Non-contact cleaning module

Abstract

To provide a cleaning module which is improved in such a manner that particles are removed from a wafer before a drying after a chemical buff polishing and / or scrubbing brushes.SOLUTION: A cleaning module 1000 comprises a wafer gripping device 1003 which includes a catch cup 1010 vertically supporting a wafer 151 and a gripping assembly 1020. The catch cup comprises a wall 1013 which has an annular inner surface 1014 including a portion which defines a processing region, and has an angled portion which is a symmetric about a center axis of the wafer gripping device. The gripping assembly comprises: a first plate assembly 1022; a second plate assembly 1024; a plurality of gripping pins; and a plurality of loading pins. Each gripping pin grips the wafer during a cleaning processing, and each loading pin grips the wafer in a filling and fetching out processing. The cleaning module further comprises a sweep arm 230 coupled to a nozzle mechanism 240 delivering liquid to the front side and the back side of the wafer.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] Field

[0001] Embodiments of the present disclosure relate generally to apparatus and methods for cleaning processed wafers, and more particularly to non-contact cleaning systems and methods for processing wafers.

[0002] 2. Description of Related Art In various instances, wafers are cleaned to remove any contamination from the wafers before they are processed for use in electrical devices. In one or more embodiments, cleaning methods such as chemical buffing and / or brush scrubbing are utilized to clean the wafers. However, these cleaning methods may result in redeposition of particles onto the wafer after the corresponding cleaning process. For example, the contact medium for these cleaning processes (e.g., buff passes and / or cleaning brushes) may be a source of contamination. The particles may result in wafers that cannot support processing to include analog, logic, and / or advanced memory applications. As a result, the yield of processed wafers will be adversely affected.

[0003] Therefore, there is a need for an improved cleaning process that can be used to remove particles from cleaned wafers prior to further processing of the wafers. Summary of the Invention

[0004] In one embodiment, the cleaning module includes a wafer gripping device. The wafer gripping device is configured to support a wafer in a vertical orientation and includes a capture cup and a gripping assembly. The capture cup includes a wall having an annular inner surface. The annular inner surface defines a processing region and has an angled portion symmetrical about a central axis of the wafer gripping device. The gripping assembly includes a first plate assembly, a second plate assembly, gripping pins, and a loading pin. The gripping pins are of the second plate assembly and the loading pins are of the first plate assembly. The gripping assembly is configured to be positioned in a loading position, a rinsing position, and a cleaning position. When in the cleaning position, the gripping assembly is disposed within the processing region. Further, when the gripping assembly is in the loading position, the gripping pins are a first distance from a center of the gripping assembly, and when the gripping assembly is in the cleaning position, the gripping pins are a second distance from the central axis of the wafer gripping device. The first distance is greater than the second distance. Additionally, when the gripper assembly is in the load position and the clean position, the load pin is each a third distance from the central axis.

[0005] In one embodiment, a method for cleaning a wafer in a cleaning module including a wafer gripping device includes moving a first plate assembly of the gripping assembly away from a second plate assembly of the gripping assembly toward an annular inner surface of a capture cup of the wafer gripping device and positioning the gripping assembly in a load position. The wafer is vertically received by a plurality of load pins of the first plate assembly. Further, moving the first plate assembly away from the second plate assembly positions the plurality of gripping pins of the second plate assembly a first distance from a central axis of the wafer gripping device. Additionally, the annular inner surface has an angled portion symmetrical about the central axis, the annular inner surface defining a processing area. The method further includes moving the first plate assembly away from the annular inner surface toward the second plate assembly and positioning the gripping assembly in a cleaning position. Additionally, the plurality of gripping pins are positioned at a second distance from the central axis to grip the wafer in response to moving the first plate assembly of the gripping assembly toward the second plate assembly, the first distance being greater than the second distance. Additionally, the method includes simultaneously rotating the gripping assembly, the capture cup and the wafer during the cleaning process.

[0006]

[0006] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above may be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the present disclosure is open to other equally effective embodiments, and therefore the accompanying drawings illustrate only typical embodiments of the present disclosure, and should not be considered as limiting its scope. [Brief description of the drawings]

[0007] [Figure 1] 1 shows a schematic top view of a chemical mechanical polishing system in accordance with one or more embodiments. [Figure 2A]

[0008] 2 is a schematic cross-sectional side view of a cleaning module according to one embodiment; [Figure 2B]

[0009] 1 illustrates a schematic diagram of a cleaning module according to one or more embodiments. [Figure 3A]

[0010] 1 is a schematic cross-sectional side view of a wafer gripping apparatus according to one or more embodiments. [Figure 3B] 1 is a schematic cross-sectional side view of a wafer gripping apparatus according to one or more embodiments. [Figure 3C]

[0011] 1 illustrates a gripper assembly according to one or more embodiments. [Figure 3D] 1 illustrates a gripper assembly according to one or more embodiments. [Figure 3E] 1 illustrates a gripper assembly according to one or more embodiments. [Figure 3F]

[0012] 1 illustrates a gripper assembly according to one or more embodiments. [Figure 3G] 1 illustrates a gripper assembly according to one or more embodiments. [Figure 4]

[0013] 1A and 1B show various nozzle mechanisms according to one or more embodiments. [Diagram 5] 1 illustrates various nozzle mechanisms according to one or more embodiments. [Figure 6]

[0014] FIG. 1 illustrates a schematic diagram of a sweep arm according to one or more embodiments. [Figure 7A]

[0015] 1 illustrates air flow within a cleaning module according to one or more embodiments. [Figure 7B]

[0016] 1 illustrates a partial schematic view of a drainage hole according to one or more embodiments. [Figure 8]

[0017] 1 illustrates a method for cleaning a wafer according to one or more embodiments. [Figure 9A]

[0018] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. [Figure 9B] 1 is an example of a wafer gripping apparatus according to one or more embodiments. [Figure 9C] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. [Figure 9D] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. [Figure 10]

[0019] 1 is a schematic cross-sectional side view of a cleaning module according to one or more embodiments. [Figure 11]

[0020] 1 is a schematic cross-sectional side view of a wafer gripping apparatus according to one or more embodiments. [Figure 12A]

[0021] 1 illustrates a diagram of a gripper assembly according to one or more embodiments. [Figure 12B] 1 illustrates a diagram of a gripper assembly according to one or more embodiments. [Figure 13]

[0022] 1 illustrates a method for cleaning a wafer according to one or more embodiments. [Figure 14A]

[0023] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. [Figure 14B] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. [Figure 14C] 1 illustrates an example of a wafer gripping apparatus according to one or more embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008]

[0024] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation thereto.

[0009]

[0025] The embodiments of the present disclosure generally relate to improved cleaning systems and methods for removing particles from processed wafers. In various instances, wafer cleaning is performed by chemical buffing and / or brush scrubbing. However, in such instances, the wafer may suffer from particle redeposition after either the chemical buffing and / or brush scrubbing process. Particles that redeposit on the wafer, even if loosely attached to the wafer and relatively small in size (e.g., about 50 nm or less), may create defects in devices formed on the wafer, thereby preventing the wafer from being fabricated to meet front-end logic and advanced memory devices. As a result, the yield of processed wafers will be adversely affected. Thus, a new cleaning method capable of removing redeposited particles is needed. For example, the following description describes a system and method for a non-contact cleaning method that can be utilized to remove residual particles on a wafer after a chemical buffing and / or brush scrubbing cleaning process.

[0010]

[0026] FIG. 1 illustrates a top view of one embodiment of a chemical mechanical planarization ("CMP") system 100. The CMP system 100 includes a factory interface 102, a cleaner 104, and a polishing module 106. A robot 111 is provided to transport wafers 151 between the factory interface 102 and the polishing module 106. The robot 111 may also be configured to transfer wafers between the polishing module 106 and the cleaner 104. The factory interface 102 includes a robot 110 configured to transport wafers (e.g., wafers 151) between one or more cassettes 114 and one or more transfer platforms 116. Additionally, the robot 110 is configured to receive wafers from the cleaner 104 and return the cleaned and polished wafers to the storage cassette 114.

[0011]

[0027] The polishing system 100 includes a polishing module 106 that at least partially supports and houses a plurality of polishing stations 124a-124d and load cups 123a-123b. Each polishing station 124 is adapted to polish a substrate held within a carrier head configured to transport a wafer 151 within a carrier head assembly that translates along an overhead track 128. The carrier head assembly 119 is moved along the track 128 by a carrier motor attached to a carriage 108. The carriage 108 generally includes structural elements that can guide the carrier head assembly 119 along the overhead track 128 and facilitate control of its position. Additionally, the polishing module 106 also includes a loading station 122 for loading and unloading a substrate from the carrier head. Each polishing station 124 includes a platen 120 that is rotated during wafer polishing. Additionally, each polishing station 124 utilizes a pad and a polishing fluid for polishing a wafer (e.g., wafer 151).

[0012]

[0028] A controller 190, such as a programmable computer, is connected to and configured to operate the elements of the polishing module 106. For example, the controller 190 can control the loading, unloading, and polishing of the wafer 151 by the polishing module 106.

[0013]

[0029] The controller 190 may include a central processing unit (CPU) 192, a memory 194, and supporting circuits 196, such as input / output circuits, power supplies, clock circuits, caches, and the like. The memory 194 is connected to the CPU 192. The memory is a non-transitory computable readable medium and may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or other forms of digital storage. In addition, although shown as a single computer in the figures, the controller 190 may be a distributed system, including, for example, multiple independently operating processors and memories. This architecture is adaptable to various polishing situations based on the programming of the controller 190 to control the sequence and timing of when the carrier heads are positioned at the polishing stations.

[0014]

[0030] The polishing system 100 further includes at least one of a megasonic cleaning module 161, a pre-cleaning module 162, a brush box cleaning module 164, a final cleaning module 166, and a drying tank 168. In addition, FIG. 1 may include an input shuttle module. In one embodiment, the megasonic cleaning module 161, the pre-cleaning module 162, the brush box cleaning module 164, the final cleaning module 166, and the drying tank 168 each include a pair of processing chambers positioned side-by-side in the Y direction. The two final cleaning modules 166 each include a cleaning module, which will be described in more detail herein. As shown, the cleaning module 166 can be used as the last cleaning step, e.g., the final cleaning module. In other embodiments, one or more cleaning modules are positioned between the cleaning module 166 and the drying tank 168. Furthermore, in one or more embodiments, one or more of the modules can be omitted.

[0015]

[0031] 2A illustrates a schematic cross-sectional view of a non-contact cleaning module 200 according to one or more embodiments. The cleaning module 200 can receive a wafer to be cleaned, e.g., wafer 151, after being cleaned in one or more of the megasonic cleaning module 161, pre-cleaning module 162, brush box cleaning module 164, and before the wafer is placed in a corresponding Marangoni drying tank (e.g., drying tank 168). Furthermore, in various embodiments, the cleaning module 200 can be located anywhere within a wafer cleaning cycle and / or edge / bevel cleaning process. The cleaning module 200 can be utilized to remove contamination from a wafer that would otherwise cause the corresponding wafer to not meet quality standards and be discarded.

[0016]

[0032] The cleaning module 200 includes a wafer gripper 203, a sweep arm 230, a nozzle assembly 240, a plenum 280, an exhaust 260, a spray bar 290, a drain 284, and an air intake 270. The cleaning module 200 may further include a sensing device 294.

[0017]

[0033] The wafer gripping device 203 is configured to support (e.g., hold) the wafer 151 in a vertical orientation. For example, the wafer gripping device 203 is configured to support the wafer 151 in a vertical orientation perpendicular to the rotation axis 216. The wafer gripping device includes a capture cup 210 and a gripping assembly 220. The capture cup 210 can include a first capture cup 211 and a second capture cup 212. The first capture cup 211 can be coupled to the second capture cup 212. For example, the first capture cup 211 can be coupled to the second capture cup 212 via one or more bolts. One or more of the first capture cup 211 and the second capture cup 212 can include one or more threaded portions configured to receive a threaded bolt. Alternatively, the capture cup 210 includes a single capture cup. For example, the capture cup 210 can be formed from a single continuous piece of material.

