Conveyor mechanism

Abstract

To provide a transfer mechanism that prevent mist from being attached to a lid and being laminated in a structure that the lid for closing an opening of a cleaning mechanism is provided to the transfer mechanism.SOLUTION: A transfer mechanism (a second transfer mechanism 50) is provided to a processing device having: a holding table that holds workpiece; a processing unit (a first cutting unit and a second cutting unit) that processes the workpiece held by the holding table; a cleaning mechanism 60 that cleans the workpiece to which the processing is applied by the processing unit. The transfer mechanism (the second transfer mechanism 50) transfers the workpiece from the holding table to the cleaning mechanism 60, and comprises: a holding mechanism that holds the workpiece; a cover part 54a that covers an opening 61a of a housing 61 of the cleaning mechanism; a movement unit that integrally moves the holding mechanism and the cover part 54a to the cleaning mechanism 60; and an air injection mechanism 51 that prevents liquid from being adhered onto the cover part 54a by injecting air toward the cover part 54a.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a transport mechanism that is provided in a processing device and that transports a workpiece. [Background technology]

[0002] Conventionally, as disclosed in Patent Document 1, for example, a conveying mechanism of a processing device that conveys a machined workpiece to a cleaning mechanism is known that is provided with a lid for closing the opening of the cleaning mechanism. By providing the conveying mechanism with a lid for closing the opening, it is possible to simplify the device since there is no need to provide a separate lid.

[0003] On the other hand, as disclosed in Patent Document 2, for example, in a processing device that generally performs cutting processing, a processing fluid is continuously supplied during processing in order to cool the cutting blade and the workpiece and to wash away processing waste. Pure water is widely used as the processing fluid, and processing fluids containing surfactants, glycerin, etc. are also used. The processing fluid supplied to the cutting blade rotating at high speed becomes a mist and is scattered inside the processing device.

[0004] Patent Document 2 discloses a technology for discharging the scattered mist to the outside of the cutting device through an exhaust duct, since if the mist adheres to components inside the processing device, it can lead to rust or breakdown of electronic devices. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-159823 A Summary of the Invention [Problem to be solved by the invention]

[0006] When a lid for closing the opening of the cleaning mechanism is provided on the transport mechanism as disclosed in Patent Document 1, there is a concern that scattered mist may adhere to the back side of the lid.

[0007] Even with the technology of Patent Document 2, there is a concern that mist may remain inside the processing equipment and adhere to the underside of the lid in cases where, for example, a type of processing fluid that does not evaporate easily is used, or where the mist is not sufficiently sucked in due to the performance of the suction source connected to the exhaust duct.

[0008] If mist adheres to and accumulates on the underside of the lid, the deposits may fall off as the equipment moves within the processing device, causing rust on other components, or the deposits may fall onto the workpieces and contaminate them.

[0009] The present invention has been made in view of the above, and proposes a novel technique for preventing adhesion and accumulation of mist on a lid that closes an opening of a cleaning mechanism in a configuration in which the transport mechanism is provided with the lid. [Means for solving the problem]

[0010] The problem to be solved by the present invention has been described above, and the means for solving this problem will now be described.

[0011] According to one aspect of the present invention, A conveying mechanism provided in a processing device including a holding table for holding a workpiece, a processing unit for processing the workpiece held by the holding table, and a cleaning mechanism for cleaning the workpiece processed by the processing unit, the cleaning mechanism includes a cleaning table that holds the workpiece, a cleaning nozzle that supplies cleaning liquid to the workpiece held by the cleaning table, and a housing that has an opening that allows the workpiece to be inserted and removed and that houses the cleaning table and the cleaning nozzle; the transport mechanism transports the work from the holding table to the cleaning mechanism; A holding part for holding the workpiece; a cover portion for covering the opening of the housing of the cleaning mechanism; a moving unit that moves the holder and the cover together relative to the cleaning mechanism; and a gas injection mechanism that injects gas toward the cover portion to prevent liquid from adhering to the cover portion.

[0012] According to another aspect of the present invention, The gas injection mechanism includes: In a state in which the opening of the housing is closed by the cover portion, Gas is injected toward the inside of the cover portion. Effect of the Invention

[0013] According to one embodiment of the present invention, by providing a gas injection mechanism, it is possible to prevent mist from adhering to or accumulating on the cover portion, and it is possible to prevent the mist from accumulating and falling, causing rust on other components, or to prevent deposits from falling onto the workpiece and contaminating the workpiece.

