Sensor Assembly and Valve Apparatus
Patent Information
- Application Number
- JP2023535651
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-12-29
- Filing Date
- 2021-12-15
- Publication Date
- 2025-03-05
- Estimated Expiration
- 2041-12-15
Smart Images

Figure 0007640702000001 
Figure 0007640702000002 
Figure 0007640702000003
Abstract
Description
[Technical field]
[0001] This application claims the benefit of priority to two Chinese patent applications, namely, Chinese patent application filed with the China Patent Office on December 15, 2020, bearing application number 202011478788.9 and titled "Sensor Assembly and Valve Apparatus", and Chinese patent application filed with the China Patent Office on December 29, 2020, bearing application number 202011589518.5 and titled "Sensor Assembly and Valve Apparatus", the contents of which are incorporated herein by reference in their entireties.
[0002] The present invention relates to the technical field of sensing, and in particular to a sensor assembly and a valve device to which the same is applied. [Background technology]
[0003] As shown in FIG. 24, a conventional sensor assembly 100 includes a pressure sensor element 130, an electronic circuit board 120, and a temperature sensor element 170. The sensor assembly 100 is configured to deliver fluid to a surface of the pressure sensor element 130 that senses pressure through an inlet opening 175 of an open fluid-tight passage, while isolating the temperature sensor 170 and electrical leads 160 from the fluid through a closed fluid-tight passage. The electrical leads 160 extend within the elongated tubular element 165 and are connected laterally through holes in the base to the electronic circuit board 120 .
[0004] A sensor assembly constructed in this manner has a large number of parts, a complex assembly process, and high manufacturing costs. Summary of the Invention [Means for solving the problem]
[0005] An object of the present invention is to provide a sensor assembly and a valve device which have a simple structure and contribute to reducing manufacturing costs.
[0006] In order to achieve the above object, the present invention is as follows. That is, it is a sensor assembly that includes a housing, a temperature sensor unit including a temperature sensing portion, a pressure sensor unit including a pressure sensing portion, a circuit unit, and a detection passage, wherein the temperature sensing portion is provided within the detection passage and is capable of converting the temperature within the detection passage into an electrical signal, and the pressure sensing portion is capable of converting the pressure within the detection passage into an electrical signal. The temperature sensor unit further includes a conductive portion that electrically connects the temperature sensing portion and the circuit unit, and the sensor assembly further includes a connector including an insertion pin and a connector housing, the insertion pin being electrically connected to the circuit unit, the housing being fixedly connected to the connector housing, the pressure sensor unit being positionally restricted between a bottom wall of the housing and the connector housing, the connector housing including a position limiting portion that is capable of abutting against an upper end surface of the pressure sensor unit.
[0007] The present invention further discloses a valve device including a valve body and a sensor assembly, the valve body having a fluid passage, the detection passage communicating with the fluid passage, and the sensor assembly being the sensor assembly described above.
[0008] In the sensor assembly and valve device of the present invention, the sensor assembly includes a pressure sensor unit, a temperature sensor unit, a circuit unit, and a connector, the housing is fixedly connected to the connector housing, and the pressure sensor unit and the circuit unit are configured to be positionally restricted between the bottom wall of the housing and the connector housing, thereby reducing the number of parts, simplifying the structure, and contributing to reducing manufacturing costs. [Brief description of the drawings]
[0009] [Figure 1] FIG. 1 is a three-dimensional schematic diagram of a sensor assembly according to a first embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded view of the sensor assembly shown in FIG. [Diagram 3] FIG. 2 is a front view of the sensor assembly shown in FIG. [Figure 4]FIG. 4 is a cross-sectional view of the structure shown in FIG. 3 taken along line A-A. [Diagram 5] 3 is a three-dimensional schematic view of an assembly consisting of the sealing unit and the first segment in FIG. 2, viewed from one direction. [Figure 6] 3 is a three-dimensional schematic view of an assembly consisting of the sealing unit and the first segment in FIG. 2, seen from another direction. [Figure 7] FIG. 6 is a top view of FIG. [Figure 8] FIG. 8 is a cross-sectional view of the structure shown in FIG. 7 taken along line A-A. [Figure 9] 3 is a three-dimensional schematic diagram of an assembly consisting of the base and the second segment in FIG. 2 as viewed from one direction. [Figure 10] FIG. 3 is a three-dimensional schematic