[0018]

[0034] The catch cup 210 includes a wall 213 having an annular inner surface 214. The annular inner surface 214 defines a processing volume 297 within the wafer gripper 203. The annular inner surface 214 has an angled portion symmetrical about a central axis of the wafer gripper 203. For example, the wafer 151 may be cleaned within the processing volume 297. Additionally, the annular inner surface 214 has an angled portion symmetrical about an axis of rotation 216.

[0019]

[0035] The gripping assembly 220 holds the wafer 151 while a cleaning fluid is applied to the wafer 151 for cleaning. The gripping assembly 220 is described in further detail with reference to Figure 3A and the corresponding description.

[0020]

[0036] The cleaning fluid may be applied to the front side of the wafer by a nozzle mechanism 240 and to the back side of the wafer through an opening 225 coupled to a fluid source 223 formed in a shaft 224 while the gripper assembly 220 and catch cup 210 are rotated. The shaft 224 may include one or more tubes configured to deliver the cleaning fluid to the wafer 151.

[0021]

[0037] The drive motor 222 may be coupled to the gripper assembly 220 via a shaft 224. The drive motor 222 rotates the gripper assembly 220 and the catch cup 210 about the axis of rotation 216. Additionally, the drive motor 222 may impart horizontal motion to the gripper assembly 220 along the axis of rotation 216. The drive motor 222 may include a first motor configured to control the rotation of the gripper assembly 220 and the catch cup 210 and a second motor configured to control the horizontal motion of the gripper assembly 220. The first motor may also be referred to as a rotary motor and the second motor may also be referred to as a linear actuator. Additionally, the second motor may be one of a hydraulic motor, a pneumatic motor, an electromechanical motor, and a magnetic motor. The horizontal motion is generally an axial motion or a motion in a direction parallel to the axis of rotation 216. In one embodiment, the horizontal motion corresponds to the X-direction motion shown by FIG. 3A. Further, the horizontal movement of the gripper assembly 220 may be independent of the movement of the catch cup 210. In addition, the gripper assembly 220 and the catch cup 210 may be configured to rotate together (e.g., simultaneously).

[0022]

[0038] A sweep arm drive motor 234, as described further below, may be coupled to the sweep arm shaft and configured to move the sweep arm 230 in an arcuate path parallel to the surface of the wafer 151. The sweep arm 234 may include one or more tubes for delivering fluid to the nozzle mechanism 240.

[0023]

[0039] The lid 202 may cover an opening formed in a wall (e.g., an enclosure wall) 283 and provide access to an interior volume 295 of the cleaning module 200 for inserting and removing the wafer 151 from the cleaning module 200. When the lid 202 is in a closed position, the interior volume 295 of the cleaning module 200 may be referred to as an isolated environment. For example, when the lid 202 is closed, the interior volume 295 of the cleaning module 200 is isolated from the outside environment such that fumes and liquids generated and / or used during cleaning of the wafer 151 do not escape the cleaning module 200 during the cleaning process. Any fumes and cleaning fluids used and / or generated during the cleaning process are removed from the cleaning module 200 in a controlled manner via the exhaust 260 and / or drain 284.

[0024]

[0040] The spray bar 290 can apply a pre-treatment fluid to the wafer 151 when the wafer 151 is inserted into the cleaning module 200 and / or rinse the wafer 151 with a rinsing fluid when the wafer 151 is removed from the cleaning module 200. In one embodiment, the spray bar 290 can be utilized to apply a fluid to the wafer 151 while the wafer 151 is in a load or unload position. Pre-treatment and / or rinsing of the wafer 151 can help remove undesirable particles from the surface of the wafer 151. For example, rinsing the wafer 151 while it is removed from the cleaning module 200 can help remove loose particles from the surface of the wafer 151 and also help prevent the removed particles from re-adhering to the surface of the wafer 151.

[0025]

[0041] The drain 284 may be utilized to remove excess water from the cleaning module 200. In one embodiment, the drain 284 removes excess cleaning fluid from the cleaning module 200 during the cleaning process.

[0026]

[0042] Air may be supplied to the plenum 280 by the air intake 270 and exhausted from the cleaning module 200 by the exhaust 260. The air intake 270 and plenum 280 may be positioned at the front of the cleaning module 200 and the exhaust 260 may be positioned at the rear of the cleaning module 200. Additionally, the plenum 280 and the exhaust 260 may be configured to control the flow of air inside the cleaning module 200 to prevent particles from redepositing on the surface of the wafer 151. The positions of the exhaust 260 and the air intake 270 may be reversed, with the exhaust 260 positioned at the front of the cleaning module 200 and the air intake 270 positioned at the rear of the cleaning module 200.

[0027]

[0043] An interior volume 295 of the cleaning module 200 may be defined between the capture cup 210 and a wall (e.g., an outer enclosure wall) 283. A wafer (e.g., wafer 151) may be inserted into the interior volume 295 when the cleaning module 200 is loaded and removed from the interior volume 295 when the cleaning module 200 is removed.

[0028]

[0044] The sensing device 294 can detect the wafer 151 inside the cleaning module 200. For example, the sensing device 294 can detect the wafer 151 inside the interior volume 295. Additionally, the sensing device 294 can detect the wafer 151 while the wafer 151 is being held by the gripper assembly 220. The sensing device 294 can detect when the wafer 151 is properly or improperly loaded into the gripper assembly 220. Additionally, the sensing device 294 can detect when the wafer 151 has been dropped or dislodged from the gripper assembly 220. The sensing device 294 can further determine when the wafer 151 is inserted into and removed from the cleaning module 200.

[0029]

[0045] In one or more embodiments, the controller 190 can control the function of the cleaning module 200. For example, the controller 190 can control the functionality of at least the gripper assembly 220, the spray bar 290, the sweep arm 230, the nozzle mechanism 240, the exhaust 260, and / or the sensing device 294.

[0030]

[0046] 2B shows the exterior of two cleaning modules, for example, cleaning modules 200 and 201. In some embodiments, cleaning module 201 includes the same components as cleaning module 200, as shown in FIGS. 2A-2B.

[0031]

[0047] A cleaner (e.g., cleaner 104) can include one or more cleaning modules (e.g., one or more of cleaning modules 200 and 201). For example, cleaner 104 can include cleaning module 200, and cleaning module 201 can be omitted. Alternatively, cleaner 104 can include both cleaning modules 200 and 201. Additionally, cleaner 104 can include more than two cleaning modules.

[0032]

[0048] The cleaning modules 200 and 201 may include one or more inlet connections 292. The inlet connections 292 provide a path for cleaning fluid to be provided inside the cleaning modules 200 and 201 during a cleaning process. The cleaning fluid may be provided to the nozzle assembly 240, to tubes on a sweep arm along the nozzle assembly 240, to the fluid source 223, and / or to the spray bar 290. Additionally, the cleaning modules 200 and 201 may include a power cable connection 293 configured to couple to a power cable external to the cleaning modules 200 and 201.

[0033]

[0049] 2B additionally shows lid 202 of cleaning module 200 and lid 204 of cleaning module 201. During a wafer loading process, lids 202 and 204 are opened so that a wafer (e.g., wafer 151) may be inserted into each of the respective cleaning modules 200, 201. Additionally, during a wafer extraction process, lids 202 and 204 are opened so that a wafer (e.g., wafer 151) may be extracted from each of the respective cleaning modules 200, 201. In one or more embodiments, lids 202 and 204 are closed to seal cleaning modules 200 and 201 during a cleaning cycle.

[0034]

[0050] 2B, the cleaning modules 200 and 201 are positioned such that the wafer 151 is in a vertical orientation during the cleaning process. However, in other embodiments, other orientations may be used. Additionally, each of the cleaning modules 200 and 201 may be configured to operate as a single module, as dictated by the architecture of the cleaner (104).

[0035]

[0051] Figure 3A illustrates an exemplary embodiment of the wafer gripping device 203. As illustrated, the wafer gripping device 203 includes the gripping assembly 220 and catch cup 210 shown in Figure 2A. The gripping assembly 220 is positioned within the processing volume 297 during at least a cleaning cycle.

[0036]

[0052] The gripper assembly 220 includes a first plate assembly 318, a second plate assembly 320, a load pin 311, and a gripper pin 315. The gripper assembly 220 is coupled to a shaft 224 that may be driven by a drive motor 222 to rotate the first plate assembly 318 and the second plate assembly 320 during a cleaning cycle of a cleaning process. Furthermore, the shaft 224 may be driven to move the first and second plate assemblies 318, 320 into and out of a load position, an unload position, a rinse position, and a cleaning position. Furthermore, cleaning fluid may flow through the shaft 224 to be applied to the backside of the wafer 151 through the apertures 351 of the first plate assembly 318 during the cleaning process. In one embodiment, the shaft 224 may be a splined shaft that allows the gripper assembly 220 to rotate while the shaft 224 translates in the +X and -X directions.

[0037]

[0053] The gripping pins 315 can grip or hold the wafer 151 during the cleaning process. The gripping pins 315 can include a shaped area configured to receive the wafer 151. For example, the gripping pins 315 can include a notched area shaped to receive an edge of the wafer 151. Furthermore, the gripping pins 315 can be housed within the second plate assembly 320. Additionally or alternatively, the gripping pins 315 can be coupled to the second plate assembly 320. The gripping pins 315 can be disposed at approximately 120° from each other. Alternatively, the gripping pins 315 can be oriented at an angle less than 120° from each other or more than 120° from each other. Furthermore, the total number of the gripping pins 315 can be one or more. Alternatively, the total number of the gripping pins 315 is two or more. Furthermore, the total number of the gripping pins 315 is three or more. The gripping pins 315 can pass through openings within the first plate assembly 318 so that the gripping pins 315 can grip or hold the wafer 151 during the cleaning cycle. The gripping pins 315 can have minimal contact with the wafer 151 along the edges of the wafer 151 so that the gripping pins 315 do not interfere with the cleaning process of the wafer 151.

[0038]

[0054] The loading pins 311 can grip or hold the wafer 151 during the loading and / or unloading process. Additionally, the loading pins 311 are coupled to the first plate assembly 318. When the gripping assembly 220 is moved between the cleaning position and the loading or unloading position, the loading pins 311 move with the first plate assembly 318. The loading pins 311 may include a shaped area configured to receive the wafer 151. For example, the loading pins 311 may include a notched area shaped to receive an edge of the wafer 151. The loading pins 311 can be configured to have minimal contact with the wafer 151 along the edge of the wafer 151 such that the loading pins 311 do not interfere with the cleaning process of the wafer 151. The loading pins 311 can be positioned at approximately 120° from each other. Alternatively, the loading pins 311 may be oriented at an angle less than 120° from each other or more than 120° from each other. Additionally, the total number of loading pins 311 can be one or more, two or more, or three or more.

[0039]

[0055] The number of gripping pins 315 and loading pins 311 may be the same. Alternatively, the number of gripping pins 315 may exceed the number of loading pins 311. Additionally, the number of gripping pins 315 may be less than the number of loading pins 311.

[0040]

[0056] The first plate assembly 318 and the loading pins 311 can be utilized during the wafer loading process. Additionally, the second plate assembly 320 and the gripping pins 315 are positioned so as not to interfere with the wafer during the loading process. For example, the first plate assembly 318 can be moved relative to the second plate assembly 320 to position the first plate assembly 318 outside the first capture cup 211 and position the gripping pins 315 in the loading position. Additionally, the distance between the gripping pins 315 and the center of the gripping assembly 220 is increased. Additionally, the gripping pins 315 can be positioned behind the loading pins 311 to provide a clear path for vertically loading and / or unloading the wafer 151 onto the loading pins 311.