[0014] Furthermore, according to one embodiment of the present invention, by injecting gas while the opening of the housing is closed with the cover portion, it is possible to cause the mist deposits to fall into the housing of the cleaning mechanism and be captured. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a diagram showing one side of an embodiment of a processing device. [Diagram 2] FIG. 4 is a diagram showing the other side of the embodiment of the processing device. [Diagram 3] FIG. 4 is an enlarged view showing a first conveying mechanism and a second conveying mechanism. [Figure 4] FIG. 4 is a perspective view illustrating a configuration of a cleaning mechanism. [Diagram 5] FIG. 4 is a side cross-sectional view illustrating the configuration of a cleaning mechanism and a second transfer mechanism. [Figure 6] 1A is a perspective view illustrating a gas injection mechanism, and FIG. 1B is a perspective view illustrating a gas injection mechanism. [Figure 7] FIG. 13 is a side cross-sectional view illustrating a state in which the cleaning mechanism is closed by a cover portion. [Figure 8]10A is a perspective view illustrating another embodiment of the gas injection mechanism, and FIG. 10B is a perspective view illustrating an embodiment in which the gas injection mechanism is disposed on the outside of the cover portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Figures 1 and 2 are perspective views of the appearance of a processing device 2 to which the present invention is applied.

[0017] As shown in FIGS. 1 and 2, the mechanical section of the processing device 2 is housed in an exterior cover 4 formed by combining a plurality of panels.

[0018] The processing device 2 has a holding table 6 that holds a workpiece. The holding table 6 is provided so as to be rotatable in the θ direction about the Z axis by a rotation drive mechanism (not shown) provided below the holding table 6. The holding table 6 is also configured so as to be movable in the X axis direction, which is the processing feed direction, by a processing feed mechanism (not shown) provided below the holding table 6. A clamp mechanism 7 that clamps the annular frame F of the wafer unit U is provided around the holding table 6.

[0019] The processing device 2 has a first cutting unit 10 and a second cutting unit 20 which are processing units that process the workpiece held by the holding table 6. The first cutting unit 10 and the second cutting unit 20 are arranged opposite to each other in the Y-axis direction to form an opposed cutting mechanism, and the processing device 2 is configured as a dual dicer. The first cutting unit 10 and the second cutting unit 20 are arranged to be movable in the Y-axis direction as well as in the Z-axis direction. Note that the present invention is also applicable to a configuration having only one cutting unit as a processing unit.

[0020] The first cutting unit 10 and the second cutting unit 20 are each composed of a spindle that is rotated by a motor, a cutting blade fixed to the tip of the spindle, and a machining fluid nozzle for supplying machining fluid to the machining point by the cutting blade during machining, and perform cutting processing along the planned division line set on the workpiece.

[0021] The processing device 2 has a cassette mounting stage 14 on which a cassette 13 containing a plurality of wafers W is mounted. The cassette mounting stage 14 is configured to be movable in the vertical direction (Z-axis direction).

[0022] A wafer unit U, which is a workpiece accommodated in the cassette 13, is configured to include a wafer W, a tape T to which the wafer W is attached, and an annular frame F attached to the tape T so as to surround the wafer W. The wafer W may be a semiconductor wafer, an optical device wafer, or the like, and is not particularly limited.

[0023] The processing device 2 has a first transport mechanism 40 including a clamp mechanism 42 and a holding mechanism 44 mounted on an L-shaped lower arm 45. The clamp mechanism 42 is for gripping the frame F of the wafer unit U and for transporting the wafer unit U in and out between the cassette 13 and the guide rail 12. The holding mechanism 44 is for moving the unprocessed wafer unit U on the guide rail 12 onto the holding table 6, and for moving the cleaned wafer unit U in the cleaning mechanism 60 onto the guide rail 12.

[0024] The processing device 2 has a second transfer mechanism 50 having a holding mechanism 54 attached to an L-shaped upper arm 55. The holding mechanism 54 is for moving the processed wafer unit U on the holding table 6 to a cleaning mechanism 60.

