Holding device

Abstract

To suppress local heat generation in a retainer.SOLUTION: A retainer includes: a plate-like member having a first surface orthogonal in a first direction; an internal electrode arranged inside the plate-like member; a terminal member arranged to the plate-like member, the terminal member being capable of conducting electricity to the internal electrode; a terminal-side electrode exposed from the first surface of the plate-like member, the terminal-side electrode being connected to the terminal member; a plurality of first via conductors arranged inside the plate-like member, each first via conductor extending in the first direction to be connected to the terminal-side electrode; and a conductive connection electrode connected to the first via conductor, the conductive connection electrode being electrically connected to the internal electrode. In the retainer, the plurality of first via conductors are arranged side by side in a third direction that intersects a second direction in which current flows through the connection electrode when the current is flown between the terminal member and the internal electrode.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a holding device for holding an object. [Background technology]

[0002] As an example of a holding device, for example, a heating device described in Patent Document 1 below is known. This heating device includes a plate-shaped member (main substrate), an internal electrode (resistance heating element) arranged inside the plate-shaped member, and a terminal side electrode (power receiving electrode) abutting against an electrode terminal unit, and heats an object such as a semiconductor wafer to a predetermined temperature while holding it on one side of the plate-shaped member. In general, the internal electrode is electrically connected to the terminal side electrode through a via conductor. The plate-shaped member is formed by stacking and sintering a plurality of green sheets. At this time, the via conductors are formed by filling through holes provided in each green sheet with a metallization paste and firing the sheets.

[0003] In such a heating device, a large current flows through the via conductor connected to the terminal electrode, which may generate heat. In order to disperse the current and suppress localized heat generation, a number of via conductors have been connected to one terminal electrode, and these via conductors have been distributed over the entire terminal electrode so that the distance between them is large. However, when the current flowing through the via conductors arranged in this manner was measured, it was found that there was a bias in the current flowing through each via conductor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-49964 A Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above situation, an objective of this technology is to optimize the arrangement of multiple via conductors connected to one terminal electrode, thereby effectively dispersing current and suppressing localized heat generation. [Means for solving the problem]

[0006] The holding device of the present disclosure comprises a plate-shaped member having a first surface perpendicular to a first direction, an internal electrode arranged inside the plate-shaped member, a terminal member arranged on the plate-shaped member and capable of passing current through the internal electrode, a terminal side electrode exposed from the first surface of the plate-shaped member and connected to the terminal member, a plurality of first via conductors arranged inside the plate-shaped member, extending in the first direction and connected to the terminal side electrode, and a conductive connection electrode connected to the first via conductors and electrically connected to the internal electrode, wherein the plurality of first via conductors are arranged in a line in a third direction that intersects a second direction in which a current flows through the connection electrode when the current is flowed between the terminal member and the internal electrode. Effect of the Invention

[0007] According to the present disclosure, heat generation in the holding device can be suppressed. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view that illustrates a heating device according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view showing the internal configuration of the heating device. [Diagram 3] FIG. 3 is an enlarged cross-sectional view of a portion of FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a state before a plurality of green sheets are thermocompression-bonded together. [Diagram 5] FIG. 5 is an enlarged plan view showing a part of the first surface of the plate-shaped member. [Figure 6] FIG. 6 is an enlarged cross-sectional view showing a part of the internal configuration of the heating device according to the second embodiment. [Figure 7]FIG. 7 is an enlarged plan view showing a part of the first surface of the plate-shaped member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] [Description of the embodiments of the present disclosure] First, the embodiments of the present disclosure will be listed and described. <1> The holding device disclosed herein comprises a plate-shaped member having a first surface perpendicular to a first direction, an internal electrode arranged inside the plate-shaped member, a terminal member arranged on the plate-shaped member and capable of passing current through the internal electrode, a terminal side electrode exposed from the first surface of the plate-shaped member and connected to the terminal member, a plurality of first via conductors arranged inside the plate-shaped member, extending in the first direction and connected to the terminal side electrode, and a conductive connection electrode connected to the first via conductors and electrically connected to the internal electrode, wherein the plurality of first via conductors are arranged in a line in a third direction that intersects a second direction in which a current flows through the connection electrode when the current is flowed between the terminal member and the internal electrode.

[0010] the above <1> According to the configuration, since the multiple first via conductors are arranged in a line in a third direction intersecting the second direction, the current is distributed to the multiple first via conductors, and each of the first via conductors contributes to the conduction. As a result, local heat generation is effectively suppressed. In this specification, "connection" means that the conductive members in question are in direct contact with each other, and "electrical connection" includes not only that the conductive members in question are in direct contact with each other, but also that they are indirectly connected via another conductive member. In addition, without departing from the gist of this disclosure, "orthogonal" includes those that intersect at an angle of approximately 90 degrees (approximately orthogonal), "parallel" includes those that are approximately parallel, and "circular" includes those that are approximately circular.

