Display device and manufacturing method thereof

Abstract

This organic EL display device (50a) comprises an IC chip (11) mounted via a first conductive material (10) and an FPC (21) mounted via a second conductive material (20). The IC chip (11) and the FPC (21) are arranged adjacent to each other, and a separating wall member (30a) separating the first conductive material (10) and the second conductive material (20) is provided between the IC chip (11) and the FPC (21).

Description

[Technical field]

[0001] The present invention relates to a display device and a manufacturing method thereof. [Background technology]

[0002] In recent years, as a display device to replace a liquid crystal display device, a self-luminous organic EL display device using an organic electroluminescence (hereinafter also referred to as "EL") element has been attracting attention. In the organic EL display device, a flexible organic EL display device has been proposed having a flexible panel structure in which electronic components such as a driving IC (integrated circuit) chip and an FPC (flexible printed circuit) are mounted directly or via a film-like substrate on a display panel having a structure in which an organic EL element and various films are laminated on a flexible resin substrate. The electronic components are mounted by pressure bonding using a conductive material (conductive adhesive) such as a conductive paste or an anisotropic conductive film (ACF).

[0003] When a defect occurs in a pressure-mounted FPC, a process (rework process) is carried out in which the defective FPC is peeled off from the board and a new FPC is remounted. During the rework process, residues of the conductive material used in the pressure-mounting remain on the traces of the peeled-off defective FPC, so a remover liquid for removing the residue is applied to the residue-removing areas. At this time, the applied remover liquid may come into contact with other electronic components (e.g., IC chips) adjacent to the defective FPC or the conductive material used in the pressure-mounting of the defective FPC. In this case, since the same conductive material is also used in the pressure-mounting of the IC chip, it may adversely affect the mounting (connection) state of the IC chip, causing a display device defect due to the IC chip.

[0004] For example, Patent Document 1 proposes a flat display device in which two dummy pads larger in size than the terminals connecting the TCPs are arranged between adjacent TCPs (branch wiring boards) connected to a PCB (main wiring board) via ACF, and these dummy pads are spaced apart, for example, by 1.5 mm or more. In this flat display device, the ACF is cut and removed in the area between the dummy pads, thereby preventing the occurrence of terminal connection defects at the connection points between the TCP and PCB adjacent to the TCP to be reworked, which are caused by the spread of a solvent (stripping solution) that removes the ACF during repair (rework process). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2002-258767 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the display device of Patent Document 1, when the electronic component to be reworked (e.g., FPC, etc.) is close to another electronic component adjacent thereto (e.g., IC chip, etc.) (e.g., about 1 to 2 mm), even if the ACF is cut and removed in the region between the dummy pads, it is difficult to remove the residue without contacting the stripping liquid with the IC chip. In addition, arranging two dummy pads larger than each terminal at a distance greater than a certain distance runs counter to the trend of modularizing the display panel that constitutes the display device to reduce its size.

[0007] The present invention has been made in consideration of these points, and its object is to suppress the occurrence of poor connection of IC chips caused by contact with a remover liquid that removes residual conductive material when the FPC is peeled off and remounted in a display device in which adjacent IC chips and FPCs are pressure-bonded together via a conductive material. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, the display device of the present invention is a display device comprising an IC chip mounted via a first conductive material and an FPC mounted via a second conductive material, wherein the IC chip and the FPC are arranged adjacent to each other, and a partition member is provided between the IC chip and the FPC to separate the first conductive material and the second conductive material.

[0009] The manufacturing method of a display device according to the present invention is a manufacturing method of a display device comprising an IC chip mounted via a first conductive material, an FPC mounted adjacent to the IC chip via a second conductive material, a partition member provided between the IC chip and the FPC and separating the first conductive material from the second conductive material, and an IC protective tape provided to cover the IC chip, and is characterized in that the method comprises an IC protective tape application process of applying the IC protective tape onto the IC chip, and the partition member is formed in the IC protective tape application process.

[0010] Furthermore, a manufacturing method for a display device according to the present invention includes an IC chip mounted via a first conductive material, an FPC mounted via a second conductive material adjacent to the IC chip, a partition member provided between the IC chip and the FPC and separating the first conductive material from the second conductive material, an IC protective tape provided to cover the IC chip, and a metal tape provided on the IC protective tape to cover the IC chip, wherein the partition member is formed integrally with the metal tape, the method comprising: an IC protective tape application process for applying the IC protective tape onto the IC chip; and a metal tape application process for applying the metal tape onto the IC chip to which the IC protective tape has been applied, and in the metal tape application process, the partition member is formed by applying the metal tape. Effect of the Invention

[0011] According to the present invention, in a display device in which adjacent IC chips and FPCs are pressure-bonded together via a conductive material, when the FPC is peeled off and remounted, it is possible to suppress the occurrence of poor connection of the IC chips due to contact with a remover that removes residual conductive material. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of an organic EL display device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a plan view of a display region of the organic EL display device according to the first embodiment of the present invention. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1, showing a terminal portion of the organic EL display device according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view showing a terminal portion in a modified example of the organic EL display device according to the first embodiment of the present invention, and corresponds to FIG. [Diagram 5] FIG. 5 is a perspective view illustrating a process of installing a partition member constituting the organic EL display device according to the first embodiment of the present invention. [Figure 6] FIG. 6 is a perspective view illustrating a rework process for peeling off and remounting the FPC constituting the organic EL display device according to the first embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view showing a terminal portion of an organic EL display device according to a second embodiment of the present invention, and corresponds to FIG. [Figure 8] FIG. 8 is a perspective view illustrating a process of installing a partition member constituting an organic EL display device according to a second embodiment of the present invention, and corresponds to FIG. [Figure 9] FIG. 9 is a cross-sectional view showing a terminal portion of an organic EL display device according to a third embodiment of the present invention, and corresponds to FIG. [Figure 10] FIG. 10 is a perspective view illustrating a process of installing a partition member constituting an organic EL display device according to a third embodiment of the present invention, and corresponds to FIG. [Figure 11] FIG. 11 is a perspective view illustrating a rework process for peeling off and remounting the FPC constituting the organic EL display device according to the third embodiment of the present invention, and corresponds to FIG. [Figure 12] FIG. 12 is a plan view showing a schematic configuration of an organic EL display device according to a fourth embodiment of the present invention, and corresponds to FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiments.

