Protective cap, electronic device, and method for manufacturing protective cap

Abstract

To provide a protective cap suitably bonding a frame part and a lid part, a manufacturing method for the same, and an electronic device even when an antireflective film is interposed between the frame part and the lid part.SOLUTION: In an electronic device 1, a protective cap 4 includes a frame part 6, a lid part 7 covering one end portion of the frame part, and a bonding part 8 formed from a welded part 11 to which the frame part and the lid part are directly welded. The lid part has a first surface 7a in contact with one end portion of the frame part on through the bonding part. The first surface has a first anti-reflective coating 9. The first anti-reflective coating has a contact part 9a in contact with the frame part. A surface roughness Sa of the contact part is 0.1 to 1.0 nm.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a protective cap, an electronic device, and a method for manufacturing the protective cap. [Background technology]

[0002] Electronic devices equipped with electronic components such as LEDs are now being used in a variety of fields, such as lighting and communications, due to their long life span and energy saving properties.

[0003] In this type of electronic device, in order to protect the electronic components, a protective cap may be placed on the base material on which the electronic components are mounted so that the electronic components are housed inside. For example, as disclosed in Patent Document 1, the protective cap includes a frame (second member) that surrounds the periphery of the electronic components, and a lid (cover member) that covers one end opening of the frame.

[0004] The protective cap is integrally formed by joining a frame and a lid. For example, a method of joining the frame and the lid can be used to irradiate a contact portion between the frame and the lid with a laser to weld a part of the frame and a part of the lid. For example, Patent Document 2 discloses a technique for joining two members with a laser, in which a first substrate and a second substrate are superimposed on each other, and a welded portion (fused portion) is formed in the interface region between them by irradiating a laser. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2015 / 190242 [Patent Document 2] Patent Publication No. 2021-88468 Summary of the Invention [Problem to be solved by the invention]

[0006] Incidentally, when the electronic component is a light-emitting element such as an LED, it is possible to form an anti-reflection film on the lid in order to improve the light extraction efficiency. For example, when an anti-reflection film is formed on the entire front and back surfaces of the lid, when the frame and the lid are overlapped for bonding, part of the anti-reflection film comes into contact with the frame.

[0007] If laser bonding is performed in this state, there is a risk that welding between the frame and the lid will be insufficient due to the presence of the anti-reflection film between them.

[0008] The present invention has been made in consideration of the above-mentioned circumstances, and has as its technical objective to suitably join the frame portion and the lid portion even when an anti-reflection film is interposed between the frame portion and the lid portion. [Means for solving the problem]

[0009] The present invention has been made to solve the above-mentioned problems, and provides a protective cap for protecting an electronic component, comprising a frame portion, a lid portion covering one end of the frame portion, and a bonding portion bonding the frame portion and the lid portion, wherein the lid portion has a first surface that contacts the one end of the frame portion via the bonding portion, the first surface having a first anti-reflection film, the first anti-reflection film having a contact portion that contacts the frame portion, and a surface roughness Sa of the contact portion being 0.1 to 1.0 nm.

[0010] According to this configuration, the surface roughness Sa of the contact portion of the first antireflection film is set to 0.1 to 1.0 nm, so that the adhesion of the contact portion and the frame portion can be improved. Therefore, by irradiating the contact portion with a laser, it is possible to form a bonded portion having sufficient bonding strength. Furthermore, even if the protective cap is required to be airtight, sufficient airtightness of the bonded portion can be ensured.

[0011] The cover may have a second surface located opposite to the first surface, and the second surface may have a second anti-reflection coating, thereby further improving the light extraction efficiency when an electronic device that emits light is manufactured using a protective cap.

[0012] The electronic device according to the present invention is characterized in that it comprises an electronic component, a base material on which the electronic component is mounted, and the above-mentioned protective cap joined to the base material so as to house the electronic component therein. In this way, it is possible to enjoy the same effects as those of the corresponding configuration of the protective cap already described.

