Component mounting device and component mounting method

Abstract

To provide a component mounting apparatus capable of determining a head movement speed by taking into account illumination condition for each component retained by each nozzle, shortening time required for capturing and recognizing components as much as possible to improve productivity, and suppressing reduction in component recognition accuracy.SOLUTION: A component mounting apparatus 1 includes: a head having a plurality of nozzles arranged along a first direction in a plurality of rows in a direction orthogonal to the first direction; a movement controlling unit for moving the head along the first direction; an image capturing unit including an illumination unit that illuminates each component retained by each nozzle of the head and captures the components from below; an image capturing control unit for controlling image capturing by the image capturing unit and illumination conditions by the illumination unit at the time of the image capturing; a component recognition unit for recognizing the components from the image captured by the image capturing unit; and a component mounting unit for mounting the components on a substrate with the head on the basis of a recognized result by the component recognition unit. The movement controlling unit controls a movement speed of the head which moves above the image capturing unit in the first direction on the basis of the illumination conditions at the time of the image capturing for each components retained by each nozzle of the head.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] Conventionally, there is known a component mounter that mounts electronic components on a board (see, for example, Patent Document 1). The component mounter of Patent Document 1 is equipped with a camera that captures components such as electronic components and circuit boards illuminated by a light source. This component mounter includes an image processing means that processes the image signal of the camera every time a component is captured by the camera while the component mounter is in operation, thereby recognizing component information such as the position and orientation of the component, and detects the brightness of a predetermined portion of the captured image of the component, and a brightness adjustment means that adjusts the shutter speed of the camera and / or the illumination luminance of the light source based on the brightness detected by the image processing means while the component mounter is in operation. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-210531 A Summary of the Invention [Problem to be solved by the invention]

[0004] It is assumed that the light source disclosed in Patent Document 1 is used to capture and recognize components picked up by nozzles mounted on a head in which the nozzles are arranged in multiple rows along a predetermined direction while moving (scanning) above the camera. In this case, the component mounter of Patent Document 1 detects the brightness of the captured image of the component each time the camera captures an image of the component, and adjusts the camera shutter speed or the illumination level of the light source, etc., so that the illumination conditions are set for each component held by each nozzle before capturing the image. Therefore, the head movement speed is slowed down in order to adjust the illumination conditions for each component, and it may take a long time to capture and recognize the components. On the other hand, if the head movement speed is made too fast, the recognition accuracy of the components based on the captured image may decrease.

[0005] The present disclosure provides a component mounting device and a component mounting method that can determine the head movement speed by taking into account the lighting conditions for each component held in each nozzle, and that can reduce the time required to image and recognize the components as much as possible, thereby improving productivity, while suppressing a decrease in component recognition accuracy. [Means for solving the problem]

[0006] One aspect of the present disclosure includes a head having a plurality of nozzles arranged along a first direction, the nozzles being arranged in a plurality of rows in a direction perpendicular to the first direction; a movement control unit that moves the head along the first direction; an imaging unit that includes an illumination unit that illuminates each component held by each nozzle of the head and images the components from below; an imaging control unit that controls imaging by the imaging unit and illumination conditions by the illumination unit at the time of imaging; a component recognition unit that recognizes the components from an image captured by the imaging unit; and a component mounting unit that mounts the components on a board with the head based on a recognition result by the component recognition unit, wherein the movement control unit controls a movement speed of the head that moves in the first direction above the imaging unit based on the illumination conditions at the time of imaging for each component held in each nozzle of the head. and determining whether or not illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the plurality of rows possessed by the head, and moving the head at a first speed if the illumination conditions are the same for all nozzle sets, and moving the head at a second speed slower than the first speed if the illumination conditions are different for at least one nozzle set. , a component mounting device.

[0007] One aspect of the present disclosure includes a step of moving a head along the first direction, the head having a plurality of nozzles arranged along the first direction and arranged in a plurality of rows in a direction perpendicular to the first direction; a step of controlling lighting conditions at the time of imaging by an illumination unit that illuminates components held by each nozzle of the head and controlling imaging by an imaging unit that images the components from below; a step of recognizing the components from an image captured by the imaging unit; and a step of mounting the components on a board by the head based on a result of the component recognition, wherein the step of moving the head includes a step of controlling a moving speed of the head moving in the first direction above the imaging unit based on lighting conditions at the time of imaging each component held by each nozzle of the head. the step of controlling the movement speed of the head includes a step of determining whether or not illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the plurality of rows held by the head, and a step of moving the head at a first speed if the illumination conditions are the same for all nozzle sets, and moving the head at a second speed slower than the first speed if the illumination conditions are different for at least one nozzle set. , a component mounting method. Effect of the Invention

[0008] According to the present disclosure, the head movement speed can be determined taking into account the lighting conditions for each component held by each nozzle, thereby shortening the time required to image and recognize the components as much as possible, thereby improving productivity while suppressing a decrease in component recognition accuracy. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a top view illustrating a mechanical configuration of a component mounting device according to a first embodiment; [Diagram 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device shown in FIG. [Diagram 3] FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. [Figure 4] FIG. 3 is a side view illustrating a mechanical configuration of the part recognition camera shown in FIG. [Diagram 5] FIG. 5 is a perspective view illustrating a mechanical configuration of the lighting unit shown in FIG. [Figure 6A] FIG. 2 is a schematic diagram illustrating an arrangement of a plurality of component holding nozzles on a moving head; [Figure 6B] FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device shown in FIG. [Figure 7A] FIG. 13 is a schematic diagram illustrating each image capture timing and each image capture range in a time-shifted lighting mode; [Figure 7B] FIG. 13 is a schematic diagram illustrating an example of an imaging timing and an imaging range in a simultaneous lighting mode; [Figure 8] A table showing an example of the determination result of simultaneous lighting possible determination for each nozzle set. [Figure 9] 1 is a flowchart illustrating an example of an operation of a component mounting device. [Figure 10] 9 is a flow chart illustrating the operation of the component mounting device; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters or duplicate explanation of substantially the same configuration may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0011] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0012] <Mechanical configuration of the component mounting device> First, the mechanical configuration of the component mounting device 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to the first embodiment. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Fig. 1. In Fig. 1 and Fig. 2, the front side of the component mounting device 1 (the lower side on the paper surface of Fig. 1 and the left side on the paper surface of Fig. 2) is also referred to as the front side, and the back side of the component mounting device 1 (the upper side on the paper surface of Fig. 1 and the right side on the paper surface of Fig. 2) is also referred to as the rear side.

[0013] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W to manufacture the board, and mount the components P in a predetermined position and attitude on the board W transported from upstream of the mounting board manufacturing line.

[0014] As shown in Figs. 1 and 2, the component mounting apparatus 1 includes a main body mechanism unit 10 (an example of a component mounting unit) that mounts components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, and capacitors, lead components, chip components, or BGA (Ball Grid Array) components) on a board W mainly through the operation of each component mechanism, and a control unit 40 that controls the operation of the main body mechanism unit 10. The main body mechanism unit 10 includes a mounting machine main body 11 including a base 12, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0015] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0016] A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

[0017] The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its underside, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20. A reel 21 is housed in each of the plurality of reel stock units. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where pick-up is performed by a moving head 26 of a head unit 23 described below.

