Conveyor

Abstract

To uniformly eliminate static on the entire substrate when eliminating static on the substrate.SOLUTION: A conveyance device 4 for conveying a substrate 19 includes a holding plate 41 that holds from above the substrate 19 held by a holding table 30, a moving unit 42 that moves the holding plate 41 in a direction in which the substrate 19 is at least peeled off from the holding table 30, and a static eliminator 44 having an air jet outlet 440 for injecting ionized air. The air jet outlet 440 is formed on the holding plate 41 along the periphery of the substrate 19. The static eliminator 44 eliminates static from the substrate 19 from the peripheral side of the substrate 19 at multiple angles.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a transport device that transports and removes static electricity from a semiconductor substrate. [Background technology]

[0002] Conventionally, ionizers installed in substrate processing equipment (see, for example, Patent Document 1) are installed on the holding table or on the transport path of the equipment base, and spray ionized air toward charged substrates to remove static electricity. However, since the area in which they can be installed is limited, bar-shaped ionizers that spray ionized air toward the substrate from one direction, or nozzle-shaped ionizers, have become common (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-327613 A [Patent Document 2] JP 2002-066865 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, as disclosed in Patent Document 2, there is a problem in that the entire substrate cannot be uniformly de-ionized when ionized air is sprayed onto the substrate from one direction, and although transport units equipped with a static elimination device for removing static electricity from the substrate during transport have been developed, these generally spray air from one direction, such as above, below, or to the side of the substrate.

[0005] Therefore, when discharging a substrate, there is a problem in that it is necessary to uniformly discharge the entire substrate. [Means for solving the problem]

[0006] The present invention for solving the above problem provides a transfer device for transferring a substrate, the transfer device comprising: a holding plate for holding the substrate from above, the substrate being held on a holding table; a moving unit for moving the holding plate in a direction at least for peeling the substrate from the holding table; and a static elimination device having an air injection port for injecting ionized air into the holding plate so as to follow the outer periphery of the substrate. Multiple with space between them The charge removing device is a conveying device characterized in that it removes charge from the outer periphery of the substrate in multiple directions.

[0007] The present invention also relates to a transport device for transporting a substrate, the transport device comprising: a holding plate for holding the substrate held on a holding table from above; a moving unit for moving the holding plate in a direction to at least peel the substrate from the holding table; and a static elimination device having an air injection port for injecting ionized air, the air injection port being formed in the holding plate in a slit shape that follows the outer periphery of the substrate, and the static elimination device for eliminating static electricity from the substrate in a multi-angle manner from the outer periphery side of the substrate. Effect of the Invention

[0009] The transport device of the present invention for transporting a substrate comprises a holding plate that holds the substrate held on a holding table from above, a moving unit that moves the holding plate in a direction at least to peel the substrate off the holding table, and a static elimination device having an air nozzle that sprays ionized air.The air nozzle is formed on, for example, the underside of the holding plate so as to follow the outer periphery of the substrate, so that the static elimination device can spray ionized air from the air nozzle to de-electrify the substrate from multiple angles from the outer periphery of the substrate, making it possible to uniformly de-electrify the entire substrate.

[0010] In the transport device of the present invention, a plurality of air injection ports are formed at intervals along the outer periphery of the substrate, for example on the underside of the holding plate, so that ionized air can be injected from the plurality of air injection ports, making it possible to de-electrify the substrate from multiple angles from the outer periphery of the substrate, thereby making it possible to uniformly de-electrify the entire substrate.

[0011] In the transport device of the present invention, the air injection port is formed in the shape of a slit on, for example, the underside of the holding plate so as to follow the outer periphery of the substrate. This makes it possible to inject ionized air from the air injection port and neutralize the substrate from multiple angles from the outer periphery of the substrate, thereby making it possible to uniformly neutralize the entire substrate. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing an example of a processing apparatus that cuts a substrate and is provided with a transport device that can neutralize static electricity from the substrate; [Diagram 2] FIG. 2 is a perspective view showing an example of a holding plate and a static eliminator installed on the holding plate. [Diagram 3] 13 is a perspective view showing another example of a holding plate and a static eliminator installed on the holding plate. FIG. [Figure 4] 11 is a plan view illustrating circular air injection ports formed at predetermined intervals in the circumferential direction of the holding plate on the lower surface side of the holding plate. FIG. [Diagram 5] 11 is a plan view illustrating a single slit-shaped air injection port that is continuous around the entire circumference on the underside of a holding plate. FIG. [Figure 6] 11 is a plan view illustrating a plurality of slit-shaped air injection ports that are discontinuously formed at equal intervals around a circumference on the lower surface side of a holding plate. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The processing device 1 shown in FIG. 1 is, for example, a cutting device that performs cutting processing on a substrate 19 held on a holding table 30 by a first cutting unit 61 or a second cutting unit 62, and includes a first conveying device 4 and a second conveying device 5 according to the present invention. The first conveying device 4 and the second conveying device 5 may be disposed in a laser processing device that performs a desired processing (for example, substrate modification or groove formation) on the substrate 19 by laser irradiation, a grinding device that grinds and thins the substrate 19 with a rotating grinding wheel, or a polishing device that polishes the substrate 19 with a polishing pad, or the first conveying device 4 or the second conveying device 5 may be usable alone. The processing device 1 may also include, for example, only the second conveying device 5.

