Multilayer coil parts

Abstract

The present invention provides a multilayer coil component through which a large current can be passed and with which impedance can be obtained over a wide frequency band.

Description

[Technical field]

[0001] The present disclosure relates to a laminated coil component. [Background technology]

[0002] In recent years, coil components capable of passing a large current have been attracting increasing attention. For example, Patent Document 1 discloses a coil component including a drum-shaped core having a winding core and a flange provided at an end of the winding core, a wire wound around the winding core, and a terminal electrode to which the end of the wire is connected. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-109789 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a laminated coil component such as that described in Patent Document 1, the coil portion is not covered with a magnetic material, so there is a large leakage of magnetic flux, and if the component is mounted on a circuit board together with other components, the magnetic flux may interfere with the other components. Therefore, it is difficult to obtain impedance over a wide frequency band even when a large current is passed through the component. On the other hand, a laminated coil component in which a coil is disposed in a magnetic material is preferable because it has a small leakage of magnetic flux.

[0005] An object of the present disclosure is to provide a laminated coil component that can pass a large current and obtain impedance over a wide frequency band. [Means for solving the problem]

[0006] The present disclosure includes the following aspects. [1] A laminate in which a plurality of insulator layers and a plurality of coil conductor layers are laminated; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 1.8 mm or more and 2.2 mm or less, and the width dimension is 1.05 mm or more and 1.45 mm or less, When the number of turns of the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is within the area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), G1 (30, 0.03), H1 (30, 0.04), I1 (24, 0.04), J1 (24, 0.05), K1 (18, 0.05), L1 (18, 0.01), M1 (12, 0.01), and N1 (12, 0.005). Multilayer coil components. [2] The multilayer coil component according to [1] above, wherein the (x, y) is within a region surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), H1 (30, 0.04), O1 (24, 0.03), P1 (24, 0.01), L1 (18, 0.01), and Q1 (18, 0.005). [3] The laminated coil component according to [1] or [2] above, wherein a dimension of the laminate in a height direction is 1.05 mm or more and 1.45 mm or less. [4] The laminated coil component according to any one of the above [1] to [3], having an impedance of 300 Ω or more in a frequency band of 10 MHz or more and 1 GHz or less. [5] A laminate in which a plurality of insulator layers and a plurality of coil conductor layers are laminated; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 3.0 mm or more and 3.4 mm or less, and the width dimension is 1.4 mm or more and 1.8 mm or less, If the number of turns in the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0 .04), I2(36,0.04), J2(36,0.05), K2(30,0.05), L2(30,0.06), M2(18,0.06), N2(18,0.03), O2(12,0.03), P2(12,0.01), Q2(18,0.01), R2(18,0.005), Multilayer coil components. [6] The above (x, y) are A2 (84,0.005), B2 (84,0.01), C2 (75,0.01), D2 (75,0.02), E2 (54,0.02), F2(54,0.03), G2(42,0.03), H2(42,0.04), I2(36,0.04), J2(36,0.05), K2(30,0.05 ), L2 (30,0.06), S2 (24,0.06), T2 (24,0.04), U2 (18,0.03), V2 (24,0.02), W2 (36,0.02), X2 (36,0.01), Y2 (54,0.01), Z2 (54,0.005). [7] The laminated coil component according to [5] or [6] above, wherein a dimension in a height direction of the laminate is 1.4 mm or more and 1.8 mm or less. [8] The laminated coil component according to any one of the above [5] to [7], having an impedance of 300 Ω or more in a frequency band of 10 MHz or more and 1 GHz or less. [9] A laminate including a plurality of insulating layers and a plurality of coil conductor layers; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 3.0 mm or more and 3.4 mm or less, and the width dimension is 2.3 mm or more and 2.7 mm or less, If the number of turns in the coil is x and the distance between the coil conductor layers is y (mm), then (x, y) is A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05), K Within the area bounded by 3(30,0.05), L3(30,0.06), M3(12,0.06), N3(18,0.05), O3(18,0.04), P3(24,0.04), Q3(24,0.03), R3(36,0.03), S3(36,0.02), E3(54,0.02), T3(54,0.01), C3(75,0.01), and U3(75,0.005), Multilayer coil components.

[10] The laminated coil component according to [9] above, having an impedance of 300 Ω or more in a frequency band of 10 MHz or more and 1 GHz or less.

[11] The laminated coil component according to any one of the above [1] to

[10] , wherein the coil conductor layer has a thickness of 10 μm or more and 25 μm or less.

