Temperature measuring device

Abstract

This temperature measuring device comprises a heat pipe including a container inside which a working fluid is sealed, a temperature sensor for detecting a temperature of the heat pipe, and a wire portion connected to the temperature sensor, wherein the heat pipe accepts heat from a plurality of heat sources.

Description

[Technical field]

[0001] The present invention relates to a temperature measuring device. This application claims priority based on Patent Application No. 2021-133131, filed in Japan on August 18, 2021, the contents of which are incorporated herein by reference. [Background technology]

[0002] Conventionally, a temperature measuring device such as that shown in Patent Document 1 has been known. This temperature measuring device has multiple temperature sensors to measure the temperatures of multiple arranged heat sources (battery cells). By measuring the temperatures of the multiple battery cells, an abnormality is detected based on a change in the temperature of the battery. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2010 / 0136392 Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration of Patent Document 1, multiple temperature sensors are arranged according to the number of heat sources. In addition, since a circuit for outputting measurement data is connected to each of the multiple temperature sensors, the temperature measurement device may become large in size.

[0005] The present invention has been made in consideration of the above circumstances, and has an object to provide a temperature measuring device capable of measuring temperature changes of multiple heat sources with one temperature sensor. [Means for solving the problem]

[0006] In order to solve the above problem, a temperature measuring device according to one embodiment of the present invention comprises a heat pipe having a container in which a working fluid is sealed, a temperature sensor that detects the temperature of the heat pipe, and a wire portion connected to the temperature sensor, wherein the heat pipe receives heat from multiple heat sources.

[0007] In this configuration, by thermally connecting the heat pipe to multiple heat sources, the working fluid circulates and the heat generated from the heat source can be transported by the working fluid to the vicinity of the temperature sensor. When the temperature of, for example, any one of the multiple heat sources increases, the temperature of the heat pipe detected by the temperature sensor also increases. Therefore, it is possible to detect an abnormality in any one of the multiple heat sources in contact with the heat pipe. In this way, the temperature measuring device can be made smaller because an abnormality in multiple heat sources can be detected by one temperature sensor. In the above-mentioned temperature measuring device, the heat is transported from the heat source to the temperature sensor by the working fluid. For example, if the heat is simply conducted by a metal rod with high thermal conductivity, it may take several minutes for the heat to be transferred. In contrast, the heat transfer by the above-mentioned working fluid is much faster than the heat transfer speed by thermal conduction, so the response speed to the temperature change of the heat source can be increased. As described above, the temperature measuring device of the above aspect can quickly detect abnormalities in a plurality of heat sources with a simple configuration.

[0008] The temperature measuring device may further include a contact surface extension plate located between the multiple heat sources and the heat pipe, the heat pipe having a flat shape, and the contact surface extension plate may be plate-shaped extending perpendicular to the thickness direction of the heat pipe.

[0009] The temperature measuring device may further include an insulating layer located between the multiple heat sources and the heat pipe, the heat pipe having a flat shape, and the insulating layer may be plate-shaped extending perpendicular to the thickness direction of the heat pipe.

[0010] The temperature measuring device may further include a height adjustment layer located between the multiple heat sources and the heat pipe, the heat pipe having a flat shape, and the height adjustment layer may be plate-shaped extending perpendicular to the thickness direction of the heat pipe.

[0011] The wire portion may be an FPC.

[0012] The temperature sensor may be disposed at a first end in a longitudinal direction of the heat pipe, and the first end side of the heat pipe may serve as a condensation section where vapor of the working fluid is condensed.

[0013] The temperature measuring device may further include a heat sink disposed at a second end in the longitudinal direction of the heat pipe.

[0014] The temperature measuring device may further include a cold plate having an inlet and an outlet for a coolant, and the plurality of heat sources may be disposed between the cold plate and the heat pipe. Effect of the Invention

