device

Abstract

To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 22 with an opening 244 as a base, and a frame-shaped film 26. Each of the first circuit member 40 and the second circuit member 50 includes an exposed part 402, and a sealing part 404 surrounding the exposed part 402. The frame-shaped film 26 includes a film sealing part 262 fixed to the first film 22, and a circuit sealing part 264 fixed to the sealing part 404. The device 10 includes a sealed space 18. The sealed space 18 is surrounded by the first sealing member 20 and the second sealing member 30 excluding the exposed part 402, and is blocked from outside the device 10. The exposed part 402 is exposed to the outside of the sealed space 18.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a device having a circuit member encapsulated by a film. [Background technology]

[0002] For example, Patent Document 1 discloses a device that can be made thin.

[0003] 14, Patent Document 1 discloses a semiconductor chip built-in module (device) 90. The device 90 includes a thermosetting resin composition (sealing resin) 92, and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so as to embed the circuit member 94 therein. Thereafter, the surface of the sealing resin 92 is polished, thereby thinning the device 90. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-332654 A Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for devices including circuit components to be made even thinner.

[0006] Therefore, an object of the present invention is to provide a new device that can be made thinner. [Means for solving the problem]

[0007] The present invention provides a first device, A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base, and includes a frame-shaped film, The first film has an opening formed therein, The edge of the opening forms a closed path; The frame-shaped film has a closed-circuit shape, At least one of the first circuit member and the second circuit member includes an exposed portion and a sealed portion, the exposed portion and the sealed portion face the first film, The sealing portion surrounds the exposed portion over an entire periphery, the frame-shaped film has a film sealing portion and a circuit sealing portion, The film sealing portion is fixed to the first film so as to surround the entire periphery of the opening, the circuit sealing portion is fixed to the sealing portion so as to surround the entire periphery of the exposed portion, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member except for the exposed portion and is isolated from the outside of the device; The exposed portion is exposed to the outside of the sealed space, the first circuit member and the second circuit member are sealed within the sealed space except for the exposed portion, the first circuit member includes a first contact; the second circuit member includes a second contact; The first contact and the second contact are pressed against each other and in contact with each other inside the sealed space. Provide the device.

[0008] The present invention also provides a first device as a second device, the first film has an outer surface; The outer surface is located outside the sealed space, The film sealing portion of the frame-shaped film is fixed to the outer surface. Provide the device.

[0009] The present invention also provides a third device, the first device comprising: the first film has an inner surface; The inner surface is located inside the sealed space, The film sealing portion of the frame-shaped film is fixed to the inner surface. Provide the device.

[0010] The present invention provides a fourth device, which is any one of the first to third devices, The frame-shaped film is made of an ultraviolet curing tape. Provide the device.

[0011] The present invention provides a fifth device, which is any one of the first to fourth devices, The second sealing member includes a second film as a base. Provide the device. Effect of the Invention

[0012] In the device of the present invention, the first sealing member and the second sealing member are stacked on top of each other with the first circuit member and the second circuit member (hereinafter simply referred to as "circuit member") sandwiched therebetween. The first sealing member is formed based on a film. Furthermore, each of the circuit members has no particular structural constraints, except that it has a contact point. That is, the circuit member of the present invention has a simple structure and can be formed from a variety of materials. For example, the circuit member may be an insulating film on which a conductor pattern having a contact point is formed. In this case, the thickness of the entire device can be made extremely thin. That is, according to the present invention, a new device that can be made thin can be provided. [Brief description of the drawings]

[0013] [Figure 1]1 is a perspective view of a device according to an embodiment of the present invention, with dashed lines depicting the outline of a hidden aperture in a first film and the boundary of a contact area formed between a first sealing member and a second sealing member; [Diagram 2] 2 is a perspective view of the device of FIG. 1 with the first sealing member removed, with dashed lines depicting the outline of the hidden opening in the first film, the boundaries of the contact areas, the location of the exposed portion, and the location of the sealing portion. [Diagram 3] 2 is a top view of the device of FIG 1, with the hidden aperture in the first film outlined in dashed lines; [Figure 4] 4 is a bottom view of the first sealing member of the device of Figure 3, with the hidden outline of the frame-shaped film and the air valve drawn in dashed lines. [Diagram 5] 2 is a perspective view of the circuit structure of the device of FIG 1, with a portion of a second circuit member drawn in dashed lines, and the first and second contact portions shown are spaced apart from each other, but in reality the first and second contact portions are in contact with each other. [Figure 6] A cross-sectional view of the device taken along line VI-VI of Fig. 1. This drawing is for the purpose of showing the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. [Figure 7] 2 is an exploded perspective view showing the device of FIG 1, with a portion of the first film (portion surrounded by a dashed line) and a portion of the second film (portion surrounded by a dashed line) depicted on an enlarged scale. [Figure 8] FIG 8 is an exploded perspective view of the air valve of the device member of FIG 7, the valve of the air valve being open. [Figure 9] FIG. 2 is a side view of the device of FIG. 1 during manufacture. [Figure 10] A cross-sectional view of the device in the process of being manufactured, taken along line VI-VI in FIG. 1. This figure is for the purpose of showing the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. A side view of a vacuum drawing tool is depicted. [Figure 11]Fig. 7 is a cross-sectional view showing a modified example of the device in Fig. 6. This drawing is for the purpose of diagrammatically showing the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. [Figure 12] 12 is a top view of the device of FIG 11, with the hidden outline of the frame-shaped film drawn in dashed lines. [Figure 13] 13 is a bottom view of the first sealing member of the device of FIG 12, with the hidden outline of the frame film and air valve drawn in dashed lines. [Figure 14] FIG. 1 is a cross-sectional view showing the device of Patent Document 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Referring to Fig. 1, a device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can operate independently without being physically attached to another electronic device (not shown). For example, the device 10 is attached near the subject's heart to measure the subject's electrocardiogram and transmit the measurement result to another electronic device. That is, the device 10 can be used as an electronic device that measures bioinformation such as an electrocardiogram. However, the present invention is not limited to this and can be applied to devices having various functions.

[0015] Referring to FIG. 2 together with FIG. 1, the device 10 of the present embodiment includes a circuit structure 12 and a sealing member 14. The circuit structure 12 is a member for making the device 10 function as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for receiving an electric signal (hereinafter referred to as a "biological signal") caused by the subject's electrocardiogram, an electronic circuit (not shown) for measuring the electrocardiogram based on the acquired biological signal, and an electronic circuit (not shown) for transmitting the measurement result to another electronic device (not shown). The sealing member 14 accommodates the circuit structure 12 therein and protects the circuit structure 12 from the external environment. That is, the circuit structure 12 is sealed inside the sealing member 14.

