Imaging device

Abstract

An imaging device according to an embodiment of the present disclosure is provided with: a first semiconductor substrate comprising a first substrate having a photoelectric conversion unit and a first transistor which constitute a sensor pixel; a second semiconductor substrate stacked on the first substrate and comprising a second substrate which includes a second transistor constituting a sensor pixel and has an opening penetrating through in a stacking direction; a through-wire passing through the opening and electrically connecting the first substrate and the second substrate; and an electrically conductive film provided at least between the second semiconductor substrate and the through-wire and connected to a fixed potential.

Description

[Technical field]

[0001] The present disclosure relates to an imaging device having a three-dimensional structure. [Background technology]

[0002] Conventionally, miniaturization of the area per pixel of a two-dimensional imaging device has been achieved by introducing a microprocess and improving the mounting density. In recent years, imaging devices with a three-dimensional structure have been developed to further miniaturize imaging devices and increase the density of pixels. In an imaging device with a three-dimensional structure, for example, a semiconductor substrate having a plurality of sensor pixels and a semiconductor substrate having a signal processing circuit for processing signals obtained by each sensor pixel are stacked on top of each other. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-245506 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, there is a demand for improved reliability in imaging devices with three-dimensional structures.

[0005] It is desirable to provide an imaging device that can improve reliability. [Means for solving the problem]

[0006] An imaging device according to an embodiment of the present disclosure includes a first substrate having a photoelectric conversion unit and a first transistor constituting a sensor pixel in a first semiconductor substrate, a second substrate stacked on the first substrate, having a second transistor constituting a sensor pixel in a second semiconductor substrate and having an opening penetrating in a stacking direction, a through-hole passing through the opening and electrically connecting the first substrate and the second substrate, and a conductive film provided at least between the second semiconductor substrate and the through-hole and connected to a fixed potential; The shortest distance between the conductive film and the second semiconductor substrate is smaller than the shortest distance between the conductive film and the through-hole wiring. It is something.

[0007] In an imaging device according to an embodiment of the present disclosure, a conductive film connected to a fixed potential is formed between the second semiconductor substrate and the through-hole wiring that passes through an opening in the second semiconductor substrate and electrically connects the first substrate and the second substrate, thereby reducing the effect of the electric field from the through-hole wiring on the transistors provided in the second substrate. [Brief description of the drawings]

[0008] [Figure 1] 1 is a block diagram illustrating an example of a functional configuration of an imaging device according to an embodiment of the present disclosure. [Diagram 2] 2 is a plan view showing a schematic configuration of the imaging device shown in FIG. [Diagram 3] FIG. 3 is a schematic diagram illustrating a cross-sectional configuration taken along line III-III′ shown in FIG. 2. [Figure 4] 2 is an equivalent circuit diagram of the pixel sharing unit shown in FIG. 1. [Diagram 5] 10 is a diagram illustrating an example of a connection mode between a plurality of pixel sharing units and a plurality of vertical signal lines. [Figure 6] 4 is a schematic cross-sectional view illustrating an example of a specific configuration of the imaging device illustrated in FIG. 3. [Figure 7A] 7 is a schematic diagram illustrating an example of a planar configuration of a main part of a first substrate illustrated in FIG. 6. [Figure 7B] 7B is a schematic diagram showing a planar configuration of a pad portion together with a main portion of the first substrate shown in FIG. 7A. [Figure 8] 7 is a schematic diagram illustrating an example of a planar configuration of a second substrate (semiconductor layer) illustrated in FIG. 6. FIG. [Figure 9] 7 is a schematic diagram illustrating an example of a planar configuration of a pixel circuit and a main part of a first substrate together with a first wiring layer illustrated in FIG. 6. [Figure 10] 7 is a schematic diagram illustrating an example of a planar configuration of a first wiring layer and a second wiring layer illustrated in FIG. 6. [Figure 11] 7 is a schematic diagram illustrating an example of a planar configuration of the second wiring layer and the third wiring layer illustrated in FIG. 6. [Figure 12] 7 is a schematic diagram illustrating an example of a planar configuration of a third wiring layer and a fourth wiring layer illustrated in FIG. 6. [Figure 13A] 2 is a schematic diagram illustrating a cross-sectional configuration of a main part of the imaging device illustrated in FIG. [Figure 13B] 13B is a schematic diagram showing a planar configuration in a horizontal direction relative to the main surface of the second substrate shown in FIG. 13A. FIG. [Figure 14] FIG. 13 is a diagram showing the Id-Vgs characteristics when a shield electrode is not provided. [Figure 15] FIG. 13 is a diagram showing Id-Vgs characteristics when a shield electrode is provided. [Figure 16] 4 is a schematic diagram for explaining a path of an input signal to the imaging device shown in FIG. 3. [Figure 17] 4 is a schematic diagram for explaining a signal path of a pixel signal in the imaging device shown in FIG. 3. [Figure 18A] 11 is a schematic diagram illustrating a cross-sectional configuration of a main part of an imaging device according to a first modified example of the present disclosure. FIG. [Figure 18B] 18B is a schematic diagram showing a plan configuration in a horizontal direction relative to the main surface of the second substrate shown in FIG. 18A. FIG. [Figure 19A] 11 is a schematic diagram illustrating a cross-sectional configuration of a main part of an imaging device according to a second modified example of the present disclosure. FIG. [Figure 19B] 19B is a schematic diagram showing a planar configuration in a horizontal direction relative to the main surface of the second substrate shown in FIG. 19A. FIG. [Figure 20A] 11 is a schematic diagram illustrating a cross-sectional configuration of a main part of an imaging device according to a third modified example of the present disclosure. FIG. [Figure 20B] 20B is a schematic diagram showing a planar configuration in a horizontal direction relative to the main surface of the second substrate shown in FIG. 20A. FIG. [Figure 21] 11 is a schematic diagram illustrating a cross-sectional configuration of a main part of an imaging device according to a second embodiment of the present disclosure. FIG. [Figure 22] 22 is a schematic diagram illustrating an example of a planar configuration in a horizontal direction relative to a main surface of a second substrate of the imaging device illustrated in FIG. 21. FIG. [Figure 23A] 22A to 22D are schematic cross-sectional views illustrating an example of a manufacturing process for the imaging device shown in FIG. 21. [Figure 23B] FIG. 23B is a schematic cross-sectional view showing a step subsequent to FIG. 23A. [Figure 23C] FIG. 23C is a schematic cross-sectional view showing a step subsequent to FIG. 23B. [Figure 24] 11 is a schematic diagram illustrating an example of a cross-sectional configuration of a main part of an imaging device according to a fourth modified example of the present disclosure. FIG. [Figure 25A] 25A to 25C are schematic cross-sectional views illustrating an example of a manufacturing process for the imaging device shown in FIG. 24. [Figure 25B] FIG. 25B is a schematic cross-sectional view showing a step subsequent to FIG. 25A. [Figure 25C] FIG. 25C is a schematic cross-sectional view showing a step subsequent to FIG. 25B. [Figure 26] 13 is a schematic diagram illustrating another example of a cross-sectional configuration of a main part of an imaging device according to Modification 4 of the present disclosure. FIG. [Figure 27] 9 is a schematic diagram illustrating a modified example of the planar configuration of the second substrate (semiconductor layer) shown in FIG. 8. FIG. [Figure 28] 28 is a schematic diagram showing a planar configuration of a first wiring layer and a main part of a first substrate together with the pixel circuit shown in FIG. 27. [Figure 29] 29 is a schematic diagram illustrating an example of a planar configuration of a second wiring layer together with the first wiring layer illustrated in FIG. 28. [Diagram 30] 30 is a schematic diagram illustrating an example of a planar configuration of a third wiring layer together with the second wiring layer illustrated in FIG. 29. [Diagram 31] 31 is a schematic diagram illustrating an example of a planar configuration of a fourth wiring layer together with the third wiring layer illustrated in FIG. 30. FIG. [Diagram 32] 7B is a schematic diagram illustrating a modified example of the planar configuration of the first substrate shown in FIG. 7A. [Diagram 33]33 is a schematic diagram illustrating an example of a planar configuration of a second substrate (semiconductor layer) laminated on the first substrate illustrated in FIG. 32. FIG. [Diagram 34] 34 is a schematic diagram illustrating an example of a planar configuration of a first wiring layer together with the pixel circuit illustrated in FIG. 33. [Diagram 35] 35 is a schematic diagram illustrating an example of a planar configuration of a second wiring layer together with the first wiring layer illustrated in FIG. 34. [Diagram 36] 36 is a schematic diagram illustrating an example of a planar configuration of a third wiring layer together with the second wiring layer illustrated in FIG. 35. FIG. [Figure 37] 37 is a schematic diagram illustrating an example of a planar configuration of a fourth wiring layer together with the third wiring layer illustrated in FIG. 36. [Figure 38] 21 is a schematic diagram illustrating another example of the planar configuration of the first substrate shown in FIG. 20. [Figure 39] 39 is a schematic diagram illustrating an example of a planar configuration of a second substrate (semiconductor layer) laminated on the first substrate illustrated in FIG. 38. FIG. [Diagram 40] 40 is a schematic diagram illustrating an example of a planar configuration of a first wiring layer together with the pixel circuit illustrated in FIG. 39. [Diagram 41] 41 is a schematic diagram illustrating an example of a planar configuration of a second wiring layer together with the first wiring layer illustrated in FIG. 40. FIG. [Diagram 42] 42 is a schematic diagram showing an example of a planar configuration of a third wiring layer together with the second wiring layer shown in FIG. 41. FIG. [Diagram 43] 43 is a schematic diagram showing an example of a planar configuration of a fourth wiring layer together with the third wiring layer shown in FIG. 42. [Diagram 44] 4 is a schematic cross-sectional view illustrating another example of the imaging device illustrated in FIG. 3. [Diagram 45] FIG. 45 is a schematic diagram for explaining a path of an input signal to the imaging device shown in FIG. 44. [Diagram 46] FIG. 45 is a schematic diagram for explaining a signal path of a pixel signal in the imaging device shown in FIG. 44. [Figure 47] 7 is a schematic cross-sectional view illustrating another example of the imaging device illustrated in FIG. 6. [Figure 48] 5 is a diagram illustrating another example of the equivalent circuit illustrated in FIG. [Figure 49] FIG. 7B is a schematic plan view illustrating another example of the pixel separating portion shown in FIG. 7A etc. [Figure 50] 23 is a cross-sectional view in the thickness direction showing an example configuration of an imaging device according to a twelfth modification of the present disclosure. FIG. [Figure 51] 23 is a cross-sectional view in the thickness direction showing an example configuration of an imaging device according to a twelfth modification of the present disclosure. FIG. [Figure 52] 23 is a cross-sectional view in the thickness direction showing an example configuration of an imaging device according to a twelfth modification of the present disclosure. FIG. [Figure 53] FIG. 23 is a horizontal cross-sectional view showing an example layout of a plurality of pixel units according to a twelfth modification of the present disclosure. [Figure 54] FIG. 23 is a horizontal cross-sectional view showing an example layout of a plurality of pixel units according to a twelfth modification of the present disclosure. [Figure 55] FIG. 23 is a horizontal cross-sectional view showing an example layout of a plurality of pixel units according to a twelfth modification of the present disclosure. [Figure 56] 13 is a cross-sectional view in the thickness direction showing a configuration example of an imaging device in which Modification Example 3 and Modification Example 12 of the present disclosure are combined. [Figure 57] 57 is a schematic diagram showing a planar configuration in a horizontal direction relative to the main surface of the second substrate shown in FIG. 56. FIG. [Figure 58] FIG. 1 is a diagram illustrating an example of a schematic configuration of an imaging system including an imaging device according to the above embodiment and its modified example. [Figure 59] 59 is a diagram showing an example of an imaging procedure of the imaging system shown in FIG. 58. [Figure 60] 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; [Figure 61] 4 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit; FIG. [Figure 62] 1 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system. [Figure 63] 2 is a block diagram showing an example of a functional configuration of a camera head and a CCU. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. The following description is a specific example of the present disclosure, and the present disclosure is not limited to the following aspect. Furthermore, the present disclosure is not limited to the arrangement, dimensions, dimensional ratios, etc. of each component shown in each drawing. The order of description is as follows. 1. First embodiment (an imaging device having a stacked structure of three substrates and having a shield electrode between a second semiconductor substrate and a through-hole wiring) 2. Variations 2-1. Modification 1 (Example in which the shield electrode extends to the first semiconductor substrate) 2-2. Modification 2 (Example of providing a shield electrode around the through-hole wiring) 2-3. Modification 3 (Example in which a part of the shield electrode around the through-wiring contacts the VSS contact of the second substrate) 3. Second embodiment (example in which a shielding film is provided around the second semiconductor substrate) 4. Modification 4 (Example in which the shielding film and the through wiring are connected on the bonding surface side between the first substrate and the second substrate) 5. Modification 5 (Planar Configuration Example 1) 6. Modification 6 (Planar Configuration Example 2) 7. Modification 7 (Planar Configuration Example 3) 8. Modification 8 (Example in which a contact portion between substrates is provided in the center of the pixel array portion) 9. Modification 9 (Example having planar type transfer transistor) 10. Modification 10 (Example in which one pixel is connected to one pixel circuit) 11. Modification 11 (Example of the configuration of the pixel separation unit) 12. Modification 12 (Example in which one well contact is provided for each of a plurality of sensor pixels) 13. Application examples (imaging systems) 14. Application Examples

[0010] <1. First embodiment> [Functional configuration of imaging device] FIG. 1 is a block diagram showing an example of a functional configuration of an imaging device (imaging device 1) according to an embodiment of the present disclosure.

[0011] The imaging device 1 in FIG. 1 includes, for example, an input section 510A, a row driver section 520, a timing control section 530, a pixel array section 540, a column signal processing section 550, an image signal processing section 560, and an output section 510B.

[0012] In the pixel array section 540, pixels 541 are repeatedly arranged in an array. More specifically, a pixel sharing unit 539 including a plurality of pixels is a repeating unit, and this is repeatedly arranged in an array having a row direction and a column direction. In this specification, for convenience, the row direction may be called the H direction, and the column direction perpendicular to the row direction may be called the V direction. In the example of FIG. 1, one pixel sharing unit 539 includes four pixels (pixels 541A, 541B, 541C, and 541D). Each of the pixels 541A, 541B, 541C, and 541D has a photodiode PD (illustrated in FIG. 6, etc., described later). The pixel sharing unit 539 is a unit that shares one pixel circuit (pixel circuit 210 in FIG. 3, described later). In other words, one pixel circuit (pixel circuit 210, described later) is included for every four pixels (pixels 541A, 541B, 541C, and 541D). By operating this pixel circuit in a time-division manner, pixel signals of the pixels 541A, 541B, 541C, and 541D are sequentially read out. The pixels 541A, 541B, 541C, and 541D are arranged in, for example, 2 rows and 2 columns. In the pixel array section 540, a plurality of row driving signal lines 542 and a plurality of vertical signal lines (column readout lines) 543 are provided in addition to the pixels 541A, 541B, 541C, and 541D. The row driving signal line 542 drives the pixels 541 included in each of a plurality of pixel sharing units 539 arranged in a row direction in the pixel array section 540. The row driving signal line 542 drives each pixel arranged in a row direction among the pixel sharing units 539. As will be described in detail later with reference to FIG. 4, the pixel sharing unit 539 is provided with a plurality of transistors. In order to drive each of these transistors, a plurality of row driving signal lines 542 are connected to one pixel sharing unit 539. The pixel sharing unit 539 is connected to the vertical signal line (column readout line) 543. Pixel signals are read out via the vertical signal line (column readout line) 543 from each of the pixels 541A, 541B, 541C, and 541D included in the pixel sharing unit 539.

[0013] The row driving unit 520 includes, for example, a row address control unit that determines the position of the row for driving the pixels, in other words, a row decoder unit, and a row driving circuit unit that generates signals for driving the pixels 541A, 541B, 541C, and 541D.

[0014] The column signal processing unit 550 includes, for example, a load circuit unit that is connected to the vertical signal line 543 and forms a source follower circuit together with the pixels 541A, 541B, 541C, and 541D (pixel sharing units 539). The column signal processing unit 550 may include an amplifier circuit unit that amplifies a signal read out from the pixel sharing unit 539 via the vertical signal line 543. The column signal processing unit 550 may include a noise processing unit. In the noise processing unit, for example, a system noise level is removed from the signal read out from the pixel sharing unit 539 as a result of photoelectric conversion.

[0015] The column signal processing unit 550 has, for example, an analog-to-digital converter (ADC). In the analog-to-digital converter, the signal read from the pixel sharing unit 539 or the analog signal that has been subjected to the noise processing is converted into a digital signal. The ADC includes, for example, a comparator unit and a counter unit. In the comparator unit, the analog signal to be converted is compared with a reference signal to be compared therewith. In the counter unit, the time until the comparison result in the comparator unit is inverted is measured. The column signal processing unit 550 may include a horizontal scanning circuit unit that controls scanning of the readout column.

[0016] The timing control section 530 supplies signals for controlling timing to the row driving section 520 and the column signal processing section 550 based on a reference clock signal and a timing control signal input to the device.

[0017] The image signal processing unit 560 is a circuit that performs various signal processing on data obtained as a result of photoelectric conversion, in other words, data obtained as a result of the imaging operation in the imaging device 1. The image signal processing unit 560 includes, for example, an image signal processing circuit unit and a data holding unit. The image signal processing unit 560 may also include a processor unit.

[0018] One example of signal processing executed by the image signal processing unit 560 is a tone curve correction process that imparts more gradation to the AD converted imaging data when the data is of a dark subject, and reduces the gradation when the data is of a bright subject. In this case, it is desirable to store in advance in the data storage unit of the image signal processing unit 560 characteristic data of the tone curve based on which the gradation of the imaging data is to be corrected.

[0019] The input section 510A is for inputting, for example, the above-mentioned reference clock signal, timing control signal, characteristic data, and the like from outside the device to the imaging device 1. The timing control signal is, for example, a vertical synchronization signal and a horizontal synchronization signal. The characteristic data is, for example, for storage in a data holding section of the image signal processing section 560. The input section 510A includes, for example, an input terminal 511, an input circuit section 512, an input amplitude changing section 513, an input data conversion circuit section 514, and a power supply section (not shown).

[0020] The input terminal 511 is an external terminal for inputting data. The input circuit unit 512 is for taking in the signal input to the input terminal 511 into the inside of the imaging device 1. The input amplitude change unit 513 changes the amplitude of the signal taken in by the input circuit unit 512 to an amplitude that is easily used inside the imaging device 1. The input data conversion circuit unit 514 changes the arrangement of the data string of the input data. The input data conversion circuit unit 514 is composed of, for example, a serial-parallel conversion circuit. In this serial-parallel conversion circuit, a serial signal received as input data is converted into a parallel signal. Note that, in the input unit 510A, the input amplitude change unit 513 and the input data conversion circuit unit 514 may be omitted. The power supply unit supplies power set to various voltages required inside the imaging device 1 based on a power source supplied from the outside to the imaging device 1.

[0021] When the imaging device 1 is connected to an external memory device, the input unit 510A may be provided with a memory interface circuit that receives data from the external memory device. The external memory device may be, for example, a flash memory, an SRAM, or a DRAM.

[0022] The output unit 510B outputs image data to the outside of the device. This image data is, for example, image data captured by the imaging device 1 and image data signal-processed by the image signal processing unit 560. The output unit 510B includes, for example, an output data conversion circuit unit 515, an output amplitude change unit 516, an output circuit unit 517, and an output terminal 518.

[0023] The output data conversion circuit unit 515 is configured, for example, by a parallel-serial conversion circuit, and the output data conversion circuit unit 515 converts the parallel signal used inside the imaging device 1 into a serial signal. The output amplitude change unit 516 changes the amplitude of the signal used inside the imaging device 1. The signal with the changed amplitude can be easily used by an external device connected to the outside of the imaging device 1. The output circuit unit 517 is a circuit that outputs data from inside the imaging device 1 to the outside of the device, and the output circuit unit 517 drives a wiring outside the imaging device 1 connected to an output terminal 518. The output terminal 518 outputs data from the imaging device 1 to the outside of the device. In the output unit 510B, the output data conversion circuit unit 515 and the output amplitude change unit 516 may be omitted.

[0024] When the imaging device 1 is connected to an external memory device, the output unit 510B may be provided with a memory interface circuit that outputs data to the external memory device. The external memory device may be, for example, a flash memory, an SRAM, or a DRAM.

