Substrate Processing Equipment

Abstract

To provide a substrate processing device, which can be mounted with various type of modules without changing a design of a vacuum conveying module and can appropriately convey an object to be conveyed.SOLUTION: A substrate processing device comprises: a vacuum conveying module having a vacuum conveying space and an opening part; a wall unit mounted on the opening part, which includes a first gate valve and a second gate valve, where a width dimension of the second gate valve is larger than a width dimension of the first gate valve; a substrate processing module which is mounted on the wall unit and has a substrate processing space, where the substrate processing space is communicated with the vacuum conveying space through the first gate valve; a ring stocker that is mounted on the wall unit; and a conveying mechanism that is configured to convey a substrate between the vacuum conveying space and the substrate processing space and is configured to convey at least one annular member between the vacuum conveying space and a storage space.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus for processing substrates. The substrate processing apparatus includes an atmospheric section for processing substrates under atmospheric pressure and a reduced-pressure section for processing substrates under reduced-pressure. The atmospheric section and the reduced-pressure section are connected together via two load lock modules whose interiors can be switched between atmospheric pressure and reduced-pressure atmospheres. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US2020 / 0083071A1 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology disclosed herein provides a substrate processing apparatus that can mount various modules, such as multiple types of processing modules and ring stockers with different internal dimensions, transport distances, etc., in the vacuum transport module of the substrate processing apparatus, and can accurately transport objects to be transported without changing the design of the vacuum transport module. [Means for solving the problem]

[0005] One aspect of the present disclosure is a substrate processing apparatus comprising: a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening, the wall unit including a first gate valve and a second gate valve, the second gate valve having a width dimension larger than the width dimension of the first gate valve; a substrate processing module attached to the wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space via the first gate valve; a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module, the storage space communicating with the vacuum transfer space via the second gate valve; and a transport mechanism disposed within the vacuum transfer space, configured to transport substrates between the vacuum transfer space and the substrate processing space via the first gate valve, and configured to transport at least one annular member between the vacuum transfer space and the storage space via the second gate valve. [Effects of the Invention]

[0006] According to the present disclosure, when various modules such as multiple types of processing modules and stockers with different internal dimensions, transport distances, etc. are installed in a vacuum transport module of a substrate processing apparatus, it is possible to install various modules and accurately transport objects to be transported without changing the design of the vacuum transport module. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing an outline of the configuration of a wafer processing apparatus according to an embodiment of the present invention; [Figure 2] 1 is a perspective view schematically illustrating an outline of the configuration of a module according to an embodiment of the present invention. [Figure 3] 1 is a vertical cross-sectional view schematically illustrating an outline of the configuration of a module according to an embodiment of the present invention. [Figure 4] FIG. 2 is a schematic cross-sectional plan view showing the configuration of an end part, a post-processing module, and a ring stocker. [Figure 5] FIG. 10 is a schematic perspective view of a configuration of an end part according to another embodiment. [Figure 6] FIG. 10 is a schematic plan view of the configuration of an end part according to another embodiment. [Figure 7] FIG. 10 is a detailed view of an aperture plate for a substrate processing module. [Figure 8] FIG. 10 is a detailed view of the ring stocker opening plate. [Figure 9] FIG. 10 is a schematic view showing a state in which a substrate processing module and a ring stocker are attached. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the manufacturing process of semiconductor devices, various processing steps are performed in which a processing module containing semiconductor wafers (hereinafter simply referred to as "wafers") is depressurized and the wafers are subjected to predetermined processing. These processing steps are performed in a substrate processing apparatus (hereinafter also referred to as a wafer processing apparatus) equipped with multiple processing modules.

[0009] This wafer processing apparatus has, for example, an atmospheric section equipped with an atmospheric module for performing a desired process on wafers in an atmospheric atmosphere, and a reduced-pressure section equipped with a reduced-pressure module for performing a desired process on wafers in a reduced-pressure atmosphere, The atmospheric section and the reduced-pressure section are connected together via a load lock module configured so that the interior can be switched between the atmospheric atmosphere and the reduced-pressure atmosphere.

[0010] Incidentally, when designing a wafer processing apparatus, it is known to attach a plurality of processing modules and component storage modules (so-called stockers) to a vacuum transfer module constituting one transfer system in a decompression section, as disclosed in Patent Document 1. The modules to be installed may have various dimensions and configurations, such as a general main process module, a post-processing module for performing post-processing on substrates, and a ring stocker for storing edge rings such as a focus ring (FR) and a cover ring (CR).

