Handling fixture

Abstract

To provide a handling jig that facilitates handling of board holding tools.SOLUTION: A handling jig 30 that consists of a top board 381, a bottom board 382, and a plurality of posts 383 connected to the top board and the bottom board, and that holds a board holding tool that holds a board with a plurality of posts to facilitate handling, has a top board holding jig 10 that holds the top board by covering the outer edge of the top board, and a bottom board holding jig 20 that holds the bottom board by covering the outer edge of the bottom board.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a handling jig. [Background technology]

[0002] Conventionally, a transport jig has been known in which a substrate holder that loads and holds substrates is sandwiched between a pair of divided members from the sides, and the substrate holder can be transported using a handle provided on the ceiling (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-139424 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to provide a handling jig that facilitates handling of a substrate holder. [Means for solving the problem]

[0005] In order to achieve the above object, a handling jig according to one aspect of the present disclosure is a handling jig that is composed of a top plate, a bottom plate, and a plurality of support columns connected to the top plate and the bottom plate, and that holds a substrate holder that holds a substrate with the plurality of support columns to facilitate handling, a top plate holding jig that holds the top plate so as to cover an outer edge portion of the top plate; A bottom plate holding jig that holds the bottom plate so as to cover the outer edge portion of the bottom plate. death, The top plate holding jig and the bottom plate holding jig are formed of a plurality of arc-shaped members that open and close by a hinge structure, and when attached to the top plate and the bottom plate, form an annular shape to hold the top plate and the bottom plate. do. Effect of the Invention

[0006] According to the present disclosure, the substrate holder can be easily handled. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a vertical cross-sectional view showing a configuration example of a vertical heat treatment apparatus. [Diagram 2] FIG. 2 is a cross-sectional view showing an example of the configuration of a vertical heat treatment apparatus. [Diagram 3] FIG. 2 is a perspective view showing a wafer boat and a handling jig according to the embodiment; [Figure 4] FIG. 2 is an exploded perspective view showing a detailed configuration of a top plate holding jig and a bottom plate holding jig. [Diagram 5] 13 is a diagram showing an example of a lock structure on the opposite side of the hinge structure portion of the top plate holding jig. FIG. [Figure 6] FIG. 1 is a perspective view showing an example of a wafer boat equipped with a handling jig; [Figure 7] FIG. 2 is a side view showing an example of a wafer boat equipped with a handling jig; [Figure 8] FIG. 13 is a diagram showing an example of components for transporting a wafer boat to a loading position of a vertical heat treatment apparatus. [Figure 9] 13 is a diagram showing a state in which the wafer boat 38 equipped with the handling jig is transferred to the boat setting jig. [Figure 10] FIG. 13 is a diagram for explaining removal of the handling jig. [Figure 11] 13 is a diagram showing a state in which the wafer boat is placed on an attachment of the boat setting jig. FIG. [Figure 12] FIG. 13 is a diagram showing the state of the tube cart before it is moved. [Figure 13] 13 is a diagram showing a state in which the wafer boat is transported to the vicinity of the heat retention table by a tube cart. [Figure 14] FIG. 13 is a diagram showing a state in which the wafer boat is set in front of the heat retention table. [Figure 15] FIG. 13 is a diagram showing an example of a boat positioning jig. [Figure 16] FIG. 13 is a diagram showing a state in which the wafer boat has been moved to directly above the heat retention table. [Figure 17] 13 is a diagram showing a state in which the wafer boat is removed and the boat setting jig is removed. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0009] [Vertical heat treatment equipment] First, a configuration example of a vertical heat treatment device having a reaction tube unit that can be transported by a transport method according to an embodiment will be described. A vertical heat treatment device with a double-tube structure will be described below, but a vertical heat treatment device with a single-tube structure may also be used. Figures 1 and 2 are cross-sectional views showing a configuration example of a vertical heat treatment device, where Figure 1 shows a vertical cross section and Figure 2 shows a horizontal cross section.

