Processing device and manufacturing method of processed products

Abstract

To simplify a device configuration, reduce footprint, and reduce a size of a storage space for segmentalized workpieces.SOLUTION: A processing apparatus includes processing tables 2A and 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate W in order to transport the sealed substrate W to the processing tables 2A and 2B, a processing mechanism 4 for cutting and segmentalized the sealed substrate W held on the processing tables 2A and 2B, a storage box 5 in which the sealed substrates W segmentalized by the processing mechanism 4 are dropped and stored, a second holding mechanism 6 for holding a product P in order to transport the product P from the processing tables 2A, 2B to the storage box 5, a transfer movement mechanism 7 which extends along an arrangement direction of the processing tables 2A, 2B and a collection box 5 and has a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a processing movement mechanism 8 for moving the processing mechanism 4 in each of a first direction along the transfer shaft 71 and a second direction orthogonal to the first direction on a horizontal plane.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device and a method for manufacturing a processed product. [Background technology]

[0002] Conventionally, a cutting device is used when cutting and dividing electronic components such as resin-encapsulated substrates into individual pieces. For example, a dividing device such as that shown in Patent Document 1 is known.

[0003] In this dividing device, a workpiece carrying means moves in the Y-axis direction to carry the package substrate to a holding table, and while moving the holding table in the processing feed direction (X-axis direction), a cutting blade cuts the package substrate to divide it into chip size packages (CSPs). When cutting, cutting water is supplied from a cutting water supply nozzle to the cutting section made by the cutting blade. In addition, in order to make the dividing device more compact than a configuration in which multiple chip size packages (CSPs) are arranged and stored on a tray, the dividing device is provided with a bulk storage means for dropping multiple chip size packages (CSPs) into a chip storage container and storing them in bulk. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5947010

[0005] However, in the above-mentioned dividing device, not only does it transport the package substrate in the Y-axis direction, but it also moves the holding table in the processing feed direction (X-axis direction) to cut the package substrate, which results in a large footprint of the device.

[0006] Furthermore, the X-axis direction moving means requires a protective member to protect the X-axis direction moving means from cutting chips or cutting water generated by cutting. As this protective member, a bellows member for protecting the X-axis direction moving means and a cover member for protecting the bellows member are used. As a result, the device configuration becomes complicated. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, the present invention has been made to solve the above-mentioned problems, and its main objective is to simplify the device configuration, reduce the footprint, and miniaturize the storage space for the individualized workpieces. [Means for solving the problem]

[0008] In other words, the processing apparatus of the present invention is characterized in that it comprises a processing table for holding an object to be processed, a first holding mechanism for holding the object to be processed in order to transport it to the processing table, a processing mechanism for cutting and individualizing the object to be processed held on the processing table, a storage box into which the object to be processed diced by the processing mechanism falls and is stored, a second holding mechanism for holding the individualized object to be processed in order to transport the individualized object to be processed from the processing table to the storage box, a transport moving mechanism extending along the arrangement direction of the processing table and the recovery box and having a common transfer axis for moving the first holding mechanism and the second holding mechanism, and a processing moving mechanism for moving the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction in a horizontal plane. Effect of the Invention

[0009] According to the present invention configured in this manner, it is possible to simplify the device configuration, reduce the footprint, and reduce the space required to accommodate the individualized workpieces. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing a schematic configuration of a cutting device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view showing a schematic diagram of a cutting table and its surrounding structure in the embodiment; [Diagram 3] 4 is a diagram (plan view) seen from the Z direction, which diagrammatically illustrates the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 4] 4 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Diagram 5] 13 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of a first holding mechanism and a transport moving mechanism of the embodiment. FIG. [Figure 6] 13 is a diagram (side view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment, as viewed from the X direction. FIG. [Figure 7] 13 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of a second holding mechanism and a transport moving mechanism of the embodiment. FIG. [Figure 8] FIG. 2 is a cross-sectional view showing a schematic configuration of the rack and pinion mechanism of the embodiment. [Figure 9] 11 is a diagram (plan view) seen from the Z direction, which diagrammatically illustrates the peripheral structure of the drying table and the storage box of the embodiment. FIG. [Figure 10] 13 is a view (front view) seen from the Y direction, which diagrammatically shows the peripheral structure of the drying table and the storage box of the embodiment. FIG. [Figure 11] 5A to 5C are schematic diagrams illustrating the operation of the cutting device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0012] As described above, the processing apparatus of the present invention includes a processing table for holding an object to be processed, a first holding mechanism for holding the object to be processed in order to transport the object to the processing table, a processing mechanism for cutting and singulating the object to be processed held on the processing table, a storage box into which the object to be processed singulated by the processing mechanism falls and is stored, a second holding mechanism for holding the object to be processed in order to transport the object to be processed from the processing table to the storage box, and a processing table and a storage box for storing the object to be processed singulated. Accommodation The system is characterized by comprising a transport moving mechanism that extends along the arrangement direction of the boxes and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, and a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis in a horizontal plane and in a second direction perpendicular to the first direction.

