Vibration Sensors

Abstract

The vibration sensor of the present application includes a housing forming an acoustic cavity, a vibration receiver including a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity, and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein the housing is configured to generate vibrations based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing so as to generate an electrical signal in the acoustic transducer, and the vibration unit includes a mass element and an elastic element, wherein the area of ​​the mass element on a side away from the acoustic transducer is smaller than the area of ​​the mass element on a side close to the acoustic transducer, and the elastic element is attached to a side wall of the mass element.

Description

[Technical field]

[0001] (Priority information) This application claims priority to an international application having application number PCT / CN2020 / 140180 filed on December 28, 2020, a Chinese application having application number 202110445739.3 filed on April 23, 2021, and an international application having application number PCT / CN2021 / 107978 filed on July 22, 2021, the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the field of acoustics, and in particular to vibration sensors. [Background technology]

[0003] A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. Currently, a vibration sensor can be used as a bone conduction microphone, and the vibration sensor can detect the vibration signal transmitted through the skin when a person speaks, thereby detecting the voice signal and not being interfered with by external noise at the same time. Currently, the structure of the vibration assembly in the vibration sensor is not stable, which causes the problem that the product yield during the manufacture of the vibration sensor is not high and the sensitivity of the vibration sensor during operation is low. Summary of the Invention [Problem to be solved by the invention]

[0004] It is therefore desirable to provide a vibration sensor that has high structural stability and high sensitivity. [Means for solving the problem]

[0005] A vibration sensor according to one embodiment of the present application includes a housing forming an acoustic cavity, a vibration receiver including a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity, and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein the housing is configured to generate vibrations based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing so as to generate an electrical signal in the acoustic transducer, and the vibration unit includes a mass element and an elastic element, wherein the area of ​​the mass element on a side away from the acoustic transducer is smaller than the area of ​​the mass element on a side close to the acoustic transducer, and the elastic element is attached to a side wall of the mass element.

[0006] In some embodiments, the mass element includes a first mass element and a second mass element, the second mass element being proximate to the acoustic transducer and the first mass element being located on a side of the second mass element away from the acoustic transducer, and a cross-sectional area of ​​the first mass element perpendicular to a vibration direction of the mass element is smaller than a cross-sectional area of ​​the second mass element perpendicular to the vibration direction of the mass element.

[0007] In some embodiments, the first mass element is located in a central region of the second mass element, and there is a constant spacing between a sidewall of the first mass element and a sidewall of the second mass element.

[0008] In some embodiments, the regular interval ranges from 10 um to 500 um.

[0009] In some embodiments, the elastic element includes a first elastic portion and a second elastic portion, both ends of the first elastic portion being connected to a sidewall of the first mass element and the second elastic portion, respectively, and the second elastic portion extending toward and connected to the acoustic transducer.

[0010] In some embodiments, the first resilient portion includes a first side connected to a sidewall of the first mass element and a second side connected to a surface of the second mass element exposed to the second acoustic cavity.

[0011] In some embodiments, a sidewall of the second mass element is connected to the second resilient portion.

[0012] In some embodiments, the acoustic transducer includes a substrate, the second elastic portion extends toward and is connected to the substrate, and the substrate, the second mass element, and the second elastic portion form a first acoustic cavity.

[0013] In some embodiments, along the vibration direction of the mass elements, the thickness of the first mass element is between 50um and 1000um and the thickness of the second mass element is between 10um and 150um.

[0014] In some embodiments, along a direction of vibration of the mass elements, a thickness of the first mass element is greater than a thickness of the second mass element.

[0015] In some embodiments, in a cross section along the vibration direction of the mass element, a line segment connecting an edge of the mass element away from the acoustic transducer and an edge of the mass element close to the acoustic transducer forms an angle in the range of 10° to 80° with the vibration direction of the mass element.

[0016] In certain embodiments, the mass element includes a first hole communicating between the first acoustic cavity and the second acoustic cavity.

[0017] In some embodiments, the radius of the first hole is between 1 um and 50 um.

[0018] In some embodiments, the housing includes a third aperture, and the second acoustic cavity communicates with the outside through the third aperture.

[0019] A vibration sensor according to one embodiment of the present application includes a housing forming an acoustic cavity, a vibration receiver including a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity, and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein the housing is configured to generate vibrations based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to vibration of the housing so as to generate an electrical signal in the acoustic transducer, the vibration unit includes a mass element and an elastic element attached to a side wall of the mass element, and the vibration sensor further includes a stopper located between the elastic member and the housing.

[0020] In some embodiments, the height of the stopper along the vibration direction of the mass element is between 100um and 1000um.

[0021] A vibration sensor according to one embodiment of the present application includes a housing forming an acoustic cavity, a vibration receiver including a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity, and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein the housing is configured to generate vibrations based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to vibration of the housing so as to generate an electrical signal in the acoustic transducer, and the vibration unit includes a mass element and an elastic element, and the mass element includes a groove located on a side along the vibration direction of the mass element.

[0022] In some embodiments, the mass element includes a first hole communicating the first acoustic cavity with the second acoustic cavity and located in the recess.

[0023] In some embodiments, the radius of the first hole is between 1 um and 50 um.

[0024] In some embodiments, the size of the recess is greater than the size of the first hole.

[0025] A vibration sensor according to one embodiment of the present application includes a housing forming an acoustic cavity, a vibration receiver including a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity, and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein the housing is configured to generate vibrations based on an external vibration signal, and the vibration unit modifies the sound pressure in the first acoustic cavity in response to vibration of the housing so as to generate an electrical signal in the acoustic transducer, and the vibration unit includes a mass element and an elastic element attached to a side wall of the mass element and extending to the housing.

[0026] In some embodiments, along the direction of vibration of the mass element, the thickness of the elastic element is greater than the thickness of the mass element.

[0027] In some embodiments, the mass element or the housing is formed with a hole having a radius of 1 um to 50 um.

[0028] The present application will now be further described in the manner of exemplary embodiments, which are illustrated in detail in the figures, which are not limiting, and in which like reference numerals refer to like structures. [Brief description of the drawings]

[0029] [Figure 1] FIG. 2 is an example block diagram of a vibration sensor in accordance with some embodiments of the present disclosure. [Figure 2A] 1 is an exemplary structural diagram of a vibration sensor according to some embodiments of the present application; [Figure 2B] FIG. 1 is a schematic diagram of a mass element according to some embodiments of the present application. [Diagram 3] FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Figure 4]FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Diagram 5] FIG. 1 is a schematic diagram of a mass element according to some embodiments of the present application. [Figure 6A] FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Figure 6B] FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Figure 6C] FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Figure 6D] FIG. 2 is a schematic diagram of a vibration unit according to some embodiments of the present application. [Figure 7] FIG. 1 is a schematic diagram of a vibration sensor according to some embodiments of the present application. [Figure 8] FIG. 1 is a schematic diagram of a vibration sensor according to some embodiments of the present disclosure. [Figure 9] FIG. 1 is a schematic diagram of a vibration receiver according to some embodiments of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In order to more clearly describe the technical means of the embodiments of the present specification, the drawings necessary for the description of the embodiments will be briefly described below. Obviously, the drawings described below are merely some examples or embodiments of the present specification, and those skilled in the art can apply the present specification to other similar scenarios based on these drawings without creative efforts. Unless it is obvious from the language environment or otherwise described, the same numbers in the drawings indicate the same structures or operations.

[0031] It should be understood that the terms "system," "apparatus," "unit," and / or "module" used herein are ways of distinguishing between different levels of assemblies, elements, components, parts, or structures, however, other terms may be used in place of the above terms if they achieve the same purpose.

[0032] The terms "first", "second" and similar terms used in the present specification and claims do not denote any order, number or importance, but merely distinguish between different components. Similarly, similar terms such as "one" or "one" do not limit the number, but indicate the presence of at least one. Unless otherwise stated, similar terms such as "front", "rear", "lower" and / or "like" are not intended to be limited to one location or one spatial orientation, but are merely for ease of description. In general, the terms "comprise" and "contain" are merely intended to indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not an exclusive listing, and the method or apparatus may include other steps or elements.

[0033] In the embodiments herein, a vibration sensor is described. In some embodiments, the vibration sensor may include a vibration receiver and an acoustic transducer. In some embodiments, the vibration receiver may include a housing capable of forming an acoustic cavity, and a vibration unit located within the acoustic cavity and capable of partitioning the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be in acoustic communication with the first acoustic cavity. The housing may be configured to be generated to vibrate based on an external vibration signal (e.g., a signal generated by vibration of bones, skin, etc. when a user speaks). The vibration unit may modify the sound pressure in the first acoustic cavity in response to the vibration of the housing to generate an electrical signal in the acoustic transducer.

