Substrate Processing Equipment

Abstract

To provide a technique capable of easily maintaining a chamber for defining a substrate processing space at which processing for a substrate is performed therein.SOLUTION: A substrate processing device disclosed herein comprises a first chamber, a substrate support, an actuator, a second chamber, and at least one fixing tool. The substrate support and the second chamber are arranged in an internal space of the first chamber. The actuator moves the substrate support between a first position and a second position. The second chamber defines the substrate processing space together with the substrate support when the substrate support is at the first position. The second chamber can be transferred between the internal space of the first chamber and the outside through an opening of the first chamber when the substrate support is at the second position. At least one fixing tool releasably fixes the second chamber to the first chamber at the internal space of the first chamber.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] SUMMARY Exemplary embodiments of the present disclosure relate to a substrate processing apparatus, a substrate processing system, and a maintenance method. [Background technology]

[0002] A plasma processing apparatus is used for plasma processing of a substrate. The plasma processing apparatus includes a chamber and a substrate support. The substrate support supports a substrate in the chamber. The substrate is processed by chemical species from a plasma generated from a process gas in the chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-197849 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for easily enabling maintenance of a chamber that defines a substrate processing space in which processing of a substrate is performed. [Means for solving the problem]

[0005] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a first chamber, a substrate support, an actuator, a second chamber, and at least one fixture. The first chamber has an interior space and an opening. The substrate support is disposed within the interior space of the first chamber. The actuator is configured to move the substrate support between a first position and a second position. The second chamber is disposed within the interior space of the first chamber. The second chamber defines a substrate processing space together with the substrate support when the substrate support is in the first position. The second chamber is transportable between the interior space of the first chamber and an outside thereof through the opening when the substrate support is in the second position. The at least one fixture is configured to releasably fix the second chamber to the first chamber in the interior space of the first chamber. Effect of the Invention

[0006] According to one exemplary embodiment, a chamber defining a substrate processing space in which processing on a substrate occurs can be easily maintained. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 illustrates a substrate processing system according to an exemplary embodiment. [Diagram 2] 1 is a schematic diagram of a substrate processing apparatus according to an exemplary embodiment; [Diagram 3] FIG. 1 illustrates a locking device and release mechanism according to an exemplary embodiment. [Figure 4] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Diagram 5] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 6] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 7]1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 8] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 9] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 10] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 11] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 12] 1 is a diagram showing a state of a substrate processing system during execution of a maintenance method according to an exemplary embodiment; [Figure 13] FIG. 13 illustrates a locking device and release mechanism according to another exemplary embodiment. [Figure 14] FIG. 13 illustrates a locking device and release mechanism according to yet another exemplary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Various exemplary embodiments are described below.

[0009] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a first chamber, a substrate support, an actuator, a second chamber, and at least one fixture. The first chamber has an interior space and an opening. The substrate support is disposed within the interior space of the first chamber. The actuator is configured to move the substrate support between a first position and a second position. The second chamber is disposed within the interior space of the first chamber. The second chamber defines a substrate processing space together with the substrate support when the substrate support is in the first position. The second chamber is transportable between the interior space of the first chamber and an outside thereof through the opening when the substrate support is in the second position. The at least one fixture is configured to releasably fix the second chamber to the first chamber in the interior space of the first chamber.

[0010] In the substrate processing apparatus of the above embodiment, the substrate is processed in the second chamber. The second chamber is disposed in the first chamber and fixed to the first chamber. The second chamber can be released from the first chamber. In addition, when the second chamber is released from the first chamber, the second chamber can be carried out from the opening of the first chamber to the outside of the first chamber. Therefore, according to the above embodiment, it is possible to easily maintain the chamber that defines the substrate processing space in which the substrate is processed, that is, the second chamber.

[0011] In one exemplary embodiment, the second chamber may include a baffle and one or more ring members, the baffle being disposed to surround the substrate support when the substrate support is in the first position, and the one or more ring members being disposed to surround a substrate mounted on the substrate support in the substrate processing space when the substrate support is in the first position.

[0012] In one exemplary embodiment, the at least one fastener may be configured to releasably fasten a top of the second chamber to a top of the first chamber within the interior space of the first chamber.

[0013] In one exemplary embodiment, the at least one retainer may include an engagement member configured to engage with a top of the second chamber and a biasing member configured to bias the engagement member upwardly when the engagement member is engaged with the top of the second chamber.

[0014] In one exemplary embodiment, the substrate processing apparatus may further comprise a release mechanism configured to release the second chamber from the first chamber by the at least one fastener.

[0015] In one exemplary embodiment, the release mechanism may include an air supply.

[0016] In one exemplary embodiment, the at least one retainer may include an engagement member and a cam mechanism, the engagement member configured to engage a top of the second chamber, and the cam mechanism configured to move the engagement member, which engages the top of the second chamber, upwardly to bring the top of the second chamber into contact with the top of the first chamber.

[0017] In one exemplary embodiment, the first chamber may have a substrate transfer port. The second chamber may include a movable shutter that faces the substrate transfer port in the interior space of the first chamber when the second chamber is secured to the first chamber. The substrate processing apparatus may further include an additional actuator configured to actuate the movable shutter between an open position and a closed position.

[0018] In another exemplary embodiment, a substrate processing apparatus is also provided. The substrate processing apparatus includes a first chamber, a substrate support, a second chamber, at least one actuator, and at least one fixture. The first chamber has a first interior space and a first opening. The substrate support is disposed in the first interior space. The second chamber is disposed in the first interior space and has a second interior space and a second opening. The at least one actuator is configured to relatively move at least one of the substrate support and the second chamber between a first state and a second state in the first interior space. The first state is a state in which the substrate support closes the second opening, and the second state is a state in which the substrate support is away from the second opening. The at least one fixture is configured to releasably fix the second chamber to the first chamber in the first interior space. The second chamber is transportable between the first interior space and the outside of the first chamber through the first opening when the second chamber is released from the fixation of the second chamber to the first chamber by the at least one fixture.