[0013] With this processing device, the processing table and Accommodation The first holding mechanism and the second holding mechanism are moved by a common transfer shaft extending along the arrangement direction of the boxes, and the processing mechanism is moved by the processing movement mechanism in a first direction along the transfer shaft and a second direction perpendicular to the first direction on a horizontal plane, so that the workpiece can be singulated without moving the processing table in the first and second directions. Therefore, it is possible to eliminate the need for a bellows member for protecting the ball screw mechanism and the like and a cover member for protecting the bellows member without moving the processing table by a ball screw mechanism or the like. As a result, the configuration of the processing device can be simplified. Furthermore, since the processing table is configured not to move in the first and second directions on a horizontal plane, the movement space of the processing table and the wasted space around it can be reduced, thereby reducing the footprint of the processing device. Furthermore, since the second holding mechanism holding the singulated workpieces is transported to a storage box and the singulated workpieces are dropped from the second holding mechanism and stored in the storage box, the storage space can be made smaller than in the conventional configuration in which the workpieces are stored in a tray, which also reduces the footprint of the processing device.

[0014] As a specific arrangement of the transfer shaft and the processing movement mechanism, it is preferable that the transfer shaft is arranged above the processing movement mechanism so as to cross the processing movement mechanism. With this configuration, the first holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the first holding mechanism can be prevented from physically interfering with the moving mechanism for processing. Also, the second holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the second holding mechanism can be prevented from physically interfering with the moving mechanism for processing.

[0015] As a specific embodiment of the second holding mechanism, it is preferable that the second holding mechanism adsorbs and holds the individualized object to be processed.

[0016] In order to reliably drop the individualized workpieces from the second holding mechanism into a storage box, it is desirable to further provide a scraping member that scrapes off the individualized workpieces from the second holding mechanism.

[0017] In order to reliably scrape off the individual pieces of the workpieces and store them in a storage box while utilizing the movement of the second holding mechanism by the moving transport mechanism, it is desirable that the scraping member is fixed to the storage box, and that the transport moving mechanism moves the second holding mechanism relative to the scraping member, thereby scraping off the individual pieces of the workpieces from the second holding mechanism.

[0018] In order to dry the individualized object to be processed, it is desirable that the processing apparatus of the present invention further includes a drying table for drying the individualized object to be processed. In this configuration, the transport moving mechanism moves the second holding mechanism from the processing table to the drying table, and moves the second holding mechanism from the drying table to the storage table. box will be moved to.

[0019] As a specific embodiment for drying the individual pieces of the workpieces, it is desirable that the processing apparatus of the present invention further comprises a drying mechanism that injects gas from above the drying table to dry the individual pieces of the workpieces, and a drying moving mechanism that moves the drying mechanism along the drying table.

[0020] As a specific embodiment of the drying mechanism, it is preferable that the drying mechanism injects gas in the direction of movement by the drying movement mechanism.

[0021] As a specific embodiment of the movement mechanism that moves the processing mechanism at least in the first direction, that is, the X direction, and the second direction, that is, the Y direction, the processing movement mechanism preferably includes an X-direction movement unit that moves the processing mechanism linearly in the X direction, and a Y-direction movement unit that moves the processing mechanism linearly in the Y direction, and the X-direction movement unit preferably includes a pair of X-direction guide rails provided along the X direction with the processing table therebetween, and a support that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction movement unit. With this configuration, since a pair of X-direction guide rails are provided in the X direction on either side of the machining table, the pitch of the pair of X-direction guide rails can be increased. As a result, the effect of Z-direction positional deviation between the X-direction guide rails on machining can be reduced. In other words, deviation in the orthogonality between the rotating tool (e.g., blade) and the machining table can be reduced, improving machining accuracy. Also, X-direction guide rails with lower specifications than before can be used.

