Apparatus and method for transferring substrates into and out of a spatial multi-substrate processing tool - Patents.com

Abstract

An apparatus and method are described for loading and unloading substrates from a spatial processing chamber. The support assembly has a rotatable central base and support arms extending therefrom. A support shaft is at the outer end of the support arm, and a substrate support is on the support shaft. Primary lift pins are disposed within openings in the substrate support. Secondary lift pins are disposed within openings in the support arm and aligned with the primary lift pins. An actuation plate within the processing region raises the primary lift pins by contact with the secondary lift pins during transport of the support assembly.

Description

[Technical field]

[0001]

[0001] 1. Field of the Invention

[0002] Embodiments of the present disclosure relate generally to semiconductor manufacturing equipment. More particularly, the disclosed embodiments relate to an apparatus and method for loading and unloading substrates in a multi-substrate processing tool. [Background technology]

[0002]

[0002] In conventional time-domain atomic layer deposition (ALD) processes, reactive gases are flowed separately into the process chamber to avoid gas-phase reactions. Individual reactive gas exposures are separated by purge / pump periods. The pump / purge periods are often much longer than the reactive gas exposure time and can become rate limiting for the overall deposition process. Spatial ALD chambers can move one or more substrates from one environment to a second environment faster than a time-domain ALD chamber can pump / purge, resulting in higher throughput.

[0003]

[0003] Current spatial ALD processing chambers rotate multiple substrates at a constant speed on a heated circular platen and move the substrates from one processing environment to an adjacent environment. The different processing environments separate incompatible gases. However, current spatial ALD processing chambers do not allow the plasma environment to be optimized for plasma exposure, resulting in problems of non-uniformity, plasma damage, and / or process flexibility.

[0004] For example, process gas flows across the substrate surface. Because the substrate rotates about an offset axis, the leading and trailing edges of the substrate have different flow streamlines. In addition, there are flow differences between the inner and outer diameter edges of the substrate due to slower velocities at the inner edge and faster velocities at the outer edge. These flow non-uniformities can be optimized but not eliminated. Exposing the substrate to a non-uniform plasma can result in plasma damage. The constant speed rotation of the spatial processing chamber causes the substrate to move in and out of the plasma, so that some areas of the substrate are exposed to the plasma and other areas are outside of the plasma. Current spatial ALD chambers can only slow or speed up the rotation speed and cannot adjust the time difference between steps without changing the chamber hardware in small or large areas.

[0005]

[0005] Furthermore, conventional multi-substrate space processing chambers require a large Z-axis travel to provide sufficient space for the lift pin actuation mechanisms that enable loading and unloading of substrates. In some processing chambers, the Z-axis travel of the chamber spindle (pedestal) is limited to a maximum of about 80 mm due to physical space constraints.

[0006]

[0006] The lift pin actuation mechanism must clear moving parts of the processing chamber during normal operation. Typically, the lift pins are subjected to multiple acceleration and deceleration forces over a short period of time. For example, lift pins in some conventional spatial processing tools must withstand a peak acceleration of 2.5 g at 2 Hz for up to 60 million cycles over a three-year period. Premature lift pin failure results in lost throughput and costs associated with repairing and replacing broken and worn parts.

[0007]

[0007] Additionally, the lift pin mechanism must function safely and reliably with an electrostatic chuck, where the lift pins may be exposed to large voltage differences and should not cause short circuits or arcing between the electrodes.

[0008] Therefore, what is needed is an apparatus and method for improving the loading and unloading of substrates within a substrate processing chamber. Summary of the Invention

[0009]

[0009] One or more embodiments of the present disclosure are directed to a processing chamber including a support assembly and an actuation plate. The support assembly includes a rotatable central base that defines an axis of rotation. The rotatable central base is movable along the axis of rotation. At least two support arms extend from the central base. Each support arm has an inner end in contact with the central base and a top surface and a bottom surface that define a thickness of the support arm. A support shaft is at an outer end of each of the support arms. A substrate support is on each of the support shafts. The substrate support has a support surface and a bottom surface that define a thickness of the substrate support. The bottom surface is spaced a distance from the top surface of the support arm.

[0010] At least three primary lift pins are positioned within each of the openings in the substrate support. Each of the primary lift pins has a top end and a bottom end that define a length of the primary lift pin. The primary lift pins and the openings are configured to cooperatively interact to prevent the primary lift pins from passing completely through the bottom surface of the substrate support.

[0011] At least three secondary lift pins are positioned within the openings in the support arm. The secondary lift pins are aligned with the primary lift pins. Each of the secondary lift pins has a top end and a bottom end defining a length. At least a portion of the bottom end extends from the bottom surface of the support arm. The secondary lift pins and the openings in the support arm are cooperatively configured to interact and prevent the secondary lift pins from passing completely through the bottom surface of the support arm.

[0012]

[0012] The actuation plate is positioned a distance from the axis of rotation so as to be aligned with the outer ends of the support arms, the actuation plate having an actuation surface spaced a distance from the bottom surface of the support arms.

[0013]

[0013] Additional embodiments of the present disclosure are directed to a processing method. A support assembly in a processing chamber is rotated to align an outer end of the support arm of the support assembly with an actuation plate in the processing chamber. The support assembly rotates about a rotation axis. The support assembly is moved along the rotation axis toward the actuation plate such that bottom ends of a plurality of secondary lift pins contact the actuation plate. The secondary lift pins have a length defined by a top end and a bottom end. The secondary lift pins pass through a thickness of the support arm. Movement of the support assembly is continued along the rotation axis toward the actuation plate to bring the top ends of the secondary lift pins into contact with the bottom ends of the primary lift pins and push the primary lift pins, such that the top ends of the primary lift pins extend from a top surface of the substrate support onto the top of a support shaft connected to the outer end of the support assembly.

[0014]

[0014] A further embodiment of the present disclosure relates to a non-transitory computer-readable medium containing instructions that, when executed by a controller of a processing chamber, cause a processing chamber to perform operations including rotating a support assembly about a rotation axis to align an outer end of a substrate support arm of the support assembly with an actuating plate; moving the support assembly along the rotation axis toward the actuating plate so that bottom lower ends of a plurality of secondary lift pins contact the actuating plate, the secondary lift pins having lengths defined by top and bottom ends, the secondary lift pins passing through a thickness of the support arms and causing the top ends of the secondary lift pins to contact the bottom ends of the primary lift pins so as to push against the primary lift pins, whereby the top ends of the primary lift pins extend from a top surface of the substrate support and over the tops of support shafts connected to the outer end of the support assembly; moving the support assembly along the rotation axis toward the actuating plate; opening an access port in a side of the processing chamber; and loading a substrate into the processing chamber on the top ends of the primary lift pins.

[0015]

[0015] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above can be made by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting its scope. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a cross-sectional isometric view of a processing chamber according to one or more embodiments of the present disclosure. [Diagram 2]

[0017] FIG. 1 illustrates a cross-sectional view of a processing chamber in accordance with one or more embodiments of the present disclosure. [Diagram 3]

[0018] FIG. 2 is an exploded cross-sectional view of a processing station according to one or more embodiments of the present disclosure. [Figure 4]

[0019] FIG. 1 is a schematic diagram of a processing platform in accordance with one or more embodiments of the present disclosure. [Diagram 5]

[0020] FIG. 2 is a schematic diagram of a support assembly in a processing position in accordance with one or more embodiments of the present disclosure. [Figure 6]

[0021] FIG. 13 is a partial schematic diagram of a support assembly in a replacement position in accordance with one or more embodiments of the present disclosure. [Figure 7]

[0022] FIG. 13 is a partial cross-sectional isometric view of a support assembly in a replacement position in accordance with one or more embodiments of the present disclosure. [Figure 8]

[0023] FIG. 13 is a partial isometric view of an outer end of a support arm according to one or more embodiments of the present disclosure. [Figure 9A]