[0019] In one exemplary embodiment, the second chamber may be transportable between the first interior space and an exterior of the first chamber through the first opening when the second chamber is unsecured from the first chamber by the at least one securing device in the second state.

[0020] In one exemplary embodiment, the at least one actuator may include a first actuator configured to move the substrate support between a first upper position and a first lower position in the first interior space, the substrate support being disposed at the first upper position in the first state and at the first lower position in the second state.

[0021] In one exemplary embodiment, the at least one actuator may include a second actuator configured to move a second chamber in the first interior volume between a second upper position and a second lower position, the second chamber being disposed in the second upper position in the first state and disposed in the second lower position in the second state.

[0022] Various exemplary embodiments will now be described in detail with reference to the drawings, in which the same or corresponding parts are designated by the same reference numerals.

[0023] In one exemplary embodiment, the substrate processing system includes one or more process modules, a transfer module, a transfer device, and a controller. Fig. 1 is a diagram showing a substrate processing system according to one exemplary embodiment. The substrate processing system PS shown in Fig. 1 includes process modules PM1 to PM6, a transfer module CTM, a transfer device CTU (see Fig. 5), and a controller MC.

[0024] The substrate processing system PS may further include stages 2a-2d, containers 4a-4d, an aligner AN, load lock modules LL1, LL2, and a transfer module TM. The number of stages, containers, and load lock modules in the substrate processing system PS may be any number greater than or equal to one. The number of process modules in the substrate processing system PS may be any number greater than or equal to one.

[0025] The stages 2a to 2d are arranged along one edge of the loader module LM. The containers 4a to 4d are mounted on the stages 2a to 2d, respectively. Each of the containers 4a to 4d is, for example, a container called a FOUP (Front Opening Unified Pod). Each of the containers 4a to 4d is configured to accommodate a substrate W therein.

[0026] The loader module LM has a chamber. The pressure in the chamber of the loader module LM is set to atmospheric pressure. The loader module LM has a transport device TU1. The transport device TU1 is, for example, an articulated robot, and is controlled by the controller MC. The transport device TU1 is configured to transport the substrate W through the chamber of the loader module LM. The transport device TU1 can transport the substrate W between each of the containers 4a to 4d and the aligner AN, between the aligner AN and each of the load lock modules LL1, LL2, and between each of the load lock modules LL1, LL2 and each of the containers 4a to 4d. The aligner AN is connected to the loader module LM. The aligner AN is configured to adjust the position of the substrate W (calibrate the position).

[0027] Each of the load lock modules LL1 and LL2 is provided between the loader module LM and the transfer module TM. Each of the load lock modules LL1 and LL2 provides a preliminary reduced pressure chamber.

[0028] The transfer module TM is connected to each of the load lock modules LL1 and LL2 via gate valves. The transfer module TM has a transfer chamber TC that can be depressurized. The transfer module TM has a transfer apparatus TU2. The transfer apparatus TU2 is, for example, an articulated robot, and is controlled by a controller MC. The transfer apparatus TU2 is configured to transfer the substrate W via the transfer chamber TC. The transfer apparatus TU2 can transfer the substrate W between each of the load lock modules LL1, LL2 and each of the process modules PM1 to PM6, and between any two of the process modules PM1 to PM6.

[0029] Each of the process modules PM1 to PM6 is an apparatus configured to perform a dedicated substrate processing. At least one of the process modules PM1 to PM6 is a substrate processing apparatus according to an exemplary embodiment described below.

[0030] The transfer module CTM has a chamber. The chamber of the transfer module CTM is connected to a first chamber of the substrate processing apparatus according to the exemplary embodiment through an opening formed in a sidewall of the first chamber. The transfer device CTU is, for example, an articulated robot. The transfer device CTU is configured to transfer a second chamber provided in the first chamber of the substrate processing apparatus to the chamber of the transfer module CTM. In the example shown in FIG. 1, the transfer module CTM is connected to the process module PM5. In an embodiment, the substrate processing system PS may include one or more transfer modules CTM connected to one or more process modules, respectively. In an embodiment, the transfer module TM may be used as the transfer module CTM.

[0031] The controller MC is configured to control each part of the substrate processing system PS. The controller MC may be a computer including a processor, a storage device, an input device, a display device, etc. The controller MC executes a control program stored in the storage device and controls each part of the substrate processing system PS based on recipe data stored in the storage device. A maintenance method according to an exemplary embodiment described below may be performed in the substrate processing system PS by the controller MC controlling each part of the substrate processing system PS.

[0032] A substrate processing apparatus according to an exemplary embodiment will be described below. FIG. 2 is a diagram that shows a substrate processing apparatus according to an embodiment. The substrate processing apparatus 1 shown in FIG. 2 is a capacitively coupled plasma processing apparatus. The substrate processing apparatus 1 includes a first chamber 10. The first chamber 10 provides an internal space. The first chamber 10 includes a chamber body 12. The chamber body 12 is electrically grounded. The chamber body 12 is made of, for example, aluminum. A corrosion-resistant film may be formed on the surface of the chamber body 12. The corrosion-resistant film is made of, for example, a material such as aluminum oxide or yttrium oxide.