[12] The coil component according to any one of the above [1] to

[11] , wherein the coil is electrically connected to the external electrode via an extraction portion. Effect of the Invention

[0007] The present disclosure can provide a laminated coil component that can pass a large current and obtain impedance over a wide frequency band. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view diagrammatically illustrating a laminated coil component 1 according to the present disclosure. [Diagram 2] FIG. 2 is a cross-sectional view showing a cut surface along II-II of the laminated coil component 1 shown in FIG. [Diagram 3] FIG. 3 is a diagram for explaining a method for manufacturing the laminated coil component 1 of the present disclosure. [Figure 4] FIG. 4 is a diagram showing a region where the laminated coil component A in the example provides an impedance of 300 Ω or more. [Diagram 5] FIG. 5 is a diagram showing a region where the laminated coil component A in the example provides an impedance of 500 Ω or more. [Figure 6] FIG. 6 is a diagram showing a region where the laminated coil component B of the example provides an impedance of 300 Ω or more. [Figure 7] FIG. 7 is a diagram showing a region where the laminated coil component B in the example provides an impedance of 500Ω or more. [Figure 8] FIG. 8 is a diagram showing a region where the laminated coil component C of the example provides an impedance of 300 Ω or more. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the present disclosure will be described in detail with reference to the drawings. However, the shapes and arrangements of the laminated coil component and each of the components are not limited to the examples shown in the drawings.

[0010] A perspective view of a laminated coil component 1 of this embodiment is shown in Fig. 1, and a cross-sectional view is shown in Fig. 2. However, the shapes and arrangements of the laminated coil components and components of the following embodiment are not limited to the examples shown in the figures. In the drawings, components having the same function may be denoted by the same reference numerals. The sizes and positional relationships of the components shown in the drawings may be exaggerated to clarify the explanation.

[0011] As shown in FIG. 1 and FIG. 2, the laminated coil component 1 of this embodiment is a laminated coil component having a substantially rectangular parallelepiped shape. In the laminated coil component 1, a surface perpendicular to the L axis in FIG. 1 is referred to as an "end surface", a surface perpendicular to the W axis is referred to as a "side surface", and surfaces perpendicular to the T axis are referred to as an "upper surface" and a "lower surface". The laminated coil component 1 is mounted on another electronic component such as a board at its lower surface. That is, the lower surface of the laminated coil component 1 is a mounting surface. The laminated coil component 1 generally includes a laminate 2 in which a plurality of insulating layers and a plurality of coil conductor layers are laminated, and external electrodes 4 and 5 provided on the surface of the laminate 2. The laminate 2 includes an insulating portion 6 and a coil 7 embedded in the insulating portion 6. The insulating portion 6 is formed by laminating a plurality of insulating layers. The coil 7 is formed by laminating a plurality of coil conductor layers 8, and connecting the coil conductor layers adjacent in the lamination direction with each other by a connection conductor. The external electrodes 4, 5 are each provided continuously on one end face and parts of the four side faces of the laminate 2. The axis of the coil 7 is the lamination direction of the laminate 2, i.e., the lamination direction of the insulator layers and the coil conductor layers 8, which is approximately parallel to the mounting surface, i.e., the lower surface of the laminated coil component.

[0012] The laminated coil component 1 of the present embodiment described above will be described below. In the present embodiment, an aspect in which the insulator portions 6 are made of a ferrite material will be described.

[0013] In the laminated coil component 1 of this embodiment, the laminate 2 is composed of an insulating portion 6 and a coil 7.

[0014] The insulating portion 6 is formed by stacking a plurality of insulating layers.

[0015] The insulating portion 6 is preferably made of a magnetic material, more preferably made of sintered ferrite. The sintered ferrite contains at least Fe, Ni, and Zn as main components. The sintered ferrite may further contain Cu.

[0016] In one embodiment, the sintered ferrite contains at least Fe, Ni, Zn and Cu as main components. Preferably, the sintered ferrite is a Ni-Cu-Zn ferrite.

[0017] In the sintered ferrite, the Fe content, calculated as Fe2O3, is preferably 40.0 mol % or more and 49.5 mol % or less (based on the total of the main components, the same applies below), and more preferably 45.0 mol % or more and 49.5 mol % or less.

[0018] In the sintered ferrite, the Zn content, calculated as ZnO, is preferably 2.0 mol % or more and 35.0 mol % or less (based on the total of the main components, the same applies below), and more preferably 10.0 mol % or more and 30.0 mol % or less.