[0041]

[0057] The wall 213 of the capture cup 210 is shaped to interact with one or more of the second plate assembly 320 and / or the gripping pins 315. The wall 213 can be part of the capture cup 210 as described above, and the annular wall can be part of the first capture cup 211. The wall 213 includes at least one angled portion such that it can interact with the feature 312 of the second plate assembly 320. Additionally, the wall 213 helps guide moisture from the wafer 151 to the drain 284, reducing particle redeposition on the wafer 151 during the cleaning process. For example, when the gripping assembly 220 is in the wafer loading position, the feature 312 interacts with the wall 213 such that the first plate assembly 318 can move relative to the second plate assembly 320, as described in more detail below.

[0042]

[0058] Additionally, the catch cup 210 can include an opening 331. The diameter of the opening 331 can be large enough to allow the passage of the first plate assembly 318, but not large enough to allow the passage of the second plate assembly 320. For example, the diameter of the opening 331 is larger than the first plate assembly 318 and smaller than the second plate assembly 320.

[0043]

[0059] The capture cup 210 may include drain holes 262 positioned in an array along the edge of the capture cup 210 so that moisture flows into the drain 284 while the wafer 151, gripper assembly 220, and capture cup 210 are rotated by the drive motor 222. Additionally, the second capture cup 212 may include a drain hole. Moisture flows through drain hole 370 into the drain 284 (FIG. 2A) where it is removed from the cleaning module 200.

[0044]

[0060] As illustrated in FIG. 3A, the gripper assembly 220 includes a first plate assembly 318 and a second plate assembly 320 configured to move relative to one another to receive the wafer 151 and aid in placing the wafer 151 in a cleaning position. Specifically, FIGS. 3C and 3D show an embodiment of the gripper assembly 220 in a retracted (e.g., cleaning) position 300a and an extended position 300b, respectively. The gripper assembly 220 can be positioned in the retracted position 300a during a cleaning process. Additionally, the gripper assembly 220 can be positioned in an extended position (e.g., load position) 300b during a wafer loading process and / or a wafer removal (removal) process. Additionally, the extended position 300b may correspond to a load position of the gripper assembly 220 within the cleaning module 200. The load / removal position may serve as a rinsing position for the wafer 151. For example, when positioned in the load / unload position for rinsing, deionized water and / or other cleaning chemistries can be delivered from the upper spray bar 290 onto the wafer 151. Additionally, when the gripper assembly 220 is in the load position, the gripper assembly 220 is positioned a distance in the X direction from where the gripper assembly 220 is positioned in the cleaning position. In one embodiment, the coupling surface 301 of the first plate assembly 318 is coupled to and driven by the shaft 224.

[0045]

[0061] One or more spring mechanisms 330 can couple the first plate assembly 318 to the second plate assembly 320. The spring mechanisms 330 can include a spring 331 and a coupling member 333. The spring mechanisms 330 allow the first plate assembly 318 to move relative to the second plate assembly 320 when the feature (or element) 312 contacts the first capture cup 211. For example, the second plate assembly 320 includes a feature 312 configured to interact with the wall 213 as the gripping assembly 220 moves in the positive X direction (e.g., horizontally toward the first capture cup 211). In one embodiment, each of the spring mechanisms 330 can include one or more springs 331 that move on or parallel to the coupling member 333.

[0046]

[0062] The gripping pins 315 can be configured to move relative to at least one other pin. For example, the gripping pins 315 can include one or more elements that move the gripping pins 315 away from one or more of the other pins. The gripping pins 315 can be configured to grip a wafer (e.g., wafer 151) during a cleaning process. Additionally, the load pins 311 can be configured to grip or hold the wafer 151 during loading and unloading processes. In other embodiments, the gripping pins 315 can be moved to hold the wafer relative to the load pins.

[0047]

[0063] The gripping assembly 220 may also include a guide pin 317 configured to limit the angular movement of the second plate assembly 320 relative to the first plate assembly 318 .

[0048]

[0064] In one or more embodiments, each gripping pin 315 can be coupled to an element 380 configured to contact the housing of the first capture cup 211, which imparts a translational motion to one or more of the gripping pins 315. For example, when the gripping assembly 220 is moved in the +X direction in response to the element 380 contacting the first capture cup 211, the gripping pins 315 pivot about the axis 302 and are moved toward the outer edge of the gripping assembly 220. FIG. 3B illustrates an exemplary embodiment in which the element 380 is in a closed position just after contacting the first capture cup 211. In one embodiment, when the gripping assembly 220 is moved in the +X direction, the element 380 contacts the first capture cup 211 and pivots about the axis 302. In response, a translational motion is imparted to the gripping pins 315 coupled to the element 380. In one embodiment, the element 380 continues to pivot until the gripping assembly 220 stops moving in the +X direction. In one embodiment, element 380 and gripping pin 315 are positioned in the open position after movement of gripping assembly 220 in the +X direction has stopped.

[0049]

[0065] Additionally, element 380 can be coupled to a spring element 381. Spring element 381 can further return element 380 to the starting position and move gripping pin 315 to the gripping position in response to element 380 no longer contacting the housing of first catch cup 211. Spring element 381 can load element 380 such that element 380 returns to the starting position when element 380 no longer contacts the housing of first catch cup 211. Additionally, spring element 381 can be a leaf spring or any other spring design.

[0050]

[0066] The loading pins 311 and gripping pins 315 can be configured to hold the wafer 151 so that the wafer 151 does not contact the first plate assembly 318 of the gripping assembly 220. Additionally, the position of the wafer 151 relative to the first capture cup 211 can be adjustable during a cleaning cycle.

[0051]

[0067] FIG. 3F illustrates an embodiment of the gripping pin 315 and element 380 in a closed position, with end 380a not in contact with the first capture cup 211. FIG. 3G illustrates the element 380 and gripping pin 315 in an open position. In the embodiment illustrated in FIG. 3G, end 380a of element 380 is in contact with the first capture cup 211. Additionally, element 380 has pivoted such that end 380b of element 380 has moved relative to end 380a. In one embodiment, end 380b has been rotated toward the top surface of the second plate assembly 320. Additionally, gripping pin 315 has also been moved to angle outward toward the first capture cup 211.

[0052]

[0068] 3C, the gripping assembly 220 further includes one or more apertures 351. In one or more embodiments, a cleaning fluid can flow through the aperture(s) 351 and onto the backside of the wafer 151. The cleaning fluid can be a rinsing agent (e.g., deionized water, ozonated water) or a cleaning chemistry. Further, the cleaning fluid can be supplied via the shaft 224 and then to the apertures 351.

[0053]

[0069] 3E shows a schematic partial plan view of the gripper assembly 220. The aperture(s) 351 direct the chemical agent to the backside of the wafer 151. The aperture(s) 351 may be arranged in a substantially circular or linear pattern. Each of the apertures 351 may be substantially the same size such that the cleaning fluid flows evenly across the backside of the wafer 151. Additionally, at least one aperture 351 may be a different size than at least one other aperture.

[0054]

[0070] FIG. 4A is a bottom view of nozzle mechanism 240 attached to sweep arm 230. As shown, nozzle mechanism 240 includes nozzle 410, nozzle 420, and nozzle 430. Alternatively, one or more of nozzle 420 and nozzle 430 may be omitted. Furthermore, nozzle mechanism 240 may include four or more nozzles. Nozzle 410 may be disposed at a first angle (e.g., angle 412 in FIG. 4B) relative to the surface of wafer 151, nozzle 420 may be disposed at a second angle (e.g., angle 422 in FIG. 4B) relative to the surface of wafer 151, and nozzle 430 may be disposed at a third angle (e.g., angle 432 in FIG. 4B) relative to the surface of wafer 151 or the surface of first plate assembly 318. Angle 412 may be different from at least one of angles 422 and 432. Furthermore, angles 422 and 432 may be substantially similar. In some configurations, the nozzle 410 may be disposed at an angle (e.g., angle 412) relative to the surface of the wafer that is smaller than the angles (e.g., 422 and 432) at which the nozzles 420 and 430 are disposed relative to the surface of the wafer. In some configurations, the angle 412 may be about 30° to about 50° relative to the surface of the first plate assembly 318 or the wafer 151, and the angles 422 and 432 are about 80° to about 100° relative to the surface of the wafer 151 or the surface of the first plate assembly 318. In one embodiment, the angle 412 is about 45° relative to the surface of the wafer 151 or the surface of the first plate assembly 318, and the angles 422 and 432 are about 90° (or perpendicular) relative to the surface of the wafer 151 or the surface of the first plate assembly 318. Additionally, other angles may be utilized. Additionally or alternatively, the angles 412, 422, and 432 may each be between about 80° and about 100°. Further, the position of each of the nozzles 410, 420, and / or 430 can be adjusted along the length of the sweep arm 230 to target a specific radial location on the wafer. Additionally, the angle and position for each nozzle can be selected such that the cleaning fluids output by each nozzle work together to remove any contamination from the surface of the wafer 151.

[0055]

[0071] The nozzle mechanism 240 can be configured to output a cleaning medium onto the first surface of the wafer 151 via the nozzles 410, 420, and 430. The cleaning medium can include a rinsing agent and a cleaning chemistry. Further, the nozzle mechanism 240 is configured to output a first cleaning medium via the nozzle 410, a second cleaning medium via the nozzle 420, and a third cleaning medium via the nozzle 430. In addition, one or more of the nozzles 410, 420, and 430 are configured to apply one or more rinsing agents.

[0056]

[0072] The nozzle mechanism 240 may include one or more non-contact cleaning techniques. The nozzles 410, 420, and 430 may output a medium that is any combination of liquid, gas, and particles. Additionally, one or more of the nozzles 410, 420, and 430 may be a high energy nozzle configured to output a high energy medium. The high energy medium may be any combination of liquid, gas, and particles. Additionally, the high energy medium may be a high energy cleaning chemical agent. One or more of the nozzles 410, 420, and 430 may be a megasonic nozzle, a fluid jet nozzle, or a kinetic energy nozzle. For example, the nozzle 410 is one of a megasonic nozzle, a jet nozzle, and a kinetic energy nozzle configured to deliver a mixture of gas and liquid. The megasonic nozzle includes one or more elements configured to apply alternating compression and rarefaction to the cleaning fluid according to a sinusoidal or other pattern to generate a megasonic working fluid. For example, a megasonic nozzle may be configured to alternatively apply compression and rarefaction in a sinusoidal pattern at a rate of 950 kHz to generate a megasonic working fluid. Alternatively, other frequencies may be used.

[0057]

[0073] Nozzle 420 is configured to apply a first chemical agent and nozzle 430 is configured to apply a rinsing agent. Further, when nozzle 410 is a megasonic nozzle, nozzle 420 is configured to apply a first chemical agent and nozzle 430 is configured to apply a second chemical agent. Alternatively, when nozzle 410 is a megasonic nozzle, nozzle 420 is configured to apply a first rinsing agent and nozzle 430 is configured to apply a second rinsing agent. Further, at least two of the nozzles are configured to apply the same rinsing agent or chemical agent.

[0058]

[0074] The cleaning fluid can be provided to the nozzle mechanism 240 via fluid connections 440. The number of connections can be based on the number of nozzles within the nozzle mechanism and / or the number of different types of chemicals and / or rinsing agents utilized by the nozzle mechanism 240. For example, if the nozzle mechanism 240 uses three nozzles configured to output two different cleaning fluids, two connections 440 can be utilized. Additionally, the flow rates of the different cleaning and / or rinsing agents through the different nozzles can be varied. For example, the flow rate of the cleaning or rinsing agent from a first one of the nozzles 410, 420, and 430 can be different than the flow rate of the cleaning or rinsing agent from a second one of the nozzles 410, 420, and 430. Alternatively, the flow rate of the cleaning or rinsing agent from at least one of the nozzles 410, 420, and 430 can be changed during the cleaning and / or rinsing process.

[0059]

[0075] 4 shows three separate nozzles, other numbers of nozzles may be utilized in other embodiments, for example, four or more nozzles may be utilized, and further, fewer than three nozzles may be utilized.

