Component mounting device and component mounting method

Abstract

To provide a component mounting apparatus and a component mounting method, capable of improving recognition accuracy of components based on images by widely securing a dynamic range of multiple images, shortening time required for component recognition, and improving component mounting efficiency.SOLUTION: A component mounting apparatus includes: an image capturing unit including an illumination unit that illuminates a component retained by a head and capturing the components from below; and an image capturing control unit that controls illumination conditions including information on image capturing by the image capturing unit, and brightness of illumination by the illumination unit at the time of the image capturing. The image capturing control unit obtains a first image by turning on the illumination unit under a first illumination condition and causing the image capturing unit to perform image capturing at a first timing when the component is moving above the image capturing unit; and obtains a second image by turning on the illumination unit under a second illumination condition and causing the image capturing unit to perform image capturing at a second timing when the component is moving above the image capturing unit. The component recognition unit recognizes the component on the basis of the first image and the second image.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] In a semiconductor or other substrate manufacturing factory, multiple mounting substrate production lines are provided, and multiple component mounting devices are arranged on each mounting substrate production line. Each component mounting device mounts electronic components or other components at positions on the substrate where solder paste has been printed. In recent years, in order to increase the productivity of substrate manufacturing factories, there has been a demand for improving the operating efficiency of these component mounting devices.

[0003] A conventional component mounting device known in the art is a component recognition device for a component mounting device that has a nozzle mounted on a moving head, and that illuminates an electronic component held by the nozzle with an illumination unit and then captures an image of the electronic component with a component recognition camera to perform image recognition (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-94299 A Summary of the Invention [Problem to be solved by the invention]

[0005] It is assumed that the illumination unit disclosed in Patent Document 1 is used to capture and recognize a component picked up by a nozzle mounted on a moving head while moving (scanning) above the component recognition camera. In this case, multiple images need to be acquired in order to recognize each of the different states or postures of the component. Also, in order to acquire multiple images, the component needs to be moved at least twice above the component recognition camera. Therefore, it takes time to recognize the component.

[0006] Furthermore, in order to recognize different states or postures of a part using multiple captured images, different pixel brightness values ​​are required for the multiple images, so a wide range of pixel brightness values ​​(dynamic range) is required across the multiple images.

[0007] The present disclosure provides a component mounting device and a component mounting method that can improve the accuracy of image-based component recognition by ensuring a wide dynamic range of multiple images, shorten the time required for component recognition, and improve component mounting efficiency. [Means for solving the problem]

[0008] According to one aspect of the present disclosure, a lighting unit is provided that illuminates a component held by a head, and the component is illuminated from below. Within the imaging range that includes the entire part an imaging control unit that controls imaging by the imaging unit and lighting conditions including information on brightness of lighting by the lighting unit at the time of imaging; a component recognition unit that recognizes the component from the image captured by the imaging unit; and a component mounting unit that mounts the component on a board with the head based on a recognition result by the component recognition unit, wherein the imaging control unit turns on the lighting unit under a first lighting condition and causes the imaging unit to capture an image at a first timing when the component is moving above the imaging unit. Including the whole of the above parts A first image is acquired, and the illumination unit is turned on at a second timing when the part is moving above the imaging unit. Different from the first lighting condition By lighting the device under a second illumination condition and causing the imaging unit to capture an image, Including the whole of the above parts A second image is acquired, and the component recognition unit recognizes the component based on the first image and the second image.

[0009] According to one aspect of the present disclosure, a lighting condition including information on the brightness of lighting when an image is captured by a lighting unit that illuminates a part held by a head is controlled, and the part held by the head is photographed from below. Within the imaging range that includes the entire partThe method includes a step of controlling imaging by an imaging unit that captures an image, a step of recognizing the component from an image captured by the imaging unit, and a step of mounting the component on a board by the head based on a result of the component recognition, wherein the step of controlling imaging includes turning on the illumination unit under a first illumination condition and causing the imaging unit to capture an image at a first timing when the component is moving above the imaging unit. Including the whole of the above parts A step of acquiring a first image and turning on the illumination unit at a second timing when the part is moving above the imaging unit. Different from the first lighting condition By lighting the device under a second illumination condition and causing the imaging unit to capture an image, Including the whole of the above parts and acquiring a second image, wherein the step of recognizing the component includes a step of recognizing the component based on the first image and the second image. Effect of the Invention

[0010] According to the present disclosure, by ensuring a wide dynamic range for multiple images, it is possible to improve the accuracy of image-based component recognition, shorten the time required for component recognition, and improve component mounting efficiency. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a top view illustrating a mechanical configuration of a component mounting device according to a first embodiment; [Diagram 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device shown in FIG. [Diagram 3] FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. [Figure 4] FIG. 3 is a side view illustrating a mechanical configuration of the part recognition camera shown in FIG. [Diagram 5] FIG. 5 is a perspective view illustrating a mechanical configuration of the lighting unit shown in FIG. [Figure 6] FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device shown in FIG. [Figure 7]FIG. 2 is a schematic diagram illustrating an example of an arrangement of nozzles for mounting components and imaging timings under various lighting conditions when imaging components mounted on the nozzles; [Figure 8A] Graph showing an example of workpiece reflectance and image brightness for each portion of a part when illuminated and imaged with an illumination value of 50. [Figure 8B] Graph showing an example of workpiece reflectance and image brightness for each portion of a part when illuminated and imaged with an illumination value of 150. [Figure 9] A table showing examples of lighting conditions for a part that is imaged multiple times. [Figure 10A] FIG. 1 is an image diagram illustrating an example of an image of a component captured under illumination conditions for alignment; [Figure 10B] FIG. 1 is an image diagram illustrating an example of an image of a part captured under lighting conditions for character recognition. [Figure 11] 1 is a flowchart illustrating an example of an operation of a component mounting device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters or duplicate explanation of substantially the same configuration may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0013] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0014] <Mechanical configuration of the component mounting device> First, the mechanical configuration of the component mounting device 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to the first embodiment. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Fig. 1. In Fig. 1 and Fig. 2, the front side of the component mounting device 1 (the lower side on the paper surface of Fig. 1 and the left side on the paper surface of Fig. 2) is also referred to as the front side, and the back side of the component mounting device 1 (the upper side on the paper surface of Fig. 1 and the right side on the paper surface of Fig. 2) is also referred to as the rear side.

