SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a substrate processing device and a substrate processing method capable of efficiently performing substrate alignment even when the displacement position of a substrate exceeds an accommodation range of a centering buffer unit.SOLUTION: A substrate processing method according to the present invention includes a measurement step of measuring the alignment of substrate placed on the hand of a transport unit that transports the substrates, a step of transporting the substrate to a substrate alignment unit by the transport unit when the alignment of the substrates is poor, and a step of aligning the positions of the substrates with the substrate alignment unit, and further includes a provisional correction step of provisionally correcting the position of the substrate before the substrate is loaded into the substrate alignment unit when the alignment state of the substrate exceeds a sensor sensing range in the measurement step.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method for a substrate that is shifted within a hand and exceeds the substrate accommodation range of a physical centering buffer. [Background technology]

[0002] In order to manufacture semiconductor devices, various processes such as deposition, photolithography, etching, cleaning, etc. are performed. Among these, an apparatus for performing some of the processes has multiple chambers. After a process is performed in one of the chambers, a substrate is transferred to another chamber.

[0003] According to one example, a substrate processing apparatus for performing a photolithography process includes various chambers such as a coating chamber for coating a substrate with a photosensitive liquid such as a photoresist, a bake chamber for heating or cooling the substrate before or after coating with the photosensitive liquid, an edge exposure chamber for exposing the edge region of the substrate, etc. The substrate is transported to these chambers in a preset order.

[0004] The substrate must be placed in a predetermined correct position on a unit that supports the substrate within the chamber. If a process is performed when the substrate is not placed in the correct position, process defects are likely to occur. For example, if a process for processing the edge region of the substrate is performed when the substrate is not aligned, a particular chemical or rinse solution may unintentionally affect the center of the substrate, and the quality of the process result may not meet the standard. In some cases, the center and edge of the substrate exposed to the chemical or rinse solution may be damaged.

[0005] Therefore, when the substrate is transferred out of its normal position on the transfer unit, or when the substrate is transferred out of its normal position on the unit supporting the substrate within the chamber, it must be aligned. Generally, when the position of the substrate exceeds the sensor reading range or unit storage range, it is aligned within the sensor reading range by a centering buffer unit that is capable of physical centering. At this time, the storage range of the centering buffer unit must exceed the substrate movement range within the hand.

[0006] If the deviation of the substrate exceeds the range of the centering buffer unit, the transport unit must be stopped and the substrate must be moved manually (by the user) to the center position.

[0007] FIG. 1 is a diagram showing a problem that occurs when a substrate that is misaligned within the accommodation range is aligned in a centering buffer unit, and FIG. 2 is a diagram showing a problem that occurs when the accommodation range is expanded to solve the problem of FIG. 1. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] International Patent Publication No. WO2016032241A1 Summary of the Invention [Problem to be solved by the invention]

[0009] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS An object of the present invention is to provide a substrate processing apparatus and method capable of efficiently aligning a substrate even when the misalignment of the substrate exceeds the accommodation range of a centering buffer unit.

[0010] Another object of the present invention is to provide a substrate processing apparatus and method that can increase the alignment accuracy of a substrate while simultaneously reducing the time required for alignment.

[0011] The object of the present invention is not limited to the present invention, and other objects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0012] According to one aspect of the present invention, there is provided a substrate processing method including a measurement step of measuring an alignment state of a substrate placed on a hand of a transport unit that transports the substrate, and if the alignment state of the substrate is poor, the transport unit transports the substrate to a substrate alignment unit, and aligns a position of the substrate in the substrate alignment unit, and if the alignment state of the substrate exceeds a sensor detection range in the measurement step, a provisional correction step of provisionally correcting a position of the substrate before loading the substrate into the substrate alignment unit.

[0013] The provisional correction step may include a direction determination step of determining a direction of deviation of the substrate using the measurement value of the measurement step, and an offset step of offsetting the position of the hand by a preset interval in a direction opposite to the deviation direction of the substrate.

[0014] Also, the preset interval may correspond to a sensing range of a sensor that measures an alignment state of the substrate placed on the hand.

[0015] In addition, the measuring step may include detecting four edge positions on the substrate using four sensors installed on the hand.

[0016] In addition, the sensor emits light toward the substrate placed on the hand, and the degree of misalignment of the substrate can be measured based on the area of ​​the detected light.

[0017] In addition, the direction determination step can determine the direction of the substrate misalignment through a non-detection sensor that is beyond the detection range of the four sensors.

