Semiconductor package, electronic device, and method for manufacturing semiconductor package

Abstract

In a semiconductor package in which a semiconductor element is connected to a substrate, warpage of the semiconductor element is prevented.　The semiconductor package includes a substrate, a semiconductor element, an adhesive portion, and protrusions. In this semiconductor package, one end of a wire is connected to the surface of the substrate. The other end of the wire is connected to one of both surfaces of the semiconductor element. The adhesive portion adheres a part of the other of both surfaces of the semiconductor element to the surface of the substrate. The protrusions project from the surface of the substrate to the remaining portion of the other of both surfaces of the semiconductor element.

Description

[Technical field]

[0001] The present technology relates to a semiconductor package, and more particularly to a semiconductor package in which a solid-state imaging element is connected by a wire, an electronic device, and a method for manufacturing the semiconductor package. [Background technology]

[0002] Conventionally, in order to facilitate the handling of semiconductor integrated circuits, semiconductor packages have been used in which a semiconductor chip having a semiconductor integrated circuit is mounted on a substrate and sealed. For example, a hollow semiconductor package has been proposed in which a semiconductor element is electrically connected to a substrate by wires and sealed with glass with an alpha ray shielding film (see, for example, Patent Document 1). In this semiconductor package, the entirety of one of the two surfaces of the semiconductor element is bonded to the substrate by an adhesive. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-114266 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned semiconductor package, alpha-ray shielding film is attached to the glass to shield alpha rays, thereby reducing lattice defects in the semiconductor element caused by alpha rays. However, in the above-mentioned semiconductor package, if the substrate has multiple layers with different thermal expansion coefficients, the substrate may warp due to temperature changes. If the substrate warps, the semiconductor element may also warp because the entire surface of the semiconductor element is bonded to the substrate. In particular, if the semiconductor element is a solid-state imaging element, the image plane is distorted due to the warping, resulting in a deterioration in the image quality of the image data.

[0005] The present technology was developed in view of these circumstances, and aims to prevent warping of a semiconductor element in a semiconductor package in which the semiconductor element is connected to a substrate. [Means for solving the problem]

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect of the present technology is a semiconductor package including a substrate having one end of a wire connected to a surface thereof, a semiconductor element having the other end of the wire connected to one of the two surfaces thereof, an adhesive portion that bonds a part of the other surface of the two surfaces to the substrate surface, and a protrusion that protrudes from the substrate surface to the remaining part of the other surface thereof, thereby preventing warping of the semiconductor element.

[0007] In the first aspect, the adhesive portion may adhere a central portion of the other surface to the surface of the substrate, thereby preventing warping of the semiconductor element.

[0008] In the first aspect, the protrusion may be formed in an island shape, thereby providing an effect that the load is supported by the island-shaped protrusion.

[0009] In addition, in the first aspect, the semiconductor element may be shaped like a rectangle, and the protrusions may be formed linearly along each of a plurality of sides of the rectangle, thereby providing an effect that a load is supported by the linear protrusions.

[0010] In addition, in the first side face, the protrusion may be formed in a frame shape along the outer periphery of the semiconductor element, thereby providing an effect that a load is borne by the frame-shaped protrusion.

[0011] In the first aspect, the semiconductor element may be a solid-state imaging element, thereby improving the image quality of image data.

[0012] A second aspect of the present technology is an electronic device including a substrate having one end of a wire connected to a surface thereof, a semiconductor element having the other end of the wire connected to one of the two surfaces thereof, an adhesive portion that bonds a part of the other surface of the substrate to the surface of the substrate, a protrusion that protrudes from the surface of the substrate to the remaining part of the other surface, and a processing portion that processes a signal generated by the semiconductor element, thereby providing an effect of processing a signal from the semiconductor element that is prevented from warping.

[0013] A third aspect of the present technology is a method for manufacturing a semiconductor package, comprising: a substrate manufacturing step of manufacturing a substrate having a protrusion on its surface; and a connection step of bonding the surface of the substrate to a part of one of both surfaces of a semiconductor element, and connecting the other of both surfaces to the substrate by a wire. This provides an effect that a part of the semiconductor element is bonded to the surface of the substrate, and a semiconductor package having a protrusion is manufactured.

