Processing device and manufacturing method of processed products

Abstract

To provide a processing apparatus for storing a workpiece to be processed while eliminating the need for a moving mechanism for moving a processing table.SOLUTION: A processing apparatus 100 includes processing tables 2A and 2B, a first holding mechanism 3 that holds a workpiece W, a processing mechanism 4 that cuts and segmentalizes the workpiece, a transfer table 5 to which the workpiece is transferred, a second holding mechanism 6, a transfer movement mechanism 7, a processing movement mechanism 8 that moves the processing mechanism in each of a first direction along a transfer axis 71 and a second direction orthogonal to the first direction on a horizontal plane, a container placement portion 21 in which a cylindrical container for storing the workpiece from one end opening portion is placed, and a transporting / storing mechanism 22 for transporting and storing the cylindrical container.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device and a method for manufacturing a processed product. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, a cutting system has been considered in which a strip picker moves in the X-axis direction to transfer the semiconductor strip from an on-load device to a chuck table of a cutting device, the chuck table picks up the semiconductor strip and moves to the rear of the system in the Y-axis direction, and then the semiconductor strip is cut into semiconductor packages by a spindle. Also, the chuck table is configured to be moved in the Y-axis direction using a ball screw (ball screw mechanism). As a container for storing the cut semiconductor packages, a container that stores them in a rectangular cylindrical transparent case called a stick, as shown in Patent Document 2, has been considered.

[0003] However, in the above-mentioned cutting system, because cutting is performed by moving the chuck table using a ball screw, it is necessary to provide a bellows member to protect the ball screw from processing water and processing debris during actual cutting, and to further provide multiple plate members on the bellows member to protect the bellows member, as shown in Patent Document 3. As a result, the device configuration becomes complicated.

[0004] Furthermore, in the above cutting system, the semiconductor strip is not only transferred in the X-axis direction, but is also transferred to the rear of the system in the Y-axis direction in order to be cut, resulting in a large footprint of the device. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2007-536727 [Patent Document 2] Japanese Utility Model Application Publication No. 63-131902 [Patent Document 3] JP 2004-186361 A Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, the present invention has been made to solve the above-mentioned problems, and its main objective is to accommodate individualized workpieces in a cylindrical container while eliminating the need for a moving mechanism for moving the processing table that holds the workpieces. [Means for solving the problem]

[0007] That is, the processing apparatus of the present invention is characterized in that it comprises a processing table for holding an object to be processed, a first holding mechanism for holding the object to be processed in order to transport it to the processing table, a processing mechanism for cutting and individualizing the object to be processed held on the processing table, a transfer table to which the object to be processed that has been individualized by the processing mechanism is transferred, a second holding mechanism for holding the object to be processed that has been individualized in order to transport the object to be processed from the processing table to the transfer table, a transport moving mechanism that extends along the arrangement direction of the processing table and the transfer table and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction in a horizontal plane, a container installation section in which a cylindrical container that contains the individualized object to be processed from an opening at one end is installed, and a transport and storage mechanism that transports and stores the individualized object to the cylindrical container installed in the container installation section from the transfer table. Effect of the Invention

[0008] According to the present invention configured in this manner, the individual pieces of the workpieces can be accommodated in the cylindrical container while eliminating the need for a moving mechanism for moving the processing table that holds the workpieces. [Brief description of the drawings]

[0009] [Figure 1] 1 is a diagram showing a schematic configuration of a cutting device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view showing a schematic diagram of a cutting table and its surrounding structure in the embodiment; [Diagram 3] 4 is a diagram (plan view) seen from the Z direction, which diagrammatically illustrates the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 4] 4 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Diagram 5] 13 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of a first holding mechanism and a transport moving mechanism of the embodiment. FIG. [Figure 6] 13 is a diagram (side view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment, as viewed from the X direction. FIG. [Figure 7] FIG. 2 is a cross-sectional view showing a schematic configuration of the rack and pinion mechanism of the embodiment. [Figure 8] 13 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of a second holding mechanism and a transport moving mechanism of the embodiment. FIG. [Figure 9] 13 is a diagram (plan view) seen from the Z direction, which diagrammatically illustrates the configuration of a transfer table, a container setting unit, and a transport and storage mechanism of the embodiment. FIG. [Figure 10] FIG. 2A is a perspective view and FIG. 2B is a cross-sectional view showing a schematic configuration of a cylindrical container according to the embodiment. [Figure 11] 11 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of a first transport mechanism according to the embodiment. FIG. [Figure 12] 5A and 5B are schematic diagrams showing a non-defective product route and a defective product route, respectively, of the sorting mechanism of the embodiment. [Figure 13] 5A and 5B are diagrams illustrating schematic views of movement paths of a first holding mechanism and a second holding mechanism in the embodiment. [Figure 14] FIG. 13 is a schematic diagram showing a separation mechanism of a modified embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0011] As described above, the processing apparatus of the present invention is characterized in that it comprises a processing table for holding an object to be processed, a first holding mechanism for holding the object to be processed in order to transport it to the processing table, a processing mechanism for cutting and individualizing the object to be processed held on the processing table, a transfer table to which the object to be processed that has been individualized by the processing mechanism is transferred, a second holding mechanism for holding the object to be processed that has been individualized in order to transport the object to be processed from the processing table to the transfer table, a transport moving mechanism that extends along the arrangement direction of the processing table and the transfer table and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction in a horizontal plane, a container installation section in which a cylindrical container that contains the individualized object to be processed from an opening at one end is installed, and a transport and storage mechanism that transports and stores the individualized object to the cylindrical container installed in the container installation section from the transfer table.

