Power supply device

Abstract

A power supply device (1A), comprising: a power supply circuit assembly (7), comprising a first printed circuit board (70) and a power supply conversion module (71), wherein the first printed circuit board (70) has a first surface (700) and a second surface (701) which are arranged opposite to each other, and the power supply conversion module (71) is provided on the first surface (700); a planar transformer (1), comprising a magnetic core assembly (2) that comprises a first magnetic core (20) and a second magnetic core (21), wherein at least one of the first magnetic core (20) and the second magnetic core (21) is arranged adjacent to the first printed circuit board (70); at least one second printed circuit board (3), provided between the first magnetic core (20) and the second magnetic core (21) and comprising a first winding (30); and at least one winding module (4), provided between the first magnetic core (20) and the second magnetic core (21) and comprising a second winding (40) and an injection molded layer (41), wherein the injection molded layer (41) covers at least part of the outer surface of the second winding (40).

Description

Power supply unit Technical Field

[0001] The present disclosure belongs to the field of power supply devices, and in particular relates to a power supply device that combines a planar transformer and a power circuit component in a Lego brick-like stacking manner. Background Art

[0002] A power supply device is used to convert the input electrical energy it receives into output electrical energy to provide the output electrical energy to a load. A power supply device typically includes a plurality of electronic components and a circuit board, wherein the plurality of electronic components includes the most important transformer. Since all electronic components in a traditional electronic device are fixed on the circuit board, the production site of a traditional electronic device must prepare all electronic components before it can be put into production and assembly, which makes the production of traditional electronic devices very inconvenient. In addition, since all electronic components in a traditional electronic device are fixed on the circuit board and cannot be separated, they cannot be repaired individually, resulting in the electronic device having to be completely dismantled during maintenance, which makes the entire power supply device impossible to recycle and reuse.

[0003] Therefore, how to develop a power supply device that overcomes the above-mentioned shortcomings is currently the most urgent issue to be solved.

[0004] Summary of the Invention

[0005] The purpose of the present disclosure is to provide a power supply device, which includes a planar transformer and a power circuit component assembled in a Lego-like stacking manner, thereby making the electronic device of the present disclosure more convenient to manufacture and allowing some components within the power supply device to be individually repaired.

[0006] To achieve the above objectives, a broader embodiment of the present disclosure provides a power supply device, comprising: a power circuit assembly comprising a first printed circuit board (PCB) and a power conversion module, the first PCB comprising a first surface and a second surface disposed opposite each other, the power conversion module being disposed on the first surface; and a planar transformer comprising: a magnetic core assembly comprising a first magnetic core and a second magnetic core, wherein at least one of the first magnetic core and the second magnetic core is disposed adjacent to the first PCB; at least one second PCB disposed between the first magnetic core and the second magnetic core and comprising a first winding; and at least one winding module disposed between the first magnetic core and the second magnetic core and comprising a second winding and an injection molding layer, the injection molding layer covering at least a portion of an outer surface of the second winding. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG1 is a schematic diagram of the combined structure of a power supply device according to a first preferred embodiment of the present disclosure;

[0008] FIG2 is a schematic diagram of the exploded structure of the power supply device shown in FIG1 ;

[0009] FIG3 is a schematic structural diagram of the second winding of the planar transformer shown in FIG1 ;

[0010] FIG4 is a schematic diagram of the internal wiring of the second printed circuit board of the planar transformer shown in FIG1 ;

[0011] FIG5 is a schematic structural diagram of a variation of the second winding of the planar transformer shown in FIG2 ;

[0012] FIG6 is a schematic diagram of the combined structure of a power supply device according to a second preferred embodiment of the present disclosure.