[0010] As shown in FIG. 1, the vertical heat treatment apparatus 1 includes a reaction tube 34 for accommodating semiconductor wafers (hereinafter referred to as "wafers W") which are substrates, a lid 36 for airtightly closing the opening at the lower end of the reaction tube 34, a wafer boat 38 which is a substrate holder that can be accommodated within the reaction tube 34 and holds a number of wafers W at predetermined intervals, a gas supply means 40 for introducing gas into the reaction tube 34, an exhaust means 41 for exhausting gas within the reaction tube 34, and a heating means 42 for heating the wafers W.

[0011] The reaction tube 34 has a cylindrical inner tube 44 with a ceiling whose lower end is open, and a cylindrical outer tube 46 with a ceiling whose lower end is open and covers the outside of the inner tube 44. The inner tube 44 and the outer tube 46 are made of a heat-resistant material such as quartz, and are arranged coaxially to form a double tube structure.

[0012] The ceiling portion 44A of the inner pipe 44 is, for example, flat. A nozzle accommodating portion 48 that accommodates a gas supply pipe is formed on one side of the inner pipe 44 along its longitudinal direction (vertical direction). For example, as shown in Fig. 2, a part of the side wall of the inner pipe 44 protrudes outward to form a convex portion 50, and the inside of the convex portion 50 is formed as the nozzle accommodating portion 48. A rectangular opening 52 having a width L1 is formed on the opposite side wall of the inner pipe 44 facing the nozzle accommodating portion 48 along its longitudinal direction (vertical direction).

[0013] The opening 52 is a gas exhaust port formed so as to exhaust gas from the inner tube 44. The length of the opening 52 is the same as the length of the wafer boat 38, or is formed so as to extend vertically longer than the length of the wafer boat 38. That is, the upper end of the opening 52 is positioned so as to extend to a height equal to or higher than the position corresponding to the upper end of the wafer boat 38, and the lower end of the opening 52 is positioned so as to extend to a height equal to or lower than the position corresponding to the lower end of the wafer boat 38. Specifically, as shown in FIG. 1, the height-direction distance L2 between the upper end of the wafer boat 38 and the upper end of the opening 52 is within a range of about 0 mm to 5 mm. Also, the height-direction distance L3 between the lower end of the wafer boat 38 and the lower end of the opening 52 is within a range of about 0 mm to 350 mm.

[0014] The lower end of the reaction tube 34 is supported by a cylindrical manifold 54 made of, for example, stainless steel. A flange portion 56 is formed at the upper end of the manifold 54, and the lower end of the outer tube 46 is placed on the flange portion 56 to support it. A seal member 58 such as an O-ring is interposed between the flange portion 56 and the lower end of the outer tube 46 to make the inside of the outer tube 46 airtight.

[0015] An annular support 60 is provided on the inner wall of the upper part of the manifold 54, and the lower end of the inner tube 44 is placed on the support 60 to support it. A lid 36 is air-tightly attached to the opening at the lower end of the manifold 54 via a seal member 62 such as an O-ring, so as to air-tightly close the opening at the lower end of the reaction tube 34, i.e., the opening of the manifold 54. The lid 36 is made of, for example, stainless steel.

[0016] A rotating shaft 66 is provided in the center of the lid 36, penetrating through the magnetic fluid seal portion 64. The lower portion of the rotating shaft 66 is rotatably supported by an arm 68A of an elevating means 68 comprising a boat elevator.

[0017] A rotating plate 70 is provided at the upper end of the rotating shaft 66, and the wafer boat 38 holding the wafers W is placed on the rotating plate 70 via a quartz heat retention stand 72. Therefore, by raising and lowering the lifting means 68, the lid 36 and the wafer boat 38 move up and down as a unit, so that the wafer boat 38 can be inserted into and removed from the reaction tube 34.

