Heat dissipation parts and vehicles

Abstract

An embodiment of the present application provides a heat dissipation component including a first heat conduction component and a first fixing plate. The first fixing plate is fixedly connected to a PCB substrate, and a first heat-generating device is provided on a side of the PCB substrate. The first fixing plate is positioned on the side of the first heat-generating device facing away from the PCB substrate. A first through-hole is provided in the first fixing plate, and the first heat-conducting component passes through the first through-hole, and the side of the first heat-conducting component is bonded to the first heat-generating device. The computing device provided in the present application may be applied to autonomous vehicles, intelligent vehicles, connected vehicles, and new energy vehicles. In the present application, the first heat-generating device is bonded to the first heat-conducting component, and the first heat-conducting component can remove heat from the first heat-generating device. In this application, the size of the heat dissipation component is reduced while maintaining heat dissipation performance.

Description

[Technical field]

[0001] The present application relates to the field of hardware structure technology, in particular to heat dissipation components and vehicles. [Background technology]

[0002] Autonomous driving is gradually becoming a new market, and one of the key components is the artificial intelligence (AI) control chip for autonomous driving and the PCB board of the AI ​​control chip. As the required computing power increases, the capacity of advanced driver assistance system (ADAS) or mobile data center (MDC) becomes higher and higher. Air cooling cannot solve the heat dissipation problem, so liquid cooling technology is required.

[0003] The existing heat dissipation components include a cooling plate with bosses, thermal grease, a printed circuit board (PCB) and a heat generating device (such as a chip). The heat generating device is on the PCB board, and thermal conduction is carried out between the surface of the heat generating device and the cooling plate through the thermal grease. However, due to the large filling thickness of the thermal grease, a large temperature rise occurs. Summary of the Invention [Means for solving the problem]

[0004] According to a first aspect, the present application provides a heat dissipation component including a first heat conducting component and a first fixing plate. The first fixing plate is fixedly connected to a PCB substrate, and a first heat generating device is provided on a side of the PCB substrate. The first fixing plate is positioned on a side of the first heat generating device facing away from the PCB substrate. The first fixing plate is provided with a first through hole, the first heat conducting component passes through the first through hole, and the side of the first heat conducting component is bonded to the first heat generating device. The first fixing plate may be a flat metal plate made of a material such as aluminum or an aluminum alloy, and the first fixing plate and the PCB substrate may be fixed at an angle parallel or nearly parallel. The PCB substrate may be a main board or a PCB substrate having another function with one or more heat generating devices. The heat generating device may be a device such as a SOC chip, a local area network switch LAN-SW, or a microcontroller unit (MCU). The first heat generating device is one of one or more heat generating devices arranged on the PCB board. The PCB board may have two sides, and heat generating devices may be arranged on both sides. The first fixing plate is positioned on the side of the first heat generating device facing away from the PCB board, so that the first heat generating device is arranged on the side of the PCB board facing the first fixing plate. Optionally, a high-power heat generating device may be arranged on one of the two sides of the PCB board, and a low-power heat generating device may be arranged on the other side, and the first heat generating device may be arranged on the side of the PCB board on which the high-power heat generating device is arranged, and the first heat generating device may be a high-power heat generating chip. The first fixing plate is provided with a first through hole, the first heat conducting part passes through the first through hole, and the side of the first heat conducting part is bonded to the first heat generating device. The side of the first heat conducting part may be bonded to the first heat generating device by direct contact, or may be bonded to the first heat generating device by indirect contact by soaking it with silicone grease.

[0005] In this embodiment of the present application, the first heat generating device is bonded to the first heat conducting part, and the first heat conducting part can take away heat from the first heat generating device. In terms of the size of the heat conducting part, since the first heat conducting part passes through the through hole of the first fixing part, the size of the first heat conducting part can be adapted to the size of the through hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat conducting part of this embodiment are small. Also, in terms of thickness, since the first heat conducting part passes through the through hole of the first fixing part, the thickness of the heat dissipation part of this embodiment is thinner than that of the fixing plate and the liquid cooling plate arranged separately.

