RFID Inlay

Abstract

To increase bonding strength between an IC chip and an antenna pattern when an anisotropic conductive material is used.SOLUTION: An RFID inlay includes a substrate, an antenna pattern, and an IC chip. The antenna pattern includes a first slit formed between a pair of contact points with the IC chip, and a second slit formed to intersect with the first slit along an arrangement direction of the pair of contact points. The IC chip is connected to the antenna pattern with an anisotropic conductive material filled at a position including an intersection part of the first slit and the second slit and arranged on a surface of the antenna pattern including the pair of contact points.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an RFID inlay. [Background technology]

[0002] In recent years, in fields such as product manufacturing, management, and distribution, RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which sends and receives information via contactless communication from an IC chip that has product-related information and identification information written on it, have become widespread (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-194743 A Summary of the Invention [Problem to be solved by the invention]

[0004] For the RFID medium to function normally, it is required that the antenna pattern and the IC chip connected to the antenna pattern can maintain electrical and mechanical connections under the conditions of use in the product.

[0005] Some RFID media incorporate an RFID inlay, which is made by connecting an antenna pattern formed on a substrate and an IC chip using an anisotropic conductive material such as an anisotropic conductive paste or an anisotropic conductive film.

[0006] However, connections using anisotropic conductive materials may be inferior in durability to the effects of temperature changes, deformation, and the like, compared to conventional connection methods using solder.

[0007] For this reason, the connection method using anisotropic conductive materials has room for improvement in terms of adhesive strength between the IC chip and the antenna pattern.

[0008] Therefore, an object of the present invention is to increase the adhesive strength between an IC chip and an antenna pattern when an anisotropic conductive material is used. [Means for solving the problem]

[0009] According to one aspect of the present invention, a substrate and a film formed on the substrate A continuous metal foil An RFID inlay is provided, which has an antenna pattern and an IC chip connected to the antenna pattern, wherein the antenna pattern has a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts, and a second slit formed along the direction in which the pair of contacts are arranged, intersecting the first slit, and partially formed along the direction in which the pair of contacts are arranged without separating the antenna pattern, and the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled at a position including the intersection of the first slit and the second slit and is arranged on a surface of the antenna pattern including the pair of contacts. Effect of the Invention

[0010] According to the present invention, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled in the intersection between the first slit and the second slit formed to cross the first slit and that is arranged on the surface of the antenna pattern including a pair of contacts. As a result, the IC chip is bonded to the substrate and the antenna pattern by the anisotropic conductive material filled in the first slit and the second slit, while maintaining adhesive strength in two axial directions, that is, the extension direction of the first slit and the extension direction of the second slit crossing the first slit, and the IC chip can be stably bonded to the antenna pattern. Therefore, the adhesive strength between the IC chip and the antenna pattern can be increased. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a plan view illustrating an RFID inlay according to the present embodiment. [Diagram 2] 2 is an enlarged view for explaining a main part S in FIG. 1. [Figure 3A] 1 is a plan view illustrating the state in which an anisotropic conductive material is placed on an antenna pattern in the process of manufacturing an RFID inlay. [Figure 3B] 1 is a plan view illustrating a state in which an IC chip is bonded to an antenna pattern in a process for manufacturing an RFID inlay. [Figure 4] FIG. 11 is a plan view illustrating a first modified example of the embodiment. [Diagram 5] FIG. 11 is a plan view illustrating a second modified example of the embodiment. [Figure 6] FIG. 11 is a plan view illustrating a third modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [RFID inlay] An RFID inlay 1 according to an embodiment of the present invention will be described below. Fig. 1 is a plan view illustrating an RFID inlay 1 according to the present embodiment.

[0013] As shown in FIG. 1, an RFID inlay 1 includes a substrate 2 , an antenna pattern 3 formed on the substrate 2 by using a metal foil, and an IC chip 4 connected to the antenna pattern 3 .

[0014] <Base material> In this embodiment, the base material 2 may be, for example, a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film formed by laminating a plurality of such resin films.

[0015] In this embodiment, as the substrate 2, in addition to the above-mentioned resin film substrate, a paper substrate such as fine paper, medium quality paper, or coated paper formed using these may be used.