[0025] [Schematic configuration of imaging device 1] 2 and 3 show an example of a schematic configuration of the imaging device 1. The imaging device 1 includes three substrates (a first substrate 100, a second substrate 200, and a third substrate 300). FIG. 2 shows a schematic planar configuration of each of the first substrate 100, the second substrate 200, and the third substrate 300, and FIG. 3 shows a schematic cross-sectional configuration of the first substrate 100, the second substrate 200, and the third substrate 300 stacked on top of each other. FIG. 3 corresponds to the cross-sectional configuration along line III-III' shown in FIG. 2. The imaging device 1 is a three-dimensional imaging device formed by bonding three substrates (the first substrate 100, the second substrate 200, and the third substrate 300). The first substrate 100 includes a semiconductor layer 100S and a wiring layer 100T. The second substrate 200 includes a semiconductor layer 200S and a wiring layer 200T. The third substrate 300 includes a semiconductor layer 300S and a wiring layer 300T. Here, the combination of the wiring included in each of the first substrate 100, the second substrate 200, and the third substrate 300 and the interlayer insulating film around it is called the wiring layer (100T, 200T, 300T) provided on each substrate (the first substrate 100, the second substrate 200, and the third substrate 300) for convenience. The first substrate 100, the second substrate 200, and the third substrate 300 are stacked in this order, and the semiconductor layer 100S, the wiring layer 100T, the semiconductor layer 200S, the wiring layer 200T, the wiring layer 300T, and the semiconductor layer 300S are arranged in this order along the stacking direction. The specific configurations of the first substrate 100, the second substrate 200, and the third substrate 300 will be described later. The arrow shown in FIG. 3 indicates the incident direction of the light L to the imaging device 1. In this specification, for convenience, in the following cross-sectional views, the light incident side of the imaging device 1 may be referred to as "bottom", "lower side", or "downward", and the side opposite the light incident side may be referred to as "upper side", "upper side", or "upper". Also, in this specification, for convenience, with respect to a substrate having a semiconductor layer and a wiring layer, the wiring layer side may be referred to as the front side, and the semiconductor layer side may be referred to as the back side. Note that the description in the specification is not limited to the above names. The imaging device 1 is, for example, a back-illuminated imaging device in which light is incident from the back side of the first substrate 100 having a photodiode.

[0026] The pixel array section 540 and the pixel sharing unit 539 included in the pixel array section 540 are both configured using both the first substrate 100 and the second substrate 200. The first substrate 100 is provided with a plurality of pixels 541A, 541B, 541C, and 541D that the pixel sharing unit 539 has. Each of these pixels 541 has a photodiode (a photodiode PD described later) and a transfer transistor (a transfer transistor TR described later). The second substrate 200 is provided with a pixel circuit (a pixel circuit 210 described later) that the pixel sharing unit 539 has. The pixel circuit reads out pixel signals transferred from the photodiodes of the pixels 541A, 541B, 541C, and 541D via the transfer transistors, or resets the photodiodes. In addition to such pixel circuits, the second substrate 200 has a plurality of row driving signal lines 542 extending in the row direction and a plurality of vertical signal lines 543 extending in the column direction. The second substrate 200 further has a power supply line 544 (such as a power supply line VDD described later) extending in the row direction. The third substrate 300 has, for example, an input section 510A, a row driver 520, a timing control section 530, a column signal processing section 550, an image signal processing section 560, and an output section 510B. The row driver 520 is provided, for example, in a region where a part of the row driver 520 overlaps with the pixel array section 540 in the stacking direction (hereinafter simply referred to as the stacking direction) of the first substrate 100, the second substrate 200, and the third substrate 300. More specifically, the row driver 520 is provided in a region where the row driver 520 overlaps with the vicinity of an end of the pixel array section 540 in the H direction in the stacking direction (FIG. 2). The column signal processing section 550 is provided, for example, in a region where a part of the row driver 520 overlaps with the pixel array section 540 in the stacking direction. More specifically, the column signal processing section 550 is provided in a region overlapping the vicinity of an end portion in the V direction of the pixel array section 540 in the stacking direction (FIG. 2). Although not shown, the input section 510A and the output section 510B may be provided in a portion other than the third substrate 300, for example, on the second substrate 200. Alternatively, the input section 510A and the output section 510B may be provided on the back surface (light incident surface) side of the first substrate 100.The pixel circuits provided on the second substrate 200 may also be called pixel transistor circuits, pixel transistor groups, pixel transistors, pixel readout circuits, or readout circuits. In this specification, the term pixel circuits is used.

[0027] The first substrate 100 and the second substrate 200 are electrically connected by, for example, through electrodes (through electrodes 120E, 121E in FIG. 6 described later). The second substrate 200 and the third substrate 300 are electrically connected by, for example, contact portions 201, 202, 301, 302. The second substrate 200 is provided with contact portions 201, 202, and the third substrate 300 is provided with contact portions 301, 302. The contact portion 201 of the second substrate 200 contacts the contact portion 301 of the third substrate 300, and the contact portion 202 of the second substrate 200 contacts the contact portion 302 of the third substrate 300. The second substrate 200 has a contact region 201R in which a plurality of contact portions 201 are provided, and a contact region 202R in which a plurality of contact portions 202 are provided. The third substrate 300 has a contact region 301R in which a plurality of contact parts 301 are provided, and a contact region 302R in which a plurality of contact parts 302 are provided. The contact regions 201R, 301R are provided between the pixel array section 540 and the row driver section 520 in the stacking direction (FIG. 3). In other words, the contact regions 201R, 301R are provided, for example, in a region where the row driver section 520 (third substrate 300) and the pixel array section 540 (second substrate 200) overlap in the stacking direction, or in a region adjacent thereto. The contact regions 201R, 301R are disposed, for example, at the end in the H direction of such a region (FIG. 2). In the third substrate 300, for example, the contact region 301R is provided at a position overlapping a part of the row driver section 520, specifically, the end in the H direction of the row driver section 520 (FIGS. 2 and 3). The contact sections 201 and 301 connect, for example, the row driving section 520 provided on the third substrate 300 and the row driving signal line 542 provided on the second substrate 200. The contact sections 201 and 301 may connect, for example, the input section 510A provided on the third substrate 300 to a power supply line 544 and a reference potential line (a reference potential line VSS described later). The contact regions 202R and 302R are provided between the pixel array section 540 and the column signal processing section 550 in the stacking direction (FIG. 3).In other words, the contact regions 202R and 302R are provided in, for example, a region where the column signal processing section 550 (the third substrate 300) and the pixel array section 540 (the second substrate 200) overlap in the stacking direction, or in a region adjacent thereto. The contact regions 202R and 302R are arranged, for example, at the end in the V direction of such a region (FIG. 2). In the third substrate 300, for example, the contact region 301R is provided in a position overlapping a part of the column signal processing section 550, specifically, an end in the V direction of the column signal processing section 550 (FIGS. 2 and 3). The contact sections 202 and 302 are for connecting pixel signals (signals corresponding to the amount of charge generated as a result of photoelectric conversion in the photodiodes) output from each of the multiple pixel sharing units 539 of the pixel array section 540 to the column signal processing section 550 provided on the third substrate 300. The pixel signals are sent from the second substrate 200 to the third substrate 300.

[0028] FIG. 3 is an example of a cross-sectional view of the imaging device 1 as described above. The first substrate 100, the second substrate 200, and the third substrate 300 are electrically connected via wiring layers 100T, 200T, and 300T. For example, the imaging device 1 has an electrical connection portion that electrically connects the second substrate 200 and the third substrate 300. Specifically, the contact portions 201, 202, 301, and 302 are formed with electrodes formed of a conductive material. The conductive material is formed of a metal material such as copper (Cu), aluminum (Al), and gold (Au). The contact regions 201R, 202R, 301R, and 302R electrically connect the second substrate and the third substrate by directly joining wiring formed as electrodes, for example, to each other, thereby enabling input and / or output of signals between the second substrate 200 and the third substrate 300.

[0029] The electrical connection portion that electrically connects the second substrate 200 and the third substrate 300 can be provided at a desired location. For example, as described as the contact regions 201R, 202R, 301R, and 302R in FIG. 3, the electrical connection portion may be provided in a region that overlaps with the pixel array section 540 in the stacking direction. The electrical connection portion may also be provided in a region that does not overlap with the pixel array section 540 in the stacking direction. Specifically, the electrical connection portion may be provided in a region that overlaps with a peripheral portion disposed outside the pixel array section 540 in the stacking direction.

[0030] The first substrate 100 and the second substrate 200 are provided with, for example, connection holes H1 and H2. The connection holes H1 and H2 penetrate the first substrate 100 and the second substrate 200 (FIG. 3). The connection holes H1 and H2 are provided outside the pixel array section 540 (or a portion overlapping the pixel array section 540) (FIG. 2). For example, the connection hole H1 is disposed outside the pixel array section 540 in the H direction, and the connection hole H2 is disposed outside the pixel array section 540 in the V direction. For example, the connection hole H1 reaches the input section 510A provided on the third substrate 300, and the connection hole H2 reaches the output section 510B provided on the third substrate 300. The connection holes H1 and H2 may be hollow or may contain a conductive material at least in part. For example, there is a configuration in which a bonding wire is connected to an electrode formed as the input section 510A and / or the output section 510B. Alternatively, there is a configuration in which an electrode formed as the input section 510A and / or the output section 510B is connected to a conductive material provided in the connection holes H1, H2. The conductive material provided in the connection holes H1, H2 may be embedded in a part or all of the connection holes H1, H2, or the conductive material may be formed on the side walls of the connection holes H1, H2.

[0031] 3 shows a structure in which the input unit 510A and the output unit 510B are provided on the third substrate 300, but the present invention is not limited to this. For example, the input unit 510A and / or the output unit 510B can be provided on the second substrate 200 by sending a signal of the third substrate 300 to the second substrate 200 via the wiring layers 200T and 300T. Similarly, the input unit 510A and / or the output unit 510B can be provided on the first substrate 100 by sending a signal of the second substrate 200 to the first substrate 100 via the wiring layers 100T and 200T.

[0032] 4 is an equivalent circuit diagram showing an example of the configuration of the pixel-shared unit 539. The pixel-shared unit 539 includes a plurality of pixels 541 (four pixels 541, 541A, 541B, 541C, and 541D, are shown in FIG. 4), one pixel circuit 210 connected to the plurality of pixels 541, and a vertical signal line 543 connected to the pixel circuit 210. The pixel circuit 210 includes, for example, four transistors, specifically, an amplification transistor AMP, a selection transistor SEL, a reset transistor RST, and an FD conversion gain switching transistor FDG. As described above, the pixel-shared unit 539 is configured to sequentially output pixel signals of the four pixels 541 (pixels 541A, 541B, 541C, and 541D) included in the pixel-shared unit 539 to the vertical signal line 543 by operating one pixel circuit 210 in a time-division manner. A state in which one pixel circuit 210 is connected to multiple pixels 541 and the pixel signals of the multiple pixels 541 are output in a time-division manner by the single pixel circuit 210 is said to be "multiple pixels 541 sharing one pixel circuit 210."

[0033] The pixels 541A, 541B, 541C, and 541D have components in common with each other. Hereinafter, in order to distinguish the components of the pixels 541A, 541B, 541C, and 541D from each other, the identification number 1 is added to the end of the reference numeral of the component of the pixel 541A, the identification number 2 is added to the end of the reference numeral of the component of the pixel 541B, the identification number 3 is added to the end of the reference numeral of the component of the pixel 541C, and the identification number 4 is added to the end of the reference numeral of the component of the pixel 541D. When it is not necessary to distinguish the components of the pixels 541A, 541B, 541C, and 541D from each other, the identification numbers at the end of the reference numerals of the components of the pixels 541A, 541B, 541C, and 541D are omitted.

[0034] The pixels 541A, 541B, 541C, and 541D each have, for example, a photodiode PD, a transfer transistor TR electrically connected to the photodiode PD, and a floating diffusion FD electrically connected to the transfer transistor TR. In the photodiodes PD (PD1, PD2, PD3, and PD4), the cathode is electrically connected to the source of the transfer transistor TR, and the anode is electrically connected to a reference potential line (for example, ground). The photodiode PD photoelectrically converts incident light and generates a charge according to the amount of light received. The transfer transistors TR (transfer transistors TR1, TR2, TR3, and TR4) are, for example, n-type CMOS (Complementary Metal Oxide Semiconductor) transistors. In the transfer transistor TR, the drain is electrically connected to the floating diffusion FD, and the gate is electrically connected to a drive signal line. This drive signal line is a part of a plurality of row drive signal lines 542 (see FIG. 1) connected to one pixel sharing unit 539. The transfer transistor TR transfers the charge generated in the photodiode PD to the floating diffusion FD. The floating diffusion FD (floating diffusions FD1, FD2, FD3, FD4) is an n-type diffusion layer region formed in a p-type semiconductor layer. The floating diffusion FD is a charge holding means that temporarily holds the charge transferred from the photodiode PD, and is also a charge-voltage conversion means that generates a voltage according to the amount of charge.

[0035] The four floating diffusions FD (floating diffusions FD1, FD2, FD3, and FD4) included in one pixel shared unit 539 are electrically connected to each other and to the gate of the amplification transistor AMP and the source of the FD conversion gain switching transistor FDG. The drain of the FD conversion gain switching transistor FDG is connected to the source of the reset transistor RST, and the gate of the FD conversion gain switching transistor FDG is connected to a drive signal line. This drive signal line is a part of a plurality of row drive signal lines 542 connected to one pixel shared unit 539. The drain of the reset transistor RST is connected to a power supply line VDD, and the gate of the reset transistor RST is connected to the drive signal line. This drive signal line is a part of a plurality of row drive signal lines 542 connected to one pixel shared unit 539. The gate of the amplification transistor AMP is connected to the floating diffusion FD, the drain of the amplification transistor AMP is connected to the power supply line VDD, and the source of the amplification transistor AMP is connected to the drain of the selection transistor SEL. The source of the selection transistor SEL is connected to a vertical signal line 543, and the gate of the selection transistor SEL is connected to the drive signal line. This drive signal line is part of a plurality of row drive signal lines 542 connected to one pixel sharing unit 539 .

[0036] When the transfer transistor TR is turned on, the transfer transistor TR transfers the charge of the photodiode PD to the floating diffusion FD. The gate (transfer gate TG) of the transfer transistor TR includes, for example, a so-called vertical electrode, and is provided extending from the surface of the semiconductor layer (semiconductor layer 100S in FIG. 6 described later) to a depth reaching the PD, as shown in FIG. 6 described later. The reset transistor RST resets the potential of the floating diffusion FD to a predetermined potential. When the reset transistor RST is turned on, the potential of the floating diffusion FD is reset to the potential of the power supply line VDD. The selection transistor SEL controls the output timing of the pixel signal from the pixel circuit 210. The amplification transistor AMP generates, as the pixel signal, a signal of a voltage according to the level of the charge held in the floating diffusion FD. The amplification transistor AMP is connected to the vertical signal line 543 via the selection transistor SEL. In the column signal processing unit 550, the amplification transistor AMP configures a source follower together with a load circuit unit (see FIG. 1) connected to the vertical signal line 543. When the selection transistor SEL is turned on, the amplification transistor AMP outputs the voltage of the floating diffusion FD to the column signal processing unit 550 via the vertical signal line 543. The reset transistor RST, the amplification transistor AMP, and the selection transistor SEL are, for example, N-type CMOS transistors.

[0037] The FD conversion gain switching transistor FDG is used to change the gain of the charge-voltage conversion in the floating diffusion FD. In general, the pixel signal is small when shooting in a dark place. Based on Q=CV, when performing charge-voltage conversion, if the capacitance (FD capacitance C) of the floating diffusion FD is large, V when converted to voltage by the amplification transistor AMP will be small. On the other hand, in a bright place, the pixel signal becomes large, so if the FD capacitance C is not large, the floating diffusion FD cannot receive the charge of the photodiode PD. Furthermore, the FD capacitance C needs to be large so that V when converted to voltage by the amplification transistor AMP does not become too large (in other words, so that it becomes small). In consideration of this, when the FD conversion gain switching transistor FDG is turned on, the gate capacitance of the FD conversion gain switching transistor FDG increases, so the overall FD capacitance C becomes large. On the other hand, when the FD conversion gain switching transistor FDG is turned off, the overall FD capacitance C becomes small. In this way, by switching the FD conversion gain switching transistor FDG on and off, the FD capacitance C can be made variable and the conversion efficiency can be switched. The FD conversion gain switching transistor FDG is, for example, an N-type CMOS transistor.

[0038] It is also possible to configure the pixel circuit 210 without providing the FD conversion gain switching transistor FDG. In this case, for example, the pixel circuit 210 is composed of three transistors, for example, an amplification transistor AMP, a selection transistor SEL, and a reset transistor RST. The pixel circuit 210 has at least one pixel transistor, for example, an amplification transistor AMP, a selection transistor SEL, a reset transistor RST, and an FD conversion gain switching transistor FDG.

[0039] The selection transistor SEL may be provided between the power supply line VDD and the amplification transistor AMP. In this case, the drain of the reset transistor RST is electrically connected to the power supply line VDD and the drain of the selection transistor SEL. The source of the selection transistor SEL is electrically connected to the drain of the amplification transistor AMP, and the gate of the selection transistor SEL is electrically connected to the row drive signal line 542 (see FIG. 1). The source of the amplification transistor AMP (the output terminal of the pixel circuit 210) is electrically connected to the vertical signal line 543, and the gate of the amplification transistor AMP is electrically connected to the source of the reset transistor RST. Although not shown in the figure, the number of pixels 541 sharing one pixel circuit 210 may be other than four. For example, two or eight pixels 541 may share one pixel circuit 210.

[0040] FIG. 5 shows an example of a connection between a plurality of pixel sharing units 539 and a vertical signal line 543. For example, four pixel sharing units 539 arranged in a column direction are divided into four groups, and a vertical signal line 543 is connected to each of the four groups. For the sake of simplicity, FIG. 5 shows an example in which each of the four groups has one pixel sharing unit 539, but each of the four groups may include a plurality of pixel sharing units 539. In this way, in the imaging device 1, a plurality of pixel sharing units 539 arranged in a column direction may be divided into groups including one or more pixel sharing units 539. For example, a vertical signal line 543 and a column signal processing unit 550 are connected to each of the groups, so that pixel signals can be read out simultaneously from each group. Alternatively, in the imaging device 1, one vertical signal line 543 may be connected to a plurality of pixel sharing units 539 arranged in a column direction. In this case, pixel signals are read out sequentially in a time-division manner from the plurality of pixel sharing units 539 connected to one vertical signal line 543.

[0041] [Specific configuration of imaging device 1] FIG. 6 shows an example of a cross-sectional configuration perpendicular to the main surfaces of the first substrate 100, the second substrate 200, and the third substrate 300 of the imaging device 1. FIG. 6 is a schematic representation for easy understanding of the positional relationship of the components, and may differ from the actual cross section. In the imaging device 1, the first substrate 100, the second substrate 200, and the third substrate 300 are stacked in this order. The imaging device 1 further has a light receiving lens 401 on the back side (light incident surface side) of the first substrate 100. A color filter layer (not shown) may be provided between the light receiving lens 401 and the first substrate 100. The light receiving lens 401 is provided, for example, for each of the pixels 541A, 541B, 541C, and 541D. The imaging device 1 is, for example, a back-illuminated imaging device. The imaging device 1 has a pixel array section 540 arranged in the center and a peripheral section 540B arranged outside the pixel array section 540.

[0042] The first substrate 100 has, in order from the light receiving lens 401 side, an insulating film 111, a fixed charge film 112, a semiconductor layer 100S, and a wiring layer 100T. The semiconductor layer 100S is made of, for example, a silicon substrate. The semiconductor layer 100S has, for example, a p-well layer 115 in a part of the surface (the surface on the wiring layer 100T side) and in the vicinity thereof, and has an n-type semiconductor region 114 in the other region (region deeper than the p-well layer 115). For example, the n-type semiconductor region 114 and the p-well layer 115 form a pn junction type photodiode PD. The p-well layer 115 is a p-type semiconductor region.

[0043] Fig. 7A shows an example of a planar configuration of the first substrate 100. Fig. 7A mainly shows the planar configuration of the pixel separation portion 117, the photodiode PD, the floating diffusion FD, the VSS contact region 118, and the transfer transistor TR of the first substrate 100. The configuration of the first substrate 100 will be described using Fig. 7A together with Fig. 6.

[0044] A floating diffusion FD and a VSS contact region 118 are provided near the surface of the semiconductor layer 100S. The floating diffusion FD is composed of an n-type semiconductor region provided in the p-well layer 115. The floating diffusions FD (floating diffusions FD1, FD2, FD3, FD4) of the pixels 541A, 541B, 541C, and 541D are provided close to each other in the center of the pixel sharing unit 539 (FIG. 7A), for example. Although details will be described later, the four floating diffusions (floating diffusions FD1, FD2, FD3, FD4) included in this pixel sharing unit 539 are electrically connected to each other via electrical connection means (pad section 120 described later) in the first substrate 100 (more specifically, in the wiring layer 100T). Furthermore, the floating diffusion FD is connected from the first substrate 100 to the second substrate 200 (more specifically, from the wiring layer 100T to the wiring layer 200T) via an electrical means (a through electrode 120E described below). In the second substrate 200 (more specifically, inside the wiring layer 200T), the floating diffusion FD is electrically connected to the gate of the amplification transistor AMP and the source of the FD conversion gain switching transistor FDG by this electrical means.

[0045] The VSS contact region 118 is a region electrically connected to the reference potential line VSS, and is arranged apart from the floating diffusion FD. For example, in the pixels 541A, 541B, 541C, and 541D, the floating diffusion FD is arranged at one end of each pixel in the V direction, and the VSS contact region 118 is arranged at the other end (FIG. 7A). The VSS contact region 118 is, for example, composed of a p-type semiconductor region. The VSS contact region 118 is connected to, for example, a ground potential or a fixed potential. This allows a reference potential to be supplied to the semiconductor layer 100S.