[0022] A method for manufacturing a processed product using the above-mentioned processing apparatus is also one aspect of the present invention.

[0023] <One embodiment of the present invention> Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate and schematic drawings are shown. The same components are given the same reference numerals and the description thereof is omitted as appropriate.

[0024] <Overall configuration of processing equipment> The processing apparatus 100 of the present embodiment is a cutting apparatus that cuts a sealed substrate W, which is an object to be processed, to separate the sealed substrate W into a plurality of products P, which are processed items.

[0025] Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin so as to encapsulate at least the electronic elements. The substrate constituting the encapsulated substrate W may be a lead frame or a printed wiring board, and may also be a semiconductor substrate (including semiconductor wafers such as silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, or the like. The substrate constituting the encapsulated substrate W may or may not be wired.

[0026] In addition, the sealed substrate W and the product P of this embodiment are configured such that one surface of the substrate is resin-molded. In such a configuration, the resin-molded surface is a surface on which electronic elements connected to the substrate are resin-molded, and is called the "sealing surface" or "package surface". On the other hand, the non-resin-molded surface opposite the resin-molded surface is called the lead surface because leads that usually function as external connection electrodes of the product are exposed. In the case where the leads are protruding electrodes used in electronic components such as BGA (Ball Grid Array), it may also be called the "ball surface". Furthermore, the non-resin-molded surface opposite the resin-molded surface may also be called the "substrate surface" because there are some forms in which no leads are formed. In the description of this embodiment, the resin-molded surface is referred to as the "sealing surface" or "package surface", and the non-resin-molded surface opposite the resin-molded surface is referred to as the "lead surface".

[0027] 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A and 2B, a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, a second holding mechanism 6 for holding a plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B to a storage box 5, a transport moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B. The first holding mechanism 3 and the transport moving mechanism 7 form a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 form a transport mechanism (unloader) for transporting the plurality of products P.

[0028] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively defined as the X direction, which is a first direction, and the Y direction, which is a second direction, and the vertical direction perpendicular to the X direction and the Y direction is defined as the Z direction. Specifically, the left-right direction in Fig. 1 is defined as the X direction, and the up-down direction is defined as the Y direction. As will be described later, the X direction is the movement direction of the support 812, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam part (beam part) spanning a pair of legs of the gate-shaped support 812 (see Figs. 2 and 3).

[0029] <Cutting tables 2A, 2B> The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

[0030] These two cutting tables 2A, 2B are provided along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and the centers of their upper surfaces (specifically, the centers of rotation by the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

[0031] The two cutting tables 2A, 2B are for suction-holding the sealed substrate W, and as shown in Fig. 1, two vacuum pumps 10A, 10B for suction-holding are arranged corresponding to the two cutting tables 2A, 2B. Each of the vacuum pumps 10A, 10B is, for example, a water-sealed vacuum pump.

[0032] Here, since the cutting tables 2A, 2B are fixed in the XYZ directions, the piping (not shown) connected from the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction power. As a result, even a very small package, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, since a decrease in suction power due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

[0033] <First holding mechanism 3> 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in Fig. 5 and Fig. 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction portions 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction portions 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

[0034] 1, the substrate supply mechanism 11 has a substrate accommodation section 111 in which a plurality of sealed substrates W are accommodated from outside, and a substrate supply section 112 that moves the sealed substrate W accommodated in the substrate accommodation section 111 to a holding position RP at which the sealed substrate W is attracted and held by the first holding mechanism 3. This holding position RP is set so as to be aligned in the same row as the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a heating section 113 that heats the sealed substrate W attracted by the first holding mechanism 3 to make it soft, thereby facilitating the attraction.

