Semiconductor device manufacturing apparatus and semiconductor device manufacturing method

Abstract

To provide a manufacturing apparatus of a semiconductor device which can improve the accuracy and a manufacturing method of the semiconductor device.SOLUTION: A mounting device 1 comprises: a bonding head 310 which holds a semiconductor chip 2 and mounts the semiconductor chip 2 on a substrate 3; a camera 321 which images the semiconductor chip 2 when being held and images the substrate 3 when being mounted; an optical unit 400 which allows a camera 321 to image the semiconductor chip 2 when being held; a reference mark 331 which is arranged so as to be included within the imaging range of the camera 321 when being held and mounted; and a control unit 700 which corrects the physical relation between the semiconductor chip 2 and the substrate 3 on the basis of a semiconductor chip image obtained by imaging the semiconductor chip 2 via the optical unit 400 by the camera 321 when being held and a substrate image obtained by imaging the substrate 3 by the camera 321 when being mounted.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an apparatus and method for manufacturing a semiconductor device. [Background technology]

[0002] In recent years, semiconductor devices have been increasingly multi-layered in order to achieve low power consumption and high driving speed. The manufacturing process of such semiconductor devices includes a chip bonding process in which semiconductor chips such as CoC (Chip on Chip) and CoW (Chip on Wafer) are stacked or a semiconductor package is mounted. This chip bonding process has changed from a contact connection method via wire bonding to a connection method using flip chips or through silicon vias (TSVs). In the contact connection method via wire bonding, a bonding accuracy of several tens of μm was sufficient, but in the bonding of flip chips in which a bump and a pad are directly contacted, an accuracy of several μm is required, and especially in the bonding of TSV chips, an accuracy of sub-μm is required. In addition, in the chip bonding process, metals are directly bonded, so high temperature and high pressure tend to be required during bonding. For this reason, in a chip bonding device having high precision, minute changes in the mechanical and thermal structures become a factor that impedes precision. As a related technique, for example, a bonding device described in Patent Document 1 is known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6407827 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the related technology has a problem in that it may be difficult to achieve even higher precision in semiconductor device manufacturing equipment such as a bonding device. [Means for solving the problem]

[0005] The manufacturing apparatus for a semiconductor device according to the present invention includes a bonding head that adsorbs and grips a mounted component supplied thereto and mounts the gripped mounted component on a substrate after moving a predetermined distance; an imaging unit movable together with the bonding head that images the mounted component when gripped and images the substrate when mounted; an optical system that enables the mounted component to be imaged from the imaging unit when gripped; a reference mark movable together with the imaging unit that is positioned so as to be included in the imaging range of the imaging unit when gripped and when mounted; and a control unit that corrects a positional relationship between the mounted component to be mounted and the substrate based on a mounted component image including the reference mark captured by the imaging unit via the optical system when gripped and a substrate image including the reference mark captured by the imaging unit when mounted.

[0006] The manufacturing apparatus for a semiconductor device according to the present invention includes a bonding head that adsorbs and grips a mounted component supplied thereto and mounts the gripped mounted component on a substrate after moving a predetermined distance; an imaging unit movable together with the bonding head that images the mounted component when gripped and images the substrate when mounted; an optical system that enables imaging of the mounted component from the imaging unit when gripped; and a control unit that corrects a positional relationship between the mounted component to be mounted and the substrate based on a mounted component image captured by the imaging unit through the optical system when gripped and a substrate image captured by the imaging unit when mounted.

[0007] The semiconductor device manufacturing apparatus of the present invention includes a bonding head that adsorbs and grips a supplied mounting component and mounts the gripped mounting component on a substrate after moving a predetermined distance; an imaging unit movable together with the bonding head that images the mounting component when gripped and images the substrate when mounted; a reference mark movable together with the imaging unit that is positioned so as to be included in the imaging range of the imaging unit when gripped and when mounted; and a control unit that corrects the positional relationship between the mounting component to be mounted and the substrate based on a mounting component image including the reference mark captured by the imaging unit when gripped and a substrate image including the reference mark captured by the imaging unit when mounted.

[0008] A manufacturing method of a semiconductor device according to the present invention is a manufacturing method of a semiconductor device in which a bonding head adsorbs and grips a mounted component supplied thereto, and after moving a predetermined distance, mounts the gripped mounted component on a substrate, wherein an imaging unit movable together with the bonding head images the mounted component when it is gripped and images the substrate when it is mounted, an optical system enables the mounted component to be imaged from the imaging unit when it is gripped, a reference mark movable together with the imaging unit is positioned so as to be included in the imaging range of the imaging unit when it is gripped and when it is mounted, and a positional relationship between the mounted component to be mounted and the substrate is corrected based on a mounted component image including the reference mark captured by the imaging unit via the optical system when it is gripped, and a substrate image including the reference mark captured by the imaging unit when it is mounted. Effect of the Invention

[0009] According to the present invention, it is possible to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method that enable high precision to be achieved. [Brief description of the drawings]

[0010] [Figure 1]1 is a configuration diagram showing a configuration example of a mounting device according to a first embodiment. [Diagram 2] 3 is a configuration diagram showing a configuration example of a chip transport unit according to the first embodiment. FIG. [Diagram 3] 3 is a configuration diagram showing a configuration example of a chip transport unit according to the first embodiment. FIG. [Figure 4] 4 is a diagram showing an example of an arrangement of reference marks according to the first embodiment; FIG. [Diagram 5] 5A and 5B are diagrams illustrating an example of an image of a reference mark according to the first embodiment. [Figure 6] 2 is a perspective view showing an example of the external configuration of the optical unit according to the first embodiment. FIG. [Figure 7] 2 is a configuration diagram showing an example of the internal configuration of an optical unit according to the first embodiment. FIG. [Figure 8] 3A to 3C are diagrams for explaining an example of imaging using the optical unit according to the first embodiment. [Figure 9] 3A to 3C are diagrams for explaining an example of imaging using the optical unit according to the first embodiment. [Figure 10] FIG. 2 is a configuration diagram showing a configuration example of a collimator according to the first embodiment. [Figure 11] 4 is a flowchart showing an operation example of the mounting method according to the first embodiment. [Figure 12] 11 is a diagram for explaining a position calculation example of the mounting method according to the first embodiment. FIG. [Figure 13] 11 is a diagram for explaining a position calculation example of the mounting method according to the first embodiment. FIG. [Figure 14] 11 is a diagram for explaining a position calculation example of the mounting method according to the first embodiment. FIG. [Figure 15] FIG. 11 is a configuration diagram showing a configuration example of a chip transport unit according to the second embodiment. [Figure 16] FIG. 1 is a perspective view showing a configuration of a related bonding apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings. For clarity of explanation, the following description and drawings are omitted and simplified as appropriate. In addition, in each drawing, the same elements are given the same reference numerals, and duplicate explanations are omitted as necessary.

