layer 15c in the laminated coil component 1 after firing, which will be described later. In this way, if the insulating layer (here, the insulating layer 15c) between the conductor layers constituting the coil 20 in the laminated coil component 1 obtained later contains a nonmagnetic ferrite material, the laminated coil component 1 is less likely to be magnetically saturated, and the DC superposition characteristics of the laminated coil component 1 are likely to be improved.

[0178] By printing the magnetic ferrite paste in the area where the non-magnetic ferrite paste layer 115ca and the conductive paste layer 124a are not formed, the magnetic ferrite paste layer 115cb is formed as shown in Fig. 12. The magnetic ferrite paste layer 115cb, like the non-magnetic ferrite paste layer 115ca, becomes a part of the insulating layer 15c in the multilayer coil component 1 after firing, which will be described later.

[0179] Resin paste is printed at predetermined locations on a portion of each of the nonmagnetic ferrite paste layer 115ca and the magnetic ferrite paste layer 115cb to form a resin paste layer 140 as shown in Fig. 13. The resin paste layer 140 shown in Fig. 13 becomes the gap layer 40 provided at the first inner interface between the inner conductor layer 23a and the insulating layer 15c in the multilayer coil component 1 after firing, which will be described later.

[0180] A conductor paste is printed on a portion of the non-magnetic ferrite paste layer 115ca, the conductor paste layer 124a, and the resin paste layer 140, thereby forming the conductor paste layer 123a as shown in FIG. 14. As a result, the conductor paste layer 121 and the conductor paste layer 123a are electrically connected via the conductor paste layer 124a. At this time, in a direction perpendicular to the direction in which the conductor paste layer 123a extends, it is preferable to make the size of the conductor paste layer 123a at the portion (included in the land portion) connected to the conductor paste layer 124a equal to the size of the conductor paste layer 124a. That is, in a direction perpendicular to the direction in which the conductor paste layer 123a extends, it is preferable to make the size of the conductor paste layer 123a at the portion (included in the land portion) connected to the conductor paste layer 124a equal to the size of the conductor paste layer 124a and smaller than the size of the conductor paste layer 121. The conductor paste layer 123a becomes the inner conductor layer 23a in the multilayer coil component 1 after firing, which will be described later.

[0181] By printing the magnetic ferrite paste in the area where the conductive paste layer 123a is not formed, a magnetic ferrite paste layer 115d is formed as shown in Fig. 15. The magnetic ferrite paste layer 115d becomes the insulating layer 15d in the multilayer coil component 1 after firing, which will be described later.

[0182] After that, the above steps are repeated. The following describes the final steps that are performed after the above steps when producing a laminated block. Note that several steps are performed between the step shown in Fig. 15 above and the step shown in Fig. 16 described later, but the description of these steps is omitted.

[0183] By printing the magnetic ferrite paste in the region where the conductive paste layer 123b is not formed, a magnetic ferrite paste layer 115f as shown in Fig. 16 is formed. The magnetic ferrite paste layer 115f becomes the insulating layer 15f of the laminated coil component 1 after firing described later. The conductive paste layer 123b becomes the inner conductive layer 23b of the laminated coil component 1 after firing described later. Note that the non-magnetic ferrite paste layer 115ea and the magnetic ferrite paste layer 115eb existing under the magnetic ferrite paste layer 115f each become a part of the insulating layer 15e of the laminated coil component 1 after firing described later.

[0184] Conductive paste is printed near one end of the conductive paste layer 123b to form a conductive paste layer 124b as shown in Fig. 17. The conductive paste layer 124b becomes the connecting conductor 24b in the multilayer coil component 1 after firing, which will be described later.

[0185] A nonmagnetic ferrite paste is printed on a portion of the magnetic ferrite paste layer 115f and on a portion overlapping the conductive paste layer 123b to form a nonmagnetic ferrite paste layer 115ga as shown in Fig. 18. At this time, the nonmagnetic ferrite paste layer 115ga is formed so that an opening is provided at the position where the conductive paste layer 124b is formed. The nonmagnetic ferrite paste layer 115ga becomes a portion of the insulating layer 15g of the multilayer coil component 1 after firing, which will be described later.

[0186] By printing the magnetic ferrite paste in the area where the non-magnetic ferrite paste layer 115ga and the conductive paste layer 124b are not formed, a magnetic ferrite paste layer 115gb is formed as shown in Fig. 19. The magnetic ferrite paste layer 115gb, like the non-magnetic ferrite paste layer 115ga, becomes a part of the insulating layer 15g in the multilayer coil component 1 after firing, which will be described later.

