Semiconductor light emitting device

Abstract

To suppress the tilt of a semiconductor light-emitting device with respect to a circuit board.SOLUTION: A side light emitting type semiconductor light-emitting device 1 includes a multilayer substrate 10 having a plurality of substrates 10A to 10C and a plurality of conductive layers 31 and 32, and semiconductor light emitting devices 60A and 60B. The multilayer substrate 10 includes a main surface 11 on which the semiconductor light emitting devices 60A and 60B are mounted, a back surface 12 on which an external electrode 50 is formed facing the opposite side of the main surface 11, and a mounting surface 13 intersecting both main surface 11 and back surface 12. The plurality of conductive layers 31, 32 have conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb exposed from the mounting surface 13.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to semiconductor light emitting devices. [Background technology]

[0002] Conventionally, so-called side-emitting type semiconductor light-emitting devices that emit light parallel to a circuit board on which they are mounted are known as semiconductor light-emitting devices equipped with semiconductor light-emitting elements (see, for example, Patent Document 1). Such a semiconductor light-emitting device includes a flat substrate, a semiconductor light-emitting element mounted on a main surface electrode formed on the main surface of the substrate, a back surface electrode formed on the back surface of the substrate, a through electrode disposed in a groove formed so as to penetrate the substrate in the thickness direction of the substrate, and a sealing resin that seals the semiconductor light-emitting element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-161697 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the process of manufacturing a semiconductor light emitting device, if the position of the sealing resin formed on the substrate is misaligned during the process of forming the sealing resin, the sealing resin may cover the through electrode. Therefore, it is conceivable to provide the through electrode so that the through electrode is not exposed from the substrate. This makes it possible to prevent the sealing resin from covering the through electrode.

[0005] In a conventional side-emitting semiconductor light-emitting device, when one of the multiple surfaces orthogonal to the main surface and back surface of the substrate is used as the mounting surface facing the circuit board, the through electrode is exposed from the mounting surface. When mounting the semiconductor light-emitting device on the circuit board, the back electrode and the through electrode are bonded to the circuit board by a conductive bonding material such as solder. However, when the through electrode is not exposed from the substrate, only the back electrode is bonded to the circuit board by the conductive bonding material, and the conductive bonding material applies a force in a direction that brings the back surface of the substrate closer to the circuit board, which may tilt the semiconductor light-emitting device so that the mounting surface is away from the circuit board. [Means for solving the problem]

[0006] A semiconductor light emitting device that solves the above problem comprises a multilayer substrate having a plurality of base materials and a conductive layer, and a semiconductor light emitting element, wherein the multilayer substrate has a main surface on which the semiconductor light emitting element is mounted, a back surface facing opposite to the main surface and on which an external electrode is formed, and a mounting surface that intersects both the main surface and the back surface, and the conductive layer is positioned away from both the main surface and the back surface in the thickness direction of the multilayer substrate and has a conductive exposed portion exposed from the mounting surface.

[0007] According to this configuration, when the semiconductor light emitting device is mounted on a circuit board, the conductive exposed portion exposed from the mounting surface of the multilayer board can be bonded to the circuit board with a conductive adhesive, and therefore, the mounting surface is bonded to the circuit board on the main surface side of the multilayer board rather than the back surface of the multilayer board, so that the semiconductor light emitting device can be stably mounted on the circuit board. Effect of the Invention

[0008] According to the above-described semiconductor light emitting device, the semiconductor light emitting device can be stably mounted on a circuit board. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view of a semiconductor light emitting device according to a first embodiment. [Diagram 2]2 is a perspective view of the semiconductor light emitting device of FIG. 1 as viewed from a different direction. [Diagram 3] FIG. 2 is a plan view of the semiconductor light emitting device of FIG. [Figure 4] FIG. 2 is a rear view of the semiconductor light emitting device of FIG. [Diagram 5] FIG. 2 is a side view of the semiconductor light emitting device of FIG. [Figure 6] 6 is a side view of the semiconductor light emitting device of FIG. 1, seen from the opposite side to FIG. 5. [Figure 7] 7 is a side view of the semiconductor light emitting device of FIG. 1, seen from a direction different from that of FIGS. 5 and 6. [Figure 8] 2 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 1. [Figure 9] 2 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 1. [Figure 10] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 11] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 12] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 13] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 14] FIG. 13 is a side view of a state in which the semiconductor light emitting device of the comparative example is mounted on a circuit board. [Figure 15] 1 is a side view of a state in which the semiconductor light emitting device of the first embodiment is mounted on a circuit board. [Figure 16] FIG. 11 is a plan view of a semiconductor light emitting device according to a second embodiment. [Figure 17] FIG. 17 is a rear view of the semiconductor light emitting device of FIG. [Figure 18] FIG. 17 is a side view of the semiconductor light emitting device of FIG. [Figure 19] 17 is a side view of the semiconductor light emitting device of FIG. 16, seen from the opposite side to FIG. 18. [Figure 20] 17 is a side view of the semiconductor light emitting device of FIG. 16, seen from a direction different from that of FIGS. 18 and 19. [Figure 21] 17 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 16. [Figure 22] 17 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 16. [Diagram 23] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 24] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Diagram 25] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 26] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 27] FIG. 13 is a plan view of a semiconductor light emitting device according to a third embodiment. [Figure 28] FIG. 28 is a rear view of the semiconductor light emitting device of FIG. [Figure 29] FIG. 28 is a side view of the semiconductor light emitting device of FIG. 27. [Diagram 30] 29 is a side view of the semiconductor light emitting device of FIG. 27, seen from the opposite side to FIG. 29. [Diagram 31] 31 is a side view of the semiconductor light emitting device of FIG. 27, seen from a direction different from that of FIGS. 29 and 30. FIG. [Diagram 32] 28 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 27. [Diagram 33] 28 is a plan view showing an example of a structure within a multilayer substrate of the semiconductor light emitting device of FIG. 27. [Diagram 34] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Diagram 35] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Diagram 36] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 37] 1A to 1C are explanatory diagrams illustrating an example of a manufacturing process for a multilayer board. [Figure 38] FIG. 11 is a plan view of a semiconductor light emitting device according to a modified example. [Figure 39] FIG. 11 is a plan view of a semiconductor light emitting device according to a modified example. [Diagram 40] FIG. 11 is a side view of a semiconductor light emitting device according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of a semiconductor light emitting device will be described with reference to the drawings. The embodiments shown below are intended to illustrate configurations and methods for embodying the technical ideas, and are not intended to limit the materials, shapes, structures, arrangements, dimensions, etc. of each component to those described below.

[0011] [First embodiment] A semiconductor light emitting device 1 according to a first embodiment will be described with reference to FIGS. 1 and 2, the semiconductor light emitting device 1 is mounted on a circuit board P10 with a conductive bonding material SD such as solder. The semiconductor light emitting device 1 is a side-emission type (side-view type) semiconductor light emitting device whose optical axis is parallel to an upper surface P11 of the circuit board P10.

[0012] 1, the semiconductor light emitting device 1 includes a multilayer substrate 10, semiconductor light emitting elements 60A, 60B mounted on the multilayer substrate 10, wires WA, WB1, WB2 connected to the semiconductor light emitting elements 60A, 60B, and a sealing resin 70 that seals the semiconductor light emitting elements 60A, 60B and the wires WA, WB1, WB2. The semiconductor light emitting elements 60A, 60B are, for example, light emitting diode (LED) elements. Note that light emitting elements such as laser diodes (LD) may be used as the semiconductor light emitting elements 60A, 60B.

[0013] The multilayer substrate 10 is formed in a rectangular plate shape. In the following description, the thickness direction of the multilayer substrate 10 is defined as the z direction, and two directions perpendicular to the z direction are defined as the x direction and the y direction, respectively. Therefore, in the following description, "viewed from the z direction" means "viewed from the thickness direction of the multilayer substrate 10," and "in the z direction" means "in the thickness direction of the multilayer substrate 10."

[0014] 3, the shape of the multilayer substrate 10 when viewed from the z direction is a rectangle having long and short sides. The multilayer substrate 10 is arranged such that the long sides run along the y direction and the short sides run along the x direction. In this embodiment, the thickness (dimension in the z direction) of the multilayer substrate 10 is about 0.6 mm, the dimension of the multilayer substrate 10 in the long side direction (y direction) is about 1.6 mm, and the dimension of the multilayer substrate 10 in the short side direction (x direction) is about 0.8 mm.

[0015] As shown in Figs. 1 to 4, the multilayer substrate 10 has a main surface 11 facing in the z direction, a back surface 12 facing the opposite side to the main surface 11 in the z direction, a mounting surface 13 and a non-mounting surface 14 intersecting both the main surface 11 and the back surface 12, and a first side surface 15 and a second side surface 16 intersecting the main surface 11, the back surface 12, the mounting surface 13, and the non-mounting surface 14. In this embodiment, the mounting surface 13 faces in the x direction. The non-mounting surface 14 faces the opposite side to the mounting surface 13 in the x direction. The first side surface 15 faces in the y direction. The second side surface 16 faces the opposite side to the first side surface 15 in the y direction.

[0016] The mounting surface 13 is a surface that faces the upper surface P11 when the semiconductor light emitting device 1 is mounted on the upper surface P11 of the circuit board P10. The mounting surface 13 and the anti-mounting surface 14 are both end surfaces in the x direction of the multilayer board 10. The mounting surface 13 and the anti-mounting surface 14 are flat surfaces along the y direction and the z direction, respectively, and are rectangular in shape with the long side direction in the y direction and the short side direction in the z direction.

[0017] The first side surface 15 and the second side surface 16 are disposed between the mounting surface 13 and the anti-mounting surface 14, and are side surfaces that connect the mounting surface 13 and the anti-mounting surface 14 in the x direction. The first side surface 15 and the second side surface 16 are both end surfaces in the y direction of the multilayer substrate 10. The first side surface 15 and the second side surface 16 are flat surfaces that extend along the x direction and the z direction, and in this embodiment, each has a rectangular shape whose long side direction is in the x direction and whose short side direction is in the z direction.

[0018] 3, a wiring layer 20 is formed on the main surface 11. The wiring layer 20 is composed of a metal layer such as Cu (copper) and a plating layer such as Ag (silver) or Au (gold). The wiring layer 20 includes a plating layer that covers the portion exposed from the sealing resin 70. This plating layer is, for example, Sn (tin) or the like.

[0019] The wiring layer 20 has a first wiring 21, a second wiring 22, a third wiring 23, and a fourth wiring 24. The first wiring 21, the second wiring 22, the third wiring 23, and the fourth wiring 24 are arranged apart from each other.

[0020] The first wiring 21 is a wiring on which both the semiconductor light emitting elements 60A, 60B are mounted. When viewed from the z direction, the first wiring 21 is disposed at a position spaced apart from the mounting surface 13. Also, when viewed from the z direction, the first wiring 21 is disposed at a position spaced apart from the second side surface 16.

[0021] The first wiring 21 has a first mounting portion 21a on which the semiconductor light emitting element 60A is mounted, a second mounting portion 21b on which the semiconductor light emitting element 60B is mounted, and a connection wiring portion 21c for connecting to an external electrode 50 described later. In this embodiment, the first mounting portion 21a, the second mounting portion 21b, and the connection wiring portion 21c are integrated. Note that the first mounting portion 21a and the second mounting portion 21b may be formed separately. In this case, the second mounting portion 21b is disposed apart from the first mounting portion 21a.

[0022] The first mounting portion 21a is disposed closer to the mounting surface 13 than the center in the x direction of the main surface 11 and closer to the second side surface 16 than the center in the y direction of the main surface 11. Therefore, the semiconductor light emitting element 60A mounted on the first mounting portion 21a is disposed closer to the mounting surface 13 than the center in the x direction of the main surface 11 and closer to the second side surface 16 than the center in the y direction of the main surface 11.

[0023] The second mounting portion 21b is disposed so as to be closer to the anti-mounting surface 14 than the center in the x direction of the main surface 11 and to straddle the center in the y direction of the main surface 11. Therefore, the semiconductor light emitting element 60B mounted on the second mounting portion 21b is disposed so as to be closer to the anti-mounting surface 14 than the center in the x direction of the main surface 11 and to straddle the center in the y direction of the main surface 11.

[0024] The connection wiring portion 21c is disposed at a position aligned with the first mounting portion 21a in the x direction and closer to the second side surface 16 than the first mounting portion 21a in the y direction. It can also be said that the connection wiring portion 21c is disposed at a corner that is closer to the mounting surface 13 and closer to the second side surface 16 among the four corners of the main surface 11 when viewed from the z direction.

[0025] The second wiring 22 is a wiring electrically connected to the semiconductor light emitting element 60A. The second wiring 22 is disposed closer to the first side surface 15 than the first mounting portion 21a in the y direction. The second wiring 22 is disposed so that its edge on the mounting surface 13 side is aligned with the edge of the first wiring 21 on the mounting surface 13 side. When viewed from the z direction, the second wiring 22 is disposed at a position away from the mounting surface 13. Also, when viewed from the z direction, the second wiring 22 is disposed at a position away from the first side surface 15.

[0026] The second wiring 22 has a wire connecting portion 22a and a connection wiring portion 22b for connecting to the external electrode 50. In this embodiment, the wire connecting portion 22a and the connection wiring portion 22b are integrated. The wire connecting portion 22a is formed closer to the first mounting portion 21a than the connection wiring portion 22b. It can also be said that the connection wiring portion 22b is disposed at a corner of the main surface 11 that is closer to the mounting surface 13 and closer to the first side surface 15, among the four corners of the main surface 11, as viewed from the z direction.

[0027] Both the third wiring 23 and the fourth wiring 24 are wirings that are electrically connected to the semiconductor light emitting element 60B. Both the third wiring 23 and the fourth wiring 24 are arranged closer to the non-mounting surface 14 than the center in the x direction of the main surface 11 of the multilayer substrate 10. The third wiring 23 and the fourth wiring 24 are arranged distributed on both sides of the second mounting portion 21b of the first wiring 21 in the y direction.

[0028] The third wiring 23 is disposed closer to the second side surface 16 than the second mounting portion 21b. The third wiring 23 has a main body portion 23a and a wire connection portion 23b protruding from the main body portion 23a.

[0029] The main body portion 23a is disposed at one of the four corners of the main surface 11, which is closer to the anti-mounting surface 14 and closer to the second side surface 16. When viewed from the z direction, the edge of the main body portion 23a in the y direction that is closer to the second side surface 16 is formed at the same position as the second side surface 16. When viewed from the z direction, the edge of the main body portion 23a in the x direction that is closer to the anti-mounting surface 14 is formed at the same position as the anti-mounting surface 14. The wire connection portion 23b is disposed closer to the second mounting portion 21b than the main body portion 23a.

[0030] The fourth wiring 24 is disposed closer to the first side surface 15 than the second mounting portion 21b. The fourth wiring 24 has a main body portion 24a and a wire connection portion 24b protruding from the main body portion 24a.

[0031] The main body portion 24a is disposed at one of the four corners of the main surface 11, which is closer to the anti-mounting surface 14 and closer to the first side surface 15. When viewed from the z direction, the edge of the main body portion 24a in the y direction that is closer to the first side surface 15 is formed at the same position as the first side surface 15. When viewed from the z direction, the edge of the main body portion 24a in the x direction that is closer to the anti-mounting surface 14 is formed at the same position as the anti-mounting surface 14. The wire connection portion 24b is disposed closer to the second mounting portion 21b than the main body portion 24a.

[0032] As shown in FIG. 3 and FIG. 5, the semiconductor light emitting element 60A is mounted on the first mounting portion 21a by a conductive bonding material SD1 such as solder or Ag paste. The semiconductor light emitting element 60A has an element main surface 60As and an element back surface 60Ar that face opposite each other in the z direction. A first electrode 61A is formed on the element main surface 60As, and a second electrode 62A is formed on the element back surface 60Ar. The semiconductor light emitting element 60A is a light emitting element that emits, for example, yellow light. The semiconductor light emitting element 60A is arranged so that the element main surface 60As faces the same side as the main surface 11. Therefore, the element back surface 60Ar and the first mounting portion 21a are bonded by the conductive bonding material SD1. As a result, the second electrode 62A and the first wiring 21 are electrically connected. In other words, it can be said that the first wiring 21 is a wiring that is electrically connected to the semiconductor light emitting element 60A. The element main surface 60As constitutes the light emitting surface of the semiconductor light emitting element 60A. A wire WA is connected to the first electrode 61A. The wire WA is connected to the wire connection portion 22a of the second wiring 22. As a result, the first electrode 61A and the second wiring 22 are electrically connected to each other.

[0033] 3 and 6, the semiconductor light emitting element 60B is mounted on the second mounting portion 21b by a conductive bonding material SD1. The semiconductor light emitting element 60B may be mounted on the second mounting portion 21b by a non-conductive bonding material, i.e., a bonding material having electrical insulation properties, instead of the conductive bonding material SD1. An example of such a bonding material is an adhesive containing an epoxy resin.

[0034] The semiconductor light emitting element 60B has an element principal surface 60Bs and an element back surface 60Br facing opposite directions in the z direction. Both a first electrode 61B and a second electrode 62B are formed on the element principal surface 60Bs. The semiconductor light emitting element 60B is a light emitting element that emits blue light, for example. The semiconductor light emitting element 60B is arranged so that the element principal surface 60Bs faces the same side as the principal surface 11. For this reason, the element back surface 60Br and the second mounting portion 21b are joined by the conductive bonding material SD1. The element principal surface 60Bs constitutes the light emitting surface of the semiconductor light emitting element 60B.

[0035] A wire WB1 is connected to the first electrode 61B, and a wire WB2 is connected to the second electrode 62B. The wire WB1 is connected to the wire connection portion 23b of the third wiring 23. This electrically connects the first electrode 61B and the third wiring 23. The wire WB2 is connected to the wire connection portion 24b of the fourth wiring 24. This electrically connects the second electrode 62B and the fourth wiring 24.

[0036] Each of the wires WA, WB1, and WB2 is made of a metal material such as Au, Al (aluminum), Cu, or Ag, and is, for example, a bonding wire formed by a wire bonding device.

[0037] As shown in FIG. 3, FIG. 5, and FIG. 6, the sealing resin 70 is formed on the main surface 11 of the multilayer substrate 10. The sealing resin 70 is made of, for example, a transparent or semi-transparent resin material having electrical insulation properties, and is made of a transparent epoxy resin in this embodiment. The sealing resin 70 in this embodiment is located inward from the first side surface 15 and the second side surface 16 in the y direction. The shape of the sealing resin 70 as viewed from the x direction is trapezoidal. Of both resin surfaces of the sealing resin 70 facing the x direction, the surface facing the same side as the mounting surface 13 is flush with the mounting surface 13. Of both resin surfaces of the sealing resin 70 facing the x direction, the surface facing the same side as the non-mounting surface 14 is flush with the non-mounting surface 14.

[0038] As shown in Fig. 4, an external electrode 50 is formed on the back surface 12. The external electrode 51 has a laminated structure of a metal layer of, for example, Au, Cu, Ag, Ni (nickel), or the like, and a plating layer of, for example, Sn, or the like, formed on the metal layer. For this reason, the thickness of the external electrode 50 may be thicker than the thickness of the wiring layer 20. The plating layer is formed by, for example, electrolytic plating.

[0039] The external electrode 50 is made up of a plurality of external electrodes, namely, a first external electrode 51, a second external electrode 52, a third external electrode 53, and a fourth external electrode 54. In other words, a plurality of external electrodes are provided. The external electrodes 51 to 54 are arranged in the x direction, spaced apart from each other in the y direction. In this embodiment, the first external electrode 51, the second external electrode 52, the third external electrode 53, and the fourth external electrode 54 are arranged in this order from the first side surface 15 to the second side surface 16. The shape of each of the external electrodes 51 to 54 as viewed from the rear surface 12 is a substantially rectangular shape with the long side direction being in the x direction and the short side direction being in the y direction. As viewed from the z direction, the edge closer to the mounting surface 13 among both ends of the x direction of each of the external electrodes 51 to 54 is formed at the same position as the mounting surface 13. As viewed from the z direction, the edge closer to the first side surface 15 among both ends of the first external electrode 51 in the x direction is formed at the same position as the first side surface 15. As viewed from the z direction, the edge closer to the second side surface 16 among both ends of the fourth external electrode 54 in the x direction is formed at the same position as the second side surface 16.

[0040] The first external electrode 51 is an external electrode electrically connected to the second wiring 22. The second external electrode 52 is an external electrode electrically connected to the fourth wiring 24. The third external electrode 53 is an external electrode electrically connected to the third wiring 23. The fourth external electrode 54 is an external electrode electrically connected to the first wiring 21. In this manner, the first external electrode 51 and the fourth external electrode 54 are electrically connected to the semiconductor light emitting element 60A. The second external electrode 52 and the third external electrode 53 are electrically connected to the semiconductor light emitting element 60B.

[0041] 4, a connection wiring portion 55 is formed on the back surface 12. The connection wiring portion 55 has a first wiring portion 55a extending along the y direction and a second wiring portion 55b branching from the first wiring portion 55a and extending in the x direction. The second wiring portion 55b is connected to the fourth external electrode 54. The connection wiring portion 55 forms a conductive path for performing electrolytic plating to form a plating layer of the fourth external electrode 54.

[0042] A resist layer 56 is provided on a part of the connection wiring portion 55. The resist layer 56 is provided to distinguish the polarity of the semiconductor light emitting device 1 (the connection direction of the semiconductor light emitting device 1), and has an asymmetric shape when viewed from the z direction. The resist layer 56 prevents the conductive bonding material SD from creeping up from each of the external electrodes 51 to 54 toward the non-mounting surface 14 when the semiconductor light emitting device 1 is mounted on the circuit board P10. This prevents the first wiring portion 55a from being electrically connected to the outer conductive exposed portion 35ra, which will be described later, by the conductive bonding material SD. In this embodiment, the resist layer 56 is formed so as to cover a part of the first wiring portion 55a and the second wiring portion 55b.

