Semiconductor Device

Abstract

This semiconductor device comprises: a semiconductor layer; a first region of a first conductive type formed on the semiconductor layer and connected to a ground potential; a second region of a second conductive type formed on the semiconductor layer; an insulating film formed on the semiconductor layer and covering the first region and the second region; an internal circuit; a signal terminal which drives the internal circuit or is driven from the internal circuit; a first wiring which connects the internal circuit and the signal terminal; a resistance element which is formed on the insulating film and interposed in the middle of the first wiring, and includes a first resistor facing the second region with the insulating film interposed therebetween; and a second wiring which is connected to the first wiring on the side closer to the signal terminal than the resistance element and connects the first wiring and the second region.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device. [Background technology]

[0002] For example, Patent Document 1 provides a document that provides information on electrostatic breakdown (ESD breakdown).

[0003] Patent Document 1 discloses a field-effect transistor with an electrostatic protection diode, the field-effect transistor including a first FET and a two-terminal electrostatic protection circuit connected between a first gate and a first source of the first FET, the two-terminal electrostatic protection circuit including a first diode located on a side that is reverse-biased when a voltage lower than the potential of the first source is applied to the first gate and having a reverse withstand voltage lower than the reverse withstand voltage between the first gate and first source of the first FET, a second diode located on a side that is forward-biased when a voltage lower than the potential of the first source is applied to the first gate and connected in anti-series with the first diode, and a resistor connected in series with a diode pair consisting of the first diode and the second diode and formed using the same channel layer as the first FET. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-143127 A Summary of the Invention [Means for solving the problem]

[0005] A semiconductor device according to one embodiment of the present disclosure may include a semiconductor layer, a first region of a first conductivity type formed in the semiconductor layer and connected to a ground potential, a second region of a second conductivity type formed in the semiconductor layer, an insulating film formed on the semiconductor layer and covering the first region and the second region, an internal circuit, a signal terminal that drives the internal circuit or is driven by the internal circuit, a first wiring that connects the internal circuit and the signal terminal, a resistive element formed on the insulating film and interposed in the middle of the first wiring, the resistive element including a first resistor facing the second region across the insulating film, and a second wiring connected to the first wiring on a side closer to the signal terminal than the resistive element and connecting the first wiring and the second region. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic plan view of a semiconductor device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram showing an example of a circuit diagram of the first circuit in FIG. [Diagram 3] FIG. 3 is a schematic plan view of the resistance element of FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] 7A to 7C are diagrams for explaining variations in the planar shape of each resistor. [Figure 8] FIG. 8 is a diagram showing a modified example of the resistance element. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] <Embodiments of the present disclosure> First, embodiments of the present disclosure will be listed and described.

[0008] A semiconductor device according to one embodiment of the present disclosure may include a semiconductor layer, a first region of a first conductivity type formed in the semiconductor layer and connected to a ground potential, a second region of a second conductivity type formed in the semiconductor layer, an insulating film formed on the semiconductor layer and covering the first region and the second region, an internal circuit, a signal terminal that drives the internal circuit or is driven by the internal circuit, a first wiring that connects the internal circuit and the signal terminal, a resistive element formed on the insulating film and interposed in the middle of the first wiring, the resistive element including a first resistor facing the second region across the insulating film, and a second wiring connected to the first wiring on a side closer to the signal terminal than the resistive element and connecting the first wiring and the second region.

[0009] According to this configuration, the first wiring is electrically branched on the side closer to the signal terminal than the resistor element, and is connected to the second region via the second wiring. This makes it possible to reduce the potential difference between the first resistor and the second region, which face each other across the insulating film, when a voltage is applied to the signal terminal. In other words, although some error due to voltage drops caused by the wiring resistance of the first wiring and the second wiring, etc. is expected, the potentials of the first resistor and the second region can be made almost the same.

[0010] Conversely, if the first resistor faces the first region (ground potential), the potential difference between the first resistor and the first region becomes the voltage value of the first resistor relative to the ground potential. Therefore, when a relatively high voltage is applied to the signal terminal, the voltage applied to the insulating film between the first resistor and the first region becomes large, increasing the possibility of the insulating film breaking down.

[0011] On the other hand, if the first resistor faces the second region (terminal potential or a potential substantially the same as the terminal potential), the voltage applied to the insulating film can be made smaller than in the case where the first resistor faces the first region (ground potential). As a result, the possibility of dielectric breakdown of the insulating film can be reduced, and the reliability of the semiconductor device can be improved.

[0012] In the semiconductor device according to the embodiment of the present disclosure, the first resistor may include a plurality of first resistors connected in series or in parallel to each other.