[0046] The first substrate 100 is provided with a transfer transistor TR together with a photodiode PD, a floating diffusion FD, and a VSS contact region 118. The photodiode PD, the floating diffusion FD, the VSS contact region 118, and the transfer transistor TR are provided in each of the pixels 541A, 541B, 541C, and 541D. The transfer transistor TR is provided on the front surface side (the side opposite to the light incident surface side, the second substrate 200 side) of the semiconductor layer 100S. The transfer transistor TR has a transfer gate TG. The transfer gate TG includes, for example, a horizontal portion TGb facing the front surface of the semiconductor layer 100S and a vertical portion TGa provided in the semiconductor layer 100S. The vertical portion TGa extends in the thickness direction of the semiconductor layer 100S. One end of the vertical portion TGa is in contact with the horizontal portion TGb, and the other end is provided in the n-type semiconductor region 114. By configuring the transfer transistor TR with such a vertical transistor, transfer failure of pixel signals is less likely to occur, and the readout efficiency of pixel signals can be improved.

[0047] The horizontal part TGb of the transfer gate TG extends from a position facing the vertical part TGa toward, for example, the center of the pixel sharing unit 539 in the H direction (FIG. 7A). This allows the H direction position of the through electrode (through electrode TGV described below) that reaches the transfer gate TG to be closer to the H direction positions of the through electrodes (through electrodes 120E and 121E described below) connected to the floating diffusion FD and the VSS contact region 118. For example, the multiple pixel sharing units 539 provided on the first substrate 100 have the same configuration (FIG. 7A).

[0048] The semiconductor layer 100S is provided with a pixel separator 117 that separates the pixels 541A, 541B, 541C, and 541D from one another. The pixel separator 117 is formed extending in a normal direction (perpendicular to the surface of the semiconductor layer 100S) of the semiconductor layer 100S. The pixel separator 117 is provided to separate the pixels 541A, 541B, 541C, and 541D from one another, and has, for example, a lattice-like planar shape (FIGS. 7A and 7B). The pixel separator 117 electrically and optically separates the pixels 541A, 541B, 541C, and 541D from one another, for example. The pixel separator 117 includes, for example, a light-shielding film 117A and an insulating film 117B. The light-shielding film 117A is made of, for example, tungsten (W) or the like. The insulating film 117B is provided between the light shielding film 117A and the p-well layer 115 or the n-type semiconductor region 114. The insulating film 117B is made of, for example, silicon oxide (SiO). The pixel separator 117 has, for example, a full trench isolation (FTI) structure and penetrates the semiconductor layer 100S. Although not shown, the pixel separator 117 is not limited to an FTI structure that penetrates the semiconductor layer 100S. For example, it may have a deep trench isolation (DTI) structure that does not penetrate the semiconductor layer 100S. The pixel separator 117 extends in the normal direction of the semiconductor layer 100S and is formed in a partial region of the semiconductor layer 100S.

[0049] The semiconductor layer 100S is provided with, for example, a first pinning region 113 and a second pinning region 116. The first pinning region 113 is provided near the back surface of the semiconductor layer 100S, and is disposed between the n-type semiconductor region 114 and the fixed charge film 112. The second pinning region 116 is provided on a side surface of the pixel separating section 117, specifically, between the pixel separating section 117 and the p-well layer 115 or the n-type semiconductor region 114. The first pinning region 113 and the second pinning region 116 are formed of, for example, a p-type semiconductor region.

[0050] A fixed charge film 112 having a negative fixed charge is provided between the semiconductor layer 100S and the insulating film 111. A first pinning region 113 of the hole accumulation layer is formed at the interface on the light-receiving surface (rear surface) side of the semiconductor layer 100S due to an electric field induced by the fixed charge film 112. This suppresses the generation of dark current due to the interface state on the light-receiving surface side of the semiconductor layer 100S. The fixed charge film 112 is formed, for example, of an insulating film having a negative fixed charge. Examples of materials for the insulating film having a negative fixed charge include hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide.

[0051] A light-shielding film 117A is provided between the fixed charge film 112 and the insulating film 111. This light-shielding film 117A may be provided continuously with the light-shielding film 117A constituting the pixel separating section 117. The light-shielding film 117A between the fixed charge film 112 and the insulating film 111 is selectively provided, for example, at a position facing the pixel separating section 117 in the semiconductor layer 100S. The insulating film 111 is provided so as to cover this light-shielding film 117A. The insulating film 111 is made of, for example, silicon oxide.

[0052] The wiring layer 100T provided between the semiconductor layer 100S and the second substrate 200 has an interlayer insulating film 119, pad portions 120 and 121, a passivation film 122, an interlayer insulating film 123, and a bonding film 124 in this order from the semiconductor layer 100S side. The horizontal portion TGb of the transfer gate TG is provided in this wiring layer 100T, for example. The interlayer insulating film 119 is provided over the entire surface of the semiconductor layer 100S and is in contact with the semiconductor layer 100S. The interlayer insulating film 119 is made of, for example, a silicon oxide film. The configuration of the wiring layer 100T is not limited to the above, and may be any configuration having wiring and an insulating film.

[0053] FIG. 7B shows the configuration of the pad sections 120 and 121 together with the planar configuration shown in FIG. 7A. The pad sections 120 and 121 are provided in selective regions on the interlayer insulating film 119. The pad section 120 is for connecting the floating diffusions FD (floating diffusions FD1, FD2, FD3, and FD4) of the pixels 541A, 541B, 541C, and 541D to each other. The pad section 120 is disposed, for example, in the center of the pixel sharing unit 539 in plan view for each pixel sharing unit 539 (FIG. 7B). The pad section 120 is disposed so as to straddle the pixel separating section 117, and is disposed so as to overlap at least a portion of each of the floating diffusions FD1, FD2, FD3, and FD4 (FIGS. 6 and 7B). Specifically, the pad section 120 is formed in a region that overlaps at least a portion of each of the plurality of floating diffusions FD (floating diffusions FD1, FD2, FD3, FD4) that share the pixel circuit 210 and at least a portion of the pixel separation section 117 formed between the plurality of photodiodes PD (photodiodes PD1, PD2, PD3, PD4) that share the pixel circuit 210 in a direction perpendicular to the surface of the semiconductor layer 100S. The interlayer insulating film 119 is provided with a connection via 120C for electrically connecting the pad section 120 and the floating diffusions FD1, FD2, FD3, FD4. The connection via 120C is provided in each of the pixels 541A, 541B, 541C, 541D. For example, a portion of the pad section 120 is embedded in the connection via 120C, so that the pad section 120 and the floating diffusions FD1, FD2, FD3, FD4 are electrically connected.

[0054] The pad portion 121 is for connecting the multiple VSS contact regions 118 to each other. For example, the VSS contact regions 118 provided in the pixels 541C and 541D of one pixel sharing unit 539 adjacent to each other in the V direction and the VSS contact regions 118 provided in the pixels 541A and 541B of the other pixel sharing unit 539 are electrically connected by the pad portion 121. The pad portion 121 is provided, for example, so as to straddle the pixel separation portion 117, and is arranged so as to overlap at least a part of each of the four VSS contact regions 118. Specifically, the pad portion 121 is formed in a region that overlaps at least a part of each of the multiple VSS contact regions 118 and at least a part of the pixel separation portion 117 formed between the multiple VSS contact regions 118 in a direction perpendicular to the surface of the semiconductor layer 100S. The interlayer insulating film 119 is provided with a connection via 121C for electrically connecting the pad portion 121 and the VSS contact region 118. The connection via 121C is provided in each of the pixels 541A, 541B, 541C, and 541D. For example, a part of the pad portion 121 is embedded in the connection via 121C, thereby electrically connecting the pad portion 121 and the VSS contact region 118. For example, the pad portion 120 and the pad portion 121 of each of the multiple pixel sharing units 539 aligned in the V direction are disposed at approximately the same position in the H direction ( FIG. 7B ).

[0055] By providing the pad section 120, it is possible to reduce the wiring for connecting each floating diffusion FD to the pixel circuit 210 (for example, the gate electrode of the amplification transistor AMP) in the entire chip. Similarly, by providing the pad section 121, it is possible to reduce the wiring for supplying a potential to each VSS contact region 118 in the entire chip. This makes it possible to reduce the area of ​​the entire chip, suppress electrical interference between wiring in miniaturized pixels, and / or reduce costs by reducing the number of components.

[0056] The pad parts 120 and 121 can be provided at desired positions on the first substrate 100 and the second substrate 200. Specifically, the pad parts 120 and 121 can be provided on either the wiring layer 100T or the insulating region 212 of the semiconductor layer 200S. When provided on the wiring layer 100T, the pad parts 120 and 121 may be directly in contact with the semiconductor layer 100S. Specifically, the pad parts 120 and 121 may be directly connected to at least a part of each of the floating diffusion FD and / or the VSS contact region 118. Also, the pad parts 120 and 121 may be provided at desired positions in the insulating region 212 of the wiring layer 100T and the semiconductor layer 200S by providing connection vias 120C and 121C from each of the floating diffusion FD and / or the VSS contact region 118 connected to the pad parts 120 and 121.

[0057] In particular, when the pad portions 120, 121 are provided in the wiring layer 100T, it is possible to reduce the number of wirings connected to the floating diffusion FD and / or the VSS contact region 118 in the insulating region 212 of the semiconductor layer 200S. This makes it possible to reduce the area of ​​the insulating region 212 for forming the through wiring for connecting the floating diffusion FD to the pixel circuit 210, among the second substrate 200 for forming the pixel circuit 210. Therefore, it is possible to secure a large area for the second substrate 200 for forming the pixel circuit 210. By securing the area for the pixel circuit 210, it is possible to form a large pixel transistor, which can contribute to improving image quality by reducing noise, etc.

[0058] In particular, when an FTI structure is used for the pixel separation section 117, it is preferable to provide a floating diffusion FD and / or a VSS contact region 118 in each pixel 541, and therefore, by using the configuration of the pad sections 120, 121, the wiring connecting the first substrate 100 and the second substrate 200 can be significantly reduced.

[0059] 7B, for example, the pad section 120 to which the floating diffusions FD are connected and the pad section 121 to which the VSS contact regions 118 are connected are alternately arranged in a straight line in the V direction. The pad sections 120 and 121 are formed in positions surrounded by the photodiodes PD, the transfer gates TG, and the floating diffusions FD. This allows elements other than the floating diffusions FD and the VSS contact regions 118 to be freely arranged on the first substrate 100 on which the elements are formed, and the layout of the entire chip can be made more efficient. In addition, symmetry in the layout of the elements formed in each pixel sharing unit 539 is ensured, and the variation in the characteristics of each pixel 541 can be suppressed.

[0060] The pad parts 120 and 121 are made of, for example, polysilicon (Poly Si), more specifically, doped polysilicon to which impurities are added. The pad parts 120 and 121 are preferably made of a conductive material with high heat resistance, such as polysilicon, tungsten (W), titanium (Ti), and titanium nitride (TiN). This makes it possible to form the pixel circuit 210 after bonding the semiconductor layer 200S of the second substrate 200 to the first substrate 100. The reason for this will be explained below. In the following explanation, the method of forming the pixel circuit 210 after bonding the semiconductor layer 200S of the first substrate 100 to the semiconductor layer 200S of the second substrate 200 is called the first manufacturing method.

[0061] Here, it is also conceivable to form the pixel circuits 210 on the second substrate 200 and then bond it to the first substrate 100 (hereinafter referred to as the second manufacturing method). In this second manufacturing method, electrodes for electrical connection are formed in advance on the surface of the first substrate 100 (surface of the wiring layer 100T) and the surface of the second substrate 200 (surface of the wiring layer 200T). When the first substrate 100 and the second substrate 200 are bonded together, the electrodes for electrical connection formed on the surfaces of the first substrate 100 and the second substrate 200 come into contact with each other at the same time. As a result, an electrical connection is formed between the wiring included in the first substrate 100 and the wiring included in the second substrate 200. Therefore, by configuring the imaging device 1 using the second manufacturing method, it is possible to manufacture the imaging device using an appropriate process according to the configuration of each of the first substrate 100 and the second substrate 200, for example, and it is possible to manufacture a high-quality, high-performance imaging device.

[0062] In such a second manufacturing method, when the first substrate 100 and the second substrate 200 are bonded together, an alignment error may occur due to a manufacturing device for bonding. In addition, the first substrate 100 and the second substrate 200 have a diameter of, for example, several tens of centimeters, and when the first substrate 100 and the second substrate 200 are bonded together, the substrates may expand and contract in microscopic regions of the first substrate 100 and the second substrate 200. This expansion and contraction of the substrates is caused by a slight difference in the timing at which the substrates contact each other. Due to such expansion and contraction of the first substrate 100 and the second substrate 200, an error may occur in the position of the electrodes for electrical connection formed on the surface of the first substrate 100 and the surface of the second substrate 200. In the second manufacturing method, it is preferable to take measures so that the electrodes of the first substrate 100 and the second substrate 200 contact each other even if such an error occurs. Specifically, at least one, and preferably both, of the electrodes of the first substrate 100 and the second substrate 200 are made large in consideration of the above-mentioned error. Therefore, when the second manufacturing method is used, for example, the size (size in the substrate planar direction) of the electrode formed on the surface of the first substrate 100 or the second substrate 200 becomes larger than the size of the internal electrode extending in the thickness direction from the inside of the first substrate 100 or the second substrate 200 to the surface.

[0063] On the other hand, by forming the pad parts 120, 121 from a heat-resistant conductive material, it becomes possible to use the first manufacturing method. In the first manufacturing method, after forming the first substrate 100 including the photodiode PD and the transfer transistor TR, the first substrate 100 and the second substrate 200 (semiconductor layer 2000S) are bonded together. At this time, the second substrate 200 is in a state in which the patterns of the active elements and wiring layers constituting the pixel circuits 210 have not yet been formed. Since the second substrate 200 is in a state before the patterns are formed, even if an error occurs in the bonding position when the first substrate 100 and the second substrate 200 are bonded together, this bonding error does not cause an error in the alignment between the pattern of the first substrate 100 and the pattern of the second substrate 200. This is because the pattern of the second substrate 200 is formed after the first substrate 100 and the second substrate 200 are bonded together. When forming a pattern on the second substrate, for example, an exposure device for pattern formation performs pattern formation while using the pattern formed on the first substrate as a target for alignment. For the above reasons, errors in the bonding positions of the first substrate 100 and the second substrate 200 do not pose a problem in manufacturing the imaging device 1 in the first manufacturing method. For the same reason, errors caused by expansion and contraction of the substrates in the second manufacturing method do not pose a problem in manufacturing the imaging device 1 in the first manufacturing method.

[0064] In the first manufacturing method, after the first substrate 100 and the second substrate 200 (semiconductor layer 200S) are bonded together in this manner, active elements are formed on the second substrate 200. After that, the through electrodes 120E, 121E and the through electrodes TGV (FIG. 6) are formed. In forming the through electrodes 120E, 121E, and TGV, for example, a pattern of the through electrodes is formed from above the second substrate 200 using reduced projection exposure by an exposure device. Since reduced exposure projection is used, even if an error occurs in the alignment between the second substrate 200 and the exposure device, the magnitude of the error is only a fraction (the reciprocal of the reduced exposure projection magnification) of the error in the second substrate 200 in the second manufacturing method. Therefore, by configuring the imaging device 1 using the first manufacturing method, it becomes easier to align the elements formed on the first substrate 100 and the second substrate 200, and a high-quality, high-performance imaging device can be manufactured.

[0065] The imaging device 1 manufactured using such a first manufacturing method has different characteristics from the imaging device manufactured using the second manufacturing method. Specifically, in the imaging device 1 manufactured using the first manufacturing method, for example, the through electrodes 120E, 121E, and TGV have a substantially constant thickness (size in the substrate plane direction) from the second substrate 200 to the first substrate 100. Alternatively, when the through electrodes 120E, 121E, and TGV have a tapered shape, they have a tapered shape with a constant inclination. The imaging device 1 having such through electrodes 120E, 121E, and TGV makes it easy to miniaturize the pixels 541.

[0066] Here, when the imaging device 1 is manufactured by the first manufacturing method, since the active elements are formed on the second substrate 200 after bonding the first substrate 100 and the second substrate 200 (semiconductor layer 200S), the first substrate 100 is also affected by the heat treatment required for forming the active elements. For this reason, as described above, it is preferable to use a conductive material with high heat resistance for the pad parts 120, 121 provided on the first substrate 100. For example, it is preferable to use a material with a higher melting point (i.e., higher heat resistance) for the pad parts 120, 121 than at least a part of the wiring material included in the wiring layer 200T of the second substrate 200. For example, a conductive material with high heat resistance such as doped polysilicon, tungsten, titanium, or titanium nitride is used for the pad parts 120, 121. This makes it possible to manufacture the imaging device 1 by using the first manufacturing method described above.

[0067] The passivation film 122 is provided over the entire surface of the semiconductor layer 100S so as to cover, for example, the pad portions 120 and 121 (FIG. 6). The passivation film 122 is made of, for example, a silicon nitride (SiN) film. The interlayer insulating film 123 covers the pad portions 120 and 121 with the passivation film 122 therebetween. This interlayer insulating film 123 is provided over, for example, the entire surface of the semiconductor layer 100S. The interlayer insulating film 123 is made of, for example, a silicon oxide (SiO) film. The bonding film 124 is provided on the bonding surface between the first substrate 100 (specifically, the wiring layer 100T) and the second substrate 200. That is, the bonding film 124 is in contact with the second substrate 200. This bonding film 124 is provided over the entire main surface of the first substrate 100. The bonding film 124 is made of, for example, a silicon nitride film or a silicon oxide film.

[0068] The light receiving lens 401 faces, for example, the semiconductor layer 100S with the fixed charge film 112 and the insulating film 111 therebetween (FIG. 6). The light receiving lens 401 is provided, for example, at a position facing the photodiode PD of each of the pixels 541A, 541B, 541C, and 541D.

[0069] The second substrate 200 has a semiconductor layer 200S and a wiring layer 200T in this order from the first substrate 100 side. The semiconductor layer 200S is made of a silicon substrate. A well region 211 is provided in the semiconductor layer 200S across the thickness direction. The well region 211 is, for example, a p-type semiconductor region. The second substrate 200 is provided with a pixel circuit 210 arranged for each pixel sharing unit 539. The pixel circuit 210 is provided, for example, on the front surface side (the wiring layer 200T side) of the semiconductor layer 200S. In the imaging device 1, the second substrate 200 is bonded to the first substrate 100 such that the back surface side (the semiconductor layer 200S side) of the second substrate 200 faces the front surface side (the wiring layer 100T side) of the first substrate 100. That is, the second substrate 200 is bonded to the first substrate 100 face-to-back.

[0070] 8 to 12 show an example of a planar configuration of the second substrate 200. FIG. 8 shows a configuration of the pixel circuit 210 provided near the surface of the semiconductor layer 200S. FIG. 9 shows a schematic configuration of the wiring layer 200T (specifically, the first wiring layer W1 described later), the semiconductor layer 200S connected to the wiring layer 200T, and each part of the first substrate 100. FIGS. 10 to 12 show an example of a planar configuration of the wiring layer 200T. Hereinafter, the configuration of the second substrate 200 will be described with reference to FIGS. 8 to 12 together with FIG. 6. In FIGS. 8 and 9, the outline of the photodiode PD (the boundary between the pixel isolation section 117 and the photodiode PD) is shown by a dashed line, and the boundary between the semiconductor layer 200S and the element isolation region 213 or the insulating region 212 in the portion overlapping the gate electrode of each transistor constituting the pixel circuit 210 is shown by a dotted line. In the portion overlapping the gate electrode of the amplifying transistor AMP, a boundary between the semiconductor layer 200S and the element isolation region 213 and a boundary between the element isolation region 213 and the insulating region 212 are provided on one side in the channel width direction.

[0071] The second substrate 200 is provided with an insulating region 212 that divides the semiconductor layer 200S and an element isolation region 213 provided in a part of the semiconductor layer 200S in the thickness direction (FIG. 6). For example, in the insulating region 212 provided between two pixel circuits 210 adjacent to each other in the H direction, the through electrodes 120E, 121E and through electrodes TGV (through electrodes TGV1, TGV2, TGV3, TGV4) of two pixel sharing units 539 connected to the two pixel circuits 210 are arranged (FIG. 9).

[0072] The insulating region 212 has approximately the same thickness as the semiconductor layer 200S (FIG. 6). The semiconductor layer 200S is divided by this insulating region 212. The through electrodes 120E, 121E and the through electrodes TGV are arranged in this insulating region 212. The insulating region 212 is made of, for example, silicon oxide.

[0073] The through electrodes 120E, 121E are provided penetrating the insulating region 212 in the thickness direction. The upper ends of the through electrodes 120E, 121E are connected to the wiring of the wiring layer 200T (first wiring layer W1, second wiring layer W2, third wiring layer W3, and fourth wiring layer W4 described later). The through electrodes 120E, 121E are provided penetrating the insulating region 212, the bonding film 124, the interlayer insulating film 123, and the passivation film 122, and the lower ends are connected to the pad parts 120, 121 (FIG. 6). The through electrodes 120E are for electrically connecting the pad part 120 and the pixel circuit 210. That is, the floating diffusion FD of the first substrate 100 is electrically connected to the pixel circuit 210 of the second substrate 200 by the through electrodes 120E. The through electrode 121E is for electrically connecting the pad portion 121 and the reference potential line VSS of the wiring layer 200T. That is, the through electrode 121E electrically connects the VSS contact region 118 of the first substrate 100 to the reference potential line VSS of the second substrate 200.

