Processing system and processing method

Abstract

To properly flatten the peeled surface of a substrate that has been peeled using a modified layer formed by irradiation of laser light as the base point.SOLUTION: Provided is a processing system for processing the object to be processed, the processing system comprising: a displacement magnitude acquisition device for acquiring the displacement magnitude of a separation surface of a separated body having been separated using a modified layer formed inside of the object to be processing as the base point; a flattening device for flattening the separated surface by irradiating the separated surface with laser light; and a control device. The control device executes: exercising control in the displacement magnitude acquisition device to acquire the displacement magnitude of the separated surface; exercising control in the flattening device to execute a first flattening process of irradiating with first laser light a recess in the separated surface the displacement magnitude of which is large; and exercising control in the flattening device to execute a second flatting process of irradiating the separated surface with second laser light of a lower output than at least the first laser light.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present disclosure relates to a processing system and a processing method. [Background technology]

[0002] Patent Document 1 discloses a method for processing a wafer having a plurality of devices formed on its front surface side, in which the wafer is separated and thinned using a modified layer formed inside the wafer by irradiation with laser light as a base point, and then the separated surface of the wafer is ground to remove the modified layer remaining on the separated surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO 2020 / 66492 Summary of the Invention [Problem to be solved by the invention]

[0004] The technique according to the present disclosure appropriately flattens the peeled surface of a substrate that has been peeled off starting from a modified layer formed by irradiation with laser light. [Means for solving the problem]

[0005] One aspect of the present disclosure is a processing system for processing a processing object, the processing system including a displacement amount acquisition device that acquires a displacement amount of a separation surface of a separation object separated based on a modified layer formed inside the processing object, a planarization device that irradiates laser light onto the separation surface to planarize the separation surface, and a control device, the control device performing the following controls: in the displacement amount acquisition device, control to acquire the displacement amount of the separation surface; in the planarization device, control to perform a first planarization process in which a first laser light is irradiated onto a convex portion on the separation surface having a large displacement amount; and in the planarization device, control to perform a second planarization process in which a second laser light having a power at least lower than that of the first laser light is irradiated onto the separation surface. Effect of the Invention

[0006] According to the present disclosure, in a substrate that has been peeled off starting from a modified layer formed by irradiation with laser light, the peeled surface of the substrate can be appropriately flattened. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a side view showing an outline of a configuration of an overlapping wafer. [Diagram 2] FIG. 4 is a side view showing the state after separation of the first wafer. [Diagram 3] 1 is a plan view showing a configuration example of a wafer processing system according to an embodiment of the present invention. [Figure 4] FIG. 2 is a side view showing a configuration example of a planarization apparatus according to the present embodiment. [Diagram 5] 1 is a side view showing a configuration example of a reforming separation device according to an embodiment of the present invention. [Figure 6] FIG. 2 is a flow diagram showing main steps of wafer processing according to the present embodiment. [Figure 7] 1A to 1C are explanatory diagrams of main steps of wafer processing according to the present embodiment. [Figure 8] FIG. 2 is a plan view showing a state in which an internal surface modification layer is formed on a first wafer. [Figure 9]4 is a vertical cross-sectional view showing a state in which an internal surface modification layer is formed on a first wafer. FIG. [Figure 10] 4 is a vertical cross-sectional view showing a state of a separation surface of a separation wafer immediately after separation. FIG. [Figure 11] 5A and 5B are explanatory diagrams showing how a separation surface is flattened in the present embodiment. [Figure 12] 13 is an explanatory diagram showing how a separation surface is flattened in accordance with another embodiment. FIG. [Figure 13] 13 is an explanatory diagram showing how a separation surface is flattened in accordance with another embodiment. FIG. [Figure 14] 13 is an explanatory diagram showing how a separation surface is flattened in accordance with another embodiment. FIG. [Figure 15] 13 is an explanatory diagram showing how a separation surface is flattened in accordance with another embodiment. FIG. [Figure 16] 10A to 10C are explanatory diagrams of main steps of a wafer processing according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the manufacturing process of semiconductor devices, a semiconductor wafer (hereinafter, referred to as a wafer) having a plurality of devices formed on its surface is thinned. There are various methods for thinning a wafer, such as a method of grinding the wafer by contacting a grinding wheel with the back surface of the wafer, and a method of separating the wafer by irradiating the inside of the wafer with a laser beam and forming a modified layer as a base point, as disclosed in Patent Document 1.

[0009] However, when the wafer is thinned by separation based on the modified layer, the separation surface of the wafer may have unevenness due to the mixture of positions irradiated and non-irradiated by the laser light when the modified layer is formed, resulting in rough surface accuracy. As disclosed in Patent Document 1, the separation surface of the wafer may be ground to remove the remaining modified layer, but if the surface accuracy of the separation surface is rough, the grinding resistance may increase, making it difficult to remove the modified layer. In order to properly remove the modified layer remaining on the separation surface, for example, it is possible to improve the surface accuracy prior to grinding the separation surface, that is, to flatten the separation surface, but Patent Document 1 does not disclose or suggest anything about flattening the separation surface prior to this grinding. Therefore, there is room for improvement in conventional wafer processing when separating a wafer based on the modified layer.

[0010] The technology disclosed herein has been made in consideration of the above circumstances, and appropriately flattens the peeled surface of a substrate in which peeling has been performed using a modified layer formed by irradiation with laser light as a base point. Hereinafter, a wafer processing system as a processing system and a wafer processing method as a processing method according to the present embodiment will be described with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configurations are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0011] In a wafer processing system 1 according to this embodiment, which will be described later, processing is performed on a laminated wafer T as a laminated substrate in which a first wafer W as a first substrate and a second wafer S as a second substrate are bonded together, as shown in Fig. 1. Hereinafter, in the first wafer W, the surface to be bonded to the second wafer S is referred to as the front surface Wa, and the surface opposite the front surface Wa is referred to as the back surface Wb. Similarly, in the second wafer S, the surface to be bonded to the first wafer W is referred to as the front surface Sa, and the surface opposite the front surface Sa is referred to as the back surface Sb.

[0012] The first wafer W is a semiconductor wafer such as a silicon substrate, and has a device layer Dv including a plurality of devices formed on the front surface Wa side. A surface film Fw is further formed on the front surface Wa side of the first wafer W, and the surface film Fw is bonded to a surface film Fs of the second wafer S. Examples of the surface film Fw include an oxide film (THOX film, SiO2 film, TEOS film), a SiC film, a SiCN film, or an adhesive. The peripheral portion of the first wafer W is chamfered, and the cross section of the peripheral portion has a smaller thickness toward the tip.