[0016] When mounting an IC chip 4 on the antenna pattern 3 formed on the substrate 2 using an anisotropic conductive material, it is preferable to use a paper substrate, since this increases the adhesive strength between the IC chip 4 and the substrate 2.

[0017] The thickness of the substrate 2 can be appropriately selected within the above range depending on the design and use of the RFID medium as a product produced using the RFID inlay 1.

[0018] <Antenna pattern> 1, the antenna pattern 3 includes a loop portion 31, an IC chip connection portion 32 on which an IC chip 4 is mounted, meanders 33 and 34 extending symmetrically from the loop portion 31, and capacitor hats 35 and 36 connected to ends of the meanders 33 and 34. In other words, the antenna pattern 3 configures a dipole antenna.

[0019] In this embodiment, the antenna pattern 3 is designed, for example, to have an antenna length and an antenna line width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

[0020] In this embodiment, the antenna pattern 3 is adhered to the base material 2 by an adhesive such as an acrylic adhesive, a urethane adhesive, a silicone adhesive, or a rubber adhesive, although not shown.

[0021] The antenna pattern 3 is made of a metal foil. Examples of metals that can be used for the antenna pattern 3 include copper and aluminum. From the viewpoint of reducing manufacturing costs, it is preferable to use aluminum foil.

[0022] From the viewpoints of the overall thickness of the RFID inlay 1, the overall thickness of the RFID medium when molded into an RFID medium, and manufacturing costs, the thickness of the metal foil is preferably 3 μm or more and 25 μm or less. In this embodiment, as an example, an aluminum foil having a thickness of 20 μm is used.

[0023] <ICチップ> In the RFID inlay 1, the IC chip 4 is a semiconductor package designed to be compatible with the UHF band and to be capable of communicating with a reader (not shown) that is a reading device for the IC chip 4.

[0024] The IC chip 4 is electrically and mechanically connected to an IC chip connection portion 32 formed in a part of the loop portion 31 of the antenna pattern 3 by an anisotropic conductive material E (shown in FIG. 3), such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0025] The anisotropic conductive material E is a mixture of conductive filler of a specified particle size in a binder resin, which is an adhesive component, and can electrically and mechanically connect the antenna pattern 3 and the IC chip 4 by processes such as thermocompression bonding or ultraviolet curing.

[0026] [Configuration of IC chip connection part in antenna pattern] Next, a description will be given of the IC chip connection portion 32 in the antenna pattern 3. Fig. 2 is an enlarged view showing a main portion S (see Fig. 1) including the IC chip connection portion 32 in the antenna pattern 3.

[0027] The IC chip connection portion 32 is formed with a pair of contacts (hereinafter referred to as bump contacts) 101, 102 for electrical connection with bumps (not shown) formed on the IC chip 4.

[0028] The IC chip connection portion 32 has a first slit 103 and a second slit 104. The first slit 103 is formed along the space between the pair of bump contacts 101, 102 (Y direction shown in FIG. 1). The second slit 104 is formed so as to intersect with the first slit 103 along the direction in which the bump contacts 101, 102 are arranged (X direction shown in FIG. 1).

[0029] Hereinafter, four corners formed in the antenna pattern 3 at the intersection C between the first slit 103 and the second slit 104 will be referred to as corners P1, P2, P3, and P4.

[0030] 2, an area SE where the anisotropic conductive material E is disposed is indicated by a dashed line, and an area SC where the IC chip 4 is disposed is indicated by a dashed double-dashed line.

[0031] 3A and 3B are schematic diagrams illustrating a process of bonding an IC chip 4 to an antenna pattern 3 in an RFID inlay 1 according to this embodiment. As shown in Fig. 3A, an anisotropic conductive material E is filled in a position including an intersection C of the first slit 103 and the second slit 104, and is disposed on the surface of the antenna pattern 3 (IC chip connection portion 32) including the bump contacts 101 and 102.