[0016] The circuit structure 12 of this embodiment includes a first circuit member 40 and a second circuit member 50. The sealing member 14 of this embodiment includes a first sealing member 20 and a second sealing member 30. That is, the device 10 includes the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50. Referring to FIG. 9 together with FIG. 1 and FIG. 2, the four members of the device 10 (the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50) are stacked in the vertical direction (Z direction) and assembled as one device 10. The device 10 of this embodiment includes only the above-mentioned four members. However, the present invention is not limited to this, and the device 10 may further include other members in addition to the above-mentioned four members.

[0017] Each component of the device 10 of this embodiment will be described below.

[0018] 7, the first sealing member 20 of the present embodiment is formed with the first film 22, which is an insulating film, as a base. In other words, the first sealing member 20 includes the first film 22 made of a film as a base. The first film 22 of the present embodiment is a rectangular thin sheet and has flexibility. The thickness of the first film 22 is, for example, about 0.01 to 0.5 mm. The first film 22 extends parallel to a horizontal plane (sheet surface: XY plane) perpendicular to the Z direction. The first film 22 has a periphery 229 in the XY plane.

[0019] 3 and 4, the first film 22 has an outer surface 232 and an inner surface 234. The outer surface 232 is the upper surface (the surface on the +Z side) of the first film 22. The inner surface 234 is the lower surface (the surface on the -Z side) of the first film 22.

[0020] Referring to FIG. 7, the first film 22 of the present embodiment has two layers, a melting layer 146 that melts when heated, and a non-melting layer 148 that does not melt when heated. The melting layer 146 is located below the non-melting layer 148. For example, the melting layer 146 is made of polyethylene, and the non-melting layer 148 is made of nylon. With this structure, the melting layer 146 can be fused to the melting layer of another member while maintaining the non-melting layer 148. However, the present invention is not limited to this. For example, the first film 22 may have only one layer, the non-melting layer 148, or may have three or more layers.

[0021] In the first film 22 of the present embodiment, two openings 244 and a valve opening 248 are formed. The opening 244 and the valve opening 248 each penetrate the first film 22 in the Z direction. The valve opening 248 has a small circular shape in the XY plane. On the other hand, the two openings 244 each have a rectangular shape of the same size in the XY plane. In detail, each of the openings 244 has an edge portion 246 in the XY plane. Each edge portion 246 of the opening 244 forms a closed path. More specifically, each edge portion 246 has a rectangular shape without a break in the XY plane. However, the present invention is not limited to this. For example, the shape and size in the XY plane of each of the openings 244 and the valve opening 248 are not particularly limited.

[0022] 1 and 7, the first sealing member 20 of the present embodiment includes, in addition to the first film 22, two frame-shaped films 26 made of a film, and an air valve .

[0023] Referring to FIG. 7, each of the frame-shaped films 26 has a closed circuit shape. In particular, each of the frame-shaped films 26 of the present embodiment is a thin sheet having a rectangular frame shape and is flexible. The outer edge of each of the frame-shaped films 26 in the XY plane has a rectangular shape. Each of the frame-shaped films 26 has a central hole 266. Each of the central holes 266 has a rectangular shape in the XY plane and penetrates the frame-shaped film 26 in the Z direction. Each of the frame-shaped films 26 of the present embodiment has the above-mentioned structure. However, as long as each of the frame-shaped films 26 has a closed (i.e., unbroken) frame shape, the structure of each of the frame-shaped films 26 is not particularly limited. For example, each of the frame-shaped films 26 may have a circular frame shape.

[0024] 3 and 4, each of the frame-shaped films 26 has a film sealing portion 262 and a circuit sealing portion 264. The circuit sealing portion 264 in this embodiment is a rectangular frame-shaped portion located around the center hole 266. The circuit sealing portion 264 surrounds the center hole 266 over the entire circumference in the XY plane. The film sealing portion 262 in this embodiment is a rectangular frame-shaped portion located around the circuit sealing portion 264. The film sealing portion 262 surrounds the circuit sealing portion 264 over the entire circumference in the XY plane. In this embodiment, there is no visible boundary between the film sealing portion 262 and the circuit sealing portion 264. However, the present invention is not limited to this, and a visible boundary may be formed between the film sealing portion 262 and the circuit sealing portion 264.

[0025] The frame-shaped film 26 in this embodiment is made of an ultraviolet curing tape. More specifically, the frame-shaped film 26 contains a pressure-sensitive adhesive that adheres to another member when pressed against the other member, and an ultraviolet curing agent that hardens when irradiated with ultraviolet light. That is, each of the film sealing portion 262 and the circuit sealing portion 264 contains a pressure-sensitive adhesive and an ultraviolet curing agent. For example, when the film sealing portion 262 is pressed against another member, the frame-shaped film 26 is adhered to the other member. Thereafter, when the frame-shaped film 26 is irradiated with ultraviolet light, the frame-shaped film 26 hardens and is fixed to the other member.

[0026] The frame-shaped film 26 in this embodiment has a lower layer portion (a portion on the -Z side) and an upper layer portion (a portion on the +Z side). The lower layer portion is made of a resin containing a pressure-sensitive adhesive and an ultraviolet curing agent. The upper layer portion is made of a resin containing neither a pressure-sensitive adhesive nor an ultraviolet curing agent. That is, the lower surfaces of the film sealing portion 262 and the circuit sealing portion 264 can be adhered to and fixed to other members. On the other hand, the upper surfaces of the film sealing portion 262 and the circuit sealing portion 264 cannot be adhered to other members simply by pressing them against each other. However, the present invention is not limited to this. For example, the resin of the upper layer portion as well as the lower layer portion of the frame-shaped film 26 may contain a pressure-sensitive adhesive and an ultraviolet curing agent.

[0027] The two frame-shaped films 26 are provided corresponding to the two openings 244 of the first film 22, respectively. In the frame-shaped films 26 and the openings 244 that correspond to each other, the size of the openings 244 in the XY plane is smaller than the size of the frame-shaped film 26 in the XY plane and larger than the size of the central hole 266 of the frame-shaped film 26 in the XY plane. Each of the frame-shaped films 26 is disposed on the outer surface 232 of the first film 22 such that the corresponding opening 244 is located inside the outer edge of the frame-shaped film 26 in the XY plane and outside the central hole 266. In other words, each of the frame-shaped films 26 is disposed on the outer surface 232 so as to straddle the edge portion 246 of the corresponding opening 244 over the entire circumference.

