High frequency module and method for manufacturing the same

Abstract

In the present invention, a first component, a second component, and a pedestal are covered and supported by a support member. Assuming that a direction perpendicular to a first surface of the support member is a height direction, a plurality of first external terminals and a plurality of second external terminals are arranged at the same position as that of the first surface in the height direction. The pedestal has a top surface oriented toward a direction opposite to the direction which the first surface faces, a plurality of top-surface-side internal terminals arranged on the top surface, and wires that connect the top-surface-side internal terminals to the second external terminals, respectively. The first component is connected to the first external terminals. The second component has a plurality of second internal terminals and is disposed so as to be stacked on the pedestal in the height direction by connecting the second internal terminals to the top-surface-side internal terminals. The dimension of the second component in the height direction is smaller than the dimension of the first component in the height direction. In a plan view of the first surface, the maximum value of the minimum dimensions each of which is of each first external terminal is larger than the maximum value of the minimum dimensions each of which is of each second internal terminal and the maximum value of the minimum dimensions each of which is of each second external terminal is larger than the maximum value of the minimum dimensions each of which is of each second internal terminal.

Description

[Technical field]

[0001] The present invention relates to a high-frequency module and a method for manufacturing the high-frequency module. [Background technology]

[0002] As mobile terminals and the like become thinner, there is a demand for further miniaturization and lower height of the high frequency modules mounted on the mobile terminals. Conventional high frequency modules are composed of an interposer substrate, a plurality of electronic circuit components mounted on the interposer substrate, and a resin member that seals these electronic circuit components. The following Patent Document 1 discloses a high frequency module that does not include an interposer. As it does not include an interposer, it is possible to achieve a lower height. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 139072 Summary of the Invention [Problem to be solved by the invention]

[0004] The external terminals of the multiple electronic circuit components that make up the high-frequency module are not the same in size. For example, the sizes of the external terminals differ among radio frequency integrated circuits (RFICs), duplexers, filters, capacitors, inductors, etc. In the high-frequency module disclosed in Patent Document 1, multiple components are supported by a support member, and the external terminals of the multiple components are exposed on one surface of the support member. In other words, multiple external terminals of different sizes are exposed on one surface.

[0005] When solder is placed on external terminals of different sizes and a reflow process is performed, the height of the solder bumps varies for each external terminal. Therefore, when this high-frequency module is mounted on another board, connection failure and an unstable mounting state are likely to occur. The object of the present invention is to provide a high-frequency module that is suitable for low height and can be stably mounted on a board. [Means for solving the problem]

[0006] According to one aspect of the present invention, A support member having a first surface; a first component, a second component, and a base that are covered and supported by the support member; a plurality of first external terminals and a plurality of second external terminals arranged at the same height as the first surface, when a direction perpendicular to the first surface is defined as a height direction; Equipped with the base has a top surface facing a direction opposite to a direction in which the first surface faces, a plurality of top surface side internal terminals arranged on the top surface, and wiring that connects the top surface side internal terminals to the second external terminals, the first component is connected to the first external terminal; the second component has a plurality of second internal terminals, and is disposed on the base in a stacked manner in a height direction by connecting the second internal terminals to the top surface side internal terminals; The second component has a smaller height dimension than the first component, A high-frequency module is provided in which, when the first surface is viewed in a plan view, the maximum value of the minimum dimension of each of the first external terminals is greater than the maximum value of the minimum dimension of each of the second internal terminals, and the maximum value of the minimum dimension of each of the second external terminals is greater than the maximum value of the minimum dimension of each of the second internal terminals.

[0007] According to another aspect of the invention, preparing an intermediate product including a temporary substrate having a first mounting surface, a base provided on the temporary substrate and having a top surface located higher than the first mounting surface when a direction perpendicular to the first mounting surface is taken as a height direction, a plurality of first external terminals arranged on the first mounting surface, a plurality of top surface side internal terminals arranged on the top surface, a plurality of second external terminals arranged at the same height direction as the first external terminals, wiring connecting the top surface side internal terminals and the second external terminals, a first component connected to the first external terminals and fixed to the temporary substrate, and a second component connected to the top surface side internal terminals and fixed to the base; covering the first mounting surface, the top surface, the first component, and the second component with a support member to support the first component, the second component, and the base; The temporary substrate is polished or ground from a surface opposite to the first mounting surface to expose the first external terminal and the second external terminal. Effect of the Invention

[0008] The first external terminal and the second external terminal can be used as external terminals for mounting on another substrate or the like. The degree of variation in the size of the terminals can be reduced compared to when the first external terminal and the second internal terminal are used as terminals for external connection. This allows the high-frequency module to be stably mounted on the substrate. In addition, by configuring the temporary substrate to be polished or ground, the high-frequency module 100 can be made low-profile. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view of a high-frequency module according to a first preferred embodiment. [Diagram 2] FIG. 2 is a bottom view of the high-frequency module according to the first preferred embodiment. [Diagram 3] FIG. 3 is a plan view showing an example of the positional relationship and shape of the first component and the first external terminal. [Figure 4] FIG. 4 is a cross-sectional view of an antenna module equipped with a high-frequency module according to the first embodiment. [Diagram 5] FIG. 5 is an equivalent circuit diagram of a portion of the antenna module equipped with the high-frequency module according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view of the high-frequency module according to the first preferred embodiment during its manufacture. [Figure 7] FIG. 7 is a cross-sectional view of the high-frequency module according to the first preferred embodiment during its manufacture. [Figure 8] FIG. 8 is a cross-sectional view of the high-frequency module according to the first preferred embodiment during its manufacture. [Figure 9] FIG. 9 is a cross-sectional view of the high-frequency module according to the first preferred embodiment during its manufacture. [Figure 10] 10A and 10B are schematic cross-sectional views showing a procedure for applying solder to lands arranged on the mounting surface of a mounting board. [Figure 11] FIG. 11 is a schematic cross-sectional view of the high-frequency module according to the first embodiment at an intermediate stage in another manufacturing method. [Figure 12] 12A to 12C are schematic cross-sectional views of the high-frequency module according to the first embodiment at intermediate stages in another manufacturing method. [Figure 13] FIG. 13 is a schematic cross-sectional view of the high-frequency module according to the first embodiment at an intermediate stage in another manufacturing method. [Figure 14] FIG. 14 is a schematic cross-sectional view of the high-frequency module according to the first embodiment at an intermediate stage in another manufacturing method. [Figure 15] FIG. 15 is a schematic cross-sectional view of the high-frequency module according to the first embodiment at an intermediate stage in another manufacturing method. [Figure 16] FIG. 16 is a cross-sectional view of a high-frequency module according to a modified example of the first preferred embodiment. [Figure 17] FIG. 17 is a cross-sectional view of a high-frequency module according to another modified example of the first preferred embodiment. [Figure 18] FIG. 18 is a cross-sectional view of a high-frequency module according to still another modified example of the first preferred embodiment. [Figure 19]FIG. 19 is a cross-sectional view of a high-frequency module according to still another modified example of the first preferred embodiment. [Figure 20] FIG. 20 is a cross-sectional view of the high-frequency module according to the second preferred embodiment. [Figure 21] FIG. 21 is a cross-sectional view of a high-frequency module according to the third preferred embodiment. [Figure 22] FIG. 22 is a diagram showing the positional relationship in a plan view of a plurality of components included in the high-frequency module according to the third preferred embodiment. [Figure 23] FIG. 23 is a cross-sectional view of the high-frequency module according to the fourth preferred embodiment. [Figure 24] FIG. 24 is a diagram showing the positional relationship in a plan view of a plurality of components included in the high-frequency module according to the fourth preferred embodiment. [Diagram 25] FIG. 25 is a cross-sectional view of a shielding function component included in the high-frequency module according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [First Example] A high-frequency module and a manufacturing method thereof according to a first preferred embodiment will be described with reference to FIGS. 1 to 10B.