[0033] The chamber body 12 includes a side wall 12s. The side wall 12s has a substantially cylindrical shape. The central axis of the side wall 12s extends in the vertical direction and is shown as an axis AX in FIG. 2. The first chamber 10 provides a substrate transfer port 12p. The substrate transfer port 12p may be provided in the side wall 12s. The inner space of the first chamber 10 is connected to a transfer chamber TC of the transfer module TM through the substrate transfer port 12p. The substrate transfer port 12p can be opened and closed by a gate valve 12g. The substrate W passes through the substrate transfer port 12p when being transferred between the inside of the first chamber 10 and the outside of the first chamber 10.

[0034] The first chamber 10 further provides an opening 12o (first opening). The opening 12o may be provided in a side wall 12s. The opening 12o has a size that allows a second chamber, which will be described later, to pass through. The inner space of the first chamber 10 (internal space or first internal space) is connected to the transfer module CTM via the opening 12o. The opening 12o can be opened and closed by a gate valve 12v.

[0035] The substrate processing apparatus 1 further includes a substrate support 14. The substrate support 14 is disposed in the first chamber 10. The substrate support 14 has a placement area 14m. The substrate support 14 is configured to support a substrate W placed on the placement area 14m. The substrate support 14 may be supported by a support portion 15. The support portion 15 has a substantially cylindrical shape. The support portion 15 is formed of an insulator such as quartz. The support portion 15 may extend upward from a bottom plate 16.

[0036] The substrate support 14 may include a lower electrode 18 and an electrostatic chuck 20. The lower electrode 18 has a substantially disk shape. The central axis of the lower electrode 18 substantially coincides with the axis AX. The lower electrode 18 is formed of a conductor such as aluminum. The lower electrode 18 provides a flow path 18f therein. The flow path 18f extends, for example, in a spiral shape. The flow path 18f is connected to a chiller unit 19. The chiller unit 19 is provided outside the first chamber 10. The chiller unit 19 supplies a coolant to the flow path 18f. The coolant supplied to the flow path 18f is returned to the chiller unit 19.

[0037] The substrate processing apparatus 1 may further include a first high frequency power supply 21 and a second high frequency power supply 22. The first high frequency power supply 21 is a power supply that generates a first high frequency power. The first high frequency power has a frequency suitable for generating plasma. The frequency of the first high frequency power is, for example, 27 MHz or more. The first high frequency power supply 21 is electrically connected to the lower electrode 18 via a matching device 21m. The matching device 21m has a matching circuit for matching the impedance of the load side (lower electrode 18 side) to the output impedance of the first high frequency power supply 21. The first high frequency power supply 21 may be connected to an upper electrode (described later) via the matching device 21m, instead of the lower electrode 18.

[0038] The second high frequency power supply 22 is a power supply that generates a second high frequency power. The second high frequency power has a frequency suitable for attracting ions to the substrate W. The frequency of the second high frequency power is, for example, 13.56 MHz or less. The second high frequency power supply 22 is electrically connected to the lower electrode 18 via a matching device 22m. The matching device 22m has a matching circuit for matching the impedance of the load side (the lower electrode 18 side) to the output impedance of the second high frequency power supply 22.

[0039] The electrostatic chuck 20 is provided on the lower electrode 18. The electrostatic chuck 20 includes a body and an electrode 20a. The body of the electrostatic chuck 20 has a substantially disk shape. The central axis of the electrostatic chuck 20 substantially coincides with the axis AX. The body of the electrostatic chuck 20 is made of ceramic. The upper surface of the body of the electrostatic chuck 20 constitutes the above-mentioned mounting area 14m. The electrode 20a is a film made of a conductor. The electrode 20a is provided in the body of the electrostatic chuck 20. The electrode 20a is connected to a DC power supply 20d via a switch 20s. When a voltage from the DC power supply 20d is applied to the electrode 20a, an electrostatic attractive force is generated between the electrostatic chuck 20 and the substrate W. Due to the generated electrostatic attractive force, the substrate W is attracted to the electrostatic chuck 20 and held by the electrostatic chuck 20. The substrate processing apparatus 1 may be provided with a gas line for supplying a heat transfer gas (eg, helium gas) to the gap between the electrostatic chuck 20 and the rear surface of the substrate W.

[0040] The substrate support 14 may support an edge ring ER. The substrate W is placed on the electrostatic chuck 20 within a region surrounded by the edge ring ER. The edge ring ER is made of, for example, silicon, quartz, or silicon carbide.

[0041] The substrate support 14 may further include an outer periphery 23. The outer periphery 23 extends along the outer periphery of the lower electrode 18, the electrostatic chuck 20, and the support 15. The outer periphery 23 is formed from an insulator such as quartz.

[0042] The substrate processing apparatus 1 further includes an actuator 24. The actuator 24 is configured to move the substrate support 14 between a first position (first upper position) and a second position (first lower position). The first position is an upper position relative to the second position. The actuator 24 may have a support portion and a drive portion. The support portion of the actuator 24 supports the substrate support 14 and extends downward. The drive portion of the actuator 24 generates power for moving the substrate support 14 via the support portion. The drive portion of the actuator 24 includes, for example, a motor.

[0043] The first chamber 10 may further include a top portion 26. The top portion 26 is provided on the side wall 12s so as to close the upper end opening of the chamber body 12. The top portion 26 extends above the top portion of the second chamber, which will be described later.

[0044] In one embodiment, the ceiling portion 26 may include a backing portion 27, an annular portion 28, an annular portion 29, and a heater unit 30. The backing portion 27 is disposed above the substrate support 14. The backing portion 27 constitutes a part of an upper electrode 31. The upper electrode 31 is disposed above the substrate support 14.

[0045] The annular portion 28 has a substantially annular shape. The annular portion 28 is formed from a metal such as aluminum. The annular portion 28 is provided on the side wall 12s via a heater unit 30. The heater unit 30 has a heater built therein. The annular portion 29 has a substantially annular shape. The annular portion 29 is provided between the backing portion 27 and the annular portion 28. The annular portion 29 is formed from an insulator such as quartz.