[0074] The through electrode TGV is provided to penetrate the insulating region 212 in the thickness direction. The upper end of the through electrode TGV is connected to the wiring of the wiring layer 200T. This through electrode TGV is provided to penetrate the insulating region 212, the bonding film 124, the interlayer insulating film 123, the passivation film 122, and the interlayer insulating film 119, and its lower end is connected to the transfer gate TG (FIG. 6). Such a through electrode TGV is for electrically connecting the transfer gate TG (transfer gates TG1, TG2, TG3, TG4) of each of the pixels 541A, 541B, 541C, 541D to the wiring of the wiring layer 200T (a part of the row driving signal line 542, specifically, the wiring TRG1, TRG2, TRG3, TRG4 in FIG. 11 described later). That is, the transfer gate TG of the first substrate 100 is electrically connected to the wiring TRG of the second substrate 200 by the through electrode TGV, so that a drive signal is sent to each of the transfer transistors TR (transfer transistors TR1, TR2, TR3, TR4).

[0075] The insulating region 212 is a region for providing the through electrodes 120E, 121E and the through electrodes TGV for electrically connecting the first substrate 100 and the second substrate 200 insulated from the semiconductor layer 200S. For example, the through electrodes 120E, 121E and the through electrodes TGV (through electrodes TGV1, TGV2, TGV3, TGV4) connected to the two pixel circuits 210 (pixel sharing units 539) adjacent to each other in the H direction are provided in the insulating region 212. The insulating region 212 is provided, for example, extending in the V direction (FIGS. 8 and 9). Here, the position of the through electrodes TGV in the H direction is arranged closer to the position of the through electrodes 120E, 121E in the H direction than the position of the vertical part TGa by devising the arrangement of the horizontal part TGb of the transfer gate TG (FIGS. 7A and 9). For example, the through electrode TGV is disposed at approximately the same position as the through electrodes 120E, 120E in the H direction. This allows the through electrodes 120E, 121E and the through electrode TGV to be provided together in the insulating region 212 extending in the V direction. As another arrangement example, it is possible to provide the horizontal part TGb only in the region overlapping the vertical part TGa. In this case, the through electrode TGV is formed approximately directly above the vertical part TGa, and the through electrode TGV is disposed, for example, in the approximately center of each pixel 541 in the H direction and the V direction. At this time, the position of the through electrode TGV in the H direction and the position of the through electrodes 120E, 121E in the H direction are largely shifted. For example, an insulating region 212 is provided around the through electrodes TGV and the through electrodes 120E, 121E to electrically insulate them from the adjacent semiconductor layer 200S. When the position of the through electrode TGV in the H direction is significantly separated from the positions of the through electrodes 120E, 121E in the H direction, it is necessary to provide an insulating region 212 independently around each of the through electrodes 120E, 121E, and TGV. This results in the semiconductor layer 200S being divided into small pieces. In contrast, a layout in which the through electrodes 120E, 121E and the through electrode TGV are collectively disposed in the insulating region 212 extending in the V direction can increase the size of the semiconductor layer 200S in the H direction. This makes it possible to secure a large area for the semiconductor element formation region in the semiconductor layer 200S.This makes it possible, for example, to increase the size of the amplification transistor AMP and suppress noise.

[0076] As described with reference to FIG. 4, the pixel sharing unit 539 has a structure in which the floating diffusions FD provided in the respective pixels 541 are electrically connected to each other, and the pixels 541 share one pixel circuit 210. The floating diffusions FD are electrically connected to each other by a pad section 120 provided on the first substrate 100 (FIGS. 6 and 7B). The electrical connection section (pad section 120) provided on the first substrate 100 and the pixel circuit 210 provided on the second substrate 200 are electrically connected to each other via one through electrode 120E. As another structural example, it is also possible to provide the electrical connection section between the floating diffusions FD on the second substrate 200. In this case, the pixel sharing unit 539 is provided with four through electrodes connected to the floating diffusions FD1, FD2, FD3, and FD4, respectively. Therefore, in the second substrate 200, the number of through electrodes penetrating the semiconductor layer 200S increases, and the insulating region 212 that insulates the periphery of these through electrodes becomes larger. In comparison, the structure in which the pad portion 120 is provided in the first substrate 100 (FIGS. 6 and 7B) can reduce the number of through electrodes and make the insulating region 212 smaller. Thus, a large area can be secured for the semiconductor element formation region in the semiconductor layer 200S. This makes it possible, for example, to increase the size of the amplification transistor AMP and suppress noise.

[0077] The element isolation region 213 is provided on the surface side of the semiconductor layer 200S. The element isolation region 213 has an STI (Shallow Trench Isolation) structure. In the element isolation region 213, the semiconductor layer 200S is dug in the thickness direction (perpendicular to the main surface of the second substrate 200), and an insulating film is embedded in the dug portion. The insulating film is made of, for example, silicon oxide. The element isolation region 213 isolates a plurality of transistors constituting the pixel circuit 210 according to the layout of the pixel circuit 210. The semiconductor layer 200S (specifically, the well region 211) extends below the element isolation region 213 (deep in the semiconductor layer 200S).

[0078] Here, with reference to Figures 7A, 7B, and 8, the difference between the outer shape (outer shape in the substrate planar direction) of the pixel sharing unit 539 on the first substrate 100 and the outer shape of the pixel sharing unit 539 on the second substrate 200 will be described.

[0079] In the imaging device 1, a pixel sharing unit 539 is provided across both the first substrate 100 and the second substrate 200. For example, the outer shape of the pixel sharing unit 539 provided on the first substrate 100 and the outer shape of the pixel sharing unit 539 provided on the second substrate 200 are different from each other.

[0080] 7A and 7B, the outlines of the pixels 541A, 541B, 541C, and 541D are indicated by dashed lines, and the outline shape of the pixel sharing unit 539 is indicated by a thick line. For example, the pixel sharing unit 539 of the first substrate 100 is configured with two pixels 541 (pixels 541A and 541B) adjacent to each other in the H direction and two pixels 541 (pixels 541C and 541D) adjacent to each other in the V direction. That is, the pixel sharing unit 539 of the first substrate 100 is configured with four pixels 541 arranged in two rows and two columns adjacent to each other, and the pixel sharing unit 539 of the first substrate 100 has a substantially square outline shape. In the pixel array section 540, such pixel sharing units 539 are arranged adjacent to each other at a two pixel pitch in the H direction (a pitch equivalent to two pixels 541) and at a two pixel pitch in the V direction (a pitch equivalent to two pixels 541).

[0081] 8 and 9, the outlines of the pixels 541A, 541B, 541C, and 541D are indicated by dashed lines, and the outline shape of the pixel sharing unit 539 is indicated by a thick line. For example, the outline shape of the pixel sharing unit 539 of the second substrate 200 is smaller than that of the pixel sharing unit 539 of the first substrate 100 in the H direction, and is larger than that of the pixel sharing unit 539 of the first substrate 100 in the V direction. For example, the pixel sharing unit 539 of the second substrate 200 is formed with a size (area) equivalent to one pixel in the H direction, and is formed with a size equivalent to four pixels in the V direction. That is, the pixel sharing unit 539 of the second substrate 200 is formed with a size equivalent to adjacent pixels arranged in one row by four columns, and the pixel sharing unit 539 of the second substrate 200 has a substantially rectangular outline shape.

[0082] For example, in each pixel circuit 210, the selection transistor SEL, the amplification transistor AMP, the reset transistor RST, and the FD conversion gain switching transistor FDG are arranged in this order in the V direction (FIG. 8). By providing the outer shape of each pixel circuit 210 in a substantially rectangular shape as described above, it is possible to arrange four transistors (the selection transistor SEL, the amplification transistor AMP, the reset transistor RST, and the FD conversion gain switching transistor FDG) in one direction (the V direction in FIG. 8). This allows the drain of the amplification transistor AMP and the drain of the reset transistor RST to be shared in one diffusion region (the diffusion region connected to the power supply line VDD). For example, it is also possible to provide the formation region of each pixel circuit 210 in a substantially square shape (see FIG. 33 described later). In this case, two transistors are arranged along one direction, and it becomes difficult to share the drain of the amplification transistor AMP and the drain of the reset transistor RST in one diffusion region. Therefore, by providing the formation region of the pixel circuit 210 in a substantially rectangular shape, it becomes easier to arrange the four transistors close to each other, and the formation region of the pixel circuit 210 can be made smaller. That is, the pixel can be miniaturized. Furthermore, when it is not necessary to reduce the formation area of ​​the pixel circuit 210, it is possible to increase the formation area of ​​the amplification transistor AMP and suppress noise.

[0083] For example, in addition to the selection transistor SEL, the amplification transistor AMP, the reset transistor RST, and the FD conversion gain switching transistor FDG, a VSS contact region 218 connected to a reference potential line VSS is provided near the surface of the semiconductor layer 200S. The VSS contact region 218 is, for example, configured of a p-type semiconductor region. The VSS contact region 218 is electrically connected to the VSS contact region 118 of the first substrate 100 (semiconductor layer 100S) via the wiring of the wiring layer 200T and the through electrode 121E. This VSS contact region 218 is provided, for example, at a position adjacent to the source of the FD conversion gain switching transistor FDG with the element isolation region 213 therebetween (FIG. 8).

[0084] Next, the positional relationship between the pixel sharing unit 539 provided on the first substrate 100 and the pixel sharing unit 539 provided on the second substrate 200 will be described with reference to Fig. 7B and Fig. 8. For example, one of the two pixel sharing units 539 arranged in the V direction of the first substrate 100 (for example, the upper side of the paper in Fig. 7B) is connected to one of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 (for example, the left side of the paper in Fig. 8). For example, the other of the two pixel sharing units 539 arranged in the V direction of the first substrate 100 (for example, the lower side of the paper in Fig. 7B) is connected to the other of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 (for example, the right side of the paper in Fig. 8).

[0085] For example, of two pixel sharing units 539 arranged in the H direction of the second substrate 200, the internal layout (arrangement of transistors, etc.) of one pixel sharing unit 539 is substantially equal to a layout obtained by inverting the internal layout of the other pixel sharing unit 539 in the V direction and H direction. The effects obtained by this layout will be described below.

[0086] In two pixel sharing units 539 arranged in the V direction of the first substrate 100, each pad section 120 is disposed at the center of the outer shape of the pixel sharing unit 539, that is, the center of the pixel sharing unit 539 in the V direction and the H direction (FIG. 7B). On the other hand, since the pixel sharing unit 539 of the second substrate 200 has an outer shape of a substantially rectangle elongated in the V direction as described above, for example, the amplification transistor AMP connected to the pad section 120 is disposed at a position shifted upward from the center of the pixel sharing unit 539 in the V direction on the paper. For example, when the internal layout of two pixel sharing units 539 arranged in the H direction of the second substrate 200 is the same, the distance between the amplification transistor AMP of one pixel sharing unit 539 and the pad section 120 (for example, the pad section 120 of the pixel sharing unit 539 on the upper side of the paper in FIG. 7B) becomes relatively short. However, the distance between the amplification transistor AMP of the other pixel sharing unit 539 and the pad section 120 (for example, the pad section 120 of the pixel sharing unit 539 on the lower side of the paper surface of FIG. 7B) becomes longer. Therefore, the area of ​​the wiring required to connect the amplification transistor AMP and the pad section 120 becomes larger, and there is a concern that the wiring layout of the pixel sharing unit 539 becomes complicated. This may affect the miniaturization of the imaging device 1.

[0087] In contrast, by inverting the internal layouts of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 at least in the V direction, the distance between the amplifier transistors AMP and the pad section 120 of both of these two pixel sharing units 539 can be shortened. Therefore, compared with a configuration in which the internal layouts of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 are the same, it is easier to miniaturize the imaging device 1. Note that the planar layout of each of the multiple pixel sharing units 539 of the second substrate 200 is symmetrical within the range shown in FIG. 8, but becomes asymmetrical when the layout of the first wiring layer W1 shown in FIG. 9 described later is included.

[0088] In addition, it is preferable that the internal layouts of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 are also inverted with respect to each other in the H direction. The reason for this will be described below. As shown in FIG. 9, the two pixel sharing units 539 arranged in the H direction of the second substrate 200 are connected to the pad sections 120, 121 of the first substrate 100. For example, the pad sections 120, 121 are disposed in the center of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 (between the two pixel sharing units 539 arranged in the H direction). Therefore, by inverting the internal layouts of the two pixel sharing units 539 arranged in the H direction of the second substrate 200 with respect to each other in the H direction, the distance between each of the multiple pixel sharing units 539 of the second substrate 200 and the pad sections 120, 121 can be reduced. That is, it becomes easier to miniaturize the imaging device 1.

[0089] In addition, the position of the outline of the pixel sharing unit 539 of the second substrate 200 may not be aligned with the position of any of the outlines of the pixel sharing unit 539 of the first substrate 100. For example, of the two pixel sharing units 539 arranged in the H direction of the second substrate 200, in one pixel sharing unit 539 (for example, the left side of the paper in FIG. 9), the outline of one side in the V direction (for example, the upper side of the paper in FIG. 9) is disposed outside the outline of one side in the V direction of the corresponding pixel sharing unit 539 of the first substrate 100 (for example, the upper side of the paper in FIG. 7B). In addition, of the two pixel sharing units 539 arranged in the H direction of the second substrate 200, in the other pixel sharing unit 539 (for example, the right side of the paper in FIG. 9), the outline of the other side in the V direction (for example, the lower side of the paper in FIG. 9) is disposed outside the outline of the other side in the V direction of the corresponding pixel sharing unit 539 of the first substrate 100 (for example, the lower side of the paper in FIG. 7B). In this way, by disposing the pixel sharing unit 539 of the second substrate 200 and the pixel sharing unit 539 of the first substrate 100 relative to each other, it is possible to shorten the distance between the amplification transistor AMP and the pad section 120. Therefore, it becomes easier to miniaturize the imaging device 1.

[0090] Furthermore, the positions of the outlines of the multiple pixel sharing units 539 on the second substrate 200 do not need to be aligned with each other. For example, two pixel sharing units 539 aligned in the H direction of the second substrate 200 are arranged with the positions of the outlines in the V direction shifted from each other. This makes it possible to shorten the distance between the amplification transistor AMP and the pad section 120. This makes it easier to miniaturize the imaging device 1.

[0091] With reference to FIG. 7B and FIG. 9, the repeated arrangement of the pixel sharing units 539 in the pixel array section 540 will be described. The pixel sharing unit 539 of the first substrate 100 has a size equivalent to two pixels 541 in the H direction and a size equivalent to two pixels 541 in the V direction (FIG. 7B). For example, in the pixel array section 540 of the first substrate 100, the pixel sharing units 539 having a size equivalent to four pixels 541 are repeatedly arranged adjacent to each other at a two pixel pitch (a pitch equivalent to two pixels 541) in the H direction and at a two pixel pitch (a pitch equivalent to two pixels 541) in the V direction. Alternatively, the pixel array section 540 of the first substrate 100 may be provided with a pair of pixel sharing units 539 in which two pixel sharing units 539 are arranged adjacent to each other in the V direction. In the pixel array section 540 of the first substrate 100, for example, a pair of pixel sharing units 539 are repeatedly arranged adjacent to each other at a two pixel pitch (a pitch equivalent to two pixels 541) in the H direction and a four pixel pitch (a pitch equivalent to four pixels 541) in the V direction. The pixel sharing unit 539 of the second substrate 200 has a size of one pixel 541 in the H direction and a size of four pixels 541 in the V direction (FIG. 9). For example, the pixel array section 540 of the second substrate 200 is provided with a pair of pixel sharing units 539 including two pixel sharing units 539 each having a size equivalent to four pixels 541. The pixel sharing units 539 are arranged adjacent to each other in the H direction and offset from each other in the V direction. In the pixel array section 540 of the second substrate 200, for example, a pair of pixel sharing units 539 are repeatedly arranged adjacent to each other with no gaps at a two pixel pitch (a pitch equivalent to two pixels 541) in the H direction and at a four pixel pitch (a pitch equivalent to four pixels 541) in the V direction. By repeatedly arranging the pixel sharing units 539 in this way, it is possible to arrange the pixel sharing units 539 without any gaps. This makes it easier to miniaturize the imaging device 1.

[0092] The amplification transistor AMP may have, for example, a planar structure, but preferably has, for example, a three-dimensional structure such as a Fin type (for example, a Fin-FET (Field-Effect Transistor), a Tri-Gate FET or a Double Gate FET) in which the channel region has an uneven structure (FIG. 6). This increases the effective gate width, making it possible to suppress noise. The selection transistor SEL, the reset transistor RST and the FD conversion gain switching transistor FDG have, for example, a planar structure. The amplification transistor AMP may have a planar structure. Alternatively, the selection transistor SEL, the reset transistor RST or the FD conversion gain switching transistor FDG may have a three-dimensional structure.

[0093] The wiring layer 200T includes, for example, a passivation film 221, an interlayer insulating film 222, and a plurality of wirings (a first wiring layer W1, a second wiring layer W2, a third wiring layer W3, and a fourth wiring layer W4). The passivation film 221 is in contact with, for example, the surface of the semiconductor layer 200S, and covers the entire surface of the semiconductor layer 200S. This passivation film 221 covers the gate electrodes of the selection transistor SEL, the amplification transistor AMP, the reset transistor RST, and the FD conversion gain switching transistor FDG. The interlayer insulating film 222 is provided between the passivation film 221 and the third substrate 300. This interlayer insulating film 222 separates the plurality of wirings (the first wiring layer W1, the second wiring layer W2, the third wiring layer W3, and the fourth wiring layer W4). The interlayer insulating film 222 is made of, for example, silicon oxide.

[0094] In the wiring layer 200T, for example, from the semiconductor layer 200S side, a first wiring layer W1, a second wiring layer W2, a third wiring layer W3, a fourth wiring layer W4, and contact parts 201, 202 are provided in this order, and these are insulated from each other by an interlayer insulating film 222. In the interlayer insulating film 222, a plurality of connection parts are provided to connect the first wiring layer W1, the second wiring layer W2, the third wiring layer W3, or the fourth wiring layer W4 to the layers below them. The connection parts are parts in which a conductive material is embedded in connection holes provided in the interlayer insulating film 222. For example, in the interlayer insulating film 222, a connection part 218V is provided to connect the first wiring layer W1 and the VSS contact region 218 of the semiconductor layer 200S. For example, the hole diameter of such a connection part that connects elements of the second substrate 200 to each other is different from the hole diameters of the through electrodes 120E, 121E and the through electrodes TGV. Specifically, the diameter of the connection hole connecting the elements of the second substrate 200 is preferably smaller than the diameter of the through electrodes 120E, 121E and the through electrode TGV. The reason for this will be described below. The depth of the connection part (connection part 218V, etc.) provided in the wiring layer 200T is smaller than the depth of the through electrodes 120E, 121E and the through electrode TGV. Therefore, the connection part can be filled with a conductive material more easily than the through electrodes 120E, 121E and the through electrode TGV. By making the diameter of the connection part smaller than the diameter of the through electrodes 120E, 121E and the through electrode TGV, it becomes easier to miniaturize the imaging device 1.

[0095] For example, the first wiring layer W1 connects the through electrode 120E to the gate of the amplification transistor AMP and the source of the FD conversion gain switching transistor FDG (specifically, a connection hole reaching the source of the FD conversion gain switching transistor FDG). The first wiring layer W1 connects, for example, the through electrode 121E to the connection portion 218V, thereby electrically connecting the VSS contact region 218 of the semiconductor layer 200S to the VSS contact region 118 of the semiconductor layer 100S.

[0096] Next, the planar configuration of the wiring layer 200T will be described with reference to Fig. 10 to Fig. 12. Fig. 10 shows an example of the planar configuration of the first wiring layer W1 and the second wiring layer W2. Fig. 11 shows an example of the planar configuration of the second wiring layer W2 and the third wiring layer W3. Fig. 12 shows an example of the planar configuration of the third wiring layer W3 and the fourth wiring layer W4.

[0097] For example, the third wiring layer W3 includes wirings TRG1, TRG2, TRG3, TRG4, SELL, RSTL, and FDGL extending in the H direction (row direction) (FIG. 11). These wirings correspond to the row driving signal lines 542 described with reference to FIG. 4. The wirings TRG1, TRG2, TRG3, and TRG4 are for sending driving signals to the transfer gates TG1, TG2, TG3, and TG4, respectively. The wirings TRG1, TRG2, TRG3, and TRG4 are connected to the transfer gates TG1, TG2, TG3, and TG4 via the second wiring layer W2, the first wiring layer W1, and the through-electrode 120E, respectively. The wiring SELL is for sending a driving signal to the gate of the selection transistor SEL, the wiring RSTL is for sending a driving signal to the gate of the reset transistor RST, and the wiring FDGL is for sending a driving signal to the gate of the FD conversion gain switching transistor FDG, respectively. The wirings SELL, RSTL, and FDGL are each connected to the gates of the selection transistor SEL, the reset transistor RST, and the FD conversion gain switching transistor FDG via the second wiring layer W2, the first wiring layer W1, and a connection portion.