view of the connector in FIG. 2. [Figure 11] FIG. 5 is a cross-sectional view of a sensor assembly according to a second embodiment of the present invention. [Figure 12] 12 is a three-dimensional schematic diagram of the base in FIG. 11 as viewed from one direction. [Figure 13] 12 is an enlarged view showing a partial structure of the base in FIG. 11. [Figure 14] FIG. 2 is a cross-sectional view of a pressure sensor unit used in the first embodiment of the present invention. [Figure 15] FIG. 11 is a cross-sectional view of a sensor assembly according to a third embodiment of the present invention. [Figure 16] 16 is a three-dimensional schematic diagram of the base in FIG. 15 as viewed from one direction. [Figure 17] FIG. 17 is a bottom view of the base in FIG. 16. [Figure 18] FIG. 18 is a cross-sectional view of the structure shown in FIG. 17 taken along line A-A. [Figure 19] FIG. 11 is a cross-sectional view of a pressure sensor unit used in a second embodiment of the present invention. [Figure 20] FIG. 10 is a cross-sectional view of a sensor assembly according to a fourth embodiment of the present invention. [Figure 21] FIG. 13 is an exploded view of a sensor assembly according to a fifth embodiment of the present invention. [Figure 22] FIG. 13 is a cross-sectional view of a sensor assembly according to a fifth embodiment of the present invention. [Diagram 23] 23 is an enlarged view showing a partial structure of a portion B in FIG. 22. [Figure 24] FIG. 1 is a schematic diagram of a sensor assembly in the prior art. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] The present invention will be further described below in conjunction with the drawings and specific embodiments.
[0011] The terms "first", "second", and the like used in the specification and claims of this application do not denote any order, quantity or importance, but are used only to distinguish elements. Similarly, the terms "a" or "one" do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise specified, terms such as "front," "back," "left," "right," "upper," "lower," and the like, used in this application are for convenience of description only and are not intended to be limited to a particular location or spatial orientation. Terms such as "comprise" or "including" are open-ended and mean that the element appearing before "comprise" or "including" covers the element appearing after "comprise" or "including" and equivalents thereof, but do not exclude that the element appearing before "comprise" or "including" may also include other elements. In this application, when "plurality" appears, it means two or more.
[0012] 1 to 16, a sensor assembly 100 according to the present invention includes a pressure sensor unit 1, a temperature sensor unit 2, a circuit unit 4, a connector 5, a sealing unit 6, and a housing 9. The circuit unit 4 is provided on one side of the pressure sensor unit 1, and the sealing unit 6 is provided on the other side of the pressure sensor unit 1. 1 to 10, the circuit unit 4 is provided above the pressure sensor unit 1, the sealing unit 6 is provided below the pressure sensor unit 1, and the temperature sensor unit 2 and the pressure sensor unit 1 are electrically connected to the circuit unit 4. The housing 9 and the connector 5 are fixedly connected to each other and form an accommodating cavity 59 , the pressure sensor unit 1 and the circuit unit 4 are disposed in the accommodating cavity 59 , and the sensor assembly 100 has a detection passage 101 . The temperature sensor unit 2 includes a temperature sensing part 21, at least a part of which is disposed within the detection passage 101, and the temperature sensing part 21 is capable of converting the temperature within the detection passage 101 into an electrical signal. The temperature sensing part 21 is a thermistor, but the type of the temperature sensing part 21 in the present invention is not limited to this. The pressure sensor unit 1 includes a pressure-sensitive portion 20 and a main body portion 10, the main body portion 10 being a ceramic base. The pressure-sensitive portion 20 is connected to the main body portion 10, and is capable of converting the pressure in the detection passage 101 into an electrical signal. The accommodating cavity 59 includes an electric control cavity 591 , the circuit unit 4 is disposed in the electric control cavity 591 , and the electric control cavity 591 is isolated from the detection passage 101 . In this embodiment, the sealing unit 6 is disposed between the housing 9 and the pressure sensor unit 1 . The sealing unit 6 includes a sealing portion 61 which is pressed between the pressure sensor unit 1 and the housing 9 such that the sealing portion 61 is in sealing contact with the pressure sensor unit 1 and the sealing portion 61 is in sealing contact with the housing 9 . As a result, the working medium in the detection passage 101 cannot enter the electronic control cavity 591, and the space in which the circuit unit 4 is provided is sealed by a single sealing unit 6. Since the circuit unit 4 does not come into contact with the working medium to be detected, it is possible to simplify the structure while reliably ensuring sealing performance.