[0015] According to the above-described aspect of the present invention, it is possible to provide a temperature measuring device capable of measuring temperature changes of a plurality of heat sources with one temperature sensor. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a top view of a temperature measuring device according to a first embodiment. [Diagram 2] FIG. 1 is a side view of a temperature measuring device according to a first embodiment. [Diagram 3] FIG. 2 is a cross-sectional view of a heat pipe. [Figure 4] FIG. 11 is a top view of a temperature measuring device according to a second embodiment. [Diagram 5] FIG. 11 is a side view of a temperature measuring device according to a second embodiment. [Figure 6] FIG. 11 is a top view of a temperature measuring device according to a third embodiment. [Figure 7] FIG. 11 is a side view of a temperature measuring device according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] (First embodiment) The configuration of the temperature measuring device 1 of this embodiment will be described below with reference to the drawings. 1 and 2, the temperature measuring device 1 includes a heat pipe 10, a temperature sensor 20, a wire portion 30, a contact surface extension plate 41, an insulating layer 42, and a height adjustment layer 43. In a cross-sectional view perpendicular to the longitudinal direction of the heat pipe 10, the heat pipe 10 has a flat shape. The temperature measuring device 1 measures the temperatures of multiple heat sources 100. Each heat source 100 is disposed between the heat pipe 10 and the cold plate 50. The heat sources 100 are, for example, multiple semiconductors mounted on a substrate 101. In Fig. 1, one heat source 100 is mounted on one substrate 101. However, multiple heat sources 100 may be mounted on one substrate 101.

[0018] (direction definition) In this embodiment, an XYZ orthogonal coordinate system is set to explain the positional relationship of each component. The X direction is the longitudinal direction in which the heat pipe 10 extends. The Y direction is the thickness direction of the heat pipe 10. The direction perpendicular to both the X direction and the Y direction is the Z direction. Hereinafter, the X direction is referred to as the longitudinal direction, the Y direction is referred to as the thickness direction, and the Z direction is referred to as the width direction.

[0019] 3, the heat pipe 10 includes a wick 12 and a container 13. The heat pipe 10 is a heat transport element that receives heat from multiple heat sources 100 and transports the heat by utilizing the latent heat of a working fluid sealed in the container 13.

[0020] As shown in FIG. 3, the heat pipe 10 has a first surface 10c and a second surface 10d facing in the thickness direction, and two side surfaces 10e facing in the width direction. The container 13 is a hollow vessel formed in a flat shape in a cross section perpendicular to the longitudinal direction. The material of the container 13 can be appropriately selected depending on conditions such as the type of working fluid and the operating temperature. For example, the container 13 is formed of a metal such as copper, steel, or aluminum. In particular, when a metal material with high thermal conductivity such as copper or aluminum is used, it is possible to improve heat transportability and heat diffusivity. In this embodiment, a copper pipe is used as the container 13.

[0021] The container 13 has a width greater than a thickness in a thickness direction. That is, the surface area of ​​the first surface 10c is greater than that of the side surface 10e. The length of the heat pipe 10 in the longitudinal direction is a length that allows contact with multiple heat sources 100. In the width direction, the width of the heat pipe 10 may be smaller than the width of the heat source 100. The width of the heat pipe 10 in the width direction is approximately constant in the longitudinal direction. Also, the thickness of the heat pipe 10 in the thickness direction is approximately constant in the longitudinal direction. Note that, at the end of the heat pipe 10 in the longitudinal direction, the width and thickness of the heat pipe 10 in the width direction and the thickness direction may be gradually narrowed toward the end face.

[0022] A working fluid is sealed in the internal space 11 of the container 13. The working fluid is a known heat transport medium capable of undergoing a phase change, and undergoes a phase change between a liquid phase and a gas phase within the container 13. For example, water, alcohol, ammonia, alternative fluorocarbons, etc. can be used as the working fluid. The type of working fluid may be changed as appropriate depending on the temperature measurement range and accuracy required for the temperature measuring device 1. In this specification, a working fluid in the liquid phase may be referred to as a "working liquid", and a working fluid in the gas phase may be referred to as "steam". In addition, when there is no particular distinction between the liquid phase and the gas phase, they are simply referred to as working fluid. The working fluid is not shown in FIG. 3.

[0023] A wick 12 is disposed within the container 13 . 3, the wick 12 is formed along the inner peripheral surface of the container 13. In the longitudinal direction, the wick 12 extends over the entire length inside the container 13. Note that the wick 12 may be formed only in a partial region of the inner peripheral surface of the container 13 in the circumferential and longitudinal directions. The wick 12 is formed, for example, by bundling a plurality of thin metal wires. The thin metal wires are linear bodies extending in the longitudinal direction of the container 13. The thin metal wires of the wick 12 are, for example, a plurality of thin copper wires. The outer diameter of the thin copper wires is, for example, several μm to several hundred μm.