[0098] For example, the fourth wiring layer W4 includes a power supply line VDD, a reference potential line VSS, and a vertical signal line 543 extending in the V direction (column direction) (FIG. 12). The power supply line VDD is connected to the drain of the amplification transistor AMP and the drain of the reset transistor RST via the third wiring layer W3, the second wiring layer W2, the first wiring layer W1, and a connection part. The reference potential line VSS is connected to the VSS contact region 218 via the third wiring layer W3, the second wiring layer W2, the first wiring layer W1, and a connection part 218V. The reference potential line VSS is also connected to the VSS contact region 118 of the first substrate 100 via the third wiring layer W3, the second wiring layer W2, the first wiring layer W1, the through electrode 121E, and the pad part 121. The vertical signal line 543 is connected to the source (Vout) of the selection transistor SEL via the third wiring layer W3, the second wiring layer W2, the first wiring layer W1, and a connection part.

[0099] The contact parts 201 and 202 may be provided at positions overlapping the pixel array part 540 in a plan view (for example, FIG. 3), or may be provided in the outer peripheral part 540B of the pixel array part 540 (for example, FIG. 6). The contact parts 201 and 202 are provided on the surface of the second substrate 200 (surface on the wiring layer 200T side). The contact parts 201 and 202 are made of metal such as Cu (copper) and Al (aluminum). The contact parts 201 and 202 are exposed on the surface of the wiring layer 200T (surface on the third substrate 300 side). The contact parts 201 and 202 are used for electrical connection between the second substrate 200 and the third substrate 300 and for bonding the second substrate 200 and the third substrate 300 together.

[0100] 6 illustrates an example in which a peripheral circuit is provided in the peripheral portion 540B of the second substrate 200. This peripheral circuit may include a part of the row driving section 520 or a part of the column signal processing section 550. As illustrated in FIG. 3, the peripheral circuit may not be provided in the peripheral portion 540B of the second substrate 200, and the connection holes H1 and H2 may be provided in the vicinity of the pixel array section 540.

[0101] FIG. 13A shows a schematic cross-sectional configuration of an electrical connection portion between the first substrate 100 and the second substrate 200, which are essential parts of the imaging device 1 of the present embodiment, via a through-hole wiring and the vicinity thereof. FIG. 13A shows, as an example, a through-hole electrode 120E that electrically connects the floating diffusion FD of the first substrate (specifically, a pad portion 120 that connects a plurality of floating diffusions FD) and the pixel circuit 210 of the second substrate 200, and a configuration of, for example, the vicinity of the amplification transistor AMP arranged in the vicinity thereof. FIG. 13B shows a schematic example of a planar configuration in a horizontal direction with respect to the main surface of the second substrate 200 shown in FIG. 13A. In the present embodiment, a shield electrode 220 is provided between the through-hole wiring arranged in the insulating region 212, such as the through-hole electrode 120E, and the semiconductor layer 200S in which each transistor constituting the pixel circuit 210, such as the amplification transistor AMP, is provided. This shield electrode 220 corresponds to a specific example of a "conductive film" in the present disclosure.

[0102] The shield electrode 220 is intended to reduce the influence of a bias applied to the through-wire on each transistor constituting the pixel circuit 210. The shield electrode 220 is provided between the through-wire arranged in the insulating region 212 and each transistor constituting the pixel circuit 210, for example, between the through-electrode 120E and the amplification transistor AMP.

[0103] Specifically, the shield electrode 220 is provided in the insulating region 212 between the through electrode 120E and the amplifying transistor AMP. One end (lower end) of the shield electrode 220 penetrates the insulating region 212 and is provided in the interlayer insulating film 123 of the first substrate 100. Specifically, the lower end of the shield electrode 220 is located, for example, at the same depth as the through electrode 120E, that is, at the same height as the upper surface of the pad section 120. The other end (upper end) of the shield electrode 220 extends into the wiring layer 200T of the second substrate 200 and is in contact with, for example, the first wiring layer W1. The first wiring layer W1 in contact with the shield electrode 220 is connected, for example, to a ground (GND) electrode, so that a fixed potential is applied to the shield electrode 220.

[0104] 13B, when the through electrode 120E is disposed on an extension of the center line A of the gate G of the amplifying transistor AMP that straddles the semiconductor layer 200S, the shield electrode 220 is preferably formed so as to separate the gate G and the through electrode 120E at least in the horizontal direction. Also, the shield electrode 220 is preferably formed at least in the vertical direction from the upper surface of the gate G of the amplifying transistor AMP to the back surface (surface S2) of the semiconductor layer 200S.

[0105] 14 shows the Id-Vgs characteristics of, for example, the amplifying transistor AMP when the shield electrode 220 is not provided. When a bias of +3.0 V is applied to the through wiring (for example, the through electrode TGV) when the shield electrode 220 is not provided, a current flows from the drain to the source, compared to the state where no bias is applied (off state: -2 V). In other words, it can be seen that when a bias is applied to the through electrode TGV, a leak current occurs.

[0106] 15 shows, for example, the Id-Vgs characteristics of the amplifier transistor AMP when a shield electrode 220 is provided between the through electrode TGV and the amplifier transistor AMP. When the shield electrode 220 is provided between the through electrode TGV and the amplifier transistor AMP, the Id-Vgs characteristics are the same as those in the off state even when a bias of +3.0 V is applied to the through electrode TGV. In other words, by providing the shield electrode 220 between the through electrode TGV and the amplifier transistor AMP, it is possible to prevent fluctuations in the transistor characteristics due to the influence of the bias applied to the through electrode TGV.

[0107] The shield electrode 220 can be formed using, for example, the same material as the through electrode 120E, for example, copper (Cu) or tungsten (W). This allows the shield electrode 220 to be formed simultaneously when the through electrode 120E is formed. In addition, the shield electrode 220 can be formed using a material different from that of the through electrode 120E, so long as the material has conductivity and is highly heat-resistant (for example, 600° C. or higher, more preferably 850° C. or higher). Examples of materials for the shield electrode 220 include two-dimensional materials such as graphene and transition metal dichalcogenides (TMDs), and polysilicon (Poly Si).

[0108] In the present embodiment, as an example, a shield electrode 220 is provided between the through electrode 120E and the amplifying transistor AMP. However, as shown in FIG. 15, the present technology can also be applied between other through wirings (e.g., the through electrode 121E and the through electrode TGV) and other transistors constituting the pixel circuit 210 (e.g., the reset transistor RST, the selection transistor SEL, and the FD conversion gain switching transistor FDG), and the same effect can be obtained.

[0109] The third substrate 300 has, for example, a wiring layer 300T and a semiconductor layer 300S in this order from the second substrate 200 side. For example, the surface of the semiconductor layer 300S is provided on the second substrate 200 side. The semiconductor layer 300S is made of a silicon substrate. A circuit is provided on the surface side of the semiconductor layer 300S. Specifically, for example, at least a part of the input unit 510A, the row driver 520, the timing control unit 530, the column signal processing unit 550, the image signal processing unit 560, and the output unit 510B is provided on the surface side of the semiconductor layer 300S. The wiring layer 300T provided between the semiconductor layer 300S and the second substrate 200 includes, for example, an interlayer insulating film, a plurality of wiring layers separated by the interlayer insulating film, and contact units 301 and 302. The contact parts 301 and 302 are exposed on the surface (surface on the second substrate 200 side) of the wiring layer 300T, and the contact part 301 is in contact with the contact part 201 of the second substrate 200, and the contact part 302 is in contact with the contact part 202 of the second substrate 200. The contact parts 301 and 302 are electrically connected to circuits (for example, at least one of the input part 510A, the row driving part 520, the timing control part 530, the column signal processing part 550, the image signal processing part 560, and the output part 510B) formed in the semiconductor layer 300S. The contact parts 301 and 302 are made of metals such as Cu (copper) and aluminum (Al). For example, the external terminal TA is connected to the input part 510A via the connection hole part H1, and the external terminal TB is connected to the output part 510B via the connection hole part H2.

[0110] Here, the features of the imaging device 1 will be described.

[0111] In general, an imaging device mainly consists of a photodiode and a pixel circuit. Increasing the area of ​​the photodiode increases the charge generated as a result of photoelectric conversion, thereby improving the signal-to-noise ratio (S / N ratio) of the pixel signal, and enabling the imaging device to output better image data (image information). On the other hand, increasing the size of the transistors (especially the size of the amplifying transistors) included in the pixel circuit reduces the noise generated in the pixel circuit, thereby improving the S / N ratio of the imaging signal, and enabling the imaging device to output better image data (image information).

[0112] However, in an imaging device in which a photodiode and a pixel circuit are provided on the same semiconductor substrate, if the area of ​​the photodiode is increased within the limited area of ​​the semiconductor substrate, the size of the transistor in the pixel circuit may be reduced, and if the size of the transistor in the pixel circuit is increased, the area of ​​the photodiode may be reduced.

[0113] To solve these problems, for example, the imaging device 1 of the present embodiment uses a structure in which a plurality of pixels 541 share one pixel circuit 210, and the shared pixel circuit 210 is arranged so as to overlap the photodiode PD. This makes it possible to maximize the area of ​​the photodiode PD and to maximize the size of the transistor provided in the pixel circuit 210 within the limited area of ​​the semiconductor substrate. This improves the S / N ratio of the pixel signal, and enables the imaging device 1 to output better image data (image information).

[0114] When realizing a structure in which a plurality of pixels 541 share one pixel circuit 210 and this is arranged to overlap the photodiode PD, a plurality of wirings connected to one pixel circuit 210 extend from the floating diffusion FD of each of the plurality of pixels 541. In order to secure a large area of ​​the semiconductor layer 200S forming the pixel circuit 210, for example, a connection wiring can be formed that connects the plurality of extending wirings to each other and combines them into one. Similarly, for the plurality of wirings extending from the VSS contact region 118, a connection wiring can be formed that connects the plurality of extending wirings to each other and combines them into one.

[0115] For example, if a connection wiring that interconnects the multiple wirings extending from the floating diffusion FD of each of the multiple pixels 541 is formed in the semiconductor layer 200S that forms the pixel circuit 210, it is considered that the area for forming the transistors included in the pixel circuit 210 will be reduced. Similarly, if a connection wiring that interconnects the multiple wirings extending from the VSS contact region 118 of each of the multiple pixels 541 and combines them into one is formed in the semiconductor layer 200S that forms the pixel circuit 210, it is considered that the area for forming the transistors included in the pixel circuit 210 will be reduced.

[0116] In order to solve these problems, for example, the imaging device 1 of this embodiment can have a structure in which a plurality of pixels 541 share one pixel circuit 210, and the shared pixel circuit 210 is arranged superimposed on a photodiode PD, and the first substrate 100 can be provided with a connection wiring that interconnects and combines the floating diffusions FD of the plurality of pixels 541, and a connection wiring that interconnects and combines the VSS contact regions 118 provided in each of the plurality of pixels 541.

[0117] Here, when the above-mentioned second manufacturing method is used as a manufacturing method for providing the first substrate 100 with the connection wiring for connecting the floating diffusions FD of the plurality of pixels 541 to one another and the connection wiring for connecting the VSS contact regions 118 of the plurality of pixels 541 to one another, for example, the first substrate 100 and the second substrate 200 can be manufactured using an appropriate process according to the configuration of each substrate, and a high-quality, high-performance imaging device can be manufactured. In addition, the connection wiring of the first substrate 100 and the second substrate 200 can be formed by a simple process. Specifically, when the above-mentioned second manufacturing method is used, an electrode connected to the floating diffusion FD and an electrode connected to the VSS contact region 118 are provided on the surface of the first substrate 100 and the surface of the second substrate 200, which are the bonding interface between the first substrate 100 and the second substrate 200. Furthermore, it is preferable to make the electrodes formed on the surfaces of the two substrates large so that the electrodes can contact each other even if a positional deviation occurs between the electrodes provided on the surfaces of the two substrates when the first substrate 100 and the second substrate 200 are bonded together. In this case, it may become difficult to arrange the electrodes within the limited area of ​​each pixel of the imaging device 1.

[0118] In order to solve the problem of needing a large electrode at the bonding interface between the first substrate 100 and the second substrate 200, for example, the imaging device 1 of this embodiment can use the first manufacturing method described above as a manufacturing method in which a plurality of pixels 541 share one pixel circuit 210 and the shared pixel circuit 210 is arranged so as to overlap the photodiode PD. This makes it easy to align the elements formed on the first substrate 100 and the second substrate 200, respectively, and allows the manufacturing of a high-quality, high-performance imaging device. Furthermore, it is possible to have a unique structure that is generated by using this manufacturing method. That is, the structure has a semiconductor layer 100S and wiring layer 100T of the first substrate 100 and a semiconductor layer 200S and wiring layer 200T of the second substrate 200 stacked in this order, in other words, a structure in which the first substrate 100 and the second substrate 200 are stacked face-to-back, and has through electrodes 120E, 121E that pass from the surface side of the semiconductor layer 200S of the second substrate 200, through the semiconductor layer 200S and the wiring layer 100T of the first substrate 100, and reach the surface of the semiconductor layer 100S of the first substrate 100.

[0119] In a structure in which a first substrate 100 is provided with connection wiring that interconnects and combines the floating diffusions FD of the multiple pixels 541 into one, and connection wiring that interconnects and combines the VSS contact regions 118 of the multiple pixels 541 into one, if this structure is stacked on a second substrate 200 using the first manufacturing method to form a pixel circuit 210 on the second substrate 200, there is a possibility that the influence of the heating process required when forming the active elements provided in the pixel circuit 210 will extend to the connection wiring formed on the first substrate 100.

[0120] Therefore, in order to solve the problem that the connection wiring is affected by the heat treatment when forming the active element, in the imaging device 1 of the present embodiment, it is desirable to use a conductive material with high heat resistance for the connection wiring that connects the floating diffusions FD of the respective pixels 541 to each other and combines them into one, and for the connection wiring that connects the VSS contact regions 118 of the respective pixels 541 to each other and combines them into one. Specifically, the conductive material with high heat resistance can be a material with a higher melting point than at least a part of the wiring material included in the wiring layer 200T of the second substrate 200.

[0121] In this manner, for example, the imaging device 1 of the present embodiment has: (1) a structure in which the first substrate 100 and the second substrate 200 are stacked face-to-back (specifically, a structure in which the semiconductor layer 100S and the wiring layer 100T of the first substrate 100 and the semiconductor layer 200S and the wiring layer 200T of the second substrate 200 are stacked in this order); (2) a structure in which through-electrodes 120E, 121E are provided from the front surface side of the semiconductor layer 200S of the second substrate 200, penetrating the semiconductor layer 200S and the wiring layer 100T of the first substrate 100, and reaching the front surface of the semiconductor layer 100S of the first substrate 100; and (3) a structure in which the floating diffusions FD provided in each of the plurality of pixels 541 are provided. By providing a structure in which the first substrate 100 and the second substrate 200 have a connection wiring that interconnects the floating diffusions FD of the respective pixels 541 and combines them into one, and a connection wiring that interconnects the VSS contact regions 118 of the respective pixels 541 and combines them into one, and a structure in which the connection wiring is formed from a conductive material with high heat resistance, it is possible to provide the first substrate 100 with the connection wiring that interconnects the floating diffusions FD of the respective pixels 541 and combines them into one, and the connection wiring that connects the VSS contact regions 118 of the respective pixels 541 and combines them into one, without providing a large electrode at the interface between the first substrate 100 and the second substrate 200.

[0122] [Operation of imaging device 1] Next, the operation of the imaging device 1 will be described with reference to Figs. 16 and 17. Figs. 16 and 17 are diagrams in which arrows representing the paths of each signal have been added to Fig. 3. Fig. 16 shows the paths of the input signal input from the outside to the imaging device 1, the power supply potential, and the reference potential with arrows. Fig. 17 shows the signal paths of the pixel signals output from the imaging device 1 to the outside with arrows. For example, an input signal (e.g., a pixel clock and a synchronization signal) input to the imaging device 1 via the input section 510A is transmitted to the row driver 520 of the third substrate 300, and a row drive signal is generated in the row driver 520. This row drive signal is sent to the second substrate 200 via the contact sections 301 and 201. Furthermore, this row drive signal reaches each of the pixel shared units 539 of the pixel array section 540 via a row drive signal line 542 in the wiring layer 200T. Among the row driving signals that reach the pixel sharing unit 539 of the second substrate 200, the driving signals other than the transfer gate TG are input to the pixel circuit 210, and each transistor included in the pixel circuit 210 is driven. The driving signal of the transfer gate TG is input to the transfer gates TG1, TG2, TG3, and TG4 of the first substrate 100 via the through electrode TGV, and the pixels 541A, 541B, 541C, and 541D are driven (FIG. 16). In addition, the power supply potential and the reference potential supplied to the input section 510A (input terminal 511) of the third substrate 300 from the outside of the imaging device 1 are sent to the second substrate 200 via the contact sections 301 and 201, and are supplied to the pixel circuits 210 of each pixel sharing unit 539 via the wiring in the wiring layer 200T. The reference potential is also supplied to the pixels 541A, 541B, 541C, and 541D of the first substrate 100 via the through electrode 121E. Meanwhile, pixel signals photoelectrically converted by the pixels 541A, 541B, 541C, and 541D of the first substrate 100 are sent to the pixel circuit 210 of the second substrate 200 for each pixel sharing unit 539 via the through-electrode 120E. A pixel signal based on this pixel signal is sent from the pixel circuit 210 to the third substrate 300 via the vertical signal line 543 and the contact units 202 and 302. This pixel signal is processed by the column signal processing unit 550 and the image signal processing unit 560 of the third substrate 300, and then output to the outside via the output unit 510B.

[0123] [effect] In this embodiment, a shield electrode 220 connected to a fixed potential (for example, a ground electrode) is provided between a through wiring (for example, a through electrode 120E) that penetrates the insulating region 212 in the thickness direction and a transistor (for example, an amplification transistor AMP) that constitutes the pixel circuit 210. This blocks the effect of the electric field from the through electrode 120E on the amplification transistor AMP.

[0124] In an imaging device having a three-dimensional structure in which a semiconductor substrate having a plurality of sensor pixels and a semiconductor substrate having a signal processing circuit for processing signals obtained by each sensor pixel are stacked on top of each other, a through-hole is disposed near a transistor constituting the signal processing circuit, and therefore the transistor constituting the signal processing circuit is affected by a bias applied to the through-hole, and the leakage current increases compared to when there is no through-hole (see FIG. 14).

[0125] In contrast, in the imaging device 1 of the present embodiment, a shield electrode 220 connected to, for example, a ground electrode is provided between, for example, the through electrode 120E and, for example, the amplification transistor AMP constituting the pixel circuit 210. This makes it possible to shield the electric field of the through electrode 120E and reduce the influence on the amplification transistor AMP. That is, it becomes possible to reduce the variation in transistor characteristics due to the presence or absence of a bias applied to the through electrode 120E or due to a change in the bias.

[0126] As described above, in this embodiment, the shield electrode 220 connected to a fixed potential is provided between the through wiring (for example, the through electrode 120E) that penetrates the insulating region 212 in the thickness direction and the transistor (for example, the amplification transistor AMP) provided in the semiconductor layer 200S, so that the electric field of the through electrode 120E with respect to the amplification transistor AMP is shielded by the shield electrode 220. This reduces the fluctuation in the transistor characteristics of the amplification transistor AMP due to the bias applied to the through electrode 120E. Therefore, it is possible to provide an imaging device 1 with high reliability.

[0127] In this embodiment, the pixels 541A, 541B, 541C, and 541D (pixel sharing unit 539) and the pixel circuit 210 are provided on different substrates (first substrate 100 and second substrate 200). This allows the areas of the pixels 541A, 541B, 541C, and 541D and the pixel circuit 210 to be enlarged compared to when the pixels 541A, 541B, 541C, and 541D and the pixel circuit 210 are formed on the same substrate. As a result, it is possible to increase the amount of pixel signals obtained by photoelectric conversion and reduce the transistor noise of the pixel circuit 210. This improves the signal-to-noise ratio of the pixel signals, and the imaging device 1 can output better pixel data (image information). In addition, it is possible to miniaturize the imaging device 1 (in other words, reduce the pixel size and make the imaging device 1 smaller). The imaging device 1 can increase the number of pixels per unit area by reducing the pixel size, and output a high-quality image.

[0128] In addition, in the imaging device 1, the first substrate 100 and the second substrate 200 are electrically connected to each other by the through electrodes 120E, 121E provided in the insulating region 212. For example, a method of connecting the first substrate 100 and the second substrate 200 by bonding pad electrodes to each other, or a method of connecting by through wiring (for example, TSV (Thorough Si Via)) that penetrates a semiconductor layer can be considered. Compared to such methods, by providing the through electrodes 120E, 121E in the insulating region 212, the area required for connecting the first substrate 100 and the second substrate 200 can be reduced. This reduces the pixel size, and the imaging device 1 can be made more compact. In addition, the resolution can be increased by further miniaturizing the area per pixel. When it is not necessary to reduce the chip size, the formation area of ​​the pixels 541A, 541B, 541C, 541D and the pixel circuit 210 can be expanded. As a result, it is possible to increase the amount of pixel signals obtained by photoelectric conversion and reduce noise in the transistors provided in the pixel circuits 210. This improves the signal-to-noise ratio of the pixel signals, enabling the imaging device 1 to output better pixel data (image information).

