Substrate processing apparatus, semiconductor device manufacturing method and program

Abstract

Provided is a technology in which are provided: a conveyance chamber that includes a conveyance space in which a substrate loaded from a substrate housing container is conveyed; a gas circulation path for connecting one end and the other end of the conveyance space; a fan provided in the gas circulation path or to an end section thereof to circulate the atmosphere in the conveyance space and the gas circulation path; a loading port through which the substrate is loaded into the conveyance space from the substrate housing container; a side surface opening that communicates with the conveyance space and is provided to at least one of two side surfaces, among a plurality of side surfaces forming the conveyance chamber, sandwiching the side surface of the conveyance chamber provided with the loading port; a door provided so as to close the side surface opening; and, a circulation duct fixed to the inner side of the door so as to be movable integrally with the door and provided so as to constitute the gas circulation path when the door is closed.

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, a method for manufacturing a semiconductor device, and a program. [Background technology]

[0002] A substrate processing apparatus used in a manufacturing process of a semiconductor device may include, for example, a load port unit that transfers substrates in and out of a wafer cassette in which the substrates are stored, and a transfer chamber in which the substrates are transferred between the load port unit and a load lock chamber or a substrate processing chamber. Also, a system that circulates clean air or an inert gas within the transfer chamber may be provided to form an airflow of clean air or an inert gas within the transfer chamber (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2017 / 022366 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide a technique capable of improving the maintainability of a transfer chamber equipped with an airflow circulation system. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, a transfer chamber including a transfer space into which the substrate carried in from the substrate container is transferred; a gas circulation path connecting one end and the other end of the transfer space; and a fan provided in the gas circulation path or at an end thereof for circulating an atmosphere in the transfer space and the gas circulation path; an entrance through which the substrate is carried from the substrate container into the transfer space; a side opening communicating with the transfer space, the side opening being provided on at least one of both side surfaces of the transfer chamber sandwiching the side surface of the transfer chamber on which the loading port is provided, among a plurality of side surfaces that define the transfer chamber; A door provided to close the side opening; a circulation duct that is fixed to the inside of the door so as to move integrally with the door and that is provided to form the gas circulation path when the door is in a closed state; A technique is provided that includes: Effect of the Invention

[0006] According to the technology disclosed herein, it is possible to improve the ease of maintenance inside a transfer chamber equipped with an airflow circulation system. [Brief description of the drawings]

[0007] [Figure 1] 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment of the present disclosure. [Diagram 2] 1 is a schematic vertical cross-sectional view of a substrate processing apparatus according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is a diagram illustrating a configuration of a control unit of the substrate processing apparatus according to an embodiment of the present disclosure. [Figure 4] 1 is a schematic perspective view showing a structure of a first transfer chamber and its peripheral mechanisms of a substrate processing apparatus according to an embodiment of the present disclosure. [Diagram 5] 1 is a schematic perspective view showing a state in which a maintenance door is opened in a substrate processing apparatus according to an embodiment of the present disclosure; [Figure 6] 1 is an enlarged perspective view showing a peripheral structure of a connection port of a circulation duct with a maintenance door open in a substrate processing apparatus according to an embodiment of the present disclosure; FIG. [Figure 7] 1 is a schematic perspective view showing a state in which a maintenance door and a circulation duct are removed in a substrate processing apparatus according to an embodiment of the present disclosure. [Figure 8] 1 is a schematic configuration diagram showing a structure of a first transfer chamber and its peripheral mechanism of a substrate processing apparatus according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] <One embodiment of the present disclosure> Hereinafter, one embodiment (first embodiment) of the present disclosure will be described with reference to Figs. 1 to 8 etc. Note that all of the drawings used in the following description are schematic, and the dimensional relationships of the elements, the ratios of the elements, etc. shown in the drawings do not necessarily match those in reality. Furthermore, the dimensional relationships of the elements, the ratios of the elements, etc. do not necessarily match between multiple drawings.

[0009] (1) Configuration of the substrate processing device 1 and 2, the substrate processing apparatus 10 according to the present embodiment includes a first transfer chamber 12 as an atmospheric transfer chamber (EFEM: Equipment Front End Module), load port units 29-1 to 29-3 as a pod opening / closing mechanism connected to the first transfer chamber 12, in which pods 27-1 to 27-3 as substrate storage containers are placed and which open and close the lids of the pods 27-1 to 27-3 to load / unload the substrate 100 into / from the first transfer chamber 12, load lock chambers 14A and 14B as pressure-controlled spare chambers, a second transfer chamber 16 as a vacuum transfer chamber, and processing chambers 18A and 18B for processing the substrate 100. The processing chamber 18A and the processing chamber 18B are separated by a boundary wall 20. In the present embodiment, a semiconductor wafer for manufacturing a semiconductor device, such as a silicon wafer, is used as the substrate 100.

[0010] In this embodiment, the load lock chambers 14A and 14B have the same configuration. Therefore, the load lock chambers 14A and 14B may be collectively referred to as the "load lock chamber 14." Also, in this embodiment, the processing chambers 18A and 18B have the same configuration. Therefore, the processing chambers 18A and 18B may be collectively referred to as the "processing chamber 18."