[0013] According to this configuration, the voltage applied to the entire first resistors can be distributed to each of the first resistors, so that the amount of heat generated in each of the first resistors can be reduced, thereby suppressing the temperature rise from the first resistors and improving the reliability of the semiconductor device.

[0014] In a semiconductor device according to one embodiment of the present disclosure, the resistive element may include a second resistor formed closer to the internal circuit than the multiple first resistors and facing the first region across the insulating film.

[0015] According to this configuration, the potential of the end of the multiple first resistors on the internal circuit side is lower than the terminal potential due to the voltage drop caused by the multiple first resistors, and is closer to the ground potential. Here, a first potential difference between the potential of the second region (terminal potential or a potential substantially the same as the terminal potential) and the potential of the end of the first resistor on the internal circuit side is compared with a second potential difference between the potential of the end and the potential of the first region (ground potential). In this case, if the second potential difference is smaller than the first potential difference (second potential difference<first potential difference), the second resistor is provided at a position facing the first region, thereby making it possible to further reduce the possibility of dielectric breakdown of the insulating film on the downstream side (internal circuit side) of the resistive element.

[0016] The semiconductor device according to the embodiment of the present disclosure may further include a ground terminal that provides the ground potential, and a ground wiring that is connected to the ground terminal.

[0017] In a semiconductor device according to one embodiment of the present disclosure, the signal terminal may include a first pad formed on a surface of the semiconductor device, and the ground terminal may include a second pad formed on the surface of the semiconductor device.

[0018] The semiconductor device according to the embodiment of the present disclosure may further include a protection element connected between the first wiring and the ground wiring.

[0019] In a semiconductor device according to one embodiment of the present disclosure, the protection element may include a first protection element connected to the first wiring on a side closer to the signal terminal than a connection portion between the first wiring and the second wiring.

[0020] In the semiconductor device according to the embodiment of the present disclosure, the protection element may include a second protection element connected to the first wiring and closer to the internal circuit than the resistance element.

[0021] In the semiconductor device according to the embodiment of the present disclosure, the resistive element may include a polysilicon resistor.

[0022] In the semiconductor device according to the embodiment of the present disclosure, the insulating film may include an oxide film.

[0023] In the semiconductor device according to the embodiment of the present disclosure, the second wiring may include a via that penetrates the insulating film in a thickness direction and is connected to the second region.

[0024] In a semiconductor device according to one embodiment of the present disclosure, the semiconductor layer may include a substrate of the first conductivity type and an epitaxial layer formed on the substrate, and the first region and the second region may be formed in the epitaxial layer. Detailed Description of the Embodiments of the Present Disclosure Next, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0025] FIG. 1 is a schematic plan view of a semiconductor device 1 according to an embodiment of the present disclosure.

[0026] The semiconductor device 1 includes, for example, a semiconductor chip having a quadrangular shape in a plan view. In this embodiment, the semiconductor device 1 is formed in a rectangular parallelepiped shape. The planar shape of the semiconductor device 1 may be a square shape as shown in FIG. 1, or a rectangular shape.

[0027] The semiconductor device 1 includes a substrate 2 that forms the outer shape of the semiconductor device 1, a plurality of circuits 3 to 6 formed on the substrate 2, and a plurality of pads 7 electrically connected to the plurality of circuits 3 to 6. The outermost surface of the substrate 2 is covered with a surface protection film 8 made of, for example, silicon oxide (SiO2).

[0028] In this embodiment, the multiple circuits 3 to 6 include a first circuit 3, a second circuit 4, a third circuit 5, and a fourth circuit 6. The multiple circuits 3 to 6 may be any of known electronic circuits (digital circuits, analog circuits) such as a switching circuit, a rectifier circuit, a smoothing circuit, and a power supply circuit. The multiple circuits 3 to 6 may include elements formed using a semiconductor portion of the substrate 2, an insulating film formed on the substrate 2, and conductive members (e.g., electrodes, wiring, vias, etc.) formed on the substrate 2. Examples of such elements include active elements such as diodes and transistors, and passive elements such as capacitors, inductors, and resistors. In this embodiment, the first circuit 3 includes a resistive element 9 and an internal circuit 10.

[0029] Moreover, the multiple circuits 3 to 6 are disposed in the center of the substrate 2 in a plan view. The multiple circuits 3 to 6 may occupy the same space or different spaces on the substrate 2. The multiple circuits 3 to 6 may be circuits that are electrically connected to each other, or may be circuits that are electrically separated from each other.

