Processing device and manufacturing method of processed products

Abstract

To stick a segmented object to an adhesive surface without requiring a moving mechanism for moving a processing table.SOLUTION: A cutting apparatus 100 includes cutting tables 2A and 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate, a cutting mechanism 4 for cutting and segmentalizing the sealed substrate W into individual pieces, a transfer table 5 onto which the segmentalized products are transferred, a second holding mechanism 6 for holding a plurality of products, a transport movement mechanism 7 which extends along an arrangement direction of the cutting tables and the transfer table and has a common transfer shaft 71 for moving the first holding mechanism and the second holding mechanism, a processing movement mechanism 8 for moving the cutting mechanism in an X direction along a transfer shaft and a Y direction orthogonal to the X direction on a horizontal plane, a mounting table 21 on which a sticking member 20 having an adhesive surface to which a plurality of products is stuck is mounted, and a sticking transport mechanism 22 for transporting a plurality of products P from the transfer table 5 to the sticking member 20 mounted on the mounting table.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device and a method for manufacturing a processed product. [Background technology]

[0002] As shown in Patent Document 1, conventionally, there is a manufacturing apparatus that includes a semiconductor package substrate cutting device for cutting a semiconductor package substrate to produce a semiconductor package having a sealing resin, and a semiconductor package placement device for placing the semiconductor package cut by the semiconductor package cutting device.

[0003] The semiconductor package substrate cutting device conveys a semiconductor package substrate in the X-axis direction and places it on a cutting table, and while moving the cutting table in the Y-axis direction, cuts the semiconductor package substrate with a rotary blade of a cutting mechanism to divide it into multiple semiconductor packages. The semiconductor package placement device affixes and stores semiconductor packages to a placement member, which is an attachment member having an adhesive layer (sticky layer). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6626027

[0005] However, in the above manufacturing apparatus, not only is the semiconductor package substrate transported in the X-axis direction, but the cutting table is also moved in the Y-axis direction to cut the semiconductor package substrate, which results in a large footprint for the apparatus.

[0006] Furthermore, the moving mechanism that moves the cutting table requires a protective member to protect the moving mechanism from cutting chips or processing water generated during cutting. This protective member may be a bellows member for protecting the moving mechanism and a cover member for protecting the bellows member. As a result, the device configuration becomes complicated. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, the present invention has been made to solve the above problems, and its main objective is to attach and store individual pieces of workpieces to an attachment member having an adhesive surface, while eliminating the need for a moving mechanism to move the processing table that holds the workpieces. [Means for solving the problem]

[0008] That is, the processing apparatus according to the present invention is characterized by comprising a processing table for holding an object to be processed, a first holding mechanism for holding the object to be processed in order to transport it to the processing table, a processing mechanism for cutting and dividing the object to be processed held on the processing table, a transfer table to which the object to be processed divided by the processing mechanism is transferred, a second holding mechanism for holding the object to be processed divided in order to transport it from the processing table to the transfer table, a transport mechanism for transporting the object to be processed, a processing mechanism for transporting the object to be processed, a transport mechanism for transporting the object to be processed, a first direction along the transfer axis in a horizontal plane, and a second direction perpendicular to the first direction, a loading table on which an attachment member having an adhesive surface to which the divided object to be processed is placed, and a transport mechanism for transporting the object to be processed from the loading table to the attachment member placed on the loading table. [Effects of the Invention]

[0009] According to the present invention configured in this manner, it is possible to attach and store the individual pieces of workpieces to an attachment member having an adhesive surface, while eliminating the need for a moving mechanism to move the processing table that holds the workpieces. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram schematically illustrating a configuration of a cutting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically showing a cutting table and its peripheral structure in the embodiment. [Figure 3] 3 is a view (plan view) seen from the Z direction, which schematically shows the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 4] 4 is a view (front view) seen from the Y direction, schematically showing the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 5] 10 is a diagram (front view) seen from the Y direction, schematically showing the configuration of the first holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 6] 10 is a diagram (side view) seen from the X direction, schematically showing the configuration of the first holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 7] 10 is a diagram (plan view) seen from the Z direction, schematically showing the positions of a transfer table and a loading table in this embodiment. FIG. [Figure 8] 10 is a diagram (front view) seen from the Y direction, schematically showing the configuration of the second holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 9] FIG. 2 is a cross-sectional view schematically showing the configuration of the rack and pinion mechanism of the embodiment. [Figure 10] 10 is a diagram (front view) seen from the Y direction, which diagrammatically shows the configuration of a transfer table, a placement table, and a pasting transport mechanism of the embodiment. FIG. [Figure 11] 2A, 2B, and 2C are a plan view, a cross-sectional view, and a partially enlarged cross-sectional view, respectively, each showing a schematic configuration of an attachment member according to the embodiment. [Figure 12] 10 is a diagram (front view) seen from the Y direction, which diagrammatically shows the configuration of a mounting table, an affixing member storage section, and an affixing member transport mechanism of the embodiment. FIG. [Figure 13] 5A and 5B are diagrams schematically showing the movement paths of the first holding mechanism and the second holding mechanism of the embodiment. [Figure 14]FIG. 10A is a diagram (front view) from the Y direction showing a schematic diagram of the configuration of the mounting table, the affixing member storage section, and the affixing member transport mechanism of the modified embodiment; FIG. 10B is a schematic diagram showing a state in which the spacing between the upper guide rails has widened; and FIG. 10C is a schematic diagram showing a state in which the spacing between the upper guide rails has narrowed. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0012] As described above, the processing apparatus of the present invention is characterized by comprising a processing table for holding a processing object, a first holding mechanism for holding the processing object in order to transport it to the processing table, a processing mechanism for cutting and dividing the processing object held on the processing table, a transfer table to which the processing object divided by the processing mechanism is transferred, a second holding mechanism for holding the divided processing object in order to transport it from the processing table to the transfer table, a transport movement mechanism that extends along the arrangement direction of the processing table and the transfer table and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction in a horizontal plane, a loading table on which an attachment member having an adhesive surface to which the divided processing object is attached is placed, and an attachment transport mechanism that transports the divided processing object from the transfer table to the attachment member placed on the loading table.