[0187] Resin paste is printed at predetermined locations on a portion of each of the nonmagnetic ferrite paste layers 115ga and the magnetic ferrite paste layers 115gb to form a resin paste layer 140 as shown in Fig. 20. The resin paste layer 140 shown in Fig. 20 becomes the gap layer 40 provided at the third outer interface between the second outer conductor layer 22 and the insulating layer 15g in the multilayer coil component 1 after firing, which will be described later.

[0188] A conductor paste is printed at a predetermined position on the magnetic ferrite paste layer 115gb to form a conductor paste layer 125b as shown in FIG. 21. The conductor paste layer 125b becomes a part of the second extension conductor 25b in the laminated coil component 1 after firing, which will be described later. By forming the conductor paste layer 125b in advance, the thickness of the second extension conductor 25b can be made greater than the thickness of the second outer conductor layer 22 other than the second extension conductor 25b in the laminated coil component 1 to be obtained later. In this way, if the second extension conductor 25b is formed thick in the laminated coil component 1 to be obtained later, the sealing property of the laminated coil component 1 is likely to be improved.

[0189] A conductor paste is printed on a portion of the non-magnetic ferrite paste layer 115ga, the conductor paste layer 124b, the conductor paste layer 125b, and the resin paste layer 140, thereby forming the conductor paste layer 122 as shown in FIG. 22. As a result, the conductor paste layer 122 and the conductor paste layer 123b are electrically connected via the conductor paste layer 124b. At this time, it is preferable that the dimensions of the conductor paste layer 122 at the portion connected to the conductor paste layer 124b (included in the land portion) in the direction perpendicular to the direction in which the conductor paste layer 122 extends are equal to the dimensions of the conductor paste layer 124b. A portion of the conductor paste layer 122 becomes the second outer conductor layer 22 of the multilayer coil component 1 after firing, which will be described later.

[0190] 23 is formed by printing the magnetic ferrite paste in the area where the conductive paste layer 122 is not formed. At this time, it is preferable that the magnetic ferrite paste layer 115h is formed to have a thickness equivalent to that of the conductive paste layer 122. The magnetic ferrite paste layer 115h becomes the insulating layer 15h in the multilayer coil component 1 after firing, which will be described later.

[0191] By printing the magnetic ferrite paste on the magnetic ferrite paste layer 115h and the conductive paste layer 122, a magnetic ferrite paste layer 115i as shown in Fig. 24 is formed. The magnetic ferrite paste layer 115i becomes the insulating layer 15i in the multilayer coil component 1 after firing, which will be described later.

[0192] In this manner, a laminate block is produced in which a plurality of conductive paste layers and resin paste layers are provided inside a laminate formed by laminating a plurality of magnetic ferrite paste layers and non-magnetic ferrite paste layers.

[0193] <Process for producing element body and coil> First, the laminate block is cut into individual chips of a predetermined size using a dicer or the like, and the resulting chips are then fired.

[0194] When the chip is fired, as described above, the magnetic ferrite paste layer and the non-magnetic ferrite paste layer become insulating layers (e.g., insulating layer 15a, etc.), the conductor paste layer becomes a conductor layer (e.g., first outer conductor layer 21, second outer conductor layer 22, inner conductor layer 23a, inner conductor layer 23b, etc.) or a conductor (e.g., connecting conductor 24a, connecting conductor 24b, first lead conductor 25a, second lead conductor 25b, etc.), and the resin paste layer becomes a void layer (e.g., void layer 40).

[0195] 2 and 3, an element body 10 formed by stacking a plurality of insulating layers in a stacking direction (here, height direction T), and a coil 20 provided inside the element body 10 and formed by electrically connecting a plurality of conductor layers stacked in the stacking direction (here, height direction T) via a connecting conductor are produced. Here, the first extension conductor 25a is exposed at the first end face 11a of the element body 10, and the second extension conductor 25b is exposed at the second end face 11b of the element body 10.

[0196] The corners and ridges of the element 10 may be rounded, for example, by placing the element 10 together with media in a rotary barrel machine and subjecting it to barrel polishing.

[0197] <Process for forming external electrodes> First, a conductive paste, such as a paste containing Ag and glass frit, is applied to form a first coating film connected to the first extraction conductor 25a exposed at the first end face 11a of the element body 10, so as to extend from the first end face 11a of the element body 10 over a portion of each of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0198] In addition, by applying a conductive paste such as a paste containing Ag and glass frit, a second coating film connected to the second extraction conductor 25b exposed at the second end face 11b of the element body 10 is formed so as to extend from the second end face 11b of the element body 10 over a portion of each of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0199] In this manner, the first coating film and the second coating film are formed at positions spaced apart from each other on the surface of the element body 10 (here, positions spaced apart in the length direction L).

[0200] When forming the first coating film and the second coating film, the first coating film and the second coating film may be formed at different times or at the same time.