[0030] The pads 7 are exposed from pad openings 11 formed in the surface protective film 8. For example, a plurality of wirings (not shown) may be formed on the substrate 2, and each portion of the wirings exposed from the pad openings 11 may be a pad 7. The pads 7 are formed on the periphery of the substrate 2 in a plan view. In this embodiment, the pads 7 are arranged along the end face of the substrate 2. More specifically, the pads 7 are arranged along each of the four end faces 2A, 2B, 2C, and 2D of the substrate 2, and the pads 7 are arranged in a rectangular ring shape as a whole. The circuits 3 to 6 are surrounded by the pads 7.

[0031] The multiple pads 7 may include a first pad 7A and a second pad 7B.

[0032] The first pad 7A may be, for example, an input terminal that supplies an input signal to the internal circuit 10. The first pad 7A may be, for example, electrically connected to the resistive element 9 of the first circuit 3 and the internal circuit 10 by a first wiring 12. In the first wiring 12, the resistive element 9 is provided on the upstream side (the side closer to the first pad 7A) and the internal circuit 10 is provided on the downstream side (the side farther from the first pad 7A).

[0033] The second pad 7B may be a ground terminal that provides a ground potential to the internal circuit 10. The second pad 7B may be electrically connected to the internal circuit 10 of the first circuit 3 by a ground wiring 13, for example.

[0034] In this embodiment, the first pad 7A is disposed closer to the resistive element 9 than the second pad 7B. For example, the distance from the periphery 14 of the occupied area (area surrounded by a dashed line in FIG. 1) of the first circuit 3 including the resistive element 9 to the first pad 7A may be shorter than the distance from the periphery 14 of the first circuit 3 to the second pad 7B. In other words, the first pad 7A is provided in a region sandwiched between the periphery 14 of the first circuit 3 and the end faces 2A to 2D of the substrate 2 (the end face 2A in this embodiment), while the second pad 7B is provided in a region not sandwiched between the periphery 14 of the first circuit 3 and the end faces 2A to 2D of the substrate 2 (the region sandwiched between the periphery 15 of the second circuit 4 and the end face 2B in this embodiment). As a result, the ground wiring 13 may be formed so as to cross the second circuit 4. Also, the ground wiring 13 may be formed so as to cover the second circuit 4.

[0035] FIG. 2 is a diagram showing an example of a circuit diagram of the first circuit 3 in FIG.

[0036] 2, the first circuit 3 is, for example, a switching circuit that performs inverter control, and has an internal circuit 10. The internal circuit 10 may be, for example, a Complementary Metal Oxide Semiconductor Field Effect Transistor (CMOSFET) that utilizes a p-channel MOSFET 16 and an n-channel MOSFET 17 in a complementary manner.

[0037] The drain sides of the p-channel MOSFET 16 and the n-channel MOSFET 17 are connected to an output terminal 18, which is connected to a load 19. The source side of the p-channel MOSFET 16 is connected to a Vdd (power supply voltage) terminal 20. The gates of the p-channel MOSFET 16 and the n-channel MOSFET 17 are connected to a common gate terminal 21 (input terminal). The source side of the n-channel MOSFET 17 is connected to a ground terminal 22, which is connected to the ground wiring 13.

[0038] The first wiring 12 connects the first pad 7A and the internal circuit 10. More specifically, the first wiring 12 is connected to a gate terminal 21 of the internal circuit 10. A control input signal that determines whether the gate output of the internal circuit 10 is enabled or disabled is supplied from the first pad 7A.

[0039] The first circuit 3 may further include a protection element 23 connected between the first wiring 12 and the ground wiring 13. The protection element 23 may be called, for example, an ESD (Electro-Static Discharge) protection element that protects the internal circuit 10 from a surge voltage such as static electricity entering from an external terminal such as the first pad 7A. The protection element 23 may have, for example, a plurality of terminals, one of which is connected to the first wiring 12 and the other of which is connected to the ground wiring 13.

[0040] The protection element 23 may include a protection transistor 24 as an example of a first protection element of the present disclosure, and a protection diode 25 as an example of a second protection element of the present disclosure.

[0041] In this embodiment, the protection transistor 24 is formed of a p-channel MOSFET. A source terminal 26 of the protection transistor 24 is connected to the first wiring 12, and a drain terminal 27 is connected to the ground wiring 13.

[0042] In this embodiment, the protection diode 25 is formed of a constant voltage diode. A cathode terminal 28 of the protection diode 25 is connected to the first wiring 12, and an anode terminal 29 is connected to the ground wiring 13.