[0013] The present invention is a method for manufacturing the above-mentioned protective cap, comprising a film-forming step of forming the first anti-reflection film on the first surface of the lid portion by a film-forming apparatus that performs a physical vapor deposition method, and a joining step of joining the first surface of the lid portion and the one end of the frame portion, wherein the film-forming apparatus comprises a holder that holds the lid portion and can move in a predetermined direction, a target that scatters particles that are material for the first anti-reflection film, and a shielding member that regulates the scattering direction of the particles scattered from the target, and wherein in the film-forming step, a portion of the particles scattered from the target are shielded by the shielding member, while particles that scatter without coming into contact with the shielding member are adhered to the first surface of the lid portion that is moving while being held by the holder.

[0014] According to this configuration, by blocking some of the particles scattered from the target with the shield member, the particles can be uniformly attached to the first surface of the lid, which makes it possible to minimize the surface roughness of the first antireflection coating.

[0015] In this method, the targets may include a first target and a second target arranged side by side, and the shield member may be disposed between the first target and the second target.

[0016] According to this configuration, by using the shielding member to regulate the scattering direction of particles scattering from the first target and particles scattering from the second target, it is possible to make the surface roughness of the first antireflection coating as small as possible.

[0017] In the method, the shielding member may be provided on the holder. The shielding member provided on the holder can block a portion of particles scattered from the target, thereby making it possible to minimize the surface roughness of the first antireflection coating.

[0018] In the bonding step of the present method, the first surface of the lid portion and the one end of the frame portion may be directly bonded to each other by contacting the first surface of the lid portion and irradiating the contact portion with a laser, thereby making it possible to manufacture a protective cap having excellent airtightness and high bonding strength. Effect of the Invention

[0019] According to the present invention, even when an anti-reflection film is interposed between the frame and the lid, the frame and the lid can be joined together suitably. [Brief description of the drawings]

[0020] [Figure 1] FIG. 4 is a cross-sectional view of the protective cap. [Diagram 2] 2 is a cross-sectional view taken along the line II-II of FIG. 1. [Diagram 3] FIG. 1 is a schematic diagram of a film forming apparatus. [Figure 4] 4 is a cross-sectional view showing a step in a method for manufacturing a protective cap. [Diagram 5] 4 is a cross-sectional view showing a step in a method for manufacturing a protective cap. [Figure 6] 4 is a plan view showing a step in a manufacturing method of the protective cap. FIG. [Figure 7] 1 is a cross-sectional view showing a step in a method for manufacturing an electronic device. [Figure 8] FIG. 13 is a schematic diagram showing another example of a film forming apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Figures 1 to 8 show a protective cap, an electronic device, and a method for manufacturing a protective cap according to the present invention.

[0022] As shown in Figures 1 and 2, the electronic device 1 includes an electronic component 2, a substrate 3 on which the electronic component 2 is mounted, a protective cap 4 disposed on the substrate 3 so as to house the electronic component 2 therein, and a sealing portion 5 that seals the substrate 3 and the protective cap 4.

[0023] 1, an electronic component 2 is fixed to a base material 3 and housed in a space inside a protective cap 4. Examples of the electronic component 2 include optical devices such as a laser module, an LED light source, an optical sensor, an imaging element, and an optical switch. In this embodiment, a case where the electronic component 2 is an LED for ultraviolet irradiation will be described as an example.

[0024] The substrate 3 has a first surface 3a that supports the electronic component 2 and the protective cap 4, and a second surface 3b located on the opposite side to the first surface 3a. In this embodiment, the substrate 3 is a plate-like body in which the first surface 3a and the second surface 3b are both flat. The substrate 3 is not limited to this shape, and may have a recess in the portion of the first surface 3a on which the electronic component 2 is mounted.

[0025] The substrate 3 is made of, for example, a metal, a metal oxide ceramic, an LTCC, or a metal nitride ceramic. Examples of metals include copper and metal silicon. Examples of metal oxide ceramics include aluminum oxide. Examples of LTCC include sintered composite powders containing, for example, crystallizable glass and a refractory filler.

[0026] An example of the metal nitride ceramic is aluminum nitride. In this embodiment, the base material 3 is made of aluminum nitride. The thermal expansion coefficient of aluminum nitride in the temperature range of 30 to 380° C. is, for example, 46×10 -7 / ℃.

[0027] As shown in FIG. 1, the protective cap 4 includes a frame 6, a lid 7 that covers one end of the frame 6, and a joint 8 that joins the frame 6 and the lid 7 together.