[0201] When the first coating film and the second coating film are formed at different times, they may be formed in the order of the first coating film and the second coating film, or the order of the second coating film and the first coating film.

[0202] Next, the first coating film is baked to form a first base electrode that extends from the first end face 11a of the element body 10 over portions of the first principal surface 12a, the second principal surface 12b, the first side surface 13a, and the second side surface 13b, and is connected to the first extraction conductor 25a.

[0203] In addition, by baking the second coating film, a second base electrode is formed that extends from the second end face 11b of the element body 10 over portions of the first principal face 12a, the second principal face 12b, the first side face 13a, and the second side face 13b, and is connected to the second extraction conductor 25b.

[0204] Then, a Ni-plated electrode and a Sn-plated electrode are formed in this order on the surface of the first base electrode by electrolytic plating or the like. In this way, an external electrode having the first base electrode, the Ni-plated electrode, and the Sn-plated electrode in this order from the surface side of the element body 10 is formed as an example of a first external electrode 31.

[0205] Furthermore, a Ni-plated electrode and a Sn-plated electrode are formed in this order on the surface of the second base electrode by electrolytic plating or the like. This forms an external electrode having the second base electrode, the Ni-plated electrode, and the Sn-plated electrode in this order from the surface side of the element body 10, as an example of a second external electrode 32.

[0206] In this way, a first external electrode 31 electrically connected to the coil 20 via the first extension conductor 25a and a second external electrode 32 electrically connected to the coil 20 via the second extension conductor 25b are formed on the surface of the element body 10, more specifically, on at least the first main surface 12a of the element body 10.

[0207] In this manner, the multilayer coil component 1 is manufactured.

[0208] In the multilayer coil component 1, both the first outer conductor layer 21 and the second outer conductor layer 22, together with the inner conductor layers including the inner conductor layer 23a and the inner conductor layer 23b, constitute the coil 20, but at least one of the first outer conductor layer 21 and the second outer conductor layer 22 may not constitute the coil 20. In other words, of the first outer conductor layer 21 and the second outer conductor layer 22, the conductor layers constituting the coil 20 may include only the first outer conductor layer 21, may include only the second outer conductor layer 22, may include both the first outer conductor layer 21 and the second outer conductor layer 22, or may not include both the first outer conductor layer 21 and the second outer conductor layer 22.

[0209] When at least one of the first outer conductor layer 21 and the second outer conductor layer 22 does not constitute the coil 20, the outer conductor layer that does not constitute the coil 20 may constitute a dummy coil separate from the coil 20. Furthermore, when at least one of the first outer conductor layer 21 and the second outer conductor layer 22 does not constitute the coil 20, an inner conductor layer (for example, the inner conductor layer 23a) may be electrically connected to an external electrode in a direction along the inner conductor layer. EXAMPLES

[0210] EXAMPLES Hereinafter, examples that specifically disclose the multilayer coil component of the present invention will be described, however, the present invention is not limited to only the following examples.

[0211] [Example 1] A simulation model of the laminated coil component of Example 1 (hereinafter simply referred to as "the laminated coil component of Example 1") had the same configuration as the laminated coil component 1 shown in Figures 1, 2, 3, and 4, except for the arrangement of the gap layer at the first outer interface.

[0212] FIG. 25 is a schematic plan view showing the laminated coil component of Example 1 as seen through from the first main surface side of the element body.

[0213] As shown in FIG. 25, in the multilayer coil component of Example 1, no air gap layer was provided across the entire first outer interface between the first outer conductor layer 21 and the insulating layer 15a.

[0214] In the multilayer coil component of Example 1, the various dimensions and distances shown in FIG. 25 were set as follows. · Dimension P in the length direction L of the multilayer coil component: 2040 μm Distance Q1 between the outermost positions of the first external electrodes 31 in the longitudinal direction L: 450 μm Distance Q2 between the outermost positions of the second external electrodes 32 in the longitudinal direction L: 450 μm Distance R between the outermost positions in the length direction L of the first outer conductor layer 21: 1640 μm Distance S between the outermost positions in the width direction W of the first outer conductor layer 21: 1040 μm Dimension F of the region overlapping with the third portion 21c of the first outer conductor layer 21 at the first outer interface in the direction in which the third portion 21c of the first outer conductor layer 21 extends (here, length direction L): 1140 μm

[0215] In the multilayer coil component of Example 1, the following settings were made. Average thickness of external electrodes (here, average dimension in the length direction L or width direction W): 30 μm Average width of conductor layer (here, average dimension in the length direction L or width direction W): 210 μm Average thickness of the void layer (here, average dimension in the height direction T): 5 μm Average width of the void layer (here, the average dimension in the length direction L or width direction W): 210 μm

[0216] [Example 2] A simulation model of the laminated coil component of Example 2 (hereinafter simply referred to as the "laminated coil component of Example 2") was adopted that had the same configuration as the laminated coil component of Example 1, except for the arrangement of the gap layer at the first outer interface.