[0025] The processing device 2 has a touch panel type display monitor 8. An operator can input operation commands for the device through the display monitor 8, and the operating status of the device is also displayed on the display monitor 8.

[0026] The processing device 2 includes a controller 80 for automatically controlling the various devices described above. Under the control of the controller 80, the wafer unit U accommodated in the cassette 13 is gripped by the clamp mechanism 42 of the first transport mechanism 40 and carried onto the guide rail 12, and is then held by the holding mechanism 44 of the first transport mechanism 40 and carried onto the holding table 6. The wafer unit U held by the holding table 6 is cut by the first cutting unit 10 and the second cutting unit 20 while a machining fluid is supplied from a machining fluid nozzle (not shown).

[0027] After cutting, the wafer unit U is held by the holding mechanism 54 of the second transfer mechanism 50, moved to the cleaning mechanism 60, and cleaned. Thereafter, the wafer unit U is held by the holding mechanism 44 of the first transfer mechanism 40, moved onto the guide rail 12, and then gripped by the clamp mechanism 42 of the first transfer mechanism 40 and carried out to the cassette 13.

[0028] FIG. 3 is an enlarged view showing the first conveying mechanism 40 and the second conveying mechanism 50. As shown in FIG. The first conveying mechanism 40 is configured to include a clamping mechanism 42 and a holding mechanism 44 .

[0029] The clamp mechanism 42 of the first conveying mechanism 40 is provided on a lower horizontal portion of a substantially L-shaped lower arm 45 that moves in the Y-axis direction and the Z-axis direction. A vertical portion of the lower arm 45 is connected via a lifting mechanism 48 to a first moving part 47 that moves in the Y-axis direction on the front surface 4a of the exterior cover 4.

[0030] The first moving part 47 is moved in the Y-axis direction by a first Y-axis direction moving mechanism 46. The first Y-axis direction moving mechanism 46 is configured to include a ball screw 46a extending in the horizontal direction, a pulse motor 46b that drives the ball screw 46a, and a pair of guide rails 46c, 46c extending in the horizontal direction above and below the ball screw 46a.

[0031] A holding mechanism 44 that holds the wafer unit U (FIG. 1) when the wafer unit U (FIG. 1) is moved between the guide rail 12 and the holding table 6 is provided on the horizontal portion of the lower arm 45.

[0032] The holding mechanism 44 is configured to have a disk-shaped cover part 44a, two arm parts 44b arranged below the cover part 44a, and holding parts 44c provided on both ends of the arm part 44b. The holding parts 44c are arranged in a total of four places, are connected to a suction source (not shown), and hold by suction the annular frame F (FIG. 1) of the wafer unit U (FIG. 1).

[0033] The second conveying mechanism 50 is provided so as to be shifted in height from the first conveying mechanism 40. The second conveying mechanism 50 is configured to include a holding mechanism .

[0034] The holding mechanism 54 of the second transfer mechanism 50 is provided on a lower horizontal portion of a substantially L-shaped upper arm 55 that moves in the Y-axis direction and the Z-axis direction. A vertical portion of the upper arm 55 is connected via a lifting mechanism 58 to a second moving unit 57 that moves in the Y-axis direction on the front surface 4a of the exterior cover 4.

[0035] The second moving part 57 is moved in the Y-axis direction by a second Y-axis direction moving mechanism 56. The second Y-axis direction moving mechanism 56 is configured to include a ball screw 56a extending in the horizontal direction, a pulse motor 56b that drives the ball screw 56a, and a pair of guide rails 56c, 56c extending in the horizontal direction above and below the ball screw 56a.

[0036] A holding mechanism 54 that holds the wafer unit U (FIG. 1) when the wafer unit U is moved between the holding table 6 and the cleaning mechanism 60 is provided on the horizontal portion of the upper arm 55.

[0037] The holding mechanism 54 is configured to have a disk-shaped cover portion 54a, two arm portions 54b arranged below the cover portion 54a, and holding portions 54c provided on both ends of the arm portion 54b. The holding portions 54c are arranged in a total of four places, are connected to a suction source (not shown), and hold by suction the annular frame F (FIG. 1) of the wafer unit U (FIG. 1).