[0035] <Cutting mechanism 4> The cutting mechanism 4, which is a processing mechanism, has two rotating tools 40 consisting of blades 41A, 41B and two spindles 42A, 42B, as shown in Figs. 1, 2 and 3. The two spindles 42A, 42B are provided so that their rotation axes are along the Y direction, and the blades 41A, 41B attached thereto are disposed so as to face each other (see Fig. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. In addition, the cutting device 100 of this embodiment is provided with a liquid supply mechanism 12 having an injection nozzle 121 that injects cutting water (machining fluid) to suppress frictional heat generated by the blades 41A, 41B, as shown in Fig. 4. The injection nozzle 121 is supported, for example, by a Z-direction moving part 83, which will be described later.

[0036] <Second holding mechanism 6> As shown in Fig. 1, the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting tables 2A, 2B to the drying table 13 or the storage box 5. As shown in Fig. 8, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction sections 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction sections 611 of the suction head 61. The suction head 61 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A, 2B to the drying table 13 and from the drying table 13 to the storage box 5.

[0037] <Transportation movement mechanism 7> As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the storage box 5.

[0038] As shown in FIG. 1, the transport moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the storage box 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

[0039] This transfer shaft 71 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11, and allows the second holding mechanism 6 to move above the storage box 5 (see FIG. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the storage box 5 are provided on the same side (nearby side) of the transfer shaft 71 in a plan view. In addition, the first cleaning mechanism 18 and the second cleaning mechanism 19, and the drying table 13, which will be described later, are also provided on the same side (nearby side) of the transfer shaft 71.

[0040] Furthermore, as shown in Figures 5, 6 and 8, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

[0041] As shown in Figures 5 to 8, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0042] The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and, like the transfer shaft 71, is provided within a range in which the first holding mechanism 3 can move above the substrate supply unit 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the storage box 5. A slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting movement mechanism 73 and a horizontal movement mechanism 74 is slidably provided on this guide rail 721. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

[0043] The rack and pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided to each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on a common transfer shaft 71, and can be changed to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on a slide member 723 and is a so-called roller pinion, and as shown in FIG. 7, has a pair of roller bodies 722b1 that rotate together with the rotating shaft of the motor, and multiple roller pins 722b2 that are provided between the pair of roller bodies 722b1 at equal intervals in the circumferential direction and are provided to be rollable relative to the roller bodies 722b1. The rack and pinion mechanism 722 of the present embodiment uses the above-mentioned roller pinion, so that two or more roller pins 722b2 come into contact with the cam rack 722a. This prevents backlash from occurring in the forward and reverse directions, improving positioning accuracy when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.

[0044] As shown in Figs. 5 and 8, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is similar to that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in Figs. 8.

[0045] The horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in Fig. 5, Fig. 6, and Fig. 8. The horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, as shown in Fig. 5 and Fig. 6, and has a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

[0046] 8, the horizontal movement mechanism 74 of the second holding mechanism 6 is similar in configuration to the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

[0047] <Cutting movement mechanism 8 (processing movement mechanism)> The cutting movement mechanism 8 linearly moves each of the two spindle parts 42A, 42B independently in the X direction, the Y direction, and the Z direction.

[0048] Specifically, as shown in Figures 2, 3 and 9, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindle portions 42A, 42B linearly in the X direction, a Y-direction movement unit 82 that moves the spindle portions 42A, 42B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindle portions 42A, 42B linearly in the Z direction.

[0049] The X-direction moving unit 81 is common to the two cutting tables 2A and 2B, and as shown in particular in FIG. 2 and FIG. 3, has a pair of X-direction guide rails 811 provided along the X direction sandwiching the two cutting tables 2A and 2B, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving unit 82 and the Z-direction moving unit 83. The pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X direction. The support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam portion (beam portion) that is bridged across the pair of legs, and the beam portion extends in the Y direction.

[0050] The support 812 is caused to move linearly back and forth along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another direct acting mechanism such as a linear motor.

[0051] As shown in FIG. 3, the Y-direction moving section 82 has a Y-direction guide rail 821 provided on the support 812 along the Y direction, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle sections 42A and 42B. This allows the two spindle sections 42A and 42B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

[0052] 2 to 4, the Z-direction moving section 83 has a Z-direction guide rail 831 provided along the Z direction on each Y-direction slider 822, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindle sections 42A, 42B. That is, the Z-direction moving section 83 is provided corresponding to each of the spindle sections 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth by another linear motion mechanism such as a ball screw mechanism.