[0013] This processing apparatus is configured to move the first holding mechanism and the second holding mechanism using a common transfer axis extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism moves the processing mechanism in a first direction along the transfer axis in a horizontal plane and in a second direction perpendicular to the first direction, so that the workpiece can be singulated without moving the processing table in the first direction and the second direction. Therefore, the processing table does not need to be moved by a ball screw mechanism or the like, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the configuration of the processing apparatus can be simplified. Furthermore, since the processing table does not move in the first and second directions on a horizontal plane, the movement space of the processing table and the wasted space around it can be reduced, thereby reducing the footprint of the processing device. Furthermore, the singulated object can be transported by the attachment transport mechanism from the transfer table to an attachment member placed on the mounting table, and the singulated object can be attached to the adhesive surface of the attachment member. As a result, when a post-process such as a sputtering process or a mounting process is performed on the singulated object, it is only necessary to move the attachment member to which the singulated object is attached, making it easy to handle the object.

[0014] As a specific arrangement of the transfer shaft and the processing movement mechanism, it is desirable that the transfer shaft be arranged above the processing movement mechanism so as to cross the processing movement mechanism. With this configuration, the first holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, preventing the first holding mechanism from physically interfering with the moving mechanism for processing. Also, the second holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, preventing the second holding mechanism from physically interfering with the moving mechanism for processing.

[0015] In order to efficiently accommodate the individualized workpieces, it is desirable to provide a plurality of the placement tables.

[0016] In order to automatically replace the adhesive member placed on the loading table, it is desirable that the processing device of the present invention be provided with a storage section for storing the adhesive member, and an adhesive member transport mechanism for transporting the adhesive member between the loading table and the storage section.

[0017] As a specific embodiment for ensuring that the adhesive member can be inserted and removed from the storage section, it is desirable to further provide a guide rail for inserting and removing the adhesive member into and from the storage section.

[0018] It is desirable that two guide rails are provided, one above the other, for one mounting table. With this configuration, by placing an empty attachment member on one of the guide rails in advance while the attachment member is placed on the placement table, the time required to place the empty attachment member on the placement table can be reduced. Note that the attachment member with the individualized workpiece attached thereto is placed on the other guide rail.

[0019] In order to attach each of the individualized workpieces to the desired position on the attachment member, it is desirable that the processing device of the present invention further includes a first imaging unit that confirms the position of the individualized workpieces held by the second holding mechanism, and a second imaging unit that confirms the position at which the individualized workpieces will be attached on the adhesive surface of the attachment member.

[0020] In order to efficiently transport the workpieces that have been cut into individual pieces from the transfer table to the attachment members placed on the loading table, it is desirable to provide multiple attachment transport mechanisms, and for each of the attachment transport mechanisms to be driven independently of each other.

[0021] As a specific embodiment of the movement mechanism that moves the processing mechanism at least in the X direction, which is a first direction, and the Y direction, which is a second direction, the processing movement mechanism includes an X-direction movement unit that moves the processing mechanism linearly in the X direction, which is the first direction, and a Y-direction movement unit that moves the processing mechanism linearly in the Y direction, which is the second direction, and it is desirable that the X-direction movement unit has a pair of X-direction guide rails that are provided along the X direction with the processing table between them, and a support that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction movement unit. With this configuration, a pair of X-direction guide rails are provided in the X direction, sandwiching the machining table, allowing for a larger pitch between the pair of X-direction guide rails. As a result, the effect of misalignment in the Z direction between the X-direction guide rails on machining can be reduced. In other words, the deviation in the orthogonality between the rotary tool (e.g., blade) and the machining table can be reduced, improving machining accuracy. Furthermore, X-direction guide rails with lower specifications than conventional ones can be used.

[0022] Another aspect of the present invention is a method for manufacturing a processed product using the above processing device.

[0023] <One embodiment of the present invention> An embodiment of a processing apparatus according to the present invention will be described below with reference to the drawings. Note that, for ease of understanding, all of the drawings shown below are drawn in a schematic manner with appropriate omissions or exaggerations. Identical components are designated by the same reference numerals, and their description will be omitted where appropriate.