[0011] Furthermore, in the vacuum transfer modules that make up one transfer system, it is possible to attach and detach modules depending on the process content, etc., and change the type and configuration of the modules to be installed.

[0012] As such, when various types of modules are installed in a single transfer system, the specifications and dimensional configurations of the modules vary depending on their functional configurations. This means that the internal dimensions of the modules and the required transfer distances may differ when using the transfer mechanism of a single transfer system. For example, the objects to be transferred in a post-processing module are substrates (wafers), while the objects to be transferred in a ring stocker are edge rings, which have a larger diameter than substrates. Naturally, the internal spatial dimensions of the two modules are designed differently. For these reasons, different types of modules have different dimensions, and the distances over which the objects must be transferred also differ. Therefore, when installing multiple modules in a single transfer system, it is necessary to install various modules so that the transfer mechanism can accurately transport objects within each module.

[0013] The technology disclosed herein has been made in consideration of the above circumstances, and provides a substrate processing apparatus that can accommodate multiple types of processing modules and stockers and accurately transport objects through a single transport system without changing the design of the vacuum transport module that makes up the single transport system. Hereinafter, a wafer processing apparatus as a substrate processing apparatus according to this embodiment will be described with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0014] <Configuration of wafer processing device> First, a wafer processing apparatus according to this embodiment will be described. FIG. 1 is a plan view showing the outline of the configuration of a wafer processing apparatus 1 according to this embodiment. In this embodiment, the wafer processing apparatus 1 is described as including a plasma processing module for performing plasma processing such as etching, film formation, or diffusion on a wafer W as a substrate. The wafer processing apparatus 1 is also described as including a post-processing module for performing, for example, an asher process on the substrate after the substrate processing in the plasma processing module, and a ring stocker for storing an annular (ring) member (edge ​​ring) arranged to surround the periphery of the wafer W. However, the module configuration of the wafer processing apparatus 1 according to the present disclosure is not limited to this and can be selected as desired depending on the purpose of wafer processing. Furthermore, various units or modules having different device configurations may be provided instead of the post-processing module or ring stocker.

[0015] 1, the wafer processing apparatus 1 has a configuration in which an atmospheric section 10 and a reduced pressure section 11 are integrally connected via a load lock module 20. The atmospheric section 10 includes an atmospheric module that performs a desired process on a wafer W in an atmospheric atmosphere. The reduced pressure section 11 includes a reduced pressure module that performs a desired process on a wafer W in a reduced pressure atmosphere.

[0016] The load lock module 20 has a plurality of wafer transfer chambers 21a, 21b, and 21c, for example, three in this embodiment, along the width direction (X-axis direction) of a loader module 30 and a fitting module 60, which will be described later.

[0017] Wafer transfer chambers 21a, 21b, and 21c (hereinafter, these may be collectively referred to simply as "wafer transfer chamber 21") serving as substrate transfer chambers are provided to communicate with the internal space of a loader module 30 (described later) in the atmospheric section 10 and the internal space of a transfer module 50 (described later) in the decompression section 11 via wafer transfer ports 22 and 23. Wafer transfer ports 22 and 23 are configured to be freely opened and closed by gate valves 24 and 25, respectively.

[0018] The wafer transfer chamber 21 is configured to temporarily hold a wafer W. The wafer transfer chamber 21 is also configured so that its interior can be switched between an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). That is, the load lock module 20 is configured so that the wafer W can be appropriately transferred between the atmospheric section 10, which has an atmospheric atmosphere, and the reduced-pressure section 11, which has a reduced-pressure atmosphere.

[0019] The atmospheric section 10 has a loader module 30 equipped with a wafer transfer mechanism 40 (described later), and a load port 32 on which a FOUP 31 capable of storing a plurality of wafers W is placed. Note that an orienter module (not shown) for adjusting the horizontal orientation of the wafer W, a storage module (not shown) for storing a plurality of wafers W, and the like may be provided adjacent to the loader module 30.

[0020] The loader module 30 is made up of a rectangular housing, and the interior of the housing is maintained at atmospheric pressure. A plurality of, for example, five load ports 32 are arranged side by side on one side of the loader module 30 that constitutes the long side on the negative Y-axis direction. Wafer transfer chambers 21a, 21b, and 21c of the load lock module 20 are arranged side by side on the other side of the loader module 30 that constitutes the long side on the positive Y-axis direction.

