Temperature sensor assembly for vacuum device

JP7631374B2Active Publication Date: 2025-02-18EDWARDS VACUUM LLC
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Patent Information

Application Number
JP2022572695
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-05-26
Filing Date
2021-05-26
Publication Date
2025-02-18
Estimated Expiration
2041-05-26

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Abstract

A vacuum device temperature sensor assembly and method for measuring the temperature of a vacuum device is disclosed. The vacuum device temperature sensor assembly includes a sheet substrate configured to conform to the shape of the item, equipment, or device whose temperature is to be determined, and a temperature sensor thermally coupled to the sheet substrate, the sheet substrate configured to provide a thermal path from the device to the temperature sensor. In this manner, the substrate provides an area for coupling with the device that is larger than the area of ​​the temperature sensor, which can reliably and accurately convey the average temperature of the device to the temperature sensor and make the temperature measurement less dependent on the exact location of the temperature sensor relative to the device.
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Description

[Technical field]

[0001] The field of the invention relates to vacuum system temperature sensor assemblies and methods for measuring the temperature of a vacuum system. [Background technology]

[0002] Temperature sensor assemblies are known. Temperature sensors can be used to measure the temperature of a variety of different items, equipment, or devices.

[0003] Although such temperature sensors exist, their use can produce unexpected results, particularly where accurately measuring the temperature of an item, equipment, or device is important to provide accurate and reliable temperature control. Summary of the Invention [Problem to be solved by the invention]

[0004] It would therefore be desirable to provide an improved temperature sensor assembly. [Means for solving the problem]

[0005] According to a first aspect, there is provided a vacuum device temperature sensor assembly comprising a sheet substrate configured to conform to a shape of an article, equipment or device whose temperature is to be determined, and a temperature sensor thermally coupled to the sheet substrate, the sheet substrate configured to provide a thermal path from the vacuum device to the temperature sensor.

[0006] The first aspect recognizes that a problem with existing temperature sensor configurations is that the temperature measured by the temperature sensor can be highly dependent on its location, and therefore the temperature communicated by the configuration can be unreliable. Accordingly, a temperature sensor assembly is provided. The assembly can comprise a substrate. The substrate can be a sheet substrate. The substrate can be configured, arranged, or adapted to form, conform, or follow the shape of a device having a temperature to be determined. The device can be a vacuum device. The assembly can comprise a temperature sensor. The sensor can be thermally coupled to or attached to the substrate. The substrate can provide a thermal path from the device to the sensor. In this manner, the substrate provides an area larger than the area of ​​the temperature sensor for coupling with the device, which can reliably and accurately communicate the average temperature of the device to the temperature sensor and make the temperature measurement less dependent on the exact location of the temperature sensor relative to the device.

[0007] The sheet substrate can be configured to conform to an exterior surface of the vacuum apparatus, i.e., the sheet substrate can be wrapped around the outside of the apparatus to provide a thermal path between the sheet substrate and the vacuum apparatus.

[0008] The sheet substrate can be flexible to conform to the exterior surface of the vacuum apparatus, which not only provides intimate contact between the sheet substrate and the vacuum apparatus to facilitate heat transfer, but also helps hold the sheet substrate in place.

[0009] The sheet substrate may be a planar sheet.

[0010] The sheet substrate can have a length that is greater than its width.

[0011] The sheet substrate can have a width that is greater than the distance between the heater elements of the vacuum device. Having a width greater than this distance can ensure that the sheet substrate will always cover the heater elements.

[0012] The sheet substrate can have a length greater than the length of the exterior surface of the vacuum apparatus.

[0013] The sheet substrate can have a length that provides multiple wraps around the vacuum apparatus, which also helps improve retention of the sheet substrate on the vacuum apparatus.

[0014] The sheet substrate can be configured to provide greater thermal conductivity across its surface than between the turns, such that the primary heat transfer path is on the surface of the substrate rather than between the layers of the turns.