[0129] Furthermore, in the imaging device 1, the pixel circuit 210, the column signal processing section 550, and the image signal processing section 560 are provided on different substrates (the second substrate 200 and the third substrate 300). This allows the area of ​​the pixel circuit 210 and the areas of the column signal processing section 550 and the image signal processing section 560 to be enlarged compared to a case in which the pixel circuit 210, the column signal processing section 550, and the image signal processing section 560 are formed on the same substrate. This allows noise generated in the column signal processing section 550 to be reduced, and allows the image signal processing section 560 to be equipped with a more advanced image processing circuit. This improves the signal-to-noise ratio of the pixel signal, and enables the imaging device 1 to output better pixel data (image information).

[0130] In the imaging device 1, the pixel array section 540 is provided on the first substrate 100 and the second substrate 200, and the column signal processing section 550 and the image signal processing section 560 are provided on the third substrate 300. The contact sections 201, 202, 301, and 302 that connect the second substrate 200 and the third substrate 300 are formed above the pixel array section 540. Therefore, the contact sections 201, 202, 301, and 302 can be freely laid out without being interfered with in the layout by various wirings provided in the pixel array. This makes it possible to use the contact sections 201, 202, 301, and 302 for electrical connection between the second substrate 200 and the third substrate 300. By using the contact sections 201, 202, 301, and 302, for example, the column signal processing section 550 and the image signal processing section 560 have a high degree of freedom in layout. This makes it possible to reduce noise generated in the column signal processing unit 550 and to incorporate a more advanced image processing circuit in the image signal processing unit 560. Therefore, the signal-to-noise ratio of the pixel signals is improved, and the imaging device 1 can output better pixel data (image information).

[0131] Furthermore, in the imaging device 1, the pixel separator 117 penetrates the semiconductor layer 100S. This makes it possible to suppress color mixing between the pixels 541A, 541B, 541C, and 541D even if the distance between adjacent pixels (pixels 541A, 541B, 541C, and 541D) is reduced due to miniaturization of the area per pixel. This improves the signal-to-noise ratio of the pixel signal, enabling the imaging device 1 to output better pixel data (image information).

[0132] Furthermore, in the imaging device 1, a pixel circuit 210 is provided for each pixel sharing unit 539. This allows the formation area of ​​the transistors (amplification transistor AMP, reset transistor RST, selection transistor SEL, FD conversion gain switching transistor FDG) that constitute the pixel circuit 210 to be larger than when a pixel circuit 210 is provided for each of the pixels 541A, 541B, 541C, and 541D. For example, by increasing the formation area of ​​the amplification transistor AMP, it is possible to suppress noise. This improves the signal-to-noise ratio of the pixel signal, and enables the imaging device 1 to output better pixel data (image information).

[0133] Furthermore, in the imaging device 1, the pad section 120 that electrically connects the floating diffusions FD (floating diffusions FD1, FD2, FD3, FD4) of the four pixels (pixels 541A, 541B, 541C, 541D) is provided on the first substrate 100. This makes it possible to reduce the number of through electrodes (through electrodes 120E) that connect the first substrate 100 and the second substrate 200, compared to the case where such a pad section 120 is provided on the second substrate 200. Therefore, it is possible to reduce the insulating region 212 and ensure a sufficient size of the formation region (semiconductor layer 200S) of the transistors that constitute the pixel circuit 210. This makes it possible to reduce noise of the transistors provided in the pixel circuit 210, improve the signal-to-noise ratio of the pixel signal, and enable the imaging device 1 to output better pixel data (image information).

[0134] In the present embodiment, the second substrate 200 has an example in which the amplification transistor AMP, the reset transistor RST, and the selection transistor SEL that can configure the pixel circuit 210 are formed in one semiconductor layer 200S. However, at least one transistor may be formed in the semiconductor layer 200S-1, and the remaining transistors may be formed in a semiconductor layer 200S-2 that is different from the semiconductor layer 100S and the semiconductor layer 200S-1. Although not shown, the semiconductor layer 200S-2 is formed, for example, by forming an insulating layer, a connection portion, and a connection wiring on the semiconductor layer 200S-1 (corresponding to the semiconductor layer 200S), and further laminating the semiconductor layer 200S-2. This new semiconductor layer 200S-2 is laminated on the surface of the interlayer insulating film 123 opposite to the surface laminated on the semiconductor layer 100S, and a desired transistor can be formed. As an example, the amplification transistor AMP can be formed in the semiconductor layer 200S-1, and the reset transistor RST and / or the selection transistor SEL can be formed in the semiconductor layer 200S-2.

[0135] Alternatively, a plurality of new semiconductor layers may be provided, and a desired transistor of the pixel circuit 210 may be provided in each of them. As an example, an amplification transistor AMP may be formed in the semiconductor layer 200S-1. Furthermore, by stacking an insulating layer, a connection portion, and a connection wiring on the semiconductor layer 200S, and then stacking the semiconductor layer 200S-2, a reset transistor RST may be formed in the semiconductor layer 200S-2. By stacking an insulating layer, a connection portion, and a connection wiring on the semiconductor layer 200S, and then stacking the semiconductor layer 200S-3, a selection transistor SEL may be formed in the semiconductor layer 200S-3. The transistors formed in the semiconductor layers 200S-1, 200S-2, and 200S-3 may be any transistor constituting the pixel circuit 210.

[0136] In this way, by providing a plurality of semiconductor layers on the second substrate 200, the area of ​​the semiconductor layer 200S occupied by one pixel circuit 210 can be reduced. If the area of ​​each pixel circuit 210 can be reduced or each transistor can be miniaturized, the chip area can be reduced. In addition, the area of ​​a desired transistor among the amplification transistor, reset transistor, and selection transistor that can configure the pixel circuit 210 can be increased. In particular, by increasing the area of ​​the amplification transistor, a noise reduction effect can be expected.

[0137] As described above, even when the pixel circuit 210 is formed by dividing it into a plurality of semiconductor layers (e.g., semiconductor layers 200S-1, 200S-2, 200S-3), a shield electrode 220 may be provided between the through electrode 120E and each pixel transistor provided in each semiconductor layer.

[0138] The following describes the second embodiment and modifications 1 to 11. In the following, the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0139] <2. Modifications> (2-1. Variation 1) Fig. 18A shows a schematic cross-sectional configuration of an electrical connection portion between a first substrate 100 and a second substrate 200 via through-hole wiring, which are essential parts of an imaging device (imaging device 1A) according to one variation (variation 1) of the first embodiment, and the vicinity thereof. Fig. 18B shows a schematic example of a planar configuration in a horizontal direction relative to the main surface of the second substrate 200 shown in Fig. 18A. The imaging device 1A of this variation differs from the first embodiment in that the shield electrode 220 extends to the surface of the semiconductor layer 100S of the first substrate 100.

[0140] One end (lower end) of the shield electrode 220 of this modification penetrates the insulating region 212 and the wiring layer 100T of the first substrate 100 and contacts the surface of the semiconductor layer 100S. The other end (upper end) of the shield electrode 220 extends into the wiring layer 200T of the second substrate 200 as in the first embodiment and contacts, for example, the first wiring layer W1. The first wiring layer W1 in contact with the shield electrode 220 is connected to, for example, a ground (GND) electrode, so that a fixed potential is applied to the shield electrode 220.

[0141] On the surface of the semiconductor layer 100S with which the shield electrode 220 is in contact, for example, a p-type semiconductor region (for example, the VSS contact region 118) is formed.

[0142] The configuration of this modification is useful, for example, when forming the VSS contact region 118 around the floating diffusion FD.

[0143] (2-2. Variation 2) Fig. 19A shows a schematic cross-sectional configuration of an electrical connection portion between a first substrate 100 and a second substrate 200 via through-hole wiring, which are essential parts of an imaging device (imaging device 1B) according to a modification (modification 2) of the first embodiment, and the vicinity thereof. Fig. 19B shows a schematic example of a planar configuration in a horizontal direction relative to the main surface of the second substrate 200 shown in Fig. 19A. The imaging device 1B of this modification differs from the first embodiment in that a shield electrode 220 is provided so as to surround the through-hole electrode 120E.

[0144] The shield electrode 220 of this modification is provided continuously around the through electrode 120E with an insulating film therebetween. One end (lower end) of the shield electrode 220 penetrates the wiring layer 100T of the first substrate 100 and contacts the surface of the semiconductor layer 100S, for example, as in the above modification 1. The other end (upper end) of the shield electrode 220 extends into the wiring layer 200T of the second substrate 200 and contacts, for example, the first wiring layer W1, as in the above first embodiment. The first wiring layer W1 in contact with the shield electrode 220 is connected to, for example, a ground (GND) electrode, so that a fixed potential is applied to the shield electrode 220.

[0145] For example, a p-type semiconductor region (for example, the VSS contact region 118) is formed on the surface of the semiconductor layer 100S in contact with the shield electrode 220. In this modification, it is sufficient that at least a portion of the shield electrode 220 in contact with the surface of the semiconductor layer 100S is in contact with, for example, the VSS contact region 118 provided on the surface of the semiconductor layer 100S.

[0146] The configuration of this modification is useful, for example, when the VSS contact region 118 is formed around the floating diffusion FD. That is, the through electrode 121E can be used as the shield electrode 220. In this modification, the through electrode 120E is surrounded by the shield electrode 220, and therefore, in addition to the effect of the first embodiment, for example, when a plurality of transistors (for example, the amplification transistor AMP, the selection transistor SEL, the reset transistor RST, and the FD conversion gain switching transistor FDG) are arranged around the through electrode 120E, the effect of reducing the influence of the bias applied to the through electrode 120E over the entire periphery can be achieved.

[0147] (2-3. Variation 3) Fig. 20A shows a schematic cross-sectional configuration of an electrical connection portion between a first substrate 100 and a second substrate 200 via through-hole wiring, which are essential parts of an imaging device (imaging device 1C) according to a modification (modification 3) of the first embodiment, and the vicinity thereof. Fig. 20B shows a schematic example of a planar configuration in a horizontal direction relative to the main surface of the second substrate 200 shown in Fig. 20A. The imaging device 1C of this modification differs from the first embodiment in that a part of a shield electrode 220 surrounding a through-hole electrode 120E is in contact with a VSS contact region 218 formed in the vicinity of the surface of the semiconductor layer 200S.

[0148] In this way, by connecting a part of the shield electrode 220 provided around the through electrode 120E and contacting the VSS contact region 118 of the first substrate 100 to the VSS contact region 218 of the second substrate 200, it is possible to collectively form wiring that electrically connects the VSS contact region 118 and the VSS contact region 218 to the power supply line VSS. As a result, compared to a case where the electrical connection between the VSS contact region 218 of the second substrate and the upper layer wiring (for example, the first wiring layer W1, etc.) is realized by separately routing, for example, the first wiring layer W1, the semiconductor layer 200S can be used as a layout area for other transistors. That is, in addition to the effect of the first embodiment, an effect is achieved that the area efficiency can be improved.

[0149] In addition, as described in the first embodiment above, in the case where the pixel circuit 210 is formed by dividing it into a plurality of semiconductor layers (e.g., semiconductor layers 200S-1, 200S-2, 200S-3), for example, as shown in Figures 56 and 57 corresponding to Modification Example 12 described later, in the semiconductor layer 1211 (corresponding to semiconductor layer 200S-1) in which a pixel transistor (e.g., an amplifying transistor AMP) is provided, the seal and electrode 220 may penetrate the insulating region 212, and in the semiconductor layer 1221 (corresponding to semiconductor layer 200S-2) in which other pixel transistors (e.g., a reset transistor RST, a selection transistor SEL, etc.) are provided, the seal and electrode 220 may be in contact with, for example, the VSS contact region 218.

[0150] <3. Second embodiment> Fig. 21 shows a cross-sectional configuration of an electrical connection via a through-hole wiring between a first substrate 100 and a second substrate 200, which are essential parts of an imaging device (imaging device 2) according to a second embodiment of the present disclosure. Fig. 22 shows a schematic diagram of an example of a planar configuration in a horizontal direction relative to the main surface of the second substrate of the imaging device 2, and shows the position of formation of a shielding film 230 in a planar view. In the imaging device 2 of this embodiment, the shielding film 230 is formed around the semiconductor layer 200S with an insulating film sandwiched therebetween. This shielding film 230 corresponds to a specific example of a "conductive film" in the present disclosure.

[0151] The shielding film 230 is intended to reduce the influence of a bias applied to the through-wire on each transistor constituting the pixel circuit 210. The shielding film 230 is provided around the semiconductor layer 200S constituting the second substrate 200, with an insulating film therebetween. Specifically, the shielding film 230 is provided in an insulating region 212 that divides the semiconductor layer 200S.

[0152] The shielding film 230 is disposed at a position closer to the semiconductor layer 200S than the through wiring (for example, the through electrodes 120E, 121E, and the through electrode TGV) provided in the insulating region 212, and penetrates the insulating region 212. In other words, for example, the shielding film 230 is preferably disposed at a position where the shortest distance to the semiconductor layer 200S is shorter than the shortest distance to the through wiring (for example, the through electrodes 120E, 121E, and the through electrode TGV) in a plan view. The shielding film 230 is connected to, for example, a ground (GND) electrode, and a fixed potential is applied to the shielding film 230. This makes it possible to shield an electric field from the through wiring that occurs when a bias is applied to the through wiring. The distance between the shielding film 230 and the semiconductor layer 200S, that is, the thickness of the insulating film between the shielding film 230 and the semiconductor layer 200S may be sufficient as long as the insulation between the shielding film 230 and the semiconductor layer 200S is ensured.

[0153] The shielding film 230 can be formed using, for example, the same material as the through electrode 120E, such as copper (Cu) or tungsten (W). This allows the shielding film 230 to be formed simultaneously when the through electrode 120E is formed. The shielding film 230 may be formed using a material different from that of the through electrode 120E, so long as the material is conductive and has high heat resistance (for example, 600° C. or higher, more preferably 850° C. or higher). Examples of materials for the shielding film 230 include two-dimensional materials such as graphene and transition metal dichalcogenides (TMDs), and polysilicon (Poly Si).

[0154] Such an imaging device 2 can be manufactured, for example, as follows: Figures 23A to 23C show an example of a manufacturing process for the imaging device 2.

[0155] First, the semiconductor layer 200S is bonded onto the first substrate 100 (interlayer insulating film 123) via the bonding film 124, and the semiconductor layer 200S is thinned as necessary. Then, the semiconductor layer 200S is separated to form openings that form the insulating region 212 and the element isolation region 213. Next, an insulating film (e.g., a silicon oxide film) is formed so as to fill the openings, thereby forming the insulating region 212 and the element isolation region 213.

[0156] 23A, an opening 212H penetrating the insulating region 212 is formed near the semiconductor layer 200S of the insulating region 212. Next, as shown in Fig. 23B, for example, polysilicon (Poly Si) is embedded in the opening 212H to form a shielding film 230. Although not shown, the shielding film 230 is connected to a ground (GND) electrode.

[0157] 23C, a passivation film 221 and an interlayer insulating film 222 are formed on the semiconductor layer 200S and the insulating region 212, and then through holes reaching the pads 120, 121 and the transfer gate TG are formed at predetermined positions of the insulating region 212 (for example, positions facing the pads 120, 121 and the transfer gate TG), and the through holes are filled with, for example, tungsten (W) to form the through electrodes 120E, 121E and the through electrode TGV in the through holes. This forms an electrical connection between the shielding film 230 and the first substrate 100 and the second substrate 200 via the through wiring shown in FIG.

[0158] As described above, in this embodiment, the shielding film 230 is provided in the insulating region 212 that divides the semiconductor layer 200S in which each transistor (for example, the amplification transistor AMP, the reset transistor RST, the selection transistor SEL, and the FD conversion gain switching transistor FDG) constituting the pixel circuit 210 is formed, so as to surround the semiconductor layer 200S. This makes it possible to shield the channel region of each transistor from the electric field from the through wiring (for example, the through electrodes 120E, 121R and the through electrode TGV) provided in the insulating region 212, thereby reducing the occurrence of noise. Therefore, it is possible to provide an imaging device 2 with high reliability.

[0159] As described in the first embodiment, when the pixel circuit 210 is formed by dividing it into a plurality of semiconductor layers (for example, semiconductor layers 200S-1, 200S-2, and 200S-3), the light-shielding film 230 may be provided in each semiconductor layer.

[0160] <4. Variation 4> 24 is a schematic cross-sectional view of an electrical connection between a first substrate 100 and a second substrate 200 via a through-hole wiring, which is a main part of an imaging device (imaging device 2A) according to a modification (modification 4) of the second embodiment. The imaging device 2A of this modification is different from the second embodiment in that a shielding film 230 and a through-hole electrode 421E penetrating a wiring layer 100T are electrically connected on the bonding surface side with the first substrate 100.

[0161] The shielding film 230 of this modification is connected to a through electrode 421E, for example, via a wiring 230E extending to the bonding surface between the first substrate 100 and the second substrate 200, at a position substantially opposite to the pad portion 121 that connects the multiple VSS contact regions 118 to each other. The through electrode 421E is a through wiring that penetrates the wiring layer 100T, and is provided on the pad portion 121 that connects the multiple VSS contact regions 181. The shielding film 230 of this modification is also electrically connected to the VSS contact region 218 provided in the semiconductor layer 200S.

[0162] As a result, the shielding film 230 is electrically connected to the power supply line VSS provided in the wiring layer 200T via the VSS contact region 218. Furthermore, the VSS contact region 118 of the first substrate 100 is electrically connected via the VSS contact region 218, the shielding film 230, and the through electrode 421E. When the shielding film 230 and the VSS contact region 218 are electrically connected, the shielding films 230 are electrically connected to each other. Although the connection method is not shown in the figure, for example, they may be connected in a planar manner in the semiconductor layer 200S, or they may be electrically connected to each other by contacts formed in the wiring layer 200T.

[0163] Such an imaging device 2A can be manufactured, for example, as follows: Figures 25A to 25C show an example of a manufacturing process for the imaging device 2A.

[0164] First, the semiconductor layer 200S is bonded onto the first substrate 100 (interlayer insulating film 123) via the bonding film 124, and the semiconductor layer 200S is thinned as necessary. The semiconductor layer 200S is then separated to form an opening 212H that constitutes the insulating region 212 and the element isolation region 213. Then, as shown in Fig. 25A, an insulating film (silicon oxide film) is formed on the surface of the semiconductor layer 200S by, for example, thermal oxidation. Also, an opening 100TH is formed that penetrates the wiring layer 100T to the pad portion 121.

[0165] Next, as shown in FIG. 25B, for example, polysilicon (Poly Si) is filled into opening 212H and opening 100TH, and areas other than desired regions are removed to form shielding film 230, wiring 230E continuing from shielding film 230, and through electrode 421E.

[0166] 25C, an insulating film (e.g., a silicon oxide film) is formed so as to fill the opening 212H, and then a passivation film 221 and an interlayer insulating film 222 are formed in this order. Next, through holes reaching the pad section 120 and the transfer gate TG are formed in predetermined positions (e.g., positions facing the pad section 120 and the transfer gate TG) of the insulating region 212, respectively, and the through holes are filled with, for example, tungsten (W) to form the through electrodes 120E and the through electrodes TGV. This completes the imaging device 2A having the configuration shown in FIG. 24.

[0167] In addition, in the above-mentioned manufacturing process, an example has been shown in which the shielding film 230 and the through electrode 421E are formed in the semiconductor layer 200S in which the element isolation region 213 has already been formed, but the element isolation region 213 may be formed after the shielding film 230 and the through electrode 421E are formed and the opening 212H is filled with an insulating film.

[0168] As described above, in this modification, the shielding film 230 and the through electrode 421E penetrating the wiring layer 100T are connected on the first substrate 100 side, and the VSS contact region 118 of the first substrate 100 and the power supply line VSS are electrically connected via the VSS contact region 218 of the second substrate 200, the shielding film 230, the through electrode 421E, and the pad portion 121. This makes it possible to reduce the area of ​​the insulating region 212 by an amount corresponding to the formation of the through electrode 121E penetrating the insulating region 212, as in the second embodiment. That is, in addition to the effect of the second embodiment, it becomes possible to improve the area efficiency.

[0169] In this modified example, the through electrode 421E and the shielding film 230 are connected on the bonding surface side between the first substrate 100 and the second substrate 200, and the VSS contact region 181 of the first substrate 100 and the VSS contact region 218 of the second substrate 200 are electrically connected via the through electrode 421E and the shielding film 230, but the present technology can also be applied to other through wiring.

[0170] Specifically, for example, as shown in FIG. 26, a through electrode 420E is provided on the pad section 120 that connects a plurality of floating diffusions FD to each other, and penetrates the wiring layer 100T, and the through electrode 420E and the shielding film 230 may be connected on the bonding surface side between the first substrate 100 and the second substrate 200. As a result, the floating diffusion FD and the gate of the amplification transistor AMP are electrically connected via the shielding film 230, the through electrode 420E, and the pad section 120, so that the area of ​​the insulating region 212 for forming the through electrode 120E penetrating the insulating region 212 can be reduced. That is, in addition to the area for forming the through electrode 121E, the area for forming the through electrode 120E can be reduced. Therefore, it is possible to further improve the area efficiency.

[0171] In addition, since the number of through-wires that run from the wiring layer 100T of the first substrate 100 to the wiring layer 200T of the second substrate 200 and the height at which they run parallel to each other can be reduced, it is possible to reduce the parasitic capacitance that occurs between each through-wire.