[0012] This processing device is configured to move the first holding mechanism and the second holding mechanism by a common transfer axis extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction on a horizontal plane, so that the object can be singulated without moving the processing table in the first and second directions. Therefore, it is possible to eliminate the need for a bellows member for protecting the ball screw mechanism and the like and a cover member for protecting the bellows member without moving the processing table by a ball screw mechanism or the like. As a result, the device configuration of the processing device can be simplified. Furthermore, since the processing table is configured not to move in the first and second directions on a horizontal plane, the movement space of the processing table and the wasted space around it can be reduced, thereby reducing the footprint of the processing device. Furthermore, the individualized workpieces can be transported by the transporting and storing mechanism from the transfer table to a cylindrical container installed in the container installation section, and the individualized workpieces can be stored through an opening at one end of the cylindrical container.

[0013] As a specific arrangement of the transfer shaft and the processing movement mechanism, it is preferable that the transfer shaft is arranged above the processing movement mechanism so as to cross the processing movement mechanism. With this configuration, the first holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the first holding mechanism can be prevented from physically interfering with the moving mechanism for processing. Also, the second holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the second holding mechanism can be prevented from physically interfering with the moving mechanism for processing.

[0014] As a specific embodiment of the transporting and storing mechanism, it is desirable that the transporting and storing mechanism comprises an intermediate table on which the individual pieces of the workpiece are temporarily placed, a first transport mechanism that transports the individual pieces of the workpiece from the transfer table to the intermediate table, and a second transport mechanism that transports the individual pieces of the workpiece from the intermediate table to the cylindrical container installed in the container installation section and stores them therein.

[0015] In order to be able to confirm or inspect the condition of the singulated workpiece, it is desirable to further provide an imaging unit that images the singulated workpiece held by the first conveying mechanism or the singulated workpiece placed on the transfer table.

[0016] In order to automatically determine whether the individualized workpieces are good or bad, it is desirable to further provide a judgment unit that uses the imaging data obtained by the imaging unit to judge whether the individualized workpieces are good or bad.

[0017] In order to automatically distinguish between good and defective products based on the judgment results of the judgment unit, it is desirable to further provide a sorting mechanism that separates the individualized processed objects that have been judged to be defective by the judgment unit.

[0018] As a specific aspect of the arrangement of the sorting mechanism, it is desirable that the sorting mechanism be provided in the second transport mechanism.

[0019] As a specific embodiment of the sorting mechanism, it is desirable that the sorting mechanism switches between a good product route that guides the individualized processed objects that have been determined to be good products by the judgment unit to the cylindrical container, and a defective product route for disposing of items that have been determined to be defective by the judgment unit into a waste container.

[0020] As a specific embodiment of the movement mechanism that moves the processing mechanism at least in the first direction, that is, the X direction, and the second direction, that is, the Y direction, the processing movement mechanism preferably includes an X-direction movement unit that moves the processing mechanism linearly in the X direction, and a Y-direction movement unit that moves the processing mechanism linearly in the Y direction, and the X-direction movement unit preferably includes a pair of X-direction guide rails provided along the X direction with the processing table therebetween, and a support that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction movement unit. With this configuration, since a pair of X-direction guide rails are provided in the X direction on either side of the machining table, the pitch of the pair of X-direction guide rails can be increased. As a result, the effect of Z-direction positional deviation between the X-direction guide rails on machining can be reduced. In other words, deviation in the orthogonality between the rotating tool (e.g., blade) and the machining table can be reduced, improving machining accuracy. Also, X-direction guide rails with lower specifications than before can be used.

[0021] A method for manufacturing a processed product using the above-mentioned processing apparatus is also one aspect of the present invention.

[0022] <One embodiment of the present invention> Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate and schematic drawings are shown. The same components are given the same reference numerals and the description thereof is omitted as appropriate.

[0023] <Overall configuration of processing equipment> The processing apparatus 100 of the present embodiment is a cutting apparatus that cuts a sealed substrate W, which is an object to be processed, to separate the sealed substrate W into a plurality of products P, which are processed items.

[0024] Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin so as to encapsulate at least the electronic elements. The substrate constituting the encapsulated substrate W may be a lead frame or a printed wiring board, and may also be a semiconductor substrate (including semiconductor wafers such as silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, or the like. The substrate constituting the encapsulated substrate W may or may not be wired.