[0011] 2, a communication part 22 that connects the adjacent chambers is formed between the load lock chamber 14 and the second transfer chamber 16. The communication part 22 is adapted to be opened and closed by a gate valve 24.

[0012] 2, a communication part 26 that communicates the adjacent chambers is formed between the second transfer chamber 16 and the processing chamber 18. The communication part 26 is adapted to be opened and closed by a gate valve 28.

[0013] In the first transfer chamber 12, a first robot 30 is provided as an atmosphere-side transfer device for transferring the substrates 100 between the load lock chamber 14 and the pods 27-1 to 27-3 placed on the load port units 29-1 to 29-3, respectively. The first robot 30 is configured to be capable of transferring a plurality of substrates 100 simultaneously within the first transfer chamber 12. The inside of the first transfer chamber 12 is configured to be purged by circulating a purge gas composed of clean air, inert gas, or the like.

[0014] As the inert gas, for example, nitrogen (N2) gas, argon (Ar) gas, helium (He) gas, neon (Ne) gas, xenon (Xe) gas, or other rare gases can be used. As the inert gas, one or more of these can be used. This also applies to other inert gases described later.

[0015] The lids of the pods 27-1 to 27-3 are opened and closed by openers 135 serving as lid opening and closing mechanisms provided in the load port units 29-1 to 29-3, respectively, and when the lids of the pods 27-1 to 27-3 are open, the pods 27-1 to 27-3 are each configured to communicate with the inside of the first transfer chamber 12 via an opening 134 serving as a loading port provided in the housing 180 of the first transfer chamber 12.

[0016] The load lock chamber 14 is adapted to carry in and out the substrate 100. Specifically, an unprocessed substrate 100 is carried in the load lock chamber 14 by the first robot 30, and the carried in unprocessed substrate 100 is carried out by the second robot 70. On the other hand, a processed substrate 100 is carried in the load lock chamber 14 by the second robot 70, and the carried in processed substrate 100 is carried out by the first robot 30.

[0017] Further, a boat 32 is provided inside the load lock chamber 14 as a support for supporting the substrates 100. The boat 32 is formed to support a plurality of substrates 100 in multiple stages at predetermined intervals and to accommodate the substrates 100 horizontally.

[0018] A gas supply pipe (not shown) communicating with the inside of the load lock chamber 14 is connected to the load lock chamber 14 so that an inert gas can be supplied into the load lock chamber 14. An exhaust pipe 44 communicating with the inside of the load lock chamber 14 is also connected to the load lock chamber 14. A valve 45 and a vacuum pump 46 serving as an exhaust device are provided downstream of the exhaust pipe 44.

[0019] Here, with the communicating parts 22, 26 closed by the gate valves 24, 28, the supply of inert gas from the gas supply pipe is stopped. In this state, when the valve 45 is opened and the vacuum pump 46 is operated, the inside of the load lock chamber 14 is evacuated to a vacuum pressure, and the inside of the load lock chamber 14 can be made to have a vacuum pressure (or reduced pressure). Also, with the communicating parts 22, 26 closed by the gate valves 24, 28, the valve 45 is closed or its opening degree is reduced and an inert gas is introduced into the inside of the load lock chamber 14 from the gas supply pipe, thereby making the inside of the load lock chamber 14 atmospheric pressure.

[0020] 2, an opening 102 is provided as an exit port for loading and unloading the substrate 100 into and from the load lock chamber 14 on the outer peripheral wall. Specifically, the opening 102 is provided on the first robot 30 side of the outer peripheral wall. The first robot 30 supports the substrate 100 on the boat 32 via the opening 102 and removes the substrate 100 from the boat 32 via the opening 102. A gate valve 104 for opening and closing the opening 102 is provided on the outer peripheral wall. A drive device 50 for raising and lowering and rotating the boat 32 via the opening 48 is provided below the load lock chamber 14.

[0021] The second transfer chamber 16 is provided with a second robot 70 as a vacuum-side transfer device that transfers the substrate 100 between the load lock chamber 14 and the processing chamber 18. The second robot 70 includes a substrate transfer section 72 that supports and transfers the substrate 100, and a transfer drive section 74 that raises, lowers, and rotates the substrate transfer section 72. The substrate transfer section 72 is provided with an arm section 76. The arm section 76 is provided with fingers 78 on which the substrate 100 is placed. The fingers 78 are configured to be extendable and retractable in an approximately horizontal direction.

[0022] The movement of the substrate 100 from the load lock chamber 14 to the processing chamber 18 is performed by the second robot 70 moving the substrate 100 supported on the boat 32 into the second transfer chamber 16 via the communication part 22, and then moving the substrate 100 into the processing chamber 18 via the communication part 26. The movement of the substrate 100 from the processing chamber 18 to the load lock chamber 14 is performed by the second robot 70 moving the substrate 100 in the processing chamber 18 into the second transfer chamber 16 via the communication part 26, and then supporting the substrate 100 on the boat 32 via the communication part 22.