[0032] 3(b), the IC chip 4 is disposed in a position supported by corners P1, P2, P3, and P4 of the antenna pattern 3. The IC chip 4 is electrically and mechanically connected to the antenna pattern 3 and the substrate 2 by anisotropic conductive material E that is filled in an intersection C of the first slit 103 and the second slit and that is disposed on the surface of the antenna pattern 3 including the bump contacts 101 and 102.

[0033] As a result, the IC chip 4 is bonded to the antenna pattern 3 and the base material 2 in two axial directions, the X direction and the Y direction, of the base material 2 by the anisotropic conductive material E that has been filled in the intersection portion C and solidified.

[0034] 2, at the intersection C, curved portions R are formed at corners P3 and P4 of the IC chip connection portion 32 on the side facing the bump contacts 101, 102 across the second slit 104. The formation of the curved portions R at the corners P3, P4 increases the area of ​​the intersection C. This makes it possible to expand the area of ​​the intersection C that is filled with the anisotropic conductive material E.

[0035] Furthermore, in this embodiment, particularly when the base material 2 is a paper base material, the binder resin of the anisotropic conductive material E can permeate into the paper base material, which makes the adhesion between the IC chip 4 and the base material 2 stronger.

[0036] The RFID inlay 1 having the above configuration can be further processed, such as by laminating another substrate on the front or back surface or forming an adhesive layer, to form an RFID medium such as a label, tag, wristband, ticket, or card.

[0037] <Effects> According to the RFID inlay 1 of this embodiment, the IC chip connection portion 32 has a first slit 103 formed between a pair of bump contacts 101, 102 (Y direction), and a second slit 104 formed intersecting the first slit 103 along the direction in which the bump contacts 101, 102 are arranged (X direction).

[0038] The IC chip 4 is supported by corners P1, P2, P3 and P4 of the antenna pattern 3, and is electrically and mechanically connected to the antenna pattern 3 and the substrate 2 by anisotropic conductive material E arranged on the surface of the antenna pattern 3 (IC chip connection portion 32) including the intersection C of the first slit 103 and the second slit 104 and the bump contacts 101, 102.

[0039] In this embodiment, the IC chip 4 is supported by corners P1, P2, P3 and P4 of the antenna pattern 3, and therefore can be connected to the antenna pattern 3 stably while maintaining its horizontality with respect to the antenna pattern 3.

[0040] In addition, since a first slit 103 and a second slit 104 are formed in the IC chip connection portion 32, the IC chip 4 is adhered to the antenna pattern 3 and the substrate 2 by the anisotropic conductive material E in two axial directions, that is, the X direction and the Y direction, of the substrate 2.

[0041] This makes it possible to support the IC chip 4 and the substrate 2 by adhesive forces acting in two axial directions, the X direction and the Y direction, compared to the conventional method in which the IC chip 4 was connected to the antenna pattern 3 by relying on the adhesive force of the anisotropic conductive material E placed in the first slit formed between the bumps.

[0042] Therefore, it is possible to improve durability against deformation caused by contraction of the antenna pattern 3 due to temperature changes and against bending of the RFID inlay 1 in the X and Y directions.

[0043] Furthermore, at the intersection C, curved portions R are formed at corners P3 and P4 of the IC chip connection portion 32. This allows the area filled with the anisotropic conductive material E to be expanded at the intersection C. This allows the adhesion area between the anisotropic conductive material E and the substrate 2 to be increased, and the adhesive strength between the IC chip 4 and the substrate 2 to be increased.

[0044] 2, the corners P1 and P2 may also have curved portions R. In this case, the area filled with the anisotropic conductive material E at the intersection C can be expanded in the same way as when the corners P3 and P4 have curved portions R.

[0045] In the RFID inlay 1, curved portions R are formed at least at the corners P3 and P4 of the IC chip connection portion 32, so that the adhesive strength between the IC chip 4 and the substrate 2 can be increased.

[0046] In this embodiment, when the base material 2 is a paper base material, the binder resin of the anisotropic conductive material E can be permeated into the paper base material. Therefore, the IC chip 4 is firmly bonded to the base material 2 (paper base material) by the anisotropic conductive material E permeated into the base material 2 (paper base material). Therefore, the mechanical connection between the IC chip 4 and the antenna pattern 3 can be improved.