[0014] First Embodiment 1 to 6 show a first embodiment of a display device according to the present invention. In the following embodiments, an organic EL display device having an organic EL element is exemplified as a display device having a light-emitting element. Here, FIG. 1 is a plan view showing a schematic configuration of an organic EL display device 50a of this embodiment. FIG. 2 is a plan view of a display region D of the organic EL display device 50a. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1, showing a terminal portion T of the organic EL display device 50a. FIG. 4 is a cross-sectional view showing the terminal portion T in a modified example of the organic EL display device 50a, and corresponds to FIG. 3. FIG. 5 is a perspective view for explaining a process of installing a partition member 30a constituting the organic EL display device 50a. FIG. 6 is a perspective view for explaining a rework process of peeling off and remounting an FPC 21 constituting the organic EL display device 50a.

[0015] As shown in Fig. 1, the organic EL display device 50a includes a display panel 40 having a rectangular display area D for displaying an image and a frame area F surrounding the display area D. In the present embodiment, the rectangular display area D is illustrated, but the rectangular shape may also include an approximately rectangular shape having arc-shaped sides, arc-shaped corners, or a notch on one side. In the organic EL display device 50a, a direction X (see Fig. 1) parallel to the substrate surface constituting the display panel 40, a direction Y (see Figs. 3 and 4) perpendicular to the direction X and parallel to the substrate surface, and a direction Z (see Figs. 3 and 4) perpendicular to the direction X and the direction Y are defined.

[0016] In the display region D, a plurality of sub-pixels P are arranged in a matrix as shown in Fig. 2. In the display region D, for example, a sub-pixel P having a red light-emitting region Lr for displaying red, a sub-pixel P having a green light-emitting region Lg for displaying green, and a sub-pixel P having a blue light-emitting region Lb for displaying blue are provided adjacent to each other as shown in Fig. 2. In the display region D, for example, one pixel is composed of three adjacent sub-pixels P having a red light-emitting region Lr, a green light-emitting region Lg, and a blue light-emitting region Lb.

[0017] In the frame region F, a terminal portion T is provided at the lower end in FIG. 1 so as to extend in the lateral direction (direction X) in FIG.

[0018] 1, a flexible substrate 41 (one end thereof) having flexibility is mounted on the terminal portion T. The flexible substrate 41 is a film-like substrate, and is made of, for example, polyimide resin. The flexible substrate 41 is electrically connected to the terminal portion T via a conductive material (not shown). Examples of the conductive material include conductive paste and ACF.

[0019] 1 and 3, an IC chip 11 is mounted on the flexible substrate 41. In other words, the flexible substrate 41 can be said to be a COF (Chip on Film) which means a film-like substrate as a substrate on which the IC chip 11 is mounted (hereinafter, the flexible substrate 41 on which the IC chip 11 is mounted will also be referred to as "COF 41").

[0020] 1 and 3, the FPC 21 is mounted on the COF 41. The FPC 21 is a film-like substrate on which various functional components other than the IC chip 11 are mounted, and is distinguished from the COF 41 on which the IC chip 11 is mounted. In other words, the COF 41 can be said to be a COF (film-like substrate) with FOF (Film on Film) mounting, as a substrate on which the FPC 21 (film-like substrate) is mounted (hereinafter, the COF 41 on which the FPC 21 is mounted is also referred to as the "FOF-mounted COF 41").

[0021] 1 and 3, the IC chip 11 is mounted (electrically connected) to the flexible substrate 41 via the first conductive material 10. Examples of the first conductive material 10 include conductive paste and ACF. Among the first conductive materials 10, ACF is preferable.

[0022] 1 and 3, the FPC 21 is mounted (electrically connected) to the COF 41 via the second conductive material 20. Examples of the second conductive material 20 include conductive paste and ACF. Among the second conductive materials 20, ACF is preferable.

[0023] As shown in Figures 1 and 3, the FPC 21 and the IC chip 11 are disposed adjacent to each other in the direction Y. Specifically, the IC chip 11 and the FPC 21 are disposed in this order from the display area D side toward the terminal section T side. The distance between the IC chip 11 and the FPC 21 is not particularly limited, but is, for example, 4 mm or less. Note that in order to miniaturize the display panel 40 module, the distance is about 1 to 2 mm.

[0024] 1 and 3, a first conductive material 10 and a second conductive material 20 are provided separately as conductive materials for mounting the IC chip 11 and the FPC 21 on the flexible substrate 41. That is, the IC chip 11 and the FPC 21 are mounted on the flexible substrate 41 via separate conductive materials. In other words, no common conductive material is used as the conductive materials for mounting the IC chip 11 and the FPC 21 on the flexible substrate 41.

[0025] 3 to 6, an IC protection tape 44 for protecting the IC chip 11 is provided on the IC chip 11 (the IC protection tape 44 is omitted in FIG. 1). The IC protection tape 44 is provided so as to cover the IC chip 11. The IC protection tape 44 includes a tape main body 42a and a spacer 43.

[0026] The tape body 42a protects the upper surface of the IC chip 11. Therefore, as shown in Figs. 3 to 6, the tape body 42a is provided so as to cover the upper surface of the IC chip 11. The tape body 42a is formed to be approximately the same size (area) as or slightly larger than the IC chip 11. Specifically, as shown in Figs. 3 and 4, the display area D side end (the end opposite to the FPC 21 side end) of the tape body 42a protrudes in the direction Y from the IC chip 11 (its end) and is formed to be larger than the IC chip 11. The tape body 42a is made of, for example, a resin film such as transparent PET (polyethylene terephthalate).

[0027] The tape body 42a is an adhesive tape with its lower surface formed as an adhesive surface. Therefore, a spacer 43 is attached to the lower surface (adhesive surface) of the tape body 42a. In this way, the tape body 42a and the spacer 43 are integrated to form an IC protection tape 44.

