Measuring device and substrate inspection device

Abstract

This measurement device (10) comprises an imaging unit (2), a first projection unit (3) for projecting linear first measurement light onto an object (S) under measurement from a direction inclined by a first angle, a second projection unit (4) for projecting linear second measurement light onto the object under measurement from a direction inclined by a second angle, and a control unit (1) for using the first measurement light and second measurement light projected onto the object under measurement imaged by the imaging unit to remove reflected light noise and acquire information about the height of the object under measurement.

Description

[Technical field]

[0001] The present invention relates to a measuring device and a substrate inspection device, and more particularly to a measuring device and a substrate inspection device that measure a measurement object based on imaging of a line-shaped measurement light. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known a measuring device that measures a measurement object based on an image of a line-shaped measuring light. Such a measuring device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2010-164377.

[0003] The above-mentioned Japanese Patent Laid-Open Publication No. 2010-164377 discloses a surface shape measuring system (measuring device) including an imaging section for imaging a measurement object, a line laser light source for irradiating a line-shaped measurement light onto the measurement object, and a control section for acquiring the surface shape of the measurement object based on the measurement light irradiated onto the measurement object imaged by the imaging section. In the surface shape measuring system of the above-mentioned Japanese Patent Laid-Open Publication No. 2010-164377, the imaging section is moved in the optical axis direction to change the focal position of the imaging section with respect to the measurement light projected at the same location, and the focused measurement light is identified to remove noise light images due to multiple reflections. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-164377 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the surface shape measurement system (measurement device) of JP 2010-164377 A, the measurement light projected at the same location is captured while changing the focal position of the imaging unit by moving the imaging unit in the optical axis direction, and the focused measurement light is identified and noise light images (reflected light noise) caused by multiple reflections are removed. Therefore, since the imaging unit is moved in the optical axis direction to capture an image of one position on the measurement object, it takes a long time to capture an image of one position on the measurement object. As a result, it takes a long time to measure the measurement object.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a measuring device and a substrate inspection device that can accurately measure the object to be measured by eliminating reflected light noise caused by the reflection of the measurement light while preventing the time required to measure the object to be measured from increasing. [Means for solving the problem]

[0007] A measurement device according to a first aspect of the present invention includes an imaging unit that images a measurement object, a first projection unit that is arranged on one side of the imaging unit and projects a line-shaped first measurement light onto the measurement object from a direction inclined at a first angle with respect to a horizontal direction, a second projection unit that is arranged on one side of the imaging unit and projects a line-shaped second measurement light onto the measurement object from a direction inclined at a second angle different from the first angle with respect to the horizontal direction, and a control unit that removes reflected light noise based on the first measurement light and the second measurement light projected onto the measurement object imaged by the imaging unit, and acquires height information of the measurement object, and based on the projection angle of the first projection unit and the projection angle of the second projection unit, The position based on the second measurement light is changed to the position based on the first measurement light. To correspond Stretch it Make corrections.

[0008] In the measuring device according to the first aspect of the present invention, as described above, a control unit is provided that removes reflected light noise based on the first measurement light and the second measurement light projected from different tilt angles to obtain height information of the measurement object. As a result, by capturing the first measurement light and the second measurement light projected from different tilt angles at one position of the measurement object, the position of the reflected light noise due to the first measurement light and the position of the reflected light noise due to the second measurement light are different positions, and by utilizing this, the reflected light noise can be removed and the measurement object can be accurately measured. Also, unlike the case where the imaging unit is moved in the optical axis direction while imaging, there is no need to perform imaging while moving the imaging unit in the optical axis direction at one position, so that the imaging time at one position can be suppressed from being long. As a result, the measurement object can be accurately measured by removing the reflected light noise caused by the reflection of the measurement light while suppressing the time required for measuring the measurement object from being long.

[0009] In the measurement device according to the first aspect, the imaging unit, the first projection unit, and the second projection unit are preferably configured to project the measurement light and capture images while moving relative to the measurement object. With this configuration, even when measuring a plurality of positions of the measurement object while moving the imaging unit, the first projection unit, and the second projection unit relative to the measurement object, it is not necessary to capture images while moving the imaging unit in the optical axis direction at each position to which the relative movement is made. This can prevent the imaging time from becoming long, and therefore can effectively prevent the time required for measuring the measurement object from becoming long.

[0010] In the measurement device according to the first aspect, the control unit is preferably configured to remove, as reflected light noise, the measurement light at a position where the position based on the first measurement light and the position based on the second measurement light do not overlap. With this configuration, when the first measurement light and the second measurement light projected from different tilt angles are projected to the same position, they are reflected to different positions due to the difference in tilt angle, so that the first measurement light and the second measurement light overlap at the directly projected position, while the reflected reflected light noise does not overlap. This makes it easy to distinguish the reflected light noise, and therefore easy to remove the reflected light noise.

[0011] In the measuring device according to the first aspect of the present invention, as described above, The control unit is configured to correct the position based on the second measurement light by expanding or contracting the position based on the first measurement light based on the projection angle of the first projection unit and the projection angle of the second projection unit so that the position based on the second measurement light corresponds to the position based on the first measurement light. This Since the deviation in scale caused by the difference in the inclination angle between the first measurement light and the second measurement light can be corrected by expansion or contraction, reflected light noise can be removed with high accuracy.

[0012] In the measuring device configured to remove the measuring light at a position where the position based on the first measuring light and the position based on the second measuring light do not overlap as reflected light noise, the control unit is preferably configured to correct the position based on the second measuring light by shifting it to correspond to the position based on the first measuring light based on the first and second measuring lights projected at the reference height position. With this configuration, the position deviation due to the difference in the tilt angle of the first measuring light and the second measuring light can be corrected, so that the reflected light noise can be removed with high accuracy.

[0013] In the measuring device according to the first aspect, preferably, the measuring device further includes a third projection unit arranged on the other side opposite to the one side of the imaging unit, and projects a third measurement light onto the measuring object from a direction inclined at a third angle with respect to the horizontal direction, and a fourth projection unit arranged on the other side of the imaging unit, and projects a fourth measurement light onto the measuring object from a direction inclined at a fourth angle different from the third angle with respect to the horizontal direction, and the control unit is configured to remove reflected light noise based on the first measurement light, the second measurement light, the third measurement light and the fourth measurement light projected onto the measuring object imaged by the imaging unit, and to obtain height information of the measuring object. With this configuration, even if a shadow occurs due to the shape of the measuring object when the measuring light is projected onto the imaging unit from one side, the shadow can be suppressed by projecting the measuring light from the other side of the imaging unit, and therefore the occurrence of a part that cannot be measured on the measuring object can be suppressed.