[0025] In addition, one surface of the sealed substrate W and the product P in this embodiment is a mounting surface on which mounting will be performed later. In the description of this embodiment, the surface on which mounting will be performed later is referred to as the "mounting surface," and the opposite surface is referred to as the "opposite surface."

[0026] Specifically, as shown in FIG. 1, the cutting apparatus 100 includes two cutting tables (processing tables) 2A, 2B for holding a sealed substrate W, a first holding mechanism 3 for holding the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A, 2B, a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A, 2B, a transfer table 5 to which multiple products P are transferred, a second holding mechanism 6 for holding the multiple products P in order to transport the multiple products P from the cutting tables 2A, 2B to the transfer table 5, a transport moving mechanism 7 having a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A, 2B. The first holding mechanism 3 and the transfer movement mechanism 7 constitute a transfer mechanism (loader) that transfers the sealed substrate W, and the second holding mechanism 6 and the transfer movement mechanism 7 constitute a transfer mechanism (unloader) that transfers a plurality of products P.

[0027] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively defined as the X direction, which is a first direction, and the Y direction, which is a second direction, and the vertical direction perpendicular to the X direction and the Y direction is defined as the Z direction. Specifically, the left-right direction in Fig. 1 is defined as the X direction, and the up-down direction is defined as the Y direction. As will be described later, the X direction is the movement direction of the support 812, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam part (beam part) spanning a pair of legs of the gate-shaped support 812 (see Figs. 2 and 3).

[0028] <Cutting tables 2A and 2B> The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

[0029] These two cutting tables 2A, 2B are provided along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and the centers of their upper surfaces (specifically, the centers of rotation by the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

[0030] The two cutting tables 2A, 2B are for suction-holding the sealed substrate W, and as shown in Fig. 1, two vacuum pumps 10A, 10B for suction-holding are arranged corresponding to the two cutting tables 2A, 2B. Each of the vacuum pumps 10A, 10B is, for example, a water-sealed vacuum pump.

[0031] Here, since the cutting tables 2A, 2B are fixed in the XYZ directions, the piping (not shown) connected from the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction power. As a result, even a very small package, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, since a decrease in suction power due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

[0032] <First holding mechanism 3> 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in Fig. 5 and Fig. 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction portions 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction portions 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

[0033] 1, the substrate supply mechanism 11 has a substrate accommodation section 111 in which a plurality of sealed substrates W are accommodated from outside, and a substrate supply section 112 that moves the sealed substrate W accommodated in the substrate accommodation section 111 to a holding position RP at which the sealed substrate W is attracted and held by the first holding mechanism 3. This holding position RP is set so as to be aligned in the same row as the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a heating section 113 that heats the sealed substrate W attracted by the first holding mechanism 3 to make it soft, thereby facilitating the attraction.

[0034] <Cutting mechanism 4> The cutting mechanism 4, which is a processing mechanism, has two rotating tools 40 consisting of blades 41A, 41B and two spindles 42A, 42B, as shown in Figs. 1, 2 and 3. The two spindles 42A, 42B are provided so that their rotation axes are along the Y direction, and the blades 41A, 41B attached thereto are disposed so as to face each other (see Fig. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. In addition, the cutting device 100 of this embodiment is provided with a liquid supply mechanism 12 having an injection nozzle 121 that injects cutting water (machining fluid) to suppress frictional heat generated by the blades 41A, 41B, as shown in Fig. 4. The injection nozzle 121 is supported, for example, by a Z-direction moving part 83, which will be described later.

[0035] <Transfer table 5> As shown in FIG. 1, the transfer table 5 in this embodiment is a table to which multiple products P inspected by the inspection unit 13 described later are transferred. This transfer table 5 is a so-called index table, on which multiple products P are temporarily placed. As shown in FIG. 1 and FIG. 9, the transfer table 5 is provided so as to be movable along the Y direction, and moves between a transfer position X1 where multiple products P are placed by the second holding mechanism 6 and a take-out position X2 where multiple products P are transported by the transport and storage mechanism 22. The transfer position X1 is set on the near side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a row along the X direction on a horizontal plane, and the take-out position X2 is set on the far side of the transfer shaft 71.

[0036] <Inspection Department 13> Here, as shown in FIG. 1, the inspection unit 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects a plurality of products P held by the second holding mechanism 6. The inspection unit 13 in this embodiment has a first inspection unit 131 that inspects the opposite side of the product P, and a second inspection unit 132 that inspects the mounting surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the opposite side, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. The first inspection unit 131 and the second inspection unit 132 may be a common unit.

[0037] Also, in order to enable the inspection unit 13 to inspect both sides of the multiple products P, an inversion mechanism 14 that inverts the multiple products P is provided (see FIG. 1). This inversion mechanism 14 has a holding table 141 that holds the multiple products P, and an inversion unit 142 such as a motor that inverts the holding table 141 so that the front and back are reversed.