[0018] Head unit 23 is disposed above base 12, and configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is capable of linear movement along the X and Y directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0019] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0020] A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to moving head 26 picks up and holds a component P from component supply mechanism 15 and moves and passes above component recognition camera 28. At this time, component recognition camera 28 images the component P sucked and held by component holding nozzle 27 as it passes at a predetermined timing and under predetermined lighting conditions (see below). The image capture result is subjected to a recognition process, whereby identification and position detection of component P can be performed with high accuracy.

[0021] Furthermore, a nozzle holder 38 and a waste box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P and the like determined to be defective as a result of image capture by the component recognition camera 28 are discarded.

[0022] <About the configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0023] The moving head 26 is a multiple head having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each moving head 26 (see FIG. 6A). For example, the moving head 26 is provided with a plurality of component holding nozzles 27 (e.g., eight nozzles) in a plurality of rows (e.g., two rows). In addition, a reflector (an example of a first reflector) (not shown) is fixed to the moving head 26 for reflecting illumination light emitted from a transmitted illumination unit 34 (see below). The reflector is disposed above the held component P.

[0024] Each of the component holding nozzles 27 vacuum-sucks and holds a component P from the tape feeder 18 of the component supply mechanism 15, for example, by using air pressure, and moves up and down individually. The moving head 26 further includes a Z-axis lifting mechanism (not shown) for individually lifting and lowering each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) for individually rotating each of the component holding nozzles 27 about the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). By this movement, the moving head 26 sucks up the component P with the component holding nozzle 27 from the take-out position of the tape feeder 18 of the component supply mechanism 15 and takes it out.

[0025] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image capture result (image capture information) is similarly subjected to recognition processing to detect the position and posture of the board W.

[0026] As a result of detecting the position of the board W, the moving head 26 places the components P at their respective mounting points (e.g., the mounting positions and mounting orientations on the board W where the components P are to be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This mounting of the components P at one time is continued until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

[0027] The component mounting device 1 repeatedly executes a series of operations of picking up and mounting multiple components P using the component holding nozzle 27 of the moving head 26, and then moving the moving head 26 back to the pick-up position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in cooperation with each other, and this cooperative operation is executed in accordance with instructions from the control unit 40.

[0028] In the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position and the subsequent return movement to the removal position is also referred to as a work unit of "one turn." The forward movement from the removal position to the mounting work position in one turn is also referred to simply as "forward movement in one turn" below.

[0029] <About the configuration of the parts recognition camera> Next, the configuration of the component recognition camera 28 will be described with reference to Figures 4 and 5. Figure 4 is a side view illustrating an example of the mechanical configuration of the component recognition camera 28 shown in Figure 2. Figure 5 is a perspective view illustrating an example of the mechanical configuration of the lighting unit section 31 shown in Figure 4. For ease of explanation, Figure 4 also illustrates the moving head 26 that moves above the component recognition camera 28 and on its optical axis, and also illustrates a schematic diagram of the internal structure of the lighting section of the component recognition camera 28, as described below.

[0030] 4, the component recognition camera 28 has an image sensor section 29 and an illumination unit section 31. The component recognition camera 28 turns on the illumination unit section 31 for the component P held by the moving head 26 only during one outward movement (i.e., one-way outward movement) in one turn, and successively captures images from below using the image sensor section 29 in accordance with that timing.

[0031] The component recognition camera 28 can capture images according to a scan imaging method, and has an ROI (Region Of Interest) function using an area sensor. The component recognition camera 28 can capture images by setting multiple ROI ranges for the imaging sensor unit 29 using the ROI function, and successively switching between these ROI ranges. The ROI range corresponds to the imaging range of the imaging sensor unit 29. The set ROI ranges may differ in position, size, etc.

[0032] The imaging sensor unit 29 has a substantially cylindrical housing 30 and an imaging element (not shown) built into the housing 30. The imaging element is, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The imaging sensor unit 29 has a shutter function and is configured to be able to capture an image by exposing the image at a predetermined timing according to a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the result of imaging by the imaging element (imaging information) to the control unit 40.

[0033] Furthermore, the component recognition camera 28 has a center camera 29A and a side camera 29B as the imaging sensor unit 29. The center camera 29A is disposed so that its optical axis is along the vertical direction (Z direction) and is capable of capturing an image of the component P moving above the component recognition camera 28. The side cameras 29B are disposed on both sides of the center camera 29A in the horizontal direction and are disposed so that their optical axes are inclined with respect to the vertical direction (Z direction) and are capable of capturing an image of the component P moving above the component recognition camera 28.

[0034] The lighting unit section 31 has a box-shaped housing 32, and is arranged in a stacked and connected state on the upper side of the housing 30 of the imaging sensor section 29. The lighting unit section 31 has a plurality of reflective lighting sections 33, a plurality of transmitted lighting sections 34, a plurality of side lighting sections 35, and a coaxial lighting section 39, which are respectively arranged inside the housing 32. By appropriately using the plurality of reflective lighting sections 33, the plurality of transmitted lighting sections 34, the plurality of side lighting sections 35, and the coaxial lighting section 39, the component mounting device 1 turns on the lighting for the moving component P, for example, under lighting conditions according to the component P, and captures an image of the component P.

[0035] Each of the multiple reflective illumination sections 33 is disposed approximately parallel to the bottom wall 32p (i.e., the XY plane, horizontal plane) of the housing 32 of the illumination unit section 31, and the illumination direction is set along the optical axis of the center camera 29A. When the reflective illumination section 33 is turned on, the illumination light is emitted approximately along the vertical direction (approximately the Z direction). Between the reflective illumination section 33 and the component holding nozzle 27 that holds the component P to be illuminated, a transmission glass G is disposed along the horizontal direction. Reflective illumination is also called oblique illumination.

[0036] The component P held by the component holding nozzle 27 is illuminated by the reflective illumination unit 33 at any timing while the component P moves above the component recognition camera 28, and the light passes through the transmission glass G to illuminate the underside of the component P. In response to this illumination timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0037] Each of the multiple transillumination units 34 is disposed obliquely with respect to the bottom wall 32p and side wall 32q (i.e., Z direction) of the housing 32, and the irradiation direction is set obliquely with respect to the optical axis of the center camera 29A. A shielding plate B is disposed between each of the reflective illumination units 33 and the transillumination units 34. The shielding plate B is also disposed obliquely with respect to both the bottom wall 32p and side wall 32q of the housing 32.

[0038] When the transmitted illumination unit 34 is turned on, the illumination light is emitted obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). At any timing while the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the transmitted illumination unit 34 turns on the reflector of the moving head 26, thereby illuminating the component P. In response to this lighting timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0039] Each of the side lighting sections 35 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and the illumination direction is perpendicular to the optical axis of the center camera 29A. The side lighting sections 35 are disposed above the reflective illumination section 33 and the transmitted illumination section 34. When the side lighting section 35 is turned on, the illumination light is emitted along a horizontal plane.