[0053] 1 and 4, the positional relationship between the moving cutting mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the moving cutting mechanism 8 and crosses the moving cutting mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

[0054] <Processing waste storage section 17> Moreover, the cutting device 100 of this embodiment further includes a processing waste storage section 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W, as shown in FIG.

[0055] 2 to 4, the processing scrap storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 having an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects the processing scraps S guided by the guide chute 171. By providing the processing scrap storage section 17 below the cutting tables 2A, 2B, the collection rate of the processing scraps S can be improved.

[0056] The guide chute 171 guides the machining scraps S that have scattered or fallen from the cutting tables 2A, 2B to a collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it difficult for the machining scraps S to be missed, and the collection rate of the machining scraps S can be further improved. In addition, the guide chute 171 is provided to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining scraps S and cutting water.

[0057] In this embodiment, the processing waste container 17 is common to the two cutting tables 2A and 2B, but it may be provided for each of the cutting tables 2A and 2B.

[0058] The collection container 172 collects the processing scraps S that have passed through the guide chute 171 due to their own weight, and in this embodiment, as shown in FIG. 4 and the like, is provided corresponding to each of the two cutting tables 2A and 2B. The two collection containers 172 are disposed on the front side of the transfer shaft, and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration can improve the ease of maintenance, such as disposal of the processing scraps S. Note that the collection container 172 may be provided entirely under all the cutting tables, or may be divided into three or more, taking into consideration the size of the sealed substrate W, the size and amount of the processing scraps S, workability, and the like.

[0059] 4 and other figures, the machining chip storage section 17 has a separation section 173 that separates the cutting water from the machining chips. As a configuration of this separation section 173, for example, a filter such as a porous plate that allows the cutting water to pass through can be provided on the bottom surface of the collection container 172. This separation section 173 makes it possible to collect the machining chips S without accumulating cutting water in the collection container 172.

[0060] <First cleaning mechanism 18> 1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 that cleans the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. This first cleaning mechanism 18 cleans the upper surfaces of the products P by using an injection nozzle 18a (see FIG. 5) that injects cleaning liquid and / or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

[0061] 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, an elevation movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. The elevation movement mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.

[0062] <Second cleaning mechanism 19> 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the bottom surfaces (package surfaces) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the storage box 5 (more specifically, the drying table 13 described later), and cleans the bottom surfaces of the multiple products P held by the second holding mechanism 6 by spraying cleaning liquid and / or compressed air onto the bottom surfaces of the multiple products P. In other words, the second cleaning mechanism 19 cleans the bottom surfaces of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

[0063] <Drying function of the cutting device 100> The cutting device 100 of this embodiment has a function of further drying the multiple products P cleaned by the second cleaning mechanism 19. Specifically, the cutting device 100 includes a drying table 13 for drying the multiple products P, a drying mechanism 14 for drying the multiple products P placed on the drying table 13, and a drying movement mechanism 15 for moving the drying mechanism 14 along the drying table 13, as shown in Figures 1, 9 and 10.

[0064] The drying table 13 is a table on which a plurality of products P are transported by the second holding mechanism 6 and the transport moving mechanism 7 and placed. The drying table 13 adsorbs and holds the plurality of products P. The drying table 13 is arranged in a row along the X direction on a horizontal plane together with the two cutting tables 2A and 2B. The drying table 13 in this embodiment is rectangular in plan view, but may have other shapes.

[0065] The drying mechanism 14 injects compressed air, which is a gas, from above the drying table 13 to dry the multiple products P adsorbed and held on the drying table 13. The drying mechanism 14 has an injection nozzle 14a that injects compressed air at the multiple products P held on the drying table 13. The injection nozzle 14a in this embodiment has a slit-shaped opening that extends linearly and is provided toward the drying table 13 (see FIG. 9), but may have multiple openings that are provided intermittently along the X direction.

[0066] The drying mechanism 14 of the present embodiment is configured to inject compressed air in the moving direction of the drying moving mechanism 15 (see FIG. 9). That is, the direction in which the compressed air is injected by the injection nozzle 14a is oriented in the moving direction of the drying moving mechanism 15 (here, from the front side to the back side in the Y direction).