[0021] A wafer transfer mechanism 40 that transfers a wafer W is provided inside the loader module 30. The wafer transfer mechanism 40 has a transfer arm 41 that holds and moves the wafer W, a rotary table 42 that rotatably supports the transfer arm 41, and a rotary table 43 on which the rotary table 42 is mounted. Also, a guide rail 44 that extends in the longitudinal direction (X-axis direction) of the loader module 30 is provided inside the loader module 30. The rotary table 43 is provided on the guide rail 44, and the wafer transfer mechanism 40 is configured to be movable along the guide rail 44.

[0022] The decompression unit 11 has a transfer module 50 that transfers the wafer W therein, a fitting module 60 that interconnects the load lock module 20 and the transfer module 50, and a processing module (hereinafter also referred to as a plasma processing module) 70 that performs a desired process on the wafer W transferred from the transfer module 50. The interiors of the transfer module 50, the fitting module 60, and the plasma processing module 70 are each configured to be able to maintain a reduced pressure atmosphere. In this embodiment, a plurality of plasma processing modules 70, for example, six plasma processing modules 70, are connected to one transfer module 50. The number and arrangement of the plasma processing modules 70 are not limited to those in this embodiment and can be set as desired.

[0023] In the decompression section 11, a post-processing module 100 serving as a substrate processing module for performing post-processing (substrate processing) on ​​wafers W that have been processed in the plasma processing module 70 and then transported via the transfer module 50, and a ring stocker 105 for storing edge rings are attached to the wall surface at the end (the end in the positive Y-axis direction) of the transfer module 50. Note that the post-processing module 100 and the ring stocker 105 are configured to be removable, and their arrangement, etc. are not limited to that of this embodiment and can be set as desired.

[0024] The transfer module 50, which serves as a vacuum transfer module, is connected to the load lock module 20 via the fitting module 60 as described above. The transfer module 50 transfers, for example, a wafer W loaded into the wafer transfer chamber 21a of the load lock module 20 to one of the plasma processing modules 70, where the wafer W is subjected to a desired process, and after performing post-processing in the post-processing module 100 as necessary, the wafer is transferred to the atmospheric section 10 via the wafer transfer chamber 21c of the load lock module 20. In one embodiment, the transfer module 50 has a vacuum transfer space and an opening. The opening is in communication with the vacuum transfer space.

[0025] A wafer transfer mechanism 80 serving as a transfer mechanism for transferring a wafer W is provided within the transfer module 50. That is, the wafer transfer mechanism 80 is disposed within the vacuum transfer space of the transfer module 50. The wafer transfer mechanism 80 includes a transfer arm 81 that holds and moves the wafer W, a rotary table 82 that rotatably supports the transfer arm 81, and a rotary table 83 on which the rotary table 82 is mounted. The rotary table 83 is fixed to the center of the transfer module 50. In one embodiment, the wafer transfer mechanism 80 is configured to transfer substrates between the vacuum transfer space of the transfer module 50 and a substrate processing space of a post-processing module 100 (described later) via a first gate valve 55a. The wafer transfer mechanism 80 is also configured to transfer at least one annular member (edge ​​ring) between the vacuum transfer space of the transfer module 50 and a storage space of a ring stocker 105 via a second gate valve 56a. In one embodiment, the wafer transfer mechanism 80 is configured to transfer multiple annular members (edge ​​rings) together between the vacuum transfer space and the storage space via the second gate valve 56 a. The multiple annular members may include a first edge ring and a second edge ring, which will be described later.

[0026] The fitting module 60 interconnects the load lock module 20 and the transfer module 50 as described above.

[0027] The plasma processing module 70 performs plasma processing such as etching, film formation, or diffusion on the wafer W. The plasma processing module 70 can be selected to perform any processing depending on the purpose of the wafer processing. The plasma processing module 70 communicates with the transfer module 50 via a wafer transfer port 51 formed in the sidewall of the transfer module 50, and the wafer transfer port 51 is configured to be freely opened and closed using a gate valve 71.

[0028] The post-processing module 100 performs post-processing, such as ashing, on the wafer W after it has been processed in the plasma processing module 70. In one embodiment, the post-processing module 100 is an ashing module. The post-processing module 100 is used as needed, and when it is not needed, the wafer W processed in the plasma processing module 70 is transferred directly to the atmospheric section 10. In one embodiment, the post-processing module (substrate processing module) 100 is attached to a wall unit 110 (described later) and has a processing space (substrate processing space). The processing space is in communication with the vacuum transfer space of the transfer module 50 via a first gate valve 55a (described later).