[0023] The processing chamber 18 is provided with a first processing section 80, a second processing section 82 disposed at a position farther from the second transfer chamber 16 than the first processing section 80, and a substrate moving section 84 that transports the substrate 100 between the second processing section 82 and the second robot 70. The first processing section 80 includes a first mounting table 92 on which the substrate 100 is placed, and a first heater 94 that heats the first mounting table 92. The second processing section 82 includes a second mounting table 96 on which the substrate 100 is placed, and a second heater 98 that heats the second mounting table 96.

[0024] The substrate moving unit 84 is composed of a moving member 86 that supports the substrate 100, and a moving shaft 88 provided in the vicinity of the boundary wall 20. The substrate moving unit 84 also rotates the moving member 86 toward the first processing unit 80 side, thereby transferring the substrate 100 between the second robot 70 on the first processing unit 80 side. In this manner, the substrate moving unit 84 moves the substrate 100 transported by the second robot 70 to the second mounting table 96 of the second processing unit 82, and also moves the substrate 100 mounted on the second mounting table 96 to the second robot 70.

[0025] Next, the configuration of the first transfer chamber 12 according to this embodiment will be described in detail with reference to FIGS. 2, 4, and 8. In the following description, the side where the load port units 29-1 to 29-3 are provided in the substrate processing apparatus 10 shown in FIG. 2 is referred to as the front side, and the opposite side is referred to as the back side. Also, the right side and the left side are referred to as viewed from the front side of the substrate processing apparatus 10 (first transfer chamber 12). FIG. 4 is a perspective view seen from the upper right side of the front side, and the panel and the load port unit constituting the housing 180 on the front side, the first robot 30, etc. are removed. In this specification, the first transfer chamber 12 is used to mean a unit mainly constituted by the housing 180, its internal configuration, and the connected gas supply / exhaust system, etc., and may also be used to mean an internal space partitioned by the housing 180.

[0026] 2 and 4, the first transfer chamber 12 is provided with a purge gas supply mechanism 162 that supplies a purge gas to an upper space (buffer space) 167, which is a duct formed in the upper portion of the first transfer chamber 12 and around the upper periphery of the transfer space 175, and a clean unit 166 as a gas supply mechanism that removes dust and impurities and supplies a purge gas into the first transfer chamber 12. By supplying an inert gas or the like as a purge gas from the purge gas supply mechanism 162, it is possible to reduce the oxygen concentration in the first transfer chamber 12.

[0027] (Purge gas supply system) 8, the housing 180 is provided with a purge gas supply mechanism 162 that supplies an inert gas into the first transfer chamber 12, and an air supply mechanism (atmosphere intake mechanism) 158 that supplies air into the first transfer chamber 12. The purge gas supply mechanism 162 and the air supply mechanism 158 can be collectively referred to as a purge gas supply system (purge gas supply unit).

[0028] The purge gas supply mechanism 162 is composed of a supply pipe 162a connected to an inert gas supply source, and a mass flow controller (MFC) 162b, which is a flow rate controller (flow rate control section) provided on the supply pipe 162a. An additional valve, which is an opening / closing valve, may be provided on the supply pipe 162a downstream of the MFC 162a.

[0029] The air supply mechanism 158 is configured with an intake damper 158a provided at an opening of the housing 180 that communicates with the atmosphere side. The air supply mechanism 158 mainly configures an air supply system (air supply section).

[0030] (Exhaust system) As shown in FIG. 8, the housing 180 is provided with an exhaust path 152 and a pressure control mechanism 150 that constitute an exhaust system (exhaust section) for exhausting gas (atmosphere) in the first transfer chamber 12. The pressure control mechanism 150 is configured to be able to control the pressure in the first transfer chamber 12 to any pressure by controlling the opening and closing of an adjustment damper 154 and an exhaust damper 156. The pressure control mechanism 150 is configured to include an adjustment damper 154 configured to maintain the pressure in the first transfer chamber 12 at a predetermined pressure, and an exhaust damper 156 configured to fully open or fully close the exhaust path 152. With this configuration, the pressure in the first transfer chamber 12 can be controlled. The adjustment damper 154 is configured to include an auto damper (back pressure valve) 151 configured to open when the pressure in the first transfer chamber 12 becomes higher than a predetermined pressure, and a press damper 153 configured to control the opening and closing of the auto damper 151. The exhaust path 152 downstream of the pressure control mechanism 150 is connected to an exhaust device such as a blower or an exhaust pump. The exhaust device may be, for example, equipment of a facility in which the substrate processing apparatus is installed, or may be a part of the substrate processing apparatus. The exhaust device may also be considered as a part of an exhaust system (exhaust section).

[0031] An oxygen concentration detector 160 is provided in the first transfer chamber 12 as an oxygen concentration sensor that detects the oxygen concentration in the first transfer chamber 12. Also, a moisture concentration detector 161 is provided in the first transfer chamber 12 as a moisture concentration sensor that detects the moisture concentration in the first transfer chamber 12.

[0032] (Clean unit) 4 and 8, clean units 166 are disposed on the left and right sides of the ceiling of the transfer space 175. As shown in Fig. 2, the clean unit 166 is configured with a fan 171 that sends out purge gas in the upper space 167 into the transfer space 175, and a filter unit 170 that is provided on the lower side (transfer space 175 side) of the fan 171 and is configured with a plurality of filters 170-A, 170-B, and 170-C.