[0043] The resist layer 56 is made of an electrically insulating material, and is formed, for example, by curing a film-like resist applied to the rear surface 12. Note that the resist layer 56 may be made of a liquid resist.

[0044] Next, the detailed configuration of the multilayer substrate 10 will be described. As shown in Figures 5 and 6, the multilayer substrate 10 has a plurality of substrates and a conductive layer. In one example, the multilayer substrate 10 has a first substrate 10A, a second substrate 10B, and a third substrate 10C, and a conductive layer 30 formed at least one between the first substrate 10A and the third substrate 10C and between the third substrate 10C and the second substrate 10B. In this embodiment, the conductive layer 30 is formed both between the first substrate 10A and the third substrate 10C and between the third substrate 10C and the second substrate 10B.

[0045] Each of the first substrate 10A, the second substrate 10B, and the third substrate 10C is made of an electrically insulating material, such as an epoxy resin or an acrylic resin. In this embodiment, each of the substrates 10A to 10C is made of an epoxy resin. The first substrate 10A, the second substrate 10B, and the third substrate 10C are stacked in the z direction. The third substrate 10C is disposed between the first substrate 10A and the second substrate 10B in the z direction, which is the stacking direction. In this embodiment, the thickness (dimension in the z direction) of the third substrate 10C is thicker than the thickness of the first substrate 10A and the thickness of the second substrate 10B. The thickness of the first substrate 10A and the thickness of the second substrate 10B are equal to each other. The thickness of each of the substrates 10A to 10C can be changed arbitrarily. For example, the thickness of the first substrate 10A and the thickness of the second substrate 10B may be different from each other. The third substrate 10C may be made of a plurality of substrates having an electrically insulating property and stacked.

[0046] The conductive layer 30 is a layer constituting a part of the conductive path connecting the wiring layer 20 and the external electrode 50, and is made of, for example, Cu. The conductive layer 30 has a first conductive layer 31 formed between the first base material 10A and the third base material 10C, and a second conductive layer 32 formed between the second base material 10B and the third base material 10C. Each of the conductive layers 31, 32 is disposed at a position spaced apart from both the main surface 11 and the back surface 12 of the multilayer substrate 10 in the z direction.

[0047] The multilayer substrate 10 also has a main surface side connection electrode 41 (see FIG. 3) that connects the wiring layer 20 and the first conductive layer 31, an intermediate connection electrode 42 (see FIG. 8) that connects the first conductive layer 31 and the second conductive layer 32, and a back surface side connection electrode 43 (see FIG. 9) that connects the second conductive layer 32 and the external electrode 50. The main surface side connection electrode 41 penetrates the first base material 10A in the z direction and is made of, for example, a via. The intermediate connection electrode 42 penetrates the third base material 10C in the z direction and is made of, for example, a through hole. The back surface side connection electrode 43 penetrates the second base material 10B and is made of, for example, a via. These connection electrodes 41 to 43 are made of, for example, Cu. The intermediate connection electrode 42 that is made of a through hole includes a cylindrical conductive film (for example, a Cu plating film) formed on the inner circumferential surface of a through hole that penetrates the third base material 10C. Furthermore, the intermediate connection electrode 42 may be a cylindrical conductive film having a hollow interior, and the hollow interior may be filled with resin or a metal such as Cu.

[0048] 8 shows the positional relationship between the first conductive layer 31 and the intermediate connection electrode 42 formed on the third base material 10C, and the wiring layer 20 and the main surface side connection electrode 41. For convenience, the wiring layer 20 and the main surface side connection electrode 41 are indicated by two-dot chain lines.

[0049] 8, the first conductive layer 31 is formed on the main surface of the third base material 10C. The first conductive layer 31 has a first main surface side wiring 31A connected to the first wiring 21, a second main surface side wiring 31B connected to the second wiring 22, a third main surface side wiring 31C connected to the third wiring 23, and a fourth main surface side wiring 31D connected to the fourth wiring 24.

[0050] As indicated by the two-dot chain line in Fig. 8, a plurality of (four in this embodiment) main surface side connection electrodes 41 are provided to individually connect each of the main surface side wirings 31A to 31D to each of the wirings 21 to 24. Also, as indicated by the dashed line in Fig. 8, a plurality of (four in this embodiment) intermediate connection electrodes 42 are provided to individually connect each of the main surface side wirings 31A to 31D. In this embodiment, the shape of each of the main surface side connection electrode 41 and the intermediate connection electrode 42 is circular when viewed from the z direction.

[0051] In this embodiment, when viewed from the z direction, each of the main surface side connection electrodes 41 is disposed inside the outer periphery of the multilayer substrate 10. Therefore, each of the main surface side connection electrodes 41 is not exposed from the multilayer substrate 10 when viewed from the x direction and the y direction, i.e., when viewed from the side of the multilayer substrate 10. Furthermore, when viewed from the z direction, each of the intermediate connection electrodes 42 is disposed inside the outer periphery of the multilayer substrate 10. Therefore, each of the intermediate connection electrodes 42 is not exposed from the multilayer substrate 10 when viewed from the side of the multilayer substrate 10.

[0052] When viewed from the z direction, the first main surface side wiring 31A is disposed at a position overlapping with the first wiring 21. More specifically, when viewed from the z direction, the first main surface side wiring 31A is disposed at a position overlapping with the connection wiring portion 21c of the first wiring 21. The first main surface side wiring 31A and the connection wiring portion 21c are connected by a main surface side connection electrode 41.

[0053] When viewed from the z direction, of both end edges in the x direction of the first principal surface side wiring 31A, the edge closer to the mounting surface 13 is formed at the same position as the mounting surface 13. In other words, as shown in Fig. 5, the first principal surface side wiring 31A is exposed from the mounting surface 13. The first principal surface side wiring 31A has an outer conductive exposed portion 33s exposed from the mounting surface 13.

[0054] When viewed from the z direction, the edge closer to the second side surface 16 of both ends of the first main surface side wiring 31A in the y direction is formed at the same position as the second side surface 16. That is, the outer conductive exposed portion 33s is also exposed from the second side surface 16. The outer conductive exposed portion 33s is continuously exposed from the multilayer substrate 10 from the second side surface 16 to the mounting surface 13. That is, the part of the outer conductive exposed portion 33s exposed from the mounting surface 13 and the part exposed from the second side surface 16 are connected. Therefore, when viewed from the mounting surface 13, the outer conductive exposed portion 33s extends along the y direction from the edge closer to the second side surface 16 of both ends of the mounting surface 13 in the y direction. Also, when viewed from the second side surface 16, the outer conductive exposed portion 33s extends along the x direction from the edge closer to the mounting surface 13 of both ends of the second side surface 16. In this embodiment, the portion of the outer conductive exposed portion 33s exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0055] The first principal surface side wiring 31A is connected to an intermediate connection electrode 42. In this embodiment, the principal surface side connection electrode 41 connected to the first principal surface side wiring 31A and the intermediate connection electrode 42 are arranged to partially overlap each other when viewed from the z direction.

[0056] When viewed from the z direction, the second main surface side wiring 31B is disposed at a position overlapping with the second wiring 22. More specifically, when viewed from the z direction, the second main surface side wiring 31B is disposed at a position overlapping with the connection wiring portion 22b of the second wiring 22. The second main surface side wiring 31B and the connection wiring portion 22b are connected by a main surface side connection electrode 41. In this embodiment, the shape of the second main surface side wiring 31B when viewed from the z direction is line-symmetrical to the first main surface side wiring 31A with respect to a virtual line extending along the x direction at the center in the y direction of the third base material 10C.

[0057] As viewed from the z direction, of both end edges in the x direction of the second main surface side wiring 31B, the edge closer to the mounting surface 13 is formed at the same position as the mounting surface 13. In other words, as shown in Fig. 5, the second main surface side wiring 31B is exposed from the mounting surface 13. The second main surface side wiring 31B has an outer conductive exposed portion 34s exposed from the mounting surface 13.

[0058] As shown in FIG. 8, when viewed from the z direction, the edge closer to the first side surface 15 of both ends of the second main surface side wiring 31B in the y direction is formed at the same position as the first side surface 15. That is, the outer conductive exposed portion 34s is also exposed from the first side surface 15. The outer conductive exposed portion 34s is continuously exposed from the multilayer substrate 10 from the first side surface 15 to the mounting surface 13. That is, the part of the outer conductive exposed portion 34s exposed from the mounting surface 13 and the part exposed from the first side surface 15 are connected. Therefore, when viewed from the mounting surface 13, the outer conductive exposed portion 34s extends along the y direction from the edge closer to the first side surface 15 of both ends of the mounting surface 13 in the y direction. Also, when viewed from the first side surface 15, the outer conductive exposed portion 34s extends along the x direction from the edge closer to the mounting surface 13 of both ends of the first side surface 15. In this embodiment, the portion of the outer conductive exposed portion 34s exposed from the first side surface 15 corresponds to the side surface exposed portion.

[0059] The second principal surface side wiring 31B is connected to an intermediate connection electrode 42. In this embodiment, the principal surface side connection electrode 41 connected to the second principal surface side wiring 31B and the intermediate connection electrode 42 are arranged to partially overlap each other when viewed from the z direction.

[0060] When viewed from the z direction, the third main surface side wiring 31C is disposed at a position overlapping with the third wiring 23. The third main surface side wiring 31C has a connection wiring portion 31Ca overlapping with the third wiring 23 when viewed from the z direction, and an extension portion 31Cb extending from the connection wiring portion 31Ca toward the mounting surface 13. In this embodiment, the connection wiring portion 31Ca and the extension portion 31Cb are integrated. The extension portion 31Cb is disposed at a position not overlapping with the third wiring 23 when viewed from the z direction. The connection wiring portion 31Ca and the third wiring 23 are connected by a main surface side connection electrode 41.

[0061] As viewed from the z direction, of both end edges in the x direction of the connection wiring portion 31Ca, the edge closer to the non-mounting surface 14 is formed at the same position as the non-mounting surface 14. That is, as shown in Fig. 6, the third main surface side wiring 31C is exposed from the non-mounting surface 14. The third main surface side wiring 31C has an outer conductive exposed portion 35sa exposed from the non-mounting surface 14. In this embodiment, the outer conductive exposed portion 35sa corresponds to the opposite side conductive exposed portion.

[0062] As shown in FIG. 8, when viewed from the z direction, the edge closer to the second side surface 16 of both ends of the connection wiring portion 31Ca in the y direction is formed at the same position as the second side surface 16. That is, the outer conductive exposed portion 35sa is also exposed from the second side surface 16. The outer conductive exposed portion 35sa is continuously exposed from the multilayer substrate 10 from the second side surface 16 to the non-mounting surface 14. That is, the part of the outer conductive exposed portion 35sa exposed from the non-mounting surface 14 and the part exposed from the second side surface 16 are connected. Therefore, when viewed from the non-mounting surface 14, the outer conductive exposed portion 35sa extends along the y direction from the edge closer to the second side surface 16 of both ends of the non-mounting surface 14 in the y direction. Also, when viewed from the second side surface 16, the outer conductive exposed portion 35sa extends along the x direction from the edge closer to the non-mounting surface 14 of both ends of the second side surface 16 in the x direction. In this embodiment, the portion of the outer conductive exposed portion 35sa that is exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0063] The connection wiring portion 31Ca is connected to an intermediate connection electrode 42. In this embodiment, the main surface side connection electrode 41 and the intermediate connection electrode 42 connected to the connection wiring portion 31Ca are arranged so as not to overlap with each other when viewed from the z direction.

[0064] When viewed from the z direction, the tip edge of the extension portion 31Cb is formed at the same position as the mounting surface 13. That is, as shown in FIG. 5, the third principal surface side wiring 31C is exposed from the mounting surface 13. The third principal surface side wiring 31C has an inner conductive exposed portion 35sb exposed from the mounting surface 13. The inner conductive exposed portion 35sb is disposed between the outer conductive exposed portion 33s of the first principal surface side wiring 31A and the outer conductive exposed portion 34s of the second principal surface side wiring 31B in the y direction. The inner conductive exposed portion 35sb is disposed closer to the outer conductive exposed portion 33s than to the center of the multilayer substrate 10 in the y direction.

[0065] When viewed from the z direction, the fourth main surface side wiring 31D is arranged at a position where it overlaps with the fourth wiring 24. In this embodiment, the shape of the fourth main surface side wiring 31D when viewed from the z direction is a shape that is line-symmetrical with the third main surface side wiring 31C with respect to a virtual line extending along the x direction at the center of the y direction of the second base material 10B. The fourth main surface side wiring 31D has a connection wiring portion 31Da that overlaps with the fourth wiring 24 when viewed from the z direction, and an extension portion 31Db that extends from the connection wiring portion 31Da toward the mounting surface 13. In this embodiment, the connection wiring portion 31Da and the extension portion 31Db are integrated. The extension portion 31Db is arranged at a position where it does not overlap with the fourth wiring 24 when viewed from the z direction. The connection wiring portion 31Da and the fourth wiring 24 are connected by the main surface side connection electrode 41.

[0066] As viewed from the z direction, of both end edges in the x direction of the connection wiring portion 31Da, the edge closer to the non-mounting surface 14 is formed at the same position as the non-mounting surface 14. That is, as shown in Fig. 6, the fourth main surface side wiring 31D is exposed from the non-mounting surface 14. The fourth main surface side wiring 31D has an outer conductive exposed portion 36sa exposed from the non-mounting surface 14. In this embodiment, the outer conductive exposed portion 36sa corresponds to the opposite side conductive exposed portion.

[0067] As shown in FIG. 8, when viewed from the z direction, the edge closer to the first side surface 15 of both ends of the connection wiring portion 31Da in the y direction is formed at the same position as the first side surface 15. That is, the outer conductive exposed portion 36sa is also exposed from the first side surface 15. The outer conductive exposed portion 36sa is continuously exposed from the multilayer substrate 10 from the first side surface 15 to the non-mounting surface 14. That is, the part of the outer conductive exposed portion 36sa exposed from the non-mounting surface 14 and the part exposed from the first side surface 15 are connected. Therefore, when viewed from the non-mounting surface 14, the outer conductive exposed portion 36sa extends along the y direction from the edge closer to the first side surface 15 of both ends of the non-mounting surface 14 in the y direction. Also, when viewed from the first side surface 15, the outer conductive exposed portion 36sa extends along the x direction from the edge closer to the non-mounting surface 14 of both ends of the first side surface 15 in the x direction. In this embodiment, the portion of the outer conductive exposed portion 35sa that is exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0068] The connection wiring portion 31Da is connected to an intermediate connection electrode 42. In this embodiment, the main surface side connection electrode 41 and the intermediate connection electrode 42 connected to the connection wiring portion 31Da are arranged so as not to overlap with each other when viewed from the z direction.

[0069] When viewed from the z direction, the tip edge of the extension portion 31Db is formed at the same position as the mounting surface 13. That is, as shown in FIG. 5, the fourth main surface side wiring 31D is exposed from the mounting surface 13. The fourth main surface side wiring 31D has an inner conductive exposed portion 36sb exposed from the mounting surface 13. The inner conductive exposed portion 36sb is disposed between the outer conductive exposed portion 33s of the first main surface side wiring 31A and the outer conductive exposed portion 34s of the second main surface side wiring 31B in the y direction. The inner conductive exposed portion 36sb is disposed closer to the outer conductive exposed portion 34s than the center of the multilayer substrate 10 in the y direction.

[0070] Fig. 9 shows the positional relationship between the second conductive layer 32 and intermediate connection electrode 42 formed on the third base material 10C, and the external electrode 50 and back surface side connection electrode 43. For convenience, in Fig. 9, the second conductive layer 32 and intermediate connection electrode 42 are indicated by solid lines, the first conductive layer 31 is indicated by two-dot chain lines, and the external electrode 50 and back surface side connection electrode 43 are indicated by dashed lines.

[0071] The second conductive layer 32 is formed on the back surface of the third base material 10C (see FIG. 8). For convenience, FIG. 9 shows a state in which the second conductive layer 32 is disposed on the main surface of the second base material 10B. As shown in FIG. 9, the second conductive layer 32 has a first back surface side wiring 32A connected to the first main surface side wiring 31A, a second back surface side wiring 32B connected to the second main surface side wiring 31B, a third back surface side wiring 32C connected to the third main surface side wiring 31C, and a fourth back surface side wiring 32D connected to the fourth main surface side wiring 31D.

[0072] 9, a plurality of (four in this embodiment) back surface side connection electrodes 43 are provided so as to individually connect each of the back surface side wirings 32A to 32D to each of the external electrodes 51 to 54. Also, the plurality of intermediate connection electrodes 42 are individually connected to each of the back surface side wirings 32A to 32D. That is, the plurality of intermediate connection electrodes 42 individually connect each of the main surface side wirings 31A to 31D to each of the back surface side wirings 32A to 32D. In this embodiment, the shape of the back surface side connection electrode 43 when viewed from the z direction is circular.

[0073] In this embodiment, when viewed from the z direction, each back surface side connection electrode 43 is disposed inside the outer periphery of the multilayer substrate 10. Therefore, each back surface side connection electrode 43 is not exposed from the multilayer substrate 10 when viewed from the side of the multilayer substrate 10.

[0074] When viewed from the z direction, the first back surface side wiring 32A is disposed at a position overlapping the first main surface side wiring 31A. The first back surface side wiring 32A and the first main surface side wiring 31A are connected by an intermediate connection electrode 42. When viewed from the z direction, the first back surface side wiring 32A is disposed at a position overlapping the fourth external electrode 54. The first back surface side wiring 32A and the fourth external electrode 54 are connected by a back surface side connection electrode 43. In this way, the first wiring 21 is electrically connected to the fourth external electrode 54 via the main surface side connection electrode 41, the first main surface side wiring 31A, the intermediate connection electrode 42, the first back surface side wiring 32A, and the back surface side connection electrode 43.

[0075] As viewed from the z direction, of both end edges in the x direction of the first back surface side wiring 32A, the edge closer to the mounting surface 13 is formed at the same position as the mounting surface 13. In other words, as shown in Fig. 5, the first back surface side wiring 32A is exposed from the mounting surface 13. The first back surface side wiring 32A has an outer conductive exposed portion 33r exposed from the mounting surface 13.

[0076] When viewed from the z direction, the edge closer to the second side surface 16 of both ends of the first back surface side wiring 32A in the y direction is formed at the same position as the second side surface 16. That is, the outer conductive exposed portion 33r is also exposed from the second side surface 16. The outer conductive exposed portion 33r is continuously exposed from the multilayer substrate 10 from the second side surface 16 to the mounting surface 13. That is, the part of the outer conductive exposed portion 33r exposed from the mounting surface 13 and the part exposed from the second side surface 16 are connected. Therefore, when viewed from the mounting surface 13, the outer conductive exposed portion 33r extends along the y direction from the edge closer to the second side surface 16 of both ends of the mounting surface 13 in the y direction. Also, when viewed from the second side surface 16, the outer conductive exposed portion 33r extends along the x direction from the edge closer to the mounting surface 13 of both ends of the second side surface 16. In this embodiment, the portion of the outer conductive exposed portion 33r that is exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0077] When viewed from the z direction, the second back surface side wiring 32B is disposed at a position overlapping with the second main surface side wiring 31B. The second back surface side wiring 32B and the second main surface side wiring 31B are connected by an intermediate connection electrode 42. When viewed from the z direction, the second back surface side wiring 32B is disposed at a position overlapping with the first external electrode 51. The second back surface side wiring 32B and the first external electrode 51 are connected by a back surface side connection electrode 43. In this manner, the second wiring 22 is electrically connected to the second external electrode 52 via the main surface side connection electrode 41, the second main surface side wiring 31B, the intermediate connection electrode 42, the second back surface side wiring 32B, and the back surface side connection electrode 43.

[0078] In this embodiment, the shape of the second back surface side wiring 32B when viewed from the z direction is line-symmetric to the first back surface side wiring 32A with respect to a virtual line extending along the x direction at the center in the y direction of the second base material 10B (multilayer substrate 10).

[0079] As viewed from the z direction, of both end edges in the x direction of the second back surface side wiring 32B, the edge closer to the mounting surface 13 is formed at the same position as the mounting surface 13. In other words, as shown in Fig. 5, the second back surface side wiring 32B is exposed from the mounting surface 13. The second back surface side wiring 32B has an outer conductive exposed portion 34r exposed from the mounting surface 13.

[0080] When viewed from the z direction, the edge closer to the first side surface 15 of both ends of the second back surface side wiring 32B in the y direction is formed at the same position as the first side surface 15. That is, the outer conductive exposed portion 34r is also exposed from the first side surface 15. The outer conductive exposed portion 34r is continuously exposed from the multilayer substrate 10 from the first side surface 15 to the mounting surface 13. That is, the part of the outer conductive exposed portion 34r exposed from the mounting surface 13 and the part exposed from the first side surface 15 are connected. Therefore, when viewed from the mounting surface 13, the outer conductive exposed portion 34r extends along the y direction from the edge closer to the first side surface 15 of both ends of the mounting surface 13 in the y direction. Also, when viewed from the first side surface 15, the outer conductive exposed portion 34r extends along the x direction from the edge closer to the mounting surface 13 of both ends of the first side surface 15. In this embodiment, the portion of the outer conductive exposed portion 34r that is exposed from the first side surface 15 corresponds to the side surface exposed portion.

