Mounting device and mounting method

Abstract

To provide a mounting device and a mounting method capable of realizing high accuracy mounting in which a mounting accuracy becomes 1 μm or less in a face-down mounting for mounting a chip component and a substrate in a manner that both of electrode surfaces face each other.SOLUTION: A mounting device comprises: an attachment tool having transparency and having a tool recognition mart, for holding a chip component; chip position recognition means for acquiring position information on a chip recognition mark and the tool recognition mark at the same time in a state where the chip component is held by the attachment tool; and substrate position recognition means for acquiring the position information on a substrate recognition mark and the tool recognition marl. On the basis of information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the substrate stage or the attachment tool is moved in a substrate inner surface direction and positioning of the chip component and the substrate is performed. A mounting method is also provided.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a mounting apparatus and a mounting method for mounting chip components on a substrate, and more particularly to a mounting apparatus and a mounting method for mounting chip components with an electrode surface of the chip component facing an electrode surface of a substrate. [Background technology]

[0002] 2. Description of the Related Art One form of mounting chip components such as semiconductor chips on a substrate such as a wiring board is face-down mounting, in which an electrode surface of the chip component faces an electrode surface of the substrate.

[0003] FIG. 17 shows an example of a board S for face-down mounting, in which a chip component is bonded to a mounting location SC of the board S with the electrode surfaces facing each other. In this case, if the chip component is not placed accurately at the mounting location SC of the board S, the electrical connection between the board S and the chip component will be incomplete, which will cause a quality defect in the semiconductor device. For this reason, a board recognition first mark AS1 and a board recognition second mark AS2 are provided on the electrode surface side as board recognition marks AS at each mounting location SC of the board S as shown in FIG. 17. Meanwhile, a chip recognition first mark AC1 and a chip recognition second mark AC2 are also provided as chip recognition marks AC on the chip component. In the state shown in FIG. 18, the relative position (in the board S in-plane direction) of the chip component C to the mounting location SC of the board S is obtained from the positional relationship between the board recognition first mark AS1 and the chip recognition first mark AC1 and the positional relationship between the board recognition second mark AS2 and the chip recognition second mark AC2, and the positional accuracy can be improved by correcting this.

[0004] Specifically, in the mounting device shown in FIG. 19, an upper and lower dual-view camera 500 is used, and an upper view 50U of the upper and lower dual-view camera 500 captures the chip recognition first mark AC1 (or the chip recognition second mark AC2) and a lower view 50D captures the board recognition first mark AS1 (or the board recognition second mark AS2) (FIG. 20).

[0005] Using this two-view camera, it is possible to obtain and correct the relative position (in the in-plane direction of the substrate S) of the chip component C with respect to the mounting location SC of the substrate S, thereby enabling mounting with a maximum error of about several μm. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2020-11970 A Summary of the Invention [Problem to be solved by the invention]

[0007] A maximum error of several μm is sufficient when the electrode pitch is 100 μm, such as when solder bumps are used as the electrodes of chip component C in face-down mounting, also known as flip-chip mounting. However, there is no room for error when the electrode pitch is just over 50 μm, such as when Cu pillar bumps are used. Furthermore, as high-density mounting progresses and electrode pitches become narrower, there are some applications for which this precision is insufficient.

[0008] Therefore, we are trying to further improve the accuracy by using two cameras with upper and lower fields of view, but in the state shown in Figure 20, even if the chip component C is aligned with the mounting location SC of the board S with an error of less than 1 μm (in the in-plane direction of the board S), the maximum error at the mounting stage may exceed 1 μm. This is due to the fact that when the chip C descends from the state shown in Figure 20 toward the board S, there is a slight inclination in the descending direction. For this reason, we are trying to solve this by increasing the processing accuracy and rigidity of each part of the mounting device so that the descending direction is perpendicular to the surface that holds the board S, but this will affect the cost of the device.

[0009] Therefore, it is expected that the mounting accuracy will improve if the alignment is performed while the board S and the chip component C are brought as close as possible to each other. However, when using a dual-view camera with upper and lower views, it is difficult to significantly improve the current situation due to the thickness and focal length of the camera itself.

[0010] On the other hand, in face-up mounting as shown in Figure 21, in which the electrode surface of the substrate S and the electrode surface of the chip component C face in the same direction, by using a mounting device 100 configured as shown in Figure 22, the positional relationship between the substrate recognition first mark AS1 and the chip recognition first mark AC1 as shown in Figure 23(a) and the positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2 as shown in Figure 23(b) can be observed from the same direction, making it possible to align the substrate S and the chip component C as close as possible to each other (Patent Document 1, etc.).

[0011] Therefore, in face-down mounting, by providing a chip recognition mark AC on the side opposite the electrode surface of the chip component C, it is possible to align the substrate S and the chip component C as close as possible, as with the face-up mounting shown in Figure 23.