[0060]

[0076] Figure 5 shows an alternative embodiment of nozzle mechanism 240. Compared to the embodiment of Figure 4, instead of having all of the connections 440 connect to a common side of nozzle mechanism 240, a first connection 442 connects to a first side of nozzle mechanism 240 and a second connection 444 connects to a second side of nozzle mechanism 240, the first side being different from the second side.

[0061]

[0077] 2A, the sweep arm 230 is coupled to a sweep arm shaft 232 and a sweep arm drive motor 234. The sweep arm shaft 232 and the sweep arm drive motor 234 form a sweep arm drive assembly 236. The sweep arm drive assembly 236 is configured to move the nozzle mechanism 240 over the surface of the wafer 151 during the cleaning process such that the cleaning fluid output by the nozzle mechanism 240 is evenly distributed across the surface of the wafer 151. The sweep arm drive assembly 236 is also configured to move the sweep arm 230 axially to set the distance between the nozzle mechanism 240 and the surface of the wafer 151.

[0062]

[0078] FIG. 6 illustrates a path 610 of the sweep arm 230 and the nozzle mechanism 240 over the wafer 151 during a cleaning cycle, according to one or more embodiments. As illustrated in FIG. 6, the wafer 151 is positioned above and held by the gripper assembly 220. The path 610 may be an arcuate path parallel to the device-side surface (front surface) of the wafer 151. Alternatively, paths of other shapes and / or lengths may be utilized. For example, the range of motion of the sweep arm 230 may be altered. As illustrated in FIG. 6, the nozzle mechanism 240 coupled to the end of the sweep arm 230 passes over the center of the wafer in an arcuate path. The position of the sweep arm 230 and / or the nozzle mechanism 240 may be adjusted to ensure that the nozzle mechanism 240 passes over the center of the rotating wafer 151 during processing. Additionally, at least one of the position of the sweep arm 230 and the position of the nozzle mechanism 240 may be adjusted to ensure that the nozzle mechanism 240 passes over a portion of the wafer 151 other than the center of the wafer 151. For example, the nozzle mechanism 240 can be moved relative to the sweep arm 230 and / or the sweep arm 230 can be moved relative to the sweep arm shaft 232 to change the position of the nozzle mechanism 240 relative to the surface of the wafer 151. Additionally, the axial distance between the nozzle mechanism 240 and the surface of the wafer 151 can be altered to aid in the cleaning process.

[0063]

[0079] The sweep arm drive motor 234 moves the sweep arm shaft 232, which in turn moves the sweep arm 230 and nozzle mechanism 240 over the wafer 151 during the cleaning process. The sweep arm drive motor 234 can control the scanning speed of the nozzle mechanism 240. For example, the sweep arm drive motor 234 can control the speed at which the nozzle mechanism is scanned along the path 610.

[0064]

[0080] FIG. 6 further illustrates the spray bar 290. The spray bar 290 can pre-treat the wafer 151 when the wafer is inserted into the cleaning module 200 and rinse the wafer 151 when the wafer is removed from the cleaning module 200. The spray bar 290 can include one or more nozzles configured to output one or more configured fluids. Alternatively, the spray bar 290 can include tubes with holes designed to maintain a uniform flow throughout the spray bar 290. For example, the spray bar 290 applies a rinsing fluid to the wafer 151 as it passes over the wafer 151 as it is transferred into and out of the cleaning module 200 to ensure that the wafer 151 remains wet during the transfer process and that particles do not redeposit on the wafer 151 when it is removed from the cleaning module 200.

[0065]

[0081] 7A illustrates an example of an airflow pattern within the cleaning module 200. As illustrated by this airflow pattern, recirculation is minimized as the airflow exits the plenum 280 and exits the exhaust 260. In general, the shape of the annular inner surface 214 of the wall 213 and the outer surface of the capture cup 210 aids in reducing air recirculation and capturing captured fluids exiting the surface of the wafer as it is rotated about the axis of rotation 313. In one embodiment, the annular inner surface 214 of the wall 213 has an inverted shape such that the airflow within the process volume 297 follows the outer edge of the gripper assembly 220 and enters the exhaust 260. Additionally, the outer surface of the capture cup 210 can be shaped such that the airflow within the interior volume 295 is around the outside of the capture cup 210 and enters the exhaust 260. Additionally, the outer surface of the capture cup 210 can be shaped such that the majority of the airflow necessarily travels around the outside of the capture cup 210 and enters the exhaust 260.

[0066]

[0082] One or more sides of the drain hole 262 can be angled such that the distance between the sides of the drain hole 262 is different. For example, the drain hole 262 can be tapered. Tapering the drain hole can increase the fluid pumping flow rate from the area inside the catch cup 210. Additionally, a labyrinth 264 can be formed between the catch cup 210 and the housing of the cleaning module 200. The labyrinth 264 can be configured to at least partially restrict moisture from flowing back through the labyrinth 264 into the interior volume 295.

[0067]

[0083] The plenum 280 can be configured to control airflow within the cleaning module 200 to minimize recirculation. For example, the plenum 280 can increase and / or decrease the amount of air entering the cleaning module 200 to minimize recirculation. Airflow recirculation can be minimized by the configurations of the catch cup 210, gripper assembly 220, plenum 280, exhaust 260, spray bar 290, drain 284, and air intake 270 disclosed herein.

[0068]

[0084] In one embodiment, a uniform airflow across the surface of the wafer 151 during the cleaning process is generated by the exhaust 260 and the plenum 280. In various embodiments, the exhaust 260 is configured to provide a path for air to exit the cleaning module 200 to prevent particles from redepositing on the surface of the wafer 151. As described above, air may be supplied to the plenum 280 by the air inlet 270 and exhausted from the cleaning module 200 by the exhaust 260. The plenum 280 may be a showerhead type plenum. Additionally, the geometry of the exhaust 260 and / or the shape of the catch cup 210 (or the shape of the first catch cup 211 and / or the second catch cup 212) may be optimized to reduce recirculation within the cleaning module 200. Reducing recirculation at least minimizes redeposition of particles and, if any, evaporated cleaning fluid onto the wafer 151. The geometry of the exhaust 260 and / or the shape of the catch cup 210 (or the shape of the first catch cup 211 and / or the second catch cup 212) can create a maze 264 behind the catch cup 210 to minimize recirculation. Additionally, the drain 284 provides a path for cleaning and rinsing fluids to be removed from the cleaning module 200 to minimize recirculation within the cleaning module 200. The plenum 280 can be positioned along a wall 283 of the cleaning module 200 such that the plenum 280 is positioned proximate to the nozzle assembly 240 and the wafer 151 is between the plenum 280 and the exhaust 260.

[0069]

[0085] 7B is a schematic top view of a portion of the gripping assembly 220, the apertures 351, and the drain holes 262, according to one or more embodiments. Each of the drain holes 262 is fluidly connected to a drain 284. Furthermore, as the gripping assembly 220, the capture cup 210, and the wafer 151 are rotated, fluid is forced through the drain holes 262 where it is removed from the cleaning module by the drain 284.

[0070]

[0086] The drain holes 262 can be positioned along the edge of the catch cup 210 (or second catch cup 212) such that moisture flows into the drain holes 262 during the cleaning process. The drain holes 262 can help remove moisture from the cleaning module 200 during the cleaning cycle to ensure that all particles dislodged from the surface of the wafer 151 during the cleaning process are removed from the cleaning module 200. In various embodiments, at least two drain holes 262 are utilized. In other embodiments, three or more drain holes 262 are utilized.

[0071]

[0087] The drain holes 262 can be configured to reduce air and / or fluid recirculation within the cleaning module 200. For example, the size and / or orientation of the drain holes 262 can be configured to reduce air and / or fluid recirculation. The drain holes 262 can have a slanted or angled orientation relative to a surface of the capture cup 210 (or second capture cup 212).

[0072]

[0088] In one embodiment, the drain 284 and / or the exhaust 260 may include one or more internal labyrinth seals that minimize the ingress of moisture into the exhaust hole (or port) 262 .

[0073]

[0089] The drain 284 can be utilized to remove excess moisture and / or any fluid from the cleaning module 200 upon completion of a cleaning cycle. In one embodiment, moisture flows into the drain 284 through the drain holes 262. For example, when the wafer 151 is rotated, the drain holes 262 are configured such that moisture does not collect on the wafer 151 but is removed via the drain 284. In one embodiment, one or more O-rings or other sealing members can be positioned where the drain 284 meets the cleaning module 200.

[0074]

[0090] 7B further shows exhaust holes 261 that are connected to the exhaust 260 and function to provide a path for air to flow within the processing volume 297, around the wafer 151, and through the exhaust 260. In one embodiment, the exhaust holes 261 help minimize recirculation within the cleaning module.

[0075]

[0091] FIG. 8 illustrates a method 800 for cleaning a wafer (e.g., wafer 151) according to one or more embodiments. In operation 810, the cleaning module is placed in a wafer loading position, as illustrated in FIG. 9A, which is described further below. For example, the lid 202 is opened, and the gripping assembly 220 of the cleaning module 200 is moved in a lateral direction (e.g., X direction) parallel to the rotation axis 216 toward the annular inner surface 214 of the wall 213 of the capture cup 210. Moving the gripping assembly 220 toward the wall 213 places the gripping assembly 220 in the loading position. In one embodiment, placing the gripping assembly 220 in the loading position includes moving the gripping assembly 220 via the shaft 224 and moving the drive motor 222 toward the wall 213 (e.g., operation 812). For example, the drive motor 222 drives the shaft 224 in a lateral direction that moves the gripping assembly 220 toward the wall 213 such that the feature 312 of the second plate assembly 320 of the gripping assembly 220 contacts the annular inner surface 214 of the wall 213. When the feature 312 contacts the wall 213, the movement of the second plate assembly 320 is stopped while the first plate assembly 318 continues to move such that at least a portion of the first plate assembly 318 is positioned within the interior volume 295. The first plate assembly 318 remains coupled to the second plate assembly 320 via the spring mechanism 330. For example, when the first plate assembly 318 moves in the positive X direction and the movement of the second plate assembly 320 stops, the spring mechanism 330 extends and maintains the coupling between the first plate assembly 318 and the second plate assembly 320.

[0076]

[0092] Each of the elements 380 is coupled to a respective one of the gripping pins 315, and when the elements 380 contact the wall 213, each of the gripping pins 315 tilt (or move) away from the movable pins relative to one another. For example, as shown in FIG. 9A, when the elements 380 contact the wall 213, the elements 380 pivot, tilting the gripping pins 315 away from the center of the gripping assembly 220 and moving them in an outward direction, which includes tilting the gripping pins 315 away from the other pins (e.g., the loading pin 311 and another one of the gripping pins 315) and moving the gripping pins 315 toward the outer edge of the gripping assembly 220 such that the separation distance between the gripping pins 315 increases.

[0077]

[0093] The gripper assembly 220 is positioned in the extended position 300b to receive the wafer 151 for cleaning and / or to remove the wafer 151 from the cleaning module 200 after a cleaning cycle is completed. For example, the gripper assembly 220 can be driven by the drive motor 222 and shaft 224 such that at least a portion of the first plate assembly 318 extends beyond the wall 213 of the catch cup 210 into the interior volume 295 and is in the extended position 300b.

[0078]

[0094] 9A illustrates an embodiment in which the gripper assembly 220 is positioned in a loading position. In the embodiment of FIG. 9A, the gripper pins 315 are moved outward and the first plate assembly 318 is spaced apart from the second plate assembly 320. Additionally, at least the loading pins 311 are outside the capture cup 210 and within the interior volume 295 such that a wafer 151 may be received on the loading pins 311 from the robot. In the loading position, the surface 301 of the first plate assembly 318 may be recessed from the wall 213 of the capture cup 210 within the processing volume 297, parallel to the outer edge of the wall 213, or may be outside the wall 213 of the capture cup 210 and within the interior volume 295. Alternatively, when in the loading position, the surface 301 may be parallel to the outer edge of the wall 213 or within the processing volume 297, and the loading pins 311 may be outside the wall 213 and within the interior volume 295.