[0012] (Review of related technologies) Fig. 16 is a perspective view showing the configuration of a related bonding apparatus described in Patent Document 1. In the related technology, at least two cameras are used from the pick-up process of the semiconductor chip to the bonding process in order to achieve high-precision bonding. One camera is used to detect position errors of the picked-up semiconductor chip, and the other is used to detect position errors of the bonding destination. However, as a result of examining ways to improve the precision of bonding in the related technology, the inventors found a problem that the use of multiple cameras leads to an accumulation of errors caused by the cameras, which becomes a factor that hinders high precision.

[0013] That is, as shown in Fig. 16, the related bonding apparatus 900 includes a base unit 911, a first transfer device 912, a second transfer device 913, a wafer supply unit 920, a chip supply unit 930, a bonding head 940, a bonding stage 950, a correction device structure 960, a first camera C901, and a second camera C902. The related bonding apparatus 900 bonds a semiconductor chip cut from a wafer to a semiconductor substrate 951 on the bonding stage 950. The first camera C901 is a camera for acquiring position information of the semiconductor chip held by the bonding head 940. The second camera C902 is a camera for acquiring position information of a substrate to which the semiconductor chip is bonded. The related bonding apparatus 900 corrects the bonding position in real time based on the position information of the semiconductor chip acquired by the first camera C901 and the position information of the substrate acquired by the second camera C902.

[0014] In the bonding device configured as shown in FIG. 16, the camera for acquiring the position information of the semiconductor chip and the camera for acquiring the position information of the substrate to which the semiconductor chip is bonded are separate, so there is an accumulation of errors. The camera is an important element for acquiring the position information of the semiconductor chip and the substrate, but it itself has time-dependent fluctuations and variation factors due to heat and vibration. Since the information acquired by the two cameras each contains individual errors, the more cameras there are, the more disadvantageous it is for high accuracy. In order to reduce errors caused by changes over time, a certain degree of effect can be expected by increasing the frequency of correction work. As for errors caused by variation factors, since they are random errors contained in each camera, repeated data acquisition in proportion to the number of cameras is required to reduce errors. In any case, the time required for the correction process to be performed is longer in order to increase accuracy, and a trade-off with productivity occurs.

[0015] In the following embodiment, the position information of the semiconductor chip and the position information of the board are acquired by a single camera, which reduces the error factors of the camera. Also, the number of parts that make up the mounting device can be reduced, which reduces the manufacturing cost of the device.

[0016] (Embodiment 1) Hereinafter, the first embodiment will be described with reference to the drawings.

[0017] <Mounting device according to the first embodiment> FIG. 1 shows a schematic configuration of a mounting device according to the present embodiment. For example, the mounting device 1 according to the present embodiment is a bonding device (a manufacturing device for semiconductor devices) such as a chip bonding device or a die bonding device. In this example, the mounting device 1 chip bonds (mounts) a semiconductor chip 2 to a substrate 3. The semiconductor chip 2 is an example of a mounting component, and is, for example, a rectangular flat chip, but may be other electronic components similar to a chip. The substrate 3 is an example of a mounted member, and is, for example, a rectangular flat semiconductor substrate, but may be a semiconductor wafer including a rectangular mounting area. That is, the substrate on which the semiconductor chip (mounting component) is mounted includes a semiconductor chip cut from a semiconductor wafer, and also includes a wafer substrate before cutting. In the following drawings and explanations, the Z-axis direction is the mounting direction in which the semiconductor chip is mounted on the substrate, and the Y-axis direction is the transport direction in which the semiconductor chip is transported from the pick-up position to the mounting position on the substrate. In the Z-axis direction (mounting direction), the semiconductor chip side may be called the top, and the substrate side may be called the bottom. In the Y-axis direction (transport direction), the pick-up position side may be called the left, and the mounting position side may be called the right.

[0018] As shown in FIG. 1, the mounting apparatus 1 includes, as its external configuration, a base section 100, an FC unit 200, a chip transport section 300, an optical unit 400, a collimator 500, and a bonding stage 600, and further includes a control section 700 as a function for controlling the operations of these components.

[0019] The base unit 100 is a foundation that supports each part of the mounting apparatus 1. For example, the base unit 100 supports the FC unit 200 and the optical unit 400 by fixing them to predetermined positions, and supports the chip transport unit 300, the collimator 500, and the bonding stage 600 so that they can be moved from their predetermined positions.

[0020] The FC (Flip Chip) unit 200 picks up the semiconductor chip 2 from the semiconductor wafer and turns it over. For example, the FC unit 200 is a chip picker that picks up the semiconductor chip 2 supplied from the semiconductor wafer. The FC unit 200 adsorbs and holds the semiconductor chip 2, and further turns the semiconductor chip 2 over. The FC unit 200 rotates the semiconductor chip 2 so that the mounting surface (terminal surface) of the picked-up semiconductor chip 2 is on the lower side in the Z-axis direction.

[0021] The chip transport unit 300 transports the semiconductor chip 2 picked up by the FC unit 200 in the Y-axis direction (from left to right) to above the bonding stage 600, and mounts the semiconductor chip 2 on the substrate 3. The chip transport unit 300 receives the semiconductor chip 2 from the FC unit 200, captures an image of the semiconductor chip 2 on the optical unit 400, and captures an image of the substrate 3 on the bonding stage 600, and mounts the semiconductor chip 2 on the substrate 3.

[0022] 2 and 3 show a specific configuration example of the chip transport unit 300. As shown in Fig. 2 and 3, the chip transport unit 300 includes a Y-axis slider 301, a bonding head 310, a vision head 320, and a reference mark arrangement unit 330.

[0023] The Y-axis slider 301 is a moving means capable of moving in the Y-axis direction, and is, for example, a slider with a gantry structure. The Y-axis slider 301 fixedly supports (commonly connects) the bonding head 310, the vision head 320, and the reference mark arrangement unit 330, and moves them simultaneously in the Y-axis direction. A Y-axis linear encoder 302 that acquires the Y-axis coordinate is fixed to the Y-axis slider 301. A gantry frame 304 on which a Y-axis scale 303 is formed is disposed along the Y-axis direction of the base unit 100, and the Y-axis slider 301 is disposed on the gantry frame 304 via a linear guide 305. The Y-axis slider 301 moves in the Y-axis direction on the Y-axis scale 303, and the Y-axis linear encoder 302 acquires the Y-axis coordinate from the Y-axis scale 303.

[0024] The bonding head 310 is a bonding means that adsorbs and holds the supplied semiconductor chip 2, and bonds (mounts) the held semiconductor chip 2 on the substrate 3 after moving a predetermined distance. The bonding head 310 receives the semiconductor chip 2 from the FC unit 200, and can be driven in the Z-axis direction (from top to bottom) to bond the received semiconductor chip 2 to the substrate 3. The bonding head 310 includes a suction head 311 and a bonding picker 312. The suction head 311 is, for example, a suction collet formed at the tip of the bonding picker 312, and adsorbs and holds the semiconductor chip 2. The bonding picker 312 moves the suction head 311 holding the semiconductor chip 2 in the Z-axis direction. For example, the bonding picker 312 is fixed (connected) to the Y-axis slider 301, and the bonding head 310 moves in the Y-axis direction.