[0043] The protection element 23 is not limited to the protection transistor 24 and the protection diode 25 shown in Fig. 2, and any known protection element can be used. The number of protection elements 23 does not need to be two as shown in Fig. 2, and may be one, or three or more. In Fig. 2, the protection transistor 24 is provided upstream of the current (closer to the pad 7 (external terminal)) than the protection diode 25, so the protection transistor 24 may be called a primary protection element (Primary Clamp), and the protection diode 25 may be called a secondary protection element (Secondary Clamp).

[0044] The resistive element 9 is interposed in the middle of the first wiring 12. In this embodiment, the resistive element 9 is provided between a connection portion 30 (first connection portion) between the protection transistor 24 and the first wiring 12, and a connection portion 31 (second connection portion) between the protection diode 25 and the first wiring 12. That is, the resistive element 9 is provided downstream of the protection transistor 24 (the side closer to the internal circuit 10). Also, the resistive element 9 is provided upstream of the protection diode 25 (the side farther from the internal circuit 10). In this embodiment, the resistive element 9 is provided downstream of the protection transistor 24 and upstream of the protection diode 25.

[0045] In this embodiment, the resistive element 9 includes a first resistor 32 and a second resistor 33 in this order from the upstream side to the downstream side (from the external terminal to the internal circuit 10).

[0046] Fig. 3 is a schematic plan view of resistance element 9 in Fig. 2. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. Fig. 5 is a cross-sectional view taken along line VV in Fig. 3. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 3. Figs. 7A to 7C are diagrams for explaining variations in the planar shape of each resistance element 9.

[0047] Next, a specific configuration of the resistance element 9 in FIG. 2 will be mainly described.

[0048] As described above, the semiconductor device 1 includes the substrate 2, and further includes a field insulating film 34, a resistive element 9, an interlayer insulating film 35, a first wiring 12, and a via 36 as an example of a second wiring of the present disclosure.

[0049] The substrate 2 includes a base substrate 37 and an epitaxial layer 38 formed on the base substrate 37 .

[0050] Base substrate 37 has a front surface 39 and a back surface 40. Front surface 39 is the surface in contact with epitaxial layer 38. Back surface 40 is entirely exposed to the outside of semiconductor device 1.

[0051] In this embodiment, the base substrate 37 is formed of a silicon (Si) substrate, but may be a substrate formed of other materials (for example, silicon carbide (SiC) or the like). In this embodiment, the base substrate 37 is a p-type. The base substrate 37 has a thickness of, for example, 1×10 14 cm -3 ~5×10 18 cm -3 The thickness of base substrate 37 before grinding is, for example, 500 μm to 800 μm.

[0052] The epitaxial layer 38 is in contact with the base substrate 37 and is laminated on the base substrate 37. The epitaxial layer 38 has a front surface 41 and a back surface 42. The front surface 41 is a surface on which various functional elements of the semiconductor device 1 are formed, and may be referred to as, for example, an element main surface. The back surface 42 is a surface in contact with the front surface 39 of the base substrate 37.

[0053] In this embodiment, the epitaxial layer 38 is formed of the same material (silicon (Si)) as the base substrate 37. The epitaxial layer 38 has an opposite conductivity type to the base substrate 37, which is n-type in this embodiment. The epitaxial layer 38 has a thickness of, for example, 5×10 14 cm -3 ~1×10 17 cm -3The epitaxial layer 38 has an impurity concentration of, for example, 3 μm to 20 μm.

[0054] A p-type element isolation well 43 as an example of the first region of the present disclosure is formed in the epitaxial layer 38. The p-type element isolation well 43 is formed so as to reach the base substrate 37 from the surface 41 of the epitaxial layer 38. As shown in FIGS. 4 to 6, the bottom of the p-type element isolation well 43 may coincide with the depth position of the boundary between the base substrate 37 and the epitaxial layer 38, or may be located midway in the thickness direction of the base substrate 37. In other words, the depth of the p-type element isolation well 43 may be greater than the thickness of the epitaxial layer 38.

[0055] The portion of epitaxial layer 38 surrounded by p-type element isolation well 43 is n-type region 44, which is an example of the second region of the present disclosure. N-type region 44 is defined on its side by p-type element isolation well 43, and its bottom by p-type base substrate 37.

[0056] Although not shown, other regions of the first circuit 3 may also have n-type regions similar to the n-type region 44 surrounded by the p-type element isolation well 43. The p-channel MOSFET 16 of the internal circuit 10 (CMOSFET) may be formed in the n-type region, and the n-channel MOSFET 17 may be formed in the p-type element isolation well 43 in the vicinity of the p-channel MOSFET 16. Also, in each of the regions of the second to fourth circuits 4 to 6, one or more n-type regions surrounded by the p-type element isolation well 43 may be formed, and functional elements constituting an LSI, such as diodes and transistors, may be formed in the regions.