[0013] Description of reference numerals:

[0014] 1A, 1B: Power supply unit

[0015] 7: Power circuit components

[0016] 70: First printed circuit board

[0017] 71: Power conversion module

[0018] 700, 200: First surface

[0019] 701, 210: Second surface

[0020] 1: Planar transformer

[0021] 2: Magnetic core assembly

[0022] 3: Second printed circuit board

[0023] 4: Winding module

[0024] 20: First core

[0025] 21: Second core

[0026] 30: First winding

[0027] 40, 40a: Second winding

[0028] 41: Injection molding layer

[0029] 22: First post

[0030] 23: Second post

[0031] 24: Middle column

[0032] 31: First hollow hole

[0033] 42: Second hollow hole

[0034] 44: First foot area

[0035] 5: Conductor

[0036] 32: Second hole

[0037] 45: Second foot area

[0038] 46, 46a: Second conductive pin

[0039] 400: Surface

[0040] 401: Depression

[0041] 460: First bend

[0042] 461: Second bending portion

[0043] 462: U-shaped structure

[0044] 33: Auxiliary winding

[0045] 34: Shielding structure

[0046] 72: First hole DETAILED DESCRIPTION

[0047] Some typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure is capable of various variations in different implementations without departing from the scope of the present disclosure, and that the descriptions and illustrations therein are intended to be illustrative in nature and not to limit the present disclosure.

[0048] Please refer to Figures 1, 2, 3 and 4, wherein Figure 1 is a schematic diagram of the combined structure of the power supply device of the first preferred embodiment of the present disclosure, Figure 2 is a schematic diagram of the exploded structure of the power supply device shown in Figure 1, Figure 3 is a schematic diagram of the structure of the second winding of the planar transformer shown in Figure 1, and Figure 4 is a schematic diagram of the internal wiring of the second printed circuit board of the planar transformer shown in Figure 1. The power supply device 1A of this embodiment can receive input electrical energy and convert it into output electrical energy to be provided to a load (not shown) for use. The power supply device 1A includes at least one power circuit component 7 and a planar transformer 1. The power circuit component 7 includes a first printed circuit board 70 and a power conversion module 71. The first printed circuit board 70 includes a first surface 700 and a second surface 701 arranged opposite to each other, and the power conversion module 71 is arranged on the first surface 700.

[0049] In some embodiments, the power conversion module 71 is used to convert input power into transition power and may include at least one electronic component, which may be, but is not limited to, a switch, a controller, a diode, a resistor, and a multilayer ceramic capacitor. In some embodiments, as shown in FIG1 , all electronic components of the power conversion module 71 may be independently disposed on the first surface 700. In other embodiments, all electronic components of the power conversion module 71 may be packaged into a single integrated module and then disposed on the first surface 700.

[0050] In other embodiments, the power circuit component 7 may further include a power factor correction module (not shown), an electromagnetic interference (EMI) / radio frequency interference (RFI) module and an input capacitor, wherein the power factor correction module (not shown), the electromagnetic interference (EMI) / radio frequency interference (RFI) module and the input capacitor are respectively arranged on the first surface 700, wherein the power factor correction module is used to perform power factor correction on the input electrical energy, the electromagnetic interference (EMI) / radio frequency interference (RFI) module is used to suppress electromagnetic interference and radio frequency interference, and the input capacitor is used to stabilize the voltage.

[0051] The planar transformer 1 of this embodiment can meet the ultra-thin high-frequency requirements of circuits and is suitable for fully automated assembly and testing. The planar transformer 1 includes a magnetic core component 2, at least one second printed circuit board 3, and at least one winding module 4.

[0052] The magnetic core assembly 2 includes a first magnetic core 20 and a second magnetic core 21. The first magnetic core 20 and the second magnetic core 21 are located on opposite sides of the planar transformer 1. Furthermore, at least one of the first magnetic core 20 and the second magnetic core 21 is positioned adjacent to a first printed circuit board 70. For example, as shown in FIG2 , the second magnetic core 21 is positioned adjacent to the first printed circuit board 70. The first printed circuit board 70 (or the power circuit assembly 7) is positioned at the outermost side of the power supply device 1A.

[0053] The number of second printed circuit boards 3 can be one or more. FIG2 illustrates one second printed circuit board 3 . The second printed circuit board 3 is disposed between the first magnetic core 20 and the second magnetic core 21 . Each second printed circuit board 3 includes a first winding 30 (as shown in FIG4 ). The first winding 30 is formed within the second printed circuit board 3 and can be composed of traces or conductors within the second printed circuit board 3 .