[0014] The substrate 19 is, for example, a circular plate-shaped silicon semiconductor wafer, and on a surface 190 of the substrate 19 facing upward, devices 192 are formed in lattice-shaped areas partitioned by planned division lines 191. For example, a back surface 193 of the substrate 19 is attached to an attachment surface (front surface) of a dicing tape 198. The outer periphery of the dicing tape 198 is attached to an annular frame 197, whereby the substrate 19 is supported by the annular frame 197 via the dicing tape 198, forming a work set 199 that can be handled using the annular frame 197. The center of the annular frame 197 and the center of the substrate 19 are in a state of approximately matching. Note that the substrate 19 is not limited to the above example, and may be a single unit without being a work set 199, and may be composed of gallium arsenide, sapphire, gallium nitride, resin, ceramics, silicon carbide, or the like other than silicon, or may be a package substrate, or the like.

[0015] As shown in FIG. 1, a processing chamber is defined inside a housing not shown on the rear side (-X direction side) of the base 10 of the processing device 1, and inside the processing chamber, there are arranged a first cutting unit 61, a first index feed unit 21 that indexes the first cutting unit 61 in the Y-axis direction, and a first cutting feed unit 24 that cuts the first cutting unit 61 in the Z-axis direction (vertical direction), as well as a second cutting unit 62, a second index feed unit 22 that indexes the second cutting unit 62 in the Y-axis direction, and a second cutting feed unit 25 that cuts the second cutting unit 62 in the Z-axis direction.

[0016] The front side (+X direction side) of the base 10 of the processing device 1 is a mounting / dismounting area where the work set 199 is loaded and unloaded onto the holding table 30, which can move back and forth in the X-axis direction, and where the substrate 19 that has been subjected to cutting processing is cleaned, etc.

[0017] The holding table 30 is surrounded by a cover 31, and can be rotated about a rotation axis in the Z-axis direction by a rotation unit (not shown) disposed below the cover 31. A bellows cover 311 that expands and contracts in the X-axis direction is connected to the cover 31, and a cutting feed unit (not shown) that reciprocates the holding table 30 in the cutting feed direction (X-axis direction) is disposed below the cover 31 and the bellows cover 311. The cutting feed unit is, for example, a ball screw mechanism that rotates a ball screw by a motor to cut and feed the holding table 30.

[0018] 1 has, for example, a circular shape in a plan view, and holds by suction the substrate 19 on a holding surface 300 that communicates with a suction source (not shown). In addition, around the periphery of the holding table 30, when the substrate 19 is a work set 199 as in this embodiment, for example, four fixing clamps 32 that can clamp and fix the annular frame 197 are evenly arranged at equal intervals in the circumferential direction.

[0019] The first cutting unit 61 and the second cutting unit 62, the first index feed unit 21 and the second index feed unit 22, and the first cutting feed unit 24 and the second cutting feed unit 25, which are arranged facing each other above the movement path of the holding table 30, each have approximately the same configuration, so only the first cutting unit 61, the first index feed unit 21, and the first cutting feed unit 24 will be described. The processing device 1 is not limited to the type capable of performing dual cutting as in this embodiment.

[0020] A processing chamber gate-type column 11 is erected on the rear side (-X direction side) of the base 10 of the processing device 1 so as to straddle the movement path of the holding table 30, and a first cutting unit 61, a first index feed unit 21, and a first cutting feed unit 24 are arranged in front of the processing chamber gate-type column 11.