[0013] The temperature sensor unit 2 further includes a conductive portion 22 and a base 3 . This conductive portion 22 electrically connects the temperature sensing portion 21 and the circuit unit 4, and at least a portion of the conductive portion 22 is connected to the base 3 by injection molding, and at least a portion of the sealing portion 61 is disposed between the base 3 and the pressure sensor unit 1.
[0014] 5 to 8, in this embodiment, the sealing unit 6 includes a sealing portion 62 and a metal frame 61. The main material of the sealing portion 62 is a rubber material, and the sealing portion 62 is injection molded using the metal frame 61 as an insert, and the metal frame 61 has an annular shape. Along the radial direction of the sealing unit 6, the outer edge of the metal frame 61 is aligned with the outer edge of the sealing portion 62, and this alignment allows for a certain degree of assembly error, and it is sufficient if the assembly error is controlled within 1 mm. The sealing portion 62 is provided along the height direction of the sealing unit 6 so as to protrude from the surface of the metal frame 61 . This allows the pressure sensor unit 1 to come into contact with the metal frame 61 by compressing the sealing portion 62, and the metal frame 61 presses the sealing portion 62 against the bottom wall side of the housing 9.
[0015] The sealed unit 6 has a first through hole 63 , and the temperature sensing portion 21 is electrically connected to the circuit unit 4 by a conductive portion 22 , and the conductive portion 22 includes a first segment 221 . One end of this first segment 221 is electrically connected to the circuit unit 4 through the first through hole 63, and the other end of the first segment 221 is formed with a first flange portion 23 having an outer diameter larger than the hole diameter of the first through hole 63. This forms a labyrinth structure between the sealing portion 62 and the first segment 221 of the conductive portion 22, improving the sealing performance.
[0016] The conductive portion 22 further includes a second segment 222 and a third segment 223 . The second segment 222 is provided between the first segment 221 and the third segment 223 and is electrically connected to the first segment 221 and the third segment 223. In this embodiment, the second segment 222 is connected to the base 3 by injection molding, and is electrically connected to the first segment 221 while being in elastic contact therewith. In this embodiment, an arc-shaped ridge 220 is formed at one end of the second segment 222 by bending or punching, and this arc-shaped ridge 220 has a certain elasticity, and a flat portion 230 is formed at the other end of the second segment 222, and the first flange portion 23 of the first segment 221 abuts against and is electrically connected to the arc-shaped ridge 220, and the third segment 223 is welded and fixed to the flat portion 230. Then, a through hole can be formed in this flat portion 230 and the third segment 223 can be inserted into the through hole and then fixed by welding, so that the flat portion 230 penetrates into a corresponding area of the internal cavity of the base 3 . This allows the insertion end of the third segment 223 to be straight, simplifying the structure. The third segment 223 is fixedly connected to the temperature sensing portion 21, and the temperature sensing portion 21 is connected to one end of the third segment 223.
[0017] 4 and 9, a portion of the second segment 222 is fixed to the base 3 by injection molding, and the base 3 has a second flange portion 31 and a cylindrical portion 32. The second flange portion 31 has a larger outer edge dimension than the cylindrical portion 32, and is arranged to protrude from the cylindrical portion 32, with the upper end surface of the second flange portion 31 abutting the lower end surface of the sealed unit 6, the lower end surface of the second flange portion 31 contacting the bottom wall of the housing 9, and the upper end surface of the sealed unit 6 abutting and sealingly connected to the lower end surface of the pressure sensor unit 1. The cylindrical portion 32 is formed with a notch 321 having a height corresponding to the height of the temperature sensing portion 21 , and the notch 321 communicates with the internal cavity of the base 3 or the detection passage 101 . This allows the working medium to enter the detection passage 101 through the cutout portion 321 . In this embodiment, the number of the cutout portions 321 is four, and the cutout portions 321 are uniformly distributed along the circumferential direction of the cylindrical portion 31. The arcuate raised portion 220 and the flat portion 230 are both provided so as to protrude from the upper end surface of the second flange portion 31 , and both the arcuate raised portion 220 and the flat portion 230 are exposed at the upper end surface of the second flange portion 31 . The cylindrical portion 32 forms a side wall of a portion of the detection passage 101 .