[0054] The number of winding modules 4 can be one or more. Figure 2 illustrates a winding module 4. The winding module 4 is disposed between the first magnetic core 20 and the second magnetic core 21, and can be located between the second printed circuit board 3 and the first magnetic core 20. Furthermore, the winding module 4 includes a second winding 40 and an injection molding layer 41. The second winding 40 can be, but is not limited to, formed by stamping a conductive sheet, such as a copper sheet. The injection molding layer 41 can be formed on the second winding 40 using plastic injection molding and covers at least a portion of the outer surface of the second winding 40. The injection molding layer 41 enables the planar transformer 1 to meet safety protection requirements. Furthermore, in this embodiment, the second printed circuit board 3 and the winding module 4 are separate components, i.e., the second printed circuit board 3 and the winding module 4 are not integrally formed.

[0055] As can be seen from the above, the power supply device 1A disclosed herein includes a power circuit assembly 7 and a planar transformer 1, and the power circuit assembly 7 and the planar transformer 1 can be combined in a stacked manner like Lego blocks. In this way, since the power circuit assembly 7 and the planar transformer 1 can be combined or disassembled, the power supply device 1A does not need to prepare all electronic components before it can be put on line for production and assembly. That is, the power circuit assembly 7 and the planar transformer 1 can be assembled separately in different places and then assembled to form the power supply device 1A. Therefore, the power supply device 1A is more convenient to manufacture. In addition, since the power circuit assembly 7 and the planar transformer 1 can be combined in a stacked manner like Lego blocks, the power circuit assembly 7 and the planar transformer 1 can be repaired individually during maintenance, so there is no need to completely dismantle the power supply device 1A. In this way, the utilization rate of the components in the power supply device 1A can be improved. Furthermore, since the planar transformer 1 includes a second printed circuit board 3 and a winding module 4, which are independent components, wherein the second printed circuit board 3 includes a first winding 30 and the winding module 4 includes a second winding 40, the planar transformer 1 actually adopts a separate design for the windings required for the transformer to form the first winding 30 and the second winding 40, which are respectively located on two independent components. In this way, the planar transformer 1 can reduce the number of layers of the second printed circuit board 3 because the second winding 40 is located on the winding module 4, so that the number of layers of the second printed circuit board 3 is less than the number of layers of a single circuit board of a traditional planar transformer, thereby shortening the production cycle of the planar transformer 1, and making the process technology of the second printed circuit board 3 lower and the fault tolerance higher, thereby reducing the production cost of the planar transformer 1. Furthermore, the planar transformer 1 disclosed in the present invention has excellent adjustability.

[0056] In some embodiments, the first winding 30 constitutes one of the primary and secondary windings of the planar transformer 1, and the second winding 40 constitutes the other of the primary and secondary windings of the planar transformer 1. Furthermore, the thickness of the second winding 40 can be greater than or equal to 0.01 mm and less than or equal to 1.5 mm, and the number of turns of the second winding 40 is two or more. Furthermore, the safety protection distance between the first winding 30 and the second winding 40 is 0.4 mm. This safety protection distance can be achieved by the thickness of the injection molding layer 41 or by the thickness of the second printed circuit board 3. Furthermore, the thickness of the injection molding layer 41 can be greater than or equal to 0.4 mm and less than or equal to 0.8 mm.

[0057] In some embodiments, the magnetic core assembly 2 further includes a first side post 22, a second side post 23, and a center post 24. The first side post 22 and the second side post 23 are located on opposite sides of the magnetic core assembly 2, and the center post 24 is located between the first side post 22 and the second side post 23. The first side post 22, the second side post 23, and the center post 24 are located between the first magnetic core 20 and the second magnetic core 21. In addition, as shown in FIG2 , the first side post 22, the second side post 23, and the center post 24 can each be composed of two sub-magnetic posts, one of the sub-magnetic posts of the first side post 22, one of the sub-magnetic posts of the second side post 23, and one of the sub-magnetic posts of the center post 24 are connected to the first magnetic core 20, and the other sub-magnetic post of the first side post 22, another sub-magnetic post of the second side post 23, and another sub-magnetic post of the center post 24 are connected to the second magnetic core 21. Of course, in other embodiments, the first side pillar 22 , the second side pillar 23 and the middle pillar 24 may each be formed of a single structure and connected to the first magnetic core 20 or the second magnetic core 21 .