[0011] 1 is a schematic cross-sectional view of a high-frequency module 100 according to a first embodiment. In this specification, a "schematic cross-sectional view" does not represent a cross section of the high-frequency module 100 cut along a specific plane, but represents a single diagram by connecting cross sections at the respective positions of multiple components included in the high-frequency module 100.

[0012] A plurality of first components 30, second components 40, and bases 50 are covered and supported by a support member 70 made of resin. For example, the support member 70 contacts the surfaces of the first components 30, second components 40, and bases 50 to support these components. The support member 70 has a first surface 70A and a second surface 70B that face in opposite directions and are arranged substantially parallel to each other. The direction in which the first surface 70A and the second surface 70B are separated is defined as the height direction. Note that the direction perpendicular to the first surface 70A can also be referred to as the height direction. Here, the "perpendicular direction" does not mean a vertical direction in the strict geometric sense, but includes a substantially vertical direction.

[0013] The first external terminals 61, the second external terminals 62, and the long terminals 68 are exposed on the first surface 70A. The long terminals 68 are not essential, and may not be provided. The exposed surfaces of the first external terminals 61, the second external terminals 62, and the long terminals 68 are substantially flush with the first surface 70A. In other words, the first external terminals 61, the second external terminals 62, and the long terminals 68 are disposed at the same height as the first surface 70A. Due to variations in the manufacturing process, a minute step may occur at the boundary between the exposed surfaces of the first external terminals 61, the second external terminals 62, and the long terminals 68 and the first surface 70A.

[0014] Here, the first external terminal 61 being disposed at the same height position as the first surface 70A means that the height position of one of the two surfaces of the first external terminal 61 that intersect with the height direction is the same as the height position of the first surface 70A. The same applies to the height positional relationship between the second external terminal 62 and the long terminal 68 and the first surface 70A. Note that a configuration in which the height positions are "same" includes a case in which there is a deviation in the height positions due to variations within an allowable range in the manufacturing process.

[0015] The first component 30 has a plurality of first internal terminals 31 arranged on a surface (hereinafter, sometimes referred to as bottom surface 30A) facing the same direction as the first surface 70A. The plurality of first internal terminals 31 are connected to the plurality of first external terminals 61 via solder members 81. A surface (hereinafter, sometimes referred to as top surface 30B) of the first component 30 facing in the opposite direction to the bottom surface 30A is covered with a support member 70.

[0016] The base 50 includes a bottom surface 50A facing the same direction as the first surface 70A, a top surface 50B facing the opposite direction to the bottom surface 50A, a plurality of bottom surface side internal terminals 51 arranged on the bottom surface 50A, a plurality of top surface side internal terminals 52 arranged on the top surface 50B, and a plurality of wirings 53 connecting the bottom surface side internal terminals 51 and the top surface side internal terminals 52. For example, a printed wiring board is used as the base 50. The plurality of bottom surface side internal terminals 51 are connected to the plurality of second external terminals 62 via solder members 82, respectively.

[0017] The second component 40 includes a plurality of second internal terminals 41 arranged on a surface (hereinafter, sometimes referred to as a bottom surface 40A) facing the same direction as the first surface 70A. The second internal terminals 41 are connected to a plurality of top surface side internal terminals 52 via solder members 85, respectively, so that the second component 40 is arranged stacked in the height direction on the base 50 and fixed to the base 50. The surface of the second component 40 facing the opposite direction to the bottom surface 40A (hereinafter, sometimes referred to as a top surface 40B) is covered with a support member 70.

[0018] The height dimension of the first part 30 is labeled as h1, the height dimension of the second part 40 is labeled as h2, and the height dimension of the base 50 is labeled as h3. The height dimension h2 of the second part 40 is smaller than the height dimension h1 of the first part 30 having the largest height dimension h1. In other words, among the first parts 30 other than the first part 30 having the largest height dimension h1, there may be some where the height dimension h1 is smaller than the height dimension h2 of the second part 40. The height dimension h3 of the base 50 is also smaller than the height dimension h1 of the first part 30 having the largest height dimension h1.

[0019] 2 is a bottom view of the high-frequency module 100 according to the first embodiment. A plurality of first components 30, second components 40, and a base 50 are supported on a support member 70. A plurality of first external terminals 61 connected to each of the first components 30 are exposed on the first surface 70A. A second external terminal 62 connected to the base 50 is exposed on the first surface 70A. Furthermore, a plurality of long terminals 68 are exposed on the first surface 70A.

[0020] When the first surface 70A is viewed from above (hereinafter sometimes simply referred to as "in a plan view"), the second component 40 is contained within the base 50. The second component 40 may be positioned such that at least a portion of the second component 40 overlaps with at least a portion of the base 50. The second component 40 has a plurality of second internal terminals 41. In a plan view, the plurality of second internal terminals 41 overlap with the plurality of second external terminals 62, respectively.