[0057] In the n-type region 44, an n-type buried region 45 is formed at the boundary between the base substrate 37 and the epitaxial layer 38. The n-type buried region 45 is formed across the boundary between the base substrate 37 and the epitaxial layer 38. The n-type buried region 45 is formed away from the boundary between the p-type element isolation well 43 and the n-type region 44 inward in a direction along the surface 41 of the epitaxial layer 38. The n-type buried region 45 may have an n-type impurity concentration that exceeds the impurity concentration of the epitaxial layer 38. For example, the impurity concentration of the n-type buried region 45 may be 1×10 16 cm -3 ~1×10 20 cm -3 may be also possible.

[0058] The field insulating film 34 is formed on a surface 41 of the epitaxial layer 38. The field insulating film 34 covers the p-type element isolation well 43 and the n-type region 44. The field insulating film 34 has a first opening 46 that exposes a part of the p-type element isolation well 43 and a second opening 47 that exposes a part of the n-type region 44. The second opening 47 is formed, for example, in a ring shape when viewed from above.

[0059] In this embodiment, the field insulating film 34 is made of silicon oxide (SiO2), more specifically, a LOCOS (LOCal Oxidation of Silicon) oxide film, but may be made of other insulating materials (e.g., silicon nitride (SiN) etc.). The field insulating film 34 may be made of a multi-layer structure of a plurality of materials, for example, silicon oxide and silicon nitride.

[0060] Furthermore, when field insulating film 34 is formed of a LOCOS oxide film, the thickness may be gradually reduced at the periphery of each of first opening 46 and second opening 47. The portions where the thickness of field insulating film 34 changes in this manner may be referred to as, for example, first bird's beak portion 48 surrounding first opening 46 and second bird's beak portion 49 surrounding second opening 47. Surface 41 (first surface 50) of the portion of epitaxial layer 38 surrounded by first bird's beak portion 48 and surface 41 (second surface 51) of the portion of epitaxial layer 38 surrounded by second bird's beak portion 49 are located higher than surface 41 in other regions of epitaxial layer 38.

[0061] The p-type element isolation well 43 is + The contact portion 52 (first contact portion) is included. + The contact portion 52 is formed on the surface 41 of the epitaxial layer 38 and is exposed through the first opening 46. + The p-type contact portion 52 is formed from the first surface 50 of the epitaxial layer 38 to a position deeper than the bottom (surface 41) of the field insulating film 34. + The contact portion 52 is formed along (in contact with) the first bird's beak portion 48 of the field insulating film 34. + The mold contact portion 52 is formed, for example, in a cross-sectional view, into a generally bottle-like shape having a narrow upper portion and a bulging lower portion.

[0062] p + The p-type contact portion 52 may have a p-type impurity concentration that exceeds the impurity concentration of the p-type element isolation well 43. For example, + The impurity concentration of the contact portion 52 is 1×10 16 cm -3 ~1×10 20 cm -3 may be also possible.

[0063] The n-type region 44 is + The contact portion 53 (second contact portion) is included. +The n-type contact portion 53 is formed on the surface 41 of the epitaxial layer 38 and is exposed from the second opening 47. + As shown in FIG. 3, the contact portion 53 is formed in a ring shape in a plan view. + The contact portion 53 is formed inwardly away from the boundary between the p-type element isolation well 43 and the n-type region 44 .

[0064] n + The n-type contact portion 53 is formed from the second surface 51 of the epitaxial layer 38 to a position deeper than the bottom (surface 41) of the field insulating film 34. + The contact portion 53 is formed along (in contact with) the second bird's beak portion 49 of the field insulating film 34. + The mold contact portion 53 is formed, for example, in a cross-sectional view, in a generally bottle-like shape with a narrow upper portion and a bulging lower portion.

[0065] n + The n-type contact portion 53 may have an n-type impurity concentration that exceeds the impurity concentration of the n-type region 44. For example, + The impurity concentration of the contact portion 53 is 1×10 16 cm -3 ~1×10 20 cm -3 may be also possible.

[0066] The resistive element 9 is formed on the field insulating film 34. In this embodiment, the resistive element 9 is formed of a polysilicon resistor, and specifically, may be a polysilicon resistor doped with a p-type impurity. The resistive element 9 may be formed of a material other than polysilicon as long as the material satisfies the function of a resistor.