[0046] The substrate processing apparatus 1 further includes a second chamber 32. The second chamber 32 is disposed within the first chamber 10. The second chamber 32 may provide a second internal space and a second opening. The second internal space is a space inside the second chamber 32, and the second opening is an opening that is continuous with the second chamber 32. The second opening may be provided in a lower portion of the second chamber 32.

[0047] The second chamber 32 defines a processing space S, i.e., a substrate processing space, together with the substrate support 14 when the substrate support 14 is in the first position. When the substrate support 14 is in the first position, a first state is formed in which the substrate support 14 closes the second opening of the second chamber 32. In the first state, the second internal space becomes the substrate processing space. On the other hand, when the substrate support 14 is moved to the second position, a second state is formed in which the substrate support 14 is away from the second opening.

[0048] The second chamber 32 is removably fixed to the first chamber 10. The second chamber 32 can be transported between the inside and outside of the first chamber 10 through the opening 12o. The second chamber 32 may be made of a conductor such as aluminum. A corrosion-resistant film may be formed on the surface of the second chamber 32. The corrosion-resistant film is made of a material such as aluminum oxide or yttrium oxide.

[0049] The substrate processing apparatus 1 further includes at least one fixing fixture 34 and a release mechanism 36. The fixing fixture 34 is configured to releasably fix the second chamber 32 to the first chamber 10 in the internal space of the first chamber 10. The release mechanism 36 is configured to release the fixing of the second chamber 32 by the fixing fixture 34. The fixing fixture 34 and the release mechanism 36 will be described in detail later.

[0050] In one embodiment, the second chamber 32 may include a top portion 32c, a side portion 32s, a baffle 32b, and one or more ring members 32r. The top portion 32c extends above the processing space S. In one embodiment, the top portion 32c may include a top plate 38 and an annular portion 39. The top plate 38 has a substantially disk shape. The annular portion 39 has a substantially ring shape. The annular portion 39 extends in a circumferential direction around the axis AX and extends in a radial direction from the outer edge of the top plate 38. The annular portion 39 supports the top plate 38. The outer edge of the top plate 38 is disposed on the inner edge of the annular portion 39. The heater unit 30 is also interposed between the annular portion 39 and the annular portion 28.

[0051] The side portion 32s extends to the side of the processing space S. The side portion 32s has a substantially cylindrical shape. In one embodiment, the side portion 32s is continuous with the outer edge of the annular portion 39 of the top portion 32c and extends downward from the outer edge of the annular portion 39.

[0052] The baffle 32b extends between the side portion 32s and the substrate support 14. The baffle 32b is disposed so as to surround the substrate support 14 when the substrate support 14 is in the first position. The baffle 32b has a substantially ring shape. The baffle 32b provides a plurality of through holes. The substrate processing apparatus 1 may further include an exhaust device 40. The exhaust device 40 includes a pressure regulator such as an automatic pressure control valve and a pressure reducing pump such as a turbo molecular pump. The exhaust device 40 is connected to the bottom of the first chamber 10 below the baffle 32b.

[0053] The ring member 32r has a substantially ring shape. The ring member 32r is disposed so as to surround the substrate W placed on the substrate support 14 when the substrate support 14 is in the first position, i.e., the inner edge of the ring member 32r surrounds the placement region 14m via the edge ring ER. The ring member 32r is supported on the inner edge of the baffle 32b.

[0054] The top plate 38 and the backing part 27 constitute the upper electrode 31 in a state where the second chamber 32 is fixed to the first chamber 10. In this state, the upper surface of the top plate 38 abuts against the lower surface of the backing part 27. In one embodiment, the upper electrode 31 may constitute a shower head. The top plate 38 provides a plurality of gas discharge holes 38h. The plurality of gas discharge holes 38h penetrate the top plate 38 in its plate thickness direction (vertical direction). The top plate 38 may be made of silicon. Alternatively, the top plate 38 may be formed by forming a corrosion-resistant film on the surface of a conductive member such as aluminum. The corrosion-resistant film is formed of a material such as aluminum oxide or yttrium oxide.

[0055] The backing part 27 is formed of, for example, aluminum. The backing part 27 provides a flow path 27f therein. The flow path 27f extends, for example, in a spiral shape within the backing part 27. The flow path 27f is connected to a chiller unit 42. The chiller unit 42 is provided outside the first chamber 10. The chiller unit 42 supplies a refrigerant to the flow path 27f. The refrigerant supplied to the flow path 27f is returned to the chiller unit 42.

[0056] The backing part 27 provides a gas diffusion chamber 27d therein. The backing part 27 also provides a plurality of holes 27h. The plurality of holes 27h extend downward from the gas diffusion chamber 27d. When the second chamber 32 is fixed to the first chamber 10, the plurality of holes 27h are connected to the plurality of gas discharge holes 38h, respectively. A gas supply part 44 is connected to the gas diffusion chamber 27d.

[0057] The gas supply unit 44 may include a gas source group 45, a valve group 46, a flow rate controller group 47, and a valve group 48. The gas source group 45 includes a plurality of gas sources. The valve group 46 and the valve group 48 each include a plurality of valves. The flow rate controller group 47 includes a plurality of flow rate controllers. Each of the plurality of flow rate controllers is a mass flow controller or a pressure-controlled flow rate controller. Each of the plurality of gas sources of the gas source group 45 is connected to the gas diffusion chamber 27d via a corresponding valve of the valve group 46, a corresponding flow rate controller of the flow rate controller group 47, and a corresponding valve of the valve group 48. In the substrate processing apparatus 1, gas from one or more gas sources selected from the plurality of gas sources of the gas source group 45 is supplied to the processing space S from the plurality of gas discharge holes 38h via the gas diffusion chamber 27d and the plurality of holes 27h.