[0011] <2> the above <1> The holding device is arranged inside the plate-shaped member, extends in the first direction, is electrically connected to the internal electrode, and has second via conductors connected to the connection electrode, and a plurality of the first via conductors are connected to a region of the terminal side electrode on the second via conductor side when viewed in the first direction.

[0012] the above <2> According to this configuration, the conductive path through each of the first via conductors can be shortened, and the first via conductors can function effectively, thereby suppressing heat generation.

[0013] <3> the above <1> In the holding device, the terminal side electrode has a terminal connection portion exposed from the first surface of the plate-shaped member and an extension portion located inside the plate-shaped member, and a plurality of the first via conductors are connected to the extension portions of the terminal side electrode.

[0014] the above <3> According to this configuration, by abutting the first via conductor against the extension portion rather than the terminal connection portion, the effect of so-called "via push-up," in which the electrical connection between the terminal member and the terminal side electrode is reduced due to unevenness in the terminal side electrode caused by the first via conductor, is reduced.

[0015] <4> the above <3> The holding device is arranged inside the plate-shaped member, extends in the first direction, is electrically connected to the internal electrode, and has second via conductors connected to the connection electrode, and a plurality of the first via conductors are connected to the extension portions of the second via conductors on the terminal side electrode when viewed in the first direction.

[0016] the above <4> According to this configuration, the first via conductor is disposed on the internal electrode side, thereby shortening the conductive path and suppressing heat generation.

[0017] <5> the above <3> or <4> In the holding device, the first via conductors are connected to a region of the extension portion on the terminal connection portion side.

[0018] The terminal side electrode is usually formed thinner than the connection electrode disposed inside the plate-like member, and therefore has a high resistance when electricity is passed therethrough and is prone to generating a large amount of heat. <5> According to the configuration, the distance over which the current flowing from the first via conductor to the terminal electrode is transmitted to the terminal member, ie, the conduction distance within the terminal electrode, is shortened, thereby suppressing heat generation.

[0019] [Details of the embodiment of the present disclosure] Specific examples of the holding device of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is indicated by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. In the following description, the upper side in Figs. 1 to 4 and 6 is referred to as the top (the lower side is referred to as the bottom), and the vertical direction is referred to as the first direction D1. Note that, for multiple identical members, some members may be given reference numerals and the reference numerals of the other members may be omitted.

[0020] [Details of embodiment 1] <Holding device> The holding device 100 according to this embodiment will be described below with reference to Fig. 1 to Fig. 5. The holding device 100 is a heating device that holds an object (e.g., a semiconductor wafer W) and heats it to a predetermined processing temperature (e.g., 400 to 800°C). The holding device 100 is also called a susceptor, and is used as a part of semiconductor manufacturing equipment such as a film forming device (CVD film forming device, sputtering film forming device, etc.) or an etching device (plasma etching device, etc.). As shown in FIG. 1, the holding device 100 includes a plate-like member 10 having a substantially circular plate shape, and a columnar support body 20 having a substantially cylindrical shape extending in the vertical direction.

[0021] <Plate-shaped components> As shown in Fig. 2, the plate-like member 10 has a first surface (lower surface) S1 that faces downward perpendicular to the first direction D1, and a second surface (upper surface) S2 that faces upward perpendicular to the first direction D1. As shown by the two-dot chain lines in Figs. 1 and 2, an object to be held, such as a semiconductor wafer W, is held on the second surface S2. The plate-like member 10 is formed of an insulating material, such as ceramics containing aluminum nitride (AlN) or alumina (Al2O3) as a main component. The main component here means the component with the highest content (weight percentage). The diameter of the plate-like member 10 is, for example, about 100 mm or more and 500 mm or less.

[0022] As shown in Figs. 2 and 3, an internal electrode 50 for heating the plate-shaped member 10 is embedded inside the plate-shaped member 10 on the upper side, i.e., the second surface S2 side. The internal electrode 50 in this embodiment is a heater electrode made of a resistance heating element. The internal electrode 50 is formed of a conductive material such as tungsten or molybdenum. The internal electrode 50 is an electrode extending along a plane parallel to the second surface S2, and is arranged to form, for example, a spiral line pattern when viewed from the first direction D1. The internal electrode 50 is connected to second via conductors 55, which will be described later, at multiple points (for example, two points).