[0067] The resistive element 9 includes the first resistor 32 and the second resistor 33 as described above.

[0068] The first resistor 32 is formed closer to the first pad 7A than the second resistor 33, and faces the n-type region 44 with the field insulating film 34 in between. A plurality of first resistors 32 are formed. More specifically, as shown in FIG. 3, a plurality of first resistors 32 are arranged in a stripe pattern on the field insulating film 34. At both ends of each of the first resistors 32, a first contact portion 54 doped with a high concentration of p-type impurities is formed, as shown in FIG. 5. The resistance values ​​of the plurality of first resistors 32 may be different from each other or may be the same.

[0069] The second resistor 33 is formed closer to the internal circuit 10 than the first resistor 32, and faces the p-type element isolation well 43 with the field insulating film 34 interposed therebetween. A plurality of second resistors 33 are formed. More specifically, as shown in FIG. 3, a plurality of second resistors 33 are arranged in a stripe pattern on the field insulating film 34. As shown in FIG. 6, a second contact portion 55 doped with a high concentration of p-type impurities is formed at both ends of each second resistor 33. The resistance values ​​of the plurality of second resistors 33 may be different from each other or may be the same. The total resistance value of the second resistor 33 may be higher or lower than the total resistance value of the first resistor 32, but it is preferable that the resistance values ​​of the first resistor 32 and the second resistor 33 are the same for the following reasons. For example, the element side wiring 60 is fixed to a potential close to the ground potential by the protection diode 25. Since the connection wiring 58 faces both the n-type region 44 close to the terminal potential and the p-type element isolation well 43 close to the ground potential across the field insulating film 34, it is preferable that the connection wiring 58 is at an intermediate potential between the terminal potential and the ground potential in order to equalize the voltages applied to the respective field insulating films 34. Therefore, it is preferable that the resistance values ​​of the first resistor 32 and the second resistor 33 are the same.

[0070] Each resistor element 9 may be formed in a straight line as shown in Figures 7A and 7B, or in a curved line as shown in Figure 7C. In the case of a relatively wide resistor element 9 as shown in Figure 7B, a plurality of vias 61 (described later) may be connected to each end of the resistor element 9.

[0071] The interlayer insulating film 35 is formed on the substrate 2 so as to cover the resistance element 9. In this embodiment, the interlayer insulating film 35 is made of silicon oxide (SiO2), but may be made of other insulating materials (for example, silicon nitride (SiN) or the like).

[0072] The first wiring 12 is formed on an interlayer insulating film 35. In this embodiment, the first wiring 12 is made of aluminum (Al). The first wiring 12 connects a plurality of first resistors 32 and a plurality of second resistors 33 in series.

[0073] The first wiring 12 can be distinguished according to the connection object. For example, the first wiring 12 may include, in order from the upstream side to the downstream side (from the first pad 7A to the internal circuit 10), a terminal side wiring 56, a first wiring 57, a connection wiring 58, a second wiring 59, and an element side wiring 60.

[0074] The terminal side wiring 56 may be a wiring extending from the resistive element 9 to the first pad 7A. The terminal side wiring 56 is connected to an end of the first resistor 32 that is closest to the first pad 7A, among the first resistors 32.

[0075] The first wiring 57 may be wiring that connects the multiple first resistors 32 in series or in parallel to each other. The first wiring 57 may be called a first series wiring when the multiple first resistors 32 are connected in series to each other, and may be called a first parallel wiring when the multiple first resistors 32 are connected in parallel to each other. The first wiring 57 alternately connects one end and the other end of the multiple stripe-shaped first resistors 32, so that the wiring path including the first wiring 57 and the first resistors 32 is formed in a zigzag shape in a plan view, as shown in FIG.

[0076] The connection wiring 58 may be a wiring that connects the first resistor 32 and the second resistor 33. The connection wiring 58 straddles between the n-type region 44 and the p-type element isolation well 43. In other words, the connection wiring 58 crosses the boundary between the n-type region 44 and the p-type element isolation well 43 above the substrate 2.

[0077] The second wiring 59 may be wiring that connects the multiple second resistors 33 in series or in parallel to each other. The second wiring 59 may be called second series wiring when the multiple second resistors 33 are connected in series to each other, and may be called second parallel wiring when the multiple second resistors 33 are connected in parallel to each other. The second wiring 59 alternately connects one end and the other end of the multiple stripe-shaped second resistors 33, so that the wiring path including the second wiring 59 and the second resistors 33 is formed in a zigzag shape in plan view, as shown in FIG.

