Glass film manufacturing method and manufacturing apparatus, and manufacturing method for electronic device including glass film

Abstract

To safely peel a glass film from a support body by effectively restricting unnecessary flexure moment caused on the glass film and such using a simply structured device.SOLUTION: In a separation step S3 where one work of a support body 1 and a glass film 2 is peeled off from the other work and a laminated body 3 is split into the support body 1 and the glass film 2, using a suction pad 13 with a bellows 14 attached thereto, the suction pad 13 suctions the other work by decompression and causes the bellows 14 to contract, imparting peeling force F onto the one work from the other work.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a method and apparatus for producing a glass film, and a method for producing an electronic device including a glass film, and in particular to a technique for peeling a glass film from a support. [Background technology]

[0002] In recent years, from the viewpoint of space saving, flat panel displays such as liquid crystal displays, plasma displays, organic electroluminescence displays, and field emission displays have come to replace the previously popular CRT type displays, and there is a demand for these flat panel displays to be even thinner.

[0003] In particular, organic EL displays and organic EL lighting can be given the ability to be folded or rolled up by taking advantage of their extremely small (thin) thickness. This not only makes them easier to carry, but also allows them to be used in a curved state in addition to the conventional flat state, so it is expected that they will be used in a variety of applications. Therefore, there is a demand for further improvement in the flexibility of the glass substrates and cover glasses used in these electronic devices.

[0004] In order to impart flexibility to a glass substrate, it is effective to make the glass substrate thin. For example, Patent Document 1 proposes a glass film having a thickness of 200 μm or less, which makes it possible to impart high flexibility to the glass substrate so that it can be used in a curved state.

[0005] On the other hand, glass substrates used in electronic devices such as flat panel displays and solar cells are subjected to various electronic device manufacturing-related processes, such as secondary processing and cleaning. However, when the glass substrates used in these electronic devices are thinned, glass is a brittle material and may break even with a slight change in stress, making it very difficult to handle when performing electronic device manufacturing-related processes. In addition, glass films with a thickness of 200 μm or less are very flexible, making it difficult to position them when performing various manufacturing-related processes (for example, misalignment occurs during patterning).

[0006] Regarding the above problem, for example, Patent Document 2 proposes a laminate in which a glass film and a supporting glass as a support for supporting the glass film are laminated and fixed to each other. If various manufacturing-related processes are performed on the laminate in this manner, even if a glass film that is poor in strength and rigidity by itself is used, the supporting glass acts as a reinforcing material, so that the laminate can be easily positioned during each process. In addition, by peeling the glass film from the supporting glass after the process is completed, it is possible to finally obtain only the glass film that has been subjected to the required process. Furthermore, by making the thickness dimension of the laminate including the glass film the same as or greater than the thickness dimension of a conventional (existing) glass substrate, the advantage of being able to use (share) a conventional manufacturing line for glass substrates as a manufacturing line for electronic devices can be expected.

[0007] Here, as a method for peeling off the glass film from the supporting glass, a method has been known in the past in which one of the supporting glass and the glass film is pulled in a direction perpendicular to the interface between the supporting glass and the glass film (normal direction) to peel off the glass film from the supporting glass. However, this method basically forces the glass film or the like (the glass film or the supporting glass) to bend and deform, so that unnecessary bending moment is generated in an area other than the interface, which may cause damage such as cracking.

[0008] In order to solve the above problem, for example, Patent Document 3 proposes a method of peeling off a substrate (glass film) from a reinforcing plate (support) by sequentially raising a plurality of movable bodies fixed at a predetermined interval on the upper side of the flexible plate while the upper surface of the reinforcing plate (support) is adsorbed by the flexible plate. In addition, a structure is proposed in which a ball joint is connected to the base end side of the movable body, thereby allowing the movable body to tilt in accordance with the bending deformation of the flexible plate. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2010-132531 A [Patent Document 2] International Publication No. 2011 / 048979 [Patent Document 3] JP 2014-141344 A Summary of the Invention [Problem to be solved by the invention]

[0010] In this way, according to the peeling device described in Patent Document 3, the movable body fixed to the flexible plate that adsorbs and holds the substrate or reinforcing plate can be tilted in accordance with the bending deformation of the flexible plate, so that the flexible plate can be bent without applying an excessive force to the movable body. Therefore, unnecessary bending moment generated in the substrate or reinforcing plate adsorbed and held by the flexible plate is suppressed, thereby preventing cracking of the substrate or reinforcing plate.

[0011] On the other hand, if it is desired to eliminate unnecessary bending moments occurring in the glass film or the like as much as possible, it is desirable to configure the suction member with multiple suction pads, rather than a flexible plate as described in Patent Document 3. Here, since the suction pad usually suctions the glass film or the like by reducing the pressure in the space between the suction pad and the suction pad to be suctioned (the surface of the glass film or the like), an exhaust pipe for reducing the pressure must be connected to the suction pad. However, when the tilting structure described in Patent Document 3 is applied to the suction pad and a structure in which the suction pad is tiltably supported by a ball joint is considered, the ball joint becomes an obstacle and the space for connecting the exhaust pipe to the suction pad is limited. Therefore, it is difficult to apply the tilting structure described in Patent Document 3 to multiple suction pads. In addition, when the tilting structure described in Patent Document 3 is applied, multiple suction pads, the same number of ball joints as the suction pads, and multiple driving devices (cylinders, etc.) for independently raising and lowering the multiple suction pads and ball joints are required, which makes the structure complicated and inevitably increases the equipment cost.

[0012] In view of the above circumstances, the technical problem to be solved by the present invention is to safely peel off a glass film from a support by using an apparatus with a simple structure to effectively suppress unnecessary bending moment generated in a glass film, etc. [Means for solving the problem]

[0013] The above-mentioned problem is solved by the method for manufacturing a glass film according to the present invention. That is, this manufacturing method includes a preparation step of preparing a laminate in which a glass film that has been subjected to a manufacturing-related process is laminated on a support that supports the glass film, and a separation step of peeling one of the workpieces, the support and the glass film, from the other workpiece to separate the prepared laminate into the support and the glass film, and is characterized in that in the separation step, a suction pad with a bellows attached is used, and one of the workpieces is sucked by the suction pad by reducing pressure and the bellows is contracted to apply a peeling force to the one workpiece from the other workpiece. Note that the "manufacturing-related process" referred to here broadly includes not only a process of directly processing the glass film, but also a process of indirectly bringing the glass film or a device including the glass film closer to the final product (shipping state), such as attaching other members and cleaning the surface of the glass film.