[0018] According to another aspect of the present invention, a substrate processing apparatus may be provided that includes a substrate alignment unit for aligning a substrate, a transport unit having a hand on which a substrate is placed and a position sensor for measuring a position of the substrate on the hand, the transport unit transporting the substrate to the substrate alignment unit, and a teaching unit for setting a transport position to which the substrate is transported on the substrate alignment unit by the transport unit, wherein the teaching unit uses the position sensor to measure a positional deviation of the substrate placed on the hand, and if an alignment state of the substrate exceeds a sensor detection range of the position sensor, corrects the transport position of the hand before seating the substrate placed on the hand on the substrate alignment unit.

[0019] In addition, the teaching unit can determine the direction of deviation of the substrate by using the measurement value of the position sensor.

[0020] In addition, the teaching unit has four position sensors installed in the hand that can detect four end positions on the board.

[0021] In addition, the teaching unit can check the direction of deviation of the board through a non-detecting position sensor that is beyond the sensor detection range among the four position sensors.

[0022] Also, the teaching unit can offset the transfer position of the hand by a preset interval in a direction opposite to the deviation direction of the substrate.

[0023] Also, the preset interval may correspond to a sensing range of the position sensor.

[0024] The substrate alignment unit may include a support plate and a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate. Also, the alignment pin may have a cone or truncated cone shaped inclined portion that has a cross section that becomes wider as it goes downward.

[0025] According to another aspect of the present invention, there is provided a method for processing a substrate using substrate processing equipment having a transfer chamber provided with a transfer robot for transporting a substrate, a plurality of process chambers provided on sides of the transfer chamber for processing the substrate, and a substrate alignment unit provided on the side of the transfer chamber, the method comprising: a measurement step of measuring an alignment state of a substrate placed on a hand of the transfer robot; and if the alignment state of the substrate is poor, the transfer robot transports the substrate to a substrate alignment unit to align the substrate, and if the alignment state of the substrate exceeds a substrate accommodation range of the substrate alignment unit in the measurement step, a step of provisionally correcting a position of the substrate before loading the substrate into the substrate alignment unit. In addition, the step of provisionally correcting the position of the substrate includes a direction determination step of determining a direction of deviation of the substrate using a measurement value of a position sensor installed on the hand, and the direction determination step may confirm the direction of deviation of the substrate through a non-detecting position sensor that is beyond a sensor detection range among the position sensors.

[0026] Also, the step of provisionally correcting the position of the substrate may further include an offsetting step of offsetting the position of the hand by a preset interval in a direction opposite to the deviation direction of the substrate.

[0027] Also, the preset interval may correspond to a sensing range of a sensor that measures an alignment state of the substrate placed on the hand.

[0028] In addition, the measuring step may include detecting four edge positions on the substrate using four sensors installed on the hand.

[0029] In addition, the sensor emits light toward the substrate placed on the hand, and the degree of misalignment of the substrate can be measured based on the area of ​​the detected light. Effect of the Invention

[0030] According to an embodiment of the present invention, even if the misalignment of the substrate exceeds the accommodation range of the centering buffer unit, the substrate can be efficiently aligned.

[0031] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those having ordinary skill in the art to which the present invention belongs from this specification and the attached drawings. [Brief description of the drawings]

[0032] [Figure 1] 11 is a diagram illustrating a problem that occurs when a substrate that is misaligned within a receiving range is aligned in a centering buffer unit. [Diagram 2] 2 is a diagram showing a problem that occurs when the accommodation range is expanded to solve the problem in FIG. 1. [Diagram 3] 1 is a top view of a substrate processing apparatus according to an embodiment of the present invention; [Figure 4] This is a drawing of the facility in Figure 3 as seen from the AA direction. [Diagram 5] This is a drawing of the facility in Figure 3 as seen from the BB direction. [Figure 6] This is a drawing of the facility in Figure 3 as seen from the CC direction. [Figure 7A] 4 is a cross-sectional view of an alignment device provided in the coating and developing module of FIG. 3. [Figure 7B] FIG. 8 is a partially enlarged cross-sectional view of FIG. [Figure 8] 1 is a diagram showing a hand on which a position detection member is installed. [Figure 9] 4 is a diagram for explaining a position detection member. [Figure 10] 1 is a diagram showing a sensor detection range of a position detection member. [Figure 11] 13 is a diagram showing a displacement of a substrate on a hand. [Figure 12] 13 is a diagram showing a displacement of a substrate on a hand. [Figure 13]11 is a table showing a direction of deviation of a substrate through a non-detecting sensor that is out of a sensor detection range in a position detection member; [Figure 14A] 1 is a diagram showing a configuration of a substrate alignment device; [Figure 14B] 1 is a diagram showing a configuration of a substrate alignment device; [Figure 14C] 1 is a diagram showing a configuration of a substrate alignment device; [Figure 15] 1 is a flow chart illustrating a substrate processing method for teaching a substrate on a hand. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. In addition, in describing the preferred embodiments of the present invention in detail, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and operations.

