Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of suppressing the collapse of a three-dimensional structure.SOLUTION: A substrate processing apparatus 10 includes a batch-type first processing unit 30, a buffer unit 40, a single-wafer type second processing unit 50, an inter-batch transport unit 60, and a batch sheet-to-sheet transfer unit 70. The first processing unit 30 processes a plurality of substrates W by immersing them in a processing liquid. The buffer unit 40 has a waiting space, and makes the plurality of substrates W wait in the waiting space while maintaining a wet state in which at least one of the liquid and the solid solidified from the liquid adheres to the plurality of substrates W. The inter-batch transfer unit 60 transfers the plurality of substrates W from the first processing unit 30 to the buffer unit 40. The second processing unit 50 dries the substrates W one by one. The batch sheet-to-sheet transfer unit 70 transfers the plurality of substrates W from the buffer unit 40 to the second processing unit 50 one by one.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] Conventionally, a batch-type processing apparatus has been proposed that uses phosphoric acid to etch away silicon nitride films. The batch-type processing apparatus processes multiple substrates at once, and therefore can process the substrates with a high throughput. The processing apparatus performs a rinse process in which phosphoric acid adhering to the multiple substrates is replaced with a rinse liquid. The processing apparatus then performs a drying process in which the multiple substrates after the rinse process are dried at once.

[0003] The following Patent Documents 1 and 2 are cited as technologies related to the present application. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-502275 A [Patent Document 2] Special Publication No. 2006-265148 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in recent years, three-dimensional structures (eg, patterns) formed on substrates have become more precise, and performing drying treatment on a plurality of substrates at the same time may result in the collapse of the three-dimensional structures.

[0006] In view of the above, an object of the present disclosure is to provide a substrate processing apparatus capable of suppressing the collapse of a three-dimensional structure. [Means for solving the problem]

[0007] A first aspect of the substrate processing apparatus includes a batch-type first processing section for processing a plurality of substrates by immersing the substrates in a processing liquid; a buffer section having a waiting space in which the plurality of substrates are kept waiting in the waiting space while maintaining a wet state in which at least one of the liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport section for transporting the plurality of substrates from the first processing section to the buffer section; a single-wafer type second processing section for drying the substrates one by one; and a batch inter-wafer transport section for transporting the plurality of substrates one by one from the buffer section to the second processing section. the buffer unit is provided in the waiting space and includes a nozzle that ejects at least one of the liquid and the vapor of the liquid toward the plurality of substrates, the nozzle being provided at a position in the waiting space to the side of the plurality of substrates in a plan view. . A second aspect of the substrate processing apparatus includes a batch-type first processing section which processes a plurality of substrates by immersing the substrates in a processing liquid, a buffer section having a waiting space in which the plurality of substrates are kept waiting while maintaining a wet state in which at least one of the liquid and a solidified form of the liquid adheres to the plurality of substrates in the waiting space, an inter-batch transport section which transports the plurality of substrates from the first processing section to the buffer section, a single-wafer type second processing section which dries the substrates one by one, and a batch inter-wafer transport section which transports the plurality of substrates one by one from the buffer section to the second processing section, wherein the buffer section is provided in the waiting space and includes a nozzle which ejects a fluid which is at least one of the liquid and vapor of the liquid toward the plurality of substrates, and the nozzle ejects the fluid intermittently.

[0010] Substrate processing equipment 3 The embodiment of the present invention is as follows: a first processing unit of a batch type for processing a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space for holding the substrates in a waiting space while maintaining a wet state in which at least one of the liquid and a solidified form of the liquid adheres to the substrates; an inter-batch transport unit for transporting the substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type for drying the substrates one by one; and a batch inter-wafer transport unit for transporting the substrates one by one from the buffer unit to the second processing unit, the buffer unit being provided in the waiting space and including a nozzle for ejecting a fluid which is at least one of the liquid and a vapor of the liquid toward the substrates; The buffer unit further includes a relative displacement mechanism that changes a relative positional relationship between the ejection opening of the nozzle and the plurality of substrates to change positions at which the fluid strikes the plurality of substrates.

[0011] Substrate processing equipment 4 The embodiment of the present invention is as follows: a first processing unit of a batch type for processing a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space for holding the substrates in a waiting space while maintaining a wet state in which at least one of the liquid and a solidified form of the liquid adheres to the substrates; an inter-batch transport unit for transporting the substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type for drying the substrates one by one; and a batch inter-wafer transport unit for transporting the substrates one by one from the buffer unit to the second processing unit, the buffer unit being provided in the waiting space and including a nozzle for ejecting a fluid which is at least one of the liquid and a vapor of the liquid toward the substrates; The buffer section keeps the multiple substrates waiting in an inclined position inclined from a horizontal position so that a first end of each of the multiple substrates on the nozzle side is positioned vertically above a second end opposite the first end.

[0012] Substrate processing equipment 5 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit, The buffer unit further includes a cooling unit that cools the plurality of substrates waiting in the waiting space.

[0013] Substrate processing equipment 6 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit, The buffer section includes an opening / closing member that opens and closes an opening of the waiting space through which the plurality of substrates pass when being carried in and out.

[0014] Substrate processing equipment 7 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit,The first processing units are arranged in a first row along a predetermined direction, and the buffer units are arranged in a second row along the predetermined direction, and the inter-batch transport unit includes a holding member that holds the substrates, a rotation mechanism that rotates the holding member between a position directly above the first row and a position directly above the second row, and a linear motion mechanism that moves the holding member along the predetermined direction.

[0015] Substrate processing equipment 8 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit, The inter-batch transport section receives the multiple substrates in an upright position from the first processing section, converts the position of the multiple substrates from the upright position to a horizontal position, and transports the multiple substrates in the horizontal position to the buffer section, the buffer section including a pair of first support members supporting both ends of each of the multiple substrates while the multiple substrates are arranged vertically, and a pair of second support members disposed on the inter-batch transport section side of the pair of first support members and capable of moving between an open position and a closed position, the open position being a position where the distance between the second support members is wider than the diameter of the multiple substrates, and the closed position being a position where the second support members support the ends of each of the multiple substrates.