[0024] <Overall configuration of the processing equipment> The processing apparatus 100 of this embodiment is a cutting apparatus that cuts an encapsulated substrate W, which is an object to be processed, into individual products P, which are a plurality of processed products.

[0025] Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin so as to encapsulate at least the electronic elements. Examples of substrates that constitute the encapsulated substrate W include lead frames and printed wiring boards, as well as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrates that constitute the encapsulated substrate W may or may not be wired.

[0026] In addition, the encapsulated substrate W and product P of this embodiment have a structure in which one surface of the substrate is resin-molded. In such a structure, the resin-molded surface is the surface on which electronic elements connected to the substrate are resin-encapsulated, and is referred to as the "encapsulation surface" or "package surface." On the other hand, the non-resin-molded surface opposite the resin-molded surface is referred to as the "lead surface" because leads that function as external connection electrodes of the product are usually exposed. If these leads are protruding electrodes used in electronic components such as BGA (Ball Grid Array), it may also be referred to as the "ball surface." Furthermore, the non-resin-molded surface opposite the resin-molded surface may have no leads formed thereon, and therefore may also be referred to as the "substrate surface." In the description of this embodiment, the resin-molded surface will be referred to as the "encapsulation surface" or "package surface," and the non-resin-molded surface opposite the resin-molded surface will be referred to as the "lead surface."

[0027] Specifically, as shown in FIG. 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, a first holding mechanism 3 that holds the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A and 2B, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, a transfer table 5 to which multiple products P are transferred, a second holding mechanism 6 that holds the multiple products P in order to transport the multiple products P from the cutting tables 2A and 2B to the transfer table 5, a transport moving mechanism 7 having a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 that moves the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B. The first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) that transports the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 constitute a transport mechanism (unloader) that transports multiple products P.

[0028] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A, 2B are referred to as the X direction, which is a first direction, and the Y direction, which is a second direction, respectively, and the vertical direction perpendicular to the X direction and the Y direction is referred to as the Z direction. Specifically, the left-right direction in FIG. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. As will be described later, the X direction is the movement direction of the support 812, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam part spanning the pair of legs of the gate-shaped support 812 (see FIGS. 2 and 3).

[0029] <Cutting tables 2A and 2B> The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

[0030] These two cutting tables 2A, 2B are provided on a horizontal plane along the X direction. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (at the same height in the Z direction) (see FIG. 4), and so that the centers of their upper surfaces (specifically, the centers of rotation by the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

[0031] The two cutting tables 2A and 2B are used to suction and hold the sealed substrate W, and as shown in Fig. 1, two vacuum pumps 10A and 10B for suction and holding are arranged corresponding to the two cutting tables 2A and 2B. Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

[0032] Here, because the cutting tables 2A, 2B are fixed in the X, Y, and Z directions, the piping (not shown) connecting the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction force. As a result, even extremely small packages, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, because a decrease in suction force due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

[0033] <First holding mechanism 3> 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction portions 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction portions 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7, which will be described later, or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

[0034] 1, the substrate supply mechanism 11 has a substrate accommodation unit 111 in which a plurality of sealed substrates W are accommodated from outside, and a substrate supply unit 112 that moves the sealed substrate W accommodated in the substrate accommodation unit 111 to a holding position RP where the sealed substrate W is held by suction by the first holding mechanism 3. This holding position RP is set so as to be aligned with the two cutting tables 2A, 2B in the X direction. The substrate supply mechanism 11 may also have a heating unit 113 that heats the sealed substrate W to be suctioned by the first holding mechanism 3 to make it flexible and facilitate suction.

[0035] <Cutting mechanism 4> As shown in FIGS. 1, 2, and 3, the cutting mechanism 4, which is a processing mechanism, has two rotary tools 40 each consisting of blades 41A and 41B and two spindles 42A and 42B. The two spindles 42A and 42B are arranged so that their rotation axes are aligned along the Y direction, and the blades 41A and 41B attached thereto are disposed facing each other (see FIG. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B rotate in a plane including the X and Z directions to cut the sealed substrate W held on each cutting table 2A and 2B. As shown in FIG. 4, the cutting apparatus 100 of this embodiment is provided with a liquid supply mechanism 12 having an injection nozzle 121 that injects cutting water (machining fluid) to suppress frictional heat generated by the blades 41A and 41B. The injection nozzle 121 is supported, for example, by a Z-direction moving unit 83, which will be described later.

[0036] <Transfer Table 5> As shown in FIG. 1, the transfer table 5 in this embodiment is a table onto which multiple products P inspected by an inspection unit 13 (described later) are transferred. This transfer table 5 is a so-called index table on which multiple products P are temporarily placed before being attached to an attachment member 20 (described later). As shown in FIGS. 1 and 7, the transfer table 5 is movable along the Y direction, moving between a transfer position X1 where the multiple products P are placed by the second holding mechanism 6 and a take-out position X2 where the multiple products P are transported by the attachment transport mechanism 22. The transfer position X1 is set closer to the front than the transfer shaft 71 and is a position where the two cutting tables 2A and 2B are aligned in the X direction on a horizontal plane, while the take-out position X2 is set farther back than the transfer shaft 71.

