IMPRINT APPARATUS, IMPRINT METHOD, AND PRODUCTION METHOD OF ARTICLE

Abstract

To provide an imprint device that is advantageous in improvement of the accuracy of alignment between a mold and a substrate, which is an exemplary object.SOLUTION: An imprint device forms a pattern by imprinting on an imprint material on a substrate by using a mold, and has: a mold support unit that supports the mold; a substrate support unit that has a mounting surface for supporting the substrate; a driving unit that relatively drives the mold support unit and the substrate support unit; a detection unit that detects a first mark on the mold and a second mark on the substrate; a position adjustment unit that adjusts the relative positions between the mold and the detection unit; and a control unit that, during the imprinting, controls the position adjustment unit to adjust the relative positions between the mold and the detection unit based on the position of the first mark detected by the detection unit within the field of view of the detection unit, and causes the driving unit to perform alignment between the substrate and the mold based on the first mark and the second mark detected by the detection unit.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article. [Background technology]

[0002] Imprinting apparatuses are being put into practical use as one of the lithography technologies for the mass production of magnetic storage media and semiconductor devices. Imprinting technology is a method of forming a circuit pattern on a substrate by bringing an original plate on which a fine circuit pattern has been formed into contact with a resin applied to a substrate such as a silicon wafer or a glass plate. For example, when forming a circuit pattern for a semiconductor device, the accuracy of the alignment between the circuit pattern already formed on the substrate and the circuit pattern to be formed is extremely important.

[0003] Imprinting apparatuses using imprinting technology employ a die-by-die alignment method for aligning a substrate and an original, which is a method for optically detecting a substrate-side alignment mark and an original-side alignment mark for each imprinting area on a substrate where imprinting processing is performed, and correcting the positional deviation between the substrate and the original.

[0004] Patent Document 1 discloses a method of driving a substrate stage by reflecting the driving amount of an alignment scope that detects an alignment mark in the alignment between a substrate and an original in the driving amount of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2015-170815 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the die-by-die alignment method of the imprint apparatus of the conventional technology, if the original shifts or drifts during imprinting, the alignment scope cannot track the original, which causes a measurement error due to the change in the position of the alignment mark within the field of view of the alignment scope, resulting in a problem of deterioration in overlay (alignment) accuracy.

[0007] The present invention has been made in consideration of the problems with the conventional technology, and has an exemplified object to provide an imprint apparatus that is advantageous in improving the alignment accuracy between a mold and a substrate. [Means for solving the problem]

[0008] The imprint apparatus of the present invention is an imprint apparatus that forms a pattern in an imprint material on a substrate using an original, and includes an original supporting section that supports the original, a substrate supporting section that supports the substrate, a drive section that drives the original supporting section and the substrate supporting section relatively, a detection section that detects a first alignment mark of the original and a second alignment mark of the substrate, and a detector that detects a position between the original and the detection section. No. 1 a position adjustment unit for adjusting a relative position; before The first alignment mark and the second alignment mark detected by the detection unit Second Controlling the driving unit to align the substrate and the original based on the relative positions. and controlling the position adjustment unit to adjust a position of the first alignment mark detected by the detection unit within a field of view of the detection unit after the alignment is started. and a control unit for controlling the Effect of the Invention

[0009] According to the present invention, it is possible to provide an imprint apparatus that is advantageous in improving the alignment accuracy between a mold and a substrate. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 illustrates an imprint apparatus according to a first embodiment. [Diagram 2] 1A and 1B are diagrams showing examples of alignment marks. [Diagram 3] 1 is a flowchart of an imprint method according to a first embodiment. [Figure 4] FIG. 1 is a diagram showing an example of a substrate and shot arrangement. [Diagram 5] FIG. 1 is a diagram of an alignment mark within the field of view of an alignment detection system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. In each drawing, the same members or elements are given the same reference numerals, and duplicated explanations will be omitted. Please note that the drawings shown below may be drawn at a scale different from the actual scale in order to make the present embodiment easier to understand.