[0058] In some embodiments, the second printed circuit board 3 includes a first hollow hole 31, and the winding module 4 includes a second hollow hole 42. The first hollow hole 31 passes through the second printed circuit board 3, and the second hollow hole 42 passes through the winding module 4. The first hollow hole 31 and the second hollow hole 42 are respectively arranged at positions corresponding to the center column 24 of the magnetic core component 2. When the first magnetic core 20 and the second magnetic core 21 of the magnetic core component 2 are respectively fastened to the second printed circuit board 3 and the winding module 4 from opposite sides of the planar transformer 1, the center column 24 is penetrated by the first hollow hole 31 and the second hollow hole 42.

[0059] In some embodiments, the injection molded layer 41 includes a first pin region 44 located on a first side of the injection molded layer 41 and including a first upper surface and a first lower surface. The first upper surface and the first lower surface are substantially parallel to the second printed circuit board 3. The planar transformer 1 further includes at least one conductor 5, such as a first conductive pin. The conductor 5 can be disposed at the first pin region 44 of the injection molded layer 41 when the injection molded layer 41 is formed on the second winding 40 by injection molding. The conductor 5 is substantially perpendicular to the first upper and first lower surfaces of the first pin region 44 and is partially covered by the injection molded layer 41. Furthermore, the conductor 5 is exposed at the first upper and first lower surfaces of the first pin region 44 and extends in a direction perpendicular to the first pin region 44. The portion of the conductor 5 exposed at the first pin region 44 can be conductively connected to a trace or conductor on the second printed circuit board 3, such as the first winding 30, by soldering. The conductor 5 can also be mounted on a system board (not shown).

[0060] In addition, in other embodiments, the first printed circuit board 70 further includes at least one first through-hole 72. The number and location of the first through-holes 72 correspond to the number and location of the conductors 5. Each first through-hole 72 allows a corresponding conductor 5 to pass through, so that the conductor 5 is assembled with the first printed circuit board 70. In this way, the power circuit assembly 7 and the planar transformer 1 can be assembled in a stacked manner like Lego blocks, and the conductor 5 can be electrically connected to the power conversion module 71 via traces (not shown) or conductors (not shown) on the first printed circuit board 70.

[0061] In some embodiments, the second printed circuit board 3 includes at least one second through hole 32 . The second through hole 32 is positioned relative to the corresponding conductor 5 . Each second through hole 32 allows a corresponding conductor 5 to pass through, and at least a portion of the conductor 5 is electrically connected to a trace or conductor on the second printed circuit board 3 .

[0062] In other embodiments, the injection molded layer 41 includes a second pin area 45 located on a second side of the injection molded layer 41, wherein the first side and the second side of the injection molded layer 41 are opposite each other. The second pin area 45 includes a second upper surface and a second lower surface, and the second upper surface and the second lower surface of the second pin area 45 are substantially parallel to the second printed circuit board 3. Furthermore, the winding module 4 further includes at least one second conductive pin 46, such as the two second conductive pins 46 shown in FIG. 3. The second conductive pin 46 is at least partially disposed within the second pin area 45. One end of each second conductive pin 46 is connected to a corresponding end of the second winding 40 and disposed within the second pin area 45. The other end of each second conductive pin 46 is exposed above or below the second upper surface or the second lower surface of the second pin area 45 and extends in a direction perpendicular to the second pin area 45. The two second conductive pins 46 can be plugged into the system board. In some embodiments, the two second conductive pins 46 may be integrally formed with the two opposite ends of the second winding 40. In other words, the two second conductive pins 46 may be directly extended from the two opposite ends of the second winding 40, and in order to expose the other end of the second conductive pin 46 to the second upper surface or the second lower surface of the second foot area 45 and extend in a direction perpendicular to the second foot area 45, each second conductive pin 46 may be bent at 90 degrees at least once from the corresponding end of the second winding 40.

[0063] In some embodiments, the second winding 40, formed of a conductive sheet, further includes a surface 400 and a recessed portion 401. The recessed portion 401 is formed inward from the surface 400. The design of the recessed portion 401 can reduce the skin effect, thereby increasing the conversion efficiency of the planar transformer 1. In other embodiments, when the second conductive pin 46 and the corresponding end of the second winding 40 are integrally formed, the surface of the second conductive pin 46 may also have a recessed portion.