[0079]

[0095] The controller 190 can provide commands to the drive motor 222 to move the shaft 224 laterally along the axis of rotation 313, FIG. 3A, to move the gripper assembly 220 laterally. Additionally, the controller 190 can receive indicia indicating that the cleaning module 200 is ready to receive a wafer for cleaning.

[0080]

[0096] In operation 820 of method 800, a wafer is received for cleaning. For example, in one embodiment, a robot 910 inserts a wafer 151 into the gripping assembly 220 for cleaning. As shown in the embodiment of FIG. 9A, the robot 910 inserts the wafer 151 such that the wafer 151 is held by the load pins 311 (e.g., rests within the grooves of the load pins). For example, the robot 910 is configured to position the wafer 151 within the load pins 311 of the gripping assembly 220.

[0081]

[0097] During entry into the cleaning module 200, one or more spray bars 290 may pre-treat the wafer 151 by applying one or more fluids to the wafer 151 as it is inserted into the cleaning module 200. In one embodiment, the wafer 151 is received after the wafer 151 has been cleaned inside one or more other cleaning modules (e.g., the megasonic cleaning module 161, the pre-cleaning module 162, or the brush box cleaning module 164).

[0082]

[0098] After the wafer 151 is fully inserted onto the load pins 311 , the robot 910 releases the wafer 151 and retreats from the cleaning module 200 .

[0083]

[0099] The controller 190 can provide instructions to the spray bar 290 to begin the pre-treatment process. Additionally, the controller 190 can receive indicia indicating that the wafer 151 has been inserted into the cleaning module 200. For example, the controller 190 can receive sensor data from the sensing device 294 indicating that the wafer 151 has been placed within the cleaning module 200 and generate instructions for the spray bar 290 to begin the pre-treatment process.

[0084]

[0100] In operation 830 of method 800, the cleaning module is placed in a cleaning position. For example, the cleaning module 200 may be placed in the cleaning position by moving the gripper assembly 220 away from the wall 213, as shown in operation 832. The drive motor 222 drives the shaft 224 to retract the gripper assembly 220 into the processing volume 297. For example, the drive motor 222 may drive the shaft 224 in a lateral or horizontal direction (e.g., X direction) along the rotation axis 216 to move the gripper assembly 220 away from the wall 213.

[0085]

[0101] As the drive motor 222 moves the gripper assembly 220 away from the wall 213, the first plate assembly 318 again contacts the second plate assembly 320, and the contact between the feature 312 and the wall 213 ends. Additionally, the element 380 pivots to a closed position and the gripper pins 315 move toward each other to grip the wafer 151. The gripper pins 315 apply pressure to the wafer to hold the wafer 151. Each of the gripper pins 315 can be coupled to a spring mechanism that exerts a force to grip the wafer 151. The drive motor 222 can drive the shaft 224 until the second plate assembly 320 contacts the capture cup 210.

[0086]

[0102] Additionally, as the gripping assembly 220 moves in the negative X direction (e.g., horizontally away from the wall 213), the feature 312 moves away from the wall 213 and the spring mechanism 330 keeps the second plate assembly 320 clamped to the first plate assembly 318. The first plate assembly 318 and the second plate assembly 320 may contact each other when the feature 312 is no longer in contact with the wall 213.

[0087]

[0103] 9C, the wafer 151 is held by the gripping pins 315 of the gripping assembly 220. In the illustrated embodiment, the gripping assembly 220 has been moved in the X direction (e.g., parallel to the axis of rotation 216) away from the wall 213 such that the element 380 is moved away from the wall 213 such that the gripping pins 315 grip the wafer 151. Additionally, the robot 910 has been retracted from the interior volume 295 of the cleaning module 200.

[0088]

[0104] The controller 190 can be configured to provide commands to the drive motor 222 to move the shaft 224 laterally away from the wall 213 to move the gripper assembly 220 laterally and away from the wall 213. The controller 190 can initiate movement of the gripper assembly 220 based on sensor data received from the sensing device 294 indicating that a wafer 151 is being held by the gripper assembly 220 and that the robot 910 has been removed from the interior volume 295. Once the gripper assembly 220 is located in the retracted position 300a, a cleaning cycle can be initiated.

[0089]

[0105] In operation 840, the wafer is cleaned. The wafer 151 and the gripping assembly 220 are placed in a cleaning position and located completely within the processing volume 297. Performing the cleaning cycle includes positioning the sweep arm over the wafer 151 and dispensing fluid to the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and shaft 224, as shown by operation 842. Additionally, performing the cleaning cycle includes rotating the wafer 151, as shown by operation 844. For example, the drive motor 222 can rotate the wafer 151, the capture cup 210, and the gripping assembly 220 simultaneously. The position of the wafer 151 within the processing volume 297 can be altered during the cleaning process. For example, the distance between the wafer 151 and the second capture cup 212 can be altered. The rate of application of the fluid to the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and shaft 224 can be altered. For example, the fluid can be applied to the front and back surfaces of the wafer 151 at the same rate or at different rates. Alternatively, the rate at which fluid is applied to the front and back surfaces of the wafer 151 may be varied during a cleaning or rinsing process. For example, the rate at which fluid is applied to the front surface of the wafer 151 via the nozzle mechanism may be increased or decreased during a cleaning or rinsing process. Additionally, the rate at which fluid is applied to the back surface of the wafer 151 via the shaft 224 may be increased or decreased during a cleaning or rinsing process.

[0090]

[0106] Cleaning the wafer 151 includes continuously rotating the capture cups 210 (e.g., the first capture cup 211 and the second capture cup 212), the gripping assembly 220, and the wafer 151 while a cleaning fluid is applied to a first side (front side) and a second side (back side) of the wafer 151. Rotating the capture cups 210, the gripping assembly 220, and the wafer 151 while the cleaning fluid is applied helps to minimize and / or eliminate particle redeposition on either surface of the wafer 151. The drive motor 222 can be configured to simultaneously rotate the capture cups 210, the gripping assembly 220, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the capture cups 210, the gripping assembly 220, and the wafer 151. The wafer 151 is rotated at a speed ranging from about 500 RPM to about 1000 RPM such that fluid is removed from the surface of the wafer 151. Alternatively, the wafer 151 can be rotated at a speed less than 500 RPM or greater than about 1000 RPM. Additionally, the speed at which the wafer 151 rotates can be varied during the cleaning process.

[0091]

[0107] A first cleaning fluid can be applied to the backside of the wafer 151 (e.g., the surface of the wafer 151 facing the front side 301) via the fluid source 223, the shaft 224, and one or more apertures 351. Additionally, a second fluid can be applied to the front side of the wafer 151 (e.g., the surface of the wafer 151 facing away from the front side 301) via the nozzle mechanism 240. The sweep arm drive motor 234 can move the sweep arm 230 such that the nozzle mechanism 240 moves over the front side of the wafer 151 in an arcuate path. The nozzle mechanism 240 can be configured to apply a cleaning fluid to the front side of the wafer 151 during the cleaning process. The fluid can include a cleaning chemistry and / or a rinsing agent. The cleaning fluid can be applied to the front and back sides of the wafer 151 substantially simultaneously. Additionally, the cleaning fluid can be applied to the front side of the wafer 151 independent of applying the cleaning fluid to the back side of the wafer 151. For example, cleaning fluid may be applied to the front side of wafer 151 and may be applied to the back side of wafer 151 during one or more overlapping and non-overlapping periods. One or more cleaning fluids may be applied to the front side of wafer 151 during a first non-overlapping period, and one or more cleaning fluids may be applied to the back side of wafer 151 during a second non-overlapping period. The overlapping and non-overlapping periods of a cleaning cycle may occur in any order. Furthermore, the number and / or order of overlapping and non-overlapping periods may be varied from one cleaning cycle to another. Additionally, splashing of cleaning fluid onto wafer 151 while in the cleaning position may be at least reduced or eliminated.

[0092]

[0108] 9D illustrates an embodiment in which the wafer 151 is in a cleaning position, which includes positioning the gripper assembly 220 within the processing volume 297. Furthermore, once the wafer gripper 210 is in the cleaning position, a cleaning cycle can be initiated.

[0093]

[0109] During at least one of the cleaning, loading and unloading processes, the airflow within the cleaning module 200 reduces the occurrence of recirculation and prevents particles from redepositing on the surface of the wafer 151 .

[0094]

[0110] The controller 190 can receive indicia indicia indicating that the gripper assembly 220 is placed in the cleaning position. The indicia may be provided within sensor data from the sensing device 294. Additionally, the controller 190 can be configured to control the flow of cleaning fluid through the shaft 224 and the aperture 351, as well as the movement and control of the fluid through the nozzle mechanism 240. The controller 190 can provide instructions to the sweep arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. Additionally, the controller 190 can output instructions to the nozzle mechanism to dispense cleaning fluid from one or more of the nozzles. Additionally, the controller 190 can control the timing of the nozzles such that the cleaning fluid is output at different times. For example, one nozzle can be controlled to begin dispensing cleaning fluid before another nozzle. One or more of the nozzles can be configured to output cleaning fluid while at least one other of the nozzles does not output cleaning fluid.

[0095]

[0111] In operation 850, the cleaned wafer is removed from the cleaning module. Removing the wafer 151 from the cleaning module includes operation 852, moving the gripping assembly 220 toward the wall 213 to place the gripping assembly 220 in an unloading position. The unloading position may correspond to moving the first plate assembly 318 of the gripping assembly 220 at least partially into the interior volume 295 and placing the gripping pins 315 in a retracted and tilted position. For example, the loading position may include positioning one or more of the pins 311 and the surface 301 of the first plate assembly 318 in the interior volume 295. Further, removing the wafer from the cleaning module includes operation 854, stopping the dispense of the cleaning fluid, and operation 856, stopping the rotation of the wafer. The capture cup 210, the gripping assembly 220, and the wafer 151 may be continuously rotated by the drive motor 222 until the wafer 151 is located in the interior volume 295.

[0096]

[0112] At the end of the cleaning cycle, the gripper assembly 220 is moved to the load position by the drive motor 222 and shaft 224. Additionally, the nozzle mechanism 240 can stop spraying fluid, and the nozzle mechanism 240 and sweep arm 230 can be moved away from the wall 213 at the end of the cleaning cycle and before the gripper assembly 220 is moved. At the end of the cleaning cycle, the nozzle mechanism 240 and sweep arm 230 can be positioned so as not to interfere with the movement of the gripper assembly 220 and robot 910.

[0097]

[0113] The dispense of cleaning fluid can be stopped at the end of the cleaning cycle. Additionally, the dispense of cleaning fluid can be stopped before the gripping assembly 220 moves towards the wall 213. Alternatively, fluid can continue to be dispensed on the backside of the wafer 151 while the dispense of fluid on the topside is stopped.

[0098]

[0114] Additionally, while the gripping assembly 220 is being moved, the gripping assembly 220 and capture cup 210 may be rotated as described above to minimize redeposition of particles onto the wafer 151. In one embodiment, rotating the gripping assembly 220 and capture cup 210 while the gripping assembly 220 is being moved reduces splashing of cleaning fluid onto the wafer 151. Additionally, the rotation of the gripping assembly 220 and capture cup 210 is stopped before the element 380 contacts the wall 213. Additionally, the rotation of the gripping assembly 220 and capture cup 210 may be stopped just before the element 380 contacts the wall 213.

[0099]

[0115] 9A shows an exemplary embodiment in which the gripper assembly 220 is positioned in an unload position so that the robot 910 can remove the wafer 151 from the cleaning module 200. The robot 910 can access the cleaning module through an opening unobstructed by the lid 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0100]

[0116] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 laterally toward the wall 213 and move the gripper assembly 220 laterally toward the wall 213 to position the gripper assembly 220 at an unloading position so that the robot 910 can remove the cleaned wafer 151 from the cleaning module 200. Additionally, the controller 190 can provide instructions to the drive motor 222 to stop rotation of the catch cup 210 and the gripper assembly 220 after the wafer 151 is positioned within the interior volume 295. The controller 190 can also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing the cleaning fluid. The controller 190 can receive sensor data from the sensing device 294 indicating that the wafer 151 has been positioned within the unloading position and initiate the unloading process in response to the sensor data.

