Power storage device

Abstract

A method for an electrical storage device includes providing a first stack and a second stack for a storage device on a substrate with a groove therebetween. Each of the first stack and the second stack includes a first electrode layer on the substrate, an electrolyte layer on the first electrode layer, and a second electrode layer on the electrolyte layer, respectively. A first material is deposited in the groove, and a second material is deposited on the first stack, the first material, and the second stack to electrically connect the first stack, the first material, and the second electrode layer of the second stack via the second material. The first material prevents the second material from contacting the first electrode layer of the first stack and the second stack and the electrolyte layer of the first stack and the second stack, thereby electrically insulating the first electrode layer of the first stack and the second stack and the electrolyte layer of the first stack and the second stack from the second material.

Description

[Technical field]

[0001] The present invention relates to power storage devices, and more particularly, but not by way of limitation, to methods and apparatus for manufacturing power storage devices. [Background technology]

[0002] A known method for manufacturing electrical storage devices such as solid-state thin-film cells comprising layers of electrodes, electrolytes and current collectors is to form a stack on a substrate. The stack comprises a first electrode layer, an electrolyte layer and a second electrode layer. The stack is then divided to form individual cells. To connect the cells together, the electrode layers of a number of stacked cells are electrically connected to each other.

[0003] Known methods for manufacturing electrical storage devices can be complex and / or difficult to control. It would therefore be desirable to provide a method for manufacturing electrical storage devices that is simpler than the known methods. Summary of the Invention [Means for solving the problem]

[0004] According to a first aspect of the present invention there is provided a method comprising: providing a first stack for the storage device on a substrate and a second stack for the storage device across a groove, Each of the first stack and the second stack comprises: a first electrode layer on a substrate; an electrolyte layer on the first electrode layer; a second electrode layer on the electrolyte layer; depositing a first material in the trench; depositing a second material over the first stack, the first material, and the second stack, electrically connecting a second electrode layer of the first stack to a second electrode layer of the second stack via the second material; The first material prevents the second material from contacting the first electrode layers of the first and second stacks and the electrolyte layers of the first and second stacks, thereby electrically insulating the first electrode layers of the first and second stacks and the electrolyte layers of the first and second stacks from the second material.

[0005] The step of depositing the second material on the first stack, the first material and the second stack can increase the contact area between the second material and the first electrode layer of the first stack and the second stack. This generally reduces the contact resistance and improves the performance of the produced energy storage device. For example, reducing the contact resistance can reduce the risk of the energy storage device failing and / or reduce undesired heating of the energy storage device. This in turn can improve the safety of the energy storage device.

[0006] The method of the first aspect can be used to reduce manufacturing tolerances compared to other approaches involving precise deposition of very specific amounts of material. For example, compared to alternative approaches that deposit small amounts of conductive material into narrow channels to form connections to current collector layers, the method of the first aspect does not require as precise control to properly connect between the second material and the first and second stacks of first electrode layers. This allows the storage device to be manufactured more simply and / or efficiently than otherwise.

[0007] In an embodiment, the groove is a first groove, and the method includes forming a second groove through the first material and depositing a second material in the second groove. The second material deposited in the second groove can provide a larger contact area for connecting the second material to an additional electrical component, such as an electrical connector for connecting multiple cells in parallel. For example, an electrical connector can be formed to contact the length of the second material deposited in the second groove, which generally provides a larger contact area between the electrical connector and the second material than if the electrical connector simply contacted the edge of the layer of the second material. This can further reduce contact resistance and improve performance of the produced energy storage device.

[0008] In an embodiment, depositing the second material includes depositing the second material using a non-inkjet printing method. This allows the second material to be deposited using a simpler method than inkjet printing, for example a deposition process such as flood deposition or physical vapor deposition (PVD). In PVD, the second material in a condensed phase is evaporated to produce a vapor, which is then condensed on the first stack, the first material, and the second stack, whereas in flood deposition, the surfaces of the first stack, the first material, and the second stack are flooded with the liquid second material, which is then cured, for example, by curing. Such a method may be performed without the need to control the deposition of the second material according to a specific pattern or at a specific location. This allows the second material to be deposited simply and efficiently.

[0009] In an embodiment, depositing the first material includes depositing the first material in a non-vacuum environment, and depositing the second material includes depositing the second material in a vacuum. For example, the first material may be deposited by inkjet printing the first material in the grooves at non-vacuum conditions, such as room temperature and / or room pressure. The non-vacuum environment may be at least one of an inert environment or a dry room environment to reduce undesirable interactions between reactive components and / or water in the surrounding environment. In some cases, the first electrode layer, electrolyte layer, and second electrode layer of the first and second stacks are deposited in a vacuum, and then the first material is deposited in a non-vacuum condition before returning to a vacuum condition to deposit the second material. Even if the environmental pressure changes during the deposition process, the electrical connections between the various components of the power storage device manufactured according to these embodiments are still sufficient to effectively operate the power storage device. Indeed, this method makes it possible to increase the contact area between the second material and the first and second electrode layers of the first and second stacks, which generally improves the performance of the energy storage device.

[0010] It should be noted that choosing when to change environmental conditions, such as temperature or pressure, during the manufacturing process is highly non-obvious. For example, going from vacuum to non-vacuum conditions during the deposition of the various layers of the first or second stack may result in undesirable reactions between these layers and the surrounding environment, leading to undesirable oxidation of at least one of these layers. Nevertheless, the inventors have surprisingly determined that going from vacuum to non-vacuum conditions after the deposition of the second electrode layer to deposit the first material does not unduly affect the performance of the manufactured energy storage device, particularly by increasing the contact area between the second electrode layer and the subsequently deposited second material.

[0011] In embodiments, the method includes depositing the first material in the groove after depositing a first layer of the second material on the first stack and the second stack, and then depositing the second material as a second layer of the second material on the first stack, the first material, and the second stack. The first layer of the second material protects the underlying second electrode layer, for example, during deposition of the first material, reducing the risk of potential contamination of the second electrode layer or undesired reactions with the second electrode layer. This may improve the electrical connection between the second electrode layer and the second material (through the first layer of the second material) and improve the functionality of the manufactured power storage device. In these embodiments, depositing the first layer of the second material may include depositing the first layer of the second material in a vacuum, and depositing the first material may include depositing the first material in a non-vacuum environment. Changing the environmental conditions from vacuum to non-vacuum conditions may cause degradation of the surfaces of the first and / or second laminate exposed to the non-vacuum conditions. However, the first layer of the second material may be less sensitive to exposure to a non-vacuum environment (during deposition of the first material) than the underlying second electrode layer. For example, the second electrode layer may include lithium ions, which are more reactive and therefore more likely to react with molecules in a non-vacuum environment, whereas the second material may include copper, which is less reactive. In other cases, the second material may include another conductive material that is less reactive than the second electrode layer. In this way, the electrical connection between the first and second layers of the second material may be improved (e.g., degradation and / or contact resistance is reduced) compared to the electrical connection between the second electrode layer and the second material when the second electrode layer is exposed to non-vacuum conditions.