[0034] The term "comprising" an element does not mean excluding other elements, but may further include other elements, unless specifically stated to the contrary. In particular, the terms "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or possibility of addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The singular expression includes the plural expression unless otherwise clearly expressed in the context. Also, in the drawings, the shapes and sizes of elements may be exaggerated for more clear explanation.

[0035] The apparatus of the present embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of the present embodiment can be connected to an exposure tool and used to perform a coating process and a developing process on the substrate. In the following, an example will be described in which a wafer is used as the substrate.

[0036] Figures 3 to 6 are schematic diagrams showing a substrate processing equipment according to an embodiment of the present invention, in which Figure 3 is a diagram showing the substrate processing equipment from above, Figure 4 is a diagram showing the equipment of Figure 3 from the direction AA, Figure 5 is a diagram showing the equipment of Figure 3 from the direction BB, and Figure 6 is a diagram showing the equipment of Figure 3 from the direction CC.

[0037] 3 to 6, the substrate processing equipment 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500, a pre-exposure and post-exposure processing module 600, and an interface module 700.

[0038] Hereinafter, the direction in which the load port 100, index module 200, first buffer module 300, coating and developing module 400, second buffer module 500, pre-exposure and post-exposure processing module 600, and interface module 700 are arranged will be referred to as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above will be referred to as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0039] The substrates W are moved to a state where they are housed inside the cassette 20. At this time, the cassette 20 has a structure that allows it to be sealed from the outside. For example, a Front Open Unified Pod (FOUP) having a door at the front may be used as the cassette 20.

[0040] The load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre- and post-exposure treatment module 600, and the interface module 700 will be described in detail below.

[0041] The load port 100 has a mounting table 120 on which a cassette 20 storing a substrate W is placed. A plurality of mounting tables 120 are provided, and the mounting tables 200 are arranged in a line along the second direction 14. In FIG. 3, four mounting tables 120 are provided.

[0042] The index module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300. The index module 200 includes a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided in the shape of a hollow rectangular parallelepiped, and is disposed between the load port 100 and the first buffer module 300.

[0043] The first buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of a rectangular parallelepiped with an empty interior, and is disposed between the index module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are disposed within the frame 310. The first buffer 320 and the second buffer 330 each temporarily store a plurality of substrates W. The first buffer robot 360 transfers the substrates W between the first buffer 320 and the second buffer 330. The cooling chamber 350 cools the substrates W.

[0044] The coating and developing module 400 performs a process of coating a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The coating and developing module 400 has an approximately rectangular parallelepiped shape. The coating and developing module 400 includes a coating module 401 and a developing module 402.

[0045] The coating module 401 and the developing module 402 are arranged to be separated by a layer between them. According to one example, the coating module 401 is located above the developing module 402. The coating module 401 includes a process of coating a photosensitive liquid such as a photoresist onto a substrate W, and a heat treatment process such as heating and cooling the substrate W before and after the resist coating process.

[0046] The coating module 401 includes a resist coating chamber 410, a bake chamber 420, and a transfer chamber 430. The resist coating chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially arranged along the second direction 14. Therefore, the resist coating chamber 410 and the bake chamber 420 are positioned to be spaced apart from each other in the second direction 14 via the transfer chamber 430.

[0047] A plurality of resist coating chambers 410 are provided, one in each of the first direction 12 and the third direction 16. In the drawing, an example in which six resist coating chambers 410 are provided is shown.

[0048] The bake chamber 420 heat-treats the substrate W. For example, the bake chamber 420 performs a prebake process in which the substrate W is heated to a predetermined temperature before the substrate W is coated with photoresist to remove organic matter and moisture from the surface of the substrate W, a softbake process after the substrate W is coated with photoresist, and a cooling process in which the substrate W is cooled after each heating process.

