Semiconductor Module

Abstract

This semiconductor module comprises: a plurality of semiconductor switching elements; a resin mold that has a lateral surface and surrounds the semiconductor switching elements; a terminal member that has a plurality of internal terminals electrically connected to the semiconductor switching elements inside the resin mold and a plurality of external terminals projecting from the lateral surface of the resin mold; and a support member that is disposed at a position apart from the lateral surface of the resin mold, extends in a direction where the external terminals are arrayed, covers a portion of the outer periphery of the external terminals, and fixes the external terminals so as to be spaced apart from each other.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor module. [Background technology]

[0002] Patent Documents 1 and 2 describe conventional semiconductor modules. Such semiconductor modules have, for example, a plurality of terminals, a plurality of semiconductor switching elements, wiring connecting the terminals, and wiring connecting the terminals and the semiconductor switching elements. The plurality of terminals are, for example, a positive power supply terminal, a negative power supply terminal, an output terminal (load terminal), a control terminal, and the like.

[0003] Patent Document 1 describes a three-dimensional structure in which control terminals and power terminals are bent, while Patent Document 2 describes a member made of highly thermally conductive resin formed around the terminals. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent No. 4336713 [Patent Document 2] Japanese Patent No. 4979909 Summary of the Invention [Problem to be solved by the invention]

[0005] The structures of Patent Documents 1 and 2 have a problem in that the terminals may become displaced or deformed due to warping or deformation of the resin mold or spring back of the terminals.

[0006] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a semiconductor module capable of suppressing misalignment and deformation of terminals. [Means for solving the problem]

[0007] The semiconductor module according to the present disclosure comprises a plurality of semiconductor switching elements, a resin mold having side surfaces and surrounding the plurality of semiconductor switching elements, a terminal member having a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surfaces of the resin mold, and a support member arranged at a position spaced apart from the side surfaces of the resin mold, extending in a direction in which the plurality of external terminals are arranged, covering a portion of the outer periphery of each of the plurality of external terminals, and fixing the plurality of external terminals so that the plurality of external terminals are spaced apart from one another. Each of the plurality of external terminals has a first terminal portion, a second terminal portion, and a step portion. The first terminal portion protrudes from the side surface of the resin mold. The second terminal portion has a width smaller than the width of the first terminal portion in the direction in which the plurality of external terminals are arranged. The second terminal portion is continuous with the first terminal portion. The second terminal portion has an end portion located on the opposite side to the side surface of the resin mold. The step portion is formed between the first terminal portion and the second terminal portion. The support member is disposed at the boundary between the first terminal portion and the second terminal portion, and covers the step portion. The semiconductor module according to the present disclosure comprises a plurality of semiconductor switching elements, a resin mold having side surfaces and surrounding the plurality of semiconductor switching elements, a terminal member having a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surfaces of the resin mold, and a support member arranged at a position spaced apart from the side surfaces of the resin mold, extending in a direction in which the plurality of external terminals are arranged, covering a portion of the outer periphery of each of the plurality of external terminals, and fixing the plurality of external terminals so that the plurality of external terminals are spaced apart from one another. The plurality of external terminals are composed of a first terminal group and a second terminal group. The first terminal group is composed of a plurality of first external terminals having a first bent portion located between the side surface of the resin mold and the support member. The second terminal group is composed of a plurality of second external terminals having a second bent portion located between the side surface of the resin mold and the support member. The distance from the side surface of the resin mold to the second bent portion is greater than the distance from the side surface of the resin mold to the first bent portion. The support member is composed of a first support member and a second support member that are parallel to each other. The first support member fixes the plurality of first external terminals such that the plurality of first external terminals of the first terminal group are spaced apart from each other. The second support member fixes the plurality of second external terminals such that the plurality of second external terminals of the second terminal group are spaced apart from each other. In a direction along the side surface of the resin mold, two or more first external terminals after the plurality of first external terminals are arranged between two second external terminals among the plurality of second external terminals. The semiconductor module according to the present disclosure comprises a plurality of semiconductor switching elements, a resin mold having side surfaces and surrounding the plurality of semiconductor switching elements, a terminal member having a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surfaces of the resin mold, and a support member arranged at a position spaced apart from the side surfaces of the resin mold, extending in a direction in which the plurality of external terminals are arranged, covering a portion of the outer periphery of each of the plurality of external terminals, and fixing the plurality of external terminals so that the plurality of external terminals are spaced apart from one another. The plurality of external terminals are composed of a first terminal group and a second terminal group. The first terminal group is composed of a plurality of first external terminals having a first bent portion located between the side surface of the resin mold and the support member. The second terminal group is composed of a plurality of second external terminals having a second bent portion located between the side surface of the resin mold and the support member. A distance from the side surface of the resin mold to the second bent portion is greater than a distance from the side surface of the resin mold to the first bent portion. The support member fixes the plurality of first external terminals such that the plurality of first external terminals of the first terminal group are spaced apart from one another, and fixes the plurality of second external terminals such that the plurality of second external terminals of the second terminal group are spaced apart from one another. Effect of the Invention