[0012] In an embodiment, the first stack is on a first portion of the substrate, the second stack is on a second portion of the substrate, and the step of depositing the second material includes depositing a portion of the second material on a third portion of the substrate between the first and second portions of the substrate. The portion of the second material on the third portion of the substrate provides a larger surface area of ​​the second material for subsequent connection to further electrical components, such as, for example, electrical connectors. This can reduce contact resistance and therefore improve performance of the manufactured electrical storage device.

[0013] In an embodiment, each of the first stack and the second stack comprises a first surface on the substrate and a second surface opposite the first surface. In such an embodiment, depositing the second material on the first stack, the first material, and the second stack may include depositing the second material to cover substantially all of the second surface of at least one of the first stack or the second stack. This provides a larger contact area between the second material and the second electrode layers of the first stack and the second stack, further reducing the contact resistance and improving the performance of the manufactured energy storage device.

[0014] In embodiments, the method includes depositing a composite laminate comprising a first laminate and a second laminate, and forming a groove through the composite laminate to form the first and second laminates with the groove between them. This simplifies the formation of the groove compared to forming a groove through a first electrode layer, then depositing an electrolyte layer, extending the groove through the electrolyte layer, then depositing a second electrode layer, and extending the groove through the second electrode layer. In these embodiments, the width of the groove may be substantially constant through the composite laminate. This simplifies the formation of the groove compared to other cases where the groove has a stepped profile and varies in width through the composite laminate (e.g., the width of a portion of the groove through the first electrode layer is smaller than the width of a portion of the groove through the electrolyte layer, which in turn is smaller than the width of a portion of the groove through the second electrode layer).

[0015] In an embodiment, the second electrode layer comprises lithium. The second material may comprise copper. These materials are suitable for forming an effective power storage device.

[0016] In an embodiment, the method includes, after the step of depositing the second material, separating the first portion of the substrate on which the first stack is disposed from the second portion of the substrate on which the second stack is disposed, the separating step including cutting the second material in the groove. In this way, the first cell and the second cell (each comprising the first stack and the second stack) can be isolated from each other, and the first cell and the second cell can be stacked on each other and connected together and / or to further electrical components, such as electrical connectors. By depositing the second material before isolating the cells, the method is more efficient than other methods, since the second material can be deposited for multiple cells in a single processing step, instead of depositing the second material individually on the stack of each individual cell.

[0017] In some embodiments, the method includes forming a further groove through the first stack after the step of depositing the second material to expose the first electrode layer of the first stack in the further groove. The exposed first electrode layer can be connected to another electrical component, such as an exposed first electrode layer of another stack, to connect the cells in parallel. By exposing the first electrode layer after depositing the second material, the first electrode layer remains protected by the electrolyte layer and the second electrode layer during the previous processing steps. This can reduce undesirable reactions between the first electrode layer and other components that may occur if the first electrode layer is exposed too early in the processing method. This in turn can improve the performance of the manufactured energy storage device by reducing degradation of the first electrode layer. In some of these embodiments, the method includes forming a further groove through the first stack and through the substrate. In this manner, the first electrode layer can be exposed while isolating the cell comprising the first stack from adjacent cells. This improves efficiency compared to methods in which the steps of exposing the first electrode layer and isolating the cell are performed separately.

[0018] According to a second aspect of the present invention, there is provided an electrical storage device formed by the method according to the first aspect of the present invention. Such an electrical storage device may have improved performance due to reduced contact resistance between the second electrode layer and the second material as described with reference to the first aspect. Additionally or alternatively, such an electrical storage device may be manufactured in an efficient and simple manner.

[0019] According to a third aspect of the present invention, there is provided an intermediate structure for an electrical storage device, the intermediate structure comprising: A substrate; a first stack for a power storage device on a substrate; a second stack for the storage device on the substrate; a first material between the first laminate and the second laminate; a second material; Each of the first stack and the second stack comprises: a first electrode layer on a substrate; an electrolyte layer on the first electrode layer; a second electrode layer on the electrolyte layer; a second material overlies the first stack, the first material, and the second stack, electrically connecting the second electrode layer of the first stack to the second electrode layer of the second stack via the second material; The first material prevents the second material from contacting the first electrode layers of the first stack and the second stack and the electrolyte layers of the first stack and the second stack, thereby electrically insulating the first electrode layers of the first stack and the second stack and the electrolyte layers of the first stack and the second stack from the second material.

[0020] A third aspect relates to an intermediate structure for an electrical storage device, which may be manufactured more simply or efficiently. For example, the intermediate structure may be manufactured using a method according to the first aspect of the invention. An electrical storage device manufactured using the intermediate structure of the third aspect may exhibit improved performance compared to an electrical storage device manufactured by a different method.

[0021] In an embodiment, the first laminate is on a first portion of the substrate, the second laminate is on a second portion of the substrate, and a portion of the second material is on a third portion of the substrate between the first portion of the substrate and the second portion of the substrate. The portion of the second material on the third portion of the substrate provides a larger surface area for connecting the second material to additional electrical components, which can reduce contact resistance and improve performance of the manufactured electrical storage device.

[0022] In embodiments, each of the first and second stacks comprises a first surface on the substrate and a second surface opposite the first surface, and the second material overlies substantially all of the second surface of at least one of the first or second stacks. The contact area between the second material and the second electrode layers of the first and second stacks in these embodiments is greater than if the second material overlies less of the second surface of the first and / or second stacks. This reduces the contact resistance and improves the performance of the energy storage device manufactured using the intermediate structure.