[0012] However, since the purpose of the alignment is to ensure reliable bonding between the electrodes of the chip component C and the substrate S, the chip recognition mark AC needs to be provided with high precision relative to the electrodes of the chip component C, but it is extremely difficult to position the chip recognition mark AC accurately and with high precision relative to the electrodes on the opposite surface, and this is not suitable as a means for performing face-down mounting with high precision. Furthermore, it is necessary to add a new process for drawing the recognition mark on the opposite side of the electrode surface, which is also undesirable in terms of process cost.

[0013] The present invention has been made in consideration of the above problems, and provides a mounting device and a mounting method that realizes high-precision mounting with a mounting accuracy of 1 μm or less in face-down mounting, in which electrode surfaces are mounted opposite each other. [Means for solving the problem]

[0014] In order to solve the above problem, the invention described in claim 1 comprises: 1. A mounting apparatus for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising: a transparent attachment tool having a tool recognition mark, which holds a surface of the chip component opposite to a surface having the chip recognition mark; a mounting head which holds the attachment tool at its tip; a lifting means which raises and lowers the mounting head in a direction perpendicular to the substrate; a substrate stage which holds the substrate; and a chip position recognition means which, while the chip component is held by the attachment tool, simultaneously acquires position information of the chip recognition mark and position information of the tool recognition mark. a substrate position recognition means for acquiring position information of the substrate recognition mark and position information of the tool recognition mark, and a control unit connected to the mounting head, the lifting means, the substrate stage, the chip position recognition means, and the substrate position recognition means, At least one of the substrate stage and the attachment tool is movable in a direction within a surface of the substrate, This is a mounting device in which the control unit moves the substrate stage or the attachment tool in an in-plane direction of the substrate based on information obtained by the chip position recognition means and information obtained by the substrate position recognition means, thereby aligning the chip component with the substrate.

[0015] The invention described in claim 2 is the mounting device described in claim 1, The mounting apparatus is capable of moving the board position recognition means independently of the mounting head, and obtains position information of at least one of the board recognition mark and the tool recognition mark through the attachment tool.

[0016] The invention described in claim 3 is the mounting device described in claim 1 or claim 2, The bonding head is a mounting device having a tool position moving means for adjusting the position of the attachment tool in the in-plane direction of the chip component.

[0017] The invention described in claim 4 is a mounting device according to any one of claims 1 to 3, The mounting device has as its components a chip slider for mounting the chip component and a transport rail for transporting the chip slider, and is provided with chip transport means for transporting the chip component immediately below the attachment tool.

[0018] The invention described in claim 5 is the mounting device described in claim 4, In the mounting apparatus, the chip transport means has a position adjustment means for adjusting the in-plane position of the chip component mounted on the chip slider.

[0019] The invention described in claim 6 is a mounting device according to any one of claims 1 to 5, In a state in which the chip component is held by the attachment tool and faces the substrate, the substrate position recognition means simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

[0020] The invention described in claim 7 is a mounting device according to any one of claims 1 to 5, In the mounting apparatus, the board position recognition means acquires position information of the board recognition mark while the chip component is not being held.

[0021] The invention described in claim 8 is the mounting device described in claim 7, This is a mounting device that brings the attachment tool closer to the upper surface of the substrate until the distance between the lower surface of the attachment tool and the upper surface of the substrate becomes approximately equal to the thickness of the chip component, and simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

[0022] The invention described in claim 9 is A mounting method for mounting a chip component having a chip recognition mark for alignment and a board having a board recognition mark for alignment, by using the mounting device according to any one of claims 1 to 5, with a surface having the chip recognition mark and a surface having the board recognition mark facing each other, comprising: This mounting method includes a substrate holding process for holding the substrate on a substrate stage; a chip holding process for holding the chip component with an attachment tool having a tool recognition mark; a chip position information acquisition process for acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; a substrate position information acquisition process for acquiring position information of the tool recognition mark and the substrate recognition mark while the chip component is held by the attachment tool and facing the substrate; and an alignment process for adjusting the position of the chip component in the in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

[0023] The invention described in claim 10 is A mounting method for mounting a chip component having a chip recognition mark for alignment and a board having a board recognition mark for alignment, by using the mounting device according to any one of claims 1 to 5, with a surface having the chip recognition mark and a surface having the board recognition mark facing each other, comprising: This mounting method includes a substrate holding process for holding the substrate on a substrate stage, a substrate position information acquisition process for acquiring position information of the substrate recognition mark, a chip holding process for holding the chip component with the attachment tool, a chip position information acquisition process for acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool, and an alignment process for adjusting the position of the chip component in the in-plane direction of the substrate based on the relative position information between the tool recognition mark and the chip recognition mark.