[0014] In this case, the control unit is preferably configured to obtain a plurality of measurement heights based on the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light projected on the measurement object captured by the imaging unit, and to compare the obtained plurality of measurement heights to obtain one height information of the measurement object. With this configuration, even if the measurement heights at one position obtained using the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light are different from each other, height information can be obtained as one measurement height, so that the height information of the measurement object can be obtained with high accuracy while suppressing the occurrence of a portion that cannot be measured on the measurement object.

[0015] In the measuring device having the third and fourth projection units, the control unit is preferably configured to invert and correct the positions based on the third and fourth measurement light so that they correspond to the positions based on the first measurement light. With this configuration, the first measurement light, the third measurement light, and the fourth measurement light, which have opposite tilt angles to each other with respect to the imaging unit, can be aligned in the same direction, making it easy to perform a process of removing noise from the reflected light.

[0016] A board inspection apparatus according to a second aspect of the present invention includes a board holding unit that holds a board on which electronic components are mounted, and a measurement unit that measures the board held by the board holding unit, wherein the measurement unit includes an imaging unit that images the board, a first projection unit that is arranged on one side of the imaging unit and projects a line-shaped first measurement light onto the board from a direction inclined at a first angle with respect to the horizontal direction, a second projection unit that is arranged on one side of the imaging unit and projects a line-shaped second measurement light onto the board from a direction inclined at a second angle different from the first angle with respect to the horizontal direction, and a control unit that removes reflected light noise based on the first measurement light and the second measurement light projected onto the board imaged by the imaging unit, and acquires height information of the board, and based on the projection angle of the first projection unit and the projection angle of the second projection unit, The position based on the second measurement light is changed to the position based on the first measurement light. To correspond Stretch it Make corrections.

[0017] In the substrate inspection device according to the second aspect of the present invention, as described above, a control unit is provided that removes reflected light noise based on the first measurement light and the second measurement light projected from different tilt angles to obtain height information of the substrate. As a result, by capturing the first measurement light and the second measurement light projected from different tilt angles at one position on the substrate, the position of the reflected light noise due to the first measurement light and the position of the reflected light noise due to the second measurement light are different positions, and by utilizing this, each reflected light noise can be removed. As a result, the substrate can be accurately measured by removing the reflected light noise. Also, unlike the case where the imaging unit is moved in the optical axis direction while capturing an image, there is no need to capture an image while moving the imaging unit in the optical axis direction at one position, so that the imaging time at one position can be suppressed from being long. As a result, it is possible to provide a substrate inspection device that can accurately measure the substrate as the measurement object by removing the reflected light noise caused by the reflection of the measurement light while suppressing the time required for measuring the substrate as the measurement object from being long. Effect of the Invention

[0023] According to the present invention, as described above, it is possible to accurately measure the measurement object by preventing the time required to measure the measurement object from increasing while removing reflected light noise caused by the reflection of the measurement light. [Brief description of the drawings]

[0024] [Figure 1] 1 is a block diagram showing a substrate inspection device according to a first embodiment of the present invention. [Diagram 2] 1 is a diagram showing an imaging section and a projection section of a substrate inspection apparatus according to a first embodiment of the present invention. [Diagram 3] FIG. 2 is a diagram for explaining height measurement of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram showing an example of the relationship between the peak of the luminance value and time when measuring the height of the substrate inspection apparatus according to the first embodiment of the present invention. [Diagram 5] FIG. 4 is a diagram for explaining a change in height per unit time in the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 6] 5A and 5B are diagrams for explaining reflection of measurement light in the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 7] FIG. 4 is a diagram for explaining the elimination of reflected light noise in the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 8] 5A to 5C are diagrams for explaining differences in height position due to different projection angles of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 9] 5A to 5C are diagrams for explaining correction by expansion and contraction of images at different projection angles in the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 10] FIG. 2 is a diagram for explaining setting of a reference position of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 11] 5A to 5C are diagrams for explaining correction, based on a reference position, of images at different projection angles of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 12] 5 is a flowchart for explaining a pre-processing by a control unit of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 13] 5 is a flowchart for explaining a measurement process by a control unit of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 14] 5A to 5C are diagrams for explaining correction by inversion of images at different projection angles in the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 15] 5 is a flowchart for explaining height information acquisition processing by a control unit of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 16] 5 is a flowchart for explaining a height selection process by a control unit of the substrate inspection apparatus according to the first embodiment of the present invention. [Figure 17] FIG. 11 is a block diagram showing a substrate inspection device according to a second embodiment of the present invention. [Figure 18] FIG. 11 is a diagram showing an imaging section and a projection section of a substrate inspection apparatus according to a second embodiment of the present invention. [Figure 19] 10A and 10B are diagrams for explaining reflection of measurement light in a substrate inspection apparatus according to a second embodiment of the present invention. [Figure 20] 13 is a diagram for explaining acquisition of a measurement height in a substrate inspection apparatus according to a second embodiment of the present invention. FIG. [Figure 21] FIG. 11 is a diagram for explaining the adoption of a measurement height in a substrate inspection apparatus according to a second embodiment of the present invention. [Figure 22] FIG. 11 is a diagram for explaining height measurement by a substrate inspection apparatus according to a second embodiment of the present invention. [Figure 23] FIG. 11 is a diagram for explaining the height relative to the line position of the substrate inspection apparatus according to the second embodiment of the present invention. [Figure 24] 10 is a flowchart for explaining height information acquisition processing by a control unit of a substrate inspection apparatus according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0026] (First embodiment) The configuration of a substrate inspection apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0027] As shown in Fig. 1, the board inspection apparatus 100 according to the first embodiment is an apparatus that images a board S (see Fig. 2) during or after production in a board production process as an inspection object, and performs various inspections of the board S and electronic components C (see Fig. 2) on the board S. The board inspection apparatus 100 constitutes part of a board production line for mounting electronic components C on the board S to produce circuit boards. The board S is an example of a "measurement object" in the claims.

[0028] The outline of the board manufacturing process is as follows: first, a solder printer (not shown) prints (applies) solder (solder paste) in a predetermined pattern on a board S on which a wiring pattern has been formed (solder printing process). Next, a surface mounter (not shown) mounts (mounts) electronic components C on the board S after solder printing (mounting process), so that the terminals of the electronic components C are placed on the solder. After that, the board S on which the components have been mounted is transported to a reflow furnace (not shown) where the solder is melted and hardened (cooled) (reflow process), so that the terminals of the electronic components C are solder-joined to the wiring of the board S. As a result, the electronic components C are fixed onto the board S in a state where they are electrically connected to the wiring, and the board manufacturing is completed.

