Switching device

Abstract

To improve abrasion resistance, solvent cleanability, and texture in a switch device having a contact that moves up and down.SOLUTION: A switch device includes a glass layer, and a switch portion arranged on the back side of the glass layer, and the glass layer has a thickness of 20 μm or more and 150 μm or less, and the switch portion includes a plurality of contacts including contacts that move up and down, and when the glass layer is pressed, the glass layer elastically deforms to switch between conduction and non-conduction of the plurality of contacts.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a switch device. [Background technology]

[0002] Switches that mechanically control electrical contact are widely used as an input method for electronic components. One such switch is the tactile switch shown in Patent Document 1. This type of switch has a sliding button that can self-recognize on / off, and is therefore considered to have the advantage of being less prone to malfunction than touch-type switches.

[0003] Among these types of switches, switches that have contacts that can move up and down and slide up and down use a flexible and unbreakable resin for the outermost surface. However, the surface of resin is easily deteriorated by scratches, is difficult to clean with solvents, and has a poor texture. Therefore, a switch device that solves these problems is required. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 06-203679 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above points, and has an object to improve the scratch resistance, solvent cleanability, and texture of a switch device having contacts that move up and down. [Means for solving the problem]

[0006] The switch device includes a glass layer, a switch unit disposed on a back surface side of the glass layer, and a bonding layer interposed between the glass layer and the switch portion;and a support portion arranged on the rear surface side of the glass layer and supporting the glass layer, the support portion being all or a part of the switch portion, the glass layer having a thickness of 20 μm or more and 150 μm or less, the switch portion having a plurality of contacts including a contact that can move up and down, and when the glass layer is pressed, the glass layer elastically deforms, switching between conductive and non-conductive states of the plurality of contacts. Effect of the Invention

[0007] According to the disclosed technology, it is possible to improve scratch resistance, solvent cleanability, and texture in a switch device having contacts that can move up and down. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view (part 1) illustrating a switch device according to a first embodiment. [Diagram 2] FIG. 4 is a second cross-sectional view illustrating the switch device according to the first embodiment. [Diagram 3] FIG. 4 is a third cross-sectional view illustrating the switch device according to the first embodiment. [Figure 4] FIG. 4 is a fourth cross-sectional view illustrating the switch device according to the first embodiment. [Diagram 5] FIG. 5 is a fifth cross-sectional view illustrating the switch device according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view illustrating the switch device according to the first embodiment; [Figure 7] FIG. 7 is a cross-sectional view illustrating the switch device according to the first embodiment; [Figure 8] FIG. 8 is a cross-sectional view illustrating the switch device according to the first embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated explanations may be omitted.

[0010] Overview of the First Embodiment Fig. 1 is a cross-sectional view (part 1) illustrating a switch device according to the first embodiment. As shown in Fig. 1, the switch device 1 has a glass layer 10, a switch portion 50, and a support portion 90. The switch device 1 is mounted on, for example, a wiring board.

[0011] One surface 10a of the glass layer 10 is the outermost surface of the switch device 1. The switch unit 50 is disposed on the other surface 10b (rear surface) of the glass layer 10. The switch unit 50, which is shown diagrammatically in FIG. 1, is a sliding type switch and includes a plurality of contacts including a contact that can move up and down. The number of contacts included in the switch unit 50 may be two, or three or more.

[0012] The support section 90 is disposed on the other surface 10b side of the glass layer 10 and supports the glass layer 10. The support section 90 can be disposed, for example, outside the switch section 50 in a frame shape so as to surround the switch section 50. Alternatively, a plurality of support sections 90 may be disposed at intervals at any positions outside the switch section 50. The support section 90 is formed, for example, from a resin, a metal, or the like.

[0013] Note that a component constituting the switch section 50 may be the support section. Alternatively, the switch section 50 itself may be the support section. That is, the support section may be a part or the whole of the switch section 50. In these cases, the support section 90 shown in FIG. 1 does not need to be provided. Alternatively, a part or the whole of the switch section 50 may be used as the support section, and the support section 90 shown in FIG. 1 may be provided separately from this.

