Semiconductor Device

Abstract

The present disclosure relates to a semiconductor device comprising: a first main terminal provided with a first electric potential; a second main terminal provided with a second electric potential that is lower than the first electric potential; a control terminal connected to an externally provided overcurrent detection circuit; at least one semiconductor element having a MOS transistor connected between the first main terminal and the second main terminal; and at least one diode for protecting the overcurrent detection circuit, said diode having a cathode electrically connected to the first main terminal and an anode electrically connected to the control terminal, wherein the at least one semiconductor element is mounted on a conductor plate, and the at least one semiconductor element and the at least one diode are sealed by an insulating resin.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device, and more particularly to a semiconductor device used in a power conversion device such as an inverter. [Background technology]

[0002] In semiconductor devices used in power conversion devices and the like, an overcurrent protection circuit is provided that detects an overcurrent flowing through a switching element and stops driving the switching element. There are two mainstream overcurrent protection circuit methods: non-saturation voltage detection and sense current detection. An example of the former is the snubber device shown in Fig. 5 of Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-42410 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the non-saturation voltage detection method, a high-voltage diode is used to protect the detection circuit, but the high-voltage diode is generally mounted on a control board and is therefore electrically connected to a high-voltage terminal such as the drain terminal of the semiconductor device. For this reason, the drain terminal of the semiconductor device connected to the high-voltage diode of the control board needs to have a long insulation distance from the surrounding terminals, which reduces the design freedom of the board pattern of the control board and the terminal arrangement of the semiconductor device. In addition, as disclosed in FIG. 8 of Patent Document 1, the high-voltage diode is mounted on the same conductive material as the switching element and is filled with insulating resin together with the printed circuit board having the snubber circuit, which increases the heat capacity of the semiconductor device and poorly couples the high-voltage diode to the switching element, resulting in a problem in the detection accuracy of the overcurrent detection circuit.

[0005] The present disclosure has been made to solve the problems described above, and aims to provide a semiconductor device that can improve the design freedom of a control board and semiconductor device and has improved detection accuracy of an overcurrent detection circuit. [Means for solving the problem]

[0006] The semiconductor device according to the present disclosure comprises a first main terminal to which a first potential is applied, a second main terminal to which a second potential lower than the first potential is applied, a control terminal connected to an externally provided overcurrent detection circuit, at least one semiconductor element having a MOS transistor connected between the first main terminal and the second main terminal, and at least one diode having a cathode electrically connected to the first main terminal and an anode electrically connected to the control terminal for protecting the overcurrent detection circuit, wherein the at least one semiconductor element is mounted on a conductor plate, and the at least one semiconductor element and the at least one diode are sealed with insulating resin. Effect of the Invention

[0007] According to the semiconductor device of the present disclosure, by providing at least one diode within the semiconductor device, the first main terminal and the control terminal can be insulated by insulating resin inside the semiconductor device, thereby improving the design freedom of the control board provided externally and the terminal arrangement of the semiconductor device, and also improving the detection accuracy of the overcurrent detection circuit. [Brief description of the drawings]

[0008] [Figure 1] 1 is a circuit diagram showing a configuration of a semiconductor device and an overcurrent detection circuit according to a first embodiment of the present disclosure. [Diagram 2] 1 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a first embodiment of the present disclosure. [Diagram 3] 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present disclosure. [Figure 4] 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present disclosure. [Diagram 5]11 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a second embodiment of the present disclosure. FIG. [Figure 6] 11 is a conceptual diagram showing a temperature distribution of a conductor plate when a current is applied to a semiconductor element of a semiconductor device according to a second embodiment of the present disclosure. FIG. [Figure 7] FIG. 11 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a third embodiment of the present disclosure. [Figure 8] 13 is a conceptual diagram showing a temperature distribution of a conductor plate when a current is applied to a semiconductor element of a semiconductor device according to a third embodiment of the present disclosure. FIG. [Figure 9] FIG. 11 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a fourth embodiment of the present disclosure. [Figure 10] 13 is a conceptual diagram showing a temperature distribution of a conductor plate when a current is applied to a semiconductor element of a semiconductor device according to a fourth embodiment of the present disclosure. FIG. [Figure 11] FIG. 13 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a fifth embodiment of the present disclosure. [Figure 12] FIG. 13 is an equivalent circuit diagram of a semiconductor device according to a fifth embodiment of the present disclosure. [Figure 13] FIG. 13 is a cross-sectional view of a semiconductor device according to a sixth embodiment of the present disclosure. [Figure 14] FIG. 13 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a seventh embodiment of the present disclosure. [Figure 15] FIG. 13 is a cross-sectional view of a semiconductor device according to a seventh embodiment of the present disclosure. [Figure 16] FIG. 13 is a circuit diagram showing a configuration of a semiconductor device and an overcurrent detection circuit according to an eighth embodiment of the present disclosure. [Figure 17] FIG. 13 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to an eighth embodiment of the present disclosure. [Figure 18] FIG. 13 is a cross-sectional view of a semiconductor device according to an eighth embodiment of the present disclosure. [Figure 19] FIG. 13 is a circuit diagram showing a configuration of a semiconductor device and an overcurrent detection circuit according to a ninth embodiment of the present disclosure. [Figure 20]FIG. 13 is a perspective view showing a configuration of a resin-sealed state of a semiconductor device according to a ninth embodiment of the present disclosure. [Figure 21] FIG. 13 is a cross-sectional view of a semiconductor device according to a ninth embodiment of the present disclosure. [Figure 22] FIG. 23 is a perspective view showing the configuration of a resin-sealed state of a semiconductor device according to a tenth embodiment of the present disclosure. [Diagram 23] FIG. 23 is an equivalent circuit diagram of a semiconductor device according to a tenth embodiment of the present disclosure. [Figure 24] FIG. 23 is a cross-sectional view of a semiconductor device according to a tenth embodiment of the present disclosure. [Diagram 25] FIG. 1 is a circuit diagram showing configurations of a semiconductor device and an overcurrent detection circuit as a prerequisite technique. [Figure 26] FIG. 1 is a diagram showing temperature characteristics of a saturation voltage of a MOSFET. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <Embodiment 1> 1 is a circuit diagram showing the configuration of a semiconductor device 100 and an overcurrent detection circuit 90 according to a first embodiment of the present disclosure. As shown in FIG. 1, the semiconductor device 100 includes a semiconductor element SE having a MOS transistor Q1, which is a metal oxide semiconductor field effect transistor (MOSFET), connected between a power terminal PT for supplying power and a reference potential GND, a diode D1 connected in anti-parallel to the MOS transistor Q1, and a temperature sensor TS for detecting the temperature of the MOS transistor Q1. The semiconductor device 100 also includes a high-voltage diode HD, the withstand voltage of which is, for example, several hundred volts to several kV, the cathode of which is connected to a drain terminal DT of the MOS transistor Q1. The high-voltage diode HD is provided to protect the overcurrent detection circuit 90 from a high voltage applied to the power terminal PT.