[0037] <Inspection Department 13> As shown in FIG. 1, the inspection unit 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects a plurality of products P held by the second holding mechanism 6. The inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the sealing surface (packaging surface) of the product P, and a second inspection unit 132 that inspects the lead surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the packaging surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. The first inspection unit 131 and the second inspection unit 132 may be a common unit.

[0038] Also, in order to enable the inspection unit 13 to inspect both sides of the multiple products P, an inversion mechanism 14 is provided that inverts the multiple products P (see FIG. 1). This inversion mechanism 14 has a holding table 141 that holds the multiple products P, and an inversion unit 142 such as a motor that inverts the holding table 141 so that the front and back are reversed.

[0039] When the second holding mechanism 6 holds the multiple products P from the processing tables 2A, 2B, the package surfaces of the products P face downward. In this state, while the multiple products P are being transported from the processing tables 2A, 2B to the inversion mechanism 14, the package surfaces of the products P are inspected by the first inspection unit 131. Thereafter, the multiple products P held by the second holding mechanism 6 are inverted by the inversion mechanism 14, which then moves to the position of the transfer table 5. During this movement, the lead surfaces of the products P, which face downward, are inspected by the second inspection unit 132. Thereafter, the products P are delivered to the transfer table 5.

[0040] <Second holding mechanism 6> 1, the second holding mechanism 6 holds the plurality of products P in order to transport the plurality of products P from the cutting tables 2A, 2B to the reversing mechanism 14. As shown in FIG. 9, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction portions 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction portions 611 of the suction head 61. The suction head 61 is moved to a desired position by a transfer mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A, 2B to the holding table 141.

[0041] <Transportation moving mechanism 7> As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the holding table 141.

[0042] As shown in FIG. 1, the transport moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

[0043] The transfer shaft 71 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5 (see FIG. 1). Furthermore, the transfer shaft 71 extends within a range that allows the affixing member transport mechanism 26, which will be described later, to move between the affixing member transport position X3 and the guide rail 27. The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (near side) of the transfer shaft 71 in a plan view. The inspection unit 13, the reversing mechanism 14, the loading table 21, the affixing member storage unit 25, the affixing member transport mechanism 26, and the first cleaning mechanism 18 and second cleaning mechanism 19, which will be described later, are also provided on the same side (near side) of the transfer shaft 71.

[0044] Furthermore, as shown in Figures 5, 6 and 9, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

[0045] As shown in Figures 5, 6, 8 and 9, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0046] The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and, like the transfer shaft 71, is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5. A slide member 723 is slidably provided on this guide rail 721, and on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting / lowering mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting / lowering mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

[0047] The rack-and-pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on the common transfer shaft 71, and can be adjusted to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on the slide member 723 and is a so-called roller pinion. As shown in FIG. 8, the pinion gear 722b has a pair of roller bodies 722b1 that rotate with the rotation shaft of the motor, and multiple roller pins 722b2 that are provided circumferentially at equal intervals between the pair of roller bodies 722b1 and are rotatable relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, so that two or more roller pins 722b2 come into contact with the cam rack 722a, no backlash occurs in the forward or reverse direction, and the positioning accuracy is improved when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.

[0048] As shown in FIGS. 5 and 9, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in FIGS. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and includes a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is similar to that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in FIG.

[0049] As shown in Figures 5, 6, and 9, horizontal movement mechanisms 74 are provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in Figures 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the elevation movement mechanism 73) and the first holding mechanism 3, and includes a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

[0050] 9, the horizontal movement mechanism 74 of the second holding mechanism 6 is configured similarly to the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may instead use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

[0051] <Cutting movement mechanism 8 (processing movement mechanism)> The cutting movement mechanism 8 linearly moves each of the two spindle parts 42A, 42B in the X, Y, and Z directions.

[0052] Specifically, as shown in Figures 2, 3 and 4, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindle units 42A and 42B linearly in the X direction, a Y-direction movement unit 82 that moves the spindle units 42A and 42B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindle units 42A and 42B linearly in the Z direction.

[0053] The X-direction moving unit 81 is common to the two cutting tables 2A, 2B, and as shown in particular in FIGS. 2 and 3 , has a pair of X-direction guide rails 811 arranged along the X direction with the two cutting tables 2A, 2B sandwiched between them, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 42A, 42B via the Y-direction moving unit 82 and the Z-direction moving unit 83. The pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A, 2B arranged along the X direction. The support 812 is, for example, gate-shaped and has a shape that extends in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam portion spanning the pair of legs, with the beam portion extending in the Y direction.

[0054] The support 812 is moved back and forth linearly along the X direction on a pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another direct acting mechanism such as a linear motor.

[0055] 3, the Y-direction moving unit 82 has a Y-direction guide rail 821 provided on the support body 812 along the Y direction, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle units 42A, 42B. This allows the two spindle units 42A, 42B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

[0056] 2 to 4, the Z-direction moving unit 83 has a Z-direction guide rail 831 provided on each Y-direction slider 822 along the Z direction, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindle units 42A, 42B. That is, a Z-direction moving unit 83 is provided corresponding to each of the spindle units 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth using another linear motion mechanism such as a ball screw mechanism.