[0021] In plan view, the minimum dimension of each of the first external terminals 61 is marked as W1, the minimum dimension of each of the second external terminals 62 is marked as W2, the minimum dimension of the second internal terminal 41 is marked as W3, and the minimum dimension of the long terminal 68 is marked as W4. The "minimum dimension" is defined as the minimum distance between two parallel lines when the two parallel lines tangent to the plane figure from both sides are sandwiched in various directions. For example, if the plane figure is a square, the minimum dimension is equal to the length of one side, and if the plane figure is a rectangle, the minimum dimension is equal to the length of the short side. If the plane figure is a circle, the minimum dimension is equal to the length of the diameter, and if the plane figure is an ellipse, the minimum dimension is equal to the length of the short axis.

[0022] In plan view, the maximum value of the minimum dimension W1 of each of the first external terminals 61 is greater than the maximum value of the minimum dimension W3 of each of the second internal terminals 41. Furthermore, the maximum value of the minimum dimension W2 of each of the second external terminals 62 is greater than the maximum value of the minimum dimension W3 of each of the second internal terminals 41. The maximum value of the minimum dimension W2 of each of the second external terminals 62 is less than or equal to the maximum value of the minimum dimension W1 of each of the first external terminals 61. The maximum value of the minimum dimension W4 of the long terminal 68 is greater than or equal to the maximum value of the minimum dimension W2 of the second external terminal 62 and less than or equal to the maximum value of the minimum dimension W1 of the first external terminal 61. That is, the following formula is established. Here, max means the maximum value of the parameter in parentheses. max(W1)>max(W3) max(W2)>max(W3) max(W1) ≧ max(W2) max(W2)≦max(W4)≦max(W1)

[0023] Next, with reference to Fig. 3, a minimum dimension of the first external terminal 61 when the shape in plan view is a shape other than a square, a circle, or the like will be described. Fig. 3 is a plan view showing an example of the positional relationship and shape of the first component 30 and the first external terminal 61. The first component 30 has two first internal terminals 31. The two first internal terminals 31 are respectively connected to two first external terminals 61. The contour line of each of the two first external terminals 61 includes a straight portion and a substantially semicircular portion connecting both ends of the straight portion. The two first external terminals 61 are arranged with the straight portions facing each other.

[0024] An xy orthogonal coordinate system is defined in which the direction in which the two first external terminals 61 are separated is the x direction. The dimension of each of the first external terminals 61 in the x direction is marked as Lx, and the dimension in the y direction is marked as Ly. In the example shown in FIG. 3, the dimension Lx in the x direction is smaller than the dimension Ly in the y direction. Also, the dimension Lxy in the diagonal direction is larger than the dimension Lx in the x direction in all directions. In this case, the minimum dimension W1 of the first external terminal 61 is equal to the dimension Lx in the x direction.

[0025] Next, an antenna module equipped with the high frequency module according to the first embodiment will be described with reference to FIGS.

[0026] 4 is a cross-sectional view of an antenna module equipped with a high-frequency module 100 according to the first embodiment. The high-frequency module 100 is mounted on an antenna substrate 90. The antenna substrate 90 has a plurality of lands 94 arranged on a mounting surface 90A on which the high-frequency module 100 is mounted. The plurality of first external terminals 61, the plurality of second external terminals 62, and the plurality of elongated terminals 68 of the high-frequency module 100 are connected to the plurality of lands 94 via solder members 95, respectively.

[0027] A plurality of antenna elements 91 are arranged on an antenna surface 90B of the antenna substrate 90 opposite to the mounting surface 90A. For example, a patch antenna is used as the antenna element 91. In FIG. 4, the ground plane constituting the patch antenna is omitted. The antenna elements 91 may be arranged on an inner layer of the antenna substrate 90, or the antenna elements 91 arranged on the antenna surface 90B may be covered with a protective film made of a dielectric. The antenna arranged on the antenna substrate 90 may be an antenna other than a patch antenna.

[0028] The plurality of antenna elements 91 are connected to the plurality of lands 94 via wiring 92 in the antenna substrate 90. That is, the plurality of antenna elements 91 are connected to the second component 40.

[0029] A high-frequency connector 93 is mounted on a mounting surface 90A of the antenna substrate 90. The high-frequency connector 93 is connected to one of the first external terminals 61 via a wiring 92 inside the antenna substrate 90.

[0030] 5 is an equivalent circuit diagram of a portion of an antenna module equipped with the high-frequency module 100 according to the first embodiment. The second component 40 includes a plurality of power amplifiers 42, a plurality of low-noise amplifiers 43, a plurality of isolators 35, and a plurality of duplexers 36. The high-frequency signal amplified by the power amplifier 42 is supplied to the antenna element 91 through the isolator 35 and the duplexer 36. The high-frequency signal received by the antenna element 91 is input to the low-noise amplifier 43 through the duplexer 36.

[0031] Each of the power amplifier 42 and the low-noise amplifier 43 includes an active element. For example, the power amplifier 42 includes a transistor 42Q, and the low-noise amplifier 43 includes a transistor 43Q. When a high-frequency signal is transmitted, heat is generated mainly in the transistor 42Q of the power amplifier 42.

[0032] 5, each of the multiple antenna elements 91 is used as both a transmitting and a receiving antenna element, but the multiple antenna elements 91 may be divided into a transmitting antenna element and a receiving antenna element. In this case, the duplexer 36 is not required. That is, the second component 40 may include multiple transmitting systems and multiple receiving systems.

[0033] 5 shows an antenna module having both transmitting and receiving functions, an antenna module having either transmitting or receiving functions may be configured. When configuring an antenna module having transmitting functions, the second component 40 does not need a low-noise amplifier 43, and it is sufficient if the second component 40 includes a power amplifier 42. When configuring an antenna module having receiving functions, the second component 40 does not need a power amplifier 42, and it is sufficient if the second component 40 includes a low-noise amplifier 43.

[0034] Next, a method for manufacturing the high frequency module according to the first embodiment will be described with reference to Figures 6 to 9. Figures 6 to 9 are cross-sectional views of the high frequency module according to the first embodiment during the course of its manufacture.

[0035] 6, a plurality of first external terminals 61, a plurality of second external terminals 62, and a plurality of long terminals 68 are formed on a first mounting surface 160A, which is one surface of a temporary substrate 160. Furthermore, a plurality of first components 30, a base 50, and a second component 40 are prepared. Solder is applied to the first internal terminal 31 of the first component 30, the second internal terminal 41 of the second component 40, and the lower surface side internal terminal 51 of the base 50, and a reflow process is performed to form solder members 81, 82, and 85.