[0024] Gaps are formed between the copper wires, extending in the longitudinal direction. These gaps are used as liquid flow paths for the working fluid, and serve as return paths (hereinafter referred to as "flow paths") for returning the working fluid from the condenser to the evaporator. The working fluid in the flow paths flows in the longitudinal direction due to capillary force. The wick 12 is not limited to thin metal wires, but may also be made of a metal mesh (mesh-like body) or a sintered body of metal powder.

[0025] Examples of metals constituting the wick 12 include copper, aluminum, stainless steel, and alloys thereof. The wick 12 is not limited to being made of metal, and may be made of a carbon material, etc. For example, the wick 12 may be made of fine carbon wires, carbon mesh, etc.

[0026] The contact surface extension plate 41 is located between the heat sources 100 and the heat pipes 10. The contact surface extension plate 41 is plate-shaped and extends perpendicular to the thickness direction. The contact surface extension plate 41 is made of a metal with high thermal conductivity, such as copper, a copper alloy, aluminum, or an aluminum alloy. When viewed in the thickness direction, the contact surface extension plate 41 is configured to cover the multiple heat sources 100. The dimension in the width direction of the contact surface extension plate 41 is larger than the width of the heat pipe 10 and is equal to or larger than the width of the heat source 100. 1, one contact surface extension plate 41 is arranged to cover seven heat sources 100, but the number of contact surface extension plates 41 can be changed as appropriate. For example, two contact surface extension plates 41 may be arranged, with one contact surface extension plate 41 covering three heat sources 100 and the other contact surface extension plate 41 covering the remaining four heat sources 100. The number of heat sources 100 may be changed as appropriate. The contact surface extension plate 41 having a large surface area comes into contact with the first surface 10c of the heat pipe 10, so that the heat generated in the multiple heat sources 100 can be efficiently transferred to the heat pipe 10. The contact surface extension plate 41 may be omitted.

[0027] The insulating layer 42 is located between the heat sources 100 and the heat pipe 10. The insulating layer 42 is plate-shaped and extends perpendicular to the thickness direction. In the example of Fig. 1 and Fig. 2, the insulating layer 42 is located between the contact surface extension plate 41 and the heat sources 100. Even if an electric circuit is formed on the surface of the heat source 100 or if an electric leakage occurs in the heat source 100, the presence of the insulating layer 42 can prevent an electric short circuit via the heat pipe 10 or the contact surface extension plate 41. When viewed in the thickness direction, the insulating layer 42 has a size equivalent to that of the contact surface extension plate 41. Note that a plurality of insulating layers 42 may be arranged to cover the plurality of heat sources 100, respectively, so that the plurality of heat sources 100 and the heat pipe 10 are not electrically connected to each other. The insulating layer 42 is preferably made of a material that has insulating properties and low thermal resistance, so that the heat generated in the heat source 100 can be efficiently transferred to the heat pipe 10. In addition, when the heat pipe 10 is covered with an insulating coating or when the contact surface extension plate 41 has insulating properties, the insulating layer 42 does not have to be disposed.

[0028] The height adjustment layer 43 is located between the heat sources 100 and the heat pipe 10. The height adjustment layer 43 is plate-shaped and extends perpendicular to the thickness direction. In the example of Fig. 1 and Fig. 2, the height adjustment layer 43 is located between the insulating layer 42 and the heat sources 100. The height adjustment layer 43 is a layer formed of a material that deforms when compressed. For example, when the positions of the upper surfaces of the heat sources 100 vary in the thickness direction, the height adjustment layer 43 can be pressed against the heat sources 100 and deformed according to the positions of the heat sources 100 in the thickness direction, so that a gap (air layer) does not occur between the upper surfaces of the heat sources 100 and the heat pipe 10. This allows the heat from the heat sources 100 to be efficiently transferred to the heat pipe 10.

[0029] When viewed in the thickness direction, the height adjustment layer 43 has a size equivalent to that of the contact surface extension plate 41. Note that a plurality of height adjustment layers 43 may be arranged so as to cover a plurality of heat sources 100, respectively. This makes it possible to prevent electrical short circuits between the heat sources 100 via the height adjustment layers 43. The height adjustment layer 43 is preferably formed of a material that is deformable by compression and has low thermal resistance. In this case, the heat generated in the heat source 100 can be efficiently transferred to the heat pipe 10. For example, the height adjustment layer 43 may be formed of silicone. The height adjustment layer 43 may be omitted. For example, when the positions of the upper surfaces of the multiple heat sources 100 are the same or when the heat pipe 10 is easily deformable in the thickness direction, the multiple heat sources 100 can be brought into direct contact with the heat pipe 10. The order in which the contact surface extension plate 41, the insulating layer 42, and the height adjustment layer 43 are laminated in the thickness direction is not limited to this order and may be changed. Furthermore, instead of arranging the insulating layer 42 and the height adjustment layer 43, a layer formed of a material having both insulating properties and height adjustment functions may be arranged. In this way, one layer may be given multiple functions.