[0028] The frame 6 is a tubular body having a through-hole (hole) H at its center. The frame 6 surrounds the periphery of the electronic component 2 accommodated in a space corresponding to the through-hole (hole) H. The frame 6 is configured as a rectangular tube, but may have another shape such as a cylinder.

[0029] The frame 6 has a first end surface 6a fixed to the lid 7 and a second end surface 6b fixed to the substrate 3. The surface roughness Sa (arithmetic mean surface height) of the first end surface 6a is preferably 0.1 to 1.0 nm. The surface roughness Sa of the second end surface 6b is preferably 0.1 to 1.0 nm. The surface roughness Sa is measured in accordance with ISO25178 (the same applies below).

[0030] The frame 6 is made of a material having optical transparency, for example, a thermal expansion coefficient of 30×10 -7 ~100×10 -7 The glass material of the frame 6 is preferably an ultraviolet-transmitting glass.

[0031] The thickness of the frame 6 is preferably larger than that of the electronic component 2, and is preferably 0.01 to 1 mm larger than that of the electronic component 2, more preferably 0.05 to 0.5 mm larger, and most preferably 0.1 to 0.2 mm larger.

[0032] The lid portion 7 is made of a substrate having optical transparency. Specifically, the lid portion 7 is made of a glass substrate including quartz glass, borosilicate glass, aluminosilicate glass, and various other types of glass, a sapphire substrate, a resin substrate, or the like.

[0033] In this embodiment, a case will be described in which a quartz glass substrate having high ultraviolet transmittance is used for the cover portion 7. Quartz glass includes fused quartz and synthetic quartz. The thermal expansion coefficient of fused quartz glass in the temperature range of 30 to 380° C. is, for example, 6.3×10 -7 / °C, and the thermal expansion coefficient of synthetic quartz glass in the temperature range of 30 to 380°C is, for example, 4.0 × 10 -7 / ℃.

[0034] The thickness of the lid portion 7 is preferably 0.1 to 1.0 mm, more preferably 0.2 to 0.8 mm, and most preferably 0.3 to 0.6 mm.

[0035] The lid portion 7 has a first surface 7a fixed to the frame portion 6, and a second surface 7b located opposite to the first surface 7a.

[0036] The first surface 7a has an antireflection film (hereinafter referred to as "first antireflection film") 9 as a functional film. The first antireflection film 9 is, for example, a silicon oxide film (SiO 2 ) and a hafnium oxide film (HfO 2 ) are alternately laminated, but the material of the anti-reflection film is not limited to that in this embodiment.

[0037] The first surface 7a is in contact with one end (first end surface 6a) of the frame 6 via the joint 8 and the first antireflection film 9. The first antireflection film 9 has a contact portion 9a that contacts the frame 6. The surface roughness of the contact portion 9a is 0.1 to 1.0 nm, more preferably 0.1 to 0.8 nm, and even more preferably 0.2 to 0.5 nm. By setting the surface roughness Sa of the contact portion 9a to 1.0 nm or less, the weldability between the lid 7 and the frame 6 is improved, and sufficient airtightness of the joint 8 can be ensured. In addition, by setting the surface roughness Sa of the contact portion 9a to 0.1 nm or more, the effect of the antireflection film can be ensured. Note that the surface roughness Sa of the first antireflection film 9 excluding the contact portion 9a is also preferably 0.1 to 1.0 nm.

[0038] The second surface 7b is a surface that constitutes a part of the outer surface of the protective cap 4. The second surface 7b has an anti-reflection film (hereinafter referred to as "second anti-reflection film") 10 as a functional film. The second anti-reflection film 10 is, for example, a silicon oxide film (SiO 2 ) and a hafnium oxide film (HfO 2 ) are alternately laminated, but the material of the second antireflection film 10 is not limited to that in this embodiment.

[0039] The joint 8 joining the frame 6 and the lid 7 is formed from a welded portion 11 in which the frame 6 and the lid 7 are directly welded to each other. The welded portion 11 is formed by laser welding. In detail, the welded portion 11 is formed by melting at least one of the frame 6 and the lid 7 in the laser irradiation area and then solidifying the melted portion. In other words, it is preferable that the welded portion 11 is made of, for example, the material of at least one of the frame 6 and the lid 7 and does not substantially include materials other than the frame 6 and the lid 7.