[0081] When viewed from the z direction, the third back surface side wiring 32C is arranged at a position overlapping with the third main surface side wiring 31C. When viewed from the z direction, the third back surface side wiring 32C has a connection wiring portion 32Ca overlapping with the connection wiring portion 31Ca of the third main surface side wiring 31C and an extension portion 32Cb overlapping with the extension portion 31Cb of the third main surface side wiring 31C. In this embodiment, the connection wiring portion 32Ca and the extension portion 32Cb are integrated. When viewed from the z direction, the extension portion 32Cb is arranged at a position overlapping with the third external electrode 53. On the other hand, when viewed from the z direction, the connection wiring portion 32Ca is arranged at a position not overlapping with the third external electrode 53. The extension portion 32Cb and the third external electrode 53 are connected by the back surface side connection electrode 43.

[0082] The third wiring 23 is electrically connected to the third external electrode 53 via the main surface side connection electrode 41, the third main surface side wiring 31C, the intermediate connection electrode 42, the third back surface side wiring 32C, and the back surface side connection electrode 43.

[0083] As viewed from the z direction, of both end edges in the x direction of the connection wiring portion 32Ca, the edge closer to the non-mounting surface 14 is formed at the same position as the non-mounting surface 14. That is, as shown in Fig. 6, the third back surface side wiring 32C is exposed from the non-mounting surface 14. The third back surface side wiring 32C has an outer conductive exposed portion 35ra exposed from the non-mounting surface 14.

[0084] When viewed from the z direction, the edge closer to the second side surface 16 of both ends of the connection wiring portion 32Ca in the y direction is formed at the same position as the second side surface 16. That is, the outer conductive exposed portion 35ra is also exposed from the second side surface 16. The outer conductive exposed portion 35ra is continuously exposed from the multilayer substrate 10 from the second side surface 16 to the non-mounting surface 14. That is, the part of the outer conductive exposed portion 35ra exposed from the non-mounting surface 14 and the part exposed from the second side surface 16 are connected. Therefore, when viewed from the non-mounting surface 14, the outer conductive exposed portion 35ra extends along the y direction from the edge closer to the second side surface 16 of both ends of the non-mounting surface 14 in the y direction. Also, when viewed from the second side surface 16, the outer conductive exposed portion 35ra extends along the x direction from the edge closer to the non-mounting surface 14 of both ends of the second side surface 16 in the x direction.

[0085] When viewed from the z direction, the tip edge of the extension portion 32Cb is formed at the same position as the mounting surface 13. That is, as shown in FIG. 5, the third back surface side wiring 32C is exposed from the mounting surface 13. The third back surface side wiring 32C has an inner conductive exposed portion 35rb exposed from the mounting surface 13. The inner conductive exposed portion 35rb is disposed between the outer conductive exposed portion 33r of the first back surface side wiring 32A and the outer conductive exposed portion 34r of the second back surface side wiring 32B in the y direction. The inner conductive exposed portion 35rb is disposed closer to the outer conductive exposed portion 33r than the center of the multilayer substrate 10 in the y direction.

[0086] When viewed from the z direction, the fourth back surface side wiring 32D is arranged at a position overlapping with the fourth main surface side wiring 31D. In this embodiment, the shape of the fourth back surface side wiring 32D when viewed from the z direction is line-symmetrical with the third back surface side wiring 32C with respect to a virtual line extending along the x direction at the center of the y direction of the second base material 10B (multilayer substrate 10). When viewed from the z direction, the fourth back surface side wiring 32D has a connection wiring portion 32Da overlapping with the connection wiring portion 31Da of the fourth main surface side wiring 31D and an extension portion 32Db overlapping with the extension portion 31Db of the fourth main surface side wiring 31D. In this embodiment, the connection wiring portion 31Da and the extension portion 32Db are integrated. When viewed from the z direction, the extension portion 32Db is arranged at a position overlapping with the second external electrode 52. On the other hand, when viewed from the z direction, the connection wiring portion 32Da is arranged at a position not overlapping with the second external electrode 52. The extension 32Db and the second external electrode 52 are connected by a rear surface side connection electrode 43.

[0087] The fourth wiring 24 is electrically connected to the second external electrode 52 via the main surface side connection electrode 41, the fourth main surface side wiring 31D, the intermediate connection electrode 42, the fourth back surface side wiring 32D, and the back surface side connection electrode 43.

[0088] As viewed from the z direction, of both end edges in the x direction of the connection wiring portion 32Da, the edge closer to the non-mounting surface 14 is formed at the same position as the non-mounting surface 14. That is, as shown in Fig. 6, the fourth back surface side wiring 32D is exposed from the non-mounting surface 14. The fourth back surface side wiring 32D has an outer conductive exposed portion 36ra exposed from the non-mounting surface 14.

[0089] When viewed from the z direction, the edge closer to the first side surface 15 of both ends of the connection wiring portion 32Da in the y direction is formed at the same position as the first side surface 15. That is, the outer conductive exposed portion 36ra is also exposed from the first side surface 15. The outer conductive exposed portion 36ra is continuously exposed from the multilayer substrate 10 from the first side surface 15 to the non-mounting surface 14. That is, the part of the outer conductive exposed portion 36ra exposed from the non-mounting surface 14 and the part exposed from the first side surface 15 are connected. Therefore, when viewed from the non-mounting surface 14, the outer conductive exposed portion 36ra extends along the y direction from the edge closer to the first side surface 15 of both ends of the non-mounting surface 14 in the y direction. Also, when viewed from the first side surface 15, the outer conductive exposed portion 36ra extends along the x direction from the edge closer to the non-mounting surface 14 of both ends of the first side surface 15 in the x direction.

[0090] When viewed from the z direction, the tip edge of the extension portion 32Db is formed at the same position as the mounting surface 13. That is, as shown in FIG. 5, the fourth back surface side wiring 32D is exposed from the mounting surface 13. The fourth back surface side wiring 32D has an inner conductive exposed portion 36rb exposed from the mounting surface 13. The inner conductive exposed portion 36rb is disposed between the outer conductive exposed portion 33r of the first back surface side wiring 32A and the outer conductive exposed portion 34r of the second back surface side wiring 32B in the y direction. The inner conductive exposed portion 36rb is disposed closer to the outer conductive exposed portion 34r than the center of the multilayer substrate 10 in the y direction.

[0091] Next, the conductive exposed portion will be described with reference to Fig. 5 to Fig. 7. For ease of understanding, the outer conductive exposed portions 33s, 33r, 34s, and 34r, the inner conductive exposed portions 35sb, 35rb, 36sb, and 36rb, and the external electrode 50 are each marked with a dot.

[0092] 5, there are provided a plurality of conductive exposed portions exposed from the mounting surface 13 of the multilayer substrate 10. In this embodiment, these conductive exposed portions are outer conductive exposed portions 33s, 33r, 34s, and 34r and inner conductive exposed portions 35sb, 35rb, 36sb, and 36rb.

[0093] As described above, the main surface side wirings 31A to 31D are provided between the first base material 10A and the third base material 10C, and are therefore arranged in a state where they are aligned with each other in the z direction. Therefore, as shown in FIG. 5, the outer conductive exposure portion 33s, the outer conductive exposure portion 34s, the inner conductive exposure portion 35sb, and the inner conductive exposure portion 36sb are arranged in a state where they are aligned with each other in the z direction. That is, the outer conductive exposure portion 33s, the outer conductive exposure portion 34s, the inner conductive exposure portion 35sb, and the inner conductive exposure portion 36sb are each arranged at a position away from both the main surface 11 and the back surface 12 of the multilayer substrate 10 in the z direction. Also, as viewed from the mounting surface 13, the outer conductive exposure portion 33s, the outer conductive exposure portion 34s, the inner conductive exposure portion 35sb, and the inner conductive exposure portion 36sb are arranged in a line spaced apart from each other in the y direction. That is, the y direction can be said to be the arrangement direction of the outer conductive exposed portion 33s, the outer conductive exposed portion 34s, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36sb, that is, the arrangement direction of the multiple conductive exposed portions. In other words, the y direction corresponds to the first direction. In the z direction, each of the main surface side wirings 31A to 31D is disposed closer to the main surface 11 than the center in the z direction of the multilayer substrate 10 (the center in the z direction of the mounting surface 13). That is, each of the conductive exposed portions 33s, 34s, 35sb, and 36sb is disposed closer to the main surface 11 than the center in the z direction of the multilayer substrate 10 (the center in the z direction of the mounting surface 13).

[0094] As described above, the back side wirings 32A to 32D are provided between the second base material 10B and the third base material 10C, and are therefore arranged in a state where they are aligned with each other in the z direction. Therefore, as shown in FIG. 5, the outer conductive exposure portion 33r, the outer conductive exposure portion 34r, the inner conductive exposure portion 35rb, and the inner conductive exposure portion 36rb are arranged in a state where they are aligned with each other in the z direction. That is, the outer conductive exposure portion 33r, the outer conductive exposure portion 34r, the inner conductive exposure portion 35rb, and the inner conductive exposure portion 36rb are each arranged at a position away from both the main surface 11 and the back surface 12 of the multilayer substrate 10 in the z direction. Also, as viewed from the mounting surface 13, the outer conductive exposure portion 33r, the outer conductive exposure portion 34r, the inner conductive exposure portion 35rb, and the inner conductive exposure portion 36rb are arranged in a line spaced apart from each other in the y direction. In addition, in the z direction, each of the back side wirings 32A to 32D is disposed closer to the back surface 12 than the center in the z direction of the multilayer substrate 10 (the center in the z direction of the mounting surface 13). In other words, each of the conductive exposed portions 33r, 34r, 35rb, and 36rb is disposed closer to the back surface 12 than the center in the z direction of the multilayer substrate 10 (the center in the z direction of the mounting surface 13).

[0095] In this way, in the z direction, the conductive exposed portions 33r, 34r, 35rb, and 36rb are arranged closer to the back surface 12 than the conductive exposed portions 33s, 34s, 35sb, and 36sb. In other words, in the z direction, the conductive exposed portions 33s, 34s, 35sb, and 36sb are arranged closer to the main surface 11 than the conductive exposed portions 33r, 34r, 35rb, and 36rb. The conductive exposed portions 33s, 34s, 35sb, and 36sb of the first conductive layer 31 exposed from the mounting surface 13 correspond to the first conductive exposed portions. Moreover, the conductive exposed portions 33r, 34r, 35rb, and 36rb of the second conductive layer 32 exposed from the mounting surface 13 correspond to the second conductive exposed portions.

[0096] 5, when viewed from the mounting surface 13, the outer conductive exposed portion 33s, the outer conductive exposed portion 33r, and the fourth external electrode 54 are aligned with each other in the y direction. When viewed from the mounting surface 13, the outer conductive exposed portion 34s, the outer conductive exposed portion 34r, and the first external electrode 51 are aligned with each other in the y direction. When viewed from the mounting surface 13, the inner conductive exposed portion 35sb, the inner conductive exposed portion 35rb, and the third external electrode 53 are aligned with each other in the y direction. When viewed from the mounting surface 13, the inner conductive exposed portion 36sb, the inner conductive exposed portion 36rb, and the second external electrode 52 are aligned with each other in the y direction.

[0097] 5, the external electrodes 51-54 have the same length in the y direction. The length in the y direction of the outer conductive exposed portion 33s, the length in the y direction of the outer conductive exposed portion 34s, the length in the y direction of the inner conductive exposed portion 35sb, and the length in the y direction of the inner conductive exposed portion 36sb are each shorter than the length in the y direction of each of the external electrodes 51-54.

[0098] The length in the y direction of the outer conductive exposure portion 33s is equal to the length in the y direction of the outer conductive exposure portion 34s. The length in the y direction of the inner conductive exposure portion 35sb is equal to the length in the y direction of the inner conductive exposure portion 36sb. Both the length in the y direction of the inner conductive exposure portion 35sb and the length in the y direction of the inner conductive exposure portion 36sb are shorter than both the length in the y direction of the outer conductive exposure portion 33s and the length in the y direction of the outer conductive exposure portion 34s.

[0099] The outer conductive exposed portions 33s, 33r are formed such that, of both ends in the y direction, the end edge closer to the first side surface 15 is closer to the second side surface 16 than the end edge closer to the first side surface 15 of the fourth external electrode 54, of both ends in the y direction. In other words, when viewed from the z direction, the end portion of the fourth external electrode 54 on the side of the first side surface 15 protrudes in the y direction from the outer conductive exposed portions 33s, 33r.

[0100] The outer conductive exposed portions 34s, 34r are formed such that, of both ends in the y direction, the end edge closer to the second side surface 16 is closer to the first side surface 15 than the end edge closer to the second side surface 16 of the first external electrode 51 of both ends in the y direction. In other words, when viewed from the z direction, the end portion of the first external electrode 51 on the side of the second side surface 16 protrudes in the y direction from the outer conductive exposed portions 34s, 34r.

[0101] The inner conductive exposed portions 35sb, 35rb are arranged such that their centers in the y direction are aligned with the center in the y direction of the third external electrode 53. Therefore, when viewed from the mounting surface 13, both ends in the y direction of the inner conductive exposed portions 35sb, 35rb are located more inward than both ends in the y direction of the third external electrode 53. In other words, when viewed from the z direction, both ends in the y direction of the third external electrode 53 protrude in the y direction from the inner conductive exposed portions 35sb, 35rb.

[0102] The inner conductive exposed portions 36sb, 36rb are arranged such that their centers in the y direction are aligned with the center in the y direction of the second external electrode 52. Therefore, when viewed from the mounting surface 13, both ends in the y direction of the inner conductive exposed portions 36sb, 36rb are located more inward than both ends in the y direction of the second external electrode 52. In other words, when viewed from the z direction, both ends in the y direction of the second external electrode 52 protrude in the y direction from the inner conductive exposed portions 36sb, 36rb.

[0103] As shown in FIG. 6, the first main surface side wiring 31A and the second main surface side wiring 31B and the first back surface side wiring 32A and the second back surface side wiring 32B are not exposed from the non-mounting surface 14, so that the first conductive layer 31 and the second conductive layer 32 are exposed differently from the non-mounting surface 14. That is, the exposure pattern of the conductive layer 30 exposed from the mounting surface 13 is different from the exposure pattern of the conductive layer 30 exposed from the non-mounting surface 14. The "exposure pattern" here includes at least one of the shape (length in the y direction) of the part exposed from the mounting surface 13 and the non-mounting surface 14, the number of exposed parts, and the position of the exposed part in the y direction in at least one of the first conductive layer 31 and the second conductive layer 32. In short, when the conductive layer 30 includes a plurality of conductive layers, it is sufficient that the exposed part of at least one conductive layer is different between the mounting surface 13 and the non-mounting surface 14.

[0104] On the opposite mounting surface 14, the outer conductive exposed portion 35sa of the third main surface side wiring 31C and the outer conductive exposed portion 36sa of the fourth main surface side wiring 31D, and the outer conductive exposed portion 35ra of the third back surface side wiring 32C and the outer conductive exposed portion 36ra of the fourth back surface side wiring 32D are exposed. The outer conductive exposed portion 35sa and the outer conductive exposed portion 35ra are aligned with each other in the y direction, and the outer conductive exposed portion 36sa and the outer conductive exposed portion 36ra are aligned with each other. The y-direction length of the outer conductive exposed portions 35sa and 35ra is longer than the y-direction length of the outer conductive exposed portions 33s and 33r (see FIG. 5) exposed from the mounting surface 13. The y-direction length of the outer conductive exposed portions 36sa and 36ra is longer than the y-direction length of the outer conductive exposed portions 34s and 34r (see FIG. 5) exposed from the mounting surface 13.

[0105] As shown in FIG. 7, on the first side 15, the outer conductive exposed portion 34s of the second main surface side wiring 31B and the outer conductive exposed portion 36sa of the fourth main surface side wiring 31D, and the outer conductive exposed portion 34r of the second back surface side wiring 32B and the outer conductive exposed portion 36ra of the fourth back surface side wiring 32D are exposed.

[0106] The outer conductive exposed portion 34s and the outer conductive exposed portion 36sa are arranged spaced apart from each other in the x direction while being aligned with each other in the z direction. The outer conductive exposed portion 34r and the outer conductive exposed portion 36ra are arranged closer to the external electrode 50 than the outer conductive exposed portion 34s and the outer conductive exposed portion 36sa in the z direction. The outer conductive exposed portion 34r and the outer conductive exposed portion 36ra are arranged spaced apart from each other in the x direction while being aligned with each other in the z direction. When viewed from the z direction, the outer conductive exposed portion 34s and the outer conductive exposed portion 34r are arranged at positions where they overlap each other. When viewed from the z direction, the outer conductive exposed portion 36sa and the outer conductive exposed portion 36ra are arranged at positions where they overlap each other.

[0107] The length in the x direction of the outer conductive exposed portion 34s is equal to or less than the length in the x direction of the outer conductive exposed portion 34r. In this embodiment, the length in the x direction of the outer conductive exposed portion 34s is shorter than the length in the x direction of the outer conductive exposed portion 34r. The length in the x direction of the outer conductive exposed portion 34s is equal to or less than the length in the x direction of the first external electrode 51 (the length in the x direction of the external electrode 50). In this embodiment, the length in the x direction of the outer conductive exposed portion 34s is shorter than the length in the x direction of the first external electrode 51. The length in the x direction of the outer conductive exposed portion 34r is equal to the length in the x direction of the first external electrode 51 (the length in the x direction of the external electrode 50). In this embodiment, the length in the x direction of the outer conductive exposed portion 34r is equal to the length in the x direction of the first external electrode 51.

[0108] The lengths of the outer conductive exposed portions 34s and 34r in the x direction can be changed arbitrarily. In one example, the length of the outer conductive exposed portion 34s in the x direction may be equal to the length of the outer conductive exposed portion 34r in the x direction, or may be longer than the length of the outer conductive exposed portion 34r in the x direction. The length of the outer conductive exposed portion 34s in the x direction may be equal to the length of the first external electrode 51 in the x direction, or may be longer than the length of the first external electrode 51 in the x direction. In another example, the length of the outer conductive exposed portion 34r in the x direction may be longer than the length of the first external electrode 51 in the x direction, or may be shorter than the length of the first external electrode 51 in the x direction.

[0109] The length in the x direction of the outer conductive exposed portion 36sa is equal to the length in the x direction of the outer conductive exposed portion 36ra. In this embodiment, the length in the x direction of the outer conductive exposed portions 36sa, 36ra is shorter than the length in the x direction of the outer conductive exposed portions 34s, 34r. Note that the length in the x direction of the outer conductive exposed portions 36sa, 36ra can be changed arbitrarily, and may be equal to the length in the x direction of the outer conductive exposed portions 34s, 34r, or may be longer than the length in the x direction of the outer conductive exposed portions 34s, 34r, for example.

[0110] Although not shown, the outer conductive exposed portion 33s of the first main surface side wiring 31A and the outer conductive exposed portion 35sa of the third main surface side wiring 31C, and the outer conductive exposed portion 33r of the first back surface side wiring 32A and the outer conductive exposed portion 35ra of the third back surface side wiring 32C are exposed on the second side surface 16. The exposure pattern (position, shape, and size) of the conductive layer exposed from the second side surface 16 is the same as the exposure pattern of the conductive layer exposed from the first side surface 15.

[0111] Next, an example of a manufacturing process for the multilayer substrate 10 will be described. The dashed rectangular shapes in Figs. 10 to 13 indicate the size equivalent to the multilayer substrate 10. Each of Figs. 10 to 13 also shows an example of an area in which eight multilayer substrates 10 are manufactured. The wiring patterns shown in Figs. 10 to 12 show the multilayer substrate 10 as seen through from the main surface 11 side. The wiring pattern shown in Fig. 13 shows the multilayer substrate 10 as seen from the back surface 12 side, inverted to match the arrangement in Figs. 10 to 12.

[0112] The method for manufacturing the multilayer substrate 10 begins with manufacturing a base material for the multilayer substrate 10. The base material for the multilayer substrate 10 includes a first base material 710A shown in Fig. 10, a third base material 710C shown in Figs. 11 and 12, and a second base material 710B shown in Fig. 13.

[0113] The first substrate 710A corresponds to the first substrate 10A of the multilayer substrate 10, and is the substrate before being cut to the size of the multilayer substrate 10 shown in the dashed rectangular shape in Fig. 10. The first substrate 710A is formed so as to cover the main surface of the third substrate 710C and a first conductive layer 731 (described later) on the main surface of the third substrate 710C.

[0114] Third substrate 710C is a substrate corresponding to third substrate 10C of multilayer substrate 10, and is a substrate before being cut to the size of multilayer substrate 10 shown by the dashed rectangular shape in FIG. The second substrate 710B is a substrate corresponding to the second substrate 10B of the multilayer substrate 10, and is a substrate before being cut to the size of the multilayer substrate 10 shown in the dashed rectangular shape in Fig. 12. The second substrate 710B is formed so as to cover the rear surface of the third substrate 710C and a second conductive layer 732 (described later) on the rear surface of the third substrate 710C.

[0115] As shown in FIG. 10, a wiring layer 720 is formed on the main surface of the first substrate 710A. A plurality of main surface side connection electrodes 41 are formed on the first substrate 710A. As shown in FIG. 11, a first conductive layer 731 is formed on the main surface of the third substrate 710C, and as shown in FIG. 12, a second conductive layer 732 is formed on the rear surface of the third substrate 710C. A plurality of intermediate connection electrodes 42 are formed on the third substrate 710C. As shown in FIG. 13, an external electrode 750 is formed on the rear surface of the second substrate 710B. A plurality of rear surface side connection electrodes 43 are formed on the second substrate 710B. The first substrate 710A, the second substrate 710B, and the third substrate 710C are laminated in the z direction so that the third substrate 710C is sandwiched between the first substrate 710A and the second substrate 710B. In this way, a base material for a multilayer substrate is manufactured.