[0010] The source terminal ST of the MOS transistor Q1 is connected to the reference potential GND and is also connected to the anode of a diode D1, the cathode of which is connected to the drain terminal DT.

[0011] The temperature sensor TS is composed of a temperature detection diode, and has a cathode terminal KT and an anode terminal AT.

[0012] The gate terminal GT of the MOS transistor Q1 and the cathode terminal KT and anode terminal AT of the temperature sensor TS are connected to a control circuit CC provided in the overcurrent detection circuit 90, but for convenience, the connection relationship with the control circuit CC is omitted.

[0013] A control circuit CC provided in the overcurrent detection circuit 90 controls the gate signal of the MOS transistor Q1, monitors the output signal of the temperature sensor TS, and monitors the overcurrent determination threshold. For convenience, however, FIG. 1 shows only a detection terminal DESAT for detecting the overcurrent determination threshold and an external signal input terminal IN.

[0014] The anode of the high-voltage diode HD is connected to a resistor R0 in the overcurrent detection circuit 90 via a control terminal PVT of the semiconductor device 100, and the resistor R0 is connected to a detection terminal DESAT of the control circuit CC. The resistor R0 is also connected to one electrode of a capacitor C1, and the other electrode of the capacitor C1 is connected to a reference potential GND in the overcurrent detection circuit 90.

[0015] The reference potential GND in the overcurrent detection circuit 90 and the reference potential GND in the semiconductor device 100 are commonly connected.

[0016] It should be noted that the semiconductor device 100 shown in FIG. 1 shows a semiconductor element composed of a MOS transistor Q1 and a diode D1 connected between the power terminal PT and a reference potential GND, but it is also possible to adopt an inverter circuit configuration in which a pair of a transistor and a diode similar to the MOS transistor Q1 and the diode D1 is connected between the reference potential GND and a ground potential, or a configuration in which multiple inverter circuits are connected in parallel.

[0017] FIG. 2 is a perspective view showing the configuration of the semiconductor device 100 in a state where it is sealed with insulating resin RS, and the outline of the insulating resin RS is indicated by a dashed line.

[0018] 2, the semiconductor device 100 has a substrate made of a conductor plate CM1 that functions as a heat spreader, and a semiconductor element SE is mounted on one of the main surfaces, which is the upper surface of the conductor plate CM1. The conductor plate CM1 is made of a material with high thermal conductivity, such as copper or aluminum, and functions as a buffer material between the semiconductor element SE and an external heat sink, while also improving heat dissipation efficiency.

[0019] The semiconductor element SE is an element in which the MOS transistor Q1 and diode D1 shown in FIG. 1 are integrated, and one end of a source terminal ST which is a plate-shaped conductive material is connected to the top surface, which is one of the main surfaces of the semiconductor element SE, and the other end of the source terminal ST protrudes to the outside from one of the side surfaces of the insulating resin RS.

[0020] The other main surface of the semiconductor element SE, that is, the lower surface, is electrically connected to the conductor plate CM1. One end of the drain terminal DT, which is a plate-shaped conductive material, is connected to the upper surface of the conductor plate CM1, and the other end of the drain terminal DT protrudes to the outside from one of the side surfaces of the insulating resin RS. The side surface of the insulating resin RS from which the other end of the source terminal ST protrudes and the side surface of the insulating resin RS from which the other end of the drain terminal DT protrudes are positioned opposite each other.

[0021] A temperature sensor TS is mounted on the upper surface of the semiconductor element SE, and a cathode electrode and an anode electrode (not shown) provided on the upper surface of the temperature sensor TS are electrically connected to one end of a cathode terminal KT and an anode terminal AT, which are plate-shaped conductive materials, via wiring WR. The other ends of the cathode terminal KT and the anode terminal AT protrude to the outside from the same side surface of the insulating resin RS as the other end of the drain terminal DT.

[0022] The output of the temperature sensor TS is fed back to the control circuit CC of the overcurrent detection circuit 90 via the cathode terminal KT and the anode terminal AT, and when the temperature of the semiconductor element SE becomes higher than a predetermined value, a protective operation such as stopping the switching operation of the MOS transistor Q1 is performed. By mounting the temperature sensor TS on the upper surface of the semiconductor element SE, the accurate temperature of the semiconductor element SE can be obtained, and the protective operation can be performed accurately.

[0023] A gate pad (not shown) on the top surface of the semiconductor element SE is electrically connected to one end of a gate terminal GT, which is a plate-shaped conductive material, via a wiring WR. The other end of the gate terminal GT protrudes to the outside from the same side surface of the insulating resin RS as the other end of the drain terminal DT.

[0024] A high-voltage diode HD is mounted on the upper surface of the conductor plate CM1 at a position away from the semiconductor element SE. The high-voltage diode HD is electrically connected to one end of the control terminal PVT, which is a plate-shaped conductive material, via a wiring WR. The other end of the control terminal PVT protrudes to the outside from the same side surface of the insulating resin RS as the other end of the drain terminal DT. The upper surface of the high-voltage diode HD serves as the anode, and the lower surface serves as the cathode.