[0023] As shown in FIG. 2, a pair of terminal holes 12 are formed in a circular shape near the center of the first surface S1 of the plate-like member 10. As shown in FIG. 2 and FIG. 3, a terminal electrode 60 is provided above each terminal hole 12. The terminal electrode 60 is formed to include, for example, a metal material and a ceramic material. As the metal material contained in the terminal electrode 60, tungsten, molybdenum, etc. can be used, but it is preferable that the metal material has a thermal expansion coefficient close to the thermal expansion coefficient of the metal material constituting the pellet 72 described later. As the ceramic material contained in the terminal electrode 60, aluminum nitride or alumina can be used, but it is preferable that the ceramic material has a thermal expansion coefficient close to the thermal expansion coefficient of the ceramic material that is the main component of the plate-like member 10. As shown in FIG. 3, the peripheral portion of the lower surface of the terminal electrode 60 enters into the insulating member, and a terminal member 70 described later is connected to a terminal connection portion 62 exposed on the first surface S1 inside the terminal connection portion 62.

[0024] 2, inside the plate-shaped member 10, a connection electrode 51, a first via conductor 53, and a second via conductor 55 are provided between the internal electrode 50 and the terminal electrode 60 to electrically connect them. The connection electrode 51 is an electrode extending on a plane parallel to the first surface S1, and the first via conductor 53 and the second via conductor 55 are linear and extend in a first direction D1. The first via conductor 53 and the second via conductor 55 are arranged at positions that do not overlap each other when viewed from the first direction D1 (at different positions in the horizontal direction).

[0025] 3, the connection electrode 51 according to this embodiment includes a lower connection electrode 51A provided on the lower side of the plate-shaped member 10, i.e., on the terminal electrode 60 side, and an upper connection electrode 51B provided above the lower connection electrode 51A, i.e., on the internal electrode 50 side. The connection electrodes 51 (the lower connection electrode 51A and the upper connection electrode 51B) are partially overlapped with the terminal electrode 60 when viewed from the first direction D1, and extend in the outer circumferential direction of the plate-shaped member 10. The connection electrode 51 is formed to have a thickness larger than that of the terminal electrode 60.

[0026] 2 and 3, the first via conductor 53 according to this embodiment extends in a first direction D1 with its lower end abutting the terminal electrode 60 and its upper end abutting the upper connection electrode 51B, and is connected to the terminal electrode 60, the lower connection electrode 51A, and the upper connection electrode 51B. In this embodiment, the multiple first via conductors 53 are arranged at positions overlapping the terminal connection portion 62 when viewed from the first direction D1. The arrangement of the multiple first via conductors 53 will be described later with reference to FIG. 5.

[0027] 2 and 3, the second via conductor 55 is located on the outer periphery side of the first via conductor 53 in the plate-shaped member 10. The second via conductor 55 according to this embodiment is disposed at a position overlapping a part of the internal electrode 50 when viewed from the first direction D1, and extends in the first direction D1 with its lower end abutting the lower connection electrode 51A and its upper end abutting the internal electrode 50.

[0028] <Columnar support> 1 and 2, etc., is formed of an insulating material such as ceramics mainly composed of aluminum nitride or alumina, similar to the plate-like member 10. The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 90 mm or less, and the height of the columnar support 20 (length in the first direction D1) is, for example, about 100 mm or more and 300 mm or less.

[0029] 2, the plate-like member 10 and the columnar support 20 are arranged so that the first surface S1 of the plate-like member 10 faces the upper surface S5 of the columnar support 20. The columnar support 20 is joined to the vicinity of the center of the first surface S1 of the plate-like member 10 via a joining part 30 formed from a known joining material.

[0030] 2, the columnar support 20 has an insertion hole 22 that opens to the first surface S1 side of the plate-like member 10. The insertion hole 22 is a hole that extends in the first direction D1 and has a circular cross section, and has a substantially constant inner diameter along the extension direction. A plurality of terminal members 70 are inserted into the insertion hole 22.

[0031] As shown in FIG. 2 and FIG. 3, the terminal member 70 includes an electrode terminal 74 and a pellet 72. The electrode terminal 74 is a columnar member having a circular shape when viewed from the first direction D1, and is made of a conductive material such as nickel (Ni). The diameter of the electrode terminal 74 is, for example, about 2 mm or more and 6 mm or less. The pellet 72 is disposed between the upper end of the electrode terminal 74 and the terminal side electrode 60. The pellet 72 is a plate-shaped member having a circular shape when viewed from the first direction D1, and is made of a metal such as tungsten, molybdenum, or kovar. The pellet 72 has a function of reducing the thermal expansion difference between the electrode terminal 74 and the terminal side electrode 60, and is preferably made of a material having a thermal expansion coefficient between the thermal expansion coefficient of the electrode terminal 74 and the thermal expansion coefficient of the terminal side electrode 60. The diameter of the pellet 72 is, for example, about 3 mm or more and 9 mm or less, and the thickness of the pellet 72 is, for example, about 1 mm or more and 6 mm or less. The upper surface of the pellet 72 is joined (brazed) to the terminal connection portion 62 by, for example, a Ni-based (Ni-Cr-based alloy, etc.), Au-based (pure Au, Au-Ni-based alloy, etc.), or Ag-based (pure Ag, etc.) inactive brazing material that does not substantially chemically bond to ceramics, and the lower surface of the pellet 72 is joined to the electrode terminal 74 by, for example, an Ag-based brazing material.