[0057] 1 and 4, the positional relationship between the moving cutting mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the moving cutting mechanism 8 and crosses the moving cutting mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

[0058] <Processing waste storage section 17> 1, the cutting device 100 of this embodiment further includes a processing waste storage unit 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W.

[0059] 2 to 4, the processing debris storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 having an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects processing debris S guided by the guide chute 171. By providing the processing debris storage section 17 below the cutting tables 2A, 2B, the collection rate of processing debris S can be improved.

[0060] The guide chute 171 guides the machining chips S that have scattered or fallen from the cutting tables 2A, 2B to the collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it less likely that the machining chips S will be missed, and the collection rate of the machining chips S can be further improved. In addition, the guide chute 171 is provided to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining chips S and cutting water.

[0061] In this embodiment, the processing waste storage section 17 is common to the two cutting tables 2A and 2B, but it may be provided for each of the cutting tables 2A and 2B.

[0062] The collection container 172 collects the processing debris S that has passed through the guide chute 171 due to its own weight, and in this embodiment, as shown in FIG. 4 etc., one is provided corresponding to each of the two cutting tables 2A, 2B. The two collection containers 172 are arranged on the front side of the transfer shaft and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration improves the ease of maintenance, such as disposal of the processing debris S. Note that one collection container 172 may be provided under all of the cutting tables, or three or more collection containers may be provided, taking into consideration the size of the sealed substrate W, the size and amount of the processing debris S, workability, etc.

[0063] 4 and other figures, the machining chip storage section 17 has a separation section 173 that separates the cutting water from the machining chips S. One possible configuration for this separation section 173 is to provide a filter such as a porous plate that allows the cutting water to pass through on the bottom surface of the collection container 172. This separation section 173 makes it possible to collect the machining chips S without the cutting water accumulating in the collection container 172.

[0064] <First cleaning mechanism 18> 1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 that cleans the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. This first cleaning mechanism 18 cleans the upper surfaces of the products P using injection nozzles 18a (see FIG. 5) that inject cleaning liquid and / or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

[0065] 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, an elevation movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. This elevation movement mechanism 181 may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, or one that uses an air cylinder.

[0066] <Second cleaning mechanism> 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the undersides (packaging surfaces) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and cleans the undersides of the multiple products P held by the second holding mechanism 6 by spraying cleaning liquid and / or compressed air onto the undersides of the multiple products P. In other words, the second cleaning mechanism 19 cleans the undersides of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

[0067] <Ring accommodation configuration> The cutting device 100 of this embodiment is configured so that a plurality of products P can be stored by being attached to an attachment member 20 having an adhesive surface 20x (also called "ring storage").

[0068] Specifically, as shown in Figures 1 and 10, the cutting device 100 includes a mounting table 21 on which an attachment member 20 having an adhesive surface 20x to which multiple products P are attached is placed, and an attachment transport mechanism 22 that transports the multiple products P from the transfer table 5 to the attachment member 20 placed on the mounting table 21.

[0069] In this embodiment, two mounting tables 21 are provided along the X direction (see FIG. 1), and an attachment member 20 is placed on each mounting table 21. Specifically, the two mounting tables 21 are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction).

[0070] 1 and 7, the two loading tables 21 are provided so as to be movable along the Y direction, and move between an affixing member transport position X3, where the affixing member 20 is transported by the affixing member transport mechanism 26, and an affixing position X4, where multiple products P are transported by the affixing transport mechanism 22. The two loading tables 21 move independently of each other between the affixing member transport position X3 and the affixing position X4. The affixing member transport position X3 is set closer to the front than the transfer shaft 71, and the affixing position X4 is set farther back than the transfer shaft 71. The loading table 21 at the affixing position X4 and the transfer table 5 at the take-out position X2 are arranged along the X direction (see FIG. 1).

[0071] 11, the attachment member 20 includes a frame-shaped member 20a having, for example, a circular or rectangular shape, and a resin sheet 20b having an adhesive surface 20x arranged inside the frame-shaped member 20a. The frame-shaped member 20a is made of a metal such as stainless steel. The resin sheet 20b includes, for example, a resin sheet-shaped base material 20b1 and an adhesive layer (adhesive layer) 20b2 made of an adhesive applied to the upper surface of the sheet-shaped base material 20b1. The upper surface of the adhesive layer (adhesive layer) 20b2 becomes the adhesive surface 20x.

[0072] The conveying mechanism for application 22 conveys the plurality of products P from the transfer table 5 that has moved to the take-out position X2 to the application member 20 that has been placed on the placement table 21 that has moved to the application position X4.

[0073] 10, the application transport mechanism 22 includes a product suction mechanism 221 that sucks up the multiple products P held on the transfer table 5, for example, row by row, and an absorption movement mechanism 222 that moves the product suction mechanism 221 along the X direction. In this embodiment, two application transport mechanisms 22 are provided (see FIG. 1), and each application transport mechanism 22 is configured to be driven independently of the other.