[0008] According to the present disclosure, a semiconductor module capable of suppressing misalignment and deformation of terminals can be provided. [Brief description of the drawings]

[0009] [Figure 1] 1 is a circuit diagram showing an overall configuration of a vehicle electric power steering device including a semiconductor module according to a first embodiment. [Diagram 2] 1 is a plan view showing an internal structure of a semiconductor module according to a first embodiment. [Diagram 3] 1 is a perspective view showing a semiconductor module according to a first embodiment. [Figure 4A] 1 is a plan view showing a main part of a semiconductor module according to a first embodiment. [Figure 4B] 1 is a plan view showing a main part of a semiconductor module according to a first embodiment. [Figure 4C] 2 is an enlarged cross-sectional view showing a main part of the semiconductor module according to the first embodiment. FIG. [Figure 5A] 4 is an enlarged cross-sectional view showing a main part of the semiconductor module according to the first embodiment, illustrating a step of bending an external terminal. FIG. [Figure 5B] 4 is an enlarged cross-sectional view showing a main part of the semiconductor module according to the first embodiment, illustrating a step of bending an external terminal. FIG. [Figure 6A] FIG. 11 is a plan view showing a semiconductor module according to a modified example of the first embodiment. [Figure 6B] 11 is a side view showing a semiconductor module according to a modified example of the first embodiment. FIG. [Figure 7] FIG. 11 is a perspective view showing a semiconductor module according to a second embodiment. [Figure 8] FIG. 11 is a perspective view showing a semiconductor module according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Embodiment 1 FIG. 1 is a circuit diagram showing the overall configuration (overall system configuration) of a vehicle electric power steering device including a semiconductor module according to a first embodiment. The vehicle electric power steering device 100 includes, for example, a control unit 1, a motor 2, a first sensor 6, a second sensor 8, a battery 9 (power source), an ignition switch 10, and the like.

[0011] The control unit 1 includes a semiconductor module 60a (see FIG. 2, described later) incorporating a plurality of semiconductor switching elements. The control unit 1 is composed of, for example, a control circuit 3, an inverter circuit 4, a power relay 5, and capacitors 7U, 7V, and 7W. The control circuit 3 is connected to a battery 9 via an ignition switch 10. The control circuit 3 includes a CPU 30, a drive circuit 31, an input circuit 32, and a power supply circuit 33, for example.

[0012] The power relay 5 is disposed upstream of the inverter circuit 4, i.e., between the inverter circuit 4 and the battery 9. The power relay 5 is composed of two switching elements 5a and 5b connected in series to each other. The power relay 5 has a relay function of connecting and disconnecting the battery 9 and the inverter circuit 4. In other words, the power relay 5 switches the power supply to the inverter circuit 4.

[0013] The capacitors 7U, 7V, and 7W are smoothing capacitors that are arranged in parallel with one another. Each of the capacitors 7U, 7V, and 7W is connected between the positive terminal of the battery 9 and the ground (negative terminal).

[0014] The inverter circuit 4 supplies a current to the windings of the motor 2 . The inverter circuit 4 has a plurality of switching elements (semiconductor switching elements). The power supply relay 5 is connected to a battery 9. The inverter circuit 4 is made up of three bridge circuits corresponding to the three-phase (U-phase, V-phase, W-phase) windings that constitute the motor 2.

[0015] Each of the three phases is configured with the same circuit. In the following explanation, one phase (U phase) will be explained, and explanations of the V phase and W phase will be omitted. In the inverter circuit 4, a high potential side switching element 41U and a low potential side switching element 42U are connected in series. A relay switching element 44U is connected to an intermediate connection portion located between the high potential side switching element 41U and the low potential side switching element 42U. The relay switching element 44U has a relay function of connecting or disconnecting the coil of the motor 2 and the inverter circuit 4 according to the load applied to the coil of the motor 2 and the output from the coil.

[0016] A shunt resistor 43U for detecting a current is connected to the downstream side of the low potential side switching element 42U (opposite side to the high potential side switching element 41U). A terminal group TM is provided on both ends of the shunt resistor 43U. The terminal group TM is used to detect a potential difference between both ends of the shunt resistor 43U and convert it into a current value. The inverter circuit 4 is provided with a monitor terminal for detecting a state (monitor signal) of the inverter circuit 4. The monitor signal is transmitted to the CPU 30 via the input circuit 32 of the control circuit 3.

[0017] The motor 2 is a brushless motor configured with three-phase windings (U-phase, V-phase, and W-phase). The U-phase winding, the V-phase winding, and the W-phase winding correspond to the three bridge circuits of the inverter circuit 4. The first sensor 6 is a rotation sensor that detects the rotation angle of the motor, and is disposed next to the motor 2. A rotation angle signal detected by the first sensor 6 is output from the first sensor 6 and input to the control circuit 3. The second sensor 8 is a torque sensor that detects a steering force, a vehicle speed sensor that detects the vehicle speed, etc. A signal detected by the second sensor 8 is output from the second sensor 8 and input to the control circuit 3.