[0024] The invention described in claim 11 is the mounting method described in claim 10, The mounting method according to claim 10, In the substrate position information acquisition process, the distance between the lower surface of the attachment tool and the upper surface of the substrate is set to be approximately equal to the thickness of the chip component, and position information of the substrate recognition mark and the tool recognition mark is acquired. Effect of the Invention

[0025] According to the present invention, alignment can be performed while the electrode surfaces of the chip component and the substrate are opposed to each other and are close to each other, making it possible to perform face-down mounting with high accuracy. [Brief description of the drawings]

[0026] [Figure 1] 1 is a schematic diagram of a mounting apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2A is a front view and FIG. 2B is a side view illustrating an optical configuration according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a block diagram showing a control system according to an embodiment of the present invention. [Figure 4] 1A shows a state in which the chip position recognition means of a mounting apparatus according to an embodiment of the present invention acquires position information of a chip recognition first mark and a tool recognition first mark, and FIG. 1B shows a state in which the chip position recognition means acquires position information of a chip recognition second mark and a tool recognition second mark. [Diagram 5] 1A is a diagram showing an example image of (a) a chip recognition first mark and a tool recognition first mark, and (b) an example image of a chip recognition second mark and a tool recognition second mark, acquired by a chip position recognition means of a mounting device according to an embodiment of the present invention. [Figure 6] 1A shows a state in which the substrate position recognition means of a mounting device according to an embodiment of the present invention acquires position information of the substrate recognition first mark and the tool recognition first mark, and FIG. 1B shows a state in which the substrate position recognition means acquires position information of the substrate recognition second mark and the tool recognition second mark. [Figure 7] 1A is a diagram showing an example image of a substrate recognition first mark and a tool recognition first mark acquired by a substrate position recognition means of a mounting device according to an embodiment of the present invention, and FIG. 1B is a diagram showing an example image of a substrate recognition second mark and a tool recognition second mark acquired by a substrate position recognition means of a mounting device according to an embodiment of the present invention. [Figure 8] 1 is a schematic diagram of a first modified example of a mounting device according to an embodiment of the present invention. [Figure 9]10A to 10C are diagrams illustrating the operation of the mounting device according to the first modified example of the embodiment of the present invention. [Figure 10] 11 is a schematic diagram of a second modified example of a mounting device according to an embodiment of the present invention. FIG. [Figure 11] 11 is a schematic diagram of a third modified example of the mounting device according to the embodiment of the present invention. FIG. [Figure 12] 1A and 1B are diagrams illustrating mounting locations for mounting individual chip components and individual board recognition marks on a board on which a plurality of chip components are mounted with small gaps therebetween. [Figure 13] 1A and 1B are diagrams illustrating a problem that occurs when recognizing a board recognition mark of a board on which a plurality of chip components are mounted with small gaps therebetween. [Figure 14] 1A shows an example of using board recognition marks in diagonally adjacent mounting areas when mounting multiple chip components with a small gap between them, and FIG. 1B shows an example of a chip component being mounted in part of the adjacent mounting area. [Figure 15] 1A and 1B are diagrams showing an example of an improvement in which board recognition marks in adjacent mounting areas are used when mounting multiple chip components with small gaps between them, in which (a) shows an example in which no chip components are mounted in the adjacent mounting area, and (b) shows an example in which a chip component is mounted in part of the adjacent mounting area. [Figure 16] 1A to 1C are diagrams illustrating a mounting method in which a board position information acquisition process is performed in advance using a mounting device according to an embodiment of the present invention. [Figure 17] 1A and 1B are diagrams illustrating mounting locations for mounting individual chip components on a board on which a plurality of chip components are mounted, and individual board recognition marks. [Figure 18] 13 is a diagram showing a state in which a chip recognition mark and a board recognition mark face each other when a chip component is mounted on a board. FIG. [Figure 19] 1 is a diagram showing an example of the configuration of a mounting device that mounts a chip component with a chip recognition mark and a board recognition mark of a board facing each other; [Figure 20] 13 is a diagram showing a state in which a chip recognition mark of a chip component and a board recognition mark of a board are opposed to each other and aligned; FIG. [Figure 21]13 is a diagram showing a state in which the chip recognition mark of the chip component and the board recognition mark of the board are oriented in the same direction. [Figure 22] 1A and 1B are diagrams showing an example of the configuration of a mounting device that mounts chip components with their chip recognition marks and board recognition marks facing in the same direction. [Diagram 23] This figure shows a mounting device that mounts chip components with their chip recognition marks and their board recognition marks facing in the same direction, with (a) the state in which position information of the board recognition first mark and the chip recognition first mark are acquired, and (b) the state in which position information of the board recognition first mark and the chip recognition first mark are acquired. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram of a mounting apparatus 1 according to an embodiment of the present invention.

[0028] Mounting devices are used to mount chip components on substrates such as wiring boards, and the mounting device 1 in FIG. 1 is configured to perform face-down mounting, in which the electrode surface of the chip component is opposed to the electrode surface of the substrate.

[0029] The mounting apparatus 1 comprises a substrate stage 2, lifting means 3, a mounting head 4, substrate position recognition means 5, chip transport means 6, and chip position recognition means 7 as its components.

[0030] 1, the substrate stage 2 is composed of a stage movement control means 20 and an adsorption table 23. The adsorption table 23 adsorbs and holds a substrate placed on its surface, and the adsorption table 23 can be moved in an in-plane direction of the substrate surface by the stage movement control means 20 while holding the substrate.