[0024] FIG. 2 is a partial schematic diagram of a primary lift pin and a secondary lift pin in a processing position in accordance with one or more embodiments of the present disclosure. [Figure 9B]

[0025] FIG. 1 is a partial schematic diagram of a primary lift pin and a secondary lift pin in a swap position in accordance with one or more embodiments of the present disclosure. [Figure 10A-10B]

[0026] 1 illustrates a secondary lift pin according to one or more embodiments of the present disclosure. [Figure 11A-11B]

[0027] 1 shows a partial schematic diagram of a method for loading and / or unloading a substrate onto a support assembly according to one or more embodiments of the present disclosure. [Fig. 11C-11D] 1 shows a partial schematic diagram of a method for loading and / or unloading a substrate onto a support assembly according to one or more embodiments of the present disclosure. [Figure 12]

[0028] FIG. 2 is a top view of the outer end of a support arm according to one or more embodiments of the present disclosure. [Figure 13]

[0029] FIG. 1 is an isometric view of a support assembly according to one or more embodiments of the present disclosure. [Figure 14]

[0030] FIG. 13 illustrates an exploded, partial isometric view of the outer end of a support arm having a removable block in accordance with one or more embodiments of the present disclosure. [Figure 15]

[0031] FIG. 1 is a schematic diagram of a processing chamber in accordance with one or more embodiments of the present disclosure. [Figure 16A]

[0032] FIG. 13 is a partial isometric view of an outer end of a support arm having a lift pin in accordance with one or more embodiments of the present disclosure. [Figure 16B]

[0033] 16B is a cross-sectional view of the embodiment of FIG. 16A taken along line 16B-16B'. [Figure 17]

[0034] FIG. 2 is a front view of a lift pin according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017]

[0035] Before describing certain example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description. The present disclosure is capable of other embodiments and of being practiced or carried out in various ways.

[0018]

[0036] As used in this specification and the appended claims, the term "substrate" refers to a surface or a portion of a surface on which a process acts. It will be understood by those skilled in the art that a reference to a substrate can also refer to only a portion of a substrate, unless the context clearly indicates otherwise. Furthermore, a reference to deposition on a substrate can refer to both a bare substrate and a substrate having one or more films or features deposited or formed thereon.

[0019]

[0037] As used herein, "substrate" (also referred to as "wafer") refers to any substrate or material surface formed on a substrate on which film processing is performed during a manufacturing process. For example, substrate surfaces on which processing can be performed include materials such as silicon, silicon oxide, strained silicon, silicon on insulator (SOI), carbon doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor substrates. Substrates may be exposed to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure, and / or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in this disclosure, any of the disclosed film processing steps may be performed on an underlying layer formed on the substrate, as disclosed in more detail below, and the term "substrate surface" is intended to include the underlying layer as the context indicates. Thus, for example, when a film / layer or partial film / layer is deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0020]

[0038] As used herein and in the appended claims, the terms "precursor," "reactant," "reactive gas," and the like are used interchangeably to refer to any gas species capable of reacting with the substrate surface or with a film formed on the substrate surface.

[0021]

[0039] 1 and 2 show a processing chamber 100 in accordance with one or more embodiments of the present disclosure. Figure 1 shows the processing chamber 100 shown as a cross-sectional isometric view in accordance with one or more embodiments of the present disclosure. Figure 2 shows a cross-section of the processing chamber 100 in accordance with one or more embodiments of the present disclosure.

[0022]

[0040] The processing chamber 100 includes a housing 102 having walls 104 and a bottom 106. The housing 102, together with a top plate 300, defines an interior region 109. The processing chamber 100 incorporates a substrate support assembly 200. As used in this manner, "assembly" refers to a combination of parts or members. The substrate support assembly 200, according to one or more embodiments, includes at least a support shaft 234 and a substrate support 230, as described further below.

[0023]

[0041] The illustrated processing chamber 100 includes multiple processing stations 110. The processing stations 110 are disposed within an interior region 109 of the housing 102 and positioned in a circular arrangement about an axis of rotation 211 of the substrate support 200. Each processing station 110 includes an injector 112 (also referred to as a gas injector) having a front surface 114. The processing stations 110 are defined as an area in which processing can be performed. For example, in some embodiments, the processing stations 110 are defined as an area bounded by a support surface 231 of the substrate support 200 and a front surface 114 of the injector 112, or a processing region 111, as described below. As discussed further below, the gas injectors 112 are part of a gas distribution assembly 105.

[0024]

[0042] The processing station 110 can be configured to perform any suitable process and provide any suitable process conditions. The type of gas injector 112 used depends, for example, on the type of process being performed and / or the type of showerhead or gas distribution plate. For example, a processing station 110 configured to operate as an atomic layer deposition apparatus can have a showerhead or vortex type gas injector. On the other hand, a processing station 110 configured to operate as a plasma station can have one or more electrodes and / or a ground plate arrangement to generate a plasma while flowing plasma gas toward the substrate. The embodiment shown in FIG. 2 has a different type of processing station 110 on the left side of the drawing (processing station 110a) than on the right side of the drawing (processing station 110b). Suitable processing stations 110 include, but are not limited to, thermal processing stations (e.g., chemical vapor deposition (CVD), atomic layer deposition (ALD)), microwave plasma, three-electrode CCP, ICP, parallel plate CCP, physical vapor deposition (PVD), UV exposure, laser processing, pump chamber, annealing station, and metrology station.

[0025]

[0043] In some embodiments, the support assembly 200 includes a rotatable central base 210. The rotatable central base 210 defines a rotation axis 211 that extends along a first direction. As a coordinate system, the rotation axis 211 extends along the Z direction such that rotation about the rotation axis 211 occurs in the XY plane. The first direction may be referred to as a vertical direction or a direction along the Z axis, but it should be understood that this use of the term "vertical" is not limited to a direction perpendicular to gravity. As used herein, when the central base 210 "rotates" about the rotation axis 211, the central base 210 is rotating in the XY plane. As used herein, movement "along" the rotation axis 211 or the first direction means that the central base 210 or a stated part is moving in the Z axis.

[0026]

[0044] The support assembly 200 includes at least two support arms connected to and extending from a central base 210. Each of the support arms 220 has a top surface 223 and a bottom surface 224 that define a thickness of the support arm 220. The support arms 220 have an inner end 221 and an outer end 222. The inner end 221 contacts the central base 210 such that as the central base 210 rotates about the axis of rotation 211, the support arms 220 rotate as well. The support arms 220 in some embodiments are connected to the central base 210 at the inner end 221 by a fastener (e.g., a bolt). In some embodiments, the support arms 220 are integrally formed with the central base 210.

[0027]

[0045] In some embodiments, the support arms 220 extend perpendicular to the axis of rotation 211 such that one of the inner end 221 or the outer end 222 on the same support arm 220 is farther from the axis of rotation 211 than the other of the inner end 221 and the outer end 222. In some embodiments, the inner end 221 of a support arm 220 is closer to the axis of rotation 211 than the outer end 222 of the same support arm 220.

[0028]

[0046] The number of support arms 220 in the support assembly 200 can vary. In some embodiments, there are at least two support arms 220, at least three support arms 220, at least four support arms 220, or at least five support arms 220. In some embodiments, there are three support arms 220. In some embodiments, there are four support arms 220. In some embodiments, there are five support arms 220. In some embodiments, there are six support arms 220.

[0029]

[0047] The support arms 220 can be positioned symmetrically about the central base 210. For example, in a support assembly 200 having four support arms 220, each of the support arms 220 is positioned at 90° intervals about the central base 210. In a support assembly 200 having three support arms 220, the support arms 220 are positioned at 120° intervals about the central base 210. Stated differently, in an embodiment having four support arms 220, the support arms are positioned to provide four-fold symmetry about the axis of rotation 211. In some embodiments, the support assembly 200 has n support arms 220, where the n support arms 220 are positioned to provide four-fold symmetry about the axis of rotation 211. In some embodiments, there are as many support arms 220 as there are processing stations 110.