[0034] In some embodiments, the vibration unit may include a mass element and an elastic element. The area of ​​the mass element on the side away from the acoustic transducer is smaller than the area of ​​the mass element on the side close to the acoustic transducer. On the condition that the thickness is the same, the contact area between the mass element and the elastic element in the embodiments of the present specification is increased compared to the contact area between a columnar (e.g., cylindrical or prismatic) mass element and the elastic element, and when the elastic element is circumferentially attached to the mass element, the connection area between the elastic element and the mass element is increased, further improving the connection strength between the elastic element and the mass element and improving the structural stability of the vibration assembly. Furthermore, by improving the connection strength between the elastic element and the mass element and improving the sealing property of the first acoustic cavity, it is possible to effectively prevent the occurrence of a situation in which a gap occurs at the connection point between the elastic element and the mass element, causing the gas in the first acoustic cavity to leak into the second acoustic cavity, and further making the change in the sound pressure in the first acoustic cavity in response to the vibration of the housing more sensitive, thereby improving the sensitivity of the vibration sensor.

[0035] 1 is an example block diagram of a vibration sensor 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the vibration sensor 100 may include a vibration receiver 110 and an acoustic transducer 120. In some embodiments, the vibration receiver 110 and the acoustic transducer 120 may be connected in a physical manner. The physical connection herein may include welding, locking, gluing, molding, etc., or any combination thereof.

[0036] In some embodiments, the vibration sensor 100 may be used as a bone conduction microphone. When used as a bone conduction microphone, the vibration sensor 100 can receive vibration signals of tissues such as bones and skin generated when a user speaks, and convert the vibration signals into electrical signals containing audio information. Since the vibration sensor 100 hardly collects sounds (or vibrations) in the air, the vibration sensor 100 is not affected by noises of the surrounding environment (e.g., surrounding other people's voices, noise of vehicles running) to a certain extent, and is suitable for use in a noisy environment to collect audio signals when a user speaks. By way of example only, the noisy environment may include noisy restaurants, venues, main streets, near roads, fire scenes, etc. In some embodiments, the vibration sensor 100 may be applied to earphones (e.g., air conduction earphones and bone conduction earphones), hearing aids, hearing aids, glasses, helmets, augmented reality (AR) devices, virtual reality (VR) devices, etc., or any combination thereof. For example, the vibration sensor 100 may be applied to earphones as a bone conduction microphone.

[0037] The vibration receiver 110 may be configured to receive and transmit a vibration signal. In some embodiments, the vibration receiver 110 includes a housing and a vibration unit. The housing may be a hollow structure, and some components of the vibration sensor 100 (e.g., the vibration unit) may be located within the housing. For example, the housing may form an acoustic cavity, and the vibration unit may be located within the acoustic cavity. In some embodiments, the vibration unit may be located within the acoustic cavity and may partition the acoustic cavity formed by the housing into a first acoustic cavity and a second acoustic cavity. The acoustic cavity may be in acoustic communication with the acoustic transducer 120. The acoustic communication may be a form of communication capable of transmitting sound pressure, sound waves, or vibration signals.

[0038] The acoustic transducer 120 can generate an electrical signal including audio information based on the change in sound pressure in the first acoustic cavity. In some embodiments, the vibration signal can be received by the vibration receiver 110 and can change the air pressure inside the first acoustic cavity, and the acoustic transducer 120 can generate an electrical signal based on the change in air pressure inside the first acoustic cavity. In some embodiments, when the vibration sensor 100 is operating, the housing can generate vibrations based on an external vibration signal (e.g., a signal generated by vibration of the skeleton, skin, etc. when a user speaks). The vibration unit can vibrate in response to the vibration of the housing and transmit the vibrations to the acoustic transducer 120 by the first acoustic cavity. For example, the vibration of the vibration unit can change the volume of the first acoustic cavity, which can further change the air pressure in the first acoustic cavity, and convert the change in air pressure in the cavity into a change in sound pressure in the cavity. The acoustic transducer 120 can detect the change in sound pressure in the first acoustic cavity and generate an electrical signal based thereon. For example, the acoustic transducer 120 may include a vibrating membrane, and when a change in sound pressure in the first acoustic cavity acts on the vibrating membrane, the vibrating membrane vibrates (or deforms), and the acoustic transducer 120 converts the vibration of the vibrating membrane into an electrical signal. For a detailed description of the vibration sensor 100, reference may be made to the detailed description of FIGS. 2A to 10.

[0039] It should be noted that the above description of the vibration sensor 100 and its components is for illustrative and explanatory purposes only and does not limit the scope of the present specification. Those skilled in the art can make various modifications and changes to the vibration sensor 100 based on the teachings of the present specification. In some embodiments, the vibration sensor 100 may further include other components, such as a power source that provides electrical energy to the acoustic transducer 120. These modifications and changes are still within the scope of the present specification.

[0040] 2A is an exemplary structural diagram of a vibration sensor 200 according to some embodiments of the present application. As shown in FIG. 2A, the vibration sensor 200 may include a vibration receiver 210 and an acoustic transducer 220, and the vibration receiver 210 may include a housing 211 and a vibration unit 212.

[0041] The housing 211 may be a hollow structure, and in some embodiments, the housing 211 may be connected to the acoustic transducer 220 to surround the structure having an acoustic cavity. There may be a physical connection between the housing 211 and the acoustic transducer 220. In some embodiments, the vibrating unit 212 is located within the acoustic cavity, and the vibrating unit 212 may divide the acoustic cavity into a first acoustic cavity 213 and a second acoustic cavity 214. In some embodiments, the vibrating unit 212 and the acoustic transducer 220 may form the first acoustic cavity 213, and the vibrating unit 212 and the housing 211 may form the second acoustic cavity 214.

[0042] The vibration sensor 200 can convert an external vibration signal into an electrical signal. By way of example only, the external vibration signal may include a vibration signal when a person speaks, a vibration signal generated by the skin due to human body movement or the operation of other devices (e.g., speakers) close to the skin, and a vibration signal generated by an object or air contacting the vibration sensor 200, or any combination thereof. When the vibration sensor 200 is operating, the external vibration signal may be transmitted to the vibration unit 212 by the housing 211, and the mass element 2121 of the vibration unit 212 vibrates in response to the vibration of the housing 211 by the elastic element 2122. The vibration of the mass element 2121 can change the volume of the first acoustic cavity 213, which in turn changes the air pressure in the first acoustic cavity 213, and convert the change in air pressure in the cavity into a change in sound pressure in the cavity. The acoustic transducer 220 can detect the change in sound pressure in the first acoustic cavity 213 and convert it into an electrical signal. For example, the acoustic transducer 220 may include a sound collection hole 2221, and a change in sound pressure in the first acoustic cavity 213 may act on a diaphragm of the acoustic transducer 220 through the sound collection hole 2221 such that the diaphragm vibrates (or deforms) and generates an electrical signal. Furthermore, the electrical signal generated by the acoustic transducer 220 may be transmitted to an external electronic device. By way of example only, the acoustic transducer 220 may include an interface 223. The interface may be wired (e.g., electrically connected) or wirelessly connected to an internal element (e.g., a processor) of the external electronic device. The electrical signal generated by the acoustic transducer 220 may be transmitted to the external electronic device via the interface in a wired or wireless manner. In some embodiments, the external electronic device may include a mobile device, a wearable device, a virtual reality device, an augmented reality device, or the like, or any combination thereof. In some embodiments, the mobile device may include a smartphone, a tablet computer, a personal digital assistant (PDA), a gaming device, a navigation device, or the like, or any combination thereof.In some examples, the wearable device may include a smart bracelet, earphones, hearing aids, smart helmets, smart watches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some examples, the virtual reality device and / or augmented reality device may include a virtual reality helmet, virtual reality glasses, virtual reality patch, augmented reality helmet, augmented reality glasses, augmented reality patch, etc., or any combination thereof. For example, the virtual reality device and / or augmented reality device may include Google Glass, Oculus Rift, Hololens, Gear VR, etc.

[0043] In some embodiments, the shape of the housing 211 may be a three-dimensional structure with a regular or irregular shape, such as a rectangular parallelepiped, a cylinder, a truncated cone, etc. In some embodiments, the material of the housing may include a metal (e.g., copper, stainless steel), an alloy, a plastic, etc., or any combination thereof. In some embodiments, the housing may have a certain thickness to ensure sufficient strength so as to better protect the components (e.g., the vibration unit 212) of the vibration sensor 200 installed in the housing. In some embodiments, the first acoustic cavity 213 may be in acoustic communication with the acoustic transducer 220. Merely by way of example, the acoustic transducer 220 may include a sound collection hole 2221, and the acoustic transducer 220 may be in acoustic communication with the first acoustic cavity 213 through the sound collection hole 2221. Note that the description of the single sound collection hole 2221 shown in FIG. 2A is for illustrative purposes only and is not intended to limit the scope of the present invention. Note that the vibration sensor 200 may include one or more sound collection holes 2221. For example, the vibration sensor 200 may include a plurality of sound collection holes arranged in an array, and the sound collection holes may be located at any position of the acoustic transducer 220 corresponding to the first acoustic cavity 213.