[0030] A temperature sensor 20 and a wire portion 30 are disposed on the first end 10a side of the heat pipe 10 in the longitudinal direction. The temperature sensor 20 detects the temperature of the heat pipe 10 at the location where it is placed. A thermistor or a thermocouple may be used as the temperature sensor 20. A thermistor is an electronic component whose resistance value changes with a change in temperature. A thermocouple is a temperature sensor made of two different metal conductors. Temperature information detected by the temperature sensor 20 is transmitted as an electric signal through the wire portion 30 and input to a determination portion and a recording portion (not shown). The temperature sensor 20 is disposed at a different position from the heat source 100 in the longitudinal direction. The temperature sensor 20 is also disposed on the second surface 10d side of the heat pipe 10. That is, the temperature sensor 20 is disposed on the second surface 10d opposite to the first surface 10c on which the heat source 100 is disposed. In the width direction, the temperature sensor 20 is disposed in the center of the heat pipe 10.

[0031] The temperature sensor 20 is disposed at a position different from the heat source 100 in the thickness direction and the longitudinal direction. In this way, the temperature sensor 20 is disposed at a position somewhat distant from the multiple heat sources 100. As a result, the influence on the temperature detected by the temperature sensor 20 is dominated by the heat transmitted from the entire multiple heat sources 100 to the temperature sensor 20 via the working fluid in the container 13, rather than the heat transmitted from a specific heat source 100 to the temperature sensor 20 by thermal conduction via the container 13. Therefore, it is possible to more reliably detect the state of temperature changes of the multiple heat sources 100 using one temperature sensor 20. In addition, even if the working fluid evaporates in a specific part of the heat pipe 10 and the wick 12 dries out, it is possible to prevent the temperature measurement part from being excessively heated and the temperature sensor 20 from breaking down. The location of the temperature sensor 20 may be changed as appropriate. For example, the temperature sensor 20 may be disposed on the first surface 10c of the heat pipe 10, or may be disposed at the same position as the heat source 100 in the longitudinal direction. In either case, when the temperature of one of the multiple heat sources 100 increases, the temperature detected by the temperature sensor 20 also increases. Therefore, it is possible to detect that an abnormality has occurred in any of the multiple heat sources 100.

[0032] The temperature sensor 20 is electrically connected to a wire section 30. The wire section 30 transmits temperature data measured by the temperature sensor 20 to a determination section or a recording section. The wire section 30 may be a metal wire capable of transmitting temperature data, or may be an FPC (Flexible Printed Circuits) in which a circuit is formed on a polyimide film. When an FPC is used as the wire section 30, the temperature sensor 20 and the heat pipe 10 can be reliably thermally connected by contacting the FPC on which the temperature sensor 20 is mounted with the heat pipe 10. In addition, since the FPC has a small thickness, it is possible to make the dimension of the temperature measuring device 1 in the thickness direction compact. The wire portion 30 is disposed near the temperature sensor 20 on the second surface 10d of the heat pipe 10. In the example of FIG.

[0033] The wire portion 30 is bonded to the heat pipe 10 by an adhesive. The adhesive is preferably a material that can reliably bond the container 13 and the wire portion 30 even when the heat pipe 10 is heated by the heat of the heat source 100 and has low thermal resistance. The adhesive may be, for example, an epoxy adhesive. The wire part 30 and the temperature sensor 20 may be arranged so that the temperature sensor 20 is in contact with the heat pipe 10, or a component other than the wire part 30 may be arranged between the temperature sensor 20 and the heat pipe 10. Also, an FPC with a built-in temperature sensor 20 may be used.

[0034] The measurement data from the temperature sensor 20 is output as an electric signal via the wire unit 30 to a determination unit and a recording unit (not shown). The determination unit determines whether the multiple heat sources 100 are operating normally based on the measurement data. The recording unit records the measurement data on a recording medium. The determination unit and the recording unit may be configured to output the determination results and the recorded data to a control unit (not shown) that controls the operation of the heat sources 100. A CPU can be used as the control unit. The determination unit and the recording unit may be provided inside the control unit or outside the control unit.