[0029] The board inspection device 100 is used, for example, to inspect the printed state of the solder on the board S after the solder printing process, the mounted state of the electronic component C after the mounting process, or the mounted state of the electronic component C after the reflow process. Therefore, one or more board inspection devices 100 are provided in a board manufacturing line. As for the printed state of the solder, inspection is performed for the misalignment of the printed position from the designed printing position, the shape, volume and height of the solder (amount of application), the presence or absence of a bridge (short circuit), and the like. As for the mounted state of the electronic component C, inspection is performed for whether the type and orientation (polarity) of the electronic component C are appropriate, whether the amount of misalignment from the designed mounting position of the electronic component C is within an allowable range, and whether the solder joint state of the terminal part is normal or not. In addition, as a common inspection content between each process, detection of foreign matter such as dust and other attached matter is also performed.

[0030] As shown in FIG. 1, the substrate inspection device 100 includes a measurement unit 10 that measures a substrate S. The measurement unit 10 includes a control unit 1, an imaging unit 2, a first projection unit 3, a second projection unit 4, a third projection unit 5, and a fourth projection unit 6. The substrate inspection device 100 also includes a head moving mechanism 7 that moves a head provided with the imaging unit 2, the first projection unit 3, the second projection unit 4, the third projection unit 5, and the fourth projection unit 6. The head moving mechanism 7 includes an X-axis motor 71, a Y-axis motor 72, and a Z-axis motor 73. The substrate inspection device 100 also includes a substrate holding unit 8 that holds a substrate S on which an electronic component C is mounted. The measurement unit 10 is an example of a "measurement device" in the claims.

[0031] The control unit 1 is configured to control each part of the substrate inspection apparatus 100. The control unit 1 includes a CPU (Central Processing Unit) 11 that executes logical operations, and a memory 12 including a ROM (Read Only Memory) that stores programs for controlling the CPU 11 and a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus. The CPU 11 is configured to control each part of the substrate inspection apparatus 100 according to the programs stored in the memory 12. The control unit 1 controls the measurement unit 10 to perform various appearance inspections of the substrate S.

[0032] The measuring unit 10 is configured to measure the three-dimensional shape by a light section method. The measuring unit 10 is moved to a predetermined position above the substrate S by the head moving mechanism 7 and configured to capture images for visual inspection of the substrate S and the electronic components C on the substrate S.

[0033] The imaging unit 2 captures an image of the substrate S as a measurement object. The imaging unit 2 is configured to capture an image of the substrate S onto which the linear measurement light is projected by the first projection unit 3, the second projection unit 4, the third projection unit 5, and the fourth projection unit 6. The imaging unit 2 has an imaging element such as a CCD image sensor or a CMOS image sensor. As shown in FIG. 2, the imaging unit 2 has an optical axis arranged along the vertical direction (Z direction). The imaging unit 2 also includes an optical system 21 including a lens.

[0034] The first projection unit 3 is arranged laterally on one side (X2 direction side) with respect to the imaging unit 2. The first projection unit 3 is configured to project a linear first measurement light onto the substrate S from a direction inclined at a first angle θ1 with respect to the horizontal direction. The second projection unit 4 is arranged laterally on one side (X2 direction side) with respect to the imaging unit 2. That is, the second projection unit 4 is arranged laterally on the same side as the first projection unit 3 with respect to the imaging unit 2. The second projection unit 4 is configured to project a linear second measurement light onto the substrate S from a direction inclined at a second angle θ2 different from the first angle θ1 with respect to the horizontal direction. The first projection light and the second projection light are projected so as not to intersect within the range of the measurement height.

[0035] The third projection unit 5 is arranged laterally on the other side (X1 direction side) with respect to the imaging unit 2. The third projection unit 5 is configured to project a line-shaped third measurement light onto the substrate S from a direction inclined at a third angle θ3 with respect to the horizontal direction. The fourth projection unit 6 is arranged laterally on the other side (X1 direction side) with respect to the imaging unit 2. That is, the third projection unit 5 and the fourth projection unit 6 are arranged laterally on the same side with respect to the imaging unit 2. The third projection unit 5 and the fourth projection unit 6 are arranged laterally on the opposite side to the first projection unit 3 and the second projection unit 4 with respect to the imaging unit 2. The fourth projection unit 6 is configured to project a fourth measurement light onto the substrate S from a direction inclined at a fourth angle θ4 different from the third angle θ3 with respect to the horizontal direction. The third projection light and the fourth projection light are projected so as not to intersect within the range of the measurement height.

[0036] The imaging unit 2, the first projection unit 3, the second projection unit 4, the third projection unit 5, and the fourth projection unit 6 are configured to project the measurement light and capture an image while moving relative to the substrate S. That is, imaging is performed while scanning the substrate S with the measurement light, and the three-dimensional shape (height information) of the substrate S is measured.

[0037] The head moving mechanism 7 is provided above the substrate holding unit 8, and is configured by, for example, an orthogonal three-axis (XYZ-axis) robot using a ball screw shaft and a servo motor. The head moving mechanism 7 is equipped with an X-axis motor 71, a Y-axis motor 72, and a Z-axis motor 73 for driving the X-axis, Y-axis, and Z-axis. The X-axis motor 71, the Y-axis motor 72, and the Z-axis motor 73 enable the head moving mechanism 7 to move the head provided with the imaging unit 2, the first projection unit 3, the second projection unit 4, the third projection unit 5, and the fourth projection unit 6 in the XY directions (horizontal directions) and the Z direction (up and down directions) above the substrate holding unit 8 (substrate S).

[0038] The board holding unit 8 is configured to hold the board S on which the electronic components C are mounted. The board holding unit 8 is also configured to transport the board S in the horizontal direction and to be able to stop and hold the board S at a predetermined inspection position. The board holding unit 8 is also configured to transport the board S after inspection in the horizontal direction from the predetermined inspection position and to carry the board S out of the board inspection apparatus 100.

[0039] The control unit 1 acquires the three-dimensional shape (height information) of the substrate S based on the line-shaped measurement light projected onto the substrate S. Specifically, as shown in Fig. 3 to Fig. 5, the control unit 1 moves the imaging unit 2, the first projection unit 3, the second projection unit 4, the third projection unit 5, and the fourth projection unit 6 relative to the substrate S in a predetermined direction (X direction) at a speed v, and acquires the height information from the temporal maximum brightness position at the measurement position on the substrate S.