[0006] In a possible implementation, a second heat generating device is further provided on a side surface of the PCB substrate, and the heat dissipation component further includes a second heat conducting component and a flexible connector. The first heat conducting component and the second heat conducting component are connected via the flexible connector. The first fixing plate further includes a second through hole, the second heat conducting component passes through the second through hole, and the side surface of the second heat conducting component is bonded to the second heat generating device.

[0007] The first heat transfer component and the second heat transfer component are connected via a flexible connector to form a whole, and the flexible conduit allows the first heat transfer component and the second heat transfer component to rise or fall a certain distance along a direction perpendicular to the plane of the first fixing plate. In some scenarios, the first heat transfer device and the second heat transfer device are not on the same plane, and in addition, the first heat transfer component and the second heat transfer component can rise or fall a certain distance along a direction perpendicular to the plane of the first fixing plate, so that the first heat transfer component and the second heat transfer component can be sufficiently closely bonded to the corresponding heat transfer device.

[0008] In a possible implementation, the first heat conducting component is a water block, or the first heat conducting component may be another component having heat conducting capabilities, such as a liquid cooling plate.

[0009] In a possible implementation, the heat dissipation component further includes a heat conduction tube. The heat conduction tube is connected to the first heat conduction component, and a groove is provided on the side of the first fixing plate facing the PCB board, and the heat conduction tube is bonded to the inner wall of the groove. It is determined whether the power of the device that needs to dissipate heat on the PCB board is too high to solve the heat dissipation by natural heat dissipation, and if the power of the device that needs to dissipate heat on the PCB board is very high, the heat conduction tube may be bonded to the inner wall of the groove on the first fixing plate, so that the heat generated by the device that needs to dissipate heat on the PCB board is transferred to the fixing plate.

[0010] In a possible implementation, the heat transfer tube is a metal tube. The heat transfer tube may also be a rigid tube, such as a plastic tube, which has better heat transfer properties.

[0011] In a possible implementation, a third heat generating device is further provided on a side of the PCB substrate, a boss is disposed on the side of the first fixing plate facing the PCB substrate, and the side of the third heat generating device facing the first fixing plate is adhered to the boss.

[0012] In a possible implementation, the first heat conducting part is connected to the PCB board in a floating manner, and the side of the first heat conducting part is bonded to the first heat generating device. The heat conducting part may be installed to fit the first fixed plate, in which case the first heat conducting part passes directly through the first through hole of the first fixed plate, and the spring screw and the board bracket can be fastened and locked to the first heat generating device (the board bracket may be disposed on the bottom housing, but is not limited thereto), so that the first heat conducting part can be connected to the PCB board in a floating manner, and further, the first heat conducting part can be bonded to the first heat generating device.

[0013] In a possible implementation, the dissipation component further includes a sealing cover. The sealing cover is fastened to the side of the first fixing plate facing away from the PCB substrate to seal the first through-hole. In this embodiment of the present application, in order to seal the through-hole provided in the first fixing plate, the sealing cover can be fastened to the side of the first fixing plate facing away from the PCB substrate to seal the first through-hole. Specifically, the sealing cover may be provided on the first fixing plate. The sealing cover may be locked to a local area in the vicinity of the heat conducting component (the first heat conducting component or the second heat conducting component), the sealing cover may be locked to a local area in the vicinity of the heat conducting component (the first heat conducting component and the second heat conducting component), or the sealing cover may be locked to the outer edge of the entire first fixing plate, and all joints are fastened via sealing rings and screws to meet the airtight requirements.

[0014] According to a second aspect, the present application provides a method for installing an in-vehicle computing device, the method comprising: fixedly connecting a side of a first fixing plate to a PCB substrate, the side of the PCB substrate being provided with a first heat generating device, the first fixing plate being positioned on a side of the first heat generating device facing away from the PCB substrate, the first fixing plate being provided with a first through hole; allowing a first heat conducting component to pass through the first through hole and allowing a side of the first heat conducting component to be attached to the first heat generating device; and fastening a sealing cover to a side of the first fixing plate facing away from the PCB substrate to seal the first through hole.

[0015] According to a third aspect, the present application provides a vehicle including a vehicle body and a heat dissipation component according to any one of the possible implementations of the first aspect provided in the vehicle body.

[0016] In this application, the designs of the above-mentioned aspects can be further combined to provide more designs.