[0012] First Embodiment An imprint apparatus according to an exemplary embodiment of the present invention will be described with reference to Fig. 1. Here, as an example, an example in which the present invention is applied to a UV light curing imprint apparatus that cures resin by irradiating it with UV light (ultraviolet light) will be described. However, the present invention can also be applied to imprint apparatuses that cure resin by irradiating it with light in other wavelength ranges, or imprint apparatuses that cure resin by other energy (for example, heat).

[0013] The imprint apparatus 100 according to the exemplary embodiment of the present invention is configured to form a pattern in a plurality of shot areas S of a substrate by repeating an imprint cycle. Here, one imprint cycle is a cycle in which a pattern is formed in one shot area S of the substrate by pressing an original (mold, type) M against resin and curing the resin.

[0014] The imprint apparatus 100 can include, for example, an exposure mechanism 120, a master manipulation mechanism 130, a master shape correction mechanism 140, a substrate driving unit 160, an alignment mechanism 170, and a controller CNT.

[0015] The exposure mechanism 120 irradiates ultraviolet light onto the resin (resist) R through the original M to harden the resin R. In this embodiment, the resin R is an ultraviolet light curable resin. The exposure mechanism 120 includes, for example, a light source unit 110 and an optical system 112. The light source unit 110 can include, for example, a light source such as a halogen lamp that generates light including ultraviolet light (e.g., i-rays, g-rays) and the like, and an optical system such as an elliptical mirror that collects the light generated from the light source.

[0016] The optical system 112 includes a lens for irradiating the resin R in the shot area S with light for hardening the resin R, and may be configured to include a half mirror HM, a mirror 114, etc. The optical system 112 may also include an optical integrator for uniformly illuminating the original M.

[0017] Light delimited by the aperture passes through the imaging system and the master M and is incident on the resin R on the substrate W. The entire shot area observation scope 190 is a scope for observing the entire shot area S, and is used to check the imprint state and the progress of imprinting and filling.

[0018] The original M is made of a material that is transparent at the wavelength of ultraviolet light, such as quartz, so that the original M can transmit ultraviolet light for curing the resin R. The original M can be transported by a not-shown original transport mechanism. The original transport mechanism includes, for example, a transport robot having a chuck such as a vacuum chuck.

[0019] The original operation mechanism 130 may include, for example, an original chuck (original support portion) 132 that supports the original M, an original driving mechanism 134 that drives the original M by driving the original chuck 132, and an original base 136 that supports the original driving mechanism 134.

[0020] The original driving mechanism 134 includes a positioning mechanism that controls the position of the original M about six axes, and a mechanism that presses the original M against the substrate W or the resin R thereon, and separates the original M from the hardened resin R. Here, the six axes refer to the X-axis, Y-axis, and Z-axis in an XYZ coordinate system in which the support surface (the surface that supports the substrate W) of the original chuck 132 is the XY plane and the direction perpendicular to that is the Z-axis, as well as rotation around each of these axes.

[0021] The original shape correction mechanism (shape correction unit) 140 can be mounted on the original chuck 132. The original shape correction mechanism 140 can correct the shape of the original M by applying pressure to the original M from the outer circumferential direction using a cylinder that operates with a fluid such as air or oil. Alternatively, the original shape correction mechanism 140 includes a temperature control unit that controls the temperature of the original M, and corrects the shape of the original M by controlling the temperature of the original M.

[0022] The substrate W may be deformed (typically expanded or contracted) by undergoing a process such as heat treatment. The original shape correction mechanism 140 corrects the shape of the original M in response to such deformation of the substrate W so that the overlay (alignment) error falls within a tolerable range.

[0023] The coating mechanism 180 applies the resin R sequentially to regions of the substrate W where imprinting is to be performed, or all at once to the entire surface of the substrate W. The coating mechanism 180 configured within the imprint apparatus 100 may be used, or all at once coating may be performed by an external device. The coating mechanism 180 may include, for example, a tank that contains the resin R, a nozzle that ejects the resin R supplied from the tank through a supply path onto the substrate W, a valve provided in the supply path, and a supply amount control unit.

[0024] Next, the original M is pressed against the resin R, and in this state, ultraviolet light is irradiated to harden the resin R. Next, the same process is carried out for the next shot area S.