[0058] In one embodiment, the side 32s of the second chamber 32 may provide an opening in a region between the substrate transfer opening 12p and the inside of the second chamber 32. The side 32s may include a movable shutter 50 for closing the opening. The substrate processing apparatus 1 may further include a drive mechanism 51 for moving the movable shutter 50. The drive mechanism 51 is configured to move the movable shutter 50 between the region between the substrate transfer opening 12p and the inside of the second chamber 32 (i.e., the opening of the side 32s) and a location retracted from the region. That is, the drive mechanism 51 is configured to move the movable shutter 50 between an open position and a closed position. The open position is a position above the closed position.

[0059] In one embodiment, the drive mechanism 51 may include an actuator 52 and a support 54. The actuator 52 is configured to generate power to move the movable shutter 50 between an open position and a closed position. The actuator 52 may include, for example, a motor. The support 54 supports the movable shutter 50. The support 54 is, for example, rod-shaped and extends in the vertical direction. An upper end 54t of the support 54 includes a protruding portion protruding in the horizontal direction. The movable shutter 50 has a portion 50a extending substantially horizontally from the baffle 32b. The portion 50a provides a recess 50b. The recess 50b is formed so that the protruding portion of the upper end 54t of the support 54 can fit therein. The portion 50a further provides a recess 50c. The recess 50c is formed so that the protruding portion of an arm of the transport device CTU, which will be described later, can fit therein. The support 54 is connected to the actuator 52. The actuator 52 moves the movable shutter 50 via a support 54 .

[0060] The following describes the retainer 34 and the release mechanism 36. In one embodiment, the retainer 34 releasably secures the top 32c of the second chamber 32 to the top 26 of the first chamber 10.

[0061] 3 is a diagram showing a fixing device and a release mechanism according to an exemplary embodiment. In one embodiment, the fixing device 34 includes a plurality of support portions 56 and a plurality of biasing members 58. The fixing device 34 may further include a plate 59. Note that the number of the support portions 56 and the number of the biasing members 58 of the fixing device 34 may each be one.

[0062] Each of the plurality of support portions 56 has an engagement member 56b. The engagement member 56b is configured to engage with the top portion 32c of the second chamber 32. In one embodiment, the engagement member 56b is formed so that the top portion 32c is suspended therefrom. The plurality of biasing members 58 are configured to bias the engagement member 56b upward in a state in which the engagement member 56b is engaged with the top portion 32c of the second chamber 32. That is, the plurality of biasing members 58 are provided to bias the top portion 32c against the top portion 26 of the first chamber 10.

[0063] In one embodiment, the top 26 of the first chamber 10 provides a cavity 26c. The cavity 26c may extend in a circumferential direction around the axis AX. The cavity 26c is closed by a lid 55. The lid 55 is provided on the top 26 of the first chamber 10 so as to close the cavity 26c. The top 26 further provides a plurality of holes 26h. The plurality of holes 26h may be arranged at equal intervals along a plurality of concentric circles centered on the axis AX. The plurality of holes 26h extend downward from the cavity 26c and open toward the top 32c. The top 32c provides a plurality of recesses 39r. The plurality of recesses 39r are each connected to the plurality of holes 26h when the second chamber 32 is fixed to the first chamber 10.

[0064] In one embodiment, each of the plurality of supports 56 is rod-shaped. The engagement member 56b of each of the plurality of supports 56 protrudes in the horizontal direction. The bottom of each of the plurality of recesses 39r includes an extension 39e. The extension 39e is formed so that the engagement member 56b of a corresponding one of the plurality of supports 56 can fit therein. In one example, each of the plurality of supports 56 may be a screw, and the engagement member 56b of each of the plurality of supports 56 may be the head of the screw.

[0065] The plurality of supports 56 extend downward from the cavity 26c through the plurality of holes 26h. When the top portion 32c is suspended from the plurality of supports 56, the engagement members 56b of the plurality of supports 56 are disposed in the plurality of recesses 39r and their extensions 39e, respectively.

[0066] The upper ends of the plurality of support portions 56 are fixed to a plate 59 in the cavity 26c. The plurality of biasing members 58 are disposed in the cavity 26c. The plurality of biasing members 58 are disposed between the plate 59 and a surface of the top portion 26 that defines the cavity 26c from below. In one embodiment, each of the plurality of biasing members 58 is a spring (e.g., a coil spring). The plurality of biasing members 58 are provided so as to surround the plurality of support portions 56 in the cavity 26c, respectively.

[0067] In one embodiment, the release mechanism 36 includes an air supplier. The air supplier applies air pressure to pull the top part 32c downwardly away from the top part 26 of the first chamber 10 in order to release the top part 32c from the fixing device 34. The air supplier of the release mechanism 36 can supply air to the gap between the cover body 55 and the plate 59. When air is supplied to the gap between the cover body 55 and the plate 59, the plate 59 and the multiple support parts 56 move downwardly, and the top part 32c is pulled downwardly away from the top part 26 of the first chamber 10. That is, the fixing of the top part 32c by the fixing device 34 is released. In a state in which the fixing of the top part 32c by the fixing device 34 is released, the fixing of the second chamber 32 to the first chamber 10 is released, and the second chamber 32 can be transported from the inside of the first chamber 10 to the outside of the first chamber 10.