[0032] <Manufacturing method of the holding device> A description will now be given of an example of a method for manufacturing the holding device 100 of this embodiment. The holding device 100 can be manufactured, for example, by preparing the plate-like member 10 and the columnar support 20 and joining them together.

[0033] The method for producing the plate-like member 10 is, for example, as follows. First, an organic solvent such as toluene is added to a mixture containing aluminum nitride powder, yttrium oxide (Y2O3) powder, an acrylic binder, and an appropriate amount of a dispersant and a plasticizer, and the mixture is mixed in a ball mill to produce a slurry for a green sheet. This slurry for a green sheet is formed into a sheet shape using a casting device and then dried to produce multiple green sheets 15 (see FIG. 4).

[0034] Metallization paste is prepared by adding metal powder such as tungsten or molybdenum to a mixture containing aluminum nitride powder, an acrylic binder, and an organic solvent such as terpineol, and kneading the mixture. This metallization paste is applied to the green sheets 15 to form the unsintered conductor layer 59 as shown in FIG. 4. For example, by using a screen printing device to apply the metallization paste in a specific pattern to the surface of each green sheet 15, the unsintered conductor layer 59 that will later become the internal electrode 50, the connection electrode 51, and the terminal side electrode 60 is formed. Furthermore, through holes are formed in the green sheets 15, and the metallization paste is filled in the through holes to form the unsintered conductor layer 59 that will later become the first via conductor 53 and the second via conductor 55.

[0035] After forming the unsintered conductor layer 59 that forms the terminal side electrode 60, a ceramic paste (e.g., a mixture of aluminum nitride, an acrylic binder, and an organic solvent such as terpineol) is applied so as to cover the entire peripheral portion, thereby forming an overcoat layer 89.

[0036] Next, a plurality of green sheets 15 (e.g., 20 sheets) on which the unsintered conductor layer 59 and the overcoat layer 89 are formed are laminated as shown in FIG. 4, and the unsintered conductor layer 59 and the overcoat layer 89 forming the terminal side electrode 60 are pressed into the green sheets 15 and thermocompressed, and the outer periphery is cut as necessary to prepare a green sheet laminate (e.g., 8 mm thick). This green sheet laminate is cut by machining to prepare a disk-shaped molded body, which is degreased, and the degreased body is fired to prepare a fired body, and the surface of the fired body is polished. Through the above steps, the plate-shaped member 10 is produced. The green sheets 15 and the overcoat layer 89 are integrated by firing. Then, the terminal side electrode 60 is formed in such a manner that the peripheral portion is inserted into the inside of the insulating member formed by these, and the central portion that becomes the terminal connection portion 62 is exposed on the first surface S1.

[0037] The columnar support 20 can be produced, for example, as follows. First, an organic solvent such as methanol is added to a mixture containing aluminum nitride powder, yttrium oxide powder, a PVA binder, an appropriate amount of a dispersant, and a plasticizer, and the mixture is mixed in a ball mill to obtain a slurry. This slurry is granulated in a spray dryer to produce a raw material powder. Next, the raw material powder is filled into a rubber mold in which a core corresponding to the insertion hole 22 is placed, and a molded body is obtained by cold isostatic pressing. The obtained molded body is degreased, and the degreased body is further fired. Through the above steps, the columnar support 20 is produced.

[0038] After the plate-like member 10 and the columnar supports 20 are produced, they are joined together. If necessary, the first surface S1 of the plate-like member 10 and the upper surface S5 of the columnar supports 20 are subjected to a lapping process, and then a known bonding agent, which is made into a paste form by mixing, for example, rare earths and an organic solvent, is uniformly applied to at least one of the first surface S1 of the plate-like member 10 and the upper surface S5 of the columnar supports 20, and a degreasing process is performed. Next, the first surface S1 of the plate-like member 10 and the upper surface S5 of the columnar supports 20 are overlapped and heated, thereby joining the plate-like member 10 and the columnar supports 20.