[0014] As described above, in the glass film manufacturing method according to the present invention, a suction pad with a bellows attached is used, and one workpiece is sucked by the suction pad by reducing the pressure, and the bellows is contracted to apply a peeling force to the one workpiece from the other workpiece. Therefore, the suction pad can be easily tilted to a relatively large angle by the deformation of the bellows. Therefore, it is possible to effectively suppress unnecessary bending moment that may occur in the glass film or the like sucked by the suction pad, and prevent the glass film or the like from cracking. In addition, by sucking the glass film with the suction pad and applying a peeling force to the glass film or the like by contracting the bellows, for example, the suction operation and the peeling force application operation can be performed by a common exhaust drive unit. Of course, if the bellows is used, the suction pad can be connected to the exhaust drive unit through its internal space, so there is no need to worry about space restrictions. As described above, according to the glass film manufacturing method according to the present invention, it is possible to simplify the structure of the device and perform peeling that is less likely to cause cracks without increasing costs.

[0015] In addition, in the glass film manufacturing method of the present invention, multiple suction pads may be arranged along the peeling progression direction, and one of the workpieces may be adsorbed with the suction pad on the rear side of the peeling progression to start the contraction of the bellows, and then one of the workpieces may be adsorbed with the suction pad on the front side of the peeling progression adjacent to the suction pad on the rear side of the peeling progression to start the contraction of the bellows.

[0016] With this configuration, when the peeling progresses to just below the suction pad on the rear side of the peeling progress that has risen due to the contraction of the bellows or beyond just below it, a peeling force can be applied to the portion of one of the workpieces just below the next suction pad. Therefore, one of the workpieces can be peeled off in sequence from the peeling area or the side closest to the peeling area without any difficulty, which makes it possible to more effectively suppress the generation of unnecessary moments and achieve stable peeling progress.

[0017] In addition, when multiple suction pads are operated in sequence as described above, in the glass film manufacturing method of the present invention, the suction pad at the front of the peeling progression may start suctioning one of the workpieces and the bellows may start contracting, provided that the contraction of the bellows attached to the suction pad at the rear of the peeling progression has caused the peeling progression area to reach at least directly below the suction pad at the front of the peeling progression.

[0018] As described above, on the condition that the peeling region reaches directly below the suction pad on the front side of the peeling progress, peeling can be progressed more smoothly by applying a peeling force to the portion of one workpiece directly below the suction pad. Also, since at least a portion of one workpiece directly below the suction pad has already been peeled off from the other workpiece, unnecessary bending moment that may occur in one workpiece can be further suppressed, and one workpiece can be peeled off smoothly.

[0019] In addition, in the method for manufacturing a glass film according to the present invention, a height position changing device capable of changing the height position of the suction pad relative to one of the workpieces may be used to adjust the amount of contraction of the bellows during decompression.

[0020] In this way, by using the height changing device to adjust the amount of contraction of the bellows when decompressing, the amount of lifting of one of the workpieces during peeling can be controlled within a desired range, making it possible to smoothly progress the peeling while imparting an appropriate bending deformation (flexural deformation) to one of the workpieces.

[0021] In addition, in the glass film manufacturing method according to the present invention, one of the workpieces may be rectangular, and the separation process may include a peel starting point formation process for forming a peel starting point at a corner of one of the workpieces, a first peel propagation process for propagating the peel starting point along a first side of one of the workpieces, and a second peel propagation process for propagating the peel propagation region that has propagated over the entire first side along a second side of one of the workpieces that is perpendicular to the first side.

[0022] In the separation process according to the present invention, for example, as is well known, a method is also conceivable in which a peeling start point is first formed at a corner of one of the workpieces, and then the suction pad is sequentially raised so as to cause the peeling start point to progress along a diagonal line of the rectangular workpiece. On the other hand, when a peeling start point is formed at a corner of one of the workpieces as described above and the peeling start point is caused to progress by the method according to the present invention, it has been found that the peeling progress mode is more stable when the peeling start point is extended in a direction along a side of the rectangular workpiece rather than being caused to progress along a diagonal line. Therefore, as described above, the peeling start point is caused to progress along a first side of one of the workpieces, and then the peeled region that has progressed over the entire first side is caused to progress along a second side perpendicular to the first side, thereby making it possible to cause the peeling to progress more stably.

[0023] In addition, when peeling is progressed along each side as described above, in the glass film manufacturing method of the present invention, a suction pad equipped with a bellows that is relatively easy to deform may be used in the first peeling progress step, and a suction pad equipped with a bellows that is relatively difficult to deform may be used in the second peeling progress step.

[0024] In this way, by using two types of bellows with different degrees of ease of deformation for the case in which the peel initiation point formed at the corner of one of the workpieces is advanced along a first edge, and the case in which the peel progression region is advanced along a second edge perpendicular to the first edge, it is possible to achieve faster and more stable peel progression.

[0025] In the method for producing a glass film according to the present invention, the support may be a plate glass. In this case, the plate glass and the glass film may be in direct contact with each other in the laminate.

[0026] By using the plate glass as the support in this way, a support with excellent surface accuracy can be manufactured at low cost. In addition, by directly adhering the plate glass with excellent surface accuracy to the glass film in this way, the glass film can be fixed to the support without misalignment, and the present invention makes it possible to reliably and safely peel the glass film from the plate glass as the support.

[0027] The above-mentioned problems are also solved by a glass film manufacturing apparatus according to the present invention. That is, this manufacturing apparatus is characterized in that, in the glass film manufacturing apparatus, a support body of a laminate in which a glass film is laminated on a support body supporting the glass film and a peeling device for peeling one of the workpieces, the glass film, from the other workpiece, the peeling device has a suction pad for adsorbing one of the workpieces, and a bellows is attached to the suction pad, and the suction pad is configured to adsorb the one of the workpieces by reducing pressure and to contract the bellows to apply a force to peel the one of the workpieces from the other workpiece.

[0028] In this way, the glass film manufacturing device according to the present invention also uses a suction pad with a bellows attached, and the suction pad sucks one workpiece by reducing pressure and contracts the bellows to apply a peeling force to the one workpiece from the other workpiece. Therefore, the suction pad can be easily tilted to a relatively large angle by deformation of the bellows. Therefore, it is possible to effectively suppress unnecessary bending moment that may occur in the glass film or the like sucked by the suction pad, and prevent cracking of the glass film or the like. In addition, by sucking the glass film with the suction pad and applying a peeling force to the glass film or the like by contracting the bellows, for example, the suction operation and the peeling force application operation can be performed by a common exhaust drive unit. As described above, the manufacturing device according to the present invention can simplify the structure of the device and perform peeling that is less likely to cause cracks without increasing costs.