[0040] The component P held by the component holding nozzle 27 is illuminated by the side illumination unit 35 at any timing while the component P moves above the component recognition camera 28, thereby illuminating the sides of the component P. In response to this illumination timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0041] The coaxial lighting section 39 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and its irradiation direction is perpendicular to the optical axis of the center camera 29A. The coaxial lighting section 39 is disposed below the reflective lighting section 33. When the coaxial lighting section 39 is turned on, the illumination light is irradiated along a horizontal plane. In addition, the component recognition camera 28 is provided with a reflector C (e.g., a mirror) (an example of a second reflector) at a position separated from the coaxial lighting section 39 in the XY plane. The coaxial lighting section 39 turns on the reflector C to illuminate the area above the reflector C.

[0042] At any timing while the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the coaxial illumination unit 39 lights up the reflector C, and as a result, the underside of the component P is illuminated through the transmission glass G. In response to this lighting timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

[0043] The illumination timings of the illumination units may overlap, and a plurality of illumination units may be turned on simultaneously to illuminate the component P. Which illumination unit is used for illumination may be determined based on the illumination conditions.

[0044] In accordance with instructions from the control unit 40, while the part P is moving above the part recognition camera 28, the part recognition camera 28 turns on the lighting unit section 31 according to the lighting conditions corresponding to the part P and captures an image, thereby detecting an image in which the part P appears.

[0045] As shown in FIG. 5, in the lighting unit section 31, a plurality of side lighting sections 35 are arranged in a circular ring shape along the horizontal direction. A plurality of reflective lighting sections 33 are arranged on the negative side of the side lighting sections 35 in the Z direction. The central section surrounded by the plurality of reflective lighting sections 33 is a space where no illumination is present. A plurality of transmitted lighting sections 34 are arranged on the outer side (opposite side of the central section) of the plurality of reflective lighting sections 33. A coaxial lighting section 39 and a reflector C are arranged on the negative side of the reflective lighting sections 33 in the Z direction. The light irradiated by the coaxial lighting section 39 is reflected by the reflector C, passes through the central section surrounded by the plurality of reflective lighting sections 33, and travels to the positive side of the Z direction.

[0046] <Example of arrangement of each component holding nozzle of the moving head> FIG. 6A is a schematic diagram illustrating an example of an arrangement of a plurality of component holding nozzles 27 of moving head 26. As shown in FIG.

[0047] In FIG. 6A, the moving head 26 has, for example, eight component holding nozzles 27 capable of holding components P arranged in two rows along the moving direction A of the moving head 26. Note that two rows and eight nozzles are merely an example, and other multiple number of rows and multiple numbers may be used. The position of the component recognition camera 28 is fixed. As the moving head 26 moves, the component recognition camera 28 sequentially captures images of each component P held by the two rows of component holding nozzles 27. In this case, two components P held by two component holding nozzles 27 at the same position in each row along the moving direction A (for example, the first nozzle position, the second nozzle position, ... from the right in FIG. 6A) are captured simultaneously or at different times.

[0048] In addition, the multiple component holding nozzles 27 at the same position along the moving direction A in each row of the moving head 26 are also referred to as a "nozzle set." The moving head 26 illustrated in FIG. 6A has eight nozzle sets NS. For the sake of explanation, the component holding nozzles 27 arranged in the row on the upper side of FIG. 6A (the end side of FIG. 7A described later) among the multiple component holding nozzles 27 in the moving head 26 are also referred to as "front row nozzles" (first row nozzles). Similarly, for the sake of explanation, the component holding nozzles 27 arranged in the row on the lower side of FIG. 6A (the center side of FIG. 7A described later) among the multiple component holding nozzles 27 in the moving head 26 are also referred to as "rear row nozzles" (second row nozzles). The front row nozzles NA hold the components PA. The rear row nozzles NB hold the components PB.

[0049] <Software configuration of component placement device> Next, a software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to the drawing. Fig. 6B is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

[0050] The control unit 40 of the component mounting device 1 is configured by a general-purpose computer, and a program as software stored and held in a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory) of the computer is executed by an arithmetic unit such as a CPU (Central Processing Unit). That is, each block shown in the control unit 40 in Fig. 6 represents a function realized by software such as a program. However, the function represented by each block is not limited to software, and each may be configured by hardware as a physical configuration of an "apparatus."

[0051] The control unit 40 includes a storage unit 41, an operation mode setting unit 45, a mechanism driving unit 46, and an image capturing processing unit 47. The storage unit 41 stores and holds at least part information 42a, lighting condition information 42b, image capturing timing information 42c, and moving speed information 42d. The image capturing processing unit 47 includes a camera control unit 48 and a part recognition unit 50.

[0052] The operation mode setting unit 45 sets the operation mode of the component mounting device 1. For example, the operation mode setting unit 45 sets the operation mode based on the illumination conditions at the time of imaging each component P held by each component holding nozzle 27 of the moving head 26. The setting information of the operation mode may be stored in the storage unit 41. The operation modes include a simultaneous lighting mode and a time-delay lighting mode. The simultaneous lighting mode is an operation mode in which each component P held by the component holding nozzles 27 in the same nozzle set NS is illuminated at the same imaging timing and is imaged collectively within a common imaging range. The time-delay lighting mode is an operation mode in which each component P held by the component holding nozzles 27 in the same nozzle set NS is illuminated at different imaging timing and is imaged individually within different imaging ranges.

[0053] The operation mode setting unit 45 performs a simultaneous lighting possible determination for each nozzle set NS. In the simultaneous lighting possible determination, it is determined whether or not the illumination conditions of each component P (e.g., components PA, PB) held by multiple component holding nozzles 27 (e.g., front row nozzles NA and rear row nozzles NB) in the same nozzle set NS are the same. In the simultaneous lighting possible determination, it is determined that simultaneous lighting is possible or that simultaneous lighting is not possible (also described as time-delay lighting is possible). The operation mode setting unit 45 determines that simultaneous lighting is possible when the above illumination conditions are the same, and determines that time-delay lighting is possible when the above illumination conditions are different.

[0054] The operation mode setting unit 45 determines the operation mode based on the result of the simultaneous lighting possible determination for each nozzle set NS. If it is determined that time-delay lighting is possible in at least one nozzle set NS, that is, if the illumination conditions of the part PA held by the front row nozzles NA in the same nozzle set NS and the illumination conditions of the part PB held by the rear row nozzles NB are different in at least one nozzle set NS, the operation mode setting unit 45 sets the operation mode to the time-delay lighting mode. If it is determined that simultaneous lighting is possible in all nozzle sets NS, that is, if the illumination conditions of the part PA held by the front row nozzles NA in the same nozzle set NS and the illumination conditions of the part PB held by the rear row nozzles NB are the same in all nozzle sets NS, the operation mode setting unit 45 sets the operation mode to the simultaneous lighting mode.

[0055] The operation mode setting unit 45 acquires production data from, for example, an external device, and performs simultaneous lighting possible determination and setting of the operation mode based on the production data. This production data may include information such as the type of each component P mounted on the board W, and may be data summarizing the mounting position or mounting posture of each component P on the board W. The operation mode may be set, for example, each time production data is acquired. The production data may include information on multiple (for example, 16) components P held at one time by each component holding nozzle 27 of the moving head 26, and different production data may be acquired each time. Therefore, the operation mode setting unit 45 may acquire production data for each turn, and set the simultaneous lighting mode or the time-delay lighting mode as the operation mode based on the production data. The operation mode setting unit 45 is capable of switching between the simultaneous lighting mode and the time-delay lighting mode at each turn based on the production data.