[0021] 1, the first index feed unit 21 includes a ball screw 210 having an axis in the Y-axis direction, a pair of guide rails 211 arranged parallel to the ball screw 210, a motor (not shown) for rotating the ball screw 210, and a movable plate 213 having an internal nut screwed into the ball screw 210 and a side portion sliding against the pair of guide rails 211. The ball screw 210 is rotated by the motor (not shown), and the movable plate 213 moves in the Y-axis direction while being guided by the pair of guide rails 211. When the movable plate 213 moves in the Y-axis direction, the first cutting unit 61 and the first cutting feed unit 24 also move in the Y-axis direction.

[0022] The first cutting feed unit 24 comprises a ball screw 240 having an axis in the vertical direction (Z-axis direction), a pair of guide rails 241 arranged on the movable plate 213 parallel to the ball screw 240, a motor 242 for rotating the ball screw 240, and a lifting plate 243 whose internal nut is screwed into the ball screw 240 and whose sides are in sliding contact with the pair of guide rails 241. The ball screw 240 is rotated by the motor 242, and as a result, the lifting plate 243 is guided by the guide rails 241 and moves in the Z-axis direction.

[0023] The first cutting unit 61 is attached to the lifting plate 243 of the first cutting feed unit 24 via an arm member 244 and positioned above the movement path of the holding table 30.The first cutting unit 61 comprises a spindle 610 whose axial direction is in the Y-axis direction, a spindle housing 611 that rotatably supports the spindle 610, a motor (not shown) that rotates the spindle 610, and a cutting blade 613 fixed to the spindle 610.As the motor rotates the spindle 610, the cutting blade 613 also rotates at high speed.

[0024] A radial nozzle 615 is disposed near the cutting blade 613, which sprays cutting water from the radial outside of the cutting blade 613 toward the contact portion (machining point) between the cutting blade 613 and the substrate 19. A pair of cooling water nozzles 616 extending parallel to each other on the +X direction side are disposed so as to sandwich the lower part of the cutting blade 613 from both sides in the Y axis direction. The pair of cooling water nozzles 616 have multiple nozzles facing the side surfaces of the cutting blade 613, and the cutting blade 613 is cooled and washed by the cutting water sprayed from the nozzles.

[0025] For example, an alignment unit 67 that detects the planned division lines 191 to be cut on the substrate 19 by performing pattern matching using a captured image is disposed near the side surface of the spindle housing 611. The first cutting unit 61 and the alignment unit 67 move in conjunction with each other in the Y-axis direction and the Z-axis direction.

[0026] 1, a cassette mounting table 13 is installed in one corner on the -Y direction side of a base 10 of the processing device 1, and the cassette mounting table 13 can be moved up and down in the Z axis direction by an elevator (not shown) arranged below it. With a cassette 14 housing a plurality of work sets 199 on its internal shelves placed on the cassette mounting table 13, the cassette mounting table 13 is raised and lowered by the elevator, thereby adjusting the height position when inserting or removing a target substrate 19 from the cassette 14.

[0027] For example, in front of an opening (not shown) on the +Y direction side of cassette 14 placed on cassette mounting table 13 shown in FIG. 1, a push-pull 15 is provided for pulling out unprocessed substrate 19 from cassette 14 and for inserting cut and cleaned work set 199 into cassette 14.

[0028] For example, above the moving path of the holding table 30, a centering guide 16 consisting of a pair of guide rails that aligns the work set 199 pulled out from the cassette 14 by the push-pull 15 at a certain position is disposed. The guide rails, each having an L-shaped cross section and extending in the Y-axis direction, can move away from or approach each other in the X-axis direction, and are disposed so that their stepped guide surfaces (inner surfaces) face each other. When the work sets 199 are carried into the holding table 30, one work set 199 is pulled out from the cassette 14 by the push-pull 15 and placed on the centering guide 16. When cleaning of the work sets 199 after machining is completed, for example, the work set 199 placed on the centering guide 16 by the second conveying device 5 is inserted into the cassette 14 by the push-pull 15 and placed on the cassette shelf. The pair of guide rails of the centering guide 16 approach each other when the work set 199 is placed to support the outer edge of the annular frame 197 and position (center) it relative to the holding table 30, and when the work set 199 is not placed, they are spaced apart to leave space above the holding surface 300 of the holding table 30.

[0029] As shown in FIG. 1, the processing apparatus 1 includes, for example, a first transfer device 4 that transfers a substrate 19 serving as a work set 199, and a second transfer device 5 that transfers the work set 199. For example, the first transport device 4 that carries the unmachined work set 199 onto the holding table 30 includes a holding plate 41 that holds the work set 199 held on the holding table 30 from above, a moving unit 42 that moves the holding plate 41 in a direction (Z-axis direction) at least to peel the work set 199 from the holding table 30, and a static eliminator 44 (see FIG. 2) having an air ejection port 440 that ejects ionized air. Note that the holding plate 41 is shown in a simplified form in FIG. 1.