[0068] Hereinafter, a maintenance method according to an exemplary embodiment will be described with reference to Figs. 4 to 12. Also, control of the controller MC for the maintenance method will be described. Each of Figs. 4 to 12 is a diagram showing a state of the substrate processing system during execution of a maintenance method according to an exemplary embodiment. In the maintenance method, the second chamber 32 is removed from the first chamber 10 and transferred to the transfer module CTM for the maintenance thereof.

[0069] Before the maintenance method is performed, the above-mentioned first state is formed. In the first state, the second chamber 32 is located at the second upper position. In the maintenance method, first, the substrate support 14 is pulled downwardly away from the second chamber 32 as shown in FIG. 4. That is, the substrate support 14 is moved from the first position (first upper position) to the second position (first lower position) to form the second state. The actuator 24 is controlled by the controller MC to pull the substrate support 14 downwardly away from the second chamber 32.

[0070] 5, in the maintenance method, the gate valve 12v is opened and the arm of the transfer device CTU is introduced from the transfer module CTM into the first chamber 10 through the opening 12o. The arm of the transfer device CTU is introduced into the first chamber 10 so that the protrusion AP is located below the recess 50c of the movable shutter 50. The transfer device CTU is controlled by the control unit MC to introduce the arm into the first chamber 10.

[0071] Next, in the maintenance method, the movable shutter 50 is transferred from the support part 54 of the drive mechanism 51 to the arm of the transport device CTU. For this purpose, the drive mechanism 51 and the transport device CTU are controlled by the control part MC.

[0072] In order to transfer the movable shutter 50 from the support portion 54 of the drive mechanism 51 to the arm of the transport unit CTU, the movable shutter 50 is moved downward as shown in Fig. 6. The movable shutter 50 is moved downward by the drive mechanism 51 so that the protrusion portion AP of the arm of the transport unit CTU fits into the recess 50c. The drive mechanism 51 is controlled by the control unit MC so as to move the movable shutter 50 downward. In a state in which the protrusion portion AP fits into the recess 50c, the movable shutter 50 is supported by the arm of the transport unit CTU.

[0073] Next, in order to transfer the movable shutter 50 from the support part 54 of the drive mechanism 51 to the arm of the transport unit CTU, the movable shutter 50 supported by the arm of the transport unit CTU is moved horizontally as shown in Fig. 7. The movable shutter 50 is moved horizontally by the transport unit CTU so as to pull the protruding part of the upper end 54t of the support part 54 away from the recessed part 50b of the movable shutter 50. The transport unit CTU is controlled by the control unit MC to move the movable shutter 50 supported by its arm horizontally.

[0074] Next, in the maintenance method, as shown in Fig. 8, the support part 54 is moved downward so as not to interfere with the movable shutter 50. The drive mechanism 51 is controlled by the control unit MC so as to move the support part 54 downward. Next, the movable shutter 50 is moved horizontally by the transport device CTU so as to return the movable shutter 50 to its original position shown in Fig. 6. The transport device CTU is controlled by the control unit MC so as to move the movable shutter 50 horizontally.

[0075] Next, in the maintenance method, the fixation of the second chamber 32 by the fixing device 34 is released in order to transfer the second chamber 32 (the remaining part of the second chamber 32 other than the movable shutter 50) to the arm of the transport device CTU. Specifically, as shown in Fig. 9, the second chamber 32 (the remaining part of the second chamber 32 other than the movable shutter 50) is moved downward, and the fixation of the second chamber 32 to the first chamber 10 is released. The second chamber 32 is moved downward by the release mechanism 36. The release mechanism 36 is controlled by the control unit MC to release the fixation of the second chamber 32 by the fixing device 34 in order to transfer the remaining part of the second chamber 32 to the transport device CTU.

[0076] Next, in the maintenance method, the second chamber 32 is moved in the horizontal direction. The second chamber 32 is moved in the horizontal direction by the transfer unit CTU so as to pull the engagement members 56b of each of the multiple support portions 56 away from the extension portions 39e of the multiple recesses 39r, as shown in Fig. 10. The transfer unit CTU is controlled by the control unit MC so as to move the second chamber 32 in the horizontal direction.

[0077] Next, in the maintenance method, the second chamber 32 is moved downward. The second chamber 32 is moved downward by the transfer device CTU so that the second chamber 32 can be transferred from inside the first chamber 10 to the transfer module CTM through the opening 12o, as shown in Fig. 11. That is, the second chamber 32 is moved to a second lower position. The transfer device CTU is controlled by the control unit MC to move the second chamber 32 downward.

[0078] Next, in the maintenance method, the second chamber 32 is transferred from inside the first chamber 10 to the transfer module CTM through the opening 12o by the transfer device CTU, as shown in Fig. 12. The transfer device CTU is controlled by the control unit MC to transfer the second chamber 32 from inside the first chamber 10 to the transfer module CTM.

[0079] As described above, the substrate W is processed in the second chamber 32. The second chamber 32 is disposed in the first chamber 10 and fixed to the first chamber 10. The fixing of the second chamber 32 to the first chamber 10 can be released by using the release mechanism 36. In addition, in a state in which the fixing of the second chamber 32 to the first chamber 10 is released, the second chamber 32 can be carried out to the outside of the first chamber 10 through the opening 12o provided in the side wall of the first chamber 10. Therefore, it is possible to easily maintain the chamber that defines the processing space S in which the processing of the substrate W is performed, that is, the second chamber 32. In addition, according to the substrate processing system PS and the above-mentioned maintenance method, the second chamber 32 can be automatically carried out from inside the first chamber 10. Therefore, the downtime of the substrate processing system PS caused by the maintenance (e.g., replacement) of the second chamber 32 is shortened.

[0080] Hereinafter, reference will be made to Fig. 13. Fig. 13 is a diagram showing a fixing device and a releasing mechanism according to another exemplary embodiment. The substrate processing apparatus 1 may include a fixing device 34B and a releasing mechanism 36B shown in Fig. 13 instead of the fixing device 34 and the releasing mechanism 36.