[0018] The CPU 30 of the control circuit 3 calculates a current value required to rotate the motor 2, and outputs a control signal based on the calculation result to the drive circuit 31. The drive circuit 31 drives each of the multiple switching elements that configure the inverter circuit 4. The inverter circuit 4 detects the current and outputs a current detection signal to the control circuit 3. The current detection signal is input to the control circuit 3, and the control circuit 3 performs feedback control between the control circuit 3 and the inverter circuit 4. All of the above-mentioned switching elements are controlled by an output signal from a drive circuit 31 based on instructions from a CPU 30.

[0019] The circuit built into the semiconductor module 60a constituting the control unit 1 is not limited to the structure shown in Fig. 1. For example, the number of bridge circuits of the inverter circuit 4 built into the semiconductor module 60a may be 1 to 3, or may be 4 or more. Also, a circuit from which the power relay 5 is omitted, a circuit from which the shunt resistor 43U is omitted, a circuit from which some of the switching elements are omitted, or the like may be built into the semiconductor module 60a.

[0020] (Semiconductor Module) Fig. 2 is a plan view showing the internal structure of the semiconductor module 60a. In Fig. 2, in order to explain the internal structure of the semiconductor module 60a, the resin mold 70 is omitted, and the outer periphery 70a of the resin mold 70 is indicated by a two-dot chain line. FIG. 3 is a perspective view showing the semiconductor module 60a. FIG. 4A is a plan view showing a main portion of a semiconductor module 60a, and is a diagram illustrating the structure of a control terminal 50i. FIG. 4B is a plan view showing a main portion of the semiconductor module 60a, and is a diagram illustrating the structure of the power terminals 50c and 50e. FIG. 4C is an enlarged cross-sectional view showing a main portion of the semiconductor module 60a, illustrating the positional relationship between the first support member 60A and the control terminal 50i, and the positional relationship between the second support member 60B and the power terminals 50c and 50e.

[0021] The semiconductor module 60a includes a high potential side switching element 41U (semiconductor switching element), a low potential side switching element 42U (semiconductor switching element), a shunt resistor 43U, a relay switching element 44U (semiconductor switching element), a resin mold 70, and a terminal member 50.

[0022] (Resin mold) The resin mold 70 is formed to encase the entire semiconductor module 60a. The resin mold 70 surrounds the switching elements 41U, 42U, 44U, and the shunt resistor 43U. In other words, the switching elements 41U, 42U, 44U, and the shunt resistor 43U are disposed in an area 70b on the inner side of an outer periphery 70a of the resin mold 70. There is no limitation on the type of material, and a known resin is used as the material for forming the resin mold 70. The resin mold 70 is formed by molding resin only on one side of the terminal member 50.

[0023] (Terminal material) The terminal member 50 has internal terminals 50a, 50g, 50f, 50g, 50h, 50j, and 50k arranged inside the resin mold 70, and a plurality of power terminals 50c, 50d, and 50e (external terminals) and a plurality of control terminals 50i (external terminals) arranged outside the resin mold 70. The internal terminal 50a is connected to the relay switching element 44U. The internal terminal 50b is connected to the high potential side switching element 41U. The internal terminal 50f is connected to the low potential side switching element 42U. The internal terminals 50g, 50h, 50j, and 50k are connected to the control terminal 50i. The power terminals 50c, 50d, 50e and the control terminals 50i protrude from a side surface 70c of the resin mold 70 (see FIG. 3). In other words, the power terminals 50c, 50d, 50e and the control terminals 50i are drawn out from the resin mold 70.

[0024] Inside the resin mold 70, connection wires 45a, 45b, 46a, 46b, and 46c are provided. The connection wire 45a electrically connects the high potential side switching element 41U, the relay switching element 44U, and the internal terminal 50f. The connection wire 45b electrically connects the low potential side switching element 42U and the internal terminal 50g. The connection wire 46a electrically connects a first control terminal 50ia, which is one of the plurality of control terminals 50i, to the low potential side switching element 42U. The connection wire 46b electrically connects a second control terminal 50ib, which is one of the plurality of control terminals 50i, to the internal terminal 50a. The connection wire 46c electrically connects a third control terminal 50ic, which is one of the plurality of control terminals 50i, to the relay switching element 44U. The connection wire 46d electrically connects a fourth control terminal 50id, which is one of the plurality of control terminals 50i, to the high potential side switching element 41U. The shunt resistor 43U electrically connects the internal terminal 50g to the internal terminal 50g.

[0025] (Support material) 3, the semiconductor module 60a has a support member 60. The support member 60 fixes the power terminals 50c, 50e and the control terminals 50i that are extended from a side surface 70c of the resin mold 70 outside the resin mold 70. Specifically, the support member 60 is composed of a first support member 60A that fixes the control terminals 50i and a second support member 60B that fixes the power terminals 50c, 50e. The first support member 60A and the second support member 60B are made of a known resin, and the type of material is not limited.