[0038] When the second holding mechanism 6 holds the multiple products P from the processing tables 2A, 2B, the opposite sides of the products P face downward. In this state, while the multiple products P are being transported from the processing tables 2A, 2B to the inversion mechanism 14, the opposite sides of the products P are inspected by the first inspection unit 131. Then, the multiple products P held by the second holding mechanism 6 are inverted by the inversion mechanism 14, and then the inversion mechanism 14 moves to the position of the transfer table 5. During this movement, the mounting surface of the products P facing downward is inspected by the second inspection unit 132. Then, the products P are delivered to the transfer table 5.

[0039] <Second holding mechanism 6> 1, the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting tables 2A, 2B to the holding table 141 or the transfer table 5. As shown in FIG. 8, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction parts 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction parts 611 of the suction head 61. The suction head 61 is moved to a desired position by a transfer mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A, 2B to the holding table 141 or the transfer table 5.

[0040] <Transportation movement mechanism 7> As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the holding table 141.

[0041] As shown in FIG. 1, the transport moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

[0042] The transfer shaft 71 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11, and allows the second holding mechanism 6 to move above the transfer table 5 (see FIG. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (near side) of the transfer shaft 71 in a plan view. In addition, the inspection unit 13, the reversing mechanism 14, the first cleaning mechanism 18, the second cleaning mechanism 19, and the container installation unit 21, which will be described later, are also provided on the same side (near side) of the transfer shaft 71.

[0043] Furthermore, as shown in Figures 5, 6 and 8, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

[0044] As shown in Figures 5 to 8, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0045] The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and, like the transfer shaft 71, is provided within a range in which the first holding mechanism 3 can move above the substrate supply unit 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5. A slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting movement mechanism 73 and a horizontal movement mechanism 74 is slidably provided on this guide rail 721. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

[0046] The rack and pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided to each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on a common transfer shaft 71, and can be changed to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on a slide member 723 and is a so-called roller pinion, and as shown in FIG. 7, has a pair of roller bodies 722b1 that rotate together with the rotating shaft of the motor, and multiple roller pins 722b2 that are provided between the pair of roller bodies 722b1 at equal intervals in the circumferential direction and are provided to be rollable relative to the roller bodies 722b1. The rack and pinion mechanism 722 of the present embodiment uses the above-mentioned roller pinion, so that two or more roller pins 722b2 come into contact with the cam rack 722a. This prevents backlash from occurring in the forward and reverse directions, improving positioning accuracy when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.

[0047] As shown in Figs. 5 and 8, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is similar to that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in Figs. 8.

[0048] The horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in Fig. 5, Fig. 6, and Fig. 8. The horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, as shown in Fig. 5 and Fig. 6, and has a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

[0049] 8, the horizontal movement mechanism 74 of the second holding mechanism 6 is similar in configuration to the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

[0050] <Cutting movement mechanism 8 (processing movement mechanism)> The cutting movement mechanism 8 linearly moves each of the two spindle portions 42A, 42B in the X, Y, and Z directions.

[0051] Specifically, as shown in Figures 2, 3 and 4, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindle parts 42A, 42B linearly in the X direction, a Y-direction movement unit 82 that moves the spindle parts 42A, 42B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindle parts 42A, 42B linearly in the Z direction.

[0052] The X-direction moving unit 81 is common to the two cutting tables 2A and 2B, and as shown in particular in FIG. 2 and FIG. 3, has a pair of X-direction guide rails 811 provided along the X direction sandwiching the two cutting tables 2A and 2B, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving unit 82 and the Z-direction moving unit 83. The pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X direction. The support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam portion (beam portion) that is bridged across the pair of legs, and the beam portion extends in the Y direction.

[0053] The support 812 is caused to move linearly back and forth along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another direct acting mechanism such as a linear motor.

[0054] As shown in FIG. 3, the Y-direction moving section 82 has a Y-direction guide rail 821 provided on the support 812 along the Y direction, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle sections 42A and 42B. This allows the two spindle sections 42A and 42B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

[0055] 2 to 4, the Z-direction moving section 83 has a Z-direction guide rail 831 provided along the Z direction on each Y-direction slider 822, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindle sections 42A, 42B. That is, the Z-direction moving section 83 is provided corresponding to each of the spindle sections 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth by another linear motion mechanism such as a ball screw mechanism.

[0056] 1 and 4, the positional relationship between the moving cutting mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the moving cutting mechanism 8 and crosses the moving cutting mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

[0057] <Processing waste storage section 17> Moreover, the cutting device 100 of this embodiment further includes a processing waste storage section 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W, as shown in FIG.

[0058] 2 to 4, the processing scrap storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 having an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects the processing scraps S guided by the guide chute 171. By providing the processing scrap storage section 17 below the cutting tables 2A, 2B, the collection rate of the processing scraps S can be improved.

[0059] The guide chute 171 guides the machining scraps S that have scattered or fallen from the cutting tables 2A, 2B to a collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it difficult for the machining scraps S to be missed, and the collection rate of the machining scraps S can be further improved. In addition, the guide chute 171 is provided to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining scraps S and cutting water.

[0060] In this embodiment, the processing waste container 17 is common to the two cutting tables 2A and 2B, but it may be provided for each of the cutting tables 2A and 2B.