[0030] A removable area gate-type column 18 is erected on the front side (+X direction side) of the base 10 of the processing device 1 so as to straddle the movement path of the holding table 30, and a first conveying device 4 and a second conveying device 5 are arranged in front of the removable area gate-type column 18.

[0031] The holding plate 41 and the moving unit 42 of the first transfer device 4 are capable of reciprocating in the Y-axis direction by, for example, an electric slider 49 attached to the front surface of the attachment / detachment area gate-type column 18.

[0032] For example, the moving unit 42 has an L-shaped outline when viewed from the side, and includes an electric cylinder 420 (or an air pressure cylinder mechanism) attached to the front surface of the slide block 490 of the electric slider 49, an arm member 421 whose rear end is connected to the lower end of a lifting rod of the electric cylinder 420 that can be raised and lowered in the Z-axis direction (not shown), and a support pillar 422 disposed on the underside of the tip side of the arm member 421 and whose lower end is connected to the upper surface of the holding plate 41.

[0033] As shown in Fig. 2, the holding plate 41 has an opening formed in the center surrounded by the outer periphery where the air ejection port 440 is formed, and has a plate base 410 having a ring shape in a plan view, for example, and a cross-shaped plate-shaped aggregate 411 is attached to the upper surface of the plate base 410, thereby reducing the overall weight. The lower end side of the support pillar 422 (see Fig. 1) of the moving unit 42 is connected to the upper surface of the plate-shaped aggregate 411. In Fig. 2, the plate base 410 is indicated by a dashed line. For example, a cable (not shown) for supplying power to the static eliminator 44 is arranged along the upper surface of the cross-shaped plate-like frame 411, and the cable is protected by a cable cover 417. The power supply main body of the static eliminator 44 is integrated with the plate base 410. When the substrate 19 is a rectangular substrate, the plate base 410 may be formed in a square ring shape in a plan view.

[0034] Both end portions of the plate-shaped aggregate 411 in the X-axis direction, for example, extend horizontally to the left and right (Y-axis direction), and a suction pad 413 is disposed, for example, on each of the lower surfaces of the extended portions. That is, the holding plate 41 in this embodiment is provided with a total of four suction pads 413.

[0035] The suction pad 413 is formed, for example, of a deformable elastic material such as rubber in a circular shape in a plan view, expanding in diameter downward. The lower surface of the suction pad 413 serves as the suction surface, and suction pipes 414 made of resin tubes are connected to the suction pad 413 so as to follow the movement of the holding plate 41. Each suction pipe 414 is connected to a suction source such as a vacuum generator or an ejector mechanism (not shown).

[0036] For example, the static eliminator 44 is provided with an air injection port 440, for example in the form of a pipe nozzle, formed on the holding plate 41 so as to follow the outer periphery of the substrate 19 held by the holding plate 41, and is, for example, of a pulse AC type, but is not limited to this and may be of a pulse DC type.

[0037] In the static eliminator 44 of this embodiment, when eliminating static electricity at least from the substrate 19, air supplied to the air outlet 440 from an air supply source (not shown) is converted into positively charged ionized air and, for example, approximately the same amount of negatively charged ionized air by an electrode needle (not shown) or the like arranged inside the air outlet 440 that is powered by a power source integrated with the plate base 410, and then sprayed from the air outlet 440. The ion balance of the ionized air sprayed from the air outlet 440 can be appropriately changed.

[0038] In the illustrated example, a total of six air ejection ports 440 are disposed on the underside of the plate base 410 at equal intervals in the circumferential direction of the plate base 410, that is, at 60 degree intervals in this embodiment. Each air ejection port 440 is formed, for example, on the outer side of the outer periphery of the annular frame 197 of the work set 199 sucked and held by the suction pad 413 in a state where the centers of the holding plates 41 are substantially aligned with each other, and along the outer periphery. Note that, when the object to be sucked and held by the holding plate 41 is the substrate 19 alone, for example, the six air ejection ports 440 are formed on the underside of the plate base 410 so as to be slidable in the radial direction of the plate base 410 in accordance with the diameters of the annular frame 197 and the substrate 19. Each air ejection port 440 may be attached to the inner circumferential surface of the plate base 410, for example. Furthermore, when the substrate to be held by suction by the holding plate 41 is a rectangular substrate, each air injection port 440 is disposed on the plate base at equal intervals in a rectangular ring shape when viewed in a plane, and the shape of the plate base does not have to be a ring shape.