[0029] The above-mentioned problems are also solved by a method for manufacturing an electronic device according to the present invention. That is, this manufacturing method includes a preparation step of preparing a support-attached electronic device, which is a laminate in a state in which a glass film having electronic device elements attached thereto is laminated on a support that supports the glass film, and a separation step of peeling one of the workpieces, the support and the glass film, from the other workpiece to separate the prepared support-attached electronic device into an electronic device including the glass film and the support, characterized in that in the separation step, a suction pad with a bellows attached is used to suction one of the workpieces by reducing pressure, and the bellows is contracted to apply a force to peel the one workpiece from the other workpiece.

[0030] In this way, in the electronic device manufacturing method according to the present invention, a suction pad with a bellows attached is used, and one workpiece is sucked by the suction pad by reducing pressure and the bellows is contracted to apply a peeling force to one workpiece from the other workpiece, so that the suction pad can be easily tilted to a relatively large angle by deformation of the bellows. This makes it possible to effectively suppress unnecessary bending moment that may occur in a glass film or the like sucked by the suction pad, and to prevent cracking of the glass film or the like. In addition, by sucking the glass film with the suction pad and applying a peeling force to the glass film or the like by contracting the bellows, for example, the suction operation and the peeling force application operation can be performed by a common exhaust drive unit. As described above, according to the electronic device manufacturing method according to the present invention, it is possible to implement a peeling method that is less likely to cause cracks by simplifying the structure of the device and without increasing costs. Effect of the Invention

[0031] As described above, according to the present invention, it is possible to use an apparatus having a simple structure to effectively suppress unnecessary bending moment occurring in a glass film, etc., thereby making it possible to safely peel off the glass film from a support. [Brief description of the drawings]

[0032] [Figure 1] 1 is a flowchart showing the procedure of a method for manufacturing an electronic device including a glass film according to a first embodiment of the present invention. [Diagram 2] 2 is a flowchart showing details of the separation process shown in FIG. 1. [Diagram 3] FIG. 2 is a cross-sectional view of a laminate including a glass film. [Figure 4] FIG. 4 is a plan view of the laminate shown in FIG. [Diagram 5] 4 is a cross-sectional view of a support-attached organic EL panel in which an organic EL element is attached as an electronic device element to the laminate shown in FIG. [Figure 6]3A is a plan view illustrating an example of a peel start point forming step shown in FIG. 2, and FIG. 3B is a cross-sectional view of a main part taken along the line AA. [Figure 7] 1 is a plan view of a glass film peeling device according to a first embodiment of the present invention. [Figure 8] 8 is a cross-sectional view of a main part BB of the peeling device shown in FIG. 7. [Figure 9] 8 is a cross-sectional view of a main part of a BB for explaining an example of a peeling developing step using the peeling device shown in FIG. 7. [Figure 10] 8 is a cross-sectional view of a main part of a BB for explaining an example of a peeling developing step using the peeling device shown in FIG. 7. [Figure 11] 8 is a plan view for explaining an example of a peeling developing step using the peeling device shown in FIG. 7. [Figure 12] FIG. 11 is a plan view for explaining an example of a peeling extending step according to a second embodiment of the present invention. [Figure 13] 1 is a cross-sectional view of a liquid crystal panel with a support when a liquid crystal panel is manufactured as an electronic device to which the present invention is applied. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] A first embodiment of a method for producing an electronic device including a glass film according to the present invention will be described below with reference to Fig. 1 to Fig. 11. Note that in the present embodiment, when producing an organic EL panel as an electronic device, the organic EL panel with a support attached thereto is separated into the organic EL panel and the support by peeling the glass film from the support.

[0034] The method for producing an electronic device according to the first embodiment of the present invention includes a laminate formation step S1 for forming a laminate including a glass film, an attachment step S2 for attaching an electronic device element to the glass film by heating the glass film, and a separation step S3 for separating the laminate with the electronic device element attached into an electronic device including the glass film and a support, as shown in Fig. 1. Among these steps, the laminate formation step S1 and the attachment step S2 correspond to the preparation steps according to the present invention.

[0035] The separation step S3 includes a peel start point forming step S4 for forming a peel start point on the laminate, a first peel extension step S5, and a second peel extension step S6, as shown in Fig. 2. Each step will be described in detail below.

[0036] (S1) Laminate formation process First, as shown in FIG. 3, a glass film 2 is laminated on a support 1 to form a laminate 3.

[0037] Here, the glass film 2 is formed of, for example, silicate glass, silica glass, etc., preferably borosilicate glass, and more preferably non-alkali glass. If the glass film 2 contains an alkali component, cations may fall off from the surface, which may cause the so-called soda-blown phenomenon. In that case, the glass film 2 may have structurally rough parts, and if the glass film 2 is used in a curved state, the parts that have become rough due to aging may become the starting point for breakage. For the above reasons, when there is a possibility that the glass film 2 will be used in a non-flat state, it is preferable to form the glass film 2 from non-alkali glass.

[0038] The alkali-free glass referred to here means glass that does not substantially contain an alkali component (alkali metal oxide), specifically, glass having an alkali component of 3000 ppm or less. Of course, from the viewpoint of preventing or reducing the deterioration over time due to the above-mentioned reasons, glass having an alkali component of 1000 ppm or less is preferable, glass having an alkali component of 500 ppm or less is more preferable, and glass having an alkali component of 300 ppm or less is even more preferable.

[0039] The thickness of the glass film 2 is set to 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less. The lower limit of the thickness can be set without any particular restrictions, but considering the handling after molding (when laminating with the support 1 or peeling off, etc.), it is preferable to set it to 1 μm or more, preferably 5 μm or more.

[0040] In this embodiment, the support 1 is a plate-like glass, and like the glass film 2, is made of known glass such as silicate glass, silica glass, borosilicate glass, and alkali-free glass. However, from the viewpoint of preventing unnecessary deformation or breakage of the glass film 2 caused by differences in thermal deformation as much as possible in a manufacturing-related process for an electronic device involving heating (attaching step S2 in this embodiment), it is preferable to select the type of glass so that the difference in linear expansion coefficient between the support 1 and the glass film 2 between 30°C and 380°C is within 5×10-7 / °C. In this case, it is preferable to form the support 1 and the glass film 2 from the same type of glass.