[0074] 10, the product suction mechanism 221 has a suction head 221A provided with a plurality of suction portions 221a for individually suctioning and holding a plurality of products P, and a vacuum pump or vacuum ejector (not shown) connected to the suction portions 221a of the suction head 221A. This product suction mechanism 221 is configured so that each suction portion 221a is capable of suctioning one product P. The multiple suction portions 221a are configured to be able to move up and down independently of one another, and can individually suction products P by lowering each suction portion 221a.

[0075] 10, the suction movement mechanism 222 includes an X-direction movement unit 222a that moves the product suction mechanism 221 in the X direction, and a Z-direction movement unit 222b that moves the product suction mechanism 221 in the Z direction. The suction movement mechanism 222 may also include a Y-direction movement unit that moves the product suction mechanism 221 in the Y direction.

[0076] The X-direction moving unit 222a has an X-direction guide rail 222a1 provided along the X direction at the rear side of the transfer shaft 71, and a support 222a2 that moves along the X-direction guide rail 222a1 and supports the product suction mechanism 221 via the Z-direction moving unit 222b. The support 222a2 moves linearly back and forth along the X direction on the X-direction guide rail 222a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 222a2 may be configured to move back and forth by another direct-acting mechanism such as a linear motor.

[0077] 10, the Z-direction moving section 222b has a Z-direction guide rail 222b1 provided on the support body 222a2 along the Z direction, and a Z-direction slider 222b2 that moves along the Z-direction guide rail 222b1 and supports the product suction mechanism 221. The Z-direction slider 222b2 moves linearly back and forth along the Z direction on the Z-direction guide rail 222b1 by, for example, a ball screw mechanism (not shown) extending in the Z direction. Alternatively, the Z-direction slider 222b2 may be configured to move back and forth by another direct-acting mechanism such as a linear motor.

[0078] Furthermore, the position of the product P in the application transport mechanism 22, which is sucked and held by the application transport mechanism 22, is confirmed by the first imaging unit 23 (see FIG. 1). This first imaging unit 23 is an imaging camera that captures an image of the product P sucked and held by the product suction mechanism 221 of the application transport mechanism 22 from below, and captures an image of the bottom surface (packaging surface) of the product P. The first imaging unit 23 is also provided so as to be movable in the front-to-rear direction (Y direction). This makes it possible to confirm the position of the product P sucked and held by each of the two application transport mechanisms 22.

[0079] 1, each application transport mechanism 22 is provided with a second imaging unit 24 that confirms the position on the application member 20 where the product P is to be applied. The second imaging unit 24 is an imaging camera that images the application member 20 on the mounting table 21 at the application position X4 from above, and captures an image of the upper surface (adhesive surface 20x) of the application member 20. The product P is then aligned with the application member 20 based on the imaging data obtained by the first imaging unit 23 and the imaging data obtained by the second imaging unit 24, and the application transport mechanism 22 applies the product P to the adhesive surface 20x of the application member 20. The alignment of the product P can be performed by the suction movement mechanism 222 of the application transport mechanism 22 or a rotation mechanism (not shown) provided in the application transport mechanism 22, or a movement mechanism (not shown) of the mounting table 21 or a rotation mechanism (not shown) provided in the mounting table 21.

[0080] As shown in FIG. 12, the cutting device 100 of this embodiment also includes an adhesive member storage section 25 that stores the adhesive member 20, and an adhesive member transport mechanism 26 that transports the adhesive member 20 between the mounting table 21 and the adhesive member storage section 25.

[0081] The affixing member storage section 25 stores empty affixing members 20 to which no product P has been attached, as well as affixing members 20 to which a product P has been attached. This affixing member storage section 25 is arranged in line in the X direction with the loading table 21 at the affixing member transport position X3 (see FIG. 1).

[0082] 1 and 12, a pair of guide rails 27 are provided at the opening of the affixing member storage section 25 to allow the affixing member 20 to be put in and taken out of the affixing member storage section 25. The pair of guide rails 27, on which the affixing member 20 is placed, are provided in front of the opening of the affixing member storage section 25 along the X direction.

[0083] The affixing member transport mechanism 26 transports the affixing member 20 between the mounting table 21 at the affixing member transport position X3 and the affixing member storage section 25. Specifically, as shown in Fig. 12, the affixing member transport mechanism 26 includes a third holding mechanism 261 that adsorbs and holds the frame-shaped member 20a of the affixing member 20, and a movement mechanism 262 that moves the third holding mechanism 261 at least in the X direction and the Z direction.

[0084] The third holding mechanism 261 has a suction head 261A provided with a plurality of suction portions 261a for suction-holding the attachment member 20, and a vacuum pump or a vacuum ejector (not shown) connected to the suction portions 261a of the suction head 261A. The movement mechanism 262 is configured using the main movement mechanism 72 of the above-mentioned transport movement mechanism 7, and further has an elevation movement mechanism 262a similar to the elevation movement mechanism 73 of the transport movement mechanism 7. The movement mechanism 262 may have a Y-direction movement mechanism that moves the third holding mechanism 261 in the Y direction.