[0040] As shown in Fig. 3, when capturing images while moving the imaging unit 2 and the projection units (first projection unit 3, second projection unit 4, third projection unit 5, and fourth projection unit 6) in the X2 direction at a speed v, the change in luminance over time of position A on the top surface of an electronic component C located at a certain distance from the movement start position and position B on the top surface of a board S is as shown in Fig. 4. Note that in the example shown in Fig. 3, the second projection unit 4 is illustrated as the projection unit, but the same applies to the other projection units (first projection unit 3, third projection unit 5, and fourth projection unit 6).

[0041] Furthermore, the imaging unit 2 captures images of the same position while shifting the same position by a predetermined pixel (for example, one pixel) in accordance with the movement, and a change in luminance value for the same position is obtained.

[0042] In Fig. 4, time t1 represents the time when the linear measurement light is irradiated (projected) onto position A. Time t2 represents the time when the linear measurement light is irradiated onto position B. In this case, the higher the position, the faster the time for the center of the linear measurement light to pass through. Also, as shown in Fig. 5, the linear measurement light moves v per unit time, so if the projection angle of the measurement light is θ, the change in height per unit time is -v × tan θ, taking into account the projection direction of the measurement light.

[0043] If the height at the start of the movement is 0, the height at elapsed time t1 is h1 = -v × tan θ × t1, and the height at elapsed time t2 is h2 = -v × tan θ × t2. The height at position A is calculated by h1 - h2.

[0044] Here, in the first embodiment, the control unit 1 removes reflected light noise based on the first and second measurement lights projected onto the substrate S imaged by the imaging unit 2, and acquires height information of the substrate S. Also, the control unit 1 removes reflected light noise based on the third and fourth measurement lights projected onto the substrate S imaged by the imaging unit 2, and acquires height information of the substrate S.

[0045] 6, the reflected light noise occurs when the measurement light is reflected by a position P1 of the electronic component C on the substrate S, the first measurement light having a projection angle θ1 is reflected to a position P2 on the substrate S, and the second measurement light having a projection angle θ2 is reflected to a position P3 on the substrate S. In this case, the first measurement light is captured at positions P1 and P2. The second measurement light is captured at positions P1 and P3.

[0046] The control unit 1 is also configured to remove the measurement light at a position where the position based on the first measurement light and the position based on the second measurement light do not overlap as reflected light noise. That is, the control unit 1 does not remove the measurement light at a position P1 where the positions of the first measurement light and the second measurement light overlap, but removes the measurement light at positions P2 and P3 where the positions of the first measurement light and the second measurement light do not overlap as reflected light noise.

[0047] As shown in FIG. 7, the control unit 1 superimposes an image at a position P1 of a projection angle θ1 and an image at a position P1 of a projection angle θ2. The control unit 1 then extracts a position that exists in both the image at the position P1 of the projection angle θ1 and the image at the position P1 of the projection angle θ2. This makes it possible to obtain an image from which reflected light noise has been removed by extracting only the positions that were lit up in all positions when images captured at the same position using linear measurement light with different projection angles are superimposed. Note that, in the superimposed and extracted image, the luminance value of the extracted position may be the average value of the multiple images or the maximum value.

[0048] Here, as shown in Fig. 8, when measurement light beams with different projection angles are irradiated (projected), the projection positions of the measurement light beams are different even at the same height position. For example, for a height h, the first measurement light beam with a projection angle θ1 is irradiated at a position d1, and the second measurement light beam with a projection angle θ2 is irradiated at a position d2. In other words, when the image of the first measurement light beam and the image of the second measurement light beam are superimposed in this state, the measurement light beam with the correct height is also removed because it does not overlap.

[0049] As shown in FIG. 9, the control unit 1 is configured to correct the position based on the second measurement light by expanding or contracting it based on the projection angle of the first projection unit 3 and the projection angle of the second projection unit 4 so that it corresponds to the position based on the first measurement light.

[0050] The relationship between the shift amount Δx of the linear measuring light and the height H when the lens resolution and the imaging pitch are 1 is expressed as H=Δx×tanθ. Therefore, the control unit 1 expands or contracts the image of the second measuring light at the projection angle θ2 according to the value of a so that Δx×tanθ1=Δx×tanθ2×a holds. In the first embodiment, the control unit 1 obtains the height information from the maximum luminance value in time, and therefore expands or contracts the luminance change on the line of interest when expanding or contracting the image, and therefore does not affect the height position.

[0051] 11, the control unit 1 is configured to correct the position based on the second measurement light by shifting the position based on the first measurement light based on the first and second measurement light projected at the reference height position so that the position corresponds to the position based on the first measurement light. In other words, when superimposing images with different projection angles, it is necessary to set which position is to be used as a reference for superimposing.

[0052] The control unit 1 measures a flat jig 9 in advance, and superimposes images with different projection angles based on the position of the line-shaped measurement light at that time, as shown in Fig. 10. The control unit 1 stores a position P4 where the first measurement light with a projection angle θ1 is projected onto the jig 9, and a position P5 where the second measurement light with a projection angle θ2 is projected onto the jig 9, as reference position coordinates of the respective measurement lights. Then, the control unit 1 superimposes an image of the first measurement light with a projection angle θ1 and an image of the second measurement light with a projection angle θ2 based on the reference position coordinates, as shown in Fig. 11.

[0053] (Pre-processing) The pre-processing by the control unit 1 will be described with reference to FIG.

[0054] In step S1 of Fig. 12, the measurement light is irradiated onto the flat jig 9 and imaged by the imaging unit 2 while scanning. In step S2, an image is created based on the imaging result by measuring the height from the maximum brightness position in time. In addition, the position of the linear measurement light for each projection unit is saved as a reference position coordinate.

[0055] (Measurement processing) The measurement process by the control unit 1 will be described with reference to FIG.

[0056] In step S3 of Fig. 13, the measurement light is irradiated onto the measurement object (substrate S) and imaged by the imaging unit 2 while scanning. In step S4, an image is created based on the imaging result by a method of measuring the height from the maximum brightness position in time. In addition, an image is created for each projection unit (first projection unit 3, second projection unit 4, third projection unit 5, and fourth projection unit 6).

[0057] In step S5, the images are stretched or contracted to make the height resolution uniform. In step S6, the images are superimposed so as to be superimposed on a reference position.

[0058] In step S7, the locations where brightness exists in the overlapped images are extracted. In step S8, a height detection process is performed on the extracted images. That is, height information at each position is calculated based on the remaining measurement light.

[0059] Here, in the first embodiment, as shown in FIG. 2, in addition to a first projection unit 3 and a second projection unit 4 arranged on the X2 side of the imaging unit 2, a third projection unit 5 and a fourth projection unit 6 arranged on the X1 side of the imaging unit 2 are provided so that measurements can be made even if a shadow occurs due to the projection angle of the measurement light.