[0023] Further configurations will become apparent from the following description, given by way of example only, and with reference to the accompanying drawings. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a schematic diagram showing a stack for a power storage device according to an embodiment. [Diagram 2] 2A to 2G are schematic diagrams showing the configuration of a method for manufacturing an electricity storage device according to an embodiment. [Diagram 3] FIG. 3 is a schematic diagram showing an intermediate structure for producing an electricity storage device according to a further embodiment. [Figure 4] 4A to 4E are schematic diagrams showing the configuration of a method for manufacturing an electricity storage device according to a further embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Details of the method, structure and device according to the embodiment will become apparent from the following description with reference to the drawings. For the purpose of explanation, numerous specific details of specific embodiments are described herein. Reference to "embodiment" or similar terms herein means that a particular configuration, structure or feature described in connection with an embodiment is included in at least one of the embodiments, but not necessarily in other embodiments. Furthermore, it should be noted that a particular embodiment is generally described with certain configurations omitted and / or necessarily simplified in order to facilitate the explanation and understanding of the concepts underlying the embodiment.

[0026] Figure 1 shows a stack of layers for an electrical storage device 100. The stack 100 of Figure 1 can be used as part of a thin film electrical storage device, for example with a solid electrolyte.

[0027] The stack 100 includes a substrate 102, a cathode current collector (CC) layer 104, a cathode layer 106, an electrolyte layer 108, and an anode layer 110. In the embodiment of FIG. 1, the anode layer 110 is located further from the substrate 102 than the cathode layer 106, and the electrolyte layer 108 is between the cathode layer 106 and the anode layer 110. The substrate 102 contacts the cathode CC layer 104 and supports the stack 100. In this embodiment, the substrate 102 directly contacts the cathode CC layer 104, but in other embodiments, there may be an additional layer (not shown) between the substrate 102 and the cathode CC layer 104, or the cathode CC layer may be omitted and the cathode layer 106 may contact the substrate 102. Unless otherwise indicated, in this specification, a reference to one element being "on" another element should be understood to include direct or indirect contact. In other words, an element on another element may be in contact with the other element, or may not be in contact with the other element but may instead be generally supported by an intervening element(s), but may still be positioned above or overlap the other element.

[0028] The substrate 102 in FIG. 1 is a polymer, such as polyethylene terephthalate (PET). In other embodiments, the substrate 102 may be or include a different material, such as silicon or glass. The substrate 102 in FIG. 1 is planar and flexible (in this case, the substrate 102 is flexible enough that it can be wrapped around a roller as part of a roll-to-roll manufacturing process, sometimes referred to as a reel-to-reel process), but in other embodiments, the substrate may be non-planar and / or rigid.

[0029] The positive electrode CC layer 104 acts as a positive current collector layer and in this case comprises nickel foil, although it will be appreciated that any suitable metal may be used instead, such as aluminum, copper or steel, or a metallized material including a metallized plastic such as aluminum on polyethylene terephthalate (PET).

[0030] The positive electrode layer 106 in Figure 1 forms a positive electrode layer (i.e., corresponds to the cathode during discharge of a cell of a power storage device including the stack 100). The positive electrode layer 106 in the embodiment of Figure 1 comprises a material suitable for storing lithium ions through a stable chemical reaction, such as lithium cobalt oxide, lithium iron phosphate, or an alkali metal polysulfide salt.

[0031] 1 forms a negative electrode layer (i.e., corresponds to the anode of a cell of a power storage device including the stack 100 during discharge). In this case, the negative electrode layer 110 includes lithium. However, in other embodiments, the negative electrode layer may include lithium, graphite, silicon, and / or indium tin oxide.

[0032] The electrolyte layer 108 may include any suitable material that is ionically conductive but also electrically insulating, such as lithium phosphorus oxynitride (LiPON). The electrolyte layer 108 of FIG. 1 is a solid layer and may be referred to as a fast ion conductor. A solid electrolyte layer may have a structure intermediate between that of a liquid electrolyte, which lacks regular structure and contains ions that may move freely, and that of a crystalline solid. A crystalline material has a regular structure, for example, with atoms arranged in a regular order, which may be arranged as a two- or three-dimensional lattice. The ions of a crystalline material are generally immobile and therefore may not be able to move freely throughout the material.

[0033] The stack 100 of Fig. 1 is manufactured by depositing a positive CC layer 104 on a substrate 102. Then, a positive electrode layer 106 is deposited on the positive CC layer 104, then an electrolyte layer 108 is deposited on the positive electrode layer 106, and then an anode layer 110 is deposited on the electrolyte layer 108. Each layer of the stack 100 may be deposited by flood deposition (sometimes called slot die coating or slit coating), which offers a simple and effective method of producing highly homogeneous layers, although other deposition methods are also possible, such as deposition processes such as physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0034] In the embodiments herein, a stack similar to or the same as stack 100 in Fig. 1 undergoes a process for manufacturing an energy storage device. Figs. 2A-2G are schematic diagrams showing components of a method for manufacturing an energy storage device according to an embodiment. Components in Figs. 2A-2G that are similar to corresponding components in Fig. 1 are given the same reference numerals, but incremented by 100. Corresponding descriptions shall apply.

[0035] Prior to Figure 2A, a number of layers have been deposited on a substrate 200. The layers in this case may include the same layers and be fabricated in the same manner as the layers of the stack 100 of Figure 1.

[0036] FIG. 2A illustrates providing a first stack 200a on a substrate 202 and forming a groove 212 through multiple layers to provide a second stack 200b on the substrate 202. The groove is, for example, a channel, slot, or trench, which may be continuous or non-continuous. In some embodiments, such as the embodiment of FIG. 2A, the groove is elongated. In FIG. 2A, the groove is elongated in the direction into and out of the page (as shown in FIG. 2A), forming an elongated trench through multiple layers.

[0037] The layers in which the groove 212 is formed may be considered to be a composite laminate comprising a first laminate 200a and a second laminate 200b. The first laminate 200a comprises a first electrode layer 206a on a substrate 202, an electrolyte layer 208a on the first electrode layer 206a, and a second electrode layer 210a on the electrolyte layer 208a. The second laminate 200b similarly comprises a first electrode layer 206b on a substrate 202, an electrolyte layer 208b on the first electrode layer 206b, and a second electrode layer 210b on the electrolyte layer 208b. The first electrode layers 206a, 206b in this case are positive electrode layers, such as the positive electrode layer 106 in FIG. 1, and comprise a material suitable for storing lithium ions. The second electrode layers 210a, 210b are negative electrode layers, such as the negative electrode layer 110 in FIG. 1, and comprise lithium. However, this is only one example. The first stack 200a and the second stack 200b in the embodiment of FIG. 2A further include current collector (CC) layers 204a, 204b, which are positive CC layers like the positive CC layer 104 in FIG. 1. However, the CC layers 204a, 204b may be omitted from the method described with reference to FIG. 2A and 2g. In such a case, the substrate 202 may be metallized or may include a conductive surface layer, or the first electrode layers 206a, 206b may perform both the electrode and current collection functions.