[0056] The operation mode setting unit 45 may identify each component P held by each component holding nozzle 27 based on the production data, i.e., may obtain the type of component P. Then, the operation mode setting unit 45 may refer to the illumination condition information 42b to determine each illumination condition corresponding to the type of each component P. Furthermore, the operation mode setting unit 45 may refer to the imaging timing information 42c to determine the imaging timing based on the operation mode. Furthermore, the operation mode setting unit 55 may refer to the movement speed information 42d to determine the movement speed of the moving head 26 based on the operation mode.

[0057] The component information 42a stores information such as the outer shape of each type of component P, the presence or absence of electrodes, and the number of electrodes. The component information 42a is used to recognize the component P, for example.

[0058] The illumination condition information 42b stores information about the illumination conditions when capturing an image of the component P. The illumination conditions may differ for each component P to be illuminated and held by the component holding nozzle 27, and may be determined for each type of component P. Thus, the illumination conditions may be determined for each position of each component holding nozzle 27 that holds each component P in the moving head 26.

[0059] The lighting condition information 42b may include information on the brightness (e.g., lighting value) of each lighting channel formed for each lighting unit for illuminating each component P. The lighting value corresponds to, for example, the current value flowing through each lighting (e.g., LED) of each lighting channel, and is a value representing the level of LED current, and is also called a lamp value. The lighting value may take any value within a range of, for example, 0 to 255. The lighting condition information 42b may include information indicating whether each lighting channel is turned on or off (i.e., whether it is turned on or off). The information indicating whether each lighting channel is turned on or off may include information on a combination of multiple lighting channels to be turned on.

[0060] Furthermore, the lighting condition information 42b may include information on the overall brightness of the lighting by the lighting unit section 31, instead of information on the brightness of each lighting channel. In other words, the lighting value may correspond to a value indicating the overall brightness of the lighting by the lighting unit section 31, instead of the individual brightness of each lighting channel, for example.

[0061] Each illumination channel may include a reflected illumination channel, a transmitted illumination channel, a side illumination channel, and a coaxial illumination channel. The reflected illumination channel is an illumination channel formed by one or more reflected illumination units 33. The transmitted illumination channel is an illumination channel formed by one or more transmitted illumination units 34. The side illumination channel is an illumination channel formed by one or more side illumination units 35. The coaxial illumination channel is an illumination channel formed by a coaxial illumination unit 39. Each illumination channel has a different illumination unit used for illumination, a different illumination direction, etc., i.e., a different illumination method.

[0062] The lighting and extinguishing of a lighting channel may be indicated by the lighting value of the lighting channel. For example, a lighting value of 0 may indicate the lighting channel, and a lighting value of any value between 1 and 255 may indicate that the lighting channel is turned on. Note that when the lighting conditions are switched, if the lighting channel to be turned on is switched, the lighting value of each lighting channel does not need to be switched. Also, when the lighting conditions are switched, if the lighting value is switched, the lighting channel to be turned on does not need to be switched.

[0063] The imaging timing information 42c stores information about imaging timing (shutter timing) for imaging the component P. The imaging timing information 42c may store, for example, information about the timing of illumination and camera imaging (also simply referred to as imaging timing) during one turn of forward movement. The imaging timing may be determined for each operation mode.

[0064] The moving speed information 42d stores information on the moving speed of the moving head 26. The moving speed may be determined for each operation mode. For example, the moving speed information 42d includes high speed information used when the operation mode is set to the simultaneous lighting mode, and medium speed information used when the operation mode is set to the time-difference lighting mode. The moving speed information 42 may include other (e.g., low) speed information. The high speed is, for example, speed V1 (e.g., 2 to 3 m / sec). The medium speed is, for example, speed V2 (e.g., 1 to 2 m / sec).

[0065] The mechanism driving unit 46 controls the main body mechanism unit 10, and for example controls the driving of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in coordination with each other. The mechanism driving unit 46 controls the moving head 26 of the head unit 23. The control of the moving head 26 includes controlling the movement of the moving head 26, or controlling the suction of the components P by the component holding nozzles 27 of the moving head 26. The control of the moving head 26 also includes controlling the speed of the moving head 26. The mechanism driving unit 46 may control the moving speed (scanning speed) of the moving head 26 when passing above the component recognition camera 28 based on the operation mode. The mechanism driving unit 46 may also control the speed of the moving head 26 based on a user operation via an operation device (not shown) of the component mounting device 1.

[0066] The camera control unit 48 of the imaging processing unit 47 controls the imaging by the imaging sensor unit 29 of the component recognition camera 28 and the lighting conditions by the lighting unit unit 31 at the time of imaging. The camera control unit 48 also determines the imaging range for imaging each component P based on the operation mode. Thus, the camera control unit 48 illuminates the component P at the imaging timing, lighting conditions, and imaging range based on the production data and the operation mode, for example, to capture an image in which the component P appears. The captured image is transmitted to the component recognition unit 50.

[0067] Therefore, under the control of the camera control unit 48, the component recognition camera 28 captures an image of each component P during its forward movement in one turn, with the imaging timing, imaging range, and lighting conditions according to the operation mode.

[0068] Based on the multiple acquired images, the component recognition section 50 of the imaging processing section 47 recognizes the features of each component P held by the component holding nozzle 27. The features of the component P may include, for example, the position of the component P, the orientation of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, characters added to the component P, or alignment. The alignment here refers to the arrangement of one or more electrodes in the component P.

[0069] The component recognition unit 50 sends information on the recognition result to the mechanism driving unit 46. Based on the recognition result, the mechanism driving unit 46 controls the movement of the moving head 26 of the head unit 23. Based on the recognition result by the component recognition unit 50, the head unit 23 mounts the component P on the board W at a predetermined position and attitude by the moving head 26.

[0070] The polarity of a component P indicates the front and back of the component P. For example, the polarity (front and back) may be indicated by chamfering a predetermined portion of the component P (for example, one of the four corners (for example, the lower left corner)). For example, the component P is mounted so that a chamfer is present at a predetermined portion. Furthermore, the polarity may be determined based on whether or not there is a character in the center of the component P, along with the chamfering at the predetermined portion.

[0071] In addition, the imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47, which, like the component recognition unit 50, recognizes the position and posture of the board W from the imaging information (image) and transmits the recognition result to the mechanism driving unit 46.

[0072] Next, imaging control and movement control in each operation mode will be described.

[0073] Fig. 7A is a schematic diagram illustrating each imaging timing and each imaging range in the time-difference lighting mode. In Fig. 7A, since it is the time-difference lighting mode, the illumination conditions of each component P in at least one nozzle set NS are different.