[0018] The gas supply means 40 is provided in the manifold 54, and introduces gases such as a film forming gas, an etching gas, and a purge gas into the inner tube 44. The gas supply means 40 has a plurality of (e.g., three) quartz gas supply pipes 76, 78, 80. Each of the gas supply pipes 76, 78, 80 is provided in the inner tube 44 along its longitudinal direction, and its base end is bent into an L-shape and supported so as to pass through the manifold 54.

[0019] As shown in FIG. 2, the gas supply pipes 76, 78, 80 are arranged in a row in the circumferential direction in the nozzle accommodating portion 48 of the inner pipe 44. A plurality of gas holes 76A, 78A, 80A are formed in each gas supply pipe 76, 78, 80 at a predetermined interval along the longitudinal direction, and each gas can be discharged in the horizontal direction from each gas hole 76A, 78A, 80A. The predetermined interval is set to be the same as the interval between the wafers W supported by the wafer boat 38, for example. The height direction positions of the gas holes 76A, 78A, 80A are set to be located at the middle between the wafers W adjacent to each other in the vertical direction, so that each gas can be efficiently supplied to the space between the wafers W. As the types of gases, a film forming gas, an etching gas, and a purge gas are used, and each gas can be supplied through each gas supply pipe 76, 78, 80 as necessary while controlling the flow rate of each gas.

[0020] A gas outlet 82 is formed on the side wall of the upper part of the manifold 54 above the support part 60, so that the gas in the inner tube 44 discharged from the opening 52 through a space 84 between the inner tube 44 and the outer tube 46 can be exhausted. An exhaust means 41 is provided at the gas outlet 82. The exhaust means 41 has an exhaust passage 86 connected to the gas outlet 82, and a pressure adjustment valve 88 and a vacuum pump 90 are provided in this order in the exhaust passage 86, so that the inside of the reaction tube 34 can be evacuated.

[0021] A cylindrical heating means is provided on the outer periphery of the outer tube so as to cover the outer tube. The heating means heats the wafer W accommodated in the reaction tube .

[0022] The overall operation of the vertical heat treatment apparatus 1 is controlled by a control means 95 such as a computer. A computer program for controlling the overall operation of the vertical heat treatment apparatus 1 is stored in a storage medium 96. The storage medium 96 may be, for example, a flexible disk, a compact disk, a hard disk, a flash memory, a DVD, or the like.

[0023] [Handling jig] 3A and 3B are perspective views showing a wafer boat and a handling jig according to the present embodiment, and Fig. 3(a) is a perspective view showing the wafer boat and the entire handling jig according to the present embodiment.

[0024] As shown in Fig. 3(a), the wafer boat 38 includes a top plate 381, a bottom plate 382, ​​support columns 383, and a ring member 384. The ring member 384 is a ring-shaped (annular) plate-like member for placing the wafer W thereon, and is arranged parallel to the top plate 381 and the bottom plate 382 with a gap between them, and its outer periphery is supported by the support columns 383. The wafer boat 38 holds the substrates, and is also called a substrate holder. Among the wafer boats 38, the wafer boat 38 having the ring member 384 as shown in Fig. 3 may also be called a ring boat.

[0025] The wafer boat 38 can be configured to be capable of loading any number of wafers W, and may be configured to be capable of loading, for example, 50 to 200 wafers W. In general, the wafer boat 38 is often configured to load about 100 or 150 wafers W.

[0026] Here, the ring members 384 of the wafer boat 38 are spaced very closely together, leaving no space to insert fingers, making it impossible to grasp the supports 383, top plate 381, bottom plate 382, ​​etc., and the shape of the wafer boat 38 makes it very difficult to transport and handle as is. In addition, the material is often quartz, which will break if dropped, so handling and transporting it entails physical and mental stress.

[0027] Therefore, by mounting the handling jig 30 according to this embodiment on the top plate 381 and the bottom plate 382, ​​the wafer boat 38 can be easily handled.