[0036] As shown in FIG. 7, the first component 30 is mounted on the temporary substrate 160 by connecting the first internal terminal 31 of the first component 30 to the first external terminal 61 via the solder member 81. The base 50 is mounted on the temporary substrate 160 by connecting the lower surface side internal terminal 51 of the base 50 to the second external terminal 62 via the solder member 82. The second component 40 is fixed to the base 50 by connecting the second internal terminal 41 of the second component 40 to the top surface side internal terminal 52 via the solder member 85. Either the procedure of mounting the base 50 on the temporary substrate 160 or the procedure of fixing the second component 40 to the base 50 may be performed first. Through the steps up to this point, an intermediate product 161 including the temporary substrate 160, the first component 30, the second component 40, and the base 50 is produced.

[0037] 8, a support member 70 made of resin is formed so as to cover the first mounting surface 160A of the temporary substrate 160, the first component 30, the second component 40, and the base 50. The support member 70 can be formed by, for example, an insert molding technique.

[0038] 9, the temporary substrate 160 is polished or ground from the surface opposite to the first mounting surface 160A (FIG. 8) to expose the first external terminals 61, the second external terminals 62, and the long terminals 68. By polishing or grinding the temporary substrate 160, the first surface 70A of the support member 70 is exposed.

[0039] Next, the excellent effects of the first embodiment will be described with reference to Figures 10A and 10B. Figures 10A and 10B are schematic cross-sectional views showing the procedure for applying solders 202A and 202B to lands 201 arranged on the mounting surface of mounting board 200.

[0040] 10A, a plurality of lands 201 of different sizes are arranged on the mounting surface of a mounting board 200. Solder 202A is applied onto each of the lands 201. For example, screen printing is used to apply the solder 202A. For example, the same volume of solder 202A is applied to each of the lands 201.

[0041] As shown in FIG. 10B, the applied solder 202A is reflowed. After reflow, the solder 202B covers almost the entire upper surface of the land 201. The height H1 of the solder 202B on the land 201 with the relatively smaller area is higher than the height H2 of the solder 202B on the land 201 with the relatively larger area. In this way, when there is variation in the size of the land 201, the height of the solder 202B also varies, and the greater the degree of variation in the area of ​​the land 201, the greater the degree of variation in the height of the solder 202B. In particular, when the degree of variation in the minimum dimension of the land 201 in a plan view increases, the degree of variation in the height of the solder 202B also increases.

[0042] In general, the terminals of a component having a smaller dimension in the height direction are smaller than the terminals of a component having a larger dimension in the height direction. As shown in Fig. 2, the maximum value of the minimum dimension W2 of each of the second internal terminals 41 is smaller than the maximum value of the minimum dimension W1 of each of the first external terminals 61. In a structure in which the second internal terminals 41 are exposed on the first surface 70A, the degree of variation in the minimum dimensions of each of the multiple terminals including the first external terminals 61 and the second internal terminals 41 exposed on the first surface 70A is likely to be large.

[0043] In the first embodiment, the first external terminal 61 and the second external terminal 62 are exposed on the first surface 70A, and the maximum value of the minimum dimension W2 of each of the second external terminals 62 is greater than the maximum value of the minimum dimension W3 of each of the second internal terminals 41. Therefore, the degree of variation in the minimum dimensions of each of the multiple terminals exposed on the first surface 70A is smaller than in a configuration in which the first external terminal 61 and the second internal terminal 41 are exposed on the first surface 70A. In other words, the base 50 has the function of making the dimension of the second external terminal 62 for connecting the second component 40 to an external board or the like larger than the dimension of the second internal terminal 41 and closer to the dimension of the first external terminal 61.

[0044] A smaller degree of variation in the minimum dimensions of each of the multiple terminals including the first external terminal 61 and the second external terminal 62 also reduces the degree of variation in the height of the solder applied to the first external terminal 61 and the second external terminal 62. This makes it possible to easily and stably mount the high-frequency module according to the first embodiment on another substrate such as the antenna substrate 90 (FIG. 4).

[0045] If the minimum dimension W2 of each of the second external terminals 62 is increased and the difference with the minimum dimension W3 of each of the second internal terminals 41 becomes too large, the degree of discontinuity of the characteristic impedance of the power feed line from the second internal terminal 41 to the antenna element 91 (FIG. 4) via the second external terminal 62 increases. As a result, the transmission loss of the high frequency signal increases. In order to suppress the increase in the transmission loss of the high frequency signal, it is preferable not to make the minimum dimension W2 of each of the second external terminals 62 larger than necessary. For example, it is preferable to set the maximum value of the minimum dimension W2 of each of the second external terminals 62 to be equal to or smaller than the minimum dimension W1 of each of the first external terminals 61. If the difference between the minimum dimension W2 of each of the second external terminals 62 and the minimum dimension W3 of each of the second internal terminals 41 is reduced, the degree of discontinuity of the characteristic impedance of the power feed line from the second internal terminal 41 to the antenna element 91 (FIG. 4) via the second external terminal 62 decreases. As a result, the transmission loss of the high frequency signal is reduced.

[0046] If the difference between the maximum and minimum values ​​of the minimum dimensions of each of the multiple terminals including the first external terminal 61 and the second external terminal 62 becomes too large, it becomes difficult to stably mount the high-frequency module 100 on another substrate. In order to maintain the excellent effect of being able to stably mount the high-frequency module 100 on another substrate, it is preferable to configure the difference between the maximum and minimum values ​​of the minimum dimensions of each of the multiple terminals including the first external terminal 61 and the second external terminal 62 to be smaller than the difference between the maximum and minimum values ​​of the minimum dimensions of each of the multiple terminals including the first external terminal 61 and the second internal terminal 41.

[0047] Furthermore, in order to prevent the excellent effect of enabling the high-frequency module 100 to be stably mounted on another substrate from being diminished, it is preferable to configure the maximum value of the minimum dimension W4 of each of the multiple long terminals 68 to be equal to or greater than the maximum value of the minimum dimension W2 of each of the second external terminals 62, and equal to or less than the maximum value of the minimum dimension W1 of each of the multiple first external terminals 61.