[0016] Substrate processing equipment 9 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit, The inter-batch transport unit receives the multiple substrates in an upright position from the first processing unit, converts the position of the multiple substrates from the upright position to a horizontal position, and transports the multiple substrates in the horizontal position to the buffer unit, the buffer unit including a lifting mechanism for raising and lowering the multiple substrates, and the batch inter-sheet transport unit removes the substrate to be removed in a state in which the lifting mechanism has raised the multiple substrates so that a substrate to be removed among the multiple substrates is located vertically above the waiting space and at least one substrate not to be removed among the multiple substrates is located within the waiting space.

[0017] Substrate processing equipment 10 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit,The buffer section waits the plurality of substrates in a position inclined from a horizontal position so that a first end of each of the plurality of substrates on the side of the batch inter-substrate transport section is positioned vertically above a second end opposite the first end.

[0018] Substrate processing equipment 11 The embodiment of the present invention is as follows: A substrate processing apparatus comprising: a first processing section of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer section having a waiting space in which the plurality of substrates are kept waiting in the waiting space while maintaining a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport section that transports the plurality of substrates from the first processing section to the buffer section; a second processing section of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport section that transports the plurality of substrates one by one from the buffer section to the second processing section, At least one of the batch inter-transport unit and the batch inter-sheet transport unit includes a posture change unit that changes the posture of the multiple substrates between an upright posture and a horizontal posture, and the substrate processing apparatus further includes a shielding plate that is provided directly above the multiple substrates held by the posture change unit and that obstructs airflow from vertically above.

[0019] Substrate processing equipment 12 The embodiment of the present invention is as follows: a first processing unit of a batch type that processes a plurality of substrates by immersing the substrates in a processing liquid; a buffer unit having a waiting space in which the plurality of substrates are kept waiting in the waiting space while a wet state in which at least one of a liquid and a solidified form of the liquid adheres to the plurality of substrates; an inter-batch transport unit that transports the plurality of substrates from the first processing unit to the buffer unit; a second processing unit of a single-wafer type that dries the substrates one by one; and a batch inter-wafer transport unit that transports the plurality of substrates one by one from the buffer unit to the second processing unit, The substrate processing apparatus further includes a load port into which the plurality of substrates are loaded from outside the substrate processing apparatus, an intermediary unit that supports in a vertical direction the substrates transported one by one from the second processing apparatus by the batch inter-batch transport unit, and an indexer transport unit that transports the plurality of substrates collectively from the load port to the inter-batch transport unit and transports the plurality of substrates collectively from the intermediary unit to the load port. A thirteenth aspect of the substrate processing apparatus is a substrate processing apparatus according to any one of the third to twelfth aspects, wherein the buffer section is provided in the waiting space and includes a waiting tank for storing the liquid, and a circulation section for returning the liquid overflowing from the waiting tank to the waiting tank. Effect of the Invention

[0020] Substrate processing apparatus No. 1 From the 13th According to this aspect, when the substrate is transported from the first processing section to the second processing section, the substrate passes through the buffer section. Therefore, even if the processing in the second processing section is delayed, the buffer section can absorb the difference in processing speed between the first processing section and the second processing section. Moreover, since the buffer section keeps the substrates in a wet state while allowing the substrates to wait, collapse of the three-dimensional structure of the substrates due to drying can be suppressed or avoided.

[0021] Substrate processing equipment 13 According to this aspect, it is possible to suppress the adhesion of impurities to the substrate.

[0022] Substrate processing equipment 1st and 2nd According to this aspect, the liquid can be easily applied to the substrate.

[0023] Substrate processing equipment 3 According to this aspect, the liquid or vapor can be supplied to a wider area of ​​the surface of the substrate.

[0024] Substrate processing equipment 4 According to this aspect, the liquid flows over the surface of the substrate from the first end toward the second end, so that the liquid can be applied to a wider area of ​​the substrate.

[0025] Substrate processing equipment 5 According to this aspect, evaporation of the liquid attached to the substrate can be suppressed.

[0026] Substrate processing equipment 6 According to this aspect, by closing the opening and closing member, evaporation of the liquid attached to the substrate can be suppressed.

[0027] Substrate processing equipment 7 According to this aspect, the inter-batch transfer section can transfer a plurality of substrates from each of the first processing sections to each of the buffer sections.

[0028] Substrate processing equipment 8 According to this aspect, when the second support member is in the open position, the inter-batch transport unit can pass the multiple substrates between the second support members and deliver them to the first support member. When the second support member is in the closed position, each of the multiple substrates can be supported at four points, allowing the substrates to be stably supported.

[0029] Substrate processing equipment 9 According to this aspect, since at least one of the objects not to be removed is located within the waiting space, drying of the at least one object not to be removed can be suppressed even when a substrate is removed from the buffer section by the batch inter-substrate transport section.

[0030] Substrate processing equipment 10This aspect contributes to the alignment of the substrate.

[0031] Substrate processing equipment 11 According to this aspect, even if a fan filter unit is provided vertically above, it is possible to prevent the substrate from drying out.

[0032] Substrate processing equipment 12 According to this aspect, the indexer transport section transports a plurality of substrates from the relay unit all at once, so that the throughput is high. [Brief description of the drawings]

[0033] [Figure 1] 1 is a plan view illustrating an example of a configuration of a substrate processing apparatus. [Diagram 2] 1 is a cross-sectional view partially and roughly illustrating an example of a three-dimensional structure of a substrate. [Diagram 3] 10 is a flowchart showing an example of an operation of the substrate processing apparatus. [Figure 4] 4 is a diagram illustrating an example of a configuration of a first processing unit. FIG. [Diagram 5] FIG. 2 is a diagram illustrating an example of a configuration of a buffer unit. [Figure 6] 4 is a diagram illustrating an example of a configuration of a second processing unit. FIG. [Figure 7] 10 is a diagram illustrating an example of a configuration of a posture conversion unit. FIG. [Figure 8] 11A and 11B are diagrams illustrating an example of how a substrate is transferred between a posture changing unit and a lifter. [Figure 9] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 10] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 11] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 12] 1 is a plan view illustrating an example of a configuration of a substrate processing apparatus. [Figure 13] 10 is a diagram illustrating an example of a configuration of a carrier storage unit. FIG. [Figure 14] 4 is a diagram illustrating an example of a configuration of a carrier transport unit. FIG. [Figure 15] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 16] 13 is a diagram illustrating an example of a state in which the transport robot takes out a substrate from a buffer unit. FIG. [Figure 17] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 18] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 19] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 20] FIG. 13 is a diagram illustrating another example of the configuration of the buffer unit. [Figure 21] FIG. 11 is a plan view illustrating a schematic configuration of another example of the substrate processing apparatus. [Figure 22] 13 is a diagram illustrating an example of the configuration of a transport robot of an inter-batch transport section. FIG. [Figure 23] FIG. 11 is a plan view illustrating a schematic configuration of another example of the substrate processing apparatus. [Figure 24] FIG. 11 is a plan view illustrating another example of the configuration of the buffer unit. [Diagram 25] FIG. 1 is a diagram illustrating an example of a configuration of a portion of a substrate processing apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] Hereinafter, an embodiment will be described with reference to the accompanying drawings. Note that the components described in the embodiment are merely examples, and are not intended to limit the scope of the present disclosure. In the drawings, the dimensions or numbers of each part may be exaggerated or simplified as necessary for ease of understanding.