[0031] The stage movement control means 20 is composed of a Y-direction stage movement control means 22 capable of linearly moving an adsorption table 23 in the Y direction, and an X-direction stage movement control means 21 capable of linearly moving the Y-direction stage movement control means 22 in the X direction and provided on a base 200. The Y-direction movement control means 22 has the adsorption table 23 mounted on a movable part arranged on a slide rail, and the movement and position of the movable part are controlled by a Y-direction servo 221. In addition, the X-direction movement control means 21 has the Y-direction movement control means 22 mounted on a movable part arranged on a slide rail, and the movement and position of the movable part are controlled by an X-direction servo 211.

[0032] The lifting means 3 is fixed to a gate-shaped frame (not shown), and a vertical drive shaft is provided perpendicular to the suction table 23, and the mounting head 4 is connected to the vertical drive shaft. The lifting means 3 has the function of driving the mounting head 4 up and down, and also applies a pressure force according to a setting. Furthermore, in the mounting device 1, the lifting means 3 is supported from two directions (by a gate-shaped frame (not shown)) and is linearly connected to the mounting head 4, so that a lateral force is unlikely to be applied to the mounting head 4 when pressure is applied.

[0033] The mounting head 4 holds the chip component C and presses it in parallel with the substrate (held on the suction table 23 of the substrate stage 2). The mounting head 4 is composed of a head body 40, a heater section 41, an attachment tool 42, and a tool position control means 43. The head body 40 is connected to the lifting means 3 via the tool position control means 43, and the heater section 41 is fixedly disposed on the lower side. The heater section 41 has a heat generating function and heats the chip component C via the attachment tool 42. The heater section 41 also has a function of suctioning and holding the attachment tool 42 using a reduced pressure flow path. The attachment tool 42 suctions and holds the chip component C, and is replaced according to the shape of the chip component C. The tool position control means 43 finely adjusts the position of the head body 40 in the vertical plane relative to the up and down drive shaft of the lifting means 3, and the positions (in the XY plane of the figure) of the attachment tool 42 and the chip component C held by the attachment tool 42 are adjusted accordingly.

[0034] The tool position control means 43 includes, as its components, an X-direction tool position control means 431, a Y-direction tool position control means 432, and a tool rotation control means 433. In the embodiment shown in Fig. 1, the tool rotation control means 433 adjusts the rotation direction of the head main body 40, the Y-direction tool position control means 432 adjusts the Y-direction position of the tool rotation control means 433, and the X-direction tool position control means 431 adjusts the X-direction position of the Y-direction position control means, but the present invention is not limited to this and it is sufficient if the X-direction position, Y-direction position, and rotation angle of the attachment tool 42 can be adjusted.

[0035] Figure 2 shows a diagram mainly focusing on the periphery of the head main body 40 (front view in Figure 2(a) and side view in Figure 2(b)), and in the face-down mounting of this embodiment, chip recognition marks AC (first chip recognition mark AC1 and second chip recognition mark AC2) are provided at diagonal positions on the electrode surface of the chip component C, and board recognition marks AS (first board recognition mark AS1 and second board recognition mark AS2) are provided at approximate positions diagonally opposite the chip component mounting location on the electrode surface of the board S, both of which face the electrode surface of the board S of the mounting head 4.

[0036] In addition, in the present invention, a tool recognition mark AT is provided on the surface of the attachment tool 42 that holds the chip component C, and the first tool recognition mark AT1 and the second tool recognition mark AT2 are arranged to correspond to the positions of the first chip recognition mark AC1 and the second chip recognition mark AC2 of the held chip component C.

[0037] The mounting device 1 is configured so that the board recognition mark AS and the tool recognition mark AT can be observed through the mounting head 4, and the attachment tool 42 is formed of a transparent material and has a through hole aligned with the position of the board recognition mark AS. Also, the heater section 41 needs to be made of a transparent material or have an opening so that the tool recognition mark AT can be observed, and in this embodiment, a through hole 41H is provided as shown in FIG. 2. Also, the mounting head 4 needs a space in which the image capture section 50 of the board position recognition means 5 can move in order to observe the board recognition mark AS and / or the tool recognition mark AT, and in this embodiment, a head space 40V is provided as shown in FIG. 2. That is, the head main body 40 is configured to be composed of side plates connected on the heater 41 and a top plate connecting the both side plates.

[0038] The board position recognition means 5 acquires position information of the board recognition mark AS and / or the tool recognition mark AT, which are focused and imaged through the mounting head 4 (through the attachment tool 42 and the heater unit 41). In this embodiment, the board position recognition means 5 includes an image capture unit 50, an optical path 52, and an imaging means 53 connected to the optical path 52 as its components.

[0039] The image capture unit 50 is disposed above the target to be recognized, from which the image capture means 53 captures an image, and brings the target into its field of view.

[0040] Moreover, the substrate position recognition means 5 is configured to be able to move in the in-plane direction of the substrate S (and chip components C) within the head space 40V by a drive mechanism (not shown). Furthermore, it is desirable that the substrate S can also be moved in the vertical direction (Z direction) so that the focal position can be adjusted.