[0029] The ring stocker 105 stores edge rings, which are commonly used to improve processing uniformity during plasma processing of wafers W in semiconductor manufacturing equipment. When needed, such as during plasma processing in the plasma processing module 70, an edge ring is removed from the ring stocker 105 and used appropriately. In one embodiment, the ring stocker 105 is attached to a wall unit 110 (described later) and has a storage space for storing at least one edge ring (annular member) used in the plasma processing module 70. The at least one edge ring is arranged to surround the substrate in the plasma processing module 70. Note that multiple edge rings may be used together in the plasma processing module 70. In one embodiment, the multiple edge rings include a first edge ring and a second edge ring, and the outer diameter of the second edge ring is larger than the outer diameter of the first edge ring. In one embodiment, the first edge ring is made of a Si material or a SiC material, and the second edge ring is made of quartz. Note that the first edge ring and the second edge ring may be made of the same material. For example, the first edge ring and the second edge ring may be made of quartz. The storage space communicates with the vacuum transfer space of the transfer module 50 via a second gate valve 56a, which will be described later.

[0030] The wafer processing apparatus 1 described above is provided with a control unit 90 as shown in Fig. 1. The control unit 90 is, for example, a computer equipped with a CPU, a memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling the transport and processing of wafers W in the wafer processing apparatus 1. The program may be recorded on a computer-readable storage medium H and installed into the control unit 90 from the storage medium H.

[0031] <Configuration of each module> The wafer processing apparatus 1 according to this embodiment is configured as described above. Next, the detailed configuration of each module will be described. Figures 2 and 3 are a perspective view and a vertical cross-sectional view, respectively, that schematically show the configuration of the load lock module 20, transfer module 50, fitting module 60, post-processing module 100, and ring stocker 105.

[0032] As shown in FIGS. 2 and 3, the load lock module 20, fitting module 60, transfer module 50, and post-processing module 100 (or ring stocker 105) are connected in this order from the negative Y-axis direction side.

[0033] 2, the load lock module 20 has three wafer transfer chambers 21a, 21b, and 21c arranged side by side along the width direction (X-axis direction) of the fitting module 60. Each of the three wafer transfer chambers 21 is formed with a wafer transfer port 22 for transferring wafers W to and from the loader module 30, and a wafer transfer port 23 as a substrate transfer port for transferring wafers W to and from the transfer module 50. In other words, three wafer transfer ports 22 and three wafer transfer ports 23 are formed in the side walls of the load lock module 20 on the negative and positive Y-axis sides.

[0034] As described above, the wafer transfer chamber 21 of the load lock module 20 is connected to the loader module 30 and the transfer module 50 via the gate valve 24 and the gate valve 25. These gate valves 24 and 25 ensure airtightness between the wafer transfer chamber 21 and the loader module 30 or the transfer module 50 while also allowing communication between them.

[0035] As shown in FIG. 3, the wafer transfer chamber 21 is provided with a stocker 26 that temporarily holds the wafers W transferred between the loader module 30 and the transfer module 50.

[0036] 3, the load lock module 20 is connected to an air supply unit 27 that supplies gas to the inside of the wafer transfer chamber 21 and an exhaust unit 28 that exhausts gas. The load lock module 20 is configured so that the inside of the wafer transfer chamber 21 can be switched between an atmospheric atmosphere and a reduced-pressure atmosphere by the air supply unit 27 and the exhaust unit 28.

[0037] An opening 52 is formed at one end of the transfer module 50 on the negative Y-axis side to which the fitting module 60 is connected, through which the wafer W is transferred between the transfer module 50 and the fitting module 60. A wafer transfer opening 57a is formed in a terminal wall surface 57, which serves as the other end of the transfer module 50 on the positive Y-axis side. An end part (wall unit) 110 is attached to the terminal wall surface 57 for transferring the wafer W between the post-processing module 100 and the ring stocker 105. The post-processing module 100 and the ring stocker 105 are each provided with a mounting table 101, 106 for mounting the wafer W and the edge ring thereon.

[0038] The end part 110 includes a main body 112 in which wafer transfer ports 111 (111a, 111b) are formed, and a first gate valve 55a and a second gate valve 56a, which will be described later. In one embodiment, the wall unit 110 is attached to the opening of the transfer module 50. That is, the wall unit 110 defines a part of the vacuum transfer space. In one embodiment, the wall unit 110 has a first space and a second space. The first space of the wall unit 110 is disposed between the vacuum transfer space of the transfer module 50 and the substrate processing space of the post-processing module 100. The second space of the wall unit 110 is disposed between the vacuum transfer space of the transfer module 50 and the storage space of the ring stocker 105. The first gate valve 55a is disposed in the first space, and the second gate valve 56a is disposed in the second space. In one embodiment, the first gate valve 55a is arranged on a surface of the wall unit 110 closer to the post-processing module 100, and the second gate valve 56a is arranged on a surface of the wall unit 110 closer to the ring stocker 105. In one embodiment, the depth dimension of the second space is greater than the depth dimension of the first space. In this case, the second gate valve 56a is arranged farther from the transfer module 50 than the first gate valve 55a. The detailed configurations of the post-processing module 100 and the ring stocker 105 will be described later with reference to FIG. 4.