[0116] Next, the base material of the multilayer substrate is cut, for example, by using a dicing blade along cutting lines CL shown by dashed lines in Figures 10 to 12. This results in individual pieces of multilayer substrate 10. Through the above process, multilayer substrate 10 is manufactured.

[0117] Next, the wiring patterns in FIGS. 10 to 13 will be described. FIG. 10 shows an example of the wiring layer 720 and the main surface side connection electrode 41 formed on the first base material 710A.

[0118] The wiring layer 720 is a conductive layer corresponding to the wiring layer 20 of the multilayer substrate 10, and has a first wiring 721, a second wiring 722, and a common wiring 723. The wiring layer 720 is formed by patterning using a mask.

[0119] The first wiring 721 is a wiring corresponding to the first wiring 21 of the multilayer substrate 10, and the second wiring 722 is a wiring corresponding to the second wiring 22 of the multilayer substrate 10. The common wiring 723 is a wiring including the third wiring 23 and the fourth wiring 24 of the multilayer substrate 10. The common wiring 723 is cut together with the first base material 710A along the cutting line CL to form the third wiring 23 and the fourth wiring 24. Therefore, the third wiring 23 and the fourth wiring 24 have portions that overlap with the outer periphery of the first base material 10A (multilayer substrate 10). The portions of the third wiring 23 and the fourth wiring 24 that overlap with the outer periphery of the first base material 10A become dicing side surfaces formed by dicing.

[0120] The main surface side connection electrode 41 is formed penetrating the first base material 710A in its thickness direction (z direction). More specifically, an opening exposing a part of the first conductive layer 731 is formed by laser processing or the like at the location of the first base material 710A where the main surface side connection electrode 41 is to be formed. Next, the opening is filled with Cu plating. This forms a via. The main surface side connection electrode 41 may be formed in the same process as the wiring layer 720, or may be formed in a different process. Through the above process, the main surface side connection electrode 41 is manufactured. The Cu plating may be formed cylindrically on the inner wall constituting the opening, rather than filling the opening.

[0121] 11 and 12 show an example of a first conductive layer 731, a second conductive layer 732, and an intermediate connector electrode 42 formed on a third base material 710C. The first conductive layer 731 is a conductive layer corresponding to the first conductive layer 31 of the multilayer substrate 10, and has a first common wiring 731A and a second common wiring 731B. The first conductive layer 731 is formed by patterning using a mask.

[0122] The first common wiring 731A is a wiring including the first main surface side wiring 31A and the second main surface side wiring 31B of the multilayer substrate 10. The first common wiring 731A is cut together with the third base material 710C along the cutting line CL to form the first main surface side wiring 31A and the second main surface side wiring 31B. Therefore, when viewed from the thickness direction (z direction) of the third base material 710C, the first main surface side wiring 31A has a portion (outer conductive exposed portion 33s) that overlaps with the mounting surface 13 and the second side surface 16 of the multilayer substrate 10, and the second main surface side wiring 31B has a portion (outer conductive exposed portion 34s) that overlaps with the mounting surface 13 and the first side surface 15 of the multilayer substrate 10. In other words, both the outer conductive exposed portion 33s and the outer conductive exposed portion 34s become dicing side surfaces formed by dicing. As a result, the outer conductive exposed portions 33s, 34s ​​are flush with the mounting surface 13. The outer conductive exposed portion 33 s is flush with the second side surface 16 , and the outer conductive exposed portion 34 s is flush with the first side surface 15 .

[0123] The second common wiring 731B is a wiring including the third main surface side wiring 31C and the fourth main surface side wiring 31D of the multilayer substrate 10. The second common wiring 731B is cut together with the third base material 710C along the cutting line CL to form the third main surface side wiring 31C and the fourth main surface side wiring 31D. Therefore, when viewed from the z direction, the third main surface side wiring 31C has a portion (inner conductive exposed portion 35sb) that overlaps with the mounting surface 13 of the multilayer substrate 10 and a portion (outer conductive exposed portion 35sa) that overlaps with the non-mounting surface 14 and the second side surface 16. The fourth main surface side wiring 31D has a portion (inner conductive exposed portion 36sb) that overlaps with the mounting surface 13 of the multilayer substrate 10 and a portion (outer conductive exposed portion 36sa) that overlaps with the non-mounting surface 14 and the first side surface 15. That is, the inner conductive exposure portions 35sb, 36sb and the outer conductive exposure portions 35sa, 36sa become dicing side surfaces formed by dicing. As a result, the outer conductive exposure portions 35sa, 36sa and the inner conductive exposure portions 35sb, 36sb become flush with the mounting surface 13. The outer conductive exposure portion 35sa becomes flush with the second side surface 16, and the outer conductive exposure portion 36sa becomes flush with the first side surface 15.

[0124] The second conductive layer 732 is a conductive layer corresponding to the second conductive layer 32 of the multilayer substrate 10, and has a first common wiring 732A and a second common wiring 732B. The second conductive layer 732 is formed by patterning using a mask.

[0125] The first common wiring 732A is a wiring including the first back surface side wiring 32A and the second back surface side wiring 32B of the multilayer substrate 10. The first common wiring 732A is cut together with the third base material 710C along the cutting line CL to form the first back surface side wiring 32A and the second back surface side wiring 32B. Therefore, when viewed from the thickness direction (z direction) of the third base material 710C, the first back surface side wiring 32A has a portion (outer conductive exposed portion 33r) overlapping with the mounting surface 13 and the second side surface 16 of the multilayer substrate 10, and the second back surface side wiring 32B has a portion (outer conductive exposed portion 34r) overlapping with the mounting surface 13 and the first side surface 15 of the multilayer substrate 10. In other words, both the outer conductive exposed portion 33r and the outer conductive exposed portion 34r become dicing side surfaces formed by dicing. As a result, the outer conductive exposed portions 33r, 34r are flush with the mounting surface 13. The outer conductive exposed portion 33r is flush with the second side surface 16, and the outer conductive exposed portion 34r is flush with the first side surface 15.

[0126] The second common wiring 732B is a wiring including the third back surface side wiring 32C and the fourth back surface side wiring 32D of the multilayer substrate 10. The second common wiring 732B is cut together with the second base material 710B along the cutting line CL to form the third back surface side wiring 32C and the fourth back surface side wiring 32D. Therefore, when viewed from the z direction, the third back surface side wiring 32C has a portion (inner conductive exposed portion 35rb) overlapping with the mounting surface 13 of the multilayer substrate 10 and a portion (outer conductive exposed portion 35ra) overlapping with the non-mounting surface 14 and the second side surface 16. The fourth back surface side wiring 32D has a portion (inner conductive exposed portion 36rb) overlapping with the mounting surface 13 of the multilayer substrate 10 and a portion (outer conductive exposed portion 36ra) overlapping with the non-mounting surface 14 and the first side surface 15. In other words, the inner conductive exposed portions 35rb, 36rb and the outer conductive exposed portions 35ra, 36ra become dicing side surfaces formed by dicing. As a result, the outer conductive exposure portions 35ra, 36ra and the inner conductive exposure portions 35rb, 36rb are flush with the mounting surface 13. The outer conductive exposure portion 35ra is flush with the second side surface 16, and the outer conductive exposure portion 36ra is flush with the first side surface 15.

[0127] The intermediate connection electrode 42 is formed penetrating the third base material 710C in its thickness direction (z direction). More specifically, a through hole is first formed by laser processing or the like at a location of the third base material 710C where the intermediate connection electrode 42 is to be formed. Next, the through hole is filled with Cu plating. This forms a via. Through the above process, the intermediate connection electrode 42 is manufactured. Note that the Cu plating may be formed in a cylindrical shape on the inner wall constituting the through hole, rather than filling the through hole.

[0128] FIG. 13 shows an example of an external electrode 750 formed on the rear surface of the second base material 710B. The external electrode 750 is a conductive layer corresponding to the external electrode 50 of the multilayer substrate 10, and has a first common electrode portion 751, a second common electrode portion 752, and a third common electrode portion 753. The metal layer of the external electrode 750 is formed by patterning. Then, a plating layer is formed by electrolytic plating using the patterned metal layer as a conductive path.

[0129] The first common electrode portion 751 is a conductive layer including four external electrodes, and both the second common electrode portion 752 and the third common electrode portion 753 are conductive layers including two external electrodes. In one example, the first common electrode portion 751 includes two first external electrodes 51 and two fourth external electrodes 54. Both the second common electrode portion 752 and the third common electrode portion 753 include a second external electrode 52 and a third external electrode 53. When the second base material 710B is cut along the cutting line CL, each of the common electrode portions 751 to 753 is cut to form the first external electrode 51, the second external electrode 52, the third external electrode 53, and the fourth external electrode 54. Therefore, when viewed from the thickness direction (z direction) of the second base material 710B, each of the external electrodes 51 to 54 has a portion overlapping the mounting surface 13, the first external electrode 51 has a portion overlapping the first side surface 15, and the fourth external electrode 54 has a portion overlapping the second side surface 16. The portions of each of the external electrodes 51 to 54 that overlap the mounting surface 13, the portion of the first external electrode 51 that overlaps the first side surface 15, and the portion of the fourth external electrode 54 that overlaps the second side surface 16 are dicing side surfaces formed by dicing. As a result, each of the external electrodes 51 to 54 has a portion that is flush with the mounting surface 13. The first external electrode 51 has a portion that is flush with the first side surface 15, and the fourth external electrode 54 has a portion that is flush with the second side surface 16.

[0130] The back side connection electrode 43 is formed penetrating the second base material 710B in its thickness direction (z direction). More specifically, an opening is first formed by laser processing or the like at the location of the second base material 710B where the back side connection electrode 43 is to be formed, exposing a part of the second conductive layer 732. Next, the opening is filled with Cu plating. This forms a via. The Cu plating may be formed in a cylindrical shape on the inner wall constituting the opening, rather than filling the opening. The back side connection electrode 43 may be formed in the same process as the external electrode 750, or in a different process. Through the above process, the back side connection electrode 43 is manufactured.

[0131] In addition, on the second base material 710B, a connection wiring portion 754 connected to the first common electrode portion 751 and a resist layer 56 covering a part of the connection wiring portion 754 are formed. The connection wiring portion 754 is a conductive layer corresponding to the connection wiring portion 55 of the multilayer substrate 10.

[0132] Electrolytic plating is performed using the connection wiring portion 754 as a conductive path, thereby forming a plating layer on the first common electrode portion 751. Thereafter, the connection wiring portion 754 is cut together with the second base material 710B along the cutting line CL, thereby forming the connection wiring portion 55 of the multilayer substrate 10.

[0133] In the method for manufacturing the semiconductor light emitting device 1, the semiconductor light emitting elements 60A, 60B are mounted on the wiring layer 720 of the base material configured as described above. Then, wires WA, WB1, WB2 that connect the semiconductor light emitting elements 60A, 60B to the wiring layer 720 are formed using a wire bonding device.

[0134] Next, a resin layer is formed to seal the semiconductor light emitting elements 60A, 60B and the wires WA, WB1, WB2. This resin layer corresponds to the sealing resin and seals the semiconductor light emitting elements 60A, 60B and the wires WA, WB1, WB2.

[0135] Finally, the resin layer and the base material of the multilayer substrate are cut using a dicing blade along the cutting lines CL shown in Figures 10 to 13, thereby dividing the semiconductor light emitting devices 1. Through the above steps, the semiconductor light emitting devices 1 are manufactured.

[0136] Before mounting the semiconductor light emitting elements 60A and 60B, the base material of the multilayer substrate may be cut along the cutting lines CL using a dicing blade. This separates the multilayer substrate 10. In this case, the semiconductor light emitting elements 60A and 60B are mounted on the separated multilayer substrate 10.

[0137] Next, mounting of the semiconductor light emitting device 1 of this embodiment on the circuit board P10 will be described. The circuit board P10 on which the semiconductor light emitting device 1 is mounted has a plurality of lands LP1 to LP4, indicated by dashed lines in FIG.

[0138] The external electrode 50 of the semiconductor light emitting device 1 is joined to the lands LP1 to LP4 by a conductive bonding material SD. Specifically, the first external electrode 51 is joined to the land LP1 by a conductive bonding material SD, the second external electrode 52 is joined to the land LP2 by a conductive bonding material SD, the third external electrode 53 is joined to the land LP3 by a conductive bonding material SD, and the fourth external electrode 54 is joined to the land LP4 by a conductive bonding material SD.

[0139] 5, the lands LP1 to LP4 are provided so as to face each other over the entire z-direction of the mounting surface 13. Therefore, in the semiconductor light emitting device 1, among the conductive exposed portions of the conductive layer 30, the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb close to the lands LP1 to LP4 are joined to the lands LP1 to LP4 by the conductive bonding material SD. Specifically, the outer conductive exposed portions 34s and 34r are joined to the land LP1 by the conductive bonding material SD, the inner conductive exposed portions 36sb and 36rb are joined to the land LP2 by the conductive bonding material SD, the inner conductive exposed portions 35sb and 35rb are joined to the land LP3 by the conductive bonding material SD, and the outer conductive exposed portions 33s and 33r are joined to the land LP4 by the conductive bonding material SD.

[0140] The operation of the semiconductor light emitting device 1 of this embodiment will be described below. Note that the multilayer substrate 10 is shown in a simplified form in FIG. 14 shows a state in which a semiconductor light emitting device 1X of the comparative example is mounted on an upper surface P11 of a circuit board P10. The semiconductor light emitting device 1X of the comparative example differs from the semiconductor light emitting device 1 of the present embodiment in that a single-layer substrate 10X is used instead of the multilayer substrate 10.

[0141] As shown in Fig. 14, in the semiconductor light emitting device 1X of the comparative example, the external electrode 50 and the circuit board P10 are joined by the conductive bonding material SD in a state where the mounting surface 13X of the substrate 10X is in contact with the circuit board P10. In this case, when the conductive bonding material SD that bonds the external electrode 50 and the circuit board P10 is solidified, a force is applied in a direction that brings the back surface 12X of the substrate 10X closer to the circuit board P10. This force may cause the mounting surface 13X of the substrate 10X to move away from the upper surface P11 of the circuit board P10 as shown by the two-dot chain line in Fig. 14, and the semiconductor light emitting device 1X of the comparative example may be tilted with respect to the upper surface P11 of the circuit board P10. As a result, the light emitted by the semiconductor light emitting element may not be parallel to the upper surface P11 of the circuit board P10.

[0142] In this respect, in the semiconductor light emitting device 1 of this embodiment, the mounting surface 13 of the multilayer substrate 10 is joined to the circuit board P10 by the conductive bonding material SD via the outer conductive exposed portions 33s, 33r, 34s, 34r and the inner conductive exposed portions 35sb, 35rb, 36sb, 36rb. As a result, even if the mounting surface 13 tries to move away from the upper surface P11 of the circuit board P10 due to the force applied in the direction in which the back surface 12X of the substrate 10X approaches the circuit board P10 by the conductive bonding material SD bonded to each of the external electrodes 51 to 54, this is suppressed by the conductive bonding material SD bonding each of the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, 36rb to the circuit board P10. Therefore, the mounting surface 13 is less likely to tilt with respect to the upper surface P11 of the circuit board P10.

[0143] The semiconductor light emitting device 1 of this embodiment provides the following advantages. (1-1) A side-emitting semiconductor light-emitting device 1 includes a multilayer substrate 10 having a plurality of base materials 10A-10C and a conductive layer 30, and semiconductor light-emitting elements 60A, 60B. The multilayer substrate 10 has a main surface 11 on which the semiconductor light-emitting elements 60A, 60B are mounted, a back surface 12 facing the opposite side to the main surface 11 and on which an external electrode 50 is formed, and a mounting surface 13 intersecting both the main surface 11 and the back surface 12. The conductive layer 30 is disposed apart from both the main surface 11 and the back surface 12 in the thickness direction (z direction) of the multilayer substrate 10, and has an outer conductive exposed portion 33s, an outer conductive exposed portion 34s, an inner conductive exposed portion 35sb, and an inner conductive exposed portion 36sb as conductive exposed portions exposed from the mounting surface 13.

[0144] According to this configuration, when the semiconductor light emitting device 1 is mounted on the circuit board P10, the external electrodes 51-54 formed on the back surface 12 of the multilayer substrate 10 are joined to the circuit board P10 by the conductive adhesive material SD, and the conductive exposed portions 33s, 34s, 35sb, and 36sb exposed from the mounting surface 13 of the multilayer substrate 10 are joined to the circuit board P10 by the conductive adhesive material SD. Therefore, the mounting surface 13 is joined to the upper surface P11 of the circuit board P10 on the side of the main surface 11 of the multilayer substrate 10 rather than the back surface 12 of the multilayer substrate 10, so that the semiconductor light emitting device 1 can be stably mounted on the circuit board P10. The same effect can be obtained for the outer conductive exposed portion 33r, the outer conductive exposed portion 34r, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36rb.

[0145] (1-2) When viewed from the mounting surface 13, the outer conductive exposed portion 33s, the outer conductive exposed portion 34s, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36sb are aligned with each other in the thickness direction (z direction) of the multilayer substrate 10 and arranged at a distance from each other in a direction perpendicular to the thickness direction of the multilayer substrate 10 (y direction).

[0146] With this configuration, compared to when there is only one conductive exposed portion, the mounting surface 13 and the circuit board P10 are joined at multiple locations on the mounting surface 13 by the conductive bonding material SD, allowing the semiconductor light emitting device 1 to be mounted on the circuit board P10 more stably.

[0147] In addition, since the conductive exposed portions 33s, 34s, 35sb, and 36sb are aligned with one another in the z direction, they are formed in the same layer of the multilayer substrate 10. Therefore, the conductive exposed portions 33s, 34s, 35sb, and 36sb can be formed in the same process, and the manufacturing process of the multilayer substrate 10 can be simplified.

[0148] In addition, since the conductive exposed portions 33s, 34s, 35sb, and 36sb are arranged at a distance from each other in the y direction, they can be bonded to the circuit board P10 by the conductive adhesive SD over a wide range in the y direction, which is the longitudinal direction of the mounting surface 13. Therefore, the entire surface of the mounting surface 13 is less likely to separate from the circuit board P10, so that the semiconductor light emitting device 1 can be more stably mounted on the circuit board P10. The same effect can be obtained with the outer conductive exposed portion 33r, the outer conductive exposed portion 34r, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36rb.

[0149] (1-3) When viewed from the mounting surface 13, the outer conductive exposed portion 33s, the outer conductive exposed portion 34s, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36sb are aligned with the respective external electrodes 51-54 in the y direction, which is the arrangement direction of these conductive exposed portions 33s, 34s, 35sb, and 36sb. The length of each of the conductive exposed portions 33s, 34s, 35sb, and 36sb in the y direction is shorter than the length of each of the external electrodes 51-54 in the y direction. In other words, each of the external electrodes 51-54 protrudes from each of the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb when viewed from the z direction.

[0150] This configuration makes it possible to prevent short circuits (solder bridges) when the semiconductor light emitting device 1 is mounted on the circuit board P10. For example, when the wiring layer 720, the first conductive layer 731, the second conductive layer 732, and the external electrode 750 are formed by patterning in the manufacturing process of the multilayer substrate 10, the wiring layer 720, the first conductive layer 731, and the second conductive layer 732 may be misaligned in the y direction with respect to the external electrode 50 depending on the accuracy of the alignment of the mask used for patterning. For example, if the length in the y direction of the inner conductive exposed portion 35rb is made equal to the length in the y direction of the third external electrode 53, the misalignment may cause the inner conductive exposed portion 35rb to come close to the land LP4 joined to, for example, the fourth external electrode 54, and the land LP4 and the inner conductive exposed portion 35rb may be joined by the conductive bonding material SD.

[0151] In this regard, since the third external electrode 53 protrudes beyond the inner conductive exposed portion 35rb when viewed from the z direction, even if misalignment occurs during the manufacturing process of the multilayer substrate 10, the inner conductive exposed portion 35rb is unlikely to protrude beyond the third external electrode 53. This prevents erroneous bonding between the inner conductive exposed portion 35rb and the land LP4. The same is true for the other conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 36sb, and 36rb. In other words, misalignment between the conductive layer 30 and the external electrode 50 is permitted, and therefore the semiconductor light emitting device 1 can be easily manufactured without requiring high-precision alignment.

[0152] (1-4) In the manufacturing process of the multilayer substrate 10, the outer conductive exposed portions 33s, 34s ​​are formed by cutting the common wirings 731A, 731B when cutting the base materials 710A-710C along the x direction. Therefore, even if a mask used for patterning the first conductive layer 731 is stacked with a misalignment in the y direction, the outer conductive exposed portion 33s has an edge formed to coincide with the second side surface 16, and the outer conductive exposed portion 34s has an edge formed to coincide with the first side surface 15. For this reason, it is only necessary to consider the positional relationship between the fourth external electrode 54 and the edge closer to the first side surface 15 of both ends of the outer conductive exposed portion 33s in the y direction, and the outer conductive exposed portion 34s has an edge formed to coincide with the first external electrode 51.

[0153] On the other hand, in the manufacturing process of the multilayer substrate 10, the inner conductive exposed portions 35sb, 36sb do not cut the common wirings 731A, 731B when the base materials 710A to 710C are cut along the x direction. Therefore, if the mask used for patterning the first conductive layer 731 is stacked with a deviation in the y direction, the second common wiring 731B may be shifted to both sides in the y direction relative to the third external electrode 53, and another second common wiring 731B may be shifted to both sides in the y direction relative to the second external electrode 52.