[0028] The spacer 43 is a reinforcing material for preventing the IC chip 11 from being broken or damaged due to stress. For this reason, the spacer 43 is provided around the IC chip 11. Specifically, as shown in Figs. 3 to 6, the spacer 43 is provided so as to surround the ends (three sides) of the IC chip 11 other than the end on the FPC 21 side (the end facing the FPC 21). The spacer 43 is formed in a U-shape in plan view. In other words, the spacer 43 has an opening that opens to the FPC 21 side in the Y direction.

[0029] The spacer 43 is made of a resin material with a relatively high hardness, such as a PET film (manufactured by Toray Industries, Inc., type: Lumirror (registered trademark) X30, thickness 0.2 mm). The upper and lower surfaces of the spacer 43 may be formed as adhesive surfaces or may not be adhesive. If the lower surface of the spacer 43 is not an adhesive surface, the lower surface and the upper surface of the FOF-mounted COF 41 do not need to be in close contact with each other. A gap sufficiently smaller than the thickness of the first conductive material 10 may be provided between the lower surface of the spacer 43 and the upper surface of the FOF-mounted COF 41.

[0030] The lengths of the spacer 43 in the X direction and the Y direction are not particularly limited, and may be appropriately determined depending on the size of the IC chip 11. The thickness (width) of the spacer 43 is not particularly limited, and is, for example, 150 μm or more. The height of the spacer 43 (length in the Z direction in FIG. 3) is not particularly limited, and may be appropriately determined depending on the thicknesses of the first conductive material 10 and the IC chip 11 (length in the Z direction in FIG. 3).

[0031] As shown in Figs. 3 and 4, a metal tape 45a for electromagnetically shielding the IC chip 11 is provided on the IC chip 11 to which the IC protective tape 44 is attached (the metal tape 45a is omitted in Fig. 1). Therefore, the metal tape 45a is provided so as to cover at least the upper surface of the IC chip 11. Note that, as shown in Figs. 3 and 4, the metal tape 45a may be provided so as to also cover the upper surface of the FPC 21 on the FOF-mounted COF 41 (the portion that overlaps with the FOF-mounted COF 41 in a plan view). In other words, the metal tape 45a may be provided so as to cover the FOF-mounted COF 41. In this case, the upper surface of the FOF-mounted COF 41 is protected by the metal tape 45a.

[0032] The metal tape 45a is formed by providing a metal foil or the like on a resin film such as transparent PET (polyethylene terephthalate) to form an integrated structure. The metal tape 45a is an adhesive tape with an adhesive surface formed on the lower surface. Therefore, the metal tape 45a is attached to the IC protection tape 44 attached on the IC chip 11 and the FPC 21 as shown in Figs. 3 and 4.

[0033] A back tape (not shown) may be provided on the bottom surface of the FOF-mounted COF 41. In this case, the bottom surface of the FOF-mounted COF 41 is protected by the back tape.

[0034] 1 and 3, in an organic EL display device 50a, a partition member 30a is provided between an IC chip 11 and an FPC 21. When a defect occurs in the FPC 21 mounted on the FOF mounting type COF 41, a process is performed in which the defective FPC 21 is peeled off and a new FPC 21 is remounted (hereinafter, this process is also referred to as an "FOF rework process" since it is a rework process of FOF mounting). In the FOF rework process, it is necessary to remove the residue of the second conductive material 20 (used for crimping and connecting the defective FPC 21) that remains at the site where the defective FPC 21 is peeled off. For this reason, a remover 25, which is a solvent for removing the residue, is applied to the mounting site of the defective FPC 21 to which the residue of the second conductive material 20 is attached. At this time, the partition member 30a functions as a barrier that prevents the remover liquid 25 from contacting and adhering to the IC chip 11 (specifically, the first conductive material 10 used for crimping connection of the IC chip 11) adjacent to the mounting site of the defective FPC 21. In other words, the partition member 30a can be said to be a wall (partition) for preventing the intrusion of the remover liquid in the FOF rework process. The partition member 30a is a partition that separates the first conductive material 10 and the second conductive material 20.

[0035] 3 to 6, the partition member 30a is configured to surround the entire periphery (four sides) of the IC chip 11 together with the spacer 43. Specifically, the partition member 30a is provided to face the opening of the spacer 43 (the end of the IC chip 11 on the FPC 21 side). Therefore, the partition member 30a also functions as a part of a reinforcing material for the IC chip 11 constituted by the spacer 43.

[0036] As shown in FIGS. 3 to 6, the partition member 30a is formed in a tape shape extending in a direction X (see FIG. 1) perpendicular to the direction Y in which the IC chip 11 and the FPC 21 face each other. The tape-shaped partition member 30a is formed of, for example, the same material as the spacer 43. Therefore, the thickness (length in the direction Y in FIGS. 1 and 3) of the tape-shaped partition member 30a is not particularly limited, but is, for example, 150 μm or more. The length in the longitudinal direction (long side in the direction X in FIG. 1) of the tape-shaped partition member 30a is not particularly limited, and may be appropriately determined according to the length in the direction X of the IC chip 11. The length in the lateral direction (short side in the direction Z in FIG. 3) of the tape-shaped partition member 30a is not particularly limited, and may be appropriately determined according to the thickness (length in the direction Z in FIG. 3) of the first conductive material 10 and the IC chip 11, but may be at least equal to or greater than the height of the IC chip 11.

[0037] 3, the partition member 30a is provided on the FOF-mounted COF 41. Specifically, the partition member 30a stands on the upper surface of the FOF-mounted COF 41 so as to be spaced apart from the IC chip 11 and the FPC 21 (the first conductive material 10 and the second conductive material 20 which connect them by pressure bonding). The tape-shaped partition member 30a stands as an upright wall with a bottom surface (lower surface) formed by its longitudinal side and thickness side. Therefore, the lower limit of the distance between the IC chip 11 and the FPC 21 is equal to or greater than the thickness of the partition member 30a.