[0026] (First support member) The first support member 60A is disposed at a position spaced apart from the side surface 70c of the resin mold 70, and extends in the direction in which the control terminals 50i are arranged. That is, the first support member 60A extends in a direction intersecting at a right angle with the direction in which each of the control terminals 50i extends. The first support member 60A covers a part of the outer periphery of each of the control terminals 50i, and fixes the control terminals 50i so that the control terminals 50i are spaced apart from each other. In other words, the first support member 60A bundles the control terminals 50i together, and maintains the interval between the adjacent control terminals 50i. Each of the plurality of control terminals 50i has an end portion 50ie located on the opposite side to the side surface 70c of the resin mold 70. The first support member 60A is disposed closer to the end portion 50ie than to the side surface 70c of the resin mold 70. Each of the plurality of control terminals 50i has a bent portion 50if located between the side surface 70c of the resin mold 70 and the first support member 60A.

[0027] 4A, each of the control terminals 50i has a first terminal portion 50ig protruding from the side surface 70c of the resin mold 70 and a second terminal portion 50ih having an end portion 50ie. The second terminal portion 50ih is continuous with the first terminal portion 50ig. The second terminal portion 50ih has a width smaller than the width of the first terminal portion 50ig in the direction in which the control terminals 50i are arranged. The first support member 60A covers a part of the outer periphery of the second terminal portion 50ih and fixes the second terminal portion 50ih. The first support member 60A is disposed at the boundary between the first terminal portion 50ig and the second terminal portion 50ih. In other words, the first support member 60A is formed so as to cover the step portion formed between the first terminal portion 50ig and the second terminal portion 50ih.

[0028] (Second support member) The second support member 60B is disposed at a position spaced apart from the side surface 70c of the resin mold 70, and extends in the direction in which the power terminals 50c, 50e are arranged. That is, the second support member 60B extends in a direction intersecting at a right angle with the direction in which the power terminals 50c, 50e extend. The second support member 60B covers a part of the outer periphery of each of the power terminals 50c, 50e, and fixes the power terminals 50c, 50e so that the power terminals 50c, 50e are spaced apart from each other. In other words, the second support member 60B bundles the power terminals 50c, 50e together, and maintains the spacing between the power terminals 50c, 50e. The power terminal 50c has an end 50ce located opposite the side surface 70c of the resin mold 70. The power terminal 50e has an end 50ee located opposite the side surface 70c of the resin mold 70. The second support member 60B is disposed closer to the ends 50ce, 50ee than the side surface 70c of the resin mold 70. The power terminal 50c has a bent portion 50cf located between the side surface 70c of the resin mold 70 and the second support member 60B. The power terminal 50e has a bent portion 50ef located between the side surface 70c of the resin mold 70 and the second support member 60B.

[0029] 4B, the power terminal 50c has a first terminal portion 50cg protruding from the side surface 70c of the resin mold 70 and a second terminal portion 50ch having an end portion 50ce. The second terminal portion 50ch is continuous with the first terminal portion 50cg. The second terminal portion 50ch has a width smaller than the width of the first terminal portion 50cg in the arrangement direction of the power terminals 50c, 50e. The power terminal 50e has a first terminal portion 50eg protruding from the side surface 70c of the resin mold 70 and a second terminal portion 50eh having an end portion 50ee. The second terminal portion 50eh is continuous with the first terminal portion 50eg. The second terminal portion 50eh has a width smaller than the width of the first terminal portion 50eg in the arrangement direction of the power terminals 50c and 50e.

[0030] Although power terminal 50d is not shown in FIG. 4B, a configuration similar to that of power terminals 50c and 50e may be applied to power terminal 50d. In this case, the power terminal 50d has a first terminal portion 50dg protruding from the side surface 70c of the resin mold 70 and a second terminal portion 50dh having an end portion 50de. The second terminal portion 50dh is continuous with the first terminal portion 50dg. The second terminal portion 50dh has a width smaller than the width of the first terminal portion 50dg in the direction in which the multiple power terminals are arranged.

[0031] The second support member 60B covers a part of the outer circumference of the second terminal portion 50ch, 50eh and fixes the second terminal portion 50ch, 50eh. The second support member 60B is disposed at the boundary between the first terminal portion 50cg and the second terminal portion 50ch, and is also disposed at the boundary between the first terminal portion 50eg and the second terminal portion 50eh. In other words, the second support member 60B is formed so as to cover the step portion formed between the first terminal portion 50eg and the second terminal portion 50eh and the step portion formed between the first terminal portion 50cg and the second terminal portion 50ch.

[0032] Each of the first support member 60A and the second support member 60B has, for example, a rectangular parallelepiped shape. Here, a rectangular parallelepiped shape is a shape having long sides aligned with the side directions of the resin mold 70. Each of the first support member 60A and the second support member 60B is disposed parallel to the side surface 70c of the resin mold 70.