[0035] A plurality of heat sources 100 are disposed between the temperature measuring device 1 and the cold plate 50. The heat sources 100 may be, for example, semiconductors or electrochemical devices (such as battery cells), but may also be other devices that generate heat during operation. In the example of Figures 1 and 2, the heat sources 100 are semiconductors mounted on a substrate 101. The heat sources 100 are arranged in a row along the longitudinal direction. The length of the heat pipe 10 and the dimensions of the contact surface extension plate 41 are appropriately changed depending on the number of the heat sources 100 arranged and their exposed areas. The shapes of the heat pipe 10 and the contact surface extension plate 41 may be changed depending on the arrangement of the heat sources 100 and the shape of the upper surface.

[0036] The cold plate 50 is disposed below the heat source 100 (the opposite side to the heat pipe 10 in the thickness direction when viewed from the heat source 100). In the example of Figs. 1 and 2, the cold plate 50 is disposed below the substrate 101 on which the heat source 100 is mounted. The cold plate 50 is formed in a plate shape extending in the longitudinal and width directions. The cold plate 50 is formed of a metal such as aluminum, and has a flow path for a coolant provided therein. The cold plate 50 has a coolant inlet 51 and an outlet 52. The coolant flows into the cold plate 50 from the inlet 51 by a pump (not shown) or the like, passes through a flow path, and flows out from the outlet 52. By flowing the coolant through the flow path, the heat source 100 thermally connected to the cold plate 50 can be cooled.

[0037] <Temperature measuring method using temperature measuring device 1> Next, the operation of the temperature measuring device 1 configured as above will be described. First, heat generated by the heat source 100 is transferred to the heat pipe 10 via the height adjustment layer 43, the insulating layer 42, and the contact surface extension plate 41. This heat causes the working fluid in the heat pipe 10 to evaporate in the vicinity of the heat source 100 (high temperature portion). The vapor moves toward a low temperature portion away from the heat source 100 and condenses. In this embodiment, the low temperature portion is the first end portion 10a side where the temperature sensor 20 is disposed. The working fluid condensed in the low temperature portion moves along the flow path of the wick 12 and moves again to the high temperature portion.

[0038] By circulating the working fluid inside the heat pipe 10 in this manner, heat from the heat source 100 is transported to the vicinity of the temperature sensor 20 (heat transport process). In addition, due to the pressure change that occurs in the internal space 11 when the working fluid changes phase to vapor and vice versa, the working fluid circulates throughout the entire internal space 11 without stagnating locally. As the working fluid continues to circulate, the temperature distribution in the heat pipe 10 may reach an equilibrium state (a state in which no change occurs in the temperature distribution). Hereinafter, the equilibrium state of the temperature distribution in the heat pipe 10 is also referred to as a steady state.

[0039] Next, the temperature of the heat pipe 10 at the location where the temperature sensor 20 is disposed is measured by the temperature sensor 20 (temperature measurement step). For example, in a steady state, the temperature measured by the temperature sensor 20 is constant. The temperature data measured by the temperature sensor 20 is output to the determination unit via the wire unit 30. Then, a determination step is performed. In the determination step, the determination unit determines whether or not each heat source 100 is operating normally based on the measurement data from the temperature sensor 20. The determination result of the determination unit may be output to the control unit of the heat source 100.

[0040] Here, if an abnormality occurs in at least one of the multiple heat sources 100, a change occurs in the temperature distribution of the heat pipe 10, and a temperature different from the temperature measured in the steady state is measured by the temperature sensor 20. For example, if one of the multiple heat sources 100 generates excessive heat, the temperature measured by the temperature sensor 20 increases. Also, if one of the multiple heat sources 100 stops operating and stops generating heat, the temperature measured by the temperature sensor 20 decreases. It is possible to detect that an abnormality has occurred in one of the heat sources 100 based on the temperature change ΔT from the temperature in the steady state. The determination unit may be configured to store a threshold value for temperature change ΔT and determine that an abnormality has occurred in the heat source 100 when the difference between the temperature in the steady state and the measured temperature exceeds the threshold value. The abnormality may also be determined based on data such as the trend of the temperature change and the speed of the temperature change. Furthermore, when the determination unit determines that an abnormality has occurred, the operation of the heat source 100 may be stopped via the control unit of the heat source 100.