[0074] In the time-lag lighting mode, the mechanism driving unit 46 sets the moving speed of the moving head 26 to speed V2 (an example of a medium speed) and moves the moving head 26 above the component recognition camera 28. By setting the moving speed to speed V2, the component mounting device 1 can secure time to switch the illumination conditions and capture images of each component P in the same nozzle set NS. In addition, in the time-lag lighting mode, the camera control unit 48 controls each nozzle set NS to capture images of each component P at different imaging timings and in different imaging ranges under each illumination condition for capturing an image of each component P. For example, the component recognition camera 28 captures an image of a component PA held by a front row nozzle NA in a specific nozzle set NS under illumination condition LA, imaging timing TA, and imaging range CA. For example, the component recognition camera 28 captures an image of a component PB held by a rear row nozzle NB in ​​a specific nozzle set NS under illumination condition LB, imaging timing TB, and imaging range CB. In other words, the camera control unit 48 images the part PA under lighting conditions LA at the imaging timing TA (first imaging for a specified nozzle set NS), and then images the part PB under lighting conditions LB at the next imaging timing TB immediately (after a short time) after the imaging timing TA (second imaging for a specified nozzle set NS).

[0075] The imaging range CA is a range in which the component PA held by the front row nozzle NA of a given nozzle set NS is captured, but the component PB held by the rear row nozzle is not captured. The imaging range CB is a range in which the component PB held by the rear row nozzle NB of a given nozzle set NS is captured, but the component PA held by the front row nozzle NA is not captured. The imaging ranges CA and CB may have the same shape and size.

[0076] In this way, when the component mounting device 1 is set to the time-delay lighting mode, the moving speed of the moving head 26 is set to a medium speed, so that the lighting conditions and the imaging range can be switched and imaging can be performed multiple times while the moving head 26 is moving. Therefore, the component mounting device 1 can reliably capture images of each component P and prevent a decrease in the recognition accuracy of the component P.

[0077] Fig. 7B is a schematic diagram illustrating an example of the imaging timing and imaging range in the simultaneous lighting mode. In Fig. 7B, since the simultaneous lighting mode is used, the illumination conditions of each component P of each nozzle set NS are the same for all nozzle sets NS.

[0078] In the simultaneous lighting mode, all the illumination conditions of all the nozzle sets NS may be the same. For example, all the illumination conditions of all the nozzle sets NS may be the same as the illumination condition LC1. In the simultaneous lighting mode, each illumination condition in the same nozzle set NS is the same in all the nozzle sets NS, but the illumination conditions between different nozzle sets NS may be different. For example, each illumination condition of the parts PA and PB held in the front row nozzles NA and rear row nozzles NB of the first nozzle set may be illumination condition LC11, each illumination condition of the parts PA and PB held in the front row nozzles NA and rear row nozzles NB of the second nozzle set may be illumination condition L12, and each illumination condition of the parts PA and PB held in the front row nozzles NA and rear row nozzles NB of the third nozzle set may be illumination condition LC13. Note that the illumination conditions LC1, LC11, LC12, and LC13 are examples of the illumination condition LC.

[0079] In the simultaneous lighting mode, the mechanism driving unit 46 sets the moving speed of the moving head 26 to a speed V1 (an example of a high speed) that is faster than the speed V2, and moves the moving head 26 above the component recognition camera 28. By setting the moving speed to the speed V1, the component mounting device 1 can capture images of each component P at high speed without switching the illumination conditions and imaging range in each nozzle set NS. In addition, in the simultaneous lighting mode, the camera control unit 48 controls each nozzle set NS to capture images of each component P under the same illumination conditions for capturing images of each component P, at the same imaging timing, and in the same imaging range. For example, the component recognition camera 28 captures images of the components PA held by the front row nozzles NA and the components PB held by the rear row nozzles NB in ​​a given nozzle set NS collectively under illumination conditions LC, imaging timing TC, and imaging range CC. In other words, the multiple components PA and PB of the same nozzle set NS are included in the same imaging range CC at the same time and are captured at the same time. The imaging range CC is a range in which the multiple components P held by each component holding nozzle 27 of the same nozzle set NS are captured.

[0080] In this way, when the illumination conditions for each component P of each nozzle set NS are the same for all nozzle sets NS, the component mounting device 1 does not need to switch illumination conditions to capture images of multiple components PA, PB in the same nozzle set NS. Therefore, the component mounting device 1 can capture images of each component PA, PB once under the same illumination conditions LC, in the same imaging range CC, and at the same imaging timing TC. Therefore, even if the moving head 26 is moved at high speed, the component mounting device 1 can illuminate and capture each component PA, PB under the same desired illumination conditions. Therefore, the component mounting device 1 can increase the imaging speed of each component P, and even in this case, each component P can be imaged under the desired illumination conditions, thereby preventing a decrease in the recognition accuracy of the component P.

[0081] <Determining whether each nozzle set can be lit simultaneously> Next, an example of the determination result of simultaneous illumination possibility determination for each nozzle set NS will be described.

[0082] Fig. 8 is a table illustrating the results of simultaneous lighting possible determination for each nozzle set NS. Table T1 in Fig. 8 shows the results of simultaneous lighting possible determination according to the type of component PA held by the front row nozzles NA (also referred to as the front row side suction component type) and the type of component PB held by the rear row nozzles NB (also referred to as the rear row side suction component type). The type of component P includes, for example, chip components, lead components, BGA components, etc. Illumination conditions are determined according to the type of component P. Note that in Fig. 8, when simultaneous lighting is possible, it is simply written as "simultaneous", and when time-difference lighting is possible, it is simply written as "time difference".

[0083] Table T1 holds a number of patterns 1 to 6, each including information on the type of component that can be picked up on the front row, information on the type of component that can be picked up on the rear row, and information on the result of a simultaneous lighting possibility determination for a combination of the type of component that can be picked up on the front row and the type of component that can be picked up on the rear row. The front row nozzles NA and the rear row nozzles NB in ​​the same pattern in table T1 are component holding nozzles 27 included in the same nozzle set NS. Each pattern here assumes that default lighting conditions, default lighting channels and lighting values ​​are used. Note that the types of components P shown in table T1 are merely examples, and other types of components P may be included.

[0084] Pattern 1 indicates that when the type of component PA held by the front row nozzles NA is a chip component and the type of component PB held by the rear row nozzles NB is a lead component, they can be lit simultaneously. Chip components are illuminated, for example, by a reflected illumination channel. Lead components are illuminated, for example, by a reflected illumination channel. Thus, in pattern 1, the illumination conditions for the components PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

[0085] In pattern 2, when the type of component PA held by the front row nozzles NA is a chip component and the type of component PB held by the rear row nozzles NB is a BGA component, time-shift lighting is possible. Since BGA components have ball-shaped electrodes, they are illuminated by, for example, side illumination channels. Therefore, in pattern 2, the illumination conditions for the components PA and PB in the same nozzle set NS are different, and it is determined that time-shift lighting is possible.

[0086] Pattern 3 indicates that time-shift lighting is possible when the type of component PA held by the front row nozzles NA is a lead component and the type of component PB held by the rear row nozzles NB is a BGA component. In pattern 3, the illumination conditions for the components PA and PB in the same nozzle set NS are different, and it is determined that time-shift lighting is possible.