[0172] In addition, when it is difficult to electrically connect the through electrode 421E connected to the VSS contact region 118 to the shielding film 230 as in this modification, it is preferable to form a contact wiring electrically connected to the VSS contact region 118 or the VSS contact region 218 separately in the shielding film 230. This makes it possible to shield the channel region of each transistor from the influence of the electric field from the through wiring (for example, the through electrodes 120E, 121R and the through electrode TGV) provided in the insulating region 212, and reduce the generation of noise.

[0173] <5. Variation 5> 27 to 31 show a modified example of the planar configuration of the imaging device 1 according to the above embodiment. FIG. 27 shows a schematic planar configuration of the semiconductor layer 200S of the second substrate 200 near the surface, and corresponds to FIG. 8 described in the above embodiment. FIG. 28 shows a schematic configuration of the first wiring layer W1 and the semiconductor layer 200S and each part of the first substrate 100 connected to the first wiring layer W1, and corresponds to FIG. 9 described in the above embodiment. FIG. 29 shows an example of the planar configuration of the first wiring layer W1 and the second wiring layer W2, and corresponds to FIG. 10 described in the above embodiment. FIG. 30 shows an example of the planar configuration of the second wiring layer W2 and the third wiring layer W3, and corresponds to FIG. 11 described in the above embodiment. FIG. 31 shows an example of the planar configuration of the third wiring layer W3 and the fourth wiring layer W4, and corresponds to FIG. 12 described in the above embodiment.

[0174] In this modification, as shown in FIG. 28, of two pixel sharing units 539 arranged in the H direction of the second substrate 200, the internal layout of one pixel sharing unit 539 (e.g., the right side of the paper) is configured to be inverted only in the H direction from the internal layout of the other pixel sharing unit 539 (e.g., the left side of the paper). Also, the deviation in the V direction between the outline of one pixel sharing unit 539 and the outline of the other pixel sharing unit 539 is larger than the deviation described in the above embodiment (FIG. 9). In this way, by increasing the deviation in the V direction, it is possible to reduce the distance between the amplification transistor AMP of the other pixel sharing unit 539 and the pad section 120 connected thereto (the pad section 120 of the other (lower side of the paper) of the two pixel sharing units 539 arranged in the V direction shown in FIG. 7B). With such a layout, in the fifth modification of the imaging device 1 shown in FIGS. 27 to 31, the area of ​​the two pixel sharing units 539 arranged in the H direction can be made the same as that of the pixel sharing unit 539 of the second substrate 200 described in the above embodiment, without inverting the planar layouts of the two pixel sharing units 539 arranged in the H direction in the V direction. The planar layout of the pixel sharing unit 539 of the first substrate 100 is the same as the planar layout (FIGS. 7A and 7B) described in the above embodiment. Therefore, the imaging device 1 of this modification can obtain the same effect as the imaging device 1 described in the above embodiment. The arrangement of the pixel sharing units 539 of the second substrate 200 is not limited to the arrangements described in the above embodiment and this modification.

[0175] <6. Variation 6> 32 to 37 show a modified example of the planar configuration of the imaging device 1 according to the above embodiment. FIG. 32 shows a schematic planar configuration of the first substrate 100, and corresponds to FIG. 7A described in the above embodiment. FIG. 33 shows a schematic planar configuration of the semiconductor layer 200S of the second substrate 200 near the surface, and corresponds to FIG. 8 described in the above embodiment. FIG. 34 shows a schematic configuration of the first wiring layer W1 and the semiconductor layer 200S and each part of the first substrate 100 connected to the first wiring layer W1, and corresponds to FIG. 9 described in the above embodiment. FIG. 35 shows an example of the planar configuration of the first wiring layer W1 and the second wiring layer W2, and corresponds to FIG. 10 described in the above embodiment. FIG. 36 shows an example of the planar configuration of the second wiring layer W2 and the third wiring layer W3, and corresponds to FIG. 11 described in the above embodiment. FIG. 37 shows an example of a planar configuration of the third wiring layer W3 and the fourth wiring layer W4, and corresponds to FIG. 12 described in the above embodiment.

[0176] In this modification, the outer shape of each pixel circuit 210 has a substantially square planar shape (FIG. 33, etc.). In this respect, the planar configuration of the imaging device 1 of this modification differs from the planar configuration of the imaging device 1 described in the above embodiment.

[0177] For example, the pixel sharing unit 539 of the first substrate 100 is formed over a pixel region of 2 rows x 2 columns as described in the above embodiment, and has a substantially square planar shape ( FIG. 32 ). For example, in each pixel sharing unit 539, the horizontal portions TGb of the transfer gates TG1 and TG3 of the pixels 541A and 541C of one pixel column extend in a direction from a position overlapping with the vertical portion TGa toward the center of the pixel sharing unit 539 in the H direction (more specifically, in a direction toward the outer edges of the pixels 541A and 541C and toward the center of the pixel sharing unit 539), and the horizontal portions TGb of the transfer gates TG2 and TG4 of the pixels 541B and 541D of the other pixel column extend in a direction from a position overlapping with the vertical portion TGa toward the outside of the pixel sharing unit 539 in the H direction (more specifically, in a direction toward the outer edges of the pixels 541B and 541D and toward the outside of the pixel sharing unit 539). The pad portion 120 connected to the floating diffusion FD is provided in the center of the pixel sharing unit 539 (the center of the pixel sharing unit 539 in the H and V directions), and the pad portion 121 connected to the VSS contact region 118 is provided at the end of the pixel sharing unit 539 at least in the H direction (in the H and V directions in Figure 32).

[0178] As another arrangement example, it is possible to provide the horizontal parts TGb of the transfer gates TG1, TG2, TG3, and TG4 only in the region facing the vertical parts TGa. In this case, the semiconductor layer 200S is likely to be divided finely, as described in the above embodiment. Therefore, it is difficult to form the transistors of the pixel circuit 210 to be large. On the other hand, if the horizontal parts TGb of the transfer gates TG1, TG2, TG3, and TG4 are extended in the H direction from the position where they overlap with the vertical parts TGa as in the above modification, the width of the semiconductor layer 200S can be increased, as described in the above embodiment. Specifically, it is possible to arrange the positions in the H direction of the through electrodes TGV1 and TGV3 connected to the transfer gates TG1 and TG3 close to the position in the H direction of the through electrode 120E, and to arrange the positions in the H direction of the through electrodes TGV2 and TGV4 connected to the transfer gates TG2 and TG4 close to the position in the H direction of the through electrode 121E (FIG. 34). This allows the width (size in the H direction) of the semiconductor layer 200S extending in the V direction to be increased, as in the above embodiment. This allows the size of the transistors in the pixel circuit 210, particularly the size of the amplifying transistor AMP, to be increased. As a result, the signal-to-noise ratio of the pixel signal is improved, and the imaging device 1 can output better pixel data (image information).

[0179] The pixel sharing unit 539 of the second substrate 200 has, for example, approximately the same size in the H direction and the V direction as the pixel sharing unit 539 of the first substrate 100, and is provided, for example, over an area corresponding to a pixel area of ​​approximately 2 rows x 2 columns. For example, in each pixel circuit 210, a selection transistor SEL and an amplification transistor AMP are arranged side by side in the V direction in one semiconductor layer 200S extending in the V direction, and an FD conversion gain switching transistor FDG and a reset transistor RST are arranged side by side in the V direction in one semiconductor layer 200S extending in the V direction. The one semiconductor layer 200S in which the selection transistor SEL and the amplification transistor AMP are provided and the one semiconductor layer 200S in which the FD conversion gain switching transistor FDG and the reset transistor RST are provided are arranged side by side in the H direction via an insulating region 212. This insulating region 212 extends in the V direction (FIG. 33).

[0180] Here, the outer shape of the pixel sharing unit 539 of the second substrate 200 will be described with reference to Fig. 33 and Fig. 34. For example, the pixel sharing unit 539 of the first substrate 100 shown in Fig. 32 is connected to an amplification transistor AMP and a selection transistor SEL provided on one side of the H direction of the pad section 120 (the left side of the paper in Fig. 34), and an FD conversion gain switching transistor FDG and a reset transistor RST provided on the other side of the H direction of the pad section 120 (the right side of the paper in Fig. 34). The outer shape of the pixel sharing unit 539 of the second substrate 200 including the amplification transistor AMP, the selection transistor SEL, the FD conversion gain switching transistor FDG, and the reset transistor RST is determined by the following four outer edges.

[0181] The first outer edge is the outer edge of one end in the V direction (the end on the upper side of the paper in FIG. 34) of the semiconductor layer 200S including the selection transistor SEL and the amplification transistor AMP. This first outer edge is provided between the amplification transistor AMP included in the pixel sharing unit 539 and the selection transistor SEL included in the pixel sharing unit 539 adjacent to the pixel sharing unit 539 on one side in the V direction (the upper side of the paper in FIG. 34). More specifically, the first outer edge is provided in the center in the V direction of the element isolation region 213 between the amplification transistor AMP and the selection transistor SEL. The second outer edge is the outer edge of the other end in the V direction (the end on the lower side of the paper in FIG. 34) of the semiconductor layer 200S including the selection transistor SEL and the amplification transistor AMP. This second outer edge is provided between the selection transistor SEL included in the pixel sharing unit 539 and the amplification transistor AMP included in the pixel sharing unit 539 adjacent to the pixel sharing unit 539 on the other side in the V direction (the lower side of the paper in FIG. 34). More specifically, the second outer edge is provided in the center in the V direction of the element isolation region 213 between the selection transistor SEL and the amplification transistor AMP. The third outer edge is the outer edge of the other end in the V direction (the end on the lower side of the paper in FIG. 34) of the semiconductor layer 200S including the reset transistor RST and the FD conversion gain switching transistor FDG. This third outer edge is provided between the FD conversion gain switching transistor FDG included in the pixel shared unit 539 and the reset transistor RST included in the pixel shared unit 539 adjacent to the other side in the V direction (the lower side of the paper in FIG. 34) of this pixel shared unit 539. More specifically, the third outer edge is provided in the center in the V direction of the element isolation region 213 between the FD conversion gain switching transistor FDG and the reset transistor RST. The fourth outer edge is the outer edge of one end in the V direction (the end on the upper side of the paper in FIG. 34) of the semiconductor layer 200S including the reset transistor RST and the FD conversion gain switching transistor FDG. This fourth outer edge is provided between the reset transistor RST included in the pixel sharing unit 539 and the FD conversion gain switching transistor FDG (not shown) included in the pixel sharing unit 539 adjacent to the pixel sharing unit 539 on one side of the V direction (the upper side of the paper in Figure 34).More specifically, the fourth outer edge is provided at the center in the V direction of the element isolation region 213 (not shown) between the reset transistor RST and the FD conversion gain switching transistor FDG.

[0182] In the outline of the pixel sharing unit 539 of the second substrate 200 including such first, second, third, and fourth outer edges, the third and fourth outer edges are arranged to be shifted to one side in the V direction with respect to the first and second outer edges (in other words, offset to one side in the V direction). By using such a layout, it is possible to arrange both the gate of the amplification transistor AMP and the source of the FD conversion gain switching transistor FDG as close as possible to the pad section 120. Therefore, the area of ​​the wiring connecting them is reduced, and it becomes easier to miniaturize the imaging device 1. The VSS contact region 218 is provided between the semiconductor layer 200S including the selection transistor SEL and the amplification transistor AMP and the semiconductor layer 200S including the reset transistor RST and the FD conversion gain switching transistor FDG. For example, the multiple pixel circuits 210 have the same arrangement.

[0183] The imaging device 1 having such a second substrate 200 can also obtain the same effects as those described in the above embodiment. The arrangement of the pixel sharing units 539 of the second substrate 200 is not limited to the arrangements described in the above embodiment and this modified example.

[0184] <7. Variation 7> 38 to 43 show a modified example of the planar configuration of the imaging device 1 according to the above embodiment. FIG. 38 shows a schematic planar configuration of the first substrate 100, and corresponds to FIG. 7B described in the above embodiment. FIG. 39 shows a schematic planar configuration of the semiconductor layer 200S of the second substrate 200 near the surface, and corresponds to FIG. 8 described in the above embodiment. FIG. 40 shows a schematic configuration of the first wiring layer W1 and the semiconductor layer 200S and each part of the first substrate 100 connected to the first wiring layer W1, and corresponds to FIG. 9 described in the above embodiment. FIG. 41 shows an example of the planar configuration of the first wiring layer W1 and the second wiring layer W2, and corresponds to FIG. 10 described in the above embodiment. FIG. 42 shows an example of the planar configuration of the second wiring layer W2 and the third wiring layer W3, and corresponds to FIG. 11 described in the above embodiment. FIG. 43 shows an example of a planar configuration of the third wiring layer W3 and the fourth wiring layer W4, and corresponds to FIG. 12 described in the above embodiment.

[0185] In this modification, the semiconductor layer 200S of the second substrate 200 extends in the H direction (FIG. 40). That is, this substantially corresponds to a configuration obtained by rotating the planar configuration of the imaging device 1 shown in FIG. 33 and the like by 90 degrees.

[0186] For example, the pixel sharing unit 539 of the first substrate 100 is formed over a pixel region of 2 rows x 2 columns as described in the above embodiment, and has a substantially square planar shape ( FIG. 38 ). For example, in each pixel sharing unit 539, the transfer gates TG1 and TG2 of the pixels 541A and 541B in one pixel row extend toward the center of the pixel sharing unit 539 in the V direction, and the transfer gates TG3 and TG4 of the pixels 541C and 541D in the other pixel row extend toward the outside of the pixel sharing unit 539 in the V direction. The pad section 120 connected to the floating diffusion FD is provided in the center of the pixel sharing unit 539, and the pad section 121 connected to the VSS contact region 118 is provided at an end of the pixel sharing unit 539 at least in the V direction (in the V direction and H direction in FIG. 38 ). At this time, the V-direction positions of the through electrodes TGV1 and TGV2 of the transfer gates TG1 and TG2 approach the V-direction position of the through electrode 120E, and the V-direction positions of the through electrodes TGV3 and TGV4 of the transfer gates TG3 and TG4 approach the V-direction position of the through electrode 121E (FIG. 40). Therefore, for the same reason as described in the above embodiment, the width (size in the V direction) of the semiconductor layer 200S extending in the H direction can be increased. This makes it possible to increase the size of the amplification transistor AMP and suppress noise.

[0187] In each pixel circuit 210, the selection transistor SEL and the amplification transistor AMP are arranged side by side in the H direction, and the reset transistor RST is arranged adjacent to the selection transistor SEL in the V direction with the insulating region 212 between them (FIG. 39). The FD conversion gain switching transistor FDG is arranged side by side with the reset transistor RST in the H direction. The VSS contact region 218 is provided in an island shape in the insulating region 212. For example, the third wiring layer W3 extends in the H direction (FIG. 42), and the fourth wiring layer W4 extends in the V direction (FIG. 43).

[0188] The imaging device 1 having such a second substrate 200 can also obtain the same effects as those described in the above embodiment. The arrangement of the pixel sharing units 539 of the second substrate 200 is not limited to the arrangements described in the above embodiment and this modification. For example, the semiconductor layer 200S described in the above embodiment and modification 1 may extend in the H direction.

[0189] <8. Variation 8> Fig. 44 is a schematic diagram showing a modified cross-sectional configuration of the imaging device 1 according to the above embodiment. Fig. 44 corresponds to Fig. 3 described in the above embodiment. In this modified example, the imaging device 1 has contact portions 203, 204, 303, and 304 at positions facing the center of the pixel array section 540, in addition to the contact portions 201, 202, 301, and 302. In this respect, the imaging device 1 of this modified example differs from the imaging device 1 described in the above embodiment.

[0190] The contact portions 203 and 204 are provided on the second substrate 200, and are exposed on the bonding surface with the third substrate 300. The contact portions 303 and 304 are provided on the third substrate 300, and are exposed on the bonding surface with the second substrate 200. The contact portion 203 contacts the contact portion 303, and the contact portion 204 contacts the contact portion 304. That is, in this imaging device 1, the second substrate 200 and the third substrate 300 are connected by the contact portions 203, 204, 303, and 304 in addition to the contact portions 201, 202, 301, and 302.

[0191] Next, the operation of the imaging device 1 will be described with reference to FIG. 45 and FIG. 46. In FIG. 45, the input signal inputted from the outside to the imaging device 1, and the paths of the power supply potential and the reference potential are indicated by arrows. In FIG. 46, the signal path of the pixel signal outputted from the imaging device 1 to the outside is indicated by arrows. For example, the input signal inputted to the imaging device 1 via the input section 510A is transmitted to the row driver 520 of the third substrate 300, and the row driver 520 generates a row drive signal. This row drive signal is sent to the second substrate 200 via the contact sections 303 and 203. Furthermore, this row drive signal reaches each pixel sharing unit 539 of the pixel array section 540 via the row drive signal line 542 in the wiring layer 200T. Among the row drive signals that reach the pixel sharing units 539 of the second substrate 200, the drive signals other than the transfer gate TG are inputted to the pixel circuit 210, and each transistor included in the pixel circuit 210 is driven. A drive signal for the transfer gate TG is input to the transfer gates TG1, TG2, TG3, and TG4 of the first substrate 100 via the through electrode TGV, and the pixels 541A, 541B, 541C, and 541D are driven. In addition, a power supply potential and a reference potential supplied to an input section 510A (input terminal 511) of the third substrate 300 from the outside of the imaging device 1 are sent to the second substrate 200 via contact sections 303 and 203, and are supplied to the pixel circuits 210 of the pixel sharing units 539 via wiring in the wiring layer 200T. The reference potential is also supplied to the pixels 541A, 541B, 541C, and 541D of the first substrate 100 via the through electrode 121E. Meanwhile, pixel signals photoelectrically converted by the pixels 541A, 541B, 541C, and 541D of the first substrate 100 are sent to the pixel circuit 210 of the second substrate 200 for each pixel sharing unit 539. A pixel signal based on this pixel signal is sent from the pixel circuit 210 to the third substrate 300 via a vertical signal line 543 and contact units 204 and 304. This pixel signal is processed by a column signal processing unit 550 and an image signal processing unit 560 of the third substrate 300, and then output to the outside via an output unit 510B.

[0192] The imaging device 1 having such contact portions 203, 204, 303, and 304 can also provide the same effects as those described in the above embodiment. The positions and number of the contact portions can be changed depending on the design of the circuit of the third substrate 300 to which the wiring via the contact portions 303 and 304 is connected.

[0193] <9. Variation 9> Fig. 47 shows a modified cross-sectional configuration of the imaging device 1 according to the above embodiment. Fig. 47 corresponds to Fig. 6 described in the above embodiment. In this modification, a transfer transistor TR having a planar structure is provided on the first substrate 100. In this respect, the imaging device 1 of this modification differs from the imaging device 1 described in the above embodiment.

[0194] In the transfer transistor TR, the transfer gate TG is formed only by the horizontal portion TGb, In other words, the transfer gate TG does not have the vertical portion TGa and is provided opposite to the semiconductor layer 100S.

[0195] The imaging device 1 having such a planar-structured transfer transistor TR also provides the same effects as those described in the above embodiment. Furthermore, by providing the planar-type transfer gate TG on the first substrate 100, the photodiode PD can be formed closer to the surface of the semiconductor layer 100S than when a vertical-type transfer gate TG is provided on the first substrate 100, and this can be considered to increase the saturation signal amount (Qs). In addition, the method of forming the planar-type transfer gate TG on the first substrate 100 requires fewer manufacturing steps than the method of forming the vertical-type transfer gate TG on the first substrate 100, and it can be considered that the manufacturing steps are less likely to adversely affect the photodiode PD.

[0196] <10. Variation 10> Fig. 48 shows a modified example of the pixel circuit of the imaging device 1 according to the above embodiment. Fig. 48 corresponds to Fig. 4 described in the above embodiment. In this modified example, a pixel circuit 210 is provided for each pixel (pixel 541A). That is, the pixel circuit 210 is not shared by multiple pixels. In this respect, the imaging device 1 of this modified example differs from the imaging device 1 described in the above embodiment.

[0197] The imaging device 1 of this modification is the same as the imaging device 1 described in the above embodiment in that the pixel 541A and the pixel circuit 210 are provided on different substrates (the first substrate 100 and the second substrate 200). Therefore, the imaging device 1 according to this modification can also obtain the same effects as those described in the above embodiment.

[0198] <11. Variation 11> Fig. 49 shows a modified example of the planar configuration of pixel separation section 117 described in the above embodiment. Gaps may be provided in pixel separation section 117 surrounding each of pixels 541A, 541B, 541C, and 541D. That is, pixels 541A, 541B, 541C, and 541D do not have to be entirely surrounded by pixel separation section 117. For example, the gaps in pixel separation section 117 are provided near pad sections 120 and 121 (see Fig. 7B).

[0199] In the above embodiment, an example (see FIG. 6) has been described in which the pixel separator 117 has an FTI structure penetrating the semiconductor layer 100S, but the pixel separator 117 may have a configuration other than the FTI structure. For example, the pixel separator 117 does not have to be provided so as to completely penetrate the semiconductor layer 100S, and may have a so-called DTI (Deep Trench Isolation) structure.