[0028] Each film sealing portion 262 of the frame-shaped film 26 arranged as described above is adhered to the outer surface 232. The film sealing portion 262 located around the opening 244 is adhered to the first film 22 around the entire circumference of the opening 244. The film sealing portion 262 is in close contact with the outer surface 232 and seals the edge portion 246 of the opening 244 around the entire circumference in the XY plane. In a process of producing the device 10 described later, the film sealing portion 262 is hardened by ultraviolet irradiation and fixed to the outer surface 232. That is, in the assembled device 10, the film sealing portion 262 is fixed to the first film 22 so as to surround the entire circumference of the opening 244.

[0029] The frame-shaped film 26 in this embodiment is fixed to the outer surface 232 of the first film 22 by a pressure-sensitive adhesive and an ultraviolet curing agent contained in the film sealing portion 262. However, the present invention is not limited to this. For example, the frame-shaped film 26 may be fixed to the outer surface 232 of the first film 22 by a fixing member such as an adhesive that is separate from the frame-shaped film 26. Furthermore, if the frame-shaped film 26 can be fixed to another member only by a pressure-sensitive adhesive, the frame-shaped film 26 does not need to contain an ultraviolet curing agent. In other words, the frame-shaped film 26 may be a simple adhesive tape.

[0030] According to the present embodiment, when the film sealing portion 262 is adhered to the outer surface 232, the circuit sealing portion 264 is located inside the opening 244 in the XY plane. In other words, of the frame-shaped film 26, the portion adhered to the outer surface 232 is the film sealing portion 262, and the portion located inside the opening 244 in the XY plane and not adhered to the outer surface 232 is the circuit sealing portion 264.

[0031] 7 and 8, the air valve 28 of this embodiment includes a shielding portion 282 made of a thin insulating film and a base portion 286 made of an insulator. As shown in FIG. 8, a through hole 288 is formed in the base portion 286. The through hole 288 penetrates the base portion 286 in the Z direction. The shielding portion 282 is formed with five valves 284 and five notches 285 corresponding to the valves 284, respectively. Each of the notches 285 penetrates the shielding portion 282 in the Z direction. The valves 284 and the notches 285 are located inside the outer periphery of the shielding portion 282 in the XY plane.

[0032] 8 together with FIG. 7, the shielding portion 282 is adhered and fixed to the upper surface of the base 286. In particular, the outer periphery of the shielding portion 282 in the XY plane is firmly attached to the upper surface of the base 286 over the entire circumference. On the other hand, the inside of the outer periphery of the shielding portion 282 in the XY plane can be separated from the upper surface of the base 286. That is, a passage through which air can pass can be formed between each of the cutouts 285 and the through hole 288. The lower surface of the base 286 is adhered and fixed to the first film 22 such that the through hole 288 is connected to the valve opening 248 of the first film 22.

[0033] 1 together with FIG. 8, air valve 28 can transition between an open state (state shown in FIG. 8) in which each of valves 284 is separated from corresponding notch 285, and a closed state (state shown in FIG. 1) in which each of valves 284 completely covers corresponding notch 285. When air valve 28 is in the open state, an air passage is formed between the inside and outside of device 10 via air valve 28. On the other hand, when air valve 28 is in the closed state, the inside of device 10 is completely blocked from the outside of device 10.

[0034] As described below, the air valve 28 is used to evacuate the inside of the device 10 when the device 10 is produced. The air valve 28 in this embodiment has a structure suitable for this use. However, the present invention is not limited to this. For example, the structure of the air valve 28 is not particularly limited as long as the air inside the device 10 can be evacuated using the air valve 28. Also, the inside of the device 10 may be evacuated without providing the air valve 28. That is, the air valve 28 may be provided as necessary.

[0035] Referring to FIG. 7, the second sealing member 30 of the present embodiment is formed with the second film 32, which is an insulating film, as a base. In other words, the second sealing member 30 includes the second film 32, which is made of a film, as a base. The second film 32 of the present embodiment is formed of a material similar to that of the first film 22, and has a structure similar to that of the first film 22. For example, the second film 32 is a rectangular thin sheet and has flexibility. The second film 32 extends parallel to the XY plane. The second film 32 has a periphery 329 in the XY plane. However, the present invention is not limited to this. For example, the second sealing member 30 may include a rigid (i.e., rigid and difficult to bend) circuit board as a base, instead of the second film 32.

[0036] The second film 32 (or rigid circuit board) of the present embodiment has two layers, a melting layer 146 that melts when heated and a non-melting layer 148 that does not melt when heated, similar to the first film 22. The melting layer 146 is located on the non-melting layer 148. With this structure, the two melting layers 146 can be heat-sealed to each other while maintaining the non-melting layers 148 of the first film 22 and the second film 32. However, the present invention is not limited to this, and each of the first film 22 and the second film 32 may have a structure according to the manufacturing method of the device 10. For example, the first film 22 and the second film 32 may be fixed to each other by a fixing member such as an adhesive. In this case, each of the first film 22 and the second film 32 may have only one layer, the non-melting layer 148. On the other hand, each of the first film 22 and the second film 32 may have three or more layers.

[0037] 2 and 7, the second sealing member 30 of the present embodiment includes an additional film 38 made of an insulating film in addition to the second film 32. The additional film 38 has an uneven portion 382. As described later, the uneven portion 382 is provided to maintain a passage through which air can pass when the inside of the device 10 is evacuated. In detail, a large number of protrusions 384 are formed on the additional film 38. Each of the protrusions 384 is a deformable protrusion protruding upward (in the +Z direction). The protrusions 384 are formed uniformly and continuously over the entire additional film 38 in the XY plane. With the above-mentioned structure, a passage through which air can pass is formed between two adjacent protrusions 384. The shape and size of the protrusions 384 are not particularly limited as long as a passage through which air can pass is formed.

[0038] 1 together with FIG. 2, the first film 22 and the second film 32 in this embodiment are overlapped with each other so that the positions of the periphery 229 and the position of the periphery 329 in the XY plane coincide with each other. However, the present invention is not limited to this. For example, the size of the first film 22 in the XY plane and the size of the second film 32 in the XY plane may be different from each other. The shapes of the first film 22 and the second film 32 are not limited to rectangular and can be modified as necessary.