[0154] In this regard, in the present embodiment, the length of the inner conductive exposed portions 35sb, 36sb in the y direction is shorter than the length of the outer conductive exposed portions 33s, 34s ​​in the y direction. This reduces the risk that the inner conductive exposed portion 35sb will be connected to a land other than the land LP3 corresponding to the third external electrode 53, and the risk that the inner conductive exposed portion 36sb will be connected to a land other than the land LP2 corresponding to the second external electrode 52, in the z direction. The same effect can be obtained for the outer conductive exposed portion 33r, the outer conductive exposed portion 34r, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36rb.

[0155] (1-5) The outer conductive exposed portion 33s is exposed from both the mounting surface 13 and the second side surface 16, and the outer conductive exposed portion 34s is exposed from both the mounting surface 13 and the first side surface 15. According to this configuration, the outer conductive exposed portion 33s is joined to the circuit board P10 by the conductive bonding material SD on both the mounting surface 13 and the second side surface 16, and the outer conductive exposed portion 34s is joined to the circuit board P10 by the conductive bonding material SD on both the mounting surface 13 and the first side surface 15. This allows the semiconductor light emitting device 1 to be more stably mounted on the circuit board P10. The same effect can be obtained for the outer conductive exposed portion 33r and the outer conductive exposed portion 34r.

[0156] (1-6) In the multilayer substrate 10, the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb are exposed from the mounting surface 13, and the outer conductive exposed portions 35sa, 35ra, 36sa, and 36ra are exposed from the opposite mounting surface 14. That is, the exposure pattern of the conductive layer 30 exposed from the opposite mounting surface 14 is different from the exposure pattern of the conductive layer 30 exposed from the mounting surface 13.

[0157] According to this configuration, when the orientation of the semiconductor light emitting device 1 is determined by an imaging device such as a camera while the semiconductor light emitting device 1 is housed in a carrier tape, the orientation can be determined based on the exposure pattern of the conductive layer 30 exposed from the non-mounting surface 14 and the exposure pattern of the conductive layer 30 exposed from the mounting surface 13. Therefore, the orientation of the semiconductor light emitting device 1 can be determined even while the semiconductor light emitting device 1 is housed in a carrier tape.

[0158] (1-7) The multilayer substrate 10 has a first conductive layer 31 formed between the first substrate 10A and the third substrate 10C, and a second conductive layer 32 formed between the second substrate 10B and the third substrate 10C. The first conductive layer 31 has an outer conductive exposed portion 33s, an outer conductive exposed portion 34s, an inner conductive exposed portion 35sb, and an inner conductive exposed portion 36sb, which are exposed from the mounting surface 13. The second conductive layer 32 has an outer conductive exposed portion 33r, an outer conductive exposed portion 34r, an inner conductive exposed portion 35rb, and an inner conductive exposed portion 36rb, which are exposed from the mounting surface 13.

[0159] According to this configuration, the mounting surface 13 and the circuit board P10 are joined by the conductive adhesive material SD at multiple locations spaced apart from each other in the z-direction of the mounting surface 13, thereby enabling the semiconductor light emitting device 1 to be mounted on the circuit board P10 more stably.

[0160] (1-8) In the y direction which is the arrangement direction of the outer conductive exposed portion 33s, the outer conductive exposed portion 34s, the inner conductive exposed portion 35sb, and the inner conductive exposed portion 36sb, the outer conductive exposed portion 33s, the outer conductive exposed portion 33r, and the fourth external electrode 54 are aligned with each other, the outer conductive exposed portion 34s, the outer conductive exposed portion 34r, and the first external electrode 51 are aligned with each other, the inner conductive exposed portion 35sb, the inner conductive exposed portion 35rb, and the third external electrode 53 are aligned with each other, and the inner conductive exposed portion 36sb, the inner conductive exposed portion 36rb, and the second external electrode 52 are aligned with each other.

[0161] According to this configuration, when the semiconductor light emitting device 1 is mounted on the circuit board P10, the outer conductive exposed portions 33s, 33r can be prevented from being connected to a land other than the land LP4 corresponding to the fourth external electrode 54, the outer conductive exposed portions 34s, 34r can be prevented from being connected to a land other than the land LP1 corresponding to the first external electrode 51, the inner conductive exposed portions 35sb, 35rb can be prevented from being connected to a land other than the land LP3 corresponding to the third external electrode 53, and the inner conductive exposed portions 36sb, 36rb can be prevented from being connected to a land other than the land LP2 corresponding to the second external electrode 52.

[0162] (1-9) When viewed from the z direction, the first wiring 21 and the second wiring 22 of the wiring layer 20 formed on the main surface 11 of the multilayer substrate 10 are disposed at a position spaced apart from the mounting surface 13 of the main surface 11. With this configuration, it is possible to prevent the conductive bonding material SD from adhering to the first wiring 21 and the second wiring 22 when the semiconductor light emitting device 1 is mounted on the circuit board P10.

[0163] (1-10) The first wiring 21 is disposed at a position spaced apart from the second side surface 16. The second wiring 22 is disposed at a position spaced apart from the first side surface 15. The first wiring 21 and the second wiring 22 are covered with the sealing resin 70. Therefore, the first wiring 21 is not exposed at the second side surface 16. Moreover, the second wiring 22 is not exposed at the first side surface 15. This configuration can prevent the conductive bonding material SD from adhering to the first wiring 21 and the second wiring 22 when the semiconductor light emitting device 1 is mounted on the circuit board P10.

[0164] (1-11) The conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb are formed flush with the mounting surface 13. According to this configuration, the conductive bonding material SD is more likely to adhere to each of the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb, compared to a case in which each of the conductive exposed portions 33s, 33r, 34s, 34r, 35sb, 35rb, 36sb, and 36rb is located inward in the x-direction from the mounting surface 13. Therefore, a decrease in the bonding strength between the mounting surface 13 and the circuit board P10 due to the conductive bonding material SD can be suppressed, and the semiconductor light emitting device 1 can be more stably mounted on the circuit board P10.

[0165] (1-12) The outer conductive exposed portions 33s, 33r are flush with the second side surface 16, and the outer conductive exposed portions 34s, 34r are flush with the first side surface 15. According to this configuration, the conductive bonding material SD adheres more easily to the outer conductive exposed portions 33s, 33r than when the outer conductive exposed portions 33s, 33r are positioned inward in the y direction from the second side surface 16. Also, the conductive bonding material SD adheres more easily to the outer conductive exposed portions 34s, 34r than when the outer conductive exposed portions 34s, 34r are positioned inward in the y direction from the first side surface 15. Therefore, a decrease in the bonding strength between the first side surface 15 and the second side surface 16 and the circuit board P10 due to the conductive bonding material SD can be suppressed, and the semiconductor light emitting device 1 can be more stably mounted on the circuit board P10.

[0166] [Second embodiment] A semiconductor light emitting device 1 of the second embodiment will be described with reference to Figures 16 to 26. The semiconductor light emitting device 1 of this embodiment differs from the semiconductor light emitting device 1 of the first embodiment mainly in the shapes of the wiring layer 20, the conductive layer 30, the connection electrodes 41 to 43, and the external electrode 50. In the following description, differences from the first embodiment will be described, and components common to the first embodiment will be denoted by the same reference numerals and their description may be omitted.

[0167] 16, this embodiment differs from the first embodiment in the shapes of the third wire 23 and the fourth wire 24 in the wiring layer 20. The connection structure between the semiconductor light emitting elements 60A and 60B and the wiring layer 20 is the same as in the first embodiment.

[0168] When viewed from the z direction, both the third wiring 23 and the fourth wiring 24 are disposed inside the outer periphery of the multilayer substrate 10. The edge closer to the second side surface 16 of both ends of the third wiring 23 in the y direction is located closer to the first side surface 15 than the edge closer to the second side surface 16 of both ends of the first wiring 21 in the y direction. The edge closer to the first side surface 15 of both ends of the fourth wiring 24 in the y direction is located closer to the second side surface 16 than the edge closer to the first side surface 15 of both ends of the second wiring 22 in the y direction. In addition, the area of ​​the third wiring 23 viewed from the z direction is smaller than the area of ​​the third wiring 23 of the first embodiment, and the area of ​​the fourth wiring 24 viewed from the z direction is smaller than the area of ​​the fourth wiring 24 of the first embodiment. The third wiring 23 extends in the y direction, and the fourth wiring 24 extends in the x direction.

[0169] 17, in this embodiment, the shape of the connection wiring portion 55 is different. The connection wiring portion 55 is disposed apart from the external electrode 50, and is not connected to the external electrode 50. Furthermore, in this embodiment, the resist layer 56 (see FIG. 4) is omitted.

[0170] As shown in FIG. 18, in this embodiment, an intermediate connection electrode 42 (hereinafter, "intermediate connection electrode 42A") connecting the first main surface side wiring 31A and the first back surface side wiring 32A, and an intermediate connection electrode 42 (hereinafter, "intermediate connection electrode 42B") connecting the second main surface side wiring 31B and the second back surface side wiring 32B are exposed from the mounting surface 13. As shown in FIG. 20, the intermediate connection electrode 42B is not exposed from the first side surface 15. Although not shown, in this embodiment, the intermediate connection electrode 42A is not exposed from the second side surface 16. In this embodiment, the intermediate connection electrodes 42A and 42B correspond to connection electrodes. Note that the intermediate connection electrode 42A in this embodiment is not exposed from the second side surface 16 by design, and may be exposed from the second side surface 16 due to a manufacturing error of the multilayer substrate 10.

[0171] The z-direction ends of the intermediate connecting electrodes 42A, 42B are formed at positions away from the main surface 11 in the z direction. In other words, of both ends of the intermediate connecting electrodes 42A, 42B, the end closer to the main surface 11 is located closer to the back surface 12 than the main surface 11. The intermediate connecting electrodes 42A, 42B are covered by the first base material 10A in the z direction. The intermediate connecting electrode 42A is covered by the first main surface side wiring 31A. The intermediate connecting electrode 42B is covered by the second main surface side wiring 31B.

[0172] The z-direction ends of the intermediate connecting electrodes 42A, 42B are formed at positions away from the rear surface 12 in the z direction. In other words, of both ends of the intermediate connecting electrodes 42A, 42B, the end closer to the rear surface 12 is located closer to the main surface 11 than the rear surface 12. The intermediate connecting electrodes 42A, 42B are covered by the second base material 10B in the z direction. The intermediate connecting electrode 42A is covered by the first rear surface side wiring 32A. The intermediate connecting electrode 42B is covered by the second rear surface side wiring 32B.

[0173] When viewed from the z direction, the intermediate connecting electrode 42A is disposed at a position overlapping with the outer conductive exposed portions 33s and 33r. When viewed from the z direction, the intermediate connecting electrode 42B is disposed at a position overlapping with the outer conductive exposed portions 34s and 34r.

[0174] 18 , in this embodiment, the y-direction length of the outer conductive exposed portions 33s, 33r is equal to the y-direction length of the fourth external electrode 54. The y-direction length of the outer conductive exposed portions 34s, 34r is equal to the y-direction length of the first external electrode 51. However, this is not limited to this, and similarly to the first embodiment, the y-direction length of the outer conductive exposed portions 33s, 33r may be shorter than the y-direction length of the fourth external electrode 54, and the y-direction length of the outer conductive exposed portions 34s, 34r may be shorter than the y-direction length of the first external electrode 51.

[0175] In this embodiment, the length in the y direction of the intermediate connecting electrode 42A is shorter than the length in the y direction of the outer conductive exposed portions 33s, 33r when viewed from the mounting surface 13. The length in the y direction of the intermediate connecting electrode 42A is shorter than the length in the y direction of the fourth external electrode 54 when viewed from the mounting surface 13. The length in the y direction of the intermediate connecting electrode 42A is longer than the length in the y direction of the inner conductive exposed portions 35sb, 35rb, 36sb, 35rb when viewed from the mounting surface 13. In addition, the length in the y direction of the intermediate connecting electrode 42B is equal to the length in the y direction of the intermediate connecting electrode 42B when viewed from the mounting surface 13. However, the lengths in the y direction of the intermediate connecting electrodes 42A, 42B are not limited to this and can be changed arbitrarily.

[0176] As shown in FIG. 19, in this embodiment, the exposed pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the opposite mounting surface 14 is the same as the exposed pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the mounting surface 13, except for the shape (length in the y direction) of the outer conductive exposed portion 36sa. The exposed pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the mounting surface 13 is the same as the exposed pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the mounting surface 13 in the first embodiment. The length of the outer conductive exposed portion 36sa in the y direction in this embodiment is longer than the length of the outer conductive exposed portion 36ra in the y direction. The length of the outer conductive exposed portion 36sa in the y direction can be changed arbitrarily, and may be equal to the outer conductive exposed portion 36ra, or may be shorter than the outer conductive exposed portion 36ra, for example.

[0177] In this embodiment, the third main surface side wiring 31C has an inner conductive exposed portion 35sc exposed from the non-mounting surface 14, and the fourth main surface side wiring 31D has an inner conductive exposed portion 36sc exposed from the non-mounting surface 14. The third back surface side wiring 32C has an inner conductive exposed portion 35rc exposed from the non-mounting surface 14, and the fourth back surface side wiring 32D has an inner conductive exposed portion 36rc exposed from the non-mounting surface 14.

[0178] As shown in Figure 20, the exposure pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the first side 15 is the same as the exposure pattern of the first conductive layer 31 and the second conductive layer 32 exposed from the first side 15 in the first embodiment.

[0179] Next, the detailed configuration of the multilayer substrate 10 will be described. 21 shows the positional relationship between the first conductive layer 31 and the intermediate connection electrode 42 formed on the third base material 10C, and the wiring layer 20 and the main surface side connection electrode 41. For convenience, the wiring layer 20 and the main surface side connection electrode 41 are indicated by two-dot chain lines.

[0180] 21, the first conductive layer 31 has a first main surface side wiring 31A, a second main surface side wiring 31B, a third main surface side wiring 31C, and a fourth main surface side wiring 31D, similar to the first embodiment. The shapes of the first main surface side wiring 31A and the second main surface side wiring 31B are generally similar to those of the first embodiment. In the third main surface side wiring 31C and the fourth main surface side wiring 31D, the shapes of the extensions 31Cb, 31Db are different from those of the first embodiment.

[0181] The extensions 31Cb and 31Db extend in the x direction from the mounting surface 13 to the anti-mounting surface 14. The extension 31Cb is connected to the connection wiring portion 31Ca and is disposed between the first main surface side wiring 31A and the extension 31Db in the y direction. The extension 31Db is connected to the connection wiring portion 31Da and is disposed between the second main surface side wiring 31B and the extension 31Cb in the y direction.

[0182] Of both x-direction edges of the extensions 31Cb, 31Db, the edge closer to the mounting surface 13 is disposed at a position overlapping the mounting surface 13 when viewed from the z-direction. This forms inner conductive exposed portions 35sb, 36sb. Of both x-direction edges of the extensions 31Cb, 31Db, the edge closer to the non-mounting surface 14 is disposed at a position overlapping the non-mounting surface 14 when viewed from the z-direction. This forms inner conductive exposed portions 35sc, 36sc.

[0183] In this embodiment, the position of the intermediate connection electrode 42 is different from that of the first embodiment. The intermediate connection electrodes 42A and 42B have a portion overlapping with the mounting surface 13 when viewed from the z direction. The shapes of the intermediate connection electrodes 42A and 42B when viewed from the z direction are semicircular. The shape of the intermediate connection electrode 42A may be semicircular (arc-shaped) when viewed from the z direction. Both the intermediate connection electrode 42 connected to the third main surface side wiring 31C and the intermediate connection electrode 42 connected to the fourth main surface side wiring 31D are disposed inside the outer periphery of the third base material 10C (multilayer substrate 10) when viewed from the z direction. That is, these intermediate connection electrodes 42 are not exposed from the multilayer substrate 10.

[0184] 22 shows the positional relationship between the second conductive layer 32 and the intermediate connection electrode 42 formed on the third base material 10C, and the external electrode 50 and the back surface side connection electrode 43. For convenience, the first conductive layer 31 and the intermediate connection electrode 42 are indicated by two-dot chain lines.

[0185] 22, the second conductive layer 32 has a first back surface side wiring 32A, a second back surface side wiring 32B, a third back surface side wiring 32C, and a fourth back surface side wiring 32D, similar to the first embodiment. The shapes of the first back surface side wiring 32A and the second back surface side wiring 32B are generally similar to those of the first embodiment. In the third back surface side wiring 32C and the fourth back surface side wiring 32D, the shapes of the extensions 32Cb, 32Db are different from those of the first embodiment.

[0186] The extensions 32Cb and 32Db extend in the x direction from the mounting surface 13 to the opposite mounting surface 14. The positional relationship between the extensions 32Cb and 32Db is the same as the positional relationship between the extensions 31Cb and 32Db. The extension 32Cb is connected to the connection wiring portion 32Ca, and the extension 32Db is connected to the connection wiring portion 32Da.

[0187] Of both x-direction edges of the extensions 32Cb, 32Db, the edge closer to the mounting surface 13 is disposed at a position overlapping the mounting surface 13 when viewed from the z-direction. This forms the inner conductive exposed portions 35rb, 36rb. Of both x-direction edges of the extensions 32Cb, 32Db, the edge closer to the anti-mounting surface 14 is disposed at a position overlapping the anti-mounting surface 14 when viewed from the z-direction. This forms the inner conductive exposed portions 35rc, 36rc.

[0188] When viewed from the z direction, the extension 32Cb is disposed at a position overlapping with the third external electrode 53. The extension 32Cb and the third external electrode 53 are connected by the back surface side connection electrode 43. The portion of the extension 32Cb to which the back surface side connection electrode 43 is connected is enlarged compared to other portions of the extension 32Cb.

[0189] When viewed from the z direction, the extension 32Db is disposed at a position overlapping the second external electrode 52. The extension 32Db and the second external electrode 52 are connected by the back surface side connection electrode 43. The portion of the extension 32Db to which the back surface side connection electrode 43 is connected is enlarged compared to other portions of the extension 32Db.

[0190] Next, an example of a wiring pattern in the manufacturing process of the multilayer substrate 10 will be described. The dashed rectangular shapes in Figs. 23 to 26 indicate the size equivalent to the multilayer substrate 10. Also, each of Figs. 23 to 26 shows an example of an area in which eight multilayer substrates 10 are manufactured. The wiring patterns shown in Figs. 23 to 26 are shown in a see-through state of the multilayer substrate 10 from the side of the main surface 11. Also, the manufacturing method of the multilayer substrate 10 is the same as the manufacturing method of the multilayer substrate 10 of the first embodiment.

[0191] The base material of multilayer substrate 10 has a first base material 810A shown in FIG. 23, a third base material 810C shown in FIGS. 24 and 25, and a second base material 810B shown in FIG. First substrate 810A is a substrate corresponding to first substrate 10A of multilayer substrate 10, and is a substrate before being cut to the size of multilayer substrate 10 shown in the dashed rectangular shape in Fig. 23. First substrate 810A is formed so as to cover a main surface of third substrate 810C and a first conductive layer 831 (described later) on the main surface of third substrate 810C.

[0192] Third base material 810C is a base material corresponding to third base material 10C of multilayer substrate 10, and is a base material before being cut to the size of multilayer substrate 10 shown by the dashed rectangular shape in FIG. Second substrate 810B is a substrate corresponding to second substrate 10B of multilayer substrate 10, and is a substrate before being cut to the size of multilayer substrate 10 shown in the dashed rectangular shape in Fig. 25. Second substrate 810B is formed so as to cover the rear surface of third substrate 810C and a second conductive layer 832 (described later) on the rear surface of third substrate 810C.

[0193] As shown in FIG. 23, a wiring layer 820 is formed on the main surface of the first substrate 810A. A plurality of main surface side connection electrodes 41 are formed on the first substrate 810A. As shown in FIG. 24, a first conductive layer 831 is formed on the main surface of the third substrate 810C, and as shown in FIG. 25, a second conductive layer 832 is formed on the rear surface of the third substrate 810C. A plurality of intermediate connection electrodes 42 are formed on the third substrate 810C. As shown in FIG. 26, an external electrode 850 is formed on the rear surface of the second substrate 810B. A plurality of rear surface side connection electrodes 43 are formed on the second substrate 810B.

[0194] FIG. 23 shows an example of the wiring layer 820 and the main surface side connection electrode 41 formed on the first base material 810A. The wiring layer 820 is a conductive layer corresponding to the wiring layer 20 of the multilayer substrate 10, and has a plurality of first wirings 821, a plurality of second wirings 822, a plurality of third wirings 823, and a plurality of fourth wirings 824. The method of forming the wiring layer 820 is the same as the method of forming the wiring layer 720 of the first embodiment. Each of the first wirings 821 is a wiring corresponding to the first wiring 21 of the multilayer substrate 10, each of the second wirings 822 is a wiring corresponding to the second wiring 22 of the multilayer substrate 10, each of the third wirings 823 is a wiring corresponding to the third wiring 23 of the multilayer substrate 10, and each of the fourth wirings 824 is a wiring corresponding to the fourth wiring 24 of the multilayer substrate 10. These wirings 821 to 824 are formed so as not to straddle the cutting line CL. A plurality of main surface side connection electrodes 41 are formed on the first base material 810A. The method of forming each of the main surface side connection electrodes 41 is the same as in the first embodiment.