[0038] The layers of FIG. 2A may be deposited under vacuum conditions. It should be understood that vacuum as referred to herein does not necessarily refer to a complete vacuum, but instead refers to an environment in which the pressure is sufficiently lower than atmospheric pressure to reduce undesirable interactions between the deposited layers and environmental molecules. Depositing the layers of FIG. 2A under vacuum conditions may limit or avoid interactions between the layers and the environment that may degrade the layers. For example, as described above, the second electrode layers 210a, 210b of FIG. 2A include highly reactive lithium ions. Thus, depositing the second electrode layers 210a, 210b in a vacuum reduces undesirable reactions between the second electrode layers 210a, 210b and molecules in the surrounding environment.

[0039] The embodiment of FIG. 2A includes laser ablation of a layer to form the groove 212 of FIG. 2A to provide the first stack 200a and the second stack 200b. Laser ablation involves irradiating a layer with a laser beam to remove a portion of the layer by evaporating, sublimating, or converting it to plasma. The amount of layer removed by laser ablation can be controlled by controlling the characteristics of the laser beam, such as the wavelength of the laser beam or the pulse length of a pulsed laser beam. Laser ablation generally allows for simple and rapid control of the formation of the groove 212. However, in other embodiments, the groove 212 may be formed using alternative methods, such as photolithography techniques.

[0040] In FIG. 2A, the width w of the groove 212 is substantially constant throughout the composite laminate (where the composite laminate is laser ablated to separate the first and second laminates 200a and 200b). A width may be considered substantially constant if it is constant or constant within manufacturing tolerances or measurement uncertainties. The width w of the groove 212 is taken in a direction parallel to the plane of the substrate 202 in the embodiment of FIG. 2A. Because the width w of the groove 212 is substantially constant, the cross section of the groove 212 in a plane perpendicular to the plane of the substrate 202 is rectangular. Forming such a shape of the groove 212 is generally easier than forming a groove 212 with a more complicated shape, such as a stepped cross section. Compared to forming a groove with a more complicated shape, laser ablation does not need to be controlled as precisely to form a groove 212 with a substantially constant width w. This allows for easier and / or more efficient formation of the power storage device. However, it should be understood that this is merely an exemplary groove shape. In other cases, the grooves 212 may have a different shape, such as a step-shaped or V-shaped cross-section.

[0041] In FIG. 2B, a first material 214 is deposited in the trench 212. The first material 214 is electrically insulating. An electrically insulating material is considered to be electrically non-conductive and therefore may conduct a relatively small amount of current when exposed to an electric field. In general, an electrically insulating material (sometimes called an insulator) conducts less current than a semiconducting material or a conductive material. However, an insulator may still contain a small amount of charge carriers to carry the current, so that a small amount of current may still flow through the electrically insulating material under the influence of an electric field. In the examples herein, a material may be considered to be electrically insulating if it has sufficient electrical insulation to perform the function of an insulator. This function may be performed, for example, if the material sufficiently insulates one element from another element such that short circuits are avoided.

[0042] The first material 214 in the embodiment of FIG. 2B is deposited using inkjet printing, which allows for precise and accurate deposition of the electrically insulating material 130a. Depositing the first material 214, for example, by inkjet printing, generally allows for flexible, efficient and / or reliable deposition of the first material 214. For example, inkjet printing may be performed at relatively low (e.g., ambient) temperatures and / or pressures, as compared to, for example, thermal spray coating, and therefore allows for economical and / or efficient deposition and thus cell production. Inkjet printing of the first material 214 in the embodiment of FIG. 2B includes inkjet printing the first material 214 in the form of a liquid ink and curing the deposited ink to form a solid layer of the first material 214. A suitable ink for use as the first material 214 is DM-INI-7003, available from Dycotec Materials Ltd., Unit 12 Star West, Westmead Industrial Estate, Westlea, Swindon, SN5 7SW, United Kingdom. The ink is a dielectric ink, which is an electrical insulator that can be polarized, for example, by application of an electric field. The dielectric material also typically has low electrical conductivity and insulates the edges of the first and second stacks 200a, 200b in the grooves 212. However, in other cases, a deposition method other than inkjet printing may be used to deposit the first material. In such cases, the first material may be or include a different material than the dielectric ink.

[0043] In the embodiment of FIG. 2B, the first material 214 is deposited in a non-vacuum environment. A non-vacuum environment is generally an environment that is not held under vacuum, which may have a pressure greater than that in a vacuum environment, for example. For example, the non-vacuum environment may be at atmospheric pressure. Using a non-vacuum environment to deposit the first material 214 simplifies the deposition process by relaxing environmental constraints. Despite the non-vacuum environment, the first material 214 (and / or the exposed surfaces of the first stack 200a and the second stack 200b) may not be adversely affected by interactions with molecules in the surrounding environment. This allows the first material 214 to be easily deposited without unduly affecting the performance of the produced power storage device.

[0044] In Fig. 2, the non-vacuum environment is an inert environment and thus includes at least one inert gas, such as argon. An inert environment is generally considered to be non-reactive and generally lacks reactive materials or includes a sufficiently low concentration of reactive materials (e.g., compared to the inert material) that the reaction between the environment and the first and second stacks 200a and 200b and / or the first material 214 is sufficiently low. The performance of the manufactured electrical storage device is not affected or is not significantly affected by such reactions. This further improves the quality of the manufactured electrical storage device.

[0045] In addition to or instead of being an inert environment, the non-vacuum environment may be a dry room environment. A dry room environment generally refers to an environment with relatively low humidity compared to atmospheric humidity. As an example, the dry room environment may have a temperature of 20° C. to 40° C. and a humidity of less than 1%. This can further reduce undesirable interactions between the first stack 200a, the second stack 200b and / or the first material 214 and the surrounding environment.

[0046] In FIG. 2B, the first stack 200a is disposed on the first portion 202a of the substrate 202, and the second stack 200b is disposed on the second portion 202b of the substrate 202. Between the first portion 202a and the second portion 202b is the third portion 202c of the substrate 202. The first material 214 is deposited on the third portion 202c of the substrate 202 to form a plug that fills the previously formed trench 212. The first material 214 covers the exposed edges of the CC layers 204a, 204b, the first electrode layers 206a, 206b, the electrolyte layers 208a, 208b, and the second electrode layers 210a, 210b of the first stack 200a and the second stack 200b. In this manner, the first electrode layer 206a, 206b and the second electrode layer 210a, 210b of each of the stacks 200a, 200b are electrically isolated from each other. However, in other embodiments, the first material 214 need not completely fill the grooves 212, but still electrically isolate the first electrode layer 206a, 206b and the second electrode layer 210a, 210b of each of the stacks 200a, 200b from each other.