[0039] 5 and 7, the first circuit member 40 of the present embodiment includes a first substrate 42 and a first conductive pattern 44. The first substrate 42 of the present embodiment is a rectangular thin sheet made of an insulating film and has flexibility. The first substrate 42 extends parallel to the XY plane. The first conductive pattern 44 is formed on the first substrate 42. More specifically, the first conductive pattern 44 of the present embodiment is made of a conductor such as copper, and is formed on each of the upper and lower surfaces of the first substrate 42 by a forming method such as silver ink printing or etching.

[0040] Referring to FIG. 6, according to this embodiment, the first conductor pattern 44 (upper first conductor pattern 44) on the upper surface of the first base 42 and the first conductor pattern 44 (lower first conductor pattern 44) on the lower surface of the first base 42 are electrically connected to each other by via holes formed in the first base 42. Referring to FIG. 5 and FIG. 7, the upper first conductor pattern 44 has the same structure as the lower first conductor pattern 44, and is located directly above the lower first conductor pattern 44. In other words, when the upper first conductor pattern 44 and the lower first conductor pattern 44 are projected onto the XY plane along the Z direction, the two projected images completely match. However, the present invention is not limited to this, and the structure of the first conductor pattern 44 can be modified as necessary.

[0041] The second circuit member 50 of the present embodiment has a second substrate 52 and a second conductive pattern 54. The second substrate 52 of the present embodiment is a rectangular thin sheet made of an insulating film and has flexibility. The second substrate 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second substrate 52. More specifically, the second conductive pattern 54 of the present embodiment is made of a conductor such as copper, and is formed on each of the upper and lower surfaces of the second substrate 52 by a forming method such as silver ink printing or etching.

[0042] Referring to FIG. 6, according to this embodiment, the second conductor pattern 54 (upper second conductor pattern 54) on the upper surface of the second base 52 and the second conductor pattern 54 (lower second conductor pattern 54) on the lower surface of the second base 52 are electrically connected to each other by via holes formed in the second base 52. Referring to FIG. 5 and FIG. 7, the upper second conductor pattern 54 has the same structure as the lower second conductor pattern 54, and is located directly above the lower second conductor pattern 54. In other words, when the upper second conductor pattern 54 and the lower second conductor pattern 54 are projected onto the XY plane along the Z direction, the two projected images completely match. However, the present invention is not limited to this, and the structure of the second conductor pattern 54 can be modified as necessary.

[0043] Each of the first circuit member 40 and the second circuit member 50 of the present embodiment has the above-mentioned structure. However, the present invention is not limited thereto. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Each of the first base 42 and the second base 52 may be a rigid circuit board. As long as each of the first conductor pattern 44 and the second conductor pattern 54 is formed from a conductor, the method of forming each of the first conductor pattern 44 and the second conductor pattern 54 is not particularly limited.

[0044] 5 and 7, the first conductor pattern 44 of the present embodiment has two first terminals 46 and a first contact 48. The second conductor pattern 54 of the present embodiment has two second terminals 56 and a second contact 58. That is, the first circuit member 40 has two first terminals 46 and a first contact 48, and the second circuit member 50 has two second terminals 56 and a second contact 58.

[0045] Each of the first terminals 46 is part of the upper first conductive pattern 44, and the first contacts 48 are part of the lower first conductive pattern 44. Each of the second terminals 56 and the second contacts 58 is part of the upper second conductive pattern 54. That is, the first terminals 46 are located on the upper surface of the first base 42, and the first contacts 48 are located on the lower surface of the first base 42. The second terminals 56 and the second contacts 58 are located on the upper surface of the second base 52.

[0046] Referring to FIG. 2, the first circuit member 40 of the present embodiment includes an exposed portion 402 and a sealing portion 404. The exposed portion 402 and the sealing portion 404 are each a part of the upper surface of the first circuit member 40. The exposed portion 402 and the sealing portion 404 face the first film 22 in the Z direction. The exposed portion 402 of the present embodiment is a rectangular region including a part of the upper surface of the first base 42 and two first terminals 46. The sealing portion 404 of the present embodiment is a rectangular frame-shaped region located around the exposed portion 402 in the XY plane. The sealing portion 404 includes a part of the upper surface of the first base 42 and a part of the first conductor pattern 44. The sealing portion 404 surrounds the exposed portion 402 all around in the XY plane.

[0047] The second circuit member 50 of the present embodiment includes an exposed portion 502 and a sealed portion 504. The exposed portion 502 and the sealed portion 504 are each a part of the upper surface of the second circuit member 50. The exposed portion 502 and the sealed portion 504 face the first film 22 in the Z direction. The exposed portion 502 of the present embodiment is a rectangular region that includes a part of the upper surface of the second base 52 and two second terminals 56. The sealed portion 504 of the present embodiment is an exposed portion. 502 Sealing portion 504 is a rectangular frame-shaped region located on the periphery in the XY plane of exposed portion 502. Sealing portion 504 includes part of the upper surface of second base 52 and part of second conductor pattern 54. Sealing portion 504 surrounds the entire periphery of exposed portion 502 in the XY plane.

[0048] 3, the exposed portions 402 and 502 are provided corresponding to the two openings 244, respectively. In the assembled device 10, the exposed portions 402 and 502 are each located at the middle of the corresponding opening 244 in the XY plane. At this time, the sealing portion 404 and the sealing portion 504 are each located on the outer periphery of the corresponding opening 244 in the XY plane, and are also located directly below the corresponding circuit sealing portion 264 of the frame-shaped film 26.

[0049] In the assembled device 10, the circuit sealing portions 264 of the two frame-shaped films 26 are fixed to the sealing portion 404 and the sealing portion 504, respectively, by a pressure-sensitive adhesive and an ultraviolet curing agent contained in the circuit sealing portion 264. However, the present invention is not limited to this. For example, the circuit sealing portion 264 may be fixed to the sealing portion 404 and the sealing portion 504, respectively, by a fixing member such as an adhesive that is separate from the frame-shaped film 26.

[0050] In this embodiment, the circuit sealing portions 264 of the two frame-shaped films 26 are fixed to the sealing portions 404 and 504, respectively, so as to surround the entire periphery of the exposed portions 402 and 502, respectively. As a result, the passage of air via the opening 244 is blocked. As long as the circuit sealing portions 264 can be fixed to the sealing portions 404 and 504, respectively, so as to block the passage of air, the exposed portions 402 and 502 can be fixed to the sealing portions 404 and 504, respectively. 、 The shapes of the sealing portion 404 and the sealing portion 504 are not particularly limited.