[0028] The handling jig 30 can be made of various materials, and may be made of resin, for example. As described above, the wafer boat 38 is generally made of quartz, which is hard and prone to breaking. By making the handling jig 30 out of resin, it becomes soft and there is no risk of breaking, so that the handling becomes very easy in terms of the material. Note that the resin may be, for example, a fluorine-based resin, and as one example, PVDF (polyvinylidene fluoride) may be used.

[0029] The handling jig 30 has a top plate holding jig 10 and a bottom plate holding jig 20. That is, the handling jig 30 includes the top plate holding jig 10 and the bottom plate holding jig 20 as a pair.

[0030] The tabletop holding jig 10 has a first holding member 11, a second holding member 12, a hinge structure 13, and a lock pin 14. The first holding member 11 and the second holding member 12 are arc-shaped members and have a shape suitable for covering the outer periphery of the tabletop 381 from the outside. The number of arc-shaped members is not limited to two, and it can be configured with three or more members, but this will complicate the mechanism and weaken the strength, so it is preferable to configure it with two members, that is, the first holding member 11 and the second holding member 12 as shown in FIG. 3.

[0031] One end of the first holding member 11 and the second holding member 12 are connected to each other by a hinge structure 13, making the first holding member 11 and the second holding member 12 rotatable. This allows the ends on the opposite sides of the hinge structure 13 to be structured so as to be freely opened and closed, as shown in Fig. 3.

[0032] The ends of the first holding member 11 and the second holding member 12 on the opposite side to the hinge structure 13 are configured to be connected and fixed to each other by a lock pin 14. The details of this structure will be described later.

[0033] Moreover, the first holding member 11 has a notch 112, and the second holding member 12 has notches 124, 125. The notches 112, 124, 125 are provided corresponding to the positions where the support pillars 383 are provided. In other words, when the top plate holding jig 10 is attached to the top plate 381, the support pillars 383 are aligned with the notches 112, 124, 125, and are provided so as not to cause interference between the first holding member 11 and the second holding member 12.

[0034] The bottom holding jig 20 includes a first holding member 21, a second holding member 22, a hinge structure 23, and a lock pin 24. The bottom holding jig 20 has a shape suitable for holding a bottom plate 382, ​​but is substantially similar in structure and function to the top plate holding jig 10.

[0035] The first holding member 21 of the bottom holding jig 20 has cutouts 213 and 214. As shown in Fig. 3(a), the cutouts 213 and 214 are configured to encompass the portion of the support 383 that protrudes outward, which prevents the outer surface of the support 383 and the inner surface of the first holding member 21 from coming into contact with each other, preventing the bottom holding jig 20 from closing.

[0036] 3B is a diagram showing the wafer boat and the lower part of the handling jig according to this embodiment. As shown in FIG. 3B, the notches 213 and 214 can be made not to contact the support 383.

[0037] 4A and 4B are exploded perspective views showing the detailed configuration of the top plate holding jig and the bottom plate holding jig, respectively.

[0038] 4(a), the top plate holding jig 10 has a first holding member 11, a second holding member 12, a hinge structure 13, a lock pin 14, and a leaf spring 15. The first holding member 10 has an engagement hole 111. The second holding member 12 has engagement holes 121 and 122, a notch 125, and a connecting hole 123. The hinge structure 13 has a hinge fulcrum 131, a screw 132, and a press-in member 133.

[0039] The first holding member 11 has an engagement hole 111 that engages with the engagement holes 121, 122 of the second holding member 12 by a hinge fulcrum 131, and the engagement holes 111 and 121, 122 engage with each other to overlap each other to form a through hole, and the hinge fulcrum 131 is passed through the through hole and screwed into the screw 132 to form a hinge structure. In other words, the first holding member 11 and the second holding member 12 can be structured to rotate around the hinge fulcrum 131 to open and close.