[0030]

[0048] In some embodiments, a support shaft 234 is disposed at the outer end 222 of each of the support arms 220. The support shaft 234 acts as a standoff that spaces the substrate support 230 a distance from the top surface 223 of the support arm 220 along a first direction.

[0031]

[0049] The substrate support 230 is positioned at the outer end 222 of the support arm 220. In some embodiments, the substrate support 230 is positioned on a support shaft 234 at the outer end 222 of the support arm 220. The center of the substrate support 230 is positioned a distance from the axis of rotation 211 such that upon rotation of the central base 210, the substrate support 230 moves in a circular path that is offset from the axis of rotation.

[0032]

[0050] The substrate support 230 has support surfaces 231 configured to support a substrate during processing. In some embodiments, all of the support surfaces 231 of the substrate support 230 are substantially coplanar. As used in this manner, "substantially coplanar" means that the plane formed by each support surface 231 is within ±5°, ±4°, ±3°, ±2°, or ±1° of the plane formed by the other support surfaces 231.

[0033]

[0051] In some embodiments, channels 236 are formed in one or more of the central base 210, the support arm 220, the support shaft 234, and / or the substrate support 230. The channels 236 can be used to route electrical connections or to provide gas flow. In some embodiments, the substrate support 230 includes one or more heating elements 235 (see FIGS. 5 and 6).

[0034]

[0052] The substrate support 230 in some embodiments is a heater. The heater may be any suitable type of heater known to one of skill in the art. In some embodiments, the heater is a resistive heater having one or more heating elements 235 within a heater body. Electrical connections to the heater in some embodiments are via channels 236.

[0035]

[0053] In some embodiments, the substrate support 230 includes an electrostatic chuck. The electrostatic chuck may include various wires and electrodes so that a substrate disposed on the heater support surface 231 can be held in place while the substrate support moves. In some embodiments, the substrate support 230 includes a heater and an electrostatic chuck, which allows a wafer to be chucked to a heater at the start of processing and remain in the same position on the same heater as it moves to different processing regions.

[0036]

[0054] FIG. 3 illustrates an exploded view of a gas distribution assembly 105 for use in a processing station 110 or processing chamber according to one or more embodiments of the present disclosure. Those skilled in the art will recognize that the embodiment illustrated in FIG. 3 is a general schematic view and omits details (e.g., gas channels). The illustrated gas distribution assembly 105 includes three main components: a gas distribution plate 112, a lid 180, and an optional spacer 330. The spacer 330 is also referred to as a pump / purge spacer, an insert or pump / purge insert, a liner or a pump / purge liner. In some embodiments, the spacer 330 is connected to or in fluid communication with a vacuum (exhaust). In some embodiments, the spacer 330 is connected to or in fluid communication with a purge gas source.

[0037]

[0055] The openings 310 in the top plate 300 can be of uniform size or of different sizes. Different size / shape gas injectors 112 can be used with appropriately shaped pump / purge spacers 330 to transition from the openings 310 to the gas distribution plate 112. For example, as shown, the pump / purge spacer 330 includes a top portion 331 and a bottom portion 333 having sidewalls 335. When inserted into the openings 310 in the top plate 300, a ledge 334 is configured to position on the top surface 301 of the lid 300 around the openings 310.

[0038]

[0056] The pump / purge spacer 330 includes an opening 339 through which the gas distribution plate 112 can be inserted. The illustrated gas distribution plate 112 has a flange 341 having a contact surface 342. The contact surface 342 of the flange 341 is configured to contact the back surface 332 at the top 331 of the pump / purge spacer 330. The diameter or width of the gas distribution plate 112 can be any suitable size that can fit within the opening 339 of the pump / purge spacer 330. This allows for different types of gas injectors 112 to be used within the same opening 310 of the top plate 300.

[0039]

[0057] The pump / purge spacer 330 of some embodiments includes a gas plenum 336 having at least one opening 338 in the bottom 333 of the pump / purge spacer 330. The gas plenum 336 has an inlet (not shown), typically near the top 331 or sidewall 335 of the pump / purge spacer 330. In some embodiments, the plenum 336 is connected to a vacuum pump or other reduced pressure source and directs gases escaping from the processing region 111 through the opening 338 in the bottom 333 of the pump / purge insert 330 to create a gas curtain type barrier to prevent leakage of process gases from within the processing chamber.

[0040]

[0058] 4 illustrates a processing platform 400 according to one or more embodiments of the present disclosure. The embodiment illustrated in FIG. 4 is merely representative of one possible configuration and should not be construed as limiting the scope of the disclosure. For example, some embodiments have a different number or type of one or more of the processing chambers 100, buffer stations 420, and / or robot 430 configurations than the illustrated embodiment.

[0041]

[0059] The exemplary processing platform 400 includes a central transfer station 410 having multiple sides 411, 412, 413, 414. The illustrated transfer station 410 has a first side 411, a second side 412, a third side 413, and a fourth side 414. Although four sides are shown, one skilled in the art will appreciate that there can be any suitable number of sides for the transfer station 410 depending, for example, on the overall configuration of the processing platform 400. In some embodiments, the transfer station 410 has three sides, four sides, five sides, six sides, seven sides, eight sides, or more.

[0042]

[0060] The transfer station 410 has a robot 430 positioned therein. The robot 430 may be any suitable robot capable of moving a substrate during processing. In some embodiments, the robot 430 has a first arm 431 and a second arm 432. The first arm 431 and the second arm 432 of some embodiments are configured to move independently of the other arm. The first arm 431 and the second arm 432 of some embodiments are configured to move in the XY plane and / or along the Z axis. In some embodiments, the robot 430 includes a third arm (not shown) or a fourth arm (not shown). Each arm can move independently of the other arm.

[0043]

[0061] The illustrated embodiment includes six processing chambers 100, two connected to each of a second side 412, a third side 413, and a fourth side 414 of a central transfer station 410. The process performed in each of the processing chambers 100 is independent of the process performed in any of the other processing chambers. In some embodiments, all of the processing chambers 100 are configured to perform the same process, improving throughput by a multiple of the number of processing chambers 100.

[0044]

[0062] The illustrated processing platform 400 also includes one or more buffer stations 420 connected to a first side 411 of the central transfer station 410. The buffer stations 420 can perform the same or different functions. For example, the buffer stations can hold a cassette of substrates to be processed and returned to the original cassette, or one of the buffer stations can hold unprocessed substrates to be moved to the other buffer station after processing. In some embodiments, one or more of the buffer stations are configured to pre-treat, pre-heat, or clean substrates before and / or after processing. In some embodiments, one or more of the buffer stations are configured to anneal or post-treat substrates before and / or after processing.

[0045]

[0063] The processing platform 400 may also include one or more access ports 418 between the central transfer station 410 and any of the processing chambers 100. The access ports 418 are configured to open and close to isolate the interior regions 109 in the processing chambers 100 from the environment in the central transfer station 410. For example, if a processing chamber generates plasma during processing, the access port of that processing chamber may be closed to help prevent stray plasma from damaging the robot in the transfer station. In some embodiments, all processing chambers 100 are configured to perform the same process, and each chamber has a processing station 110 that isolates the substrate to a processing region 111 during processing, so the access ports are open throughout.

[0046]

[0064] The processing platform 400 of some embodiments is connected to a factory interface 450 to allow substrates or cassettes of substrates to be loaded onto the processing platform 400. A robot 455 in the factory interface 450 can be used to move the substrates or cassettes into and out of the buffer station. The substrates or cassettes can be moved within the processing platform 400 by a robot 430 in a central transfer station 410. In some embodiments, the factory interface 450 is a transfer station of another cluster tool (i.e., another multi-chamber processing platform).

[0047]

[0065] Some embodiments of the processing platform 400 include a controller 490 that is coupled to and controls the operation of various components of the processing platform 400. The controller 490 of some embodiments controls the entire processing platform 400. In some embodiments, the processing platform 400 includes multiple controllers 490, each configured to control one or more individual portions of the processing platform 400. For example, some embodiments of the processing platform 400 include separate controllers for one or more of the individual processing chambers 100, the central transfer station 410, the factory interface 450, and / or the robot 430.