[0041] The thickness dimension of the support 1 is not particularly limited as long as it can improve the handleability of the glass film 2, and is set to the same level as or greater than the thickness dimension of the glass film 2. Specifically, the thickness dimension of the support 1 is set to 300 μm or more, and preferably 500 μm or more. The upper limit of the thickness dimension can be set without any particular restrictions, but it is preferable to keep it at a thickness dimension that can withstand bending (curving) of the support 1 described later. Specifically, it is preferably set to 1000 μm or less, and preferably 700 μm or less.

[0042] The support 1 and the glass film 2 are formed by a known forming method such as a downdraw method, preferably an overflow downdraw method. They can also be formed by a float method, a slot downdraw method, a roll-out method, an updraw method, etc. If necessary, secondary processing can be performed (stretching the primary glass molded body by redrawing) to set the thickness to less than 100 μm.

[0043] In a state in which the laminate 3 is formed, the support 1 and the glass film 2 are fixed to each other to such an extent that they can be peeled off. Any means can be adopted as the fixing means, and in this embodiment, the mutual fixation is realized by directly adhering the plate glass as the support 1 and the glass film 2 to each other without the interposition of an adhesive or the like.

[0044] In this case, the surface roughness Ra of the surface 2a of the glass film 2 on the support 1 side (the lower surface in FIG. 3) and the surface 1a of the support 1 on the glass film 2 side (the upper surface in FIG. 3) are both set to 2.0 nm or less. By setting the surface roughness Ra of each of the surfaces 1a, 2a within the above-mentioned range, it becomes possible to laminate the support 1 and the glass film 2 in a state of being fixed to each other without misalignment (to form the laminate 3). Of course, from the viewpoint of improving adhesion, it is preferable to set it to 1.0 nm or less, and more preferably 0.2 nm or less.

[0045] On the other hand, the magnitude of the surface roughness Ra of the surface 2b of the glass film 2 opposite the support 1 is not particularly limited. However, since this surface will be the target surface for electronic device-related processing such as film formation in the attachment step S2 described later, the surface roughness Ra is preferably 2.0 nm or less, more preferably 1.0 nm or less, and even more preferably 0.2 nm or less.

[0046] In addition, from the viewpoint of protecting the edge of the glass film 2, when the glass film 2 and the support 1 are laminated, the support 1 protrudes from the glass film 2 (see FIG. 3). In this case, the amount of protrusion of the support 1 from the glass film 2 is set to, for example, 0.5 mm or more and 10 mm or less, and preferably 0.5 mm or more and 1.0 mm or less. By reducing the amount of protrusion of the support 1 (to a maximum of about 10 mm) as described above, the glass film 2 having a relatively large area can be efficiently supported over the entire surface.

[0047] In this embodiment, as shown in Fig. 4, both the support 1 and the glass film 2 are rectangular. In addition, the support 1 protrudes from the glass film 2 at the entire peripheral edge of the laminate 3 formed by laminating the glass film 2 on the support 1, so that the support 1 protrudes from the glass film 2 at the corner portion 4 of the glass film 2. Note that, although the embodiment shows an example in which the support 1 protrudes from the glass film 2 at all four edges of the laminate 3, it is of course possible to adopt a form in which the support 1 protrudes from the glass film 2 at three edges or one edge. In this case, it is desirable that the end face of the glass film 2 and the end face of the support 1 coincide with each other at the edge on the side where the support 1 does not protrude.

[0048] In addition, when forming the laminate 3, the lamination operation may be performed under reduced pressure. This makes it possible to reduce or eliminate air bubbles that are generated (remain) between the glass film 2 and the support 1 when the glass film 2 is laminated on the support 1.

[0049] (S2) Installation process After forming the laminate 3 including the glass film 2 as described above, the laminate 3 is subjected to a process related to the manufacture of an electronic device involving heating, specifically, attachment of an organic EL element 5 as an electronic device element. As a result, as shown in Fig. 5, the organic EL element 5 is formed on the surface 2b of the glass film 2, which is a part of the laminate 3, opposite the support 1. Then, a cover glass 6 is placed on the organic EL element 5, and the periphery of the cover glass 6 is fixed to the glass film 2, thereby sealing the organic EL element 5. As a result, an organic EL panel 8 with a support is formed in which the support 1 is fixed to the organic EL panel 7.

[0050] Here, the thickness of the cover glass 6 is set to, for example, 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less. By setting the thickness of the cover glass 6 in this manner, it is possible to provide the cover glass 6 with appropriate flexibility.

[0051] The organic EL element 5 may be attached to the glass film 2 in any manner. For example, the organic EL element 5 may be formed by sequentially forming an anode layer, a hole transport layer, a light-emitting layer, an electron transport layer, a cathode layer, and the like on the surface 2b of the glass film 2 opposite the support 1 by a known film forming method such as a CVD method or sputtering (detailed illustration is omitted). The fixing means of the cover glass 6 to the glass film 2 may also be any manner. For example, the cover glass 6 may be fixed to the glass film 2 by a known laser sealing technique. In this case, the film forming process by the CVD method or sputtering corresponds to the manufacturing-related process of the electronic device involving heating. Therefore, by forming the organic EL element 5 on the surface 2b of the glass film 2 opposite the support 1 as described above, the glass film 2 is heated. In addition, due to this heating, a new bond is formed between the glass film 2 and the support 1, and the fixing force between the glass film 2 and the support 1 is increased compared to when the laminate was formed (when the laminate 3 was formed).

[0052] In the embodiment shown in FIG. 5, the cover glass 6 and the glass film 2 are directly fixed to each other. However, the cover glass 6 may be adhesively fixed to the glass film 2 by appropriately using a known glass frit, spacer, or the like (not shown).

[0053] (S3) Separation process After the support-attached organic EL panel 8 is thus formed (prepared), the support 1 is peeled off from the glass film 2 constituting the support-attached organic EL panel 8, thereby separating the support-attached organic EL panel 8 into the organic EL panel 7 and the support 1 (see FIG. 1). Note that in FIG. 6 and subsequent figures, the organic EL element 5 and the cover glass 6 included in the support-attached organic EL panel 8 are not shown.

[0054] (S4) Peeling starting point forming process In this embodiment, first, as shown in Fig. 6(a), with the support 1 placed below and the glass film 2 placed above, a corner portion 4 of the glass film 2 is peeled off from the support 1 to form a peel starting point 9 between the corner portion 4 and the support 1. Any means can be used to form the peel starting point 9, but for example, a peel starting point forming member 10 such as a knife is inserted between the corner portion 4 of the glass film 2 and the support 1 to form the peel starting point 9 directly below the corner portion 4 (see Fig. 6(b)).