[0044] In some embodiments, the vibrating unit 212 may include a mass element 2121 and an elastic element 2122. In some embodiments, the mass element 2121 and the elastic element 2122 may be connected in a physical manner, for example, glued. By way of example only, the elastic element 2122 may be a material with a certain adhesiveness such that it is glued directly to the mass element 2121.

[0045] In some embodiments, the elastic element 2122 may be a material that is resistant to high temperatures so that the elastic element 2122 maintains its performance during processing and manufacturing of the vibration sensor 200. In some embodiments, when the elastic element 2122 is in an environment of 200° C. to 300° C., its Young's modulus and shear modulus do not change or change only slightly (e.g., within 5%), and the Young's modulus may characterize the deformation ability of the elastic element 2122 when it is stretched or compressed, and the shear modulus may characterize the deformation ability of the elastic element 2122 when it is sheared. In some embodiments, the elastic element 2122 may be a material that has good elasticity (i.e., is easily elastically deformed) so that the vibration unit 212 can vibrate in response to the vibration of the housing 211. By way of example only, the material of the elastic element 2122 may include silicone rubber, silicone gel, silicone sealant, and the like, or any combination thereof. In order for the elastic element 2122 to have good elasticity, in some embodiments, the shore hardness of the elastic element 2122 may be less than 50 HA. Preferably, the shore hardness of the elastic element 2122 may be less than 45 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 40 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 35 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 30 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 25 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 20 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 15 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 10 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 5 HA.

[0046] In some embodiments, the material of the mass element 2121 has a density below a certain density threshold (e.g., 6 g / cm 3), e.g., a metal. By way of example only, the material of the mass element 2121 may include metals or alloys such as lead, copper, silver, tin, stainless steel, ferritic stainless steel, or any combination thereof. With the same mass, the higher the density of the material of the mass element 2121, the smaller the size, so that by manufacturing the mass element 2121 from a material whose density is greater than a certain density threshold, the size of the vibration sensor 200 can be reduced to a certain extent. In some embodiments, the density of the material of the mass element 2121 has a significant effect on the resonance peak of the frequency response curve and the sensitivity of the vibration sensor 200. With the same volume, the higher the density of the mass element 2121, the larger its mass, and the lower the frequency of the vibration signal (e.g., bone conduction sound), so that by increasing the mass of the mass element 2121, the sensitivity of the vibration sensor 200 in the low frequency band (e.g., 20 Hz to 6000 Hz) can be improved. In some embodiments, the density of the material of the mass element 2121 is 6 g / cm 3 In some embodiments, the density of the material of mass element 2121 is greater than 7 g / cm 3 In some embodiments, the density of the material of the mass element 2121 is between 7 and 20 g / cm 3 Preferably, the density of the material of the mass element 2121 is between 7 and 15 g / cm 3 More preferably, the density of the material of the mass element 2121 is 7 to 10 g / cm 3 More preferably, the density of the material of the mass element 2121 is 7 to 8 g / cm 3 In some embodiments, the mass element 2121 and the elastic element 2122 may be made of different materials and are assembled (e.g., glued) to form the vibration unit 212. In some embodiments, the mass element 2121 and the elastic element 2122 may be made of the same material and are integrally molded to form the vibration unit 212.

[0047] In some embodiments, the thickness of the mass element 2121 along the vibration direction (as shown in FIG. 2A) may be between 60 um and 1150 um. Preferably, the thickness of the mass element 2121 along the vibration direction may be between 70 um and 900 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 80 um and 800 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 90 um and 700 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 100 um and 600 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 110 um and 500 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 120 um and 400 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 130 um and 300 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be between 140 um and 200 um. More preferably, the thickness of the mass element 2121 along the vibration direction may be 100 um to 150 um.

[0048] In some embodiments, the elastic element 2122 may be attached to a peripheral surface of the mass element 2121. For example, if the mass element 2121 is a columnar structure (cylinder or prism), the peripheral surface of the mass element 2121 is the side surface of the columnar structure. For example, if the mass element 2121 is two columnar structures of different sizes (e.g., a first mass element 21211 and a second mass element 21212), the peripheral surface of the mass element 2121 includes, in addition to the side surfaces of the first mass element 21211 and the second mass element 21212, a region of the second mass element 21212 that is not covered by the first mass element 21211 in a direction perpendicular to the vibration direction of the mass element 2121. The side of the mass element 2121 away from the acoustic transducer 220 and the side of the mass element 2121 close to the acoustic transducer 220 are approximately perpendicular to the vibration direction and are used to define the second acoustic cavity 214 and the first acoustic cavity 213, respectively. Since the elastic element 2122 is attached to the peripheral surface of the mass element 2121, in the process of the vibration unit 212 vibrating along the vibration direction, the vibration amount of the mass element 2121 is converted into an acting force on the elastic element 2122, which generates shear deformation in the elastic element 2122. Compared with the tensile deformation and the compressive deformation, the shear deformation reduces the spring constant of the elastic element 2122, thereby reducing the resonant frequency of the vibration sensor 200, so that in the vibration process of the vibration unit 212, the amplitude of the mass element 2121 in a low frequency range (for example, 20Hz to 6000Hz) is improved, and the sensitivity of the vibration sensor 200 is improved. In some embodiments, the elastic element 2122 can be in close contact with the peripheral surface of the mass element 2121 to ensure the sealing of the first acoustic cavity 213, so that the change in air pressure in the first acoustic cavity 213 is only related to the amplitude of the vibration unit 212, and the change in sound pressure in the first acoustic cavity 213 is more obvious and effective.

[0049] In some embodiments, the elastic element 2122 may be a tubular structure. Accordingly, the shape of the inner wall of the elastic element 2122 of the tubular structure may match the shape of the peripheral surface of the mass element 2121. Here, it can be understood that the inner wall of the elastic element 2122 and the mass element 2121 have the same cross-sectional shape at different heights along the vibration direction. The inner wall of the elastic element 2122 is a side wall that is bonded to the mass element 2121 of the tubular structure. For example, the mass element 2121 is stepped, and the connection point between the elastic element 2122 and the mass element 2121 is stepped to match the mass element 2121. In some embodiments, the shape of the cross section perpendicular to the vibration direction of the mass element 2121 may be a regular or irregular shape, such as a triangle, a square, a circle, an ellipse, a sector, a rounded rectangle, etc. The shape of the outer wall of the tubular structure of the elastic element 2122 is not limited herein, and the outer wall of the elastic element 2122 may be a side wall away from the inner wall connected to the mass element 2121 of the elastic element 2122. For example, the shape of the outer wall of the tubular structure of the elastic element 2122 may include a circular cylinder, an elliptical cylinder, a cone, a rounded rectangular cylinder, a rectangular cylinder, a polygonal cylinder, an irregular cylinder, etc., or any combination thereof.

[0050] In some embodiments, the elastic element 2122 may extend toward the acoustic transducer 220 and be connected to the acoustic transducer 220. For example, as shown in FIG. 2A, one end of the elastic element 2122 extending toward the acoustic transducer 220 may be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 may be connected in a physical manner, for example, by bonding or welding. In some embodiments, the elastic element 2122 may be connected to the acoustic transducer 220 via a connecting member (not shown in FIG. 2A), one end of the connecting member is connected to the elastic element 2122, and the other end of the connecting member is connected to the acoustic transducer 220. In some embodiments, there may be direct contact or a gap between the elastic element 2122 and the housing 211. For example, as shown in FIG. 2A, there may be a gap between the elastic element 2122 and the housing 211. The size of the gap between the elastic element 2122 and the housing 211 can be adjusted by a designer according to the size of the vibration sensor 200. Compared with the elastic element 2122 directly contacting the housing 211, when there is a gap between the elastic element 2122 and the housing 211, the equivalent rigidity of the elastic element 2122 can be reduced and the elasticity of the elastic element 2122 can be improved, so that in the vibration process of the vibration unit 212, the amplitude of the mass element 2121 in a low frequency range (for example, 20 Hz to 6000 Hz) is improved, and the sensitivity of the vibration sensor 200 is improved.