[0047] In FIG. 2C, a groove 216 is formed through the first material 214. This separates the first material 214 into a first portion 214a that is disposed over the exposed edge of the first laminate 200a and a second portion 214b that is disposed over the exposed edge of the second laminate 200b. For ease of reference, the groove 212 through the composite laminate formed in FIG. 2A may be referred to as the first groove 212, and the groove 216 formed in FIG. 2C may be referred to as the second groove 216. The second groove 216 is narrower than the first groove 212, so that the first and second portions 214a and 214b of the first material remain between the first and second laminates 200a and 200b, electrically insulating the exposed edges of the first and second laminates 200a and 200b. The second grooves 216 are formed in the same manner (i.e., using laser ablation) as the first grooves 212 in the embodiment of Figure 2C, however, in other embodiments, the second grooves 216 may be formed using a different process, which may be the same or different from the process used to form the first grooves 212.

[0048] 2C, the second trench 216 extends through the depth of the first material 214, exposing a portion of the substrate 202 that was previously covered by the first material 214. Thus, in this case, the second trench 216 forms a through hole through the first material 214. However, this is not the case for other embodiments, such as those in which the second trench is shallower such that it extends only partway through the depth of the first material 214, or those in which the formation of the second trench is omitted.

[0049] In FIG. 2D, a second material 218 is deposited on the first stack 200a, the first material 214, and the second stack 200b. The second material 218 in this embodiment is electrically conductive. Thus, a flow of ions or electrons through the second material 218 can cause a current to flow through the second material 218. The second material 218 electrically connects the second electrode layer 210a of the first stack 200a to the second electrode layer 210b of the second stack 200b through the second material 218. The first stack 200a and the second stack 200b can be electrically connected to further electrical components through the second material 218.

[0050] The second material 218 acts as a negative CC layer (sometimes referred to as anode CC layer) in the embodiment of FIG. 2D. The second material 218 contacts the second electrode layers 210a, 210b of the first and second stacks 200a, 200b, and corresponds in this case to the anode during discharge of the cells formed from the first and second stacks 200a, 200b, respectively. The second material 218 in this embodiment includes copper. However, it will be understood that any suitable metal can be used, such as aluminum, nickel foil or steel, or metallized materials including metallized plastics such as aluminum on polyethylene terephthalate (PET).

[0051] Depositing the second material 218 on the first stack 200a and the second stack 200b increases the contact area between the second material 218 and the second electrode layer 210a, 210b, compared to other cases where the negative electrode or negative electrode CC is connected to an additional electrical component such as an electrical connector along the exposed side edge of the negative electrode or negative electrode CC. For example, the area of ​​such a side edge of the negative electrode or negative electrode CC for connecting to an electrical connector is generally much smaller than the area of ​​the surface of the first stack 200a and the second stack 200b on which the second material 218 is deposited in FIG. 2D. In an embodiment such as FIG. 2E, the contact area between the second material 218 and the second electrode layer 210a, 210b of at least one of the first stack 200a or the second stack 200b is larger than the area of ​​the end face of the second electrode layer 210a, 210b in the second groove 216. Increasing the contact area generally reduces the contact resistance at the interface between the second material 218 and the second electrode layers 210a, 210b, improving the performance of the fabricated power storage device.

[0052] The second material 218 in embodiments such as that of FIG. 2D is deposited using a non-inkjet printing method, which is a deposition method that does not include inkjet printing technology. Such methods may be simpler and more economical than inkjet printing. Suitable methods include vapor deposition methods such as PVD or CVD, or flood deposition. In these methods, the second material 218 may be deposited on a surface of the structure shown in FIG. 2C to form a layer of the second material 218 on the surface of the structure as shown in FIG. 2D. This allows the second material 218 to be deposited on the exposed surface of the structure without the need to precisely control where the second material 218 is deposited. This allows for a simplified deposition of the second material 218 compared to depositing the second material 218 according to a specific pattern (e.g., the second material is deposited on some areas of the surface but not on other areas). Furthermore, at least some non-inkjet printing methods are more economical and / or simpler than inkjet printing techniques.

[0053] In FIG. 2D, each of the first stack 200a and the second stack 200b comprises a first surface 220a, 220b on the substrate 202 and a second surface 222a, 222b opposite the first surface 220a, 220b. The second material 218 is deposited to cover substantially all (in this case, all) of the second surfaces 222a, 222b of both the first stack 200a and the second stack 200b. This further simplifies the deposition of the second material 218 and further increases the contact area between the second material 218 and the second electrode layers 210a, 210b. Depositing the second material 218 in this manner may include, for example, encapsulating the second surfaces 222a, 222b of the first stack 200a and the second stack 200b using the second material 218. This protects the second surfaces 222a, 222b by reducing contact between the second surfaces 222a, 222b and the surrounding environment, for example by the second material 218 being configured as a barrier between the second surfaces 222a, 222b and the environment, and therefore the second material 218 protects the second surfaces 222a, 222b from potential damage or interaction with the surrounding environment.

[0054] For example, it should be understood that depositing the second material 218 to cover substantially all of a given surface refers to depositing the second material 218 to cover all of the given surface, all of the given surface within manufacturing or measurement tolerances, or a substantial portion of the given surface, such as more than 80% of the given surface. In this manner, after deposition, the second material 218 overlaps substantially all of the second surfaces 222a, 222b of the first and second stacks 200a, 200b in FIG. 2D. The second material 218 is deposited on and in contact with the second surfaces 222a, 222b of the first and second stacks 200a, 200b in the embodiment of FIG. 2D. However, in other embodiments, the second material 218 may be deposited such that there is at least one intervening layer between the second material 218 and the second surfaces 222a, 222b of the first and second stacks 200a, 200b, but the second material 218 nevertheless overlaps the second surfaces 222a, 222b. In such cases, the at least one intervening layer is typically electrically conductive, and the second material 218 is electrically connected to the second electrode layers 210a, 210b through the at least one intervening layer.