[0061] The collection container 172 collects the processing scraps S that have passed through the guide chute 171 due to their own weight, and in this embodiment, as shown in FIG. 4 and the like, is provided corresponding to each of the two cutting tables 2A and 2B. The two collection containers 172 are disposed on the front side of the transfer shaft, and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration can improve the ease of maintenance, such as disposal of the processing scraps S. Note that the collection container 172 may be provided entirely under all the cutting tables, or may be divided into three or more, taking into consideration the size of the sealed substrate W, the size and amount of the processing scraps S, workability, and the like.

[0062] 4 and other figures, the machining chip storage section 17 has a separation section 173 that separates the cutting water from the machining chips S. As a configuration of this separation section 173, for example, a filter such as a porous plate that allows the cutting water to pass through can be provided on the bottom surface of the collection container 172. This separation section 173 makes it possible to collect the machining chips S without accumulating cutting water in the collection container 172.

[0063] <First cleaning mechanism 18> 1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 that cleans the upper surfaces (mounting surfaces) of the multiple products P held on the cutting tables 2A and 2B. This first cleaning mechanism 18 cleans the upper surfaces of the products P with an injection nozzle 18a (see FIG. 5) that injects cleaning liquid and / or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

[0064] 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, an elevation movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. The elevation movement mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.

[0065] <Second cleaning mechanism> 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the undersides (opposite sides) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and cleans the undersides of the products P by spraying cleaning liquid and / or compressed air onto the undersides of the multiple products P held by the second holding mechanism 6. In other words, the second cleaning mechanism 19 cleans the undersides of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

[0066] <Tube storage configuration> The cutting device 100 of this embodiment is configured to accommodate a plurality of products P in a cylindrical container 20 (also called "tube accommodation"). The cylindrical container 20 may be called a tube, a magazine stick, a stick magazine, a stick, or the like.

[0067] Specifically, as shown in Figures 1, 9 and 10, the cutting device 100 includes a container installation section 21 in which a cylindrical container 20 that stores multiple products P from one end opening 20x is installed, and a transporting and storing mechanism 22 that transports the multiple products P from the transfer table 5 to the cylindrical container 20 installed in the container installation section 21 and stores them therein.

[0068] The container setting section 21 is configured to set an empty cylindrical container 20 that does not contain a product P, and a transfer and storage mechanism 22 inserts the product P into the cylindrical container 20 from one end opening 20x.

[0069] As shown in Figures 1 and 9, the container installation section 21 of this embodiment includes an empty container storage section 211 that stores an empty cylindrical container 20, an insertion position installation section 212 that sends out the empty cylindrical container 20 from the empty container storage section 211 and installs the empty cylindrical container 20 at an insertion position where a product P is inserted from one end opening 20x, and a stored container storage section 213 that stores stored cylindrical containers 20 that are fully loaded with products P or that contain a desired number of products P.

[0070] Here, as shown in FIG. 10, the cylindrical container 20 accommodates a plurality of products P aligned in a row. Specifically, the cylindrical container 20 has a shape extending linearly, and has a space for accommodating the products P inside. The cross-sectional shape of the cylindrical container perpendicular to the longitudinal direction corresponds to the cross-sectional shape of the products P. The cylindrical container 20 shown in FIG. 10 has a configuration in which a part of the side wall extending along the longitudinal direction is open, but the side wall may be closed. The cylindrical container 20 may be configured to accommodate a plurality of products P aligned in a row, or may be configured to accommodate a plurality of products P aligned in multiple rows. Furthermore, the cylindrical container 20 may be made of resin or metal. Although FIG. 10 shows a form in which the products P have leads, the products P may be of a non-lead type such as QFN.

[0071] As shown in Figures 1 and 9, the transporting and storing mechanism 22 includes an intermediate table 23 on which multiple products P are temporarily placed, a first transport mechanism 24 that transports the multiple products P from the transfer table 5 located at the removal position to the intermediate table 23, and a second transport mechanism 25 that transports the multiple products P from the intermediate table 23 to a cylindrical container 20 installed in the insertion position installation section 212 of the container installation section 21 and stores them therein.

[0072] The intermediate table 23 is a table on which the product P is temporarily placed after being transported from the transfer table 5 at the removal position X2 by the first transport mechanism 24. The product P temporarily placed on the intermediate table 23 is transported by the second transport mechanism 25 to the cylindrical container 20 placed in the container installation section 21. The intermediate table 23 in this embodiment is fixed in the X and Y directions, but may be configured to be movable.

[0073] The first transport mechanism 24 transports a predetermined number of products P (for example, one product at a time) from the transfer table 5 that has moved to the take-out position X2 to the intermediate table 23.

[0074] Specifically, as shown in Figures 9 and 11, the first conveying mechanism 24 includes a product suction mechanism 241 that adsorbs a predetermined number (e.g., one) of multiple products P held on the transfer table 5, and an adsorption movement mechanism 242 that moves the product suction mechanism 241 along the X direction.