[0014] FIG. 2 is a cross-sectional view (part 2) illustrating the switch device according to the first embodiment, showing a state in which one surface 10a of the glass layer 10 is pressed in the direction of the arrow.

[0015] The thickness of the glass layer 10 is 20 μm or more and 150 μm or less. By making the glass layer 10 have such a thickness, the glass layer 10 can be elastically deformed and can be locally recessed. When one surface 10a side of the glass layer 10 is pressed, the glass layer 10 is elastically deformed to slide the contacts of the switch section 50 in the vertical direction. This causes the multiple contacts of the switch section 50 to switch between conductive and non-conductive states. The glass layer 10 can be elastically deformed so as to sink about 0.5 mm to 2 mm in the vertical direction, for example.

[0016] For example, if the contacts of switch section 50 are not in contact (non-conductive state) when glass layer 10 is not pressed, then when glass layer 10 is pressed and deformed, the contacts of switch section 50 come into contact with each other and become conductive. In Fig. 2, when the force pressing in the direction of the arrow is removed, glass layer 10 returns to the state shown in Fig. 1, and the two contacts of switch section 50 again become non-contact.

[0017] In this way, by setting the thickness of glass layer 10 to be 20 μm or more and 150 μm or less, glass layer 10 becomes elastically deformable. As a result, when glass layer 10 is pressed, the contacts of switch unit 50 slide up and down in accordance with local deformation of glass layer 10, and the multiple contacts of switch unit 50 can be switched between conductive and non-conductive states.

[0018] The switch device 1 has an outermost surface made of glass layer 10, and therefore has improved scratch resistance, solvent cleanability, and texture compared to a case where the outermost surface is made of resin. In addition, the switch device 1 is a sliding type switch, which provides a tactile sensation when pressed and reduces the risk of malfunction.

[0019] Although a type that uses capacitance or the like can be considered as a switch that uses glass on the top surface, it is difficult to create an up-and-down sliding action with ordinary plate glass. Therefore, there is no tactile sensation when pressed, and there is a risk of malfunctioning even if touched unintentionally.

[0020] First Example of First Embodiment 3 is a cross-sectional view (part 3) illustrating the switch device according to the first embodiment, showing a first specific example of the configuration of the switch device. As shown in FIG. 3, the switch device 1A has a glass layer 10, a bonding layer 30, and a switch portion 50.

[0021] In the switch device 1A, the thickness of the glass layer 10 is 20 μm or more and 150 μm or less. The switch section 50 is disposed on the other surface 10b side of the glass layer 10. A bonding layer 30 that bonds the glass layer 10 and the switch section 50 is interposed on the other surface 10b side of the glass layer 10. In the switch device 1A, the switch section 50 also functions as a support section.

[0022] The switch section 50 is a membrane switch, and includes a first sheet 51, a spacer 52, a second sheet 53, a first contact 55, and a second contact 56. The first sheet 51 and the second sheet 53 are arranged to face each other with the spacer 52 in between. The spacer 52 is arranged, for example, so as to contact the outer periphery of the upper surface of the first sheet 51 and the outer periphery of the lower surface of the second sheet 53, and the inside of the spacer 52 is a gap. The first contact 55 is arranged on the second sheet 53 side of the first sheet 51, and the second contact 56 is arranged on the first sheet 51 side of the second sheet 53, spaced apart from the first contact 55. The second sheet 53 is configured to be elastically deformable. The first sheet 51, the spacer 52, and the second sheet 53 are made of, for example, resin.

[0023] In the switch device 1A shown in Fig. 3, when one surface 10a of the glass layer 10 is pressed in the same manner as in Fig. 2, the glass layer 10 elastically deforms, switching between contact and non-contact between the first contact 55 and the second contact 56 of the switch section 50. Note that in Fig. 3, external connection terminals electrically connected to the first contact 55 and the second contact 56 are omitted from the illustration.