[0017] An embodiment of the present application provides a heat dissipation component, including a first heat conducting component and a first fixing plate. The first fixing plate is fixedly connected to a PCB board, and a first heat generating device is provided on a side of the PCB board. The first fixing plate is positioned on a side of the first heat generating device facing away from the PCB board. The first fixing plate is provided with a first through hole, the first heat conducting component passes through the first through hole, and the side of the first heat conducting component is bonded to the first heat generating device. In this embodiment of the present application, the first heat generating device is bonded to the first heat conducting component, and the first heat conducting component can take heat away from the first heat generating device. In terms of the size of the heat conducting component, since the first heat conducting component passes through the through hole of the first fixing part, the size of the first heat conducting component may be adapted to the size of the through hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat conducting component of this embodiment are small. In terms of thickness, since the first heat conduction component passes through the through hole of the first fixing portion, the thickness of the heat dissipation component of this embodiment is thinner than when the fixing plate and the liquid cooling plate are arranged separately. [Brief description of the drawings]

[0018] [Figure 1a] 1 is a schematic diagram of a vehicle structure according to an embodiment of the present application; [Figure 1b] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Diagram 2] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Diagram 3] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 4] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Diagram 5] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 6] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 7] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 8]1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 9] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 10] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; [Figure 11] 1 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, the embodiments of the present invention will be described with reference to the drawings in the embodiments of the present invention. The terms used in the implementation form of the present invention are merely used to describe specific embodiments of the present invention, and are not intended to limit the present invention.

[0020] The following describes embodiments of the present application with reference to the accompanying drawings. Those skilled in the art can see that with the evolution of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application can also be applied to similar technical problems.

[0021] In the specification, claims, and accompanying drawings of this application, terms such as "first", "second", etc., are used to distinguish between similar objects and do not necessarily indicate a particular order or sequence. It should be understood that terms used in this way are interchangeable in appropriate circumstances, and are merely a distinguishing way to describe objects having the same attributes in the embodiments of this application. In addition, the terms "include", "contain" and any other variations are meant to include a non-exclusive inclusion, whereby a process, method, system, product, or apparatus that includes a set of units is not necessarily limited to those units, and may include other units not expressly listed, or other steps or modules that are not inherent to such a process, method, product, or apparatus.

[0022] First, the application scenario of the heat dissipation part provided in this application is described. The heat dissipation part provided in this application may be applied to a vehicle, for example, to an in-vehicle computing device in a vehicle. The in-vehicle computing device is applied to automated driving of an intelligent vehicle. The intelligent vehicle includes an electric vehicle or a gasoline vehicle that supports unmanned driving, driver assistance (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing. The in-vehicle computing equipment is configured to control and monitor the driving state of the intelligent vehicle, which includes, but is not limited to, an in-vehicle mobile data center (MDC), a human-machine interface (HMI) implementing the function of a human-machine dialogue controller, an in-vehicle infotainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).The in-vehicle computing device may specifically be a chip having computing and processing capabilities, or may be a collection of multiple devices such as processors and memories integrated on a printed circuit board (PCB), where the processor includes, but is not limited to, a central processing unit (CPU), a general-purpose processor, a digital signal processing (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or another programmable logic device, a discrete gate or transistor logic device, a discrete hardware component, a graphics processing unit (GPU), an artificial intelligence (AI) chip, and the like. The general-purpose processor may be a microprocessor or any conventional processor, and the like. From the above description, it can be seen that the in-vehicle computing device is equipped with a chip with a relatively large amount of calculation. Therefore, when using the in-vehicle computing device, a relatively high heat dissipation requirement is required. For this reason, the present application provides a heat dissipation component for improving the heat dissipation effect of the chip.