[0038] The partition member 30a is fixed to the upper surface of the FOF-mounted COF 41. This allows the partition member 30a to maintain an installed state as a standing wall. Examples of methods for fixing the lower surface of the partition member 30a to the upper surface of the FOF-mounted COF 41 include a method in which the lower surface of the partition member 30a is formed as an adhesive surface and the lower surface is attached to the upper surface of the FOF-mounted COF 41 to adhesively fix the two together; a method in which a curable resin (adhesive) that cures when blocked by heat, ultraviolet light, moisture, oxygen, or the like is applied in advance to the lower surface of the partition member 30a or the upper surface of the FOF-mounted COF 41 where the partition member 30a is fixed, and the curable resin is cured to adhesively fix the two together, and the like.

[0039] 3, the partition member 30a is separated from the metal tape 45a. In other words, the partition member 30a is not fixed to the lower surface (adhesive surface) of the metal tape 45a. Note that the partition member 30a and the metal tape 45a may be in contact with each other as long as they are not fixed to each other.

[0040] Variation of the First Embodiment As shown in FIG. 4, the partition member 30a may stand on the upper surface of the FOF mounting type COF 41 so as to be separated from the FPC 21 and in contact with the IC chip 11. Specifically, the partition member 30a may be adhesively fixed to at least a part of one side surface (FPC 21 side) of the IC chip 11. In this case, the side surface of the partition member 30a on the IC chip 11 side is formed as an adhesive surface. The lower surface of the partition member 30a may be formed as an adhesive surface or may not be adhesive. When the lower surface of the partition member 30a is not an adhesive surface, the lower surface and the upper surface of the FOF mounting type COF 41 may not be in close contact with each other. Between the lower surface of the partition member 30a and the upper surface of the FOF mounting type COF 41, a gap sufficiently smaller than the thickness of the first conductive material 10 may be formed. Even in this case, the peeling liquid 25 is a relatively viscous solution or paste, so that it can be prevented from entering the IC chip 11 side through the gap.

[0041] The modified example of the organic EL display device 50a, ie, the configuration in which the side surface of the partition member 30a on the IC chip 11 side is formed as an adhesive surface, can also be applied to the embodiments described later.

[0042] The organic EL display device 50a configured as described above includes an IC chip 11 and an FPC 21 adjacent to each other, and a partition member 30a disposed between the IC chip 11 and the FPC 21. The partition member 30a is provided as a partition that separates a first conductive material 10 and a second conductive material 20 for mounting the IC chip 11 and the FPC 21, respectively. In the organic EL display device 50a, the IC chip 11, the FPC 21, and the partition member 30a are mounted on a flexible substrate 41 connected to a terminal portion T in a frame region F of the display panel 40.

[0043] Next, a method for manufacturing the organic EL display device 50a of the present embodiment and its modified example will be described. The manufacturing method of the organic EL display device 50a includes an IC protection tape attaching step. Further, the manufacturing method of the organic EL display device 50a includes a COF bonding step and an FPC mounting step before the IC protection tape attaching step.

[0044] <COF Bonding Step> A flexible substrate 41 (COF 41) on which an IC chip 11 is mounted via a first conductive material 10 is mounted on the terminal portion T of the display panel 40. Specifically, the COF 41 is thermocompression bonded and mounted on the terminal portion T via a conductive material different from (another) the first conductive material 10 and the second conductive material 20.

[0045] <FPC Mounting Step> An FPC 21 is thermocompression bonded to the COF 41 via a second conductive material 20 to perform FOF mounting. Thereby, an FOF-mounted COF 41 is formed. That is, the FPC mounting step can also be said to be an FOF mounting step of mounting the FPC 21 on the COF 41.

[0046] <IC Protection Tape Attaching Step> An IC protection tape 44 is attached on the IC chip 11. Specifically, for example, using a jig, a tape main body 42a constituting the IC protection tape 44 is attached to the upper surface of the IC chip 11 so that a spacer 43 constituting the IC protection tape 44 surrounds three sides excluding the end portion on the FPC 21 side of the IC chip 11.

[0047] Subsequently, as shown in FIG. 5, a partition member 30a is provided between the IC chip 11 and the FPC 21. Specifically, the lower surface of the partition member 30a is attached (adhesively fixed) or adhesively fixed so that a tape-shaped partition member 30a stands upright on the FOF-mounted COF 41 between the first conductive material 10 and the second conductive material 20. Due to the close contact between the partition member 30a and the FOF-mounted COF 41, the first conductive material 10 and the second conductive material 20 are partitioned. Thus, in the manufacturing method of the organic EL display device 50a, the partition member 30a is formed in the IC protection tape attaching step.

[0048] <Other processes> The method for manufacturing the organic EL display device 50a may include other steps, such as a metal tape application step, a back surface tape application step, and a rework step, as required.

[0049] [Metal tape application process] The metal tape application process is performed after the IC protection tape application process. In the metal tape application process, a metal tape 45a is applied onto the FOF mounting type COF 41 to which the IC protection tape 44 has been applied. Specifically, for example, a jig is used to apply the metal tape 45a to the IC protection tape 44 (specifically, the tape main body 42a constituting the IC protection tape 44) applied onto the IC chip 11 and to the FPC 21. As a result, the IC chip 11 is covered with the metal tape 45a via the IC protection tape 44, and is electromagnetically shielded.

[0050] [Backside tape application process] When the organic EL display device 50a has a back surface tape, a back surface tape attachment step may be performed. In the back surface tape attachment step, the back surface tape is attached to the back surface of the FOF mounting type COF 41, which is opposite to the surface (front surface) to which the metal tape 45a is attached, using, for example, a jig. The back surface tape attachment step may be performed before or after the IC protection tape attachment step, or before or after the metal tape attachment step.

[0051] [Rework process] When a defect occurs in the FPC 21 mounted in the FPC mounting process, a rework process is performed. The rework process is a process in which the defective FPC 21 is peeled off from the FOF mounting type COF 41 and a new FPC 21 is remounted on the COF 41. In other words, the rework process is a FOF rework process in which the FOF mounting is reworked.