[0060] In addition, in the first embodiment, the control unit 1 is configured to remove reflected light noise and acquire height information of the substrate S based on the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light projected onto the substrate S imaged by the imaging unit 2.

[0061] In the same manner as in the case where the first projection unit 3 and the second projection unit 4 are used, the reflected light noise is removed using the third projection unit 5 and the fourth projection unit 6. In addition, the first projection unit 3 and the third projection unit 5 arranged on opposite sides of the image capture unit 2 are used to determine the shape of the area with or without the influence of a shadow. That is, the image based on the first measurement light of the first projection unit 3 and the image based on the third measurement light of the third projection unit 5 are superimposed to extract the overlapping position, and if there is an overlapping position, no shadow is cast in both the first measurement light and the third measurement light, and it is determined that the area is flat. If there is no overlapping position, a shadow is cast in at least one of the first measurement light and the third measurement light, and it is determined that the area is not flat.

[0062] In addition, the positions of the linear measurement light beams are reversed in the images based on the measurement light beams projected in opposite directions, so that the positions of the linear measurement light beams are reversed. Therefore, the control unit 1 is configured to invert and correct the positions based on the third and fourth measurement light beams so that they correspond to the positions based on the first measurement light beam, as shown in FIG.

[0063] In addition, in the first embodiment, the control unit 1 is configured to acquire multiple measurement heights based on the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light projected onto the substrate S imaged by the imaging unit 2, and to acquire one piece of height information of the substrate S by comparing the acquired multiple measurement heights.

[0064] Specifically, the control unit 1 superimposes an image of the first measurement light projected from the first projection unit 3 and an image of the second measurement light projected from the second projection unit 4, removes reflected light noise, and obtains the first height information H1. The control unit 1 also superimposes an image of the third measurement light projected from the third projection unit 5 and an image of the fourth measurement light projected from the fourth projection unit 6, removes reflected light noise, and obtains the second height information H2. The control unit 1 also superimposes an image of the first measurement light projected from the first projection unit 3 and an image of the third measurement light projected from the third projection unit 5, removes reflected light noise, and obtains the third height information H3. The control unit 1 then classifies the three height information into cases based on the conditions of the obtained height, and obtains one height information.

[0065] When there is height information H3 obtained by irradiating the imaging unit 2 with measurement light from both sides, the control unit 1 determines that the position of the substrate S to be measured is flat, and adopts the height information H3. When there is only one of height information H1 and H2 obtained by irradiating the imaging unit 2 with measurement light from one side, the control unit 1 determines that the measurement target is in the position of one of the shadows, and adopts the height information H1 or H2 for which height information is present. When there is both height information H1 and H2 obtained by irradiating the imaging unit 2 with measurement light from one side, the control unit 1 determines that the measurement target has a complex shape that is not flat. In this case, when the difference between the height information H1 and H2 is less than a predetermined value N, the control unit 1 adopts the average value of the two height information H1 and H2. When the difference between the height information H1 and H2 is equal to or greater than a predetermined value N, the control unit 1 adopts the height information with the greater luminance of the line-shaped measurement light.

[0066] (Height information acquisition process) A height information acquisition process by the controller 1 when acquiring height information based on the first, second, third and fourth measurement light will be described with reference to FIG.

[0067] 15, the measurement object (substrate S) is irradiated with the measurement light and imaged by the imaging unit 2 while being scanned. In step S12, height information H1 is obtained by removing reflected light noise from images captured using the measurement light (first measurement light and second measurement light) with projection angles θ1 and θ2, and height information H2 is obtained by removing reflected light noise from images captured using the measurement light (third measurement light and fourth measurement light) with projection angles θ3 and θ4.

[0068] In step S13, the measurement light images with larger projection angles (closer to the vertical) on both sides of the image capturing unit 2 are selected. In this case, the image of the first measurement light with a projection angle θ1 is selected on the X2 side of the image capturing unit 2. Also, the image of the third measurement light with a projection angle θ3 is selected on the X1 side of the image capturing unit 2. This makes it less likely that a shadow will be generated compared to when the projection angle is small. In step S14, one of the two selected images is flipped left and right to align the reference position, and the two images are superimposed.

[0069] In step S15, the location where the luminance exists in the overlapped image is extracted. In step S16, the height detection process is performed on the extracted image, and height information H3 with reflected light noise removed is obtained. That is, the height information H3 at each position is calculated based on the remaining measurement light.

[0070] In step S17, one piece of height information is selected for each of the measurement positions for the height information H1, H2 and H3.

[0071] (Height selection process) The height selection process in step S17 of FIG. 15 will be described with reference to FIG.

[0072] In step S21 of FIG. 16, three pieces of height information H1, H2 and H3 are obtained.

[0073] In step S22, it is determined whether or not the height information H3 exists. If the height information H3 exists, the process proceeds to step S23, where the height information H3 is selected. If the height information H3 does not exist, the process proceeds to step S24.

[0074] In step S24, it is determined whether or not only the height information H1 is present among the height information H1 and H2. If only the height information H1 is present, the process proceeds to step S25, where the height information H1 is selected. If not, the process proceeds to step S26.

[0075] In step S26, it is determined whether or not only the height information H2 is present among the height information H1 and H2. If only the height information H2 is present, the process proceeds to step S27, where the height information H2 is selected. If not, the process proceeds to step S28.

[0076] In step S28, it is determined whether or not both the height information H1 and H2 are present. If neither the height information H1 nor H2 is present, the process proceeds to step S29, where no height information is selected. If both the height information H1 and H2 are present, the process proceeds to step S30.

[0077] In step S30, it is determined whether the difference between the height information H1 and H2 is less than a predetermined value N. If it is less than the predetermined value N, the process proceeds to step S31, where height information obtained by averaging the height information H1 and H2 is selected. If it is not less than the predetermined value N (if it is equal to or greater than the predetermined value N), the process proceeds to step S32.

[0078] In step S32, it is determined whether the luminance of the line-shaped measurement light is brighter (brighter) than the height information H1 of the height information H2. If the height information H1 is brighter, the process proceeds to step S33, where the height information H1 is selected. If the height information H1 is not brighter (if the height information H2 is brighter), the process proceeds to step S34, where the height information H2 is selected.