[0023] For example, as shown in Fig. 1a, the in-vehicle computing device 201 is installed at a suitable position such as the center console or near the liquid cooling pump of the vehicle, detects the environment of the vehicle through various sensors (such as millimeter wave radar 206, laser radar 205, camera 202, etc.) installed on the vehicle body, and then feeds back the environment to the built-in chip of the in-vehicle computing device 201 for real-time inference and calculation, and finally, the in-vehicle computing device 201 can send operation commands to the vehicle control unit (VCU) 204 and control the automobile (e.g., brake and decelerate) through the VCU 204 to realize various levels of autonomous driving functions. Alternatively, the in-vehicle computing device 201 may use a T-BOX (telematics BOX) 203 to upload data to a back-end cloud data center. Optionally, the in-vehicle computing device 201 may transmit with the camera 202 via a multimedia serial link (MSL), transmit with the laser radar 205 via an in-vehicle Ethernet link, transmit with the VCU 204 via a controller area network (CAN) bus, transmit with the millimeter wave radar 206 via the CAN bus, and transmit with the T-BOX 203 via an in-vehicle Ethernet link.

[0024] The in-vehicle computing device 201 in this application may include a heat dissipation component configured to provide heat dissipation to a heat dissipation device within the in-vehicle computing device 201 .

[0025] 1B is an exploded schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application. As shown in FIG. 1B, the heat dissipation component provided in this embodiment of the present application includes a first heat conducting component 101 and a first fixing plate 102.

[0026] In this embodiment of the present application, the first fixed plate 102 is fixedly connected to the PCB substrate 103, a first heat generating device 104 is provided on a side of the PCB substrate 103, and the first fixed plate 102 is positioned on the side of the first heat generating device 104 facing away from the PCB substrate 103.

[0027] The first fixing plate 102 may be a sheet-shaped metal plate made of a material such as aluminum or an aluminum alloy, and the first fixing plate 102 and the PCB board 103 may be fixed at an angle parallel or nearly parallel. The PCB board 103 may be a main board or PCB board 103 having another function, which is provided with one or more heat generating devices. The heat generating device may be a device such as an SOC chip, a local area network switch LAN-SW, or a microcontroller unit (MCU). The first heat generating device 104 is one of one or more heat generating devices arranged on the PCB board 103. The PCB board 103 may have two sides, and heat generating devices may be arranged on both sides of the PCB board 103. The first fixing plate 102 is positioned on the side of the first heat generating device 104 facing away from the PCB board 103, so that the first heat generating device 104 is provided on the side of the PCB board 103 facing the first fixing plate 102. Optionally, a high-power heat generating device may be arranged on one of the two sides of the PCB substrate 103 and a low-power heat generating device may be arranged on the other side, and a first heat generating device 104 may be arranged on the side of the PCB substrate 103 where the high-power heat generating device is arranged, and the first heat generating device 104 may be a high-power heat generating chip.

[0028] In this embodiment of the present application, the first fixing plate 102 is provided with a first through hole 105, the first heat conducting part 101 passes through the first through hole 105, and the side of the first heat conducting part 101 is bonded to the first heat generating device 104. The side of the first heat conducting part 101 may be bonded to the first heat generating device 104 by direct contact, or may be bonded to the first heat generating device 104 by indirect contact by being saturated with silicone grease.

[0029] 2 is a schematic diagram of a structure of a fixing plate according to an embodiment of the present application. As shown in FIG. 2, the first fixing plate 102 may be provided with a first through hole 105. In this embodiment of the present application, the first fixing plate 102 and the PCB board 103 are disposed opposite each other, and the first fixing plate 102 may be provided with a first through hole 105 at a position opposite the first heat generating device 104. The first heat conducting part 101 may pass through the first through hole 105 and be bonded to the first heat generating device 104.

[0030] Specifically, as shown in Fig. 1b, a first fixing plate 102 is provided with a first through-hole 105, and a first heat-conducting component 101 is provided in the first through-hole 105. During installation, the first fixing plate 102 may be moved toward the PCB board 103, allowing the first heat-conducting component 101 to be bonded to the first heat-generating device 104.

[0031] In an optional implementation, the first heat conducting component 101 may be a water block, and the channels and fins may be included inside the water block. The channels may be filled with liquid, and the flow of the liquid further removes heat. The liquid may be water or another refrigeration medium. The first heat conducting component 101 may also be other components with good heat dissipation, such as a liquid cooling plate.