[0019] In the sintered ferrite, the Cu content, calculated as CuO, is preferably 6.0 mol % or more and 13.0 mol % or less (based on the total of the main components, the same applies below), and more preferably 7.0 mol % or more and 10.0 mol % or less.

[0020] In the sintered ferrite, the Ni content is not particularly limited and may be the balance of the other main components Fe, Zn and Cu. For example, the Ni content is preferably 10.0 mol% or more and 45.0 mol% or less in terms of NiO.

[0021] In one embodiment, the sintered ferrite contains Fe at 40.0 mol % or more and 49.5 mol % or less when calculated as Fe2O3, Zn at 2.0 mol % or more and 35.0 mol % or less when calculated as ZnO, Cu at 6.0 mol % or more and 13.0 mol % or less when calculated as CuO, and Ni at 10.0 mol % or more and 45.0 mol % or less when calculated as NiO.

[0022] In the present disclosure, the sintered ferrite may further contain an additive component. Examples of additive components in the sintered ferrite include, but are not limited to, Mn, Co, Sn, Bi, and Si. The contents (addition amounts) of Mn, Co, Sn, Bi, and Si are preferably 0.1 parts by weight or more and 1 part by weight or less in terms of Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2, respectively, per 100 parts by weight of the total of the main components (Fe (Fe2O3 equivalent), Zn (ZnO equivalent), Cu (CuO equivalent), and Ni (NiO equivalent)). The sintered ferrite may further contain impurities that are unavoidable in the manufacturing process.

[0023] The relative magnetic permeability of the insulating portion 6 can be preferably 3 or more and 800 or less, more preferably 100 or more and 400 or less, and further preferably 100 or more and 200 or less.

[0024] As described above, the coil 7 is configured by electrically connecting the coil conductor layers 8 to each other in a coil shape. The coil conductor layers 8 adjacent to each other in the stacking direction are connected by a connection conductor (e.g., a via conductor) that penetrates the insulator portion 6. The coil 7 is electrically connected to the external electrodes 4 and 5 by lead-out portions.

[0025] The material constituting the coil conductor layer 8 is not particularly limited, and examples thereof include Au, Ag, Cu, Pd, and Ni. The material constituting the coil conductor layer 8 is preferably Ag or Cu, and more preferably Ag. The conductive material may be one type or two or more types.

[0026] The thickness of the coil conductor layer 8 may be preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 25 μm or less. By increasing the thickness of the coil conductor layer 8, the resistance value of the coil conductor layer 8 becomes smaller, and a laminated coil component capable of handling a larger current can be obtained. Here, the thickness of the coil conductor layer refers to the thickness of the coil conductor layer along the lamination direction (L direction in FIG. 2).

[0027] The width of the coil conductor layer 8 may be preferably 100 μm or more and 600 μm or less, more preferably 200 μm or more and 400 μm or less. By increasing the width of the coil conductor layer 8, the resistance value of the coil conductor layer 8 becomes smaller, and a laminated coil component capable of handling a larger current can be obtained. Here, the width of the coil conductor layer refers to the width of the coil conductor layer perpendicular to the winding direction and lamination direction of the coil.

[0028] The thickness of the coil conductor layer can be measured as follows. Polishing is performed with the LT surface of the chip facing the polishing paper, and polishing is stopped at the center of the W dimension of the coil conductor layer. After that, observation is performed under a microscope, and the thickness of the coil conductor layer is measured using the measurement function attached to the microscope. The thickness of the coil conductor layer is measured at the center of the coil conductor layer in the coil conductor layer width direction (T direction in Figure 2) in the LT cross section.

[0029] The width of the coil conductor layer can be measured as follows. Polishing is performed with the TW surface of the chip facing the polishing paper, and polishing is stopped at the center of the L dimension of the coil conductor layer. After that, observation is performed under a microscope, and the width of the coil conductor layer is measured using the measurement function attached to the microscope.

[0030] The connecting conductor is provided so as to penetrate the insulating layer. The material constituting the connecting conductor may be the material described with respect to the coil conductor layer 8. The material constituting the connecting conductor may be the same as or different from the material constituting the coil conductor layer 8. In a preferred embodiment, the material constituting the connecting conductor is the same as the material constituting the coil conductor layer 8. In a preferred embodiment, the material constituting the connecting conductor is Ag.

[0031] The longitudinal dimension (length in the L direction) of the laminate 2 can be preferably 1.8 mm or more and 3.4 mm or less, and the width dimension (length in the W direction) can be 1.05 mm or more and 2.7 mm or less.

[0032] In one embodiment, the longitudinal dimension of the laminate 2 can be 1.8 mm or more and 2.2 mm or less, and the width dimension can be 1.05 mm or more and 1.45 mm or less.