[0048]

[0066] 4 as being connected to and controlling one or more components of the processing platform 400, the controller 490 may be connected to a single processing chamber 100. For example, although not included in the drawings, the controller 490 in some embodiments is connected to the processing chamber 100 shown and described with respect to FIGS.

[0049]

[0067] In some embodiments, at least one controller 490 is coupled to the processing chamber 100, the substrate support assembly 200, flow controllers, pressure gauges, pumps, feedback circuits, reaction space pressure gauges, gas distribution assembly 105, robot 430, robot 455, or other components used to operate the processing platform 400, as would be understood by one of ordinary skill in the art.

[0050]

[0068] The controller 490 may be one of any form of general purpose computer processor, microcontroller, microprocessor, etc. that can be used in an industrial environment to control various chambers and sub-processors. At least one controller 490 of some embodiments has a processor 492, a memory 494 coupled to the processor 492, input / output devices 496 coupled to the processor 492, and support circuitry 498 for communication between different electronic components. The memory 494 of some embodiments includes one or more of a temporary memory (e.g., random access memory) and a non-transitory memory (e.g., storage).

[0051]

[0069] The processor's memory 494 or computer readable medium may be one or more readily available memories, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or other form of local or remote digital storage. The memory 494 may hold a set of instructions operable by the processor 492 to control system parameters and components. The support circuits 498 are coupled to the processor 492 for supporting the processor in a conventional manner. The circuits may include, for example, cache, power supplies, clock circuits, input / output circuits, subsystems, etc.

[0052]

[0070] The processes can generally be stored in memory as software routines that, when executed by a processor, cause the process chamber to perform the processes of the present disclosure. The software routines can also be stored and / or executed by a second processor (not shown) located remotely from the hardware controlled by the processor. Some or all of the methods of the present disclosure can also be performed in hardware. Thus, the processes can be implemented in software and executed in hardware, such as, for example, an application specific integrated circuit or other type of hardware implementation, using a computer system, or as a combination of software and hardware. The software routines, when executed by a processor, transform a general-purpose computer into a special-purpose computer (controller) that controls the chamber operation so that the processes are performed.

[0053]

[0071] One or more embodiments of the present disclosure advantageously provide a simple and reliable mechanism for transferring wafers into and out of a spatial multi-substrate processing tool. Some embodiments incorporate primary lift pins without counterweights. Some embodiments use conductive materials for the primary lift pins. In some embodiments, the primary lift pins can be advantageously dropped into openings in the pedestal heater.

[0054]

[0072] The secondary lift pins are positioned to rotate with the support arm 220 such that the secondary lift pins remain associated with the same substrate support throughout.

[0055]

[0073] In some embodiments, both the primary and secondary lift pins are electrically and / or thermally conductive. The use of conductive material in the lift pins prevents charge build-up that can cause the lift pins to stick during processing. Some embodiments prevent uneven chucking of the incoming substrate by grounding the substrate until it is fully seated on the substrate support surface 231. Additionally, the conductive lift pins ground and bleed charge from the substrate as it exits.

[0056]

[0074] Some embodiments include a static lift pin actuation plate. The actuation plate can be positioned at any suitable location within the processing chamber. In some embodiments, the actuation plate is positioned adjacent to the chamber access port. Some embodiments of the present disclosure advantageously eliminate the need for a separate active lift motor for lift pin actuation during wafer transfer. In some embodiments, the combination of lift pins and actuation plate reduces intrusion into the processing area, reduces costs, and / or shortens substrate transfer time.

[0057]

[0075] 5-8, the support assembly 200 is movable along the axis of rotation 211 between a processing position (as shown in FIG. 5) and a transfer position (as shown in FIG. 6-8). When used in this manner, the term "transfer position" refers to a physical position of the support assembly 200 where a substrate can be loaded and / or unloaded from the support surface 231. The use of the term "loading" also means unloading, unless otherwise specified. FIG. 5 shows a partial cross-sectional schematic view of a processing chamber with the support assembly 220 in a processing position, according to one or more embodiments of the present disclosure. FIG. 6 shows a partial cross-sectional schematic view of a processing chamber with the support assembly 220 in a transfer position, according to one or more embodiments of the present disclosure. FIG. 7 shows a partial cross-sectional front view of the processing chamber of FIG. 6. FIG. 8 shows a partial perspective view of a portion of the processing chamber of FIG. 7 at a different viewing angle.

[0058]

[0076] The support assembly 200 in some embodiments rotates about a rotational axis 211 using a rotational motor 260 connected to the rotatable base 210. In some embodiments, the support assembly 200 is movable along the length of the rotational axis 211 (in the Z-axis direction) using a lift motor 265.

[0059]

[0077] Some embodiments of the present disclosure incorporate at least three primary lift pins 500 positioned within each opening 239 of the substrate support 230. The openings 239 pass through the entire thickness of the substrate support 230, allowing the primary lift pins 500 to be dropped through the support surface 231 into the openings 239 and easily removed. The number of primary lift pins 500 can vary and is not limited to three. In some embodiments, there are more or less than three primary lift pins 500. In some embodiments, there are at least four, five, or six primary lift pins 500.

[0060]

[0078] Each of the primary lift pins 500 has a top end 501 and a bottom end 502 that define a length LP of the primary lift pin 500. FIG. 9A shows a close-up view of the primary lift pin 500 in the opening 239 of the substrate support 230 in a processing position. The primary lift pin 500 and the opening 239 of some embodiments are configured to cooperatively interact to prevent the primary lift pin 500 from passing completely through the bottom surface 232 of the substrate support 230. FIG. 9B shows a close-up view of the primary lift pin 500 of FIG. 9A in the opening 239 of the substrate support 230 in a transfer position. The top end portion 504 of the illustrated primary lift pin 500 has a flared shape that interacts with a complementary flared shape 237 along the length of the opening 239. 9A, the complementary flare feature 237 in the opening 239 is disposed within a sufficient thickness of the substrate support 230 such that the top end 501 of the primary lift pin 500 is recessed below the support surface 231 when in the processing position. In some embodiments, the top end 501 of the primary lift pin 500 is substantially flush with or below the support surface 231 of the substrate support 230 when the processing chamber is in the processing position.

[0061]

[0079] In some embodiments, the top end portion 504 of the primary lift pin 500 is flared and the opening 239 in the substrate support 230 has a complementary flared surface 505 that prevents the length of the primary lift pin 500 from passing through the bottom surface 232 of the substrate support 230.

[0062]

[0080] Although the top end 504 of the primary lift pin 500 is shown with a conical flare, one skilled in the art will recognize that this is but one possible configuration and that the top end of the primary lift pin 500 may have any suitable shape. A complementary shape formed in the aperture 239 in some embodiments mimics the shape of the top end portion 504. In some embodiments, the aperture 239 has some irregularities that cooperatively interact with the primary lift pin 500 to prevent the primary lift pin 500 from falling off the substrate support 230.

[0063]

[0081] In some embodiments, the bottom end 502 of the primary lift pin 500 is rounded. As will be further described, the rounded bottom end 502 can help minimize or eliminate lateral loads during interaction with the secondary lift pin 510.

[0064]

[0082] The length LP of the primary lift pin 500 can vary. In some embodiments, the length LP of the primary lift pin 500 is greater than the thickness of the substrate support 230 such that a portion of the primary lift pin 500 can be above the support surface 231, and a portion of the primary lift pin 500 can be below the bottom surface 232 of the substrate support 230 at any time. This is shown in FIG. 9B. The length LP of the primary lift pin 500 in some embodiments is minimized to prevent the primary lift pin 500 from wobbling within the opening 239.