[0039] The second transport device 5, which transports the post-machining substrate 19 (work set 199) from the holding table 30 shown in FIG. 1 and transports the work set 199 onto the spinner table 120 of the cleaning unit 12 described later, is equipped with, for example, a holding plate 41 in which the air ejection port 440 of the charge removal device 44 described above is arranged, a moving unit 52 such as an electric cylinder that moves the holding plate 41 in at least a direction (Z-axis direction) to peel the work set 199 off the holding table 30, and a Y-axis moving unit 53 such as an electric slider that enables the holding plate 41 to move back and forth in the Y-axis direction.

[0040] The Y-axis moving unit 53 is attached to the front surface of the attachment / detachment area gate-type column 18 and includes a slide block 534 that can reciprocate in the Y-axis direction. For example, the slide block 534 is formed to have a longer dimension in the X-axis direction than the slide block 490 of the electric slider 49, and the moving unit 52 is attached to the lower surface of the +X direction side of the slide block 534 that is thus formed longer. Therefore, the moving unit 42 of the first conveying device 4 is shifted in the X-axis direction from the moving line of the holding plate 41 connected to the lower end side of the moving unit 52. As a result, when the work set 199 is carried out from the holding table 30, the holding plate 41 of the second conveying device 5 can convey the work set 199 in the Y-axis direction without colliding with the first conveying device 4.

[0041] For example, the plate base 410 of the holding plate 41 provided in the first conveying device 4 and the second conveying device 5 may be a plate base 419 which is a circular plate shown in Fig. 3 and is integrated with a power supply body capable of supplying power to the air ejection port 440. The nozzle-shaped air ejection port 440 of the static eliminator 44 may be, for example, eight air ejection ports 440 arranged at 45 degree intervals in the circumferential direction of the plate base 419 on the lower surface of the plate base 419 as shown in Fig. 4. The air ejection port 440 shown in Fig. 2, Fig. 3, or Fig. 4 is formed, for example, in a circular shape. In Fig. 3, the plate base 419 is indicated by a dashed line. It is preferable that the ionized air sprayed from air spray nozzle 440 toward the outer periphery of substrate 19 and the outer periphery of annular frame 197 be sprayed in a direction inclined at an angle of less than 90 degrees with respect to front surface 190, which is the upper surface of substrate 19, because this makes it easier for the ionized air to flow around to rear surface 193 of substrate 19, that is, in this embodiment, the rear surface side of dicing tape 198 attached to rear surface 193 of substrate 19.

[0042] 5 shows an air jet port 448 which is another form of the air jet port 440 shown in Figs. 2, 3, and 4 of the static eliminator 44. The air jet port 448 is a slit-shaped jet port which forms a single continuous circumference and is formed on the lower surface of the plate base 419 of the holding plate 41 (or on the lower surface or inner peripheral surface of the plate base 410 shown in Fig. 2) along the outer periphery of the substrate 19 and the outer periphery of the annular frame 197.

[0043] 6 shows an air jet port 447 which is another form of the air jet port 440 shown in Figs. 2, 3, and 4 of the static eliminator 44. The air jet port 447 is a plurality of discontinuous slit-shaped jet ports which are formed on the lower surface of the plate base 419 of the holding plate 41 (or on the lower surface or inner peripheral surface of the plate base 410 shown in Fig. 2) along the outer periphery of the substrate 19 and the outer periphery of the annular frame 197, and which form a circular shape as a whole. In the example shown in Fig. 6, six slit-shaped air jet ports 447 are formed at 60 degree intervals in the circumferential direction.

[0044] 1, a single-wafer cleaning unit 12 for cleaning processed substrates 19 is disposed within the movable range of the second transfer device 5. The cleaning unit 12 suction-holds the substrate 19 on a spinner table 120, and cleans the surface 190 by spraying cleaning water from a cleaning nozzle (not shown) that moves in a swiveling motion above the substrate 19 onto the surface 190, which is the cut surface of the rotating substrate 19.

[0045] The following provides a detailed explanation of the operation of each component of the processing apparatus 1, and in particular the operation of the first conveying device 4 and the second conveying device 5, when the processing apparatus 1 shown in FIG. 1 cuts the substrate 19 serving as the work set 199. First, the cassette 14 accommodating a plurality of work sets 199 shown in FIG. 1 is placed on the cassette placement table 13, and then the height of the cassette 14 is adjusted by the elevator.