[0055] (S5) First peeling progress step (S6) Second peeling progress process After the peeling starting point 9 is formed between the glass film 2 and the support 1 as described above, the peeling starting point 9 is advanced in a predetermined direction. FIG. 7 shows a plan view of a peeling device 11 for performing the above peeling. FIG. 8 shows a cross-sectional view of a main part of the peeling device 11 shown in FIG. 7, which is a cross-sectional view when cut at a virtual cross section along a first side 1c of the support 1 (in FIG. 7, the side extending in the vertical direction). As shown in FIG. 7 and FIG. 8, the peeling device 11 has a holding member 12 for holding one of the organic EL panel 7 including the glass film 2 and the support 1, a plurality of suction pads 13 for suctioning the other work, a bellows 14 attached to the suction pad 13, an exhaust chamber 15 connected to the bellows 14, and an exhaust drive unit 16 connected to the exhaust chamber 15. In this embodiment, the peeling device 11 further has a height position changing device 17 for changing the height position of the suction pad 13 connected to the exhaust chamber 15 via the bellows 14 with respect to the lifting target (here, the support 1). Hereinafter, each element will be described in detail.

[0056] The holding member 12 has a flat mounting surface 18, and is capable of supporting the support-attached organic EL panel 8 including the laminate 3 on the mounting surface 18. In this embodiment, the support-attached organic EL panel 8 is supported with a surface 2b (actually, the surface of the cover glass 6) of the glass film 2 opposite to the support 1 being in contact with the mounting surface 18.

[0057] Further, a groove 19 of a predetermined shape is formed on the mounting surface 18 of the holding member 12, and a suction hole 20 opening into this groove 19 is formed. This groove 19 is formed so as to follow the peripheral portion (actually, the peripheral portion of the cover glass 6) of the organic EL panel 8 with a support to be placed on the mounting surface 18, and when the organic EL panel 8 with a support is placed on the mounting surface 18, the entire area of ​​the groove 19 is covered by the cover glass 6 (only the glass film 2 is shown in FIG. 7). Therefore, by driving a suction device 21 (see FIG. 8) connected to the suction hole 20 to suck (e.g., vacuum) the space surrounded by the cover glass 6 and the groove 19, the glass film 2 is adsorbed and held on the mounting surface 18 via the cover glass 6.

[0058] The chucking pressure (vacuum pressure) at this time is set to a value that can reliably hold the glass film 2 without damaging it during the peeling operation, for example. Specifically, the chucking pressure of the glass film 2 is set to 0.03 MPa or more and 0.15 MPa or less, and preferably 0.05 MPa or more and 0.10 MPa or less.

[0059] As shown in Fig. 7, the suction pads 13 are arranged in a predetermined arrangement above the support 1, and are configured to be able to adsorb the surface 1b of the support 1 opposite to the glass film 2. In this embodiment, a plurality of suction pads 13 are arranged along the first side 1c of the support 1, and a plurality of suction pads 13 are arranged along the second side 1d of the support 1. In the example shown in Fig. 7, five suction pads 13 are arranged along the first side 1c of the support 1, and five suction pads 13 are arranged along the second side 1d (the side extending horizontally in Fig. 7) perpendicular to the first side 1c of the support 1. Therefore, in this case, a total of 25 suction pads 13 are arranged in five rows, each row consisting of five suction pads 13.

[0060] Here, when the suction portion of the suction pad 13 is circular, its outer diameter dimension (maximum outer diameter dimension) is set to, for example, 20 mm or more and 80 mm or less, and preferably 20 mm or more and 40 mm or less. The horizontal interval of the suction pads 13 is arbitrary, and is set to, for example, 0 mm or more and 100 mm or less, and preferably 1 mm or more and 50 mm or less. The suction pressure of the suction pads 13 on the support 1 is set to, for example, 0.1 MPa or more and 1.0 MPa or less, and preferably 0.2 MPa or more and 0.8 MPa or less.

[0061] An expandable bellows 14 is attached to each suction pad 13. In this embodiment, two stages of bellows 14 are integrally attached to the anti-suction side of the suction pad 13 (see FIG. 8). Here, the bellows 14 is contractible so as to raise the suction pad 13 by the negative pressure (reduced pressure state) generated in the suction pad 13 and the bellows 14 when the support 1 is sucked by the suction pad 13. Note that the material and structure of the bellows 14 are arbitrary as long as the bellows 14 can be contracted as described above. For example, the suction pad 13 and the bellows 14 may be made of the same material, or may be made of different materials. In addition, as described later, when it is desired to change the responsiveness (the lifting speed and the lifting amount of the support 1, etc.) depending on the lifting location of the support 1, the material, structure, etc. of the corresponding suction pad 13 and the bellows 14 (particularly the bellows 14) may be made different. For example, in the case where peeling progresses in two stages (first peeling progress step S5 and second peeling progress step S6) as in this embodiment, the bellows 14 used in the first peeling progress step S5 (bellows 14a-14e in the leftmost row in FIG. 7) may be made of a material and have a structure that is relatively easy to stretch, and the bellows 14 used in the second peeling progress step S6 (bellows 14f, 14g... in the second row to the fifth row from the left in FIG. 7) may be made of a material and have a structure that is relatively difficult to stretch. Here, silicone rubber is an example of a material that is relatively easy to stretch, and nitrile rubber is an example of a material that is relatively difficult to stretch.

[0062] An exhaust chamber 15 is connected to the bellows 14, and the exhaust chamber 15 is connected to an exhaust drive unit 16 such as a pump. Here, the exhaust chamber 15 is divided into each bellows 14, and the suction pad 13 and the bellows 14 can be driven independently by exhausting the exhaust chambers 15 separately. In this embodiment, one exhaust drive unit 16 is connected to the exhaust chambers 15, and a switching valve 22 is provided between each exhaust chamber 15 and the exhaust drive unit 16 to switch between a communication state and a cut-off state. Here, for example, the exhaust drive unit 16 is an electric pump, the switching valve 22 is an electromagnetic valve, and the exhaust drive unit 16 and the switching valve 22 are electrically controlled by a control device (not shown), so that the operations of the suction pad 13 and the bellows 14 described later can be electrically controlled independently.

[0063] In this embodiment, the height position changing device 17 has a mounting section 23 to which all the suction pads 13 and bellows 14 are attached via the exhaust chamber 15, and a lifting drive section 24 that drives the mounting section 23 to move up and down (see FIG. 8). Therefore, in this case, the lifting drive section 24 moves the mounting section 23 along the height direction (the normal direction of the support 1), so that all the suction pads 13 and bellows 14 fixed to the mounting section 23 can move along the height direction together with the mounting section 23. In addition, the lifting drive section 24 holds the mounting section 23 at a predetermined height position, so that the height positions of all the suction pads 13 and bellows 14 fixed to the mounting section 23 relative to the support 1 are held at predetermined positions.