[0041] The mounting head 4 is moved by the lifting means 3 in a direction perpendicular to the substrate S, but this operation can be performed independently of the operation of the substrate position recognition means 5. For this reason, it is necessary to design the head space 40V to have a dimension such that even if the mounting head 4 moves in the vertical direction, the substrate position recognition means 5 that has entered the head space 40V does not interfere.

[0042] In addition, the movable range of the image capture unit 50 of the substrate position recognition means 5 is not limited to within the head space 40V, but it is also possible to move outside the head space 40V and over the substrate S to obtain position information of the substrate recognition mark AS.

[0043] The chip transport means 6 is composed of a transport rail 60 and a chip slider 61. The chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it to just below the attachment tool 42 to transport it.

[0044] Here, a chip supply unit (not shown) places the chip component C at a fixed position on the chip slider 61. If necessary, the position of the chip component C placed on the chip slider 61 may be recognized by a recognition mechanism (not shown). The chip transport means 6 may have a position adjustment means for adjusting the position of the chip component C mounted on the chip slider 61 in the in-plane direction (XY direction). In this way, by controlling the positions of the chip slider 61 and the chip component C placed on the chip slider 61, it is possible to transfer the chip component C within a predetermined range of the attachment tool 42. After the attachment tool 42 holds the chip component C, the chip slider 61, which has released the holding of the chip component C, moves to a retracted position.

[0045] The chip position recognition means 7 images the chip recognition mark AC of the chip component C held by the attachment tool 42 and also images the tool recognition mark AT, thereby acquiring position information of the chip recognition mark AC and the tool recognition mark AT.

[0046] As shown in the block diagram of FIG. 3, the mounting apparatus 1 includes a control unit 10 that connects the substrate stage 2, lifting means 3, mounting head 4, substrate position recognition means 5, transport means 6 and chip position recognition means 7.

[0047] The control unit 10 essentially consists of a CPU and a storage device as its main components, and has an interface with each device as necessary. The control unit 10 also has a built-in program, which allows it to perform calculations using acquired data and output the results of the calculations. It is also desirable for the control unit 10 to have a function for recording acquired data and calculation results and using them as data for new calculations.

[0048] The control unit 10 is connected to the substrate stage 2, and controls the operation of the X-direction stage movement control means 21 and the Y-direction stage movement control means 22 to control the in-plane movement of the suction table 23. The control unit 10 also controls the suction table 23 to control the suction holding and release of the substrate S.

[0049] The control unit 10 is connected to the lifting means 3 and has the function of controlling the position of the mounting head 4 in the vertical direction (Z direction) and controlling the pressure applied when the chip component C is pressure-bonded to the substrate S.

[0050] The control unit 10 is connected to the mounting head 4, and has the function of controlling the suction, holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater part 41, and the position of the head main body 40 (and the heater part 41 and attachment tool 42) in the XY plane using a tool position control means 43.

[0051] The control unit 10 is connected to the substrate position recognition means 5 and has a function of controlling the driving in the horizontal (in the XY plane) and vertical (Z direction) directions, as well as controlling the imaging means 53 to acquire image data. Furthermore, the control unit 10 has an image processing function, and has a function of calculating the positions of the substrate recognition mark AS and / or the tool recognition mark AT from the image acquired by the imaging means 53.

[0052] The control unit 10 is connected to the chip transport means 6 and has a function of controlling the position of a chip slider 61 that moves along a transport rail 60 .

[0053] The control unit 10 is connected to the chip position recognition means 7, and has a function of controlling the driving of the chip position recognition means 7 in the horizontal direction (in the XY plane) and controlling an imaging means (not shown) to acquire image data. Furthermore, the image processing function of the control unit 10 has a function of calculating the positions of the chip recognition mark AC and / or the tool recognition mark AT.

[0054] 4 to 7, a process in which the mounting device 1 aligns and mounts a chip component at a mounting location SC of the substrate S will be described below, but prior to this, the substrate S has undergone a substrate holding process and is held on the substrate stage 2 of the mounting device 1. Here, it is desirable that information on the position of the substrate S relative to the suction table 23 of the substrate stage 2 is obtained by an image recognition means or the like and stored in the control unit 10.

[0055] The chip components C are transported by the chip transport means 6 and undergo a chip holding process in which they are held by the attachment tool 42. Here, the chip components C are delivered from a chip supply unit (not shown) to the chip slider 61, and when delivered from the chip slider 61 to the attachment tool 42, a predetermined positional accuracy is ensured, and the chip components C are held by the attachment tool 42 with the predetermined positional accuracy.