[0025] The vision head 320 is an imaging means that moves together with the bonding head 310 and captures (observes) images of the semiconductor chip 2 and the substrate 3. The vision head 320 captures an image of the semiconductor chip 2 on the optical unit 400, and also captures an image of the substrate 3 on the bonding stage 600. The vision head 320 includes a camera 321 and a camera lens 322. The camera 321 is an imaging element (imaging unit) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) sensor. In this embodiment, only one camera 321 is used from picking up the semiconductor chip 2 to bonding it to the substrate 3, and the single camera 321 captures images of the semiconductor chip 2 and the substrate 3 and obtains position information of each. When the bonding head 310 holds the semiconductor chip 2, the camera 321 captures an image of the semiconductor chip 2 held via the optical unit 400 to obtain position information of the semiconductor chip 2, and when mounting the semiconductor chip 2 on the substrate 3, the camera 321 captures an image of the substrate 3 arranged on the bonding stage 600 to obtain position information of the substrate 3 on which the semiconductor chip 2 is mounted. The imaging direction of the camera 321 is a direction from top to bottom in the Z-axis direction, and the camera lens 322 is formed facing the imaging direction. The camera lens 322 is an optical system attached to the camera 321, and is, for example, a telecentric lens. For example, the vision head 320 is fixed (connected) to the Y-axis slider 301, and the vision head 320 moves in the Y-axis direction.

[0026] The reference mark arrangement section 330 arranges the reference mark 331 according to the present embodiment. The reference mark 331 is a mark indicating a reference (position) for correcting the position and attitude of the semiconductor chip 2 and the substrate 3 to be mounted. The reference mark arrangement section 330 includes the reference mark 331, a mark fixing section 332, and a mirror 333. The reference mark 331 is movable together with the camera 321, is included in the field of view (imaging range) of the camera 321 from picking up and holding the semiconductor chip 2 until bonding to the substrate 3, and is arranged at a position where the camera 321 can always take an image of the reference mark 331. The reference mark 331 is held by a structure that sufficiently suppresses the relative position fluctuation with the Y-axis linear encoder 302 (movement distance detection section) that grasps the Y coordinate of the camera 321. That is, the reference mark 331 is fixed at a predetermined position so that the distance from the Y-axis linear encoder 302 does not change (so that the relative position is constant). The mark fixing section 332 is arranged at a position at a predetermined distance from the Y-axis linear encoder 302, and the reference mark 331 is arranged at the tip of the mark fixing section 332. For example, the mark fixing part 332 is fixed so as to extend in the Z-axis direction (from top to bottom) from the Y-axis slider 301, and the reference mark 331 arranged on the mark fixing part 332 moves in the Y-axis direction. The mirror 333 is arranged on the optical path of the camera 321, and enables the optical path to be branched from a part of the field of view of the camera 321 to capture an image of the reference mark 331. In addition, an auxiliary light (not shown) for illuminating the reference mark 331 may be provided. For example, the reference mark 331 may be illuminated from the back side by the auxiliary light, or may be controlled independently of the light for capturing the image of the semiconductor chip 2.

[0027] FIG. 4 shows a specific example of the reference mark 331 and the mirror 333, and FIG. 5 shows an example of capturing an image of the reference mark 331. As shown in FIG. 4, for example, a mirror 333 is attached to the tip of the camera lens 322, and the reference mark 331 can be captured through the mirror 333. The reference mark 331 is disposed at a position at a predetermined distance from the camera 321. Specifically, the reference mark 331 is disposed at a position that is the focal length of the camera 321. As shown in FIG. 5, the field of view (image) of the camera 321 includes an image of the back surface of the semiconductor chip 2 or an image of the substrate 3, and an image of the reference mark 331. In this example, the reference mark 331 is located at the upper left of the field of view (image) of the camera 321, but may be captured at other positions as long as it can indicate the position of the reference. In addition, the reference mark 331 is, for example, a cross mark, but may be a circle mark or any other shape mark as long as it can indicate the position of the reference.

[0028] The optical unit 400 is an optical system that inverts the optical path of the camera 321. In this embodiment, the optical unit 400 detects a position error of the semiconductor chip 2 when the bonding head 310 picks up and holds it, so that the back surface of the semiconductor chip 2 can be imaged from the camera 321. The camera 321 (vision head 320) is arranged so as to image the same direction as the mounting direction (Z-axis direction) of the bonding head 310 from top to bottom, and the optical unit 400 enables the camera 321 to image the surface (mounting surface) opposite to the suction surface of the semiconductor chip 2 that is sucked and held by the bonding head 310 from bottom to top. The optical unit 400 does not have a drive shaft and is fixed to the base unit 100. The optical unit 400 is arranged under the moving path in the Y-axis direction of the chip transport unit 300 (bonding head 310 and vision head 320) from the FC unit 200 to the bonding stage 600. The FC unit 200 picks up the semiconductor chip 2 at the pick-up position, and the bonding head 310 takes an image of the semiconductor chip 2 held by the FC unit 200. The optical system inside the optical unit 400 is a telecentric relay optical system, and can transfer the backside image of the semiconductor chip 2 with the same optical performance as when the camera 321 takes an image directly from below. Although a crobit may be used as the image transfer means, a telecentric system is preferable due to the deterioration of optical performance, the working distance, the glass thickness, and other restrictions on the device design. Note that a non-telecentric optical system may be realized by specially designing the optical system of the camera lens 322 attached to the camera 321 and the optical system of the optical unit 400. For example, the optical magnification of the optical unit 400 may be variable.

[0029] FIG. 6 shows an example of the external configuration of the optical unit 400, and FIG. 7 shows an example of the configuration of the optical system inside the optical unit 400. As shown in FIG. 6, the optical unit 400 includes a housing 401 and openings 402a and 402b as an external configuration. The housing 401 includes an optical system therein and has, for example, a substantially rectangular parallelepiped shape according to the design of the optical system. The openings 402a and 402b are formed on the upper surface (input / output surface) of the housing 401 and have, for example, a circular shape similar to that of the internal lens. The openings 402a and 402b are first and second input / output parts (input / output parts) for inputting / outputting light (image) to / from the internal optical system. For example, one of the openings 402a and 402b is an input part for inputting light, and the other is an output part for outputting light. For example, the openings 402a and 402b are formed near both ends in the longitudinal direction of the upper surface of the housing 401, respectively. The openings 402a and 402b may be formed at any other positions depending on the internal optical system.