[0035] In addition, the drawings show an XYZ Cartesian coordinate system as appropriate. The Z axis is an axis along the vertical direction. In the following, one side and the other side in the X-axis direction are also referred to as the +X side and the +Y side, respectively. The same applies to the Y-axis and Z-axis directions. In the following, the vertically upward direction is also referred to as the +Z side.

[0036] Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly indicate the positional relationship, but also indicate a state in which the two are relatively displaced in terms of angle or distance within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions indicating an equal state (e.g., "same," "equal," "homogeneous," etc.) not only strictly indicate a state in which the two are quantitatively equal, but also indicate a state in which there is a difference in which a tolerance or similar function is obtained, unless otherwise specified. Expressions indicating a shape (e.g., "square shape" or "cylindrical shape," etc.) not only strictly indicate the shape geometrically, but also indicate a shape having, for example, unevenness or chamfering, within a range in which a similar effect is obtained, unless otherwise specified. The expressions "comprise," "include," "have," "includes," "includes," or "has" a component are not exclusive expressions that exclude the presence of other components. The expression "at least one of A, B, and C" includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0037] <First embodiment> <Overall configuration of substrate processing apparatus> 1 is a plan view illustrating an example of a configuration of a substrate processing apparatus 10. The substrate processing apparatus 10 is an apparatus for performing wet processing on a substrate W.

[0038] The substrate W is, for example, a semiconductor substrate, and a three-dimensional structure is formed on its main surface. As a more specific example, a three-dimensional structure is formed on the main surface of the substrate W during the manufacturing process of a three-dimensional NAND (Not-AND) flash memory. FIG. 2 is a cross-sectional view partially and roughly illustrating an example of the three-dimensional structure of the substrate W. In the example of FIG. 2, the substrate W includes a support layer 93. The support layer 93 is, for example, a silicon layer. A stacked structure 90 is formed on the support layer 93. The stacked structure 90 includes a plurality of insulating films 91 and a plurality of sacrificial films 92. The insulating films 91 and the sacrificial films 92 are alternately stacked in the Z-axis direction. The insulating film 91 is, for example, a silicon dioxide film, and the sacrificial film 92 is, for example, a silicon nitride film. The insulating films 91 and the sacrificial films 92 have thicknesses of, for example, 1 nm or more and 50 nm or less. In addition, a trench 94 is formed in the stacked structure 90. The trench 94 penetrates the stacked structure 90 along the thickness direction of the substrate W. In addition, a pillar (not shown) is provided in the stacked structure 90. The pillars support the insulating film 91 when the sacrificial film 92 is removed. The width of the pillars (the width parallel to the main surface of the substrate W) is, for example, not less than 1 nm and not more than 50 nm.

[0039] In the following description, the main surface on which the three-dimensional structure is formed is also referred to as the front surface, out of the two main surfaces of the substrate W. Here, as an example, it is assumed that no device is formed on the back surface of the substrate W.

[0040] In the present embodiment, as a specific example, the substrate processing apparatus 10 etches the sacrificial film 92, but the substrate processing apparatus 10 may perform other processes on the substrate W. Below, an example of the overall configuration of the substrate processing apparatus 10 will be outlined, and then an example of each configuration will be described in detail.

[0041] As shown in Fig. 1, the substrate processing apparatus 10 includes a batch-type first processing section 30, a buffer section 40, a single-wafer type second processing section 50, an inter-batch transport section 60, and an inter-batch single-wafer transport section 70. In the example of Fig. 1, the substrate processing apparatus 10 includes a housing 100, which houses at least the first processing section 30, the buffer section 40, the second processing section 50, the inter-batch transport section 60, and the inter-batch single-wafer transport section 70. In other words, in the example of Fig. 1, the substrate processing apparatus 10 is a hybrid-type substrate processing apparatus in which the batch-type first processing section 30 and the single-wafer type second processing section 50 are mixed in the same housing 100.

[0042] 1, the substrate processing apparatus 10 is also provided with a load port 11 as a loading port into which multiple substrates W are loaded from the outside. A portable container (hereinafter referred to as a carrier) C1 for storing multiple substrates W is loaded into the load port 11. In the example of FIG. 1, multiple carriers C1 are placed in a row along the Y-axis direction in the load port 11.

[0043] The carrier C1 may be a FOUP (Front Opening Unified Pod) that stores the substrates W in an enclosed space, a SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette) that exposes the substrates W to the outside air. Here, the multiple substrates W are stored in the carrier C1 in a horizontal position with their surfaces facing the +Z side and lined up in the Z-axis direction. The horizontal position here means that the thickness direction of the substrates W is aligned with the Z-axis direction. The number of substrates W stored in the carrier C1 is not particularly limited, but is, for example, 25.

[0044] In the example of Fig. 1, the substrate processing apparatus 10 is also provided with an indexer transport section 20 that transports multiple substrates W between each carrier C1 and the inter-batch transport section 60. The indexer transport section 20 is provided inside the housing 100. The indexer transport section 20 picks up multiple substrates W from each carrier C1 all at once, converts the attitude of the substrates W from a horizontal attitude to an upright attitude, and transports the multiple substrates W in the upright attitude to the inter-batch transport section 60. The upright attitude here means an attitude in which the thickness direction of the substrate W is aligned with the horizontal direction. The indexer transport section 20 passes the multiple substrates W to the inter-batch transport section 60 in an upright attitude in which the surface of the substrate W faces the -Y side, for example.

[0045] The inter-batch transport section 60 receives a plurality of substrates W in an upright position collectively from the indexer transport section 20, and transports the plurality of substrates W collectively to the first processing section 30 and the buffer section 40 in succession.