[0078] The element side wiring 60 may be a wiring extending from the resistive element 9 to the internal circuit 10. The element side wiring 60 is connected to an end of the second resistor 33 that is closest to the internal circuit 10 among the second resistors 33.

[0079] The wirings 56-60 and the resistive element 9 (the first resistor 32 and the second resistor 33) are connected by vias 61. The vias 61 extend in the thickness direction of the interlayer insulating film 35, and connect the wirings 56-60 and the resistive element 9. In this embodiment, the vias 61 are made of tungsten (W), but may be made of other conductive materials (for example, aluminum (Al), copper (Cu), etc.). Furthermore, with respect to the resistive element 9, the vias 61 are connected to the first contact portion 54 of the first resistor 32 and the second contact portion 55 of the second resistor 33.

[0080] The via 36 connects the first wiring 12 and the n-type region 44. The via 36 is connected to the first wiring 12 on a side closer to the first pad 7A than the resistor element 9. More specifically, the via 36 extends from the terminal side wiring 56 through the interlayer insulating film 35 in the thickness direction, and + The via 36 is connected to the mold contact portion 53. In this embodiment, the via 36 is made of tungsten (W), but may be made of other conductive materials (for example, aluminum (Al), copper (Cu), etc.).

[0081] The semiconductor device 1 further includes a via 62 that connects the ground wiring 13 and the p-type element isolation well 43. More specifically, the via 62 extends from the ground wiring 13 through the interlayer insulating film 35 in the thickness direction and + The via 62 is connected to the p-type contact portion 52. As a result, the p-type element isolation well 43 and the base substrate 37 are connected to the ground potential. In this embodiment, the via 62 is made of tungsten (W), but may be made of other conductive materials (for example, aluminum (Al), copper (Cu), etc.).

[0082] The vias 36, 61, and 62 are called "vias" because they are members that penetrate the interlayer insulating film 35 in the thickness direction, but they may also be called "wiring" or "connecting members" because they connect different conductive members.

[0083] On the interlayer insulating film 35, a multilayer wiring structure including an interlayer insulating film and wiring may be further formed, or the surface protective film 8 may be directly formed.

[0084] As described above, according to the semiconductor device 1, the first wiring 12 electrically branches off on the side closer to the first pad 7A than the resistance element 9, and is connected to the n-type region 44 through the via 36 (second wiring). This makes it possible to reduce the potential difference between the first resistor 32 and the n-type region 44, which face each other across the field insulating film 34, when a voltage is applied to the first pad 7A. In other words, although some error due to voltage drops caused by the wiring resistance of the first wiring 12 and the via 36 and the like is expected, the potentials of the first resistor 32 and the n-type region 44 can be made substantially the same.

[0085] Conversely, if the entire resistance element 9 faces a region of ground potential such as the p-type element isolation well 43, the potential difference between the resistance element 9 and the p-type element isolation well 43 becomes the voltage value of the resistance element 9 with respect to the ground potential. Therefore, when a relatively high voltage (for example, a voltage exceeding 1000 V caused by static electricity or the like) is applied to the first pad 7A, the voltage applied to the field insulating film 34 between the resistance element 9 and the p-type element isolation well 43 becomes large, increasing the possibility that the field insulating film 34 will undergo dielectric breakdown.

[0086] In contrast, if the first resistor 32 faces the n-type region 44 (terminal potential or substantially the same potential as the terminal potential), the voltage applied to the field insulating film 34 can be made smaller than in a configuration in which the entire resistive element 9 faces the p-type element isolation well 43 (ground potential). As a result, the possibility of dielectric breakdown of the field insulating film 34 can be reduced, and the reliability of the semiconductor device 1 can be improved.

[0087] Moreover, a plurality of first resistors 32 are formed so as to be connected to each other in series or in parallel. Therefore, the voltage applied to the entire plurality of first resistors 32 can be distributed to each first resistor 32, so that the amount of heat generated in each first resistor 32 can be reduced. As a result, the temperature rise from the first resistor 32 can be suppressed, and the reliability of the semiconductor device 1 can be improved. This is effective because the first resistor 32 is covered with the interlayer insulating film 35, and heat is likely to be trapped between the field insulating film 34 and the interlayer insulating film 35.