[0079] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0080] In the first embodiment, as described above, the control unit 1 is provided to remove reflected light noise based on the first measurement light and the second measurement light projected from different tilt angles, and to obtain height information of the substrate S as a measurement object. As a result, by capturing the first measurement light and the second measurement light projected from different tilt angles at one position of the substrate S, the position of the reflected light noise due to the first measurement light and the position of the reflected light noise due to the second measurement light are different positions, and by utilizing this, each reflected light noise can be removed. As a result, the substrate S can be accurately measured by removing the reflected light noise. Also, unlike the case where the imaging unit 2 is moved in the optical axis direction while capturing an image, there is no need to capture an image while moving the imaging unit 2 in the optical axis direction at one position, so that the imaging time at one position can be suppressed from being long. As a result, the reflected light noise caused by the reflection of the measurement light can be removed while suppressing the time required for measuring the substrate S as a measurement object from being long, and the substrate S as a measurement object can be accurately measured.

[0081] In the first embodiment, as described above, the imaging unit 2, the first projection unit 3, and the second projection unit 4 are configured to project the measurement light and capture images while moving relative to the substrate S. As a result, even when measuring a plurality of positions on the substrate S while moving the imaging unit 2, the first projection unit 3, and the second projection unit 4 relative to the substrate S, it is not necessary to capture images while moving the imaging unit 2 in the optical axis direction at each position to which the imaging unit 2 is moved relatively. This makes it possible to prevent the imaging time from becoming long, and therefore effectively prevents the time required for measuring the substrate S from becoming long.

[0082] In the first embodiment, as described above, the control unit 1 is configured to remove the measurement light at a position where the position based on the first measurement light and the position based on the second measurement light do not overlap as reflected light noise. As a result, when the first measurement light and the second measurement light projected from different tilt angles are projected to the same position, they are reflected to different positions due to the difference in tilt angle, so that the first measurement light and the second measurement light overlap at the directly projected position, while the reflected reflected light noise does not overlap. As a result, the reflected light noise can be easily identified, and the reflected light noise can be easily removed.

[0083] In the first embodiment, as described above, the control unit 1 is configured to correct the position based on the second measurement light by expanding or contracting the position based on the first measurement light so that the position corresponds to the position based on the first measurement light, based on the projection angle of the first projection unit 3 and the projection angle of the second projection unit 4. This allows the scale deviation caused by the difference in the inclination angle between the first measurement light and the second measurement light to be corrected by expansion or contraction, thereby enabling the reflected light noise to be removed with high accuracy.

[0084] In the first embodiment, as described above, the control unit 1 is configured to correct the position based on the second measurement light by shifting the position based on the first measurement light based on the first and second measurement light projected at the reference height position so that the position corresponds to the position based on the first measurement light. This makes it possible to correct the position shift caused by the difference in the tilt angle between the first and second measurement light, thereby making it possible to accurately remove reflected light noise.

[0085] In the first embodiment, as described above, the third projection unit 5 is disposed on the other side opposite to the one side of the imaging unit 2 and projects the third measurement light onto the substrate S from a direction inclined at a third angle θ3 with respect to the horizontal direction, and the fourth projection unit 6 is disposed on the other side of the imaging unit 2 and projects the fourth measurement light onto the substrate S from a direction inclined at a fourth angle θ4 different from the third angle θ3 with respect to the horizontal direction. The control unit 1 is configured to remove reflected light noise based on the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light projected onto the substrate S imaged by the imaging unit 2, and to acquire height information of the substrate S. As a result, even if a shadow is generated due to the shape of the substrate S when the measurement light is projected onto the imaging unit 2 from one side, the generation of the shadow can be suppressed by projecting the measurement light onto the imaging unit 2 from the other side, and therefore the generation of a portion of the substrate S that cannot be measured can be suppressed.

[0086] In the first embodiment, as described above, the control unit 1 is configured to acquire a plurality of measurement heights based on the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light projected onto the substrate S imaged by the imaging unit 2, and to compare the acquired plurality of measurement heights to acquire one piece of height information of the substrate S. As a result, even if the measurement heights at one position acquired using the first measurement light, the second measurement light, the third measurement light, and the fourth measurement light are different from each other, height information can be acquired as one measurement height, so that the height information of the substrate S can be acquired with high accuracy while suppressing the occurrence of a portion of the substrate S that cannot be measured.

[0087] In the first embodiment, as described above, the control unit 1 is configured to invert and correct the positions based on the third and fourth measurement light so that they correspond to the positions based on the first measurement light. This allows the first measurement light, the third measurement light, and the fourth measurement light, which have opposite tilt angles to each other, to be aligned in the same direction with respect to the imaging unit 2, making it easy to perform a process of removing noise from the reflected light.

[0088] Second embodiment Next, the configuration of a substrate inspection apparatus 200 according to a second embodiment of the present invention will be described with reference to Fig. 17 to Fig. 24. In the second embodiment, unlike the first embodiment, an example of a configuration for removing reflected light noise based on measurement light projected from one projection unit will be described. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0089] As shown in Fig. 17, a board inspection apparatus 200 according to the second embodiment is an apparatus that images a board S (see Fig. 18) during or after production in a board production process as an inspection object, and performs various inspections of the board S and electronic components C (see Fig. 18) on the board S. The board S is an example of a "measurement object" in the claims.

[0090] As shown in FIG. 17, the board inspection apparatus 200 includes a measurement unit 20 that measures the board S. The measurement unit 20 includes a control unit 1, an imaging unit 2, and a projection unit 201. The board inspection apparatus 200 also includes a head moving mechanism 7 that moves a head provided with the imaging unit 2 and the projection unit 201. The head moving mechanism 7 includes an X-axis motor 71, a Y-axis motor 72, and a Z-axis motor 73. The board inspection apparatus 200 also includes a board holding unit 8 that holds the board S on which electronic components C are mounted. The measurement unit 20 is an example of a "measurement device" in the claims.

[0091] The measuring unit 20 is configured to measure the three-dimensional shape by a light-section method. The measuring unit 20 is moved to a predetermined position above the substrate S by the head moving mechanism 7 and configured to capture images for visual inspection of the substrate S and the electronic components C on the substrate S.

[0092] The imaging unit 2 captures an image of the substrate S as a measurement object. The imaging unit 2 is configured to capture an image of the substrate S onto which the linear measurement light is projected by the projection unit 201.

[0093] 18, the projection unit 201 is disposed on one side (the X2 direction side) of the imaging unit 2. The projection unit 201 is configured to project a line-shaped measurement light onto the substrate S from a direction inclined at an angle θ5 with respect to the horizontal direction.

[0094] The control unit 1 acquires the three-dimensional shape (height information) of the substrate S based on the line-shaped measurement light projected onto the substrate S. Specifically, the control unit 1 moves the imaging unit 2 and the projection unit 201 relative to the substrate S in a predetermined direction (X direction) to acquire the height information from the spatial position at the measurement position of the substrate S.