[0217] FIG. 26 is a schematic plan view showing the laminated coil component of Example 2 as seen through from the first main surface side of the element body.

[0218] 26 , in the laminated coil component of Example 2, the gap layer 40 is not provided in a part of the region overlapping with the first portion 21a of the first outer conductor layer 21 and a part of the region overlapping with the second portion 21b of the first outer conductor layer 21, of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a. That is, in the laminated coil component of Example 2, the gap layer 40 is provided in a part of the region overlapping with the first portion 21a of the first outer conductor layer 21, a part of the region overlapping with the second portion 21b of the first outer conductor layer 21, and the entire region overlapping with the third portion 21c of the first outer conductor layer 21, of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a.

[0219] [Example 3] A simulation model of the laminated coil component of Example 3 (hereinafter simply referred to as the "laminated coil component of Example 3") was adopted that had the same configuration as the laminated coil component of Example 1, except for the arrangement of the gap layer at the first outer interface.

[0220] FIG. 27 is a schematic plan view showing the laminated coil component of Example 3 as seen through from the first main surface side of the element body.

[0221] 27, in the laminated coil component of Example 3, the gap layer 40 is not provided in the entire region of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a that overlaps with the first portion 21a of the first outer conductor layer 21 and the entire region of the first outer conductor layer 21 that overlaps with the second portion 21b of the first outer conductor layer 21. In other words, in the laminated coil component of Example 3, the gap layer 40 is provided in the entire region of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a that overlaps with the third portion 21c of the first outer conductor layer 21.

[0222] [Example 4] A simulation model of the laminated coil component of Example 4 (hereinafter simply referred to as the "laminated coil component of Example 4") was adopted that had the same configuration as the laminated coil component of Example 1, except for the arrangement of the gap layer at the first outer interface.

[0223] FIG. 28 is a schematic plan view showing the laminated coil component of Example 4 as seen through from the first main surface side of the element body.

[0224] 28, in the laminated coil component of Example 4, the first outer interface between the first outer conductor layer 21 and the insulating layer 15a is set such that the gap layer 40 is not provided in the entire region overlapping with the first portion 21a of the first outer conductor layer 21, the entire region overlapping with the second portion 21b of the first outer conductor layer 21, and a region of the region overlapping with the third portion 21c of the first outer conductor layer 21 that has a length of 20% or more of the dimension in the extending direction of the third portion 21c of the first outer conductor layer 21 from each of the ends on both sides of the first external electrode 31 side and the second external electrode 32 side. That is, in the laminated coil component of Example 4, the gap layer 40 is provided in a part of the region overlapping with the third portion 21c of the first outer conductor layer 21 of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a.

[0225] [Comparative Example 1] A simulation model of the laminated coil component of Comparative Example 1 (hereinafter simply referred to as the "laminated coil component of Comparative Example 1") was adopted that had the same configuration as the laminated coil component of Example 1, except for the arrangement of the gap layer at the first outer interface.

[0226] FIG. 29 is a schematic plan view showing the laminated coil component of Comparative Example 1 as seen through from the first main surface side of the element body.

[0227] As shown in FIG. 29, in the multilayer coil component of Comparative Example 1, a gap layer 40 was provided across the entire first outer interface between the first outer conductor layer 21 and the insulating layer 15a.

[0228] [evaluation] For the laminated coil component of Example 1, the laminated coil component of Example 2, the laminated coil component of Example 3, the laminated coil component of Example 4, and the laminated coil component of Comparative Example 1, a simulation was performed using finite element analysis software "Femtet" manufactured by Murata Software Co., Ltd. At this time, the impact load (corresponding to the impact load D in FIG. 2) applied to the laminated coil component in the lamination direction (here, the height direction T) when mounting the laminated coil component was set to 53 N.

[0229] The simulation results of the tensile stress for each example of the laminated coil component are shown in Table 1. Note that Table 1 also shows the dimension of the gap layer 40 in the length direction L (referred to as "gap layer dimension" in Table 1) for each example of the laminated coil component.

[0230] [Table 1]

[0231] As shown in Table 1, the laminated coil component of Example 1, the laminated coil component of Example 2, the laminated coil component of Example 3, and the laminated coil component of Example 4 had lower tensile stresses generated in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21 than the laminated coil component of Comparative Example 1. Therefore, it is considered that the laminated coil component of Example 1, the laminated coil component of Example 2, the laminated coil component of Example 3, and the laminated coil component of Example 4 suppress the occurrence of cracks in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21 when the laminated coil component is mounted, compared to the laminated coil component of Comparative Example 1.