[0049] The transfer chamber 430 is positioned parallel to the first buffer 320 of the first buffer module 300 in the first direction 12 . The developing module 402 includes a developing process for supplying a developer to remove a portion of the photoresist to obtain a pattern on the substrate W, and a thermal treatment process such as heating and cooling performed on the substrate W before or after the developing process. The developing module 402 includes a developing chamber 460, a bake chamber 470, and a transfer chamber 480. The developing chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially arranged along the second direction 14. The developing chambers 460 all have the same structure. However, the type of developer used in each developing chamber 460 may be different. The developing chambers 460 remove the areas of the photoresist on the substrate W that are irradiated with light. At this time, the areas of the protective film that are irradiated with light are also removed. Alternatively, depending on the type of photoresist used, only the areas of the photoresist and protective film that are not irradiated with light may be removed.

[0050] The bake chamber 470 of the developing module 402 heat-treats the substrate W. For example, the bake chamber 470 performs a post-bake process for heating the substrate W before a developing process is performed, a hard-bake process for heating the substrate W after the developing process is performed, and a cooling process for cooling the heated substrate W after each bake process.

[0051] The second buffer module 500 serves as a passageway for transporting the substrate W between the coating and developing module 400 and the pre- or post-exposure treatment module 600. The second buffer module 500 also performs predetermined processes, such as a cooling process and an edge exposure process, on the substrate W. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560.

[0052] When the exposure apparatus performs an immersion exposure process, the pre- and post-exposure treatment module 600 can perform a process of applying a protective film to protect a photoresist film applied to the substrate W during immersion exposure. In addition, the pre- and post-exposure treatment module 600 can perform a process of cleaning the substrate W after exposure. In addition, when a coating process is performed using a chemically amplified resist, the pre- and post-exposure treatment module 600 can perform a post-exposure bake process.

[0053] The pre- and post-exposure treatment module 600 includes a pre-treatment module 601 and a post-treatment module 602. The pre-treatment module 601 performs a process of treating the substrate W before performing an exposure process, and the post-treatment module 602 performs a process of treating the substrate W after the exposure process.

[0054] In the pre- and post-exposure processing module 600, a pre-processing module 601 and a post-processing module 602 are provided so as to be completely separated from each other.

[0055] The pre-treatment module 601 includes a protective film coating chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film coating chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially arranged along the second direction 14.

[0056] Therefore, the protective film coating chamber 610 and the bake chamber 620 are positioned to be spaced apart from each other in the second direction 14 via the transfer chamber 630. A plurality of protective film coating chambers 610 are provided and arranged in layers along the third direction 16.

[0057] Alternatively, a plurality of protective film coating chambers 610 may be provided in each of the first direction 12 and the third direction 16. A plurality of bake chambers 620 may be provided and arranged in layers along the third direction 16. Alternatively, a plurality of bake chambers 620 may be provided in each of the first direction 12 and the third direction 16.

[0058] The post-treatment module 602 includes a cleaning chamber 660, a post-exposure bake chamber 670, and a transfer chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially arranged along the second direction 14.

[0059] Therefore, the cleaning chamber 660 and the post-exposure bake chamber 670 are positioned to be spaced apart from each other in the second direction 14 via the transfer chamber 680. A plurality of cleaning chambers 660 may be provided and arranged along the third direction 16 to be layered on top of each other.

[0060] Alternatively, a plurality of cleaning chambers 660 may be provided in each of the first direction 12 and the third direction 16. A plurality of post-exposure bake chambers 670 may be provided and arranged in layers along the third direction 16. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in each of the first direction 12 and the third direction 16.

[0061] The interface module 700 transfers substrates W between the processing modules 600 before and after exposure. The interface module 700 includes a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are positioned within the frame 710. The first buffer 720 and the second buffer 730 are disposed to be stacked on top of each other with a certain distance between them. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is disposed at a height corresponding to the pre-treatment module 601, and the second buffer 730 is disposed at a height corresponding to the post-treatment module 602. When viewed from above, the first buffer 720 is disposed in a line with the transfer chamber 630 of the pre-treatment module 601 along the first direction 12, and the second buffer 730 is disposed in a line with the transfer chamber 630 of the post-treatment module 602 along the first direction 12.

[0062] In one embodiment of the present invention, a substrate alignment device 800 is provided in the coating and developing module 400 in the equipment configured as above.

[0063] As shown in FIGS. 7A and 7B, the substrate alignment apparatus 800 includes a chamber 810, a support plate 820, and a guide unit 830.

[0064] An opening through which a substrate enters and exits is formed in the chamber 810. The chamber 810 may be provided for each of the coating module 401 and the developing module 402. A support plate 820 is provided inside the chamber 810.