[0032] In this embodiment of the present application, a second heat generating device 106 may be further provided on the side of the PCB board 103, and the heat dissipation component further includes a second heat conducting component 107 and a flexible connector 108. The first heat conducting component 101 and the second heat conducting component 107 are connected via the flexible connector 108. The first fixing plate 102 is further provided with a second through hole 111, the second heat conducting component 107 passes through the second through hole 111, and the side of the second heat conducting component 107 is bonded to the second heat generating device 106.

[0033] In this embodiment of the present application, similar to the first heat generating device 104, the second heat generating device 106 may be further provided on the surface of the PCB board 103 on which the first heat generating device 104 is provided, and the second heat generating device 106 is one of one or more heat generating devices arranged on the PCB board 103. The PCB board 103 may have two surfaces, and heat generating devices may be arranged on both surfaces. Since the first fixing plate 102 is positioned on the side of the second heat generating device 106 facing away from the PCB board 103, the second heat generating device 106 is provided on the surface of the PCB board 103 facing the first fixing plate 102. Similar to the first through hole 105, the first fixing plate 102 and the PCB board 103 are arranged opposite each other, and the first fixing plate 102 may be provided with a second through hole 111 at a position opposite the second heat generating device 106. The second heat conducting part 107 may be adhered to the second heat generating device 106 through the second through hole 111 .

[0034] The first heat conducting part 101 and the second heat conducting part 107 are connected to form a whole via a flexible connector 108, and the flexible conduit allows the first heat conducting part 101 and the second heat conducting part 107 to rise or fall a certain distance along a direction perpendicular to the plane of the first fixed plate 102. In some scenarios, the first heat conducting part 104 and the second heat conducting part 106 are not on the same plane, and in addition, the first heat conducting part 101 and the second heat conducting part 107 can rise or fall a certain distance along a direction perpendicular to the plane of the first fixed plate 102, so that the first heat conducting part 101 and the second heat conducting part 107 can be sufficiently closely bonded to the corresponding heat conducting device. It should be understood that the flexible connector 108 may be a flexible tube, or a combination of a flexible tube and a rigid tube (such as a metal tube).

[0035] Specifically, please refer to FIG. 3. FIG. 3 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application. As shown in FIG. 3, the first heat conduction component 101 and the second heat conduction component 107 are connected through a flexible connector 108, the first heat conduction component 101 and the second heat conduction component 107 are water blocks, the flexible connector 108 is set to be hollow, and the empty cavity inside the flexible connector 108 may be used as a liquid flow path. In addition, the heat dissipation component may include a heat conduction tube 109. The heat conduction tube 109 is connected to the first heat conduction component 101, the heat conduction tube 109 is connected to the second heat conduction component 107, the heat conduction tube 109 is set to be hollow, and the empty cavity inside the heat conduction tube 109 may be used as a liquid flow path. Optionally, the heat conduction tube 109 may be a metal tube, a plastic tube with better heat conduction properties, etc.

[0036] 4 is a schematic diagram of a structure of a heat dissipation component according to an embodiment of the present application. As shown in FIG. 4, along the line of sight toward the PCB board 103, it can be seen that the first heat conduction component 101 is positioned in the first through-hole 105, and the second heat conduction component 107 is positioned in the second through-hole 111.

[0037] In a possible implementation, a third heat generating device is further provided on a side of the PCB substrate 103, a boss 112 is disposed on the side of the first fixing plate 102 facing the PCB substrate 103, and the side of the third heat generating device facing the first fixing plate 102 is adhered to the boss 112.

[0038] Optionally, the side of the first fixing plate 102 facing the PCB board 103 may alternatively be provided with a boss 112 corresponding to a third heat generating device on the PCB board 103. FIG. 5 is a schematic diagram of a structure of a fixing plate according to an embodiment of the present application. As shown in FIG. 5, in addition to the first through hole 105 and the second through hole 111, a plurality of bosses 112 may be provided on the side of the first fixing plate 102 facing the PCB board 103. Each boss 112 corresponds to another heat generating device (a heat generating device other than the first heat generating device 104 and the second heat generating device 106) on the PCB board 103.