[0013] The second wafer S is, for example, a wafer that supports the first wafer W. A surface film Fs is formed on the surface Sa of the second wafer S. Examples of the surface film Fs include an oxide film (THOX film, SiO2 film, TEOS film), a SiC film, a SiCN film, or an adhesive. The second wafer S also functions as a protective material (support wafer) that protects the device layer Dv of the first wafer W. The second wafer S does not need to be a support wafer, and may be a device wafer in which a device layer (not shown) is formed, similar to the first wafer W.

[0014] In the drawings used in the following description, the device layer Dv and the surface films Fw and Fs may be omitted in order to avoid complication of the illustration.

[0015] In addition, in a wafer processing system 1 of this embodiment described later, as shown in FIG. 2, the first wafer W of the overlapped wafer T is separated and thinned. In the following description, the first wafer W on the separated front surface Wa side is referred to as the first separated wafer W1, and the first wafer W on the separated back surface Wb side is referred to as the second separated wafer W2. Note that the first separated wafer W1 refers to the first wafer W supported by the second wafer S, and may be referred to as the first separated wafer W1 including the second wafer S. Furthermore, the surfaces of the first separated wafer W1 and the second separated wafer W2 on the separated side may be referred to as the separated surfaces W1a and W2a, respectively.

[0016] In the following embodiments, the laminated substrate corresponds to a "processing target" according to the technology of the present disclosure, and the separated wafers W1 and W2 correspond to a "separated object" according to the technology of the present disclosure.

[0017] As shown in Fig. 3, the wafer processing system 1 has a configuration in which a loading / unloading station 2 and a processing station 3 are integrally connected. The loading / unloading station 2 and the processing station 3 are arranged side by side from the positive side to the negative side of the X-axis. The loading / unloading station 2 loads / unloads cassettes Ct, Cw1, and Cw2, each capable of accommodating a plurality of overlapped wafers T, a plurality of first separated wafers W1, and a plurality of second separated wafers W2, between the loading / unloading station 2 and the outside, for example. The processing station 3 is equipped with various processing devices that perform desired processing on the overlapped wafer T and the separated wafers W1 and W2.

[0018] The loading / unloading station 2 is provided with a cassette mounting table 10. In the illustrated example, a plurality of cassettes, for example, three cassettes Ct, Cw1, and Cw2, can be freely mounted in a row in the Y-axis direction on the cassette mounting table 10. Note that the number of cassettes Ct, Cw1, and Cw2 mounted on the cassette mounting table 10 is not limited to this embodiment and can be determined arbitrarily.

[0019] In the loading / unloading station 2, a wafer transfer area 20 is provided adjacent to the cassette mounting table 10 on the negative side of the X-axis of the cassette mounting table 10. A wafer transfer device 22 is provided in the wafer transfer area 20, which is movable on a transfer path 21 extending in the Y-axis direction. The wafer transfer device 22 has two transfer arms 23, 23 for holding and transferring the overlapped wafer T and the separated wafers W1, W2. Each transfer arm 23 is configured to be movable in the horizontal direction (X-axis direction and Y-axis direction), the vertical direction, around the horizontal axis, and around the vertical axis. The configuration of the transfer arm 23 is not limited to this embodiment, and any configuration may be used.

[0020] The processing station 3 is provided with, for example, three processing blocks G1 to G3 and a wafer transfer area 30. The first processing block G1, the second processing block G2, and the third processing block G3 are arranged in this order from the positive side of the X-axis (the load / unload station 2 side) to the negative side. The first processing block G1 is arranged on the positive side of the X-axis of the wafer transfer area 30, and the second processing block G2 and the third processing block G3 are each arranged on the positive side of the Y-axis of the wafer transfer area 30.

[0021] The wafer transport area 30 is provided with a wafer transport device 32 that is movable on a transport path 31 extending in the X-axis direction. The wafer transport device 32 is configured to be capable of transporting the overlapped wafer T and the separated wafers W1 and W2 to each of the processing devices in the processing blocks G1 to G3. The wafer transport device 32 also has two transport arms 33, 33 that hold and transport the overlapped wafer T and the separated wafers W1 and W2. Each transport arm 33 is supported by an articulated arm member 34 and is configured to be movable in the horizontal direction, the vertical direction, around a horizontal axis, and around a vertical axis. The configuration of the transport arm 33 is not limited to this embodiment, and any configuration may be used.

[0022] The first processing block G1 is provided with two wet etching apparatuses 40, 40, two cleaning apparatuses 50, 50, a buffer apparatus 60, and a modified separation apparatus 70. The wet etching apparatus 40, the cleaning apparatus 50, and the buffer apparatus 60 are arranged in this order from the positive side to the negative side of the Y axis. The two wet etching apparatuses 40, 40 are arranged in a stacked manner. The two cleaning apparatuses 50, 50 are arranged in a stacked manner. In addition, the buffer apparatus 60 and the modified separation apparatus 70 are arranged in a stacked manner.

[0023] In the second processing block G2, an inversion device 80 and a planarization device 90 are provided, stacked in this order from above.

[0024] In the third processing block G3, a processing device 100 is provided.

[0025] The two wet etching devices 40 etch the separation surfaces W1a and W2a of the separated wafers W1 and W2 ground by the processing device 100. For example, a chemical solution (etching solution) is supplied to the separation surfaces W1a and W2a of the separated wafers W1 and W2. For example, HF, HNO3, H3PO4, TMAH, Choline, KOH, etc. are used as the chemical solution.

[0026] The two cleaning devices 50 respectively clean the separation surfaces W1a, W2a of the separated wafers W1, W2 ground by the processing device 100. For example, a brush is brought into contact with the separation surfaces W1a, W2a to scrub the separation surfaces W1a, W2a. Note that a pressurized cleaning liquid may be used to clean the separation surfaces W1a, W2a.

[0027] The buffer device 60 temporarily holds the unprocessed overlapped wafer T that is transferred from the wafer transfer region 20 to the wafer transfer region 30. The buffer device 60 may be configured to adjust the horizontal orientation of the overlapped wafer T by detecting the position of a notch portion of the first wafer W with a detection unit (not shown) while rotating the overlapped wafer T held by a chuck (not shown), for example.

[0028] The modification separation apparatus 70, which functions as a separation apparatus, irradiates laser light into the inside of the first wafer W to form an internal surface modification layer, which will be described later, and further separates the first wafer W into a first separated wafer W1 and a second separated wafer W2 based on the internal surface modification layer.

[0029] The modified separation apparatus 70 has a chuck 71 that holds the overlapped wafers T with the first wafer W placed on top and the second wafer S placed on the bottom as shown in Fig. 4. The chuck 71 is configured to be movable in the X-axis direction and / or the Y-axis direction by a moving unit 72. The moving unit 72 is configured as a precision XY stage, for example. The chuck 71 is also configured to be rotatable around a vertical axis by a rotating unit 73.