[0040] The first holding member 11 and the second holding member 12 have an arc shape and are shaped to cover the outer edge of the top plate 381. In addition, both the first holding member 11 and the second holding member 12 have a two-stage configuration in the height direction, and each has a first-stage holding portion 11a, 12a and a second-stage handling portion 11b, 12b. The holding portions 11a, 12a are portions that hold the top plate 381, and have an inner circumferential surface that has a recessed shape consisting of three surfaces like a rail. In other words, they have a rail shape that can cover three surfaces of the side, upper surface, and lower surface of the top plate 381 so that the top plate 381 can be held.

[0041] The second-stage handling parts 11b and 12b serve as handles for transporting the wafer boat 38. In other words, the wafer boat 38 can be easily transported by inserting fingers into the central openings of the handling parts 11b and 12b and gripping the handling parts 11b and 12b.

[0042] A structure is provided at the tip portions of the first holding member 11 and the second holding member 12 on the opposite side of the hinge structure 13 so that the tips can be connected and fixed to each other. A connecting hole 123 is provided at the tip of the second holding member 12. Although the connecting hole is hidden and cannot be seen at the tip of the first holding member 11, a connecting hole is formed that can overlap with the connecting hole 123 to form a single through hole, and by inserting the lock pin 14 with these connecting holes overlapping, the tips of the first holding member 11 and the second holding member 12 can be connected and fixed.

[0043] Furthermore, leaf spring 15 is fixed to the second holding member with screws 151. Leaf spring 15 is provided so as to apply a biasing force to lock pin 14 to prevent lock pin 14 from falling off. In other words, leaf spring 15 is provided so as to straddle the connecting portion between first holding member 11 and second holding member 12 and to contact lock pin 14, and applies a biasing force to lock pin 14 toward the center, providing a force to prevent lock pin 14 from falling off.

[0044] In this embodiment, an example has been described in which leaf spring 15 is used as a biasing means, but as long as the biasing force can be applied in the direction in which first retaining member 11 and second retaining member 12 are closed, a biasing means other than leaf spring 15 may be used.

[0045] 3, the first holding member 11 has the notch 112 and is configured not to come into contact with the support column 383. Similarly, the second holding member 12 also has notches 124 and 125.

[0046] FIG. 4(b) is an exploded perspective view showing the detailed configuration of the bottom holding jig 20. As shown in FIG.

[0047] As shown in FIG. 4( b ), the bottom holding jig 20 has a first holding member 21, a second holding member 22, a hinge structure 23, a lock pin 24, and a leaf spring 25.

[0048] The first holding member 21 has an engagement hole 211 at the end on the hinge structure 23 side, and a connection hole 212 at the tip opposite the hinge structure 23. The second holding member 22 has engagement holes 221, 222 at the end on the hinge structure 23 side, and connection holes 223, 224 at the tip opposite the hinge structure 23.

[0049] The first holding member 21 has an engagement hole 211 that engages with the engagement holes 221, 222 of the second holding member 22 by a hinge fulcrum 231, and the engagement holes 211 and 221, 222 engage with each other to overlap each other to form a through hole, and the hinge fulcrum 231 is passed through the through hole and screwed into the screw 232 to form a hinge structure. In other words, the first holding member 21 and the second holding member 22 can be structured to rotate around the hinge fulcrum 231 to open and close.

[0050] The first holding member 21 and the second holding member 22 have an arc shape and are shaped to cover the outer edge of the bottom plate 382. In addition, both the first holding member 21 and the second holding member 22 have a two-stage configuration in the depth direction, and each has a first-stage holding portion 21a, 22a and a second-stage handling portion 21b, 22b. The holding portions 21a, 22a are portions that hold the bottom plate 382, ​​and their inner circumferential surfaces have a recessed shape consisting of three surfaces like a rail. In other words, they have a rail shape that can cover three surfaces of the side, upper surface, and lower surface of the bottom plate 382 so that the bottom plate 382 can be held.