[0033] In another embodiment, the longitudinal dimension of the laminate 2 may be 3.0 mm or more and 3.4 mm or less, and the width dimension may be 1.4 mm or more and 1.8 mm or less.

[0034] In another embodiment, the longitudinal dimension of the laminate 2 may be 3.0 mm or more and 3.4 mm or less, and the width dimension may be 2.3 mm or more and 2.7 mm or less.

[0035] The height dimension of the laminate 2 can be 1.05 mm or more and 1.45 mm or less in one embodiment, 1.4 mm or more and 1.8 mm or less in another embodiment, and 2.3 mm or more and 2.7 mm or less in yet another embodiment.

[0036] The number of turns of the coil 7 may preferably be 12 or more and 84 or less.

[0037] The number of turns of the coil means the number of turns of the coil. That is, the number of turns increases by 1 every time the coil is wound 360°.

[0038] The distance between the coil conductor layers in the laminate 2 is preferably 0.005 mm or more and 0.06 mm or less, and more preferably 0.005 mm or more and 0.04 mm or less.

[0039] The distance between the coil conductor layers can be measured as follows. Polishing is performed with the LT surface of the chip facing the polishing paper, and polishing is stopped at the center of the W dimension of the coil conductor layer. After that, observation is performed under a microscope, and the shortest distance between the coil conductor layers ("d" in Figure 2) is measured using the measurement function attached to the microscope. The shortest distance between all coil conductor layers in the cross section is measured, and the average is taken as the "distance between coil conductor layers."

[0040] In one embodiment, the longitudinal dimension of the laminate 2 is 1.8 mm or more and 2.2 mm or less, and the widthwise dimension is 1.05 mm or more and 1.45 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), (x, y) is, as shown in FIG. 4, A1 (54, 0.005), B1 (54, 0.01), C1 ( The area is within the region bounded by D1(42,0.01), D1(42,0.02), E1(36,0.02), F1(36,0.03), G1(30,0.03), H1(30,0.04), I1(24,0.04), J1(24,0.05), K1(18,0.05), L1(18,0.01), M1(12,0.01), and N1(12,0.005).

[0041] In a preferred embodiment, the longitudinal dimension of the laminate 2 is 1.8 mm or more and 2.2 mm or less, and the width dimension is 1.05 mm or more and 1.45 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), (x, y) is within the area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), H1 (30, 0.04), O1 (24, 0.03), P1 (24, 0.01), L1 (18, 0.01), and Q1 (18, 0.005), as shown in FIG. 5.

[0042] In one embodiment, the longitudinal dimension of the laminate 2 is 3.0 mm or more and 3.4 mm or less, and the widthwise dimension is 1.4 mm or more and 1.8 mm or less. If the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), (x, y) is, as shown in FIG. 6, A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (5 4,0.02), F2(54,0.03), G2(42,0.03), H2(42,0.04), I2(36,0.04), J2(36,0.05), K2(30,0.05), L2(30,0.06), M2(18,0.06), N2(18,0.03), O2(12,0.03), P2(12,0.01), Q2(18,0.01), and R2(18,0.005).

[0043] In a preferred embodiment, the longitudinal dimension of the laminate 2 is 3.0 mm or more and 3.4 mm or less, and the widthwise dimension is 1.4 mm or more and 1.8 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), (x, y) is, as shown in FIG. 7, A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 ( 54,0.03), G2(42,0.03), H2(42,0.04), I2(36,0.04), J2(36,0.05), K2(30,0.05), L2(30,0.06), S2(24,0.06), T2(24,0.04), U2(18,0.03), V2(24,0.02), W2(36,0.02), X2(36,0.01), Y2(54,0.01), Z2(54,0.005).

[0044] In one embodiment, the longitudinal dimension of the laminate 2 is 3.0 mm or more and 3.4 mm or less, and the widthwise dimension is 2.3 mm or more and 2.7 mm or less. If the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), (x, y) is, as shown in FIG. 8, A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), ), H3(42,0.04), I3(36,0.04), J3(36,0.05), K3(30,0.05), L3(30,0.06), M3(12,0.06), N3(18,0.05), O3(18,0.04), P3(24,0.04), Q3(24,0.03), R3(36,0.03), S3(36,0.02), E3(54,0.02), T3(54,0.01), C3(75,0.01), U3(75,0.005).

[0045] The laminated coil component of the present disclosure, by satisfying the above dimensions of the laminate and (x, y), is capable of passing a large current and obtaining impedance over a wide frequency band.