[0065] The guide unit 830 is installed on the support plate 820. A plurality of guide units 830 are provided. The guide units 830 are combined with each other to provide a space within which the substrate W is placed. The guide unit 830 includes an alignment pin 831 and a fixed body 832. The alignment pin 831 aligns the substrate in the correct position. The fixed body 832 has a support surface 832a that supports the edge region of the substrate in the aligned state. The fixed body 832 is fixedly connected to the support plate 820.

[0066] The alignment pin 831 includes an inclined portion 831a and a body portion 831b. The inclined portion 831a is formed in a cone or truncated cone shape with a cross section that becomes wider as it goes downward. The body portion 831b extends downward from the inclined portion 831a to the fixed body 832, and its side is perpendicular to the support plate 820. The height H2 of the body portion 831b is smaller than the thickness H1 of the substrate W. According to one example, the height H2 of the body portion 831b is not smaller than ½ of the thickness H1 of the substrate W. For example, the height of the body portion may be ½ of the substrate thickness.

[0067] The fixed body 832 includes a support 832a and a support shaft 832b. The support 832a is cylindrical and has a support surface 832c on its upper surface. The support shaft 832b extends from the support 832a and is fixedly connected to the support plate 820.

[0068] When the substrate W is placed between the guide units 830, it is lowered along the inclined portions 831a.

[0069] The transfer of the substrate W between the substrate aligning apparatus 800, the coating chamber 410, the bake chambers 420 and 470, and the developing chamber 460 as configured above is performed by a transfer robot 900 provided in the transfer chambers 430 and 480.

[0070] The transfer robot 900 is provided in the transfer chamber 430. The transfer robot 900 includes a hand 910 and a position detection member 920. The teaching unit 930 corresponds to a controller that sets and controls the transfer position of the transfer robot 900.

[0071] The hand 910 moves the substrate W to a process chamber or to the substrate alignment device 800 .

[0072] FIG. 8 is a diagram showing a hand on which a position detection member is installed, FIG. 9 is a diagram for explaining the position detection member, and FIG. 10 is a diagram showing a sensor detection range of the position detection member.

[0073] 8 to 10, a position detection member 920 is provided on a base unit 902 on which a hand 910 is installed. The position detection member 920 measures the alignment state of the substrate W. The teaching unit 930 receives a signal from the position detection member 920 and determines the alignment state of the substrate W. If the alignment state of the substrate W placed on the hand 920 is poor, the teaching unit 930 controls the transfer robot 900 to transfer the substrate W to the substrate alignment device 800.

[0074] The position detection member 920 detects an end position on the substrate W held by the hand 910. The position detection member 920 is installed on the base part 902. A plurality of position detection members 920 may be provided. As an example, four position detection members 920 may be provided in positions facing each other. In this case, the position detection members 920 can detect four end positions on the substrate W. As an example, the position detection member 920 may be provided as a laser displacement sensor. The four position detection members 920 shown in FIG. 10 may be defined as a first sensor 920-1, a second sensor 920-2, a third sensor 920-3, and a fourth sensor 920-4, respectively.

[0075] The position detection member 920 emits light toward the substrate placed on the hand 910 and measures the degree of misalignment of the substrate based on the area of ​​the detected light. For example, the position detection member 920 may include a light emitting portion 921 and a light receiving portion 922.

[0076] The light emitting unit 921 emits light. The light source emitted from the light emitting unit 921 may be a laser light. Alternatively, the light source of the light emitting unit 921 may be an LED light.

[0077] The light receiving unit 922 receives the light irradiated from the light emitting unit 921. The light receiving unit 922 can measure the position of the substrate W according to the amount of light received. For example, when the substrate W is not present, the amount of light irradiated from the light emitting unit 92 is set as a reference value. Then, when the substrate W is held by the hand 910, if light is irradiated from the light emitting unit 921, the amount of light hidden by the substrate W is removed and the position of the substrate W is measured based on the received light source. The range A1 shown in FIG. 9 and FIG. 10 indicates the sensor detection range of the position detection member. For example, if the size of the substrate is 300 mm, the detection range of the position detection member 920 may be ±4 mm (PCD 308 mm). And, the substrate accommodation range on the hand 910 may be ±6 mm (PCD 312 mm), which is wider than the sensor detection range. Therefore, the substrate can be placed at a position shifted from the sensor detection range on the hand.

[0078] When the position detection member 920 is provided with a laser displacement, the light receiving unit 922 receives a laser beam. Alternatively, when the light emitting unit 921 emits an LED light, the light receiving unit 922 may be provided with a linear image sensor. As an example, the linear image sensor may be any of various linear image sensors such as a CCD (Charge Coupled Device) line sensor, a fiber line sensor, a photoelectric sensor, etc.