[0087] Pattern 4 indicates that the type of component PA held by the front row nozzles NA is a chip component, and the type of component PB held by the rear row nozzles NB is a chip component, and they can be lit simultaneously. In pattern 4, the illumination conditions for the components PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

[0088] In pattern 5, when the type of component PA held by the front row nozzles NA is a lead component and the type of component PB held by the rear row nozzles NB is a lead component, it is indicated that they can be lit simultaneously. In pattern 5, the illumination conditions of the components PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

[0089] Pattern 6 indicates that the type of component PA held by the front row nozzles NA is a BGA component, and the type of component PB held by the rear row nozzles NB is a BGA component, and thus they can be lit simultaneously. In pattern 6, the illumination conditions for the components PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

[0090] The operation mode setting unit 45 identifies each of the components PA, PB held by the front row nozzles NA and rear row nozzles NB of each nozzle set NS based on the production data, and identifies the illumination conditions of each of the components PA, PB. Based on the illumination conditions of each of the identified components PA, PB, the operation mode setting unit 45 determines whether each of the nozzle sets NS can be turned on simultaneously or with a time lag, as exemplified in table T1.

[0091] In addition, in the patterns 1 to 6 of the table T1, it is assumed that the lighting conditions for each component P are default settings. The default settings of the lighting conditions for each component P may be included in the lighting condition information 42b and stored in the storage unit 41. Here, the lighting conditions may be other than the default settings. For example, the operation mode setting unit 45 may acquire input information for changing the lighting conditions (lighting channel or lighting value, etc.) from the user via an operation device (not shown) provided in the component mounting device 1. The operation mode setting unit 45 may adjust the lighting channel or lighting value, etc. based on the input information. In this case, even if the lighting conditions for imaging each component P are the same in the default settings as in the patterns 1, 4 to 6 and it is determined that simultaneous lighting is possible, the lighting conditions are no longer the same by changing the lighting channel or lighting value, etc. For this reason, in this case, the operation mode setting unit 45 may determine that simultaneous lighting is not possible (time-difference lighting is possible) in the corresponding nozzle set NS.

[0092] <Component mounting device operation> Next, the operation of the component mounting apparatus 1 will be described. 9 and 10 are flow charts illustrating the operation of the component mounting apparatus 1. A counter posF (an integer variable) for sequentially counting the front row nozzles NA of the multiple nozzle sets NS of the moving head 26 is stored in the memory unit 41 of the control unit 40. Similarly, a counter posR (an integer variable) for sequentially counting the rear row nozzles NB of the multiple nozzle sets NS is stored in the memory unit 41 of the control unit 40.

[0093] 6A, it is assumed that the moving head 26 has 2 rows x 8 component holding nozzles 27, and that the front row nozzles NA are identified by identification numbers 1 to 8, and the rear row nozzles NB are identified by identification numbers 9 to 16. For example, the front row nozzles NA and rear row nozzles NB are arranged in ascending order of their identification numbers (1, 2, 3, ... and 9, 10, 11, ...) starting from the moving direction side of the moving head 26 in the moving direction A. Therefore, the combination of the front row nozzles NA and rear row nozzles NB of each nozzle set NS is expressed as follows, when each nozzle set NS = (identification number of the front row nozzles NA, identification number of the rear row nozzles NB). That is, the first nozzle set NS = (1, 9), the second nozzle set NS = (2, 10), the third nozzle set NS = (3, 11), the fourth nozzle set NS = (4, 12), the fifth nozzle set NS = (5, 13), the sixth nozzle set NS = (6, 14), the seventh nozzle set NS = (7, 15), and the eighth nozzle set NS = (8, 16).

[0094] The mechanism driving unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism driving unit 46 starts the forward movement (head movement) in one turn from the time of transmission of S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12). Then, the operation mode setting unit 45 initializes the counters posF and posR, i.e., assigns the integer "1" to the counter posF and the integer "9" to the counter posR, and counts that the nozzle set NS to be processed is the first one (the first nozzle set NS) (S13).

[0095] The operation mode setting unit 45 acquires, based on the production data, an illumination condition (also referred to as an illumination condition of posF) for capturing an image of a component P held by a front row nozzle NA corresponding to the value of posF, and an illumination condition (also referred to as an illumination condition of posR) for capturing an image of a component P held by a rear row nozzle NB corresponding to the value of posR. For example, when the first nozzle set NS is the target, the operation mode setting unit 45 acquires an illumination condition corresponding to the front row nozzle NA with the identification number 1, and an illumination condition corresponding to the rear row nozzle NB with the identification number 9. The operation mode setting unit 45 judges whether the illumination condition of posF and the illumination condition of posR are the same (S14). That is, the operation mode setting unit 45 judges whether the illumination conditions of each component P held by the nozzle set NS to be processed are the same (corresponding to a simultaneous lighting possible judgment).

[0096] If the illumination conditions of posF and posR are the same (Yes in S14), the operation mode setting unit 45 determines that simultaneous lighting is possible for the nozzle set NS being processed (S15). On the other hand, if the illumination conditions of posF and posR are different (No in S14), the operation mode setting unit 45 determines that time-shift lighting is possible for the nozzle set NS being processed (S16).

[0097] The operation mode setting unit 45 determines whether posF=8 (S17). That is, it determines whether the processes of S14 to S16 have been performed for all of the eight nozzle sets NS of the moving head 26. If posF=8 is not true, that is, if there are any nozzle sets NS that have not been subjected to the processes of S14 to S16, the operation mode setting unit 45 adds a value of 1 to the value of posF and adds a value of 1 to the value of posR (S18). Then, the process proceeds to S14. Note that in S17, the operation mode setting unit 45 may determine whether posR=16, rather than whether posF=8.

[0098] The operation mode setting unit 45 determines whether or not simultaneous lighting is possible in all nozzle sets NS (also referred to as all pos) (S19).

[0099] If simultaneous lighting is possible for all nozzle sets NS (Yes in S19), the operation mode setting unit 45 sets the operation mode of the component mounting device 1 to the simultaneous lighting mode (S20). In the simultaneous lighting mode, the camera control unit 48 does not switch the imaging range and illumination conditions for imaging each component PA, PB held by the front row nozzles NA and the rear row nozzles NB in ​​the same nozzle set NS, but sets the components PA, PB to be illuminated and imaged at the same timing. Also, in the simultaneous lighting mode, the mechanism driving unit 46 sets the moving speed of the moving head 26 to a high speed (for example, speed V1) (S21).

[0100] If time-delay lighting is possible for at least one nozzle set NS (No in S19), the operation mode setting unit 45 sets the operation mode of the component mounting device 1 to the time-delay lighting mode (S22). In the time-delay lighting mode, the camera control unit 48 switches the imaging range and illumination conditions for imaging each component PA, PB held by the front row nozzles NA and the rear row nozzles NB in ​​the same nozzle set NS, and sets to illuminate and image each component PA, PB at different imaging timings TA, TB. Also, in the time-delay lighting mode, the mechanism driving unit 46 sets the moving speed of the moving head 26 to a medium speed (for example, speed V2) (S23).

[0101] When the moving head 26 is set to high speed in S21, it moves at high speed in the moving direction A under the control of the mechanism driving unit 46. When the moving head 26 is set to medium speed in S23, it moves at medium speed in the moving direction A under the control of the mechanism driving unit 46.