[0046] The external electrodes 4, 5 are provided so as to cover both end faces of the laminate 2. The external electrodes are made of a conductive material, preferably one or more metal materials selected from Au, Ag, Pd, Ni, Sn and Cu.

[0047] The external electrodes 4 and 5 may be single-layer or multi-layered. In one embodiment, the external electrodes may be multi-layered, preferably having 2 to 4 layers, for example, 3 layers.

[0048] In one embodiment, the external electrodes 4, 5 are multi-layered and may include a layer containing Ag or Pd, a layer containing Ni, or a layer containing Sn. In a preferred embodiment, the external electrodes 4, 5 are composed of a layer containing Ag or Pd, a layer containing Ni, and a layer containing Sn. Preferably, the above layers are provided in the following order from the coil conductor layer side: a layer containing Ag or Pd, preferably Ag, a layer containing Ni, and a layer containing Sn. Preferably, the layer containing Ag or Pd is a layer formed by baking an Ag paste or a Pd paste, and the layer containing Ni and the layer containing Sn may be plated layers.

[0049] The laminated coil component of the present disclosure may have an impedance of preferably 300 Ω or more, and more preferably 500 Ω or more, in a frequency band of 10 MHz or more and 1 GHz or less.

[0050] The laminated coil component of the present disclosure can pass a current of preferably 500 mA or more, and more preferably 1.0 A or more. The upper limit of the current that can be passed through the laminated coil component of the present disclosure is not particularly limited, but is, for example, 6 A or less.

[0051] A method for manufacturing the laminated coil component 1 of the present embodiment described above will be described below. In the present embodiment, a mode in which the insulator parts 6 are made of a ferrite material will be described. However, the method for manufacturing the laminated coil component 1 is not limited to the example described below.

[0052] (1) Preparation of magnetic materials

[0053] First, a ferrite material is prepared. The ferrite material contains, for example, Fe, Zn, Cu, and Ni as main components. Usually, the main components of the ferrite material are substantially composed of oxides of Fe, Zn, Cu, and Ni (ideally, Fe2O3, ZnO, NiO, and CuO).

[0054] As the ferrite material, Fe2O3, ZnO, CuO, NiO, and additional components as necessary are weighed to obtain a predetermined composition, and mixed and pulverized. For example, the raw materials of the predetermined composition are placed in a ball mill together with pure water and PSZ (partially stabilized zirconia) balls, and mixed and pulverized in a wet manner for 4 to 8 hours. The pulverized ferrite material is dried and calcined to obtain a calcined powder. For example, the moisture is evaporated and dried, and then calcined at a temperature of 700°C to 800°C for 2 to 5 hours to obtain a calcined powder.

[0055] In the ferrite material, the Fe content, calculated as Fe2O3, is preferably 40.0 mol % or more and 49.5 mol % or less (based on the total of the main components, the same applies below), and more preferably 45.0 mol % or more and 49.5 mol % or less.

[0056] In the ferrite material, the Zn content, calculated as ZnO, is preferably 2.0 mol % or more and 35.0 mol % or less (based on the total of the main components, the same applies below), and more preferably 10.0 mol % or more and 30.0 mol % or less.

[0057] In the ferrite material, the Cu content, calculated as CuO, is preferably 6.0 mol % or more and 13.0 mol % or less (based on the total of the main components, the same applies below), and more preferably 7.0 mol % or more and 10.0 mol % or less.

[0058] In the ferrite material, the Ni content is not particularly limited and may be the balance of the other main components Fe, Zn and Cu. For example, the Ni content is preferably 10.0 mol% or more and 45.0 mol% or less in terms of NiO.

[0059] In one embodiment, the ferrite material contains Fe at 40.0 mol % or more and 49.5 mol % or less when calculated as Fe2O3, Zn at 2.0 mol % or more and 35.0 mol % or less when calculated as ZnO, Cu at 6.0 mol % or more and 13.0 mol % or less when calculated as CuO, and Ni at 10.0 mol % or more and 45.0 mol % or less when calculated as NiO.

[0060] In the present disclosure, the ferrite material may further contain an additive component. Examples of additive components in the ferrite material include, but are not limited to, Mn, Co, Sn, Bi, and Si. The contents (addition amounts) of Mn, Co, Sn, Bi, and Si are preferably 0.1 parts by weight or more and 1 part by weight or less in terms of Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2, respectively, per 100 parts by weight of the total of the main components (Fe (Fe2O3 equivalent), Zn (ZnO equivalent), Cu (CuO equivalent), and Ni (NiO equivalent)). The ferrite material may further contain impurities that are unavoidable in the manufacturing process.