[0051] In the assembled device 10, the exposed portion 402 and the exposed portion 502 are exposed upward from the central hole 266 of the frame-shaped film 26. In other words, the portion of the first circuit member 40 exposed from the central hole 266 is the exposed portion 402, and the portion surrounding the exposed portion 402 in the XY plane is the sealing portion 40. In 4 Similarly, the portion of the second circuit member 50 exposed from the central hole 266 is the exposed portion 502, and the portion surrounding the exposed portion 502 in the XY plane is the sealed portion 504.

[0052] 6, in the assembled device 10, the first contact 48 and the second contact 58 are in contact with each other. That is, the first conductor pattern 44 and the second conductor pattern 54 are electrically connected to each other and can be electrically connected to the outside of the device 10 via the first terminal 46 (see FIG. 1) of the exposed portion 402 and the second terminal 56 (see FIG. 1) of the exposed portion 502. For example, the contact resistance between the first contact 48 and the second contact 58 can be measured by a four-terminal method using the first terminal 46 and the second terminal 56.

[0053] 5 and 7 are abstract conductor patterns for simply explaining the present invention and have no specific function. That is, even if the illustrated first contacts 48 and second contacts 58 come into contact with each other, the device 10 does not function as an electronic device.

[0054] Meanwhile, an electronic circuit (not shown) capable of measuring the electrocardiogram of the subject is formed on the actual first conductor pattern 44 and second conductor pattern 54, for example. With reference to Fig. 3, a conductive part (not shown) capable of contacting the skin of the subject may be formed on the first conductor pattern 44 of the exposed portion 402 instead of the first terminal 46. A display part (not shown) equipped with an LED (light emitting diode) may be formed on the second conductor pattern 54 of the exposed portion 502 instead of the second terminal 56. In this case, the electronic circuit can obtain a biological signal caused by the electrocardiogram of the subject from the conductive part, and can display the measurement result on the display part.

[0055] The exposed portion 402 (exposed portion 502) may be provided with not only the conductive portion (electrode) and the display portion described above, but also other portions according to the application of the device 10. For example, the exposed portion 402 (exposed portion 502) may be provided with a sensing surface of a sensor element such as a humidity sensor or a gas sensor, a light receiving portion of a light receiving element, or a light emitting portion of a light emitting element.

[0056] 5, according to the present embodiment, the number of each of the first contacts 48 and the second contacts 58 is one. However, the present invention is not limited to this. For example, the number of each of the first contacts 48 and the second contacts 58 may be two or more.

[0057] 1 and 2, according to the present embodiment, the number of each of the exposed portions 402 and 502 is one. However, the present invention is not limited thereto. For example, the number of each of the exposed portions 402 and 502 may be two or more. The device 10 may have only one exposed portion 402 or only one exposed portion 502. That is, at least one of the first circuit member 40 and the second circuit member 50 may have an exposed portion 402 (exposed portion 502) and a sealing portion 404 (sealing portion 504). Referring to FIG. 6, in the assembled device 10, the first contact 48 may be in contact with the second contact 58, and each of the exposed portions 402 and 502 may be exposed to the outside of the device 10.

[0058] The device 10 of this embodiment will be described in more detail below.

[0059] 1 and 2, the first film 22 of the present embodiment has a first inner portion 222 and a first outer portion 224. The first outer portion 224 of the present embodiment has a first seal portion 226 and a first contact portion 228. The first inner portion 222 is located inside the first outer portion 224 in the XY plane. In other words, the first outer portion 224 is a portion of the first film 22 that surrounds the first inner portion 222.

[0060] 2, the second film 32 of the present embodiment has a second inner portion 322 and a second outer portion 324. The second outer portion 324 of the present embodiment has a second seal portion 326 and a second contact portion 328. The second inner portion 322 is located inside the second outer portion 324 in the XY plane. In other words, the second outer portion 324 is a portion of the second film 32 that surrounds the second inner portion 322.

[0061] 1 and 2, the first inner portion 222 of the first film 22 and the second inner portion 322 of the second film 32 are portions that house the circuit structure 12 in the device 10, and are separated from each other. Meanwhile, the first seal portion 226 and the second seal portion 326 of the present embodiment are connected to each other to form the seal mark 16. According to the present embodiment, the first seal portion 226 and the second seal portion 326 are connected to each other by thermal sealing. That is, the seal mark 16 of the present embodiment is a mark where the first seal portion 226 and the second seal portion 326 are welded to each other by heating. However, the present invention is not limited thereto, and the first seal portion 226 and the second seal portion 326 can be connected by various methods such as high frequency, ultrasonic waves, laser, and adhesion.

[0062] The seal mark 16 in this embodiment is formed around the entire circumference of the first seal portion 226 and the second seal portion 326. The seal mark 16 surrounds the entire circumference of the first contact portion 228 and the second contact portion 328 in the XY plane. However, the present invention is not limited to this, and the seal mark 16 may be formed in a necessary place depending on the manufacturing method of the device 10. For example, the seal mark 16 may be formed partially, or may not be formed at all.

[0063] Referring to FIG. 6, as described below, after the first seal portion 226 and the second seal portion 326 are connected to each other, the inside of the device 10 is evacuated. According to this embodiment, when evacuating, the first contact portion 228 and the second contact portion 328 contact each other at the contact region 17 due to the air pressure difference. As a result, a sealed space 18 is formed in the device 10. The sealed space 18 is surrounded by the first inner portion 222 and the second inner portion 322. The contact region 17 of this embodiment surrounds the first inner portion 222 and the second inner portion 322 all around in the XY plane without any breaks. However, the present invention is not limited to this, and the contact region 17 may be formed at a necessary place according to the manufacturing method of the device 10. For example, the contact region 17 may be formed partially or not at all.

[0064] The sealed space 18 formed as described above is surrounded by the first sealing member 20 and the second sealing member 30, except for the exposed portion 402 and the exposed portion 502, and is isolated from the outside of the device 10. According to this embodiment, the first seal portion 226 and the second seal portion 326 are firmly connected to each other. In addition, the contact area 17 is located inside the seal mark 16 in the XY plane, and blocks the flow of air between the inside and outside of the sealed space 18. That is, the air pressure inside the sealed space 18 is maintained at a low pressure lower than the atmospheric pressure.

[0065] The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18 maintained at the above-mentioned low pressure, except for the exposed portion 402 and the exposed portion 502. In other words, except for the exposed portion 402 and the exposed portion 502, none of the first circuit member 40 and the second circuit member 50 is located outside the device 10. The first contact 48 and the second contact 58 are pressed against each other and in contact inside the sealed space 18. More specifically, a contact force is generated between the first contact 48 and the second contact 58 due to the air pressure difference between the inside and outside of the sealed space 18. The first contact 48 and the second contact 58 are pressed against each other due to this air pressure difference, and this reliably maintains contact between the first contact 48 and the second contact 58.