[0025] A cross-sectional view taken along line AA in Fig. 2 is shown in Fig. 3, and a cross-sectional view taken along line BB in Fig. 2 is shown in Fig. 4. Note that the insulating resin RS is omitted in Figs. 3 and 4.

[0026] 3, the semiconductor element SE and the cathode layer KD of the high-voltage diode HD are connected to the upper surface of the conductive plate CM1 by a conductive material CM2. The conductive material CM2 may be, for example, solder, conductive resin, Ag sintered material, or Cu sintered material.

[0027] The source terminal ST is connected to a source electrode of a MOS transistor Q1 (not shown) on the upper surface of the semiconductor element SE by a conductive material CM3. The conductive material CM3 may be the same material as the conductive material CM2.

[0028] The cathode electrode of the diode D1 of the semiconductor element SE is common to the source electrode of the MOS transistor Q1, and the anode electrode of the diode D1 is common to the drain electrode of the MOS transistor Q1.

[0029] As shown in FIG. 4, the cathode layer KD of the high-voltage diode HD is located on the lower surface side of the high-voltage diode HD and is connected to the upper surface of the conductor plate CM1 by a conductive material CM2. The anode layer AD of the high-voltage diode HD is located on the upper surface side opposite to the cathode layer KD and is connected to the wiring WR by wire bonding. The cathode layer KD and the anode layer AD can be provided with a cathode electrode and an anode electrode, respectively, but are omitted from the illustration for convenience. The wiring WR is also connected to one end of the control terminal PVT by wire bonding. The wiring WR can be, for example, an aluminum wiring.

[0030] As described above, the semiconductor device 100 of the first embodiment has a built-in high-voltage diode HD, and therefore the terminal insulation is possible inside the insulating resin RS, so that the insulation distance between the control terminal PVT and the drain terminal DT can be made shorter than that of the conventional semiconductor device, and the design freedom of the terminal arrangement of the control substrate and the semiconductor device is improved. The insulation distance between the control terminal PVT and the drain terminal DT is defined by the distance ID indicated by the arrow in FIG. 2.

[0031] In addition, the desaturation detection voltage is determined by the sum of the saturation voltage of the MOS transistor Q1, which is the switching element, and the forward voltage and resistance power loss of the high-voltage diode HD. However, when the switching element is a MOSFET, the MOSFET saturation voltage has a large positive temperature characteristic, which affects the operating temperature range of the overcurrent detection circuit.

[0032] This problem will be described using an overcurrent detection circuit 70, which is the prerequisite technology, shown in Fig. 25. In Fig. 25, the same components as those in the overcurrent detection circuit 90 and the semiconductor device 100 described using Fig. 1 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0033] As shown in FIG. 25, an overcurrent detection circuit 70 includes a high-voltage diode HD, and a drain terminal DT of a MOS transistor Q1 of a semiconductor device 80 is connected to a control terminal PVT and a power terminal PT.

[0034] The cathode of a high-voltage diode HD is connected to the control terminal PVT, and the anode of the high-voltage diode HD is connected to a resistor R0 in the overcurrent detection circuit .

[0035] The overcurrent determination threshold V of such an overcurrent detection circuit 70 DESAT is the saturation voltage V of the transistor shown in FIG. DS , forward voltage V of high voltage diode HD F , the saturation voltage V of the MOS transistor Q1 DS and resistive power losses (I CHG ×R DESAT ) and is determined by the following relationship V DESAT =(I CHG ×R DESAT )+V F +V DS where I CHG is the current flowing through resistor R1, and R DESAT is the resistance of resistor R0.

[0036] FIG. 26 shows the temperature characteristics of the saturation voltage of a MOSFET. The horizontal axis indicates the environmental temperature E T (℃), and the vertical axis shows the saturation voltage V DS (V) is shown.

[0037] As shown in Figure 26, the saturation voltage of the MOSFET, V DS Since the higher the temperature, the larger the absolute value of the positive temperature characteristic tends to be, the environmental temperature E T The higher the overcurrent threshold V DESAT will become higher.

[0038] In the control circuit CC, the overcurrent determination threshold is monitored. When the voltage exceeds a certain level, the circuit shifts to the overcurrent protection operation. However, since the monitoring range of the control circuit CC has limitations, if the overcurrent determination threshold becomes too high at high temperatures, it will affect the operating temperature range of the overcurrent protection circuit.

[0039] However, in the semiconductor device 100, by arranging the high-voltage diode HD adjacent to the MOS transistor Q1 which is the heat source, the temperature of the high-voltage diode HD rises and the forward voltage drops compared to the case where the high-voltage diode HD is provided outside the semiconductor device. As a result, it acts in a direction to cancel out the temperature characteristics of the saturation voltage V DS of the MOSFET, and the detection accuracy of the overcurrent detection circuit 90 is improved.

[0040] <Embodiment 2> FIG. 5 is a perspective view showing the configuration of the semiconductor device 200 according to Embodiment 2. In FIG. 5, the same components as those of the semiconductor device 100 described with reference to FIG. 2 are denoted by the same reference numerals, and redundant descriptions are omitted.

[0041] In the semiconductor device 200 shown in FIG. 5, the distance LA from the semiconductor element SE to one end face of the conductor plate CM1 and the distance LB to the other end face of the conductor plate CM1 are not the same.

[0042] Here, one end face of the conductor plate CM1 is the end face EP1 (first end face) parallel to the longitudinal direction of the source terminal ST and the drain terminal DT, and the other end is the end face EP2 (second end face) orthogonal to the end face EP1. In the example shown in FIG. 5, the planar shape of the conductor plate CM1 is rectangular, and a semiconductor element SE with a square planar shape is mounted at the center of the upper surface of the conductor plate CM1. The distance LA (first distance) to the end face EP1 on the long side of the conductor plate CM1 is shorter than the distance LB (second distance) to the end face EP2 on the short side of the conductor plate CM1, and the relationship is LA < LB. The high-voltage diode HD is mounted on the conductor plate CM1 on the end face EP1 side where the distance from the semiconductor element SE is short.