[0030] A laser head 74 is provided above the chuck 71, which irradiates the inside of the first wafer W with laser light. The laser head 74 irradiates a desired position inside the first wafer W with a high-frequency pulsed laser light (e.g., YAG laser) oscillated from a laser light oscillator (not shown) and having a wavelength that is transparent to the first wafer W. As a result, the portion inside the first wafer W where the laser light is focused is modified, and an internal surface modified layer is formed. The laser head 74 is configured to be movable in the X-axis direction and / or the Y-axis direction by a moving unit 75. The moving unit 75 is configured, for example, as a precision XY stage. The laser head 74 is also configured to be movable in the Z-axis direction by a lifting unit 76.

[0031] In addition, a suction pad 77 that suction-holds the back surface Wb of the first wafer W is provided above the chuck 71. The suction pad 77 is configured to be rotatable about a vertical axis by a rotating unit 78. The suction pad 77 is configured to be movable in the Z-axis direction by a lifting unit 79.

[0032] In addition, the modification separation apparatus 70 may be configured to be able to acquire the position of an internal surface modification layer formed inside the first wafer W, or the position of an internal surface modification layer remaining on the separation surfaces of the separated wafers W1 and W2, for example, by imaging the polymerized wafer T held on the chuck 71 with an imaging mechanism (not shown), such as a CCD camera.

[0033] The reversing device 80 reverses the front and back surfaces of the second separated wafer W2 separated by the modified separation device 70. The reversing device 80 may have any configuration.

[0034] The two planarization devices 90 irradiate laser light onto the separation surfaces W1a, W2a of the separated wafers W1, W2 separated by the modification separation device 70, respectively, to planarize the separation surfaces W1a, W2a prior to the grinding process in the processing device 100. In the following description, "planarization" refers to a process for improving the surface precision (surface roughness) of the separation surfaces W1a, W2a of the first wafer W (separated wafers W1, W2) after separation in the modification separation device 70, thereby reducing the grinding resistance during the grinding process in the processing device 100 described below.

[0035] The flattening apparatus 90 has a chuck 91 that holds the first separated wafer W1 with the separation surface W1a on the upper side and the back surface Sb of the second wafer S on the lower side, as shown in FIG. 5. The chuck 91 is configured to be movable in the X-axis direction and / or the Y-axis direction by a moving unit 92. The moving unit 92 is configured as a precision XY stage, for example. The chuck 91 is also configured to be rotatable about a vertical axis by a rotating unit 93. When the flattening apparatus 90 flattens the second separated wafer W2, the chuck 91 holds the second separated wafer W2 with the separation surface W2a on the upper side and the back surface Wb of the first wafer W on the lower side.

[0036] A laser head 94 is provided above the chuck 91, which irradiates the separation surfaces W1a, W2a of the separated wafers W1, W2 with laser light. The laser head 94 irradiates desired positions of the separation surfaces W1a, W2a of the separated wafers W1, W2 with high-frequency pulsed laser light (for example, an ultrashort pulse laser such as a picosecond laser or a femtosecond laser) oscillated from a laser light oscillator (not shown). This removes the portion of the separation surfaces W1a, W2a of the separated wafers W1, W2 where the laser light is focused, thereby flattening the separation surfaces W1a, W2a (improving surface accuracy). The laser head 94 is configured to be movable in the X-axis direction and / or the Y-axis direction by a moving unit 95, and is configured to be able to arbitrarily adjust the irradiation position of the laser light on the separation surfaces W1a, W2a by, for example, a galvano scanner. The moving unit 95 is configured as a precision XY stage, for example. The laser head 94 is also configured to be movable in the Z-axis direction by an elevator unit 96.

[0037] The laser head 94 may further include a spatial light modulator (not shown). The spatial light modulator modulates and outputs the laser light. Specifically, the spatial light modulator can control the focal position and phase of the laser light, and can adjust the shape and number (number of branches) of the irradiated laser light. At this time, the branched and irradiated laser light is configured so that the output, etc., of each branch can be adjusted. As the spatial light modulator, for example, LCOS (Liquid Crystal Silicon) can be selected.

[0038] The planarization device 90 also has an imaging mechanism 97 that captures images of the separation surfaces W1a, W2a of the separated first wafer W (separated wafers W1, W2) to detect the surface condition. For example, a CCD camera or the like can be used as the imaging mechanism 97. Then, based on the surface condition of the separation surfaces W1a, W2a obtained from the imaging results by the imaging mechanism 97, for example, the position of the internal surface modification layer remaining on the separation surfaces W1a, W2a, the amount of displacement of the separation surfaces W1a, W2a, etc., which will be described later, can be obtained.

[0039] 3, the processing apparatus 100 grinds the separated surface W1a of the first separated wafer W1 and the separated surface W2a of the second separated wafer W2. The processing apparatus 100 includes a rotary table 110, a first grinding unit 120, and a second grinding unit .

[0040] The turntable 110 is configured to be freely rotatable about a vertical rotation center line 111 by a rotation mechanism (not shown). Four chucks 112 for suction-holding the separated wafers W1, W2 are provided on the turntable 110. The chucks 112 are arranged evenly on the same circumference as the turntable 110, i.e., at 90 degree intervals. The four chucks 112 are movable to delivery positions A1, A2 and processing positions B1, B2 by the rotation of the turntable 110. Each chuck 112 is held by a chuck base (not shown) and configured to be rotatable by a rotation mechanism (not shown).

[0041] In this embodiment, the first transfer position A1 is a position on the negative X-axis and negative Y-axis sides of the turntable 110, where the first separated wafer W1 is transferred. The second transfer position A2 is a position on the positive X-axis and negative Y-axis sides of the turntable 110, where the second separated wafer W2 is transferred. The first processing position B1 is a position on the positive X-axis and positive Y-axis sides of the turntable 110, where the first grinding unit 120 is disposed. The second processing position B2 is a position on the negative X-axis and positive Y-axis sides of the turntable 110, where the second grinding unit 130 is disposed.

[0042] In the first grinding unit 120, the separation surface W1a of the first separated wafer W1 is ground. The first grinding unit 120 has a first grinding section 121 equipped with a grinding wheel (not shown) that is annular and rotatable. The first grinding section 121 is configured to be movable in the vertical direction along a support 122. Then, while the separation surface W1a of the first separated wafer W1 held by the chuck 112 is in contact with the grinding wheel, the chuck 112 and the grinding wheel are rotated, and the grinding wheel is lowered to grind the separation surface W1a of the first separated wafer W1. This reduces the thickness of the first separated wafer W1 to a desired thickness, and flattens the separation surface W1a of the first separated wafer W1.