[0018] Referring to FIG. 4 , the housing 9 has a first step portion 91 and a second step portion 92, these first step portion 91 and second step portion 92 being arranged on the bottom wall of the housing 9, the first step portion 91 having a first step surface 911, and the second step portion 92 having a second step surface 922, the first step surface 911 being closer to the pressure sensor unit 1 than the second step surface 922, the lower end surface of the sealing portion 61 being sealed and connected to the first step surface 911, and the first flange portion 23 of the first segment 221 being abutted against the first step surface 911 and restricted in position, thereby preventing the first flange portion 23 from crushing the arc-shaped ridge portion 220. The second step portion 92 has a mounting hole 923, the second flange portion 31 abuts against the second step surface 922 to be restricted in its axial position, the second flange portion 32 is restricted in its lateral position by the side wall of the second step portion 92, the cylindrical portion 32 of the base 3 is positioned within the mounting hole 923, and at least the cutout portion 321 is positioned so as to be exposed to the housing 9. In this embodiment, the housing 9 further has a third step surface 93, and the metal frame 61 abuts against the third step surface 93, thereby preventing excessive deformation or crushing when the metal frame 62 presses the sealing portion 62.
[0019] Referring to Figures 4 and 10, the connector 5 includes an insertion pin 52 and a connector housing 51, the insertion pin 52 is electrically connected to the circuit unit 4, and the insertion pin 52 can electrically connect the circuit unit 4 to an external power source. The insertion pins 52 are fixed to the connector housing 51 by injection molding, and the housing 9 is fixedly connected to the connector housing 51 . In this embodiment, the housing 9 and the connector housing 51 are fixedly connected by rivets, and the connector housing 51 includes a position limiting portion 511 which is capable of abutting against the upper end surface of the pressure sensor unit 1. In one embodiment, in order to prevent deformation of components due to temperature fluctuations from affecting the sealing performance of the sensor assembly 100, the position limiting portion 511 does not directly abut against the circuit board 41 on which the circuit unit 4 is provided, but abuts against the pressure sensor unit 1 away from the circuit board 41 on which the circuit unit 4 is provided. Thus, the position limiting portion 511 can be a position limiting post or a notched annular portion. Referring to FIG. 10, when the position limiting portion 511 is a notched annular portion, the housing 9 is fixedly connected to the connector housing 51. The position limiting portion 511 abuts against the pressure sensor unit 1, the lower end surface of the pressure sensor unit 1 abuts against the upper end of the sealed unit 6, the lower end surface of the sealed unit 6 abuts against the upper end surface of the second flange portion 31 and the first step surface 911 of the housing 9, and the lower end surface of the second flange portion 31 contacts the bottom wall of the housing 9. Thus, when the circuit unit 4 is sealed within the electrical control cavity 591 by fixedly connecting the housing 9 to the connector housing 51, installation is easy. Compared with the need to install two sealing rings, the present invention has only one sealing part, so the structure is simple, and the sealing part is integrally molded and made of the same material, so the temperature consistency is good and the sealing reliability is improved.
[0020] 11 to 13 show a second embodiment of the sensor assembly 100, the main difference between the second embodiment and the first embodiment being that the first segment 221 and the second segment 222 of the conductive portion 22 are connected in a different manner. In this embodiment, the first segment 221 and the second segment 222 of the conductive portion 22 are fixedly connected and are rigidly connected, and specifically, may be welded. In this embodiment, the second segment 222 is connected to the base 3 by injection molding, and one end of the second segment 222 has an extension 224 that exposes the base 3. A first groove 225 is formed in this extension 224. The first groove 225 is a blind hole, and the tip of the first segment 221 fits into the first groove 225 to restrict its position in the axial direction, or the first segment 221 and the second segment 222 are welded together as a reference for assembly and positioning. The first segment 221 and the second segment 222 are electrically connected, the outer edge of the extension portion 224 is larger than the hole diameter of the first through hole 63, the upper end surface of the extension portion 224 is in sealing contact with the sealing portion 61, and the lower end surface of the extension portion 224 is fixed to the base 3 by injection molding.