[0051] The handling parts 21b and 22b on the second stage serve as handles for transporting the wafer boat 38. In other words, the wafer boat 38 can be easily transported by inserting fingers through the central openings of the handling parts 21b and 22b and gripping the handling parts 21b and 22b.

[0052] A structure is provided at the tip portions of the first holding member 21 and the second holding member 22 on the opposite side of the hinge structure 23 to connect and fix the tips to each other. Connecting holes 223, 224 are provided at the tip of the second holding member 22. Connecting holes 212 are formed at the tip of the first holding member 21 where the tip protrudes, and by inserting the lock pin 24 with these connecting holes 212, 223, 224 overlapping, the tips of the first holding member 21 and the second holding member 22 can be connected and fixed.

[0053] Furthermore, leaf spring 25 is fixed to the second holding member with screws 251. Leaf spring 25 is provided so as to apply a biasing force to lock pin 24. In other words, leaf spring 25 is provided so as to straddle the connecting portion between first holding member 21 and second holding member 22 and to contact lock pin 24, and applies a biasing force to lock pin 24 toward the center, providing a force to prevent lock pin 24 from falling off.

[0054] In this embodiment, an example has been described in which leaf spring 25 is used as a biasing means, but as long as the biasing force can be applied in the direction in which first retaining member 21 and second retaining member 22 are closed, a biasing means other than leaf spring 25 may be used.

[0055] 3, first holding member 21 has notches 213 and 214 and is configured not to come into contact with support 383. Second holding member 22 also has notches 225 and 226 and is configured not to come into contact with support 383.

[0056] Fig. 5 is a diagram showing an example of a lock structure on the opposite side of the hinge structure of the tabletop holding jig. As shown in Fig. 5, the lock pin 14 is detachable, but the leaf spring 15 is inserted into a groove 14a formed on the outer surface of the lock pin 14 to apply a biasing force, preventing the lock pin 14 from falling off and providing a secure fixed connection between the first holding member 11 and the second holding member 12.

[0057] In this regard, the bottom plate holding jig has a similar configuration, and is structured so that the lock pin 24 will not fall off.

[0058] Fig. 6 is a perspective view showing an example of a wafer boat 38 equipped with a handling jig 30. As shown in Fig. 6, by attaching the handling jig 30 to the wafer boat 38, it becomes possible to insert a hand from the center and grasp the handling portion 10b. This improves the handleability of the wafer boat 38.

[0059] Fig. 7 is a side view showing an example of a wafer boat 38 equipped with a handling jig 30. As shown in Fig. 7, by mounting the handling jig 30, i.e., the top plate holding jig 10 and the bottom plate holding jig 20, on a top plate 381 and a bottom plate 382, ​​respectively, the handling sections 10b and 20b are provided with a space between them and the bottom plates 381 and 382, ​​and the shape is easy to transport.

[0060] 7 shows that a support stand 100 is provided to engage with the bottom plate holding jig 20, and engages with the step of the bottom plate holding jig 20 to stably support the wafer boat 38. By attaching the bottom plate holding jig 20 in this manner, the wafer boat 38 can be stably placed.

[0061] In this way, according to the handling jig of this embodiment, the pair of the top plate holding jig 10 and the bottom plate holding jig 20 reliably holds the wafer boat 38, and easy-to-grasp spaces are formed above the top plate 381 and below the bottom plate 382, ​​improving the handleability, including transportation, of the wafer boat 38. In addition, by using a material that is softer and less likely to break than quartz, such as resin, the handleability of the wafer boat 38 can be further improved.

[0062] [How to set up the boat] Next, a method of setting the wafer boat at a position for carrying it into the vertical heat treatment apparatus, that is, above the heat retention table 72, using the handling jig according to this embodiment will be described.