[0030] As shown in FIG. 7, the optical unit 400 includes lenses 403a and 403b and mirrors 404a and 404b as an internal optical system. For example, the lenses 403a and 403b are convex lenses with the same characteristics, and the mirrors 404a and 404b are total reflection mirrors with the same characteristics. The lenses 403a and 403b and the mirrors 404a and 404b have the same height in the Z-axis direction. The mirror 404a is disposed below the lens 403a in the Z-axis direction, and similarly, the mirror 404b is disposed below the lens 403b in the Z-axis direction. One of the lens 403a and the mirror 404a and the lens 403b and the mirror 404b is the light incident side (object side), and the other is the light exit side (imaging side). For example, when light (image) is incident on lens 403a from above in the Z-axis direction, the light that passes through lens 403a is reflected to the right in the Y-axis direction at an angle of 90 degrees by mirror 404a, the light reflected by mirror 404a is reflected upward in the Z-axis direction at an angle of 90 degrees by mirror 404b, and the light reflected by mirror 404b is emitted via lens 403b.

[0031] For example, the height L0a of the object in the Z-axis direction and the height L0b of the image in the Z-axis direction are set to the same height, the distance in the Z-axis direction from the object and image to the lenses 403a and 403b is set to L1, the distance in the Z-axis direction from the lenses 403a and 403b to the mirrors 404a and 404b is set to L2, and the distance in the Y-axis direction from the mirrors 404a and 404b is set to L3. In this case, a bilateral (two-way) telecentric optical system can be obtained by setting L1=L2+0.5*L3=focal length f of the lens. Note that L3 is the distance in the Y-axis direction between the object and the image, and is the center distance between the bonding head 310 and the vision head 320. In other words, the positional relationship between the bonding head 310 and the vision head 320 (camera 321) corresponds to the positional relationship (optical axis pitch) of the lenses 403a and 403b (openings 402a and 402b).

[0032] 8 and 9 show an example of imaging the semiconductor chip 2 using the optical unit 400. As shown in FIG. 8, the vision head 320 may further include an epi-illuminator 323 that illuminates in the imaging direction. For example, the epi-illuminator 323 is attached to the camera lens 322, and the epi-illuminator 323 is used to illuminate the semiconductor chip 2 when imaging via the optical unit 400. Illumination light is emitted from the epi-illuminator 323 from above to below in the Z-axis direction via the camera lens 322, and illuminates the semiconductor chip 2 via the lens 403b, mirror 404b, mirror 404a, and lens 403a of the optical unit 400.

[0033] 9, an additional light may be provided to add brightness to the illumination light from the epi-illumination 323. For example, an auxiliary light source 405 may be added inside the optical unit 400 as the additional light. By providing auxiliary illumination to the semiconductor chip 2 from the auxiliary light source 405, the brightness of the semiconductor chip image can be improved. For example, the mirror inside the optical unit 400 may be changed to a beam splitter 406 with a transmission:reflection ratio of 50%:50%, and the semiconductor chip 2 may be illuminated from the bottom to the top in the Z-axis direction from the auxiliary light source 405 via the beam splitter 406.

[0034] The collimator 500 is a measuring means for measuring tilt information and distance information (Z-axis direction distance) of the semiconductor chip 2 and the substrate 3. A distance sensor capable of performing measurements similar to those of the collimator may be used. The collimator 500 moves in the Y-axis direction independently of the chip transport unit 300, and measures the semiconductor chip 2 and the substrate 3. FIG. 10 shows a specific configuration example of the collimator 500. As shown in FIG. 10, the collimator 500 includes a Y-axis slider 501, a measuring unit 502, and a Z-axis slider 503.

[0035] The Y-axis slider 501 is a moving means capable of moving in the Y-axis direction, similar to the Y-axis slider 301 of the chip transport unit 300. The Y-axis slider 501 supports the measurement unit 502 and the Z-axis slider 503 in a fixed manner and moves them in the Y-axis direction. The measurement unit 502 measures the inclination information and distance information of the semiconductor chip 2 and the substrate 3 by using a laser beam. The Z-axis slider 503 moves the measurement unit 502 fixed to the tip in the Z-axis direction. For example, the Z-axis slider 503 is fixed to the Y-axis slider 501, and the collimator 500 moves independently in the Y-axis direction. Note that this configuration of the collimator 500 is an example, and the position of the measurement unit 502 in the Z-axis direction may be fixed without providing the Z-axis slider 503.

[0036] The measuring unit 502 includes light emitting and receiving elements 511a and 511b, and mirrors 512a and 512b. The light emitting and receiving elements 511a and 511b include a light source that irradiates laser light and a light receiving element that receives reflected light. The light emitting and receiving element 511a and the mirror 512a are for measuring the semiconductor chip 2. The light emitting and receiving element 511a emits laser light from right to left in the Y-axis direction, and the emitted laser light is bent by 90 degrees by the mirror 512a and reflected from bottom to top in the Z-axis direction to irradiate the semiconductor chip 2. The reflected light reflected from top to bottom in the Z-axis direction by the irradiated laser light from the semiconductor chip 2 is reflected from left to right in the Y-axis direction by the mirror 512a and received by the light emitting and receiving element 511a. The inclination and distance of the semiconductor chip 2 are measured based on the intensity of the received reflected light, etc. Similarly, the light emitting and receiving element 511b and the mirror 512b are for measuring the substrate 3. Light emitting / receiving element 511b emits laser light from right to left in the Y-axis direction, and the emitted laser light is bent 90 degrees by mirror 512b, reflected from top to bottom in the Z-axis direction, and irradiated onto substrate 3. The reflected light of the irradiated laser light reflected from bottom to top in the Z-axis direction by substrate 3 is reflected from left to right in the Y-axis direction by mirror 512b and received by light emitting / receiving element 511b. The inclination and distance of substrate 3 are measured based on the intensity of the received reflected light, etc.

[0037] The bonding stage 600 movably mounts the substrate 3 to be bonded. The bonding stage 600 can be driven in the X-axis direction to specify the bonding position of the semiconductor chip 2. The bonding stage 600 can also be driven in the Θ-axis (Θ-direction) which is a rotation axis around the Z-axis, the Tx-axis (Tx-direction) which is a rotation axis around the X-axis, and the Ty-axis (Ty-direction) which is a rotation axis around the Y-axis. This allows the bonding position of the semiconductor chip 2 to be corrected using a correction value calculated based on the position information and angle information around the Z-axis of the semiconductor chip 2 and the substrate 3 acquired by the camera 321, and the height information and tilt information of the semiconductor chip 2 and the substrate 3 acquired by the collimator 500.