[0065]

[0083] In some embodiments, the primary lift pins 500 and the openings 239 are configured to prevent tilting of the primary lift pins 500 within the openings 239. The sizes of the primary lift pins 500 and / or the openings 239 vary such that a gap is formed between the pins and the openings. The size of the gap (also referred to as the tolerance) is small enough to prevent tilting. In some embodiments, the primary lift pins 500 and the openings 239 of the substrate support 230 are configured to have a maximum tilt of 0.33° with respect to a line perpendicular to the plane of the pedestal surface.

[0066]

[0084] The primary lift pins 500 may be made of any suitable material. In some embodiments, the primary lift pins 500 are made of a thermally and / or electrically conductive material. In some embodiments, the primary lift pins 500 include one or more of aluminum nitride, aluminum oxide, stainless steel, stainless steel coated with aluminum oxide, or silicon carbide. In some embodiments, the primary lift pins 500 do not have auxiliary weights to prevent the primary lift pins 500 from wobbling.

[0067]

[0085] 5-8, some embodiments include at least three secondary lift pins 510. The secondary lift pins 510 are positioned within the openings 229 of the support arm 220. Each of the secondary lift pins 510 has a length L S 10A and 10B show two possible secondary lift pins 510. The secondary lift pins 510 shown in FIGS. 10A and 10B are merely representative of possible configurations and should not be construed as limiting the scope of the present disclosure. The illustrated embodiment has a length L of the secondary lift pin 510. S It includes a symbolic break 515 to indicate that is variable.

[0068]

[0086] At least some of the secondary lift pins 510 are aligned with the primary lift pins 500. In some embodiments, there are the same number of secondary lift pins 510 as primary lift pins 500. In some embodiments, each of the secondary lift pins 510 is aligned with a primary lift pin 500. The number of primary lift pins 500 and secondary lift pins 510 can vary, as long as sufficient interaction can be created between the lift pins to enable loading and unloading of the substrate.

[0069]

[0087] The secondary lift pin 510 is positioned within an opening 229 in the outer end 222 of the support arm 220. At least a portion 514 of the lower end 512 (or a region proximate the bottom end 512) extends from the bottom surface 224 of the support arm 220. With reference to FIG. 11A, the length L of the portion 514 of the secondary lift pin 510 that extends below the bottom surface 224 of the support arm 220 is SB is the distance D between the top end 511 and the bottom end 502 of the secondary lift pin 510 G , and the distance D between the top end 501 of the primary lift pin 500 and the top surface 231 of the substrate support 230. P In some embodiments, the distance D from the bottom end 512 of the secondary lift pin 510 to the actuation surface 531 of the actuation plate 530 is at least equal to A is the distance D between the top end 511 and the bottom end 502 of the secondary lift pin 510 G , and the distance D between the top end 501 of the primary lift pin 500 and the top surface 231 of the substrate support 230 P Greater than.

[0070]

[0088] The secondary lift pins 510 and the openings 229 in the support arms 220 are configured to cooperatively interact to prevent the secondary lift pins 510 from passing completely through the bottom surface 224 of the support arms 220 .

[0071]

[0089] In some embodiments, the top end 511 of the secondary lift pin 510 is flat. In some embodiments, the bottom end 502 of the primary lift pin 500 is rounded and the top end 511 of the secondary lift pin 510 is flat. The combination of flat and rounded surfaces on the primary and secondary lift pins cushions against lateral loads due to slight misalignment. In some embodiments, the bottom end 502 of the primary lift pin 500 is flat and the top end 511 of the secondary lift pin 510 is rounded.

[0072]

[0090] The opening 229 in the support arm 220 may be of any suitable size that allows the secondary lift pin 510 to move along the Z-axis direction. In some embodiments, the opening 229 in the support arm 220 is sized to fit over the diameter D of the bottom end portion 514 of the secondary lift pin 510. SPThe size is within 0.01 inch, 0.0075 inch, or 0.005 inch of the

[0073]

[0091] In some embodiments, the secondary lift pins 510 and the openings 229 in the support arm 220 are configured to prevent the secondary lift pins 510 from tilting more than 0.33° during movement of the support assembly. The angle of tilt is measured relative to the top surface 223 of the support arm 220, with 0 degrees being perpendicular to the top surface 223.

[0074]

[0092] The secondary lift pins 510 may be made of any suitable material, in some embodiments, the secondary lift pins 510 include one or more of stainless steel or titanium.

[0075]

[0093] 10A illustrates an embodiment of a secondary lift pin 510. The secondary lift pin shown has a stepped diameter along its length LS, with the upper portion 517 having a diameter D of the lower portion 514. SP Diameter D is larger than SU 10A 。 The intersection of the upper portion 517 and the lower portion 514 provides a transition from the smaller diameter to the larger diameter. The transition may be abrupt, such as the step shown in FIG. 10A , or gradual, such as the flared tip of the primary lift pin. In some embodiments, the transition forms a contact surface 519. The contact surface 519 is configured to contact the top surface 223 of the support arm 220 when the processing chamber is in the processing position.

[0076]

[0094] 10B illustrates another embodiment of a secondary lift pin 510. In this embodiment, the secondary lift pin 510 has a bushing 518 positioned along the length LS of the lift pin 510. The bushing 518 has a bottom surface that acts similarly to the contact surface 519 of FIG. 10A. The bushing 518 is configured to contact the top surface 223 of the support arm 220 and prevent the secondary lift pin 510 from moving beyond the processing position toward the actuator plate 530. The bushing 518 in some embodiments is movable along the length of the secondary lift pin 510 so that the length of the bottom portion 514 can be adjusted.

[0077]

[0095] 5-8, the processing chamber 100 includes an actuation plate 530. The actuation plate 530 has an actuation surface 531 configured to engage the bottom ends 512 of the secondary lift pins 510. The actuation plate 530 is spaced a distance from the axis of rotation 211 such that it aligns with the outer ends 222 of the support arms 220. In some embodiments, there is one actuation plate 530.

[0078]

[0096] The actuation plate 530 can be of any suitable shape. In the illustrated embodiment, the actuation plate 530 forms a portion of a ring. The size of the actuation plate 530 is sufficient if all of the secondary lift pins 510 at one end of the support arm 220 can simultaneously engage the actuation surface 531.

[0079]

[0097] The actuation surface 531 of the actuation plate 530 is disposed at a distance D from the bottom surface 224 of the support arm 220 along the Z axis when the processing chamber is in the processing position, as shown in FIGS. 5 and 11A. AP When the support assembly 200 is in the processing position, the bottom ends 502 of the primary lift pins 500 are positioned at a processing distance (length L PB The bottom end 502 of the primary lift pin 500 extends a distance D from the top end 511 of the secondary lift pin 510. GThe bottom end 512 of the secondary lift pin 510 is spaced apart from the bottom surface 224 of the support arm 220 by a processing distance (length L SP When the support arm 220 is adjacent to the actuation plate 530, the bottom end 512 of the secondary lift pin 510 extends a processing distance D from the actuation surface 531. A When used in this manner, the support arm 220 abuts the actuation plate 530 when the support arm 220 is sufficiently aligned along the Z axis such that the actuation surface 531 can engage the secondary lift pin 510.

[0080]

[0098] 11A-11D, a portion of a processing method according to one or more embodiments of the present disclosure is described. In FIG. 11A, the support assembly 200 in the processing chamber 100 is rotated to align the outer end 222 of the support arm 220 with the actuation plate 530.

[0081]

[0099] 11B shows the embodiment of FIG. 11A after the support assembly 200 has moved along the axis of rotation 211 toward the actuating plate 530. The bottom surfaces 512 of the secondary lift pins 510, which pass through the thickness of the support arm 220, contact the actuating surface 531 of the actuating plate 530. At this point in the process, the distance D between the bottom ends 512 of the secondary lift pins 510 and the actuating surface 531 of the actuating plate 530 is A is zero. The length L of the lower portion 514 of the secondary lift pin 510 SB remains the same until contact occurs between the secondary lift pins 510 and the actuator plate 530.