[0051] In some embodiments, the area of ​​the mass element 2121 on the side away from the acoustic transducer 220 is smaller than the area of ​​the mass element 2121 on the side closer to the acoustic transducer 220. In some embodiments, the areas of the cross sections perpendicular to the vibration direction of the mass element 2121 may all be different, for example, the mass element 2121 has a stepped structure. In order to increase the connection area between the elastic element 2122 and the peripheral surface of the mass element 2121, in some embodiments, the areas of the cross sections perpendicular to the vibration direction of the mass element 2121 gradually increase from the side of the mass element 2121 away from the acoustic transducer 220 to the side of the mass element 2121 closer to the acoustic transducer 220. In some embodiments, the areas of the cross sections perpendicular to the vibration direction of the mass element 2121 may be partially the same, for example, the peripheral side of the mass element 2121 has a stepped structure. When the thickness of the mass element 2121 along the vibration direction is constant, if the areas of multiple cross-sections perpendicular to the vibration direction of the mass element 2121 are different, the area of ​​the peripheral surface of the mass element 2121 can be increased, and the connection area between the elastic element 2122 and the mass element 2121 can be increased, improving the connection strength between the elastic element 2122 and the mass element 2121, strengthening the sealing of the first acoustic cavity, and making the change in sound pressure in the first acoustic cavity in response to the vibration of the housing more noticeable, thereby improving the sensitivity of the vibration sensor.

[0052] In some embodiments, the peripheral surface of the mass element 2121 may have at least one step-like structure. FIG. 2B is a schematic diagram of a mass element 2121 according to some embodiments of the present application. Referring to FIG. 2A and FIG. 2B, the mass element 2121 may include a first mass element 21211 and a second mass element 21212, the second mass element 21212 is close to the acoustic transducer 220, the first mass element 21211 is located on the side of the second mass element 21212 away from the acoustic transducer 220, and the area of ​​the cross section of the first mass element 21211 perpendicular to the vibration direction of the mass element 2121 is smaller than the area of ​​the cross section of the second mass element 21212 perpendicular to the vibration direction of the mass element 2121, so that the entire outer edge of the first mass element 21211 and the second mass element 21212 forms a step-like structure. As a mere example, the peripheral surface of the mass element 2121 may include a sidewall a of the first mass element 21211, an area b and a sidewall c of the second mass element 21212, and the sidewall a, the area b and the sidewall c form a step-like structure. The step-like structure can increase the area of ​​the peripheral surface of the mass element 2121, and accordingly increase the connection area between the elastic element 2122 and the sidewall of the mass element 2121, which is conducive to the close contact between the mass element 2121 and the elastic element 2122, thereby improving the sealing between the elastic element 2122 and the mass element 2121, and helping to ensure the sealing of the first acoustic cavity 213. In some embodiments, the first mass element 21211 and the second mass element 21212 may be connected and fixed in a physical manner, for example, by bonding (adhesion is achieved by a colloid having adhesive properties such as epoxy adhesive, silicone sealant, etc.) or by integral molding. In some embodiments, a side of the first mass element 21211 proximal to the acoustic transducer 220 and a side of the second mass element 21212 distal to the acoustic transducer 220 may be fixedly connected in a physical manner.

[0053] In some embodiments, the side of the first mass element 21211 away from the acoustic transducer 220 is perpendicular to its vibration direction, and the side of the second mass element 21212 close to the acoustic transducer 220 is perpendicular to its vibration direction. In some embodiments, the closer to the second mass element 21212, the larger the cross-sectional area perpendicular to the vibration direction of the first mass element 21211, and the closer to the acoustic transducer 220, the larger the cross-sectional area perpendicular to the vibration direction of the second mass element 21212. In some embodiments, the first mass element 21211 may be concentrically disposed with the second mass element 21212 or may be non-concentrically disposed with the second mass element 21212. In some embodiments, the shape of the sidewall of the first mass element 21211 and / or the second mass element 21212 (i.e., a cross section perpendicular to the vibration direction) may include a circular cylinder, an elliptical cylinder, a trapezoid, a rounded rectangular cylinder (as shown in FIG. 2B), a rectangular cylinder, a polygonal cylinder, an irregular cylinder (e.g., a cylinder having multiple stepped surfaces), etc., or any combination thereof. In some embodiments, the first mass element 21211 and the second mass element 21212 may have the same shape of the sidewall, for example, as shown in FIG. 2B, the first mass element 21211 and the second mass element 21212 both have a rounded rectangular cylinder shape of the sidewall. In some embodiments, the first mass element 21211 and the second mass element 21212 may have different sidewall shapes, for example, the sidewall shape of the first mass element 21211 is formed into a cylindrical shape and the sidewall shape of the second mass element 21212 is formed into a rounded rectangular pillar. In some embodiments, the material of the first mass element 21211 and the material of the second mass element 21212 may be the same or different, and by way of example only, the material of the first mass element 21211 and the second mass element 21212 may include metals or alloys such as lead, copper, silver, tin, stainless steel, ferritic stainless steel, or any combination thereof. In some embodiments, the density of the material of the first mass element 21211 and the second mass element 21212 is 6 g / cm or less. 3 In some embodiments, the density of the material of the first mass element 21211 and the second mass element 21212 is 7 g / cm 3 It could be larger.

[0054] In some embodiments, the first mass element 21211 is located in a central region of the second mass element 21212 such that there is a constant distance d (e.g., 10 um to 1000 um) between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212, i.e., there is a constant distance d between the edge of the side of the first mass element 21211 that is close to the acoustic transducer 220 and the edge of the side of the second mass element 21212 that is away from the acoustic transducer 220. In some embodiments, the spacing d between the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212 may be equal everywhere, for example, when the first mass element 21211 is concentrically disposed with the second mass element 21212, the shape of the sidewall of the first mass element 21211 and the shape of the sidewall of the second mass element 21212 are both cylindrical structures, and the spacing d between the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212 is equal everywhere. In some embodiments, the spacing d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 may not be equal, for example, if the shape of the sidewall of the first mass element 21211 is a cylindrical structure and the shape of the sidewall of the second mass element 21212 is a rectangular pillar, the spacing between the edge of the sidewall of the second mass element 21212 and the sidewall of the first mass element 21211 is not equal to the spacing between the edge of the sidewall of the second mass element 21212 and the sidewall of the first mass element 21211. In some embodiments, the fixed spacing d may be 10 um to 500 um. More preferably, the fixed spacing d may be 20 um to 450 um. More preferably, the fixed spacing d may be 30 um to 400 um. More preferably, the fixed spacing d may be 40 um to 350 um. More preferably, the fixed spacing d may be 50 um to 300 um. More preferably, the regular interval d may be 60 um to 250 um. More preferably, the regular interval d may be 70 um to 200 um. More preferably, the regular interval d may be 80 um to 150 um. More preferably, the regular interval d may be 90 um to 100 um.

[0055] In some embodiments, the thickness of the first mass element 21211 along the vibration direction may be greater than the thickness of the second mass element 21212 along the vibration direction. Increasing the thickness of the first mass element 21211 not only increases the mass of the entire mass element 2121, but also increases the connection area between the elastic element 2122 and the side wall a of the first mass element 21211, thereby improving the connection strength between the elastic element 2122 and the mass element 2121. In some embodiments, the thickness of the first mass element 21211 along the vibration direction may be 50 um to 1000 um, and the thickness of the second mass element 21212 along the vibration direction may be 10 um to 150 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 60 um to 900 um, and the thickness of the second mass element 21212 along the vibration direction may be 20 um to 130 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 70 um to 800 um, and the thickness of the second mass element 21212 along the vibration direction may be 30 um to 120 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 80 um to 700 um, and the thickness of the second mass element 21212 along the vibration direction may be 40 um to 110 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 90 um to 600 um, and the thickness of the second mass element 21212 along the vibration direction may be 50 um to 100 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 100 um to 500 um, and the thickness of the second mass element 21212 along the vibration direction may be 60 um to 90 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 200 um to 400 um, and the thickness of the second mass element 21212 along the vibration direction may be 60 um to 90 um. More preferably, the thickness of the first mass element 21211 along the vibration direction may be 300 um to 350 um, and the thickness of the second mass element 21212 along the vibration direction may be 70 um to 80 um.

[0056] It should be noted that the mass element 2121 is not limited to the structure including the first mass element 21211 and the second mass element 21212 as shown in Figures 2A and 2B, but may further include a third mass element, a fourth mass element, or more mass elements. When the mass element 2121 includes two or more mass elements, one step-like structure can be formed between the sidewalls of every two mass elements.