[0043] When current is applied to the semiconductor element SE, the temperature of the conductive plate CM1 rises, with the semiconductor element SE as a heat source. However, if the distance LA and the distance LB from the semiconductor element SE to the end face of the conductive plate CM1 are not equal, the way the heat spreads, i.e., the temperature distribution, becomes uneven, and the temperature of the semiconductor element SE becomes closer to that of the semiconductor element SE when the distance is shorter.

[0044] Figure 6 is a conceptual diagram showing the temperature distribution of the conductor plate CM1 when current is applied to the semiconductor element SE, with the shade of hatching in the sand representing high and low temperatures. As shown in Figure 6, an elliptical temperature distribution is formed, with the semiconductor element SE in the center at the highest temperature and the temperature decreasing toward the outside. The major axis of the ellipse is parallel to the minor side of the conductor plate CM1, and the high temperature region extends up to the vicinity of the part where the high-voltage diode HD is mounted.

[0045] Therefore, by arranging the high-voltage diode HD on the side where the distance from the semiconductor element SE to the end face of the conductive plate CM1 is shorter, the thermal coupling between the semiconductor element SE and the high-voltage diode HD is improved, which enhances the effect of canceling out the temperature dependency of the MOS transistor Q1 (Figure 1), which is a MOSFET, and improves the detection accuracy of the overcurrent detection circuit 90.

[0046] In addition, since the drain terminal DT and the conductive material joining the drain terminal DT to the conductor plate CM1 are arranged on the side with the longer distance to the end face, arranging the high-voltage diode HD on this side imposes restrictions on the arrangement of the drain terminal DT and the conductive material. However, by arranging the high-voltage diode HD on the side with the shorter distance to the end face, there are no restrictions on the arrangement of the drain terminal DT and the conductive material, and this improves the freedom in designing the semiconductor device.

[0047] In addition, Figure 5 describes an example in which the conductive plate CM1 has a rectangular shape in a plan view. However, even if the shape in a plan view is square, or if the semiconductor element SE is not positioned in the center and the distances LA and LB are not equal, the temperature distribution of the conductive plate CM1 will be uneven. Therefore, in this case too, the detection accuracy of the overcurrent detection circuit 90 can be improved by placing the high-voltage diode HD on the side with the shorter distance.

[0048] <Embodiment 3> Fig. 7 is a perspective view showing a configuration of a semiconductor device 300 according to the third embodiment. In Fig. 7, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0049] 7, two semiconductor elements SE are arranged in parallel on the upper surface of a conductive plate CM1. The two semiconductor elements SE have source terminals ST connected in parallel, and each semiconductor element SE is equipped with a temperature sensor TS, and the temperature sensor TS has a cathode electrode and an anode electrode (not shown) provided on the upper surface electrically connected to one end of a cathode terminal KT and an anode terminal AT, which are plate-shaped conductive materials, via wiring WR.

[0050] Further, a gate pad (not shown) on the upper surface of each semiconductor element SE is electrically connected to one end of a gate terminal GT, which is a plate-shaped conductive material, via a wiring WR.

[0051] On the upper surface of the conductive plate CM1, two drain terminals DT are connected to two semiconductor elements SE.

[0052] The high-voltage diode HD is mounted between the two semiconductor elements SE arranged on the upper surface of the conductive plate CM1. When a current is applied to the two semiconductor elements SE, the two semiconductor elements SE act as a heat source and the temperature of the conductive plate CM1 rises, but in the area where the semiconductor elements SE are adjacent to each other, thermal interference occurs and the temperature becomes higher.

[0053] Fig. 8 is a conceptual diagram showing the temperature distribution of the conductive plate CM1 when current is applied to two semiconductor elements SE, with the shade of hatching in the sand representing high and low temperatures. As shown in Fig. 8, thermal interference occurs in the area where the semiconductor elements SE are adjacent, making the temperature higher than other areas on the same concentric circle. By arranging the high-voltage diode HD in the area where such thermal interference occurs, the thermal coupling between the semiconductor element SE and the high-voltage diode HD is improved, which enhances the effect of canceling out the temperature dependency of the MOS transistor Q1 (Fig. 1), which is a MOSFET, and improves the detection accuracy of the overcurrent detection circuit 90.

[0054] <Fourth embodiment> Fig. 9 is a perspective view showing a configuration of a semiconductor device 400 according to the fourth embodiment. In Fig. 9, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0055] 9, three semiconductor elements SE are arranged in parallel on the upper surface of a conductive plate CM1. The three semiconductor elements SE have source terminals ST connected in parallel, and each semiconductor element SE is equipped with a temperature sensor TS, and the temperature sensor TS has a cathode electrode and an anode electrode (not shown) provided on the upper surface electrically connected to one end of a cathode terminal KT and an anode terminal AT, which are plate-shaped conductive materials, via wiring WR.

[0056] Further, a gate pad (not shown) on the upper surface of each semiconductor element SE is electrically connected to one end of a gate terminal GT, which is a plate-shaped conductive material, via a wiring WR.

[0057] On the upper surface of the conductive plate CM1, three drain terminals DT are connected to the three semiconductor elements SE.

[0058] The high-voltage diode HD is mounted in the region between the central semiconductor element SE and the adjacent semiconductor element SE to the left, near the central semiconductor element SE. When current is applied to the three semiconductor elements SE, the three semiconductor elements SE act as heat sources to raise the temperature of the conductor plate CM1, but in the region where the semiconductor elements SE are adjacent, thermal interference occurs, causing the temperature to rise.