[0038] The control unit 700 controls the operation of each unit of the mounting device 1 and realizes the mounting method in the mounting device 1. The control unit 700 may be realized by a computer device such as a personal computer or a server that executes a control program. The control unit 700 controls the movement of the chip transport unit 300 and the collimator 500, acquires images (position information) of the semiconductor chip 2 and the substrate 3 captured by the camera 321, acquires tilt information and distance information of the semiconductor chip 2 and the substrate 3 measured by the collimator 500, and controls to correct the position and attitude (positional relationship) of the semiconductor chip 2 and the substrate 3 based on the acquired images and information. In this embodiment, the control unit 700 acquires a semiconductor chip image including a reference mark 331 captured by the camera 321 via the optical unit 400 when the semiconductor chip 2 is gripped, and a substrate image including a reference mark 331 captured by the camera 321 when mounting on the substrate 3. The control unit 700 calculates the correction amounts of the semiconductor chip 2 and the substrate 3 based on the positional relationship between the reference mark 331 and the semiconductor chip 2 in the semiconductor chip image and the positional relationship between the reference mark 331 and the substrate 3 in the substrate image. In particular, the control unit 700 calculates the correction amounts of the semiconductor chip 2 and the substrate 3 based on the coordinates of a representative point of the semiconductor chip 2 with the reference mark 331 in the semiconductor chip image as the origin and the coordinates of a representative point of the substrate 3 (a point corresponding to the representative point of the semiconductor chip 2) with the reference mark 331 in the substrate image as the origin.

[0039] <Implementation method of the first embodiment> Fig. 11 shows a mounting method using the mounting device according to this embodiment, which is an example of one cycle of operations from picking up a semiconductor chip to bonding.

[0040] 11, first, the FC unit 200 picks up the semiconductor chip 2 (S101). For example, the FC unit 200 picks up the semiconductor chip 2 on which semiconductor elements are formed and cut, from a semiconductor wafer on a wafer stage (not shown). Next, the FC unit 200 inverts the top and bottom surfaces of the semiconductor chip 2 (S102). The FC unit 200 rotates the picked-up semiconductor chip 2 so that the top and bottom surfaces are inverted by 180 degrees.

[0041] Next, the FC unit 200 passes the semiconductor chip 2 to the bonding head 310 (S103). For example, the Y-axis slider 301 of the chip transport part 300 is moved in the Y-axis direction, and the bonding head 310 is stopped at a position above the FC unit 200. The FC unit 200 passes the picked-up and inverted semiconductor chip 2 to the bonding head 310. The bonding head 310 receives the semiconductor chip 2 and holds it by suction.

[0042] Next, the pickup position and posture of the semiconductor chip 2 are inspected (S104). For example, the Y-axis slider 301 of the chip transport unit 300 is moved in the Y-axis direction, and the bonding head 310 and the vision head 320 are stopped at a predetermined position above the optical unit 400. That is, the bonding head 310 and the vision head 320 move until they are above the openings 402a and 402b of the optical unit 400, respectively. Note that the positions of the bonding head 310 and the vision head 320 (chip transport unit 300) on the Y-axis at this time (when the semiconductor chip 2 is gripped) are sometimes called the "semiconductor chip imaging position", and the state of the bonding head 310 and the vision head 320 at the semiconductor chip imaging position is sometimes called the "semiconductor chip imaging state". At the semiconductor chip imaging position, the camera 321 of the vision head 320 images the back surface (mounting surface) of the semiconductor chip 2 gripped by the bonding head 310 via the optical unit 400. The control unit 700 acquires the position of the semiconductor chip 2 and the rotation angle around the Z axis from the captured semiconductor chip image. At this time, by using the distance from the reference mark 331 reflected in the field of view of the camera 321, an error due to a positional deviation of the camera 321 can be eliminated.

[0043] Additionally, the collimator 500 acquires the tilt angle of the semiconductor chip 2. For example, the chip transport unit 300 is moved to a semiconductor chip imaging position, and after the semiconductor chip image is captured, the Y-axis slider 501 of the collimator 500 is moved in the Y-axis direction and stopped at a predetermined position near the bonding head 310. That is, the collimator 500 moves until the tip of the measuring unit 502 of the collimator 500 is between the semiconductor chip 2 and the optical unit 400. The collimator 500 measures the tilt angle of the semiconductor chip 2 by irradiating the back surface of the semiconductor chip 2 with laser light from the measuring unit 502 upward.

[0044] Next, the position and posture of the substrate 3 are inspected (S105). For example, the Y-axis slider 301 of the chip transport unit 300 is moved in the Y-axis direction, the bonding stage 600 is moved in the X-axis direction, and the bonding head 310 and the vision head 320 are stopped at a predetermined position above the bonding stage 600. That is, the bonding head 310 and the bonding stage 600 are moved so that the semiconductor chip 2 held by the bonding head 310 and the substrate 3 on the bonding stage 600 are aligned on the Z-axis. Note that the positions of the bonding head 310 and the vision head 320 (chip transport unit 300) on the Y-axis at this time (when mounting on the substrate 3) are sometimes called the "substrate imaging position", and the state of the bonding head 310 and the vision head 320 at the substrate imaging position is sometimes called the "substrate imaging state". At the substrate imaging position, the camera 321 of the vision head 320 images the surface (mounting surface) of the substrate 3 on the bonding stage 600. The control unit 700 acquires the position of the substrate 3 and the rotation angle around the Z axis from the captured substrate image. At this time, by using the distance from the reference mark 331 captured within the field of view of the camera 321, errors due to misalignment of the camera 321 can be eliminated.

[0045] Additionally, the collimator 500 acquires the tilt angle of the substrate 3. For example, the chip transport unit 300 is moved to a substrate imaging position, and after capturing an image of the substrate, the Y-axis slider 501 of the collimator 500 is moved in the Y-axis direction and stopped at a predetermined position on the bonding stage 600. That is, the collimator 500 moves until the tip of the measuring unit 502 is between the semiconductor chip 2 and the substrate 3. The collimator 500 measures the tilt angle of the substrate 3 by irradiating the laser light downward from the measuring unit 502 to the surface of the substrate 3.

[0046] Next, the position of the bonding head 310 and the position and attitude of the bonding stage 600 are finely corrected (S106). The control unit 700 calculates the amount of correction for the position and attitude of the semiconductor chip 2 and the substrate 3 based on the position and attitude of the inspected semiconductor chip 2 and the position and attitude of the substrate 3. The bonding head 310 and the bonding stage 600 finely correct the position and attitude of the semiconductor chip 2 and the substrate 3 according to the calculated amount of correction. Finally, the semiconductor chip 2 is mounted on the substrate 3 (S107). For example, with the position and attitude of the semiconductor chip 2 and the substrate 3 corrected, the bonding head 310 moves the semiconductor chip 2 downward in the Z-axis direction and presses the semiconductor chip 2 onto the substrate 3. Furthermore, the bonding stage 600 is heated to perform bonding.