[0047] [Modification of IC chip connection part] <First Modification> Fig. 4 is a plan view illustrating a first modified example of the present embodiment. Fig. 4 shows an enlarged view of a main part of IC chip connection part 321 shown as the first modified example. In the first modified example, the same reference numerals are used to designate components having the same effects as those in the above-described embodiment, and detailed descriptions thereof will be omitted.

[0048] In IC chip connection portion 321, width W11 of first slit 103 on the side facing bump contacts 101, 102 across second slit 104 is formed to be wider than width W12 of first slit 103 on the bump contacts 101, 102 side.

[0049] However, the width W11 of the first slit 103 is set to a width that leaves an area capable of stably supporting the IC chip 4 at the corners P3 and P4.

[0050] With the above configuration, in the first modified example, the horizontality with respect to the antenna pattern 3 can be maintained, and the IC chip 4 can be stably connected to the antenna pattern 3.

[0051] In addition, since the distance between the corners P3 and P4 of the IC chip connection portion 321 in the X direction is increased, it is possible to expand the area filled with the anisotropic conductive material E at the intersection portion C. Therefore, it is possible to increase the adhesion area between the anisotropic conductive material E and the substrate 2, and to increase the adhesive strength between the IC chip 4 and the substrate 2.

[0052] In particular, when the base material 2 is a paper base material, the area over which the binder resin of the anisotropic conductive material E can infiltrate into the paper base material is increased, thereby further increasing the adhesive strength between the IC chip 4 and the base material 2 (paper base material).

[0053] <Second Modification> Fig. 5 is a plan view illustrating a second modified example of the present embodiment. Fig. 5 shows an enlarged view of a main part of IC chip connection part 322 shown as the second modified example. In the second modified example, the same reference numerals are used for components having the same effects as those in the above-mentioned embodiment, and detailed description thereof will be omitted.

[0054] In IC chip connection portion 322, width W2 of second slit 104 is formed wider than width W1 of first slit 103.

[0055] However, the width W2 of the second slit 104 is set to a width that leaves an area capable of stably supporting the IC chip 4 at the corners P1 and P3, and at the corners P2 and P4.

[0056] With the above configuration, in the second modified example, the horizontality with respect to the antenna pattern 3 can be maintained, and the IC chip 4 can be stably connected to the antenna pattern 3.

[0057] In the second modified example, the distance in the Y direction between the corners P1 and P3 and between the corners P2 and P4 of the IC chip connection portion 32 is increased, so that the area filled with the anisotropic conductive material E can be expanded at the intersection C. Therefore, the adhesion area between the anisotropic conductive material E and the substrate 2 can be increased, and the adhesive strength between the IC chip 4 and the substrate 2 can be increased.

[0058] In particular, when the base material 2 is a paper base material, the area over which the binder resin of the anisotropic conductive material E can infiltrate into the paper base material is increased, thereby further increasing the adhesive strength between the IC chip 4 and the base material 2 (paper base material).

[0059] <Third Modification> Fig. 6 is a plan view illustrating a third modified example of the present embodiment. Fig. 6 shows an enlarged view of a main part of IC chip connection part 323 shown as the third modified example. In the third modified example, the same reference numerals are used for components having the same effects as those in the above-mentioned embodiment, and detailed description thereof will be omitted.

[0060] In the IC chip connection portion 323, the intersection C is expanded at the corners P1 and P2 to a position that leaves at least an area capable of forming the bump contacts 101 and 102. In other words, the corners P1 and P2 are curved and reduced to the vicinity of the bump contacts 101 and 102.

[0061] Moreover, the corners P3 and P4 are reduced, and instead the intersection C is expanded to a position where the support regions Q1 and Q2 capable of supporting the corners of the IC chip 4 are left.

[0062] With the above configuration, in the third modified example, the horizontality of the IC chip 4 relative to the antenna pattern 3 is maintained at the corners P1, P2 and the support regions Q1, Q2, while the adhesive area between the anisotropic conductive material E and the base material 2 is maximized, so that the IC chip 4 can be stably connected to the antenna pattern 3. This makes it possible to increase the adhesive strength between the IC chip 4 and the base material 2.