[0059] Fig. 10 is a conceptual diagram showing the temperature distribution of the conductor plate CM1 when current is applied to three semiconductor elements SE, with the shade of hatching in the sand representing the temperature. As shown in Fig. 10, thermal interference occurs in the area where the semiconductor elements SE are adjacent, making the temperature higher than other areas on the same concentric circle.

[0060] Because the temperature of the central semiconductor element SE becomes highest due to thermal interference, arranging the high-voltage diode HD closer to the central semiconductor element SE enhances the thermal coupling between the semiconductor element SE and the high-voltage diode HD, which enhances the effect of canceling out the temperature dependency of the MOS transistor Q1 (FIG. 1), which is a MOSFET, and improves the detection accuracy of the overcurrent detection circuit 90. Note that, although this embodiment shows an example in which three semiconductor elements SE are arranged on the upper surface of the conductive plate CM1, this is not limited to three semiconductor elements SE, and is effective when an odd number of semiconductor elements SE, such as five or seven, are arranged.

[0061] <Fifth Preferred Embodiment> Fig. 11 is a perspective view showing a configuration of a semiconductor device 500 according to the fifth embodiment. In Fig. 11, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted. Fig. 12 shows an equivalent circuit diagram of the semiconductor device 500.

[0062] In the semiconductor devices 100 to 400 of the first to fourth embodiments, a configuration is shown in which a high-voltage diode HD is mounted on the conductive plate CM1. However, even if multiple high-voltage diodes HD are arranged on the conductive plate CM1, they cannot be electrically connected in series.

[0063] 11, an insulating substrate IM having two conductor patterns CM10 is mounted on a conductor plate CM1, and high-voltage diodes HD are mounted on each of the conductor patterns CM10 with their cathodes facing each other. Also, one high-voltage diode HD is mounted on the conductor plate CM1 near the insulating substrate IM with its cathode facing the conductor plate CM1.

[0064] The three diodes are arranged in a row, and the anode of the high-voltage diode HD (first diode) closest to the control terminal PVT is electrically connected to one end of the control terminal PVT via a wiring WR, and the conductor pattern CM10 carrying the high-voltage diode HD is electrically connected to the anode of the next high-voltage diode HD via a wiring WR. The conductor pattern CM10 carrying the high-voltage diode HD is electrically connected to the anode of the high-voltage diode HD (second diode) on the conductor plate CM1 via a wiring WR.

[0065] By adopting such a configuration, as shown in FIG. 12, three high-voltage diodes HD are connected in series, which enhances the effect of canceling the temperature dependency of the MOS transistor Q1 (FIG. 1), which is a MOSFET, and improves the detection accuracy of the overcurrent detection circuit 90.

[0066] The number of high-voltage diodes HD arranged is not limited to three, and two or more diodes can enhance the effect of canceling the temperature dependency of the MOS transistor Q1.

[0067] <Sixth embodiment> Fig. 13 is a cross-sectional view showing a partial configuration of a semiconductor device 600 according to an embodiment, and corresponds to Fig. 4 of the first embodiment. As shown in Fig. 13, the semiconductor device 600 has high-voltage diodes HD1 and HD2 stacked in this order from the bottom on a conductor plate CM1.

[0068] The cathode layer KD1 of the high-voltage diode HD1 is connected to the conductor plate CM1 by a conductive material CM2, the anode layer AD1 of the high-voltage diode HD1 is connected to the cathode layer KD2 of the high-voltage diode HD2 by a conductive material CM2, one end of the wiring WR is connected to the anode layer AD2 of the high-voltage diode HD2 by wire bonding, and the other end of the wiring WR is connected to the control terminal PVT.

[0069] By stacking multiple high-voltage diodes in this manner, multiple high-voltage diodes can be connected in series with a simpler configuration, and a semiconductor device with improved cancellation of the temperature dependence of MOS transistor Q1 can be manufactured at lower cost.

[0070] <Embodiment 7> Fig. 14 is a perspective view showing a configuration of a semiconductor device 700 of the seventh embodiment. Fig. 15 is a cross-sectional view taken along line CC in Fig. 14. In Fig. 14, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0071] 14, a high-voltage diode HD is mounted on the upper surface of a semiconductor element SE. A surface electrode that functions as the source electrode of a MOS transistor Q1 is provided on the upper surface of the semiconductor element SE, but an electrode that is electrically separated from this surface electrode and has the same potential as the drain electrode of the MOS transistor Q1 is provided on the upper surface of the semiconductor element SE, and the high-voltage diode HD is mounted on this electrode.

[0072] By mounting the high-voltage diode HD on the MOS transistor Q1, which is the switching element, the high-voltage diode HD is placed in close proximity to the switching element, which is the heat source. This makes it possible to further improve the thermal coupling between the semiconductor element SE and the high-voltage diode HD, and further enhances the effect of canceling out the temperature dependency of the MOS transistor Q1.

[0073] The cross-sectional structure of the high-voltage diode HD will be described with reference to FIG. 15. In the following description, N and P indicate the conductivity types of semiconductors. In this disclosure, the first conductivity type is N-type and the second conductivity type is P-type, but the first conductivity type may be P-type and the second conductivity type may be N-type. + The P type indicates that the impurity concentration is higher than that of the N type. + The N-type indicates that the impurity concentration is higher than that of the P-type.

[0074] As shown in FIG. 15, the semiconductor element SE of the semiconductor device 700 has a back electrode 15 (first main electrode) functioning as a drain electrode on the lower surface side, and a N + A type semiconductor layer 1 and an N-type semiconductor layer 2 are provided in this order, and a plurality of P-type semiconductor layers 3 are selectively provided on the upper layer of the semiconductor layer 2. + A mold semiconductor layer 4 is selectively provided. The semiconductor layers 1 and 2 constitute a semiconductor substrate.

[0075] In addition, the upper layer of the semiconductor layer 2 is provided with a N + A type semiconductor layer 5 is selectively provided, and an element isolation insulating film 16 is provided between the semiconductor layer 3 and the semiconductor layer 5 .