[0015] The sheet substrate can have a thermal conductivity that reduces the temperature variation across the surface of the sheet compared to the temperature variation across the surface of the vacuum apparatus, and thus can help average out temperature differences across different portions of the vacuum apparatus, providing more reliable temperature measurements.

[0016] The sheet substrate can have a thermal mass that is less than the thermal mass of the vacuum device, which allows the sheet substrate to heat or cool more quickly than the vacuum device and therefore respond to temperature changes at least as quickly as the vacuum device.

[0017] The sheet substrate can be positioned between the temperature sensor and the vacuum device.

[0018] The temperature sensor may cover the sheet substrate.

[0019] The sheet substrate can have a thermal conductivity greater than that of the vacuum device, such that the sheet substrate can heat or cool faster than the vacuum device and respond to temperature changes at least as quickly as the vacuum device.

[0020] The sheet substrate may have a thermal conductivity greater than 8 W·m-1·K-1.

[0021] The sheet substrate can be metal and / or carbon and / or graphene.

[0022] The sheet substrate may include a heat insulating layer, which can reduce the effect of external temperature changes on the temperature experienced by the temperature sensor.

[0023] The sheet insulation layer may be disposed on the sheet substrate, and thus may be formed as part of one layer of the sheet substrate.

[0024] The assembly may include an outer insulating layer covering the sheet substrate and the temperature sensor.

[0025] According to a second aspect, there is provided a method comprising conforming a sheet substrate to a shape of a vacuum device where a temperature is to be determined, and thermally coupling a temperature sensor to the sheet substrate to provide a thermal path from the vacuum device to the temperature sensor.

[0026] The method can include conforming the sheet substrate to an exterior surface of a vacuum apparatus.

[0027] The method can include configuring the sheet substrate to be flexible to conform to an exterior surface of a vacuum apparatus.

[0028] The method can include configuring the sheet substrate as a planar sheet.

[0029] The method can include configuring the sheet substrate to have a length that is greater than its width.

[0030] The method can include configuring the sheet substrate to have a width greater than the distance between heater elements of the vacuum device.

[0031] The method can include configuring the sheet substrate to have a length that is greater than a length of an exterior surface of the vacuum apparatus.

[0032] The method can include configuring the sheet substrate to have a length that provides multiple wraps around a vacuum device.

[0033] The method can include configuring the sheet substrate to provide greater thermal conductivity across its surface than between turns.

[0034] The method can include configuring the sheet substrate to have a thermal conductivity that reduces the temperature change across a surface of the sheet surface as compared to the temperature change across a surface of the vacuum device.

[0035] The method can include configuring the sheet substrate to have a thermal mass that is less than the thermal mass of the vacuum device.

[0036] The method can include placing the sheet substrate between a temperature sensor and a vacuum device.

[0037] The method may include covering the sheet substrate with a temperature sensor.

[0038] The method can include configuring the sheet substrate to have a thermal conductivity greater than the thermal conductivity of the vacuum device.

[0039] The method can include configuring the sheet substrate to have a thermal conductivity greater than 8 W·m−1·K−1.

[0040] The method may include configuring the sheet substrate to be at least one of metal and carbon, preferably graphene.

[0041] The method can include configuring a sheet substrate to include a thermal insulation layer.

[0042] The method can include disposing a sheet insulation layer on a sheet substrate.

[0043] The method may include covering the sheet substrate and the temperature sensor with an outer insulating layer.

[0044] Further particular and preferred aspects are set out in the accompanying independent and dependent claims. Features of the dependent claims may be combined with features of the independent claims as appropriate and in combinations other than those explicitly set out in the claims.

[0045] Where features of an apparatus are described as operable to provide a certain functionality, this should be understood to include features of the apparatus providing that functionality or adapted or configured to provide that functionality.