[0014] In the third aspect, the protrusion may be provided when forming the wiring pattern of the substrate in the substrate manufacturing procedure, thereby providing an effect that a load is supported by the protrusion formed when the wiring pattern is formed.

[0015] In the third aspect, in the substrate manufacturing procedure, a protrusion may be provided on the substrate after the substrate is manufactured, thereby providing an effect that the load is supported by the protrusion provided after the substrate is manufactured. [Brief description of the drawings]

[0016] [Figure 1] 1 is a block diagram showing an example of a configuration of an electronic device according to an embodiment of the present technology; [Diagram 2] 1 is a cross-sectional view showing a configuration example of a semiconductor package according to an embodiment of the present technology; [Diagram 3] 1 is an example of a top view of a semiconductor package according to an embodiment of the present technology; [Figure 4]1 is a plan view showing an example of a shape and arrangement of protrusions according to an embodiment of the present technology; [Diagram 5] 1A and 1B are cross-sectional views of a semiconductor package at high and low temperatures according to an embodiment of the present technology; [Figure 6] 1A and 1B are cross-sectional views of a semiconductor package according to a comparative example at high and low temperatures; [Figure 7] 1A to 1C are diagrams for explaining a manufacturing method up to the formation of a glass mounting frame in the embodiment of the present technology. [Figure 8] 4A to 4C are diagrams for explaining a manufacturing method up to placing glass and solder balls in the embodiment of the present technology. [Figure 9] 1 is a flowchart illustrating an example of a method for manufacturing a semiconductor package according to an embodiment of the present technology. [Figure 10] 11A to 11C are diagrams for explaining a manufacturing method up to the stage of providing a protrusion in a first modified example of an embodiment of the present technology. [Figure 11] 13 is an example of a plan view showing a shape and arrangement of protrusions in a second modified example of the embodiment of the present technology. [Figure 12] 13 is an example of a plan view showing a shape and arrangement of protrusions in a third modified example of the embodiment of the present technology. FIG. [Figure 13] 13 is an example of a top view of a semiconductor package according to a third modified example of the embodiment of the present technology. [Figure 14] 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; [Figure 15] 4 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, modes for carrying out the present technology (hereinafter, referred to as embodiments) will be described. The description will be made in the following order. 1. Embodiment (Example in which a part of a solid-state imaging element is bonded to a substrate and a protrusion is provided on the substrate) 2. Application examples for mobile objects

[0018] <1. Preferred embodiment> [Example of electronic device configuration] 1 is a block diagram showing an example of a configuration of an electronic device 100 according to an embodiment of the present technology. The electronic device 100 is a device for capturing image data, and includes an optical unit 110, a solid-state imaging element 230, and a DSP (Digital Signal Processing) circuit 120. The electronic device 100 further includes a display unit 130, an operation unit 140, a bus 150, a frame memory 160, a storage unit 170, and a power supply unit 180. Examples of the electronic device 100 include digital cameras such as digital still cameras, as well as smartphones, personal computers, and vehicle-mounted cameras.

[0019] The optical unit 110 collects light from a subject and guides it to the solid-state imaging element 230. The solid-state imaging element 230 generates image data by photoelectric conversion in synchronization with a vertical synchronization signal. Here, the vertical synchronization signal is a periodic signal of a predetermined frequency that indicates the timing of imaging. The solid-state imaging element 230 supplies the generated image data to the DSP circuit 120 via a signal line 239.

[0020] The DSP circuit 120 executes a predetermined signal processing on image data from the solid-state imaging element 230. The DSP circuit 120 outputs the processed image data to a frame memory 160 or the like via a bus 150. The DSP circuit 120 is an example of a processing unit described in the claims.

[0021] The display unit 130 displays image data. For example, a liquid crystal panel or an organic EL (Electro Luminescence) panel is assumed as the display unit 130. The operation unit 140 generates an operation signal in accordance with a user's operation.