[0061] It is to be noted that the Fe content (converted as Fe2O3), Mn content (converted as Mn2O3), Cu content (converted as CuO), Zn content (converted as ZnO) and Ni content (converted as NiO) in the above-mentioned sintered ferrite can be considered to be substantially no different from the Fe content (converted as Fe2O3), Mn content (converted as Mn2O3), Cu content (converted as CuO), Zn content (converted as ZnO) and Ni content (converted as NiO) in the ferrite material before sintering.

[0062] (2) Preparation of ferrite sheet The calcined powder is placed in a ball mill together with PSZ media, and then an organic binder such as polyvinyl butyral, an organic solvent such as ethanol or toluene, and a plasticizer are added and mixed. Next, the powder is formed into a sheet with a thickness of 20 μm to 50 μm using a doctor blade method or the like, and this is punched into a rectangular shape to produce a green sheet.

[0063] (3) Preparation of conductive paste for coil conductor layer

[0064] First, a conductive material is prepared. Examples of the conductive material include Au, Ag, Cu, Pd, and Ni, and preferably Ag or Cu, and more preferably Ag. A predetermined amount of conductive material powder is weighed, and mixed with a predetermined amount of a solvent (e.g., eugenol), a resin (e.g., ethyl cellulose), and a dispersant in a planetary mixer or the like, and then dispersed in a three-roll mill or the like to prepare a conductive paste for a coil conductor layer.

[0065] (4) Creating the coil pattern The green sheet obtained above is irradiated with a laser to form via holes at predetermined locations. The conductive paste is screen-printed to fill the via holes with the conductive paste and form a coil conductor layer pattern. For example, as shown in Figures 3(a) to (l), via holes are formed in green sheets 21a to 21l, and via conductor patterns 31a to 31l and coil conductor layer patterns 32c to 32j are formed.

[0066] (5) Preparation of unfired laminate The green sheets on which the coil patterns are formed obtained above are stacked in a predetermined order. Specifically, as shown in Fig. 3(a)-(b), the green sheets on which the via conductor patterns are formed are stacked. The stacked green sheets form the exterior of the laminated coil component, and the via conductor patterns form the lead-out portion. In this process, the number of green sheets to be stacked can be appropriately selected according to the desired thickness of the exterior. Next, as shown in Fig. 3(c)-(j), the green sheets on which the via conductor patterns and the coil conductor patterns are formed are stacked. The coil patterns formed by the green sheets of Fig. 3(c)-(f) have three turns. In this process, the number of green sheets to be stacked can be appropriately selected according to the desired number of turns. Next, as shown in Fig. 3(k)-(l), the green sheets on which the via conductor patterns are formed are stacked. The stacked green sheets form the exterior of the laminated coil component, and the via conductor patterns form the lead-out portion. In this process, the number of green sheets to be stacked can be appropriately selected according to the desired thickness of the exterior. The green sheets thus stacked are then thermocompression bonded to produce an unfired laminated block.

[0067] (6) Firing Next, the unsintered laminate block obtained above is cut with a dicer or the like to separate into individual elements.

[0068] Next, the green body is sintered, for example, at a temperature of 900° C. or higher and 920° C. or lower for 2 to 4 hours, to obtain the laminate 2 of the laminated coil component 1.

[0069] Next, the obtained laminate 2 may be subjected to barrel processing to remove the corners of the element body and form roundness. The barrel processing may be performed on an unfired laminate or on a fired laminate. The barrel processing may be either a dry method or a wet method. The barrel processing may be a method of rubbing elements together with each other, or a method of barrel processing together with a media.

[0070] (7) Formation of external electrodes Next, an Ag paste for forming external electrodes containing Ag and glass is applied to the end faces of the laminate 2, and baked at 800° C. to 820° C. to form base electrodes. The thickness of the base electrodes is preferably 1 μm to 10 μm, more preferably 3 μm to 6 μm. Next, a Ni coating and a Sn coating are sequentially formed on the base electrodes by electrolytic plating to form external electrodes, thereby obtaining a laminated coil component 1 as shown in FIG. 1.

[0071] Although one embodiment of the present invention has been described above, this embodiment can be modified in various ways.