[0075] 11, the product suction mechanism 241 has a suction head 241A provided with suction parts 241a for suctioning and holding a plurality of products P, and a vacuum pump or vacuum ejector (not shown) connected to the suction parts 241a of the suction head 241A. The product suction mechanism 241 is configured so that each of the suction parts 241a is capable of suctioning one product P. The multiple suction parts 241a are configured to be capable of moving up and down independently of one another, and each suction part 241a can suction an individual product P by descending.

[0076] 11, the suction moving mechanism 242 includes an X-direction moving section 242a that moves the product suction mechanism 241 in the X direction, and a Z-direction moving section 242b that moves the product suction mechanism 241 in the Z direction. The suction moving mechanism 242 may also include a Y-direction moving section that moves the product suction mechanism 241 in the Y direction.

[0077] The X-direction moving section 242a has an X-direction guide rail 242a1 provided along the X-direction at the rear side of the transfer shaft 71, and a support 242a2 that moves along the X-direction guide rail 242a1 and supports the product suction mechanism 241 via the Z-direction moving section 242b. The support 242a2 reciprocates linearly along the X-direction on the X-direction guide rail 242a1 by, for example, a ball screw mechanism (not shown) extending in the X-direction. This ball screw mechanism is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 242a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.

[0078] 11, the Z-direction moving section 242b has a Z-direction guide rail 242b1 provided along the Z direction on the support 242a2, and a Z-direction slider 242b2 that moves along the Z-direction guide rail 242b1 and supports the product suction mechanism 241. The Z-direction slider 242b2 reciprocates linearly along the Z direction on the Z-direction guide rail 242b1 by, for example, a ball screw mechanism (not shown) extending in the Z direction. Alternatively, the Z-direction slider 242b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.

[0079] As shown in Figures 9 and 12, the second conveying mechanism 25 conveys the product P placed on the intermediate table 23 to the cylindrical container 20 installed in the insertion position installation section 212 of the container installation section 21, and inserts and stores the product P through one end opening 20x of the cylindrical container 20.

[0080] Specifically, the second conveying mechanism 25 has a product guide section 251 that guides the product P to one end opening 20x of the cylindrical container 20, and a product moving section 252 that moves the product P on the product guide section 251 toward one end opening 20x of the cylindrical container 20.

[0081] The product guide portion 251 aligns the products P and guides them into the cylindrical container 20. Since the cylindrical container 20 in this embodiment is installed along the Y direction, the product guide portion 251 is also provided along the Y direction. In this embodiment, the container installation portion 21 is provided on the front side of the transfer shaft 71, and the intermediate table 23 is provided on the rear side of the transfer shaft 71, so the product guide portion 251 is perpendicular to the transfer shaft 71 below the transfer shaft 71.

[0082] The product moving section 252 has a pressing member 252a that presses the product P, and a driving section 252b that moves the pressing member 252a along the Y direction. Note that the driving section 252b may be, for example, one that uses a ball screw mechanism, one that uses an air cylinder, or one that uses a linear motor.

[0083] <Function for separating defective products> The cutting device 100 of this embodiment has a function of inspecting the quality of a plurality of products P and separating out defective products.

[0084] Specifically, as shown in Figures 1, 9 and 12, the cutting device 100 further includes an imaging unit 26 that images a plurality of products P, a judgment unit 27 that judges the quality of the plurality of products P using the imaging data obtained by the imaging unit 26, and a sorting mechanism 28 that sorts the products P that are judged to be defective by the judgment unit 27.

[0085] The imaging unit 26 is an imaging camera that images the product P held by the product suction mechanism 241 of the first conveying mechanism 24 from below, and images the bottom surface (opposite surface) of the product P. Alternatively, a different imaging unit may be used to image, for example, the top surface (mounting surface) of the product P placed on the transfer table 5.

[0086] The judgment unit 27 detects defects (such as bent leads, insufficient resin filling, air bubbles, etc.) of the product P using the imaging data obtained by the imaging unit 26, and judges the quality of the product P. The judgment unit 27 is composed of a control unit CTL.

[0087] The sorting mechanism 28 is provided in the second conveying mechanism 25 and switches between a good product route R1 for guiding products P determined to be good by the judgment unit 27 to the cylindrical container 20 and a defective product route R2 for disposing of products P determined to be defective by the judgment unit 27 into a waste container 29, as shown in Figure 12.

[0088] Specifically, the sorting mechanism 28 is provided in a part of the product guide section 251, and switches between a good product route R1 and a defective product route R2. The sorting mechanism 28 of this embodiment has a turntable 281 on which the product P is placed, and a moving mechanism 282 that moves the product P from the turntable 281 to each route R1, R2, and the good product route R1 and the defective product route R2 are switched by rotating the turntable 281. Here, the good product route R1 is a direction along the Y direction, and the defective product route R2 is a direction along the X direction. The moving mechanism 282 can be configured similarly to the product moving section 252 of the second transport mechanism 25 described above.