[0048] The height dimension h2 of the second component 40 included in the high-frequency module 100 according to the first embodiment is smaller than the height dimension h1 of the first component 30. Since the second component 40, which has a relatively small height dimension, is stacked on the base 50, the top surface 40B of the second component 40 approaches the second surface 70B of the support member 70. This reduces the thermal resistance of the heat transfer path from the second component 40 to the second surface 70B of the support member 70. As a result, the heat dissipation from the second component 40 can be improved. In particular, when the second component 40 includes an active element such as a transistor 42Q (FIG. 5) and is the main heat source of the high-frequency module 100, it is effective to improve the heat dissipation from the second component 40.

[0049] Furthermore, in the first embodiment, the first component 30 is connected to the first external terminal 61 without an interposer or the like. Therefore, the high-frequency module 100 can be made lower in height than a configuration including an interposer or the like. If the height dimension h3 of the base 50 is made too large, the effect of making the high-frequency module 100 lower in height is reduced. In order to maintain the excellent effect of making the high-frequency module lower in height, it is preferable to make the height dimension h3 of the base 50 equal to or smaller than the height dimension h1 of the first component 30 having the maximum height dimension h1. Furthermore, it is preferable to make the sum of the height dimension h3 of the base 50 and the height dimension h2 of the second component 40 equal to or smaller than 1.5 times the height dimension h1 of the first component 30 having the maximum height dimension h1.

[0050] Next, another method for manufacturing the high-frequency module 100 according to the first preferred embodiment will be described with reference to Figures 11 to 15. Figures 11 to 15 are schematic cross-sectional views of the high-frequency module according to the first preferred embodiment during its manufacturing process.

[0051] 11, a plurality of first external terminals 61, a plurality of second external terminals 62, and a plurality of long terminals 68 are formed on a first mounting surface 160A, which is one surface of a temporary substrate 160. Thereafter, a multilayer wiring structure 55 is formed on the first mounting surface 160A. In the process of forming the multilayer wiring structure 55, a plurality of wirings 53 made of via conductors or the like are formed. A plurality of top surface side internal terminals 52 are formed on a top surface 50B, which is the uppermost surface of the multilayer wiring structure 55. The wirings 53 connect the second external terminals 62 and the top surface side internal terminals 52.

[0052] 12, a portion of the multilayer wiring structure 55 (FIG. 11) is removed until the first external terminals 61 and the long terminals 68 are exposed. The portion of the multilayer wiring structure 55 is removed by, for example, polishing or grinding. At this time, a pedestal 50 consisting of a portion of the multilayer wiring structure 55 is left in the region where the second external terminals 62 and the top surface side internal terminals 52 are arranged.

[0053] 13, the second component 40 is fixed to the top surface 50B of the base 50 by connecting the second internal terminal 41 of the second component 40 to the top surface side internal terminal 52 via the solder member 85. The first component 30 is mounted on the temporary substrate 160 by connecting the first internal terminal 31 of the first component 30 to the first external terminal 61 via the solder member 81. Through the steps up to this point, an intermediate product 161 including the temporary substrate 160, the first component 30, the second component 40, and the base 50 is produced.

[0054] 14, a support member 70 made of resin is formed so as to cover the first mounting surface 160A of the temporary substrate 160, the first external terminals 61, the long terminals 68, the base 50, the first component 30, and the second component 40. The support member 70 can be formed by using, for example, an insert molding technique. Note that a thin layer of the multilayer wiring structure 55 remains on the first mounting surface 160A. The support member 70 covers the first mounting surface 160A via this thin layer.

[0055] As shown in FIG. 15, the temporary substrate 160 is polished or ground from the surface opposite to the first mounting surface 160A until the first external terminal 61, the second external terminal 62, and the long terminal 68 are exposed. The first surface 70A of the support member 70 is covered with a thin insulating layer that is a part of the multilayer wiring structure 55. The surfaces of the first external terminal 61 and the long terminal 68 facing the support member 70 contact the first surface 70A of the support member 70. The first external terminal 61 and the long terminal 68 protrude from the first surface 70A by the thickness of the first external terminal 61 and the long terminal 68. The second external terminal 62 is disposed at the same height position as the first external terminal 61 and the long terminal 68.

[0056] The high-frequency module 100 manufactured by this manufacturing method does not have the bottom surface side internal terminal 51 disposed on the base 50 of the high-frequency module 100 shown in Fig. 1 , and the solder member 82 connecting the bottom surface side internal terminal 51 and the second external terminal 62. The wiring 53 connected to the top surface side internal terminal 52 is directly connected to the second external terminal 62.

[0057] Next, a high-frequency module according to a modification of the first embodiment will be described with reference to FIG. 16. FIG. 16 is a cross-sectional view of a high-frequency module 100 according to a modification of the first embodiment. In the first embodiment (FIGS. 1 and 2), the bottom surface side internal terminals 51 and the top surface side internal terminals 52 connected to each other of the base 50 are arranged at the same position in a plan view. In contrast, in this modification, at least a part of the bottom surface side internal terminals 51 and the top surface side internal terminals 52 connected to each other of the base 50 are arranged at different positions in a plan view. For example, the bottom surface side internal terminals 51 are arranged so that the minimum interval between them is wider than the minimum interval between the top surface side internal terminals 52. In this modification, the base 50 functions as a rewiring layer of a fan-out package. Note that in this modification, the long terminals 68 provided in the high-frequency module 100 according to the first embodiment (FIGS. 1 and 2) are not provided.

[0058] Next, a high-frequency module according to another modified example of the first embodiment will be described with reference to Fig. 17. Fig. 17 is a cross-sectional view of a high-frequency module 100 according to another modified example of the first embodiment. In the first embodiment (Figs. 1 and 2), each of the multiple first external terminals 61 and the multiple second external terminals 62 is configured with an isolated metal pattern. In contrast, in this modified example, at least one first external terminal 61 and at least one second external terminal 62 are connected by a wiring 64 exposed on the first surface 70A. The wiring 64 can be formed on the first mounting surface 160A of the temporary substrate 160 simultaneously with the first external terminals 61, etc., in the process shown in Fig. 6, for example.

[0059] In this modification, the first component 30 and the second component 40 included in the high-frequency module 100 can be connected within the high-frequency module 100. This makes it possible to reduce the number of wires within the mounting board on which the high-frequency module 100 is mounted.

[0060] Next, a high-frequency module according to yet another modification of the first preferred embodiment will be described with reference to Fig. 18. Fig. 18 is a cross-sectional view of a high-frequency module 100 according to yet another modification of the first preferred embodiment.