[0081] The fixing device 34B includes a plurality of supports 56B and a cam mechanism 60. The number of supports 56B in the fixing device 34B may be one. The engagement members 56b of each of the supports 56B are configured to engage with the top 32c of the second chamber 32, similar to the engagement members 56b of each of the supports 56. In one embodiment, the engagement members 56b of each of the supports 56B are configured to have the top 32c suspended therefrom, similar to the engagement members 56b of each of the supports 56. The cam mechanism 60 is configured to move the supports 56B upward to bring the top 32c into contact with the top 26 of the first chamber 10.

[0082] As shown in FIG. 13, each of the multiple support parts 56B is rod-shaped. The top part 26 of the first chamber 10 provides multiple holes 26h extending downward from the inside thereof. The multiple holes 26h may be arranged at equal intervals around the axis line AX. When the second chamber 32 is fixed to the first chamber 10, the multiple holes 26h are connected to the multiple recesses 39r. The multiple support parts 56B are respectively arranged in the multiple holes 26h. Also, when the top part 32c is suspended from the multiple support parts 56B, the engagement members 56b of the multiple support parts 56B are respectively arranged in the multiple recesses 39r and their extensions 39e.

[0083] The fixing device 34B includes a plurality of shafts 61 and a cam 62. The top portion 26 of the first chamber 10 further provides a plurality of holes 26i. Each of the plurality of holes 26i intersects with the plurality of holes 26h and extends radially with respect to the axis AX. Each of the plurality of shafts 61 is disposed in the plurality of holes 26i so as to extend radially. One end of each of the plurality of shafts 61 protrudes outward from the top portion 26 and constitutes a cam follower 61f. The other end of each of the plurality of shafts 61 provides a slope 61s. Each of the plurality of support portions 56B has an opening through which the corresponding shaft 61 of the plurality of shafts 61 passes. The slope 61s of each of the plurality of shafts 61 abuts against a portion of the corresponding support portion 56B of the plurality of support portions 56B that defines an opening from above.

[0084] The cam 62 has a ring shape and extends around the axis line AX. The cam 62 is provided so as to surround one end (i.e., the cam follower 61f) of each of the multiple shafts 61. The cam 62 provides a cam surface 62s. The cam follower 61f of each of the multiple shafts 61 abuts against the cam surface 62s.

[0085] When the cam 62 is rotated around the axis AX, the shafts 61 move along the radial direction. When the cam 62 is rotated around the axis AX so as to move the shafts 61 closer to the axis AX, the support parts 56B move upward. As a result, the second chamber 32 is fixed in a state in which the top part 32c abuts against the top part 26 of the first chamber 10. On the other hand, when the cam 62 is rotated around the axis AX so as to move the shafts 61 away from the axis AX, the support parts 56B move downward. As a result, the second chamber 32 is pulled downward away from the first chamber 10, and the fixation of the second chamber 32 to the first chamber 10 is released.

[0086] The release mechanism 36B generates power to rotate the cam 62 around the axis line AX. The release mechanism 36B includes, for example, a motor. When the release mechanism 36B rotates the cam 62 around the axis line AX so as to move the multiple shafts 61 away from the axis line AX, the second chamber 32 is pulled downward away from the first chamber 10, and the second chamber 32 is released from the fixation of the second chamber 32 to the first chamber 10.

[0087] Hereinafter, reference will be made to Fig. 14. Fig. 14 is a diagram showing a fixing device and a release mechanism according to yet another exemplary embodiment. The substrate processing apparatus 1 may include a fixing device 34C and a release mechanism 36C shown in Fig. 14 instead of the fixing device 34 and the release mechanism 36.

[0088] The fixing device 34C includes a plurality of supports 56C and a cam mechanism 70. The number of supports 56C in the fixing device 34C may be one. The engagement members 56b of each of the supports 56C are formed such that the top portion 32c is suspended therefrom, similar to the engagement members 56b of each of the supports 56. The cam mechanism 70 is configured to move the supports 56C upward to bring the top portion 32c into contact with the top portion 26 of the first chamber 10.

[0089] As shown in FIG. 14, each of the multiple support parts 56C is rod-shaped. The top part 26 of the first chamber 10 provides multiple holes 26h extending downward from the inside thereof. The multiple holes 26h may be arranged at equal intervals around the axis line AX. When the second chamber 32 is fixed to the first chamber 10, the multiple holes 26h are connected to the multiple recesses 39r. The multiple support parts 56C are respectively arranged in the multiple holes 26h. Also, when the top part 32c is suspended from the multiple support parts 56C, the engagement members 56b of the multiple support parts 56C are respectively arranged in the multiple recesses 39r and their extensions 39e.

[0090] The top portion 26 of the first chamber 10 further provides a plurality of holes 26j. Each of the holes 26j intersects with the holes 26h and extends in a radial direction relative to the axis AX. The upper ends of the support portions 56C are disposed in the holes 26j, respectively. The upper ends of the support portions 56C respectively constitute a plurality of cam followers 56f.

[0091] The cam mechanism 70 includes a plurality of cam followers 56f and a plurality of camshafts 71. The plurality of camshafts 71 are disposed in the plurality of holes 26j, respectively. Each of the plurality of camshafts 71 has a substantially cylindrical shape and extends in a radial direction with respect to the axis line AX. Both ends of each of the plurality of camshafts 71 are supported by a pair of camshaft bearings 72. Each of the plurality of camshafts 71 is supported by the pair of camshaft bearings 72 so as to be rotatable about its central axis line.