[0039] After joining the plate-like member 10 and the columnar support 20, the pellet 72 is inserted into the insertion hole 22, and the upper surface of the pellet 72 is brazed (950 to 1150°C, 10 to 30 minutes) to the lower surface of each terminal connection portion 62 using, for example, a non-active brazing material (for example, a Ni-based, Au-based, or Ag-based brazing material). In addition, the electrode terminal 74 is inserted into the insertion hole 22, and the upper surface of the electrode terminal 74 is brazed to the lower surface of the pellet 72 using, for example, an Ag-based brazing material. In this manner, the holding device 100 having the above-mentioned configuration is manufactured.

[0040] <Operation of the retention device> In the holding device 100 as described above, when a voltage is applied from a power source not shown to the internal electrode 50 via the terminal member 70, the terminal side electrode 60, the first via conductor 53, the connection electrode 51, and the second via conductor 55, the internal electrode 50, which is made of a resistive heating element, generates heat, and the object (e.g., a semiconductor wafer W) held on the second surface S2 of the plate-like member 10 is heated to a predetermined temperature (e.g., about 400°C to 800°C).

[0041] When a voltage is applied from the terminal member 70 to the internal electrode 50, the current flowing from the internal electrode 50 to the terminal member 70 flows in a direction that connects the connection part of the second via conductor 55 and the connection part of the first via conductor 53 in the connection electrode 51. This direction (the direction in which the current flows in the connection electrode 51 when the current flows between the terminal member 70 and the internal electrode 50) is defined as a second direction D2. The connection electrode 51 is an electrode that extends on a plane that intersects with the first direction D1 (in this embodiment, a plane perpendicular to the first direction D1), and the second direction D2 is a direction that intersects with the first direction D1 (see FIGS. 2 and 3).

[0042] <Arrangement of Multiple First Via Conductors> In the holding device 100 according to this embodiment, a plurality of first via conductors 53 are connected to the terminal electrode 60. This is to prevent the current flowing from the internal electrode 50 to the terminal member 70 from concentrating in the vicinity of the terminal electrode 60, and to disperse the current into a plurality of conductive paths to suppress localized heat generation. The plurality of first via conductors 53 are disposed at approximately the same height (between the terminal electrode 60 and the upper connection electrode 51B) in the first direction D1.

[0043] The arrangement (planar arrangement) of the plurality of first via conductors 53 as viewed from the first direction D1 will be described with reference to FIG. 5. As shown in FIG. 5, the center of the terminal side electrode 60 is exposed in a circular shape inside the terminal hole 12 on the first surface S1 of the plate-like member 10. This exposed portion is the terminal connection portion 62, and the outer peripheral portion of the terminal connection portion 62 is inserted into the insulating member. In other words, the peripheral portion of the lower surface of the terminal side electrode 60 is covered in a doughnut shape by the insulating member, and the inner terminal connection portion 62 is exposed in a circular shape on the first surface S1. In this embodiment, the plurality of first via conductors 53 are connected to the terminal connection portion 62 of the terminal side electrode 60. By connecting the first via conductor 53 directly above the connection portion with the terminal member 70 in this manner, the conductive distance in the terminal side electrode 60 is minimized.

[0044] As shown in Fig. 5, the multiple first via conductors 53 are connected to a region on the second via conductor 55 side of the terminal electrode 60, more specifically, on the internal electrode 50 side of the diameter perpendicular to the second direction D2 in the circular terminal connection portion 62. The multiple first via conductors 53 are arranged in an arc shape along the periphery of the terminal connection portion 62. If the arrangement direction of the multiple first via conductors 53 is defined as a third direction D3, in the holding device according to the present disclosure, the third direction D3 is a direction intersecting the second direction D2. The third direction D3 in the holding device 100 according to this embodiment is a direction along the periphery of the terminal connection portion 62 (see Fig. 5).

[0045] <Effects of this embodiment> As described above, the holding device 100 of this embodiment comprises a plate-shaped member 10 having a first surface (lower surface) S1 perpendicular to a first direction (up-down direction) D1, an internal electrode 50 arranged inside the plate-shaped member 10, a terminal member 70 arranged on the plate-shaped member 10 and capable of passing electricity through the internal electrode 50, a terminal side electrode 60 exposed from the first surface S1 of the plate-shaped member 10 and connected to the terminal member 70, a plurality of first via conductors 53 arranged inside the plate-shaped member 10, extending in the first direction D1 and connected to the terminal side electrode 60, and a conductive connection electrode 51 connected to the first via conductors 53 and electrically connected to the internal electrode 50, and the plurality of first via conductors 53 are arranged in a row in a third direction D3 intersecting a second direction D2 in which a current flows through the connection electrode 51 when a current is passed between the terminal member 70 and the internal electrode 50.