[0079] 15 is a flow chart showing a substrate processing method for teaching a substrate on a hand. Referring to FIGS. 10 to 15, a teaching unit 930 receives the positions of the four ends of the substrate W detected by the position detection member 920. The teaching unit 930 detects the center and the degree of deviation of the substrate W using the positions of the four ends of the substrate W. The teaching unit 930 obtains the amount of deviation of the substrate W maintained on the hand 910 using the detected center of the substrate W, and transports the substrate W based on this amount.

[0080] The teaching unit 930 uses the position detection member 920 to measure the positional deviation of the substrate placed on the hand 910, and if the alignment state of the substrate exceeds the sensor detection range, corrects the transport position of the hand 910 before the substrate placed on the hand 910 is seated on the substrate alignment unit.

[0081] The teaching unit 930 can determine the direction of deviation of the substrate by using the measurement value of the position detection member. For example, the teaching unit 930 can confirm the direction of deviation of the substrate by using a non-detecting position sensor that is out of the sensor detection range among the four position detection members.

[0082] 11, when the first sensor 920-1 and the fourth sensor 920-4 detect the substrate and the second and third sensors 920-2 and 920-3 do not detect the substrate, the teaching unit 930 can determine that the substrate has shifted beyond the sensor detection range in the 12 o'clock direction (0°). For reference, the first sensor 920-1 and the fourth sensor 920-4 can receive a relatively smaller amount of light (e.g., 50%) than the amount of light received when the substrate is in the normal position, and the second sensor 920-2 and the third sensor 920-3 can receive 100% of the total amount of light emitted from the light emitting unit at the light receiving unit.

[0083] 12, when the first sensor 920-1, the third sensor 920-3, and the fourth sensor 920-4 detect the substrate, and the second sensor 920-2 does not detect the substrate, the teaching unit 930 can determine that the substrate has shifted beyond the sensor detection range in the direction between 10 o'clock and 11 o'clock (315°). For reference, the fourth sensor 920-4 receives a relatively smaller amount of light (e.g., 50%) than the amount of light received when the substrate is in the normal position, and conversely, the second sensor 920-2 receives the entire amount of light (100%) emitted from the light emitter at the light receiver since the substrate has shifted beyond the sensor detection range and there is no light shaded by the substrate.

[0084] FIG. 13 is a table showing the direction of deviation of the substrate through the non-detecting sensor that is out of the sensor detection range of the position detection member.

[0085] As shown in FIG. 13, the teaching unit 930 determines the direction of deviation of the substrate by using the measurement value of the position detection member 920 .

[0086] When the deviation direction of the substrate is determined in the above manner, the teaching unit 930 offsets the position of the hand by a preset interval in the opposite direction to the deviation direction of the substrate. Here, the preset interval (offset movement distance) may correspond to the sensing range of the position detection member 920 that measures the alignment state of the substrate placed on the hand. For example, if the sensing range of the position detection member 920 is ±4 mm (PCD 308 mm), the position of the hand 910 is offset by about 4 mm in the deviation direction (for reference, the substrate accommodation range on the hand 910 is ±6 mm (PCD 312 mm) which is wider than the sensor sensing range).

[0087] When the substrate is lowered onto the substrate alignment device 800 with the hand offset by 4 mm, the substrate can be aligned stably within the accommodation range (same as the sensor detection range) of the substrate alignment device. If the substrate is brought from the substrate alignment device with the hand in its original position before the offset, the substrate will be located within the detection range of the position detection member.

[0088] If the offset of the hand by the teaching unit is omitted as shown in Figure 1, the substrate is out of the accommodation range of the substrate alignment device and substrate alignment is not possible. If the substrate placed on the hand is out of the sensor detection range and the substrate alignment device can align the substrate, it is possible to do so by designing the alignment pins to be larger as shown in Figure 2. However, if the size of the alignment pins is increased, the size (height) of the substrate alignment device also increases, which is disadvantageous for the stacked structure.

[0089] 14A to 14C are diagrams showing various types of substrate alignment devices.

[0090] Fig. 14A shows a typical triangular pyramid shaped alignment pin, Fig. 14B shows a cone shaped alignment pin, and Fig. 14C shows a typical support pin shape. In Fig. 14C, the substrate is placed on the support pin 839 in a provisionally corrected state through the offset operation of the hand 910, and then the hand 910 picks up the substrate again at the position before the offset operation. Therefore, the substrate on the hand 910 is positioned within the sensor detection range, so the substrate can be transported using a typical teaching method.