[0043] In the second grinding unit 130, the separation surface W2a of the second separated wafer W2 is ground. The second grinding unit 130 has a second grinding section 131 equipped with a grinding wheel (not shown) that is annular and rotatable. The second grinding section 131 is configured to be movable in the vertical direction along a support 132. Then, while the separation surface W2a of the second separated wafer W2 held by the chuck 112 is in contact with the grinding wheel, the chuck 112 and the grinding wheel are rotated, and the grinding wheel is lowered to grind the separation surface W2a of the second separated wafer W2. This reduces the thickness of the second separated wafer W2 to a desired thickness, and flattens the separation surface W2a of the second separated wafer W2.

[0044] The above-described wafer processing system 1 is provided with a control device 140. The control device 140 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the laminated wafer T in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of the drive systems of the above-described various processing devices and transport devices, and for realizing wafer processing, which will be described later, in the wafer processing system 1. The above-described program may be recorded in a computer-readable storage medium and installed in the control device 140 from the storage medium. The above-described storage medium may be temporary or non-temporary.

[0045] Next, a description will be given of wafer processing performed using the wafer processing system 1 configured as above. In this embodiment, the first wafer W and the second wafer S are bonded together to form an overlapped wafer T in advance.

[0046] First, a cassette Ct storing a plurality of overlapped wafers T is placed on the cassette placement stage 10 of the carry-in / out station 2. Next, the overlapped wafers T in the cassette Ct are taken out by the wafer transfer device 22 and transferred to the buffer device 60. In the buffer device 60, the horizontal orientation of the overlapped wafers T (first wafer W) may be adjusted.

[0047] Next, the laminated wafer T is transported to the modified separation apparatus 70 by the wafer transport device 32. In the modified separation apparatus 70, an internal surface modified layer M1 is formed inside the first wafer W as shown in Fig. 7(a) (step P1 in Fig. 6). The internal surface modified layer M1 serves as a base point when the first wafer W is separated into a first separated wafer W1 and a second separated wafer W2.

[0048] Specifically, as shown in FIG. 8, the chuck 71 (overlapped wafer T) is rotated by the rotating unit 73, and the overlapped wafer T and the laser head 74 are moved horizontally relative to each other to form a plurality of inner surface modified layers M1, for example, in a spiral shape in a cross-sectional view, inside the first wafer W. These inner surface modified layers M1 are formed at the same height inside the first wafer W. Then, the inner surface modified layers M1 are formed on the entire inner surface of the first wafer W. Here, the inner surface modified layers M1 are formed at a circumferential interval P (pulse pitch) and a radial interval Q (index pitch). The circumferential interval P (pulse pitch) and the radial interval Q (index pitch) may be changed midway, that is, the circumferential interval P (pulse pitch) and / or the radial interval Q (index pitch) may be different between the outer circumference and the inner circumference of the first wafer W.

[0049] In FIG. 8, the dashed arrow indicates the movement trajectory of the position of the laser head 74 relative to the first wafer W (the irradiation position of the laser light L), and the open circle within the surface of the first wafer W indicates the formed internal surface modified layer M1.

[0050] The internal surface modified layer M1 is formed by irradiating the inside of the first wafer W with laser light L from the laser head 74 as shown in Fig. 9. The lower end of the internal surface modified layer M1 is located above the target surface (dotted line in Fig. 9) of the first wafer W after grinding in the processing apparatus 100. In addition, a crack C1 propagates from the internal surface modified layer M1 in the surface direction.

[0051] After the internal surface modification layer M1 is formed inside the first wafer W, the first wafer W is subsequently separated into a first separated wafer W1 and a second separated wafer W2 using the internal surface modification layer M1 as a base point, as shown in FIG. 7(b) (step P2 in FIG. 6). Specifically, in the modification separation device 70, the back surface Wb of the first wafer W is suction-held by an adsorption pad 77. Thereafter, the adsorption pad 77 is raised to separate the second separated wafer W2 from the first separated wafer W1. At this time, the adsorption pad 77 may be rotated to separate the first separated wafer W1 and the second separated wafer W2 at the internal surface modification layer M1 as a boundary.

[0052] As shown in FIG. 7(b) and FIG. 10, an inner surface modification layer M1 remains on the separation surface W1a of the first separated wafer W1 and the separation surface W2a of the second separated wafer W2, respectively. 8 and 9, the surface of the first wafer W after the laser light L is irradiated includes a portion that is not directly irradiated with the laser light L, i.e., a portion where the internal surface modification layer M1 is formed, and a portion where the crack C1 has progressed. In other words, the separation surface W1a of the first separation wafer W1 and the separation surface W2a of the second separation wafer W2 each include a portion separated with the internal surface modification layer M1 as a base point and a portion separated with the crack C1 as a base point. As a result, uneven portions are formed on the separation surfaces W1a and W2a as shown in FIGS. 7(b) and 10, respectively, and the surface accuracy is reduced.

[0053] Here, in the processing apparatus 100, if the surface accuracy of the separation surfaces W1a, W2a is reduced as shown in Fig. 10, there is a risk that the removal of the internal surface modification layer M1 cannot be appropriately performed as described above. Therefore, in the wafer processing system 1 according to this embodiment, prior to the grinding process in the processing apparatus 100, the uneven portions formed on the separation surfaces W1a, W2a in this manner are removed to improve (flatten) the surface accuracy.

[0054] After the first wafer W is separated into the first separated wafer W1 and the second separated wafer W2, the first separated wafer W1 is then transferred to the planarization device 90 by the wafer transfer device 32. In the planarization device 90, first, the image capturing mechanism 97 captures an image of the separated surface W1a of the first separated wafer W1, and the displacement amount H of the uneven portion of the separated surface W1a shown in FIG. 10 (the distance from a reference plane (e.g., the bonding surface between the first wafer W and the second wafer S) to the separated surface W1a) is calculated (step P3 in FIG. 6). At this time, the horizontal orientation of the first separated wafer W1 may be adjusted by rotating the chuck 91.

[0055] The displacement amount H of the uneven portion can be calculated based on the distance between adjacent recesses (the radial distance Q of the internal surface modification layer M1 shown in Figure 8) obtained, for example, by imaging the separation surfaces W1a, W2a of the separated wafers W1, W2.

[0056] In parallel with step P3, the second separated wafer W2 is transferred to the reversing device 80 by the wafer transfer device 32. In the reversing device 80, the front and back surfaces of the second separated wafer W2 are reversed (step P4 in FIG. 6).