[0041] Here, a method for detecting an abnormality caused by the temperature of the battery cell when the heat source 100 is a battery cell of an electric vehicle will be described. Assume that an electric vehicle is equipped with 20 modules, each with 12 battery cells. In the conventional technology, one temperature sensor is placed for each battery cell, so a total of 240 temperature sensors must be installed. Furthermore, it is necessary to wire the 240 temperature sensors to output their measurement results, which can lead to a large temperature measurement device.

[0042] In contrast, according to the temperature measuring device 1 of this embodiment, one heat pipe 10 is thermally connected to twelve battery cells, so that one temperature sensor 20 can measure temperature changes in the twelve battery cells. That is, by arranging one temperature measuring device 1 for one set of modules, it is possible to detect abnormalities in a plurality of battery cells. In this way, according to the temperature measuring device 1, it is possible to measure temperature changes in a plurality of heat sources 100 with a simple configuration, and since the wiring of the wire portion 30 can be simplified, it is possible to save space. Also, control may be performed so that only the module including the battery cell in which an abnormality has occurred is electrically disconnected from the electric vehicle, thereby making it possible to improve the safety of the electric vehicle.

[0043] As described above, the temperature measuring device 1 of this embodiment comprises a heat pipe 10 having a container 13 in which a working fluid is sealed, a temperature sensor 20 that detects the temperature of the heat pipe 10, and a wire portion 30 connected to the temperature sensor 20, and the heat pipe 10 receives heat from multiple heat sources 100. In this configuration, by thermally connecting the heat pipe 10 to the multiple heat sources 100, the working fluid circulates and the heat generated from the heat sources 100 can be transported to the vicinity of the temperature sensor 20 by the working fluid. When the temperature of, for example, any one of the multiple heat sources 100 increases, the temperature of the heat pipe 10 detected by the temperature sensor 20 also increases. Therefore, it is possible to detect an abnormality in any one of the multiple heat sources 100 in contact with the heat pipe 10. In this way, since an abnormality in the multiple heat sources 100 can be detected by one temperature sensor 20, the temperature measuring device 1 can be made smaller.

[0044] Furthermore, in the temperature measurement device 1 of this embodiment, heat is transported from the heat source 100 to the temperature sensor 20 by a working fluid. For example, when heat is simply conducted by a metal rod with high thermal conductivity, it may take several minutes for the heat to transfer. In contrast, heat transport by a working fluid as in this embodiment is much faster than the heat transfer speed by thermal conduction, and therefore the response speed to temperature changes of the heat source 100 can be increased. As described above, according to the temperature measuring device 1 of the above embodiment, abnormalities in the multiple heat sources 100 can be detected quickly with a simple configuration.

[0045] In addition, the temperature measuring device 1 further includes a contact surface extension plate 41 positioned between the multiple heat sources 100 and the heat pipe 10, the heat pipe 10 having a flat shape, and the contact surface extension plate 41 may be plate-shaped extending perpendicular to the thickness direction of the heat pipe 10. This allows the heat generated by the multiple heat sources 100 to be efficiently transferred into the heat pipe 10.

[0046] In addition, the temperature measuring device 1 further includes an insulating layer 42 located between the multiple heat sources 100 and the heat pipe 10, the heat pipe 10 having a flat shape, and the insulating layer 42 may be plate-shaped extending perpendicular to the thickness direction of the heat pipe 10. This makes it possible to prevent an electrical short circuit via the heat pipe 10 or the contact surface extension plate 41 .

[0047] In addition, the temperature measuring device 1 further includes a height adjustment layer 43 located between the multiple heat sources 100 and the heat pipe 10, the heat pipe 10 having a flat shape, and the height adjustment layer 43 may be plate-shaped extending perpendicular to the thickness direction of the heat pipe 10. By preventing the occurrence of gaps (air layers) between the upper surfaces of the heat sources 100 and the heat pipes 10, the heat from the multiple heat sources 100 can be efficiently transferred to the heat pipes 10.

[0048] The wire portion 30 may also be an FPC. This enables further miniaturization of the temperature measuring device 1. In particular, since the heat pipe 10 is configured so that the thickness in the thickness direction is thinner than the dimension in the width direction, when combined with an FPC, a temperature measuring device 1 that is thin in the thickness direction can be obtained.