[0047] Next, as a specific example of S106 in FIG. 11, a position calculation algorithm for correcting the positions of the semiconductor chip and the substrate will be described. For example, the position calculation algorithm is executed by the control unit 700. A calculation method in an example where there is no reference mark will be described using FIG. 12 and FIG. 13, and a calculation method in an example where there is a reference mark will be described using FIG. 14. Both examples are applicable to the mounting device according to this embodiment. That is, when there is no reference mark, the error caused by multiple cameras can be suppressed by using one camera, and when there is a reference mark, the error caused by the positional deviation of one camera can be further suppressed. In the following description, the following variables are used. ai: the i-th representative point on the semiconductor chip 2. The image coordinates of ai are (u ai ,v ai ) [pixel]. For simplicity, i=1, 2, 3, but more points may be used as representative points. The representative points of the semiconductor chip 2 are, for example, terminals of the semiconductor chip 2 or predetermined marks. ga: The center of gravity of the representative point on the semiconductor chip 2. ga is calculated from the coordinates of a1, a2, and a3. The image coordinates of ga are (u ga ,v ga ) [pixels]. θa: the rotation angle of the semiconductor chip 2. θa is calculated from the coordinates a1, a2, and a3. bi: the i-th representative point on the substrate 3. The image coordinates of bi are (u bi ,v bi ) [pixel]. Here, for simplicity, i=1, 2, 3, but more points may be used as representative points. The representative points of the substrate 3 are points corresponding to the representative points of the semiconductor chip 2, and are, for example, terminals of the substrate 3 or predetermined marks. gb: The center of gravity of the representative point on the substrate 3. gb is calculated from the positions of b1, b2, and b3. The image coordinates of gb are (u gb ,v gb ) [pixels]. θb: the rotation angle of the substrate 3. θb is calculated from the coordinates b1, b2, and b3. z: the distance [mm] on the Z axis of the semiconductor chip 2 when the surface of the substrate 3 is used as a reference in the substrate image capture state. βv: the optical magnification of the vision head 320 [mm / pixel]. βr: the optical magnification of the optical unit 400 [times].

[0048] 12 shows an example of alignment in an ideal case where there is no camera misalignment in an example without a reference mark. In an example without a reference mark (an example in which the reference mark is removed from the mounting apparatus 1 according to this embodiment), the bonding head 310 and the vision head 320 fixed to the Y-axis slider 301 move simultaneously in the Y-axis direction.

[0049] The purpose of the position calculation algorithm is to accurately align the semiconductor chip 2 and the substrate 3. For the sake of explanation, it is assumed here that it is desired to accurately align a representative point bi (i=1, 2, 3) on the substrate 3 with a corresponding representative point ai (i=1, 2, 3) on the semiconductor chip 2.

[0050] In the position calculation algorithm, first, in the semiconductor chip imaging state (position Y1) on the left side of Fig. 12, the camera 321 images the semiconductor chip 2 via the optical unit 400, and obtains the captured semiconductor chip image P1. The image coordinates of ai are obtained from the semiconductor chip image P1. The position ga of the semiconductor chip 2 (here, assumed to be the center of gravity of three points) and the rotation angle θa are calculated from the obtained image coordinates of ai.

[0051] Next, the bonding head 310 retracts the semiconductor chip 2 in the Z-axis direction, moves the Y-axis slider 301 (bonding head 310 and vision head 320) in the Y-axis direction, and moves the bonding stage 600 in the X-axis direction to capture the mounting position of the semiconductor chip 2 on the substrate 3 in the field of view of the camera. The position (design value) of the substrate 3 to be mounted is programmed, and can be moved with enough accuracy to fit within the field of view of the camera 321. In the substrate imaging state (position Y2) on the right side of FIG. 12, the camera 321 images the substrate 3 and obtains the captured substrate image P2. The image coordinates of bi are obtained from the substrate image P2. The position gb and rotation angle θb of the substrate are calculated from the obtained image coordinates of bi.

[0052] In addition, calibration is performed during assembly and adjustment of the mounting device. offset (The center distance [mm] on the Y axis between the vision head axis and the bonding head axis) is assumed to have been acquired. Furthermore, the retraction amount z [mm] of the semiconductor chip 2 is assumed to be known (the scale value in the Z axis direction).

[0053] Next, the information obtained above (coordinates of ai, ga, bi, gb, θa, θb, y offset , z), the amount of movement (amount of correction) to be instructed to the mounting device is calculated as follows:

[0054] The representative point on the semiconductor chip 2 and the representative point on the substrate 3 can be linked by the following equation (1).

number

[0055] If the center of the camera field of view in the substrate imaging state is taken as the origin, then r ai is expressed as the following equation (2).

number

[0056] Similarly, r bi can be expressed by the following equation (3).

number

[0057] If the amount of rotation required to correct the attitude of the semiconductor chip 2 is R, then R can be calculated by the following equation (4).

number

[0058] If the amount of translation of the position of the semiconductor chip 2 is T, T can be calculated by the following equation (5).

number

[0059] The following movement amount and rotation angle (correction amount) can be calculated from the above formulas (4) and (5). ·Y-axis direction movement distance Ty [mm] of the Y-axis slider 301 · X-axis travel distance of bonding stage 600 Tx [mm] · Z-axis movement distance Tz [mm] of bonding head 310 Rotation angle θ of semiconductor chip 2 [mm] The semiconductor chip 2 and the substrate 3 are aligned by instructing the mounting device (each component of the mounting device from the control unit 700) on the calculated movement amount and rotation angle.

[0060] Fig. 13 shows an example of alignment when there is a camera misalignment in an example without a reference mark. As in Fig. 12, bonding head 310 and vision head 320 fixed to Y-axis slider 301 are simultaneously moved in the Y-axis direction, and the amount of movement is calculated. Here, we consider a case where the light receiving element inside camera 321 is slightly misaligned between the semiconductor chip imaging state (position Y1) and the board imaging state (position Y2). The same can be considered when the entire vision head 320 is misaligned.

[0061] First, the amount of positional deviation of the light receiving element of camera 321 is expressed by equation (6). Note that the positional deviation of the light receiving element is not limited to translational movement only and may also include rotation, but for simplicity of explanation, only the translational movement component is considered here.

number

[0062] At this time, since the image coordinates of the representative point bi on the substrate 3 calculated from the substrate image P2 contain a positional deviation as an error, the above formula (3) becomes the following formula (7).

number

[0063] That is, the true value r bi An error of -Δr is added to the amount of positional deviation Δp of the light receiving element converted into mm, and is expressed by the following formula (8).

number

[0064] T' calculated from the board image P2 of the board 3 including the positional deviation is given by the following formula (9) based on the above formula (5).

number

[0065] In this way, the amount of positional deviation of the light receiving element of camera 321 is directly added as an error to the amount of movement of semiconductor chip 2. To remove this error, it is necessary to know the amount of movement Δr of the light receiving element, but in this example, it is not possible to separate the accurate position of substrate 3 and the amount of deviation of the light receiving element as in equation (7).