[0024] In the example of Fig. 3, when the glass layer 10 is not pressed, the first contact 55 and the second contact 56 of the switch unit 50 are not in contact (non-conductive state). Therefore, when the glass layer 10 is pressed and deformed, the second sheet 53 of the switch unit 50 is elastically deformed accordingly, and the second contact 56 approaches the first contact 55, and the first contact 55 and the second contact 56 come into contact with each other, resulting in a conductive state. As in the case of Fig. 2, when the force pressing the glass layer 10 is removed, the glass layer 10 returns to the state of Fig. 3, and the first contact 55 and the second contact 56 are again not in contact with each other.

[0025] Here, the glass layer 10 and the bonding layer 30 will be described in more detail.

[0026] The glass layer 10 is not particularly limited, and an appropriate glass layer can be adopted depending on the purpose. The glass layer 10 can be classified according to composition, for example, soda-lime glass, borate glass, aluminosilicate glass, quartz glass, etc. Also, according to alkali components, it can be non-alkali glass or low-alkali glass. The content of alkali metal components (e.g., Na2O, K2O, Li2O) in the above glass is preferably 15 wt% or less, more preferably 10 wt% or less.

[0027] Considering the surface hardness, airtightness, and corrosion resistance of glass, the thickness of the glass layer 10 is preferably 20 μm or more. Since the glass layer 10 needs to have flexibility and durability for repeated use like a film, the thickness of the glass layer 10 is preferably 150 μm or less. The thickness of the glass layer 10 is more preferably 30 μm to 120 μm, and particularly preferably 50 μm to 100 μm.

[0028] The glass layer 10 preferably has a light transmittance of 85% or more at a wavelength of 550 nm. The glass layer 10 preferably has a refractive index of 1.4 to 1.65 at a wavelength of 550 nm. The glass layer 10 preferably has a density of 2.3 g / cm 3 ~3.0g / cm 3 and more preferably 2.3 g / cm 3 ~2.7g / cm 3 It is.

[0029] The method for forming the glass layer 10 is not particularly limited, and an appropriate method can be adopted depending on the purpose. Typically, the glass layer 10 can be produced by melting a mixture containing a main raw material such as silica or alumina, an antifoaming agent such as mirabilite or antimony oxide, and a reducing agent such as carbon at a temperature of about 1400°C to 1600°C, forming it into a thin plate, and then cooling it. Examples of the method for forming the glass layer 10 include a slot downdraw method, a fusion method, and a float method. The glass layer formed into a plate by these methods may be chemically polished with a solvent such as hydrofluoric acid as necessary to make it thinner or to increase the smoothness.

[0030] A functional layer such as an antifouling layer, an antireflection layer, a conductive layer, a reflective layer, a decorative layer, etc. may be provided on the front and / or back surface of the glass layer 10. In the switch device according to this embodiment, the glass layer 10 is located on the outermost surface. Here, "the glass layer 10 is located on the outermost surface" means that the glass layer 10 is substantially located on the outermost surface, and even if an additional layer such as the above is provided, in this embodiment, it is expressed that the glass layer 10 is located on the outermost surface.

[0031] Any pressure sensitive adhesive or adhesive can be used as the bonding layer 30. However, from the viewpoint of strength, it is preferable to use an adhesive as the bonding layer 30. From the viewpoint of appearance, the thickness of the bonding layer 30 is preferably 0.5 μm or more and 25 μm or less, more preferably 0.5 μm or more and 5 μm or less, and further preferably 0.5 μm or more and 3 μm or less.

[0032] In this specification, the term "adhesive" refers to a layer that has adhesive properties at room temperature and adheres to an adherend with light pressure. Therefore, even when an adherend that has been stuck to the adhesive is peeled off, the adhesive retains practical adhesive strength. On the other hand, the term "adhesive" refers to a layer that can bond substances by being interposed between them. Therefore, when an adherend that has been stuck to the adhesive is peeled off, the adhesive no longer has practical adhesive strength.

[0033] When an adhesive is used for the bonding layer 30, for example, an adhesive having an acrylic polymer, a silicone polymer, a polyester, a polyurethane, a polyamide, a polyether, a fluorine-based polymer, a rubber-based polymer, or the like as a base polymer is used.