[0055] 2D, the second material 218 is deposited in the second trench 216 formed through the first material 214. In this case, because the second trench 216 extends through the first material 214 to an exposed portion of the third portion 202c of the substrate 202, the second material 218 is also deposited on this portion of the third portion 202c of the substrate 202. However, in other embodiments, the second material 218 may contact a different portion of the substrate 202 or may not contact the substrate 202 (e.g., if the second trench 216 extends only partway through the first material 214 and the substrate 202 is not exposed when the second trench 216 is formed, or if the formation of the second trench is omitted). The third portion 202c of the substrate 202 is between the first and second portions 202a and 202b of the substrate 202 on which the first and second stacks 200a and 200b are disposed. The first, second and third portions 202a, 202b and 202c are labeled in FIG. 2B but are omitted from FIG. 2D for clarity. By depositing the second material 218 on the first stack 200a, the first material 214, a portion of the third portion 202c of the substrate 202 and the second stack 200b, the second material 218 can be deposited as a layer covering the structure of FIG. 2C, for example as a continuous layer. Again, this simplifies the deposition of the second material 218 compared to depositing the second material on some areas of the structure but not on other areas.

[0056] By depositing the second material 218 in the second groove 216, the area of ​​the second material 218 for subsequent connection to additional electrical components, such as an electrical connector, is increased compared to other cases where the second material 218 does not extend into the second groove 216. For example, an electrical connector can then be deposited along the length of the second material 218 in the second groove 216 (a length taken perpendicular to the width w of the first groove 212 shown in FIG. 2A). In an embodiment, the length of the second material 218 in the second groove 216 is greater than the width of the layer of the second material 218. Thus, contacting the length of the second material 218 with an electrical connector can increase the contact area compared to other cases where the electrical connector contacts the negative electrode, negative electrode CC, or the side edge of the conductive material connected to the negative electrode or negative electrode CC (which generally has a surface area much smaller than the surface area of ​​the length of the second material 218).

[0057] In the embodiment of Figure 2D, the second material 218 is deposited in a vacuum. Thus, in this case, the first stack 200a and the second stack 200b are formed in a vacuum, the first material 214 is deposited in a non-vacuum environment, and the second material 218 is deposited in a vacuum. Nevertheless, it has been found that the increased contact area between the second material 218 and the second electrode layers 210a, 210b, even under changing environmental conditions, generally improves the performance of the manufactured energy storage device.

[0058] After the second material 218 is deposited, the first material 214 prevents the second material 218 from contacting the first electrode layers 206a, 206b of the first stack 200a and the second stack 200b and the electrolyte layers 208a, 208b of the first stack 200a and the second stack 200b, thereby electrically insulating the first electrode layers 210a, 210b of the first stack 200a and the second stack 200b and the electrolyte layers 208a, 208b of the first stack 200a and the second stack 200b from the second material 218. Thus, the first material 214 acts as an insulating layer to prevent or reduce short circuits between the first electrode layer 206a and the second electrode layer 210a of the first stack 200a, and between the first electrode layer 206b and the second electrode layer 210b of the second stack 200b.

[0059] The structure of FIG. 2D may be considered an intermediate structure 224 for a power storage device. A power storage device may be manufactured from the intermediate structure 224 by further processing of the intermediate structure 224. An example of further processing that may be applied to the intermediate structure 224 is shown in FIG. 2E, where a first portion 202a of the substrate 202 on which the first stack 200a is disposed is separated from a second portion 202b of the substrate 202 on which the second stack 200b is disposed. The separation may be performed using any suitable cutting method, such as laser cutting. In FIG. 2E, the separation of the first portion 202a and the second portion 202b of the substrate 202 includes cutting the second material 218 in the groove between the first stack 200a and the second stack 200b. Thereby, the second material 218 is separated into a first portion 218a covering the first stack 200a and the first portion 214a of the first material 214, and a second portion 218b covering the second stack 200b and the second portion 214b of the first material 214. In this manner, the first stack 200a and the second stack 200b are separated from each other, which may be referred to as isolation or cell isolation.

[0060] In FIG. 2F, a further groove 226 is formed through the first stack 200a, exposing the first electrode layer 206a in the further groove 226. In this embodiment, the further groove 226 extends completely through the first portion 218a of the second material 218, the second electrode layer 210a, the electrolyte layer 208a, and the first electrode layer 206a, without extending into the CC layer 204a. This exposes the edges of the first portion 218a of the second material 218, the second electrode layer 210a, the electrolyte layer 208a, and the first electrode layer 206a, as well as the top surface of the CC layer 204a (opposite the surface of the CC layer 204a on the substrate 200). This allows the first electrode layer 206a and / or the CC layer 204a to be subsequently connected to further electrical components, such as electrical connectors for connecting cells in series or parallel. By exposing the first electrode layers 206a after depositing the second material 218, the first electrode layers 206a remain protected by the other layers of the stack 200a during previous processing, thereby reducing the risk of undesired interactions between the first electrode layers 206a.

[0061] Figure 2G illustrates that in some embodiments (as shown), forming the additional trench 226 through the first stack 200a includes forming the additional trench 226 through the first stack 200a and through the substrate 202. In other words, Figure 2F illustrates a snapshot midway through forming the additional trench 226, at which point the additional trench 226 extends partway through the first stack 200a. Continuing to form the additional trench 226 results in the structure shown in Figure 2G. In FIG. 2G, a further groove 226 is formed through the entire first stack 200a and through the first portion 202a of the substrate 202 on which the first stack 200a is disposed, separating the substrate 202 into a first sub-portion 202a′ and a second sub-portion 202a″. This therefore isolates the portion of the first stack 200a on the first sub-portion 202a′ of the substrate 202 from the remainder of the layers to form a first cell for the energy storage device. By forming the further groove 226 to expose the first electrode layer 206a and the CC layer 204a and to isolate the first cell, the energy storage device can be manufactured more efficiently than if these steps were performed separately.

[0062] 2E and 2G may be performed simultaneously or as part of the same process step (e.g., using the same equipment). For example, a laser cutter may be oriented across the surface of the intermediate structure 224 to cut the substrate 202 to separate the first portion 202a and the second portion 202b from each other and the first sub-portion 202a′ and the second sub-portion 202a″ from each other (and to expose the first electrode layer 206a and the CC layer 204a of the first stack 200a). This further improves the manufacturing efficiency of the power storage device.