[0066] To summarize the above explanation, in the device 10 of the present embodiment, the first sealing member 20 and the second sealing member 30 are overlapped so as to be in contact with each other, with the first circuit member 40 and the second circuit member 50 (hereinafter simply referred to as "circuit members") sandwiched therebetween. Each of the first sealing member 20 and the second sealing member 30 of the present embodiment is formed based on a film.

[0067] Furthermore, there are no particular structural constraints on each of the circuit members, except that they each have a contact (first contact 48 or second contact 58). That is, the circuit members of this embodiment have a simple structure and can be formed from a variety of materials. For example, the circuit members may be insulating films on which conductor patterns (first conductor pattern 44 or second conductor pattern 54) having contacts are formed. In this case, the overall thickness of the device 10 can be made extremely thin. That is, according to this embodiment, a new device 10 that can be made thin can be provided.

[0068] According to this embodiment, the connection between the first seal portion 226 and the second seal portion 326 and the contact between the first contact portion 228 and the second contact portion 328 can reliably maintain the airtightness of the sealed space 18. However, the present invention is not limited to this embodiment. For example, the first seal portion 226 and the second seal portion 326 may partially surround the first contact portion 228 and the second contact portion 328 in the XY plane. Also, the first seal portion 226 and the second seal portion 326 may partially surround the first inner portion 222 and the second inner portion 322 in the XY plane.

[0069] According to this embodiment, the first circuit member 40 and the second circuit member 50 can be easily removed from the sealed space 18 by cutting off the first sealed portion 226 and the second sealed portion 326. Thereafter, the frame-shaped film 26 can be peeled off to easily separate the first circuit member 40 and the second circuit member 50 from the first sealed portion 226 and the second sealed portion 326. That is, according to this embodiment, the members can be easily separated and recovered.

[0070] According to this embodiment, the outer surface 232 of the first film 22 is located outside the sealed space 18. The film sealing portion 262 of the frame-shaped film 26 is fixed to the outer surface 232 arranged in this manner. On the other hand, the exposed portion 402 and the exposed portion 502 are exposed to the outside of the sealed space 18. If no such exposed portion 402 (exposed portion 502) is provided, the electronic circuit (not shown) formed on the first conductor pattern 44 and the second conductor pattern 54 needs to acquire the subject's biosignal without contacting the subject (in a non-contact manner). However, it is difficult to accurately acquire a weak biosignal in a non-contact manner. On the other hand, according to this embodiment, the biosignal can be reliably acquired by contacting the conductive portion (not shown) provided on the exposed portion 402 or the exposed portion 502 with the subject's skin.

[0071] Each of the first sealing member 20 and the second sealing member 30 preferably has a high oxygen barrier property. More specifically, each of the first film 22 and the second film 32 (or a rigid circuit board) preferably includes a layer made of a material having a high oxygen barrier property (high oxygen barrier material). This layer structure can reduce oxidation of the metal members of the circuit structure 12.

[0072] For example, the high-oxygen barrier material may be linear low density polyethylene (LLDPE). More specifically, the high-oxygen barrier material may be PET / Al / PE, which is a laminate of polyethylene terephthalate, aluminum, and polyethylene, ON / PE, which is a laminate of biaxially oriented nylon and polyethylene, PET / EVOH / PE, which is a laminate of polyethylene terephthalate, polyvinyl chloride, and polyethylene, or may be formed by laminating a transparent high-barrier film and polyethylene. The transparent high-barrier film may be SiOx-deposited PET (polyethylene terephthalate) or aluminum oxide-deposited PET (polyethylene terephthalate).

[0073] Each of the first sealing member 20 and the second sealing member 30 of the present embodiment preferably has high water vapor barrier properties in addition to high oxygen barrier properties. More specifically, each of the first film 22 and the second film 32 (or a rigid circuit board) preferably includes a layer made of a material having high water vapor barrier properties (high water vapor barrier material). This layer structure can make the circuit structure 12 waterproof. For example, the high water vapor barrier material may be a material in which a sheet such as ON / PE, OPP (biaxially oriented polypropylene), or PET is coated with PVDC (polyvinylidene chloride).

[0074] Each of the first sealing member 20 and the second sealing member 30 may have various barrier properties such as a nitrogen barrier property in addition to a high oxygen barrier property and a high water vapor barrier property. That is, each of the first sealing member 20 and the second sealing member 30 preferably has a high barrier property according to the application.

[0075] The device 10 of this embodiment (see FIG. 1) is manufactured through four steps: a preparation step, an arrangement step, a sealing step, and a vacuum drawing step. However, the present invention is not limited to this, and the manufacturing method of the device 10 can be modified as necessary. An example of the manufacturing method of the device 10 of this embodiment will be described below.

[0076] 9, first, in a preparation step, the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50 are prepared.

[0077] Next, in the arrangement step, the first sealing member 20, the first circuit member 40, the second circuit member 50, and the second sealing member 30 are stacked on top of each other in this order from top to bottom along the Z direction. At this time, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact 48 and the second contact 58 face each other in the Z direction. Also, the exposed portion 402 and the exposed portion 502 are arranged so that they face the center hole 266 (see FIG. 7) of the frame-shaped film 26, respectively, in the Z direction. The additional film 38 is positioned at the middle part of the second film 32 in the XY plane. The first circuit member 40 and the second circuit member 50 are positioned at the middle part of the additional film 38 in the XY plane. Also, the first film 22 and the second film 32 are arranged so that the two melt layers 146 (see FIG. 7) face each other in the Z direction.

[0078] Referring to FIG. 10, next, in the sealing process, the circuit sealing portion 264 of the frame-shaped film 26 is pressed against and adhered to the sealing portion 404 and the sealing portion 504, respectively. After that, the frame-shaped film 26 is irradiated with ultraviolet light to fix the film sealing portion 262 to the first film 22, and fix the circuit sealing portion 264 to the sealing portion 404 and the sealing portion 504. Next, the first film 22 and the second film 32 are heat-sealed. In detail, the two melt layers 146 (see FIG. 7) at the outer periphery of the first film 22 and the second film 32 in the XY plane are welded to each other by heat sealing. As a result of the heat sealing, the device 10 having the seal mark 16 is formed. The internal space of the device 10 is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10 except for the air valve 28.