[0063] In particular, when the base material 2 is a paper base material, the area over which the binder resin of the anisotropic conductive material E can infiltrate into the paper base material is increased, thereby further increasing the adhesive strength between the IC chip 4 and the base material 2 (paper base material).

[0064] [Other embodiments] Although the embodiments of the present invention have been described above, the above-mentioned embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above-mentioned embodiments.

[0065] In this embodiment, the case has been described where the antenna pattern 3 is a dipole antenna for a UHF band inlet, but it may also be a coil antenna for an HF band.

[0066] 4 and 5, the corners P1 and P2 may also have curved portions R. In this case, the area filled with the anisotropic conductive material E can be expanded at the intersection C, as in the case where the curved portions R are formed at the corners P3 and P4. Therefore, the adhesion area between the anisotropic conductive material E and the substrate 2 can be increased, and the adhesion strength between the IC chip 4 and the substrate 2 can be increased.

[0067] As the anisotropic conductive material E, an anisotropic conductive film can be used in addition to an anisotropic conductive adhesive. The anisotropic conductive film is a resin sheet to which the filler and binder described above are fixed, and is used by thermocompression bonding. The anisotropic conductive material E may be a thermosetting type or an ultraviolet-curing type. EXAMPLES

[0068] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0069] [Evaluation of IC chip adhesive strength] RFID inlays were prepared as specimens for the examples and comparative examples, and the adhesive strength of the IC chip to the antenna pattern was evaluated by a DieShear test.

[0070] The DieShear test is as follows.

[0071] A specimen was created based on the RFID inlay 1 described using Fig. 1, and a specified jig (peeling claw) was pressed against the side of the IC chip 4 of the RFID inlay 1 as the specimen, a load was applied in a direction along the plane of the base material 2, and the applied load was measured when the IC chip 4 was peeled off from the antenna pattern 3. Note that, on the plane of the base material 2, measurements were taken in both the X direction and the Y direction as the load direction.

[0072] <Example 1> Substrate: Paper (thickness 80μm) Antenna: Aluminum foil (thickness 20μm) Line width: 30μm~40μm, Line depth: 1μm~2μm Line spacing: 50μm~60μm ·Anisotropic conductive material: UV-curable anisotropic conductive adhesive IC chip type: IMPINJ MONZA R6 Curing conditions for anisotropic conductive material: Temperature (room temperature 25°C), UV irradiation (3000mJ / cm 2 ~5000mJ / cm 2 ), irradiation time (3 seconds), pressure (1.0N) Antenna pattern First slit width: 0.2 mm Second slit width: 0.2 mm

[0073] <Comparative Example 1> The specimen of Comparative Example 1 was produced under the same conditions as those of Example 1, except that an antenna pattern in which the second slit 104 was not formed was used.

[0074] <Evaluation Results> The adhesive strength between the antenna pattern 3 and the IC chip 4 mounted on the antenna pattern 3 was evaluated by a DieShear test. The applied load when the IC chip 4 peeled off from the antenna pattern 3 is expressed as the average value of the results of five tests performed under the same conditions for each specimen. The results are shown in Table 1.

[0075] [Table 1]

[0076] As shown in Table 1, comparing Comparative Example 1 with Example 1, it was found that in Example 1 in which a second slit was formed, the difference in endurance load in the direction in which the load was applied was smaller than that of the RFID inlay of the Comparative Example which was bonded under the same conditions using the same anisotropic conductive adhesive.