[0085] <Example of cutting device operation> Next, an example of the operation of the cutting apparatus 100 will be described with reference to Fig. 10, Fig. 12, and Fig. 13. Fig. 13 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting apparatus 100. In this embodiment, all operations and controls of the operation of the cutting apparatus 100, such as transporting the sealed substrate W, cutting the sealed substrate W, inspecting the product P, and storing the product P in a ring, are performed by the control unit CTL (see Fig. 1).

[0086] The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP where the sealed substrate W is held by the first holding mechanism 3 (see FIG. 1).

[0087] 13, the transfer movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 sucks and holds the sealed substrate W. Thereafter, the transfer movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the sucking and holds, and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B suck and hold the sealed substrate W.

[0088] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting movement mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting movement mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retracted from the cutting table 2B to the transfer table 5 side, there is no need to lift and lower the first holding mechanism 3 as described above.

[0089] In this state, the cutting movement mechanism 8 sequentially moves the two spindle parts 42A, 42B in the X direction and the Y direction, and the cutting tables 2A, 2B rotate, thereby cutting the sealed substrate W into individual pieces in a lattice pattern.

[0090] After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport moving mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

[0091] Next, the transport movement mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 suction-holds the multiple products P. Thereafter, the transport movement mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. As a result, the second cleaning mechanism 19 cleans the undersides (packaging surfaces) of the multiple products P held by the second holding mechanism 6.

[0092] After cleaning, the multiple products P held by the second holding mechanism 6 have their undersides (package surfaces) inspected by the inspection unit 131, and are then transferred to the inversion mechanism 14, which suction-holds the package surfaces and then inverts them. After inversion, the inversion mechanism 14 moves, and the lead surfaces of the products P are inspected by the inspection unit 132. After double-sided inspection in this manner, the products P are transferred from the inversion mechanism 14 to the transfer table 5. The transfer table 5 on which the multiple products P are placed moves to the take-out position X2 (see FIGS. 1, 7, and 10).

[0093] Meanwhile, an empty affixing member 20 is transported from the affixing member storage unit 25 to the mounting table 21 at the affixing member transport position X3 by the affixing member transport mechanism 26. Then, the mounting table 21 to which the empty affixing member 20 has been transported moves to the affixing position X4 (see FIGS. 7 and 10).

[0094] In this state, as shown in FIG. 10 , the application transport mechanism 22 sucks and holds the product P from the transfer table 5 at the take-out position X2. Then, it moves above the first imaging unit 23. As a result, the first imaging unit 23 confirms the position of the product P in the application transport mechanism 22. The application transport mechanism 22 also moves, and the second imaging unit 24 confirms the position where the product P is to be attached on the application member 20 on the mounting table 21 at the attachment position X4. The application transport mechanism 22 then attaches the product P it is holding to the application member 20. This operation is repeated multiple times until the maximum number of products P that can be attached to the application member 20 have been attached, or until all of the multiple products P on the transfer table 5 have been attached.

[0095] 7 and 12, the mounting table 21 moves to the affixing member transport position X3. Then, the affixing member transport mechanism 26 transports the affixed affixing member 20 placed on the mounting table 21 to the affixing member storage section 25. Specifically, the affixing member transport mechanism 26 places the affixed affixing member 20 on a pair of guide rails 27 provided in the affixing member storage section 25, and stores the affixed affixing member 20 in the affixing member storage section 25 by pushing the affixed affixing member 20 placed on the pair of guide rails 27.

[0096] Next, when an empty adhesive member 20 is to be removed from the adhesive member storage section 25, the adhesive member transport mechanism 26 pulls out the adhesive member 20 from the adhesive member storage section 25, places it on a pair of guide rails 27, adsorbs and holds the empty adhesive member 20 placed on the pair of guide rails 27, and transports it to the loading table 21 located at the adhesive member transport position X3.

[0097] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5, and the cutting mechanism 4 is moved by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 on a horizontal plane and in the Y direction perpendicular to the X direction. This allows the sealed substrate W to be singulated without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, the cutting tables 2A, 2B do not need to be moved by a ball screw mechanism or the like, and bellows members for protecting the ball screw mechanism and the like and cover members for protecting the bellows members are not required. As a result, the configuration of the cutting device 100 can be simplified.

[0098] Furthermore, since the cutting tables 2A, 2B are configured not to move in the X and Y directions on a horizontal plane, the movement space of the cutting tables 2A, 2B and the wasted space around them can be reduced, and the footprint of the cutting device 100 can be reduced.

[0099] Furthermore, the attachment transport mechanism 22 can transport the multiple products P from the transfer table 5 to the attachment member 20 placed on the mounting table 21, and the multiple products P can be attached to the adhesive surface 20x of the attachment member 20. As a result, when performing a post-process such as a sputtering process or a mounting process on the multiple products P, it is sufficient to move the attachment member 20 to which the multiple products P are attached, making it easy to handle the multiple products P.