[0046] 1 moves in the -Y direction and enters the cassette 14. Furthermore, the push-pull 15 grips the annular frame 197 of the work set 199 placed on the target shelf, pulls out one work set 199 from the cassette 14, and places the annular frame 197 on the centering guide 16. Then, the pair of guide rails of the centering guide 16 approach each other in the X-axis direction to support the outer periphery of the annular frame 197, thereby centering the work set 199.

[0047] 1, the first transfer device 4 moves in the Y-axis direction, and the holding plate 41 of the first transfer device 4 is positioned above the annular frame 197 on the centering guide 16. Here, the center of the holding plate 41 and the center of the work set 199 are approximately aligned. Furthermore, the moving unit 42 lowers the holding plate 41 in the -Z direction, and the four suction pads 413 (see FIG. 2) come into contact with the upper surface of the annular frame 197 and perform suction, whereby the holding plate 41 picks up the work set 199.

[0048] In this state, as shown in FIG. 2, the air injection ports 440 of the static eliminator 44 are positioned diagonally above and outside the annular frame 197, for example, at intervals of 60 degrees in the circumferential direction of the annular frame 197, slightly outside and along the outer periphery of the annular frame 197.

[0049] When the work set 199 is picked up by the first transport device 4, the pair of guide rails of the centering guide 16 move in a direction away from each other, and a gap through which the work set 199 can pass is formed between the pair of guide rails. Then, the moving unit 42 lowers the holding plate 41, and the work set 199 is placed on the holding surface 300 of the holding table 30 that was previously positioned below the centering guide 16. After the holding table 30 suction-holds the substrate 19 on the holding surface 300 and the annular frame 197 is clamped and fixed by the fixed clamps 32, the suction of the annular frame 197 by the holding plate 41 is released, and the holding plate 41 is detached from the work set 199.

[0050] When the work set 199 detaches from the centering guide 16, the centering guide 16 is in contact only with the annular frame 197, so that the peeling charge of the work set 199 is small. However, in the case of a substrate on which a device is formed that requires strict control of the charge amount, the work set 199 may be de-electrified by a de-electrification device 44 as described below.

[0051] Next, the holding table 30 that holds the substrate 19 by suction is sent in the -X direction by a cutting feed unit (not shown) and enters a processing chamber (not shown), and the position of the planned division line 191 to be cut is detected by the alignment unit 67 shown in Fig. 1. As the planned division line 191 is detected, for example, the first cutting unit 61 is indexed in the Y-axis direction, and the target planned division line 191 and the cutting blade 613 are aligned in the Y-axis direction. The first cutting feed unit 24 lowers the first cutting unit 61 and positions the first cutting unit 61 at a height position where the cutting blade 613 fully cuts the substrate 19 and cuts into the dicing tape 198, for example.

[0052] The cutting feed unit (not shown) feeds the holding table 30 in the -X direction, and the cutting blade 613 cuts into the substrate 19 while rotating at high speed, cutting the division lines 191. When the substrate 19 advances in the -X direction to a predetermined position in the X-axis direction where the cutting blade 613 finishes cutting the division lines 191, the cutting feed unit (not shown) stops the cutting feed of the substrate 19 once, and the first incision feed unit 24 raises the first cutting unit 61 to separate the cutting blade 613 from the substrate 19. Then, the cutting feed unit (not shown) feeds the holding table 30 in the +X direction to return it to its original position, and the first cutting unit 61 is index-fed in the Y-axis direction by the interval between adjacent division lines 191, and similar cutting is performed sequentially, and all division lines 191 in the same direction are cut. Furthermore, the holding table 30 is rotated 90 degrees and similar cutting is performed, so that all division lines 191 are cut vertically and horizontally, and the substrate 19 is divided into chips having devices 192.

[0053] The holding table 30 is fed in the +X direction by a cutting feed unit (not shown), and the second transport device 5 carries out the work set 199 from the holding table 30, for example. 1 moves the holding plate 41 of the second transfer device 5 in the Y-axis direction and is positioned above the work set 199 held on the holding table 30, so that the center of the holding plate 41 and the center of the work set 199 are approximately aligned. Furthermore, the moving unit 52 lowers the holding plate 41 in the -Z direction, and the four suction pads 413 (see FIG. 2) come into contact with the upper surface of the annular frame 197 to perform suction.