[0089] <An example of the cutting device's operation> Next, an example of the operation of the cutting apparatus 100 will be described with reference to Fig. 9, Fig. 11, Fig. 12, and Fig. 13. Fig. 13 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 in the operation of the cutting apparatus 100. In this embodiment, all operations and controls of the operation of the cutting apparatus 100, such as transporting the sealed substrate W, cutting the sealed substrate W, inspecting the product P, and storing the product P in a tube, are performed by the control unit CTL (see Fig. 1).

[0090] The substrate supplying section 112 of the substrate supplying mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating section 111 toward the holding position RP where the substrate W is held by the first holding mechanism 3 (see FIG. 1).

[0091] 13, the transfer movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transfer movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the adsorption and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B adsorb and hold the sealed substrate W.

[0092] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting movement mechanism 73 lifts the first holding mechanism 3 to a position where it does not physically interfere with the cutting movement mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retreated from the cutting table 2B to the transfer table 5 side, there is no need to lift and lower the first holding mechanism 3 as described above.

[0093] In this state, the cutting movement mechanism 8 sequentially moves the two spindle parts 42A, 42B in the X direction and the Y direction while the cutting tables 2A, 2B rotate, thereby cutting the sealed substrate W into individual pieces in a lattice pattern.

[0094] After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (mounting surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport moving mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

[0095] Next, the transport moving mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 adsorbs and holds the multiple products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. As a result, the second cleaning mechanism 19 cleans the lower surface (opposite surface) of the multiple products P held by the second holding mechanism 6.

[0096] After cleaning, the bottom surfaces (opposite surfaces) of the multiple products P held by the second holding mechanism 6 are inspected by the inspection unit 131, and then the products P are transferred to the reversing mechanism 14, which suction-holds the opposite surfaces and then reverses them. After the reversing, the reversing mechanism 14 moves, and the mounting surface of the product P is inspected by the inspection unit 132. After both sides have been inspected in this manner, the product P is transferred from the reversing mechanism 14 to the transfer table 5.

[0097] The transfer table 5 on which the multiple products P are placed moves to the removal position X2 (see FIGS. 1, 9, and 11). Meanwhile, an empty cylindrical member 20 is placed in the insertion position installation section 212 of the container installation section 21 (see FIGS. 9 and 12).

[0098] 11, the first conveying mechanism 22 sucks and holds the product P from the transfer table 5 located at the take-out position X2. Then, it moves above the imaging unit 26. As a result, the imaging unit 26 captures an image of the product P sucked and held by the first conveying mechanism 22. The judging unit 27 judges the quality of the product P using the imaging data obtained by the imaging unit 26. Thereafter, the first holding mechanism 22 moves the product P to the intermediate table 23, releases the suction and holding of the product P, and places the product P on the intermediate table 23. The product P placed on the intermediate table 23 is transported to the rotation table 281 by, for example, the moving mechanism 282 of the sorting mechanism 28.

[0099] The sorting mechanism 28 switches between a good product route R1 and a defective product route R2 for each product P based on the result of the pass / fail judgment by the judgment section 27. If the product is a good product, the sorting mechanism 28 switches to the good product route R1 (see FIG. 12(a)), and the moving mechanism 282 transports the product P to the product guide section 251. The product P transported to the product guide section 251 is inserted and accommodated inside the cylindrical container 20 by the product moving section 252 of the second transport mechanism 25. On the other hand, if the product is defective, the sorting mechanism 28 switches to the defective product route R2 (see FIG. 12(b)), and the moving mechanism 282 transports the product P to the waste container 29 for disposal.

[0100] When the cylindrical container 20 is fully loaded, or when the desired number of products P are contained in the cylindrical container 20, the contained cylindrical container 20 in the insertion position installation section 212 is moved to the contained container storage section 213, and an empty cylindrical container 20 is sent out from the empty container storage section 211 and installed in the insertion position installation section 212.

[0101] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5, and the cutting mechanism 4 is moved by the cutting moving mechanism 8 in the X direction along the transfer shaft 71 on a horizontal plane and in the Y direction perpendicular to the X direction, so that the sealed substrate W can be divided into individual pieces without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, it is possible to eliminate the need for a bellows member for protecting the ball screw mechanism and the like and a cover member for protecting the bellows member without moving the cutting tables 2A, 2B by a ball screw mechanism or the like. As a result, the device configuration of the cutting device 100 can be simplified.

[0102] Furthermore, since the cutting tables 2A, 2B are configured not to move in the X and Y directions on a horizontal plane, the movement space of the cutting tables 2A, 2B and the wasted space around them can be reduced, and the footprint of the cutting device 100 can be reduced.

[0103] Furthermore, the transport and storage mechanism 22 can transport a plurality of products P from the transfer table 5 to the cylindrical container 20 placed in the container installation section 21, and store the plurality of products P through one end opening 20x of the cylindrical container 20.

[0104] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0105] For example, in the above embodiment, the container installation portion 21 is provided on the front side of the transfer shaft 71, but it may be provided on the rear side of the transfer shaft 71.

[0106] Furthermore, the cylindrical container 20 installed in the container installation section 21 may be arranged along the X direction or along another direction, in addition to being arranged along the Y direction.