[0022] The bus 150 is a common path for the optical unit 110, solid-state image sensor 230, DSP circuit 120, display unit 130, operation unit 140, frame memory 160, storage unit 170 and power supply unit 180 to exchange data with one another.

[0023] The frame memory 160 holds image data. The storage unit 170 stores various data such as image data. The power supply unit 180 supplies power to the solid-state imaging element 230, the DSP circuit 120, the display unit 130, and the like.

[0024] In the above-mentioned configuration, for example, the solid-state imaging element 230 is mounted in a semiconductor package.

[0025] [Example of semiconductor package configuration] 2 is a cross-sectional view showing an example of a configuration of a semiconductor package 200 according to an embodiment of the present technology. The semiconductor package 200 includes a glass 210, a glass mounting frame 220, a solid-state imaging element 230, and a substrate 240.

[0026] The substrate 240 is a substrate for mounting the solid-state imaging element 230. The substrate 240 is manufactured by stacking a plurality of layers. The solid-state imaging element 230 is mounted on one of the two surfaces of the substrate 240, and this surface will hereinafter be referred to as the "front surface" of the substrate 240. A plurality of solder balls 280 are formed on the rear surface of the substrate 240 opposite the front surface. Various wirings are formed on the front surface of the substrate 240 and inside the substrate 240.

[0027] An axis perpendicular to the surface of the substrate 240 is hereinafter referred to as the "Z-axis." A predetermined axis parallel to the surface of the substrate 240 is hereinafter referred to as the "X-axis," and an axis perpendicular to the Z-axis and the X-axis is hereinafter referred to as the "Y-axis." The figure is a cross-sectional view taken along a cross section perpendicular to the Y-axis.

[0028] The glass mounting frame 220 is a frame-shaped member for mounting the glass 210, and is formed along the outer periphery of the surface of the substrate 240. The glass 210 is bonded to the glass mounting frame 220 by an adhesive portion 252. The glass 210 seals the semiconductor package 200.

[0029] The solid-state imaging element 230 photoelectrically converts light incident through the glass 210 and captures image data. In the figure, the arrow indicates the incident light. A pixel array section in which a plurality of pixels are arranged is formed on the light-receiving surface of the solid-state imaging element 230, and this surface is hereinafter referred to as the "surface" of the solid-state imaging element 230. On this surface, a predetermined number of pads are formed around the pixel array section, and one end of a wire 270 is connected to each of the pads. The other ends of the wires 270 are connected to pads on the surface of the substrate 240. In this manner, the solid-state imaging element 230 is mounted by wire bonding.

[0030] In addition, a part of the back surface of both sides of the solid-state imaging element 230, which is opposite to the front surface, is adhered to the front surface of the substrate 240 by an adhesive part 251 in order to prevent the solid-state imaging element 230 from being displaced, and the remaining part is not adhered. For example, only the center part of the back surface of the solid-state imaging element 230 is adhered by the adhesive part 251. An adhesive having a certain degree of flexibility (in other words, elasticity) in the operating temperature range is used as the adhesive part 251. For example, a silicone-based adhesive having flexibility in the range of -40 to 125 degrees (°C) is used.

[0031] Moreover, a predetermined number of protrusions 261 are provided on the surface of the substrate 240. These protrusions 261 are provided below the area of ​​the back surface of the solid-state imaging element 230 where no adhesive is provided, with the direction from the back surface to the front surface of the substrate 240 being the upward direction. In other words, the protrusions 261 protrude along the Z-axis direction from the front surface of the substrate 240 to the remaining part of the back surface of the solid-state imaging element 230 that is not bonded. That is, on the substrate side, the protrusions 261 are arranged in a place that does not correspond to the adhesive part 251 (such as the periphery of the adhesive part 251). Furthermore, the upper part of the protrusion 261 is in contact with the back surface of the solid-state imaging element 230, but is not fixed thereto. Furthermore, it is desirable to apply a solder resist or the like to the upper part of the protrusion 261 to provide insulation. These protrusions 261 are used as a support for receiving a load in a wire bonding process described later.