[0039] As shown in the figure, no plate-like member or gate valve is provided between the transfer module 50 and the fitting module 60. In other words, the internal spaces of the transfer module 50 and the fitting module 60 are connected to each other, defining an integrated transfer space S into which the wafer W is transferred by the wafer transfer mechanism 80.

[0040] As described above, a plurality of wafer transfer ports 51 (six in this embodiment, corresponding to the number of installed plasma processing modules 70) communicating with the plasma processing modules 70 are formed on the side surfaces on the negative and positive X-axis directions that form the long sides of the transfer module 50. The wafer transfer ports 51 are configured to be freely opened and closed using gate valves 71 (see FIG. 1).

[0041] A gas supply unit 54 for supplying an inert gas (e.g., N2 gas) to the transfer space S is connected to the ceiling surface of the transfer module 50 above the wafer transfer port 51. The gas supply unit 54 supplies the inert gas to the transfer space S so as to block the wafer transfer port 51, in other words, to form an air curtain, thereby preventing particles and the like from scattering from the plasma processing module 70 to the transfer module 50 when the gate valve 71 is opened.

[0042] In addition, the gas supply unit 54 supplies an inert gas into the inside of the transfer space S so as to eliminate stagnant areas of the air flow inside the transfer space S and to enable the inside of the transfer space S to be properly exhausted by an exhaust mechanism (not shown) connected to the fitting module 60.

[0043] <Configuration of post-processing module and ring stocker> Next, the detailed configuration of the post-processing module 100 and the ring stocker 105 will be described. Fig. 4 is a schematic plan cross-sectional view showing the configuration of the end part (wall unit) 110 provided on the end wall surface 57 of the transfer module 50 in the wafer processing apparatus 1, the post-processing module 100, and the ring stocker 105, and is an enlarged view of the periphery of the post-processing module 100 and the ring stocker 105. In Fig. 4, the state in which the wafer transfer mechanism 80 (transfer arm 81) extends into the interior of each module is shown by dashed lines.

[0044] As shown in FIG. 4, an end part 110 equipped with a first gate valve 55a and a second gate valve 56a is attached to an end wall surface 57 of the transfer module 50. The end part 110 has a main body 112 formed with a wafer transfer port 111 (111a, 111b) that can be opened and closed by the first gate valve 55a and the second gate valve 56a. The end part 110 is configured so that the main body 112 can be attached to the end wall surface 57 of the transfer module 50. The attachment method is not particularly limited, and may be, for example, by screwing. A post-processing module 100 is mounted on the end wall surface 57 via the first gate valve 55a of the end part 110, and a ring stocker 105 is mounted on the end wall surface 57 via the second gate valve 56a of the end part 110.

[0045] The main body 112 of the end part 110 is configured by connecting a first main body 112a and a second main body 112b. The first main body 112a is a hollow housing that connects the end wall 57 and the post-processing module 100. The side facing the end wall 57 is open, and a wafer transfer port 111a is formed on the side facing the post-processing module 100. A first gate valve 55a is provided inside the first main body 112a. The second main body 112b is a hollow housing that connects the end wall 57 and the ring stocker 105. The side facing the end wall 57 is open, and a wafer transfer port 111b is formed on the side facing the ring stocker 105. A second gate valve 55b is provided inside the first main body 112a. The configuration of the main body 112 is arbitrary. For example, in the configuration according to this embodiment, the first gate valve 55a and the second gate valve 56a have different configurations, so that the thickness in the width direction (X-axis direction) (thickness in the Y-axis direction) varies depending on the location.

[0046] The configuration of the end part 110 is not limited to the illustrated form. For example, the first gate valve 55a and the second gate valve 56a may be gate valves with different dimensions and structures. That is, the first gate valve 55a may be a so-called bonnet type gate valve, and the second gate valve 56a may be a so-called insert type gate valve. The bonnet type first gate valve is a gate valve attached to the convex part of the first main body 112a. Also, the insert type gate valve is a gate valve attached to the concave part of the second main body 112b.