[0057] In some embodiments, the elastic element 2122 may include a first elastic portion 21221 and a second elastic portion 21222, where the first elastic portion 21221 is attached to a sidewall of the first mass element 21211 and the second elastic portion 21222 is attached to a sidewall of the second mass element 21212, and the first elastic portion 21221 and the second elastic portion 21222 may be connected in a physical manner, for example, by bonding or welding. In some embodiments, the first elastic portion 21221 and the second elastic portion 21222 may be a unitary molded structure. In some embodiments, the first elastic portion 21221 is in intimate contact with a sidewall of the first mass element 21211 and the second elastic portion 21222 is in intimate contact with a sidewall of the second mass element 21212, and the first elastic portion 21221 is hermetically connected to the second elastic portion 21222. In some embodiments, both ends of the first elastic portion 21221 may be respectively connected to the sidewall of the first mass element 21211 and the second elastic portion 21222. In some embodiments, both ends of the first elastic portion 21221 may be hermetically connected to the sidewall of the first mass element 21211 and the second elastic portion 21222, respectively. The first elastic portion 21221 may include a first side surface 21221a and a second side surface 21221b, the first side surface 21221a being connected to a sidewall of the first mass element 21211, and the second side surface 21221b being connected to a surface of the second mass element 21212 exposed to the second acoustic cavity 214. The second side surface 21221b of the first elastic portion 21221 may be connected to a stepped surface of the second mass element 21212, and the stepped surface of the second mass element 21212 has a supporting effect on the first elastic portion 21221. The second side surface 21221b of the first elastic portion 21221 may be connected to the second elastic portion 21222. The sidewall of the second mass element 21212 is connected to the second elastic portion 21222. In some embodiments, the second elastic portion 21222 extends toward the acoustic transducer 220 and is connected to the acoustic transducer 220 (eg, the substrate 222).In some embodiments, both ends of the second elastic portion 21222 may be connected to the sidewall of the second mass element 21212 and the acoustic transducer 220, respectively, and one end of the second elastic portion 21222 connected to the sidewall of the second mass element 21212 may be further connected to the first elastic portion 21221. In some embodiments, the shape of the first side surface 21221a of the first elastic portion 21221 matches the shape of the sidewall of the first mass element 21211, for example, the shape of a cross section perpendicular to the vibration direction of the first mass element 21211 may be a regular or irregular shape such as a triangle, a square, a circle, an ellipse, a sector, a rounded rectangle, etc., and the shape of the cross section perpendicular to the vibration direction of the first mass element 21211 of the first side surface 21221a at each height along the vibration direction of the first mass element 21211 is the same as the cross-sectional shape of the first mass element 21211. In some embodiments, the shape of the side of the second elastic portion 21222 adjacent to the side wall of the second mass element 21212 matches the shape of the side wall of the second mass element 21212, for example, the shape of a cross section perpendicular to the vibration direction of the second mass element 21212 may be a regular or irregular shape such as a triangle, square, circle, ellipse, sector, rounded rectangle, etc., and at each height along the vibration direction, the shape of the cross section perpendicular to the vibration direction of the side of the second elastic portion 21222 adjacent to the side wall of the second mass element 21212 is the same as the shape of the cross section perpendicular to the vibration direction of the side wall of the second mass element 21212. The shape of the side surface of the first elastic portion 21221 away from the side wall of the first mass element 21211 and the shape of the side surface of the second elastic portion 21222 away from the side wall of the second mass element 21212 are not limited herein, and for example, the shapes of the sides may include a cylindrical shape, an elliptical cylindrical shape, a conical shape, a rounded rectangular cylinder, a rectangular cylinder, a polygonal cylinder, an irregular cylinder, etc., or any combination thereof. In some embodiments, the first elastic portion 21221 and the second elastic portion 21222 may be made of the same or different materials, and by way of example only, the material of the first elastic portion 21221 or the second elastic portion 21222 may include silicone rubber, silicone gel, silicone sealant, etc., or any combination thereof.

[0058] In some embodiments, the mass element 2121 may further include a first hole 21213 communicating between the first acoustic cavity 213 and the second acoustic cavity 214. The first hole 21213 penetrates the mass element 2121 and allows gas to flow between the first acoustic cavity 213 and the second acoustic cavity 214, thereby balancing the change in air pressure inside the first acoustic cavity 213 and the second acoustic cavity 214 due to temperature change during the manufacturing process of the vibration sensor 200 (e.g., during the reflow soldering process), and reducing or preventing damage to the components of the vibration sensor 200, such as cracking and deformation, due to the change in air pressure.

[0059] In some embodiments, the first hole portion 21213 may be a single hole structure. In some embodiments, the diameter of the single hole may be 1 to 50 um. Preferably, the diameter of the single hole may be 2 to 45 um. More preferably, the diameter of the single hole may be 3 to 40 um. More preferably, the diameter of the single hole may be 4 to 35 um. More preferably, the diameter of the single hole may be 5 to 30 um. More preferably, the diameter of the single hole may be 5 to 25 um. More preferably, the diameter of the single hole may be 5 to 20 um. More preferably, the diameter of the single hole may be 6 to 15 um. More preferably, the diameter of the single hole may be 7 to 10 um. In some embodiments, the first hole portion 21213 may be an array composed of a certain number of microholes. Merely by way of example, the number of microholes may be 2 to 10. In some embodiments, the diameter of each microhole may be 0.1 to 25 um. Preferably, the diameter of each micropore may be 0.5 to 20 um. More preferably, the diameter of each micropore may be 0.5 to 25 um. More preferably, the diameter of each micropore may be 0.5 to 20 um. More preferably, the diameter of each micropore may be 0.5 to 15 um. More preferably, the diameter of each micropore may be 0.5 to 10 um. More preferably, the diameter of each micropore may be 0.5 to 5 um. More preferably, the diameter of each micropore may be 0.5 to 4 um. More preferably, the diameter of each micropore may be 0.5 to 3 um. More preferably, the diameter of each micropore may be 0.5 to 2 um. More preferably, the diameter of each micropore may be 0.5 to 1 um.

[0060] In some embodiments, the mass element 2121 may not have the first hole 21213. In some embodiments, if the mass element 2121 does not have the first hole 21213, the connection strength between the mass element 2121 and the elastic element 2122 may be improved (e.g., the adhesive strength of the adhesive between the mass element 2121 and the elastic element 2122 may be improved) to prevent the components of the vibration sensor 200 from being damaged by changes in air pressure inside the first acoustic cavity 213.

[0061] In some embodiments, the acoustic transducer 220 may include a substrate 222. The substrate 222 may fix and / or support the vibration receiver 210. In some embodiments, the substrate 222 may be installed on the acoustic transducer 220, and the housing 211 may be physically connected to the substrate 222 so as to surround the acoustic cavity. In some embodiments, one end of the elastic element 2122 extending toward the acoustic transducer 220 may be connected to the substrate 222, and the substrate 222 may fixedly support the vibration unit 212. By installing the substrate 222, the vibration receiver 210 may be processed, manufactured, and sold as an independent member. The acoustic transducer 220 having the substrate 222 may be physically connected (e.g., bonded) directly to the vibration receiver 210 to form the vibration sensor 200, which simplifies the manufacturing process of the vibration sensor 200 and improves the flexibility of the manufacturing process of the vibration sensor 200. In some embodiments, the thickness of the substrate 222 may be 10 um to 300 um. Preferably, the thickness of the substrate 222 may be between 20 um and 280 um. More preferably, the thickness of the substrate 222 may be between 30 um and 270 um. More preferably, the thickness of the substrate 222 may be between 40 um and 250 um. More preferably, the thickness of the substrate 222 may be between 80 um and 90 um. In some embodiments, the material of the substrate 222 may include a metal (e.g., iron, copper, stainless steel, etc.), an alloy, a non-metal (plastic, rubber, resin), etc., or any combination thereof.

[0062] In some embodiments, the sound collection hole 2221 may be located in the substrate 222, and the sound collection hole 2221 penetrates the substrate 222 along the vibration direction. A change in sound pressure in the first acoustic cavity 213 can act on the acoustic transducer 220 through the sound collection hole 2221 to generate an electrical signal.

[0063] The above description of the vibration sensor 200 and its components is merely for illustrative purposes and does not limit the scope of application of this specification. Those skilled in the art can make various modifications and changes to the vibration sensor 200 based on the teachings of this specification, for example, the vibration sensor 200 may include at least one first hole 21213, and the first hole 21213 may be disposed through the elastic element 2122. These modifications and changes are still within the scope of this specification.

[0064] In order to ensure that the elastic element and the mass element have a large connection area and further improve the connection strength between the elastic element and the mass element, the mass element may have another structure, which satisfies that the area of ​​the mass element away from the acoustic transducer is smaller than the area of ​​the mass element close to the acoustic transducer. Figure 3 is a schematic diagram of a vibration unit 312 according to some embodiments of the present application. As shown in FIG. 3, the area of ​​the side of the mass element 3121 away from the acoustic transducer is larger than the area of ​​the side of the mass element 3121 close to the acoustic transducer, and in a cross section along the vibration direction of the mass element 3121 (as shown in FIG. 3), the side connecting the edge of the mass element 3121 away from the acoustic transducer and the edge of the mass element 3121 close to the acoustic transducer is an inclined surface, and the elastic element 3122 is connected to the inclined surface connecting the side of the mass element 3121 away from the acoustic transducer and the side of the mass element 3121 close to the acoustic transducer, ensuring that the elastic element 3122 and the mass element 3121 have a large connection area and further improving the connection strength between the elastic element 3122 and the mass element 3121.