[0033] Filter unit 170 is a filter for removing dust and impurities in the purge gas sent out from fan 171. Filter unit 170 may include a moisture removal filter that collects and removes moisture in the gas passing through it. The moisture removal filter may be configured, for example, by a chemical filter that adsorbs moisture. Filter unit 170 may be provided above fan 171, or may be provided above and below fan 171.

[0034] As shown in FIG. 7, the multiple filters 170-A, 170-B, 170-C are each independently arranged to be slidable horizontally, and are configured to be able to be attached / detached through at least one of an opening (not shown) provided on the front panel side of the substrate processing apparatus 10 (the panel surface above the load port units 29-1 to 29-3) or a side opening (maintenance opening 191 that is opened by opening a maintenance door 190 described later) provided on the side side of the first transport chamber 12.

[0035] (Gas circulation structure) 8, the first transfer chamber 12 is provided with a gas circulation path including a transfer space 175 in which a substrate is transferred, a suction outlet 164 provided at one end of the transfer space 175, an opening 165 provided at the other end, a circulation duct 168 and an upper space 167 which constitute a circulation path connecting the suction outlet 164 and the opening 165, and a fan 171 provided on or at an end of the circulation path for circulating the gas (atmosphere) in the first transfer chamber 12 (circulation path and transfer space 175) in a direction from the delivery outlet to the suction outlet. The purge gas introduced into the first transfer chamber 12 circulates in the first transfer chamber 12 including the transfer space 175 due to these configurations.

[0036] (Transportation space) As shown in FIG. 8, the transfer space 175 has the first robot 30 installed therein, and is configured to be able to communicate with the pods 27-1 to 27-3 and the load lock chamber 14 shown in FIG. 1 through the opening 134 shown in FIG. 1 and the opening 102 shown in FIG. 2, respectively. Directly below the horizontal movement arm of the first robot 30, a perforated plate 174 is installed as a flow straightening plate for straightening the flow of the purge gas. The perforated plate 174 has a plurality of holes, and is formed, for example, by a punching panel. The transfer space 175 is divided into an upper first space and a lower second space by the perforated plate 174. The second space is also called a lower space (second buffer space) 176.

[0037] (circulation route) 8, in the lower part of the first transfer chamber 12 (at a position at least lower than the first robot 30), suction units 164 for sucking out and circulating the purge gas that has flowed through the transfer space 175 in the first transfer chamber 12 are arranged on both the left and right sides of the first robot 30. In addition, in the upper part of the transfer space 175 (for example, the ceiling part of the transfer space 175), openings 165 for sending out and circulating the purge gas into the transfer space 175 are arranged on both the left and right sides of the first robot 30.

[0038] An upper space 167 to which a purge gas supply system and an exhaust system are connected is disposed above the transfer space 175 via the opening 165 and the clean unit 170. The lower part of the transfer space 175 and the upper space 167 are connected to the suction part 164 of the circulation duct 168 via a connection port 169.

[0039] In addition, circulation ducts 168 as circulation paths connecting the pair of left and right suction sections 164 and the pair of left and right clean units 166 are also formed on the left and right sides of the first robot 30, respectively.

[0040] Next, a description will be given of the flow of purge gas in the first transfer chamber 12. First, an inert gas serving as a flow-controlled purge gas is introduced from the purge gas supply mechanism 162 into the upper space 167 of the clean unit 166. The purge gas is supplied into the transfer space 175 from the ceiling of the transfer space 175 via the clean unit 166, and forms a downflow in the transfer space 175 from the opening 165 toward the suction part 164.

[0041] The circulation duct 168 is connected to the upper space 167 on the upstream side of the clean unit 166, and constitutes a flow path for circulating the purge gas sucked out from the lower space 176 of the transfer space 175 by the suction part 164 back into the upper space 167. In other words, a circulation path is constituted by the upper space 167 and the circulation duct 168. With this configuration, the purge gas supplied into the first transfer chamber 12 circulates through the transfer space 175 and the circulation duct 168 and the upper space 167, which are the circulation paths.

[0042] As described above, the lower space 176 is formed below the transfer space 175, partitioned by the porous plate 174. It can be said that the flow path including the upper space 167, the lower space 176, and the circulation duct 168 constitutes a gas circulation path. This makes it possible to regulate (rectify) the flow of the purge gas, and also to suppress the return of particles into the first space of the transfer space 175.

[0043] When the conductance of the circulation duct 168 is small, an opening connected to the left and right suction portions 164 may be provided in the lower space 176, and a fan for promoting the circulation of the purge gas may be installed in the opening.

[0044] Next, the maintenance structure of the first transfer chamber 12 according to this embodiment will be described in detail with reference to Fig. 5 to Fig. 7. Fig. 5 and Fig. 6 are perspective views seen from the rear side with the right-side maintenance door open. Fig. 7 is a perspective view seen from the front side with the right-side maintenance door and some panels on the front side removed.