[0061] In the first embodiment (FIG. 1), the first internal terminal 31 of the first component 30 and the first external terminal 61 exposed on the first surface 70A of the support member 70 are connected via a solder member 81. In contrast to this, in this modification, the first internal terminal 31 of the first component 30 is exposed on the first surface 70A, and the first internal terminal 31 is used as a first external terminal 61 for connecting to a mounting board or the like. Similarly, the lower surface side internal terminal 51 of the base 50 is exposed on the first surface 70A, and the lower surface side internal terminal 51 is used as a second external terminal 62.

[0062] The structure of the high-frequency module 100 according to this modified example is produced, for example, by polishing or grinding the temporary substrate 160 shown in FIG. 9 until the first external terminal 61, the second external terminal 62, and the long terminal 68 are exposed, and then the polishing or grinding is continued until the first internal terminal 31 and the bottom-side internal terminal 51 are exposed.

[0063] In this modification, it is possible to further reduce the height of the high-frequency module 100. Note that in the step shown in Fig. 9, the solder members 81, 82 may be polished or ground partway to expose the solder members 81, 82 on the first surface 70A. In this configuration, the solder members 81, 82 are used as the first external terminal 61 and the second external terminal 62, respectively.

[0064] Next, a high-frequency module according to yet another modified example of the first preferred embodiment will be described with reference to Fig. 19. Fig. 19 is a cross-sectional view of a high-frequency module 100 according to yet another modified example of the first preferred embodiment.

[0065] In the first embodiment (FIG. 1), the top surface 30B of the first component 30 and the top surface 40B of the second component 40 are covered with the support member 70. In contrast, in this modification, at least one of the top surface 30B of the first component 30 and the top surface 40B of the second component 40 is substantially flush with the second surface 70B of the support member 70 and is exposed from the support member 70. Such a structure can be produced by polishing or grinding the support member 70 from the second surface 70B after the step of polishing or grinding the temporary substrate 160 shown in FIG.

[0066] By exposing the top surface 40B of the second component 40 from the support member 70, it is possible to further improve the heat dissipation from the second component 40. In order to employ this structure, it is preferable to set the dimension of the base 50 in the height direction so that the height from the first surface 70A to the top surface 40B of the second component 40 and the height to the exposed top surface 30B of the first component 30 are equal.

[0067] [Second Example] Next, a high-frequency module according to a second embodiment will be described with reference to Fig. 20. Below, a description of the configuration common to the high-frequency module 100 according to the first embodiment described with reference to Figs. 1 to 9 will be omitted.

[0068] 20 is a cross-sectional view of a high-frequency module 100 according to a second embodiment. In the second embodiment, an antenna component 110 is supported on a support member 70 in addition to a first component 30, a second component 40, and a base 50. The antenna component 110 includes a plurality of radiating elements 111 therein, a feeder 113 arranged for each of the radiating elements 111, and a ground plane 114. The ground plane 114 is arranged parallel to the first surface 70A, and the plurality of radiating elements 111 are arranged at positions farther away from the ground plane 114 as viewed from the first surface 70A. Each of the radiating elements 111 and the ground plane 114 form a patch antenna.

[0069] The antenna component 110 further includes a plurality of antenna terminals 112 arranged on a surface facing in the same direction as the first surface 70A. The plurality of antenna terminals 112 are connected to the plurality of radiating elements 111 via feeder lines 113, respectively. In addition to the first external terminal 61 and the second external terminal 62, a plurality of third external terminals 63 are exposed on the first surface 70A. That is, the third external terminals 63 are arranged at the same height position as the first external terminal 61 and the second external terminal 62.

[0070] The multiple antenna terminals 112 are respectively connected to the multiple third external terminals 63 via solder members 83. A surface of the antenna component 110 facing in a direction opposite to the direction in which the first surface 70A faces (hereinafter, may be referred to as a top surface 110B) is flush with the second surface 70B of the supporting member 70 and is exposed from the supporting member 70.

[0071] The second component 40 is, for example, a radio frequency integrated circuit (RFIC), and is connected to the radiating element 111 via the second external terminal 62, a wiring on the mounting board, the third external terminal 63, the solder member 83, the antenna terminal 112, and the power feeder 113. Note that, as in the modified example of the first embodiment shown in Fig. 17, the second external terminal 62 and the third external terminal 63 may be connected via a wiring exposed on the first surface 70A.

[0072] A high frequency signal is supplied from the second component 40 to each of the multiple radiating elements 111, and radio waves are radiated from each of the radiating elements 111. The boresight of the radiating elements 111 faces in the opposite direction to the direction in which the first surface 70A faces. In other words, the boresight of the radiating elements 111 faces in the opposite direction to the boresight of the antenna element 91 of the antenna module shown in Fig. 4. The boresight is also referred to as the main radiation direction.

[0073] Next, the advantageous effects of the second embodiment will be described. In the second embodiment, similarly to the first embodiment, the high-frequency module 100 can be stably mounted on the mounting board, and the height of the high-frequency module 100 can be reduced. Furthermore, in the second embodiment, radio waves can be emitted in the direction opposite to the direction in which the first surface 70A of the support member 70 faces. In other words, radio waves can be emitted in the direction in which the component mounting surface of the mounting board on which the high-frequency module 100 is mounted faces.

[0074] Next, a modified example of the second embodiment will be described. The high-frequency module 100 according to the second embodiment may be mounted on the antenna substrate 90 shown in Fig. 4. By adopting this configuration, it becomes possible to radiate radio waves to both sides of the first surface 70A.

[0075] [Third Example] Next, a high-frequency module according to a third embodiment will be described with reference to Fig. 21 and Fig. 22. Below, a description of the configuration common to the high-frequency module 100 according to the second embodiment described with reference to Fig. 20 will be omitted.

[0076] FIG. 21 is a cross-sectional view of a high-frequency module 100 according to the third embodiment, and FIG. 22 is a diagram showing the positional relationship of multiple components included in the high-frequency module 100 in a plan view. In the second embodiment (FIG. 20), the boresight direction of multiple radiating elements 111 in the antenna component 110 is opposite to the direction in which the first surface 70A faces. In contrast, in the third embodiment, the antenna component 110 includes two types of radiating elements 111A and 111B having different boresight directions. The boresight of one type of radiating element 111A faces in the opposite direction to the direction in which the first surface 70A faces, and the boresight of the other type of radiating element 111B faces in a direction parallel to the first surface 70A. Note that the boresight direction of the radiating element 111B does not necessarily need to be parallel to the first surface 70A, and may be inclined with respect to a plane including the first surface 70A. For example, the direction of the boresight may be tilted in a direction such that the tilt angle with respect to a plane including first surface 70A is 45° or less. Hereinafter, radiating element 111B may be referred to as a "horizontal radiating element." Ground plane 114A is disposed relative to radiating element 111A, and ground plane 114B is disposed relative to radiating element 111B.