[0032] Although the solid-state imaging element 230 is mounted on the substrate 240, a semiconductor element other than the solid-state imaging element 230 may be mounted. For example, various sensors such as a ToF (Time of Flight) sensor may be mounted instead of the solid-state imaging element 230. The solid-state imaging element 230 is an example of a semiconductor element as defined in the claims.

[0033] 3 is an example of a top view of a semiconductor package 200 according to an embodiment of the present technology. The substrate 240 is rectangular when viewed from the Z-axis direction, and a glass mounting frame 220 is formed along the outer periphery of the substrate 240.

[0034] A rectangular solid-state imaging element 230 is mounted in an area surrounded by the glass mounting frame 220. A pixel array section 231 in which a plurality of pixels are arranged in a two-dimensional lattice pattern is provided on the surface of this solid-state imaging element 230. A predetermined number of pads 271 are arranged around this pixel array section 231. For example, the pads 271 are arranged along two parallel sides out of the four sides of the solid-state imaging element 230. In addition, a predetermined number of pads 272 are arranged around the solid-state imaging element 230 on the surface of the substrate 240. These pads 271 and pads 272 are connected by wires 270.

[0035] 4 is an example of a plan view showing the shape and arrangement of the protrusions 261 according to the embodiment of the present technology. This figure is a plan view in which the semiconductor package 200 is cut along the X1-X2 axis in FIG. 2 and perpendicular to the Z axis.

[0036] 4 indicates the outer periphery of the solid-state imaging element 230. As illustrated in the figure, the adhesive portion 251 is formed in a part (e.g., the central portion) of the back surface of the solid-state imaging element 230. Here, the "central portion" refers to an area surrounded by a predetermined boundary line that is a predetermined distance or more away from the outer periphery of the solid-state imaging element 230.

[0037] For example, the shape of the adhesive 251 is rectangular, and the distance between each side of the solid-state imaging element 230 and each side of the adhesive 251 (i.e., the center) is dx or dy. Values ​​according to the degree of warping expected to occur in the substrate 240 are set for the distances dx and dy from the outer periphery. The greater the expected warping, the larger the values ​​set for dx and dy. Note that although the shape of the adhesive 251 is rectangular, the shape is not limited to rectangular and may be circular or irregular.

[0038] Furthermore, on the surface of the substrate 240, a plurality of protrusions 261 are arranged in places not corresponding to the adhesive portion 251 (for example, around the adhesive portion 251). For example, island-shaped protrusions 261 are arranged below the pads 271 along two sides along which the pads 271 are arranged. Furthermore, the shape of the protrusions 261 is rectangular or circular as viewed from the Z-axis direction. Furthermore, it is desirable that the protrusions 261 are arranged at positions facing the corners of the rectangular solid-state imaging element 230. In the same figure, the protrusions 261 are arranged at all four corners of the rectangle.

[0039] 5 is an example of a cross-sectional view of the semiconductor package 200 at high temperature and low temperature according to an embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the semiconductor package 200 at high temperature, and b is an example of a cross-sectional view of the semiconductor package 200 at low temperature.

[0040] As described above, the substrate 240 includes multiple layers. If these layers have different thermal expansion coefficients, warping may occur in the substrate 240 due to temperature changes. For example, if the environmental temperature is higher than a predetermined temperature, the substrate 240 warps upward as shown in FIG. 1A. On the other hand, if the environmental temperature is lower than the predetermined temperature, the substrate 240 warps downward as shown in FIG. 1B.

[0041] On the other hand, the entire back surface of the solid-state imaging element 230 is not bonded, and only a part of the back surface (such as the center) is bonded by the adhesive part 251. Furthermore, the protrusions 261 arranged at places other than the adhesive part 251 (such as the periphery of the adhesive part 251) are not fixed to the back surface of the solid-state imaging element 230. Therefore, even if the substrate 240 warps upward, as illustrated in FIG. 1A, the protrusions 261 move away from the outer periphery of the solid-state imaging element 230, and warping of the solid-state imaging element 230 is suppressed. Furthermore, even if the substrate 240 warps downward, as illustrated in FIG. 1B, the adhesive part 251 at the center, which has flexibility, bulges slightly, and warping of the solid-state imaging element 230 is suppressed.