[0057] The second separated wafer W2, whose front and back surfaces have been inverted, is transferred to the planarization device 90 by the wafer transfer device 32. In the planarization device 90, first, an image of the separated surface W2a of the second separated wafer W2 is captured, and the amount of displacement H of the uneven portion of the separated surface W2a is obtained (step P5 in FIG. 6). At this time, the chuck 91 may be rotated to adjust the horizontal orientation of the second separated wafer W2.

[0058] In this embodiment, the amount of displacement H of the uneven portion is calculated based on the results of imaging the separation surfaces W1a and W2a by the imaging mechanism 97 as shown in steps P3 and P5, but the amount of displacement H of the uneven portion can be acquired by any method. Specifically, for example, the amount of displacement H may be directly measured using a laser displacement meter or the like, or, for example, the capacitance distribution within the separation surface W1a may be measured and the amount of displacement H may be calculated based on the measured capacitance distribution. Furthermore, the position where the displacement amount H is acquired is not limited to the planarization apparatus 90, and the displacement amount H may be acquired in the buffer apparatus 60, the modified separation apparatus 70, or the inversion apparatus 80. Alternatively, an independent displacement amount acquisition apparatus (not shown) may be disposed in the wafer processing system 1.

[0059] After the images of the separation surfaces W1a and W2a of the separated wafers W1 and W2 are captured, the separation surfaces W1a and W2a of the separated wafers W1 and W2 are flattened as shown in Fig. 7(c) and Fig. 7(d) (step P6 in Fig. 6). Specifically, the projections formed on the separation surfaces W1a and W2a are irradiated with laser light to remove the projections by ablation processing.

[0060] Here, in order to properly remove the convex portions formed on the separation surfaces W1a and W2a, it is necessary to adjust the energy amount of the irradiated laser light according to the profile of the separation surfaces W1a and W2a. That is, it is necessary to irradiate the laser light with high output to the portion (convex portion) with a large displacement amount H, and with low output to the portion (concave portion) with a small displacement amount H. However, since it takes time (about 0.5 to 1.0 seconds) to change the output of the laser light irradiated from the laser head 94, if the output is changed sequentially according to the profile of the separation surfaces W1a and W2a, it takes a long time to flatten the entire surface of the separation surfaces W1a and W2a.

[0061] In this embodiment, in order to shorten the time required for the planarization process of the separation surfaces W1a and W2a, the following two methods are controlled in the planarization process. The following methods are controlled, for example, by the control device 140. Note that the planarization process for the separation surface W2a is performed in the same manner as the planarization process for the separation surface W1a, so in the following explanation, the planarization process for the separation surface W1a will be illustrated as a representative example.

[0062] The first method is to independently control the process using a high-power laser light (first laser light) and the process using a low-power laser light (second laser light) in order to reduce the number of times the laser light output is changed during the series of planarization processes.

[0063] Specifically, first, as shown in Fig. 11(a), a high-power laser beam is irradiated onto a convex portion D having a large displacement amount H, and the displacement amount H1 at the convex portion D is made to substantially coincide with the displacement amount H2 at a concave portion (a portion between adjacent convex portions D) as shown in Fig. 11(b) (first flattening process). The irradiation of the high-power laser beam onto the convex portions D is performed on the entire convex portions D on the separation surfaces W1a and W2a.

[0064] Next, low-power laser light is irradiated onto the entire surfaces of the separation surfaces W1a, W2a of the separation wafers W1, W2, which have been displaced by H2, so that the displacement H on the entire surfaces of the separation surfaces W1a, W2a is made substantially equal as shown in Fig. 11(c), i.e., the surface accuracy of the separation surfaces W1a, W2a is improved (second planarization process). At this time, since the convex portions D formed on the separation surfaces W1a, W2a as shown in Fig. 11(a) and Fig. 11(b) have been removed in advance, the surface accuracy of the entire surfaces of the separation surfaces W1a, W2a can be appropriately improved without changing the output of the low-power laser light midway.

[0065] According to the first method, without sequentially changing the output according to the profile of the separation surfaces W1a, W2a, the convex portion D is removed in advance to make the displacement amount H approximately uniform, and then a low-output laser beam is applied to improve the surface accuracy of the separation surfaces W1a, W2a. This significantly reduces the number of times the output of the laser beam is changed, specifically to just one time, and therefore the time required to flatten the entire surfaces of the separation surfaces W1a, W2a can be appropriately shortened.

[0066] The second method is to split the laser light into multiple beams when the laser head 94 has the spatial light modulator (e.g., LCOS) described above in order to reduce the number of times the laser light output is changed or the number of times the laser light is irradiated during the series of flattening processes.

[0067] The specific method is the same as the first method shown in Fig. 11, that is, the surface accuracy over the entire surface of the separation surfaces W1a, W2a is improved by sequentially performing the first planarization process and the second planarization process, but in this second method, the laser light L is split into multiple (two in the illustrated example) by a spatial light modulator as shown in Fig. 12, and the laser light L is irradiated simultaneously to multiple points on the separation surfaces W1a, W2a. More specifically, after the first laser light is irradiated simultaneously to multiple convex portions D to perform the above-mentioned first planarization process, the second laser light is further irradiated simultaneously to multiple points on the separation surfaces W1a, W2a to perform the above-mentioned second planarization process. This makes it possible to expand the area that can be planarized at one time, thereby shortening the time required for the planarization process of the separation surfaces W1a, W2a.

[0068] In addition, in Figure 12, an example is shown in which a plurality of first laser beams branched by a spatial light modulator are simultaneously irradiated onto a plurality of convex portions D, and a plurality of second laser beams are simultaneously irradiated onto separation surfaces W1a and W2a. However, as shown in Figure 13, the first flattening process and the second flattening process described above may be performed simultaneously by simultaneously irradiating laser beam L onto the convex portion D and the adjacent concave portion.

[0069] More specifically, as shown in Fig. 13, the first laser light is irradiated onto the convex portion D while moving the laser head 94, and the second laser light is irradiated onto the separation surfaces W1a and W2a so as to follow the irradiation of the first laser light onto the convex portion D. That is, in the example shown in Fig. 12, after the first planarization process is performed, the output of the laser light is changed and the second laser light is subsequently irradiated to perform the second planarization process, but in the example shown in Fig. 13, the second laser light is irradiated onto the separation surfaces W1a and W2a immediately after the irradiation of the first laser light onto the convex portion D. As a result, the first planarization process and the second planarization process are performed substantially simultaneously without changing the output of the laser light L.

[0070] In such a case, it is desirable to independently control the output of the first laser light L to the convex portion D and the output of the second laser light L to the separation surfaces W1a, W2a after removing the convex portion D. This allows the first planarization process and the second planarization process to be performed substantially simultaneously as described above, so that the entire separation surfaces W1a, W2a can be planarized without changing the output of the laser light, i.e., the time required for the planarization process can be significantly shortened.