[0040] 2, a plurality of welded portions 11 (two in the illustrated example) are formed in a concentric ring shape along the through portion (hole) H, but there may be only one. The multiple welded portions 11 are spaced apart from one another, but may overlap. Each welded portion 11 is configured in a square ring shape in a plan view, but is not limited to this and may be configured in a circular ring shape or other ring shapes.

[0041] The welded portion 11 is formed continuously across the frame portion 6 and the lid portion 7 in the thickness direction. In this embodiment, there is no interface between the frame portion 6 and the lid portion 7 inside the welded portion 11. Of course, an interface may remain between the frame portion 6 and the lid portion 7 inside the welded portion 11.

[0042] The width S1 of the welded portion 11 is preferably 10 to 200 μm, more preferably 10 to 100 μm, and most preferably 10 to 50 μm. The thickness S2 of the welded portion 11 is preferably 10 to 200 μm, more preferably 10 to 150 μm, and most preferably 10 to 100 μm.

[0043] The sealing portion 5 that seals the base material 3 and the frame portion 6 of the protective cap 4 is not particularly limited, but in this embodiment, it comprises, in order from the second end face 6b side of the frame portion 6, a metallized layer 12 and a solder layer 13.

[0044] The metallized layer 12 is a metal film formed on the second end surface 6b of the frame portion 6 of the protective cap 4 by, for example, physical vapor deposition. The metallized layer 12 has a role of improving adhesion with the solder layer 13. As the metallized layer 12, for example, Cr, Ti, Ni, Pt, Au, Co, or an alloy layer containing these, or a multilayer film of these metals or alloys can be used.

[0045] As the solder layer (brazing material) 11, for example, Au, Sn, Ag, Pb, and alloys containing these metals, that is, Au-Sn based solder, Sn-Ag based solder, Pb based solder, etc., can be used. The thermal expansion coefficient of Au-Sn based solder in the temperature range of 30 to 380° C. is, for example, 175×10 -7 / ℃.

[0046] A method for manufacturing the electronic device 1 having the above-mentioned configuration will be described below. Note that the method for manufacturing the electronic device 1 includes a method for manufacturing the protective cap 4.

[0047] The method for manufacturing the electronic device 1 includes a preparation step of preparing the protective cap 4, and a sealing step of fixing the protective cap 4 to the base material 3.

[0048] The preparation process is a process (method) for manufacturing the protective cap 4. The preparation process includes a film formation process for forming the anti-reflection films 9, 10 on the lid portion 7, and a bonding process for bonding the frame portion 6 and the lid portion 7 after the film formation process.

[0049] In the film formation step, a film formation apparatus that performs physical vapor deposition is used to form the antireflection films 9, 10 on the first surface 7a and the second surface 7b of the lid portion 7. Hereinafter, the formation of the first antireflection film 9 on the first surface 7a by the film formation apparatus 14 will be described with reference to FIG.

[0050] In this embodiment, a sputtering device such as a magnetron sputtering device is used as the film forming device 14, but the present invention is not limited to this configuration, and a film forming device that performs other physical vapor deposition methods such as vacuum deposition may be used.

[0051] The film forming apparatus 14 includes a vacuum chamber 15, a holder 16 that holds the lid portion 7, a rotating body 17 (rotating drum) that supports the holder 16, targets 18a, 18b that scatter particles that will become material for the first anti-reflection coating 9, and a shield member 19 that regulates the direction of scattering of the particles scattered from the targets 18a, 18b.

[0052] The vacuum chamber 15 accommodates the holder 16, the rotor 17, and the targets 18a and 18b therein. The internal space of the vacuum chamber 15 is set to a predetermined vacuum level by a vacuum pump. An inert gas such as argon gas can be supplied into the vacuum chamber 15.

[0053] The holder 16 detachably holds the lid portion 7 with the first surface 7a of the lid portion 7 exposed. The holder 16 is made of metal, but the material of the holder 16 is not limited to this embodiment.