[0045] A maintenance opening 191, which is an opening used for performing maintenance inside the first transfer chamber 12, is provided on each of the left and right side surfaces of the first transfer chamber 12, that is, on both sides of the first transfer chamber 12 between the load port units 29-1 to 29-3 and the first robot 30. In addition, a maintenance door 190 configured to close the maintenance opening 191 as a side opening is provided on each of the both sides of the first transfer chamber 12. The maintenance opening 191 and the maintenance door 190 may be provided on only one of the left and right sides of the first transfer chamber 12. As shown in FIG. 5, the maintenance door 190 is attached to the side surface of the first transfer chamber 12 with one side extending in the vertical direction on the front side of the substrate processing apparatus 10 as a rotation axis. By providing such a maintenance door 190, it is possible to easily access the inside of the first transfer chamber 12. Furthermore, by providing the circulation ducts 168 constituting the gas circulation path on both the left and right side surfaces of the first transfer chamber 12 among the multiple side surfaces that form the first transfer chamber 12, it is possible to increase the degree of freedom in the position of providing the load lock chamber 14 and the opening 102 that communicates the load lock chamber 14 with the first transfer chamber 12. In other words, the positions of the load lock chamber 14 and the opening 102 are not limited by the circulation duct 168.

[0046] Furthermore, as shown in FIG. 5, the circulation duct 168 is fixedly attached to the inside of the maintenance door 190. As a result, the maintenance door 190 and the circulation duct 168 are movable as a unit. With this structure, the circulation duct 168 is connected to the first transfer chamber 12 by opening and closing the maintenance door 190. Also, even if the circulation duct 168 is provided on the side of the first transfer chamber 12, access to the inside of the first transfer chamber 12 can be made easy by simply opening the maintenance door 190 without removing the circulation duct 168. That is, the maintainability can be improved. Also, by making it possible to omit the clearance between the circulation duct 168 and the maintenance door 190, the footprint of the device can be reduced.

[0047] Further, at the upper end of the circulation duct 168, a connection port 169 is provided as an upper end opening that connects to an upper space 167, which is a space on the upstream side of the clean unit 166. The connection port 169 is provided to face the opening of the upper space 167, and when the maintenance door 190 is closed, the connection port 169 and the upper space 167 are connected to each other. Here, the upper end of the maintenance opening 191 and the upper end of the circulation duct 168 are provided to extend at least to a height where the opening of the upper space 167 connected to the circulation duct 168 is provided. By opening and closing the maintenance door 190, the connection port 169 of the circulation duct 168 can be pressed against the opening of the upper space 167 and brought into close contact, making it easy to seal the connection of the openings.

[0048] Also, a sealing member (sealing member, sealing portion) 192 made of, for example, elastic resin or rubber is disposed on the edge of the connection port 169. As a result, when the maintenance door 190 is closed, the connection port 169 of the circulation duct 168 can be pressed against the opening of the upper space 167 to be tightly attached, so that the space between the connection port 169 and the upper space 167 is sealed, and the purge gas in the circulation duct 168 can be circulated efficiently without leaking. Also, it is possible to prevent particles from entering from the outside. The sealing member may be provided on the edge of the opening of the upper space 167 to which the connection ports 169 are respectively connected.

[0049] At the lower end of the circulation duct 168, there is provided an suction section 164 as a lower end opening that connects to the lower space 176. The suction section 164 is provided to face the opening of the lower space 176, and when the maintenance door 190 is closed, the suction section 164 and the lower space 176 are connected to each other.

[0050] A sealing member 193 is provided as a second sealing portion at the edge of the suction portion 164 of the circulation duct 168, and the circulation duct 168 is connected to the opening of the lower space 176 via the sealing member 193 when the maintenance door 190 is closed. As in the case of the connection portion of the connection port 169 of the circulation duct 168, even when the circulation duct 168 is separated from the opening of the lower space 176 by opening and closing the maintenance door 190, the purge gas in the lower space 176 can be discharged to the circulation duct 168 without leakage and circulated efficiently. In addition, the inflow of particles from the outside can be prevented. The sealing member 193 may be provided at the edge of the opening of the lower space 176 to which the suction portions 164 are respectively connected.

[0051] Furthermore, since the maintenance door 190 in this embodiment is configured to open and close horizontally around one side extending in the vertical direction of the substrate processing apparatus 10 as a rotation axis, an operator can safely open and close the door even if the weight is large due to the circulation duct 168 being integrated therewith. Furthermore, when the door is open, the open state can be maintained in a safe condition.

[0052] A locking mechanism is provided that presses the maintenance door 190 against the side of the first transfer chamber 12 (the housing 180 that includes the first transfer chamber 12 inside) when the maintenance door 190 is in a closed state. The locking mechanism may use a mechanism that uses a screw, a spring, or a bar structure that applies pressure by the principle of leverage. This makes it possible to more reliably ensure a sealed state between the upper space 167 and the opening of the circulation duct 168.

[0053] As shown in Figs. 4 and 7, the filter unit 170 is disposed at a height where the maintenance opening 191 and the circulation duct 168 extend. When the maintenance door 190 is opened and the circulation duct 168 moves, access to the filter unit 170 becomes easy. In other words, maintainability is improved. Also, as shown in Fig. 7, the side surfaces of the multiple filters 170-A, 170-B, and 170-C constituting the filter unit 170 face (are exposed to) the maintenance opening 191. With the maintenance door 190 open, attachment and detachment of the filters 170-A, 170-B, and 170-C becomes even easier.