[0042] Here, consider a semiconductor package of a comparative example in which the entire back surface of the solid-state imaging element is bonded to the front surface of a substrate.

[0043] 6 is an example of a cross-sectional view of a semiconductor package at high and low temperatures in a comparative example, where a is an example of a cross-sectional view of the semiconductor package 200 at high temperature, and b is an example of a cross-sectional view of the semiconductor package 200 at low temperature.

[0044] When the environmental temperature is higher than a predetermined temperature, the substrate warps upward as shown in Fig. 1. In the comparative example, the entire back surface of the solid-state imaging element is bonded to the substrate, so that the solid-state imaging element warps together with the substrate.

[0045] On the other hand, when the environmental temperature is lower than the predetermined temperature, the substrate warps downward as shown in Fig. 1. In the comparative example, the entire back surface of the solid-state imaging element is bonded to the substrate, so the solid-state imaging element warps in the same way as at high temperatures.

[0046] If the solid-state imaging element is warped, the image surface may become distorted, and the image quality of the image data may be degraded. In contrast, if only the center part of the back surface of the solid-state imaging element 230 is bonded, it is possible to prevent the solid-state imaging element 230 from warping and improve the image quality, as shown in FIG.

[0047] [Semiconductor package manufacturing method] Next, a method for manufacturing the semiconductor package 200 will be described.

[0048] 7 is a diagram for explaining a manufacturing method up to the formation of the glass mounting frame 220 in the embodiment of the present technology. In the figure, "a" is a diagram for explaining a process for manufacturing the substrate 240. In the figure, "b" is a diagram for explaining a process for forming the glass mounting frame 220.

[0049] The manufacturing system for the semiconductor package 200 manufactures a substrate 240 having a protrusion 261 formed on its surface, as illustrated in FIG. 1A. Here, the protrusion 261 is formed, for example, at the same time as forming the wiring pattern of the substrate 240. The height of the protrusion 261 is, for example, 10 to 20 micrometers (μm). Note that the manufacturing system can also form the protrusion 261 separately after manufacturing the substrate 240, as described below.

[0050] Next, the manufacturing system forms a glass mounting frame 220 along the outer periphery of the substrate 240, as illustrated in FIG.

[0051] 8 is a diagram for explaining a manufacturing method up to placing the glass 210 and the solder balls 280 in the embodiment of the present technology. In the figure, "a" is a diagram for explaining a step of applying an adhesive. In the figure, "b" is a diagram for explaining a mounting step of the solid-state imaging element 230. In the figure, "c" is a diagram for explaining a step of placing the glass 210 and the solder balls 280.

[0052] As shown in FIG. 13A, the manufacturing system applies adhesive to an area of ​​the surface of the substrate 240 that corresponds to the center of the solid-state imaging element 230. This adhesive functions as an adhesive portion 251.

[0053] Then, as illustrated in b in the figure, the manufacturing system bonds the center of the back surface of the solid-state imaging element 230, and electrically connects the solid-state imaging element 230 to the substrate 240 by the wire 270. For example, ultrasonic wire bonding is used as this wire bonding, in which ultrasonic waves are applied while a load is applied to the connection point of the wire 270. If the protrusion 261 is not provided, there is a risk that the solid-state imaging element 230 will tilt with respect to the substrate 240 when a load is applied. However, by arranging the protrusion 261 below the connection point, the protrusion 261 functions as a support for receiving the load, and it is possible to prevent the solid-state imaging element 230 from tilting.

[0054] As described above, since wire bonding is performed in an environment where a load and ultrasonic waves are applied, the material of the protrusion 261 has a certain strength and does not allow the ultrasonic waves to escape.

[0055] Next, the manufacturing system adheres the glass 210 to the glass mounting frame 220, and mounts a predetermined number of solder balls 280 on the back surface of the substrate 240, as illustrated in c of the same figure.