[0077] For example, each of the radiating element 111B and the ground plane 114B is formed of a metal pattern perpendicular to the first surface 70A. The radiating element 111B and the ground plane 114B form a patch antenna. The antenna component 110 having such a structure can be produced using, for example, a 3D printer.

[0078] Next, the excellent effects of the third embodiment will be described. In the third embodiment, as in the second embodiment, the high frequency module 100 can be stably mounted on a mounting board, and the height of the high frequency module 100 can be reduced. Furthermore, in the third embodiment, radio waves can be emitted in a direction opposite to the direction in which the first surface 70A faces and in a direction parallel to the first surface 70A.

[0079] Next, a high-frequency module according to a modification of the third preferred embodiment will be described. Although the high-frequency module 100 according to the third embodiment includes one horizontal radiating element 111B, a plurality of horizontal radiating elements 111B may be arranged in a direction parallel to the first surface 70A to form an antenna array. Also, a plurality of horizontal radiating elements 111B may be arranged, and the boresight direction of each of the plurality of radiating elements 111B may be oriented in a plurality of directions parallel to the first surface 70A.

[0080] [Fourth Example] Next, a high-frequency module according to a fourth embodiment will be described with reference to Fig. 23, Fig. 24, and Fig. 25. Below, a description of the configuration common to the high-frequency module according to the third embodiment shown in Fig. 21 and Fig. 22 will be omitted.

[0081] Fig. 23 is a cross-sectional view of a high-frequency module 100 according to a fourth embodiment, and Fig. 24 is a diagram showing the positional relationship of multiple components included in the high-frequency module 100 in a plan view. In the fourth embodiment, a shielding function component 30S is used for at least one of the multiple first components 30. The shielding function component 30S has an electromagnetic shielding function. At least one shielding function component 30S is disposed next to the antenna component 110 in a plan view. Here, "disposed next to" means that the antenna component 110 and the shielding function component 30S are disposed close to each other so that no other components are disposed between them in a plan view.

[0082] For example, in a plan view, at least one shield function component 30S is disposed between the antenna component 110 and the second component 40. No second component 40 is disposed between the antenna component 110 and the shield function component 30S. As shown in Fig. 24, in a plan view, three shield function components 30S are disposed so as to surround the antenna component 110 from three directions other than the boresight direction of the horizontal radiating element 111B.

[0083] 25 is a cross-sectional view showing an example of a shield function component 30S. The shield function component 30S includes a plurality of sub-components 131. The sub-components 131 are covered and supported by an internal support member 133. The internal support member 133 has a second surface 133A, and a plurality of first internal terminals 31 are exposed on the second surface 133A. The first internal terminals 31 are connected to the sub-components 131 via solder members 84. The first internal terminals 31 are connected to a plurality of first external terminals 61 via solder members 81 as shown in FIG. 23.

[0084] A top surface 133B facing in a direction opposite to the direction in which the second surface 133A of the internal support member 133 faces, and a side surface 133C connecting the second surface 133A and the top surface 133B are covered with a metal film 32. This metal film 32 is covered with a support member 70 (FIG. 23). That is, the shielding function component 30S includes a metal film 32 disposed at the interface with the support member 70. The metal film 32 covering the top surface 133B of the internal support member 133 is exposed from the support member 70 as shown in FIG. 23. Note that the metal film 32 covering the top surface 133B of the internal support member 133 may be configured to be covered with the support member 70.

[0085] At least one of the first internal terminals 31 is exposed on a side surface 133C of the internal support member 133, and is connected to the metal film 32. The metal film 32 is connected to a first external terminal 61 (FIG. 23) via the first internal terminal 31 and a solder member 81. The first external terminal 61 connected to the metal film 32 is connected to a ground conductor of the mounting board.

[0086] As the shielding function component 30S, in addition to the component having the structure shown in FIG. 25, other components having a function of electromagnetically shielding the antenna component 110 may be used. As the shielding function component 30S, for example, a system-in-package (SiP) module having a metal film on its surface, a single component such as a shielded inductor, or a composite component having a structure in which a metal member for heat dissipation is in contact with the top surface of an electronic component may be used. In addition to electrical functional components, as the shielding function component 30S, a component specialized for an electromagnetic shielding function, for example, a metal member of various shapes such as a metal block, may be used. The shielding function component 30S may include a metal portion disposed at the interface with the support member 70. This metal portion functions as an electromagnetic shielding structure.

[0087] Next, the excellent effects of the fourth embodiment will be described. In the fourth embodiment, similarly to the third embodiment, the high-frequency module 100 can be stably mounted on the mounting board, and the high-frequency module 100 can be made low-profile. Furthermore, the metal film 32 of the shielding function component 30S functions as an electromagnetic shielding film. That is, the shielding function component 30S functions as a reflector that reflects radio waves radiated from the antenna component 110. This improves the radiation characteristics of the radiating elements 111A and 111B of the antenna component 110 in the boresight direction. Furthermore, the isolation between the antenna component 110 and other components in the high-frequency module 100 can be improved.

[0088] Next, a high-frequency module according to a modification of the fourth preferred embodiment will be described. In the fourth embodiment (FIG. 25), the entire top surface 133B and the side surface 133C of the internal support member 133 are covered with the metal film 32, but only a part of the surface may be covered with the metal film 32. The metal film 32 may be patterned into various shapes, such as a mesh or stripe shape.