[0067] 9, the spray nozzle 14a of the drying mechanism 14 is arranged at an angle of, for example, less than 30 degrees with respect to the arrangement direction of the multiple products P held on the drying table 13 along the X direction. Here, the multiple products P are arranged in a matrix shape in the X direction and the Y direction on the drying table 13, and the spray nozzle 14a of the drying mechanism 14 sprays compressed air at an angle with respect to one side of each product P along the X direction. This makes it easier to blow away moisture accumulated between adjacent products P from the products P. This promotes drying of the multiple products P. Also, the slit-shaped opening of the spray nozzle 14a of the drying mechanism 14 may be provided at a slight angle toward the drying table 13, so that the compressed air is blown in the moving direction of the drying mechanism 14.

[0068] The moving mechanism for drying 15 moves the drying mechanism 14 in the Y direction above the drying table 13. The moving mechanism for drying 15 of this embodiment moves the drying mechanism 14 back and forth in the Y direction relative to the drying table 13. Specifically, as shown in Figs. 9 and 10, the moving mechanism for drying 15 includes a Y-direction guide rail 151 extending in the Y direction, a slide member 152 that moves along the Y-direction guide rail 151 and holds the drying mechanism 14, and a drive unit (not shown) that moves the slide member 152 along the Y-direction guide rail 151. The drive unit may be, for example, a ball screw mechanism, an air cylinder, or a linear motor.

[0069] <An example of drying operation> Next, the drying operation by the drying mechanism 14 and the drying moving mechanism 15 will be described.

[0070] Before placing multiple products P on the drying table 13, the moving mechanism for drying 15 moves the drying mechanism 14 to one side in the Y direction of the drying table 13 (for example, the front side) so as not to interfere with the placement of the multiple products P. Then, when the multiple products P are placed and held on the drying table 13, the drying mechanism 14 starts spraying compressed air, and the moving mechanism for drying 15 moves the drying mechanism 14 to the other side in the Y direction (for example, the rear side). This dries the multiple products P held on the drying table 13. Note that when the moving mechanism for drying 15 moves the drying mechanism 14 from the other side in the Y direction (the rear side) to one side in the Y direction (the front side), the drying mechanism 14 stops spraying gas. Note that the drying mechanism 14 may be configured to spray compressed air not only on the outward path but also on the return path.

[0071] <Storage box 5 and scraping member 16> 1, 9, and 10, the storage box 5 stores a plurality of products P in a loose state (so-called bulk storage). The storage box 5 is arranged in a row along the X direction on a horizontal plane together with the two cutting tables 2A and 2B. The storage box 5 further includes a scraping member 16 that scrapes off the plurality of products P from the second holding mechanism 6.

[0072] The storage box 5 has an upper opening 5X that is rectangular in plan view (see FIG. 9). The scraping member 16 is fixed to one side of the upper opening 5X of the storage box 5. By moving the second holding mechanism 6 in the X direction relative to the scraping member 16, the product P is scraped off and falls into the storage box 5.

[0073] Furthermore, the storage box 5 of this embodiment is provided between the drying table 13 and the plate storage section 20 that stores a holding plate (not shown) in the X direction, and the scraping member 16 is provided on one side of the upper opening 5X of the storage box 5 on the drying table 13 side. This ensures that the second holding mechanism 6 does not interfere with the plate storage section 20 when scraping off the product P.

[0074] The holding plates accommodated in the plate accommodating section 20 are intended to hold the sealed substrate W or the product P, and include, for example, holding plates for the cutting tables 2A, 2B for cutting the sealed substrate W, holding plates for the drying table 13 for drying the product P, and holding plates for the second holding mechanism 6 that holds the product P for transporting it.

[0075] The scraping member 16 extends upward from one side of the upper opening 5X on the drying table 13 side (see FIG. 9). The scraping member 16 may be any member capable of scraping off the products P that remain on the second holding mechanism 6 after the adsorption is released, and may be made of a resin such as PEEK, and may be in the form of a brush or a flat plate.