[0052] The FOF rework process includes a metal tape peeling process, an FPC peeling process, a peeling solution application process, a second conductive material removal process, and an FPC remounting process. If the manufacturing method for the organic EL display device 50a includes a back surface tape attachment process, the FOF rework process may include a back surface tape peeling process. In addition, since the IC protection tape 44 does not particularly interfere with workability in the FOF rework process, a process of peeling off the IC protection tape 44 is not necessary.

[0053] (Metal tape peeling process) The metal tape 45a attached in the metal tape attachment process is peeled off from the IC protection tape 44 and the FPC 21. The partition member 30a is adhesively or bonded to the FOF mounting type COF 41, but is not adhesively fixed to the metal tape 45a. Therefore, when the metal tape 45a is peeled off, the partition member 30a is unlikely to peel off from the FOF mounting type COF 41.

[0054] In the metal tape peeling step, care is taken to prevent the IC protection tape 44 from peeling off from the IC chip 11. If the IC protection tape 44 peels off from the IC chip 11, the IC protection tape attachment step can be carried out again after the FOF rework step.

[0055] (Backside tape peeling process) If the back surface tape attachment step has been performed, the back surface tape is peeled off from the FOF mounting type COF 41 .

[0056] (FPC peeling process) The defective FPC 21 is peeled off from the FOF mounting type COF 41. Specifically, the defective FPC 21 is peeled off while the portion of the FOF mounting type COF 41 where the defective FPC 21 is mounted is heated.

[0057] (Removal solution application process) A remover 25 is applied to the area of ​​the COF 41 where the defective FPC 21 was mounted. Specifically, the remover 25 is applied so as to cover the residue of the second conductive material 20 remaining in the area of ​​the defective FPC 21. A commercially available product that is generally used can be used as the remover 25. For example, an example of the remover 25 (repair liquid) for ACF is Model: RP-04 manufactured by Hitachi Chemical Co., Ltd.

[0058] 6, when the remover 25 is applied (specifically, in a series of rework steps), the partition member 30a is present on the COF 41. The partition member 30a functions as a wall that prevents the remover 25 from penetrating into the IC chip 11. The partition member 30a makes it difficult for the remover 25 to come into contact with and adhere to the IC chip 11 or the first conductive material 10 during the remover application step.

[0059] (Second conductive material removal process) A predetermined time after the application of the remover liquid, the residue of the second conductive material 20 adhering to the mounting site of the defective FPC 21 is removed by rubbing with, for example, a cotton swab or a spatula. Specifically, the residue of the second conductive material 20 that has swelled and floated due to the remover liquid 25 and the remover liquid 25 are wiped off and cleaned. The partition member 30a makes it difficult for the remover liquid 25 to come into contact with and adhere to the IC chip 11 or the first conductive material 10 during the second conductive material removal process.

[0060] (FPC re-mounting process) A process similar to the FPC mounting process is carried out using a new FPC 21. Specifically, the new FPC 21 is thermocompression bonded to the site of the defective FPC 21 mounting portion on the COF 41 via a new second conductive material 20, thereby remounting the FOF.

[0061] After the series of rework steps described above, a metal tape attachment step, a back surface tape attachment step, etc. are performed as necessary. In this manner, the organic EL display device 50a of the present embodiment can be manufactured.

[0062] <Effects> As described above, the organic EL display device 50a (including the modified examples) according to this embodiment and the manufacturing method thereof can provide the following advantages.

[0063] In the organic EL display device 50a, a partition member 30a is provided between the IC chip 11 mounted via the first conductive material 10 and the FPC 21 mounted via the second conductive material 20, separating the first conductive material 10 and the second conductive material 20. The partition member 30a functions as a wall (partition) that prevents a remover 25 for removing residues of the second conductive material 20 from contacting the IC chip 11 or the first conductive material 10 when the FPC 21 is peeled off and remounted. Due to the partition member 30a, even in a display panel structure in which the IC chip 11 and the FPC 21 are disposed adjacent to each other and are relatively close to each other, the mounting portion of the IC chip 11 is unlikely to be corroded by the remover 25, and therefore the occurrence of poor connection of the IC chip 11 due to contact with the remover 25 can be suppressed.

[0064] In the method for producing the organic EL display device 50a, the partition members 30a can be formed in the IC protection tape attachment step that is conventionally included, and therefore the organic EL display device 50a can be easily produced.

[0065] Furthermore, in the manufacturing method of the organic EL display device 50a, when the remover 25 is applied to the defective FPC 21 mounting portion trace in the rework process (removal liquid application process), the partition member 30a is present on the FOF-mounted COF 41. Therefore, in the remover liquid application process and the subsequent second conductive material removal process, work such as applying the remover liquid and removing residues can be performed without worrying about the remover liquid 25 coming into contact with the mounting portion of the IC chip 11. In other words, the workability of the rework process can be improved.

[0066] According to the organic EL display device 50a and the manufacturing method thereof, rework can be reliably performed regardless of the structure of the module, and therefore the reliability (quality) of the display device can be improved.

[0067] Second Embodiment Next, a second embodiment of the present invention will be described. Figures 7 and 8 show a second embodiment of the display device according to the present invention. Figure 7 is a cross-sectional view showing a terminal portion T of an organic EL display device 50b of this embodiment, and corresponds to Figure 3. Figure 8 is a perspective view for explaining a process of installing a partition member 30b constituting the organic EL display device 50b, and corresponds to Figure 5.

[0068] The overall configuration of the organic EL display device 50b is the same as that of the first embodiment except for the configuration of the terminal portion T, and therefore a detailed description thereof will be omitted here. Also, components similar to those of the first embodiment are denoted by the same reference numerals and descriptions thereof will be omitted.

[0069] 7 and 8, the organic EL display device 50b includes a partition member 30b instead of the partition member 30a constituting the organic EL display device 50a of the first embodiment. Also, the configuration of the IC protection tape 44 is different from that of the organic EL display device 50a.