[0089] The above-mentioned embodiments are merely examples, and it goes without saying that partial replacement or combination of the configurations shown in different embodiments is possible. Similar effects due to similar configurations of multiple embodiments are not mentioned in each embodiment. Furthermore, the present invention is not limited to the above-mentioned embodiments. For example, it will be obvious to those skilled in the art that various modifications, improvements, combinations, etc. are possible. [Explanation of symbols]

[0090] 30 1st Part 30A Bottom surface of the first part 30B Top surface of first part 30S Shielded Functional Parts 31 1st internal terminal 32 Metal Film 35 Isolator 36 Duplexer 40 2nd Part 40A Bottom surface of second part 40B Top surface of second part 41 2nd internal terminal 42 Power Amplifier 42Q Transistor 43 Low Noise Amplifier 43Q Transistor 50 Pedestal 50A Underside of base 50B Top of the base 51 Bottom internal terminal 52 Top side internal terminal 53 Wiring 55 Multilayer wiring structure 61 First external terminal 62 Second external terminal 63 Third external terminal 64 Wiring 68 Long terminal 70 Support member 70A First surface of support member 70B second surface of support member 81, 82, 83, 84, 85 Soldering materials 90 Antenna Board 90A Mounting surface 90B Antenna surface 91 Antenna elements 92 Wiring 93 High Frequency Connector 94 Land 95 Soldering materials 100 High Frequency Module 110 Antenna parts 110B Top surface of antenna parts 111, 111A, 111B Radiating elements 112 Antenna terminal 113 Power line 114, 114A, 114B Ground Plane 131 Sub-parts 133 Internal support member 133A Second surface of internal support member 133B Top surface of internal support member 133C Side of Internal Support Member 160 Temporary board 160A 1st mounting surface 161 Intermediate products 200 Mounting Board 201 Land 202A applied solder 202B Solder after reflow processing

Claims

1. a support member having a first surface; a first component, a second component, and a base that are covered and supported by the support member; a plurality of first external terminals and a plurality of second external terminals arranged at positions in the same height direction as the first surface, where a direction perpendicular to the first surface is defined as a height direction; Equipped with the base has a top surface facing a direction opposite to a direction in which the first surface faces, a plurality of top surface side internal terminals arranged on the top surface, and wiring that connects the top surface side internal terminals to the second external terminals, the first component is connected to the first external terminal; the second component has a plurality of second internal terminals, and is disposed on the base in a stacked manner in a height direction by connecting the second internal terminals to the top surface side internal terminals; The second component has a height dimension smaller than a height dimension of the first component, A high-frequency module in which, when the first surface is viewed in a plan view, the maximum value of the minimum dimension of each of the first external terminals is greater than the maximum value of the minimum dimension of each of the second internal terminals, and the maximum value of the minimum dimension of each of the second external terminals is greater than the maximum value of the minimum dimension of each of the second internal terminals.

2. The high-frequency module according to claim 1 , wherein the base is disposed between the second component and the second external terminal in a height direction.

3. 3 . The high-frequency module according to claim 1 , wherein a maximum value of a minimum dimension of each of the second external terminals is equal to or smaller than a maximum value of a minimum dimension of each of the first external terminals when the first surface is viewed in plan.

4. The high frequency module according to claim 1 , wherein the second component includes an active element.

5. The support member has a second surface facing in a direction opposite to a direction in which the first surface faces, The high frequency module according to claim 1 , wherein at least one of the first components or at least one of the second components is exposed on the second surface.

6. A high-frequency module as described in any one of claims 1 to 5, wherein in at least one of the pairs of the top surface side internal terminal and the second external terminal connected by the wiring, the top surface side internal terminal and the second external terminal are arranged in different positions when viewed in a plane of the first surface.

7. an antenna component supported by the support member; a plurality of third external terminals arranged at the same height positions as the first external terminals and the second external terminals; Furthermore, The radio frequency module according to claim 1 , wherein the antenna component includes at least one radiating element, the radiating element being connected to the third external terminal.

8. 8. The radio frequency module according to claim 7, wherein the antenna component includes a plurality of the radiating elements, the boresights of some of the radiating elements facing in a direction opposite to the direction in which the first surface faces, and the boresights of at least some of the other radiating elements facing in a direction parallel to the first surface.

9. 8. The high-frequency module according to claim 7, wherein at least one of the first components is arranged next to the antenna component when the first surface is viewed in a plane, and the first component arranged next to the antenna component includes a metal portion arranged in at least a portion of an interface with the support member.

10. preparing an intermediate product including a temporary substrate having a first mounting surface, a base provided on the temporary substrate and having a top surface located higher than the first mounting surface when a direction perpendicular to the first mounting surface is taken as a height direction, a plurality of first external terminals arranged on the first mounting surface, a plurality of top surface side internal terminals arranged on the top surface, a plurality of second external terminals arranged at the same height direction as the first external terminals, wiring connecting the top surface side internal terminals and the second external terminals, a first component connected to the first external terminals and fixed to the temporary substrate, and a second component connected to the top surface side internal terminals and fixed to the base; covering the first mounting surface, the top surface, the first component, and the second component with a support member to support the first component, the second component, and the base; The manufacturing method for a high frequency module includes polishing or grinding the temporary substrate from a surface opposite to the first mounting surface to expose the first external terminal and the second external terminal.

11. the base includes a plurality of bottom surface side internal terminals arranged on a bottom surface facing in a direction opposite to a direction in which the top surface faces, and the wiring connects the top surface side internal terminals and the bottom surface side internal terminals; the first component includes a plurality of first inner terminals; the second component includes a plurality of second inner terminals; In the step of preparing the intermediate product, the lower surface side internal terminal is connected to the second external terminal, thereby fixing the base to the temporary substrate; before or after the base is fixed to the temporary substrate, the second internal terminal is connected to the top surface side internal terminal to fix the second component to the base; The method for manufacturing a high frequency module according to claim 10 , wherein the first component is fixed to the temporary substrate by connecting the first internal terminal to the first external terminal.

12. the first component includes a plurality of first inner terminals; the second component includes a plurality of second inner terminals; In the step of preparing the intermediate product, forming a plurality of the first external terminals and a plurality of the second external terminals on the first mounting surface of the temporary substrate; forming a multilayer wiring structure on the first mounting surface, the multilayer wiring structure including a top surface as the top surface, a plurality of top surface side internal terminals arranged on the top surface, and the wiring connecting the top surface side internal terminals and the second external terminal; removing a portion of the multilayer wiring structure until the first external terminal is exposed, and leaving the base made of a portion of the multilayer wiring structure in a region where the second external terminal and the top surface side internal terminal are disposed; The second component is fixed to the base by connecting the second internal terminal to the top surface side internal terminal; The method for manufacturing a high frequency module according to claim 10 , wherein the first component is fixed to the temporary substrate by connecting the first internal terminal to the first external terminal.

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