[0039] In this embodiment of the present application, the first fixed plate 102 may further be provided with a groove 113 on the side facing the PCB board 103, and the heat conduction tube 109 is bonded to the inner wall of the groove 113. The channel of the heat conduction tube 109 may or may not contact the first fixed plate 102, depending on whether the power of the device that needs to dissipate heat on the PCB board 103 is too high to solve the heat dissipation by natural heat dissipation. If the power of the device that needs to dissipate heat on the PCB board 103 is very high, the heat conduction tube 109 may be bonded to the inner wall of the groove 113 on the first fixed plate 102, so that the heat generated by the device that needs to dissipate heat on the PCB board 103 is transferred to the fixed plate. The bonding position may be coated with a certain heat contact material, such as, but not limited to, epoxy resin. Figure 6 is a schematic diagram of the structure of the fixed plate according to an embodiment of the present application. As shown in FIG. 6, the groove 113 may be provided on the side of the first fixing plate 102 facing the PCB substrate 103 .

[0040] In this embodiment of the present application, the first heat conducting component 101 may be floatingly connected to the PCB substrate 103 such that a side of the first heat conducting component 101 is attached to the first heat generating device 104 .

[0041] In one implementation, Fig. 7 is a schematic diagram of a heat dissipation component according to an embodiment of the present application. As shown in Fig. 7, the first heat conduction component 101 may be installed to fit into the first fixed plate 102, in which case the first heat conduction component 101 can pass directly through the first through hole 105 of the first fixed plate 102, and the spring screw and the board bracket 115 can be fastened and locked to the first heat generating device 104 (the board bracket 115 can be disposed on the bottom housing 114, but is not limited thereto), so that the first heat conduction component 101 can be connected to the PCB board 103 in a floating manner, and further, the first heat conduction component 101 can be bonded to the first heat generating device 104.

[0042] In this embodiment of the present application, the heat generating device may be disposed on the surface of the PCB board 103 facing away from the first fixed plate 102, and contact with the long boss 112 on the bottom housing 114, and the contact interface may be filled with a thermal pad or thermal grease. The bottom housing 114 may be a pure metal plate, or may be a whole cavity-type liquid cooling plate, or may be a heat dissipation structure similar to the first fixed plate 102 and the heat conducting parts, which is not limited here.

[0043] In this embodiment of the present application, in order to seal the through-hole provided in the first fixed plate 102, the sealing cover 110 may be fastened to the side of the first fixed plate 102 facing away from the PCB board 103 to seal the first through-hole 105. Specifically, the sealing cover 110 may be provided on the first fixed plate 102. As shown in FIG. 8, the sealing cover 110 may be locked to a local area near the heat conducting component (the first heat conducting component 101 or the second heat conducting component 107), as shown in FIG. 9, the sealing cover 110 may be locked to a local area near the heat conducting component (the first heat conducting component 101 and the second heat conducting component 107), or as shown in FIG. 10, the sealing cover 110 may be locked to the outer edge of the entire first fixed plate 102, and all the joints are fastened via sealing rings and screws to meet the airtight requirement. FIG. 11 is a schematic diagram of an in-vehicle computing device.

[0044] In this embodiment of the present application, the first heat generating device 104 is bonded to the first heat conducting part 101, and the first heat conducting part 101 can take away heat from the first heat generating device 104. In terms of the size of the heat conducting part, the first heat conducting part 101 passes through the through hole of the first fixing part, so the size of the first heat conducting part 101 can be adapted to the size of the through hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat conducting part 101 of this embodiment is small. Also, in terms of thickness, the first heat conducting part 101 passes through the through hole of the first fixing part, so the thickness of the heat dissipation part of this embodiment is thinner than the case where the fixing plate and the liquid cooling plate are separately arranged.

[0045] In addition, it should be noted that the described device embodiments are merely examples. The units described as separate parts may or may not be physically separated, and the parts represented as units may or may not be physical units, may be located in one location, or may be distributed among multiple network units. Some or all of the modules may be selected based on the actual requirements to achieve the purpose of the solution of the embodiment. In addition, in the accompanying drawings of the device embodiments provided in this application, the connection relationship between the modules indicates that the modules have communication connections with each other, which may be specifically implemented as one or more communication buses or signal cables.