[0033] 4C, in the thickness direction TH of the first support member 60A, the center position P1 of the first support member 60A coincides with the center position P2 of the control terminal 50i. The thickness of the first support member 60A is equal to or greater than the thickness of the control terminal 50i. In other words, the thickness of the first support member 60A and the thickness of the control terminal 50i are set so that the structures of the first support member 60A and the control terminal 50i are symmetrical with respect to the center line C passing through the center positions P1 and P2.

[0034] Similarly, in the thickness direction of the second support member 60B, the center position of the second support member 60B coincides with the center positions of the power terminals 50c, 50e. The thickness of the second support member 60B is equal to or greater than the thickness of the power terminals 50c, 50e. In other words, the power terminals 50c, 50e are fixed by the second support member 60B so that the second support member 60B and the power terminals 50c, 50e are symmetrical with respect to the center line C passing through the center positions P1, P2.

[0035] Each of the plurality of control terminals 50i has two first surfaces F and two second surfaces S. The first surfaces F are parallel to a direction (D3 in FIG. 3) perpendicular to the direction (D2 in FIG. 3) in which the control terminals 50i extend and the direction (D1 in FIG. 3) in which the control terminals 50i are arranged. The second surfaces S are parallel to the direction (D2 in FIG. 3) in which the control terminals 50i are arranged. The first support member 60A covers the two first surfaces F and two second surfaces S of each of the plurality of control terminals 50i.

[0036] Similarly, each of the power terminals 50c, 50e has two first faces F and two second faces S. The first faces F are parallel to a direction (E3 in FIG. 3) perpendicular to the direction (E1 in FIG. 3) in which the power terminals 50c, 50e extend and the direction (E2 in FIG. 3) in which the power terminals 50c, 50e are arranged. The second faces S are parallel to the direction (E2 in FIG. 3) in which the power terminals 50c, 50e are arranged. The second support member 60B covers the two first faces F and two second faces S of each of the power terminals 50c, 50e.

[0037] The thickness of the support member 60 is equal to or less than the thickness of the resin mold 70 . The reason is that, compared to the resin mold 70 that covers multiple semiconductor switching elements, terminal members, and connecting wires, the support member 60 only fixes the control terminals 50i and the power terminals 50c, 50e, and the pressure applied to the support member 60 is also small.

[0038] Next, a process of bending the external terminals to form bent portions will be described with reference to FIGS. 5A and 5B. 5A and 5B are enlarged cross-sectional views showing a main part of a semiconductor module 60a, illustrating a process of bending the external terminals. In the following description, the process of bending the control terminal 50i will be described. The process of bending the power terminals 50c and 50e is the same as the process of bending the control terminal 50i, so the description will be omitted.

[0039] 5A, the first support member 60A is formed on the multiple control terminals 50i. The position where the first support member 60A is formed is closer to the end portion 50ie than the side surface 70c of the resin mold 70. As a result, the multiple control terminals 50i are bundled by the first support member 60A.

[0040] Next, the jig 200 is placed below the control terminal 50i, and the jig 200 is moved upward. The jig 200 comes into contact with the control terminal 50i. As the jig 200 moves upward, the jig 200 bends the control terminal 50i. As a result, a bent portion 50if is formed in the control terminal 50i between the side surface 70c of the resin mold 70 and the first support member 60A.

[0041] According to the semiconductor module 60a of the first embodiment, the multiple control terminals 50i can be bundled and fixed by the first support member 60A. The multiple power terminals 50c, 50e can be bundled and fixed by the second support member 60B. This makes it possible to suppress deformation of the terminal member 50 when the terminal member 50 is processed, and to stabilize the dimensions of each of the multiple control terminals 50i and the multiple power terminals 50c, 50e after processing.

[0042] Furthermore, since each of the first support member 60A and the second support member 60B has a rectangular parallelepiped shape, the size of each of the first support member 60A and the second support member 60B can be minimized. This allows the size of the semiconductor module 60a to which each of the first support member 60A and the second support member 60B is attached to be reduced.

[0043] In addition, in the thickness direction TH, the center position of the support member 60 (first support member 60A, second support member 60B) coincides with the center position of the external terminals (control terminal 50i, power terminals 50c, 50e). This suppresses deformation such as warping and twisting of the support member 60, and stabilizes the dimensional accuracy of the control terminal 50i and the power terminals 50c, 50e.

[0044] Furthermore, since the external terminals (control terminal 50i, power terminals 50c, 50e) are fixed by the support member 60, the stress applied to the external terminals when the external terminals are cut in the process of manufacturing the semiconductor module 60a can be alleviated by the support member 60. This makes it possible to prevent the resin constituting the resin mold 70 from peeling off from the external terminals in the process of manufacturing the resin mold 70 and the external terminals. Furthermore, by providing the support member 60, it is possible to prevent deformation such as twisting and bending of the external terminals in the process of manufacturing the external terminals.