[0025] The substrate driving section 160 may include, for example, a substrate chuck (substrate support section) 162 having a mounting surface that supports the substrate W, a substrate stage 164 that drives the substrate W by driving the substrate chuck 162, and a stage driving mechanism (not shown).

[0026] The stage driving mechanism may include a positioning mechanism that controls the position of the substrate W by controlling the position of the substrate stage 164 with respect to the six axes mentioned above.

[0027] The alignment mechanism 170 may include, for example, an alignment scope (detection unit) 172 and an alignment stage mechanism 174.

[0028] The alignment scope 172 may include an automatic adjustment scope (AAS) that aligns the original M with the shot area S of the substrate W. The alignment scope 172 detects an alignment mark AMM formed on the original M and an alignment mark (second alignment mark) AMW formed on the substrate W, via the original M. Although only one alignment mechanism 170 is shown in FIG. 1, multiple alignment mechanisms 170 are installed.

[0029] The imprint apparatus 100 also includes a surface plate and a vibration isolator (damper), which are not shown.

[0030] The surface plate supports the entire imprint apparatus 100 and forms a reference plane when the substrate stage 164 moves. The vibration isolators eliminate vibrations from the floor and support the base plate.

[0031] Hereinafter, the operation of the imprint apparatus 100 will be described with reference to Fig. 3. In this embodiment, this operation is controlled by the control unit CNT.

[0032] First, the original M is transported to the original chuck 132, positioned, and held by the original chuck 132 (step 1002).

[0033] Next, in step 1004, the substrate W is loaded onto the substrate chuck 162 by a transport mechanism (not shown) and held by the substrate chuck 162. Here, it is assumed that at least one layer of patterns has already been formed on the substrate W together with the alignment marks AMW.

[0034] 2 illustrates alignment marks AMM, AMW formed on original M and substrate W. Alignment mark (first alignment mark) AMM on original M and alignment mark AMW on substrate W are configured so as not to completely overlap each other, and it is possible to measure the relative position of alignment mark AMM on substrate W through original M. In addition, by measuring the positions of alignment marks AMM, AMW (also referred to as alignment marks AM) within the field of view of alignment scope 172, it is also possible to measure the relative position between alignment scope 172 and alignment mark AMM or AMW. As shown in FIG. 4, multiple shot areas S are formed on substrate W, and multiple alignment marks AMW are formed within each shot area S.

[0035] Next, in step 1006, the resin R is applied to the region where imprinting is to be performed by the application mechanism 180. The resin R may be applied to the entire surface of the substrate W in advance using an external device.

[0036] Next, in step 1008, the alignment scope 172 is driven by the alignment stage mechanism (position adjustment unit) 174 to the position of the alignment mark AMM on the original M.

[0037] Next, in step 1010, the original M is lowered by the original operating mechanism 130, so that the original M is pressed (imprinted) against the substrate W or the resin R. Here, instead of driving the original M to be lowered, the substrate W may be raised so that the original M is pressed against the resin R. The pressing load can be controlled, for example, using a load sensor built into the original driving mechanism 134.

[0038] Subsequently, in and after step 1012, alignment measurement is performed according to the die-by-die alignment method during imprinting. Specifically, the alignment marks AMM, AMW of the original M and the substrate W are imaged by the alignment scope 172, and the relative positions between the alignment marks AMM, AMW of the original M and the substrate W are measured by an image processing device (not shown). Based on the result of the relative position measurement between the alignment marks AMM, AMW, the difference in shot shape between the original M and the substrate W (coordinates, rotation, magnification, platform component, etc.) is measured.

[0039] Next, in step 1014, alignment is performed based on the result of measuring the relative position between the alignment marks AMM and AMW during imprinting. Furthermore, if necessary, the shape of the original M is corrected (deformed) by the original shape correction mechanism 140 to match the shot shape of the substrate W.

[0040] Since correction of the shape of the original M by the original shape correcting mechanism 140 will cause correction errors due to driving errors of the original shape correcting mechanism 140 and the like, in step 1016, a tolerance determination of the shot shape difference between the original M and the substrate W is made.