[0076] A gate electrode 12 is provided between the edge portions of two opposing semiconductor layers 4 provided on adjacent semiconductor layers 3, with a gate insulating film 11 interposed therebetween.

[0077] An interlayer insulating film 13 is provided so as to cover the gate insulating film 11 and the gate electrode 12, and a surface electrode 14 (second main electrode) functioning as a source electrode is provided so as to cover the interlayer insulating film 13. The surface electrode 14 is a film of an aluminum alloy such as Al or AlSi.

[0078] The configuration of the MOS transistor Q1, which is a MOSFET, has been described above. However, since the MOS transistor Q1 has a known transistor structure formed by known technology, a description of the manufacturing process etc. will be omitted.

[0079] On the upper part of the semiconductor layer 5, a surface electrode 21 is provided, which has the same thickness and is made of the same material as the surface electrode 14, and a cathode electrode 22 of a high-voltage diode HD is connected to the surface electrode 21 via a conductive material CM4. An N-type cathode layer 23 and a P-type anode layer 24 are laminated in this order on the cathode electrode 22, an anode electrode 25 is provided on the anode layer 24, and a conductive material CM4 is provided on the anode electrode 25. One end of a wiring WR is connected to the conductive material CM4 by wire bonding, and the other end of the wiring WR is connected to the control terminal PVT. The conductive material CM4 can be made of the same material as the conductive material CM2 described above.

[0080] The back electrode 15, which functions as a drain electrode, is made of N + A film of aluminum (Al) or an aluminum alloy such as AlSi formed on the N-type semiconductor layer 1, and an N-type semiconductor layer 2 is formed on the upper layer of the N-type semiconductor layer 2. + When the N-type semiconductor layer 5 is provided, the N + / N / N + A layered structure of N + Type semiconductor layer 1 and N + The potential of the semiconductor layer 5 is substantially the same as that of the high-voltage diode HD. Therefore, the cathode electrode 22 of the high-voltage diode HD is pseudo-connected to the drain electrode, and a configuration in which the high-voltage diode HD is mounted on the MOS transistor Q1 can be realized.

[0081] <Embodiment 8> Fig. 16 is a circuit diagram showing configurations of a semiconductor device 800 and an overcurrent detection circuit 90 according to an eighth embodiment of the present disclosure. Note that in Fig. 16, the same components as those in the semiconductor device 100 described with reference to Fig. 1 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0082] A semiconductor device 800 shown in FIG. 16 has a configuration in which a multiplier circuit MP is provided between the cathode of a high-voltage diode HD and a drain terminal DT of a MOS transistor Q1.

[0083] The multiplier circuit MP is a VBE type multiplier circuit having an NPN transistor Q2 whose collector terminal CT is connected to the cathode of a high-voltage diode HD and whose emitter terminal ET is connected to the drain terminal DT of a MOS transistor Q1, a resistor R1 (first resistor) connected between the base terminal BT and emitter terminal ET of the transistor Q2, and a resistor R2 (second resistor) connected between the base terminal BT and collector terminal CT of the transistor Q2.

[0084] The multiplier circuit MP amplifies the forward voltage of the PN junction diode formed by the base and emitter of the transistor Q2 using resistors R1 and R2, and can adjust it to a voltage level determined by the resistance values ​​of resistors R1 and R2.

[0085] That is, the resistance values ​​of resistors R1 and R2 are R1 and R2, respectively, and the base-emitter voltage of transistor Q2 is V BE Then, the collector-emitter voltage V of transistor Q2 is CE V CE =(1+R2 / R1) V BE Therefore, by adjusting the resistance values ​​of resistors R1 and R2, the collector-emitter voltage V CE can be adjusted to any value.

[0086] In addition, the base-emitter voltage V BE has a negative temperature characteristic, just like the forward voltage of a diode. Even without forming a series circuit of diodes, the base-emitter voltage V BE can be amplified by the resistance ratio of the resistance values ​​R1 and R2.

[0087] Fig. 17 is a perspective view showing a configuration of a semiconductor device 800 according to the eighth embodiment. In Fig. 17, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0088] In the semiconductor device 800 shown in Fig. 17, a multiplier circuit MP is mounted on the upper surface of the conductor plate CM1 at a position away from the semiconductor element SE, and a high-voltage diode HD is mounted on one end of the control terminal PVT. The multiplier circuit MP and the high-voltage diode HD are electrically connected via a wiring WR. The upper surface of the multiplier circuit MP serves as a collector, and the lower surface serves as an emitter.

[0089] Fig. 18 shows a cross-sectional view taken along line DD in Fig. 17. As shown in Fig. 18, the multiplier circuit MP has a back electrode 31 functioning as an emitter electrode on the lower surface side, and the back electrode 31 is connected to a conductor plate CM1 via a conductive material CM2.

[0090] An N-type semiconductor layer 32 is provided on the back electrode 31, and a P-type semiconductor layer 33 is selectively provided on the upper layer of the semiconductor layer 32. + A type semiconductor layer 34 is optionally provided.

[0091] An interlayer insulating film 35 is provided on the semiconductor layer 32, and an emitter electrode 36 is provided on the interlayer insulating film 35, the emitter electrode 36 penetrating the interlayer insulating film 35 to reach the semiconductor layer 32, a base electrode 37 penetrating the interlayer insulating film 35 to reach the semiconductor layer 33, and a collector electrode 38 penetrating the interlayer insulating film 35 to reach the semiconductor layer 34.

[0092] A resistor R1 is provided on the interlayer insulating film 35 between the emitter electrode 36 and the base electrode 37, and a resistor R2 is provided on the interlayer insulating film 35 between the collector electrode 38 and the base electrode 37. The resistors R1 and R2 are made of, for example, a polysilicon layer containing semiconductor impurities, and the resistance value can be adjusted by adjusting the amount of impurities. The resistance value can also be adjusted by adjusting the thickness of the resistors R1 and R2 using a laser trimming technique or the like.