[0077] It was also found that the RFID inlay 1 of Example 1 had an increased applied load of 11.3% in the Y direction and 21.9% in the X direction when the IC chip 4 was peeled off from the antenna pattern 3, compared to the RFID inlay of the comparative example. [Explanation of symbols]

[0078] 1 RFID inlay 2 Base material 3 Antenna Pattern 4. IC chip 31 Loop section 32 IC chip connection part 33,34 Meander 35,36 Capacitor Hat 101,102 Bump contact 103 First Slit 104 Second slit 321 IC chip connection part 322 IC chip connection part 323 IC chip connection part C intersection E Anisotropic conductive material P1,P2,P3,P4 corner Q1,Q2 Support area R curve part SE region (region where anisotropic conductive material E is placed) SC area (area where IC chip 4 is placed)

Claims

1. An RFID inlay having a substrate, an antenna pattern which is a continuous body of metal foil formed on the substrate, and an IC chip connected to the antenna pattern, The antenna pattern is a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts; a second slit formed in a direction in which the pair of contacts are arranged so as to intersect with the first slit and partially formed in the direction in which the pair of contacts are arranged without separating the antenna pattern, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled in a position including an intersection of the first slit and the second slit and that is disposed on a surface of the antenna pattern including the pair of contacts; RFID inlay.

2. 2. The RFID inlay of claim 1, At the intersection, a curved portion is formed at least at a corner of the antenna pattern on a side facing the pair of contacts across the second slit. RFID inlay.

3. 3. An RFID inlay according to claim 1 or 2, a width of the first slit on a side facing the pair of contacts across the second slit is wider than a width of the other side; RFID inlay.

4. 3. An RFID inlay according to claim 1 or 2, The width of the second slit is wider than the width of the first slit. RFID inlay.

5. 5. An RFID inlay according to any one of claims 1 to 4, The substrate is a paper substrate; RFID inlay.

6. 6. An RFID inlay according to any one of claims 1 to 5, The pair of contacts refers to two contacts consisting of one contact formed on one side of the antenna pattern separated by the first slit and one contact formed on the other side of the antenna pattern. RFID inlay.

7. 7. An RFID inlay according to any one of claims 1 to 6, At the intersection, a curved portion is formed at a corner portion on the side where the pair of contacts of the antenna pattern are provided. RFID inlay.

8. An RFID inlay having a substrate, an antenna pattern formed on the substrate, and an IC chip connected to the antenna pattern, The antenna pattern is a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts; a second slit formed in a direction in which the pair of contacts are arranged so as to intersect with the first slit and partially formed in the direction in which the pair of contacts are arranged without separating the antenna pattern, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled at a position including an intersection of the first slit and the second slit and that is disposed on a surface of the antenna pattern including the pair of contacts; At the intersection, a curved portion is formed at least at a corner of the antenna pattern on a side facing the pair of contacts across the second slit. RFID inlay.

9. An RFID inlay having a substrate, an antenna pattern formed on the substrate, and an IC chip connected to the antenna pattern, The antenna pattern is a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts; a second slit formed in a direction in which the pair of contacts are arranged so as to intersect with the first slit and partially formed in the direction in which the pair of contacts are arranged without separating the antenna pattern, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled at a position including an intersection of the first slit and the second slit and that is disposed on a surface of the antenna pattern including the pair of contacts; a width of the first slit on a side facing the pair of contacts across the second slit is wider than a width of the other side; RFID inlay.

10. An RFID inlay having a substrate, an antenna pattern formed on the substrate, and an IC chip connected to the antenna pattern, The antenna pattern is a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts; a second slit formed in a direction in which the pair of contacts are arranged so as to intersect with the first slit and partially formed in the direction in which the pair of contacts are arranged without separating the antenna pattern, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled at a position including an intersection of the first slit and the second slit and that is disposed on a surface of the antenna pattern including the pair of contacts; The substrate is a paper substrate; RFID inlay.

11. An RFID inlay having a substrate, an antenna pattern formed on the substrate, and an IC chip connected to the antenna pattern, The antenna pattern is a first slit formed between a pair of contacts with the IC chip and separating the antenna pattern between the pair of contacts; a second slit formed in a direction in which the pair of contacts are arranged so as to intersect with the first slit and partially formed in the direction in which the pair of contacts are arranged without separating the antenna pattern, the IC chip is connected to the antenna pattern by an anisotropic conductive material that is filled at a position including an intersection of the first slit and the second slit and that is disposed on a surface of the antenna pattern including the pair of contacts; At the intersection, a curved portion is formed at a corner portion on the side where the pair of contacts of the antenna pattern are provided. RFID inlay.

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