[0195] 24 and 25 show an example of a first conductive layer 831, a second conductive layer 832, and an intermediate connector electrode 42 formed on a third base material 810C. The first conductive layer 831 is a conductive layer corresponding to the first conductive layer 31 of the multilayer substrate 10. The method of forming the first conductive layer 31 is the same as the method of forming the first conductive layer 731 of the first embodiment. The first conductive layer 831 has a wiring unit 831U in which a plurality of common wirings 831A arranged at a distance from each other in the x direction are connected to each other by a pair of connection wirings 831B. A plurality of wiring units 831U are formed on the third base material 810C. The plurality of wiring units 831U are arranged at a distance from each other in the y direction. The pair of connection wirings 831B are distributed and arranged on both sides of the common wiring 831A in the y direction. The wiring unit 831U has a shape that is line-symmetrical with respect to a virtual line extending in the x direction at the center of the wiring unit 831U in the y direction.

[0196] Each common wiring 831A includes a connection wiring portion 31Ca of the first main surface side wiring 31A, the second main surface side wiring 31B, and the third main surface side wiring 31C, and a connection wiring portion 31Da of the fourth main surface side wiring 31D. The pair of connection wirings 831B includes an extension portion 31Cb of the third main surface side wiring 31C and an extension portion 31Db of the fourth main surface side wiring 31D.

[0197] The third base material 810C is cut so that the multilayer substrate 10 (in the rectangular shape of the dashed line) overlaps with parts of the wiring units 831U adjacent to each other in the y direction. As a result, the main surface side wirings 31A to 31D spaced apart from each other are formed on the cut third base material 810C. In this case, as shown in FIG. 24, the main surface side wirings 31A to 31D are individually formed by the four common wirings 831A.

[0198] Each intermediate connecting electrode 42 is disposed at a position overlapping with the common wiring 831A when viewed from the z direction. Both the intermediate connecting electrode 42A and the intermediate connecting electrode 42B are formed to straddle the cutting line CL. As a result, when the third base material 810C is cut, the intermediate connecting electrodes 42A and 42B are exposed from the side surface (mounting surface 13) of the third base material 810C.

[0199] The second conductive layer 832 is a conductive layer corresponding to the second conductive layer 32 of the multilayer substrate 10. The method of forming the second conductive layer 832 is the same as the method of forming the second conductive layer 732 of the first embodiment. The second conductive layer 832 has a wiring unit 832U in which a plurality of common wirings 832A arranged at a distance from each other in the x direction are connected to each other by a pair of connection wirings 832B. A plurality of wiring units 832U are formed on the second base material 810B. The plurality of wiring units 832U are arranged at a distance from each other in the y direction. The pair of connection wirings 832B are distributed and arranged on both sides of the common wiring 832A in the y direction. The wiring unit 832U has a shape that is line-symmetrical with respect to a virtual line extending in the x direction at the center of the wiring unit 832U in the y direction.

[0200] Each common wiring 832A includes a connection wiring portion 32Ca of the first back-surface-side wiring 32A, the second back-surface-side wiring 32B, and the third back-surface-side wiring 32C, and a connection wiring portion 32Da of the fourth back-surface-side wiring 32D. The pair of connection wirings 832B includes an extension portion 32Cb of the third back-surface-side wiring 32C and an extension portion 32Db of the fourth back-surface-side wiring 32D.

[0201] The second base material 810B is cut so that the multilayer substrate 10 (rectangles indicated by dashed lines) overlaps with parts of the wiring units 832U adjacent to each other in the y direction. As a result, the rear surface side wirings 32A-32D spaced apart from each other are formed on the cut second base material 810B. In this case, as shown in FIG. 25, the rear surface side wirings 32A-32D are individually formed by the four common wirings 832A.

[0202] FIG. 26 shows an example of an external electrode 850 formed on the second base material 810B. The external electrodes 850 are conductive layers corresponding to the external electrodes 50 of the multilayer substrate 10, and a plurality of external electrodes 850 are formed on the third base material 810C. The method for forming the external electrodes 850 is similar to the method for forming the external electrodes 750 of the first embodiment. In an arrangement mode of the plurality of external electrodes 850, the external electrodes 850 are arranged in a row spaced apart from each other in the x direction, and are arranged in a row spaced apart from each other in the y direction. The external electrodes 850 include a first external electrode 51, a second external electrode 52, a third external electrode 53, and a fourth external electrode 54. In the external electrode 850, the external electrodes 51 to 54 have an integrated shape.

[0203] Second base material 810B is cut so that multilayer substrate 10 (rectangle shape indicated by dashed lines) overlaps with parts of adjacent external electrodes 850 in the y direction. As a result, external electrodes 51-54 spaced apart from one another and connection wiring portions 55 spaced apart from one another are formed on cut second base material 810B.

[0204] In the method for manufacturing the semiconductor light emitting device 1, the semiconductor light emitting elements 60A, 60B are mounted on the wiring layer 820 of the base material configured as described above. Then, wires WA, WB1, WB2 that connect the semiconductor light emitting elements 60A, 60B and the wiring layer 820 are formed using a wire bonding device.

[0205] Next, a resin layer is formed to seal the semiconductor light emitting elements 60A, 60B and the wires WA, WB1, WB2. This resin layer corresponds to the sealing resin and seals the semiconductor light emitting elements 60A, 60B and the wires WA, WB1, WB2.

[0206] Finally, the resin layer and the base material of the multilayer substrate are cut using a dicing blade along the cutting lines CL shown in Figures 23 to 26, thereby dividing the semiconductor light emitting devices 1. Through the above steps, the semiconductor light emitting devices 1 are manufactured.

[0207] Before mounting the semiconductor light emitting elements 60A and 60B, the base material of the multilayer substrate may be cut along the cutting lines CL using a dicing blade. This causes the multilayer substrate 10 to be divided into individual pieces. In this case, the semiconductor light emitting elements 60A and 60B are mounted on the individual pieces of the multilayer substrate 10.

[0208] According to this embodiment, in addition to the effects of the first embodiment, the following effects can be obtained. (2-1) Both the intermediate connection electrode 42A connecting the first main surface side wiring 31A and the first back surface side wiring 32A, and the intermediate connection electrode 42B connecting the second main surface side wiring 31B and the second back surface side wiring 32B are exposed from the mounting surface 13.

[0209] According to this configuration, the intermediate connection electrodes 42A, 42B can be bonded to the circuit board P10 by the conductive bonding material SD. Therefore, the bonding strength between the mounting surface 13 and the circuit board P10 is improved, and the force of the conductive bonding material SD bonded to each of the external electrodes 51-54 that brings the back surface 12 closer to the circuit board P10 makes it even more difficult for the mounting surface 13 to separate from the circuit board P10. Therefore, the semiconductor light emitting device 1 can be more stably mounted on the circuit board P10.

[0210] (2-2) The first base material 10A covers the intermediate connector electrode 42 in the z direction. According to this configuration, when a resin layer corresponding to the sealing resin 70 is formed in the manufacturing process of the semiconductor light emitting device 1, the first base material 810A corresponding to the first base material 10A prevents the resin material constituting the resin layer from penetrating into the intermediate connecting electrode 42. This makes it easier for the intermediate connecting electrode 42 exposed from the mounting surface 13 to be joined to the circuit board P10 by the conductive bonding material SD.

[0211] [Third embodiment] 27 to 37, the semiconductor light emitting device 1 of the third embodiment will be described. The semiconductor light emitting device 1 of the present embodiment differs from the semiconductor light emitting device 1 of the first embodiment mainly in that it includes one semiconductor light emitting element 60C instead of the semiconductor light emitting elements 60A and 60B, and accordingly the shapes of the wiring layer 100, the conductive layer 110, and the external electrode 130 are mainly different. In the following description, differences from the first embodiment will be described, and components common to the first embodiment may be denoted by the same reference numerals and their description may be omitted.

[0212] As shown in FIG. 27, the semiconductor light emitting device 1 of this embodiment includes one semiconductor light emitting element 60C. One example of the semiconductor light emitting element 60C is a VCSEL element. The semiconductor light emitting element 60C may be an LED element or a phototransistor. The semiconductor light emitting element 60C has an element main surface 60Cs and an element back surface 60Cr (see FIG. 29) facing opposite directions in the z direction. The element main surface 60Cs constitutes a light emitting surface. A first electrode 61C is formed on the element main surface 60Cs, and a second electrode 62C (see FIG. 29) is formed on the element back surface 60Cr.

[0213] The semiconductor light emitting element 60C is mounted on a wiring layer 100 formed on the main surface 11 of the multilayer substrate 10. The wiring layer 100 is made of the same material as the wiring layer 20 of the first embodiment, for example, and has a first wiring 101 and a second wiring 102.

[0214] The first wiring 101 is a wiring on which the semiconductor light emitting element 60C is mounted. The second wiring 102 is a wiring electrically connected to the semiconductor light emitting element 60C. The first wiring 101 and the second wiring 102 are arranged in a state where they are aligned with each other in the x direction and spaced apart from each other in the y direction. The second wiring 102 is disposed on the main surface 11 closer to the second side surface 16 than the first wiring 101.

[0215] As shown in FIG. 29, the semiconductor light emitting element 60C is mounted on the first wiring 101 so that the element principal surface 60Cs faces the same side as the principal surface 11. The element rear surface 60Cr of the semiconductor light emitting element 60C is joined to the first wiring 101 by a conductive bonding material SD1. This electrically connects the second electrode 62C of the semiconductor light emitting element 60C to the first wiring 101. The first electrode 61C of the semiconductor light emitting element 60C to the second wiring 102 by a wire WC. This electrically connects the first electrode 61C to the second wiring 102.

[0216] 27, a recess 101a is formed in one of both ends in the y direction of the first wiring 101 that is closer to the first side surface 15. The recess 101a is recessed along the y direction. The recess 101a indicates the polarity of the semiconductor light emitting device 1 (the connection direction of the semiconductor light emitting device 1).

[0217] 28, an external electrode 130 and a resist layer 133 are formed on the rear surface 12 of the multilayer substrate 10. The external electrode 130 is formed of, for example, the same material as the external electrode 50 of the first embodiment. The resist layer 133 is formed of, for example, the same material as the resist layer 56 of the first embodiment.

[0218] The external electrode 130 has a first external electrode 131 and a second external electrode 132. The first external electrode 131 and the second external electrode 132 are arranged spaced apart from each other in the y direction while being aligned with each other in the x direction. The first external electrode 131 is disposed at one of both ends of the back surface 12 in the y direction that is closer to the first side surface 15. The second external electrode 132 is disposed at one of both ends of the back surface 12 in the y direction that is closer to the second side surface 16.

[0219] The resist layer 133 indicates the polarity of the semiconductor light emitting device 1. When viewed from the z direction, the resist layer 133 has a T-shape having a portion located between the first external electrode 131 and the second external electrode 132 in the y direction and a portion located closer to the non-mounting surface 14 than the external electrodes 131, 132.

[0220] As shown in FIG. 29, the semiconductor light emitting device 1 includes a conductive layer 110 having a different shape from the conductive layer 30, instead of the conductive layer 30. The conductive layer 110 includes a first conductive layer 111 and a second conductive layer 112, similar to the conductive layer 30. The first conductive layer 111 is formed between the first base material 10A and the third base material 10C, and the second conductive layer 112 is formed between the third base material 10C and the second base material 10B. In the z direction, the first conductive layer 111 and the second conductive layer 112 are disposed apart from both the main surface 11 and the back surface 12. The first conductive layer 111 and the second conductive layer 112 are disposed apart from each other in the z direction. The second conductive layer 112 is disposed closer to the external electrode 130 than the first conductive layer 111 in the z direction.

[0221] The detailed configuration of the multilayer substrate 10 will now be described. 32 shows the positional relationship between the first conductive layer 111 formed on the third base material 10C and the wiring layer 100. For convenience, the wiring layer 100 is shown by a two-dot chain line.

[0222] As shown in FIG. 32, the first conductive layer 111 has a first main surface side wiring 111A electrically connected to the first wiring 101 and a second main surface side wiring 111B electrically connected to the second wiring 102. The first wiring 101 and the first main surface side wiring 111A are connected by a main surface side connection electrode 121 (see FIG. 26). The second wiring 102 and the second main surface side wiring 111B are connected by another main surface side connection electrode 121. The first main surface side wiring 111A is disposed at a position overlapping the first wiring 101 when viewed from the z direction. The second main surface side wiring 111B is disposed at a position overlapping the second wiring 102 when viewed from the z direction. In this embodiment, each main surface side connection electrode 121 penetrates the first base material 10A in the z direction and is disposed inside the outer periphery of the multilayer substrate 10. Therefore, when viewed from the x and y directions, each of the main surface side connection electrodes 121 is not exposed from the multilayer substrate 10. Each of the main surface side connection electrodes 121 is formed in the same manner as the main surface side connection electrodes 41 of the first embodiment.

[0223] The first main surface side wiring 111A is arranged at one of both ends in the y direction of the third base material 10C that is closer to the first side surface 15. The second main surface side wiring 111B is arranged at one of both ends in the y direction of the third base material 10C that is closer to the second side surface 16. The first main surface side wiring 111A and the second main surface side wiring 111B are line-symmetrical with respect to a virtual line along the x direction at the center of the third base material 10C in the y direction when viewed from the z direction.

[0224] The first principal surface side wiring 111A is formed in the x direction from the mounting surface 13 to the opposite mounting surface 14. The first principal surface side wiring 111A has a conductive exposed portion 111Aa exposed from the mounting surface 13 and an opposite side conductive exposed portion 111Ab exposed from the opposite mounting surface 14. In this embodiment, the conductive exposed portion 111Aa corresponds to the first conductive exposed portion.

[0225] When viewed from the z direction, the edge closer to the first side surface 15 of both ends of the conductive exposed portion 111Aa in the y direction is formed at the same position as the first side surface 15. That is, the conductive exposed portion 111Aa is also exposed from the first side surface 15. The conductive exposed portion 111Aa is continuously exposed from the mounting surface 13 to the first side surface 15. That is, the part of the conductive exposed portion 111Aa exposed from the mounting surface 13 and the part of the conductive exposed portion 111Aa exposed from the first side surface 15 are connected. Therefore, as shown in FIG. 28, when viewed from the mounting surface 13, the conductive exposed portion 111Aa extends along the y direction from the edge closer to the first side surface 15 of both ends of the mounting surface 13 in the y direction. Also, as shown in FIG. 32, the conductive exposed portion 111Aa extends along the x direction from the edge closer to the mounting surface 13 of both ends of the first side surface 15. In this embodiment, the portion of the conductive exposed portion 111Aa exposed from the first side surface 15 corresponds to the side surface exposed portion.

[0226] When viewed from the z direction, of both end edges in the y direction of the opposite-side conductive exposed portion 111Ab, the edge closer to the first side surface 15 is formed inside the first side surface 15. In other words, the opposite-side conductive exposed portion 111Ab is not exposed from the first side surface 15.

[0227] The second principal surface side wiring 111B has a conductive exposed portion 111Ba and an opposite side conductive exposed portion 111Bb, similar to the first principal surface side wiring 111A. The conductive exposed portion 111Ba is also exposed from the second side surface 16. The conductive exposed portion 111Ba is continuously exposed from the mounting surface 13 to the second side surface 16. In other words, the part of the conductive exposed portion 111Ba exposed from the mounting surface 13 and the part exposed from the second side surface 16 are connected. In this embodiment, the conductive exposed portion 111Ba corresponds to the first conductive exposed portion. The part of the conductive exposed portion 111Ba exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0228] 33 shows the positional relationship between the second conductive layer 112 formed on the second base material 10B and the external electrode 130. For convenience, the first conductive layer 111 is shown by a two-dot chain line. As shown in FIG. 33, the second conductive layer 112 has a first back surface side wiring 112A electrically connected to the first main surface side wiring 111A, and a second back surface side wiring 112B electrically connected to the second main surface side wiring 111B. The first main surface side wiring 111A and the first back surface side wiring 112A are connected by an intermediate connection electrode 122. The intermediate connection electrode 122 penetrates the third base material 10C in the z direction. The second main surface side wiring 111B and the second back surface side wiring 112B are connected by another intermediate connection electrode 122. The first back surface side wiring 112A is arranged at a position overlapping the first main surface side wiring 111A when viewed from the z direction. The second back surface side wiring 112B is arranged at a position overlapping the second main surface side wiring 111B when viewed from the z direction. In this embodiment, each intermediate connection electrode 122 is arranged inside the outer periphery of the multilayer substrate 10. Therefore, when viewed from the x direction and the y direction, each intermediate connecting electrode 122 is not exposed from the multilayer substrate 10. Each intermediate connecting electrode 122 is formed in the same manner as the intermediate connecting electrode 42 of the first embodiment.

[0229] The first back surface side wiring 112A has the same shape as the first main surface side wiring 111A. Therefore, the first back surface side wiring 112A has a conductive exposed portion 112Aa and an opposite side conductive exposed portion 112Ab, similar to the first main surface side wiring 111A. In this embodiment, the conductive exposed portion 112Aa corresponds to the second conductive exposed portion. The portion of the conductive exposed portion 112Aa exposed from the first side surface 15 corresponds to the side surface exposed portion.

[0230] The second back surface side wiring 112B has the same shape as the second main surface side wiring 111B. Therefore, the second back surface side wiring 112B has a conductive exposed portion 112Ba and an opposite side conductive exposed portion 112Bb, similar to the second main surface side wiring 111B. In this embodiment, the conductive exposed portion 112Ba corresponds to the second conductive exposed portion. The portion of the conductive exposed portion 112Ba exposed from the second side surface 16 corresponds to the side surface exposed portion.

[0231] The second conductive layer 112 and the external electrode 130 are connected by the back-side connection electrode 123. More specifically, the first back-side wiring 112A and the first external electrode 131 are connected by the back-side connection electrode 123. The second back-side wiring 112B and the second external electrode 132 are connected by another back-side connection electrode 123. In this manner, the first wiring 101 is electrically connected to the first external electrode 131 via the main-side connection electrode 121, the first main-side wiring 111A, the intermediate connection electrode 122, the first back-side wiring 112A, and the back-side connection electrode 123. The second wiring 102 is electrically connected to the second external electrode 132 via the main-side connection electrode 121, the second main-side wiring 111B, the intermediate connection electrode 122, the second back-side wiring 112B, and the back-side connection electrode 123. Each back-side connection electrode 123 penetrates the second base material 10B in the z direction.

[0232] Next, the relationship between first conductive layer 111, second conductive layer 112, and external electrode 130 will be described. 29, the conductive exposed portion 111Aa and the conductive exposed portion 111Ba are both provided between the first base material 10A and the third base material 10C, and are therefore aligned with each other in the z direction. The conductive exposed portion 111Aa and the conductive exposed portion 111Ba are arranged at a distance from each other in the y direction. In other words, the y direction corresponds to the first direction, which is the arrangement direction of the conductive exposed portions.

[0233] Both the conductive exposed portion 112Aa and the conductive exposed portion 112Ba are provided between the second base material 10B and the third base material 10C, and therefore are aligned with each other in the z direction. The conductive exposed portion 112Aa and the conductive exposed portion 112Ba are arranged apart from each other in the y direction. Therefore, the y direction can also be said to be the arrangement direction of the conductive exposed portion in which the conductive exposed portion 112Aa and the conductive exposed portion 112Ba are arranged. In this case, the y direction corresponds to the first direction.

[0234] 29, the conductive exposed portion 111Aa, the conductive exposed portion 112Aa, and the first external electrode 131 are arranged spaced apart from each other in the z direction while being aligned with each other in the y direction. The conductive exposed portion 111Ba, the conductive exposed portion 112Ba, and the second external electrode 132 are arranged spaced apart from each other in the z direction while being aligned with each other in the y direction.

[0235] The length in the y direction of the conductive exposed portion 111Aa is equal to the length in the y direction of the conductive exposed portion 111Ba. The length in the y direction of the conductive exposed portion 112Aa is equal to the length in the y direction of the conductive exposed portion 112Ba. The length in the y direction of the first external electrode 131 is equal to the length in the y direction of the second external electrode 132. The length in the y direction of each of the conductive exposed portions 111Aa, 111Ba, 112Aa, and 112Ba is equal to or less than the length in the y direction of each of the external electrodes 131 and 132. In this embodiment, the length in the y direction of each of the conductive exposed portions 111Aa, 111Ba, 112Aa, and 112Ba is shorter than the length in the y direction of each of the external electrodes 131 and 132.

[0236] 30, the opposite side conductive exposed portion 111Ab and the opposite side conductive exposed portion 111Bb are both provided between the first base material 10A and the third base material 10C, and are therefore aligned with each other in the z direction. The opposite side conductive exposed portion 111Ab and the opposite side conductive exposed portion 111Bb are arranged at a distance from each other in the y direction.

[0237] Both the opposite side conductive exposed portion 112Ab and the opposite side conductive exposed portion 112Bb are provided between the second base material 10B and the third base material 10C, and therefore are aligned with each other in the z direction. The opposite side conductive exposed portion 112Ab and the opposite side conductive exposed portion 112Bb are arranged at a distance from each other in the y direction.

[0238] 30, the opposite side conductive exposed portion 111Ab and the opposite side conductive exposed portion 112Ab are arranged spaced apart from each other in the z direction while being aligned with each other in the y direction. The opposite side conductive exposed portion 111Bb and the opposite side conductive exposed portion 112Bb are arranged spaced apart from each other in the z direction while being aligned with each other in the y direction.

[0239] The length in the y direction of the opposite side conductive exposed portion 111Ab is equal to the length in the y direction of the opposite side conductive exposed portion 111Bb. The length in the y direction of the opposite side conductive exposed portion 112Ab is equal to the length in the y direction of the opposite side conductive exposed portion 112Bb. The length in the y direction of each of the conductive exposed portions 111Ab, 111Bb is equal to the length in the y direction of each of the conductive exposed portions 112Ab, 112Bb.