[0107] Furthermore, the sorting mechanism 28 may be configured to be capable of separating products P determined to be good from products P determined to be defective, and to remove defective products from the good product route. For example, as shown in Fig. 14(a), the sorting mechanism 28 may be configured to have an opening / closing mechanism 283 on the bottom surface of the product guide section 251 along which the products P slide, and to open the opening / closing mechanism 283 to drop and remove defective products. As shown in Fig. 14(b), the sorting mechanism 28 may be configured to have a removal mechanism 284 that pushes products P determined to be defective moving along the product guide 251 to the side, and to push and remove the defective products with the removal mechanism 284.

[0108] The imaging unit 26 in the above embodiment images the product P held by the first transport mechanism 24, but may also image the product P placed on the transfer table 5. Also, the imaging unit 26 may be attached to the product suction mechanism 241 of the first transport mechanism 24 to image the product P placed on the transfer table 5 or the intermediate table 23. Also, in addition to the imaging unit 26 in the above embodiment, one attached to the product suction mechanism 241 of the first transport mechanism 24 may be used in combination.

[0109] In the above embodiment, a cutting device using a twin cut table system and a twin spindle configuration has been described, but the present invention is not limited to this and may also be a cutting device using a single cut table system and a single spindle configuration, or a cutting device using a single cut table system and a twin spindle configuration.

[0110] Furthermore, since the cam rack elements constituting the transfer shaft 71 can be configured by connecting a plurality of them, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module that performs a type of inspection different from the inspection at the inspection unit 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Note that, other than the configuration exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) anywhere, and the added module may be a module with various functions other than inspection.

[0111] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0112] 100...Cutting equipment (processing equipment) W···Sealed substrate (object to be processed) P...Product (processed product) 2A, 2B: Cutting table (processing table) 3...1st holding mechanism 4...Cutting mechanism (processing mechanism) 5. Transfer table 6...Second holding mechanism 7. Transport mechanism 71 Transfer shaft 8...Moving mechanism for processing 81...X direction moving part 82 Y-direction moving part 811... Pair of X-direction guide rails 812...Support 20 Cylindrical container 20x...one end opening 21...Container installation section 22. Transport and storage mechanism 23. Intermediate table 24...First transfer mechanism 25...Second transfer mechanism 26 Imaging unit 27... Judgment section 28...Separation mechanism 29. Waste container R1: Good product route R2: Defective product route

Claims

1. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a container installation section in which a cylindrical container that accommodates the individual pieces of the processing object from an opening at one end is installed; a transport and storage mechanism that transports the individual pieces of the processing object from the transfer table to the cylindrical container installed in the container installation section and stores the individual pieces in the cylindrical container; An imaging unit that images the object to be processed, The transport and storage mechanism includes: an intermediate table on which the individualized object to be processed is temporarily placed; a first transport mechanism that transports the individualized object from the transfer table to the intermediate table; a second conveying mechanism that conveys the individualized object from the intermediate table to the cylindrical container installed in the container installation section and accommodates the individualized object, The imaging unit images the individualized workpiece held by the first conveying mechanism, or the individualized workpiece placed on the transfer table, of the processing apparatus.

2. The processing apparatus according to claim 1 , further comprising a determination unit that determines quality of the individualized workpieces by using imaging data obtained by the imaging unit.

3. The processing apparatus according to claim 2 , further comprising a sorting mechanism that sorts the individualized workpieces determined to be defective by the determination unit.

4. The processing apparatus according to claim 3 , wherein the separating mechanism is provided in the second transport mechanism.

5. The processing apparatus of claim 3 or 4, wherein the sorting mechanism switches between a good product route for guiding the individualized processing objects determined to be good products by the judgment unit to the cylindrical container, and a defective product route for disposing of items determined to be defective by the judgment unit into a waste container.

6. A processing table for holding an object to be processed; a first holding mechanism that holds the workpiece for transporting the workpiece to the processing table; a processing mechanism for cutting the object held on the processing table into individual pieces; a transfer table onto which the object to be processed that has been singulated by the processing mechanism is transferred; a second holding mechanism that holds the singulated object to transport the singulated object from the processing table to the transfer table; a transfer mechanism for conveyance extending along an arrangement direction of the processing table and the transfer table and having a common transfer axis for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane; a container installation section in which a cylindrical container that accommodates the individual pieces of the processing object from an opening at one end is installed; a transport and storage mechanism that transports the individual pieces of the processing object from the transfer table to the cylindrical container installed in the container installation section and stores the individual pieces in the cylindrical container, The processing movement mechanism includes an X-direction movement unit that moves the processing mechanism linearly in the X-direction, which is the first direction, and a Y-direction movement unit that moves the processing mechanism linearly in the Y-direction, which is the second direction, The X-direction moving unit has a pair of X-direction guide rails arranged along the X direction on either side of the processing table, and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving unit.

7. 7. The processing device according to claim 1, wherein the transfer shaft is disposed above the processing movement mechanism so as to cross the processing movement mechanism.

8. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product by using the processing apparatus according to any one of claims 1 to 7;

Images