[0066] 14 shows an example of alignment when there is a camera misalignment in an example with a reference mark. In an example with a reference mark (an example of the mounting device 1 according to the present embodiment), the bonding head 310, the vision head 320, and the reference mark 331 fixed to the Y-axis slider 301 move simultaneously in the Y-axis direction, and the amount of movement is calculated.

[0067] As explained in the device configuration of this embodiment, the position reference (reference mark 331) is arranged so that it is always reflected in a part of the field of view of the camera 321. The semiconductor chip 2 is imaged in the semiconductor chip imaging state (position Y1), and the image coordinates of the representative point ai on the semiconductor chip 2 are obtained from the captured semiconductor chip image P1. At this time, the image center is not set as the origin, but the reflected reference mark 331 is set as the origin.

[0068] Assume that the light receiving element inside camera 321 shifts in position by Δp [pixels] between the semiconductor chip imaging state and the board imaging state (position Y2). In this case, in board image P2 obtained by imaging board 3 in the board imaging state, reference mark 331 appears shifted by -Δp. Similarly, board 3 appears shifted by -Δp from its true position in board image P2.

[0069] If the image coordinates of bi are obtained without using the reference mark 331 as the origin, the movement amount of the light receiving element is added as an error as in the above equations (7) and (9), but if the image coordinates of bi are calculated using the reference mark 331 as the origin, the movement amount Δp of the light receiving element is not included, and the above equations (3) and (5) are obtained. In addition, by capturing the change in the image coordinates of the reference mark 331, it is possible to separate the accurate position of the substrate 3 and the amount of deviation of the light receiving element as in the above equation (7).

[0070] <Advantages of the First Embodiment> As described above, in this embodiment, the process from picking up to bonding is performed with one camera, thereby reducing the error factors caused by the camera and achieving high-precision (e.g., sub-μm) mounting accuracy. In addition, since there is only one camera, the number of parts in the mounting device can be reduced, and the manufacturing cost of the mounting device can be reduced.

[0071] Specifically, in this embodiment, the following two ideas are adopted to achieve high-precision mounting using a single camera.

[0072] 1. An optical unit for observing the back surface was installed to detect position errors of the picked-up semiconductor chip: Since the semiconductor chip has been picked up, it is necessary to image it from the bottom up. In the related art, the first camera is arranged so that it images from the bottom up, but in this embodiment, the camera is attached so that it images from the top down, and an optical unit is added to image the backside of the semiconductor chip. The optical unit has the function of transferring the image of the backside of the semiconductor chip to the imaging position of the camera. This makes it possible to image the backside of the semiconductor chip while the camera remains fixed in the orientation that images from the top down. Since the position error of the bonding destination (substrate) is imaged from the top down, it can be directly imaged without the optical unit.

[0073] 2. In order to correct the camera misalignment, a reference mark was provided that was always visible in the camera's field of view: The camera is an important element for detecting position errors of semiconductor chips and boards, and the positional deviation of the camera itself is directly linked to mounting errors. However, the camera is subjected to mechanical stress as it drives the Y axis, and furthermore, the light receiving devices inside the camera, such as CCD and CMOS, generate heat and are subjected to thermal stress. In order to achieve high-precision mounting, it is necessary to monitor the positional deviation of the camera itself and reflect it in the correction of the mounting position. In this embodiment, a fiducial mark that can always be imaged is provided within the field of view of the camera. The fiducial mark is devised and fixed so that the relative position of the camera and the encoder that detects the Y coordinate of the bonding head does not change. When detecting position errors of the semiconductor chip and the board, the error is managed based on the relative position from this fiducial mark, so that the influence of the camera itself, even if it is misaligned, can be eliminated.

[0074] (Embodiment 2) Hereinafter, the second embodiment will be described with reference to the drawings. In this embodiment, an example in which the configuration of the collimator is changed in the mounting device according to the first embodiment will be described. The other configurations are the same as those in the first embodiment.

[0075] Fig. 15 shows a configuration example of a chip transport unit 300 including a collimator according to this embodiment. As shown in Fig. 15, the chip transport unit 300 includes a Y-axis slider 301, a bonding head 310, a vision head 320, and a reference mark arrangement unit 330, as in the first embodiment, and further includes a collimator 500.

[0076] In the first embodiment, as described in FIG. 10, the collimator 500 is fixed to the Y-axis slider 501 and is configured to be independently movable on the Y-axis. In the present embodiment, as shown in FIG. 15, the collimator 500 is fixed to the same Y-axis slider 301 as the bonding head 310 and the vision head 320, and is configured to be driven in the Y-axis direction together with the bonding head 310 and the vision head 320. The distance in the Y-axis direction from the bonding head 310 to the vision head 320 (camera 321) is the same as the distance in the Y-axis direction from the bonding head 310 to the collimator 500. The positional relationship between the bonding head 310 and the collimator 500 corresponds to the positions of the two openings (optical axes of the lenses) of the optical unit 400. That is, the collimator 500 is disposed next to the bonding head 310 on the opposite side to the vision head 320 at the optical axis pitch of the optical unit 400. As a result, the inclination of the semiconductor chip 2 and distance information in the Z-axis direction are measured via the optical unit 400.

[0077] In the first embodiment, the semiconductor chip 2 and the substrate 3 are measured using two light emitting and receiving elements and two mirrors, but in the present embodiment, the semiconductor chip 2 and the substrate 3 are measured using one light emitting and receiving element 511. When measuring the semiconductor chip 2, the laser light from the collimator 500 is emitted downward along the Z axis, and the tilt angle and Z axis direction distance information of the semiconductor chip 2 are obtained via the optical unit 400. When measuring the substrate 3, the optical unit 400 is not necessary, and the substrate surface is directly measured with the laser light emitted in the Z axis direction. The control unit 700 calculates the correction amount of the semiconductor chip 2 and the substrate 3 using the tilt information and distance information of the semiconductor chip 2 measured by the collimator 500 via the optical unit 400 and the tilt information and distance information of the substrate 3 measured directly by the collimator 500.

[0078] As described above, in this embodiment, the collimator can be driven integrally with the bonding head and the vision head, and the semiconductor chip can be measured from the collimator via the optical unit. This allows the collimator to be realized with a single light emitting / receiving element, improving the measurement accuracy of the collimator and reducing the number of parts and costs.

[0079] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention.

[0080] Each configuration in the above-described embodiments is configured by hardware or software, or both, and may be configured by one piece of hardware or software, or may be configured by multiple pieces of hardware or software. The function (processing) of each device may be realized by a computer having a CPU, memory, etc. For example, a program for performing the method (control method) in the embodiment may be stored in a storage device, and each function may be realized by executing the program stored in the storage device by a CPU.