[0232] Furthermore, as shown in Table 1, as the dimension of the gap layer 40 in the longitudinal direction L decreases in the order of the laminated coil component of Example 2, the laminated coil component of Example 3, the laminated coil component of Example 4, and the laminated coil component of Example 1, the tensile stress generated in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21 decreases. From this, it was confirmed that, from the viewpoint of reducing the tensile stress generated in the insulating layer 15a around the first portion 21a and the second portion 21b of the first outer conductor layer 21, it is preferable that the void layer 40 is not provided in the entire region of the first outer interface between the first outer conductor layer 21 and the insulating layer 15a that overlaps with the first portion 21a of the first outer conductor layer 21 and the entire region that overlaps with the second portion 21b of the first outer conductor layer 21, as in the laminated coil component of Example 3 and the laminated coil component of Example 4, and it is more preferable that the void layer 40 is not provided in the entire first outer interface between the first outer conductor layer 21 and the insulating layer 15a, as in the laminated coil component of Example 1.

[0233] The present specification discloses the following:

[0234] <1> An element body formed by laminating a plurality of insulating layers in a lamination direction; a plurality of conductor layers provided inside the element body and stacked together with the plurality of insulating layers in the stacking direction; a plurality of external electrodes provided on a surface of the element body; the element body has a first main surface and a second main surface opposed to each other in the stacking direction, At least some of the conductor layers are electrically connected to each other to form a coil electrically connected to the external electrodes; the plurality of conductor layers include a first outer conductor layer located at the outermost position on the first main surface side of the element body in the stacking direction, a second outer conductor layer located at the outermost position on the second main surface side of the element body in the stacking direction, and at least one inner conductor layer located between the first outer conductor layer and the second outer conductor layer in the stacking direction, the plurality of external electrodes include a first external electrode provided at least on the first main surface of the element body, and a second external electrode provided at least on the first main surface of the element body so as to be spaced apart from the first external electrode and not electrically connected to the first outer conductor layer in a direction along the first outer conductor layer, each of the inner conductor layers forms a first inner interface with an adjacent insulating layer on the first main surface side of the element body in the stacking direction, and forms a second inner interface with an adjacent insulating layer on the second main surface side of the element body in the stacking direction; the first outer conductor layer forms a first outer interface between itself and the adjacent insulating layer on the first main surface side of the element body in the stacking direction, and forms a second outer interface between itself and the adjacent insulating layer on the second main surface side of the element body in the stacking direction; the first outer conductor layer has a first portion overlapping a portion of the second outer electrode provided on the first main surface of the element body when viewed in the stacking direction, A gap layer is provided in at least one interface among all of the first inner interfaces and the second inner interfaces, a laminated coil component, characterized in that, when viewing at least one cross section of the first portion of the first outer conductor layer along the stacking direction and a direction perpendicular to the direction in which the first portion of the first outer conductor layer extends when viewed from the stacking direction, the gap layer is not provided at either the first outer interface or the second outer interface.

[0235] <2> the first external electrode is electrically connected to the first outer conductor layer in a direction along the first outer conductor layer; <1> The laminated coil component according to claim 1.

[0236] <3> the first external electrode is not electrically connected to the second outer conductor layer in a direction along the second outer conductor layer; <1> or <2> The laminated coil component according to claim 1.

[0237] <4> the second external electrode is electrically connected to the second outer conductor layer in a direction along the second outer conductor layer; <1> ~ <3> 2. The multilayer coil component according to claim 1 ,

[0238] <5> the first main surface of the element body is a mounting surface that faces an object to be mounted when the multilayer coil component is mounted; <1> ~ <4> 2. The multilayer coil component according to claim 1 ,

[0239] <6> In both the first outer interface and the second outer interface, the gap layer is not provided in the entire region overlapping the first portion of the first outer conductor layer when viewed from the stacking direction. <1> ~ <5> 2. The multilayer coil component according to claim 1 ,

[0240] <7> the first outer conductor layer further has a second portion overlapping a portion of the first outer electrode provided on the first main surface of the element body when viewed from the stacking direction, In both the first outer interface and the second outer interface, the gap layer is not provided in at least a part of an area overlapping the second portion of the first outer conductor layer when viewed from the stacking direction. <1> ~ <6> 2. The multilayer coil component according to claim 1 ,

[0241] <8> In both the first outer interface and the second outer interface, the gap layer is not provided in the entire region overlapping the second portion of the first outer conductor layer when viewed from the stacking direction. <7> The laminated coil component according to claim 1.