[0054] Rotating body 17 is formed in a circular shape, and detachably holds a plurality of holders 16 on its outer circumferential surface. Rotating body 17 rotates around rotation axis 17a at its center, thereby moving holders 16 in its circumferential direction.

[0055] The targets 18a, 18b include a first target 18a and a second target 18b arranged side by side in the vacuum chamber 15. The first target 18a and the second target 18b are made of a material for forming the first antireflection film 9.

[0056] The shield member 19 is made of a metal plate-like member, but is not limited to this material and shape. The shield member 19 is disposed between the rotor 17 and each of the targets 18a and 18b. The shield member 19 is also disposed between the first target 18a and the second target 18b, which are arranged side by side.

[0057] In the film formation process, while rotating the rotor 17, some of the particles scattered from the targets 18a, 18b are shielded by the shield member 19, while the particles that scatter without coming into contact with the shield member 19 are adhered to the first surface 7a of the lid portion 7, which is moving while being held by the holder 16.

[0058] 3, some of the particles scattered from each of the targets 18a, 18b are scattered toward the rotor 17 without coming into contact with the shield member 19, as shown by arrow D1. Other of the particles scattered from each of the targets 18a, 18b are scattered so as to come into contact with the shield member 19, as shown by arrow D2.

[0059] In this manner, by shielding a portion of the particles scattered from each of the targets 18a, 18b with the shield member 19, the incident angle of the particles with respect to the first surface 7a of the lid portion 7 held by the holder 16 is regulated. This allows the particles to adhere uniformly to the first surface 7a of the lid portion 7.

[0060] By rotating the rotor 17 multiple times, particles scattered from the targets 18a and 18b are deposited on the first surface 7a to form a film having a predetermined thickness. When the first anti-reflection film 9 has a multi-layered film structure, targets corresponding to the materials constituting each layer are prepared, and the above-mentioned film formation process is repeated multiple times. As a result, the first anti-reflection film 9 is formed on the first surface 7a of the lid 7.

[0061] In the film formation step, the second antireflection film 10 can be formed on the second surface 7b of the lid portion 7 by the film formation device 14, similarly to the formation of the first antireflection film 9. The order of formation of the first antireflection film 9 and the second antireflection film 10 is not particularly limited, and the second antireflection film 10 may be formed before the first antireflection film 9.

[0062] In the joining process for joining the frame portion 6 and the lid portion 7, a first surface 7a of the lid portion 7 is joined to a first end face 6a which is one end of the frame portion 6. That is, in the joining process, the first surface 7a of the lid portion 7 and the first end face 6a of the frame portion 6 are brought into contact with each other, and a laser is irradiated to the contact portion, thereby directly welding the first surface 7a of the lid portion 7 to the first end face 6a of the frame portion 6.

[0063] 4, a lid 7 and a frame 6 having a metallized layer 12 and a solder layer 13 formed thereon are prepared. Next, a first surface 7a of the lid 7 is brought into contact with a first end face 6a of the frame 6. In this case, a contact portion 9a of a first antireflection coating 9 formed on the first surface 7a of the lid 7 comes into contact with the first end face 6a of the frame 6.

[0064] In this state, as shown in Fig. 5, a laser irradiation device 20 irradiates a laser L by focusing the laser beam onto the contact portion between the frame portion 6 and the lid portion 7. The laser L is irradiated from at least one side of the frame portion 6 and the lid portion 7. In this embodiment, the laser L is irradiated from the lid portion 7 side. As a result, the contact portion between the frame portion 6 and the lid portion 7 is welded to form a welded portion 11, and the frame portion 6 and the lid portion 7 are joined by this welded portion 11.

[0065] As the laser L, an ultrashort pulse laser having a pulse width on the order of picoseconds or femtoseconds is preferably used.

[0066] The wavelength of the laser L is not particularly limited as long as it is a wavelength that can be transmitted through a glass member, but for example, it is preferably 400 to 1600 nm, and more preferably 500 to 1300 nm. The pulse width of the laser L is preferably 10 ps or less, more preferably 5 ps or less, and most preferably 200 fs to 3 ps. The focused diameter of the laser L is preferably 50 μm or less, more preferably 30 μm or less, and preferably 20 μm or less.