[0046] In the holding device 100, when a voltage is applied from the terminal member 70 to the internal electrode 50, the current from the internal electrode 50 to the terminal electrode 60 flows through the connection electrode 51 along the second direction D2, and flows through the first via conductor 53 that is reached first to the terminal electrode 60. If two first via conductors 53 are arranged side by side in the second direction D2, the current toward these first via conductors 53 flows from the first via that is reached, that is, from one of the first via conductors 53 arranged on the internal electrode 50 side in the second direction D2, to the terminal electrode 60. The other first via conductor 53 located behind one of the first via conductors 53 in the second direction D2 hardly contributes to the conduction, so that even if a plurality of first via conductors 53 are arranged in such an arrangement, the current cannot be dispersed well.

[0047] In the holding device 100 of the present embodiment, the multiple first via conductors 53 are arranged side by side in the third direction D3 intersecting the second direction D2, so that each of the first via conductors 53 contributes to conduction, and the current is dispersed among the multiple first via conductors 53. As a result, localized heat generation is effectively suppressed.

[0048] In addition, the holding device 100 of this embodiment is arranged inside the plate-shaped member 10, extends in a first direction D1 and is electrically connected to the internal electrode 50, and has a plurality of second via conductors 55 connected to the connection electrode 51, and the plurality of first via conductors 53 are connected to the area on the second via conductor 55 side of the terminal connection portion 62 of the terminal side electrode 60 when viewed in the first direction D1.

[0049] In the holding device 100 of this embodiment, the plurality of first via conductors 53 can function effectively while shortening the conductive path through each first via conductor 53. As a result, heat generation is suppressed. In the holding device 100 of this embodiment, the plurality of first via conductors 53 are arranged along the periphery of the terminal connection portion 62 on the second via conductor 55 side when viewed in the first direction D1. In this embodiment, the terminal connection portion 62 is formed in a circular shape, and the first via conductors 53 are arranged in an arc shape along the periphery of the terminal connection portion 62. In this way, the conductive path through each first via conductor 53 can be shortened to suppress heat generation.

[0050] [Details of embodiment 2] The retaining device 200 according to this embodiment will be described below with reference to Fig. 6 and Fig. 7. The retaining device 200 according to this embodiment differs from the terminal side electrodes 60 and the first via conductors 53 according to the first embodiment mainly in the dimensions, shape, and arrangement of the terminal side electrodes 260 and the like, and the arrangement of the first via conductors 253 connected thereto. Since the other basic configurations are the same as those of the first embodiment, in the following description, the same components as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof will be omitted.

[0051] 6, the terminal side electrode 260 according to this embodiment includes a terminal connection portion 262 exposed from the first surface S1 of the plate-shaped member 210 above each terminal hole 12, and an extension portion 264 located inside the plate-shaped member 210. The extension portion 264 extends toward the second via conductor 255 further than the terminal connection portion 262 when viewed in the first direction D1. The peripheral portion of the lower surface of the terminal side electrode 260 including the extension portion 264 is covered with an insulating member, and the terminal connection portion 262 is exposed on the first surface S1 at the center above the terminal hole 12.

[0052] 6, the first via conductor 253 extends in a first direction D1 between the terminal electrode 260 and the upper connection electrode 51B, and is connected to the terminal electrode 260, the lower connection electrode 51A, and the upper connection electrode 51B. On the other hand, the second via conductor 255 according to this embodiment extends in the first direction D1 with its lower end abutting the upper connection electrode 51B and its upper end abutting the internal electrode 50.

[0053] The arrangement (planar arrangement) of the multiple first via conductors 253 etc. as viewed from the first direction D1 will be described with reference to Fig. 7. The terminal side electrode 260 according to this embodiment is provided so as to form a substantially elliptical shape extending from above the terminal hole 12 toward the outer periphery where the second via conductors 255 are arranged as viewed from the first direction D1. At the center of the position overlapping with the terminal hole 12 as viewed from the first direction D1, the terminal connection portion 262 is exposed on the first surface S1.

[0054] As shown in FIG. 7, in this embodiment, a plurality of first via conductors 253 are connected to the extension portion 264 of the terminal side electrode 260. In general, via conductors are formed by filling through holes provided in each green sheet with metallization paste, laminating unsintered conductor layers formed to protrude slightly from the surface of the green sheet, and firing the layers. When the first via conductors thus formed are disposed above the terminal hole 12, the lower end of the first via conductor protrudes into the inside of the terminal hole 12, which may cause unevenness in the terminal side electrode. If unevenness occurs in the terminal side electrode, this may lead to a decrease in the electrical connectivity between the terminal side electrode and the terminal member (this phenomenon is known as "via push-up"). In this embodiment, the first via conductors 253 are connected to a position of the terminal side electrode 260 that is shifted from the connection portion with the terminal member 70, that is, to the extension portion 264 instead of the terminal connection portion 262, thereby reducing the effect of via push-up.