[0041] If it is determined in step 1016 that the shot shape difference between the original M and the substrate W is outside the allowable range, alignment measurement is performed again. However, before that, it is determined whether the relative position between the field of view of the alignment scope 172 and the alignment mark AM is outside the allowable range (outside the first range) (step 1018).

[0042] If the result of the determination in step 1018 is outside the permissible range, the alignment scope 172 is driven to perform relative alignment between the field of view of the alignment scope 172 and the alignment mark AM (step 1020).

[0043] FIG. 5 is a diagram showing the inside of the field of view of the alignment scope 172. The alignment scope 172 is driven by the alignment stage mechanism 174 to adjust the relative position so that the alignment mark AM is always located at the reference point (origin) of the field of view. A plurality of alignment mechanisms 170 are mounted, and the relative position of the alignment mark AM is adjusted individually for each alignment scope 172. Here, the alignment mark AM being located at the reference point of the field of view refers to a state in which the areas of the alignment mark AMM and the alignment mark AMW are in a positional relationship (within a first permissible range) that overlaps with the reference point of the field of view. More preferably, the positional relationship (within a first permissible range) is such that the distance between the center of the alignment mark AM and the reference point of the field of view is 5% or less, preferably 2% or less, more preferably 1% or less of the minimum diameter of the field of view of the alignment scope 172.

[0044] After adjusting the relative position between the field of view of the alignment scope 172 and the alignment mark AM, alignment measurement is again performed using the alignment scope 172. Based on the measurement result, shape correction is performed on the original M until the difference between the shot shapes of the original M and the substrate W falls within a predetermined tolerance range (a second tolerance range).

[0045] Thereafter, when the residual error falls within the allowable range, curing of the resin R, which is the imprint material, begins (step 1022). The curing of the resin R is performed by irradiating the resin R with ultraviolet light through the original M using the exposure mechanism 120. In this way, in parallel with the imprinting process, the detected alignment marks AMW of the substrate and the alignment marks AMM of the original are detected, and alignment between the substrate W and the original M is performed based on the detected alignment marks AM.

[0046] After the curing of the resin R is completed, in step 1024, the original M is raised by the original operating mechanism 130, thereby separating the original M from the cured resin R (demolding). Here, instead of driving the original M, the substrate W may be lowered.

[0047] In step 1026, it is determined whether imprinting has been completed for all shot areas S of the substrate W. If there is a shot area S on which imprinting has not been performed, the process returns to step 1006, and the above process is repeated for the next shot area S. On the other hand, if imprinting has been completed for all shot areas S, in step 1028, the substrate W is unloaded from the substrate chuck 162 by a transport mechanism (not shown).

[0048] In this embodiment, if the determination in step 1018 indicates that the relative position between the alignment scope 172 and the alignment mark AM is outside the allowable range, the alignment scope 172 is driven to align the relative positions. However, the present invention is not limited to this. It is also possible to control the driving so that the relative positions of the alignment scope 172 and the alignment mark AM are always aligned, without making a determination as to whether or not the allowable conditions apply. Also, it is not limited to the alignment scope 172 that is driven, and the original M may be moved by the original driving mechanism 134.

[0049] Also, although the curing of the resin R (step 1022) has been described as being performed when the alignment residual in step 1014 can be brought within the allowable range, the curing may start after a predetermined time has elapsed. Also, if the driving of the alignment scope 172 or the like causes the process time to exceed the originally planned process time, the process time may be extended.

[0050] <Embodiments of the method for manufacturing an article> A manufacturing method for a device (such as a semiconductor integrated circuit element or a liquid crystal display element) as an article includes a step of forming a pattern on a substrate (such as a wafer, a glass plate, or a film-like substrate) using the above-mentioned imprint apparatus.

[0051] The manufacturing method may further include a step of etching the patterned substrate. In addition, when manufacturing other articles such as patterned media (recording media) or optical elements, the manufacturing method may include other processes for processing the substrate on which the pattern is formed instead of etching.

[0052] The method for producing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production costs of the article, as compared to conventional methods.