[0046] The first processing apparatus 30 is a batch-type apparatus that immerses a plurality of substrates W in a processing liquid to process the plurality of substrates W collectively. Specifically, the first processing apparatus 30 includes a processing tank 31. A processing liquid is stored in the processing tank 31. By immersing the plurality of substrates W in the processing liquid in the processing tank 31, the first processing apparatus 30 can collectively perform processing according to the processing liquid on the plurality of substrates W.

[0047] In the example of Fig. 1, a plurality of first processing units 30 are arranged in a line along the X-axis direction (corresponding to a predetermined direction). In addition, in the example of Fig. 1, a first processing unit 30a for a chemical liquid and a first processing unit 30b for a rinsing liquid are provided as the plurality of first processing units 30. In the example of Fig. 1, two first processing units 30a and one first processing unit 30b are arranged in a line along the X-axis direction.

[0048] The processing tank 31 of the first processing unit 30a stores a chemical liquid. When the substrate processing apparatus 10 etches the sacrificial film 92 of the substrate W, the chemical liquid contains an etching liquid (e.g., phosphoric acid) capable of removing the sacrificial film 92. When the substrates W are immersed in the chemical liquid, the chemical liquid acts on the sacrificial film 92 through the trenches 94 of each substrate W, and etches the sacrificial film 92.

[0049] The processing tank 31 of the first processing unit 30b stores a rinsing liquid. The rinsing liquid includes, for example, pure water. By immersing the substrates W after the chemical processing in the rinsing liquid, the chemical liquid adhering to the substrates W can be replaced with the rinsing liquid.

[0050] The inter-batch transport unit 60 (specifically, the transport robot 61) receives the multiple substrates W in an upright position from the indexer transport unit 20, and transports the multiple substrates W to the first processing unit 30a. The multiple substrates W are collectively treated with a chemical solution by the first processing unit 30a. As a result, for example, the sacrificial film 92 of each substrate W is removed. Due to the removal of the sacrificial film 92, the insulating film 91 is no longer supported by the sacrificial film 92. Therefore, the insulating film 91 is prone to collapse.

[0051] Next, the inter-batch transport section 60 receives the multiple substrates W after the chemical processing from the first processing section 30a, and transports the multiple substrates W to the first processing section 30b. During this transport, the multiple substrates W are transported with the processing liquid (chemical liquid in this case) attached thereto. That is, the multiple substrates W are transported in a wet state. Therefore, during this transport, collapse of the three-dimensional structure of the substrates W (e.g., the insulating film 91) due to drying can be suppressed or avoided. The multiple substrates W are collectively rinsed by the first processing section 30b. As a result, the chemical liquid attached to each substrate W is replaced with the rinsing liquid.

[0052] Next, the inter-batch transfer section 60 receives the multiple substrates W from the first processing section 30b and transfers the multiple substrates W to the buffer section 40. During this transfer as well, the multiple substrates W are transferred with the processing liquid (here, the rinsing liquid) adhering thereto. In other words, the multiple substrates W are transferred in a wet state. Therefore, during this transfer as well, collapse of the three-dimensional structure of the substrates W due to drying can be suppressed or avoided.

[0053] In the example of Fig. 1, the buffer unit 40 is provided on the -Y side with respect to the first processing unit 30. In the example of Fig. 1, a plurality of buffer units 40 are provided and arranged in a row along the X-axis direction. In the example of Fig. 1, the plurality of first processing units 30 are arranged in a first row on the +Y side along the X-axis direction, and the plurality of buffer units 40 are arranged in a second row on the -Y side along the X-axis direction.

[0054] Each buffer unit 40 keeps the substrates W waiting in a wet state. The wet state here refers to, for example, a state in which liquid adheres to the substrates W (particularly the inside of the stacked structure 90). In the example of FIG. 1, the buffer unit 40 includes a waiting tank 41. A liquid is stored in the waiting tank 41. The liquid is, for example, pure water. The substrates W are immersed in the liquid in the waiting tank 41, so that the substrates W can wait in a wet state. This makes it possible to suppress or avoid drying of the substrates W during waiting, and therefore to suppress or avoid collapse of the three-dimensional structure of the substrates W due to drying.

[0055] Here, the inter-batch transport unit 60 receives a plurality of substrates W in an upright position from the first processing unit 30b, and transports the plurality of substrates W in the upright position to the buffer unit 40. Thus, the plurality of substrates W in the upright position are immersed in the standby tank 41. Such a buffer unit 40 can be realized with a similar structure to that of the first processing unit 30, and therefore the existing structure of the first processing unit 30 can be utilized. Therefore, existing technology can be easily utilized, and an increase in the manufacturing cost of the substrate processing apparatus 10 can be suppressed.

[0056] In the example of FIG. 1, the batch inter-sheet transport section 70 is provided on the -Y side with respect to the buffer section 40. The batch inter-sheet transport section 70 receives the multiple substrates W from the buffer section 40 and transports the multiple substrates W one by one to the second processing section 50. Since the buffer section 40 keeps the substrates W waiting in a wet state, the batch inter-sheet transport section 70 receives the substrates W in a wet state from the buffer section 40. Here, the batch inter-sheet transport section 70 receives the multiple substrates W in an upright position from the buffer section 40, converts the position of the substrates W from the upright position to a horizontal position, and transports the substrates W in the horizontal position one by one to the second processing section 50. Here, the batch inter-sheet transport section 70 converts the position of the substrates W to a horizontal position in which the surface of the substrate W faces the +Z side.

[0057] In the example of Fig. 1, the second processing unit 50 is provided on the -Y side with respect to the buffer unit 40. In addition, in the example of Fig. 1, a plurality of second processing units 50 are arranged in a matrix in a plan view. As a specific example, four second processing units 50 are arranged in a matrix of two rows and two columns.

[0058] Each second processing unit 50 dries at least one substrate W at a time. The drying process is not particularly limited, but may be, for example, spin drying. That is, the second processing unit 50 may dry the substrate W by rotating the substrate W around a rotation axis Q1 that passes through the center of the substrate W and is aligned with the Z-axis. Since the second processing unit 50 dries the substrate W one at a time, the substrate W can be dried with higher drying performance. Therefore, collapse of the three-dimensional structure of the substrate W due to drying can be suppressed or avoided.