[0034] When an adhesive is used for the bonding layer 30, for example, a polyester adhesive, a polyurethane adhesive, a polyvinyl alcohol adhesive, or an epoxy adhesive is used. When the adhesive is a thermosetting adhesive, it can exhibit peel resistance by heating and curing (solidifying). When the adhesive is a light-curing adhesive such as an ultraviolet-curing adhesive, it can exhibit peel resistance by curing by irradiating it with ultraviolet light or the like. When the adhesive is a moisture-curing adhesive, it can react with moisture in the air to cure, and can therefore exhibit peel resistance by being left to stand.

[0035] Second Example of First Embodiment 4 is a cross-sectional view (part 4) illustrating the switch device according to the first embodiment, showing a second specific example of the configuration of the switch device. As shown in FIG. 4, the switch device 1B has a glass layer 10, a bonding layer 30, a switch portion 60, and a support portion 90.

[0036] In the switch device 1B, the thickness of the glass layer 10 is 20 μm or more and 150 μm or less. The switch section 60 is disposed on the other surface 10b side of the glass layer 10. A part or the whole of the outer periphery of the other surface 10b of the glass layer 10 is bonded to the support section 90 via the bonding layer 30. As described above, the support section 90 may be disposed in a frame shape so as to surround the switch section 60, or a plurality of support sections 90 may be disposed at intervals at any positions outside the switch section 60. The bonding layer 30 is provided for the purpose of fixing the position of the glass layer 10 in the plane, and the bonding layer 30 may be omitted if the position of the glass layer 10 in the plane does not change due to the structure of the switch device.

[0037] The switch unit 60 is a tactile switch, and includes a housing 61, a film 62, a frame 63, a stem 64, a first contact 65, and a second contact 66. The housing 61 and the frame 63 are each square-shaped and are arranged to face each other with an adhesive film 62 sandwiched between them. The film 62 is arranged, for example, so as to close the opening of the housing 61. The stem 64 is held by the frame 63 in a state in which it can slide freely in the up and down direction. The first contact 65 and the second contact 66 are arranged on the bottom surface of the housing 61. The second contact 66 is arranged above the first contact 65, separated from the first contact 65. The film 62 and the second contact 66 are configured to be elastically deformable. The housing 61, the film 62, the frame 63, and the stem 64 are made of, for example, resin.

[0038] In the switch device 1B shown in Fig. 4, when one surface 10a of the glass layer 10 is pressed in the same manner as in Fig. 2, the glass layer 10 elastically deforms, switching between contact and non-contact between the first contact 65 and the second contact 66 of the switch section 60. Note that in Fig. 4, external connection terminals electrically connected to the first contact 65 and the second contact 66 are omitted from the illustration.

[0039] In the example of Fig. 4, when the glass layer 10 is not pressed, the first contact 65 and the second contact 66 of the switch unit 60 are not in contact (non-conductive state). Therefore, when the glass layer 10 is pressed and deformed, the stem 64 of the switch unit 60 is pressed accordingly, and the film 62 and the second contact 66 are elastically deformed, so that the second contact 66 approaches the first contact 65, and the first contact 65 and the second contact 66 come into contact with each other and become conductive. As in the case of Fig. 2, when the force pressing the glass layer 10 is removed, the glass layer 10 returns to the state of Fig. 4, and the first contact 65 and the second contact 66 are again not in contact with each other.

[0040] Third Example of First Embodiment 5 is a cross-sectional view (part 5) illustrating the switch device according to the first embodiment, showing a third specific example of the configuration of the switch device. As shown in FIG. 5, the switch device 1C differs from the switch device 1A (see FIG. 3) in that a resin layer 20 is provided between the glass layer 10 and the bonding layer 30. That is, the resin layer 20 is interposed between the glass layer 10 and the switch section 50.

[0041] The resin layer 20 has flexibility. From the viewpoint of flexibility, the thickness of the resin layer 20 is preferably 50 μm or more and 150 μm or less. Examples of materials for the resin layer 20 include polyester resins such as polyethylene terephthalate resins and polyethylene naphthalate resins, cycloolefin resins such as norbornene resins, polyethersulfone resins, polycarbonate resins, acrylic resins, polyolefin resins, polyimide resins, polyamide resins, polyimideamide resins, polyarylate resins, polysulfone resins, polyetherimide resins, and urethane resins.