[0053] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) that implements one or more of the functions.

[0054] Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0055] 100: Imprint device 132: Original chuck (original support part) 134: Master plate drive unit (drive unit) 160: Substrate drive unit (drive unit) 162: Substrate chuck (substrate support part) 170: Alignment mechanism (detection unit) CNT: Control unit M:Original version R: Resin (imprint material) W: Substrate

Claims

1. An imprint apparatus for forming a pattern in an imprint material on a substrate using an original, A master supporting portion for supporting the master; A substrate support portion that supports the substrate; a drive unit that drives the original support unit and the substrate support unit relative to each other; a detection unit that detects a first alignment mark of the original and a second alignment mark of the substrate; a position adjustment unit that adjusts a first relative position between the original and the detection unit; an imprint apparatus comprising: a control unit that controls the drive unit to align the substrate and the original based on a second relative position of the first alignment mark and the second alignment mark detected by the detection unit; and a control unit that controls the position adjustment unit to adjust the position of the first alignment mark detected by the detection unit within the field of view of the detection unit after the alignment starts.

2. The imprint apparatus of claim 1, characterized in that when the position of the first alignment mark detected by the detection unit within the field of view of the detection unit is outside a first tolerance range, the control unit drives the position adjustment unit to adjust the first alignment mark so that it is within the first tolerance range, and after performing the adjustment, the control unit performs the alignment between the substrate and the original plate by the driving unit so that the second relative position is within a second tolerance range.

3. The imprint apparatus according to claim 2 , wherein the control unit terminates the alignment when a predetermined process time has elapsed.

4. The imprint apparatus according to claim 2, characterized in that the control unit extends a predetermined process time to perform the alignment when the second relative position does not fall within the second tolerance range even when the driving unit drives at least one of the original support part and the substrate support part.

5. The imprint apparatus according to claim 1, characterized in that when the position of the first alignment mark within the field of view of the detection unit does not fall within a first tolerance range by driving the position adjustment unit to adjust the position, the control unit extends a predetermined process time to perform the adjustment.

6. a shape correction unit that changes the shape of the original, the control unit adjusts the second relative position and changes the shape of the original by the shape correction unit in performing the alignment.

6. The imprint apparatus according to claim 1, wherein the imprint apparatus is a laser beam source.

7. The imprint apparatus according to claim 1 , wherein the position adjustment unit adjusts the first relative position by moving the detection unit.

8. The imprint apparatus according to claim 1 , wherein the position adjustment unit adjusts the first relative position by moving the original supporting unit.

9. An imprinting method for forming a pattern in an imprint material on a substrate using a master, comprising the steps of: a step of imprinting the substrate coated with an imprint material using the original plate on which the pattern is formed; performing alignment between the substrate and the original based on a second relative position between a first alignment mark of the original and a second alignment mark of the substrate detected by a detection unit, and adjusting a position of the first alignment mark detected by the detection unit within a field of view of the detection unit after starting the alignment; and hardening the imprint material and releasing it from the mold.

10. 10. The imprint method according to claim 9, wherein the alignment step is completed when a predetermined process time has elapsed.

11. The imprint method according to claim 9 , wherein the step of performing alignment includes a step of aligning the substrate and the original so that the second relative position is within a second tolerance range.

12. The imprint method according to claim 9, characterized in that the alignment process includes a process of aligning the substrate and the original so that the second relative position is within a second tolerance range, and if the process is not completed after a predetermined process time has elapsed, the alignment process includes an alignment process of extending the time of the process.

13. An imprinting method as described in claim 9, characterized in that, when adjusting the position of the first alignment mark within the field of view of the detection part, if the position of the first alignment mark within the field of view of the detection part is not within a first tolerance range, a predetermined process time is extended to perform the adjustment.

14. An imprinting method according to any one of claims 9 to 13, characterized in that it includes a step of adjusting a first relative position between the detection unit and the original so that the first alignment mark of the original is within the field of view of the detection unit prior to the step of imprinting.

15. forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 8; a step of processing the substrate on which the pattern is formed in the step; A method for producing an article, comprising the steps of:

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