[0064] In some embodiments, the area of ​​the first surface 700 of the first printed circuit board 70 is the same as the area of ​​the second surface 701 of the first printed circuit board 70 , the area of ​​the first surface 200 of the first magnetic core 20 is the same as the area of ​​the second surface 210 of the second magnetic core 21 , and the area of ​​the second surface 701 of the first printed circuit board 70 is less than or equal to 1.5 times the area of ​​the second surface 210 of the second magnetic core 21 . When the first printed circuit board 70 is adjacent to the second magnetic core 21 , the overlap between the second surface 701 of the first printed circuit board 70 and the second surface 210 of the second magnetic core 21 accounts for at least 70% of the area of ​​the second surface 701 of the first printed circuit board 70 or 70% of the area of ​​the second surface 210 of the second magnetic core 21 . When the first printed circuit board 70 is adjacent to the first magnetic core 20 , the overlap between the second surface 701 of the first printed circuit board 70 and the first surface 200 of the first magnetic core 20 accounts for at least 70% of the area of ​​the second surface 701 of the first printed circuit board 70 or 70% of the area of ​​the first surface 200 of the first magnetic core 20 .

[0065] Referring again to FIG. 4 , in some embodiments, the second printed circuit board 3 includes, in addition to the first winding 30, at least one auxiliary winding 33 and at least one shielding structure 34. Each auxiliary winding 33 and each shielding structure 34 can be located in any space on one or more layers within the second printed circuit board 3 and is not limited to the locations shown in FIG. The auxiliary winding 33 and the first winding 30 together constitute the primary or secondary winding of the planar transformer 1 . The auxiliary winding 33 can serve as a control signal line for the circuit. Furthermore, the wire diameter of the auxiliary winding 33 is smaller than or equal to that of the first winding 30. The shielding structure 34 is a metal conductor structure used to suppress EMI. In some embodiments, at least one layer of the second printed circuit board 3 includes the first winding 30. Furthermore, each layer of the second printed circuit board 3 can include at least one of the first winding 30, the auxiliary winding 33, and the shielding structure 34.

[0066] In some embodiments, after the power circuit assembly 7 and the planar transformer 1 are assembled like Lego bricks, they can be potted to cover at least a portion of the power circuit assembly 7 and the planar transformer 1 with a resin to enhance the safety and reliability of the power supply device 1A. In other embodiments, the conductor 5 (i.e., the first conductive pin) and the second conductive pin 46 can each be partially exposed to the potting resin, thereby allowing the conductor 5 and the second conductive pin 46 to be plugged into a system board.

[0067] In some embodiments, as shown in FIG. 2 , the power supply device 1A further includes a hollow cover 8 for accommodating the assembled power circuit assembly 7 and the planar transformer 1 , thereby protecting the internal components of the power supply device 1A.

[0068] In other embodiments, the power supply device 1A may instead include two power supply circuit assemblies, respectively disposed on two opposite outer sides of the power supply device 1A, wherein the first printed circuit board 70 of one of the two power supply circuit assemblies is disposed adjacent to the second magnetic core 21, and the first printed circuit board of the other of the two power supply circuit assemblies is disposed adjacent to the first magnetic core 20.

[0069] Please refer to FIG5 , which is a schematic diagram of a variation of the second winding of the planar transformer shown in FIG2 . In some embodiments, as shown in FIG5 , at least one second conductive pin 46 may include a first bent portion 460 and a second bent portion 461. The first bent portion 460 is connected between the corresponding end of the second winding 40 and the second bent portion 461 and is at least partially disposed within the second footing region 45 . Furthermore, the first bent portion 460 is formed by bending at least once an end of the second winding 40 . The second bent portion 461 is at least partially exposed on the second upper surface or the second lower surface of the second footing region 45 and extends perpendicular to the second footing region 45 . The second bent portion 461 is formed by bending once an end of the first bent portion 460 , so that the second bent portion 461 includes a U-shaped structure 462 at the bend. The formation of the U-shaped structure 462 increases the overall lead length of the second winding 40 .

[0070] Of course, referring to the above content, it can be known that the number of printed circuit boards and the number of winding modules of the planar transformer of the present disclosure can be arbitrarily changed according to actual needs, for example, including two winding modules and one printed circuit board.