[0055] As shown in FIG. 7, the first via conductors 253 are connected to the extension 264 on the second via conductor 255 side of the terminal electrode 260. More specifically, the first via conductors 253 are connected to a region on the terminal connection portion 262 side of the extension 264. Specifically, the first via conductors 253 are connected to positions where the distance from the periphery on the terminal connection portion 262 side in the direction along the second direction D2 is at least ½ or less, preferably ⅓ or less, of the distance to the extension end of the extension 264. The first via conductors 253 according to this embodiment are arranged in an arc shape along the periphery on the terminal connection portion 262 side of the extension 264, in other words, the periphery of the terminal hole 12, as viewed in the first direction D1. The third direction D3, which is the arrangement direction of the multiple first via conductors 253, is in this embodiment a direction along the periphery of the extension portion 264 on the terminal connection portion 262 side, and is a direction intersecting the second direction D2, which is the direction in which current flows through the connection electrode 51 (see Figure 7).

[0056] <Effects of this embodiment> In the holding device 200 of this embodiment, the terminal side electrode 260 has a terminal connection portion 262 exposed from the first surface S1 of the plate-shaped member 10 and an extension portion 264 located inside the plate-shaped member 10, and a plurality of first via conductors 253 are connected to the extension portions 264 of the terminal side electrode 260.

[0057] In the holding device 200 of this embodiment, the first via conductor 253 is abutted against the extension portion 264 rather than the terminal connection portion 262, thereby reducing the effect of so-called "via push-up," in which the electrical connection between the terminal member 70 and the terminal side electrode 260 is reduced due to unevenness in the terminal side electrode 260 caused by the formation of the first via conductor 253.

[0058] In addition, the holding device 200 of this embodiment is arranged inside the plate-shaped member 210, extends in the first direction D1 and is electrically connected to the internal electrode 50, and is provided with a second via conductor 255 connected to the connection electrode 51, and the multiple first via conductors 253 are connected to the extension portion 264 on the second via conductor 255 side of the terminal side electrode 260 when viewed in the first direction D1.

[0059] In the holding device 200 of this embodiment, the first via conductor 253 is connected to the terminal side electrode 260 on the second via conductor 255 side (the electrical connection position side between the internal electrode 50 and the connection electrode 51) rather than the terminal connection portion 262, thereby keeping the conductive path short.

[0060] In addition, in the holding device 200 according to this embodiment, the first via conductors 253 are connected to a region of the extending portion 264 on the terminal connecting portion 262 side.

[0061] The terminal side electrode 260 is usually formed thinner than the connection electrode 51 disposed inside the plate-like member 210, and therefore has a high resistance when electricity is passed through it, and is prone to generating a large amount of heat. In the holding device 200 according to this embodiment, the first via conductor 253 is connected to the area on the terminal connection portion 262 side, thereby shortening the distance over which the current flowing from the first via conductor 253 to the terminal side electrode 260 is transmitted to the terminal member 70, i.e., the conductive distance within the terminal side electrode 260, and thus heat generation is suppressed.

[0062] <Other embodiments> (1) In the above embodiment, the second via conductor 55, 255 is described as being directly connected to the internal electrode 50. However, the second via conductor (a via conductor connected to the same connection electrode as the first via conductor) may be indirectly connected to the internal electrode via another connection electrode, another via conductor, etc.

[0063] (2) In the above embodiment, the holding device 100 is described as having the lower connection electrode 51A and the upper connection electrode 51B arranged above and below as connection electrodes, but is not limited thereto. The present technology is also applicable to a holding device having only one of the lower connection electrode 51A or the upper connection electrode 51B in the above embodiment as a connection electrode.

[0064] (3) In the above embodiment, the internal electrode 50 is a heater electrode made of a resistance heating element, but is not limited thereto. The internal electrode may be, for example, a chuck electrode for generating electrostatic attraction. In the above embodiment, the internal electrode 50 forms a spiral linear pattern when viewed from the first direction D1, but is not limited thereto. The internal electrode 50 is a linear or planar electrode extending on a plane intersecting the first direction D1, and may form, for example, a concentric linear pattern when viewed from the first direction D1.

[0065] (4) In the above embodiment, the holding device 100 having one heater electrode as the internal electrode 50 has been described, but the present technology can also be applied to a holding device having multiple heater electrodes. For example, in a holding device having multiple heater electrodes as internal electrodes, the present technology can be applied to a common driver electrode connected to the multiple heater electrodes or individual driver electrodes individually connected to each heater electrode as connecting electrodes. In such a configuration, since a large amount of current flows through the common driver electrode, it is particularly useful to apply the present technology to the common driver electrode as a connecting electrode.