[0015] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W to manufacture the board, and mount the components P in a predetermined position and attitude on the board W transported from upstream of the mounting board manufacturing line.

[0016] As shown in Figs. 1 and 2, the component mounting apparatus 1 includes a main body mechanism unit 10 (an example of a component mounting unit) that mounts components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, and capacitors, lead components, chip components, or BGA (Ball Grid Array) components) on a board W mainly through the operation of each component mechanism, and a control unit 40 that controls the operation of the main body mechanism unit 10. The main body mechanism unit 10 includes a mounting machine main body 11 including a base 12, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0017] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0018] A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

[0019] The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its underside, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20. A reel 21 is housed in each of the plurality of reel stock units. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where pick-up is performed by a moving head 26 of a head unit 23 described below.

[0020] Head unit 23 is disposed above base 12, and configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is capable of linear movement along the X and Y directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0021] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0022] A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to the moving head 26 while picking up and holding a component P from the component supply mechanism 15 moves and passes above the component recognition camera 28. At this time, the component recognition camera 28 images the component P sucked and held by the component holding nozzle 27 passing by it multiple times at a predetermined timing and under predetermined lighting conditions (see below). In other words, the component recognition camera 28 images the component P held by the component holding nozzle 27, and while the lighting conditions are changed multiple times by the control unit 40 while the component P is moving above it, the component recognition camera 28 continuously images the component P at a timing corresponding to each of the lighting conditions (see below). Each of these imaging results is integrated and subjected to a recognition process, whereby the identification and position detection of the component P are performed with high accuracy.

[0023] Furthermore, a nozzle holder 38 and a waste box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P and the like determined to be defective as a result of image capture by the component recognition camera 28 are discarded.

[0024] <About the configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0025] The moving head 26 is a multiple head having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each moving head 26 (see FIG. 7). For example, the moving head 26 is provided with a plurality of component holding nozzles 27 (e.g., eight nozzles) in a plurality of rows (e.g., two rows). In addition, a reflector (an example of a first reflector) (not shown) is fixed to the moving head 26 for reflecting illumination light emitted from a transmitted illumination unit 34 (see below). The reflector is disposed above the held component P.

[0026] Each of the component holding nozzles 27 vacuum-sucks and holds a component P from the tape feeder 18 of the component supply mechanism 15, for example, by using air pressure, and moves up and down individually. The moving head 26 further includes a Z-axis lifting mechanism (not shown) for individually lifting and lowering each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) for individually rotating each of the component holding nozzles 27 about the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). By this movement, the moving head 26 sucks up the component P with the component holding nozzle 27 from the take-out position of the tape feeder 18 of the component supply mechanism 15 and takes it out.

[0027] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image capture result (image capture information) is similarly subjected to recognition processing to detect the position and posture of the board W.

[0028] As a result of detecting the position of the board W, the moving head 26 places the components P at their respective mounting points (e.g., the mounting positions and mounting orientations on the board W where the components P are to be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This mounting of the components P at one time is continued until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

[0029] The component mounting device 1 repeatedly executes a series of operations of picking up and mounting multiple components P using the component holding nozzle 27 of the moving head 26, and then moving the moving head 26 back to the pick-up position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in cooperation with each other, and this cooperative operation is executed in accordance with instructions from the control unit 40.

[0030] In the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position and the subsequent return movement to the removal position is also referred to as a work unit of "one turn." The forward movement from the removal position to the mounting work position in one turn is also referred to simply as "forward movement in one turn" below.

[0031] <About the configuration of the parts recognition camera> Next, the configuration of the component recognition camera 28 will be described with reference to Figures 4 and 5. Figure 4 is a side view illustrating an example of the mechanical configuration of the component recognition camera 28 shown in Figure 2. Figure 5 is a perspective view illustrating an example of the mechanical configuration of the lighting unit section 31 shown in Figure 4. For ease of explanation, Figure 4 also illustrates the moving head 26 that moves above the component recognition camera 28 and on its optical axis, and also illustrates a schematic diagram of the internal structure of the lighting section of the component recognition camera 28, as described below.

[0032] 4, the component recognition camera 28 has an image sensor section 29 and an illumination unit section 31. In just one turn of the component recognition camera 28 (i.e., a one-way outward movement), the illumination unit section 31 is turned on multiple times for the component P held by the moving head 26, and the image sensor section 29 continuously captures images from below in accordance with each of the timings.

[0033] The component recognition camera 28 can capture images according to a scan imaging method and has a region of interest (ROI) function using an area sensor. The component recognition camera 28 can capture images by setting the ROI range of the image sensor unit 29 to multiple locations (for example, two locations) using the ROI function and switching between the multiple locations continuously.

[0034] The imaging sensor unit 29 has a substantially cylindrical housing 30 and an imaging element (not shown) built into the housing 30. The imaging element is, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The imaging sensor unit 29 has a shutter function and is configured to be able to capture an image by exposing the image at a predetermined timing according to a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the result of imaging by the imaging element (imaging information) to the control unit 40.

[0035] Furthermore, the component recognition camera 28 has a center camera 29A and a side camera 29B as the imaging sensor unit 29. The center camera 29A is disposed so that its optical axis is along the vertical direction (Z direction) and is capable of capturing an image of the component P moving above the component recognition camera 28. The side cameras 29B are disposed on both sides of the center camera 29A in the horizontal direction and are disposed so that their optical axes are inclined with respect to the vertical direction (Z direction) and are capable of capturing an image of the component P moving above the component recognition camera 28.