[0092] Each of the plurality of camshafts 71 provides a cam surface on its inner side. Each of the plurality of cam followers 56f abuts against the cam surface of a corresponding one of the plurality of camshafts 71.

[0093] When the camshafts 71 are rotated around their central axes, the cam followers 56f (i.e., the upper ends of the support portions 56C) move upward or downward. As a result, the support portions 56C move upward or downward. When the camshafts 71 are rotated so that the support portions 56C move upward, the second chamber 32 is fixed with the top portion 32c abutting against the top portion 26 of the first chamber 10. On the other hand, when the camshafts 71 are rotated so that the support portions 56C move downward, the second chamber 32 is pulled downward away from the first chamber 10, and the fixation of the second chamber 32 to the first chamber 10 is released.

[0094] The release mechanism 36C generates power to rotate the multiple camshafts 71 via the shaft 73. The release mechanism 36C includes, for example, a motor. When the release mechanism 36C rotates the multiple camshafts 71 to move the multiple support parts 56C downward, the second chamber 32 is pulled downward away from the first chamber 10, and the second chamber 32 is released from the first chamber 10.

[0095] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various additions, omissions, substitutions, and modifications may be made. In addition, elements in different embodiments can be combined to form other embodiments.

[0096] For example, in other embodiments, the substrate processing apparatus may be another type of plasma processing apparatus, such as an inductively coupled plasma processing apparatus, an electron cyclotron resonance (ECR) plasma processing apparatus, or a plasma processing apparatus that uses microwaves to generate plasma, etc. In still other embodiments, the substrate processing apparatus may be a substrate processing apparatus configured to perform substrate processing other than plasma processing.

[0097] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various changes may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims. [Explanation of symbols]

[0098] 1...substrate processing apparatus, 10...first chamber, 12s...side wall, 12o...opening, 14...substrate support, 24...actuator, 32...second chamber, S...processing space, 34...fixing device, 36...release mechanism, PS...substrate processing system, CTM...transfer module, CTU...transfer device.

Claims

1. a first chamber having an interior space and an opening; a substrate support disposed within the interior space of the first chamber; an actuator configured to move the substrate support between a first position and a second position; a second chamber disposed within the interior space of the first chamber, the second chamber defining a substrate processing space together with the substrate support when the substrate support is in the first position, and the second chamber being transportable between the interior space of the first chamber and an outside thereof through the opening when the substrate support is in the second position; at least one fastener configured to releasably fasten the second chamber to the first chamber in the interior space of the first chamber; Equipped with the first chamber includes a top portion; the second chamber includes a ceiling extending above the substrate processing volume and separate from the ceiling of the first chamber; Substrate processing equipment.

2. the second chamber includes a baffle and one or more ring members, the baffle being arranged to surround the substrate support when the substrate support is in the first position, and the one or more ring members being arranged to surround a substrate placed on the substrate support in the substrate processing space when the substrate support is in the first position. The substrate processing apparatus according to claim 1 .

3. the at least one fastener is configured to releasably fasten a top of the second chamber to a top of the first chamber in the interior space of the first chamber; The substrate processing apparatus according to claim 2 .

4. The at least one fixation device comprises: an engagement member configured to engage a top of the second chamber; a biasing member configured to bias the engagement member upward when the engagement member is engaged with the top portion of the second chamber; Including, The substrate processing apparatus according to claim 3 .

5. The substrate processing apparatus of claim 4 , further comprising a release mechanism configured to release the second chamber from the first chamber by the at least one fastener.

6. The substrate processing apparatus according to claim 5 , wherein the release mechanism includes an air supplier.

7. The at least one fixation device comprises: an engagement member configured to engage a top of the second chamber; a cam mechanism configured to move the engagement member engaging the top of the second chamber upwardly so as to bring the top of the second chamber into contact with the top of the first chamber; Including, The substrate processing apparatus according to claim 3 .

8. the first chamber has a substrate transfer port; the second chamber includes a movable shutter that faces the substrate transfer port when the second chamber is fixed to the first chamber in the internal space of the first chamber; The substrate processing apparatus further includes an additional actuator configured to actuate the movable shutter between an open position and a closed position. The substrate processing apparatus according to any one of claims 2 to 7.

9. a first chamber having a first interior space and a first opening; a substrate support disposed within the first interior space; a second chamber disposed within the first interior space, the second chamber having a second interior space and a second opening; at least one actuator configured to relatively move at least one of the substrate support and the second chamber between a first state and a second state in the first interior space, the first state being a state in which the substrate support closes the second opening and the second state being a state in which the substrate support is away from the second opening; at least one retainer configured to releasably secure the second chamber to the first chamber in the first interior space, the second chamber being transportable between the first interior space and an exterior of the first chamber through the first opening when the second chamber is released from the first chamber by the at least one retainer; and Equipped with the first chamber includes a top portion; the second chamber defines a substrate processing space together with the substrate support in the first state; the second chamber includes a ceiling extending above the substrate processing volume and separate from the ceiling of the first chamber; Substrate processing equipment.

10. 10. The substrate processing apparatus of claim 9, wherein the second chamber is transportable between the first internal space and an outside of the first chamber through the first opening when the second chamber is released from being fixed to the first chamber by the at least one fixing device in the second state.

11. 11. The substrate processing apparatus of claim 9 or 10, wherein the at least one actuator includes a first actuator configured to move the substrate support between a first upper position and a first lower position in the first internal space, the substrate support being disposed at the first upper position in the first state and at the first lower position in the second state.

12. 12. The substrate processing apparatus of claim 11, wherein the at least one actuator includes a second actuator configured to move the second chamber between a second upper position and a second lower position in the first internal space, the second chamber being disposed at the second upper position in the first state and at the second lower position in the second state.

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