[0240] 29 and 30, the length in the y direction of each of the conductive exposed portions 111Ab, 111Bb, 112Ab, and 112Bb is shorter than the length in the y direction of each of the conductive exposed portions 111Aa, 111Ba, 112Aa, and 112Ba. Therefore, the exposure pattern of each of the wirings 111A, 111B, 112A, and 112B exposed from the mounting surface 13 is different from the exposure pattern of each of the wirings 111A, 111B, 112A, and 112B exposed from the opposite mounting surface 14.

[0241] As shown in FIG. 31, the conductive exposed portion 111Aa and the conductive exposed portion 112Aa are aligned in the x direction and spaced apart from each other in the z direction. The length in the x direction of the conductive exposed portion 111Aa is equal to the length in the x direction of the conductive exposed portion 112Aa. The length in the x direction of each of the conductive exposed portions 111Aa and 112Aa is equal to or greater than ½ of the length in the x direction of the multilayer substrate 10. In this embodiment, the length in the x direction of each of the conductive exposed portions 111Aa and 112Aa is greater than ½ of the length in the x direction of the multilayer substrate 10. That is, each of the conductive exposed portions 111Aa and 112Aa extends from the mounting surface 13 to a position farther from the mounting surface 13 than the center in the x direction of the first side surface 15. In this embodiment, the length in the x direction of each of the conductive exposed portions 111Aa and 112Aa is equal to the length in the x direction of the first external electrode 131 (external electrode 130). Here, the x direction corresponds to the second direction because it is a direction perpendicular to both the z direction, which is the thickness direction of the multilayer substrate 10, and the y direction, which is the arrangement direction of the exposed conductive portions.

[0242] Although not shown, the length in the x direction of each of the conductive exposed portions 111Ba, 112Ba is equal to the length in the x direction of each of the conductive exposed portions 111Aa, 112Aa. That is, the length in the x direction of each of the conductive exposed portions 111Ba, 112Ba is equal to or more than 1 / 2 the length in the x direction of the multilayer substrate 10. In this embodiment, the length in the x direction of each of the conductive exposed portions 111Ba, 112Ba is greater than 1 / 2 the length in the x direction of the multilayer substrate 10. Therefore, each of the conductive exposed portions 111Ba, 112Ba extends from the mounting surface 13 to a position farther from the mounting surface 13 than the center in the x direction of the second side surface 16. In this embodiment, the length in the x direction of each of the conductive exposed portions 111Ba, 112Ba is equal to the length in the x direction of the second external electrode 132 (external electrode 130).

[0243] Next, an example of each wiring pattern in the manufacturing process of the multilayer substrate 10 will be described. The dashed rectangular shapes in Figs. 34 to 37 indicate the size equivalent to the multilayer substrate 10. Also, each of Figs. 34 to 37 shows an example of an area in which a plurality of multilayer substrates 10 are manufactured. The wiring patterns shown in Figs. 34 to 37 are shown in a see-through state of the multilayer substrate 10 from the main surface 11 side. Also, the manufacturing method of the multilayer substrate 10 is the same as the manufacturing method of the multilayer substrate 10 of the first embodiment.

[0244] The base material of multilayer substrate 10 has a first base material 910A shown in FIG. 34, a third base material 910C shown in FIGS. 35 and 36, and a second base material 910B shown in FIG. First substrate 910A is a substrate corresponding to first substrate 10A of multilayer substrate 10, and is a substrate before being cut to the size of multilayer substrate 10 shown in the dashed rectangular shape in Fig. 34. First substrate 910A is formed so as to cover a main surface of third substrate 910C and a first conductive layer 931 (described later) on the main surface of third substrate 910C.

[0245] Third substrate 910C is a substrate corresponding to third substrate 10C of multilayer substrate 10, and is the substrate before being cut to the size of multilayer substrate 10 shown by the dashed rectangular shape in FIGS. Second substrate 910B is a substrate corresponding to second substrate 10B of multilayer substrate 10, and is a substrate before being cut to the size of multilayer substrate 10 shown in the dashed rectangular shape in Fig. 37. Second substrate 910B is formed so as to cover the rear surface of third substrate 910C and a second conductive layer 932 (described later) on the rear surface of third substrate 910C.

[0246] As shown in FIG. 34, a wiring layer 920 is formed on the main surface of the first base material 910A. A plurality of main surface side connection electrodes 121 are formed on the first base material 910A. As shown in FIG. 35, a first conductive layer 931 is formed on the main surface of the third base material 910C, and as shown in FIG. 36, a second conductive layer 932 is formed on the back surface of the third base material 910C. A plurality of intermediate connection electrodes 122 are formed on the third base material 910C. As shown in FIG. 37, an external electrode 950 is formed on the back surface of the second base material 910B. A plurality of back surface side connection electrodes 123 are formed on the second base material 910B.

[0247] FIG. 34 shows an example of a wiring layer 920 and a main surface side connection electrode 41 formed on a first base material 910A. The wiring layer 920 is a conductive layer corresponding to the wiring layer 100 of the multilayer substrate 10, and has a plurality of first wirings 921 and a plurality of second wirings 922. The method of forming the wiring layer 920 is similar to the method of forming the wiring layer 720 of the first embodiment. Each of the first wirings 921 corresponds to the first wirings 101 of the wiring layer 100, and each of the second wirings 922 corresponds to the second wirings 102 of the wiring layer 100. A plurality of main surface side connection electrodes 121 are formed on the first base material 910A. The method of forming each of the main surface side connection electrodes 121 is the same as the method of forming the main surface side connection electrodes 41 of the first embodiment.

[0248] 35 and 36 show an example of a first conductive layer 931, a second conductive layer 932, and an intermediate connector electrode 122 formed on a third base material 910C. The first conductive layer 931 is a conductive layer corresponding to the first conductive layer 111 of the multilayer substrate 10. The method of forming the first conductive layer 931 is similar to the method of forming the first conductive layer 731 of the first embodiment. The first conductive layer 931 has a wiring unit 931U having a plurality of common wirings 931A arranged at a distance from each other in the x direction and a pair of connection wirings 931B connecting the common wirings 931A adjacent to each other in the x direction. The first conductive layer 931 has a plurality of wiring units 931U, and is configured so that the plurality of wiring units 931U are arranged at a distance from each other in the y direction.

[0249] Each common wiring 931A includes a portion of two first main surface side wirings 111A and a portion of two second main surface side wirings 111B. The pair of connection wirings 931B includes a portion of the first main surface side wiring 111A and a portion of the second main surface side wiring 111B. Therefore, the two first main surface side wirings 111A and two second main surface side wirings 111B are formed by the common wiring 931A and the pair of connection wirings 931B on both sides of the common wiring 931A in the x direction.

[0250] The second conductive layer 932 is a conductive layer corresponding to the second conductive layer 112 of the multilayer substrate 10. The method for forming the second conductive layer 932 is the same as the method for forming the second conductive layer 732 of the first embodiment. When viewed from the z direction, the shape of the second conductive layer 932 is the same as the shape of the first conductive layer 931 (see FIG. 35). Therefore, like the first conductive layer 931, the second conductive layer 932 has a plurality of wiring units 932U formed therein, each of which has a plurality of common wirings 932A and a pair of connection wirings 932B.

[0251] 35, the third base material 910C is cut along the cutting lines CL so that the multilayer substrate 10 overlaps with a part of the wiring unit 931U adjacent to each other in the y direction. As a result, a plurality of third base materials 10C are formed, and one first main surface side wiring 111A and one second main surface side wiring 111B are formed on each third base material 10C.

[0252] 36, the third base material 910C is cut along the cutting lines CL so that the multilayer substrate 10 overlaps with a part of the wiring unit 932U adjacent in the y direction. As a result, a plurality of third base materials 10C are formed, and one first back surface side wiring 112A and one second back surface side wiring 112B are formed on each of the third base materials 10C.

[0253] 35 is formed so as to divide the common wiring 931A into four in the x-direction and the y-direction, and is formed so as to divide the pair of connection wirings 931B in the y-direction. Therefore, the first principal surface side wiring 111A and the second principal surface side wiring 111B formed by cutting the third base material 910C along the cutting lines CL have conductive exposed portions 111Ab, 111Bb, 111Aa, and 111Ba.

[0254] 36 is formed so as to divide the common wiring 932A into four in the x-direction and the y-direction, and is formed so as to divide the pair of connection wirings 932B in the y-direction. Therefore, the first back-surface-side wiring 112A and the second back-surface-side wiring 112B formed by cutting the third base material 910C along the cutting lines CL have the conductive exposed portions 112Ab, 112Bb, 112Aa, and 112Ba formed therein.

[0255] FIG. 37 shows an example of an external electrode 950 formed on the second base material 910B. The external electrodes 950 are conductive layers corresponding to the external electrodes 50 of the multilayer substrate 10, and a plurality of external electrodes 950 are formed on the third base material 910C. The method for forming the external electrodes 950 is similar to the method for forming the external electrodes 750 of the first embodiment. In an arrangement mode of the plurality of external electrodes 950, a row of the external electrodes 950 arranged at a distance from each other in the x direction are arranged at a distance from each other in the y direction. The external electrode 950 has a shape in which two first external electrodes 131 and two second external electrodes 132 are integrated together.

[0256] 37, the second base material 910B is cut so that the multilayer substrate 10 overlaps with parts of the external electrodes 950 adjacent to each other in the y direction. As a result, one first external electrode 131 and one second external electrode 132 spaced apart from each other are formed on the cut second base material 910B.

[0257] In the method for manufacturing the semiconductor light emitting device 1, the semiconductor light emitting element 60C is mounted on the wiring layer 920 of the base material configured as described above. Then, the wires WC that connect the semiconductor light emitting element 60C and the wiring layer 920 are formed using a wire bonding device.

[0258] Next, a resin layer is formed to seal the semiconductor light emitting elements 60C and the wires WC. This resin layer corresponds to the sealing resin, and seals the semiconductor light emitting elements 60C and the wires WC.

[0259] Finally, a dicing blade is used to cut the resin layer and the base material of the multilayer substrate along cutting lines CL shown in Figures 34 to 37, thereby dividing the semiconductor light emitting devices 1. Through the above steps, the semiconductor light emitting devices 1 are manufactured.

[0260] Before mounting the semiconductor light emitting element 60C, the base material of the multilayer substrate may be cut along the cutting line CL using a dicing blade. This causes the multilayer substrate 10 to be divided into individual pieces. In this case, the semiconductor light emitting element 60C is mounted on the individual pieces of the multilayer substrate 10.

[0261] According to the semiconductor light emitting device 1 of this embodiment, in addition to the effects equivalent to those of the first embodiment, the following effects can be obtained. (3-1) The length in the x direction of each of the conductive exposed portions 111Aa, 112Aa, 111Ba, and 112Ba is equal to or greater than half the length of the multilayer substrate 10 in the x direction.

[0262] This configuration can increase the bonding strength when each of the conductive exposed portions 111Aa, 112Aa, 111Ba, and 112Ba is bonded to the circuit board P10 with the conductive bonding material SD. This makes it difficult for the mounting surface 13 to separate from the circuit board P10. This allows the semiconductor light emitting device 1 to be more stably mounted on the circuit board P10.

[0263] (3-2) Of both ends of the first wiring 101 in the y direction, the end closer to the first side surface 15 has a recess 101a formed therein. According to this configuration, the polarity of semiconductor light emitting device 1 can be determined by visually checking recess 101a.

[0264] [Example of change] The above-described embodiments are examples of possible forms of the semiconductor light-emitting device according to the present disclosure, and are not intended to limit the forms. The semiconductor light-emitting device according to the present disclosure may take forms different from those exemplified in the above-described embodiments. One example is a form in which a part of the configuration of each of the above-described embodiments is replaced, changed, or omitted, or a form in which a new configuration is added to each of the above-described embodiments. In addition, the following modified examples can be combined with each other as long as there is no technical contradiction. In the following modified examples, the parts common to each of the above-described embodiments are given the same reference numerals as the above-described embodiments, and the description thereof is omitted.

[0265] In the first embodiment, the semiconductor light emitting element 60B may be replaced with the semiconductor light emitting element 60A. That is, the semiconductor light emitting device 1 may include a plurality of semiconductor light emitting elements of the same type. In this case, the shape of the wiring layer 20 may be changed depending on the type of the semiconductor light emitting element. In one example, as shown in FIG. 38, the wiring layer 20 has a first wiring 21, a second wiring 22, a third wiring 23, and a fourth wiring 24.

[0266] The first wiring 21 is a wiring for mounting one semiconductor light emitting element 60A. The second wiring 22 is a wiring for electrically connecting to the one semiconductor light emitting element 60A. The third wiring 23 is a wiring for mounting another semiconductor light emitting element 60A. The fourth wiring 24 is a wiring for electrically connecting to another semiconductor light emitting element 60A. As in the first embodiment, both the first wiring 21 and the second wiring 22 are disposed inward from the outer periphery of the main surface 11 of the multilayer substrate 10 when viewed from the z direction.

[0267] The second electrode 62A formed on the element back surface 60Ar of one semiconductor light emitting element 60A is electrically connected to the first wiring 21 via the conductive bonding material SD1. As a result, the second electrode 62A is electrically connected to the fourth external electrode 54 via the first wiring 21, the main surface side connection electrode 41, the first main surface side wiring 31A, the intermediate connection electrode 42, the first back surface side wiring 32A, and the back surface side connection electrode 43.

[0268] The first electrode 61A of one semiconductor light emitting element 60A is connected to the second wiring 22 by the wire WA. As a result, the first electrode 61A is electrically connected to the first external electrode 51 via the second wiring 22, the main surface side connection electrode 41, the second main surface side wiring 31B, the intermediate connection electrode 42, the second back surface side wiring 32B, and the back surface side connection electrode 43.

[0269] The second electrode 62A of the other semiconductor light emitting element 60A is electrically connected to the third wiring 23 via the conductive bonding material SD1. As a result, the second electrode 62A is electrically connected to the third external electrode 53 via the third wiring 23, the main surface side connection electrode 41, the third main surface side wiring 31C, the intermediate connection electrode 42, the third back surface side wiring 32C, and the back surface side connection electrode 43.

[0270] The first electrode 61A of another semiconductor light emitting element 60A is connected to the fourth wiring 24 by the wire WA. As a result, the first electrode 61A is electrically connected to the second external electrode 52 via the fourth wiring 24, the main surface side connection electrode 41, the fourth main surface side wiring 31D, the intermediate connection electrode 42, the fourth back surface side wiring 32D, and the back surface side connection electrode 43. The configuration of the wiring layer 20 as shown in FIG. 38 can be similarly applied to the second embodiment.

[0271] In the third embodiment, for example, as shown in Fig. 39, the semiconductor light emitting element 60C may be changed to a semiconductor light emitting element 60A. In this case, the configuration of the wiring layer 100 may be changed as shown in Fig. 39. Specifically, the wiring layer 100 has a first wiring 101A on which the semiconductor light emitting element 60A is mounted, and a second wiring 102A electrically connected to the semiconductor light emitting element 60A.

[0272] The first wiring 101A is disposed closer to the second side surface 16 than the second wiring 102A on the main surface 11 of the multilayer substrate 10. The first wiring 101A has an element mounting portion 101b, a connection wiring portion 101c, and a coupling portion 101d that couples the element mounting portion 101b and the connection wiring portion 101c. The element mounting portion 101b is a portion on which the semiconductor light emitting element 60A is mounted, and is disposed in the center of the main surface 11 in the x direction and the y direction. The connection wiring portion 101c is a portion that is electrically connected to the first main surface side wiring 111A via the main surface side connection electrode 121, and is disposed at the end of the main surface 11 that is closer to the second side surface 16 than both ends in the y direction. The coupling portion 101d is disposed between the element mounting portion 101b and the connection wiring portion 101c in the y direction, and extends along the y direction.

[0273] The second electrode 62A (see FIG. 5) formed on the element back surface 60Ar of the semiconductor light emitting element 60A is electrically connected to the first wiring 101A via the conductive bonding material SD1. As a result, the second electrode 62A is electrically connected to the first external electrode 131 via the first wiring 101A, the main surface side connection electrode 121, the first main surface side wiring 111A, the intermediate connection electrode 122, the first back surface side wiring 112A, and the back surface side connection electrode 123.

[0274] The second wiring 102A is disposed at one of both ends in the y direction of the main surface 11, which is closer to the first side surface 15. The second wiring 102A has a connection wiring portion 102a and a wire connection portion 102b extending in the y direction from the connection wiring portion 102a.

[0275] The connection wiring portion 102a is a portion that is connected to the second conductive layer 112 via the main surface side connection electrode 121. The connection wiring portion 102a has a recess 102c formed therein, similar to the recess 101a of the first wiring 101A of the third embodiment.

[0276] The first electrode 61A of the semiconductor light emitting element 60A and the wire connection portion 102b are connected by a wire WA. As a result, the first electrode 61A is electrically connected to the second external electrode 132 via the second wiring 102A, the main surface side connection electrode 121, the second main surface side wiring 111B, the intermediate connection electrode 122, the second back surface side wiring 112B, and the back surface side connection electrode 123. The semiconductor light emitting element 60C may be changed to the semiconductor light emitting element 60B.

[0277] In the second embodiment, the positions of the intermediate connecting electrodes 42A, 42B in the multilayer substrate 10 can be changed as desired. In one example, the intermediate connecting electrode 42A may be disposed away from the second side surface 16 as long as it is in a position overlapping with the fourth external electrode 54 as viewed from the z direction. The intermediate connecting electrode 42B may be disposed away from the first side surface 15 as long as it is in a position overlapping with the first external electrode 51 as viewed from the z direction. In another example, the intermediate connecting electrode 42A may be disposed so as to be exposed also from the second side surface 16. The intermediate connecting electrode 42B may be disposed so as to be exposed also from the first side surface 15.

[0278] In the third embodiment, the length in the x direction of the conductive exposed portions 111Aa, 112Aa may be less than half the length in the x direction of the multilayer substrate 10. Furthermore, the length in the x direction of the conductive exposed portions 111Ba, 112Ba may be less than half the length in the x direction of the multilayer substrate 10.

[0279] In the third embodiment, both of the length in the y direction of the conductive exposed portion 111Aa and the length in the y direction of the conductive exposed portion 112Aa may be greater than or equal to the length in the y direction of the first external electrode 131. Furthermore, both of the length in the y direction of the conductive exposed portion 111Ba and the length in the y direction of the conductive exposed portion 112Ba may be greater than or equal to the length in the y direction of the second external electrode 132.

[0280] In the third embodiment, the length in the x direction of the conductive exposed portion 111Aa and the length in the x direction of the conductive exposed portion 112Aa can each be changed arbitrarily. In one example, the length in the x direction of the conductive exposed portion 111Aa and the length in the x direction of the conductive exposed portion 112Aa may be different from each other. In addition, the length in the x direction of the conductive exposed portion 111Ba and the length in the x direction of the conductive exposed portion 112Ba can each be changed arbitrarily. In one example, the length in the x direction of the conductive exposed portion 111Ba and the length in the x direction of the conductive exposed portion 112Ba may be different from each other.

[0281] In the third embodiment, the length in the y direction of the conductive exposed portion 111Aa and the length in the y direction of the conductive exposed portion 112Aa can be changed arbitrarily. In one example, the length in the y direction of the conductive exposed portion 111Aa and the length in the y direction of the conductive exposed portion 112Aa may be different from each other. In addition, the length in the y direction of the conductive exposed portion 111Ba and the length in the y direction of the conductive exposed portion 112Ba can be changed arbitrarily. In one example, the length in the y direction of the conductive exposed portion 111Ba and the length in the y direction of the conductive exposed portion 112Ba may be different from each other. In this way, the length in the y direction of the conductive exposed portion 111Aa and the length in the y direction of the conductive exposed portion 112Aa may be different from each other. The length in the y direction of the conductive exposed portion 111Ba and the length in the y direction of the conductive exposed portion 112Ba may be different from each other.

[0282] In each embodiment, at least one of the first conductive layer 31 (111) and the second conductive layer 32 (112) does not have to be exposed from the opposite mounting surface . In each embodiment, at least one of the first conductive layer 31 (111) and the second conductive layer 32 (112) does not have to be exposed from both the first side surface 15 and the second side surface 16.

[0283] In the first and second embodiments, at least one of the inner conductive exposed portions 35sb, 35rb, 36sb, and 36rb may be omitted. At least one of the outer conductive exposed portions 33s, 33r, 34s, and 34r that are exposed from the mounting surface 13 may be omitted. For example, a multilayer board may be used in which the conductive layers 31 and 32 are not exposed from the mounting surface 13. In this case, the conductive layers 31 and 32 are exposed from the first side surface 15 and the second side surface 16. That is, the conductive layers 31 and 32 have a conductive exposed portion that is exposed from the first side surface 15 and the second side surface 16. This conductive exposed portion extends from the edge of the first side surface 15 and the second side surface 16 on the mounting surface 13 side in a direction away from the mounting surface 13. One of the conductive layers 31 and 32 may be omitted.

[0284] In the second embodiment, the outer conductive exposed portions 33s, 33r, 34s, 34r and the inner conductive exposed portions 35sb, 35rb, 36sb, 36rb may be omitted. In this case, the intermediate connecting electrodes 42A, 42B exposed from the mounting surface 13 are joined to the upper surface P11 of the circuit board P10 by the conductive bonding material SD1. As in the second embodiment, the intermediate connecting electrodes 42A, 42B are covered from the z direction by the first base material 10A. Moreover, the intermediate connecting electrodes 42A, 42B are covered from the z direction by the second base material 10B.