[0101]

[0117] 10 is a cross-sectional view illustrating a non-contact vertical cleaning module for a wafer processing system, such as cleaning module 1000, according to one or more embodiments. The cleaning module 1000 is configured to clean a wafer 151 in a vertical orientation (e.g., perpendicular to the axis of rotation 1016). The cleaning module 1000 is similar to the cleaning module 200. For example, both cleaning modules 200 and 1000 include a nozzle mechanism 240, a plenum 280, an exhaust 260, a spray bar 290, a drain 284, an air intake 270, a drive motor 222, a shaft 224, and a fluid source 223. These elements are described in more detail above. However, the wafer gripper 1003 of the cleaning module 1000 is different from the wafer gripper 203 of the cleaning module 200.

[0102]

[0118] Similar to cleaning module 200, cleaning module 1000 can receive a wafer to be cleaned, e.g., wafer 151, after the wafer has been cleaned in one or more of megasonic cleaning module 161, pre-cleaning module 162, brush box cleaning module 164, and before the wafer is placed in a corresponding Marangoni drying tank (e.g., drying tank 168). Cleaning module 1000 can be located anywhere within a wafer cleaning cycle and / or edge / bevel cleaning process. Cleaning module 1000 can be utilized to remove contamination from a wafer that would otherwise fail quality standards and may be discarded.

[0103]

[0119] The wafer gripping device 1003 is configured to support the wafer 151 in a vertical orientation (e.g., perpendicular to the axis of rotation 1016). The wafer gripping device 1003 includes a capture cup 1010 and a gripping assembly 1020. The capture cup 1010 is configured similarly to the capture cup 210. For example, the capture cup 1010 can be constructed from a single piece of material, as described with respect to the capture cup 210. Alternatively, the capture cup 1010 can include a first capture cup 1011 and a second capture cup 1012. The first capture cup 1011 and the second capture cup 1012 can be coupled to one another, similar to the first capture cup 211 and the second capture cup 212.

[0104]

[0120] The capture cup 1010 includes a wall 1013. The wall 1013 is configured similarly to the wall 213, as described above. The wall 1013 includes an annular inner surface 1014 that is configured similarly to the annular inner surface 214, as described above. The annular inner surface 1014 has an angled portion that is symmetric about a central axis of the wafer gripper 1003. The capture cup 1010 is described in more detail below.

[0105]

[0121] The drive motor 222 is coupled to the gripping assembly 1020. The drive motor 222 is described in more detail above. The drive motor 222 may include a first motor configured to control the rotation of the gripping assembly 1020 and the capture cup 101 about the axis of rotation 1016, and a second motor configured to control the horizontal movement of the gripping assembly 1020. The horizontal movement is generally the axial movement of the gripping assembly 1020 or the movement in a direction parallel to the axis of rotation 1016. The horizontal movement corresponds to the movement in the X direction. Furthermore, the horizontal movement of the gripping assembly 1020 may be independent of the movement of the capture cup 1010. In addition, the gripping assembly 1020 and the capture cup 1010 may be configured to rotate together, for example, the gripping assembly 1020 and the capture cup may rotate simultaneously.

[0106]

[0122] As described above with respect to the cleaning module 200, the spray bar 290 can apply a pre-treatment fluid to the wafer 151 as the wafer 151 is inserted into the cleaning module 1000 and / or rinse the wafer 151 with a rinsing fluid as the wafer 151 is removed from the cleaning module 1000. The spray bar 290 may also be utilized to apply fluid to the wafer 151 while the wafer 151 is not being gripped and cleaned.

[0107]

[0123] As described above with respect to cleaning module 200a, the drain 284 may be utilized to remove excess moisture from the cleaning module 1000. The drain 284 may remove excess cleaning fluid from the cleaning module 1000 during the cleaning process.

[0108]

[0124] As described with respect to the cleaning module 200, the plenum 280 can receive air circulating inside the cleaning module 1000 from the air intake 270. Additionally, air can be exhausted from the cleaning module 1000 by the exhaust 260. The air intake 270 and the plenum 280 are positioned at the front of the cleaning module 200 and the exhaust 260 is positioned at the rear of the cleaning module 1000. Alternatively, the positions of the exhaust 260 and the air intake 270 can be reversed, with the exhaust 260 positioned at the front of the cleaning module 1000 and the air intake 270 positioned at the rear of the cleaning module 1000. Additionally, the plenum 280 and the exhaust can be configured to control the flow of air inside the cleaning module 1000 to prevent particles from redepositing on the surface of the wafer 151.

[0109]

[0125] The cleaning module 1000 may further include a sensing device 294. The sensing device 294 is described in more detail above. The sensing device 294 may detect the wafer 151 inside the cleaning module 1000. For example, the sensing device 294 may detect the wafer 151 inside the interior volume 295. Additionally, the sensing device 294 may detect the wafer 151 while the wafer 151 is being held by the gripper assembly 1020. The sensing device 294 may detect when the wafer 151 is properly or improperly loaded into the gripper assembly 1020. Additionally, the sensing device 294 may detect when the wafer 151 has fallen or fallen off the gripper assembly 1020.

[0110]

[0126] The controller 190 may control the functionality of the cleaning module 1000 similar to the functionality of the cleaning module 200. For example, the controller 190 may control the functionality of at least the drive motor 222, the gripper assembly 1020, the spray bar 290, the sweep arm 230, the nozzle mechanism 240, the air intake 270, and / or the exhaust 260.

[0111]

[0127] 11 illustrates one embodiment of the wafer gripping device 1003 shown in FIG. The gripping assembly 1020 is positioned within the processing volume 297 during the cleaning process. Additionally, the gripping assembly 1020 includes a first plate assembly 1022, a second plate assembly 1024, a load pin 1030, and a gripping pin 1032. The first plate assembly 1022 is coupled to a shaft 224 that can be driven by a drive motor 222 to rotate the first plate assembly 1022, the second plate assembly 1024, and the catch cup 1010 during a cleaning cycle. Additionally, the drive motor 222 can move the shaft 224 horizontally along an axis 1016 to move the gripping assembly 1020 into and out of the load and cleaning positions. Additionally, cleaning fluid can flow through shaft 224 to be applied to the backside of wafer 151 through apertures 1051 in first plate assembly 1022 during the cleaning process. In one embodiment, shaft 224 may be a splined shaft that allows shaft 224 to drive gripper assembly 1020 while translating in the +X and -X directions.

[0112]

[0128] The annular inner surface 1014 of the wall 1013 can be shaped to help guide moisture from the wafer 151 into the drain 284 during cleaning and reduce particle redeposition on the wafer 151. For example, the annular inner surface 1014 can include a first angled portion and a second angled portion to help guide moisture away from the wafer 151 during cleaning. The first angled portion can be larger than the second angled portion. Additionally, the angle of the second angled portion relative to the surface 1101 of the first plate assembly 1022 can be larger than the angle of the first angled portion relative to the surface 1101 of the first plate assembly 1022.

[0113]

[0129] The capture cup 1010 can be configured to include a first capture cup 1011 and a second capture cup 1012. The first capture cup 1011 can be attached to the second capture cup 1012. For example, the first capture cup 1011 can be attached to the second capture cup 1012 via one or more bolts or similar attachment elements. The first capture cup 1011 and / or the second capture cup 1012 may include one or more threaded portions configured to receive a threaded bolt. Alternatively, the capture cup 1010 may be formed from a single piece of material.

[0114]

[0130] The second capture cup 1012 can include drain holes 262 of FIG. 7B. The drain holes 262 can be positioned in an array along an edge of the capture cup 1010 such that moisture flows into the drain 284 while the wafer 151, gripper assembly 220, and capture cup 1010 are rotated by the drive motor 222. Additionally, the drain holes 262 may be positioned in an array along an edge of the second capture cup 1012. Moisture flows through the drain holes 262 into the drain 284 where it is removed from the cleaning module 1000.

[0115]

[0131] The first plate assembly 1022 and the second plate assembly 1024 are configured to move relative to each other to receive the wafer 151 and aid in placing the wafer 151 in the cleaning position. Specifically, FIGS. 12A and 12B show an embodiment of the gripper assembly 1020 in a retracted position 1200a and an extended position 1200b, respectively. The gripper assembly 1020 can be positioned in the retracted position 1200a during a cleaning process. Additionally, the gripper assembly 1020 can be positioned in the extended position 1200b during a wafer loading process and / or a wafer removal (ejection) process. The extended position 1200b may correspond to a loading position of the gripper assembly 1020 within the cleaning module 1000. Additionally, when in the loading position, the gripper assembly 1020 may be positioned at a distance in the X direction from the cleaning position. The surface 1101 of the first plate assembly 1022 is coupled to and driven by the shaft 224.

[0116]

[0132] The capture cup 1010 includes one or more spring mechanisms 1230 coupled to the second plate assembly 1024. The spring mechanisms 1230 function to hold the second plate assembly 1024 within a certain distance of the capture cup 1010 and allow the second plate assembly 1024 to move relative to the capture cup 1010. In embodiments in which the capture cup 1010 includes a first capture cup 1011 and a second capture cup 1012, the one or more spring mechanisms 1230 are disposed within the second capture cup 1012.

[0117]

[0133] The spring mechanism 1230 will typically include a spring 1231 and a linking member 1233. The spring mechanism 1230 allows the second plate assembly 1024 to move relative to the capture cup 1010 (or the second capture cup 1012) when the first plate assembly 1022 is driven horizontally by the shaft 224. For example, when the first plate assembly 1022 is moved to the extended (e.g., loading or unloading position) position 1200b, the spring mechanism 1230 expands and moves the second plate assembly 1024 away from the capture cup 1010 (or the second capture cup 1012). Each of the spring mechanisms 1230 may include one or more springs 1231 that move on or parallel to the linking member 1233. The axial movement of the second plate assembly 1024 may be limited by the linking member 1233.

[0118]

[0134] One or more actuator pins 1242 can be disposed within the capture cup 1010 (or the second capture cup 1012). The actuator pins 1242 can be coupled to a spring element 1243. Alternatively, the actuator pins 1242 may be omitted and only the spring element 1243 may be used. Further, the number of actuator pins 1242 is equal to the number of gripping pins 1032. For example, each actuator pin 1242 can be configured to interact with a corresponding one of the gripping pins 1032.

[0119]

[0135] The gripper assembly 1020 can include a load pin 1030 and a gripper pin 1032. The load pin 1030 can be configured to receive and hold the wafer 151 during a loading process and to hold the wafer 151 during an unloading process. The load pin 1030 can be secured to the first plate assembly 1022.

[0120]

[0136] The gripping pins 1032 can include one or more elements 1240 configured to impart motion on the gripping pins 1032. For example, the gripping pins 1032 can be configured such that the distance between each gripping pin 1032 and the center of the gripping assembly 1020 is variable. Additionally, the gripping pins 1032 can be coupled to the second plate assembly 1024. For example, the second plate assembly 1024 can include a cavity in which the gripping pins 1032 are disposed. The gripping pins 1032 can grip a wafer (e.g., wafer 151) during a cleaning process.

[0121]

[0137] The gripping assembly 1020 can include one or more loading pins 1030 and one or more gripping pins 1032. For example, the gripping assembly 1020 can include at least three gripping pins 1032 and at least three loading pins 1030. The gripping pins 1032 can be arranged such that each pin is at about 120° with another gripping pin. Alternatively, the gripping pins 315 can be arranged at other angles to each other. Further, the loading pins 1030 can be arranged such that each pin is at about 120° with another loading pin. Alternatively, the loading pins 1030 can be arranged at other angles to each other. In addition, the gripping pins 1032 can be arranged according to a first angle, and the loading pins 1030 can be arranged according to a second angle that is different from the first angle. The number of gripping pins 1032 can be greater than the number of loading pins 1030. Alternatively, the number of gripping pins 1032 is equal to or less than the number of loading pins 1030 .