[0056] 9 is a flowchart showing an example of a manufacturing method for the semiconductor package 200 according to the embodiment of the present technology. The manufacturing system first manufactures the substrate 240 provided with the protrusions 261 (step S901), and forms a glass mounting frame (step S902).

[0057] Then, the manufacturing system applies adhesive to an area corresponding to the center of the solid-state imaging element 230 (step S903), and mounts the solid-state imaging element 230 by wire bonding (step S904). Then, the manufacturing system mounts the glass 210 and the solder balls 280 (step S905). After step S905, the manufacturing system performs the remaining steps such as testing, and completes the manufacturing of the semiconductor package 200.

[0058] In this way, according to the embodiment of the present technology, a part (such as a central part) of the back surface of the solid-state imaging element 230 is bonded to the substrate 240, so that it is possible to prevent the solid-state imaging element 230 from warping. Also, since the protrusion 261 is provided on the surface of the substrate 240 at a location that does not correspond to the adhesive portion 251 (such as the periphery of the adhesive portion 251), the load applied to the solid-state imaging element 230 during wire bonding can be supported by the protrusion 261. This allows the solid-state imaging element 230 to be mounted by wire bonding.

[0059] [First Modification] In the above-described embodiment, the protrusions 261 are formed when forming the wiring pattern, but it becomes necessary to change the shape of the mask for forming the wiring pattern. The semiconductor package 200 of the first modification of this embodiment differs from the embodiment in that the protrusions 261 are provided after the substrate 240 is manufactured.

[0060] 10 is a diagram for explaining a manufacturing method up to providing a protrusion in the first modified example of the embodiment of the present technology. In the figure, "a" is a diagram for explaining a process of forming a glass mounting frame 220. In the figure, "b" is a diagram for explaining a process of providing a protrusion 261.

[0061] The manufacturing system of the modified embodiment manufactures a substrate 240 without protrusions 261 by a process of forming a wiring pattern, etc. Then, the manufacturing system forms a glass mounting frame 220 on the substrate 240, as illustrated in FIG. 11A. Next, the manufacturing system adheres protrusions 261 to the surface of the substrate 240, as illustrated in FIG. 11B.

[0062] As illustrated in the figure, by providing the protrusions 261 after manufacturing the substrate 240, it becomes unnecessary to change the process for manufacturing the substrate 240. For example, it becomes unnecessary to change the shape of the mask for forming the wiring pattern.

[0063] In this manner, in the first modified example of the embodiment of the present technology, since the protrusions 261 are provided after the substrate 240 is manufactured, there is no need to change the manufacturing process of the substrate 240.

[0064] [Second modified example] In the above embodiment, the island-shaped protrusions 261 are formed, but with this shape, the area for receiving the load is small and there is a risk of insufficient strength. The semiconductor package 200 of the second modification of this embodiment differs from the embodiment in that the shape of the protrusions 261 is linear to improve strength.

[0065] 11 is an example of a plan view showing the shape and arrangement of the protrusion 261 in the second modified example of the embodiment of the present technology. As illustrated in the figure, the protrusion 261 is formed linearly along each of two parallel sides among the four sides of the rectangular solid-state imaging element 230. Pads 271 are formed along each of these sides. By forming the protrusion 261 linearly, the strength of the protrusion 261 can be improved.

[0066] Although the protrusions 261 are formed along each of the two sides, when the pads 271 are arranged along three sides, the protrusions 261 can also be formed along each of the three sides.

[0067] In this way, according to the second modified example of the embodiment of the present technology, since the protrusions 261 are formed in a linear shape, the strength of the protrusions 261 can be improved compared to when the protrusions 261 are formed in an island shape.

[0068] [Third Variation] In the second modification of the above-mentioned embodiment, linear protrusions 261 are formed, but this shape may result in a small area for receiving a load, which may result in insufficient strength. The semiconductor package 200 of the third modification of the embodiment differs from the embodiment in that the shape of the protrusions 261 is frame-shaped to improve strength.