[0200] <12. Variation 12> In the above-described first embodiment, a structure has been described in which a wiring electrically connected to the floating diffusion FD (i.e., a floating diffusion contact) and a wiring electrically connected to the well layer WE (i.e., a well contact) are disposed in each of the plurality of sensor pixels. However, the embodiment of the present disclosure is not limited to this. In the embodiment of the present disclosure, one floating diffusion contact may be disposed in each of the plurality of sensor pixels. For example, four adjacent sensor pixels may share one floating diffusion contact. Similarly, one well contact may be disposed in each of the plurality of sensor pixels. For example, four adjacent sensor pixels may share one well contact.

[0201] 50 to 52 are cross-sectional views in the thickness direction showing a configuration example of an imaging device 1A according to a modification 12 of the present disclosure. FIGS. 53 to 55 are cross-sectional views in the horizontal direction showing a layout example of a plurality of pixel units PU according to a modification 12 of the present disclosure. Note that the cross-sectional views shown in FIGS. 50 to 52 are merely schematic views and are not intended to strictly and correctly show the actual structure. In the cross-sectional views shown in FIGS. 50 to 52, the horizontal positions of the transistors and impurity diffusion layers are intentionally changed at positions sec1 to sec3 in order to easily explain the configuration of the imaging device 1A on paper.

[0202] Specifically, in pixel unit PU of imaging device 1A shown in Fig. 50, the cross section at position sec1 is a cross section taken along line A1-A1' in Fig. 53, the cross section at position sec2 is a cross section taken along line B1-B1' in Fig. 54, and the cross section at position sec3 is a cross section taken along line C1-C1' in Fig. 55. Similarly, in imaging device 1A shown in Fig. 51, the cross section at position sec1 is a cross section taken along line A2-A2' in Fig. 53, the cross section at position sec2 is a cross section taken along line B2-B2' in Fig. 54, and the cross section at position sec3 is a cross section taken along line C2-C2' in Fig. 55. In the imaging device 1A shown in Figure 52, the cross section at position sec1 is a cross section taken along line A3-A3' in Figure 53, the cross section at position sec2 is a cross section taken along line B3-B3' in Figure 54, and the cross section at position sec3 is a cross section taken along line C3-C3' in Figure 55.

[0203] As shown in FIG. 51 and FIG. 55, the imaging device 1A shares a common pad electrode 1102 arranged across a plurality of sensor pixels 1012 and one wiring L1002 provided on the common pad electrode 1102. For example, the imaging device 1A has an area in which the floating diffusions FD1 to FD4 of the four sensor pixels 1012 are adjacent to each other via the element isolation layer 1016 in a plan view. The common pad electrode 1102 is provided in this area. The common pad electrode 1102 is arranged across the four floating diffusions FD1 to FD4 and is electrically connected to each of the four floating diffusions FD1 to FD4. The common pad electrode 1102 is made of, for example, a polysilicon film doped with n-type impurities or p-type impurities.

[0204] One wiring L1002 (i.e., a floating diffusion contact) is provided on the center of the common pad electrode 1102. As shown in Fig. 51 and Fig. 53 to Fig. 55, the wiring L1002 provided on the center of the common pad electrode 1102 extends from the first substrate unit 1010 through the lower substrate 1210 of the second substrate unit 1020 to the upper substrate 1220 of the second substrate unit 1020, and is connected to the gate electrode AG of the amplification transistor AMP via wiring provided on the upper substrate 1220, etc.

[0205] As shown in FIG. 50 and FIG. 55, the imaging device 1A shares a common pad electrode 1110 arranged across a plurality of sensor pixels 1012 and one wiring L1010 provided on the common pad electrode 1110. For example, the imaging device 1A has an area in which the well layers WE of the four sensor pixels 1012 are adjacent to each other via the element isolation layer 1016 in a plan view. The common pad electrode 1110 is provided in this area. The common pad electrode 1110 is arranged across the well layers WE of the four sensor pixels 1012 and is electrically connected to each of the well layers WE of the four sensor pixels 1012. As an example, the common pad electrode 1110 is arranged between one common pad electrode 1102 and another common pad electrode 1102 arranged in the Y-axis direction. The common pad electrodes 1102 and 1110 are arranged alternately in the Y-axis direction. The common pad electrode 1110 is made of, for example, a polysilicon film doped with n-type or p-type impurities.

[0206] One wiring L1010 (i.e., a well contact) is provided on the center of the common pad electrode 1110. As shown in Fig. 50, 52 to 55, the wiring L1010 provided on the center of the common pad electrode 1110 extends from the first substrate unit 1010 through the lower substrate 1210 of the second substrate unit 1020 to the upper substrate 1220 of the second substrate unit 1020, and is connected to a reference potential line that supplies a reference potential (e.g., ground potential: 0V) via a wiring or the like provided on the upper substrate 1220.

[0207] The wiring L1010 provided on the center of the common pad electrode 1110 is electrically connected to the upper surface of the common pad electrode 1110, the inner side surface of a through hole provided in the lower substrate 1210, and the inner side surface of a through hole provided in the upper substrate 1220. As a result, the well layer WE of the semiconductor substrate 1011 of the first substrate unit 1010, and the well layers of the lower substrate 1210 and upper substrate 1220 of the second substrate unit 1020 are connected to a reference potential (for example, ground potential: 0 V).

[0208] The imaging device 1A according to the modification 12 of the present disclosure has the same effect as the imaging device 1 according to the first embodiment. The imaging device 1A further includes common pad electrodes 1102, 1110 that are provided on the front surface 11a side of the semiconductor substrate 1011 constituting the first substrate unit 1010 and arranged to straddle a plurality of (for example, four) sensor pixels 1012 adjacent to each other. The common pad electrode 1102 is electrically connected to the floating diffusions FD of the four sensor pixels 1012. The common pad electrode 1110 is electrically connected to the well layers WE of the four sensor pixels 1012. This allows the wiring L1002 connected to the floating diffusion FD for each of the four sensor pixels 1012 to be shared. The wiring L1010 connected to the well layer WE for each of the four sensor pixels 1012 to be shared. This makes it possible to reduce the number of wirings L1002 and L1010, so that the area of ​​the sensor pixel 1012 can be reduced, and the imaging device 1A can be made more compact.

[0209] <13. Application Examples> FIG. 58 shows an example of a schematic configuration of an imaging system 7 including the imaging device 1 according to the above embodiment and its modified example.

[0210] The imaging system 7 is, for example, an electronic device such as an imaging device such as a digital still camera or a video camera, or a mobile terminal device such as a smartphone or a tablet terminal. The imaging system 7 includes, for example, the imaging device 1 according to the above embodiment and its modified example, a DSP circuit 243, a frame memory 244, a display unit 245, a storage unit 246, an operation unit 247, and a power supply unit 248. In the imaging system 7, the imaging device 1 according to the above embodiment and its modified example, the DSP circuit 243, the frame memory 244, the display unit 245, the storage unit 246, the operation unit 247, and the power supply unit 248 are connected to each other via a bus line 249.

[0211] The imaging device 1 according to the above embodiment and its modified examples outputs image data according to incident light. The DSP circuit 243 is a signal processing circuit that processes a signal (image data) output from the imaging device 1 according to the above embodiment and its modified examples. The frame memory 244 temporarily holds the image data processed by the DSP circuit 243 on a frame-by-frame basis. The display unit 245 is formed of a panel-type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays a moving image or a still image captured by the imaging device 1 according to the above embodiment and its modified examples. The storage unit 246 records image data of a moving image or a still image captured by the imaging device 1 according to the above embodiment and its modified examples in a recording medium such as a semiconductor memory or a hard disk. The operation unit 247 issues operation commands for various functions of the imaging system 7 according to an operation by a user. The power supply unit 248 appropriately supplies various power sources that serve as operating power sources for the imaging device 1 according to the above embodiment and its modified examples, the DSP circuit 243, the frame memory 244, the display unit 245, the storage unit 246, and the operation unit 247 to these supply targets.

[0212] Next, the imaging procedure in the imaging system 7 will be described.

[0213] 59 shows an example of a flowchart of the imaging operation in the imaging system 7. The user issues an instruction to start imaging by operating the operation unit 247 (step S101). Then, the operation unit 247 transmits an imaging command to the imaging device 1 (step S102). Upon receiving the imaging command, the imaging device 1 (specifically, the system control circuit 36) executes imaging in a predetermined imaging method (step S103).

[0214] The imaging device 1 outputs image data obtained by imaging to the DSP circuit 243. Here, the image data refers to data for all pixels of pixel signals generated based on charges temporarily stored in the floating diffusion FD. The DSP circuit 243 performs predetermined signal processing (e.g., noise reduction processing, etc.) based on the image data input from the imaging device 1 (step S104). The DSP circuit 243 stores the image data that has been subjected to the predetermined signal processing in the frame memory 244, and the frame memory 244 stores the image data in the storage unit 246 (step S105). In this manner, imaging is performed in the imaging system 7.

[0215] In this application example, the imaging device 1 according to the above-described embodiment and its modified example is applied to an imaging system 7. This allows the imaging device 1 to be made smaller or have higher definition, so that a small or high-definition imaging system 7 can be provided.

[0216] <14. Application Examples> [Application example 1] The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, etc.

[0217] FIG. 60 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a moving object control system to which the technology of the present disclosure can be applied.

[0218] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 60, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also, as functional configurations of the integrated control unit 12050, a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053 are illustrated.

[0219] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0220] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as head lamps, back lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves or signals of various switches transmitted from a portable device that replaces a key may be input to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, and the like of the vehicle.

[0221] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for a person, a car, an obstacle, a sign, or characters on a road surface, based on the received image.

[0222] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0223] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing.

[0224] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0225] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on the driver's operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle acquired by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0226] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside-vehicle information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0227] The audio / video output unit 12052 transmits at least one output signal of audio and image to an output device capable of visually or audibly notifying information to passengers in the vehicle or the outside of the vehicle. In the example of Fig. 59, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as the output device. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

[0228] FIG. 61 is a diagram showing an example of the installation position of the imaging unit 12031.

[0229] In FIG. 61, a vehicle 12100 has imaging units 12101, 12102, 12103, 12104, and 12105 as an imaging unit 12031.

[0230] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided at positions such as the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The images of the front acquired by the imaging units 12101 and 12105 are mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

[0231] 61 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, an overhead image of the vehicle 12100 viewed from above is obtained by superimposing the image data captured by the imaging units 12101 to 12104.

[0232] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of a plurality of imaging elements, or may be an imaging element having pixels for detecting a phase difference.

[0233] For example, the microcomputer 12051 can extract, as a preceding vehicle, a three-dimensional object that is the closest three-dimensional object on the travel path of the vehicle 12100 and travels at a predetermined speed (for example, 0 km / h or more) in approximately the same direction as the vehicle 12100, by calculating the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the change over time of this distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104. Furthermore, the microcomputer 12051 can set a vehicle distance to be secured in advance in front of the preceding vehicle, and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control). In this way, cooperative control can be performed for the purpose of automatic driving that travels autonomously without relying on the driver's operation.

[0234] For example, the microcomputer 12051 classifies and extracts three-dimensional object data on three-dimensional objects, such as two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects, based on the distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk indicating the degree of danger of collision with each obstacle, and when the collision risk is equal to or exceeds a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0235] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured images of the imaging units 12101 to 12104. The recognition of such a pedestrian is performed, for example, by a procedure of extracting feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras, and a procedure of performing pattern matching processing on a series of feature points that indicate the contour of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

[0236] An example of a mobile object control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 among the configurations described above. Specifically, the imaging device 1 according to the above embodiment and its modified example can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, a high-definition captured image with little noise can be obtained, and therefore, high-precision control using the captured image can be performed in the mobile object control system.

[0237] [Application example 2] FIG. 62 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0238] 62 shows a state in which an operator (doctor) 11131 is performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0239] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the illustrated example, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may be configured as a so-called flexible scope having a flexible lens barrel.

[0240] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an observation target in the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0241] An optical system and an image sensor are provided inside the camera head 11102, and reflected light (observation light) from an observation target is collected on the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to an observation image. The image signal is transmitted to a camera control unit (CCU) 11201 as RAW data.

[0242] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and performs overall control of the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102, and performs various types of image processing on the image signal, such as development processing (demosaic processing), for displaying an image based on the image signal.

[0243] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0244] The light source device 11203 is composed of a light source such as an LED (Light Emitting Diode), and supplies the endoscope 11100 with irradiation light when photographing an operation site or the like.

[0245] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiated light, magnification, focal length, etc.) of the endoscope 11100.

[0246] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 sends gas into the body cavity of the patient 11132 via the insufflation tube 11111 to inflate the body cavity for the purpose of securing the field of view of the endoscope 11100 and securing the working space of the surgeon. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, image, or graph.

[0247] The light source device 11203 that supplies irradiation light to the endoscope 11100 when photographing the surgical site can be composed of a white light source composed of, for example, an LED, a laser light source, or a combination of these. When the white light source is composed of a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so that the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to capture images corresponding to each of the RGB colors in a time-division manner by irradiating the observation object with laser light from each of the RGB laser light sources in a time-division manner and controlling the driving of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter to the image sensor.

[0248] The light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. The driving of the image sensor of the camera head 11102 may be controlled in synchronization with the timing of the change in the light intensity to obtain images in a time-division manner, and the images may be synthesized to generate an image with a high dynamic range that is free of so-called blackout and whiteout.

[0249] The light source device 11203 may be configured to supply light of a predetermined wavelength band corresponding to the special light observation. In the special light observation, for example, by utilizing the wavelength dependency of light absorption in body tissue, a narrow band light is irradiated compared to the irradiated light (i.e., white light) during normal observation, and a predetermined tissue such as blood vessels on the mucous membrane surface is photographed with high contrast, so-called narrow band imaging is performed. Alternatively, in the special light observation, a fluorescent observation may be performed in which an image is obtained by fluorescence generated by irradiating an excitation light. In the fluorescent observation, it is possible to irradiate an excitation light to a body tissue and observe the fluorescence from the body tissue (autofluorescence observation), or to locally inject a reagent such as indocyanine green (ICG) into the body tissue and irradiate the body tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0250] FIG. 63 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0251] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other by a transmission cable 11400 so as to be able to communicate with each other.

[0252] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

[0253] The imaging unit 11402 is composed of an imaging element. The imaging element constituting the imaging unit 11402 may be one (so-called single-plate type) or multiple (so-called multi-plate type). When the imaging unit 11402 is composed of a multi-plate type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining the image signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to 3D (Dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical site. Note that when the imaging unit 11402 is composed of a multi-plate type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0254] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately behind the objective lens.

[0255] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be appropriately adjusted.

[0256] The communication unit 11404 is configured by a communication device for transmitting and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0257] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201, and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of capturing the image, and / or information specifying the magnification and focus of the captured image.

[0258] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by a user, or may be automatically set by the control unit 11413 of the CCU 11201 based on an acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0259] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404.

[0260] The communication unit 11411 is configured with a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0261] Furthermore, the communication unit 11411 transmits, to the camera head 11102, a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0262] The image processing unit 11412 performs various types of image processing on the image signal, which is RAW data sent from the camera head 11102 .

[0263] The control unit 11413 performs various controls related to imaging of the surgical site etc. by the endoscope 11100 and display of the captured image obtained by imaging the surgical site etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0264] Further, the control unit 11413 causes the display device 11202 to display the captured image showing the surgical site, etc., based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 can recognize surgical tools such as forceps, specific living body parts, bleeding, mist when the energy treatment tool 11112 is used, etc., by detecting the shape and color of the edge of an object included in the captured image. When the control unit 11413 causes the display device 11202 to display the captured image, it may use the recognition result to superimpose various types of surgery support information on the image of the surgical site. By superimposing and presenting the surgery support information to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0265] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for communication of electrical signals, an optical fiber for optical communication, or a composite cable of these.

[0266] Here, in the illustrated example, communication is performed wired using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0267] An example of an endoscopic surgery system to which the technology according to the present disclosure can be applied has been described above. Of the configurations described above, the technology according to the present disclosure can be suitably applied to the imaging unit 11402 provided in the camera head 11102 of the endoscope 11100. By applying the technology according to the present disclosure to the imaging unit 11402, the imaging unit 11402 can be made smaller or have higher resolution, so that a small or high-resolution endoscope 11100 can be provided.

[0268] The present disclosure has been described above by giving the first and second embodiments and their modified examples 1 to 11, application examples and application examples, but the present disclosure is not limited to the above embodiments, etc., and various modifications are possible.

[0269] Note that the effects described in this specification are merely examples. The effects of the present disclosure are not limited to the effects described in this specification. The present disclosure may have effects other than the effects described in this specification.

[0270] The present disclosure may also be configured as follows. According to one embodiment of the present technology configured as follows, a conductive film connected to a fixed potential is formed between the second semiconductor substrate and the through-hole wiring that electrically connects the first substrate and the second substrate, so that the electric field from the through-hole wiring to the transistor provided on the second substrate is reduced. This makes it possible to improve reliability. (1) a first substrate having a photoelectric conversion unit and a first transistor constituting a sensor pixel on a first semiconductor substrate; a second substrate, the second substrate being stacked on the first substrate, the second substrate having a second transistor that constitutes the sensor pixel and an opening penetrating the second substrate in a stacking direction; a through wiring passing through the opening and electrically connecting the first substrate and the second substrate; a conductive film provided at least between the second semiconductor substrate and the through-hole wiring and connected to a fixed potential; An imaging device comprising: (2) The imaging device according to (1), wherein the conductive film is connected to a ground electrode. (3) The imaging device according to (1) or (2), wherein the conductive film penetrates the second semiconductor substrate. (4) The imaging device according to any one of (1) to (3), wherein the conductive film extends to the first semiconductor substrate. (5) The imaging device according to any one of (1) to (4), wherein the conductive film is provided around the through-hole wiring with an insulating film therebetween. (6) a conductive region provided on a surface of the first semiconductor substrate facing the second semiconductor substrate and connected to a fixed potential; The imaging device according to any one of (1) to (5), wherein one end of the conductive film is connected to the conductive region. (7) an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate; The imaging device according to (6), wherein the conductive film is electrically connected to the conductive region via a connection wiring that penetrates the interlayer insulating layer. (8) The imaging device according to any one of (1) to (7), wherein the shortest distance between the conductive film and the second semiconductor substrate is shorter than the shortest distance between the conductive film and the through-hole wiring. (9) the sensor pixel further includes a floating diffusion that temporarily holds a charge output from the photoelectric conversion unit via the first transistor, The imaging device according to any one of (1) to (8), wherein the through wiring is connected to a gate of the first transistor or the floating diffusion. (10) The imaging device according to any one of (1) to (9), wherein the conductive film is formed using a conductive material having high heat resistance. (11) The imaging device according to (10), wherein the conductive material has a heat resistance of 600° C. or more. (12) The imaging device according to (10), wherein the conductive material has a heat resistance of 850° C. or more. (13) The imaging device according to any one of (1) to (12), wherein the conductive film is formed using polysilicon, tungsten, or a two-dimensional material.

[0271] This application claims priority based on Japanese Patent Application No. 2019-118481, filed on June 26, 2019 in the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0272] Those skilled in the art will recognize that various modifications, combinations, subcombinations, and variations may occur to those skilled in the art depending on design requirements and other factors, and that such modifications are within the scope of the appended claims and their equivalents.

Claims

1. a first substrate having a photoelectric conversion unit and a first transistor constituting a sensor pixel on a first semiconductor substrate; a second substrate, the second substrate being stacked on the first substrate, the second substrate having a second transistor that constitutes the sensor pixel and an opening penetrating the second substrate in a stacking direction; a through wiring passing through the opening and electrically connecting the first substrate and the second substrate; a conductive film provided at least between the second semiconductor substrate and the through-hole wiring and connected to a fixed potential; an imaging device, wherein the shortest distance between the conductive film and the second semiconductor substrate is shorter than the shortest distance between the conductive film and the through-hole wiring;

2. The imaging device according to claim 1 , wherein the conductive film is connected to a ground electrode.

3. The imaging device according to claim 1 , wherein the conductive film penetrates the second semiconductor substrate.

4. The imaging device according to claim 1 , wherein the conductive film extends to the first semiconductor substrate.

5. The imaging device according to claim 1 , wherein the conductive film is provided around the through-hole wiring with an insulating film therebetween.

6. a conductive region provided on a surface of the first semiconductor substrate facing the second semiconductor substrate and connected to a fixed potential; The imaging device according to claim 1 , wherein one end of the conductive film is connected to the conductive region.

7. an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate; The imaging device according to claim 6 , wherein the conductive film is electrically connected to the conductive region via a connection wiring that penetrates the interlayer insulating layer.

8. the sensor pixel further includes a floating diffusion that temporarily holds a charge output from the photoelectric conversion unit via the first transistor, The imaging device according to claim 1 , wherein the through-hole interconnect is connected to a gate of the first transistor or the floating diffusion.

9. The imaging device according to claim 1 , wherein the conductive film is formed using a conductive material having high heat resistance.

10. The imaging device according to claim 9 , wherein the conductive material has a heat resistance of 600° C. or more.

11. The imaging device according to claim 9 , wherein the conductive material has a heat resistance of 850° C. or more.

12. The imaging device according to claim 1 , wherein the conductive film is formed using polysilicon, tungsten, or a two-dimensional material.

Images