[0036] The lighting unit section 31 has a box-shaped housing 32, and is arranged in a stacked and connected state on the upper side of the housing 30 of the imaging sensor section 29. The lighting unit section 31 has a plurality of reflective lighting sections 33, a plurality of transmitted lighting sections 34, a plurality of side lighting sections 35, and a coaxial lighting section 39, which are respectively arranged inside the housing 32. By appropriately using the plurality of reflective lighting sections 33, the plurality of transmitted lighting sections 34, the plurality of side lighting sections 35, and the coaxial lighting section 39, the component mounting device 1 lights up the moving component P under a plurality of lighting conditions and captures an image of the component P.

[0037] Each of the multiple reflective illumination sections 33 is disposed approximately parallel to the bottom wall 32p (i.e., the XY plane, horizontal plane) of the housing 32 of the illumination unit section 31, and the illumination direction is set along the optical axis of the center camera 29A. When the reflective illumination section 33 is turned on, the illumination light is emitted approximately along the vertical direction (approximately the Z direction). Between the reflective illumination section 33 and the component holding nozzle 27 that holds the component P to be illuminated, a transmission glass G is disposed along the horizontal direction. Reflective illumination is also called oblique illumination.

[0038] The component P held by the component holding nozzle 27 is illuminated by the reflective illumination unit 33 at time t1 when the component P moves above the component recognition camera 28, and the light passes through the transmission glass G to illuminate the underside of the component P. At the same time as this timing t1, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0039] Each of the multiple transillumination units 34 is disposed obliquely with respect to the bottom wall 32p and side wall 32q (i.e., Z direction) of the housing 32, and the irradiation direction is set obliquely with respect to the optical axis of the center camera 29A. A shielding plate B is disposed between each of the reflective illumination units 33 and the transillumination units 34. The shielding plate B is also disposed obliquely with respect to both the bottom wall 32p and side wall 32q of the housing 32.

[0040] When the transmitted illumination unit 34 is turned on, the illumination light is emitted obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). At time t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the transmitted illumination unit 34 turns on the reflector of the moving head 26, thereby illuminating the component P. In response to this turning-on time t2, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0041] Each of the side lighting sections 35 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and the illumination direction is perpendicular to the optical axis of the center camera 29A. The side lighting sections 35 are disposed above the reflective illumination section 33 and the transmitted illumination section 34. When the side lighting section 35 is turned on, the illumination light is emitted along a horizontal plane.

[0042] The component P held by the component holding nozzle 27 is turned on by the side illumination unit 35 at time t3 when the component P moves above the component recognition camera 28, to illuminate the sides of the component P. At the time t3 when the component P is turned on, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0043] The coaxial lighting section 39 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and its irradiation direction is perpendicular to the optical axis of the center camera 29A. The coaxial lighting section 39 is disposed below the reflective lighting section 33. When the coaxial lighting section 39 is turned on, the illumination light is irradiated along a horizontal plane. In addition, the component recognition camera 28 is provided with a reflector C (e.g., a mirror) (an example of a second reflector) at a position separated from the coaxial lighting section 39 in the XY plane. The coaxial lighting section 39 turns on the reflector C to illuminate the area above the reflector C.

[0044] At time t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the coaxial illumination unit 39 lights up the reflector C, which illuminates the underside of the component P through the transmission glass G. At the same time as this lighting is turned on at time t4, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0045] The illumination timings t1 to t4 by each illumination unit are any of a plurality of image capture timings within the time of the forward movement in one turn. Furthermore, the illumination timings by each illumination unit may overlap, and a plurality of illumination units may be turned on simultaneously to illuminate the component P.

[0046] The component recognition camera 28 detects a plurality of types of images by switching the illumination conditions and turning on the camera and capturing images at each of a plurality of capture timings while the component P is moving above it in accordance with instructions from the control unit 40.

[0047] As shown in FIG. 5, in the lighting unit section 31, a plurality of side lighting sections 35 are arranged in a circular ring shape along the horizontal direction. A plurality of reflective lighting sections 33 are arranged on the negative side of the side lighting sections 35 in the Z direction. The central section surrounded by the plurality of reflective lighting sections 33 is a space where no illumination is present. A plurality of transmitted lighting sections 34 are arranged on the outer side (opposite side of the central section) of the plurality of reflective lighting sections 33. A coaxial lighting section 39 and a reflector C are arranged on the negative side of the reflective lighting sections 33 in the Z direction. The light irradiated by the coaxial lighting section 39 is reflected by the reflector C, passes through the central section surrounded by the plurality of reflective lighting sections 33, and travels to the positive side of the Z direction.

[0048] <Software configuration of component placement device> Next, a software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to the drawing. Fig. 6 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

[0049] The control unit 40 of the component mounting device 1 is configured by a general-purpose computer, and a program as software stored and held in a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory) of the computer is executed by an arithmetic unit such as a CPU (Central Processing Unit). That is, each block shown in the control unit 40 in Fig. 6 represents a function realized by software such as a program. However, the function represented by each block is not limited to software, and each may be configured by hardware as a physical configuration of an "apparatus."

[0050] The control unit 40 includes a storage unit 41, a mechanism driving unit 46, and an image processing unit 47. The mechanism driving unit 46 controls the main body mechanism unit 10, and controls the driving of, for example, the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in coordination with one another.

[0051] The storage unit 41 stores and holds at least mounting information 42, component information 43, illumination condition information 44, and imaging timing information 45. The mounting information 42 stores information such as the type of component P to be mounted on each board W, and the mounting position and mounting posture of the component P on the board W. The component information 43 stores information such as the external shape of each type of component P, and the presence or absence of electrodes and the number of electrodes.

[0052] The lighting condition information 44 stores information on the lighting conditions when the component P is imaged. The lighting condition information 44 may include information on the brightness of each lighting channel formed for each lighting unit (e.g., lighting value). The lighting value corresponds to, for example, the current value flowing through each lighting (e.g., LED) of each lighting channel, and is a value that indicates the level of LED current, and is also called a lamp value. The lighting value may take any value within a range of, for example, 0 to 255. The lighting condition information 44 may include information indicating whether each lighting channel is turned on or off (i.e., whether it is turned on or off). The information indicating whether each lighting channel is turned on or off may include information on a combination of multiple lighting channels to be turned on.