[0076] In this embodiment, the storage box 5 is disposed in front of the transfer shaft 71. In front A handle 51 (see FIG. 9) is provided on the outer surface of the side so that it can be removed from the front side of the cutting device 100. This configuration improves the ease of maintenance, such as removal and recovery of the products P. Note that the direction in which the storage box 5 is removed is not limited to the front side, and it may be removed from, for example, the side or the back side of the cutting device 100.

[0077] <An example of the operation of the cutting device 100> Next, an example of the operation of the cutting apparatus 100 will be described. Fig. 11 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 in the operation of the cutting apparatus 100. In this embodiment, all operations and controls of the cutting apparatus 100, such as transporting the sealed substrate W, cutting the sealed substrate W, drying the product P, and scraping off the product P, are performed by the control unit CTL (see Fig. 1).

[0078] The substrate supplying section 112 of the substrate supplying mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating section 111 towards the holding position RP where the substrate W is held by the first holding mechanism 3.

[0079] Next, the transfer movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transfer movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the adsorption and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B adsorb and hold the sealed substrate W.

[0080] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and moving mechanism 73 lifts the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retreated from the cutting table 2B to the drying table 13 side, there is no need to lift and lower the first holding mechanism 3 as described above.

[0081] In this state, the cutting movement mechanism 8 sequentially moves the two spindle parts 42A, 42B in the X direction and the Y direction while the cutting tables 2A, 2B rotate, thereby cutting the sealed substrate W into individual pieces in a lattice pattern.

[0082] After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport moving mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

[0083] Next, the transport moving mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 adsorbs and holds the multiple products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. As a result, the second cleaning mechanism 19 cleans the lower surfaces (package surfaces) of the multiple products P held by the second holding mechanism 6.

[0084] After the cleaning, the moving mechanism for transport 7 moves the second holding mechanism 6 to the drying table 13, and the second holding mechanism 6 releases the suction hold and places the multiple products P on the drying table 13. Then, the drying table 13 suction holds the sealed substrate W. At this time, the moving mechanism for transport 7 retreats the second holding mechanism 6 to a position where it does not interfere with the movement of the drying mechanism 14.

[0085] In this state, the moving mechanism for drying 15 moves the drying mechanism 14 back and forth in the Y direction, and the drying mechanism 14 sprays compressed air, thereby drying the multiple products P. The number of times the moving mechanism for drying 15 moves the drying mechanism 14 back and forth can be set appropriately, and may be one time or multiple times.

[0086] After drying, the moving mechanism for transport 7 moves the second holding mechanism 6 to the drying table 13, and the second holding mechanism 6 suctions and holds the multiple products P from the drying table 13. Thereafter, the moving mechanism for transport 7 moves the second holding mechanism 6 holding the multiple products P to the storage box 5.

[0087] Then, the second holding mechanism 6 releases the suction and holding of the multiple products P above the upper opening 5X of the storage box 5. Thereafter, the transfer mechanism 7 moves the second holding mechanism 6 toward the drying table 13 relative to the scraping member 16 so that the products P remaining in the second holding mechanism 6 without falling from the second holding mechanism 6 come into contact with the scraping member 16. In this embodiment, in order to reliably scrape off the products P, the second holding mechanism 6 is moved relative to the scraping member 16 so that the scraping member 16 comes into contact with the lower surface, which is the suction surface, of the second holding mechanism 6. As a result, the multiple products P fall into and are stored in the storage box 5.

[0088] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the collection box 5, and the cutting mechanism 4 is moved in the X direction and the Y direction along the transfer shaft 71 in a horizontal plane by the cutting movement mechanism 8, so that the sealed substrate W can be divided into individual pieces without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, it is possible to eliminate the need for a bellows member for protecting the ball screw mechanism and the like and a cover member for protecting the bellows member without moving the cutting tables 2A, 2B by a ball screw mechanism or the like. As a result, the device configuration of the cutting device 100 can be simplified.

[0089] In addition, since the cutting tables 2A, 2B are configured not to move in the X and Y directions, the movement space of the cutting tables 2A, 2B and the wasted space around them can be reduced, and the footprint of the cutting device 100 can be reduced.

[0090] Furthermore, the second holding mechanism 6 holding the multiple products P is transported to the storage box 5, and the multiple products P are dropped from the second holding mechanism 6 and stored in the storage box 5, so the storage space can be made smaller than in the conventional configuration in which products are stored in a tray. This also makes it possible to reduce the footprint of the cutting device 100.