[0065] In some embodiments, the side of the mass element 3121 connecting the side away from the acoustic transducer and the side close to the acoustic transducer may be a sloping surface having a smooth surface. In some embodiments, the side of the mass element 3121 connecting the side away from the acoustic transducer and the side close to the acoustic transducer may be a sloping surface having a plurality of projections and recesses, for example, the surface of the sloping surface may have a wavy or sawtooth structure. In some embodiments, in a cross section along the vibration direction of the mass element 3121, a line segment connecting an edge of the mass element 3121 on the side away from the acoustic transducer and an edge of the mass element 3121 on the side close to the acoustic transducer forms an included angle c in the range of 10° to 80° between the vibration direction of the mass element 3121, and by setting the value range of the included angle c, it is possible to avoid that if the included angle c is too small, the optimization effect of the connection strength between the elastic element 3122 and the mass element 3121 is not obvious, and if the included angle c is too large, it is possible to avoid that the area of ​​the mass element 3121 on the side away from the acoustic transducer is too small and the mass of the mass element 3121 is too small. Preferably, the included angle c may be 20° to 70°. More preferably, the included angle c may be 30° to 60°. More preferably, the included angle c may be 40° to 50°. More preferably, the included angle c may be from 42° to 48°.More preferably, the included angle c may be from 44° to 46°.

[0066] In some embodiments, the elastic element 3122 is attached to a side of the mass element 3121 that connects the side of the mass element 3121 away from the acoustic transducer to the side of the mass element 3121 that is close to the acoustic transducer. In some embodiments, one end of the elastic element 3122 is connected to the inclined surface of the mass element 3121, and the other end of the elastic element 3122 is connected to the acoustic transducer. A first acoustic cavity 313 is formed between the side of the mass element 3121 that is close to the acoustic transducer, the elastic element 3122, and the acoustic transducer. In some embodiments, the shape of the end surface of the elastic element 3122 that is connected to the inclined surface of the mass element 3121 matches the shape of the inclined surface of the mass element 3121, for example, if the edge of the connected side is a wavy or sawtooth curve, the outer edge of the end surface of the elastic element 3122 that is connected to the connected side is also a wavy or sawtooth curve. This specification does not limit the shape of the side of the elastic element 3122 exposed to the second acoustic cavity, and for example, in a cross section along the vibration direction of the mass element 3121, the edge of the side of the elastic element 3122 exposed to the second acoustic cavity may be an irregular curve with multiple bumps.

[0067] In some embodiments, the mass element 3121 may further include a first hole 31213 penetrating the mass element 3121 to allow gas flow between the first acoustic cavity 313 and the second acoustic cavity. In some embodiments, the first hole 31213 may be a single hole structure. In some embodiments, the first hole 31213 may be an array of a certain number of micropores. By way of example only, the number of micropores may be 2 to 10.

[0068] In some embodiments, the substrate 322 can fix and / or support the vibration unit 312. In some embodiments, an end of the elastic element 3122 connected to the acoustic transducer may be connected to the substrate 322 such that the substrate 322 can fix and support the vibration unit 312. In some embodiments, the substrate 322 may include a sound collection hole 2221 that acoustically communicates the first acoustic cavity 313 with the acoustic transducer.

[0069] It should be noted that the above description of the vibration unit 312 and its components is merely for illustrative purposes and does not limit the scope of application of this specification. Those skilled in the art can make various modifications and changes to the vibration unit 312 based on the teachings of this specification, for example, the vibration sensor 200 may include at least two elastic elements, the elastic element is connected to the elastic element, the elastic element adjacent to the mass element is connected to the mass element, and the mass element adjacent to the acoustic transducer is connected to the acoustic transducer. These modifications and changes are still within the scope of this specification.

[0070] In the process of forming the first hole in the mass element, some elements (e.g., the substrate) of the acoustic transducer may be destroyed. In order to prevent the formation of the first hole from destroying the acoustic transducer, in some embodiments, the mass element may include one or more second holes (also called grooves), and the first hole communicates with the second hole. Figure 4 is a schematic diagram of a vibration unit 412 according to some embodiments of the present application. As shown in Figure 4, both ends of the elastic element 4122 are respectively connected to the side wall of the mass element 4121 and the acoustic transducer in a physical manner, for example, bonded, and a first acoustic cavity 413 is formed between the side of the mass element 4121 close to the acoustic transducer, the elastic element 4122, and the acoustic transducer.

[0071] When the first hole 41213 needs to be provided in the mass element 4121, the first hole 41213 is difficult to process due to the large overall thickness of the mass element 4121 along the vibration direction. In some embodiments, the second hole 41214 may be provided in the mass element 4121, and the first hole 41213 communicates with the second hole 41214. In some embodiments, the mass element 4121 may include one or more second holes 41214. The provision of the second hole 41214 thins the local structure of the mass element 4121, making it easier to form the first hole 41213 in the thinned local structure, and at the same time, it is easier to control the processing force of the first hole 41213, and other components of the vibration sensor (e.g., the substrate 422, the acoustic transducer) are not damaged during the processing of the first hole 41213. In some embodiments, the second hole 41214 is located on a side of the mass element 4121 along the vibration direction. For example, the second hole 41214 may be located on a side of the mass element 4121 close to the substrate 422 or on a side of the mass element 4121 away from the substrate 422. In some embodiments, the first hole 41213 and the second hole 41214 are located along the vibration direction of the mass element 4121, and the first hole 41213 and the second hole 41214 penetrate the mass element 4121. In some embodiments, the second hole 41214 may be located concentrically with the mass element 4121 or may be located non-concentrically with the mass element 4121. In some embodiments, the first hole 41213 may be located concentrically with the second hole 41214 or may be located non-concentrically with the second hole 41214.

[0072] In some embodiments, the second hole portion 41214 and / or the first hole portion 41213 may be a square hole, a polygonal hole, a circular hole, an irregular hole, etc., or any combination thereof, and the shape of the second hole portion 41214 and the first hole portion 41213 is not limited herein. In some embodiments, the first hole portion 41213 and the second hole portion 41214 may have the same shape or different shapes. In some embodiments, the first hole portion 41213 and the second hole portion 41214 may both have a single hole structure. In some embodiments, the second hole portion 41214 may have a single hole structure, and the first hole portion 41213 may be an array composed of a certain number of micropores.

[0073] In some embodiments, the size of the second hole 41214 is larger than the size of the first hole 41213, so that the first hole 41213 can be easily processed in the second hole 41214. In some embodiments, the area of ​​a cross section of the second hole 41214 perpendicular to the vibration direction of the mass element 4121 is larger than the area of ​​a cross section of the first hole 41213 perpendicular to the vibration direction of the mass element 4121. When both the second hole 41214 and the first hole 41213 are circular holes, the hole diameter of the second hole 41214 may be 100 um to 1600 um, and the hole diameter of the first hole 41213 may be 1 um to 50 um. Preferably, the hole diameter of the second hole 41214 may be 110 um to 1400 um, and the hole diameter of the first hole 41213 may be 2 um to 45 um. Preferably, the hole diameter of the second hole portion 41214 may be 120 um to 1200 um, and the hole diameter of the first hole portion 41213 may be 3 um to 40 um. Preferably, the hole diameter of the second hole portion 41214 may be 130 um to 1000 um, and the hole diameter of the first hole portion 41213 may be 4 um to 35 um. Preferably, the hole diameter of the second hole portion 41214 may be 140 um to 800 um, and the hole diameter of the first hole portion 41213 may be 5 um to 30 um. Preferably, the hole diameter of the second hole portion 41214 may be 160 um to 600 um, and the hole diameter of the first hole portion 41213 may be 5 um to 25 um. Preferably, the hole diameter of the second hole 41214 may be 180 um to 500 um, and the hole diameter of the first hole 41213 may be 5 um to 20 um. Preferably, the hole diameter of the second hole 41214 may be 200 um to 400 um, and the hole diameter of the first hole 41213 may be 10 um to 15 um.

[0074] Figure 5 is a schematic diagram of the mass element 4121 shown in Figure 4, in which the second hole portion 41214 is arranged on the side of the mass element 4121 close to the acoustic transducer, the first hole portion 41213 is arranged on the side of the mass element 4121 away from the acoustic transducer, and the second hole portion 41214 and the first hole portion 41213 are arranged to penetrate the mass element 4121.