[0049] Furthermore, the temperature sensor 20 may be disposed at a first end 10a in the longitudinal direction of the heat pipe 10, and the first end 10a side of the heat pipe 10 may serve as a condensation section where the vapor of the working fluid is condensed. This makes it possible to efficiently transport the heat from the heat source 100 to the vicinity of the temperature sensor 20 .

[0050] <Second embodiment> Next, a second embodiment of the present invention will be described, but the basic configuration is similar to that of the first embodiment. Therefore, the same components are given the same reference numerals and the description thereof will be omitted, and only the differences will be described. 4 and 5 show a temperature measuring device 1 according to a second embodiment. This embodiment differs from the temperature measuring device 1 of the first embodiment in that a heat sink 60 is formed at a second end 10b in the longitudinal direction of the heat pipe 10. Since the heat source 100 can be cooled by the heat pipe 10 on which the heat sink 60 is formed, a cold plate 50 is not provided.

[0051] The heat sink 60 has plate-like fins 61 that are vertically arranged on the outer circumferential surface of the container 13 of the heat pipe 10. The multiple fins 61 are formed at the second end 10b so as to contact the first surface 10c, the second surface 10d, and the side surface 10e of the heat pipe 10. The fins 61 are formed of a metal with good thermal conductivity, such as copper, a copper alloy, aluminum, or an aluminum alloy.

[0052] In the first embodiment, the first end 10a serves as the condensation portion, but in this embodiment, the second end 10b side where the heat sink 60 is disposed serves as the condensation portion. The transfer of heat and the circulation of the working fluid in the heat pipe 10 in this embodiment will be described below. The heat of the heat source 100 causes the working fluid in the heat pipe 10 to evaporate in the vicinity of the heat source 100. The vapor moves to the second end 10b of the heat pipe 10 where the heat sink 60 is provided and condenses. At this time, the heat is transferred to the heat sink 60. The heat transferred to the fins 61, which have a large surface area, is efficiently dissipated from the fins 61. Furthermore, the heat may be dissipated from the fins 61 more efficiently by blowing air from the fan F. In this way, the heat source 100 can be cooled by the heat sink 60.

[0053] The working fluid condensed at the second end 10b moves along the flow path of the wick 12 to the vicinity of the heat source 100 and becomes vapor again. In this way, the working fluid mainly circulates from the heat source 100 to the second end 10b in the longitudinal direction. In addition, the working fluid circulates throughout the entire inside of the heat pipe 10, including the first end 10a side, due to the main circulation, and the working fluid circulates due to the temperature difference between the heat source 100 and the first end 10a. Due to this circulation of the working fluid, the temperature at the first end 10a side also changes depending on the heat generation state of the heat source 100, so the temperature sensor 20 arranged at the first end 10a can detect the temperature change of the heat source 100.

[0054] As described above, the temperature measuring device 1 of this embodiment further includes the heat sink 60 disposed at the second end 10b of the heat pipe 10 in the longitudinal direction. This makes it possible to measure the temperatures of multiple heat sources 100 with one temperature sensor 20, while efficiently cooling multiple heat sources 100 with the heat pipe 10. In addition, since there is no need to install a separate cooling device for the heat source, the device having the heat source 100 can be made smaller.

[0055] <Third embodiment> Next, a third embodiment of the present invention will be described, but the basic configuration is similar to that of the first embodiment. Therefore, the same components are given the same reference numerals and the description thereof will be omitted, and only the differences will be described. 6 and 7 show a temperature measuring device 1 according to a third embodiment. In this embodiment, a heat sink 60 is formed at the second end 10b of the heat pipe 10 of the temperature measuring device 1, as in the second embodiment. Note that, while the cold plate 50 was not provided in the second embodiment, in this embodiment, the cold plate 50 is provided below the heat source 100, and the heat source 100 is cooled by the heat pipe 10 equipped with the heat sink 60 and the cold plate 50.

[0056] As in the second embodiment, the temperature of the first end 10a also changes depending on the heat generation level of the heat source 100 due to the circulation of the working fluid inside the heat pipe 10, so that the temperature change of the heat source 100 can be detected by the temperature sensor 20 arranged at the first end 10a.