[0021] 15 to 18 show a sensor assembly 100 according to the third embodiment, which differs from the first embodiment mainly in the following points. In this embodiment, the sealed unit 6 does not include a metal frame, the sealed portion 61 has a first through hole 63, the pressure sensor unit 1 has a second through hole 64, the first segment 221 of the conductive portion 22 is mechanically connected and electrically connectable to the circuit unit 4 through the first through hole 63 of the sealed portion 61 and the second through hole 64 of the pressure sensor unit 1, the upper end surface of the first flange portion 23 of the first segment 221 abuts the lower end surface of the sealed portion 61, and the lower end surface of the first flange portion 23 is connected to the base 3 so as to be positionally restricted. The second segment 222 includes a vertical segment 226 that abuts and is electrically connected to the first flange portion 23 . The pressure sensor unit 1 of this embodiment is also applicable to the sensor assembly 100 of the first embodiment. Compared to the first embodiment, the metal frame is omitted, which is advantageous for further reducing costs. Furthermore, in this embodiment, the base 3 includes a position limit ring 33, the upper end surface of which has a gap between the lower end surface of the pressure sensor unit 1, and the sealing portion 61 is ring-shaped and is disposed between the position limit ring 33 and the side wall of the housing 9.
[0022] 14 and 19, the pressure sensor unit 1 includes a main body portion 10 and a pressure sensitive portion 20. The main body portion 10 and the pressure sensitive portion 20 are made of a material such as aluminum. The pressure-sensitive portion 20 is fixedly connected to the main body portion 10, and the position limiting portion 511 abuts against the upper end portion of the main body portion 10.
[0023] In FIG. 14, the pressure sensor unit 1 is a ceramic capacitance sensor. In this embodiment, the pressure sensor unit 1 includes a main body portion 10 and a pressure sensitive portion 20 , the main body portion 10 including a first end portion 11 , and the pressure sensitive portion 20 including a second end portion 12 . The first end 11 and the second end 12 are provided on opposite sides of the pressure sensor unit 1 in the thickness direction, and the circuit unit 4 is provided above the first end 11. In this embodiment, the circuit unit 4 is disposed on a circuit board 41, which is provided above the first end portion 11, and the pressure-sensing portion 20 is disposed at the second end portion 12. Furthermore, the second end 12 includes a first area 121 and a second area 122 . The first area 121 is a pressure-sensitive area, and the second area 122 is provided to surround the outer edge of the first area 121. The first area 121 is exposed to the sensing passage 101 for converting the fluid pressure signal into an electrical signal. The main body 10 has a second groove 113 extending along the thickness direction of the pressure sensor unit 1 , and the second groove 1113 corresponds to the first area 121 . The pressure sensor unit 1 further includes a conductive pin, one end of which is disposed in the second groove 113, the conductive pin corresponding to the first area 121, and converting the pressure signal in the detection passage 101 into an electrical signal. The pressure sensor unit 1 further includes a conductive pillar 14 . The conductive pillar 14 is used to electrically connect the first area 121 and the circuit unit 4 to transmit an electrical signal from the first area 121 to the circuit unit 4.
[0024] The above pressure sensor is applicable to the embodiment of FIG. The pressure sensor unit 1 has a second through hole 64, and the first segment 221 of the conductive portion 22 is mechanically connected and electrically connectable to the circuit unit 4 through the first through hole 63 of the sealed unit 6 and the second through hole 64 of the pressure sensor unit 1, and the upper end surface of the first flange portion 23 of the first segment 221 abuts against the lower end surface of the sealed portion and is sealed. Moreover, the pressure sensor unit 1 of this embodiment is also applicable to the sensor assembly 100 of the first embodiment. 4, the lower end surface of the first flange portion 23 of the first segment 221 can be electrically connected to the arc-shaped protruding portion 220 while elastically abutting thereon. Of course, the pressure sensor unit 1 of this embodiment is also applicable to the sensor assembly 100 of the second embodiment. 11 to 13, in this embodiment, the second segment 222 is connected to the base 3 by injection molding, and one end of the second segment 222 has an extension portion 224 that exposes the base 3, and a first groove 225 is formed in the extension portion 224. This first groove 225 is a blind hole, and the tip of the first segment 221 enters into the first groove 225 to restrict its position in the axial direction, or the first segment 221 and the second segment 222 are welded together as a reference for assembly and positioning, and these first segment 221 and second segment 222 are electrically connected, and the outer edge of the extension portion 224 is larger than the hole diameter of the first through hole 63. This allows the extension portion 224 to cover the first through hole 63, the upper end surface of the extension portion 224 to be in sealing contact with the sealing portion 61, and the lower end surface of the extension portion 224 to be fixed to the base 3 by injection molding. In FIG. 19, a pressure sensor unit 1 is a MEMS (microelectromechanical system) pressure sensor, which is divided into two types, a piezoresistance type and a capacitance type, and each type is manufactured based on micromachining technology and sacrificial layer technology. The pressure sensing unit 20 is a single chip that integrates the sensing element with signal processing, calibration, compensation and a microcontroller.