[0070] In the organic EL display device 50b, as shown in Fig. 8, a tape body 42a constituting an IC protection tape 44 is provided with a protruding portion 42b protruding in a direction Y (towards the FPC 21) from its end on the FPC 21 side. Between the protruding portion 42b and the tape body 42a, a folding axis is formed along a direction X (see Fig. 1) perpendicular to the direction Y in which the IC chip 11 and the FPC 21 face each other. Specifically, a cut (slit) 42c that makes folding easy is formed along the folding axis. With the above configuration, the protruding portion 42b can be folded at 90° (a right angle) with respect to the tape body 42a.

[0071] The protruding portion 42b is then bent 90° along the cut 42c in the direction of the arrow shown in Fig. 8 to form the partition member 30b as shown in Fig. 7. Therefore, the partition member 30b is formed, for example, from the same material as the tape main body 42a.

[0072] The partition member 30b may have its lower surface formed as an adhesive surface and be adhesively fixed to the FOF-mounted COF 41, or may be adhesively fixed to the FOF-mounted COF 41 by the same method as described above. Further, a modified example of the organic EL display device 50a may be applied to the organic EL display device 50b. That is, the side surface of the partition member 30b on the side of the IC chip 11 may be formed as an adhesive surface.

[0073] The organic EL display device 50b of the present embodiment can be manufactured by changing the IC protection tape attachment step in the manufacturing method of the organic EL display device 50a of the first embodiment as follows.

[0074] <IC protection tape attachment step> In the IC protection tape attachment step, after attaching the IC protection tape 44 onto the IC chip 11, instead of separately providing the partition member 30b, the protruding portion 42b is bent 90° along the cut 42c in the direction of the arrow shown in FIG. 8. In this way, the partition member 30b is formed only by bending the protruding portion 42b. Therefore, for example, the IC protection tape 44 may be attached so that the cut 42c (axis of bending) is along the end portion (side) of the IC chip 11 on the FPC 21 side.

[0075] <Effect> As described above, according to the organic EL display device 50b according to the present embodiment, the same effects as described above can be obtained. Further, in the organic EL display device 50b, in addition to the above effects, the following effects can be obtained.

[0076] In the organic EL display device 50b, since the partition member 30b is formed by the protruding portion 42b constituting the IC protection tape 44, it is not necessary to separately provide the partition member 30b. That is, the number of components can be reduced.

[0077] In the manufacturing method of the organic EL display device 50b, in the IC protection tape attachment step, the partition member 30b is formed simply by bending the protruding portion 42b relative to the tape body 42a. In other words, compared to the case where the IC protection tape 44 and the partition member 30a are attached separately, the attachment step is performed only once for the IC protection tape 44, which improves the attachment workability in the IC protection tape attachment step. Furthermore, even compared to the case where the partition member 30a is adhesively fixed, the step is unnecessary, so the same effect can be obtained.

[0078] Third embodiment Next, a third embodiment of the present invention will be described. Figs. 9 to 11 show a third embodiment of the display device according to the present invention. Fig. 9 is a cross-sectional view showing a terminal portion of an organic EL display device 50c of this embodiment, and corresponds to Fig. 3. Fig. 10 is a perspective view for explaining a process of installing a partition member 30c constituting the organic EL display device 50c of this embodiment, and corresponds to Fig. 5. Fig. 11 is a perspective view for explaining a rework process of peeling off and remounting the FPC 21 constituting the organic EL display device 50c of this embodiment, and corresponds to Fig. 6.

[0079] The overall configuration of the organic EL display device 50c is the same as that of the first embodiment except for the configuration of the terminal portion T, and therefore a detailed description thereof will be omitted here. Also, the same components as those in the first embodiment are denoted by the same reference numerals and descriptions thereof will be omitted.

[0080] 9 to 11, the organic EL display device 50c includes a partition member 30c instead of the partition member 30a constituting the organic EL display device 50a of the first embodiment. The organic EL display device 50c also includes a metal tape 45b.

[0081] In the organic EL display device 50c, as shown in Fig. 9, a partition member 30c is provided (fixed) on the lower surface of a metal tape 45a. Specifically, the partition member 30c is formed integrally with the metal tape 45a. As a result, the partition member 30c and the metal tape 45a are integrated to form a metal tape 45b. The partition member 30c is formed of the same material as the spacer 43 constituting the IC protection tape 44, for example.

[0082] The lower surface of the metal tape 45a is formed as an adhesive surface. As a result, the upper surface of the partition member 30c is adhesively fixed to the lower surface of the metal tape 45a. Since the lower surface of the metal tape 45a has adhesive properties, the upper surface of the partition member 30c does not have to have adhesive properties, but may be formed as an adhesive surface.

[0083] The partition member 30c may have its lower surface formed as an adhesive surface and be adhesively fixed to the FOF-mounted COF 41, or may be adhesively fixed to the FOF-mounted COF 41 by the same method as above. A modified example of the organic EL display device 50a may be applied to the organic EL display device 50c. That is, the side surface of the partition member 30c on the IC chip 11 side may be formed as an adhesive surface.

[0084] Here, the tackiness of the lower surface of the partition member 30c (the tackiness between the partition member 30c and the FOF mounting type COF 41) is higher than the tackiness of the upper surface (the tackiness between the partition member 30c and the metal tape 45a). Specifically, the adhesive force (tackiness) between the lower surface of the partition member 30c and the upper surface of the FOF mounting type COF 41 is stronger than the tackiness between the upper surface of the partition member 30c and the lower surface of the metal tape 45a. As a method for providing a difference in tackiness in this way, for example, a method of providing an adhesive surface having a stronger tackiness than the tackiness of the lower surface (adhesive surface) of the metal tape 45a on the lower surface of the partition member 30c; a method of applying a curable resin having a stronger tackiness than the tackiness of the lower surface of the metal tape 45a to the lower surface of the partition member 30c or the upper surface of the FOF mounting type COF 41 where the partition member 30a is fixed, and the like can be mentioned.

[0085] The organic EL display device 50c of the present embodiment can be manufactured by changing the IC protection tape attachment step and the metal tape attachment step in the manufacturing method of the organic EL display device 50a of the first embodiment as follows. Specifically, the manufacturing method of the organic EL display device 50c can be manufactured only by the same steps as the manufacturing method of the conventional organic EL display device not provided with the partition member 30c.