[0054] In this state, in this embodiment, the air injection port 440 of the static eliminator 44 is positioned diagonally above and outside the annular frame 197, spaced 60 degrees apart in the circumferential direction of the annular frame 197, so as to be slightly outside and along the outer periphery of the annular frame 197.

[0055] When the holding plate 41 is raised in this state to separate the work set 199 from the holding surface 300 of the holding table 30, which has stopped vacuum suction, static electricity may occur. This is a phenomenon known as peeling static electricity, and if this occurs, there is a problem that the substrate 19 of the work set 199 and the dicing tape 198 after separation become positively (+) or negatively (-) charged.

[0056] Therefore, for example, in parallel with the detachment of the work set 199 from the holding table 30 by the holding plate 41, the air injection port 440 of the charge removal device 44 shown in FIG. 2 injects air supplied from an air supply source (not shown) into positively charged ionized air and, for example, approximately the same amount of negatively charged ionized air.

[0057] The ionized air 4409 ejected from the six air ejection ports 440 spreads out, for example, in a fan shape and reaches the substrate 19 from multiple angles from the outer periphery side of the substrate 19. That is, the ionized air 4409 reaches the substrate 19 from substantially the entire periphery of the substrate 19. This causes the static electricity that has been charged to the substrate 19 by peeling electrification to be uniformly removed.

[0058] In addition, some of the ionized air 4409 sprayed from the six air spray ports 440 flows around from the outer periphery of the annular frame 197 to the back side of the work set 199 (the back side of the dicing tape 198), so that together with the ionized air 4409 flowing over the dicing tape 198 toward the outer periphery of the substrate 19 and uniformly de-electrifying the surface of the dicing tape 198, the entire back side of the dicing tape 198 is also uniformly de-electrified. Similarly, even when the holding plate 41 is suction-holding the substrate 19 alone, some of the ionized air 4409 also flows around to the back surface 193 side of the substrate 19, so that the substrate 19 is uniformly de-ionized from both the outer periphery and the back surface 193 side.

[0059] The ability of the static elimination device 44 to uniformly eliminate static electricity from the substrate 19 and the dicing tape 198 in a multi-angled manner from the outer periphery of the substrate 19 can also be achieved in a substantially similar manner when the holding plate 41 as shown in FIG. 3 is provided with a circular plate-shaped plate base 419 and ionized air 4409 is sprayed from the air nozzle 440 shown in FIG. 4, the slit-shaped air nozzle 448 which forms a single continuous circumference as shown in FIG. 5, or multiple slit-shaped air nozzles 447 which are discontinuous and formed in a circular shape as a whole as shown in FIG. 6.

[0060] While the above-mentioned static elimination is being performed, work set 199 is transported by second transport device 5 onto spinner table 120 of cleaning unit 12, and work set 199 is placed on spinner table 120 with substrate 19 facing upward, and then is held by suction. Note that substrate 19 may be transported from holding table 30 to spinner table 120 by first transport device 4 while static elimination of substrate 19 and the like is being performed in the same manner as above. Next, a cleaning nozzle (not shown) revolves back and forth at a predetermined angle above work set 199. In addition, as spinner table 120 rotates at a predetermined rotational speed, cleaning water is sprayed from the cleaning nozzle toward the entire surface 190 of substrate 19, thereby performing cleaning.

[0061] 1, the first transfer device 4 moves in the Y-axis direction, and the holding plate 41 of the first transfer device 4 is positioned above the work set 199 on the spinner table 120. The center of the holding plate 41 and the center of the work set 199 are brought into a state where they are substantially aligned. Furthermore, the moving unit 42 lowers the holding plate 41 in the -Z direction, and the four suction pads 413 (see FIG. 2) come into contact with the upper surface of the annular frame 197 and perform suction, whereby the holding plate 41 picks up the work set 199.

[0062] As the holding plate 41 is raised by the moving unit 42, even when the work set 199 is removed from the spinner table 120 from which the suction holding has been released, the work set 199 becomes charged due to peeling electrification. Therefore, as described above, the de-ionization device 44 of the first conveying device 4 sprays ionized air 4409 from the air injection port 440, thereby de-ionizing the substrate 19 uniformly and in multiple directions from the outer periphery of the substrate 19, and also de-ionizing the dicing tape 198.

[0063] Then, the holding plate 41 moves in the −Y direction, and the annular frame 197 of the work set 199 is placed on the centering guide 16. Furthermore, after the annular frame 197 is gripped by the push-pull 15, the work set 199 is inserted into the shelf of the cassette 14 on the cassette mounting table 13 by the push-pull 15.