[0059] The second processing apparatus 50 may supply a rinsing liquid such as pure water and isopropyl alcohol to the main surface of the substrate W as a pre-processing prior to the drying process.

[0060] Furthermore, as a pre-processing step, the second processing unit 50 may supply a processing liquid for forming a water-repellent film onto the surface of the substrate W to form the water-repellent film, and then supply a rinsing liquid. This can further prevent the collapse of the three-dimensional structure of the substrate W during the drying process. Alternatively, the second processing unit 50 may supply a supercritical liquid onto the surface of the substrate W as a pre-processing step. This can also further prevent the collapse of the three-dimensional structure of the substrate W during the drying process.

[0061] The batch inter-sheet transport section 70 takes out the dried substrates W from each second processing section 50 and transports the substrates W to the indexer transport section 20 via the relay unit 12. The relay unit 12 includes a storage container (not shown) that supports a plurality of substrates W arranged along the Z-axis direction. The storage container is, for example, a stationary storage container. The batch inter-sheet transport section 70 transports the substrates W one by one from each second processing section 50 to the relay unit 12. With each transport, the number of substrates W stored in the relay unit 12 increases. When a predetermined number of substrates W (for example, 25 substrates) are stored in the relay unit 12, the indexer transport section 20 takes out the substrates W from the relay unit 12 all at once and transports the substrates W to the carrier C1 of the load port 11.

[0062] <An example of the operation of the substrate processing apparatus> Fig. 3 is a flow chart that outlines an example of a processing step for substrates W. As shown in Fig. 3, first, a batch-type chemical processing is performed on a plurality of substrates W (step S1: batch-type chemical processing). As a more specific procedure, first, the plurality of substrates W are transported from the carrier C1 of the load port 11 to the first processing unit 30a by the indexer transport unit 20 and the inter-batch transport unit 60. Then, the first processing unit 30a performs chemical processing on the plurality of substrates W collectively. As a result, for example, the sacrificial film 92 of each substrate W is removed.

[0063] Next, a batch-type rinse process is performed on the plurality of substrates W (step S2: batch-type rinse step). Specifically, the plurality of substrates W are transported from first processing unit 30a to first processing unit 30b by inter-batch transport unit 60. Then, first processing unit 30b performs a rinse process on the plurality of substrates W collectively. As a result, the chemical liquid adhering to each substrate W is replaced with the rinse liquid.

[0064] Next, the multiple substrates W wait in the buffer section 40 (step S3: waiting step). Specifically, the multiple substrates W are transported from the first processing section 30b to the buffer section 40 by the inter-batch transport section 60. The buffer section 40 then causes the multiple substrates W to wait in a wet state. As a specific example, in the buffer section 40, the multiple substrates W are immersed in liquid in a waiting tank 41, so that the multiple substrates W wait in a wet state.

[0065] Next, the substrates W are subjected to a drying process one by one (step S4: single-wafer drying process). Specifically, the substrates W are transported one by one from the buffer unit 40 to each of the second processing units 50 by the batch single-wafer transport unit 70. Then, each of the second processing units 50 performs at least a drying process on the substrates W. Each of the second processing units 50 may perform a pre-processing process and then a drying process, if necessary.

[0066] The substrate W dried in the second processing section 50 is transported via the batch inter-substrate transport section 70, the relay unit 12 and the indexer transport section 20 to the carrier C1.

[0067] As described above, according to the substrate processing apparatus 10, the first processing section 30 can process a plurality of substrates W collectively (steps S1 and S2). This allows the substrates W to be processed with high throughput. As a specific example, the sacrificial films 92 of a plurality of substrates W can be etched away with high throughput. In particular, since the removal of the sacrificial film 92 with phosphoric acid takes time, a batch processing method in which a plurality of substrates W is processed collectively is particularly beneficial.

[0068] After the batch processing, the substrates W wait in the buffer section 40. That is, the substrates W pass through the buffer section 40 when being transported from the first processing section 30 to the second processing section 50. Therefore, even if an abnormality occurs in some of the downstream second processing sections 50 and processing in the second processing section 50 is delayed, the substrates W processed by the first processing section 30 can wait in an available buffer section 40. Therefore, as long as the buffer section 40 is available, the first processing section 30 can process the substrates W sequentially. That is, the difference between the processing speed of the batch-type first processing section 30 and the processing speed of the single-wafer-type second processing section 50 can be absorbed by the buffer section 40, and a decrease in throughput can be suppressed.

[0069] Moreover, since the buffer unit 40 keeps the substrate W in a wet state while it waits, collapse of the three-dimensional structure of the substrate W due to drying can be suppressed or avoided even during standby.

[0070] Furthermore, the substrates W are subjected to drying processing one by one by the second processing section 50 (step S4). That is, in this embodiment, after the batch-type wet processing, a drying processing is performed not in a batch-type manner but in a single-wafer type manner. Therefore, the substrates W can be dried with high drying performance. Therefore, collapse of the three-dimensional structure of the substrates W due to drying can be suppressed.

[0071] Furthermore, in the above example, when a plurality of processed substrates W are stored in the relay unit 12, the indexer transport section 20 transports the plurality of substrates W collectively from the relay unit 12 to the carrier C1 of the load port 11. This makes it possible to improve throughput compared to the case where the processed substrates W are transported one by one to the carrier C1.

[0072] <Specific examples of each configuration> A specific example of each component of the substrate processing apparatus 10 will be described below.

[0073] <Indexer transport section> 1, the indexer transport section 20 includes a transport robot 21, a relay robot 22, and a relay robot 23. The transport robot 21 is provided on the +X side of the load port 11 so as to be movable along the Y-axis direction. The transport robot 21 can stop at a position facing each carrier C1 placed on the load port 11 in the X-axis direction.

[0074] 1, the transport robot 21 includes a plurality of (e.g., 25) hands 211 and an upright support member 212. The plurality of hands 211 are arranged side by side in the Z-axis direction. The transport robot 21 moves the plurality of hands 211 to remove a plurality of unprocessed substrates W from the carrier C1. As a result, one substrate W is placed on each hand 211.

[0075] Each hand 211 is provided with an upright support member 212 that supports the substrate W at its base. The upright support member 212 is provided to be movable in the X-axis direction, and by moving to the -X side with the substrate W held on the hand 211, the end of the substrate W on the +X side is clamped in its thickness direction.