[0091] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0092] For example, although the embodiment described above has a configuration including the drying table 13, the drying table 13 may not be included.

[0093] Alternatively, without using the scraping member 16, the multiple products P can be dropped by injecting gas from the second holding mechanism 6 after the suction and holding by the second holding mechanism 6 is released.

[0094] Furthermore, in addition to being configured to fix the scraping member 16 to the storage box 5, it may be fixed to another member, or the scraping member 16 may be configured to be movable so that the scraping member 16 moves relative to the second holding mechanism 6 to scrape off multiple products P.

[0095] In the above embodiment, a cutting device using a twin cut table system and a twin spindle configuration has been described, but the present invention is not limited to this and may also be a cutting device using a single cut table system and a single spindle configuration, or a cutting device using a single cut table system and a twin spindle configuration.

[0096] Furthermore, since the cam rack elements constituting the transfer shaft 71 can be configured by connecting a plurality of them, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the drying table 13. In this case, for example, a module that inspects the product P can be added between the module on the second cleaning mechanism 19 side and the module on the drying table 13 side. Note that, in addition to the configuration exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) anywhere, and the added module may be a module with various functions other than inspection.

[0097] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0098] 100...Cutting equipment (processing equipment) W···Sealed substrate (object to be processed) P...Product (processed product) 2A, 2B: Cutting table (processing table) 3...1st holding mechanism 4...Cutting mechanism (processing mechanism) 5. Storage box 6...Second holding mechanism 7. Transport mechanism 71 Transfer shaft 8...Moving mechanism for processing 81...X direction moving part 82 Y-direction moving part 811... Pair of X-direction guide rails 812...Support 13. Drying table 14...Drying mechanism 15...Drying movement mechanism 16....Scraping member

Claims

1. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a storage box into which the object to be processed that has been individualized by the processing mechanism falls and is stored; a second holding mechanism that holds the individual object to be processed in order to transport the individual object from the processing table to the storage box; a transfer mechanism for transfer extending along an arrangement direction of the processing table and the storage box and having a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a scraping member that scrapes off the individualized object to be processed from the second holding mechanism.

2. The scraping member is fixed to the storage box, The processing apparatus according to claim 1 , wherein the transport moving mechanism moves the second holding mechanism relative to the scraping member, thereby scraping off the individual pieces of the workpiece from the second holding mechanism.

3. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a storage box into which the object to be processed that has been individualized by the processing mechanism falls and is stored; a second holding mechanism that holds the individual object to be processed in order to transport the individual object from the processing table to the storage box; a transfer mechanism for transfer extending along an arrangement direction of the processing table and the storage box and having a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a drying table for drying the individualized object, The transportation moving mechanism moves the second holding mechanism from the processing table to the drying table and from the drying table to the storage box.

4. A drying mechanism that sprays gas from above the drying table to dry the individual pieces of the processed object; The processing apparatus according to claim 3 , further comprising a moving mechanism for drying that moves the drying mechanism along the drying table.

5. The processing apparatus as described in Claim 4, wherein the drying mechanism sprays gas in the direction of movement by the drying movement mechanism.

6. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a storage box into which the object to be processed that has been individualized by the processing mechanism falls and is stored; a second holding mechanism that holds the individual object to be processed in order to transport the individual object from the processing table to the storage box; a transfer mechanism for transfer extending along an arrangement direction of the processing table and the storage box and having a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction on a horizontal plane, The processing movement mechanism includes an X-direction movement unit that moves the processing mechanism linearly in the X-direction, which is the first direction, and a Y-direction movement unit that moves the processing mechanism linearly in the Y-direction, which is the second direction, The X-direction moving unit has a pair of X-direction guide rails arranged along the X direction on either side of the processing table, and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving unit.

7. 7. The processing device according to claim 1, wherein the transfer shaft is disposed above the processing movement mechanism so as to cross the processing movement mechanism.

8. The processing apparatus according to claim 1 , wherein the second holding mechanism suction-holds the individualized object.

9. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product by using the processing apparatus according to any one of claims 1 to 8;

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