[0047] In the configuration according to this embodiment, as shown in FIG. 4, as the configuration of the end part 110, the thickness L1 in the Y-axis direction of the part corresponding to the first gate valve 55a and the thickness L2 in the Y-axis direction of the part corresponding to the second gate valve 56a are different, and they are in the relationship of L1 < L2. In other words, the distance L1 between the post-processing module 100 and the end wall surface 57 of the transfer module 50 is configured to be smaller than the distance L2 between the ring stocker 105 and the end wall surface 57 of the transfer module 50.

[0048] Also, various modules such as the post-processing module 100 and the ring stocker 105 have a chamber thickness, internal space dimensions, etc. according to their characteristics, and the distance from the module entrance to the transfer center also varies depending on the various modules. In the configuration according to this embodiment, as shown in FIG. 4, the distance M1 from the module entrance to the transfer center in the post-processing module 100 and the distance M2 from the module entrance to the transfer center in the ring stocker 105 are in the relationship of M1 > M2. This is due to the fact that the post-processing module 100 may perform plasma processing, so the thickness of the module wall is thick, and the size of the entire module housing is larger than that of the ring stocker 105.

[0049] Also, as shown in FIG. 4, the width dimension (dimension in the X-axis direction) D1 of the first gate valve 55a and the width dimension (dimension in the X-axis direction) D2 of the second gate valve 56a are in the relationship of D1 < D2. This is because the object to be transported by the post-processing module 100 is the wafer W, while the object to be transported by the ring stocker 105 is an edge ring having a larger diameter than the wafer W.

[0050] In the design of the wafer processing apparatus 1 in the semiconductor device manufacturing process, the designs and dimensions of various modules such as the post-processing module 100 and the ring stocker 105 are determined in advance according to the processing content and the like. That is, the distance M1 from the module entrance to the transport center in the post-processing module 100 and the distance M2 from the module entrance to the transport center in the ring stocker 105, which are described above, are defined in advance.

[0051] On the other hand, the end part 110 according to the present embodiment is a part that is removably configured on the end wall surface 57 of the transfer module 50. That is, its design is arbitrary, and it is also possible to manufacture and prepare a plurality of types of end parts 110. Naturally, the width dimensions D1 and D2 of the first gate valve 55a and the second gate valve 56a possessed by the end part 110 can be designed arbitrarily. For example, an end part 110 having a first gate valve 55a with a width dimension D1 adapted to the design of the post-processing module 100 and a second gate valve 56a with a width dimension D2 adapted to the design of the ring stocker 105, as in the configuration according to the present embodiment, may be designed and used.

[0052] In the wafer processing apparatus 1 according to the present embodiment, as described above, an end part 110 that is removably configured on the end wall surface 57 of the transfer module 50 is attached, and various modules such as the post-processing module 100 and the ring stocker 105 are mounted via the end part 110. Thereby, it becomes possible to mount various modules such as the post-processing module 100 and the ring stocker 105 via the end part 110 without changing the design of the transfer module 50 as a vacuum transfer module.

[0053] Furthermore, by appropriately designing the end part 110, it is possible to accurately transport objects (such as wafers W and edge rings) to the post-processing module 100 and the ring stocker 105. Specifically, by manufacturing the end part 110 such that the Y-axis thickness L1 of the first gate valve 55a and the Y-axis thickness L2 of the second gate valve 56a provided in the end part 110 are set to desired values, it is possible to appropriately adjust the transport distance in each module. Specifically, the transport distance in the post-processing module 100 according to this embodiment is L1+M1, and the transport distance in the ring stocker 105 is L2+M2. By changing the values ​​of L1 and L2 according to the design of the end part 110, it is possible to design the transport distance in each module to a desired distance.

[0054] It should be noted that the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0055] In the above embodiment, the gate valves provided in the end part 110 are illustrated and described as the first gate valve 55a, which is a so-called bonnet-type gate valve, and the second gate valve 56a, which is a so-called insert-type gate valve. However, this is not limited to this. For example, if two post-processing modules are to be mounted on the end wall surface 57 of the transfer module 50, an end part configured to include two so-called bonnet-type gate valves may be manufactured. Furthermore, for example, if two ring stockers are to be mounted on the end wall surface 57 of the transfer module 50, an end part configured to include two so-called insert-type gate valves may be manufactured. As described above, the end part is a component configured to be detachable from the transfer module 50, so it is sufficient to use different end parts depending on the type of modules to be mounted. Therefore, the wafer processing apparatus 1 includes a flexible system attached to the opening of the transfer module 50. The flexible system selectively includes any one of a first replaceable unit, a second replaceable unit, and a third replaceable unit. The first replaceable unit includes a first wall unit (not shown) and two post-processing modules 100. The first wall unit is attached to the opening of the transfer module 50 and includes two first gate valves 55a. The two post-processing modules 100 are attached to the first wall unit. Each post-processing module 100 has a substrate processing space, which communicates with the vacuum transfer space of the transfer module 50 via the first gate valve 55a. The second replaceable unit includes a second wall unit (not shown) and two ring stockers 105. The second wall unit is attached to the opening of the transfer module 50 and includes two second gate valves 56a. The two ring stockers 105 are attached to the second wall unit. Each ring stocker 105 has a storage space for storing one or more edge rings (annular members) used in the plasma processing module 70. The storage space communicates with the vacuum transfer space of the transfer module 50 via a second gate valve 56a.The third replaceable unit includes a third wall unit 110 , one post-processing module 100 and one ring stocker 105 .