[0045] In the first embodiment, the first support member 60A is disposed closer to the end 50ie than the side surface 70c of the resin mold 70. The second support member 60B is disposed closer to the end portions 50ce, 50ee than the side surface 70c of the resin mold 70. This makes it possible to obtain an effect of the support members 60 (the first support member 60A, the second support member 60B) returning the positions of the external terminals (the control terminals 50i, the power terminals 50c, 50e) to their original positions, that is, an effect of correcting the positions of the external terminals, even if the positions of the external terminals (the control terminals 50i, the power terminals 50c, 50e) are shifted in the process of manufacturing the semiconductor module 60a.

[0046] The support members 60 (first support member 60A, second support member 60B) extend in a direction in which the multiple external terminals (control terminal 50i, power terminals 50c, 50e) are arranged. Furthermore, the support members 60 are not formed in areas where the external terminals are not formed. This allows the length of the support members 60 to be shortened, which contributes to the miniaturization of the semiconductor module 60a.

[0047] The first support member 60A covers the two first surfaces F and two second surfaces S of each of the multiple control terminals 50i, thereby suppressing deformation of the multiple control terminals 50i in directions parallel to each of the first surfaces F and second surfaces S. Similarly, the second support member 60B covers the two first faces F and two second faces S of each of the power terminals 50c, 50e, thereby suppressing deformation of the power terminals 50c, 50e in directions parallel to each of the first faces F and second faces S.

[0048] Furthermore, as shown in Figures 5A and 5B, the first support member 60A is positioned closer to the end portion 50ie than the side surface 70c of the resin mold 70, so that even if the bending portion 50if is formed using the jig 200, interference such as the jig 200 contacting the first support member 60A can be avoided.

[0049] Variation 1 of the first embodiment In the present first modification, the material of the support member 60 (the first support member 60A and the second support member 60B) is the same as the material of the resin mold . As a result, when forming the resin mold 70, the support member 60 can be formed using the same material as the resin mold 70. That is, the resin mold 70 and the support member 60 can be formed in the same process. As a result, it is not necessary to form the support member 60 in a process separate from the process of forming the resin mold 70. Therefore, the process of forming only the support member 60 can be omitted.

[0050] Variation 2 of embodiment 1 The present modified example 2 differs from the above-described embodiment 1 in that the resin mold 70 has a rectangular shape. Fig. 6A is a plan view showing the semiconductor module 61a. Fig. 6B is a side view showing the semiconductor module 61a. Moreover, the symbol X shown in Fig. 6B typically indicates a case where warping occurs in the resin mold 70 during molding of the resin mold 70. In FIG. 6A, the second support member 60B is omitted.

[0051] As shown in FIG. 6A, a rectangular resin mold 70 has a long side 70L and a short side 70S in a plan view. The first support member 60A (60) extends along the long side 70L and bundles and fixes the plurality of control terminals 50i.

[0052] When molding the resin mold 70, warping may occur in the resin mold 70. This warping tends to occur along the direction of the long side 70L of the resin mold 70, as indicated by the symbol X. When such warping occurs in the resin mold 70, the position of the end 50ie of the control terminal 50i may become misaligned.

[0053] In contrast, as shown in FIG. 6B, in this modification 2, a first support member 60A is provided, so that even if the resin mold 70 has a rectangular shape, the first support member 60A can suppress warping of the resin mold 70.

[0054] Embodiment 2 FIG. 7 is a perspective view showing a semiconductor module 62a according to the second embodiment. The second embodiment differs from the first embodiment described above in that the resin mold 70 has a rectangular shape and a plurality of external terminals are arranged in two rows.

[0055] 7, the semiconductor module 62a includes a rectangular resin mold 70, a plurality of control terminals 50i, and power terminals 50c, 50d, and 50e. The control terminals 50i and the power terminals 50c, 50d, and 50e are extended from one long side 70L of the resin mold 70. The control terminals 50i (first external terminals) constitute a first terminal group 55 including a plurality of external terminals arranged in a first row. Each of the control terminals 50i has a bent portion 50if (first bent portion) located between the side surface 70c of the resin mold 70 and the first support member 60A. The first support member 60A bundles and fixes the control terminals 50i constituting the first terminal group 55 such that the control terminals 50i are spaced apart from each other.

[0056] The power terminals 50c, 50d, 50e (second external terminals) constitute a second terminal group 56 including a plurality of external terminals arranged in a second row. Each of the power terminals 50c, 50d, 50e has a bent portion 50cf, 50df, 50ef (second bent portion) located between the side surface 70c of the resin mold 70 and the second support member 60B. The second support member 60B bundles and fixes the power terminals 50c, 50d, 50e constituting the second terminal group 56 such that the power terminals 50c, 50d, 50e are spaced apart from each other.

[0057] 4B, the second support member 60B is formed to cover the step portion formed between the first terminal portion 50eg and the second terminal portion 50eh and the step portion formed between the first terminal portion 50cg and the second terminal portion 50ch. As a result, the second support member 60B is hooked and fixed by the step portions.