[0053] Furthermore, the lighting condition information 44 may include information on the overall brightness of the lighting by the lighting unit section 31, rather than information on the brightness of each lighting channel. In other words, the lighting value may correspond to a value indicating the overall brightness of the lighting by the lighting unit section 31, rather than the individual brightness of each lighting channel, for example.

[0054] Each illumination channel may include a reflected illumination channel, a transmitted illumination channel, a side illumination channel, and a coaxial illumination channel. The reflected illumination channel is an illumination channel formed by one or more reflected illumination units 33. The transmitted illumination channel is an illumination channel formed by one or more transmitted illumination units 34. The side illumination channel is an illumination channel formed by one or more side illumination units 35. The coaxial illumination channel is an illumination channel formed by a coaxial illumination unit 39. Each illumination channel has a different illumination unit used for illumination, a different illumination direction, etc., i.e., a different illumination method.

[0055] The lighting and extinguishing of a lighting channel may be indicated by the lighting value of the lighting channel. For example, a lighting value of 0 may indicate the lighting channel, and a lighting value of any value between 1 and 255 may indicate that the lighting channel is turned on. When switching lighting conditions, if the lighting channel to be turned on is switched, it is not necessary to switch the lighting value of each lighting channel. Also, when switching lighting conditions, if the lighting value is switched, it is not necessary to switch the lighting channel to be turned on.

[0056] The imaging timing information 45 stores information about imaging timing (shutter timing) for imaging the part P multiple times. The imaging timing information 45 may store information about timing of turning on the light and capturing images with the camera multiple times during one turn of forward movement (also simply referred to as imaging timing).

[0057] The imaging processing unit 47 includes a camera control unit 48 and a part recognition unit 50 .

[0058] The camera control unit 48 controls the imaging by the imaging sensor unit 29 of the part recognition camera 28 and the lighting conditions by the lighting unit unit 31 at the time of imaging. For example, the camera control unit 48 reads the lighting condition information 44 and the imaging timing information 45 from the storage unit 41, and captures a plurality of images by illuminating the part P held by the head unit 23 under a plurality of lighting conditions corresponding to the purpose of imaging the part P or the type of the part P, at a plurality of imaging timings according to the imaging timing information 45.

[0059] As a specific example, in one turn of forward movement, the camera control unit 48 turns on the lighting unit 31 under lighting conditions LA at the image capturing timing TA when the component P is moving above the component recognition camera 28, and captures an image G1 (see FIG. 10A, described later, for example) showing the component P. Similarly, in one turn of forward movement, the camera control unit 48 turns on the lighting unit 31 under lighting conditions LB at the next image capturing timing TB immediately (after a very short time) after the image capturing timing TA, and captures an image G2 (see FIG. 10B, described later, for example) showing the same component P. Note that various lighting conditions may be applied depending on the type or use of the component P, and are set before the component mounting device 1 actually starts operation. The captured images G1 and G2 are transmitted to the component recognition unit 50.

[0060] Based on the multiple acquired images (e.g., images G1 and G2), the component recognition unit 50 recognizes each feature of the component P held by the component holding nozzle 27. The features of the component P may include, for example, the position of the component P, the orientation of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, or characters added to the component P. Based on the recognition result by the component recognition unit 50, the head unit 23 mounts the component P on the board W at a predetermined position and orientation with its moving head 26.

[0061] The polarity of a component P indicates the front and back of the component P. For example, the polarity (front and back) may be indicated by chamfering a predetermined portion of the component P (for example, one of the four corners (for example, the lower left corner)). For example, the component P is mounted so that a chamfer is present at a predetermined portion. Furthermore, the polarity may be determined based on whether or not there is a character in the center of the component P, along with the chamfering at the predetermined portion.

[0062] In addition, the imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47, which, like the component recognition unit 50, recognizes the position and posture of the board W from the imaging information (image) and transmits the recognition result to the mechanism driving unit 46.

[0063] FIG. 7 is a schematic diagram illustrating an example of an arrangement of the component holding nozzles 27 that mount the components P, and imaging timings under various illumination conditions when imaging the components P mounted on the component holding nozzles 27. In FIG.

[0064] Each moving head 26 has eight component holding nozzles 27 capable of holding components P arranged in two rows along the component movement direction A. Note that two rows and eight nozzles are merely examples, and other multiple number of rows and multiple numbers may be used. The position of the component recognition camera 28 is fixed. As the moving head 26 moves, the image sensor unit 29 sequentially captures images of each component P held by the two rows of component holding nozzles 27. In this case, two components P held by two component holding nozzles 27 at the same position along the movement direction A in each row (for example, the first nozzle position, the second nozzle position, ... from the right in FIG. 7) are simultaneously captured. In other words, these two components P are simultaneously included in the image capture range of the image sensor unit 29. A plurality of component holding nozzles 27 at the same position along the movement direction A in each row is also referred to as a "nozzle set." The moving head 26 illustrated in FIG. 7 has eight nozzle sets.

[0065] The imaging sensor unit 29, under the control of the camera control unit 48, performs a first imaging of the component P under the illumination condition LA at the imaging timing TA during the forward movement in one turn, and performs a second imaging of the component P under the illumination condition LB at the next imaging timing TB immediately (after a very short time) after the imaging timing TA. In FIG. 7, the imaging range of the first imaging is indicated by the imaging range CA, and the imaging range of the second imaging is indicated by the imaging range CB. That is, the imaging sensor unit 29 images almost the same location twice. Note that the imaging ranges CA and CB have the same shape and size. In this way, the component mounting device 1 can obtain images of the subject (component P) illuminated under two illumination conditions in one scan (forward movement in one turn) by suppressing a decrease in the moving speed of the moving head 26 due to imaging, and can improve the image recognition accuracy based on the images.