[0056] Therefore, in the chip position information acquisition process shown in FIG. 4, the chip position recognition means 7 can observe the chip recognition mark AC and the tool recognition mark AT at a high magnification in the same field of view. That is, in the state shown in FIG. 4(a), the chip recognition first mark AC1 and the tool recognition first mark AT1 can be imaged in the same field of view as shown in FIG. 5(a), and the relative position information of the chip recognition first mark AC1 and the tool recognition first mark AT1 can be obtained. Similarly, in the state shown in FIG. 4(b), an image as shown in FIG. 5(b) can be obtained, and the relative position information of the chip recognition second mark AC2 and the tool recognition second mark AT2 can be obtained. From the position information of the chip recognition mark AC and the tool recognition mark AT obtained at these two places, the position information of the tool recognition first mark AT1 and the tool recognition second mark AT2 can be calculated as the position information of the chip recognition first mark AC1 and the chip recognition second mark AC2 of the held chip component C.

[0057] 1, the chip position recognition means 7 is fixed to the suction table 23. Therefore, the stage movement control means 20 moves the suction table 23 so that the chip position recognition means 7 is located under the attachment tool 42.

[0058] After the chip position information acquisition process, the stage movement control means 20 moves the suction table 23 so that the chip mounting location SC is located directly under the attachment tool 42. Thereafter, the lifting means 3 is driven to lower the mounting head 4, and the chip component C is brought as close as possible to the substrate S without coming into contact with it (FIG. 6).

[0059] From this state, in the process of acquiring board position information shown in FIG. 6, the board position recognition means 5 observes the board recognition mark AS from above the attachment tool 42, but since the attachment tool 42 is transparent, the tool recognition mark AT can also be observed. Furthermore, as described above, since the arrangement information of the board S on the suction table 23 is obtained, the mounting location SC of the board S is arranged directly below the attachment tool 42, and the board position recognition means 5 can observe the board recognition mark AS and the tool recognition mark AT at high magnification within the same field of view. That is, in the state shown in FIG. 6(a), the tool recognition first mark AT1 and the board recognition first mark AS1 can be imaged within the same field of view as shown in FIG. 7(a). Similarly, in the state shown in FIG. 6(b), the tool recognition second mark AT2 and the board recognition second mark AS2 can be imaged within the same field of view as shown in FIG. 7(b).

[0060] Although the first chip recognition mark AC1 is shown in Fig. 7(a) and the second chip recognition mark AC2 is shown in Fig. 7(b), neither can be observed if the substrate position recognition means 5 is an imaging means for the visible light range. However, from the relative positional relationship between the chip recognition mark AC and the tool recognition mark AT obtained in the chip position information acquisition process, it is possible to obtain position information of the first chip recognition mark AC1 in the field of view shown in Fig. 7(a) and the second chip recognition mark AC2 in the field of view shown in Fig. 7(b).

[0061] Therefore, during the alignment process, the control unit 10 controls the tool position control means 43 and / or the stage movement control means 20 to perform alignment so as to determine the positional relationship between the first chip recognition mark AC1 and the first board recognition mark AS1, and the positional relationship between the second chip recognition mark AC2 and the second board recognition mark AS2, and to correct the positional misalignment of the chip component C relative to the mounting location SC of the board S.

[0062] Thereafter, the lifting means 3 is driven to lower the mounting head 4 to bring the chip component C into close contact with the substrate S, and as the mounting process, a predetermined pressure is applied to the chip component C, and the heater section 40 is heated to bond the electrodes of the substrate C and the chip component C. Here, since the distance of descent from the alignment process to the mounting process is very short, mounting can be performed while maintaining the accuracy of alignment achieved in the alignment process.

[0063] Incidentally, in the mounting device 1 shown in Fig. 1, the chip position recognition means 7 is provided on the suction table 23, but the location of the chip position recognition means 7 is not limited thereto. For example, in a modified example 1 shown in Fig. 8, the chip position recognition means 7 is provided slidably along the transport rail 60 of the chip transport means 6, and can be disposed under the attachment tool 42 as shown in Fig. 9. Furthermore, it is also possible to configure the chip position recognition means 7 to be aligned with the board position recognition means 5 as in a modified example 2 shown in Fig. 10. In this configuration, by providing the board position recognition means 5 on a drive means that moves it also in the vertical direction, the chip position recognition means 7 can observe the chip component C held by the attachment tool 42.

[0064] Modification 3 in FIG. 11 shows an example in which a plurality of mounting heads 4 (4A and 4B) are provided for one substrate stage .

[0065] Recently, a configuration has emerged in which the mounting location SC is arranged with a small gap on the board S, as shown in Fig. 12. In this configuration, unlike the style in which the board recognition mark AS is located outside the mounting location SC as shown in Fig. 17, the board recognition mark AS is provided within the mounting location SC as shown in Fig. 12.

[0066] For this reason, even if the present invention is applied to a configuration in which mounting locations SC are arranged on a board S with only a small gap between them, as shown in FIG. 13, during the process of acquiring board position information, the board recognition mark AS is hidden by the chip components and cannot be observed.