[0082]

[0100] 11C shows the embodiment of FIG. 11B after the support assembly 200 has moved further along the axis of rotation 211 toward the actuation plate 530. Contact between the actuation surface 531 and the bottom end 512 of the secondary lift pin 510 holds the secondary lift pin 510 in place against the actuation surface 531. The support arm 220 continues to move toward the actuation plate, causing the lower portion 514 of the secondary lift pin 510 to slide through the opening 229 in the support arm 220, increasing the length L of the lower portion 514 of the secondary lift pin 510. SBis reduced below the bottom surface 224 of the support arm.

[0083]

[0101] The substrate support 230 and primary lift pins 500 also continue to move along the Z axis toward the actuator plate 530. The bottom ends 502 of the primary lift pins 500 contact the top ends 511 of the secondary lift pins 510. At this point, the distance D G decreases to zero, and the lower portion 516 of the secondary lift pin 510 above the top surface 223 of the support arm 220 is at a distance D GL The distance D at the time shown in FIG. GL is the distance D at the time shown in FIG. G The length L that the primary lift pins 500 extend below the bottom surface 232 of the substrate support 230 is equal to BP remains the same as in FIG. 11B.

[0084]

[0102] 11D illustrates the embodiment of FIG. 11C after the support assembly 200 has been moved to a transfer position, as shown in FIG. 6. When in the transfer position, the actuation surface 531 of the actuation plate 530 is a loading distance D along the Z axis from the bottom surface 224 of the support arm 220. AL The bottom surface 224 of the support arm 220 is disposed at a loading distance D from the actuation surface 531 of the actuation plate 530. AL The bottom ends 512 of the secondary lift pins 510 are in contact with the actuation surface 531, and the length of the lower portions 514 of the secondary lift pins 510 that extend from the bottom surface 224 is a minimum length L SBL The top end 511 of the secondary lift pin 510 is in contact with the bottom end 502 of the primary lift pin 500, and the top end 501 of the primary lift pin 500 is a loading distance D from the support surface 231 of the substrate support 230. PL 11A-11D. The length LPB of the primary lift pins 500 extending from the bottom surface 232 of the substrate support 230 is a minimum length. Figure 9B shows a close-up view of the primary lift pins 500 in the transfer position and supporting the substrate 101. Some embodiments further include performing the operations described with respect to Figures 11A-11D in reverse.

[0085]

[0103] Figures 12-14 show a support arm 220 according to one or more embodiments of the present disclosure. Figure 12 shows an enlarged partial view of the outer end 222 of the support arm 220 looking at the top surface 223. Figure 13 shows an orthogonal view of the support arm 220 with the outer end 222 of Figure 12. Figure 14 shows an exploded view of the outer end 222 of the partial support arm 220 shown in Figures 12 and 13.

[0086]

[0104] The outer end 222 of the illustrated support arm 220 has three secondary lift pins 510 spaced about a periphery of the outer end 222. Two of the secondary lift pins 510 are positioned within a protrusion 226 that extends from a central portion of the outer end 222. The protrusion 226 in some embodiments is integrally formed with the support arm 220.

[0087]

[0105] Each of the protrusions 226 includes a pair of openings 229a, 229b that extend through the thickness of the support arm 220. Only one of the pair of openings 229a, 229b has a secondary lift pin 510 disposed therein. In the illustrated embodiment, each of the openings 229a has a secondary lift pin 510 and each of the openings 229b is unoccupied. In some embodiments, each of the openings 229b has a secondary lift pin 510 and each of the openings 229a is unoccupied. In some embodiments of a processing tool that includes multiple processing chambers 100, one of the processing chambers 100 has a secondary lift pin 510 in one of the openings 229a, 229b and another processing chamber 100 is a mirror image having a secondary lift pin 510 in the other of the openings 229a, 229b.

[0088]

[0106] In the embodiment shown in Figures 12-14, two protrusions 226 are present on the outer end 222 of each support arm 220, accounting for two secondary lift pins 510. The third secondary lift pin 510 is disposed in a removable block 550 that connects to the outer surface 551 of the support arm 220. For example, in an embodiment in which the channel 236 is drilled through the body of the support arm 220 from the outer surface 551 toward the central base 210, there is no protrusion on the outer surface 551. The removable block 550 in some embodiments is attached to the outer surface 551 after drilling. In some embodiments, the removable block 550 seals the open end of the drilled channel 236. In some embodiments, the open end of the drilled channel is covered by a separate cover piece (not shown), and the removable block 550 is attached to the outer surface 551 through, on, or around the separate cover piece.

[0089]

[0107] The removable block 550 includes a body 552 having at least one connecting flange 553 and a protrusion 554. The illustrated removable block 550 has two connecting flanges 553 on either side of the protrusion 554. The removable block 550 includes two openings 559a, 559b for holding the secondary lift pins 510. The spacing between the openings 559a, 559b in some embodiments is the same as the spacing between the openings 229a, 229b on the protrusion 226 of the outer end 222 of the support arm 220.

[0090]

[0108] In the illustrated embodiment, the body 552 of the removable block 550 includes an index tab 555. The index tab 555 extends from the body 552 in a direction opposite to the projection 554. The index tab 555 in some embodiments is sized to cooperatively interact with a detent 556 formed on the outer end 222 of the support arm 220. In the illustrated embodiment, the detent 556 is a notch removed from the intersection of the outer surface 551 and the top surface 223 of the support arm. In some embodiments, there are multiple index tabs 555 on the removable block 550 and multiple detents 556 on the outer end 222 of the support arm 220. The index tab 555 and the detent 556 aid in aligning the removable block 550 on the outer end 222 of the support arm 220 to maintain the position and angular relationship of the secondary lift pin 510.

[0091]

[0109] In some embodiments, the processing chamber 100 includes at least one removable secondary lift pin block 550 connected to the outer end 222 (or outer surface 551) of the support arm 220. The removable secondary lift pin block 550 of some embodiments has at least one aperture configured to support one of the secondary lift pins 510. In some embodiments, the removable secondary lift pin block 550 includes two apertures 559a, 559b configured to engage the secondary lift pin 510, where one of the apertures is not used or remains open.

[0092]

[0110] In the embodiment of Figure 8, the secondary lift pins 510 are arranged in a triangular pattern with one of the secondary lift pins 550 aligned along a central axis 560 (see Figure 12) of the support arm 220. The dual apertures 229a, 229b, 559a, 559b of Figures 12-14 shift the angle of the triangular pattern such that the apertures 559a, 559b at the outer end 222 are no longer aligned with the central axis 560. Using each of the apertures 229a, 559a in the "a" position or the apertures 229b, 559b in the "b" position results in a triangular pattern rotated an amount about the center of the triangle.

[0093]

[0111] 15 shows a schematic diagram of a processing chamber 100 in accordance with one or more embodiments of the present disclosure. The embodiment shown has four processing stations 110 arranged around an interior region 109. The support assembly 200 is rotated to a position such that each of the outer ends 22 of the support arms 220 is adjacent to a processing station 110. The secondary lift pins 510 are shown in the upper left processing station 110, which is the station 110 closest to the access port 118.

[0094]

[0112] 16A, 16B, and 17 show one or more embodiments of the present disclosure in which secondary lift pins 510 are positioned within bushings 561a located in openings 229a. Openings 229b have bushings 561b with openings 562 without secondary lift pins 510. In some embodiments, bushings 561b without secondary lift pins 510 are omitted.

[0095]

[0113] FIG. 16A shows an elevational view of a portion of the outer end 222 of the support arm 220. FIG. 16B shows a cross-sectional view of the protrusion 226 shown in FIG. 16A along line 16B-16B'. The bushing 561, which may be either bushing 561a or 561b in some embodiments, is a cylindrical piece within an inner surface 562 and an outer surface 563 that define a thickness of a wall 566 of the bushing 561. The bushing 561 has a top end 564 and a bottom end 565 that define a length of the bushing 561. The top end 564 in some embodiments has a flange 567 having an outer diameter larger than the outer diameter of the wall 566 to prevent the bushing 561 from falling through the opening 229b. An opening 569 extends from the top end 564 to the bottom end 565 of the bushing 561, within which the secondary lift pin 510 may be positioned.