[0063] 8 is a diagram showing an example of components for transporting the wafer boat 38 to the loading position of the vertical heat treatment device. As shown in Fig. 8, the wafer boat 38 is transported using a handling jig 30, a boat setting jig 160, and a tube cart 170.

[0064] The boat setting jig 160 includes a delivery jig 161 and an upper plate 162 .

[0065] 9 is a diagram showing a state in which the wafer boat 38 equipped with the handling jig 30 is transferred to the boat setting jig 160. First, the wafer boat 38 equipped with the handling jig 30 is placed on the transfer jig 161 of the boat setting jig 160.

[0066] This work is performed by a human being. That is, the wafer boat 38 with the handling jig 30 attached thereto is carried by a human being and placed on the delivery jig 161.

[0067] Once the wafer boat 38 is placed on the delivery jig 161, the handle 166 is rotated to raise the upper plate 162 so that the wafer boat 38 is placed on the U-shaped attachment 163. The attachment 163 has a stepped structure on which the wafer boat 38 can be placed, and is structured to receive the wafer boat 38 on the lower step of the step.

[0068] The boat setting jig 160 includes a side plate 164 and a guide 165 .

[0069] 10 is a diagram for explaining removal of the handling jig 30. Before the wafer boat 38 is placed on the attachment 163, the handling jig 30 is removed from the wafer boat 38. To remove the handling jig 30, for example, in the case of the bottom plate holding jig 20, the lock pin 24 is removed to open the bottom plate holding jig 20, and the handling jig 30 can be removed.

[0070] Similarly, by releasing the lock pin 14 of the top plate holding jig 10, the top plate holding jig 10 can be easily removed from the wafer boat .

[0071] FIG. 11 is a diagram showing a state in which the wafer boat 38 is placed on an attachment 163 of the boat setting jig 160. As shown in FIG.

[0072] 11, the wafer boat 38 from which the handling jig 30 has been removed is placed on the attachment 163. At this time, the bottom plate 382 of the wafer boat 38 is fixed by the holder 167. In this state, the height of the upper plate 162 is adjusted. At this time, the appropriate height may be clarified by inserting the positioning pins 173 into the pin holes 173a.

[0073] Furthermore, when the wafer boat 38 is placed on the attachment 163, the marking position of the attachment 163 and the circumferential position of the pillars of the wafer boat 38 are aligned.

[0074] The height of the upper plate 162 is adjusted to an appropriate height determined according to the model of the vertical heat treatment device.

[0075] The boat set jig 160 is placed on a tube cart 170 .

[0076] 12 is a diagram showing the state of the tube cart before movement. With the wafer boat 38 placed at a predetermined height on the tube cart 170, the tube cart 170 is moved forward to transport the wafer boat 38.

[0077] 13 is a diagram showing a state where the wafer boat is transported to the vicinity of the heat retention table 72 by a tube cart. As shown in FIG. 13, the heat retention table 72 is disposed below the reaction tube 34. The heat retention table 72 is placed on the lid 36. The wafer boat 38 is placed on the heat retention table 72, and the lid 36 is raised, whereby the wafer boat 38 is disposed inside the reaction tube 34.

[0078] Therefore, in order to carry the wafer boat 38 into the reaction tube 34 , the wafer boat 38 is transported near the heat retention table 72 by the tube cart 170 .

[0079] 14 is a diagram showing a state in which the wafer boat 38 is set in front of the heat retention table 72. In this manner, the wafer boat 38 can be transported to the side of the heat retention table 72 by the tube cart 170. A boat positioning jig 180 is placed on the upper surface of the heat retention table 72.

[0080] Fig. 15 is a diagram showing an example of a boat positioning jig. As shown in Fig. 15, the boat positioning jig 180 is placed on the heat retention table 72, and has a plurality of (e.g., three) protrusions 181 on its surface. The wafer boat 38 can be positioned by engaging the protrusions 181 with depressions (not shown) on the bottom surface of the wafer boat 38. For example, the wafer boat 38 may be positioned using such a boat positioning jig 180.