[0067] FIG. 14 shows an example of using the board recognition mark AS of the adjacent mounting location. That is, in FIG. 14(a), in the mounting areas located on the diagonal line, the board recognition first mark AS1 of the mounting area at the top right of the figure is used as the board recognition second mark Aso2, and the board recognition second mark AS2 of the mounting area at the bottom left of the figure is used as the board recognition first mark Aso1, and it is possible to observe the outside of the chip component Ca (for alignment). However, once a chip component Cb is placed at the mounting location, the chip component Cb makes it impossible to observe one of the board recognition marks AS diagonally opposite the chip component Ca as shown in FIG. 14(b). For this reason, it is difficult to sequentially align and mount the chip components C at the mounting locations SC of the board S as shown in FIG. 12 using the present invention.

[0068] However, this problem can be dealt with by devising an arrangement of the board recognition marks AS provided at the mounting locations SC of the board S. That is, by providing the board recognition marks AS at the upper left of each mounting location SC as shown in Fig. 15, it is possible to align the chip component Ca to be aligned using the board recognition marks AS at the mounting locations to the right and below, although they are not completely diagonal to the chip recognition mark AC of the chip component Ca to be aligned. An example is shown in Fig. 15(a), and by repeating the movement from this state to the right and, after reaching the right end, to the left end of the lower row, it is possible to align and mount the chip component C at each mounting location on the board S using the present invention.

[0069] In addition, by changing the order of the chip position information acquisition process and the substrate position information acquisition process, it is also possible to perform alignment using the substrate recognition mark AS in the mounting location SC shown in Figure 12 without using the substrate recognition mark AS in an adjacent mounting area.

[0070] That is, when no chip component C is held as shown in Fig. 16, the relative position information of the tool recognition mark AT and the board recognition mark AS can be acquired by the board position recognition means 5 as a board position information acquisition process. Specifically, as shown in Fig. 16, the attachment tool 42 is brought close to the board S, and the board position recognition means 5 is used to acquire the positional relationship between the first tool recognition mark AT1 and the first board recognition mark AS1 (Fig. 16(a)), and the positional relationship between the second tool recognition mark AT2 and the second board recognition mark AS2 (Fig. 16(b)), and the relative position information is stored.

[0071] Thereafter, the attachment tool 42 is raised and holds the chip component C (chip holding process), and the chip position recognition means 7 is used to acquire the positional relationship between the first chip recognition mark AC1 and the first tool recognition mark AT1, and the relative position information between the second chip recognition mark AC2 and the second tool recognition mark AT2 (chip position information acquisition process).

[0072] Using the position information obtained by the above procedures, when the chip component C held by the attachment tool 42 is close to the substrate S, the tool position control means 43 calculates the adjustment amount by which the attachment tool 42 should be moved in order to align the chip component C with the mounting location SC of the substrate S, and the tool position control means 43 performs the position adjustment (alignment process).

[0073] Thereafter, the lifting means 3 is driven to lower the mounting head 4 to bring the chip component C into close contact with the substrate S, and as a mounting process, the chip component C is pressed with a predetermined pressure and the heater section 40 is heated to bond the electrodes of the substrate S and the chip component C (mounting process).

[0074] Incidentally, in the mounting process, the distance between the upper surface of the substrate S and the lower surface of the attachment tool 42 corresponds to the thickness of the chip component C. Therefore, in the substrate position information acquisition process shown in FIG. 16, if the distance G between the lower surface of the attachment tool 42 and the upper surface of the substrate S is made equal to the thickness of the chip component C, highly accurate mounting is possible. For example, even if there is a slight inclination in the driving direction of the lifting means 3, positional deviation in the mounting process can be suppressed by making the distance G in the substrate position information acquisition process equal to the thickness of the chip component C. It should be noted that even if the distance G between the lower surface of the attachment tool 42 and the upper surface of the substrate S in the substrate position information acquisition process is made exactly the same as the thickness of the chip component C, it is not possible to make the distance G exactly the same as the thickness of the chip component C. Since there are thickness variations in the substrate S and the chip component C, it is sufficient to make the distance approximately equal to the thickness of the chip component C. Here, approximately equal allows an error of ±30% with respect to the design thickness of the chip component C.

[0075] In the above-described example, the chip position recognition means 7 obtains the positional relationship between the chip recognition mark AC and the board recognition mark AS after the attachment tool 42 holds the chip component C, and the alignment process is performed. However, the alignment may be performed at the stage when the attachment tool 42 holds the chip component C. Specifically, when the chip component C mounted on the chip slider 61 of the chip transport means 6 is delivered to the attachment tool 42, the chip position recognition means 7 may obtain the positional information of the chip recognition mark AC and the tool recognition mark AT, and perform alignment (so that the chip recognition mark AC has a predetermined positional relationship with the board recognition mark AS) before the attachment tool 42 holds the chip component C. In this case, if the attachment tool 42 holds the chip component C by adjusting the position only on the chip slider 61 side without driving the tool position control means 43, the chip component C can be mounted on the mounting location SC with high accuracy by simply lowering the mounting head 4 by the lifting means 3. In other words, the alignment process may be performed prior to the chip holding process.