[0096]

[0114] Bushing 561 may be made of any suitable material known to one of ordinary skill in the art. Suitable materials include, but are not limited to, polyethylene terephthalate (PET), acrylic, polycarbonate, acrylic polycarbonate, polystyrene, cross-linked polystyrene (e.g., Rexolite®), polyetherimide (PEI), and polyvinylidene fluoride (PVDF). In some embodiments, bushing 561 is made of polyetheretherketone (PEEK).

[0097]

[0115] The inner diameter of the opening 569 in some embodiments is configured to cooperatively interact with the outer diameter of the lower portion 514 of the secondary lift pin 510 to prevent or minimize tilt. In some embodiments, the inner diameter of the bushing 561 is in the range of 3.0 mm to 9.0 mm, or in the range of 4.0 mm to 8.0 mm, or in the range of 5.0 mm to 7.0 mm, or in the range of 5.5 mm to 6.5 mm. In some embodiments, the outer diameter of the portion 514 of the secondary lift pin 510 is in the range of 2.5 mm to 8.5 mm, or in the range of 3.5 mm to 7.5 mm, or in the range of 4.5 mm to 6.5 mm, or in the range of 5.0 mm to 6.0 mm. In some embodiments, the inner diameter of the bushing 561 is greater than the outer diameter of the lower portion 514 of the secondary lift pin 510 by 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1.0 mm. In some embodiments, the inner diameter of the bushing 561 is greater than the outer diameter of the lower portion 514 of the secondary lift pin 510 by less than 1.2 mm, 1.0 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, or 0.3 mm.

[0098]

[0116] In some embodiments, the bushing 561 has a length from a top end 564 to a bottom end 565 that is greater than the thickness of the protrusion 226 or the support arm 220. This type of embodiment is shown in Figure 16B. In some embodiments, the bottom portion of the bushing that extends from the bottom surface 224 of the support arm 220 has a locking pin 570 to prevent accidental lifting of the bushing 561.

[0099]

[0117] In some embodiments, the secondary lift pin 510 includes one or more weight reduction cutouts to lower the center of gravity, in some embodiments, while maintaining the overall stiffness of the secondary lift pin 510. In some embodiments, a secondary lift pin 510 with a lower center of gravity reduces vibration and friction between the secondary lift pin 510 and the bushings 561 a, 561 b positioned in the openings 229 a, 229 b, respectively.

[0100]

[0118] Some embodiments of the present disclosure provide an arrangement that extends the life of the bushing 561. Without being bound by theory, it is believed that a lower center of gravity and / or lower overall mass prevents the secondary lift pin 510 from wobbling or tilting as much as it would without the cutout, resulting in less friction against the bushing, which in turn extends the life of the PEEK bushing, which is a consumable part, and increases the time between routine maintenance. In some embodiments, reduced mass of the lift pin reduces friction between the lift pin and the bushing. In some embodiments, lowering the center of gravity of the secondary lift pin allows for increased travel distance along the Z axis without reducing the likelihood of the pin tilting to one side or the other during travel.

[0101]

[0119] In some embodiments, the secondary lift pins 510 maintain sufficient structural integrity to provide a low center of gravity and prevent bending of the pins. Attempts to lower the center of gravity have proven difficult as the resulting pins are brittle and easily bent.

[0102]

[0120] 17 , some embodiments of the present disclosure are directed to a secondary lift pin 510 having one or more cutouts 521 along the length of the secondary lift pin 510. In some embodiments, the cutouts 521 are in the top 517 of the secondary lift pin 510 and not in the bottom 514. In some embodiments, the cutouts are elongated slots along the length of the secondary lift pin 510 to reduce the overall weight of the secondary lift pin 510.

[0103]

[0121] The embodiment shown in Figure 17 includes three cutouts 521. One of ordinary skill in the art will recognize that this is merely representative of one possible configuration and that other configurations are within the scope of this disclosure. The number of cutouts 521 can vary depending on, for example, the overall length of the lift pin, the overall weight of the lift pin, the amount of weight to be removed from the lift pin, and / or the amount the center of gravity needs to be lowered. In some embodiments, there are 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more cutouts 521.

[0104]

[0122] In some embodiments, the cutouts reduce the weight of the secondary lift pins by an amount of 0.01 pounds, 0.02 pounds, 0.03 pounds, 0.04 pounds, 0.05 pounds, 0.06 pounds, 0.07 pounds, or 0.08 pounds or more.

[0105]

[0123] In some embodiments, the cutouts are configured to lower the center of gravity of the secondary lift pins 510 by 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, or 12 mm or more. In some embodiments, the cutouts are configured to lower the center of gravity of the secondary lift pins 510 by 20 mm, 18 mm, 16 mm, 14 mm, or 12 mm or less.

[0106]

[0124] Further, in this embodiment, the station closest to the access port 118 is the only station adjacent to the actuation plate 530. The orientation shown is that of the transfer position. In some embodiments, when the support assembly 200 is in the transfer position, only one of the support arms 220 is positioned above the actuation plate 530, and movement of the support assembly 200 along the rotation axis 211 actuates the secondary lift pins 510 of only the support arm 220 positioned above the actuation plate 530. In some embodiments, the actuation plate 530 is aligned with one of the processing stations 110 such that a substrate is loaded and / or unloaded directly onto the substrate support 230 aligned with the processing station 110.

[0107]

[0125] During transfer of a substrate to and / or from the processing chamber 100, the access port 118 opens and the robot arm enters the interior region 109. In some embodiments, the substrate is moved 556 through the access port 118 onto the primary lift pins 500 at an angle relative to the central axis 560 of the support arm 220. In some embodiments, the angle 565 is in the range of 50° to 60°.

[0108]

[0126] 4, some embodiments of the present disclosure are directed to a processing platform 400 incorporating a processing chamber 100 as described herein. In some embodiments, the processing platform 400 includes at least two processing chambers 100 as described herein arranged on either side of a central transfer station 410. In some embodiments, the processing chambers 100 are in an opposite arrangement such that one of the processing chambers 100 uses the openings 229a, 559a in the support arm 220 and the other processing chamber 100 uses the openings 229b, 559b in the support arm 220.

[0109]

[0127] Some embodiments of the present disclosure are directed to a controller 490 having one or more configurations for performing individual processes or sub-processes to perform the method embodiments described herein. The controller 490 can be connected and configured to operate intermediate components to perform the functions of the method. For example, the controller 490 of some embodiments is connected (directly or indirectly) to and configured to control one or more of gas valves, actuators, motors, access ports, reduced pressure controls, etc. Some embodiments are directed to a non-transitory computer-readable medium configured to perform the method embodiments.

[0110]

[0128] In some embodiments, the controller 490, or non-transitory computer readable medium, has one or more configurations or instructions selected from: moving a substrate on the robot to primary lift pins; loading and / or unloading a substrate from the system; rotating the support assembly about an axis of rotation to align an outer end of the support arm with the actuator plate; moving the support assembly along the axis of rotation toward the actuator plate; moving the support assembly along the axis of rotation away from the actuator plate; controlling an electrostatic chuck and / or an electrode in the support; and / or controlling a thermal element to control a temperature of the substrate support.

[0111]

[0129] In some embodiments, the present invention relates to a non-transitory computer-readable medium comprising instructions that, when executed by a controller of a processing chamber, cause a processing chamber to perform operations including rotating a support assembly about a rotation axis to align an outer end of a substrate support arm of the support assembly with an actuation plate; moving the support assembly along the rotation axis toward the actuation plate such that bottom lower ends of a plurality of secondary lift pins contact the actuation plate, the secondary lift pins having lengths defined by top and bottom ends, the secondary lift pins passing through a thickness of the support arms and causing the top ends of the secondary lift pins to contact the bottom ends of the primary lift pins so as to push against the primary lift pins, whereby the top ends of the primary lift pins extend from a top surface of the substrate support up a support shaft connected to the outer end of the support assembly; moving the support assembly along the rotation axis toward the actuation plate; opening an access port in a side of the processing chamber; and loading a substrate into the processing chamber on the top ends of the primary lift pins.