[0057] As described above, the temperature measuring device 1 of this embodiment further includes a cold plate 50 having a coolant inlet 51 and outlet 52, and multiple heat sources 100 are arranged between the cold plate 50 and the heat pipe 10. In this configuration, the cold plate 50 mainly cools the heat source 100, and the heat pipe 10 can be used as an auxiliary cooling device. This makes it possible to use the heat pipe 10 as an auxiliary cooling device even when the heat source 100 generates more heat than the cooling capacity of the cold plate 50 and a thermal overload that exceeds the cooling capacity of the cold plate 50 is applied. This makes it possible to measure temperature changes of multiple heat sources 100 while improving the cooling capacity.

[0058] The technical scope of the present invention is not limited to the above-described embodiment or examples, and various modifications can be made without departing from the spirit of the present invention.

[0059] For example, in the first embodiment, the heat source 100 is cooled by the cold plate 50, but the heat source 100 may be cooled by the heat pipe 10 in an auxiliary manner. In addition, in the third embodiment, the heat pipe 10 provides auxiliary cooling of the heat source 100, but if auxiliary cooling of the heat source 100 is not required, the airflow from the fan F may be stopped or the amount of airflow may be adjusted.

[0060] In the first embodiment, the first end 10a side of the heat pipe 10 is the condensation part of the working fluid, and the temperature sensor 20 is disposed near this condensation part, but the position of the temperature sensor 20 is not limited to the vicinity of the condensation part. For example, as in the second and third embodiments, the temperature sensor 20 may be disposed at the end of the heat pipe 10 on the opposite side to the condensation part in the longitudinal direction. That is, as explained in the first to third embodiments, it is sufficient that the temperature sensor 20 is disposed at a position where the temperature change of the multiple heat sources 100 can be detected by the action of the circulation of the working fluid.

[0061] In addition, when the heat source 100 starts to operate and before the circulation of the working fluid in the heat pipe 10 reaches a steady state, the temperature measured by the temperature sensor 20 may vary due to the heat transport and cooling capacity of the heat pipe 10. In addition, the operation of the heat source 100 may be in a state in which more heat is generated due to a command from a device having the heat source 100. In other words, the temperature of the heat source 100 may change depending on the operating conditions of the heat source 100, rather than due to an abnormality in the heat source 100. In such a case, the threshold value of the temperature change ΔT may be set to be changed in advance in response to an operation command for the heat source 100 so that the determination unit does not determine that an abnormality has occurred.

[0062] In addition, within the scope of the spirit of the present invention, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate. [Explanation of symbols]

[0063] 1...temperature measuring device, 10...heat pipe, 10a...first end, 10b...second end, 10c...first surface, 10d...second surface, 10e...side, 11...internal space, 12...wick, 13...container, 20...temperature sensor, 30...wire portion, 41...contact surface extension plate, 42...insulating layer, 43...height adjustment layer, 50...cold plate, 51...inlet, 52...outlet, 60...heat sink, 61...fin, 100...heat source, F...fan

Claims

1. a heat pipe having a container in which a working fluid is enclosed; a temperature sensor for detecting a temperature of the heat pipe; A wire portion connected to the temperature sensor; a cold plate having a cooling fluid inlet and an outlet; The heat pipe receives heat from a plurality of heat sources; the plurality of heat sources are disposed between the cold plate and the heat pipes; A temperature measuring device, wherein the temperature sensor is disposed at a position different from the heat source in the thickness direction and longitudinal direction of the heat pipe, and the temperature sensor measures the temperature of the heat pipe at the position where it is disposed.

2. a contact surface extension plate located between the plurality of heat sources and the heat pipe; The heat pipe has a flat shape, The temperature measuring device according to claim 1 , wherein the contact surface extension plate is a plate extending perpendicular to the thickness direction of the heat pipe.

3. an insulating layer located between the plurality of heat sources and the heat pipe; The heat pipe has a flat shape, The temperature measuring device according to claim 1 , wherein the insulating layer is in the form of a plate extending perpendicular to the thickness direction of the heat pipe.

4. a height adjustment layer located between the plurality of heat sources and the heat pipe; The heat pipe has a flat shape, The temperature measuring device according to claim 1 , wherein the height adjustment layer is a plate extending perpendicular to the thickness direction of the heat pipe.

5. The temperature measuring device according to claim 1 , wherein the wire portion is an FPC.

6. The temperature sensor is disposed at a first end of the heat pipe in the longitudinal direction, The temperature measuring device according to claim 1 , wherein the first end side of the heat pipe serves as a condensation section where the vapor of the working fluid is condensed.

7. The temperature measuring device according to claim 1 , further comprising a heat sink disposed at a second end of the heat pipe in the longitudinal direction.

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