[0063] After each cell is isolated, the exposed first electrode layer may be appropriately insulated and the isolated cells may be stacked one on top of the other, as shown, for example, in Figures 2E-2G. Electrical connectors may then be provided along both sides of the cell, such that a first electrical connector on one side of the cell contacts the CC layer 204 but is prevented from contacting other layers by the electrically insulating material. Similarly, a second electrical connector on the other side of the cell may be positioned to contact the second material 218 but is prevented from contacting other layers by the first material 214. As described above, the second electrical connector may be deposited over the second material 218 along a side of the first stack 200a shown in Figure 2G (i.e., a plane perpendicular to the plane of the substrate 202). For example, the second electrical connector may contact all, substantially all, or a majority of the portions of the second material 218 disposed along the side of the first stack 200a. This increases the contact area between the second electrical connector and the second material 218, further reducing the contact resistance. The first electrical connector and the second electrical connector may be a metallic material that is applied to the edges of the cell stack, for example by sputtering. Thus, the cells of the cell stack can be simply and easily joined in parallel.

[0064] In some cases, double-sided processing may be used, with multiple layers deposited on both sides of the same substrate, i.e., including multiple layers on both sides of the substrate. An example of an intermediate structure 324 formed by double-sided processing is shown diagrammatically in Figure 3. Components of intermediate structure 324 in Figure 3 that are similar to intermediate structure 224 in Figure 2B are labeled with the same reference numerals, but incremented by 100. Corresponding descriptions shall apply.

[0065] The layers disposed on the first side 328a of the substrate 302 of the intermediate structure 324 of Figure 3 are the same as the layers disposed on the substrate 202 of the intermediate structure 224 of Figure 2D, and include a first stack 300a, a second stack 300b, a first material 314, and a second material 318 covering the first stack 300a and the second stack 300b and the first material 314. In this embodiment, these layers are deposited in the same manner as the deposition of the layers of the intermediate structure 224 described with reference to Figures 2A-2D.

[0066] 3 includes the same layers, in the same order, disposed on the first side 328a of the substrate 302. The layers on the second side 328b of the substrate 302 are also deposited in the same manner as the deposition of the layers of the intermediate structure 224 described with reference to FIGS. 2A-2D, but are deposited on the opposite side of the substrate 302 to the layers on the first side 328a of the substrate 302. Each layer on the second side 328b of the intermediate structure 324 is the same as the corresponding layer on the first side 328a of the intermediate structure 324 and is labeled the same, but primed.

[0067] Depositing layers on both sides of substrate 302 may further improve the efficiency of the manufacturing process, for example, potentially reducing the number of laser cutting steps, since the laser may pass through more layers per cut.

[0068] Figures 4A-4E are schematic diagrams showing configurations of a method for manufacturing an electric storage device according to a further embodiment. The method of Figures 4A-4E is the same as that of Figures 2A-2G, except that a first layer of a second material is deposited on the first and second stacks before depositing the first material in the groove between the first and second stacks. The configurations of Figures 4A-4E that are the same as the corresponding configurations of Figures 2A-2G are given the same reference numerals, but incremented by 200. The corresponding description shall apply.

[0069] FIG. 4A shows the composite laminate 400 before separating the composite laminate 400 into a first laminate 400a and a second laminate 400b. The laminate 400 of FIG. 4A is similar to the laminate 100 of FIG. 1, except that a first layer of a second material 430 is deposited on the laminate 400. The first layer of a second material 430 is deposited on the second electrode layer 410 of the laminate 400 in this example and is the same as the second material 218 described with reference to FIGS. 2A-2G. For example, the first layer of a second material 430 may comprise copper and may be deposited in a vacuum. It should be understood that the composite laminate 400 comprises layers from which the first and second laminates are formed, so that by depositing the first layer of a second material 430 on the composite laminate 400 as shown in FIG. 4A, the first layer of a second material 430 is deposited on the first and second laminates.

[0070] In this case, the first layer 430 of the second material forms part of the CC layer (in this case the negative electrode CC layer). The first layer 430 protects the underlying layers of the stack 400 from damage or other degradation due to exposure to the surrounding environment. For example, since the second electrode layer 410 in this embodiment contains highly reactive lithium ions, the first layer 430 acts as a barrier between the highly reactive second electrode layer 410 and the surrounding environment. The first layer 430 can thus reduce the interaction between the second electrode layer 410 and the environment, improving the performance of the manufactured energy storage device and improving the safety of the manufacturing process. In this case, the layers of the stack 400 and the first layer 430 of the second material are deposited in a vacuum to further reduce the interaction between the second electrode layer 410 and the environment. Because the second material itself is less sensitive to environmental conditions than the second electrode layer 410, after depositing the first layer 430 of the second material onto the stack 400, the stack 400 may be exposed to a non-vacuum environment, e.g., for further processing, without unduly affecting the performance of the produced energy storage device.

[0071] 4A, a first layer 430 of a second material is deposited (although this is by way of example only) over substantially all (in this case all) of the composite laminate 400. This protects underlying layers of the composite laminate 400 from undesirable interactions with the environment. This also simplifies the deposition of the first layer 430 compared to depositing according to a specific pattern.

[0072] FIG 4B illustrates the formation of the first stack 400a and the second stack 400b by providing a groove 412 through the composite stack 400 shown in FIG 4A. FIG 4B illustrates the same process as FIG 2A, except that the first portion 430a and the second portion 430b of the first layer of the second material 430 are disposed on the first stack 400a and the second stack 400b (on the second electrode layers 410a, 410b). It should be understood that in other embodiments, the first stack 400a and the second stack 400b may be created by forming the groove 412 through the composite stack 400 before the first layer of the second material 430 is subsequently deposited on the first stack 400a and the second stack 400b.

[0073] 4C shows a first material 414 being deposited in the grooves 412 to insulate the exposed edges of the first and second stacks 400a, 400b. In this embodiment, the first material 414 also covers the exposed edges of the first and second portions 430a, 430b of the first layer of the second material, although this is not necessary in other embodiments.

[0074] FIG. 4D illustrates forming a second trench 416 through the first material 414 for subsequent deposition of a second material layer for electrical connection of the first and second cells formed from the first and second stacks 400a and 400b.

[0075] 4B-4d in this embodiment are performed under non-vacuum conditions, however, the first layer of second material 430 protects the underlying layers of the first stack 400a and second stack 400b and reduces undesirable reactions between these layers and the non-vacuum environment.

[0076] FIG 4E illustrates the deposition of a second material on the first stack 400a, the first material 414, and the second stack 400b as a second layer of second material 432. FIG 4E illustrates the same process as described above with reference to FIG 2D, except that the second material is deposited on the first layer of second material 430, rather than on the second electrode layers 410a, 410b of the first stack 400a and the second stack 400b. In other words, the first layer of second material 430 is between the deposited second layer of second material 432 and the second electrode layers 410a, 410b. By depositing the second layer of the second material 432 on the first stack 400a, the first material 414, and the second stack 400b, a larger contact area is provided between the second electrode layers 410a, 410b and the second material, and between the second material and further electrical components, via the second layer of the second material 432, allowing the second electrode layers 410a, 410b to be easily connected to further electrical components.