[0075] FIG. 6A is a schematic diagram of a vibration unit 412 according to some embodiments of the present application. As shown in FIG. 6A, the second hole 41214 may be further located on the side of the mass element 4121 that is away from the acoustic transducer, and the first hole 41213 is located on the side of the mass element 4121 that is closer to the acoustic transducer, and the second hole 41214 and the first hole 41213 penetrate the mass element 4121. In some embodiments, the depth of the first hole 41213 along the vibration direction of the mass element 4121 may be greater than, less than, or equal to the depth of the second hole 41214 along the vibration direction of the mass element 4121. Merely by way of example, FIG. 6B is a schematic diagram of a vibration unit 412 according to some embodiments of the present application. As shown in Fig. 6B, the second hole 41214 is located on the side of the mass element 4121 that is farther from the acoustic transducer, the first hole 41213 is located on the side of the mass element 4121 that is closer to the acoustic transducer, the second hole 41214 and the first hole 41213 penetrate the mass element 4121, and the depth of the first hole 41213 in the vibration direction of the mass element 4121 is greater than the depth of the second hole 41214 in the vibration direction of the mass element 4121. Fig. 6C is a schematic diagram of a vibration unit 412 according to some embodiments of the present application. As shown in FIG. 6C, in some embodiments, the second holes 41214 are provided on both the side of the mass element 4121 close to the acoustic transducer and the side of the mass element 4121 away from the acoustic transducer, and the second holes 41214 on both sides of the mass element 4121 communicate with each other through the first holes 41213. In some embodiments, the vibrating unit 412 may include multiple layers of mass elements 4121 stacked together, and the materials of the multiple layers of mass elements 4121 may be the same, partially the same, or completely different, and the first holes 41213 are provided through some of the mass elements 4121, and the second holes 41214 are provided through some of the mass elements 4121, and the first holes 41213 communicate with the second holes 41214. For illustrative purposes only, FIG. 6D is a schematic diagram of a vibrating unit 412 according to some embodiments of the present application.As shown in FIG. 6D , the vibration unit 412 may include two stacked layers of mass elements 4121, the materials of the two layers of mass elements 4121 being different, a first hole portion 41213 being disposed through the mass element 4121 away from the acoustic transducer, and a second hole portion 41214 being disposed through the mass element 4121 close to the acoustic transducer, and the first hole portion 41213 being in communication with the second hole portion 41214.

[0076] The above description of the vibration unit 412 and its components is merely for illustration and explanation, and does not limit the scope of application of this specification. A person skilled in the art can make various modifications and changes to the vibration unit 412 based on the suggestions of this specification. For example, the second hole 41214 and the first hole 41213 may be installed through the side wall of the mass element 4121. These modifications and changes are still within the scope of this specification. The second hole 41214 shown in Figures 4 to 6D may also be applied to the vibration sensor 200 shown in Figure 2A. The mass elements 4121 shown in Figures 4 to 6D are merely examples, and their specific shapes and structures may refer to the contents of Figures 2A and 2B, and will not be further described here.

[0077] In some embodiments, the elastic element occupies a large space in the acoustic cavity during processing, especially when the elastic element is in a semi-fluid state or deformed in a high-temperature process, making it difficult to control the size of the elastic element. In some embodiments, the vibration sensor may further include a stopper, which is located between the elastic element and the housing to limit the flow trajectory of the elastic element in a high-temperature state, making it easier to control the size of the elastic element. FIG. 7 is a schematic diagram of a vibration sensor 500 according to some embodiments of the present application. As shown in FIG. 7, the vibration sensor 500 includes a vibration receiver 510, an acoustic transducer 520, and a stopper 530. The vibration receiver 510 may include a housing 511 and a vibration unit 512. The housing 511 may be connected to the acoustic transducer 520 so as to surround the package structure having the acoustic cavity. The vibration unit 512 may be located in the acoustic cavity. The vibration unit 512 can divide the acoustic cavity into a first acoustic cavity 513 and a second acoustic cavity 514. The vibration unit 512 may include a mass element 5121 and an elastic element 5122. The elastic element 5122 may be attached to a side wall of the mass element 5121 and extend toward the acoustic transducer 520 and directly connected to a substrate 522, the substrate 522 may be mounted on the acoustic transducer 520, and the vibration receiver 510 may be mounted on the substrate 522. The structure and members of the vibration sensor 500 are the same as or similar to those of the vibration sensor 200 described in FIG. 2A, and may refer to the description in FIG. 2A in particular, and will not be further described here.

[0078] In some embodiments, the stopper 530 is located between the elastic element 5122 and the housing 511, and the stopper 530 acts as a restricting member against the outer wall of the elastic element 5122, and can control the flow of the elastic element 5122 during the manufacturing process of the vibration receiver 510, thereby better controlling the size and shape of the elastic element 5122.

[0079] In some embodiments, stopper 530 may be disposed around elastic element 5122, with a side of elastic element 5122 adjacent to mass element 5121 physically connected to mass element 5121 and a side of elastic element 5122 adjacent to stopper 530 physically connected to stopper 530. In some embodiments, stopper 530 may be physically connected to substrate 522. In some embodiments, stopper 530 may not contact housing 511 or may contact housing 511.

[0080] In some embodiments, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 100 um to 1000 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 110 um to 900 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 120 um to 800 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 130 um to 700 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 140 um to 600 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 150 um to 500 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 160 um to 400 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 170 um to 300 um. Preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 may be 180 um to 200 um. More preferably, the height of the stopper 530 along the vibration direction of the mass element 5121 is equal to the height of the mass element 5121. In this specification, the material and density of the stopper 530 are not limited, and for example, the stopper 530 may use a non-magnetic metal material.

[0081] In some embodiments, the housing 511 may be provided with at least one third hole 5111, which penetrates the housing 511. The structure of the third hole 5111 is the same as or similar to the structure of the first hole 21213, and may refer to the description in FIG. 2A specifically, and will not be further described here. The third hole 5111 allows the second acoustic cavity 514 and the outside gas to flow therethrough, and therefore balances the change in air pressure inside the second acoustic cavity 514 due to temperature change during the manufacturing process of the vibration sensor 500 (e.g., during the reflow soldering process), and can reduce or prevent damage, such as cracking, deformation, etc., of the components of the vibration sensor 500 due to the change in air pressure. In addition, when the mass element 5121 vibrates, the third hole 5111 can reduce attenuation caused by the gas inside the second acoustic cavity 514.

[0082] In some embodiments, air-conducted sound in the environment may affect the performance of the vibration sensor 500. To reduce the effect of air-conducted sound in the environment, the third hole 5111 on the housing 511 may be sealed by a sealing material after the manufacturing of the vibration sensor 500 is completed, for example, after reflow soldering. By way of example only, the sealing material may include an epoxy adhesive, a silicone sealant, or the like, or any combination thereof. In some embodiments, the housing 511 may not have the third hole 5111.

[0083] The description of the vibration sensor 500 and its components in FIG. 7 is merely for illustration and explanation, and does not limit the scope of application of this specification. Those skilled in the art can make various modifications and changes to the vibration sensor 500 based on the suggestions of this specification. For example, the housing 511 and the acoustic transducer 520 may be in contact (e.g., physically connected) or indirectly connected. These modifications and changes are still within the scope of this specification. The stopper 530 shown in FIG. 7 may also be applied to the vibration sensor shown in FIGS. 2A to 6D. The mass element 5121 in FIG. 7 is merely an example, and the specific shape and structure thereof may be referred to the contents of FIGS. 2A to 6D, and will not be further described here.

[0084] FIG. 8 is a schematic diagram of a vibration sensor 600 according to some embodiments of the present application. As shown in FIG. 8, the vibration sensor 600 includes a vibration receiver 610 and an acoustic transducer 620. The vibration receiver 610 may include a housing 611 and a vibration unit 612. The housing 611 may be connected to the acoustic transducer 620 so as to surround a package structure having an acoustic cavity, and the vibration unit 612 may be located in the acoustic cavity to partition the acoustic cavity into a first acoustic cavity 613 and a second acoustic cavity 614. The vibration unit 612 may include a mass element 6121 and an elastic element 6122, and the mass element 6121 is connected to the housing 611 by the elastic element 6122. The structure and members of the vibration sensor 600 are the same as or similar to the structure and members of the vibration sensor 200 described in FIG. 2A, and may specifically refer to the description in FIG. 2A, and will not be further described here.

[0085] In some embodiments, the elastic element 6122 is fitted to the outside of the mass element 6121, the inside of the elastic element 6122 is physically connected to the mass element 6121, and the outside of the elastic element 6122 is physically connected to the housing 611. In some embodiments, the elastic element 6122 and the substrate 622 have a certain distance in the vibration direction of the mass element 6121, and the elastic element 6122, the mass element 6121, the housing 611, and the substrate 622 form a first acoustic cavity 613, and the elastic element 6122, the mass element 6121, and the housing 611 form a second acoustic cavity 614. When forming the first acoustic cavity 613 and the second acoustic cavity 614, the height of the mass element 6121 can be controlled by a jig (not shown in FIG. 8 ), for example, the mass element 6121 is placed on a jig, and the jig itself raises the mass element 6121, and then the mass element 6121 and the housing 611 are connected by an elastic element 6122 to realize the control of the height of the mass element 6121, thereby making it possible to more stably control the height of the first acoustic cavity 613 and the second acoustic cavity 614. In some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is equal to the thickness of the mass element 6121. In some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is smaller or larger than the thickness of the mass element 6121.