[0079] Next, in a vacuum drawing process, the inside of the device 10 is evacuated. According to the present embodiment, the air inside the device 10 is removed using an instrument 80 and an air valve 28. The instrument 80 in this embodiment is a syringe-type piston pump. The instrument 80 includes a syringe 82 and a plunger 84. The lower end of the syringe 82 has a ring shape that corresponds to the outer periphery of the shielding portion 282 of the air valve 28 in the XY plane.

[0080] In the evacuation process, first, the lower end of syringe 82 is pressed against the upper surface of shielding portion 282 (see FIG. 8). Next, plunger 84 is pulled upward. At this time, air valve 28 is opened, and an air passage is formed between the inside of device 10 and the inside of syringe 82. Air inside device 10 is drawn into syringe 82 through passage hole 288 and notch 285 (see FIG. 8) of air valve 28. As a result, the air pressure inside device 10 gradually decreases. When the air pressure inside device 10 becomes low, close to a vacuum, the evacuation by instrument 80 is stopped.

[0081] 6 together with FIG. 10, when the evacuation is stopped, the valve 284 (see FIG. 8) of the air valve 28 closes the notch 285 (see FIG. 8) due to the pressure difference between the air pressure inside the device 10 and the atmospheric pressure, and the air valve 28 is in a closed state. As a result, the air pressure inside the device 10 is maintained at a low pressure. That is, a low-pressure sealed space 18 that is isolated from the outside is formed in the device 10. The first contact 48 and the second contact 58 are pressed against each other due to the pressure difference between the inside and outside of the sealed space 18, and come into contact with each other.

[0082] When drawing a vacuum, the first film 22 and the second film 32 tend to come into close contact with each other and form a contact area such as the contact area 17. If the additional film 38 were not provided, the contact area between the first film 22 and the second film 32 would also tend to be formed inside the sealed space 18. That is, the air passage between the air valve 28 and the contact area such as the first contact 48 may be blocked by the contact area. In this case, the air pressure in the space where the first contact 48 and the second contact 58 are located may not be sufficiently reduced, and the first contact 48 and the second contact 58 may not come into reliable contact with each other.

[0083] On the other hand, the additional film 38 of the present embodiment is located between the first film 22 and the second film 32, and therefore prevents direct contact between the first film 22 and the second film 32. Also, since the additional film 38 has the uneven portion 382, ​​the air passage via the air valve 28 is maintained even if the first film 22 and the second film 32 come into indirect contact with each other via the additional film 38. As a result, the first contact 48 and the second contact 58 are reliably in contact with each other.

[0084] The additional film 38 in this embodiment is an embossed film separate from the second film 32, and is disposed on the second film 32. The uneven portion 382 is formed over the entire upper and lower surfaces of the additional film 38. However, the present invention is not limited to this. For example, the additional film 38 may be adhered and fixed to the upper surface of the second film 32. The uneven portion 382 may be formed only on the upper surface of the additional film 38. The uneven portion 382 may be formed on the second film 32 by embossing the second film 32. In this case, the additional film 38 does not need to be provided. That is, the second sealing member 30 may include only the second film 32 having the uneven portion 382.

[0085] The additional film 38 in this embodiment forms the second sealing member 30 together with the second film 32. However, the present invention is not limited to this. For example, the additional film 38 may form the first sealing member 20 together with the first film 22. More specifically, the additional film 38 may be disposed below the first film 22. Also, the first film 22 may be embossed to form the uneven portion 382 on the first film 22. In this case, the additional film 38 does not need to be provided.

[0086] According to the manufacturing method of this embodiment, the first contact 48 and the second contact 58 are reliably in contact with each other without using a fixing member such as an adhesive. Therefore, when the device 10 is no longer needed, the device 10 can be disassembled simply by cutting off the first outer portion 224 and the second outer portion 324 and then peeling off the frame-shaped film 26. In addition, the first circuit member 40 and the second circuit member 50 can be sealed inside the low-pressure sealed space 18, which reduces deterioration of the metal members due to oxidation, etc.

[0087] 10, according to the manufacturing method of this embodiment, a vacuum can be easily drawn using a simple tool 80. The vacuum can be drawn repeatedly using the tool 80. For example, even if the air pressure in the sealed space 18 increases when the device 10 is in use, the tool 80 can be used to draw a vacuum again. As a result, the contact force between the first contact 48 and the second contact 58 can be maintained when the device 10 is in use. However, the present invention is not limited to this, and the manufacturing method of the device 10 can be modified as necessary.

[0088] For example, the structure of the tool 80 is not particularly limited as long as it can draw a vacuum. Also, instead of using the tool 80 shown in the figures, a nozzle may be inserted into the device 10 and a vacuum may be drawn using the nozzle. In this case, it is not necessary to provide the air valve 28. Also, sealing and drawing a vacuum may be performed using a commercially available desktop vacuum packaging machine (not shown). Figure 9 1, the members of device 10 may be placed in a vacuum chamber (not shown) and vacuumed while heat sealing. In this case, additional film 38 may not be provided. Also, there is no need to provide unevenness 382 on other members. However, from the viewpoint of easily manufacturing device 10, it is preferable to use a commercially available simple tool such as tool 80 (see FIG. 10).

[0089] According to the manufacturing method of this embodiment, the frame-shaped film 26 is adhered to the first film 22 in the preparation step, and is fixed to the first film 22, the first circuit member 40, and the second circuit member 50 in the sealing step. However, the present invention is not limited to this. For example, the frame-shaped film 26 may be adhered to the first film 22 in the sealing step. Furthermore, the frame-shaped film 26 may be fixed to the first film 22, the first circuit member 40, and the second circuit member 50 by irradiating it with ultraviolet light after the evacuation step is completed. However, from the viewpoint of reliably evacuating the inside of the device 10, the manufacturing method of this embodiment is preferable.

[0090] In addition to the modifications already described, this embodiment can be modified in various ways as described below.

[0091] Comparing FIG. 11 with FIG. 6, the device 10A according to the first modification includes the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50, which are the same as those of the device 10. However, the frame-shaped film 26 of the first sealing member 20 is disposed inside the device 10A. In addition, in each of the frame-shaped films 26, the upper layer and the lower layer each contain a pressure-sensitive adhesive and an ultraviolet curing agent. Referring to FIG. 11, the inner surface 234 of the first film 22 of the device 10A is located inside the sealed space 18. Referring to FIGS. 11 to 13, the film sealing portion 262 of the frame-shaped film 26 of the device 10A is fixed to the inner surface 234 disposed in this manner.