[0091] The substrate alignment apparatus, substrate processing apparatus, and substrate processing method according to an embodiment of the present invention have been described in detail above. However, the present invention is not limited to the above examples and can be applied to all apparatuses that process substrates W. In particular, the guide unit 830 included in an embodiment of the present invention can be applied to a liquid processing chamber that supplies liquid to the substrate W to process the substrate W, and a bake chamber that heats the substrate W. [Explanation of symbols]

[0092] 800 Substrate Alignment Device 810 Chamber 820 Support plate 830 Guide unit 831 Alignment pin 831a Slope 900 Transport Robot 910 Hand 920 Position detection member 930 Teaching Unit

Claims

1. A method for processing a substrate, comprising: a measuring step of measuring an alignment state of a substrate placed on a hand of a transport unit that transports the substrate; if the alignment state of the substrate is not good, the transfer unit transfers the substrate to a substrate alignment unit for aligning the substrate; aligning a position of the substrate by the substrate alignment unit; The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; if the alignment state of the substrate exceeds a sensor detection range in the measuring step, a provisional correction step of provisionally correcting a position of the hand before loading the substrate into the substrate alignment unit so that the substrate placed on the hand can be transported between the alignment pins, The provisional correction step includes: a direction determination step of determining a direction of deviation of the substrate using the measurement value of the measurement step; and offsetting the position of the hand by a preset interval in a direction opposite to the shift direction of the substrate, The measuring step includes: A substrate processing method in which four sensors provided on a base portion on which the hand is installed detect four edge positions on the substrate.

2. A method for processing a substrate, comprising: a measuring step of measuring an alignment state of a substrate placed on a hand of a transport unit that transports the substrate; if the alignment state of the substrate is not good, the transfer unit transfers the substrate to a substrate alignment unit for aligning the substrate; aligning a position of the substrate by the substrate alignment unit; The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; if the alignment state of the substrate exceeds a sensor detection range in the measuring step, a provisional correction step of provisionally correcting a position of the hand before loading the substrate into the substrate alignment unit so that the substrate placed on the hand can be transported between the alignment pins, The provisional correction step includes: a direction determination step of determining a direction of deviation of the substrate using the measurement value of the measurement step; and offsetting the position of the hand by a preset interval in a direction opposite to the shift direction of the substrate, The preset interval is: The substrate processing method further comprises providing a sensing range of a sensor on the base on which the hand is installed, the sensing range corresponding to a sensing range of a sensor for measuring an alignment state of the substrate.

3. 2. The method of claim 1, wherein the sensor emits light toward the substrate placed on the hand and measures the degree of misalignment of the substrate based on an area of ​​the detected light.

4. A method for processing a substrate, comprising: a measuring step of measuring an alignment state of a substrate placed on a hand of a transport unit that transports the substrate; if the alignment of the substrate is poor, the transfer unit transfers the substrate to a substrate alignment unit; aligning a position of the substrate by the substrate alignment unit; The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; if the alignment state of the substrate exceeds a sensor detection range in the measuring step, a provisional correction step of provisionally correcting a position of the hand before loading the substrate into the substrate alignment unit so that the substrate placed on the hand can be transported between the alignment pins, The provisional correction step includes: a direction determination step of determining a direction of deviation of the substrate using the measurement value of the measurement step; and offsetting the position of the hand by a preset interval in a direction opposite to the shift direction of the substrate, The measuring step includes: four sensors provided on a base on which the hand is installed detect four edge positions on the substrate; The direction determination step includes: The method of the present invention verifies the direction of deviation of the substrate through a sensor that does not detect the substrate due to being outside the sensor detection range among the four sensors.

5. A substrate processing apparatus, comprising: a substrate alignment unit for aligning the substrate; a transport unit that has a hand on which a substrate is placed and a position sensor that measures a position of the substrate on the hand, and transports the substrate to the substrate alignment unit; a teaching unit that sets a transfer position at which the substrate is transferred onto the substrate alignment unit by the transfer unit, The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; The teaching unit includes: measuring a positional deviation of the substrate placed on the hand using the position sensor, and if an alignment state of the substrate exceeds a sensor detection range of the position sensor, correcting a transfer position of the hand so that the substrate placed on the hand can be transferred between the alignment pins before seating the substrate placed on the hand on the substrate alignment unit; The teaching unit includes: determining a direction of displacement of the substrate using measurements from the position sensor; The substrate processing apparatus includes four position sensors provided on a base portion on which the hand is installed, and which detect four edge positions on the substrate.