[0086] 9 is a schematic diagram of a vibration receiver 610 according to some embodiments of the present application. As shown in FIG. 9, in some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is greater than the thickness of the mass element 6121, and both sides of the elastic element 6122 along the vibration direction of the mass element 6121 may protrude beyond both sides of the mass element 6121, thus increasing the connection area between the elastic element 6122 and the mass element 6121 and improving the connection strength between them.

[0087] In some embodiments, a hole 630 may be formed in the mass element 6121. The hole 630 penetrates the mass element 6121 to communicate the first acoustic cavity 613 and the second acoustic cavity 614, and therefore balances the change in air pressure inside the first acoustic cavity 613 and the second acoustic cavity 614 due to temperature changes during the manufacturing process of the vibration sensor 600 (e.g., during the reflow soldering process), and can reduce or prevent damage to the components of the vibration sensor 600, such as cracking and deformation, due to the change in air pressure. In some embodiments, a hole 630 may be formed in the housing 611, and the hole 630 can penetrate the housing 611 to communicate the second acoustic cavity 614 with the outside, and the hole 630 can reduce attenuation caused by the gas inside the second acoustic cavity 614 when the mass element 6121 vibrates. Regarding the shape and structure of the hole 630, reference may be made to the descriptions relating to the first hole, the second hole, and the third hole in other parts of the embodiments of this specification, for example, FIG. 2A and its related descriptions.

[0088] 8 and 9 are merely for illustrative purposes and are not intended to limit the scope of application of this specification. Those skilled in the art can make various modifications and changes to the vibration sensor 600 based on the suggestions of this specification. For example, neither the housing 611 nor the mass element 6121 has a hole 630, or both the housing 611 and the mass element 6121 have a hole 630. These modifications and changes are still within the scope of this specification.

[0089] Although the basic concept has been described above, it is clear to those skilled in the art that the above detailed disclosure is merely provided as an example and is not intended to limit the present application. Although not expressly described herein, those skilled in the art may make various changes, improvements and modifications to the present application. These changes, improvements and modifications are intended to be suggested by the present application and therefore fall within the spirit and scope of the exemplary embodiments of the present application.

[0090] Also, certain terms are used herein to describe embodiments of the present application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the present application. Thus, it is emphasized and understood that references to two or more of "one embodiment," "one embodiment," or "one alternative embodiment" in various parts of this specification do not necessarily all refer to the same embodiment. Also, certain features, structures, or characteristics in one or more embodiments of the present application may be combined as appropriate.

[0091] Also, as will be appreciated by those skilled in the art, aspects of the present application may be illustrated and described in several patentable classes or contexts, including any new and useful process, machine, manufacture, or combination of matter, or any new and useful improvement thereto. Thus, aspects of the present application may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. Any of the above hardware or software may be referred to as a "data block," "module," "engine," "unit," "assembly," or "system." Also, aspects of the present application may take the form of a computer program product embodied in one or more computer-readable medium(s) containing computer-readable program code.

[0092] The computer storage medium may include a propagated data signal, propagated on baseband or as part of a carrier wave, for carrying the computer program code. The propagated signal may include various forms, such as electromagnetic signals, optical signals, or suitable combinations. The computer storage medium may be any computer readable medium other than a computer readable storage medium, which may be connected to an instruction execution system, device, or facility to realize the communication, propagation, or transmission of the program used. The program code on the computer storage medium may be propagated via any suitable medium, including wireless, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0093] The computer program code necessary for the operation of each part of this application may be coded in one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, traditional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages. The program code may run entirely on the user's computer, on the user's computer as a separate software package, partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer by any form of network, such as a local area network (LAN) or wide area network (WAN), may be connected to an external computer (e.g., via the Internet), may be in a cloud computing environment, may be used as a service, such as Software as a Service (SaaS).

[0094] Additionally, unless expressly stated in the claims, the order of enumeration of processing elements or sequences, the use of alphanumeric characters, or the use of other designations does not limit the order of procedures and methods of the present application. While the above disclosure describes through various examples what are presently believed to be various useful embodiments of the invention, it should be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but on the contrary are intended to cover all modifications and equivalent combinations that are within the spirit and scope of the embodiments of the present application. For example, the system assembly described above may be implemented by a hardware device, but may also be implemented as a software-only solution, for example, by installing the described system on an existing server or mobile device.

[0095] Similarly, in the foregoing description of embodiments of the present application, it should be understood that various features may be grouped together in a single embodiment, figure, or description for the purpose of simplifying the application and facilitating an understanding of one or more embodiments of the present invention. This method of disclosure, however, should not be interpreted as reflecting an intention that the claimed subject matter requires more features than are recited in each claim. In fact, an embodiment may include fewer than all features of a single embodiment disclosed above.

[0096] In some embodiments, numbers describing the number of components and attributes are used, and it is understood that the numbers describing such embodiments are modified in some instances by the modifiers "about," "approximately," or "substantially." Unless otherwise specified, "about," "approximately," or "substantially" indicate that the numbers may vary by ±20%. Thus, in some embodiments, all numerical parameters used in the specification and claims are approximations that may vary depending on the characteristics required for a particular embodiment. In some embodiments, the numerical parameters should be applied with the stated number of significant digits and ordinary rounding techniques. In some embodiments, the numerical ranges and parameters determining the ranges are approximations; however, in specific embodiments, such numerical values ​​are set as precisely as possible.

[0097] All patents, patent applications, published patent applications, and other materials, such as articles, books, specifications, publications, documents, etc., referenced in this application are incorporated herein by reference in their entirety, except for prosecution history documents that are inconsistent or inconsistent with the content of this application, and documents that may have a limiting effect on the broadest scope of the claims of this application (now or later related to this application). In addition, if the explanations, definitions, and / or use of terms in the accompanying materials of this application are inconsistent or inconsistent with the content set forth in this application, the explanations, definitions, and / or use of terms in this application shall control.

[0098] Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations may be within the scope of the present application. Thus, by way of example, and not of limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Thus, the embodiments of the present application are not limited to the embodiments expressly introduced and described herein. [Explanation of symbols]

[0099] 100 Vibration Sensor 110 Vibration Receiver 120 Acoustic Transducer 211 Housing 212 Vibration Unit 213 First Acoustic Cavity 214 Second Acoustic Cavity 2121 Mass element 2122 Elastic element

Claims

1. a vibration receiver including a housing defining an acoustic cavity and a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; an acoustic transducer in acoustic communication with the first acoustic cavity; Including, The housing is configured to generate vibrations based on an external vibration signal, and the vibration unit modifies an acoustic pressure in the first acoustic cavity in response to the vibration of the housing to generate an electrical signal in the acoustic transducer; A vibration sensor, wherein the vibration unit includes a mass element and an elastic element, a side surface connecting the side of the mass element away from the acoustic transducer and the side of the mass element close to the acoustic transducer is a smoothly inclined surface, an area of ​​the side of the mass element away from the acoustic transducer is smaller than an area of ​​the side of the mass element close to the acoustic transducer, and the elastic element is attached to a side wall of the mass element.

2. The vibration sensor of claim 1, wherein in a cross section along the vibration direction of the mass element, a line segment connecting an edge of the mass element away from the acoustic transducer and an edge of the mass element close to the acoustic transducer forms an angle in the range of 10° to 80° with the vibration direction of the mass element.

3. A vibration sensor as described in claim 1, further comprising a stopper between the elastic element and the housing.

4. A vibration sensor as described in claim 1, wherein one end of the elastic element is connected to the inclined surface of the mass element, and the other end of the elastic element is directly connected to the acoustic transducer.

5. A vibration sensor as described in claim 1, wherein the first acoustic cavity is formed by the acoustic transducer, the elastic element, and a side of the mass element adjacent to the acoustic transducer.

6. A vibration sensor as described in claim 1, wherein the elastic element is attached to a side wall of the mass element and extends into the housing.

7. a vibration receiver including a housing defining an acoustic cavity and a vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; an acoustic transducer in acoustic communication with the first acoustic cavity; The housing is configured to generate vibrations based on an external vibration signal, and the vibration unit modifies an acoustic pressure in the first acoustic cavity in response to the vibration of the housing to generate an electrical signal in the acoustic transducer; The vibration unit includes a mass element and an elastic element attached to a side wall of the mass element, the mass element including a groove located on a side of the mass element along a vibration direction, the mass element further includes a first hole portion that communicates the first acoustic cavity with the second acoustic cavity and is located in the groove; A vibration sensor, wherein the size of the groove is larger than the size of the first hole.

8. A vibration sensor as described in Claim 7, wherein the first hole portion is arranged concentrically with the groove.

9. A vibration sensor as described in claim 7, wherein the first hole portion is not arranged concentrically with the groove.

10. A vibration sensor as described in claim 7, wherein the groove is provided on a side of the mass element closer to the acoustic transducer, the first hole portion is provided on a side of the mass element away from the acoustic transducer, and the groove and the first hole portion penetrate the mass element.

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