[0095] Specifically, the control unit 1 irradiates the measurement light from the projection unit 201 at a projection angle θ5 as shown in FIG. 22. In this case, the measurement light is projected onto the position xa on the top surface of the electronic component C, and onto the position xb on the top surface of the board S. As shown in FIG. 23, the control unit 1 calculates the height ha of xa as ha=xa×tan θ5 based on the position x0 where the x coordinate is 0. The control unit 1 also calculates the height hb of xb as hb=xb×tan θ5. Note that since the imaging unit 2 and the projection unit 201 move in the X direction, when comparing the heights of the same positions of the board S and the electronic component C, the imaging and height calculation are repeated while shifting the imaging position little by little to create a height table.

[0096] Here, in the second embodiment, the control unit 1 is configured to acquire, when multiple measurement heights are acquired for the same position due to reflected light noise caused by the measurement light being reflected off the substrate S as the measurement object, the measurement height having the greater brightness of the measurement light as the height information of the substrate S.

[0097] Specifically, the control unit 1 is configured to acquire the height of the substrate S for all of the measurement light captured by the imaging unit 2, including reflected light noise, and when multiple measurement heights are acquired for the same position, acquire the measurement height with the greater brightness of the measurement light as the height information of the substrate S.

[0098] 19, the measurement light reflected by a position P6 of an electronic component C on a substrate S is reflected to a position P7 on the substrate S. In this case, the measurement light is captured at positions P6 and P7.

[0099] As shown in FIG. 20, the control unit 1 selects the location where the peak luminance value of the line light is the largest for each line in the horizontal direction (X direction) and obtains the height. In the example shown in FIG. 20, the luminance value of position P7 is larger than that of position P6, so the control unit 1 obtains the height based on the position of position P7. Then, the control unit 1 erases the measurement light at position P7 from the image. Then, the control unit 1 selects the location where the peak luminance value of the line light is the largest for each line in the horizontal direction (X direction) from the image from which position P7 has been erased and obtains the height. In the example shown in FIG. 20, the measurement light remains at position P6, so the control unit 1 obtains the height based on the position of position P6. Then, the control unit 1 erases the measurement light at position P6 from the image. The control unit 1 performs similar processing for other positions on the substrate S.

[0100] As shown in Fig. 21, by performing similar processing at other positions on the substrate S, the height of the position P7 is obtained even when the measurement light is directly irradiated onto the position P7. In this case, the control unit 1 compares the magnitude of the luminance value of the measurement light used for multiple heights of the position P7. Then, the control unit 1 selects the height with the largest luminance value as the height of the position P7. In other words, since the measurement light directly projected onto the position P7 is brighter than the measurement light reflected onto the position P6 and projected onto the position P7, the darker one is removed as reflected light noise.

[0101] In addition, since it is assumed that two or more heights are measured in addition to reflected light noise, if the difference between two or more heights is less than a certain value, the average value may be calculated and selected as the height at that position. Also, if the difference between two or more heights is equal to or greater than a certain value, the luminance values ​​of the measurement light are compared.

[0102] (Height information acquisition process) The altitude information acquisition process performed by the control unit 1 will be described with reference to FIG.

[0103] 24, the number of height detections n is set. That is, the number of repetitions n of the process of selecting and erasing the location with the largest peak luminance value of the line light for each line in the horizontal direction (X direction) is set. In step S42, the measurement light is irradiated onto the substrate S as the measurement object, and an image is captured once by the imaging unit 2.

[0104] In step S43, an image is acquired by a method of measuring height and position from a spatial position based on the imaging result, and the height of the linear measurement light having the largest peak luminance value is acquired for each line in the horizontal direction (X direction). In step S44, it is determined whether the detection process has been performed n times. If the detection process has not been performed n times, the process proceeds to step S45, and if the detection process has been performed n times, the process proceeds to step S46.

[0105] In step S45, the linear measuring light whose height has been detected is erased from the image. Then, the process returns to step S43. In step S46, it is determined whether or not a height already exists at the position where the height has been detected. If a height already exists, the process proceeds to step S47, and if a height does not exist, the process proceeds to step S48.

[0106] In step S47, the peak brightness values ​​are compared and the heights are consolidated into one. In other words, if there are multiple heights for the same position, the height with the larger peak brightness value at that position is selected. Then, the process proceeds to step S48. In step S48, the position where the height was detected, the height, and the peak brightness value are saved.

[0107] In step S49, it is determined whether or not scanning of the measurement object (substrate S) is complete. If scanning is complete, the height information acquisition process is terminated. If scanning is not complete, the positions of the imaging unit 2 and the projection unit 201 are moved, and the process returns to step S42, and the processes of steps S42 to S49 are repeated.

[0108] The other configurations of the second embodiment are similar to those of the first embodiment.

[0109] (Effects of the second embodiment) In the second embodiment, as described above, when multiple measurement heights are acquired at the same position due to reflected light noise caused by the measurement light reflected on the substrate S as the measurement object, the control unit 1 is provided to acquire the measurement height with the greater luminance of the measurement light as the height information of the substrate S. This allows the measurement height caused by the reflected light noise to be removed from the multiple measurement heights and the substrate S to be measured with high accuracy by utilizing the fact that the luminance when the measurement light is directly projected onto the substrate S is greater than the luminance of the reflected light noise. Also, unlike the case where imaging is performed while moving the imaging unit 2 in the optical axis direction, there is no need to perform imaging while moving the imaging unit 2 in the optical axis direction at one position, so that the imaging time at one position can be suppressed from being long. As a result, the reflected light noise caused by the reflection of the measurement light can be removed while suppressing the time required for measuring the substrate S as the measurement object from being long, and the substrate S as the measurement object can be measured with high accuracy.

[0110] In the second embodiment, as described above, the control unit 1 is configured to acquire the height of the substrate S for all of the measurement light captured by the imaging unit 2, including reflected light noise, and acquire the measurement height with the greater luminance of the measurement light as the height information of the substrate S when multiple measurement heights are acquired for the same position. This makes it possible to prevent the occurrence of positions on the substrate S where the measurement height cannot be acquired, and therefore makes it possible to prevent the positions where the measurement height cannot be acquired from being predicted and interpolated from the surrounding heights. As a result, the substrate S can be measured with high accuracy.

[0111] (Modification) The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0112] For example, in the above-described first embodiment, an example of a configuration in which two projection units are provided on one side of the imaging unit and two projection units are provided on the other side is shown, but the present invention is not limited to this. In the present invention, two projection units may be provided only on one side of the imaging unit. Also, three or more projection units may be provided on the same side of the imaging unit.