[0076] Here, the transport robot 21 has a posture conversion function that converts the postures of the multiple substrates W from a horizontal posture to an upright posture. Specifically, the transport robot 21 rotates the multiple hands 211 by 90 degrees around a rotation axis along the Y-axis direction. This rotation is realized by, for example, a motor. As a result, the thickness direction of the substrate W is along the X-axis direction. The transport robot 21 also rotates the multiple hands 211 by 90 degrees around a rotation axis along the Z-axis direction. This rotation is also realized by, for example, a motor. As a result, the thickness direction of the substrate W is along the Y-axis direction. Here, the transport robot 21 converts the posture of the substrate W so that the surface of the substrate W faces the -Y side. Then, the transport robot 21 moves to the end of the +Y side of its movement path while holding the multiple substrates W, and hands over the multiple substrates W to the relay robot 22.

[0077] 1, the relay robot 22 includes a pair of holding members 221. Each holding member 221 has an elongated shape extending in the Y-axis direction, and the two holding members 221 are provided side by side in the X-axis direction. Each holding member 221 has a plurality of grooves (not shown) formed side by side along the Y-axis direction. The pitch of the grooves is equal to the pitch of the plurality of substrates W.

[0078] The relay robot 22 has a lifting mechanism (not shown) that lifts and lowers the pair of holding members 221. With the lifting mechanism of the relay robot 22 lowering the pair of holding members 221 to the lower position, the transport robot 21 moves to the end of the +Y side of the movement path. At this time, the pair of holding members 221 are positioned lower than the multiple substrates W. The transport mechanism of the relay robot 22 lifts the pair of holding members 221, thereby lifting the multiple substrates W from the transport robot 21 from the -Z side. At this time, the ends of each substrate W are inserted into each groove. As a result, the pair of holding members 221 hold the multiple substrates W in an upright position. Then, the transport robot 21 moves to the -Y side.

[0079] The lifting mechanism of the relay robot 22 includes, for example, a ball screw structure including a motor, or a cam mechanism, an air cylinder, etc. Note that other lifting mechanisms described later are similar, so repeated explanations will be avoided below.

[0080] The relay robot 23 includes a holding member 231. The holding member 231 is a member that holds multiple substrates W in an upright position. A plurality of grooves (not shown) are formed on the upper surface of the holding member 231, aligned along the Y-axis direction. The pitch of the grooves is equal to the pitch of the multiple substrates W. The -Z side end of each substrate W is inserted into each groove, whereby the multiple substrates W are supported by the holding member 231 in an upright position.

[0081] The relay robot 23 includes a moving mechanism (not shown) that moves the holding member 231 in the X-axis direction. The moving mechanism moves the holding member 231 between a first delivery position that faces the relay robot 22 in the Z-axis direction and a second delivery position that is on the +X side of the first delivery position. The moving mechanism includes, for example, a ball screw structure including a motor or a mechanism such as an air cylinder. Note that the other moving mechanisms described later are similar, so repeated explanations will be avoided below.

[0082] When the holding members 231 are located at the first transfer position, the holding members 231 are located directly below the multiple substrates W held by the relay robot 22. In this state, the lifting mechanism of the relay robot 22 lowers the pair of holding members 221, whereby the multiple substrates W are transferred to the holding members 231.

[0083] The movement mechanism of the relay robot 23 moves the holding member 231 to the second transfer position. As a result, the multiple substrates W in the upright posture move to the second transfer position. The relay robot 23 delivers the multiple substrates W to the inter-batch transport part 60 at the second transfer position.

[0084] As described above, the indexer transport section 20 takes out a plurality of unprocessed substrates W from the carrier C1, converts the orientation of the substrates W into an upright orientation, and transports the plurality of substrates W in the upright orientation to the inter-batch transport section 60.

[0085] Furthermore, the transport robot 21 collectively removes the plurality of processed substrates W from the relay unit 12 at the −Y end of its movement path. Then, the transport robot 21 stores the plurality of processed substrates W in the carrier C1 of the load port 11.

[0086] <First processing section> Next, a description will be given of an example of the first processing unit 30. In the example of Fig. 1, the multiple first processing units 30 are arranged in a line along the X-axis direction together with the relay robot 23 on the +X side of the relay robot 23.

[0087] 4 is a diagram illustrating an example of the configuration of first processing apparatus 30. First processing apparatus 30 includes a processing tank 31 and a lifter 32. Processing tank 31 has a box shape that opens to the +Z side, and stores the processing liquid.

[0088] The lifter 32 includes a plurality of holding members 33 (three in the figure) that hold a plurality of substrates W in an upright position, a base 34 that supports the holding members 33, and a lifting mechanism 35 that raises and lowers the base 34. Each holding member 33 has an elongated shape extending in the Y-axis direction, and its base end on the +Y side is attached to the base 34. A plurality of grooves (not shown) are formed in each holding member 33 in a line in the Y-axis direction. The pitch of the grooves is equal to the pitch of the plurality of substrates W. The ends of the substrates W are inserted into the grooves of the holding members 33, so that the plurality of holding members 33 hold the plurality of substrates W in an upright position. The base 34 has a plate-like shape and is provided with its thickness direction aligned along the Y-axis direction. The lifting mechanism 35 raises and lowers the base 34, thereby raising and lowering the plurality of substrates W held by the holding members 33. In the following, the lifting mechanism 35 may be described as the lifter 32.

[0089] The lifter 32 raises and lowers the multiple substrates W between a transfer position on the +Z side of the processing tank 31 and a processing position within the processing tank 31. The transfer position is a position where the multiple substrates are transferred between the lifter 32 and the inter-batch transport section 60. In the example of FIG. 4, the lifter 32 located at the transfer position is shown by a solid line. The processing position is a position where the multiple substrates W are immersed in the processing liquid. The lifter 32 lowers the multiple substrates W to the processing position, whereby the multiple substrates W are processed. In the example of FIG. 4, the lifter 32 and the substrates W located at the processing position are also shown by a two-dot chain line diagrammatically.

[0090] The first processing apparatus 30 is provided with a supply unit that supplies the processing liquid to the processing tank 31, and a discharge unit that discharges the processing liquid from the processing tank 31. If necessary, the first processing apparatus 30 may be provided with at least one of a gas supply unit that supplies a gas to the processing liquid in the processing tank 31, and a circulation unit that returns the processing liquid overflowing from the +Z side of the processing tank 31 back to the processing tank 31.