6. A substrate processing apparatus, comprising: a substrate alignment unit for aligning the substrate; a transport unit that has a hand on which a substrate is placed and a position sensor that measures a position of the substrate on the hand, and transports the substrate to the substrate alignment unit; a teaching unit that sets a transfer position at which the substrate is transferred onto the substrate alignment unit by the transfer unit, The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; The teaching unit includes: measuring a positional deviation of the substrate placed on the hand using the position sensor, and if an alignment state of the substrate exceeds a sensor detection range of the position sensor, correcting a transfer position of the hand so that the substrate placed on the hand can be transferred between the alignment pins before seating the substrate placed on the hand on the substrate alignment unit; The teaching unit includes: determining a direction of displacement of the substrate using measurements from the position sensor; four position sensors provided on a base on which the hand is installed detect four edge positions on the substrate; Among the four position sensors A substrate processing apparatus that checks the direction of substrate misalignment through a position sensor that does not detect a substrate due to being outside the sensor detection range.

7. The teaching unit includes: The substrate processing apparatus according to claim 6 , wherein the transport position of the hand is offset by a preset interval in a direction opposite to the direction of deviation of the substrate.

8. The preset interval is: The substrate processing apparatus of claim 7 , wherein the detection range of the position sensor corresponds to the detection range of the position sensor.

9. The alignment pin is The substrate processing apparatus according to claim 5, further comprising a cone-shaped or truncated cone-shaped inclined portion provided so that the cross section becomes wider toward the bottom.

10. A method for processing a substrate, comprising: A method for processing a substrate using a substrate processing apparatus having a transfer chamber provided with a transfer robot for transferring a substrate, a plurality of process chambers provided at a side of the transfer chamber for processing a substrate, and a substrate alignment unit provided at the side of the transfer chamber, a measuring step for measuring an alignment state of the substrate placed on the hand of the transport robot; if the alignment state of the substrate is not good, the transfer robot transfers the substrate to a substrate alignment unit for aligning the substrate, and aligns the substrate; The substrate alignment unit includes: A support plate; a plurality of alignment pins coupled to an upper surface of the support plate for aligning a position of the substrate; if the alignment state of the substrate exceeds a substrate accommodation range of the substrate alignment unit in the measuring step, provisionally correcting a position of the hand before loading the substrate onto the substrate alignment unit so that the substrate placed on the hand can be transported between the alignment pins, The step of provisionally correcting includes: a direction determination step of determining a direction of deviation of the substrate using the measurement value of the measurement step; and offsetting the position of the hand by a preset interval in a direction opposite to the shift direction of the substrate, The measuring step includes: A substrate processing method in which four sensors provided on a base portion on which the hand is installed detect four edge positions on the substrate.

11. A method for processing a substrate, comprising: A method for processing a substrate using a substrate processing apparatus having a transfer chamber provided with a transfer robot for transferring a substrate, a plurality of process chambers provided at a side of the transfer chamber for processing a substrate, and a substrate alignment unit provided at the side of the transfer chamber, a measuring step for measuring an alignment state of the substrate placed on the hand of the transport robot; if the alignment state of the substrate is not good, the transfer robot transfers the substrate to a substrate alignment unit to align the substrate, if the alignment state of the substrate exceeds a substrate accommodation range of the substrate alignment unit in the measuring step, provisionally correcting a position of the substrate before loading the substrate into the substrate alignment unit; The step of provisionally correcting the position of the substrate includes: a direction determining step of determining a direction of deviation of the substrate using a measurement value of a position sensor provided on a base on which the hand is installed; The direction determination step includes: The method further comprises: determining a direction of deviation of the substrate through one of the position sensors that does not detect the substrate due to being outside a sensor detection range.

12. The step of provisionally correcting the position of the substrate includes:

12. The method of claim 11, further comprising: offsetting the position of the hand by a preset interval in a direction opposite to the direction of deviation of the substrate.

13. The preset interval is: The method of claim 12, wherein the hand is provided on the base, the hand being provided with a sensing range corresponding to a sensing range of a sensor for measuring an alignment state of the substrate.

14. The measuring step includes: The substrate processing method according to claim 11 , wherein four sensors provided on a base portion on which the hand is placed detect four edge positions on the substrate.

15. 13. The method of claim 12, wherein a position sensor provided on a base on which the hand is installed emits light toward the substrate placed on the hand and measures the degree of misalignment of the substrate based on an area of ​​the detected light.

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