[0054] 7, in this embodiment, multiple filters 170-A, 170-B, and 170-C that make up filter unit 170 can be slid horizontally and independently installed / removed through maintenance opening 191. With maintenance door 190 open, filters 170-A, 170-B, and 170-C can be easily installed and removed.

[0055] 8, the maintenance door 190 and the circulation duct 168 are provided with windows (transparent windows, peepholes) 195, 196, respectively, through which the inside of the transfer space 175 can be visually observed. Since the inside of the transfer space 175 can be visually observed even when the maintenance door 190 is closed, ease of maintenance can be improved.

[0056] 3, the substrate processing apparatus 10 includes a controller 120 as a control unit. The controller 120 is configured as a computer including a CPU (Central Processing Unit) 121A, a RAM (Random Access Memory) 121B, a storage device 121C, and an I / O port 121D.

[0057] The RAM 121B, the storage device 121C, and the I / O port 121D are configured to be able to exchange data with the CPU 121A via an internal bus 121E. The controller 120 is connected to an input / output device 122 configured as, for example, a touch panel.

[0058] The storage device 121C is composed of, for example, a flash memory, a HDD (Hard Disk Drive), etc. A control program for controlling the operation of the substrate processing apparatus, a process recipe in which the procedures and conditions of the substrate processing described later are described, etc. are readably stored in the storage device 121C. The process recipe is a combination of procedures in the substrate processing step described later that are executed by the controller 120 to obtain a predetermined result, and functions as a program. Hereinafter, the process recipe, the control program, etc. are collectively referred to simply as a program. In addition, the process recipe is also simply referred to as a recipe. In this specification, when the word program is used, it may include only a recipe, only a control program, or both. The RAM 121B is configured as a memory area (work area) in which the programs, data, etc. read by the CPU 121A are temporarily stored.

[0059] The I / O port 121D is connected to the fan 171, the first robot 30, the second robot 70, the drive unit 50, the gate valve 24, the gate valve 28, the gate valve 104, the purge gas supply mechanism 162, the valve 45, the vacuum pump 46, the substrate moving unit 84, the first heater 94, the second heater 98, etc.

[0060] The CPU 121A is configured to read and execute a control program from the storage device 121C, and also to read a recipe from the storage device 121C in response to an input of an operation command from the input / output device 122, etc. The CPU 121A is configured to be capable of controlling the transport operation of the substrate 100 by the first robot 30, the second robot 70, the drive device 50, and the substrate moving unit 84, the purge gas supply and circulation operation in the first transport chamber 12 by the purge gas supply mechanism 162 and the fan 171, the opening and closing operations of the gate valve 24, the gate valve 28, and the gate valve 104, the flow rate and pressure adjustment operation by the valve 45 and the vacuum pump 46, the temperature adjustment operation by the first heater 94 and the second heater 98, etc., in accordance with the contents of the read recipe.

[0061] The controller 120 can be configured by installing the above-mentioned program stored in an external storage device (for example, a magnetic disk such as a hard disk, an optical disk such as a CD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory) 123 into a computer. The storage device 121C and the external storage device 123 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. When the term recording media is used in this specification, it may include only the storage device 121C alone, only the external storage device 123 alone, or both. The program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using the external storage device 123.

[0062] (2) Substrate processing Next, a description will be given of a method for manufacturing a semiconductor device using the substrate processing apparatus 10, that is, a processing step (procedure) for the substrate 100. Note that each component of the substrate processing apparatus 10 is controlled by the controller 120 as described above.

[0063] First, the lids of the pods 27-1 to 27-3 placed on the load port units 29-1 to 29-3 are opened by the opening / closing mechanisms of the load port units 29-1 to 29-3. After that, the first robot 30 transfers the substrates 100 stored in the pods 27-1 to 27-3 into the first transfer chamber 12. At this time, an inert gas is introduced into the first transfer chamber 12 as a purge gas supplied from the purge gas supply mechanism 162, and the first transfer chamber 12 is purged by circulating the purge gas through the clean unit 166 and the circulation duct 168.

[0064] Next, the pressure inside the load lock chamber 14 is returned to atmospheric pressure, and then the gate valve 104 is opened. Specifically, an inert gas is supplied from a gas supply pipe into the load lock chamber 14. In this manner, the pressure inside the load lock chamber 14 is returned to atmospheric pressure, and then the gate valve 104 is opened.

[0065] Next, the substrate 100 is carried into the load lock chamber 14. Specifically, the first robot 30 carries the substrate 100 carried into the first transfer chamber 12 into the load lock chamber 14, and places the substrate 100 on the boat 32 inside the chamber.

[0066] Next, after closing the gate valve 104, the inside of the load lock chamber 14 is evacuated to a vacuum pressure. Specifically, after the boat 32 supports a predetermined number of substrates 100, the valve 45 of the exhaust pipe 44 is opened and the inside of the load lock chamber 14 is evacuated by the vacuum pump 46. In this manner, the inside of the load lock chamber 14 is evacuated to a vacuum pressure. At this time, the second transfer chamber 16 and the processing chamber 18 are evacuated to a vacuum pressure.