[0025] The pressure sensor unit 1 includes a first end 11 and a second end 12 . The first end 11 and the second end 12 are provided on opposite sides of the pressure sensor unit 1 in the thickness direction, and the circuit unit 4 is provided above the first end 11. As shown in FIG. 19, a third through hole 65 is formed in the main body 10, and the pressure sensing part 20 is provided on one side of the first end 11, and the third through hole 65 enables the pressure sensing part 20 to detect the pressure of the fluid in the detection passage. This pressure sensor is applicable to the sensor assembly 100 of the third embodiment. The pressure sensor unit 1 has a second through hole 64, and the first segment 221 of the conductive portion 22 is mechanically connected and electrically connectable to the circuit unit 4 through the first through hole 63 of the sealed unit 6 and the second through hole 64 of the pressure sensor unit 1, the upper end surface of the first flange portion 23 of the first segment 221 abuts against the lower end surface of the sealed portion and is sealed, the detection passage 101 communicates with the third through hole 65, and the pressure-sensitive film of the pressure-sensitive portion 20 is exposed to the third through hole 65. Of course, this pressure sensor unit 1 is also applicable to the first and second embodiments. The base 3 is molded by injection molding (inert molding) using the second segment 222 of the conductive portion 22 as an insert for injection molding so that the second segment 222 is hermetically fixed within the base 3.
[0026] FIG. 20 shows a sensor assembly 100 according to the fourth embodiment, which differs from the third embodiment mainly in the following points. In this embodiment, the conductive portion 22 of the temperature sensing section 21 further includes an elastic portion 227 , and the first segment 221 is electrically connected to the circuit unit 4 by the elastic portion 227 . In this embodiment, the elastic portion 227 is a spring, the circuit unit 4 is printed on the circuit board 41 , and the elastic portion 227 abuts between the circuit board 41 and the first segment 221 . A pad is provided on the circuit board 41, a step portion 2211 is provided on the first segment 221, the elastic portion 227 abuts against the pad and the step portion 2211, and the elastic portion 227 is in a compressed state between the pad and the step portion 2211. Of course, the elastic portion 227 may be welded to one of the pad or the step portion 2211 and abutted against the other. The second segment 222 is fixedly connected to the first segment 221, and the lower end of the first flange portion 23 of this first segment 221 is fixed to the upper end surface of the second segment 222 by welding or crimping. The main body 10 of the pressure sensor unit 1 is a ceramic base having a second through hole 64, and the elastic portion 227 is disposed within the second through hole 64, thereby contributing to increasing the guiding stability of the elastic portion 227.
[0027] 21 to 23 are schematic diagrams of a sensor assembly 100 according to the fifth embodiment. In this embodiment, the sensor assembly 100 includes a housing 9 , a temperature sensor unit 2 , a pressure sensor unit 1 and a circuit unit 4 . The temperature sensor unit 2 and the pressure sensor unit 1 are electrically connected to the circuit unit 4. The temperature sensor unit 2 includes a temperature sensing portion 21, and the pressure sensor unit 1 includes a pressure sensing portion 20 and a main body portion . The main body 10 is a ceramic base, the temperature sensing portion 21 is capable of converting the temperature in the detection passage 101 into an electrical signal, and the pressure sensing portion 20 is capable of converting the pressure in the detection passage 101 into an electrical signal. Furthermore, the pressure sensor unit 1 includes a metal layer 228 that is hermetically connected to the ceramic substrate, and the pressure-sensitive portion 20 is connected to the ceramic substrate so as to be positionally limited thereto. Furthermore, the circuit unit 4 is formed on a ceramic base, and the conductive portion 22 of the temperature sensor unit 2 electrically connects the temperature sensitive portion 21 and the circuit unit 4, and the conductive portion 22 is fixed to the metal layer 228 by welding. In this way, since the circuit unit 4 is formed directly using the ceramic base, there is no need to provide a separate circuit board.