[0064] In this embodiment, the maximum contraction amount of the bellows 14, in other words, the maximum lifting amount of the support 1 by the suction pad 13, is set by lowering the attachment portion 23 to a position where the suction pad 13 comes into contact with the support 1 and the bellows 14 contracts by a predetermined amount. That is, as shown in Fig. 9, the maximum contraction amount of the bellows 14 due to the subsequent decompression (a value z1-z0 obtained by subtracting the initial contraction amount z0 from the contraction amount z1 at the time of decompression shown in Fig. 10) is set according to the contraction amount (initial contraction amount z0) of the bellows 14 when the suction pad 13 comes into contact with the support 1. Therefore, when the height position of the exhaust chamber 15 is kept constant during the development of peeling, if the initial contraction amount z0 of the bellows 14 is small, the contraction amount z1-z0 of the bellows 14 at the time of decompression becomes large accordingly, and if the initial contraction amount z0 is large, the contraction amount z1-z0 of the bellows 14 at the time of decompression becomes small accordingly. As a specific example, the contraction amount z1-z0 of the bellows 14 during decompression, ie, the maximum lift amount, is set to 2 mm or more and 10 mm or less, and preferably 2 mm or more and 5 mm or less.

[0065] Next, an example of a peeling and advancing operation (first peeling and advancing step S5 and second peeling and advancing step S6) using the peeling device 11 having the above configuration will be described with reference to mainly FIGS. 7 to 11 together with the effects of the present invention.

[0066] First, the organic EL panel 8 with the support to be peeled is placed on the holding member 12 with the support 1 facing up (see Figs. 7 and 8). Then, the suction device 21 is driven to suction and hold the glass film 2 on the mounting surface 18 of the holding member 12. The suction pad 13 and the bellows 14 arranged above the organic EL panel 8 with the support are lowered by the lifting and lowering drive unit 24 of the height position changing device 17, so that the suction pad 13 comes into contact with the surface 1b of the support 1 opposite to the glass film 2 (see Fig. 9). At this point, none of the suction pads 13 is in a reduced pressure state, and therefore no suction force is applied to the support 1. A film 25 is interposed at the peeling starting point 9 formed at the corner portion 4 in order to prevent the support 1 and the glass film 2 from reattaching to each other.

[0067] Next, the exhaust drive unit 16 is driven to exhaust the inside of the exhaust chamber 15, thereby reducing the pressure of the internal space of the bellows 14 and the suction pad 13 communicating with the exhaust chamber 15. Here, the switching valve 22 provided in the exhaust chamber 15 of the suction pad 13a and the bellows 14a closest to the peeling starting point 9 is opened to cause the suction pad 13a to be adsorbed to the support 1. In addition, the pressure inside the bellows 14a is reduced to contract it further than the state at the start of the decompression (the state shown in FIG. 9), thereby applying a peeling force F from the glass film 2 to the support 1 in the state of being adsorbed by the suction pad 13a (see FIG. 10). As a result, the corner portion 4 of the support 1 adsorbed by the suction pad 13a to which the bellows 14a is attached is pulled upward, and the peeling starting point 9 located directly below it progresses toward the area directly below the adjacent suction pad 13b (in the direction shown by the arrow X in FIG. 7).

[0068] At this time, the support 1 undergoes a predetermined bending deformation as it is pulled upward. The suction pad 13a rises with the contraction of the bellows 14a, and as a result of pulling the support 1 in the adsorbed state upward, the suction pad 13a tries to tilt from the flat posture in response to the bending deformation of the support 1 (see FIG. 10). Here, the bellows 14a exhibits a smaller deformation resistance than the support 1 and the suction pad 13a, so the bellows 14a easily and preferentially bends in response to the bending deformation of the support 1. This prevents or suppresses as much as possible the situation in which the suction pad 13a in the adsorbed state causes an unnecessary bending moment in the support 1, and allows the peeling to proceed safely while preventing cracks in the support 1. In addition, with this structure, the bellows 14a always contracts after the suction pad 13a adsorbs the support 1, so that the support 1 can be reliably pulled up (a peeling force F can be applied to the support 1).

[0069] At this time, the suction pad 13b is not in a decompressed state, and is held at a predetermined height by the height position changing device 17, so that the suction pad 13b is in contact with the support 1. Therefore, no particularly large force is applied to the support 1 by the suction pad 13b. As a result, depending on the degree to which the support 1 is pulled up by the suction pad 13a, the peeling start point 9 may advance to the area directly below the adjacent suction pad 13b, as shown in FIG. 10. This allows the next suction pad 13b to be easily pulled up without difficulty, and allows the peeling to progress more smoothly. In more detail, since the next suction pad 13b has bellows 14b, the bellows 14b can be contracted without applying suction force when the support 1 (corner portion 4) directly below the suction pad 13a is pulled up, so that the suction pad 13b can be lifted in an inclined manner. This allows the peeling start point 9 to easily advance to the area directly below the next suction pad 13b when the suction pad 13a is pulled up. This makes it possible to prevent or suppress as much as possible a situation in which an unnecessary bending moment is generated in the support 1 by the suction pad 13a in the suction state, and to safely progress the peeling while preventing the support 1 from cracking.

[0070] In this manner, the support 1 is pulled up by the rise of the suction pad 13a closest to the peel starting point 9, and then the support 1 is lifted while being sucked in the order from the suction pad 13b adjacent to the suction pad 13a in the direction along the first side 1c to the suction pad 13e closest to the second side 1d, thereby causing the peel starting point 9 formed in the corner portion 4 to progress along the entire first side 1c (see FIG. 7). In this embodiment, by sequentially opening the switching valves 22 attached to the respective exhaust chambers 15, the corresponding suction pads 13b (13c...) and bellows 14b (14c...) are sequentially reduced in pressure, causing the bellows 14b (14c...) to contract and the suction pads 13b (13c...) to rise as described above. As a result, the support 1 is pulled up along the first side 1c, and peeling progresses over the entire area of ​​the first side 1c of the support 1, so that the vicinity of the first side 1c is completely peeled off from the glass film 2 (a state in which a peeled region 9' shown in FIG. 11 is formed). This completes the first peeling progress step S5.