[0066] Next, the workpiece reflectance and image brightness when illuminated and imaged under each illumination condition will be described. The workpiece reflectance is the reflectance of each workpiece (for example, the mold or electrode in the part P). The workpiece reflectance differs according to the characteristics of each workpiece. For example, a workpiece made of a metal material or the like has a high workpiece reflectance, and a workpiece made of a resin material or the like has a low reflectance. The image brightness corresponds to the pixel value of the captured image, and is represented by a value of 0 to 255, for example.

[0067] 8A is a graph illustrating the work reflectance and image brightness of each portion of a part when the part is illuminated and imaged with an illumination value of 50. The illumination value of 50 here is not the individual brightness of each illumination channel, but a value indicating the brightness obtained by the overall illumination by the illumination unit section 31. This illumination value is an example of the illumination condition LA for the first imaging.

[0068] In the case of an illumination value of 50, the electrode portion of the part P has a higher workpiece reflectance than the molded portion. The image brightness of the molded portion is 50, and the image brightness of the electrode portion is 250. That is, the image brightness of the electrode portion is higher than that of the molded portion. That is, the molded portion does not reflect much of the illuminated light, so the image brightness of the captured image is low and close to black. On the other hand, the electrode portion reflects a lot of the illuminated light, so the image brightness of the captured image is high and close to white. Therefore, in an image illuminated with an illumination value of 50, only the electrode portion is very bright, and it can be said to be an image suitable for checking the alignment based on the arrangement of the electrode portion. The alignment here refers to the arrangement of one or more electrodes in the part P.

[0069] 8B is a graph illustrating the work reflectance and image brightness of each portion of a part when the part is illuminated and imaged with an illumination value of 150. The illumination value of 150 here is not the individual brightness of each illumination channel, but a value indicating the brightness obtained by the overall illumination by the illumination unit section 31. This illumination value is an example of the illumination condition LB for the second imaging.

[0070] In the case of an illumination value of 150, the electrode portion of the part P has a higher workpiece reflectance than the molded portion. In addition, the image brightness of the molded portion is a value of 150, and the image brightness of the electrode portion is a value of 250. That is, the image brightness of the electrode portion is higher than that of the molded portion. In addition, compared to the case of an illumination value of 50, the image brightness of the molded portion is higher, and the image brightness of the molded portion is about the same. Therefore, in an image captured under illumination with an illumination value of 150, the electrode portion is very bright, and the molded portion is also bright. Therefore, for example, the character portion written on the molded portion of the part P is also bright, and it can be said that the image is suitable for character recognition. The control unit 40 can decipher the content of the character by performing image recognition of the character portion based on the captured image, and can trace this part P based on the result of decoding the character of the part P, so that various inspections or traceability, etc., for the part P are possible.

[0071] In this way, in the first exposure, component recognition camera 28 may capture an image G1 at an illumination value that illuminates the electrode portion of the component in order to obtain brightness suitable for component alignment. In the second exposure, component recognition camera 28 may switch the illumination value from the first exposure and capture an image G2 at an illumination value three times the illumination value of the first illumination unit 31 in order to obtain brightness that allows the shading of the molded portion of component P to be distinguished. This allows component mounting device 1 to obtain images with a wide dynamic range from images G1 and G2, and improves the various recognition accuracy of component P based on images G1 and G2.

[0072] Next, a specific example of the lighting conditions taking into account each lighting channel will be described.

[0073] Figure 9 is a table showing specific examples of illumination conditions for a part P that is imaged multiple times. In table T1 of Figure 9, the illumination conditions include information on illumination values ​​for each illumination channel. Illumination channel CH1 is a reflected illumination channel. Illumination channel CH2 is a transmitted illumination channel. Illumination channel CH3 is a side illumination channel. Illumination channel CH4 is a coaxial illumination channel.

[0074] Furthermore, in table T1, combinations of the first imaging of part P and the second imaging of part P are shown as illumination patterns. Table T1 shows illumination patterns 1 to 4. For example, in illumination pattern 1, the first imaging is performed under illumination condition LA, the illumination value of illumination channel CH1 is a value of 100, and the illumination values ​​of the other illumination channels CH2 to CH4 are a value of 0. Furthermore, in illumination pattern 1, the second imaging is performed under illumination condition LB, and the illumination values ​​of each of the illumination channels CH1 to CH4 are all a value of 50.

[0075] In addition, in table T1, the first imaging is performed for the same purpose in all of the illumination patterns 1 to 4, and the illumination condition LA is a fixed condition. The purpose of this image is for alignment. The image for alignment is an image for recognizing the arrangement of electrodes in the component P.

[0076] On the other hand, in table T1, the second imaging is performed with different applications of the images captured with illumination patterns 1 to 4, and the illumination condition LB is variable. For example, the application of the second image captured with illumination pattern 1 is for character recognition. An image for character recognition is an image for recognizing characters attached to component P. The illumination condition LB in this case is as described above.

[0077] For example, the second image captured for illumination pattern 2 is used for polarity discrimination. An image for polarity discrimination is an image for discriminating the polarity indicating the front or back of an electrode pattern. In this case, the illumination condition LB is such that the illumination value of illumination channel CH1 is 100, the illumination value of illumination channel CH2 is 100, the illumination value of illumination channel CH3 is 30, and the illumination value of illumination channel CH4 is 0.

[0078] For example, the second image captured with illumination pattern 3 is used for 3D (three-dimensional) measurement. An image for 3D measurement is an image for measuring the height (length in the thickness direction) of part P. In this case, the illumination condition LB has an illumination value of 50 for illumination channel CH1 and an illumination value of 0 for the other illumination channels CH2 to CH4.

[0079] For example, the second image captured with illumination pattern 4 is used for contour recognition. An image for contour recognition is an image for recognizing the contour (silhouette, for example, mold contour) of part P. In this case, the illumination condition LB is such that the illumination value of illumination channel CH1 is 0, the illumination value of illumination channel CH2 is 90, the illumination value of illumination channel CH3 is 0, and the illumination value of illumination channel CH4 is 10.