[0038] In the above-described second conveying mechanism 50, a moving unit is configured to integrally move the holder 54c and the cover 54a relative to the cleaning mechanism 60. In this embodiment, the moving unit includes an upper arm 55, a lifting mechanism 58, a second moving part 57, and a second Y-axis direction moving mechanism 56.

[0039] 4 and 5 are diagrams showing the configuration of the cleaning mechanism. The cleaning mechanism 60 is for cleaning the workpiece that has been machined by the first cutting unit 10 and the second cutting unit 20, which are the machining units.

[0040] The cleaning mechanism 60 is configured to include a cleaning table 62 that holds the wafer unit U, a cleaning nozzle 63 that supplies a cleaning liquid to the wafer unit U held by the cleaning table 62, and a housing 61 that has an opening 61a that allows the wafer unit U to be inserted and removed and that houses the cleaning table 62 and the cleaning nozzle 62. This opening 61a is opened and closed by a cover portion 54a of the second transfer mechanism 50 (FIG. 5).

[0041] The upper surface of the cleaning table 62 is composed of a circular suction holding surface 62a. The cleaning table 62 is rotated by a rotation drive mechanism 62b. A plurality of clamps 62c that detachably hold the annular frame F of the wafer unit U (FIG. 5) are disposed at equal intervals on the outer periphery of the suction holding surface 62a of the cleaning table 62. These clamps 62c operate to press down on the annular frame F from above when the cleaning table 62 rotates and centrifugal force is generated.

[0042] The cleaning table 62 is raised and lowered between a unit transfer position near the height of the opening 61a of the housing 61 and a cleaning position at the bottom inside the housing 61 by a lifting mechanism such as an air cylinder (not shown).

[0043] The cleaning nozzle 63 is supported so as to be horizontally rotatable on a nozzle base 66 disposed between the cleaning table 62 and the inner surface of the housing 61. A cleaning liquid for cleaning is sprayed from the cleaning nozzle 63. The cleaning liquid used is, for example, pure water.

[0044] In addition, a drying nozzle 64 is provided in parallel with the cleaning nozzle 63. Dry air for air blowing is sprayed from the drying nozzle 64.

[0045] Furthermore, in addition to the two nozzles described above, the cleaning mechanism 60 may be provided with, for example, a nozzle for supplying a protective film agent for forming a protective film layer on the surface of the wafer W (FIG. 1).

[0046] 6A and 6B are diagrams showing the configuration of the gas injection mechanism 51 of the second conveyance mechanism 50. As shown in FIG. The gas jetting mechanism 51 jets gas toward the cover portion 54a to prevent liquid from adhering to the cover portion 54a. The gas used is, for example, dry air.

[0047] 6(A), in this embodiment, the cover portion 54a is fixed to a horizontal portion 55a of an upper arm 55, and two nozzles 51a connected to an air supply source (not shown) are provided at the tip of the horizontal portion 55a. The gas injection mechanism 51 is composed of the nozzles 51a.

[0048] The cover portion 54a is configured to have a disk-shaped flat plate portion 54d and a peripheral wall portion 54e that is suspended downward from the outer periphery of the flat plate portion 54d, and the gas injected from each nozzle 51a is injected toward the inside of the peripheral wall portion 54e. The gas that hits the peripheral wall portion 54e flows along the inside of the peripheral wall portion 54e, and this flow of gas forms an air curtain.

[0049] 7, when the wafer unit U is cleaned and dried in the cleaning mechanism 60, the opening 61a of the cleaning mechanism 60 is closed by the cover portion 54a of the second transfer mechanism 50, and the cleaning table 62 is rotated while a cleaning liquid and dry air are supplied to the wafer unit U. At this time, the cleaning liquid scatters as mist inside the housing 61.

[0050] In such a situation where the mist scatters, an air curtain is formed inside the cover portion 54a by the gas injection mechanism 51. This makes it possible to prevent the mist from adhering to the underside of the flat plate portion 54d of the cover portion 54a and the inside of the peripheral wall portion 54e. It is also possible to prevent the mist from adhering to the arm portion 54b and the holding portion 54c that are disposed inside the cover portion 54a and that hold the wafer unit U.

[0051] Furthermore, as shown in FIG. 6(B), for example, after cleaning or drying, mist that has adhered to the cover portion 54a, the arm portion 54b, etc. can be removed by causing it to fall into the housing 61 by blowing air using the gas injection mechanism 51.