[0071] Next, the second peeling and extending step S6 is started. Specifically, the peeling region 9' is extended in the direction Y along the second side 1d of the support 1 by using the suction pads 13f... and bellows 14f... in the row second closest to the peeling region 9' (see FIG. 11). In this case, the switching valves 22 attached to each exhaust chamber 15 are simultaneously opened to reduce the pressure of the corresponding plurality of suction pads 13f... and bellows 14f..., which are five in each row, and the bellows 14f... contract and the suction pads 13f... rise as described above. As a result, the region of the support 1 directly below the suction pads 13f is pulled up, and the peeling region 9' extends in the direction Y along the second side 1d. The above operation is similarly performed for the adjacent suction pads 13g... (13h..., 13i...) and bellows 14g... (14h..., 14i...), so that the peeling region 9' advances sequentially along the second side 1d of the support 1. Then, when the peeling region 9' reaches the other end of the second side 1d of the support 1 (the end opposite to the peeling starting point 9), the support 1 and the glass film 2 are completely peeled off. Alternatively, when the peeling region 9' reaches a predetermined size, the lifting operation is terminated, and the support 1 is completely peeled off from the glass film 2, for example, by hand, as necessary. This ends the second peeling development step S6, and the organic EL panel 7 including the glass film 2 and the support 1 are separated from each other.

[0072] Although the first embodiment of the method for manufacturing an electronic device including a glass film according to the present invention has been described above, this manufacturing method can naturally take any form within the scope of the present invention.

[0073] Fig. 12 is a plan view for explaining an outline of a separation step S3' according to a second embodiment of the present invention. As shown in Fig. 12, the separation step S3' according to this embodiment differs from the separation step S3 according to the first embodiment in that it includes a peel starting point forming step S4 for forming a peel starting point 9 at a corner portion 4 of the glass film 2, as in the first embodiment, and a peel progressing step S7 for progressing the peel starting point 9 along a diagonal line D of the support 1. That is, while the first embodiment illustrates a case in which peeling progresses in sequence along each side 1c, 1d of the support 1, in this embodiment, peeling progresses along the diagonal line D of the support 1.

[0074] In this case, the suction pad 13 and the bellows 14 are operated in a procedure different from that of the first embodiment. Specifically, as shown in FIG. 12, one or more suction pads 13A, 13B, 13B, 13C..., 13I and multiple bellows 14A, 14B, 14B, 14C..., 14I arranged in a direction perpendicular to the diagonal line D of the support 1 are grouped together, and the suction pads 13A (13B...) and the bellows 14A (14B...) of each group are operated in synchronization with each other. Therefore, in the above-mentioned case, first, one suction pad 13A and bellows 14A under which the peeling starting point 9 is located are operated in the same manner as in the first embodiment, and the support 1 is lifted up. As a result, the peeling starting point 9 advances toward the adjacent suction pads 13B, 13B in a direction along the diagonal line D of the support 1. After the peel starting point 9 starts to advance along the diagonal line D in this manner, the adjacent suction pads 13B and bellows 14B are actuated to pull up the support 1. This causes the peel starting point 9 to advance beyond just below the suction pads 13B toward the suction pads 13C adjacent to these suction pads 13B. By sequentially performing the above operations from the peel starting point 9 side on the diagonal line D toward the opposite side (the most forward side of the peel advancement), the support 1 and the glass film 2 are completely peeled off.

[0075] As described above, according to the glass film manufacturing method (peeling method) and electronic device manufacturing method of the present invention, the support 1 and the glass film 2 can be safely peeled off regardless of the peeling direction.

[0076] In the above description, the peel starting point forming member 10 is inserted between the corner portion 4 of the glass film 2 and the support 1 with the glass film 2 facing up in the peel starting point forming step S4, and the suction pads 13a to 13i (13A to 13I) are adsorbed to the surface 1b of the support 1 with the support 1 facing up in each of the peeling progress steps S5 to S7, and then the support 1 is pulled up. Of course, a different form can be used. Although not shown in the drawings, the peel starting point 9 may be formed between the support 1 and the glass film 2 with the support 1 facing up in the peel starting point forming step S4. Alternatively, the suction pads 13a to 13i (13A to 13I) may be adsorbed to the surface 2b (cover glass 6) of the glass film 2 with the glass film 2 facing up in each of the peeling progress steps S5 to S7, and then the support 1 is pulled up.

[0077] In the first embodiment, the height position changing device 17 is used to set all the suction pads 13a-13i and the bellows 14a-14i to the same height position, but other configurations are of course possible. For example, although not shown, different height position changing devices may be used for the suction pads 13a-13e used in the first peeling and advancing step S5 and the suction pads 13f-13i used in the second peeling and advancing step S6, so that the contraction amounts (z1-z0) during decompression by the bellows 14a-14e and 14f-14i differ between the first peeling and advancing step S5 and the second peeling and advancing step S6.

[0078] In addition, with regard to the exhaust drive unit 16, for example, although not shown in the figure, different exhaust drive units may be used for the suction pads 13a to 13e used in the first peeling and advancing step S5 and the suction pads 13f to 13i used in the second peeling and advancing step S6.

[0079] In the above embodiment, the peel starting point 9 is formed at the corner portion 4 of the glass film 2, but of course other configurations are also possible. For example, as shown in Fig. 11, before the peel extension steps S5 to S7, a peel region 9' as a peel starting point may be formed over the entire first side 1c of the support 1, or a peel region 9' as a peel starting point may be formed over the entire second side 1d. Alternatively, if a new peel region can be formed at the corner portion 4 of the glass film 2 by the operation of the suction pad 13a and the bellows 14a shown in Fig. 7, the peel starting point forming step S4 can be omitted.

[0080] In the above embodiment, a plate-like glass is used as the support 1, and the support 1 and the glass film 2 are fixed to each other by direct contact, but the present invention can be applied to a laminate 3 in which the glass film 2 and the support 1 are fixed by other means. For example, the present invention can be applied to a laminate (not shown) in which the support 1 is constituted by a layer made of a non-glass material such as an acrylic adhesive layer, a silicone thin film layer, or an inorganic thin film layer (ITO, oxide, metal, carbon) and a plate-like glass, and the non-glass material layer is bonded to the glass film 2.