[0071] The planarization process according to the embodiment is performed as described above. Next, the first separated wafer W1 that has been subjected to the planarization process is transferred to the processing apparatus 100 by the wafer transfer device 32 and delivered to the chuck 112 at the first delivery position A1. At the same time, the second separated wafer W2 is inverted in the inversion device 80, and then transferred to the processing apparatus 100 by the wafer transfer device 32 and delivered to the chuck 112 at the second delivery position A2.

[0072] Next, the turntable 110 is rotated 180° about the vertical axis to move the first separated wafer W1 to the first processing position B1, and the second separated wafer W2 to the second processing position B2.

[0073] Next, the separation surface W1a of the first separated wafer W1 is ground at the first processing position B1, and the height position of the separation surface W1a (the thickness of the first separated wafer W1) is reduced to the target surface as shown in FIG. 7(e) and FIG. 11(d). At the same time, the separation surface W2a of the second separated wafer W2 is ground at the second processing position B2 (step P7 in FIG. 6). At this time, the surface accuracy of the separation surfaces W1a, W2a of the separated wafers W1, W2 has been improved by the flattening process in step P6. This allows the grinding units 120, 130 to properly grind the separation surfaces W1a, W2a.

[0074] Next, the turntable 110 is rotated 180° around the vertical axis to move the first separated wafer W1 to the first transfer position A1, and the second separated wafer W2 to the second transfer position A2. At the first transfer position A1, the separated surface W1a of the first separated wafer W1 may be cleaned with a cleaning liquid using a cleaning liquid nozzle (not shown). At the second transfer position A2, the separated surface W2a of the second separated wafer W2 may be cleaned with a cleaning liquid using a cleaning liquid nozzle (not shown).

[0075] Next, the first separated wafer W1 is transferred to one cleaning apparatus 50 by the wafer transfer apparatus 32, and the second separated wafer W2 is transferred to the other cleaning apparatus 50 by the wafer transfer apparatus 32. In the cleaning apparatus 50, the separated surfaces W1a and W2a of the separated wafers W1 and W2 are scrubbed and cleaned, respectively (step P8 in FIG. 6).

[0076] Next, the first separated wafer W1 is transferred by the wafer transfer device 22 to one wet etching device 40, and the second separated wafer W2 is transferred by the wafer transfer device 22 to the other wet etching device 40. In the wet etching device 40, the separated surfaces W1a, W2a of the separated wafers W1, W2 are wet etched with a chemical solution (step P9 in FIG. 6). Grinding marks may be formed on the separated surfaces W1a, W2a ground by the above-mentioned processing device 100. In this step P9, the grinding marks can be removed by wet etching, and the separated surfaces W1a, W2a can be smoothed.

[0077] Thereafter, the first separated wafer W1 and the second separated wafer W2 that have been subjected to all the processes are respectively transferred by the wafer transfer device 22 to the cassettes Cw1 and Cw2 on the cassette mounting table 10. In this manner, a series of wafer processes in the wafer processing system 1 is completed. The first separated wafer W1 having the device layer Dv is commercialized. The second separated wafer W2 is, for example, reused.

[0078] According to the above embodiment, prior to grinding the separation surfaces W1a, W2a of the separated wafers W1, W2, the surface accuracy is improved by irradiating the separation surfaces W1a, W2a with a laser beam. This prevents the unevenness formed on the separation surfaces W1a, W2a from interfering with the grinding process, and thus allows the separation surfaces W1a, W2a to be appropriately ground.

[0079] Furthermore, in the planarization process aimed at improving surface accuracy according to the embodiment, in order to reduce the number of times the output of the laser light L is changed according to the displacement amount H of the convex portion D formed on the separation surfaces W1a and W2a, the first planarization process using the high-output laser light L and the second planarization process using the low-output laser light L are independently performed. This allows the output of the laser light L to be changed only when transitioning from the first planarization process to the second planarization process, thereby appropriately reducing the number of times the output of the laser light L is changed and shortening the time required for the planarization process.

[0080] In the planarization process according to the embodiment, the laser light irradiated from the laser head 94 is split by a spatial light modulator, and the laser light is irradiated simultaneously to a plurality of points on the separation surfaces W1a and W2a. This makes it possible to expand the area irradiated with the laser light L at one time and shorten the time required for the planarization process, and also to reduce the number of times the output of the laser light L is changed, thereby further shortening the time required for the planarization process.

[0081] In the above embodiment, the conditions of the planarization process in the planarization device 90 (such as the output and irradiation position of the laser light L) are determined based on the displacement amount H of the uneven portion calculated based on the imaging results of the separation surfaces W1a and W2a. However, the method of determining the conditions of the planarization process is not limited to the above embodiment.

[0082] Specifically, the conditions of the planarization process in the planarization apparatus 90 may be controlled based on, for example, the formation conditions of the internal surface modified layer M1 in the modified separation apparatus 70 (the irradiation conditions of the laser light when forming the internal surface modified layer M1 in the modified separation apparatus 70).

[0083] As described above, the displacement amount H of the uneven portion of the separation surfaces W1a, W2a can be calculated based on the irradiation conditions of the laser light L (e.g., output, irradiation time, etc.) and the circumferential interval P and radial interval Q of the internal surface modified layer M1 shown in FIG. 8. The irradiation conditions of the laser light L and the pitch of the internal surface modified layer M1 can be obtained by referring to the processing recipe in the modification separation device 70. From this point of view, the displacement amount H of the uneven portion of the separation surfaces W1a, W2a may be estimated and calculated by referring to the processing recipe in the modification separation device 70 instead of imaging the separation surfaces W1a, W2a. In other words, the conditions of the planarization process in the planarization device 90 may be determined based on the formation conditions of the internal surface modified layer M1.

[0084] In the above embodiment, the separation surfaces W1a, W2a of the separated wafers W1, W2 after separation in the modified separation apparatus 70 are imaged. However, as described above, the displacement amount H of the uneven portion can be calculated based on the circumferential interval P and radial interval Q of the inner surface modified layer M1. From this viewpoint, the circumferential interval P and radial interval Q may be detected by imaging the back surface Wb (irradiated surface of the laser light L) of the first wafer W before separation after the formation of the inner surface modified layer M1, instead of imaging the separation surfaces W1a, W2a. In this case, the imaging of the back surface Wb (irradiated surface of the laser light L) of the first wafer W may be performed inside the modified separation apparatus 70 instead of the flattening apparatus 90, or may be performed in, for example, the buffer apparatus 60.