[0092] Except for the above-mentioned differences, device 10A has a similar structure to device 10 and functions similarly to device 10. That is, this modification also provides the same effects as the above-mentioned embodiment.

[0093] The frame-shaped film 26 of this modified example has the same structure as the frame-shaped film 26 of the above-described embodiment, except that the upper layer contains a pressure-sensitive adhesive and an ultraviolet curing agent. However, the present invention is not limited to this, and further modifications are possible. For example, the upper layer of the frame-shaped film 26 may be a melting layer (not shown). The lower layer of the frame-shaped film 26 may be an ultraviolet curing tape. In this case, the upper layer of the frame-shaped film 26 may function as a film sealing portion 262, and the lower layer of the frame-shaped film 26 may function as a circuit sealing portion 264.

[0094] According to the above-described modified example, the frame-shaped film 26 can be fixed to the inner surface 234 of the first film 22 by thermally welding the film sealing portion 262, which is a melting layer, to the melting layer 146 (see FIG. 7) of the first film 22. Meanwhile, the frame-shaped film 26 can be fixed to the sealing portion 404 and the sealing portion 504 by pressing the circuit sealing portion 264 against the sealing portion 404 and the sealing portion 504 and then irradiating them with ultraviolet light.

[0095] 12 and 13, according to the above-described modified example, in the frame-shaped film 26 and the opening 244 corresponding to each other, the size of the opening 244 in the XY plane is larger than the size of the center hole 266 of the frame-shaped film 26 in the XY plane. Small That is, each of the frame-shaped films 26 may be disposed on the inner surface 234 of the first film 22 such that the corresponding opening 244 is positioned inside the central hole 266 in the XY plane.

[0096] 7, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other at the rear end (the end on the -X side) in the front-rear direction (X direction). In other words, each of the first film 22 and the second film 32 may be part of a single folded flat sheet. Also, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other except for the rear end. In other words, each of the first film 22 and the second film 32 may be part of a single bag-shaped sheet.

[0097] The rear end of the bag-shaped sheet described above may be provided with an openable and closable fastener. In this case, after closing the fastener and drawing a vacuum, the first film 22 and the second film 32 may be heat-sealed at a portion located in front of the air valve 28 (+X side). After heat-sealing, the portion where the air valve 28 is provided may be cut off.

[0098] The first circuit member 40 may be a member integral with the first sealing member 20, and the second circuit member 50 may be a member integral with the second sealing member 30. For example, the first base 42 may be adhered and fixed to the lower surface of the first film 22, and the first conductor pattern 44 may be formed on the lower surface of the first film 22. The second circuit member 50 may be provided on the additional film 38. For example, the second base 52 may be adhered and fixed to the upper surface of the additional film 38, and the second conductor pattern 54 may be formed on the upper surface of the additional film 38. In addition, when the second sealing member 30 does not include the additional film 38, the second base 52 may be adhered and fixed to the upper surface of the second film 32, and the second conductor pattern 54 may be formed on the upper surface of the second film 32.

[0099] The device 10 (device 10A) may include a cushioning material (not shown) made of an open-cell structure such as urethane sponge, instead of the additional film 38. The cushioning material may be disposed above the first circuit member 40, or below the second circuit member 50. In either case, the cushioning material may be disposed at a position corresponding to the first contact 48 and the second contact 58 in the XY plane.

[0100] When the above-mentioned buffer material is provided, the buffer material is compressed when a vacuum is drawn. The first contact 48 and the second contact 58 are pressed against each other by the restoring force of the compressed buffer material. In addition, even if air enters the sealed space 18, the air is absorbed by the buffer material. At this time, the reduction in the restoring force of the elastic member 60C is slight, so that the change in the contact force between the first contact 48 and the second contact 58 can be suppressed. According to this modification, it is possible to provide a device 10 (device 10A) that can stably operate for a long period of time in various environments. [Explanation of symbols]

[0101] 10,10A Device 12 Circuit structure 14 Sealing member 146 Molten Layer 148 Non-melted layer 16 Seal marks 17 Contact area 18 Sealed space 20 First sealing member 22 1st Film 222 1st inner part 224 First outer part 226 First seal part 228 1st contact part 229 Periphery 232 External surface 234 Inner surface 244 Aperture 246 Edge 248 Valve opening 26 Frame Film 262 Film sealing section 264 Circuit sealing part 266 Center hole 28 Air valve 282 Shielding part 284 Valve 285 Notch 286 base 288 Passing hole 30 Second sealing member 32 2nd Film 322 Second inner part 324 Second outer part 326 Second seal part 328 2nd contact part 329 Periphery 38 Additional Films 382 Uneven part 384 Protrusion 40 First circuit member 402 Exposed part 404 Sealing part 42 First Base 44 First conductor pattern 46 1st terminal 48 First Contact 50 Second circuit member 502 Exposed part 504 Sealing part 52 Second Base 54 Second Conductor Pattern 56 2nd terminal 58 Second Contact 80 Equipment 82 Syringe 84 Plunger

Claims

1. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base and a frame-shaped film, The first film has an opening formed therein, The edge of the opening forms a closed path; The frame-shaped film has a closed-circuit shape, At least one of the first circuit member and the second circuit member includes an exposed portion and a sealed portion, the exposed portion and the sealed portion face the first film, The sealing portion surrounds the exposed portion over an entire periphery, the frame-shaped film has a film sealing portion and a circuit sealing portion, The film sealing portion is fixed to the first film so as to surround the entire periphery of the opening, the circuit sealing portion is fixed to the sealing portion so as to surround the entire periphery of the exposed portion, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member except for the exposed portion and is isolated from the outside of the device; The exposed portion is exposed to the outside of the sealed space, the first circuit member and the second circuit member are sealed within the sealed space except for the exposed portion, the first circuit member includes a first contact; the second circuit member includes a second contact; The first contact and the second contact are pressed against each other and in contact with each other inside the sealed space due to a pressure difference between the inside and the outside of the sealed space without using a fixing member. device.

2. 2. The device of claim 1, the first film has an outer surface; The outer surface is located outside the sealed space, The film sealing portion of the frame-shaped film is fixed to the outer surface. device.

3. 2. The device of claim 1, the first film has an inner surface; The inner surface is located inside the sealed space, The film sealing portion of the frame-shaped film is fixed to the inner surface. device.

4. A device according to any one of claims 1 to 3, The frame-shaped film is made of an ultraviolet curing tape. device.

5. A device according to any one of claims 1 to 4, The second sealing member includes a second film as a base. device.

Images