[0077] The intermediate structure 424 shown in Figure 4E may undergo further processing as shown in Figures 4E-4G to expose the first electrode layer (which may be referred to as positive electrode exposure) and isolate the stack into cells. The isolated cells may be stacked and connected together in series or parallel.

[0078] 4A-4E involve single-sided processing, it should be understood that the method of FIGS. 4A-4E may equally be performed in a double-sided manner, for example as described with reference to FIG.

[0079] The above embodiments should be understood as illustrative examples. Further examples are envisioned.

[0080] For example, the figures above show a first stack and a second stack having a first electrode layer and a CC layer between the first electrode layer and the substrate. Other embodiments may be the same as the embodiments above, but omit the CC layer, or the first electrode layer may include a CC layer. In embodiments where the first electrode layer includes a CC layer, forming a further groove through the first stack to expose the first electrode layer may include forming a further groove to expose the CC layer of the first electrode layer in the groove. For example, the CC layer of the first electrode layer may be used to electrically connect the first electrode layer to a further electrical component, such as an electrical connector.

[0081] 2A-2G show an embodiment in which a second trench 216 is formed through the first material 214 prior to depositing the second material 218. However, in other embodiments, the second material may be deposited over the first stack, the first material, and the second stack without forming a second trench.

[0082] In the above embodiment, the positive electrode is closer to the substrate than the negative electrode. In other embodiments, the same as the above embodiment, the negative electrode may be closer to the substrate than the positive electrode. For example, the first electrode layer may be the negative electrode layer and the second electrode layer may be the positive electrode layer. In such a case, the layer acting as the current collecting layer (if present) may also be reversed compared to the above embodiment, for example, the second material may function as the positive electrode CC and the CC layer between the first electrode layer and the substrate may function as the negative electrode CC.

[0083] It should be understood that any feature described in connection with any one embodiment may be used alone or in combination with the other features described, and may also be used in combination with one or more features of any other embodiment or any combination of any other embodiment. Moreover, equivalents and variations not described above may be employed within the scope of the appended claims.

Claims

1. Providing a first stack for a power storage device on a substrate and a second stack for the power storage device across a groove, Each of the first stack and the second stack comprises: a first electrode layer on the substrate; an electrolyte layer on the first electrode layer; a second electrode layer on the electrolyte layer, a first surface on the substrate and a second surface opposite the first surface; depositing a first material in the groove to a level equal to or less than the second surface of the first stack and the second stack; depositing a second material over the first stack, the first material, and the second stack, electrically connecting the second electrode layer of the first stack to the second electrode layer of the second stack through the second material; the first material prevents the second material from contacting the first electrode layers of the first stack and the second stack and the electrolyte layer of the first stack and the second stack, thereby electrically insulating the first electrode layers of the first stack and the second stack and the electrolyte layer of the first stack and the second stack from the second material; the groove is a first groove, The method includes forming a second groove through the first material; and depositing the second material in the second trench.

2. The method of claim 1 , wherein depositing the second material comprises depositing the second material using a non-inkjet printing method.

3. depositing the first material includes depositing the first material in a non-vacuum environment; The method of claim 1 or 2, wherein depositing the second material comprises depositing the second material in a vacuum.

4. The method of claim 3 , wherein the non-vacuum environment is at least one of an inert environment or a dry room environment.

5. depositing the first material into the groove after the step of depositing a first layer of the second material on the first stack and the second stack; and thereafter depositing the second material onto the first stack, the first material and the second stack as a second layer of the second material.

6. depositing the first layer of the second material comprises depositing the first layer of the second material in a vacuum; The method of claim 5 , wherein depositing the first material comprises depositing the first material in a non-vacuum environment.

7. the first stack is on a first portion of the substrate; the second stack is on a second portion of the substrate; 7. The method of claim 1, wherein the step of depositing the second material comprises depositing a portion of the second material on a third portion of the substrate between the first portion and the second portion of the substrate.

8. 8. The method of claim 1, wherein depositing the second material on the first stack, the first material, and the second stack comprises depositing the second material so as to cover all of the second surface of at least one of the first stack or the second stack.

9. depositing a composite laminate comprising the first laminate and the second laminate; and forming the groove through the composite laminate and forming the first laminate and the second laminate on either side of the groove.

10. The method of claim 9 , wherein the groove width is constant throughout the composite laminate.

11. after the step of depositing the second material, separating a first portion of the substrate on which the first stack is disposed from a second portion of the substrate on which the second stack is disposed; The method of any one of claims 1 to 10, wherein the separating step comprises cutting the second material in the groove.

12. 12. The method according to claim 1, further comprising, after the step of depositing a second material, forming a further groove through the first stack to expose the first electrode layer of the first stack in the further groove.

13. The method of claim 12 , wherein forming the further trench comprises forming the further trench through the first stack and through the substrate.

14. A substrate; a first stack for a power storage device on the substrate; a second stack for the power storage device on the substrate; a first material between the first stack and the second stack; a second material; and an intermediate structure for the electrical storage device, comprising: Each of the first stack and the second stack comprises: a first electrode layer on the substrate; an electrolyte layer on the first electrode layer; a second electrode layer on the electrolyte layer, the first material having a groove therethrough; a first surface on the substrate and a second surface opposite the first surface; the second material is on the first stack, the first material, and the second stack, and electrically connects the second electrode layer of the first stack and the second electrode layer of the second stack through the second material; an intermediate structure, wherein the first material is deposited to a height equal to or lower than the second surfaces of the first stack and the second stack, preventing the second material from contacting the first electrode layers of the first stack and the second stack and the electrolyte layers of the first stack and the second stack, thereby electrically insulating the first electrode layers of the first stack and the second stack and the electrolyte layers of the first stack and the second stack from the second material.

15. the first stack is on a first portion of the substrate; the second stack is on a second portion of the substrate; 15. The intermediate structure of claim 14, wherein a portion of the second material is on a third portion of the substrate between the first portion of the substrate and the second portion of the substrate.

16. 16. An intermediate structure according to claim 14 or 15, wherein the second material overlies all of the second surface of at least one of the first laminate or the second laminate.

17. The intermediate structure according to any one of claims 14 to 16, wherein the second electrode layer comprises lithium.

18. An intermediate structure according to any one of claims 14 to 17, wherein the second material comprises copper.

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