[0085] In the above embodiment, the surface accuracy of the separation surfaces W1a and W2a is improved (flattened) in the flattening device 90, thereby reducing the grinding resistance in the grinding process in the processing device 100. However, the flattening device 90 may further remove the internal surface modified layer M1 remaining on the separation surfaces W1a and W2a. By removing the internal surface modified layer M1, which is the portion where the Si crystal is amorphized, in the flattening device 90, it is not necessary to grind both the amorphous portion and the Si single crystal portion in the grinding process in the processing device 100. This suppresses the occurrence of differences in the grinding resistance value in the separation surfaces W1a and W2a due to differences in the crystal structures of the amorphous portion and the Si single crystal portion, and the grinding process can be performed efficiently.

[0086] Specifically, first, a high-power laser beam L is irradiated (first planarization process) to make the displacement amount H1 at the convex portion D approximately equal to the displacement amount H2 at the concave portion D as shown in FIG. 14(b). Then, as shown in FIG. 14(c), a low-power laser beam L is irradiated (second planarization process) to reduce the height position (thickness of the first separated wafer W1) of the separation surfaces W1a, W2a to the target surface where the internal surface modification layer M1 is to be removed, and the separation surfaces W1a, W2a are planarized at the target surface. In other words, the internal surface modification layer M1 is removed at the same time as the planarization process of the separation surfaces W1a, W2a in the planarization device 90.

[0087] 14, the internal surface modification layer M1 is removed to the target surface in the second planarization process in which low-power laser light L is irradiated, but the internal surface modification layer M1 can be removed by any method in the planarization device 90. Specifically, for example, as shown in FIG. 15(b), after the displacement amount H1 in the convex portion D is reduced to the target surface in the first planarization process, the displacement amount H2 in the concave portion may be reduced to the target surface in the second planarization process.

[0088] Furthermore, even when the inner surface modification layer M1 is removed in the flattening device 90, the laser light L from the laser head 94 may be split into multiple beams by a spatial light modulator, as in the above embodiment. In such a case, the split laser light L may be irradiated simultaneously onto multiple convex portions D, or may be irradiated simultaneously onto each of the convex portions D and the concave portions. Furthermore, when multiple branched laser beams L are simultaneously irradiated onto the convex portions D and concave portions D, respectively, it is desirable to control the output of each laser beam L to an output that can reduce the displacement amount H of the convex portions D and concave portions D to the target surface.

[0089] Here, the peripheral portion of the first wafer W is usually chamfered, but if an internal surface modification layer M1 is formed on the entire surface of the first wafer W and then separation is performed as shown in Fig. 7, the peripheral portion of the first wafer W will have a sharply pointed shape (a so-called knife edge shape). This may cause chipping at the peripheral portion of the first wafer W, which may damage the first wafer W. Therefore, a so-called edge trim may be performed to remove the peripheral portion of the first wafer W before the grinding process.

[0090] Therefore, edge trimming may be performed in the wafer processing system 1 of the above embodiment. Hereinafter, a description will be given of wafer processing according to another embodiment, which is performed using the wafer processing system 1. Note that in this embodiment, detailed description of processing similar to that in the above embodiment will be omitted.

[0091] The overlapped wafer T is transported to the modified separation apparatus 70 by the wafer transport apparatus 32. In the modified separation apparatus 70, a peripheral modified layer M2 and an inner surface modified layer M1 are sequentially formed inside the first wafer W, as shown in Fig. 16(b) and Fig. 16(c).

[0092] The peripheral modified layer serves as a base point for removing the peripheral portion We in edge trimming, and is formed in a ring shape along the boundary between the peripheral portion We and the central portion Wc to be removed in the first wafer W. Furthermore, inside the first wafer W, a crack C2 has developed from the peripheral modified layer M2 and reached the front surface Wa. However, the crack C2 has not yet reached the back surface Wb.

[0093] The inner surface modified layer M1 is formed in the surface direction from the center to the peripheral modified layer M2, that is, in the central portion Wc. The inner surface modified layer M1 is formed in the same manner as in the above embodiment (step P1 in FIG. 6).

[0094] Next, in the same modified separation apparatus 70, the first wafer W is separated into a first separated wafer W1 and a second separated wafer W2 using the inner surface modified layer M1 and the peripheral modified layer M2 as base points, as shown in Fig. 16(d). At this time, the second separated wafer W2 is separated together with the peripheral portion We. The method of separating the first wafer W is the same as that of the above embodiment (step P2 in Fig. 6).

[0095] Next, the first separated wafer W1 is transferred to the planarization device 90 by the wafer transfer device 32. In the planarization device 90, first, an image of the separation surface W1a of the first separated wafer W1 is captured, and the amount of displacement H of the uneven portion of the separation surface W1a is obtained. At this time, the horizontal orientation of the first separated wafer W1 may be adjusted.

[0096] In parallel with this, the second separated wafer W2 is transferred to the reversing device 80 by the wafer transfer device 32. In the reversing device 80, the front and back surfaces of the second separated wafer W2 are reversed.

[0097] The second separated wafer W2 with its front and back sides inverted is transferred to the planarization device 90 by the wafer transfer device 32. In the planarization device 90, first, an image of the separation surface W2a of the second separated wafer W2 is captured, and the amount of displacement H of the uneven portion of the separation surface W2a is obtained. At this time, the horizontal orientation of the second separated wafer W2 may be adjusted.

[0098] Next, in the planarization device 90, the separation surfaces W1a and W2a of the separated wafers W1 and W2 are planarized, respectively, as shown in Fig. 16(e) and Fig. 16(f). Specifically, the projections formed on the separation surfaces W1a and W2a are irradiated with laser light to remove the projections by ablation processing. The method for planarizing the separation surfaces W1a and W2a is the same as that of the above embodiment (step P6 in Fig. 6).

[0099] Next, the first separated wafer W1 and the second separated wafer W2 are each transported to the processing apparatus 100 by the wafer transport device 32. In the processing apparatus 100, the separated surface W1a of the first separated wafer W1 is ground as shown in FIG. 16(g) to remove the peripheral modified layer M2 and the internal surface modified layer M1 remaining on the separated surface W1a. At the same time, the separated surface W2a of the second separated wafer W2 is ground as shown in FIG. 16(h) to remove the peripheral modified layer M2 and the internal surface modified layer M1 remaining on the separated surface W2a. The method of grinding the separated surfaces W1a and W2a is the same as in the above embodiment (step P7 in FIG. 6).

[0100] The subsequent processes are the same as those in the above embodiment (steps P8 and P9 in FIG. 6). That is, the separated wafers W1 and W2 that have been subjected to the grinding process are sequentially cleaned in the cleaning device 50 and etched in the wet etching device 40.