[0067] The repetition frequency of the laser L must be such that it causes continuous heat accumulation, and specifically, it is preferably 100 kHz or more, more preferably 200 kHz or more, and even more preferably 500 kHz or more.

[0068] It is also preferable to use a method of dividing one pulse into multiple pulses and irradiating the laser with shorter pulse intervals (burst mode), which makes it easier for heat to accumulate and allows the junction 8 to be formed stably.

[0069] As shown in Fig. 6, the laser L is scanned outside the through-hole H so as to trace a circular orbit T along the through-hole H. In this case, the laser L is scanned so as to circle the circular orbit T while the irradiation area R overlaps on the circular orbit T. Alternatively, the laser L is scanned so as to circle the circular orbit T multiple times. When multiple welds 11 are formed in a concentric ring shape, multiple circular orbits T for scanning the laser L are also set in a concentric ring shape.

[0070] By forming a predetermined number of welded portions 11, the protective cap 4 in which the frame portion 6 and the lid portion 7 are joined by the joint portion 8 is manufactured.

[0071] In the sealing step of fixing the protective cap 4 to the base material 3, first, as shown in FIG. 7, the protective cap 4 obtained in the preparation step and the base material 3 on which the electronic component 2 is mounted are prepared. Next, the second end face 6b of the frame 6 and the first surface 3a of the base material 3 are brought into contact with each other via the metallized layer 12 and the solder layer 13. By heating in this state, the solder layer 13 is softened and fluidized (reflowed), and the frame 6 and the base material 3 are joined by the solder layer 13. The solder layer 13 may be heated using a heating furnace or a laser. As a result, a sealing part 5 that seals the base material 3 and the protective cap 4 is formed.

[0072] 8 shows another example of the film forming apparatus 14. In this example, shield members 19a, 19b of the film forming apparatus 14 are provided on the holder 16. The shield members 19a, 19b include a first shield member 19a and a second shield member 19b arranged to sandwich the lid portion 7 held by the holder 16. Each of the shield members 19a, 19b is a metal plate-like member and is detachably attached to the holder 16. Each of the shield members 19a, 19b is arranged to face the traveling direction of the holder 16 (the rotation direction of the rotor 17).

[0073] In this example, in the film forming process, the shield members 19a, 19b provided on the holder 16 can block some of the particles scattered from the targets 18a, 18b.

[0074] According to the manufacturing method of the protective cap 4 and the electronic device 1 (the manufacturing method of the protective cap 4) of this embodiment described above, in the film formation process, the scattering direction of particles scattering from each target 18a, 18b is regulated by the shield members 19, 19a, 19b, so that the particles can be uniformly deposited on the first surface 7a of the lid portion 7.

[0075] This allows the surface roughness Sa of the contact portion 9a of the first antireflection film 9 to be 0.1 to 1.0 nm. Therefore, when the contact portion 9a of the first antireflection film 9 and the first end face 6a of the frame portion 6 are brought into contact with each other, the adhesion therebetween can be improved. In this state, by irradiating the contact portion with a laser beam L, a bonding portion 8 having sufficient bonding strength can be formed. This bonding portion 8 also makes it possible to ensure sufficient airtightness of the protective cap 4.

[0076] The present invention is not limited to the configuration of the above embodiment, nor is it limited to the above-mentioned effects and advantages. Various modifications of the present invention are possible without departing from the spirit and scope of the present invention.

[0077] In the above embodiment, the metallized layer 12 and the solder layer 13 are formed in advance on the frame 6 of the protective cap 4, and the base material 3 and the protective cap 4 are sealed together. However, the present invention is not limited to this configuration. For example, the metallized layer and the solder layer may be formed in advance on the first surface 3a of the base material 3, and the second end surface 6b of the frame 6 of the protective cap 4 may be sealed together with the first surface 3a of the base material 3.

[0078] Alternatively, without using the above-mentioned metallized layer and solder layer, the second end face 6b of the frame 6 and the first surface 3a of the base material 3 may be brought into direct contact with each other, and this contact portion may be directly welded by irradiating with a laser. EXAMPLES

[0079] In the following, examples of the present invention and comparative examples will be described. In both the examples and the comparative examples, a substrate-shaped synthetic quartz was used for the lid, and a rectangular cylindrical synthetic quartz was used for the frame.