[0056] Various designs and configurations of end parts are possible. For example, if no module is mounted on the end wall surface 57 of the transfer module 50, a so-called end plate may be attached to cover and close the end wall surface 57 with a plate-like member. That is, the unit flexible system may selectively include any one of the first, second, third, and fourth replaceable units. The fourth replaceable unit includes a fourth wall unit (end plate). Furthermore, the wafer processing apparatus 1 may be configured such that one vacuum transfer module is connected to another vacuum transfer module. In this case, instead of the end parts described in the above embodiment, a cylindrical pass module may be attached to connect the vacuum transfer modules and transfer substrates between the vacuum transfer modules.

[0057] Furthermore, instead of the configuration of the end part 110 according to the above embodiment, the end part 110 may be configured from a common end plate and aperture plates corresponding to each replaceable unit (e.g., post-processing module 100, ring stocker 105). Figures 5 and 6 are schematic explanatory views of the configuration of the end part 110 according to another embodiment, with Figure 5 being a schematic perspective view and Figure 6 being a schematic plan view. In the description of this embodiment, components having the same functional configuration as those according to the above embodiment are denoted by the same reference numerals, and their description may be omitted.

[0058] As shown in FIGS. 5 and 6, the end part 110 includes a common end plate 120 configured to have two gate valves, an opening plate 124 for a substrate processing module that corresponds to each gate valve 130, 130 and is detachably provided, and an opening plate 126 for a ring stocker. In this embodiment, the configurations of the two gate valves 130, 130 provided in the end part 110 are arbitrary. For example, either the so-called bonnet type gate valve or the insert type gate valve described above may be used.

[0059] That is, in a state where the common end plate 120 is attached to the end wall surface 57 of the transfer module 50, the opening plate 124 for the substrate processing module and the opening plate 126 for the ring stocker are detachably provided in an arbitrary configuration. The detaching means is arbitrary, and for example, it may be screw fastening. As an example of attachment, as shown in FIG. 6, the opening plate 124 for the substrate processing module and the post-processing module 100 may be attached to one gate valve 130 in this order from the device main body side. Further, the opening plate 126 for the ring stocker and the ring stocker 105 may be attached to the other gate valve 130 in this order from the device main body side.

[0060] FIG. 7 is a detailed view of the opening plate 124 for the substrate processing module. FIG. 8 is a detailed view of the opening plate 126 for the ring stocker. FIG. 7 shows a state where the opening plate 124 for the substrate processing module is attached to the post-processing module 100, and FIG. 8 shows a state where the opening plate 126 for the ring stocker is attached to the ring stocker 105. As can be seen by comparing FIG. 7 and FIG. 8, the thicknesses of the opening plate 124 for the substrate processing module and the opening plate 126 for the ring stocker are significantly different. The opening plate 126 for the ring stocker is configured to be thicker than the opening plate 124 for the substrate processing module. Thereby, in the end part 110, similar to that described in the above embodiment, it can be configured such that the thickness L1 in the Y-axis direction at one gate valve 130 and the thickness L2 in the Y-axis direction at the other gate valve 130 are different (L1 < L2) (see FIG. 6).

[0061] In this embodiment, the substrate processing module aperture plate 124 and the ring stocker aperture plate 126 are detachable as needed. This allows for easy adjustment of the transfer distance L1+M1 in the post-processing module 100 and the transfer distance L2+M2 in the ring stocker 105 by using an aperture plate corresponding to the desired mounting module. In particular, since the transfer distances for both can be adjusted without replacing the common end plate 120, adjustment of the transfer distances becomes easy.