[0086] <IC protection tape attachment step> In the manufacturing method of the organic EL display device 50c, the partition member 30c is not formed in the IC protection tape attachment step. Specifically, it is only necessary to attach the IC protection tape 44 to the upper surface of the IC chip 11. That is, the operation of attaching (adhesively fixing) or adhesively fixing the partition member 30a onto the FOF-mounted COF 41 and the operation of bending the protruding portion 42b are unnecessary.

[0087] 〔Metal tape attachment step〕 As shown in FIG. 10, in the metal tape attachment step, a metal tape 45b in which the partition member 30c and the metal tape 45a are integrally formed is attached onto the FOF-mounted COF 41 using, for example, a jig so that the partition member 30c is disposed between the IC chip 11 and the FPC 21. By attaching the metal tape 45b, the partition member 30c is formed. Thus, in the manufacturing method of the organic EL display device 50c, the partition member 30c is formed in the metal tape attachment step instead of the IC protection tape attachment step.

[0088] 〔Rework step〕 In the manufacturing method of the organic EL display device 50c, the procedure of each step in the rework step is the same as that of the manufacturing method of the organic EL display device 50a.

[0089] (Metal tape peeling step) 11, in the metal tape peeling step in the rework process, the metal tape 45a constituting the metal tape 45b is peeled off from the IC protective tape 44 and the FPC 21. At this time, by utilizing the difference in tackiness between the upper and lower surfaces of the bulkhead member 30c constituting the metal tape 45b, the bulkhead member 30c is peeled off from the metal tape 45a and remains on the FOF mounting type COF 41. Specifically, since the adhesive force between the lower surface of the bulkhead member 30c and the FOF mounting type COF 41 is stronger than the adhesive force between the upper surface of the bulkhead member 30c and the metal tape 45a, it is possible to peel off only the metal tape 45a from the bulkhead member 30c while the bulkhead member 30c remains adhesively or bonded to the FOF mounting type COF 41. As described above, in the manufacturing method of the organic EL display device 50c, after the metal tape 45a is peeled off from the FOF-mounted COF 41 in a series of rework steps, the partition member 30c peeled off and separated from the metal tape 45a is present on the FOF-mounted COF 41. The organic EL display device 50c is configured such that the partition member 30c is formed by peeling off the metal tape 45a.

[0090] <Effects> As described above, the organic EL display device 50c according to this embodiment can provide the same effects as those described above. In addition to the effects described above, the organic EL display device 50c can provide the following effects.

[0091] In the organic EL display device 50c, since the partition members 30c are formed integrally with the metal tape 45a, there is no need to provide the partition members 30c separately, which means that the number of parts can be reduced.

[0092] In the method for manufacturing the organic EL display device 50c, a conventional metal tape attachment process is performed using the metal tape 45b in which the partition member 30c and the metal tape 45a are integrally formed. In other words, the organic EL display device 50c can be manufactured using only the same processes as those in the conventional organic EL display device not provided with the partition member 30c, including the IC protection tape attachment process, and therefore the workability can be further improved.

[0093] Fourth embodiment Next, a fourth embodiment of the present invention will be described. Fig. 12 shows a fourth embodiment of the display device according to the present invention. Fig. 12 is a plan view showing a schematic configuration of an organic EL display device 50d of this embodiment, and corresponds to Fig. 1.

[0094] The overall configuration of the organic EL display device 50d is the same as that of the first embodiment except for the configuration of the terminal portion T, and therefore a detailed description thereof will be omitted here. Also, components similar to those of the first embodiment will be denoted by the same reference numerals and descriptions thereof will be omitted.

[0095] In the organic EL display device 50a of the first embodiment, the IC chip 11 and the FPC 21 are mounted via a flexible substrate 41 connected to the display panel 40 (terminal portion T in the frame region F), whereas in the organic EL display device 50d of the present embodiment, the IC chip 11 and the FPC 21 are directly mounted on the display panel 40 (terminal portion T in the frame region F) as shown in Fig. 12. Therefore, in the organic EL display device 50d, the partition member 30a is also directly mounted on the display panel 40. In other words, the organic EL display device 50d does not include a flexible substrate 41.

[0096] The organic EL display device 50d may have any of the modified examples of the organic EL display device 50a, the organic EL display device 50b, and the organic EL display device 50c. In other words, the organic EL display device 50d may include the partition member 30b or the partition member 30c instead of the partition member 30a.

[0097] The organic EL display device 50d of this embodiment can be manufactured by replacing the flexible substrate 41 (COF 41) with the display panel 40 (the terminal portion T in the frame area F) in each step of the manufacturing method for the organic EL display device 50a of the first embodiment. In addition, the manufacturing method for the organic EL display device 50d includes an IC chip mounting step prior to the FPC mounting step.

[0098] [IC chip mounting process] In the IC chip mounting process, the IC chip 11 is thermocompression bonded and mounted on the terminal portion T of the display panel 40 via the first conductive material 10. That is to say, the IC chip mounting process can also be said to be a COP forming process for forming a COP (Chip on Plastic) in which the IC chip 11 is directly mounted on the display panel 40.

[0099] <FPC Mounting Process> The FPC 21 is thermocompression bonded and mounted on the display panel 40 (COP) on which the IC chip 11 is mounted via the second conductive material 20.

[0100] <Effect> As described above, according to the organic EL display device 50d according to the present embodiment, the same effects as described above can be obtained.

[0101] 《Other Embodiments》 In each of the above embodiments, an organic EL display device has been described as an example of the display device. However, the present invention can be applied to a display device including a plurality of light-emitting elements driven by current. For example, it can be applied to a display device including a QLED (Quantum-dot light emitting diode) which is a light-emitting element using a quantum dot-containing layer.

Industrial Applicability

[0102] As described above, the present invention is useful for flexible display devices.