[0042] In this way, when the glass layer 10 and the resin layer 20 are laminated, the resin layer 20 suppresses excessive deformation of the glass layer 10, and has the effect of preventing cracking of the glass layer 10, and at the same time, an appropriate amount of deformation is realized, thereby improving the durability of the glass layer 10 when it is repeatedly elastically deformed. The amount of deformation of the glass layer 10 can be controlled by changing the thickness of the resin layer 20.

[0043] A bonding layer 30 is provided between the glass layer 10 and the resin layer 20. Any adhesive or pressure-sensitive adhesive can be used as the bonding layer 30. However, from the viewpoint of strength, it is preferable to use an adhesive as the bonding layer 30. From the viewpoint of appearance, the thickness of the bonding layer 30 is preferably 0.5 μm or more and 25 μm or less, more preferably 0.5 μm or more and 5 μm or less, and even more preferably 0.5 μm or more and 3 μm or less.

[0044] Fourth Example of First Embodiment Fig. 6 is a cross-sectional view (part 6) illustrating the switch device according to the first embodiment, showing a fourth specific example of the configuration of the switch device. As shown in Fig. 6, the switch device 1D differs from the switch device 1B (see Fig. 4) in the layer configuration of the laminate joined onto the support portion 90.

[0045] In the switch device 1D, a bonding layer 31, a resin layer 21, a bonding layer 32, and a resin layer 22 are laminated in this order on the other surface 10b side of the glass layer 10, and this laminate is bonded onto the support part 90 via a bonding layer 33, with the glass layer 10 facing the front side. However, the bonding layer 33 is not necessarily required if the laminate is fixed in the switch device 1D and no misalignment or the like occurs within the plane.

[0046] The resin layers 21 and 22 are flexible. From the viewpoint of flexibility, the thickness of each of the resin layers 21 and 22 is preferably 50 μm or more and 150 μm or less. The resins exemplified as the resin layer 20 can be used as the material of the resin layers 21 and 22. The resin layers 21 and 22 may be made of the same resin or different resins.

[0047] Any adhesive or bonding agent can be used for the bonding layers 31, 32, and 33. However, from the viewpoint of strength, it is preferable to use the adhesive exemplified as the bonding layer 30 for the bonding layer 31, the adhesive exemplified as the bonding layer 30 for the bonding layer 32, and the adhesive or bonding agent exemplified as the bonding layer 30 for the bonding layer 33. The thickness of the bonding layer 31 is preferably 0.5 μm to 25 μm, more preferably 0.5 μm to 5 μm, and even more preferably 0.5 μm to 3 μm. The thickness of the bonding layer 32 is preferably 5 μm to 200 μm, more preferably 20 μm to 150 μm, and even more preferably 20 μm to 100 μm, in view of the manufacturing method of the adhesive layer. The thickness of the bonding layer 33 is preferably within a range of 5 μm to 2 mm.

[0048] In this way, the resin layer and the bonding layer do not need to be one layer each, and multiple layers may be laminated. Such a laminated structure can prevent cracking of the glass layer 10 and can further improve the durability of the glass layer 10 when it is repeatedly elastically deformed. This laminated structure may be applied to the switch device 1A shown in FIG. 5 or to the switch devices described below.

[0049] Fifth Example of First Embodiment FIG. 7 is a cross-sectional view (part 7) illustrating the switch device according to the first embodiment, showing a fifth specific example of the configuration of the switch device. As shown in FIG. 7, the switch device 1E differs from the switch device 1A (see FIG. 3) in that the switch device 1E has a plurality of switch sections 50 on the other surface 10b side of one glass layer 10. The number of switch sections 50 is arbitrary. The plurality of switch sections 50 may be arranged, for example, in a line, in a staggered pattern, or two-dimensionally. When arranged two-dimensionally, they may be arranged regularly (for example, in a matrix) or irregularly.