[0062] 9 is a schematic diagram of the state in which a post-processing module 100 and a ring stocker 105 are attached to each gate valve 130, 130 of an end part 110 according to this embodiment. As shown in Fig. 9, the dimensions of the modules attached via the end part 110 to the end wall surface 57 of the transfer module 50 may vary significantly depending on the type. By configuring the end part 110 to be composed of a common end plate 120 and each opening plate 124, 126, it is possible to easily attach and detach the various modules to be attached, even if the dimensions of the various modules vary significantly, as shown in Fig. 9.

[0063] Furthermore, in the above embodiment, the wafer transfer mechanism 80 has been described as primarily transporting wafers W. However, when plasma processing is performed on wafers W in the plasma processing module 70, as in the wafer processing apparatus 1 according to this embodiment, an edge ring ER may be used. In such a case, the vacuum transfer unit may be configured to be able to transport the edge ring ER as well. For example, the ring stocker 105 according to the above embodiment stores edge rings that are typically used when plasma processing is performed in the plasma processing module 70. In such a configuration, it is naturally desirable that the wafer transfer mechanism 80 be configured to be able to transport the edge ring in addition to the wafer W. [Explanation of symbols]

[0064] 1. Wafer processing equipment 50 Transfer Module 55a First gate valve 56a Second gate valve 57 End wall 80 Wafer transport mechanism 100 Post-processing module (substrate processing module) 105 Ring Stocker 110 Wall unit (end part) W wafer

Claims

1. a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening, the wall unit including a first gate valve and a second gate valve, the second gate valve having a width dimension larger than a width dimension of the first gate valve; a substrate processing module attached to the wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space via the first gate valve; a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module, the storage space being in communication with the vacuum transfer space via the second gate valve; a transfer mechanism disposed within the vacuum transfer space and configured to transfer a substrate between the vacuum transfer space and the substrate processing space via the first gate valve, and configured to transfer at least one annular member between the vacuum transfer space and the storage space via the second gate valve.

2. 2. The substrate processing apparatus of claim 1, wherein the wall unit has a first space and a second space, the first space being disposed between the vacuum transfer space and the substrate processing space, the second space being disposed between the vacuum transfer space and the storage space, the first gate valve being disposed in the first space, and the second gate valve being disposed in the second space.

3. 3 . The substrate processing apparatus according to claim 1 , wherein the second gate valve is disposed farther from the vacuum transfer module than the first gate valve.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing module is a post-processing module.

5. The substrate processing apparatus according to claim 4 , wherein the post-processing module is an ashing processing module.

6. The substrate processing apparatus of claim 1 , wherein the at least one annular member comprises at least one edge ring arranged to surround the substrate in the plasma processing module.

7. The substrate processing apparatus of claim 6 , wherein the at least one edge ring comprises a plurality of edge rings used together in the plasma processing module.

8. The substrate processing apparatus of claim 7 , wherein the plurality of edge rings include a first edge ring and a second edge ring, and an outer diameter of the second edge ring is larger than an outer diameter of the first edge ring.

9. The substrate processing apparatus of claim 8 , wherein the first edge ring is made of a Si material or a SiC material, and the second edge ring is made of quartz.

10. the first gate valve is a bonnet type gate valve, 10. The substrate processing apparatus according to claim 1, wherein the second gate valve is an insert type gate valve.

11. The wall unit comprises: a common end plate attached to the opening and including the first gate valve and the second gate valve; a substrate processing module aperture plate attached between the common end plate and the substrate processing module; The substrate processing apparatus according to claim 1, further comprising: a ring stocker opening plate attached between the common end plate and the ring stocker.

12. a vacuum transfer module having a vacuum transfer space and an opening; a flexible system attached to the opening of the vacuum transport module, the flexible system selectively including any one of a first replaceable unit, a second replaceable unit, and a third replaceable unit; The first replaceable unit comprises: a first wall unit attached to the opening and including two first gate valves; two substrate processing modules attached to the first wall unit, each substrate processing module having a substrate processing space, the substrate processing space communicating with the vacuum transfer space via the first gate valve; The second replaceable unit comprises: a second wall unit attached to the opening and including two second gate valves; two ring stockers attached to the second wall unit, each ring stocker having a storage space for storing an annular member used in a plasma processing module, the storage space communicating with the vacuum transfer space via the second gate valve; The third replaceable unit is a third wall unit attached to the opening and including a first gate valve and a second gate valve, the second gate valve having a width dimension larger than a width dimension of the first gate valve; a substrate processing module attached to the third wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space via the first gate valve; a ring stocker attached to the third wall unit and having a storage space for storing an annular member used in a plasma processing module, the storage space communicating with the vacuum transfer space via the second gate valve.

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