[0113] In the second embodiment, an example of a configuration in which one projection unit is provided is shown, but the present invention is not limited to this. In the present invention, a plurality of projection units may be provided in the configuration of the second embodiment.

[0114] In the above first and second embodiments, an example of a configuration in which the measuring device (measurement unit) of the present invention is provided in a board inspection device that inspects a board is shown, but the present invention is not limited to this. The measuring device (measurement unit) of the present invention may be provided in a device other than a board inspection device. For example, the measuring device (measurement unit) of the present invention may be provided in a printing device that prints solder on a board, a component mounting device that mounts electronic components on a board, a foreign object inspection device, etc. Furthermore, the measuring device (measurement unit) of the present invention may be provided in a three-dimensional measuring device that measures the three-dimensional shape of a measurement object.

[0115] In the first embodiment, the position based on the second measurement light is corrected by expanding or contracting so as to correspond to the position based on the first measurement light, but the present invention is not limited to this. In the present invention, the position based on the first measurement light may be corrected by expanding or contracting so as to correspond to the position based on the second measurement light. In addition, both the position based on the first measurement light and the position based on the second measurement light may be corrected by expanding or contracting so that the position based on the first measurement light corresponds to the position based on the second measurement light.

[0116] In the first embodiment, the position based on the second measurement light is shifted to correspond to the position based on the first measurement light for correction, but the present invention is not limited to this. In the present invention, the position based on the first measurement light may be shifted to correspond to the position based on the second measurement light for correction. In addition, both the position based on the first measurement light and the position based on the second measurement light may be shifted for correction so that the position based on the first measurement light corresponds to the position based on the second measurement light.

[0117] In the first embodiment, the position based on the third measurement light and the fourth measurement light is inverted to correspond to the position based on the first measurement light for correction, but the present invention is not limited to this. In the present invention, the position based on the third measurement light and the fourth measurement light may be inverted to correspond to the position based on the second measurement light for correction. Also, the position based on the first measurement light may be inverted to correspond to the position based on the third measurement light and the fourth measurement light for correction. Also, the position based on the second measurement light may be inverted to correspond to the position based on the third measurement light and the fourth measurement light for correction.

[0118] In the first embodiment, an example of a configuration in which the reference position of the measurement light is set using a jig is shown, but the present invention is not limited to this. In the present invention, for example, the reference position of the measurement light may be set using a known flat position on the device without using a jig.

[0119] In the above first and second embodiments, for convenience of explanation, the control process of the control unit is explained using a flow-driven flow in which the control process is performed in order according to the processing flow, but the present invention is not limited to this. In the present invention, the process of the control unit may be performed by an event-driven process in which the process is executed on an event-by-event basis. In this case, the process may be completely event-driven, or may be a combination of event-driven and flow-driven. [Explanation of symbols]

[0120] 1. Control section 2. Imaging unit 3 1st projection section 4 Second projection section 5 Third projection section 6 4th projection section 8 Board holding part 10. Measurement section (measuring device) 20 Measurement section (measuring device) 100 Circuit board inspection equipment 200 Circuit Board Inspection Equipment 201 Projection section C Electronic components S Substrate (measurement object)

Claims

1. An imaging unit that images an object to be measured; a first projection unit that is disposed on one side of the imaging unit and projects a linear first measurement light onto the measurement object from a direction inclined at a first angle with respect to a horizontal direction; a second projection unit that is disposed on the one side of the imaging unit and projects a line-shaped second measurement light onto the measurement object from a direction inclined at a second angle different from the first angle with respect to a horizontal direction; and a control unit that removes reflected light noise based on the first measurement light and the second measurement light projected onto the measurement object imaged by the imaging unit, and acquires height information of the measurement object, The control unit corrects the position based on the second measurement light by stretching or shortening the position based on the first measurement light based on the projection angle of the first projection unit and the projection angle of the second projection unit to correspond to the position based on the first measurement light.

2. The measurement device according to claim 1 , wherein the imaging section, the first projection section, and the second projection section are configured to project the measurement light and capture an image while moving relatively to the measurement object.

3. The measurement device according to claim 1 or 2, wherein the control unit is configured to remove measurement light at a position where a position based on the first measurement light and a position based on the second measurement light do not overlap as reflected light noise.

4. The measurement device of claim 3, wherein the control unit is configured to correct a position based on the second measurement light by shifting the position based on the first measurement light to correspond to a position based on the first measurement light based on the first measurement light and the second measurement light projected at a reference height position.

5. a third projection unit disposed on the other side opposite to the one side with respect to the imaging unit, the third projection unit projecting a third measurement light onto the measurement object from a direction inclined at a third angle with respect to a horizontal direction; A fourth projection unit is disposed on the other side of the imaging unit and projects a fourth measurement light onto the measurement object from a direction inclined at a fourth angle different from the third angle with respect to the horizontal direction, The measuring device according to any one of claims 1 to 4, wherein the control unit is configured to remove reflected light noise based on the first measurement light, the second measurement light, the third measurement light and the fourth measurement light projected onto the measurement object imaged by the imaging unit, and to obtain height information of the measurement object.

6. The measuring device according to claim 5, wherein the control unit is configured to acquire a plurality of measurement heights based on the first measurement light, the second measurement light, the third measurement light and the fourth measurement light projected onto the measurement object imaged by the imaging unit, and to compare the acquired plurality of measurement heights to acquire one piece of height information of the measurement object.

7. The measurement device according to claim 5 or 6, wherein the control unit is configured to invert and correct positions based on the third measurement light and the fourth measurement light so as to correspond to a position based on the first measurement light.

8. a board holder for holding a board on which electronic components are mounted; a measurement unit that measures the substrate held by the substrate holder, The measurement unit includes: an imaging unit that images the substrate; a first projection unit that is disposed on one side of the imaging unit and projects a line-shaped first measurement light onto the substrate from a direction inclined at a first angle with respect to a horizontal direction; a second projection unit that is disposed on the one side of the imaging unit and projects a line-shaped second measurement light onto the substrate from a direction inclined at a second angle different from the first angle with respect to a horizontal direction; a control unit that removes reflected light noise based on the first measurement light and the second measurement light projected onto the substrate and captured by the imaging unit, and acquires height information of the substrate, A substrate inspection device, wherein the control unit corrects the position based on the second measurement light by stretching or shortening the position based on the first measurement light based on the projection angle of the first projection unit and the projection angle of the second projection unit so that the position based on the first measurement light corresponds to the position based on the first measurement light.

Images