[0102] The camera control unit 48 controls the moving head 26 to illuminate each nozzle set NS under each lighting condition and capture an image of each component PA, PB while the moving head 26 is moving, based on the production data, the operating mode, or information stored in the memory unit 41 (e.g., lighting condition information 42b, imaging timing information 42c) (S24).

[0103] When the component recognition camera 28 is set to the simultaneous lighting mode, it illuminates and captures each of the components PA and PB in the same nozzle set NS at the same timing without switching the imaging range and illumination conditions under the control of the camera control unit 48. In this case, the component recognition camera 28 illuminates and captures the components PA and PB according to a common illumination condition LC for the parts PA and PB. Through this imaging, the camera control unit 48 obtains an image GC in which both the parts PA and PB are captured. In other words, one image is obtained for each nozzle set NS.

[0104] Furthermore, when the component recognition camera 28 is set to the time-difference lighting mode, the camera control unit 48 controls the camera to switch the imaging range and illumination conditions within the same nozzle set NS to illuminate and image each of the components PA and PB at different times. In this case, the component recognition camera 28 illuminates and images the component PA according to illumination conditions LA for the component PA, and illuminates and images the component PB according to illumination conditions LB for the component PB. Through this imaging, the camera control unit 48 obtains an image GA in which the part PA is captured and an image GB in which the part PB is captured. In other words, multiple images are obtained for each nozzle set NS.

[0105] When the acquisition of images of each component P (PA, PB) by each nozzle set NS is completed, the component recognition unit 50 performs image recognition on each acquired image (S25). In this case, the component recognition unit 50 recognizes, for example, each component P held by each component holding nozzle 27 (the front row nozzles NA and the rear row nozzles NB of each nozzle set NS) by image recognition of each image, and acquires recognition information related to each component P. The recognition information related to the component P here may include, for example, position information and orientation information of the component P, discrimination information of the polarity of the component P, information on the measurement result of the 3D measurement, information on the recognition result of the outer shape of the component P, information on the recognition result of the characters attached to the component P, or information on the recognition result of the alignment of the component P. The component recognition unit 50 sends the recognition result of the image recognition to the mechanism driving unit 46.

[0106] Shortly after the component holding nozzles 27 of each nozzle set NS pass above the component recognition camera 28, the moving head 26 reaches the vicinity of the mounting position of each component P. Then, the mechanism driving unit 46 ends the movement of the moving head 26 above the component recognition camera 28 (S26). Based on the recognition result by the component recognition unit 50, the mechanism driving unit 46 commands the moving head 26 of the head unit 23 to mount each component P in a predetermined position and attitude on the board W. In accordance with the command from the mechanism driving unit 46, the head unit 23 causes the moving head 26 to mount each component P on the board W (S27).

[0107] In this way, the component mounting device 1 can be set to the simultaneous lighting mode when it is not necessary to switch the lighting conditions for imaging each component P in the same nozzle set NS in all nozzle sets NS of the moving head 26. Also, the component mounting device 1 can be set to the time-delay lighting mode when it is necessary to switch the lighting conditions for imaging each component P in the same nozzle set NS in at least one nozzle set NS of the moving head 26. In the simultaneous lighting mode, the component mounting device 1 can collectively image and recognize each component P held in the same nozzle set NS by speeding up the movement of the moving head 26, while shortening the time required to image each component P. In the time-delay lighting mode, the component mounting device 1 can ensure time to switch the lighting conditions or imaging range for imaging each component P by slowing down the movement of the moving head 26 from high speed (for example, to medium speed), and can image and recognize each component P individually.

[0108] Furthermore, even if the component mounting device 1 has a moving head 26 with multiple rows of component holding nozzles 27, rather than always performing multiple imaging with separate exposures for the front row nozzles NA and the rear row nozzles NB in ​​the same nozzle set NS, the component mounting device 1 can perform imaging with a single exposure depending on the lighting conditions, thereby increasing the moving speed of the moving head 26. Furthermore, the component mounting device 1 can switch between multiple operation modes according to production data, minimizing the number of times imaging is performed within the same nozzle set NS, and can move the moving head 26 at an optimal speed, thereby maintaining the accuracy of component recognition and improving productivity as much as possible.

[0109] As described above, the component mounting device 1 of the present embodiment includes the moving head 26 (an example of a head), the operation mode setting unit 45 (an example of a movement control unit), the mechanism driving unit 46 (an example of a movement control unit), the component recognition camera 28 (an example of an imaging unit), the camera control unit 48 (an example of an imaging control unit), the component recognition unit 50, and the head unit 23 (an example of a component mounting unit). The moving head 26 has a plurality of component holding nozzles 27 (an example of a nozzle) arranged along the moving direction A (an example of a first direction) and arranged in a plurality of rows in a direction perpendicular to the moving direction A. The mechanism driving unit 46 moves the moving head 26 along the moving direction A. The component recognition camera 28 includes an illumination unit 31 (an example of an illumination unit) that illuminates each component P held by each component holding nozzle 27 of the moving head 26, and images the component P from below. The camera control unit 48 controls the imaging by the component recognition camera 28 and the illumination conditions by the illumination unit 31 during imaging. The component recognition unit 50 recognizes the component P from the image captured by the component recognition camera 28. The head unit 23 mounts the component P on the board W using the moving head 26 based on the recognition result by the component recognition unit 50. The operation mode setting unit 45 and the mechanism driving unit 46 control the moving speed of the moving head 26, which moves in the moving direction A above the component recognition camera 28, based on the lighting conditions when the image of each component P held by each component holding nozzle 27 of the moving head 26 is captured.

[0110] As a result, the component mounting device 1 can reduce the time required to image and recognize the components P and improve productivity by accelerating the movement speed of the moving head 26 as much as possible in accordance with the lighting conditions of each component P held by the multiple component holding nozzles 27, while reliably imaging the components P in accordance with the lighting conditions and suppressing a decrease in the recognition accuracy of the components P.

[0111] Furthermore, the operation mode setting unit 45 may determine whether the illumination conditions for illuminating each component P held by each component holding nozzle 27 are the same for each nozzle set NS formed by multiple component holding nozzles 27 at the same position in the multiple rows of movement direction A of the moving head 26. If the illumination conditions are the same for all nozzle sets NS, the mechanism driving unit 46 may move the moving head 26 at a speed V1 (an example of a first speed). If the illumination conditions are different for at least one nozzle set NS, the mechanism driving unit 46 may move the moving head 26 at a speed V2 (an example of a second speed) that is slower than speed V1.

[0112] As a result, when the illumination conditions for each component P held by each component holding nozzle 27 in the nozzle set NS are the same in all nozzle sets NS, the component mounting device 1 does not need to switch illumination conditions, thereby shortening the imaging time and increasing the moving speed of the moving head 26. Also, when the illumination conditions for each component P differ in at least one nozzle set NS, the component mounting device 1 can keep the moving speed of the moving head 26 at a medium speed in order to ensure imaging time for switching illumination conditions.

[0113] In addition, when the lighting conditions are the same for all nozzle sets NS, the camera control unit 48 may control each component P to be illuminated under the same lighting conditions at the same timing for each nozzle set NS and to capture images of each component P at the same time.