[0080] Such illumination conditions at the time of each imaging are stored in the storage unit 41, and are included in, for example, illumination condition information 44. The illumination condition information 44 may be held for each illumination pattern as shown in Fig. 9. Furthermore, the illumination condition information 44 may be held in the storage unit 41 for each purpose of the image captured each time. Note that the illumination condition LA for the first imaging is a variable condition like the illumination condition LB for the second imaging, and imaging may be performed for purposes other than alignment.

[0081] Fig. 10A is an image diagram illustrating an image of a component P captured under illumination conditions LA for alignment. Image G1 in Fig. 10A is an image for alignment obtained by capturing an image under illumination conditions LA of illumination patterns 1 to 4 shown in Fig. 9 or illumination conditions LA as illumination value 50 by the illumination unit section 31 shown in Fig. 8A. Image G1 is obtained by capturing an image for the first time, for example.

[0082] In image G1, a plurality of electrodes 61 are arranged along each edge of a component P having a substantially rectangular shape. In Fig. 10A, the image brightness of each electrode is relatively greater than the image brightness of its surroundings, thereby clearly indicating the arrangement of the electrodes 61. By performing image recognition on image G1, the component recognition unit 50 can easily recognize the alignment of the electrodes 61 on the component P, and can easily mount the component P based on this alignment.

[0083] Fig. 10B is an image diagram illustrating an image of a part P captured under illumination conditions LB for character recognition. Image G2 in Fig. 10B is an image for character recognition obtained by capturing an image under illumination conditions LB of the illumination pattern 1 shown in Fig. 9 or illumination conditions LB with an illumination value of 150 by the illumination unit section 31 shown in Fig. 8B. Image G2 is obtained by capturing an image for the second time, for example.

[0084] In the image G2, a plurality of electrodes 61 are arranged along each edge of the component P having a substantially rectangular shape. In addition, inside the arrangement of the plurality of electrodes 61, a mold 63 to which characters in a character section 62 are added is present. In FIG. 10B, the arrangement of the electrodes 61 is clearly shown, and characters added to the character section 62 of the mold 63 are clearly shown. The component recognition unit 50 is able to extract and recognize characters in the component P by performing image recognition on the image G2. Furthermore, because the characters can be recognized, the traceability of the component P is improved based on the characters even during the manufacture of the component P or after shipment. Therefore, even if the component P is a very expensive component (e.g., a BGA component), the component mounting device 1 can manage the serial rod of this component P and quickly respond when a problem occurs in the market.

[0085] In addition, the electrode 61 is also shown in image G2, but the mold 63 other than the electrode 61 is also shown brightly, so the difference in brightness between the electrode 61 and the other parts is smaller than in image G1 of FIG. 10A. Therefore, the contrast of the image brightness in image G2 is smaller. Therefore, compared to image G2, image G1 has a higher contrast of each electrode and has a higher recognition accuracy of alignment based on image recognition. Therefore, image G1 is more preferable as an image for alignment than image G2.

[0086] In this way, component recognition camera 28 may obtain image G1 by capturing an image under illumination condition LA for the first image capture. Component recognition camera 28 may change the illumination condition for the second image capture and capture an image under illumination condition LB for the second image capture to obtain image G2. Since electrode 61 has high brightness and high contrast in image G1, component mounting device 1 can improve the recognition accuracy of alignment of component P. Furthermore, since the characters in character portion 62 have high brightness in image G2, component mounting device 1 can improve the inspection accuracy or traceability accuracy of component P.

[0087] <Component mounting device operation> Next, the operation of the component mounting device will be described. Fig. 11 is a flowchart illustrating an operation flow executed by the control unit 40 shown in Fig. 5. Note that a counter n (an integer variable) for sequentially counting the multiple nozzle sets NS of the moving head 26 is stored and held in the memory unit 41 of the control unit 40.

[0088] The mechanism driving unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism driving unit 46 starts the forward movement (head movement) in one turn from the time of transmitting S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12). Then, the control unit 40 initializes the counter n (i.e., assigns the integer "1" to the counter n) and counts that the nozzle set NS to be imaged is the first one (S13).

[0089] The camera control unit 48 of the imaging processing unit 47 determines whether or not it is the first imaging timing TA (S14) based on the imaging timing information 45. If it is not the first imaging timing TA (No in S14), it waits until the first imaging timing TA.

[0090] If it is the first imaging timing TA, the camera control unit 48 controls the illumination of the component P according to the illumination condition LA based on the illumination condition information 44, and controls the imaging of the component P in the illuminated state (S15). For example, at the first imaging timing TA, the camera control unit 48 turns on the illumination channel based on the illumination condition LA in the illumination unit section 31 with an illumination value based on the illumination condition LA, and causes the component recognition camera 28 to capture an image. This allows the camera control unit 48 to obtain an image G1 at the first imaging timing TA for imaging each component P held by the nozzle set NS corresponding to the counter n.

[0091] The camera control unit 48 determines whether or not it is the second imaging timing TB (S16) based on the imaging timing information 45. If it is not the second imaging timing TB (No in S16), the camera control unit 48 waits until the second imaging timing TB occurs.

[0092] If it is the second imaging timing TB, the camera control unit 48 controls to illuminate the component P according to the illumination condition LB based on the illumination condition information 44, and controls to capture an image of the component P in an illuminated state (S17). For example, the camera control unit 48 turns on the illumination channel based on the illumination condition LB in the illumination unit section 31 with an illumination value based on the illumination condition LB at the second imaging timing TB, and causes the component recognition camera 28 to capture an image. This allows the camera control unit 48 to capture an image G2 at the second imaging timing TB for capturing an image of each component P held by the nozzle set NS corresponding to the counter n. In other words, the camera control unit 48 captures the image G2 at the second imaging timing TB immediately (after a very short time) after the first imaging timing TA, in a state where the illumination condition is switched and the component P is illuminated.

[0093] Furthermore, in S17, the camera control unit 48 may acquire information on the purpose of the image via an operation device (not shown), and determine the lighting conditions LB for the second imaging based on the information on the purpose of the image and the lighting condition information 44 stored in the storage unit 41. This allows the camera control unit 48 to acquire the image G2 by imaging under the lighting conditions LB suitable for the purpose desired by the user, for example.