[0091] In the example of FIG. 4, a transfer robot 61 of the inter-batch transfer section 60 is also shown, but the transfer robot 61 will be described in detail later.

[0092] <Buffer section> 5 is a diagram illustrating an example of the configuration of the buffer unit 40. The buffer unit 40 may have a configuration similar to that of the first processing unit 30, or may have a configuration different from that of the first processing unit 30. In the example of FIG. 5, the buffer unit 40 includes a waiting tank 41 and a lifter 42. The waiting tank 41 has a box shape that opens to the +Z side and stores liquid. The lifter 42 includes a plurality of holding members 421 that hold a plurality of substrates W in an upright position, a base 422 that supports the holding members 421, and a lifting mechanism 423 that lifts and lowers the base 422. The holding members 421, the base 422, and the lifting mechanism 423 are similar to the holding members 33, the base 34, and the lifting mechanism 35, respectively.

[0093] The lifter 42 raises and lowers the multiple substrates W between a transfer position on the +Z side of the standby tank 41 and a standby position within the standby tank 41. The transfer position is a position where the multiple substrates W are transferred between the lifter 42 and the inter-batch transport section 60. The standby position is a position where the multiple substrates W are immersed in liquid within the standby tank 41. The lifter 42 lowers the multiple substrates W to the standby position, allowing the multiple substrates W to wait in a wet state.

[0094] 5, the buffer unit 40 further includes an opening / closing member 43. The opening / closing member 43 can switch the state of the waiting space H1, in which the multiple substrates W are waiting, between a sealed state and an open state. The waiting tank 41 is provided within the waiting space H1. The opening / closing member 43 is, for example, an openable and closable lid or shutter provided on the +Z side of the waiting space H1. When the opening / closing member 43 is opened, the waiting space H1 is connected to the outside space, and when the opening / closing member 43 is closed, the waiting space H1 is shielded from the outside space.

[0095] The lifter 42 can lower the multiple substrates W into the waiting space H1 with the opening / closing member 43 open. Specifically, when the substrates W are loaded or unloaded, the multiple substrates W pass through the opening on the +Z side of the waiting space H1 along the Z-axis direction through the opening on the +Z side, thereby entering the waiting space H1. The opening / closing member 43 closes the opening of the waiting space H1, thereby suppressing or avoiding the intrusion of floating matter from the external space into the waiting space H1. Thus, contamination of the multiple substrates W can be suppressed or avoided. In addition, since the waiting space H1 is sealed, evaporation of the liquid in the waiting tank 41 can also be suppressed.

[0096] 5, the buffer unit 40 further includes a supply unit 44, a circulation unit 45, and a discharge unit 46. The supply unit 44 supplies liquid to the standby tank 41. The circulation unit 45 circulates the liquid by returning the liquid that has overflowed from the end (i.e., the upper end) of the standby tank 41 to the standby tank 41 again. The discharge unit 46 discharges the liquid from the standby tank 41.

[0097] Supply unit 44 includes supply pipe 441 and valve 442. An upstream end of supply pipe 441 is connected to a liquid supply source, and liquid discharged from a downstream end of supply pipe 441 is supplied into standby tank 41. The liquid supply source has a tank for storing liquid. Note that, although the downstream end of supply pipe 411 supplies liquid to standby tank 41 from the +Z side of standby tank 41 in the example of FIG. 1, this is not limited thereto. For example, the downstream end of supply pipe 411 may be connected to the bottom of standby tank 41, and liquid may be supplied to standby tank 41 from the bottom of standby tank 41. Valve 442 is interposed in supply pipe 441.

[0098] The circulation unit 45 includes, for example, an upflow tank 451, a circulation pipe 452, a pump 453, and a filter 454. The upflow tank 451 is an outer tank that receives liquid overflowing from the upper end of the standby tank 41. The upstream end of the circulation pipe 452 is connected to, for example, the bottom of the upflow tank 451, and the downstream end of the circulation pipe 452 is connected to, for example, the bottom of the standby tank 41. The pump 453 is interposed in the circulation pipe 452 and sends the liquid from the upflow tank 451 to the standby tank 41. The filter 454 is interposed in the circulation pipe 452 and captures impurities from the liquid flowing through the circulation pipe 452. This allows clean liquid to flow into the standby tank 41.

[0099] By circulating the liquid, a liquid flow from the -Z side to the +Z side (so-called upflow) is generated in the standby tank 41, so that adhesion of impurities to the substrates W can be suppressed.

[0100] The discharge unit 46 includes a discharge pipe 461 and a valve 462. In the example of Fig. 5, the upstream end of the discharge pipe 461 is connected to the middle of the circulation pipe 452. The valve 462 is disposed in the discharge pipe 461. When the valve 462 is opened, the liquid in the standby tank 41 and the upflow tank 451 is discharged to the outside through the circulation pipe 452 and the discharge pipe 461.

[0101] It is not necessary to provide the circulation section 45 in order to form an upflow. In short, it is sufficient that the upflow tank 451, a supply pipe for introducing liquid into the bottom of the standby tank 41, and a discharge pipe for discharging the liquid from the upflow tank 451 are provided.

[0102] <Inter-batch transport section> Next, an example of the inter-batch transfer section 60 will be described. In the example of Fig. 1, the transfer robot 61 includes a pair of holding members 611, a base 612, an opening / closing mechanism 613, and a moving mechanism 614. The base 612 is, for example, a plate-like member, and is provided on the +Z side of the first processing section 30 with its thickness direction aligned along the Z-axis direction.

[0103] The holding members 611 are members that hold a plurality of upright substrates W. The two holding members 611 are provided side by side in the X-axis direction, and are attached to the base 612 so as to be displaceable.

[0104] The opening / closing mechanism 613 displaces the holding members 611 between their respective closed and open positions. The closed position is a position where the distance between the two holding members 611 is narrow, and the holding members 611 clamp multiple substrates W. In the examples of Figures 4 and 5, the holding members 611 positioned in the closed position are shown typically by two-dot chain lines. The open position is a position where the distance between the two holding members 611 is wider than the distance in the closed position, and the holding members 611 release their holding of multiple substrates W. The opening / closing mechanism 613 includes, for example, a motor or an air cylinder.