[0122]

[0138] The gripping pin 1032 can be moved between a loading or unloading position and a gripping position. For example, when the element 1240 disengages from the actuator pin 1242 and engages the stopper 1247, the gripping pin 1032 is moved between the gripping position and the loading position. The gripping pin 1032 is in the gripping position in the embodiment of FIG. 12A and in the loading position in the embodiment of FIG. 12B.

[0123]

[0139] The stopper 1247 can be a part of the capture cup 1010. Alternatively, the stopper 1247 is attached to the capture cup 1010. Additionally, at least a portion of the stopper 1247 can be positioned within the cavity 1246. For example, the stopper 1247 can include a protrusion positioned within the cavity that interacts with the element 1240 to control the movement of the gripper pin 1032. The distance between the protrusion of the stopper 1247 and the actuator pin 1242 can define the amount of movement of the gripper pin 1032. For example, optimizing the distance between the protrusion of the stopper 1247 and the actuator pin 1242 allows the gripper pin 1032 a greater amount of movement. Additionally, although a single stopper 1247 is shown, the gripper assembly 1020 can include one stopper 1247 for each gripper pin 1032.

[0124]

[0140] The gripping pin 1032 can be moved to the gripping position in response to the first plate assembly 1022 imparting motion to the second plate assembly 1024. For example, when the first plate assembly 1022 is driven by the shaft 224 to a retracted position (e.g., a cleaning position) 1200a or to an extended position (e.g., a loading or unloading position). When placing the gripping assembly in the cleaning position, the force exerted by the first plate assembly 1022 on the second plate assembly 1024 compresses the spring mechanism 1230, allowing axial motion of the second plate assembly 1024 and element (e.g., an actuation element) 1240 to contact pin (e.g., an actuator pin) 1242, causing the gripping pin 1032 to pivot about axis 1033 toward the center of assembly rotation.

[0125]

[0141] The gripping force may be defined by the compression of the spring element 1243. Furthermore, the compression of the spring element 1243 depends on the distance between the second plate assembly 1024 and the second catch cup 1012. When placing the gripping assembly 1200 in the extended position, the first plate assembly 1022 disengages from the second plate assembly 1024 and the spring mechanism 1230 expands to move the second plate assembly 1024 and the element 1240 away from the second catch cup 1012. The element 1240 disengages from the actuator pin 1242 and contacts the stopper 1247, allowing the gripping pin 1032 to pivot about the axis 1033 away from the center of rotation of the gripping assembly 1200. Furthermore, the axial movement of the second plate assembly 1024 may be limited by the coupling member 1233. The position of the gripping pins 1032 corresponds to the distance between the second plate assembly 1024 and the second catch cup 1012 and may be defined by engagement of the element 1240 with the pin 1242 and / or the stopper 1247 and / or placement of the element 1240 within the gripping pins 1032. When the gripping pins 1032 are in the gripping position, the distance between the gripping pins 1032 may be reduced compared to when the gripping pins 1032 are in the loading position or the unloading position.

[0126]

[0142] The pins 1030 and 1032 can be configured to hold the wafer 151 so that the wafer 151 does not contact the first plate assembly 1022. The distance between the wafer 151 and the first plate assembly 1022 is fixed.

[0127]

[0143] The bellows 1250 is disposed around the second plate assembly 1024 and is configured to prevent moisture from entering any space between the second plate assembly 1024 and the capture cup 1010 (or second capture cup 1012). The bellows 1250 can completely surround the second plate assembly 1024 or only partially surround the second plate assembly 1024. Furthermore, the bellows 1250 may expand and compress in response to movement of the second plate assembly 1024. Additionally, the bellows may be coupled to the capture cup 1010 (or second capture cup 1012).

[0128]

[0144] To prevent moisture from reaching the shaft 224 and / or flowing between the shaft 224 and the second plate assembly 1024 and / or the catch cup 1010 (or second catch cup 1012), a bellows 1252 can be coupled to the shaft 224. The bellows 1252 can completely or partially surround the shaft 224. Additionally, the bellows 1252 may expand and compress in response to movement of the shaft 224.

[0129]

[0145] The bellows 1254 can be positioned with the cavity 1246 in which the gripping pin 1032 is positioned. The bellows 1254 can help prevent moisture from entering the cavity and flowing between the cavity and the second catch cup 1012.

[0130]

[0146] A flexing device can be disposed between the second capture cup 1012 and the second plate assembly 1024. The flexing device can be configured to apply a force to the second plate assembly 1024 to assist in moving the second plate assembly 1024 away from the capture cup 1010 (or the second capture cup 1012).

[0131]

[0147] The gripper assembly 1020 may further include a guide pin 1035. The guide pin 1035 may be coupled to the second plate assembly 1024 and configured to guide the movement and alignment of the first plate assembly 1022 and the second plate assembly 1024. For example, as the first plate assembly 1022 approaches the second plate assembly 1024, the guide pin 1035 passes through the cavity 1270 to align the first and second plate assemblies 1022, 1024. Additionally, the guide pin 1035 may be configured to limit the angular movement of the second plate assembly 1024 relative to the first plate assembly 1022. The gripper assembly 1020 may include one, multiple, or none of the guide pins 1035.

[0132]

[0148] 12B shows the gripper assembly 1020 in an extended (e.g., load or unload) position 1200b. As shown, the gripper pin 1032 has moved away from the capture cup 1010 (or second capture cup 1012) to the load position in response to the movement of the second plate assembly 1024. For example, the spring mechanism 1230 has extended in response to the first plate assembly 1022 being moved away from the second plate assembly 1024, pushing the second plate assembly 1024 away from the capture cup 1010 (or second capture cup 1012). Additionally, the element 1240 disengages from the actuator pin 1242 and engages the stopper 1247, moving the gripper pin 1032 to the load position. Additionally, the bellows 1250 and bellows 1252 expand with the movement of the second plate assembly 1024 and the shaft 224, respectively.

[0133]

[0149] The cleaning fluid can flow to the backside of the wafer 151 through the one or more apertures 1051. The cleaning fluid can be a rinsing agent (e.g., deionized water or ozonated water) or a cleaning chemical agent. Furthermore, the cleaning fluid can be supplied via the shaft 224 and then to the one or more apertures 1051. As shown, the one or more apertures 1051 can be utilized to flow the chemical to the backside of the wafer 151. The one or more apertures 1051 can be formed in the first plate assembly 1022. The number of apertures 1051 can be one or more. Furthermore, the one or more apertures 1051 can be arranged in a substantially circular or linear pattern. In one embodiment, each of the one or more apertures 1051 can be substantially the same size such that the cleaning fluid flows evenly across the backside of the wafer 151. In other embodiments, at least one of the one or more apertures 1051 can be a different size than at least one other aperture.

[0134]

[0150] FIG. 13 illustrates a method 1300 for cleaning a wafer (e.g., wafer 151). In operation 1310, the cleaning module is placed in a wafer loading position. For example, the lid 202 is opened and a first plate assembly 1022 of the gripper assembly 1020 of the cleaning module 1000 is moved laterally (e.g., in the X direction) toward the wall 213 to place the gripper assembly 1020 in the loading position. Placing the gripper assembly 1020 in the loading position includes moving the first plate assembly 1022 toward the wall 213 via the shaft 224 and the drive motor 222 (operation 1312). For example, the drive motor 222 can drive the shaft 224 laterally to move the first plate assembly 1022 toward the wall 213 such that the first plate assembly 1022 separates from the second plate assembly 1024. Additionally, the spring mechanism 1230 extends in response to moving the first plate assembly 1022 away from the second catch cup 1012, allowing the element 1240 to position the gripping pin 1032 in the loading position.

[0135]

[0151] Each of the gripping pins 1032 is coupled to a respective element 1240 such that it may be tilted (or moved) away from each of the other gripping pins 1032. For example, as shown in FIG. 14A , in response to the first plate assembly 1022 separating from the second plate assembly 1024, the element 1240 engages the stopper 1247 and pivots about the axis 1033, tilting the gripping pins 1030 away from the center of the gripping assembly 1020. Moving the gripping pins 1032 includes moving the gripping pins 1032 toward the outer edge of the gripping assembly 1020 such that the gripping pins 1032 tilt away from the other gripping pins 1032 and the loading pin 1030, increasing the separation distance between the gripping pins 1032 and the distance between the gripping pins 1032 and the loading pin 1030.

[0136]

[0152] The gripper assembly 1020 can be positioned in the extended position 1200b to receive the wafer 151 for cleaning and / or to remove the wafer 151 from the cleaning module 1000 after a cleaning cycle is completed. For example, the gripper assembly 1020 can be driven by the drive motor 222 and shaft 224 such that at least a portion of the first plate assembly 1022 extends beyond the capture cup 1010 (or the first capture cup 1011) and is positioned in the extended position 1200b. For example, at least one of the surface 1101 and the loading pin 1030 extends beyond the capture cup 1010 into the interior volume 295. Alternatively, the surface 1101 can be positioned within the processing volume 297 while the loading pin 1030 is positioned within the interior volume 295.

[0137]

[0153] The controller 190 can provide commands to the drive motor 222 to move the shaft 224 laterally to move the gripper assembly 1020 horizontally along the axis 1016. Additionally, the controller 190 can receive indicia indicating that the cleaning module 1000 is ready to receive a wafer for cleaning. The indicia can be received as sensor data received from the sensing device 294.

[0138]

[0154] In operation 1320 of method 1300, a wafer is received for cleaning. For example, in one embodiment, the robot 910 inserts the wafer 151 into the gripper assembly 1020 for cleaning. For example, as shown in the embodiment of FIG. 14A, the robot 910 inserts the wafer 151 such that the wafer 151 is held by the load pins 1030 (e.g., rests within the grooves of the load pins).

[0139]

[0155] During entry into the cleaning module 1000, one or more spray bars 290 may pre-treat the wafer 151 by applying one or more fluids to the wafer 151 as it is inserted into the cleaning module 1000. The wafer 151 is received after the wafer 151 has been cleaned inside one or more other cleaning modules (e.g., the megasonic cleaning module 161, the pre-cleaning module 162, or the brush box cleaning module 164).

[0140]

[0156] After the wafer 151 is fully inserted onto the load pins 1030 , the robot 910 releases the wafer 151 and the robot 910 retreats from the cleaning module 1000 .

[0141]

[0157] The controller 190 provides instructions to the spray bar 290 to begin the pre-treatment process. Additionally, the controller 190 can receive indicia indicating that the wafer 151 has been inserted into the cleaning module 1000. The indicia can be received as sensor data from the sensing device 294.

[0142]

[0158] In operation 1330 of method 1300, the cleaning module is placed in a cleaning position. For example, the cleaning module 1000 can be placed in the cleaning position by moving the first plate assembly 1022 toward the second plate assembly 1024 away from the wall 1024, as shown in operation 1332. The drive motor 222 can drive the shaft 224 to retract the first plate assembly 1022 of the gripper assembly 1020 and move the first plate assembly 1022 toward the second plate assembly 1024 away from the wall 1013. For example, the drive motor 222 can drive the shaft 224 in a lateral or horizontal direction (e.g., X direction) to move the first plate assembly 1022 toward the second plate assembly 1024 away from the wall 1013.

[0143]

[0159] Furthermore, as the drive motor 222 moves the first plate assembly 1022 toward the second plate assembly 1024 away from the wall 1013, the first plate assembly 1022 contacts the second plate assembly 1024 and compresses the spring mechanism 1230. Furthermore, as the first plate assembly 1022 exerts an additional force on the second plate assembly 1024 and the spring mechanism 1230 compresses, the element 1240 disengages from the stopper 1247 and contacts a corresponding one of the actuator pins 1242, placing the gripping pin 1032 in a gripping position. In response, the gripping pin 1032 exerts a gripping force or pressure on the wafer 151. By changing the position of the second plate assembly 1024, the amount of gripping force exerted by the gripping pin 1032 can be altered.