[0058] The distance from the side surface 70c of the resin mold 70 to the bent portions 50cf, 50df, and 50ef is greater than the distance from the side surface 70c of the resin mold 70 to the bent portion 50if. In addition, the first support member 60A and the second support member 60B are parallel to each other.

[0059] According to the semiconductor module 62a of the second embodiment, the first support member 60A can bundle and fix the multiple control terminals 50i. The second support member 60B can bundle and fix the multiple power terminals 50c, 50d, 50e. This can suppress deformation of the terminal member 50 when the terminal member 50 is processed, and can stabilize the dimensions of the multiple control terminals 50i and the multiple power terminals 50c, 50d, 50e after processing. Furthermore, the same or similar effects as those of the first embodiment described above can be obtained.

[0060] A variation of the second embodiment. 7, support members may be provided according to the positions of the bent portions 50cf, 50df, and 50ef. With this structure, even if multiple bent portions are arranged in two rows, the positions of the bent portions of the multiple power terminals 50c, 50d, and 50e can be corrected by the support members.

[0061] Embodiment 3 FIG. 8 is a perspective view showing a semiconductor module according to the third embodiment. The third embodiment differs from the second embodiment described above in that a plurality of external terminals arranged in two rows are fixed by one support member 60.

[0062] 8, the semiconductor module 63a includes a rectangular resin mold 70, a plurality of control terminals 50i, and power terminals 50c, 50d, and 50e. The control terminals 50i and the power terminals 50c, 50d, and 50e are extended from one long side 70L of the resin mold 70. The plurality of control terminals 50i (first external terminals) constitute a first terminal group 55 including a plurality of external terminals arranged in a first row. Each of the plurality of control terminals 50i has a bent portion 50if (first bent portion) located between the side surface 70c of the resin mold 70 and the support member 60.

[0063] The power terminals 50c, 50d, 50e (second external terminals) and the plurality of control terminals 50i (second external terminals) constitute a second terminal group 56 including a plurality of external terminals arranged in a second row. Each of the power terminals 50c, 50d, 50e has a bent portion 50cf, 50df, 50ef (second bent portion) located between the side surface 70c of the resin mold 70 and the support member 60. Furthermore, each of the plurality of control terminals 50i arranged in the second row has a bent portion 50ii (second bent portion) located between the side surface 70c of the resin mold 70 and the support member 60.

[0064] The distance from the side surface 70c of the resin mold 70 to the bent portions 50cf, 50df, 50ef, and 50ii is greater than the distance from the side surface 70c of the resin mold 70 to the bent portion 50if. The support member 60 bundles and fixes the plurality of control terminals 50i constituting the first terminal group 55 and the power terminals 50c, 50d, 50e and the plurality of control terminals 50i constituting the second terminal group 56 so that they are spaced apart from each other.

[0065] According to the semiconductor module 63a of the third embodiment, the control terminals 50i and the power terminals 50c, 50d, and 50e can be bundled and fixed by one support member 60A. This makes it possible to suppress deformation of the terminal member 50 when the terminal member 50 is processed, and to stabilize the dimensions of each of the control terminals 50i and the power terminals 50c, 50d, and 50e after processing. Furthermore, it is possible to obtain the same or similar effects as those of the first embodiment described above.

[0066] Furthermore, the number of support members can be reduced because there is only one support member 60. Since the control terminals 50i and the power terminals 50c, 50d, and 50e are bundled and fixed together, dimensional accuracy can be improved. [Explanation of symbols]

[0067] 1...Control unit 2...Motor 3...Control circuit 4...Inverter circuit 5...Power relay 5a, 5b...Switching element 6...First sensor 7U, 7V, 7W...Capacitor 8...Second sensor 9...Battery 10...Ignition switch 31...Drive circuit 32...Input circuit 33...Power circuit 41U...High potential side switching element (semiconductor switching element) 42U...Low potential side switching element (semiconductor switching element) 43U...Shunt resistor 44U...Relay switching element (semiconductor switching element) 45a, 45b, 46a, 46b, 46c, 46d...Connection wiring 50...Terminal member 50a, 50b, 50f, 50g, 50h...Internal terminal 50c, 50d, 50e...Power terminal 50ce, 50de, 50ee, 50ie...End portion 50cf, 50df, 50ef, 50if, 50ii...Bending portion 50cg, 50dg, 50eg...First terminal portion 50dh, 50ch, 50eh...Second terminal portion 50i...Control terminal 50ia...First control terminal (control terminal) 50ib...Second control terminal (control terminal) 50ic...Third control terminal (control terminal) 50id...Fourth control terminal (control terminal) 50ig...First terminal portion 50ih...Second terminal portion 50j, 50k...Internal terminal 55...First terminal group 56...Second terminal group 60...Support member 60a, 61a, 62a, 63a...Semiconductor module 60A...First support member (support member) 60B...Second support member (support member) 70...Resin mold 70a...Outer periphery 70b...Area 70c...Side 70L...Long side 70S...Short side 100...Vehicle electric power steering device 200...Jig F...First surface S...Second surface P1...Center position P2...Center position TM...Terminal group