[0050] In this way, the switch device has multiple switch units, making it possible to apply the switch device to a variety of devices, such as remote controls, keyboards, smartphones, operation panels for warm-water washing toilet seats, operation panels for white goods, operation panels for audiovisual devices, and wall switches.

[0051] In addition, when a switch device has multiple switch parts, it is not necessary for all the switch parts to have the same specifications. For example, the switch parts may be a mixture of membrane switches and tact switches. Alternatively, some switch parts may not be of the sliding type but may be of the non-sliding type (e.g., capacitance type). For example, a method is conceivable in which a sliding type switch part and a non-sliding type switch part are arranged on the back side of a single elastically deformable glass layer that constitutes the top surface of a remote control or the like, and the sliding type is used only for parts where it is particularly desired to prevent malfunction, such as a power switch.

[0052] Sixth Example of First Embodiment Fig. 8 is a cross-sectional view (part 8) illustrating the switch device according to the first embodiment, showing an eighth specific example of the configuration of the switch device. As shown in Fig. 8, the switch device 1F differs from the switch device 1D (see Fig. 6) in that it has a support portion 90 on the outer side of the multiple switch portions 50 and that a gap S is formed between the other surface 10b of the glass layer 10 and the upper surface of each switch portion 50.

[0053] In this way, the glass layer 10 and the switch portion 50 do not necessarily need to be in contact with each other, and there may be a gap S between the glass layer 10 and the switch portion 50. Depending on the application of the switch device 1F, having the gap S may improve the design. The same applies when using an item other than the switch portion 50.

[0054] Although preferred embodiments have been described above in detail, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0055] For example, in the above-described embodiment, a membrane switch and a tact switch are exemplified as the switch portion, but the present invention is not limited to this, and any type of switch may be used for the switch portion of the switch device according to the present embodiment.

[0056] The decorative print of the switch may be provided on any layer, such as the glass layer or the resin layer, or may be provided on each layer and then superimposed. [Explanation of symbols]

[0057] 1, 1A, 1B, 1C, 1D, 1E, 1F Switching device 10 Glass Layer 20, 21, 22 Resin layer 30, 31, 32, 33 bonding layer 50, 60 Switch section 51 Sheet 1 52 Spacer 53 2nd Sheet 55, 65 First contact 56, 66 Second contact 61 Housing 62 Film 63 Frames 64 Stem 90 Support part

Claims

1. A glass layer; A switch portion disposed on the rear surface side of the glass layer; a bonding layer interposed between the glass layer and the switch portion; a support portion disposed on a rear surface side of the glass layer and supporting the glass layer; the support portion is a part or the whole of the switch portion, The thickness of the glass layer is 20 μm or more and 150 μm or less, The switch unit includes a plurality of contacts including a contact that can move up and down, When the glass layer is pressed, the glass layer elastically deforms, switching between conductive and non-conductive states of the plurality of contacts.

2. A glass layer; A switch portion disposed on the rear surface side of the glass layer; a resin layer interposed between the glass layer and the switch portion; a support portion disposed on a rear surface side of the glass layer and supporting the glass layer; the support portion is a part or the whole of the switch portion, The thickness of the glass layer is 20 μm or more and 150 μm or less, The switch unit includes a plurality of contacts including a contact that can move up and down, When the glass layer is pressed, the glass layer elastically deforms, switching between conductive and non-conductive states of the plurality of contacts.

3. 3. The switch device according to claim 1, wherein when the glass layer is pressed, the glass layer elastically deforms in a vertical direction by 0.5 mm to 2 mm, switching between conductive and non-conductive states of the plurality of contacts.

4. The switch device according to claim 1 , wherein the support portion is disposed outside the switch portion.

5. The switch device according to claim 1 , further comprising a plurality of the switch sections.

6. The switch device according to claim 5 , wherein the switch portions are arranged two-dimensionally.

7. The switch device according to claim 1 , further comprising an air gap between the glass layer and the switch portion.

8. The switch device according to claim 1 , wherein the switch portion is a membrane switch.

9. The switch device according to claim 1 , wherein the switch portion is a tactile switch.

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