[0101] In this embodiment, the same effects as those of the above embodiment can be obtained. Moreover, according to this embodiment, the peripheral portion We of the first wafer W is removed by edge trimming, so that the formation of a so-called knife edge shape in the peripheral portion We is suppressed.

[0102] In the above embodiment, the planarization process is performed in the planarization device 90 disposed independently inside the wafer processing system 1, but the planarization process may be performed, for example, in the modification separation device 70. In this case, since the laser light (e.g., YAG laser) for forming the inner surface modification layer M1 and the laser light (e.g., picosecond laser) for performing the planarization process are different, it is preferable that the laser heads for irradiating the respective laser lights are disposed independently.

[0103] In the above embodiment, the inner surface modified layer M1, which is the base point for separating the first wafer W, and the peripheral modified layer M2, which is the base point for removing the peripheral portion We, are formed in the modified separation device 70, but the positions at which these modified layers are formed are not limited to this. Specifically, for example, a separation device (not shown) for separating the first wafer W and a modification device (not shown) for forming the inner surface modified layer M1 and the peripheral modified layer M2 may be independently arranged inside the wafer processing system 1, and these modified layers may be formed inside the modification device.

[0104] In the above embodiment, the processing object is a silicon wafer, but the type of processing object is not limited to this. For example, instead of a silicon substrate, a glass substrate, a single crystal substrate, a polycrystalline substrate, or an amorphous substrate may be selected as the processing object. Also, instead of a circular substrate, an ingot, a base, or a thin plate may be selected.

[0105] In the above embodiment, the case where the first wafer W in the overlapped wafer T is thinned has been described, but the above embodiment can also be applied to the case where one wafer is thinned.

[0106] The embodiments disclosed herein should be considered as illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0107] 1. Wafer Processing System 70 Flattening device 140 Control device D Convex part H Displacement L Laser light M1 Internal surface modification layer S 2nd wafer T Polymerized Wafer W First wafer W1 First separation wafer W1a separation plane W2 Second separation wafer W2a Separation surface

Claims

1. A processing system for processing an object to be processed, comprising: a displacement acquisition device that acquires a displacement amount of a separation surface of a separated body separated from a modified layer formed inside the processing object as a base point; a planarization device that irradiates the separation surface with a laser beam to planarize the separation surface; A control device, The control device includes: performing control to acquire an amount of displacement of the separation surface in the displacement amount acquisition device; performing control in the planarization device to execute a first planarization process in which a first laser light is irradiated onto a convex portion having a large amount of displacement on the separation surface; and performing control in the planarization device to perform a second planarization process in which the separation surface is irradiated with a second laser beam having a lower output than the first laser beam.

2. The processing system according to claim 1 , further comprising a separation device that separates the object to be processed into a plurality of separated bodies using the modified layer as a base point.

3. The processing system according to claim 1 , wherein the displacement amount acquisition device is integral with the planarization device.

4. the flattening device is configured to be capable of simultaneously irradiating a plurality of the laser beams onto different positions on the separation surface; The control device includes: a control for simultaneously irradiating a plurality of the first laser beams onto different convex portions in the first planarization process; 4. The processing system according to claim 1, further comprising: a control for simultaneously irradiating different positions on the separation surface with a plurality of the second laser beams in the second planarization process.

5. the flattening device is configured to be capable of simultaneously irradiating a plurality of the laser beams onto different positions on the separation surface; The control device includes: The processing system according to any one of claims 1 to 3, wherein control is performed to simultaneously perform the first planarization process and the second planarization process by simultaneously irradiating the first laser light onto the convex portion and irradiating the second laser light onto a concave portion adjacent to the convex portion and having a smaller displacement than the convex portion.

6. The processing system according to claim 5 , wherein the control device performs control to independently adjust outputs of the first laser light and the second laser light that are simultaneously irradiated.

7. the processing object is a laminated substrate in which a front surface side of a first substrate and a front surface side of a second substrate are bonded together, The processing object is separated into a first separation substrate on a front side and a second separation substrate on a back side of the first substrate, using the modified layer formed inside the first substrate as a base point; 7. The processing system according to claim 1, wherein the planarizing device planarizes at least the separation surface of the first separation substrate.

8. A reversing device for reversing the front and back surfaces of the second separation substrate, The processing system according to claim 7 , wherein the planarizing device planarizes the separation surface of the second separated substrate after inversion.

9. The control device includes:

9. The processing system according to claim 7, wherein control is performed so that the peripheral portion of the first substrate is removed together with the second separated substrate.

10. 10. The processing system according to claim 1, further comprising a processing device for grinding the separated surface after planarization.

11. A method for processing an object to be processed, comprising the steps of: acquiring a displacement amount of a separation surface of a separated object separated from the processing object with a modified layer formed inside the processing object as a base point; performing a first planarization process by irradiating the separation surface with a first laser light to remove convex portions on the separation surface that have a large amount of displacement; and performing a second planarization process by irradiating the separation surface with a second laser beam having a lower output than at least the first laser beam, thereby making the amount of displacement uniform over the entire surface of the separation surface.

12. The processing method according to claim 11 , further comprising: separating the processing object into a plurality of separate bodies using the modified layer as a base point.

13. The processing method according to claim 11 , wherein acquisition of the displacement amount of the separation surface and the first planarization process and the second planarization process of the separation surface are performed in a same device.

14. In the first planarization process, a plurality of first laser beams are simultaneously irradiated onto different convex portions formed on the separation surface; The processing method according to any one of claims 11 to 13, further comprising: simultaneously irradiating different positions of the separation surface with a plurality of the second laser beams in the second planarization process.

15. The processing method according to any one of claims 11 to 13, wherein the first planarization process and the second planarization process are performed simultaneously by simultaneously irradiating the first laser light onto the convex portion and irradiating the second laser light onto a concave portion adjacent to the convex portion and having a smaller displacement than the convex portion.

16. The processing method according to claim 15 , wherein outputs of the first laser light and the second laser light which are simultaneously irradiated are adjusted independently of each other.

17. the processing object is a laminated substrate in which a front surface side of a first substrate and a front surface side of a second substrate are bonded together, The processing object is obtained by separating the first substrate into a first separation substrate on a front side and a second separation substrate on a back side, using the modified layer formed inside the first substrate as a base point; The processing method according to any one of claims 11 to 16, wherein the first planarization process and the second planarization process are performed on at least the separation surface of the first separation substrate.

18. inverting the second separated substrate after separation; 20. The method of claim 17, further comprising: performing the first planarization process and the second planarization process on the separated surface of the second separated substrate after inversion.

19. 19. The processing method according to claim 17 or 18, further comprising removing a peripheral portion of the first substrate together with the second separated substrate from the first substrate.

20. The method according to any one of claims 11 to 19, further comprising grinding the separated surface after planarization.

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