[0067] Next, the substrate 100 is transferred from the load lock chamber 14 to the processing chamber 18. Specifically, first, the gate valve 24 is opened. At this time, the driving device 50 raises and lowers the boat 32 so that the substrate 100 supported by the boat 32 can be removed by the second robot 70. Furthermore, the driving device 50 rotates the boat 32 so that the substrate removal port of the boat 32 faces the second transfer chamber 16 side.

[0068] The second robot 70 extends the fingers 78 of the arm portion 76 toward the boat 32, and places the substrate 100 on these fingers 78. After the fingers 78 are retracted, the arm portion 76 is rotated so as to face the processing chamber 18. Next, the fingers 78 are extended, and the substrate 100 is carried into the processing chamber 18 via the communication portion 26 with the gate valve 28 opened.

[0069] In the processing chamber 18, the substrate 100 placed on the finger 78 is placed on the first mounting table 92 of the first processing section 80, or is delivered to a moving member 86 waiting on the side of the first processing section 80. After receiving the substrate 100, the moving member 86 rotates toward the second processing section 82 and places the substrate 100 on the second mounting table 96.

[0070] Then, in the processing chamber 18, a predetermined process such as an ashing process is performed on the substrate 100. During the predetermined process, the substrate 100 is heated by a heater or by reaction heat generated by the process, and thereby the temperature of the substrate 100 increases.

[0071] Next, the processed substrate 100 is transferred from the processing chamber 18 to the load lock chamber 14. The transfer (loading) of the substrate 100 from the processing chamber 18 to the load lock chamber 14 is performed in the reverse order to the operation of loading the substrate 100 into the processing chamber 18. At this time, a vacuum pressure state is maintained inside the load lock chamber 14.

[0072] When the processed substrates 100 are carried into the load lock chamber 14 and the substrates 100 are supported in multiple stages at predetermined intervals in the boat 32, the gate valve 24 is closed and the pressure inside the load lock chamber 14 is made atmospheric. Specifically, an inert gas is supplied into the load lock chamber 14 from a gas supply pipe. In this way, the pressure inside the load lock chamber 14 is made atmospheric with the inert gas.

[0073] Next, the controller 120 controls the driving device 50 to rotate the boat 32 so that the substrate removal port of the boat 32 faces the first transfer chamber 12 side.

[0074] Next, the gate valve 104 is opened, and the substrate 100 is transferred from the load lock chamber 14 to the atmosphere. Specifically, the substrate 100 is transferred from the load lock chamber 14 with the gate valve 104 open to the first transfer chamber 12 by using the first robot 30.

[0075] Next, the lids of the pods 27-1 to 27-3 placed on the load port units 29-1 to 29-3 are opened by the opening / closing mechanisms of the load port units 29-1 to 29-3. Thereafter, the first robot 30 carries the substrate 100 removed from the load lock chamber 14 into the pods 27-1 to 27-3. In this manner, the transport operation of the substrate 100 is completed.

[0076] <Other embodiments of the present disclosure> In the above-described embodiment, the substrate processing apparatus 10 is an annealing apparatus. However, the substrate processing apparatus of the present disclosure is not limited to an annealing apparatus. That is, the present disclosure can be applied to a substrate processing apparatus in which the temperature of the substrate rises in the processing chamber, regardless of the processing content in the processing chamber. The substrate processing apparatus may be, for example, an apparatus that performs other processing such as a film formation process, an etching process, a diffusion process, an oxidation process, a nitriding process, or an ashing process.

[0077] In the above-described embodiment, the substrate as the object to be transported is the substrate 100. However, the substrate as the object to be transported is not limited to the substrate 100. In other words, the substrate as the object to be transported in the present disclosure may be a photomask, a printed wiring board, a liquid crystal panel, or the like.

[0078] In the above-described embodiment, the substrate processing apparatus 10 has a plurality of substrate processing chambers 18A, 18B. However, the substrate processing apparatus may have at least one substrate processing chamber.

[0079] As described above, the present disclosure can be implemented in various forms, and the technical scope of the present disclosure is not limited to the above-mentioned embodiment. For example, the configuration of the substrate processing apparatus 10 described in the above-mentioned embodiment (e.g., the configuration of the processing chambers 18A, 18B, etc.) is merely a specific example, and it goes without saying that various changes can be made without departing from the gist of the present disclosure. [Explanation of symbols]

[0080] 10 Substrate processing equipment 12 First Transport Room 27-1~27-3 Pod (substrate container) 100 Substrates 134 Opening (loading entrance) 171 Fans 175 Transport Space 168 Circulation Duct 190 Maintenance Door 191 Maintenance opening (side opening)

Claims

1. a transfer chamber including a transfer space into which the substrate carried in from the substrate container is transferred; a gas circulation path connecting one end and the other end of the transfer space; a fan provided in the gas circulation path or at an end thereof for circulating an atmosphere in the transfer space and the gas circulation path; an entrance through which the substrate is carried from the substrate container into the transfer space; a side opening communicating with the transfer space, the side opening being provided on at least one of both side surfaces of the transfer chamber sandwiching the side surface of the transfer chamber on which the loading port is provided, among a plurality of side surfaces that define the transfer chamber; A door provided to close the side opening; a circulation duct that is fixed to the inside of the door so as to move integrally with the door and that is provided to form the gas circulation path when the door is closed; Equipped with a buffer space constituting the gas circulation path is provided above the transfer space via the fan, and an upper end of the side opening and an upper end of the circulation duct are provided to extend at least to a height at which an opening of the buffer space connected to the circulation duct is provided. Substrate processing equipment.