[0081] In the above description, the case of manufacturing an organic EL panel 7 as an electronic device is exemplified, but the present invention can be applied to manufacturing methods of other electronic devices. FIG. 13 shows a cross-sectional view of a liquid crystal panel 31 with a support according to one example. This panel 31 is formed by fixing a pair of supports 1, 1 to both sides of a liquid crystal panel 32 as a final product, for example, as follows. That is, first, a pair of laminates 3, 3 each of which is laminated with a support 1 and a glass film 2 is formed (laminate formation step S1). Thereafter, a spacer 33 is formed on the surface 2b of the glass film 2 of one laminate 3 to define a space for sealing liquid crystal (not shown), and the glass film 2 of the other laminate 3 is fixed on the spacer 33 (attachment step S2). After preparing the liquid crystal panel 31 with a support in this way, the supports 1 are peeled off one by one by the above-mentioned peeling method, and one liquid crystal panel 31 with a support is separated into two supports 1, 1 and one liquid crystal panel 32 (separation step S3). Therefore, by applying the present invention to the manufacture of a liquid crystal panel 32, it is possible to safely and easily separate a liquid crystal panel 31 with a support into the support 1 and the liquid crystal panel 32 without damaging the glass film 2.

[0082] Of course, even when the glass film 2 itself is obtained (manufactured) as a final product, by applying the present invention, it becomes possible to safely and easily separate the support 1 from the glass film 2 without damaging the glass film 2. [Explanation of symbols]

[0083] 1 Support Sides 1c and 1d 2. Glass film 3. Laminate 4 Corner section 5. Organic EL elements 6. Coverslip 7. Organic EL Panel 8. Organic EL panel with support 9 Peeling starting point 9' Peeling area 10. Peel starting point forming member 11 Peeling device 12 Retaining member 13(13a~13i,13A~13I) Suction pad 14(14a~14i,14A~14I) Bellows 15 Exhaust chamber 16 Exhaust drive unit 17 Height position change device 18 Placement surface 19 Groove 20 suction hole 21 Suction device 22 Switching valve 23 Mounting part 24 Lifting drive unit 25 Film 31 Liquid crystal panel with support 32 Liquid crystal panel 33 Spacer F Peeling force S1 Laminate formation process S2 Installation process S3 separation process S4 Peeling starting point formation process S5 First peeling progress process S6 Second peeling progress process S7 Peeling progression process (diagonal line) z0 Initial shrinkage amount z1 Contraction amount during decompression

Claims

1. A preparation step of preparing a laminate in which a glass film that has been subjected to a manufacturing-related treatment is laminated on a support that supports the glass film; A method for producing a glass film, comprising: a separation step of peeling one of the support and the glass film from the other work to separate the prepared laminate into the support and the glass film, In the separation step, a plurality of suction pads to which bellows are attached are arranged along a predetermined direction, an independent exhaust chamber is connected to each of the bellows, and one or a plurality of exhaust drive units are provided to connect two or more of the exhaust chambers to each of the exhaust drive units, and a switching unit is provided to switch between a communication state and a cut-off state between each of the exhaust chambers and the exhaust drive units; A method for manufacturing a glass film, characterized in that the multiple exhaust chambers are sequentially depressurized to adsorb one of the workpieces with the suction pad, and the bellows are contracted to sequentially raise the suction pad along the specified direction, thereby applying a peeling force to the one of the workpieces from the other workpiece, and progressing the peeling in the specified direction.

2. 2. A method for manufacturing a glass film as described in claim 1, wherein one of the workpieces is adsorbed by a rear suction pad located on the rear side of the peeling progression direction to initiate the contraction of the bellows of the rear suction pad, and then one of the workpieces is adsorbed by a front suction pad located on the front side of the peeling progression direction adjacent to the rear suction pad to initiate the contraction of the bellows of the front suction pad.

3. 3. A method for manufacturing a glass film as described in claim 2, wherein, when the contraction of the bellows of the rear suction pad causes the area in which the peeling is progressing to reach at least directly below the front suction pad, the front suction pad starts to adsorb one of the workpieces and the bellows of the front suction pad start to contract.

4. A method for manufacturing a glass film according to any one of claims 1 to 3, further comprising adjusting the amount of contraction of the bellows during decompression using a height position changing device capable of changing the height position of the suction pad relative to the one of the workpieces.

5. The one workpiece is rectangular, The separation step includes a peel start point forming step of forming a peel start point at a corner portion of the one of the workpieces, a first peeling propagation step of propagating the peeling generated at the peeling starting point portion along a first side of the one of the workpieces; The method for manufacturing a glass film according to any one of claims 1 to 4, further comprising a second peeling extension step of causing the peeling extension region that has been extended along the first side to extend along a second side of the one of the workpieces that is perpendicular to the first side.

6. The method for manufacturing a glass film as described in claim 5, wherein in the first peeling-off progress step, an adsorption pad having a bellows that is relatively easy to deform is used as the bellows, and in the second peeling-off progress step, an adsorption pad having a bellows that is relatively difficult to deform is used as the bellows.

7. The method for producing a glass film according to any one of claims 1 to 6, wherein the support is a plate glass, and in the laminate, the plate glass and the glass film are in direct contact with each other.

8. A glass film manufacturing apparatus including a peeling device for peeling one of a support and the glass film from the other work of a laminate in a state in which the glass film is laminated on a support that supports the glass film, the peeling device includes a plurality of suction pads arranged along a predetermined direction and suctioning the one of the workpieces, a bellows attached to each of the suction pads, a plurality of exhaust chambers independently connected to each of the bellows, one or a plurality of exhaust drive units connected to the plurality of exhaust chambers, and a switching unit for switching between a communication state and a cut-off state between each of the exhaust chambers and the exhaust drive unit, Two or more of the exhaust chambers are connected to each of the exhaust drive units, The peeling device is configured to sequentially reduce pressure in the multiple exhaust chambers to adsorb one of the workpieces with the suction pad and to contract the bellows to sequentially raise the suction pad along the specified direction, thereby applying a peeling force to the one of the workpieces from the other workpiece and progressing the peeling in the specified direction.

9. A preparation step of preparing an electronic device with a support, the electronic device being a laminate in a state in which a glass film having an electronic device element attached thereto is laminated on a support that supports the glass film; A method for manufacturing an electronic device, comprising: a separation step of peeling one of the support and the glass film from the other work to separate the prepared electronic device with the support into an electronic device including the glass film and the support, a first exhaust chamber connected to each of the first and second exhaust drive units, and a switching unit that switches between a communication state and a cut-off state between each of the first and second exhaust chambers and the first and second exhaust drive units, and a first separation step of the first and second exhaust chambers, the first and second exhaust chambers being connected to each of the first and second exhaust drive units, the first and second exhaust chambers being connected to each of the first and second exhaust drive units, and the second separation step of the first and second exhaust drive units being connected to each of the first and second exhaust drive units, the first and second exhaust chambers being connected to each of the first and second exhaust drive units, and the second separation step of the first and second exhaust drive units being connected to each of the first and second exhaust drive units,

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