[0064] As described above, the first conveying device 4 (second conveying device 5) according to the present invention for conveying the substrate 19 includes a holding plate 41 for holding the substrate 19 held on the holding table 30 from above, a moving unit 42 (moving unit 52) ​​for moving the holding plate 41 in the Z-axis direction to at least peel off the substrate 19 from the holding table 30, and a static elimination device 44 having an air ejection port 440 for ejecting ionized air. The air ejection port 440 is formed on, for example, the lower surface of the holding plate 41 so as to follow the outer periphery of the substrate 19, so that the ionized air is ejected from the air ejection port 440, and static elimination of the substrate 19 from multiple angles from the outer periphery of the substrate 19 becomes possible, and the entire substrate 19 can be uniformly static eliminated. In addition, in the case where the substrate 19 is the work set 199 as in this embodiment, the ionized air can be made to flow around the dicing tape 198 side, which is the back side of the work set 199, so that static elimination can also be performed on the back side of the dicing tape 198.

[0065] In the first conveying device 4 (second conveying device 5) of the present invention, a plurality of air injection ports 440 are formed at intervals along the outer periphery of the substrate 19, for example on the underside of the holding plate 41. This makes it possible to inject ionized air from the plurality of air injection ports 440 and neutralize the substrate 19 from multiple angles from the outer periphery of the substrate 19, thereby making it possible to uniformly neutralize the entire substrate 19.

[0066] In the first conveying device 4 (second conveying device 5) of the present invention, the air ejection port 448 shown in FIG. 5 (air ejection port 447 shown in FIG. 6) is formed in a slit shape on, for example, the lower surface of the holding plate 41 so as to follow the outer periphery of the substrate 19. This makes it possible to eject ionized air from the air ejection port 448 (air ejection port 447) and neutralize the substrate 19 from multiple angles from the outer periphery of the substrate 19, thereby making it possible to uniformly neutralize the entire substrate 19.

[0067] The first conveying device 4 and the second conveying device 5 according to the present invention are not limited to the above-mentioned embodiment, and may be embodied in various different forms within the scope of the technical concept. Furthermore, the configuration of the processing device 1 and the cutting process of the substrate 19 using the processing device 1 are not limited to the above-mentioned embodiment, and may be appropriately changed within the scope of the effect of the present invention. [Explanation of symbols]

[0068] 19: Substrate 190: Surface of substrate 191: Dividing line 192: Device 193: Back surface of substrate 198: Dicing tape 197: Annular frame 1: Processing equipment 10: Base 11: Machining chamber gate column 61: First cutting unit 610: Spindle 613: Cutting blade 67: Alignment unit 21: 1st index feed unit 24: 1st infeed feed unit 62: Second cutting unit 13: Cassette stand 14: Cassette 15: Push-pull 16: Centering guide 18: Detachable area gate-type column 30: Holding table 31: Cover 311: Bellows cover 4: First conveyor 41: Holding plate 410: Plate base 411: Plate-shaped aggregate 417: Cable cover 413: Suction pad 414: Suction tube 419: Circular plate base 42: Moving unit 420: Electric cylinder 421: Arm member 422: Support column 49: Electric slider 44: Static electricity removal device 440: Air injection port 448: A continuous circular slit-shaped nozzle 447: Discrete slit-like nozzles arranged in a circular pattern 5: Second conveying device 41: Holding plate 44: Static electricity removing device 52: Moving unit 53: Y-axis moving unit 12: Cleaning unit 120: Spinner table

Claims

1. A transport device for transporting a substrate, a holding plate that holds the substrate held on the holding table from above; a moving unit that moves the holding plate in a direction at least for peeling the substrate from the holding table; a static eliminator having an air injection port for injecting ionized air; a plurality of the air ejection ports are formed at intervals on the holding plate along the outer periphery of the substrate; The charge removing device is a conveying device that removes charge from the substrate from multiple angles from the outer periphery of the substrate.

2. A transport device for transporting a substrate, a holding plate that holds the substrate held on the holding table from above; a moving unit that moves the holding plate in a direction at least for peeling the substrate from the holding table; a static eliminator having an air injection port for injecting ionized air; the air ejection port is formed in a slit shape in the holding plate so as to follow the outer periphery of the substrate, The charge removing device is a conveying device that removes charge from the substrate from multiple angles from the outer periphery of the substrate.

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