[0066] (5) In the above embodiment, the pellet 72 is disposed between the electrode terminal 74 and the terminal connection portion 62. However, the pellet 72 may not be disposed, and the electrode terminal 74 and the terminal connection portion 62 may be joined by a joint formed of a brazing material.

[0067] (6) The materials used to form the components of the heating device in the above embodiment are merely examples, and the components may be formed of other materials. Furthermore, the manufacturing method of the heating device in the above embodiment is merely an example, and various modifications are possible.

[0068] (7) Furthermore, the present disclosure is not limited to the holding devices 100, 200, which are heating devices, but is similarly applicable to other holding devices (e.g., electrostatic chucks, etc.) that include a ceramic member, an internal electrode (heater electrode, chuck electrode, RF electrode, etc.) disposed inside the ceramic member, a via conductor electrically connected to the internal electrode, a terminal member capable of passing electricity through the internal electrode, and a conductive connecting electrode that electrically connects the via and the terminal member, and that hold an object on the surface of the ceramic member. [Explanation of symbols]

[0069] 100,200...holding device, 10,210...plate-shaped member, 12...terminal hole, 15...green sheet, 20...columnar support, 22...insertion hole, 30...joint, 50...internal electrode, 51...connection electrode, 51A...lower connection electrode, 51B...upper connection electrode, 53,253...first via conductor, 55,255...second via conductor, 59...unsintered conductor layer, 60,260...terminal side electrode, 62,262...terminal connection portion, 264...extension, 70...terminal member, 72...pellet, 74...electrode terminal, 89...overcoat layer D1: first direction (vertical direction), D2: second direction, D3: third direction, S1: first surface (lower surface), S2: second surface (upper surface), S5: upper surface, W: semiconductor wafer

Claims

1. a plate-like member having a first surface perpendicular to a first direction; an internal electrode disposed inside the plate-like member; a terminal member disposed on the plate-like member and capable of conducting electricity to the internal electrode; a terminal side electrode having a terminal connection portion exposed from the first surface of the plate-like member and connected to the terminal member; a plurality of first via conductors disposed inside the plate-like member, extending in the first direction and connected to the terminal electrodes; a conductive connection electrode connected to the first via conductor and electrically connected to the internal electrode; the connection electrode is an electrode extending on a plane intersecting the first direction, When a direction intersecting the first direction is defined as a second direction, and a direction intersecting both the first direction and the second direction is defined as a third direction, the first via conductors are arranged side by side in the third direction, and when a current flows between the terminal member and the internal electrode, the current flows through the connection electrode; A holding device, wherein the multiple first via conductors are arranged in an arc shape along the periphery of the terminal connection portion, on the internal electrode side of the circular terminal connection portion relative to a diameter perpendicular to the second direction.

2. a second via conductor disposed inside the plate-like member, extending in the first direction, electrically connected to the internal electrode, and connected to the connection electrode; The holding device according to claim 1 , wherein the first via conductors are connected to a region of the terminal electrode on a side of the second via conductor when viewed in the first direction.

3. a plate-like member having a first surface perpendicular to a first direction; an internal electrode disposed inside the plate-like member; a terminal member disposed on the plate-like member and capable of conducting electricity to the internal electrode; a terminal side electrode exposed from the first surface of the plate-like member and connected to the terminal member; a plurality of first via conductors disposed inside the plate-like member, extending in the first direction and connected to the terminal electrodes; a conductive connection electrode connected to the first via conductor and electrically connected to the internal electrode; the connection electrode is an electrode extending on a plane intersecting the first direction, When a direction intersecting the first direction is defined as a second direction, and a direction intersecting both the first direction and the second direction is defined as a third direction, the first via conductors are arranged side by side in the third direction, and when a current flows between the terminal member and the internal electrode, the current flows through the connection electrode; The terminal electrode is a terminal connection portion exposed from the first surface of the plate-like member; an extension portion located inside the plate-like member; A holding device, wherein the plurality of first via conductors are connected to the extending portion of the terminal side electrode.

4. a second via conductor disposed inside the plate-like member, extending in the first direction, electrically connected to the internal electrode, and connected to the connection electrode; The holding device according to claim 3 , wherein the first via conductors are connected to the extending portion of the terminal electrode on a side of the second via conductor when viewed in the first direction.

5. The holding device according to claim 3 , wherein the first via conductors are connected to a region of the extension portion on a side of the terminal connection portion.

Images