[0094] The control unit 40 determines whether the counter n is 8, that is, whether the processing of S14 to S17 has been completed for all nozzle sets NS (here, eight nozzle sets) (S18). If processing has not been completed up to the eighth nozzle set NS, which corresponds to n=8, the control unit 40 adds the integer 1 to the value of the counter n (S19) and proceeds to S14 to execute processing for the next nozzle set NS.

[0095] That is, the camera control unit 48 alternately captures an image G1 based on the illumination condition LA and an image G2 based on the illumination condition LB one by one, and the images G1 and G2 are regarded as images of the first set (first nozzle set NS). After capturing the images of the first set, the mechanism driving unit 46 continues to move the moving head 26 along the movement direction A until the component holding nozzle 27 is no longer present (here, until the eighth nozzle set NS is reached), and the camera control unit 48 controls the capturing of images by the component recognition camera 28.

[0096] When the eighth nozzle set NS has been processed, the component recognition unit 50 performs image recognition on each image G1 obtained by the first imaging of each nozzle set NS (S20). In this case, the component recognition unit 50 can obtain, for example, alignment information of each component P held by each component holding nozzle 27 by image recognition of each image G1. The component recognition unit 50 sends the recognition result of the image recognition to the mechanism driving unit 46.

[0097] The component recognition unit 50 also performs image recognition on each image G2 obtained by the second imaging of each nozzle set NS (S21). In this case, the component recognition unit 50 can obtain information on the recognition result corresponding to each application (e.g., character recognition, polarity discrimination, 3D measurement, or external shape recognition) corresponding to the illumination condition LB through image recognition of each image G2. That is, the component recognition unit 50 can obtain, for example, information on the recognition result of the character attached to the component P, discrimination information on the polarity (e.g., front and back) of the component P, information on the measurement result of the 3D measurement, or information on the recognition result of the external shape of the component P. The component recognition unit 50 sends the recognition result of the image recognition to the mechanism drive unit 46.

[0098] Shortly after the component holding nozzles 27 of each nozzle set NS pass above the component recognition camera 28, the moving head 26 reaches the vicinity of the mounting position of the component P. Then, the mechanism driving unit 46 ends the movement above the component recognition camera 28 (S22). Based on the recognition result by the component recognition unit 50, the mechanism driving unit 46 commands the moving head 26 of the head unit 23 to mount the component P at a predetermined position and attitude on the board W. In accordance with the command from the mechanism driving unit 46, the head unit 23 causes the moving head 26 to mount the component P on the board W (S23).

[0099] According to such a component mounting device 1, the same component P is imaged multiple times during one turn of forward movement, so that in order to obtain multiple images G1, G2, only one scan in the movement direction A is required, and the movement of the moving head 26 can be shortened. Therefore, the component mounting device 1 can shorten the time required to image each component P, and shorten the time required to complete recognition of each component P. For example, while it takes about several hundred ms for the moving head 26 to move two turns, by performing exposure and imaging multiple times in one turn, it takes only a time on the order of microseconds.

[0100] In addition, the component mounting device 1 sets different illumination conditions LA and LB when capturing the multiple images G1 and G2, so that the multiple images G1 and G2 with different pixel luminance values ​​can be obtained. Therefore, a wide range of pixel luminance values ​​(dynamic range) can be secured across the multiple images G1 and G2. Therefore, the component mounting device 1 can recognize different states or postures of the component P based on the multiple images G1 and G2 in which the component P is captured, and can improve the recognition accuracy of the component P.

[0101] That is, the component mounting device 1 captures images of the same component P multiple times at different brightnesses by staggered lighting, expanding the dynamic range across the multiple images and improving the recognition accuracy of the component P. Also, the component mounting device 1 does not require the moving head 26 to hold each component P and move back and forth multiple times over the same location to capture images, which reduces the imaging time and reduces production tactical loss.

[0102] As described above, the component mounting device 1 of the present embodiment includes the lighting unit section 31 (an example of a lighting section) that illuminates the component P held by the moving head 26 (an example of a head), the component recognition camera 28 (an example of an imaging section) that images the component P from below, the camera control section 48 (an example of an imaging control section) that controls the imaging by the component recognition camera 28 and the illumination conditions including information on the brightness of the illumination by the lighting unit section 31 at the time of imaging, the component recognition section 50 that recognizes the component P from the images G1 and G2 captured by the component recognition camera 28, and the head unit 23 (an example of a component mounting section) that mounts the component P on the board W by the moving head 26 based on the recognition result by the component recognition section 50. The camera control section 48 turns on the lighting unit section 31 under the illumination condition LA (an example of a first illumination condition) at the imaging timing TA (an example of a first timing) when the component P is moving above the component recognition camera 28, and acquires the image G1 (an example of a first image) by causing the component recognition camera 28 to capture an image. The camera control unit 48 turns on the lighting unit 31 under lighting condition LB (an example of a second lighting condition) at imaging timing TB (an example of a second timing) when the component P is moving above the component recognition camera 28, and captures an image G2 (an example of a second image) by causing the component recognition camera 28 to capture an image. The component recognition unit 50 recognizes the component P based on the images G1 and G2.

[0103] As a result, the component mounting device 1 obtains multiple images G1, G2 of the same component P under different lighting conditions LA, LB, thereby obtaining an image with a wide dynamic range and improving the recognition accuracy of the component P. Furthermore, the component mounting device 1 can capture images twice under different lighting conditions during one movement (during the forward movement in one turn), eliminating the need for the moving head 26 to make a reciprocating motion to capture images twice, thereby shortening the time required to recognize the component P.

[0104] Furthermore, the lighting unit section 31 may have multiple lighting channels CH1 to CH4 with different lighting methods. The lighting conditions LA may include lighting values ​​indicating the brightness of the first lighting by each of the multiple lighting channels CH1 to CH4. The lighting conditions LB may include lighting values ​​indicating the brightness of the second lighting by each of the multiple lighting channels CH1 to CH4.