[0071] Please refer to Figure 6, which is a schematic diagram of the combined structure of the power supply device of the second preferred embodiment of the present disclosure. The power supply device 1B of this embodiment is similar in structure to the power supply device 1A shown in Figure 1, and the same component numbers represent the same components, structures and functions, which will not be repeated here. Compared to the power supply device 1A shown in Figure 1, in which the power circuit assembly 7 is located at the outermost side of the power supply device 1A, the power circuit assembly 7 of the power supply device 1B of this embodiment is disposed between the first magnetic core 20 and the second magnetic core 21 of the magnetic core assembly 2. Therefore, the first printed circuit board 70 is disposed adjacent to the first magnetic core 20 and the second magnetic core 21, respectively.

[0072] In summary, the present disclosure provides a power supply device comprising a power circuit assembly and a planar transformer, wherein the power circuit assembly and the planar transformer can be stacked together like Lego blocks. As a result, since the power circuit assembly and the planar transformer form a combined structure, the power supply device does not require all electronic components to be assembled online during production. In other words, the power circuit assembly and the planar transformer can be assembled separately and then assembled together to form the power supply device, making the power supply device more convenient to manufacture. Furthermore, since the power circuit assembly and the planar transformer can be stacked together like Lego blocks, the power circuit assembly and the planar transformer can be repaired individually during maintenance, eliminating the need to completely dismantle the power supply device, thereby improving component utilization within the power supply device. Furthermore, because the planar transformer includes a second printed circuit board and a winding module, which are independent components, wherein the second printed circuit board includes a first winding and the winding module includes a second winding, the planar transformer actually separates the windings required for the transformer into a first winding and a second winding, and the windings are located on two independent components respectively. In this way, the planar transformer can reduce the number of layers of the second printed circuit board because the second winding is located on the winding module. The number of layers of the second printed circuit board is fewer than the number of layers of a single circuit board in a traditional planar transformer, thereby shortening the production cycle of the planar transformer, and making the process of the second printed circuit board lower and the fault tolerance higher, thereby reducing the production cost of the planar transformer. Furthermore, the planar transformer disclosed in the present invention has excellent adjustability.

Claims

1. A power supply device, comprising: At least one power circuit assembly includes a first printed circuit board and a power conversion module, the first printed circuit board includes a first surface and a second surface disposed opposite to each other, and the power conversion module is disposed on the first surface; and A planar transformer comprising: A magnetic core assembly, comprising a first magnetic core and a second magnetic core, wherein at least one of the first magnetic core and the second magnetic core is disposed adjacent to the first printed circuit board; at least one second printed circuit board, disposed between the first magnetic core and the second magnetic core, and comprising a first winding; and At least one winding module is disposed between the first magnetic core and the second magnetic core and comprises a second winding and an injection molding layer, wherein the injection molding layer covers at least a portion of the outer surface of the second winding.

2. The power supply device as claimed in claim 1, wherein the power circuit component is located at the outermost side of the power supply device, and the second magnetic core is disposed adjacent to the first printed circuit board.

3. The power supply device as claimed in claim 1, wherein the planar transformer further comprises at least one conductor, the at least one conductor is partially covered by the injection molding layer, the first printed circuit board further comprises at least one first through hole, the number and setting positions of the first through holes correspond to the number and setting positions of the conductors, each of the first through holes is for the corresponding conductor to pass through, so that the conductor is assembled with the first printed circuit board.

4. The power supply device as claimed in claim 1, wherein the power supply device further comprises a hollow cover for accommodating the combined power circuit component and the planar transformer.

5. The power supply device as described in claim 1, wherein the first winding constitutes one of a primary side winding and a secondary side winding of the planar transformer, and the second winding constitutes the other of the primary side winding and the secondary side winding of the planar transformer. 6 . The power supply device as claimed in claim 1 , wherein the thickness of the second winding is greater than or equal to 0.01 mm and less than or equal to 1.5 mm, and the thickness of the injection molding layer is greater than or equal to 0.4 mm and less than or equal to 0.8 mm.

7. The power supply device as claimed in claim 1, wherein the planar transformer comprises at least one conductor, the at least one conductor is partially covered by the injection molding layer, and the at least one conductor is conductively connected to the first winding, assembled with the first printed circuit board and electrically connected to the power conversion module.

8. The power supply device as claimed in claim 7, wherein the injection molding layer includes a first pin area, which is located on a first side of the injection molding layer and includes a first upper surface and a first lower surface, the first upper surface and the first lower surface are parallel to the second printed circuit board, and the at least one conductor includes at least one first conductive pin, the first conductive pin is disposed in the first pin area and is partially covered by the injection molding layer, and the first conductive pin is further exposed to the first upper surface and the first lower surface of the first pin area and extends in a direction perpendicular to the first pin area, wherein the first conductive pin is conductively connected to the first winding.