[0072] The present invention will be described below with reference to examples, but the present invention is not limited to these examples. EXAMPLES

[0073] Working Example The number of turns and the distance between the coil conductor layers were varied using analysis simulation software Femtet (registered trademark) from Murata Software Co., Ltd., to determine the regions where impedances of 300Ω or more and 500Ω or more were obtained in the frequency range of 10MHz to 1GHz. The simulation was performed on the following laminated coil components A, B, and C. Multilayer coil component A: longitudinal dimension = 2.0 mm, width dimension = 1.2 mm Multilayer coil component B: Lengthwise dimension = 3.2 mm, Widthwise dimension = 1.6 mm Multilayer coil component C: longitudinal dimension = 3.2 mm, width dimension = 2.5 mm

[0074] Simulation conditions Simulation was performed using CAE (Computer Aided Engineering) software Femtet (registered trademark of Murata Software Co., Ltd.). First, a 3D model of the laminated coil component shown in Figs. 1, 2, and 3 was created. The longitudinal dimension of the laminated coil component was set to 3.100 mm, the width and height dimensions to 1.520 mm, the coil inner diameter to 0.450 mm, the width of the coil conductor layer to 0.210 mm, the thickness of the coil conductor layer to 0.018 mm, the land radius to 0.125 mm, the via radius to 0.060 mm, the longitudinal dimension of the laminated coil component of the external electrode to 0.775 mm, the coil conductor layer thickness to the range of 0.005 mm to 0.060 mm, and the total number of turns of the coil to the range of 18.00 turns to 84.00 turns. The material of the coil conductor portion and the external electrodes was silver. In this case, the relative dielectric constant of silver is 1.0 and the conductivity is 6.289×10 7 The base material of the chip coil component was ferrite, with a dielectric constant of 15, the relative permeability and tan δ at 10 MHz were set to 125 and 0.0116, the relative permeability and tan δ at 100 MHz were set to 42 and 1.4980, and the relative permeability and tan δ at 1 GHz were set to 1.42 and 8.0975. The analysis conditions were set to harmonic analysis of electric field analysis, and the impedance (|Z| value) was calculated at 10 MHz, 100 MHz, and 1 GHz. (Each dielectric constant, conductivity, relative permeability, and tan δ are actual measured values.)

[0075] The results are shown in Tables 1 to 3 below.

[0076] Table 1: Simulation results for multilayer coil component A [Table 1]

[0077] Table 2: Simulation results for multilayer coil component B [Table 2]

[0078] Table 3: Simulation results for multilayer coil component C [Table 3]

[0079] From the above results, the regions in which impedances of 300Ω or more and 500Ω or more can be obtained are as follows for the laminated coil components A to C. Here, the number of turns of the coil is x, and the distance between the coil conductor layers is y (mm).

[0080] Multilayer coil component A, 300Ω or more The area enclosed by A1(54,0.005), B1(54,0.01), C1(42,0.01), D1(42,0.02), E1(36,0.02), F1(36,0.03), G1(30,0.03), H1(30,0.04), I1(24,0.04), J1(24,0.05), K1(18,0.05), L1(18,0.01), M1(12,0.01), and N1(12,0.005) (the area shown in Figure 4).

[0081] Multilayer coil component A, 500Ω or more The area enclosed by A1(54,0.005), B1(54,0.01), C1(42,0.01), D1(42,0.02), E1(36,0.02), F1(36,0.03), H1(30,0.04), O1(24,0.03), P1(24,0.01), L1(18,0.01), and Q1(18,0.005) (the area shown in Figure 5).

[0082] Multilayer coil component B, 300Ω or more The area enclosed by A2(84,0.005), B2(84,0.01), C2(75,0.01), D2(75,0.02), E2(54,0.02), F2(54,0.03), G2(42,0.03), H2(42,0.04), I2(36,0.04), J2(36,0.05), K2(30,0.05), L2(30,0.06), M2(18,0.06), N2(18,0.03), O2(12,0.03), P2(12,0.01), Q2(18,0.01), and R2(18,0.005) (the area shown in Figure 6).

[0083] Multilayer coil component B, 500Ω or more A2(84,0.005), B2(84,0.01), C2(75,0.01), D2(75,0.02), E2(54,0.02), F2( 54,0.03), G2(42,0.03), H2(42,0.04), I2(36,0.04), J2(36,0.05), K2(30,0 .05), L2(30,0.06), S2(24,0.06), T2(24,0.04), U2(18,0.03), V2(24,0.02), W2(36,0.02), X2(36,0.01), Y2(54,0.01), Z2(54,0.005) (area shown in Figure 7).