[0093] One end of a wiring WR is connected to the collector electrode 38 by wire bonding, and the other end of the wiring WR is connected to a surface electrode 44 of a high-voltage diode HD mounted on the control terminal PVT. In the high-voltage diode HD, a back electrode 41 functioning as an anode electrode is connected to the control terminal PVT via a conductive material CM2, a P-type anode layer 42 and an N-type cathode layer 43 are laminated in this order on the back electrode 41, and a surface electrode 44 functioning as a cathode electrode is provided on the cathode layer 43.

[0094] By arranging the multiplier circuit MP having negative temperature characteristics in the vicinity of the switching element, which is a heat source, it is possible to enhance the effect of canceling the temperature dependency of the MOS transistor Q1 (FIG. 16), which is a MOSFET, with a simpler configuration, thereby improving the detection accuracy of the overcurrent detection circuit 90.

[0095] <Embodiment 9> Fig. 19 is a circuit diagram showing the configuration of a semiconductor device 900 and an overcurrent detection circuit 90 according to a ninth embodiment of the present disclosure. The semiconductor device 900 shown in Fig. 19 has a configuration in which a high-voltage diode HD is built into a semiconductor element SE. Note that in Fig. 19, the same components as those in the semiconductor device 100 described using Fig. 1 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0096] Fig. 20 is a perspective view showing a configuration of a semiconductor device 900 according to the ninth embodiment. In Fig. 207, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0097] In the semiconductor device 900 shown in Fig. 20, the high-voltage diode HD is provided in the vicinity of the connection region of the source terminal ST on the opposite side to the position where the temperature sensor TS of the semiconductor element SE is disposed, and is electrically connected to one end of the control terminal PVT via a wiring WR. For convenience, the semiconductor element SE and the high-voltage diode HD are shown separately in Fig. 20.

[0098] 21 shows a cross-sectional view taken along line EE in FIG. 20. As shown in FIG. 21, the semiconductor element SE has a back electrode 15 functioning as a drain electrode on the lower surface side. + A type semiconductor layer 1 and an N-type semiconductor layer 2 are provided in this order, and a plurality of P-type semiconductor layers 3 are selectively provided on the upper layer of the semiconductor layer 2. + A mold semiconductor layer 4 is selectively provided. The semiconductor layers 1 and 2 constitute a semiconductor substrate.

[0099] Moreover, a P-type semiconductor layer 7 is selectively provided on the upper layer of the semiconductor layer 2, and an element isolation insulating film 16 is provided between the semiconductor layer 3 and the semiconductor layer 7.

[0100] A gate electrode 12 is provided between the edge portions of two opposing semiconductor layers 4 provided on adjacent semiconductor layers 3, with a gate insulating film 11 interposed therebetween.

[0101] An interlayer insulating film 13 is provided so as to cover the gate insulating film 11 and the gate electrode 12, and a surface electrode 14 functioning as a source electrode is provided so as to cover the interlayer insulating film 13. The surface electrode 14 is a film of Al or an aluminum alloy such as AlSi.

[0102] The configuration of the MOS transistor Q1, which is a MOSFET, has been described above. However, since the MOS transistor Q1 has a known transistor structure formed by known technology, a description of the manufacturing process etc. will be omitted.

[0103] A front surface electrode 21 is provided on the upper portion of the semiconductor layer 7, and is formed to the same thickness and from the same material as the front surface electrode 14. A wiring WR (FIG. 20) is connected to the front surface electrode 21 by wire bonding. The front surface electrode 21 functions as an anode electrode, and the front surface electrode 21, the semiconductor layer 7, the semiconductor layer 2, the semiconductor layer 1 and the back surface electrode 15 constitute a high-voltage diode HD.

[0104] As shown in FIG. 21, by forming the MOS transistor Q1 and the high-voltage diode HD on a common semiconductor substrate, the high-voltage diode HD is placed in close proximity to the switching element, which is the heat source, thereby making it possible to achieve extremely high thermal coupling.

[0105] <Embodiment 10> Fig. 22 is a perspective view showing a configuration of a semiconductor device 1000 according to the tenth embodiment. In Fig. 22, the same components as those in the semiconductor device 100 described with reference to Fig. 2 are denoted by the same reference numerals, and duplicated descriptions will be omitted. Also, an equivalent circuit diagram of the semiconductor device 1000 is shown in Fig. 23.

[0106] In the semiconductor devices 100 to 900 of the first to ninth embodiments, the temperature sensor TS is mounted on the semiconductor element SE. However, in the semiconductor device 1000 shown in FIG. 22, the temperature sensor TS is mounted on the high-voltage diode HD.

[0107] The temperature sensor TS has a cathode electrode and an anode electrode (not shown) provided on the upper surface, which are electrically connected to one end of the cathode terminal KT and the anode terminal AT via a wiring WR, respectively. The high-voltage diode HD is electrically connected to one end of the control terminal PVT via a wiring WR.

[0108] Fig. 24 shows a cross-sectional view taken along line FF in Fig. 22. As shown in Fig. 24, the high-voltage diode HD has a back electrode 50 functioning as a cathode electrode on the lower surface side, an N-type semiconductor layer 51 and a P-type semiconductor layer 52 are provided in this order on the back electrode 50, a silicon oxide film 53 is selectively provided on the upper layer of the semiconductor layer 52, and an N-type semiconductor layer 54 and a P-type semiconductor layer 55 are diode-connected on the silicon oxide film 53 to form a temperature sensor TS. The semiconductor layer 54 and the semiconductor layer 55 are formed by doping a polysilicon layer with N-type and P-type impurities, respectively.