[0081] These programs can be stored and provided to a computer using various types of non-transitory computer readable media. Non-transitory computer readable media include various types of tangible storage media. Examples of non-transitory computer readable media include magnetic recording media (e.g., flexible disks, magnetic tapes, hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), CD-ROM (Read Only Memory), CD-R, CD-R / W, and semiconductor memory (e.g., mask ROM, PROM (Programmable ROM), EPROM (Erasable PROM), flash ROM, RAM (random access memory)). The programs may also be provided to a computer by various types of transitory computer readable media. Examples of transitory computer readable media include electric signals, optical signals, and electromagnetic waves. The transitory computer readable media can provide the programs to a computer via a wired communication path such as an electric wire and an optical fiber, or via a wireless communication path. [Explanation of symbols]

[0082] 1 Mounting equipment 2. Semiconductor chips 3. Substrate 100 Base FC200 unit 300 Chip transport unit 301 Y-axis slider 302 Y-axis linear encoder 303 Y-axis scale 304 Gantry Frame 305 Linear Guide 310 Bonding Head 311 Suction head 312 Bonding Picker 320 Vision Head 321 Camera 322 Camera Lens 323 Reflection lighting 330 Reference mark placement section 331 Reference Mark 332 Mark fixing part 333 Mirror 400 Optical Unit 401 Case 402a, 402b opening 403a, 403b Lenses 404a, 404b mirror 405 Auxiliary light source 406 Beam Splitter 500 Collimator 501 Y-axis slider 502 Measurement Department 503 Z-axis slider 511, 511a, 511b Light emitting / receiving element 512a, 512b mirror 600 Bonding Stage 700 Control section

Claims

1. a bonding head that picks up and holds the mounted component and then mounts the held component on a substrate after moving a predetermined distance; an imaging unit movable together with the bonding head, the imaging unit imaging the mounted component when gripped and imaging the board when mounted; an optical system that enables an image of the mounted component to be captured by the imaging unit when the mounted component is gripped; a reference mark that is movable together with the imaging unit and is disposed so as to be included in an imaging range of the imaging unit when the substrate is gripped and when the substrate is mounted; a control unit that corrects a positional relationship between the mounted component to be mounted and the board based on a mounted component image including the reference mark captured by the imaging unit via the optical system when the mounted component is gripped and a board image including the reference mark captured by the imaging unit when the mounting is performed; and A manufacturing apparatus for a semiconductor device comprising:

2. The reference mark is disposed at a position corresponding to a focal length of the imaging unit.

2. The apparatus for manufacturing a semiconductor device according to claim 1.

3. a mirror disposed on an optical path of the imaging unit; The reference mark is disposed so as to be included in an imaging range of the imaging unit via the mirror.

3. The manufacturing apparatus for a semiconductor device according to claim 1.

4. a movement distance detection unit fixed to the imaging unit and detecting a movement distance of the imaging unit; The relative position between the reference mark and the movement distance detection unit is constant. The manufacturing apparatus for a semiconductor device according to claim 1 .

5. an auxiliary lighting unit that illuminates the reference mark from the back side; The manufacturing apparatus for a semiconductor device according to claim 1 .

6. the control unit corrects a positional relationship between the mounted component and the board based on a positional relationship between the reference mark and the mounted component in the mounted component image and a positional relationship between the reference mark and the board in the board image. The manufacturing apparatus for a semiconductor device according to claim 1 .

7. the control unit corrects a positional relationship between the mounted component and the board based on coordinates of a representative point of the mounted component with the reference mark in the mounted component image as an origin and coordinates of a representative point of the board with the reference mark in the board image as an origin.

7. The apparatus for manufacturing a semiconductor device according to claim 6.

8. the imaging unit is disposed so as to capture an image in the same direction as the mounting direction of the bonding head; the optical system enables the imaging unit to image a surface of the mounting component opposite to a suction surface of the mounting component that is suctioned and gripped by the bonding head; The manufacturing apparatus for a semiconductor device according to claim 1 .

9. The optical system includes a first input / output unit and a second input / output unit capable of inputting and outputting light, The positions of the bonding head and the imaging unit correspond to the positions of the first input / output unit and the second input / output unit. The manufacturing apparatus for a semiconductor device according to claim 8 .

10. The optical system is a telecentric optical system. The manufacturing apparatus for a semiconductor device according to claim 1 .

11. The optical system has a variable optical magnification. The manufacturing apparatus for a semiconductor device according to claim 1 .

12. an illumination unit that illuminates the mounted component when capturing an image of the mounted component via the optical system; The manufacturing apparatus for a semiconductor device according to claim 1 .

13. An additional illumination unit is provided to add brightness to the illumination light emitted from the illumination unit. The apparatus for manufacturing a semiconductor device according to claim 12.

14. The additional illumination unit illuminates the mounted component via a beam splitter included in the optical system. The apparatus for manufacturing a semiconductor device according to claim 13.

15. a measuring unit movable together with the bonding head, the measuring unit measuring an inclination or distance of the mounted component via the optical system when the mounted component is held, and measuring an inclination or distance of the board when the mounted component is mounted; The manufacturing apparatus for a semiconductor device according to claim 1 .

16. The positions of the bonding head and the measurement unit correspond to the position of the optical axis of the optical system. The apparatus for manufacturing a semiconductor device according to claim 15.

17. a distance from the bonding head to the imaging unit and a distance from the bonding head to the measurement unit are the same; 17. The apparatus for manufacturing a semiconductor device according to claim 15 or 16.

18. a bonding head that picks up and holds the mounted component and then mounts the held component on a substrate after moving a predetermined distance; an imaging unit movable together with the bonding head, the imaging unit imaging the mounted component when gripped and imaging the board when mounted; an optical system that enables an image of the mounted component to be captured by the imaging unit when the mounted component is gripped; a control unit that corrects a positional relationship between the mounted component to be mounted and the board based on a mounted component image captured by the imaging unit through the optical system when the mounted component is gripped and a board image captured by the imaging unit when the mounting is performed; and Equipped with The optical system includes a first input / output unit and a second input / output unit capable of inputting and outputting light, the positions of the bonding head and the imaging unit correspond to the positions of the first input / output unit and the second input / output unit, The optical system is a telecentric optical system between the first input / output section and the second input / output section. Manufacturing equipment for semiconductor devices.

19. A method for manufacturing a semiconductor device, comprising: a bonding head sucking and holding a mounted component supplied thereto; and mounting the held mounted component on a substrate after moving the bonding head a predetermined distance, comprising: an imaging unit movable together with the bonding head, which images the mounted component when gripped and images the board when mounted; an optical system that enables the imaging unit to capture an image of the mounted component when the mounted component is gripped; a reference mark movable together with the imaging unit is disposed so as to be included in an imaging range of the imaging unit when the gripping unit is gripped and when the mounting unit is mounted; correcting a positional relationship between the mounted component to be mounted and the board based on a mounted component image including the reference mark obtained by capturing an image of the mounted component by the imaging unit via the optical system when the mounted component is gripped, and a board image including the reference mark obtained by capturing an image of the board by the imaging unit during the mounting. A method for manufacturing a semiconductor device.

Images