[0028] The pressure sensor unit 1 of this embodiment is a MEMS pressure sensor, and the pressure sensitive section 20 includes a MEMS sensing section 111 and a transmission section 112 . The MEMS sensing section 111 is electrically connected to the circuit unit 4 by the transmission section 112 . The ceramic base and metal layer 228 have a second through hole 64, one end of the first segment 221 is electrically connected to the circuit unit 4 through the second through hole 64, and the other end of the first segment 221 has a first flange portion 23 having an outer diameter larger than the hole diameter of the second through hole 64, and the upper end surface of the first flange portion 23 can be welded and fixed to the metal layer 228 while covering the second through hole 64, and the lower end surface of the first flange portion 23 is electrically connected to the second segment 222. The sensor assembly 100 may be mounted on a component having a flow passage, which may be an electronic expansion valve used in refrigerant flow control in a vehicle air conditioning system to achieve refrigerant throttling. The sensor assembly 100 can be used as a combined temperature and pressure sensor to detect both the pressure and temperature of a refrigerant flowing through a flow passage. Of course, the component may be a four-way valve, a heat exchanger, a fluid pipeline thermal management system component, etc., and the pressure and temperature of the refrigerant inside the thermal management system component may be measured. The same parts as in the third embodiment will not be described in detail here.
[0029] The valve device includes a valve body and a sensor assembly 100, the sensor assembly 100 being fixedly attached to the valve body, the valve body including a flow passage. The detection passage 101 of the sensor assembly 100 communicates with the flow path, the pressure sensor unit 1 can detect the pressure of the fluid in the flow path, and the temperature sensor unit 2 can detect the temperature of the fluid in the flow path.
[0030] It should be noted that the above-described embodiment does not limit the present invention, but is merely intended to explain the present invention. Although the present invention has been described in detail herein with reference to the above embodiments, the present invention can be modified or substituted equivalently, and all improvements that do not depart from the spirit and scope of the present invention should be included within the protective scope of the claims.
Claims
1. A sensor assembly including a housing, a temperature sensor unit including a temperature sensing portion, a pressure sensor unit including a pressure sensing portion, a circuit unit, and a detection passage, the temperature sensing portion being provided in the detection passage and capable of converting a temperature in the detection passage into an electrical signal, and the pressure sensing portion being capable of converting a pressure in the detection passage into an electrical signal, the temperature sensor unit further includes a conductive portion that electrically connects the temperature sensing portion and the circuit unit; The sensor assembly further includes a connector including a mating pin and a connector housing; the insertion pin is electrically connected to the circuit unit; The housing is fixedly connected to the connector housing, the pressure sensor unit is positioned between a bottom wall of the housing and the connector housing; The connector housing includes a position limiting portion, the position limiting portion is capable of contacting an upper end surface of the pressure sensor unit, The temperature sensor unit further includes a base, The base is connected to the housing so as to be positionally restricted; the conductive portion includes a first segment directly connected to the circuit unit, a second segment connected to the base by injection molding and in contact with and electrically connected to the first segment, and a third segment fixedly connected to the temperature sensing portion and welded to the second segment, The sensor assembly is characterized in that the housing is fixed to the connector housing with a rivet.
2. The pressure sensor further includes a sealing unit disposed between the housing and the pressure sensor unit. the sealing unit includes a sealing portion pressed between the pressure sensor unit and the housing; 2. The sensor assembly of claim 1, wherein the seal is in sealing contact with the pressure sensor unit and in sealing contact with the housing.
3. The temperature sensing portion is provided in an internal cavity formed in the base, The sensor assembly of claim 2 , wherein the sensing passage comprises a cavity formed in the base.
4. The sealing unit has a first through hole, The pressure sensor unit has a second through hole, one end of the first segment of the conductive portion is electrically connected to the circuit unit through the first through hole and the second through hole; The sensor assembly according to claim 3 , characterized in that a first flange portion is formed at the other end of the first segment, the first flange portion having an outer diameter larger than the hole diameter of the first through hole and capable of covering the first through hole.