[0046] Embodiments of the present invention are described in detail below with reference to the accompanying drawings. [Brief description of the drawings]

[0047] [Figure 1A] 1 illustrates a temperature sensor assembly according to one embodiment. [Figure 1B] 1 illustrates a temperature sensor assembly according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] Before describing the embodiments in more detail, an overview will first be provided. The embodiments provide a temperature sensor suitable for providing reliable, accurate and consistent temperature measurements of an apparatus such as an abatement apparatus or a conduit coupled to a vacuum pump. The sensor has a substrate that can be reshaped to closely fit the shape of the vacuum apparatus and provides a thermal path to the temperature sensor that measures the temperature of the vacuum apparatus or a portion thereof. The substrate is typically formed of a sheet that can be wrapped or conformed to the vacuum apparatus or a portion thereof and is typically sized to wrap around the vacuum apparatus or a portion thereof only multiple times. The sheet is also sized to be wide enough to ensure contact with localized heating or cooling devices on the vacuum apparatus, reducing temperature variations that may result from placing the temperature sensor at different positions relative to the localized heating or cooling devices.

[0049] Temperature Sensor Assembly 1A and 1B show a temperature sensor assembly 10 according to one embodiment. Fig. 1A is a plan view and Fig. 1B is a side view. The temperature sensor assembly 10 includes a conductive sheet 20 and a temperature sensor 30 such as a thermistor or a thermocouple.

[0050] The temperature sensor 30 is connected by one or more wires 40 to a device (not shown) that receives a signal indicative of the temperature measured by the temperature sensor 30. The temperature sensor 30 is typically attached to a first surface 50 of the conductive sheet 20 using a thermal bond to enhance the thermal bond between the conductive sheet 20 and the temperature sensor 30. However, the temperature sensor 30 could simply be placed on the conductive sheet 20 and held in place by wrapping the conductive sheet 20 or by an insulating layer 70.

[0051] The conductive sheet 20 has an overall length L and an overall width W, and generally the length L is greater than the width W. In this example, the temperature sensor 30 is located midway along the width W, but towards one end of the length L of the conductive sheet 20. The conductive sheet 20 is made of a material that is flexible, usable or compatible with the outer surface of the vacuum device 80 to which it is applied. The conductive sheet 20 is also made of a material with a greater thermal conductivity and / or less thermal mass than the vacuum device 80 to which it is applied. This helps ensure that the temperature of the conductive sheet 20 changes faster than the temperature of the vacuum device 80 to which it is applied. Typically, the conductive sheet 20 is made of a metal (such as aluminum or copper) or a carbon material (such as graphene). While in this example the conductive sheet 20 is rectangular, it is understood that this need not be the case and any suitable shape that fits the applied vacuum device can be provided, such as a circular, elliptical, irregular shape, or a shape with voids or openings to allow protrusions from the applied vacuum device to pass through.

[0052] In this example, the temperature sensor assembly 10 is configured to be applied to a vacuum device 80 (a pipe in this example) that is heated by a heater coil 90 that forms a helix along the cylindrical surface of the vacuum device 80. However, it should be understood that the temperature sensor assembly 10 can be configured to be applied to other devices whose temperature is to be measured. The length L is configured to be longer than the circumference of the vacuum device 80. Typically, the length L is set to some number of times the circumference to provide multiple turns of the conductive sheet 20 around the vacuum device 80. Even if the multiple turns are in contact, the primary thermal path is along the conductive sheet 20, not between adjacent turns of the conductive sheet 20. The width W is selected to be greater than the distance D between each turn of the heater 90. This helps to ensure that the conductive sheet 20 can always overlap at least one of the turns of the heater 90, regardless of where the conductive sheet 20 is positioned along the axial length of the vacuum device 80. This configuration helps to provide an accurate average temperature measurement that is less sensitive to local temperature variations experienced by the vacuum device 80. An insulating layer 70 (such as a polymer) is optionally provided, which may be applied after the conductive sheet 20 is applied to the vacuum apparatus 80 or which may be pre-adhered to the conductive sheet 20 before it is applied to the vacuum apparatus 80.