[0144]

[0160] The controller 190 can be configured to provide instructions to the drive motor 222 to move the shaft 224 laterally away from the wall 1013 toward the second plate assembly 1024 and to move the first plate assembly 1022 laterally away from the wall 1013 toward the second plate assembly 1024. Once the gripper assembly 1020 is positioned in the retracted position 1200b, a cleaning cycle can be initiated. The controller 190 can receive sensor data from the sensing device 294 indicating that the gripper assembly 1020 is positioned in the retracted position 1200b (e.g., a cleaning position) and initiate a cleaning cycle.

[0145]

[0161] In operation 1340, the wafer is cleaned. The wafer 151 and gripper assembly 1020 are placed in a cleaning position such that the wafer 151 and gripper assembly 1020 are located entirely within the processing volume 297. The wafer 151 may be cleaned by the cleaning module 1000. For example, performing a cleaning cycle may include dispensing a fluid onto a surface of the wafer 151, as indicated by operation 1342. Additionally, performing a cleaning cycle may include rotating the wafer 151, as indicated by operation 1344.

[0146]

[0162] In addition, the position of the wafer 151 within the processing volume 297 can be altered during the cleaning process. For example, one or more of the distance between the second plate assembly 1024 and the capture cup 1010 (or second capture cup 1012) and the amount that the spring mechanism 1230 is compressed can be altered to alter the position of the wafer 151 within the processing volume 297.

[0147]

[0163] Cleaning the wafer 151 includes simultaneously rotating the capture cup 1010, the gripping assembly 1020, and the wafer 151 while a cleaning fluid is applied to a first side (front) and a second side (back) of the wafer 151. Simultaneously rotating the capture cup 1010, the gripping assembly 1020, and the wafer 151 while the cleaning fluid is applied helps to minimize and / or eliminate particle redeposition on either surface of the wafer 151. For example, the drive motor 222 can be configured to rotate the capture cup 1010, the gripping assembly 1020, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the capture cup 1010, the gripping assembly 1020, and the wafer 151. The wafer 151 is rotated at a speed ranging from about 500 RPM to about 1000 RPM such that fluid is removed from the surface of the wafer 151. The wafer 151 can be rotated at a speed less than 500 RPM or greater than about 1000 RPM. Furthermore, the speed at which the wafer 151 rotates can be varied during the cleaning process. In addition, a cleaning cycle can be initiated after the wafer gripper 210 is placed in the cleaning position.

[0148]

[0164] A first cleaning fluid may be applied to the backside of the wafer 151 (e.g., the surface adjacent to the front side 1101) via the fluid source 223, the shaft 224, and the aperture 1051. Additionally, a second fluid may be applied to the front side of the wafer 151 (e.g., the surface opposite the front side 1101) via the nozzle mechanism 240. The sweep arm drive motor 234 moves the sweep arm 230 such that the nozzle mechanism 240 moves over the front side of the wafer 151 in an arcuate path. The nozzle mechanism 240 may be configured to apply a cleaning fluid to the front side of the wafer 151 during the cleaning process. The fluid may include a cleaning chemistry and / or a rinsing agent. In one embodiment, the cleaning fluid may be applied to the front and back sides of the wafer 151 substantially simultaneously. Additionally, the cleaning fluid may be applied to the front side of the wafer 151 independent of applying the cleaning fluid to the back side of the wafer 151. For example, cleaning fluid may be applied to the backside of wafer 151 and may be applied to the backside of wafer 151 during one or more overlapping and non-overlapping periods. During a first non-overlapping period, one or more cleaning fluids may be applied to the front side of wafer 151 and during a second non-overlapping period, one or more cleaning fluids may be applied to the backside of wafer 151. The overlapping and non-overlapping periods of a cleaning cycle may occur in any order. Furthermore, the number and / or order of overlapping and non-overlapping periods may vary from one cleaning cycle to another. Splashing of cleaning fluid onto wafer 151 while in the cleaning position may be at least reduced, and in various embodiments may be eliminated.

[0149]

[0165] During at least one of the cleaning, loading and unloading processes, the airflow within the cleaning module 200 reduces the occurrence of recirculation and prevents particles from redepositing on the surface of the wafer 151 .

[0150]

[0166] The controller 190 can receive indicia indicating that the gripper assembly 220 is placed in the cleaning position. For example, the controller 190 can receive sensor data from the sensing device 294. Additionally, the controller 190 can be configured to control the flow of cleaning fluid through the shaft 224 and the aperture 1051, as well as the movement and control of the fluid through the nozzle mechanism 240. The controller 190 can provide instructions to the sweep arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. Additionally, the controller 190 can output instructions to the nozzle mechanism to dispense cleaning fluid from one or more of the nozzles. Additionally, the controller 190 can control the timing of the nozzles such that the cleaning fluid is output at different times. For example, one nozzle can be controlled to begin dispensing cleaning fluid before another nozzle. One or more of the nozzles can be configured to output cleaning fluid while at least one other of the nozzles does not output cleaning fluid.

[0151]

[0167] In operation 1350, the cleaned wafer is removed from the cleaning module. Removing the wafer from the cleaning module 1000 includes moving the first plate assembly 1022 of the gripping assembly 1020 away from the second plate assembly 1024 of the gripping assembly 1020 (operation 1352). As the first plate assembly 1022 moves away from the second capture cup 1012, the spring mechanism 1230 expands and applies a force to the second plate assembly 1024. In response, the second plate assembly 1024 moves in the same direction as the first plate assembly 1022 is moved, reducing the force exerted by the actuator pin 1242 on the element 1240. Additionally, as the second plate assembly 1024 moves the element 1240 it engages the stopper 1247 to move the gripping pins 1032 to the load position, releasing the gripping pins 1032 from the wafer 151 and removing the wafer 151 onto the load pins 1032 .

[0152]

[0168] Further, removing the wafer from the cleaning module includes operation 1354, stopping the dispense of the cleaning fluid, and operation 1356, stopping the rotation of the wafer.

[0153]

[0169] At the end of the cleaning cycle, the gripper assembly 1020 is moved to the load position by the drive motor 222 and shaft 224. Additionally, the nozzle mechanism 240 can stop the spraying fluid, the nozzle mechanism 240 and the sweep arm 230 can be moved away from the catch cup 1010 at the end of the cleaning cycle before the first plate assembly 1022 is moved, and the nozzle mechanism 240 and the sweep arm 230 can be moved away from the path of movement of the first plate assembly 1022. For example, at the end of the cleaning cycle, the nozzle mechanism 240 and the sweep arm 230 can be positioned so as not to interfere with the movement of the gripper assembly 1020 and the robot 910.

[0154]

[0170] The drive motor 222 and shaft 224 can be configured to move the first plate assembly 1022 laterally toward the wall 1013, separating the first plate assembly 1022 from the second plate assembly 1024 and placing the gripper pins 1032 in the load position. Further, the wafer 151 is moved within the interior volume 295. Additionally, the spray bar 290 can be engaged to apply fluid to the wafer 151 during the ejection process.

[0155]

[0171] At the end of the cleaning cycle, the dispensing of cleaning fluid is stopped via the shaft 224 and nozzle mechanism 240. The dispensing of cleaning fluid is stopped before the first plate assembly 1022 is moved towards the wall 1013. While the dispensing of fluid to the front side is stopped, fluid may continue to be dispensed onto the back side of the wafer 151.

[0156]

[0172] Additionally, the wafer 151 can be removed after the gripper assembly 1020 is placed in the removal position.

[0157]

[0173] 14A shows an example in which the gripper assembly 1020 is positioned in an unload position so that the robot 910 can remove the wafer 151 from the cleaning module 1000. In one embodiment, the robot 910 can access the cleaning module through an opening unobstructed by the lid 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0158]

[0174] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 laterally toward the first catch cup 211 and move the first plate assembly 1022 laterally toward the wall 1013 to place the gripper assembly 1020 in an unloading position so that the robot 910 can remove the cleaned wafer 151 from the cleaning module 1000. Additionally, the controller 190 can provide instructions to the drive motor 222 to stop rotation of the catch cup 1010 and the gripper assembly 1020 after the wafer 151 is positioned within the interior volume 295. The controller 190 can also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing the cleaning fluid. Additionally, the controller 190 can provide instructions to the spray bar 290 to start dispensing the fluid. For example, the controller 190 can instruct the spray bar 290 to begin dispensing fluid when the first plate assembly 1022 begins to move, when the first plate assembly 1022 clears the wall 1013, or at any other point during the removal process to coincide with the end of the cleaning cycle.

[0159]

[0175] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A wafer gripping apparatus configured to support a wafer in a vertical orientation, comprising: a catch cup including a wall having an annular inner surface defining a processing area; A gripping assembly comprising: a first plate assembly including a plurality of load pins, each of the plurality of load pins configured to support an edge of a wafer disposed in a vertical orientation; and A second plate assembly including a plurality of gripping pins, each of the plurality of gripping pins comprising: the second plate assembly is configured to be positioned a first distance from a central axis of the wafer gripping apparatus based on the second plate assembly being positioned a second horizontal distance from the first plate assembly, and each of the plurality of gripping pins is configured to contact an edge of the wafer to hold the wafer in a vertical orientation when positioned at the first distance from the central axis; a second plate assembly configured to be positioned at a third distance from the central axis based on the second plate assembly being positioned at a fourth horizontal distance from the first plate assembly, the third distance being greater than the first distance and the fourth distance being greater than the second distance; a gripping assembly including: A wafer gripping device comprising: a cleaning module including:

2. The cleaning module of claim 1 , wherein each of the plurality of gripper pins passes through a respective opening in the first plate assembly.

3. the second plate assembly further comprising one or more features configured to contact the capture cup; the one or more features are configured to contact the capture cup to stop movement of the second plate assembly relative to movement of the first plate assembly. The cleaning module of claim 1 .

4. The cleaning module of claim 3 , wherein each gripping pin of the plurality of gripping pins is coupled to a respective element including one of the one or more features configured to contact the capture cup.

5. The cleaning module of claim 1 , wherein the first plate assembly is connected to the second plate assembly via one or more spring mechanisms.

6. The cleaning module of claim 1 , wherein the second plate assembly is coupled to the catch cup via one or more spring mechanisms.

7. The one or more spring mechanisms include: the first plate assembly is compressed based on being at the second distance from the second plate assembly; The cleaning module of claim 6 , configured to extend based on the first plate assembly being the fourth distance from the second plate assembly.

8. the capture cup further comprising a plurality of actuator pins; each of the plurality of gripper pins is coupled to a respective actuator element configured to engage and disengage from each of the plurality of actuator pins; The cleaning module of claim 1 .

9. a nozzle mechanism coupled to the sweep arm, a first nozzle oriented at a first angle with a surface of the first plate assembly and configured to provide a high energy fluid at the wafer; a surface of the first plate assembly and a second nozzle oriented at a second angle different from the first angle and configured to apply a second fluid to the wafer; a nozzle mechanism including:

2. The cleaning module of claim 1, wherein the first nozzle is one of a megasonic nozzle and a jet nozzle configured to deliver a mixture of gas and liquid, and the sweep arm is configured to move the nozzle mechanism over at least a portion of the first plate assembly.

10. 2. The cleaning module of claim 1, further comprising a drive motor configured to impart horizontal motion to at least one of the first plate assembly and the second plate assembly and to rotate the gripper assembly, the capture cup, and the vertically oriented wafer simultaneously about the central axis during a cleaning process.

11. 2. The cleaning module of claim 1, wherein the capture cup comprises one or more drain holes configured to guide moisture to the one or more drain holes when the capture cup is rotated about the central axis, each of the one or more drain holes being fluidly connected to the interior region of the cleaning module through a respective air maze shaped to reduce the inflow of moisture into the interior region.

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