[0046] Based on the description of the implementation form above, those skilled in the art can clearly understand that the present invention can be implemented by software in addition to the necessary general-purpose hardware, or by dedicated hardware including dedicated integrated circuits, dedicated CPUs, dedicated memories, dedicated components, etc. Generally, any function that can be implemented by a computer program can be easily implemented by using corresponding hardware. Furthermore, the specific hardware configuration for realizing the same function may be in various forms, for example, an analog circuit, a digital circuit, or a dedicated circuit. However, for the present application, in most cases, the software program implementation form is a better implementation form. Based on such understanding, the technical solution of the present application may be essentially or the part that contributes to the prior art may be implemented in the form of a software product. The software product is stored in a readable storage medium such as a computer floppy disk, USB flash drive, removable hard disk, ROM, RAM, magnetic disk, or optical disk, and includes some instructions for instructing a computer device (which may be a personal computer, a training device, or a network device, etc.) to execute the method described in the embodiment of the present application.

[0047] All or part of the above embodiments may be implemented using software, hardware, firmware, or any combination thereof. If software is used for implementation, all or part of the embodiments may be implemented in the form of a computer program product.

[0048] A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the procedures or functions according to the embodiments of the present application are generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or another programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from a computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website, computer, training device, or data center to another website, computer, training device, or data center by wire (e.g., coaxial cable, optical fiber, or digital subscriber line (DSL)) or wireless (e.g., infrared, radio frequency, or microwave) method. The computer-readable storage medium may be any available medium accessible by a computer, or a data storage device, such as a training device or a data center, incorporating one or more available media. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, or a magnetic tape), an optical medium (e.g., a DVD), a semiconductor medium (e.g., a solid state disk (SSD)), or the like. [Explanation of symbols]

[0049] 101 First heat transfer part 102 First fixing plate 103 PCB Board 104 First heating device 105 First through hole 106 Second Heating Device 107 Second heat transfer part 108 Flexible Connector 109 Heat transfer tube 110 Sealing cover 111 Second through hole 112 Boss 113 Groove 114 Bottom Housing 115 PCB bracket 201 In-vehicle computing equipment 202 Camera 203 T-BOX 204 Vehicle Control Unit (VCU) 205 Laser radar 206 Millimeter Wave Radar

Claims

1. A heat dissipation component comprising a first heat conducting component (101) and a first fixing plate (102), the first fixing plate (102) is fixedly connected to a PCB board (103), a first heat generating device (104) is provided on a side of the PCB board (103), and the first fixing plate (102) is positioned on a side of the first heat generating device (104) facing away from the PCB board (103); a first through hole (105) is provided in the first fixing plate (102), the first heat conducting part (101) passes through the first through hole (105), and a side surface of the first heat conducting part (101) is bonded to the first heat generating device (104); a second heat generating device (106) is further provided on the side surface of the PCB board (103), and the heat dissipation component further comprises a second heat conducting component (107) and a flexible connector (108); the first heat conducting component (101) and the second heat conducting component (107) are connected via the flexible connector (108); The first fixing plate (102) is further provided with a second through hole (111), the second heat conducting part (107) passes through the second through hole (111), and a side surface of the second heat conducting part (107) is bonded to the second heat generating device (106), a heat dissipating part.

2. The heat dissipation component of claim 1 , wherein the first heat conducting component (101) is a water block.

3. Further comprising a heat transfer tube (109); The heat dissipation component of claim 1, wherein the heat conduction tube (109) is connected to the first heat conduction component (101), a groove (113) is provided on the side of the first fixing plate (102) facing the PCB board (103), and the heat conduction tube (109) is adhered to the inner wall of the groove (113).

4. The heat dissipation component according to claim 3, wherein the heat transfer tube (109) is a metal tube.

5. The heat dissipation component according to claim 1 , further comprising a third heat generating device on a side surface of the PCB substrate (103).

6. The heat dissipation component of claim 1, wherein the first heat conduction component (101) is connected to the PCB substrate (103) in a floating manner, such that a side of the first heat conduction component (101) is adhered to the first heat generating device (104).

7. Further comprising a sealing cover (110); The heat dissipation component of claim 1, wherein the sealing cover (110) is fastened to a side of the first fixing plate (102) facing away from the PCB substrate (103) so as to seal the first heat conduction component (101).

8. A vehicle comprising: a vehicle body; and the heat dissipation component according to claim 1 provided on the vehicle body.

Images