[0112]

[0130] References throughout this specification to "one embodiment," "a particular embodiment," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of phrases such as "in one or more embodiments," "a particular embodiment," "in an embodiment," or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0113]

[0131] Although the disclosure herein has been described with reference to specific embodiments, those skilled in the art will recognize that the described embodiments are merely illustrative of the principles and applications of the disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed method and apparatus without departing from the spirit and scope of the disclosure. Thus, the disclosure may include modifications and variations that come within the scope of the appended claims and their equivalents.

Claims

1. 1. A processing chamber including a support assembly, the support assembly comprising: a rotatable central base defining an axis of rotation, the rotatable central base being movable along the axis of rotation; at least two support arms extending from the central base, each of the support arms having an inner end contacting the central base, a top surface and a bottom surface defining a thickness of the support arm; a support shaft at an outer end of each of the support arms; a substrate support on each of the support shafts, the substrate support having a support surface defining a thickness of the substrate support and a bottom surface, the bottom surface being spaced a distance from the top surface of the support arm; at least three primary lift pins positioned within openings in each of the substrate support, each of the primary lift pins having a top end and a bottom end defining a length of the primary lift pin, at least a portion of the bottom end extending from the bottom surface of the substrate support, the primary lift pins and the openings configured to cooperatively interact to prevent the primary lift pins from passing completely through the bottom surface of the substrate support; at least three secondary lift pins positioned within openings in the support arm, the secondary lift pins aligned with the primary lift pins, each of the secondary lift pins having top and bottom ends defining a length, at least a portion of the bottom ends extending from the bottom surface of the support arm, the secondary lift pins and the openings in the support arm configured to cooperatively interact to prevent the secondary lift pins from passing completely through the bottom surface of the substrate support; an actuation plate positioned a distance from the axis of rotation to align with the outer ends of the support arms, the actuation plate having an actuation surface spaced a distance from the bottom surfaces of the support arms and the bottom surfaces of the secondary lift pins; Including, the support assembly is movable between a processing position in which the bottom ends of the primary lift pins and the top ends of the secondary lift pins are spaced apart, and a transfer position in which one of the support arms is aligned with the actuation plate and the bottom ends of the primary lift pins are in direct contact with the top ends of the secondary lift pins; A processing chamber, wherein in the transfer position, the support assembly moves along the rotational axis toward the actuator plate to lift the secondary lift pins and the primary lift pins such that the primary lift pins extend above a top surface of the substrate support.

2. The processing chamber of claim 1 , wherein the support assembly is movable along the axis of rotation between the processing position and the transfer position.

3. 3. The processing chamber of claim 2, wherein when the support assembly is in the processing position, the bottom ends of the primary lift pins extend a processing distance from the bottom surface of the substrate support and are spaced a distance from the top ends of the secondary lift pins, the bottom ends of the secondary lift pins extend a processing distance from the bottom surface of the support arm, and when adjacent the actuation plate, the bottom ends of the secondary lift pins are a processing distance from the actuation surface.

4. 4. The processing chamber of claim 3, wherein when the support assembly is in the transfer position, the bottom surface of the support arm is spaced a loading distance from the actuation plate such that the bottom ends of the secondary lift pins contact the actuation plate, the top ends of the secondary lift pins contact the bottom ends of the primary lift pins, and the top ends of the primary lift pins extend a loading distance from the support surface.

5. The processing chamber of claim 4 , wherein when in the processing position, the top ends of the primary lift pins are flush or below the support surface.

6. The processing chamber of claim 5 , wherein each of the substrate supports comprises one or more heating elements and the primary lift pins comprise a thermally conductive material.

7. 6. The processing chamber of claim 5, wherein the bottom end of each of the primary lift pins is rounded and the top end of each of the secondary lift pins is flat.

8. 6. The processing chamber of claim 5, wherein a portion of the top end of the primary lift pin is flared and the opening in the substrate support has a complementary flared surface to prevent a length of the primary lift pin from passing through the bottom surface of the substrate support.

9. 10. The processing chamber of claim 8, wherein the primary lift pins and the opening in the substrate support are configured to prevent the primary lift pins from tilting more than 0.33 degrees.

10. 10. The processing chamber of claim 9, wherein the primary lift pins do not have auxiliary weights to prevent the primary lift pins from wobbling.

11. 5. The processing chamber of claim 4, wherein the opening in the support arm is sized within 0.005 inches of a diameter of a bottom end portion of the secondary lift pin.

12. 5. The processing chamber of claim 4, wherein the secondary lift pins and openings in the support arms are configured to prevent the secondary lift pins from tilting more than 0.33 degrees during movement of the support assembly.

13. 5. The processing chamber of claim 4, wherein the secondary lift pins have bushings positioned along a length of the pins, the bushings having a bottom surface configured to prevent the secondary lift pins from moving beyond the processing position.

14. 5. The processing chamber of claim 4, wherein the secondary lift pin has a stepped diameter along its length such that an upper portion of the secondary lift pin has a larger diameter than a lower portion of the secondary lift pin, the upper portion and the lower portion forming a contact surface.

15. 5. The processing chamber of claim 4, wherein when the support assembly is in the transfer position, only one of the support arms is positioned above the actuation plate, and movement of the support assembly along the rotation axis actuates the secondary lift pins only in the support arm positioned above the actuation plate.

16. 10. The processing chamber of claim 1, further comprising at least one removable secondary lift pin block connected to the outer end of the support arm, the removable secondary lift pin block having at least one opening configured to support one of the secondary lift pins.

17. 20. The processing chamber of claim 16, wherein the removable secondary lift pin block includes two openings configured to engage secondary lift pins, one of the openings being unused.

18. a chamber body surrounding a processing region, the support assembly and the actuation plate being positioned within the processing region; and a plurality of processing stations within the processing region having a number equal to the number of the substrate supports; an access port in a side of the chamber body; Further comprising:

10. The processing chamber of claim 1, wherein the working plate is aligned with one of the processing stations such that a substrate is loaded and / or unloaded directly onto a substrate support aligned with the processing station.

19. rotating a support assembly about an axis of rotation within a processing chamber such that an outer end of a support arm of the support assembly is aligned with an actuator plate within the processing chamber; moving the support assembly along the axis of rotation toward the actuator plate such that bottom ends of a plurality of secondary lift pins contact the actuator plate, the secondary lift pins having a length defined by a top end and a bottom end, the secondary lift pins passing through a thickness of the support arm; continuing to move the support assembly along the axis of rotation toward the actuator plate such that the top ends of the secondary lift pins contact and push against the bottom ends of the primary lift pins, whereby the top ends of the primary lift pins extend from a top surface of a substrate support that is on top of a support shaft connected to the outer end of the support assembly; A processing method comprising:

20. When executed by a controller of a process chamber, the process chamber is rotating the support assembly about a rotation axis such that an outer end of a substrate support arm of the support assembly is aligned with an actuator plate; moving the support assembly along the axis of rotation toward the actuating plate such that bottom ends of a plurality of secondary lift pins contact the actuating plate, the secondary lift pins having a length defined by a top end and a bottom end, the secondary lift pins passing through a thickness of the support arm, the top ends of the secondary lift pins contacting the bottom ends of the primary lift pins and pushing against the primary lift pins such that the top ends of the primary lift pins extend from a top surface of a substrate support that is on top of a support shaft connected to the outer end of the support assembly; opening a side access port of the processing chamber; loading a substrate into the processing chamber onto the top ends of the primary lift pins; A non-transitory computer-readable medium for carrying out instructions including:

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