[0052] 6(B), not only the mist generated by the cleaning mechanism 60, but also the machining fluid used during cutting in the first cutting unit 10 (FIG. 1) or the second cutting unit 20 (FIG. 1) may become mist and adhere to the cover part 54a, the arm part 54b, etc., and the mist can be removed by blowing air with the gas injection mechanism 51, thereby preventing the mist from accumulating and falling off. For example, it is possible to periodically move the second conveying mechanism 50 above the cleaning mechanism 60 and blow air to drop the accumulated matter into the housing 61.

[0053] 8(A) is a diagram showing another embodiment of the gas injection mechanism 51A provided in the second conveying mechanism 50. In this gas injection mechanism 51A, a circular tube member 51n is provided inside the cover portion 54a, and nozzles 51m are provided at multiple positions on the tube member 51n.

[0054] The gas injection mechanism 51A may inject dry air from a plurality of points in the circumferential direction to form an air curtain inside the cover portion 54a. This embodiment is particularly suitable for a configuration in which the cover portion 54a does not have the peripheral wall portion 54e.

[0055] 8(B) is a diagram showing another embodiment of the gas injection mechanism 51B provided in the second conveying mechanism 50. This gas injection mechanism 51B is configured to include a nozzle 51x for supplying dry air toward the outside of the cover portion 54a.

[0056] By using this type of gas injection mechanism 51B to inject dry air onto the outer surface of the cover portion 54a, the mist of cleaning liquid and processing liquid adhering to the outer surface of the cover portion 54a can be removed by air blowing, preventing these from accumulating and falling off.

[0057] The gas injection mechanisms described above may be implemented alone or in combination. In addition, they may be provided only on the cover portion 54a of the second conveying mechanism 50, or may be provided on the cover portion 44a of the first conveying mechanism 40 (FIG. 3).

[0058] As described above, by providing the gas injection mechanism 51 on the cover portion 54a of the second conveying mechanism 50 that closes the opening 61a of the cleaning mechanism 60, as shown in Figures 6(A) and (B), it is possible to prevent mist from adhering to or accumulating on the cover portion 54a, and to prevent the mist from accumulating and falling, causing rust on other components, or from deposits falling onto the workpiece and contaminating the workpiece.

[0059] Furthermore, as shown in Figures 6(B) and 7, by injecting gas while the opening 61a of the housing 61 is closed by the cover portion 54a, the mist deposits can be caused to fall into the housing 61 of the cleaning mechanism 60 and captured. [Explanation of symbols]

[0060] 2 Processing equipment 6 Holding table 10 First cutting unit 20 Second cutting unit 40 First conveying mechanism 42 Clamping mechanism 44 Retention mechanism 44a Cover part 44b Arm section 44c Adsorption part 45 Lower Arm 46 First Y-axis direction movement mechanism 50 Second conveying mechanism 51 Gas injection mechanism 51a Nozzle 54 Retention mechanism 54a Cover part 54b Arm section 54c Adsorption part 54d Flat plate part 54e Peripheral wall part 55 Upper Arm 56 Second Y-axis direction movement mechanism 60 Cleaning mechanism 61 Case 61a aperture 62 Cleaning Table 62a Suction holding surface 63 Cleaning nozzle 64 Drying nozzle

Claims

1. A conveying mechanism provided in a processing device including a holding table for holding a workpiece, a processing unit for processing the workpiece held by the holding table, and a cleaning mechanism for cleaning the workpiece processed by the processing unit, the cleaning mechanism includes a cleaning table that holds the workpiece, a cleaning nozzle that supplies cleaning liquid to the workpiece held by the cleaning table, and a housing that has an opening that allows the workpiece to be inserted and removed and that houses the cleaning table and the cleaning nozzle; the transport mechanism transports the work from the holding table to the cleaning mechanism; A holding part for holding the workpiece; a cover portion for covering the opening of the housing of the cleaning mechanism; a moving unit that moves the holder and the cover together relative to the cleaning mechanism; and a gas injection mechanism that injects gas toward the cover portion to prevent liquid from adhering to the cover portion.

2. The gas injection mechanism includes: In a state in which the opening of the housing is closed by the cover portion, A gas is injected toward the inside of the cover portion.

2. The transport mechanism according to claim 1.

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