2. a sealing member is provided on at least one of an edge of an upper end opening of the circulation duct and an edge of an opening of the buffer space connected to the circulation duct; The circulation duct is connected to the buffer space via the sealing member when the door is closed. The substrate processing apparatus according to claim 1 .

3. A filter is provided above or below the fan, and the filter is disposed at a height where the side opening and the circulation duct extend. The substrate processing apparatus according to claim 1 .

4. A side surface of the filter faces the side opening. The substrate processing apparatus according to claim 3 .

5. The filter is configured to be removable through the side opening by moving in a horizontal direction. The substrate processing apparatus according to claim 4 .

6. A purge gas supply system for supplying a purge gas is connected to the buffer space. The substrate processing apparatus according to any one of claims 1 to 5.

7. The door is configured to be opened and closed horizontally around a rotation axis arranged vertically. The substrate processing apparatus according to any one of claims 1 to 5.

8. Among the plurality of side surfaces forming the transfer chamber, a side surface facing the side surface of the transfer chamber in which the carry-in port is provided is provided with a carry-out port through which the substrate is carried out from within the transfer space. The substrate processing apparatus according to claim 1 .

9. A second buffer space constituting the gas circulation path is provided at a lower portion of the transfer space. The substrate processing apparatus according to claim 1 .

10. a second sealing portion is provided on at least one of an edge portion of a lower end opening of the circulation duct and an edge portion of an opening of the second buffer space connected to the circulation duct, and the circulation duct is connected to the opening of the second buffer space via the second sealing portion when the door is closed; The substrate processing apparatus according to claim 9 .

11. A second buffer space constituting the gas circulation path is provided at a lower portion of the transfer space. The substrate processing apparatus according to claim 1 .

12. a second sealing portion is provided on at least one of an edge portion of a lower end opening of the circulation duct and an edge portion of an opening of the second buffer space connected to the circulation duct, and the circulation duct is connected to the opening of the second buffer space via the second sealing portion when the door is closed; The substrate processing apparatus of claim 11 .

13. The door and the circulation duct are provided with transparent windows through which the inside of the transfer space can be viewed. The substrate processing apparatus according to claim 1 .

14. a transfer chamber including a transfer space into which the substrate is transferred; a gas circulation path connecting one end and the other end of the transfer space; a fan provided in the gas circulation path or at an end thereof; an entrance through which the substrate is carried into the transfer space from a substrate storage container; a side opening communicating with the transfer space, the side opening being provided on at least one of both side surfaces of the transfer chamber sandwiching the side surface of the transfer chamber on which the loading port is provided, among a plurality of side surfaces that define the transfer chamber; A door provided to close the side opening; a circulation duct that is fixed to the inside of the door so as to move integrally with the door and that is provided to form the gas circulation path when the door is closed; a buffer space constituting the gas circulation path is provided above the transfer space via the fan, and an upper end of the side opening and an upper end of the circulation duct are provided to extend at least to a height at which an opening of the buffer space connected to the circulation duct is provided, the substrate processing apparatus comprising: a step of circulating an atmosphere in the transfer space and the gas circulation path by the fan; carrying the substrate accommodated in the substrate accommodation container into the transfer space through the entrance while the atmosphere in the transfer space is circulated by the fan; and transporting the substrate within the transport space.

15. a transfer chamber including a transfer space into which the substrate is transferred; a gas circulation path connecting one end and the other end of the transfer space; a fan provided in the gas circulation path or at an end thereof; an entrance through which the substrate is carried into the transfer space from a substrate storage container; a side opening communicating with the transfer space, the side opening being provided on at least one of both side surfaces of the transfer chamber sandwiching the side surface of the transfer chamber on which the loading port is provided, among a plurality of side surfaces that define the transfer chamber; A door provided to close the side opening; a circulation duct that is fixed to the inside of the door so as to move integrally with the door and that is provided to form the gas circulation path when the door is closed; a buffer space constituting the gas circulation path is provided above the transfer space via the fan, and an upper end of the side opening and an upper end of the circulation duct are provided to extend at least to a height at which an opening of the buffer space connected to the circulation duct is provided, the substrate processing apparatus comprising: a step of circulating an atmosphere in the transfer space and the gas circulation path by the fan; carrying the substrate accommodated in the substrate accommodation container into the transfer space through the entrance while the atmosphere in the transfer space is circulated by the fan; transporting the substrate within the transport space; A program for causing a computer to execute the above-mentioned substrate processing apparatus.

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