[0081] 16 is a diagram showing a state in which the wafer boat 38 has been moved to directly above the heat retention table 72. When the tube cart 170 is further advanced from the state shown in FIG. 14, the wafer boat 38 can be placed directly above the heat retention table 72. In this state, the wafer boat 38 is positioned using the boat positioning jig 180.

[0082] 17 is a diagram showing a state in which the wafer boat is lifted and the boat setting jig 160 is retracted. After the boat setting jig 160 is retracted, the boat positioning jig 180 is removed and the wafer boat 38 is moved again to directly above the heat retention table 72. Then, the handle 166 is turned to lower the attachment 162. Once the wafer boat 38 is positioned and placed on the heat retention table 72, the boat setting jig 160 is retracted to the position of the tube cart 200, and the tube cart 200 is retracted. This allows the wafer boat 38 to be positioned and placed on the heat retention table 72.

[0083] Thereafter, the lid 36 is raised and the wafer boat 38 is carried into the reaction tube 34, where a film formation process can be carried out.

[0084] In this way, by using the handling jig 30, the boat setting jig 160, and the tube cart 170, the wafer boat 38, which is difficult to grasp, can be easily handled, and it can be easily transported to the heat retention table 72 and placed on the heat retention table 72.

[0085] As described above, the handling jig according to this embodiment makes it possible to easily grasp and transport a wafer boat 38, particularly a type of wafer boat 38 known as a ring boat in which multiple annular plates are provided at predetermined intervals as plates for supporting wafers, thereby significantly improving handleability.

[0086] Although the preferred embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present disclosure. [Explanation of symbols]

[0087] 10 Top plate holding jig 11, 21 First holding member 12, 22 Second holding member 13, 23 Hinge structure 14, 24 Lock pin 15, 25 Leaf spring 20 Bottom plate holding jig 30 Handling fixture 34 Reaction tube 38 Wafer Boat 44 Inner tube 46 Outer tube 76, 78, 80 Gas supply pipes

Claims

1. A handling jig that is composed of a top plate, a bottom plate, and a plurality of support columns connected to the top plate and the bottom plate, and that holds a substrate holder that holds a substrate with the plurality of support columns, and that facilitates handling, a top plate holding jig that holds the top plate so as to cover an outer edge portion of the top plate; a bottom plate holding jig for holding the bottom plate so as to cover an outer edge portion of the bottom plate, The top plate holding jig and the bottom plate holding jig are handling jigs consisting of multiple arc-shaped members that open and close using a hinge structure, and when attached to the top plate and the bottom plate, form a circular ring shape to hold the top plate and the bottom plate.

2. 2. The handling jig according to claim 1, wherein the top plate holding jig and the bottom plate holding jig have holding portions for holding outer edges of side surfaces and flat surfaces of the top plate and the bottom plate, respectively.

3. 3. The handling jig according to claim 2, wherein the top plate holding jig and the bottom plate holding jig have handling portions that are raised one step higher than the holding portions and do not come into contact with the top plate and the bottom plate.

4. The handling jig according to claim 1 , wherein a fixing structure portion for fixing the connection between the plurality of arc-shaped members is provided at the tip of the plurality of arc-shaped members opposite the hinge structure.

5. The fixing structure includes a lock pin that fixes the engagement portion, and 5. The handling jig according to claim 4, further comprising: a biasing member for preventing the lock pin from falling off.

6. A through hole is provided in the engagement portion where the arc-shaped members overlap each other, The handling jig according to claim 5 , wherein the lock pin is inserted into the through hole.

7. A handling jig as described in any one of claims 1 to 6, wherein the inner surfaces covering the side portions of the top plate holding jig and the bottom plate holding jig have notches at locations that maintain the positions of the supports of the substrate holder.

Images