[0076] In the above explanation, in the process of acquiring the substrate position information, the substrate position recognition means 5 acquires the position information of the tool recognition mark AT and the substrate recognition mark AS, but it is also possible to perform alignment without acquiring the position information of the tool recognition mark AT. In other words, it is also possible to adjust the position of the tool recognition mark AT so that the position of the chip recognition mark AC matches the position information of the substrate recognition mark AS acquired by the substrate position recognition means 5 and stored by the control unit 10. [Explanation of symbols]

[0077] 1 Mounting equipment 2. Substrate stage 3 Lifting means 4 Mounting head 5 Board position recognition means 6 Chip transport means 7. Chip position recognition means 10 Control section 20 Stage movement control means 21 X-direction stage movement control means 22 Y-direction stage movement control means 23 Vacuum table 40 Head body 41 Heater section 42 Attachment Tools 43 Tool position control means 50 Image capture unit 52 Light path 53 Imaging means 60 Transport rail 61 Tip Slider AC, AC1, AC2 chip recognition mark AS, AS1, AS2 Board recognition mark AT, AT1, AT2 Tool Recognition Mark C Chip parts S-substrate SC (chip component) mounting location

Claims

1. A chip component having a chip recognition mark for alignment and a substrate recognition mark for alignment A substrate having a chip recognition mark and a substrate having a chip recognition mark are provided on a surface having the chip recognition mark and a surface having the substrate recognition mark. A mounting apparatus for mounting a semiconductor device in a facing relationship, an attachment tool having transparency and a tool recognition mark, the attachment tool holding a surface of the chip component opposite to a surface having the chip recognition mark; a mounting head that holds the attachment tool at a tip thereof; a lifting means for lifting the mounting head in a direction perpendicular to the substrate; a substrate stage for holding the substrate; a chip position recognition means for simultaneously acquiring position information of the chip recognition mark and position information of the tool recognition mark while the chip component is held by the attachment tool; a substrate position recognition unit that can be moved independently of the mounting head and that acquires position information of the substrate recognition mark and position information of the tool recognition mark; a control unit connected to the mounting head, the lifting means, the substrate stage, the chip position recognition means, and the substrate position recognition means, At least one of the substrate stage and the attachment tool is movable in a direction within a surface of the substrate, A mounting apparatus in which the control unit moves the substrate stage or the attachment tool in an in-plane direction of the substrate based on information obtained by the chip position recognition means and information obtained by the substrate position recognition means, thereby aligning the chip component with the substrate.

2. The mounting device according to claim 1 , the substrate position recognition means recognizes all of the substrate recognition marks and the tool recognition marks in the alignment of one of the chip components by the substrate position recognition means; A mounting apparatus in which at least one of the board recognition mark and the tool recognition mark is recognized by the board position recognition means through the attachment tool.

3. The mounting device according to claim 1 or 2, The mounting head has a tool position moving means for adjusting the position of the attachment tool in the in-plane direction of the chip component.

4. The mounting device according to any one of claims 1 to 3, A chip slider on which the chip component is mounted and a carrier rail for carrying the chip slider The attachment tool is a component of a chip component conveying device that conveys the chip component directly under the attachment tool. A mounting device equipped with a substrate transport means.

5. The mounting device according to claim 4, The mounting apparatus wherein the chip transport means has position adjustment means for adjusting the in-plane position of the chip component mounted on the chip slider.

6. The mounting device according to any one of claims 1 to 5, A mounting apparatus in which, in a state in which the chip component is held by the attachment tool and faces the substrate, the substrate position recognition means simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

7. The mounting device according to any one of claims 1 to 5, The mounting apparatus, in a state where the chip component is not being held, wherein the board position recognition means acquires position information of the board recognition mark.

8. The mounting device according to claim 7, A mounting apparatus that brings the attachment tool closer to the upper surface of the substrate until the distance between the lower surface of the attachment tool and the upper surface of the substrate becomes approximately equal to the thickness of the chip component, and simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

9. Using the mounting device according to any one of claims 1 to 5, A mounting method for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising the steps of: a substrate holding step of holding the substrate on a substrate stage; a chip holding step of holding the chip component with an attachment tool having a tool recognition mark; a chip position information acquiring step of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; a substrate position information acquiring step of acquiring position information of the tool recognition mark and the substrate recognition mark while the chip component is held by the attachment tool and faces the substrate; A mounting method comprising an alignment process for adjusting the position of the chip component in an in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

10. Using the mounting device according to any one of claims 1 to 5, A mounting method for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising the steps of: a substrate holding step of holding the substrate on a substrate stage; a substrate position information acquiring step of acquiring position information of the substrate recognition mark; a chip holding step of holding the chip component with the attachment tool; a chip position information acquiring step of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; A mounting method comprising an alignment process for adjusting the position of the chip component in an in-plane direction of the substrate based on relative position information between the tool recognition mark and the chip recognition mark.

11. The mounting method according to claim 10, In the board position information acquisition step, the distance between the lower surface of the attachment tool and the upper surface of the board is set to be approximately equal to the thickness of the chip component, and position information of the board recognition mark and the tool recognition mark is acquired.

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