[0105] This allows the component mounting device 1 to set the brightness for each lighting channel under each of the lighting conditions LA and LB, and to adjust the brightness in more detail to illuminate the component P. Therefore, the component mounting device 1 can further improve the recognition accuracy of the component P.

[0106] Furthermore, the lighting unit section 31 may have a plurality of lighting channels CH1 to CH4 with different lighting methods. The lighting conditions LA may include information on the lighting channel used to capture the image G1. The lighting conditions LB may include information on the lighting channel used to capture the image G2.

[0107] As a result, the component mounting device 1 can adjust the illuminated position and brightness of the component P by using different lighting channels or a combination of different lighting channels to capture images G1 and G2, thereby improving the recognition accuracy of the component P.

[0108] Furthermore, the camera control unit 48 may obtain information on the purpose of the image G2 and determine the lighting condition LB based on the purpose of the image G2.

[0109] This allows the component mounting device 1 to capture the image G2 under illumination conditions LB suitable for each purpose of recognizing the component P (for example, checking characters attached to the component P, determining the polarity of the component P, or measuring the component P in 3D or recognizing the outer shape of the component P). Therefore, the component mounting device 1 can improve the recognition accuracy of the component P corresponding to each purpose by using the captured image G2.

[0110] The lighting condition LA may be a fixed condition, and the lighting condition LB may be a variable condition.

[0111] Thus, the component mounting device 1 can acquire the image G1 required for component recognition by setting the illumination conditions for acquiring the image G1 as the illumination conditions LA, and can acquire the image G2 captured under the illumination conditions LB suitable for the desired purpose by setting the illumination conditions for acquiring an arbitrary image G2 for component recognition as the illumination conditions LB.

[0112] The multiple illumination channels may also include a transmitted illumination channel CH2 that illuminates a first reflector arranged above the component P, a side illumination channel CH3 that illuminates the side of the component P, a reflected illumination channel CH1 that illuminates the underside of the component P, and a coaxial illumination channel CH4 that illuminates a reflector C (an example of a second reflector) arranged below the component P.

[0113] This allows the component mounting apparatus 1 to obtain images G1 and G2 captured by illuminating the component P from various angles.

[0114] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modified or amended examples within the scope of the claims, and it is understood that these also naturally belong to the technical scope of the present disclosure. In addition, the components in the above embodiments may be arbitrarily combined within the scope of the present disclosure. [Industrial Applicability]

[0115] The present disclosure is useful for component mounting devices and component mounting methods that can improve the accuracy of image-based component recognition by ensuring a wide dynamic range of multiple images, shorten the time required for component recognition, and improve component mounting efficiency. [Explanation of symbols]

[0116] 1 Component placement device 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 Slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Part holding nozzle 28 Parts Recognition Camera 29 Image sensor section 30 Case 31 Lighting unit section 33 Reflection lighting section 34 Transillumination unit 35 Side lighting section 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 40 Control section 41 Storage section 42 Implementation Information 43 Parts Information 44 Lighting Condition Information 45 Imaging timing information 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit 61 Electrode 62 Text section 63 Mold B Shielding plate C Reflector G Transparent glass G1, G2 images P parts W substrate

Claims

1. an imaging unit that captures an image of the component from below within an imaging range that includes the entire component; and an imaging control unit that controls imaging by the imaging unit and lighting conditions including information on the brightness of lighting by the lighting unit at the time of imaging; a component recognition unit that recognizes the component from the image captured by the imaging unit; a component mounting unit that mounts the component on a board using the head based on a recognition result by the component recognition unit, the imaging control unit, at a first timing when the component is moving above the imaging unit, turns on the illumination unit under a first illumination condition and causes the imaging unit to capture an image, thereby obtaining a first image including the entire component, and, at a second timing when the component is moving above the imaging unit, turns on the illumination unit under a second illumination condition different from the first illumination condition and causes the imaging unit to capture an image, thereby obtaining a second image including the entire component; The part recognition unit recognizes the part based on the first image and the second image. Parts mounting device.

2. The illumination unit has a plurality of illumination channels with different illumination methods, the first lighting condition includes a lighting value indicating a brightness of a first lighting by each of the plurality of lighting channels; the second lighting condition includes a lighting value indicating a brightness of the second lighting by each of the plurality of lighting channels; 2. The component mounting apparatus according to claim 1.

3. The illumination unit has a plurality of illumination channels with different illumination methods, the first illumination condition includes information of an illumination channel used to capture the first image; The second illumination condition includes information of an illumination channel used to capture the second image.

3. The component mounting device according to claim 1 or 2.

4. The imaging control unit is Obtaining information regarding a purpose of the second image; determining the second lighting condition based on an intended use of the second image; The component mounting device according to any one of claims 1 to 3.

5. the first lighting condition is a fixed condition; the second lighting condition is a variable condition; 5. The component mounting apparatus according to claim 4.

6. The plurality of illumination channels include: a transillumination channel for illuminating a first reflector disposed above the component; a side illumination channel for illuminating the side of the component; a reflected illumination channel for illuminating an underside of the component; a coaxial illumination channel that illuminates a second reflector disposed below the component; 4. The component mounting device according to claim 2 or 3.

7. controlling lighting conditions including information on the brightness of lighting when an image is captured by an illumination unit that illuminates the component held by the head, and controlling imaging by an imaging unit that captures an image of the component held by the head from below in an imaging range that includes the entire component; Recognizing the component from an image captured by the imaging unit; mounting the component on a board using the head based on a result of the component recognition; having The step of controlling the imaging includes: acquiring a first image including the entire part by turning on the illumination unit under a first illumination condition and causing the imaging unit to capture an image at a first timing when the part is moving above the imaging unit; and acquiring a second image including the entire part by turning on the illumination unit under a second illumination condition different from the first illumination condition and causing the imaging unit to capture an image at a second timing when the part is moving above the imaging unit, The step of recognizing the part includes a step of recognizing the part based on the first image and the second image. How to install parts.

Images