[0088] In addition, in the semiconductor device 1, in addition to the first resistor 32, a second resistor 33 is provided. The potential of the end of the multiple first resistors 32 on the internal circuit 10 side is lower than the terminal potential due to the voltage drop caused by the multiple first resistors 32, and is closer to the ground potential. Here, a first potential difference between the potential of the n-type region 44 (terminal potential or a potential substantially the same as the terminal potential) and the potential of the end of the first resistor 32 on the internal circuit 10 side (the first resistor 32 at the top of the page in FIG. 3 ) is compared with a second potential difference between the potential of the end and the potential of the p-type element isolation well 43 (ground potential). In this case, if the second potential difference is smaller than the first potential difference (second potential difference<first potential difference), the second resistor 33 is provided at a position facing the p-type element isolation well 43, thereby making it possible to further reduce the possibility of dielectric breakdown of the field insulating film 34 on the downstream side (internal circuit 10 side) of the first resistor 32.

[0089] Although the embodiment of the present disclosure has been described above, the present disclosure can be embodied in other forms.

[0090] 8, the resistive element 9 may be only the first resistor 32. In other words, the entire resistive element 9 may face the n-type region 44 with the field insulating film 34 interposed therebetween.

[0091] In the above embodiment, the first wiring 12 is located on the interlayer insulating film 35 covering the resistance element 9, but this is not limiting. For example, when a multilayer wiring structure is further formed on the interlayer insulating film 35, the first wiring 12 may be formed on any of the interlayer insulating films of the multilayer wiring structure.

[0092] Furthermore, between the resistance element 9 and the substrate 2, only the field insulating film 34 may be interposed as described above, or in addition to the field insulating film 34, another insulating film may be interposed.

[0093] Furthermore, the internal circuit 10 may be, for example, an input circuit of a CMOS inverter as shown in FIG. 2, an output circuit of a CMOS inverter, or an input circuit of a differential amplifier using bipolar transistors.

[0094] In addition, various design modifications can be made within the scope of the claims.

[0095] This application corresponds to Patent Application No. 2020-069913 filed with the Japan Patent Office on April 8, 2020, the entire disclosure of which is incorporated herein by reference. [Explanation of symbols]

[0096] 1 Semiconductor device 2. Board 7 Pad 7A 1st Pad 7B 2nd Pad 9 Resistance elements 10 Internal circuit 12 1st wiring 13 Ground wiring 23 Protection elements 24 Protection transistor 25 Protection Diode 30 Connection 32 1st resistor 33 2nd resistor 34 Field insulating film 36 Via 37 Base Board 38 Epitaxial Layer 43 p-type isolation well 44 n-type region

Claims

1. A semiconductor layer; a first region of a first conductivity type formed in the semiconductor layer and connected to a ground potential; a second region of a second conductivity type formed in the semiconductor layer; an insulating film formed on the semiconductor layer and covering the first region and the second region; An internal circuit; a signal terminal for driving the internal circuit or being driven by the internal circuit; a first wiring that connects the internal circuit and the signal terminal; a resistor element formed on the insulating film and interposed in the middle of the first wiring, the resistor element including a first resistor facing the second region across the insulating film; a second wiring connected to the first wiring on a side closer to the signal terminal than the resistive element, the second wiring connecting the first wiring and the second region.

2. The semiconductor device according to claim 1 , wherein said first resistor includes a plurality of first resistors connected in series or in parallel with each other.

3. 3. The semiconductor device according to claim 2, wherein said resistive element includes a second resistor formed closer to said internal circuit than said plurality of first resistors and facing said first region with said insulating film interposed therebetween.

4. a ground terminal for providing the ground potential; 4. The semiconductor device according to claim 1, further comprising a ground wiring connected to said ground terminal.

5. the signal terminal includes a first pad formed on a surface of the semiconductor device; The semiconductor device according to claim 4 , wherein the ground terminal includes a second pad formed on a surface of the semiconductor device.

6. 6. The semiconductor device according to claim 4, further comprising a protection element connected between said first wiring and said ground wiring.

7. 7. The semiconductor device according to claim 6, wherein the protection element includes a first protection element connected to the first wiring on a side closer to the signal terminal than a connection portion between the first wiring and the second wiring.

8. 8. The semiconductor device according to claim 7, wherein said protection element includes a second protection element connected to said first wiring on a side closer to said internal circuit than said resistance element.

9. 9. The semiconductor device according to claim 1, wherein the resistive element includes a polysilicon resistor.

10. 10. The semiconductor device according to claim 1, wherein the insulating film includes an oxide film.

11. 11. The semiconductor device according to claim 1, wherein the second wiring includes a via that penetrates the insulating film in a thickness direction and is connected to the second region.

12. the semiconductor layer includes a substrate of the first conductivity type and an epitaxial layer formed on the substrate; 12. The semiconductor device according to claim 1, wherein the first region and the second region are formed in the epitaxial layer.

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