[0053] In operation, a conductive sheet 20 is provided with a shape and dimensions suitable for application to a vacuum device 80, and a temperature sensor 30 is thermally coupled to the conductive sheet 20, with wiring 40 attached to the temperature sensor 30. The conductive sheet 20 is wrapped around the vacuum device 80 with the second surface 60 in contact with the vacuum device 80, in this example, multiple turns. The width W of the conductive sheet 20 is greater than the distance D between each turn of the heater 90, such that the conductive sheet 20 covers at least one turn of the heater 90. An insulating layer 70 is then wrapped around the exposed first surface 50 of the conductive sheet 20.

[0054] As the temperature of the heater 90 changes, the large thermal conductivity and small thermal mass of the conductive sheet 20, together with the insulating effect of the insulating layer 70, enable the change in temperature to be rapidly transmitted by the conductive sheet 20 to the temperature sensor 30, so that the temperature is indicated by a signal passing through the wiring 40.

[0055] Although exemplary embodiments of the present invention are disclosed in detail herein with reference to the accompanying drawings, it should be understood that the present invention is not limited to the precise embodiments, and various changes and modifications can be made thereto by those skilled in the art without departing from the scope of the present invention as defined by the appended claims and their equivalents. [Explanation of symbols]

[0056] 10 Temperature sensor assembly 20 Conductive sheet 30 Temperature Sensor 40 Wiring 50 First Surface 60 Second Surface 70 Insulation Layer 80 Vacuum equipment 90 Heater

Claims

1. conforming a planar, flexible sheet substrate to an exterior surface of a vacuum device whose temperature is to be determined, the vacuum device having a plurality of heater elements, the sheet substrate having a width greater than the distance between the heater elements and a length providing multiple wraps around the vacuum device; thermally coupling the temperature sensor to the sheet substrate by disposing the sheet substrate between the temperature sensor and the vacuum device to provide a thermal path from the vacuum device to the temperature sensor; The method includes:

2. 1. A vacuum system temperature sensor assembly comprising: a vacuum apparatus in which a temperature is determined, the vacuum apparatus having a plurality of heater elements; a sheet substrate that is a planar sheet and flexible to conform to an exterior surface of the vacuum apparatus, the sheet substrate having a width greater than the distance between the heater elements and a length that provides multiple wraps around the vacuum apparatus; a temperature sensor thermally coupled to the sheet substrate; Equipped with the sheet substrate is configured to provide a thermal path from the vacuum device to the temperature sensor; The sheet substrate is disposed between the temperature sensor and the vacuum device, forming a vacuum device temperature sensor assembly.

3. 3. The vacuum system temperature sensor assembly of claim 2, further comprising an outer insulating layer covering said sheet substrate and said temperature sensor, providing a greater thermal conductivity across said sheet substrate than between said multiple turns.

4. 4. A vacuum system temperature sensor assembly as described in claim 2 or 3, wherein the sheet substrate has a thermal conductivity selected to reduce temperature variation across a surface of the sheet substrate compared to temperature variation across a surface of the vacuum system.

5. 5. A vacuum system temperature sensor assembly as claimed in any one of claims 2 to 4, wherein the sheet substrate has a thermal mass selected to be less than a thermal mass of the vacuum system.

6. The vacuum system temperature sensor assembly of claim 2 , wherein the temperature sensor covers the sheet substrate.

7. 7. A vacuum system temperature sensor assembly as claimed in any one of claims 2 to 6, wherein the sheet substrate has a thermal conductivity selected to be greater than a thermal conductivity of the vacuum system.

Citation Information

Patent Citations

  • JP1979138686U

  • Heat sensor

    JP1990171625A

  • Baking method for vacuum device

    JP1993228354A

  • Cable core temperature measuring method for pipe type cable

    JP1994221928A

  • Means and method for mounting temperature sensors

    US4346864A