[0242] <9> the first outer conductor layer has a first portion overlapping a portion of the second external electrode provided on the first main surface of the element body when viewed in the stacking direction, a second portion overlapping a portion of the first external electrode provided on the first main surface of the element body when viewed in the stacking direction, and a third portion other than the first portion and the second portion, At both the first outer interface and the second outer interface, the gap layer is not provided in the entire region overlapping the first portion of the first outer conductor layer when viewed from the stacking direction, the entire region overlapping the second portion of the first outer conductor layer when viewed from the stacking direction, and a region of the region overlapping the third portion of the first outer conductor layer when viewed from the stacking direction, the region extending from each of the ends on both sides of the first external electrode side and the second external electrode side, the length of which is 20% or more of the dimension in the direction in which the third portion of the first outer conductor layer extends. <1> ~ <8> 2. The multilayer coil component according to claim 1 ,

[0243] <10> The void layer is not provided over both the first outer interface and the second outer interface. <1> ~ <9> 2. The multilayer coil component according to claim 1 ,

[0244] <11> an area ratio of the air gap layer to the first outer conductor layer at both the first outer interface and the second outer interface is lower than an area ratio of the air gap layer to the inner conductor layer at at least one of all of the first inner interfaces and the second inner interfaces; <1> ~ <10> 2. The multilayer coil component according to claim 1 ,

[0245] <12> the first external electrode and the second external electrode are each provided on the second main surface of the element body in addition to the first main surface of the element body; <1> ~ <11> 2. The multilayer coil component according to claim 1 ,

[0246] <13> the second outer conductor layer forms a third outer interface between itself and the adjacent insulating layer on the first main surface side of the element body in the stacking direction, and forms a fourth outer interface between itself and the adjacent insulating layer on the second main surface side of the element body in the stacking direction; the second outer conductor layer has a first portion overlapping a portion of the first outer electrode provided on the second principal surface of the element body when viewed in the stacking direction, In both the third outer interface and the fourth outer interface, the gap layer is not provided in at least a part of an area overlapping the first portion of the second outer conductor layer when viewed from the stacking direction. <12> The laminated coil component according to claim 1.

[0247] <14> In both the third outer interface and the fourth outer interface, the gap layer is not provided in the entire region overlapping the first portion of the second outer conductor layer when viewed from the stacking direction. <13> The laminated coil component according to claim 1.

[0248] <15> the second outer conductor layer further has a second portion overlapping a portion of the second outer electrode provided on the second main surface of the element body when viewed from the stacking direction, In both the third outer interface and the fourth outer interface, the gap layer is not provided in at least a part of an area overlapping the second portion of the second outer conductor layer when viewed from the stacking direction. <13> or <14> The laminated coil component according to claim 1.

[0249] <16> the gap layer is not provided in the entire region overlapping the second portion of the second outer conductor layer when viewed from the stacking direction in both the third outer interface and the fourth outer interface; <15> The laminated coil component according to claim 1.

[0250] <17> the second outer conductor layer has: a first portion overlapping a portion of the first external electrode provided on the second main surface of the element body when viewed in the stacking direction; a second portion overlapping a portion of the second external electrode provided on the second main surface of the element body when viewed in the stacking direction; and a third portion other than the first portion and the second portion, At both the third outer interface and the fourth outer interface, the gap layer is not provided in the entire region overlapping the first portion of the second outer conductor layer when viewed from the stacking direction, the entire region overlapping the second portion of the second outer conductor layer when viewed from the stacking direction, and a region of the region overlapping the third portion of the second outer conductor layer when viewed from the stacking direction, the region extending from each of the ends on both sides of the first external electrode side and the second external electrode side, the length of which is 20% or more of the dimension in the direction in which the third portion of the second outer conductor layer extends. <13> ~ <16> 2. The multilayer coil component according to claim 1 ,

[0251] <18> The void layer is not provided over both the third outer interface and the fourth outer interface. <13> ~ <17> 2. The multilayer coil component according to claim 1 ,

[0252] <19> an area ratio of the air gap layer to the second outer conductor layer at both the third outer interface and the fourth outer interface is lower than an area ratio of the air gap layer to the inner conductor layer at at least one of all of the first inner interfaces and the second inner interfaces; <13> ~ <18> 2. The multilayer coil component according to claim 1 ,

[0253] <20> In all of the first inner interface and the second inner interface, the void layer is provided on at least a portion of each interface. <1> ~ <19> 2. The multilayer coil component according to claim 1 ,

[0254] <21> The void layer is provided over at least one of the first inner interface and the second inner interface. <20> The laminated coil component according to claim 1.

[0255] <22> The void layer is provided over the entirety of one of the first inner interface and the second inner interface. <21> The laminated coil component according to claim 1.