[0080] In Examples 1 to 3, a silicon oxide film (SiO 2 ) and hafnium oxide film (HfO 2) were alternately laminated in two layers to form an anti-reflection film. At this time, the surface roughness Sa of the contact portion was adjusted by adjusting the length of a shielding member that regulates the scattering direction of particles scattered from a target that scatters particles that are the material of the first anti-reflection film. On the other hand, in Comparative Example 1, a silicon oxide film (SiO 2 ) and hafnium oxide film (HfO 2 ) were alternately laminated in two layers to form an anti-reflection film. This resulted in the formation of cover samples of Examples 1 to 3 and Comparative Example 1, which had different surface roughness of the anti-reflection film at the contact portion. Note that an anti-reflection film with the same surface roughness was also formed on the portion other than the contact portion of each sample.

[0081] The lid was then placed on the frame so that the contact portion of the lid overlapped one end of the frame, and an ultrashort pulse laser was irradiated at this overlapping point to join the frame and lid, producing a sample protective cap.

[0082] The bonding strength between the lid and frame of the obtained protective cap samples was then evaluated by an accelerated deterioration test using a PCT (Pressure Cooker Test). Specifically, the protective cap samples prepared as described above were kept in an environment of 121°C, 2 atm, and 80% relative humidity for 12 hours, after which those that were able to maintain the bond between the lid and frame were judged as "good" products, and those that were not were judged as "bad" products. The results are shown in Table 1.

[0083] [Table 1]

[0084] From Table 1, it can be seen that when the surface roughness Sa of the contact portion is 1.1 or more, the bond between the lid portion and the frame portion deteriorates. [Explanation of symbols]

[0085] 1 Electronic equipment 2. Electronic Components 3 Base material 4 Protective cap 6 Frame 6a First end face of frame 7 Lid 7a First surface 7b Second surface 9 First anti-reflection coating 9a Contact part 10 Second anti-reflection coating 14 Film deposition equipment 16 Holder 18a First Target 18b Second Target 19 Shielding material 19a First shield member 19b Second shield member L Laser

Claims

1. A protective cap for protecting an electronic component, A frame portion, a lid portion that covers one end of the frame portion, and a joint portion that joins the frame portion and the lid portion, the lid portion has a first surface that contacts the one end of the frame portion via the joint portion, the first surface has a first anti-reflective coating; the first antireflection film has a contact portion in contact with the frame portion, The protective cap is characterized in that the surface roughness Sa of the contact portion is 0.1 to 1.0 nm.

2. the lid portion has a second surface opposite the first surface; The protective cap of claim 1 , wherein the second surface comprises a second anti-reflective coating.

3. 3. An electronic device comprising: an electronic component; a substrate on which the electronic component is mounted; and the protective cap according to claim 1 or 2 joined to the substrate so as to house the electronic component therein.

4. A method for producing the protective cap according to claim 1 or 2, comprising the steps of: a deposition step of forming the first anti-reflection film on the first surface of the lid portion by a deposition device that performs a physical vapor deposition method, and a joining step of joining the first surface of the lid portion and the one end of the frame portion, the film forming apparatus includes a holder that holds the lid portion and is movable in a predetermined direction, a target that scatters particles that are to be a material of the first antireflection coating, and a shield member that regulates a scattering direction of the particles scattered from the target; A method for manufacturing a protective cap, characterized in that in the film formation process, a portion of the particles scattered from the target are shielded by the shielding member, while particles that scatter without coming into contact with the shielding member are adhered to the first surface of the lid portion, which is moving while being held by the holder.

5. The targets include a first target and a second target arranged side by side, The method for manufacturing a protective cap according to claim 4 , wherein the shield member is disposed between the first target and the second target.

6. The method for manufacturing a protective cap according to claim 4 , wherein the shielding member is provided on the holder.

7. A method for manufacturing a protective cap described in any one of claims 4 to 6, wherein in the joining process, the first surface of the lid portion and the one end of the frame portion are brought into contact with each other and a laser is irradiated to the contact portion to directly join the first surface of the lid portion and the one end of the frame portion.

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