[0109] The semiconductor layer 54 and the semiconductor layer 55 are covered with an interlayer insulating film 56 made of borophosphosilicate glass (BPSG), tetra ethyl orthosilicate (TEOS), low temperature oxide (LTO), or the like. A cathode electrode 57 and an anode electrode 58 of the temperature sensor TS are provided on the interlayer insulating film 56, penetrating the interlayer insulating film 56 to reach the semiconductor layer 54 and the semiconductor layer 55, respectively. Wiring WR (FIG. 22) is connected to the cathode electrode 57 and the anode electrode 58 by wire bonding. The temperature sensor TS on the semiconductor element SE in the semiconductor devices 100 to 900 of the first to ninth embodiments has the same configuration as the sensor TS in FIG. 24.

[0110] Further, on the semiconductor layer 52 in an area where the silicon oxide film 53 is not provided, a surface electrode 59 functioning as an anode electrode of the high-voltage diode HD is provided, and a wiring WR (FIG. 22) is connected to the surface electrode 59 by wire bonding.

[0111] By adopting such a configuration, as shown in FIG. 23, the temperature sensor TS is built into the high-voltage diode HD, and the semiconductor element SE includes only the MOS transistor Q1 and the diode D1.

[0112] When the MOS transistor Q1 is made of wide bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), the chip size, i.e., the SiC substrate and the GaN substrate, can be reduced by disposing the temperature sensor TS on the high-voltage diode HD made of silicon semiconductor, thereby reducing the cost of the semiconductor device. In addition, by making the silicon semiconductor element and the wide bandgap semiconductor element into separate chips, the manufacturing process can be simplified and the cost of the semiconductor device can be reduced.

[0113] Although the present disclosure has been described in detail, the above description is illustrative in all respects and does not limit the present disclosure. It is understood that countless variations not illustrated can be assumed without departing from the scope of the present disclosure.

[0114] In addition, within the scope of the present disclosure, it is possible to freely combine the respective embodiments, and to appropriately modify or omit the respective embodiments.

Claims

1. a first main terminal to which a first potential is applied; a second main terminal to which a second potential lower than the first potential is applied; a control terminal connected to an external overcurrent detection circuit; at least one semiconductor device having a MOS transistor connected between the first main terminal and the second main terminal; at least one diode having a cathode electrically connected to the first main terminal and an anode electrically connected to the control terminal, the at least one diode protecting the overcurrent detection circuit; The at least one semiconductor element is mounted on a conductive plate; The at least one semiconductor element and the at least one diode are sealed with an insulating resin.

2. The at least one diode The semiconductor device according to claim 1 , mounted on said conductive plate.

3. The at least one semiconductor device comprises: the at least one semiconductor element is mounted at a position on the conductor plate such that a first distance from the semiconductor element to a first end face of the conductor plate is different from a second distance from the semiconductor element to a second end face perpendicular to the first end face; the first distance is less than the second distance; The at least one diode 3. The semiconductor device according to claim 2, wherein the semiconductor device is mounted on the conductive plate on the side of the first end face.

4. The at least one semiconductor element is two semiconductor elements, The two semiconductor elements are mounted in a row on the conductor plate with a gap between them; The at least one diode The semiconductor device according to claim 1 , mounted between said two semiconductor elements.

5. The at least one semiconductor element is an odd number of three or more semiconductor elements, the three or more semiconductor elements are mounted in a row on the conductor plate at intervals; The at least one diode 2. The semiconductor device according to claim 1, wherein the semiconductor device is mounted between a central semiconductor element and an outer semiconductor element closer to the central semiconductor element.

6. The at least one diode may be a plurality of diodes, the plurality of diodes are mounted on an insulating substrate having a plurality of conductor patterns arranged in a row at intervals on the conductor plate, and are electrically connected in series; 2. The semiconductor device according to claim 1, wherein an anode of a first diode at one end of the array of said plurality of diodes is electrically connected to said control terminal, and a cathode of a second diode at the other end of the array is electrically connected to said first main terminal.

7. The at least one diode may be a plurality of diodes, 2. The semiconductor device according to claim 1, wherein said plurality of diodes are stacked and mounted on said conductor plate with their respective cathodes facing said conductor plate, and are electrically connected in series.

8. The at least one semiconductor device comprises: a first main electrode facing the conductive plate, and a second main electrode on an opposite side to the first main electrode; a surface electrode adjacent to the second main electrode and electrically isolated from the second main electrode; the surface electrode is electrically connected to the first main electrode through an inside of the at least one semiconductor element; The at least one diode 2. The semiconductor device according to claim 1, wherein said cathode is mounted on said front surface electrode of said at least one semiconductor element so as to be electrically connected thereto.

9. a multiplier circuit interposed between the cathode of the at least one diode and the first main terminal; The multiplier circuit comprises: a transistor having a collector electrically connected to the cathode of the at least one diode and an emitter electrically connected to the first main terminal; a first resistor electrically connected between the base and the emitter of the transistor; 2. The semiconductor device according to claim 1, further comprising: a second resistor electrically connected between said base and said collector.

10. The at least one semiconductor device comprises: a first main electrode facing the conductive plate, and a second main electrode on an opposite side to the first main electrode; a surface electrode adjacent to the second main electrode and electrically isolated from the second main electrode; The at least one diode the anode is connected to the surface electrode; 2. The semiconductor device according to claim 1, wherein said cathode is provided inside said at least one semiconductor element so as to be connected to said first main electrode.

11. a temperature sensor mounted on the at least one semiconductor element and configured to detect a temperature of the at least one semiconductor element; 2. The semiconductor device according to claim 1, wherein the temperature detected by said temperature sensor is fed back to said overcurrent detection circuit.

12. a temperature sensor mounted on the at least one diode and configured to detect a temperature of the at least one semiconductor element; 2. The semiconductor device according to claim 1, wherein the temperature detected by said temperature sensor is fed back to said overcurrent detection circuit.

13. The overcurrent detection circuit includes:

2. The semiconductor device according to claim 1, further comprising: a first protection circuit for protecting said MOS transistor from an overcurrent by detecting a non-saturation voltage of said MOS transistor.

Images