[0084] Multilayer coil component C, 300Ω or more A3(84,0.005), B3(84,0.01), C3(75,0.01), D3(75,0.02), E3(54,0.02), F3(54,0.03), G3(42,0.03), H3(42,0.04), I3(36,0.04), J3(36,0.05), K3(30,0.05), L3(30,0.06), M The area enclosed by 3(12,0.06), N3(18,0.05), O3(18,0.04), P3(24,0.04), Q3(24,0.03), R3(36,0.03), S3(36,0.02), E3(54,0.02), T3(54,0.01), C3(75,0.01), and U3(75,0.005) (the area shown in Figure 8). [Industrial Applicability]

[0085] The laminated coil component according to the present disclosure can be used in a wide variety of applications, such as as an inductor. [Explanation of symbols]

[0086] 1...Laminated coil components 2...Laminate 4,5...External electrode 6…Insulation section 7…Coil 8...Coil conductor layer 21a~21l...Green sheet 31a~31l…Via conductor patterns 32c~32j...Coil conductor pattern

Claims

1. a laminate in which a plurality of insulator layers and a plurality of coil conductor layers are laminated; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 1.8 mm or more and 2.2 mm or less, and the width dimension is 1.05 mm or more and 1.45 mm or less, When the number of turns of the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is within an area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), G1 (30, 0.03), H1 (30, 0.04), I1 (24, 0.04), J1 (24, 0.05), K1 (18, 0.05), L1 (18, 0.01), M1 (12, 0.01), and N1 (12, 0.005). Multilayer coil components.

2. 2. The laminated coil component according to claim 1, wherein the (x, y) is within a region surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), H1 (30, 0.04), O1 (24, 0.03), P1 (24, 0.01), L1 (18, 0.01), and Q1 (18, 0.005).

3. 2. The laminated coil component according to claim 1, wherein a dimension of the laminate in a height direction is not less than 1.05 mm and not more than 1.45 mm.

4. 2. The laminated coil component according to claim 1, having an impedance of 300Ω or more in a frequency band of 10 MHz or more and 1 GHz or less.

5. a laminate in which a plurality of insulator layers and a plurality of coil conductor layers are laminated; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 3.0 mm or more and 3.4 mm or less, and the width dimension is 1.4 mm or more and 1.8 mm or less, When the number of turns of the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is within an area surrounded by A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0.04), I2 (36, 0.04), J2 (36, 0.05), K2 (30, 0.05), L2 (30, 0.06), M2 (18, 0.06), N2 (18, 0.03), O2 (12, 0.03), P2 (12, 0.01), Q2 (18, 0.01), and R2 (18, 0.005). Multilayer coil components.

6. 6. The laminated coil component according to claim 5, wherein the (x, y) is within a region surrounded by A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0.04), I2 (36, 0.04), J2 (36, 0.05), K2 (30, 0.05), L2 (30, 0.06), S2 (24, 0.06), T2 (24, 0.04), U2 (18, 0.03), V2 (24, 0.02), W2 (36, 0.02), X2 (36, 0.01), Y2 (54, 0.01), and Z2 (54, 0.005).

7. 6. The laminated coil component according to claim 5, wherein a dimension of the laminate in a height direction is 1.4 mm or more and 1.8 mm or less.

8. 6. The laminated coil component according to claim 5, having an impedance of 300Ω or more in a frequency band of 10 MHz or more and 1 GHz or less.

9. a laminate in which a plurality of insulator layers and a plurality of coil conductor layers are laminated; an external electrode provided on a surface of the laminate and electrically connected to the coil conductor layer; A laminated coil component comprising: the plurality of insulating layers are magnetic; the plurality of coil conductor layers are electrically connected to form a coil; The axis of the coil is substantially parallel to the mounting surface, The longitudinal dimension of the laminate is 3.0 mm or more and 3.4 mm or less, and the width dimension is 2.3 mm or more and 2.7 mm or less, When the number of turns of the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05), K Within the area surrounded by 3(30,0.05), L3(30,0.06), M3(12,0.06), N3(18,0.05), O3(18,0.04), P3(24,0.04), Q3(24,0.03), R3(36,0.03), S3(36,0.02), E3(54,0.02), T3(54,0.01), C3(75,0.01), and U3(75,0.005), Multilayer coil components.

10. 10. The laminated coil component according to claim 9, having an impedance of 300Ω or more in a frequency band of 10 MHz or more and 1 GHz or less.

11. The laminated coil component according to any one of claims 1 to 10, wherein the coil conductor layer has a thickness of 10 µm or more and 25 µm or less.

12. The laminated coil component according to claim 1, wherein the coil is electrically connected to the external electrodes via lead-out portions.

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