[0256] <23> The void layer is provided over both the first inner interface and the second inner interface. <21> The laminated coil component according to claim 1. [Explanation of symbols]

[0257] 1. Multilayer coil components 10 Base 11a: first end surface of element 11b: second end surface of element 12a: First principal surface of the body 12b Second main surface of the body 13a First side of the body 13b Second side of the body 15a, 15b, 15c, 15d, 15e, 15f, 15g, 15h, 15i Insulating layer 20 Coil 21 First outer conductor layer 21a: first portion of first outer conductor layer 21b: second portion of the first outer conductor layer 21c third portion of the first outer conductor layer 22 Second outer conductor layer 23a, 23b Inner conductor layer 24a, 24b Connecting conductor 25a First lead conductor 25b Second lead conductor 31 1st external electrode 32 2nd external electrode 40 void layer 115a, 115b, 115cb, 115d, 115eb, 115f, 115gb, 115h, 115i magnetic ferrite paste layer 115ca, 115ea, 115ga Non-magnetic ferrite paste layer 121, 122, 123a, 123b, 124a, 124b, 125a, 125b Conductive paste layer 140 Resin paste layer C Coil shaft D. Impact load E1: an end portion of the region of the first outer interface that overlaps with the third portion of the first outer conductor layer on the first outer electrode side E2: An end portion of the region of the first outer interface that overlaps with the third portion of the first outer conductor layer on the second outer electrode side F: A dimension of a region of the first outer interface overlapping the third portion of the first outer conductor layer in a direction in which the third portion of the first outer conductor layer extends. L Length direction P is the lengthwise dimension of the multilayer coil component Q1 Distance between the outermost positions of the first external electrodes in the longitudinal direction Q2 Distance between the outermost positions of the second external electrodes in the longitudinal direction R is the distance between the outermost positions in the longitudinal direction of the first outer conductor layer S: Distance between the outermost positions in the width direction of the first outer conductor layer T Height direction W Width direction

Claims

1. An element body formed by laminating a plurality of insulating layers in a lamination direction; a plurality of conductor layers provided inside the element body and stacked in the stacking direction together with the plurality of insulating layers; a plurality of external electrodes provided on a surface of the element body; the element body has a first main surface and a second main surface opposed to each other in the stacking direction, At least some of the conductor layers are electrically connected to each other to form a coil electrically connected to the external electrodes; the plurality of conductor layers include a first outer conductor layer located at an outermost position on the first main surface side of the element body in the stacking direction, a second outer conductor layer located at an outermost position on the second main surface side of the element body in the stacking direction, and at least one inner conductor layer located between the first outer conductor layer and the second outer conductor layer in the stacking direction, the plurality of external electrodes include a first external electrode provided at least on the first main surface of the element body, and a second external electrode provided at least on the first main surface of the element body so as to be spaced apart from the first external electrode and not electrically connected to the first outer conductor layer in a direction along the first outer conductor layer, each of the inner conductor layers forms a first inner interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction, and forms a second inner interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction; the first outer conductor layer forms a first outer interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction, and forms a second outer interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction; the first outer conductor layer has a first portion overlapping a portion of the second outer electrode provided on the first main surface of the element body when viewed in the stacking direction, A gap layer is provided in at least one interface among all of the first inner interfaces and the second inner interfaces, a first outer interface and a second outer interface of the first outer conductor layer, the first outer interface being parallel to the first stacking direction and a second outer interface being perpendicular to the first stacking direction, the first outer conductor layer being parallel to the first stacking direction and a second outer interface being perpendicular to the first stacking direction.

2. The multilayer coil component according to claim 1 , wherein the first external electrode is electrically connected to the first outer conductor layer in a direction along the first outer conductor layer.

3. 2 . The multilayer coil component according to claim 1 , wherein the first external electrode is not electrically connected to the second outer conductor layer in a direction along the second outer conductor layer.

4. The multilayer coil component according to claim 1 , wherein the second external electrode is electrically connected to the second outer conductor layer in a direction along the second outer conductor layer.

5. 2. The laminated coil component according to claim 1, wherein the first main surface of the element body is a mounting surface that faces an object to be mounted when the laminated coil component is mounted.

6. 2. The multilayer coil component according to claim 1, wherein at both the first outer interface and the second outer interface, the gap layer is not provided over an entire region overlapping the first portion of the first outer conductor layer when viewed from the stacking direction.

7. the first outer conductor layer further has a second portion overlapping a portion of the first external electrode provided on the first main surface of the element body when viewed from the stacking direction, 2. The multilayer coil component according to claim 1, wherein the gap layer is not provided in at least a part of an area overlapping the second portion of the first outer conductor layer when viewed from the stacking direction, at both the first outer interface and the second outer interface.