[0114] This allows the component mounting device 1 to capture images of multiple components P for one nozzle set NS in one capture. Even in this case, the component mounting device 1 can ensure brightness appropriate for each component P and suppress a decrease in the recognition accuracy of the component P based on the captured image.

[0115] In addition, when the lighting conditions are different for at least one nozzle set NS, the camera control unit 48 may control each nozzle set NS to illuminate each component P at different times under each lighting condition corresponding to each component P, and capture an image of each component P individually.

[0116] This allows the component mounting device 1 to capture images of multiple components P by capturing images of one nozzle set NS multiple times. In this case, different illumination is performed according to the illumination conditions of each component P held by one nozzle set NS, ensuring suitable brightness for each component P and suppressing a decrease in the recognition accuracy of the component P based on the captured images.

[0117] Furthermore, the camera control unit 48 may acquire information on the type (category) of the part P, and determine the lighting conditions for each part P based on the type of the part P. The information on the type of the part P may be acquired from the production data.

[0118] This allows the component mounting apparatus 1 to switch the illumination conditions depending on whether the component holding nozzle 27 holds a chip component, a lead component, or a BGA component, and determine illumination conditions suitable for imaging each component P.

[0119] Furthermore, the lighting unit section 31 may have a plurality of lighting channels with different lighting methods. The lighting conditions may include information on the lighting channel used to capture an image.

[0120] As a result, when the component mounting device 1 switches the illumination channel (e.g., the reflected illumination channel, the side illumination channel, the transmitted illumination channel, or the coaxial illumination channel) used to illuminate each component P in the same nozzle set NS, it can illuminate and image the component P with the illumination channel to be used while moving the moving head 26 at a medium speed in the time-difference lighting mode. Also, when the component mounting device 1 does not switch the illumination channel to be used to illuminate each component P in the same nozzle set NS, it can illuminate and image the component P with the illumination channel to be used while moving the moving head 26 at a high speed in the simultaneous lighting mode.

[0121] Furthermore, the lighting conditions may include a lighting value indicating the brightness of the lighting by the lighting unit section 31. The lighting value may be a variable value.

[0122] As a result, when the component mounting device 1 switches the illumination value used for illuminating each component P in the same nozzle set NS, for example, it can image the component P by illuminating it with the illumination value to be used while moving the moving head 26 at a medium speed in the time-delay lighting mode. Also, when the component mounting device 1 does not switch the illumination value used for illuminating each component P in the same nozzle set NS, it can image the component P by illuminating it with the illumination value to be used while moving the moving head 26 at a high speed in the simultaneous lighting mode. Also, even when the same component P held by each component holding nozzle 27 in the same nozzle set NS is imaged in all nozzle sets NS, for example, the component mounting device 1 can use the simultaneous lighting mode in the case of default illumination values, and use the time-delay lighting mode in the case of adjusting the illumination value by user operation or the like.

[0123] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modified or amended examples within the scope of the claims, and it is understood that these also naturally belong to the technical scope of the present disclosure. In addition, the components in the above-mentioned embodiments may be arbitrarily combined within the scope of the present disclosure.

[0124] In the above embodiment, moving head 26 having 2 rows x 8 component holding nozzles 27 has been exemplified, but this is not limited to this. For example, moving head 26 may have three or more rows of component holding nozzles 27, or 8, 12, 14, or 16 component holding nozzles 27 per row. [Industrial Applicability]

[0125] The present disclosure is useful for component mounting devices and component mounting methods that can determine the head movement speed taking into account the lighting conditions for each component held in each nozzle, and that can reduce the time required to image and recognize the components as much as possible, thereby improving productivity, while suppressing a decrease in component recognition accuracy. [Explanation of symbols]

[0126] 1 Component placement device 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 Slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Part holding nozzle 28 Parts Recognition Camera 29 Image sensor section 30 Case 31 Lighting unit section 33 Reflection lighting section 34 Transillumination unit 35 Side lighting section 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 39 Coaxial lighting section 40 Control section 41 Storage section 42a Parts Information 42b Lighting condition information 42c Imaging timing information 42d Movement speed information 45 Operation mode setting section 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit B Shielding plate C Reflector CA,CB,CC Imaging range G Transparent glass NA front row nozzle NB Rear row nozzle NS Nozzle Set P,PA,PB parts T1 Table W substrate

Claims

1. a head having a plurality of nozzles arranged along a first direction, the nozzles being arranged in a plurality of rows in a direction perpendicular to the first direction; a movement control unit that moves the head along the first direction; an imaging unit including an illumination unit that illuminates each component held by each nozzle of the head and that images the component from below; an imaging control unit that controls imaging by the imaging unit and lighting conditions by the lighting unit during imaging; a component recognition unit that recognizes the component from the image captured by the imaging unit; a component mounting unit that mounts the component on a board using the head based on a recognition result by the component recognition unit, The movement control unit is controlling a moving speed of the head moving in the first direction above the imaging unit based on an illumination condition at the time of imaging each component held by each nozzle of the head; determining whether or not the illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles in the plurality of rows of the head that are located at the same position in the first direction; moving the head at a first speed when the illumination conditions are the same for all nozzle sets; moving the head at a second speed slower than the first speed when the illumination conditions are different for at least one nozzle set; Parts mounting device.

2. The imaging control unit is When the illumination conditions are the same for all the nozzle sets, control is performed so that each component is illuminated under the same illumination conditions at the same timing for each nozzle set, and images of each component are captured collectively.

2. The component mounting apparatus according to claim 1.

3. The imaging control unit is When the illumination conditions are different for at least one nozzle set, control is performed so that each nozzle set is illuminated under each illumination condition corresponding to each component at a different timing, and each component is individually imaged.

2. The component mounting apparatus according to claim 1.

4. The imaging control unit is Acquire information on the type of the part; determining the illumination conditions for each component based on the type of the component; The component mounting device according to any one of claims 1 to 3.

5. The illumination unit has a plurality of illumination channels with different illumination methods, The lighting conditions include information on a lighting channel used to capture the image. The component mounting device according to any one of claims 1 to 4.

6. the lighting condition includes an illumination value indicating a brightness of the lighting by the lighting unit, The illumination value is a variable value. The component mounting device according to any one of claims 1 to 5.

7. a step of moving a head, the head having a plurality of nozzles arranged along a first direction and arranged in a plurality of rows in a direction perpendicular to the first direction, along the first direction; controlling lighting conditions when an image is captured by an illumination unit that illuminates a component held by each nozzle of the head, and controlling imaging by an imaging unit that images the component from below; Recognizing the component from an image captured by the imaging unit; mounting the component on a board using the head based on a result of the component recognition; having The step of moving the head includes: controlling a moving speed of the head moving in the first direction above the imaging unit based on an illumination condition at the time of imaging each component held by each nozzle of the head, The step of controlling the moving speed of the head includes: determining whether or not the illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the plurality of rows possessed by the head; moving the head at a first speed when the illumination conditions are the same for all nozzle sets, and moving the head at a second speed slower than the first speed when the illumination conditions are different for at least one nozzle set. How to install parts.

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