[0100] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0101] For example, in the above embodiment, a configuration in which a plurality of (specifically, two) mounting tables 21 are provided has been described, but as shown in Fig. 14(a), there may be only one mounting table 21. In this case, two guide rails 27A, 27B may be provided above and below the opening of the attachment member storage section 25. In this configuration, the upper guide rail 27A is configured so that the distance between them can be expanded or contracted by an expansion / contraction mechanism (not shown).

[0102] The operation of the two-stage guide rails 27A and 27B is as follows.

[0103] First, the spacing between the upper guide rails 27A is widened by the expansion / contraction mechanism (see FIG. 14(b)). Then, the affixing member transport mechanism 26 descends between the upper guide rails 27A, pulls out the empty affixing member 20 from the affixing member storage section 25 onto the lower guide rail 27B, and temporarily places it thereon. Thereafter, the affixing member transport mechanism 26 moves to the placement table 21 located at the affixing member transport position X3, and receives the affixed affixing member 20.

[0104] Next, the gap between the upper guide rails 27A is reduced by the expansion / contraction mechanism (see FIG. 14(c)). Then, the affixing member transport mechanism 26 places the affixing member 20 that has been affixed on the upper guide rails 27A and pushes the affixing member 20 into the affixing member storage section 25.

[0105] Thereafter, the gap between the upper guide rails 27A is widened by the expansion / contraction mechanism, and the affixing member transport mechanism 26 descends between the upper guide rails 27A, picks up the empty affixing member 20 placed on the lower guide rail 27B, and transports it to the placement table 21.

[0106] Furthermore, although the embodiment described above has two application transport mechanisms 22, it may also be possible to have one application transport mechanism 22.

[0107] Furthermore, although the first imaging section 23 is common to the two application transport mechanisms 22, a first imaging section 23 may be provided for each of the two application transport mechanisms 22.

[0108] In the above embodiment, a cutting device of a twin cut table type and a twin spindle configuration has been described, but this is not limited to this, and the cutting device may also be a cutting device of a single cut table type and a single spindle configuration, or a cutting device of a single cut table type and a twin spindle configuration.

[0109] Furthermore, since the cam rack elements that make up the transfer shaft 71 can be configured by connecting multiple elements, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module that performs a type of inspection different from the inspection performed by the inspection unit 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Note that, in addition to the configuration exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) at any point, and the added module may be a module with various functions other than inspection.

[0110] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0111] 100...Cutting equipment (processing equipment) W···Sealed substrate (object to be processed) P...Product (processed product) 2A, 2B... Cutting table (processing table) 3...1st holding mechanism 4...Cutting mechanism (processing mechanism) 5. Transfer table 6...Second holding mechanism 7. Transfer mechanism 71 Transfer shaft 8...Moving mechanism for processing 81...X direction moving part 82 Y-direction moving part 811: A pair of X-direction guide rails 812...Support 20. Adhesive member 20x...adhesive surface 21. Mounting table 22. Application transport mechanism 23 First imaging unit 24 Second imaging unit 25....Attachment material storage section 26. Attachment material transport mechanism 27 Guide rail 27A, 27B Guide rail

Claims

1. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a plurality of mounting tables on which affixing members having adhesive surfaces to which the individual pieces of the processing objects are affixed are placed; a conveying mechanism for application that conveys the individualized object from the transfer table to the application member placed on the placement table.

2. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a mounting table on which an attachment member having an adhesive surface to which the individualized object to be processed is attached is placed; a conveying mechanism for application that conveys the individualized object from the transfer table to the application member placed on the placement table; an attachment member storage section for storing the attachment member; a conveying mechanism for conveying the affixing member between the placement table and the affixing member storage unit; a guide rail for inserting and removing the attachment member into and from the storage section, A processing apparatus, wherein two of the guide rails are provided above and below one of the mounting tables.

3. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a mounting table on which an attachment member having an adhesive surface to which the individualized object to be processed is attached is placed; a conveying mechanism for application that conveys the individualized object from the transfer table to the application member placed on the placement table; a first imaging unit for confirming a position of the individualized object held by the attachment transport mechanism; a second imaging unit that confirms the position where the individualized object to be processed is to be attached on the adhesive surface of the attachment member.

4. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a mounting table on which an attachment member having an adhesive surface to which the individualized object to be processed is attached is placed; a plurality of conveying mechanisms for attachment that convey the individual pieces of the processing object from the transfer table to the attachment member placed on the placement table, The processing apparatus, wherein each of the application transport mechanisms is driven independently of each other.

5. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a mounting table on which an attachment member having an adhesive surface to which the individualized object to be processed is attached is placed; a conveying mechanism for application that conveys the individualized object from the transfer table to the application member placed on the placement table, The processing movement mechanism includes an X-direction movement unit that linearly moves the processing mechanism in the X-direction, which is the first direction; a Y-direction moving unit that moves the processing mechanism linearly in the Y direction, which is the second direction; The X-direction moving unit has a pair of X-direction guide rails arranged along the X direction on either side of the processing table, and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving unit.

6. 6. The processing device according to claim 1, wherein the transfer shaft is disposed above the processing movement mechanism so as to cross the processing movement mechanism.

7. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product by using the processing apparatus according to any one of claims 1 to 6.

Images