Explanation of Reference Numerals

[0103] D Display area F Frame area T Terminal portion 10 First conductive material 11 IC chip 20 Second conductive material 21 FPC 25 Release liquid 30a, 30b, 30c Partition member 40 Electronic component 41 Flexible substrate (COF) 42a Tape body 42b Protrusion 43 Spacer 44 IC protection tape 45a, 45b Metal tape 50a,50b,50c,50d Organic EL display device

Claims

1. an IC chip mounted via a first conductive material; and an FPC mounted via a second conductive material, the IC chip and the FPC are disposed adjacent to each other, A display device comprising: a partition member provided between the IC chip and the FPC, the partition member separating the first conductive material from the second conductive material and isolating the IC chip from the FPC.

2. 2. The display device according to claim 1, The display device according to claim 1, wherein the partition member is fixed to a substrate on which the IC chip and the FPC are mounted.

3. 3. The display device according to claim 1, The display device according to claim 1, wherein the partition member is formed in a tape shape extending in a direction perpendicular to a direction in which the IC chip and the FPC face each other.

4. The display device according to any one of claims 1 to 3, an IC protection tape provided so as to cover the IC chip; the IC protection tape is provided with a spacer surrounding an end of the IC chip other than an end facing the FPC, The display device is characterized in that the partition members are made of the same material as the spacers.

5. The display device according to any one of claims 1 to 3, an IC protection tape provided so as to cover the IC chip; the IC protection tape is provided with a bent portion that is bent about a bending axis in a direction perpendicular to a direction in which the IC chip and the FPC face each other, The display device, wherein the partition member is made of the bent portion.

6. 6. The display device according to claim 5, The display device is characterized in that the IC protection tape has a cut formed along the axis of the folding.

7. The display device according to any one of claims 1 to 3, an IC protection tape provided to cover the IC chip; a metal tape provided on the IC protection tape so as to cover the IC chip; The display device is characterized in that the partition member is fixed to a lower surface of the metal tape.

8. The display device according to claim 7, The lower surface of the metal tape is formed as an adhesive surface, The display device is characterized in that the upper surface of the partition member is adhesively fixed to the lower surface of the metal tape.

9. 9. The display device according to claim 8, The display device is characterized in that the tackiness between the partition member and a substrate on which the IC chip and the FPC are mounted is higher than the tackiness between the partition member and the metal tape.

10. The display device according to any one of claims 7 to 9, the IC protection tape is provided with a spacer surrounding an end of the IC chip other than an end facing the FPC, The display device is characterized in that the partition members are made of the same material as the spacers.

11. The display device according to any one of claims 1 to 10, A display device characterized in that the distance between the IC chip and the FPC is 4 mm or less.

12. The display device according to claim 11, The display device according to claim 1, wherein the thickness of the partition member in the direction in which the IC chip and the FPC face each other is 150 μm or more.

13. The display device according to any one of claims 1 to 12, The display device according to claim 1, wherein the side surface of the partition member facing the IC chip is formed as an adhesive surface.

14. The display device according to any one of claims 1 to 13, A display panel having a display area and a frame area provided around the display area; a flexible substrate connected to one end of the frame area of ​​the display panel, The display device further comprises the IC chip and the FPC mounted on the flexible substrate.

15. The display device according to any one of claims 1 to 13, A display panel having a display area and a frame area provided around the display area, a display device comprising: the display panel; and a display unit including: a display panel; a display panel including a display panel;

16. an IC chip mounted via a first conductive material; an FPC mounted adjacent to the IC chip via a second conductive material; a partition member provided between the IC chip and the FPC to separate the first conductive material and the second conductive material; and an IC protective tape provided to cover the IC chip, an IC protection tape application step of applying the IC protection tape onto the IC chip; A manufacturing method of a display device, wherein the partition member is formed in the IC protection tape attaching step.

17. The method for manufacturing a display device according to claim 16, the IC protection tape is provided with a protruding portion protruding from the FPC side end portion, A method for manufacturing a display device, characterized in that in the IC protective tape attachment process, the partition member is formed by bending the protrusion along a bending axis that is perpendicular to the direction in which the IC chip and the FPC face each other.

18. The method for manufacturing a display device according to claim 16 or 17, a rework process for removing the defective FPC and remounting a new FPC when a defect occurs in the FPC; The method for manufacturing a display device, wherein the partition member is present in the rework step.

19. an IC chip mounted via a first conductive material; an FPC mounted adjacent to the IC chip via a second conductive material; a partition member provided between the IC chip and the FPC to separate the first conductive material and the second conductive material; an IC protection tape provided to cover the IC chip; a metal tape provided on the IC protection tape so as to cover the IC chip; A manufacturing method of a display device in which the partition member is fixed to a lower surface of the metal tape, comprising the steps of: an IC protection tape attachment step of attaching the IC protection tape onto the IC chip; a metal tape application step of applying the metal tape onto the IC chip to which the IC protection tape has been applied, The method for manufacturing a display device, wherein in the metal tape attaching step, the partition member is formed by attaching the metal tape.

20. 20. The method for manufacturing a display device according to claim 19, a rework process for removing the defective FPC and remounting a new FPC when a defect occurs in the FPC; The rework step includes a metal tape peeling step of peeling off the metal tape, The method for manufacturing a display device, wherein, in the metal tape peeling step, after the metal tape is peeled off, the partition member is peeled off from the metal tape and remains.

21. A method for manufacturing a display device according to any one of claims 16 to 20, The display device includes: A display panel having a display area and a frame area provided around the display area; a flexible substrate connected to one end of the frame area of ​​the display panel, the IC chip and the FPC are mounted on the flexible substrate, Before the IC protection tape attachment step, A method for manufacturing a display device, comprising the steps of: mounting the FPC on the flexible substrate on which the IC chip is mounted via the first conductive material by thermocompression bonding via the second conductive material.

22. A method for manufacturing a display device according to any one of claims 16 to 20, The display device includes: A display panel having a display area and a frame area provided around the display area, the IC chip and the FPC are mounted on one end of the frame region of the display panel, Before the IC protection tape attachment step, an IC chip mounting step of mounting the IC chip on the display panel by thermocompression bonding via the first conductive material; a FPC mounting step of thermocompression bonding the FPC to the display panel on which the IC chip is mounted, via the second conductive material.

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