Claims

1. A plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of semiconductor switching elements; a terminal member including a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surface of the resin mold; a support member that is disposed at a position spaced apart from the side surface of the resin mold, extends in a direction in which the plurality of external terminals are arranged, covers a portion of an outer periphery of each of the plurality of external terminals, and fixes the plurality of external terminals so that the plurality of external terminals are spaced apart from one another; Equipped with Each of the plurality of external terminals is a first terminal portion protruding from the side surface of the resin mold; a second terminal portion having a width smaller than a width of the first terminal portion in a direction in which the plurality of external terminals are arranged, the second terminal portion being continuous with the first terminal portion and having an end portion located on the opposite side to the side surface of the resin mold; a step portion formed between the first terminal portion and the second terminal portion; having The support member is disposed at a boundary between the first terminal portion and the second terminal portion and covers the step portion. Semiconductor module.

2. A plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of semiconductor switching elements; a terminal member including a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surface of the resin mold; a support member that is disposed at a position spaced apart from the side surface of the resin mold, extends in a direction in which the plurality of external terminals are arranged, covers a portion of an outer periphery of each of the plurality of external terminals, and fixes the plurality of external terminals so that the plurality of external terminals are spaced apart from one another; Equipped with The plurality of external terminals include a first terminal group including a plurality of first external terminals each having a first bent portion located between the side surface of the resin mold and the support member; a second terminal group including a plurality of second external terminals each having a second bent portion located between the side surface of the resin mold and the support member; It is composed of a distance from the side surface of the resin mold to the second bent portion is greater than a distance from the side surface of the resin mold to the first bent portion, The support member is composed of a first support member and a second support member that are parallel to each other, the first support member fixes the first external terminals of the first terminal group such that the first external terminals are spaced apart from each other; the second support member fixes the second external terminals of the second terminal group such that the second external terminals are spaced apart from each other; two or more first external terminals among the plurality of first external terminals are disposed between two second external terminals among the plurality of second external terminals in a direction along the side surface of the resin mold; Semiconductor module.

3. A plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of semiconductor switching elements; a terminal member including a plurality of internal terminals electrically connected to the plurality of semiconductor switching elements inside the resin mold and a plurality of external terminals protruding from the side surface of the resin mold; a support member that is disposed at a position spaced apart from the side surface of the resin mold, extends in a direction in which the plurality of external terminals are arranged, covers a portion of an outer periphery of each of the plurality of external terminals, and fixes the plurality of external terminals so that the plurality of external terminals are spaced apart from one another; Equipped with The plurality of external terminals include a first terminal group including a plurality of first external terminals each having a first bent portion located between the side surface of the resin mold and the support member; a second terminal group including a plurality of second external terminals each having a second bent portion located between the side surface of the resin mold and the support member; It is composed of a distance from the side surface of the resin mold to the second bent portion is greater than a distance from the side surface of the resin mold to the first bent portion, the support member fixes the first external terminals of the first terminal group so that the first external terminals are spaced apart from one another, and fixes the second external terminals of the second terminal group so that the second external terminals are spaced apart from one another; Semiconductor module.

4. The material of the resin mold is the same as the material of the support member. The semiconductor module according to claim 1 .

5. The support member has a rectangular parallelepiped shape, The support member is disposed in parallel to the side surface of the resin mold. The semiconductor module according to claim 1 .

6. In the thickness direction of the support member, A center position of the support member coincides with a center position of each of the plurality of external terminals. The semiconductor module according to claim 1 .

7. each of the plurality of external terminals has an end portion located on an opposite side to the side surface of the resin mold; The support member is disposed closer to the end portion than to the side portion of the resin mold. The semiconductor module according to claim 1 .

8. The thickness of the support member is equal to or less than the thickness of the resin mold. The semiconductor module according to claim 1 .

9. Each of the plurality of external terminals is two first surfaces parallel to a direction in which the plurality of external terminals extend and a direction perpendicular to a direction in which the plurality of external terminals are arranged; two second surfaces parallel to a direction in which the plurality of external terminals are arranged; having The support member covers the two first surfaces and the two second surfaces. The semiconductor module according to claim 1 .

10. Each of the plurality of external terminals is a bent portion located between the side surface of the resin mold and the support member; The semiconductor module according to claim 1 .

11. Each of the plurality of external terminals is a first terminal portion protruding from the side surface of the resin mold; a second terminal portion having a width smaller than a width of the first terminal portion in a direction in which the plurality of external terminals are arranged, the second terminal portion being continuous with the first terminal portion and having an end portion located on the opposite side to the side surface of the resin mold; having The support member is disposed at the boundary between the first terminal portion and the second terminal portion. The semiconductor module according to claim 2 or 3.

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