[0069] 12 is a plan view showing an example of the shape and arrangement of a protrusion 261 according to a second modified example of the embodiment of the present technology. As shown in the figure, the protrusion 261 is formed in a frame shape along the outer periphery of the solid-state imaging element 230.

[0070] 13 is an example of a top view of a semiconductor package 200 in a third modified example of an embodiment of the present technology. As illustrated in the figure, pads 271 are arranged along the outer periphery of a solid-state imaging element 230. By forming the protrusions 261 in a frame shape in accordance with the arrangement of the pads 271, it is possible to improve strength compared to the case where the protrusions are formed in a linear shape.

[0071] In this manner, according to the third modified example of the embodiment of the present technology, since the protrusion 261 is formed in a frame shape, the strength of the protrusion 261 can be improved compared to when the protrusion is formed in a linear shape.

[0072] <2. Application examples for mobile objects> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, etc.

[0073] FIG. 14 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a moving object control system to which the technology according to the present disclosure can be applied.

[0074] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 14, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also, as functional configurations of the integrated control unit 12050, a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053 are illustrated.

[0075] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0076] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as head lamps, back lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves or signals of various switches transmitted from a portable device that replaces a key may be input to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, and the like of the vehicle.

[0077] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle, and receives the captured image. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for a person, a car, an obstacle, a sign, or characters on a road surface, based on the received image.

[0078] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0079] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing.

[0080] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0081] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on the driver's operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle acquired by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0082] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside-vehicle information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0083] The audio / video output unit 12052 transmits at least one output signal of audio and video to an output device capable of visually or audibly notifying information to passengers in the vehicle or the outside of the vehicle. In the example of Fig. 14, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as the output device. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

[0084] FIG. 15 is a diagram showing an example of the installation position of the imaging unit 12031.

[0085] In FIG. 15, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0086] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided at positions such as the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the upper part of the windshield inside the vehicle cabin is mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

[0087] 15 shows an example of the imaging ranges of the imaging units 12101 to 12104. An imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and an imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, an overhead image of the vehicle 12100 viewed from above is obtained by superimposing the image data captured by the imaging units 12101 to 12104.

[0088] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of a plurality of imaging elements, or may be an imaging element having pixels for detecting a phase difference.

[0089] For example, the microcomputer 12051 can extract, as a preceding vehicle, a three-dimensional object that is the closest three-dimensional object on the travel path of the vehicle 12100 and travels at a predetermined speed (for example, 0 km / h or more) in approximately the same direction as the vehicle 12100, by calculating the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the change over time of this distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104. Furthermore, the microcomputer 12051 can set a vehicle distance to be secured in advance in front of the preceding vehicle, and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control). In this way, cooperative control can be performed for the purpose of automatic driving that travels autonomously without relying on the driver's operation.

[0090] For example, the microcomputer 12051 classifies and extracts three-dimensional object data on three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0091] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured images of the imaging units 12101 to 12104. The recognition of such a pedestrian is performed, for example, by a procedure of extracting feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras, and a procedure of performing pattern matching processing on a series of feature points that indicate the contour of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

[0092] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to, for example, the imaging unit 12031 among the configurations described above. Specifically, the electronic device 100 in FIG. 1 can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, it is possible to prevent warping of the solid-state imaging element 230, thereby obtaining a captured image that is easier to see, and thus reducing the driver's fatigue.

[0093] The above-mentioned embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specified in the claims correspond to each other. Similarly, the matters specified in the claims and the matters in the embodiment of the present technology having the same name correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist of the technology.