8. 8. The multilayer coil component according to claim 7, wherein at both the first outer interface and the second outer interface, the gap layer is not provided over an entire region overlapping the second portion of the first outer conductor layer when viewed from the stacking direction.

9. the first outer conductor layer has: a first portion overlapping a portion of the second external electrode provided on the first main surface of the element body when viewed in the stacking direction; a second portion overlapping a portion of the first external electrode provided on the first main surface of the element body when viewed in the stacking direction; and a third portion other than the first portion and the second portion, 2. The multilayer coil component according to claim 1, wherein at both the first outer interface and the second outer interface, the gap layer is not provided in an entire region overlapping the first portion of the first outer conductor layer when viewed from the stacking direction, an entire region overlapping the second portion of the first outer conductor layer when viewed from the stacking direction, and a region over a length of 20% or more of a dimension in an extension direction of the third portion of the first outer conductor layer from each of ends on both sides of the first external electrode side and the second external electrode side of the region overlapping the third portion of the first outer conductor layer when viewed from the stacking direction.

10. The multilayer coil component according to claim 1 , wherein the gap layer is not provided entirely on either the first outer interface or the second outer interface.

11. 2. The multilayer coil component according to claim 1, wherein an area ratio of the air gap layer to the first outer conductor layer at both the first outer interface and the second outer interface is lower than an area ratio of the air gap layer to the inner conductor layer at at least one interface among all of the first inner interfaces and the second inner interfaces.

12. 2. The multilayer coil component according to claim 1, wherein the first external electrode and the second external electrode are each provided on the second main surface of the element body in addition to the first main surface of the element body.

13. the second outer conductor layer forms a third outer interface between adjacent insulating layers on the first main surface side of the element body in the stacking direction, and forms a fourth outer interface between adjacent insulating layers on the second main surface side of the element body in the stacking direction, the second outer conductor layer has a first portion overlapping a portion of the first outer electrode provided on the second main surface of the element body when viewed in the stacking direction, 13. The multilayer coil component according to claim 12, wherein at both the third outer interface and the fourth outer interface, the gap layer is not provided in at least a part of a region overlapping the first portion of the second outer conductor layer when viewed from the stacking direction.

14. 14. The multilayer coil component according to claim 13, wherein at both the third outer interface and the fourth outer interface, the gap layer is not provided in an entire region overlapping the first portion of the second outer conductor layer when viewed from the stacking direction.

15. the second outer conductor layer further has a second portion overlapping a portion of the second external electrode provided on the second main surface of the element body when viewed from the stacking direction, 14. The multilayer coil component according to claim 13, wherein at both the third outer interface and the fourth outer interface, the gap layer is not provided in at least a part of a region overlapping the second portion of the second outer conductor layer when viewed from the stacking direction.

16. 16. The multilayer coil component according to claim 15, wherein at both the third outer interface and the fourth outer interface, the gap layer is not provided over an entire region overlapping the second portion of the second outer conductor layer when viewed from the stacking direction.

17. the second outer conductor layer has: the first portion overlapping a portion of the first external electrode provided on the second main surface of the element body when viewed in the stacking direction; a second portion overlapping a portion of the second external electrode provided on the second main surface of the element body when viewed in the stacking direction; and a third portion other than the first portion and the second portion, 14. The stacked coil component according to claim 13, wherein at both the third outer interface and the fourth outer interface, the gap layer is not provided in an entire region overlapping the first portion of the second outer conductor layer when viewed from the stacking direction, an entire region overlapping the second portion of the second outer conductor layer when viewed from the stacking direction, and a region of the region overlapping the third portion of the second outer conductor layer when viewed from the stacking direction, the region extending from each of both ends on the first external electrode side and the second external electrode side, the length of which is 20% or more of a dimension in an extension direction of the third portion of the second outer conductor layer.

18. The multilayer coil component according to claim 13 , wherein the gap layer is not provided entirely on either the third outer interface or the fourth outer interface.

19. 14. The multilayer coil component according to claim 13, wherein an area ratio of the air gap layer to the second outer conductor layer at both the third outer interface and the fourth outer interface is lower than an area ratio of the air gap layer to the inner conductor layer at at least one interface among all of the first inner interfaces and the second inner interfaces.

20. The multilayer coil component according to any one of claims 1 to 19, wherein the void layer is provided in at least a part of each of the first inner interfaces and the second inner interfaces.

21. The multilayer coil component according to claim 20 , wherein the gap layer is provided over the entirety of at least one of the first inner interface and the second inner interface.

22. The multilayer coil component according to claim 21 , wherein the gap layer is provided over the entirety of one of the first inner interface and the second inner interface.

23. The multilayer coil component according to claim 21 , wherein the air gap layer is provided over the entirety of both the first inner interface and the second inner interface.

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