[0285] In the third embodiment, the conductive exposed portions 111Aa, 112Aa and the conductive exposed portions 111Ba, 112Ba do not necessarily have to be exposed from the mounting surface 13. The conductive exposed portions 111Aa, 112Aa are exposed from the first side surface 15, and the conductive exposed portions 111Ba, 112Ba are exposed from the second side surface 16.

[0286] In each embodiment, one of the first conductive layer 31 (111) and the second conductive layer 32 (112) may be omitted. In each embodiment, it is possible to arbitrarily change the number of base materials and the number of conductive layers of the multilayer substrate 10. In one example, the multilayer substrate 10 may have a laminated structure of a first base material 10A, a second base material 10B, and a conductive layer formed between the first base material 10A and the second base material 10B.

[0287] In each embodiment, the sealing resin 70 is formed apart from both the first side surface 15 and the second side surface 16 when viewed from the z direction. In other words, the sealing resin 70 is formed so as to cover a part of the main surface 11, but this is not limited to the above. In one example, as shown in Fig. 40, the sealing resin 70 may be formed so as to cover the entire main surface 11. In the illustrated example, the shape of the sealing resin 70 as viewed from the mounting surface 13 is a rectangle whose long side direction is the y direction and whose short side direction is the z direction.

[0288] In the first and second embodiments, the semiconductor light emitting element 60B may be mounted on the second mounting portion 21b with an adhesive material such as epoxy resin. The adhesive material may or may not be conductive.

[0289] [Note] The technical ideas that can be understood from the above-described embodiments and modifications will be described below. (Appendix A1) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting element; Equipped with The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, the conductive layer is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate, and has a conductive exposed portion exposed from the mounting surface.

[0290] (Appendix A2) the multilayer substrate has the main surface, the back surface, and a side surface intersecting the mounting surface; the conductive exposed portion is exposed on both the mounting surface and the side surface, The semiconductor light emitting device according to Appendix A1, wherein the conductive exposed portion has a portion exposed from the mounting surface and a portion exposed from the side surface that are connected to each other.

[0291] (Appendix A3) The semiconductor light emitting device according to appendix A2, wherein a portion of the conductive exposed portion exposed from the side surface is flush with the side surface.

[0292] (Appendix A4) the multilayer substrate has a first base material including the main surface, a second base material including the back surface, and a third base material disposed between the first base material and the second base material in a thickness direction of the multilayer substrate, the conductive layer includes a first conductive layer formed between the first base material and the second base material, and a second conductive layer formed between the second base material and the third base material, the first conductive layer has a first conductive exposed portion exposed from both the mounting surface and the side surface, The semiconductor light emitting device according to appendix A2 or A3, wherein the second conductive layer has a second conductive exposed portion exposed from both the mounting surface and the side surface.

[0293] (Appendix B1) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting element; Equipped with The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface intersecting both the main surface and the back surface; a side surface intersecting the main surface, the rear surface, and the mounting surface; the plurality of conductive layers have conductive exposed portions exposed from the side surfaces, The conductive exposed portion extends from an edge of the side surface facing the mounting surface in a direction away from the mounting surface.

[0294] (Appendix B2) The semiconductor light emitting device according to claim B1, wherein the conductive exposed portion is flush with the side surface. (Appendix B3) the multilayer substrate has a first base material including the main surface, a second base material including the back surface, and a third base material disposed between the first base material and the second base material in a thickness direction of the multilayer substrate, the conductive layer includes a first conductive layer formed between the first base material and the second base material, and a second conductive layer formed between the second base material and the third base material, the first conductive layer has a first conductive exposed portion exposed from the side surface, The semiconductor light emitting device according to appendix B1 or B2, wherein the second conductive layer has a second conductive exposed portion exposed from the side surface.

[0295] (Appendix C1) A multilayer substrate having a plurality of base materials and a conductive layer formed between the plurality of base materials; A semiconductor light emitting element; A side emission type semiconductor light emitting device comprising: the conductive layer is provided in a plurality of layers spaced apart from each other in a thickness direction of the multilayer substrate, The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface intersecting both the main surface and the back surface; a connection electrode that connects the plurality of conductive layers in a thickness direction of the multilayer substrate, the connection electrode is covered in a thickness direction of the multilayer substrate by one of the plurality of base materials that constitutes the main surface, and is exposed from the mounting surface.

[0296] (Appendix C2) The semiconductor light emitting device according to claim C1, wherein the connection electrode is formed in a semicircular shape when viewed in a thickness direction of the multilayer substrate.

[0297] (Appendix C3) The semiconductor light emitting device according to claim 1, wherein the connection electrode is covered in a thickness direction of the multilayer substrate by a base material that configures the rear surface among the plurality of base materials. (Appendix D1) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting device, The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, The conductive layer is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer board and has a conductive exposed portion exposed from the mounting surface. Semiconductor light emitting device. (Appendix D2) The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of exposed conductive portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate. The semiconductor light emitting device according to claim D1. (Appendix D3) The external electrodes are provided in plurality, When the arrangement direction of the plurality of conductive exposed portions is defined as a first direction, The external electrodes are arranged apart from one another in the first direction, When viewed from the mounting surface, the plurality of exposed conductive portions and the plurality of external electrodes are aligned with each other in the first direction. The semiconductor light emitting device according to claim D2. (Appendix D4) The length of each of the conductive exposed portions in the first direction is shorter than the length of each of the external electrodes in the first direction. The semiconductor light emitting device according to claim D3. (Appendix D5) the plurality of conductive exposed portions include an outer conductive exposed portion disposed at an end of the mounting surface in the first direction, and an inner conductive exposed portion disposed on the mounting surface more inward than the outer conductive exposed portion, The length of the inner conductive exposed portion in the first direction is shorter than the length of the outer conductive exposed portion in the first direction. The semiconductor light emitting device according to claim D4. (Appendix D6) the multilayer substrate has the main surface, the back surface, and a side surface intersecting the mounting surface; The outer conductive exposed portion is exposed on both the mounting surface and the side surface. The semiconductor light emitting device according to claim D5. (Appendix D7) The surface facing the opposite side to the mounting surface is called the non-mounting surface, the conductive layer has an opposite conductive exposed portion exposed from the opposite mounting surface, The exposed pattern of the opposite conductive exposed portion is different from the exposed pattern of the conductive exposed portion. The semiconductor light emitting device according to any one of Appendix D1 to D6. (Appendix D8) the multilayer substrate has a first base material including the main surface, a second base material including the back surface, and a third base material disposed between the first base material and the second base material in a thickness direction of the multilayer substrate, The conductive layer is formed at least one of between the first base material and the second base material and between the second base material and the third base material. The semiconductor light emitting device according to claim D1. (Appendix D9) the conductive layer includes a first conductive layer formed between the first base material and the second base material, and a second conductive layer formed between the second base material and the third base material, the first conductive layer has a first conductive exposed portion exposed from the mounting surface, The second conductive layer has a second conductive exposed portion exposed from the mounting surface. The semiconductor light emitting device according to claim D8. (Appendix D10) When viewed from the mounting surface, the plurality of first conductive exposed portions and the plurality of second conductive exposed portions are aligned with each other in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate, When the arrangement direction of the plurality of first conductive exposed portions is defined as a first direction, In the first direction, the external electrode, the first conductive exposed portion, and the second conductive exposed portion are aligned with each other. The semiconductor light emitting device according to claim D9. (Appendix D11) the multilayer substrate has a connection electrode penetrating the third base material in a thickness direction of the multilayer substrate and connecting the first conductive layer and the second conductive layer, an end of the connection electrode in a thickness direction of the multilayer substrate is formed at a position away from the main surface, The first base material is provided so as to cover the connection electrodes in a thickness direction of the multilayer substrate. The semiconductor light emitting device according to appendix D9 or D10. (Appendix D12) The connection electrodes are exposed from the mounting surface. The semiconductor light emitting device according to claim D11. (Appendix D13) a wiring layer to which the semiconductor light emitting element is electrically connected is formed on the main surface; When viewed in a thickness direction of the multilayer board, the wiring layer is disposed on the main surface at a position spaced apart from the mounting surface. The semiconductor light emitting device according to any one of Appendix D1 to D12. (Appendix D14) The conductive exposed portion is formed flush with the mounting surface. The semiconductor light emitting device according to any one of Appendix D1 to D13. (Appendix D15) The semiconductor light emitting element is one, When viewed from the mounting surface, the conductive exposed portions are aligned with each other in a thickness direction of the multilayer substrate and are provided at both ends of the mounting surface in a first direction that is a direction perpendicular to the thickness direction of the multilayer substrate, When the surfaces intersecting the main surface, the back surface, and the mounting surface are defined as side surfaces, the conductive exposed portion is exposed on both the mounting surface and the side surface, When a portion of each of the conductive exposed portions that is exposed from the side surface is defined as a side surface exposed portion, and a direction perpendicular to both the thickness direction of the multilayer substrate and the first direction is defined as a second direction, The side surface exposed portion extends from the mounting surface to a position farther from the mounting surface than a center of the side surface in the second direction. The semiconductor light emitting device according to any one of Appendix D1 to D4. (Appendix D16) The semiconductor light emitting element is provided in plurality, Each of the semiconductor light emitting elements is mounted on the main surface. The semiconductor light emitting device according to any one of Appendix D1 to D14. (Appendix E1) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting device, The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface intersecting both the main surface and the back surface; a side surface intersecting the main surface, the rear surface, and the mounting surface; the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, The conductive exposed portion has an outer conductive exposed portion that is exposed on both the mounting surface and the side surface. Semiconductor light emitting device. (Appendix E2) The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of exposed conductive portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate. 2. The semiconductor light emitting device according to claim 1. (Appendix E3) The external electrodes are provided in plurality, When the arrangement direction of the plurality of conductive exposed portions is defined as a first direction, The external electrodes are arranged apart from one another in the first direction, When viewed from the mounting surface, the plurality of exposed conductive portions and the plurality of external electrodes are aligned with each other in the first direction. 2. The semiconductor light emitting device according to claim 1, (Appendix E4) The length of each of the conductive exposed portions in the first direction is shorter than the length of each of the external electrodes in the first direction. 2. The semiconductor light emitting device according to claim 1, (Appendix E5) the plurality of conductive exposed portions include the outer conductive exposed portion disposed at an end of the mounting surface in the first direction, and an inner conductive exposed portion disposed on the mounting surface more inward than the outer conductive exposed portion, The length of the inner conductive exposed portion in the first direction is shorter than the length of the outer conductive exposed portion in the first direction. 2. The semiconductor light emitting device according to claim 1, (Appendix E6) The surface facing the opposite side to the mounting surface is called the non-mounting surface, the conductive layer has an opposite conductive exposed portion exposed from the opposite mounting surface, The exposed pattern of the opposite conductive exposed portion is different from the exposed pattern of the conductive exposed portion. The semiconductor light emitting device according to any one of Appendix E1 to E5. (Appendix E7) the multilayer substrate has a first base material including the main surface, a second base material including the back surface, and a third base material disposed between the first base material and the second base material in a thickness direction of the multilayer substrate, The conductive layer is formed at least one of between the first base material and the second base material and between the second base material and the third base material. 2. The semiconductor light emitting device according to claim 1. (Appendix E8) the conductive layer includes a first conductive layer formed between the first base material and the second base material, and a second conductive layer formed between the second base material and the third base material, the first conductive layer has a first conductive exposed portion exposed from the mounting surface, The second conductive layer has a second conductive exposed portion exposed from the mounting surface. The semiconductor light emitting device according to claim E7. (Appendix E9) The first conductive exposed portion is provided in plurality, and the second conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of first conductive exposed portions and the plurality of second conductive exposed portions are aligned with each other in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate, When the arrangement direction of the plurality of first conductive exposed portions is defined as a first direction, In the first direction, the external electrode, the first conductive exposed portion, and the second conductive exposed portion are aligned with each other. The semiconductor light emitting device according to claim E8. (Appendix E10) the multilayer substrate has a connection electrode penetrating the third base material in a thickness direction of the multilayer substrate and connecting the first conductive layer and the second conductive layer, an end of the connection electrode in a thickness direction of the multilayer substrate is formed at a position away from the main surface, The first base material is provided so as to cover the connection electrodes in a thickness direction of the multilayer substrate. The semiconductor light emitting device according to appendix E8 or E9. (Appendix E11) The connection electrodes are exposed from the mounting surface. 2. The semiconductor light emitting device according to claim 10. (Appendix E12) a wiring layer to which the semiconductor light emitting element is electrically connected is formed on the main surface; When viewed in a thickness direction of the multilayer board, the wiring layer is disposed on the main surface at a position spaced apart from the mounting surface. The semiconductor light emitting device according to any one of Appendixes E1 to E11. (Appendix E13) The conductive exposed portion is formed flush with the mounting surface. The semiconductor light emitting device according to any one of Appendix E1 to E12. (Appendix E14) A portion of the outer conductive exposed portion that is exposed from the side surface is defined as a side surface exposed portion, a direction perpendicular to the thickness direction of the multilayer substrate is defined as a first direction, and a direction perpendicular to both the thickness direction of the multilayer substrate and the first direction is defined as a second direction. The side surface exposed portion extends from the mounting surface to a position farther from the mounting surface than a center of the side surface in the second direction. The semiconductor light emitting device according to any one of Appendixes E1 to E13. (Appendix E15) The semiconductor light emitting element is provided in plurality, Each of the semiconductor light emitting elements is mounted on the main surface. The semiconductor light emitting device according to any one of Appendixes E1 to E14. (Appendix E16) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting device, The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of conductive exposed portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a first direction perpendicular to the thickness direction of the multilayer substrate, and are arranged in a line; the plurality of conductive exposed portions include an outer conductive exposed portion disposed at an end of the mounting surface in the first direction, and an inner conductive exposed portion disposed on the mounting surface more inward than the outer conductive exposed portion, The length of the inner conductive exposed portion in the first direction is shorter than the length of the outer conductive exposed portion in the first direction. Semiconductor light emitting device. (Appendix E17) a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting device, The multilayer substrate comprises: a main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of conductive exposed portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate, and are arranged in a line; The external electrodes are provided in plurality, When the arrangement direction of the plurality of conductive exposed portions is defined as a first direction, The external electrodes are arranged apart from one another in the first direction, When viewed from the mounting surface, the plurality of exposed conductive portions and the plurality of external electrodes are aligned with each other in the first direction, The length of each of the conductive exposed portions in the first direction is shorter than the length of each of the external electrodes in the first direction. Semiconductor light emitting device. [Explanation of symbols]

[0298] 1...Semiconductor light-emitting device 10…Multilayer board 10A…1st base material 10B…Second base material 10C…Third base material 11...Main surface 12…Back side 13...Mounting surface 14…Opposite mounting surface 15...1st side (side) 16…Second side (side) 20...Wiring layer 30...Conductive layer 31...First conductive layer 32...Second conductive layer 33s, 34s...Outer conductive exposed part (conductive exposed part, first conductive exposed part, side exposed part) 34r, 34r...Outer conductive exposed part (conductive exposed part, second conductive exposed part, side exposed part) 35sa,36sa...Outer conductive exposed part (conductive exposed part, first conductive exposed part, side exposed part) 35ra, 36ra...Outer conductive exposed part (conductive exposed part, second conductive exposed part, side exposed part) 35sb, 35rb, 35sb, 36rb...Inner conductive exposed part (opposite conductive exposed part) 41...Main surface side connection electrode 42...Intermediate connection electrode (connection electrode) 43…Back side connection electrode 50…External electrode 60A, 60B, 60C...Semiconductor light emitting element

Claims

1. a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting element; Equipped with The multilayer substrate comprises: A main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects both the main surface and the back surface; a side surface intersecting the main surface, the back surface, and the mounting surface; having the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, the conductive exposed portion has an outer conductive exposed portion exposed on both the mounting surface and the side surface, The external electrodes are provided in plurality, When viewed from the mounting surface, a direction perpendicular to a thickness direction of the multilayer substrate is defined as a first direction. the plurality of external electrodes include an outer external electrode that is disposed at an end of the mounting surface in the first direction, When viewed from the mounting surface, the outer external electrode and the outer conductive exposed portion are aligned with each other in the first direction, The length of the outer conductive exposed portion in the first direction is shorter than the length of the outer external electrode in the first direction. Semiconductor light emitting device.

2. The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of exposed conductive portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate. The semiconductor light emitting device according to claim 1 .

3. In the first direction, the plurality of external electrodes are arranged at a distance from each other, When viewed from the mounting surface, the plurality of exposed conductive portions and the plurality of external electrodes are aligned with each other in the first direction. The semiconductor light emitting device according to claim 2 .

4. The length of each of the conductive exposed portions in the first direction is shorter than the length of each of the external electrodes in the first direction. The semiconductor light emitting device according to claim 3 .

5. the plurality of conductive exposed portions include the outer conductive exposed portion disposed at an end of the mounting surface in the first direction, and an inner conductive exposed portion disposed on the mounting surface more inward than the outer conductive exposed portion, The length of the inner conductive exposed portion in the first direction is shorter than the length of the outer conductive exposed portion in the first direction. The semiconductor light emitting device according to claim 4 .

6. The surface facing the opposite side to the mounting surface is called the non-mounting surface, the conductive layer has an opposite conductive exposed portion exposed from the opposite mounting surface, The exposed pattern of the opposite conductive exposed portion is different from the exposed pattern of the conductive exposed portion. The semiconductor light emitting device according to any one of claims 1 to 5.

7. the multilayer substrate has a first substrate including the main surface, a second substrate including the back surface, and a third substrate disposed between the first substrate and the second substrate in a thickness direction of the multilayer substrate, The conductive layer is formed at least one of between the first base material and the second base material and between the second base material and the third base material. The semiconductor light emitting device according to claim 1 .

8. the conductive layer includes a first conductive layer formed between the first base material and the second base material, and a second conductive layer formed between the second base material and the third base material, the first conductive layer has a first conductive exposed portion exposed from the mounting surface, The second conductive layer has a second conductive exposed portion exposed from the mounting surface. The semiconductor light emitting device according to claim 7 .

9. A plurality of the first conductive exposed portions are provided, and a plurality of the second conductive exposed portions are provided, When viewed from the mounting surface, the plurality of first conductive exposed portions and the plurality of second conductive exposed portions are aligned with each other in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate, In the first direction, the external electrode, the first conductive exposed portion, and the second conductive exposed portion are aligned with each other. The semiconductor light emitting device according to claim 8 .

10. the multilayer substrate has a connection electrode penetrating the third base material in a thickness direction of the multilayer substrate and connecting the first conductive layer and the second conductive layer, an end of the connection electrode in a thickness direction of the multilayer substrate is formed at a position away from the main surface, The first base material is provided so as to cover the connection electrodes in a thickness direction of the multilayer substrate.

10. The semiconductor light emitting device according to claim 8.

11. The connection electrodes are exposed from the mounting surface. The semiconductor light emitting device according to claim 10.

12. a wiring layer to which the semiconductor light emitting element is electrically connected is formed on the main surface; When viewed in a thickness direction of the multilayer board, the wiring layer is disposed on the main surface at a position spaced apart from the mounting surface. The semiconductor light emitting device according to any one of claims 1 to 11.

13. The conductive exposed portion is formed flush with the mounting surface. The semiconductor light emitting device according to any one of claims 1 to 12.

14. A portion of the outer conductive exposed portion that is exposed from the side surface is defined as a side surface exposed portion, and a direction perpendicular to both the thickness direction of the multilayer substrate and the first direction is defined as a second direction. The side surface exposed portion extends from the mounting surface to a position farther from the mounting surface than a center of the side surface in the second direction. The semiconductor light emitting device according to any one of claims 1 to 13.

15. The semiconductor light emitting element is provided in plurality, Each of the semiconductor light emitting elements is mounted on the main surface. The semiconductor light emitting device according to any one of claims 1 to 14.

16. a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting element; Equipped with The multilayer substrate comprises: A main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of conductive exposed portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a first direction perpendicular to the thickness direction of the multilayer substrate, and are arranged in a line, the plurality of conductive exposed portions include an outer conductive exposed portion disposed at an end of the mounting surface in the first direction, and an inner conductive exposed portion disposed on the mounting surface more inward than the outer conductive exposed portion, a length of the inner conductive exposed portion in the first direction is shorter than a length of the outer conductive exposed portion in the first direction; The external electrodes are provided in plurality, the plurality of external electrodes include an outer external electrode that is disposed at an end of the mounting surface in the first direction, When viewed from the mounting surface, the outer external electrode and the outer conductive exposed portion are aligned with each other in the first direction, The length of the outer conductive exposed portion in the first direction is shorter than the length of the outer external electrode in the first direction. Semiconductor light emitting device.

17. a multilayer substrate having a plurality of base materials and conductive layers; A semiconductor light emitting element; Equipped with The multilayer substrate comprises: A main surface on which the semiconductor light emitting device is mounted; a back surface facing the opposite side to the main surface and having external electrodes formed thereon; a mounting surface that intersects with both the main surface and the back surface, the conductive layer has a conductive exposed portion that is disposed apart from both the main surface and the back surface in a thickness direction of the multilayer substrate and is exposed from the mounting surface, The conductive exposed portion is provided in plurality, When viewed from the mounting surface, the plurality of conductive exposed portions are aligned in a thickness direction of the multilayer substrate and spaced apart from each other in a direction perpendicular to the thickness direction of the multilayer substrate, and are arranged in a line; The external electrodes are provided in plurality, When the arrangement direction of the plurality of conductive exposed portions is defined as a first direction, The external electrodes are arranged apart from one another in the first direction, When viewed from the mounting surface, the plurality of exposed conductive portions and the plurality of external electrodes are aligned with each other in the first direction, The length of each of the conductive exposed portions in the first direction is shorter than the length of each of the external electrodes in the first direction. Semiconductor light emitting device.

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