5. The sealing unit further includes a metal frame, The sealing portion is injection molded using the metal frame as an insert, The metal frame has an annular shape, The outer edge of the metal frame is aligned with the outer edge of the sealing portion along the radial direction of the sealing unit, The sealing portion is provided so as to protrude from a surface of the metal frame along a height direction of the sealing unit, a portion of the pressure sensor unit compresses the sealing portion and comes into contact with the metal frame; 4. The sensor assembly according to claim 2, wherein the metal frame presses the sealing portion against a bottom wall of the housing.
6. an upper end surface of the pressure sensor unit abuts against the connector housing, and a lower end surface of the pressure sensor unit abuts against the housing by compressing the sealing portion; 4. The sensor assembly according to claim 2, wherein an upper end surface of the sealing portion abuts against and is hermetically connected to a lower end surface of the pressure sensor unit, and a lower end surface of the sealing portion is hermetically connected to the housing.
7. The main material of the sealing portion is a rubber material, The sealing unit has a first through hole, The temperature sensor unit includes a conductive portion, the temperature sensing portion is electrically connected to the circuit unit by the conductive portion, the conductive portion includes a first segment, One end of the first segment is electrically connected to the circuit unit through the first through hole, 7. The sensor assembly according to claim 5, wherein the other end of the first segment is provided with a first flange portion having an outer diameter larger than a diameter of the first through hole.
8. The connector housing includes a position limiting portion, the position limiting portion is capable of contacting an upper end surface of the pressure sensor unit, The housing is fixed to the connector housing by rivets, the base has a second flange portion, the upper end surface of which contacts the lower end surface of the sealing unit and the lower end surface of which contacts the bottom wall of the housing; 6. The sensor assembly according to claim 5, wherein an upper end surface of the sealing unit abuts against a lower end surface of the pressure sensor unit.
9. The connector housing includes a position limiting portion, the sensor assembly includes a circuit board on which the circuit unit is printed, the position limiting portion is capable of contacting an upper end surface of the circuit board, The pressure sensor unit includes a main body portion, The pressure sensing portion is fixedly connected to the body portion, a lower end surface of the circuit unit abuts against an upper end surface of the main body; The housing is fixed to the connector housing by rivets, the base has a second flange portion, the upper end surface of which contacts the lower end surface of the sealing unit and the lower end surface of which contacts the bottom wall of the housing; The sensor assembly according to claim 5 , wherein an upper end surface of the sealing unit abuts against a lower end surface of the main body portion.
10. The pressure sensor unit further includes a body portion fixedly connected to the pressure sensitive portion, the body portion includes a ceramic substrate and a metal layer hermetically connected to the ceramic substrate; the pressure-sensing portion is connected to the ceramic base so as to be positionally restricted; the circuit unit is molded on the ceramic base, The sensor assembly according to claim 1 , wherein the conductive portion is fixed to the metal layer by welding.
11. the pressure sensor unit is a MEMS pressure sensor unit; the pressure-sensing unit includes a MEMS sensing unit and a transmitting unit; the MEMS sensing unit is electrically connected to the circuit unit by the transmission unit; the conductive portion includes a first segment and a second segment, the ceramic substrate and the metal layer have through holes; the first segment has one end electrically connected to the circuit unit through the through hole and the other end having a first flange portion having an outer diameter larger than a diameter of the through hole; The sensor assembly according to claim 10 , wherein the first flange portion has an upper end surface that covers the through hole and can be welded to the metal layer, and a lower end surface that is electrically connected to the second segment.
12. the base further includes a position limiting ring; an upper end surface of the position limiting ring has a gap between it and a lower end surface of the pressure sensor unit; The sensor assembly further includes a sealing unit disposed between the housing and the pressure sensor unit, the sealing unit includes a sealing portion pressed between the pressure sensor unit and the housing; the sealing portion is in sealing contact with the pressure sensor unit and with the housing; The sensor assembly of claim 11, wherein the sealing portion is ring-shaped and disposed between the position limiting ring and a side wall of the housing.
13. The housing has a first step portion and a second step portion, the first step portion and the second step portion are provided on a bottom wall of the housing, The first step portion has a first step surface, The second step portion has a second step surface, the first step surface is closer to the pressure sensor unit than the second step surface; The lower end surface of the sealing portion is sealed and connected to the first step surface, The second step portion has an attachment hole, the second flange portion abuts against the second step surface and is positionally restricted by a side wall of the second step portion, 10. The sensor assembly according to claim 8, wherein a portion of the base is located within the mounting hole.
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