[0094] It should be noted that the effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0095] The present technology can also be configured as follows. (1) a substrate having one end of a wire connected to its surface; a semiconductor element having the other end of the wire connected to one of its two surfaces; an adhesive portion that adheres a portion of the other one of the two surfaces to a surface of the substrate; a protrusion protruding from the surface of the substrate to the remaining portion of the other surface; A semiconductor package comprising: (2) The adhesive portion bonds the center portion of the other surface to the surface of the substrate. The semiconductor package according to (1) above. (3) The protrusions are formed in an island shape. The semiconductor package according to (1) or (2). (4) The semiconductor element has a rectangular shape, The protrusions are formed linearly along each of a plurality of sides of the rectangle. The semiconductor package according to (1) or (2). (5) The protrusion is formed in a frame shape along the outer periphery of the semiconductor element. The semiconductor package according to (1) or (2). (6) The semiconductor element is a solid-state image sensor. A semiconductor package according to any one of (1) to (5). (7) a substrate having one end of a wire connected to its surface; a semiconductor element having the other end of the wire connected to one of its two surfaces; an adhesive portion that adheres a portion of the other one of the two surfaces to a surface of the substrate; a protrusion extending from a surface of the substrate to a remaining portion of the other surface; A processing unit that processes a signal generated by the semiconductor device; An electronic device comprising: (8) a substrate manufacturing procedure for manufacturing a substrate having protrusions on a surface thereof; a connecting step of bonding a surface of the substrate to a portion of one of both surfaces of the semiconductor element and connecting the other of both surfaces to the surface of the substrate by a wire; A method for manufacturing a semiconductor package comprising the steps of: (9) In the substrate manufacturing procedure, the protrusion is provided when forming a wiring pattern of the substrate. A method for manufacturing a semiconductor package according to (8) above. (10) In the substrate manufacturing procedure, a protrusion is provided on the substrate after the substrate is manufactured. A method for manufacturing a semiconductor package according to (8) above. [Explanation of symbols]

[0096] 100 Electronic equipment 110 Optics Department 120 DSP circuits 130 Display section 140 Operation section 150 Bus 160 Frame Memory 170 Storage section 180 Power supply section 200 Semiconductor Packages 210 Glass 220 Glass mounting frame 230 Solid-state image sensor 231 Pixel array section 240 Substrate 251, 252 Adhesive part 261 Protrusion 270 Wire 271, 272 Pad 280 Solder ball 12031 Imaging unit

Claims

1. A substrate having one end of a wire connected to a surface thereof; a semiconductor element having the other end of the wire connected to one of its two surfaces; a silicone adhesive portion that bonds a portion of the other of the two surfaces to the surface of the substrate; a protrusion extending from a surface of the substrate to a remaining portion of the other surface; a solder resist applied to the upper portion of the protrusion with the protrusion protruding in the upward direction; Equipped with The protrusion is conductive. Semiconductor package.

2. The adhesive portion bonds the center portion of the other surface to the surface of the substrate.

2. The semiconductor package of claim 1.

3. The protrusions are formed in an island shape.

2. The semiconductor package of claim 1.

4. The semiconductor element has a rectangular shape, The protrusions are formed linearly along each of a plurality of sides of the rectangle.

2. The semiconductor package of claim 1.

5. The protrusion is formed in a frame shape along the outer periphery of the semiconductor element.

2. The semiconductor package of claim 1.

6. The semiconductor element is a solid-state image sensor.

2. The semiconductor package of claim 1.

7. A substrate having one end of a wire connected to a surface thereof; a semiconductor element having the other end of the wire connected to one of its two surfaces; a silicone adhesive portion that bonds a portion of the other of the two surfaces to the surface of the substrate; a protrusion extending from a surface of the substrate to a remaining portion of the other surface; a solder resist applied to an upper portion of the protrusion with the protrusion protruding in an upward direction; A processing unit that processes a signal generated by the semiconductor device; Equipped with The protrusion is conductive. electronic equipment.

8. A substrate manufacturing procedure for manufacturing a substrate having protrusions on a surface thereof; a connection step of bonding the surface of the substrate and a portion of one of the two surfaces of the semiconductor element with a silicone adhesive and connecting the other of the two surfaces to the surface of the substrate with a wire; Equipped with In the substrate manufacturing procedure, the protrusion is provided when forming a wiring pattern of the substrate, and a solder resist is applied to the upper part of the protrusion with the protruding direction of the protrusion being the upward direction. A method for manufacturing a semiconductor package.

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