9. The power supply device as claimed in claim 8, wherein the second printed circuit board comprises at least one second through hole, each of the second through holes is arranged opposite to the corresponding conductor, and the second through holes are used for the corresponding conductor to pass through.

10. A power supply device as described in claim 8, wherein the injection molding layer includes a second pin area, which is located on a second side opposite to the first side of the injection molding layer, and the second pin area includes a second upper surface and a second lower surface, the second upper surface and the second lower surface are parallel to the second printed circuit board, and the winding module further includes at least one second conductive pin, the second conductive pin is arranged in the second pin area and is partially covered by the injection molding layer, and the second conductive pin is further exposed to the second upper surface or the second lower surface of the second pin area and extends in a direction perpendicular to the second pin area, wherein the second conductive pin is conductively connected to the second winding.

11. A power supply device as described in claim 10, wherein the second conductive pin includes a first bending portion and a second bending portion, the first bending portion is connected between the second winding and the second bending portion, and is at least partially disposed in the second pin area, wherein the first bending portion is formed by bending an end portion of the second winding at least once, the second bending portion is at least partially exposed to the second upper surface or the second lower surface of the second pin area and extends in a direction perpendicular to the second pin area, and the second bending portion is formed by bending an end portion of the first bending portion once, wherein the second bending portion includes a U-shaped structure at the bending position.

12. The power supply device as claimed in claim 1, wherein the power circuit component and the planar transformer are at least partially covered by resin in a potting manner for packaging.

13. The power supply device as claimed in claim 10, wherein the power circuit component and the planar transformer are at least partially covered by resin in a potting manner for packaging, and the first conductive pin and the second conductive pin are respectively partially exposed to the potting resin and at least partially exposed.

14. The power supply device as claimed in claim 1, wherein the second winding is formed by stamping a conductive sheet. 15 . The power supply device as claimed in claim 14 , wherein the second winding further comprises a surface and a recessed portion, wherein the recessed portion is formed by being recessed from the surface of the second winding.

16. The power supply device as claimed in claim 1, wherein the second printed circuit board comprises at least one layer, and the second printed circuit board comprises at least one auxiliary winding and at least one shielding structure, wherein the auxiliary winding and the first winding are together a primary winding or a secondary winding of the planar transformer, and the auxiliary winding constitutes a control signal line, and the shielding structure is a metal conductor structure, wherein, The at least one layer of the second printed circuit board includes the first winding, and each layer of the second printed circuit board includes at least one of the first winding, the auxiliary winding and the shielding structure.

17. The power supply device as described in claim 1, wherein the power supply device comprises two power supply circuit components, the two power supply circuit components are respectively arranged on two opposite outer sides of the power supply device, the first printed circuit board of one of the two power supply circuit components is arranged adjacent to the second magnetic core, and the first printed circuit board of the other one of the two power supply circuit components is arranged adjacent to the first magnetic core.

18. The power supply device as claimed in claim 1, wherein an area of ​​the first surface of the first printed circuit board is the same as an area of ​​the second surface of the first printed circuit board, an area of ​​a first surface of the first magnetic core is the same as an area of ​​a second surface of the second magnetic core, and an area of ​​the second surface of the first printed circuit board is less than or equal to 1.5 times an area of ​​the second surface of the second magnetic core; when the first printed circuit board is adjacent to the second magnetic core, a portion where the second surface of the first printed circuit board and the second surface of the second magnetic core overlap with each other accounts for at least 70% of an area of ​​the second surface of the first printed circuit board or 70% of an area of ​​the second surface of the second magnetic core; when the first printed circuit board is adjacent to the first magnetic core, a portion where the second surface of the first printed circuit board and the first surface of the first magnetic core overlap with each other accounts for at least 70% of an area of ​​the second surface of the first printed circuit board or 70% of an area of ​​the first surface of the first magnetic core. 19 . The power supply device as claimed in claim 1 , wherein the power conversion module comprises at least one switch element, at least one controller, at least one diode, at least one resistor and at least one multilayer ceramic capacitor.

Images