[0105] The moving mechanism 614 moves the pair of holding members 611 to a transfer position with the relay robot 23, a transfer position with the first processing unit 30, and a transfer position with the buffer unit 40. In the example of Fig. 1, the moving mechanism 614 includes a linear motion mechanism 615 and a turning mechanism 616. The linear motion mechanism 615 moves the base 612 along the X-axis direction. As a result, the holding members 611 attached to the base 612 also move along the X-axis direction. The linear motion mechanism 615 has a mechanism such as a ball screw mechanism including a motor.

[0106] The turning mechanism 616 turns the holding member 611 around the turning axis Q2 to move it back and forth between a +Y position directly above the first processing unit 30 and a -Y position directly above the buffer unit 40. The turning axis Q2 is located between the first processing unit 30 and the buffer unit 40 and is an axis along the Z axis. The turning mechanism 616 has, for example, a shaft and a motor. The shaft extends along the turning axis Q2, and, for example, the upper end of the shaft is connected to the end of the base 612 opposite to the holding member 611. The motor rotates the shaft to rotate the base 612 around the turning axis Q2. This allows the holding member 611 connected to the base 612 to rotate between the +Y position and the -Y position.

[0107] With the rotation mechanism 616 positioning the holding member 611 at the +Y position, the linear motion mechanism 615 moves the holding member 611 along the X-axis direction, thereby moving the holding member 611 to a transfer position with the relay robot 23 and the first processing unit 30. With the rotation mechanism 616 positioning the holding member 611 at the -Y position, the linear motion mechanism 615 moves the holding member 611 along the X-axis direction, thereby moving the holding member 611 to a transfer position with the buffer unit 40. Note that, due to the rotation of the rotation mechanism 616, the posture of the substrate W at the -Y position becomes an upright posture in which the surface of the substrate W faces the +Y side. Then, at each transfer position, the opening / closing mechanism 613 moves the holding member 611 to an open position or a closed position as appropriate, thereby allowing the inter-batch transport unit 60 to transfer the substrates W to and from the transfer target.

[0108] <Second Processing Section> Next, an example of the second processing apparatus 50 will be described. Fig. 6 is a diagram that shows a schematic example of the configuration of the second processing apparatus 50. The second processing apparatus 50 includes a substrate holding section 51. The substrate holding section 51 holds the substrate W in a horizontal position. In the example of Fig. 6, the substrate holding section 51 includes a stage 511 and a plurality of chuck pins 512. The stage 511 has a disk shape, and is provided on the -Z side of the substrate W. The stage 511 is provided with its thickness direction aligned along the Z-axis direction.

[0109] The multiple chuck pins 512 are erected on the main surface (i.e., the upper surface) on the +Z side of the stage 511. Each of the multiple chuck pins 512 is provided displaceable between a chuck position in contact with the peripheral edge of the substrate W and a release position away from the peripheral edge of the substrate W. When the multiple chuck pins 512 move to their respective chuck positions, the multiple chuck pins 512 hold the substrate W. When the multiple chuck pins 512 move to their respective release positions, the hold of the substrate W is released.

[0110] In the example of FIG. 6, the substrate holder 51 further includes a rotation mechanism 513, which rotates the substrate W around a rotation axis Q1. The rotation axis Q1 is an axis that passes through the center of the substrate W and is along the Z-axis direction. For example, the rotation mechanism 513 includes a shaft 514 and a motor 515. The end (i.e., the upper end) of the shaft 514 on the +Z side is coupled to the main surface (i.e., the lower surface) on the -Z side of the stage 511, and extends from the lower surface of the stage 511 along the rotation axis Q1. The motor 515 rotates the shaft 514 around the rotation axis Q1, thereby rotating the stage 511 and the multiple chuck pins 512 together. As a result, the substrate W held by the multiple chuck pins 512 rotates around the rotation axis Q1. Such a substrate holder 51 may be called a spin chuck.

[0111] The substrate holder 51 rotates the substrate W at high speed around the rotation axis Q1, thereby scattering liquid adhering to the substrate W from the periphery of the substrate W, thereby drying the substrate W (so-called spin drying).

[0112] 6, second processing apparatus 50 also includes a guard 52. Guard 52 has a cylindrical shape and surrounds substrate W held by substrate holding portion 51. Guard 52 receives liquid splashed from the periphery of substrate W.

[0113] In the example of FIG. 6, the second processing unit 50 also includes a nozzle 53. The nozzle 53 is used to supply a rinsing liquid to the substrate W. The rinsing liquid includes, for example, at least one of pure water and isopropyl alcohol. The nozzle 53 is provided so as to be movable between a nozzle processing position and a nozzle standby position by a moving mechanism 54. The nozzle processing position is, for example, a position facing the center of the surface of the substrate W in the Z-axis direction, and the nozzle standby position is, for example, a position radially outward from the substrate W. The moving mechanism 54 has, for example, a mechanism such as a ball screw mechanism or an arm rotation mechanism. When the nozzle 53 is located at the nozzle processing position, the rinsing liquid is discharged onto the rotating substrate W. As a result, the rinsing liquid that has landed on the surface of the substrate W is subjected to centrifugal force and spreads over the entire surface of the substrate W, and is scattered outward from the periphery of the substrate W. As a result, the substrate W can be rinsed.

[0114] <Batch sheet-to-sheet transport section> Next, a description will be given of an example of the batch inter-substrate transfer section 70. In the example of Fig. 1, the batch inter-substrate transfer section 70 includes a posture conversion section 71, a transfer robot 72, and a transfer robot 73. The posture conversion section 71 receives a plurality of substrates W in an upright posture from the buffer section 40, and converts the postures of the substrates W from the upright posture to a horizontal posture.

[0115] Fig. 7 is a diagram illustrating an example of the configuration of the attitude changing unit 71. Fig. 7(a) illustrates an example of the configuration of the attitude changing unit 71 when viewed along the X-axis direction, and Fig. 7(b) illustrates an example of the attitude changing unit 71 when viewed along the Y-axis direction. Fig. 8 illustrates an example of how substrates W are transferred between the attitude changing unit 71 and the lifter 42. Fig. 8(a) illustrates an example of how the attitude changing unit 71 receives multiple substrates W from the lifter 42, and Fig. 8(b) illustrates an example of how the attitude changing unit 71 changes the attitude of the substrates W from an upright position to a horizontal position.

[0116] The attitude changing unit 71 includes a pair of holding members 711 , a pair of holding members 712 , a rotating member 713 , a base 714 , and a rotating mechanism 715 .

[0117] The rotating member 713 is attached rotatably about a rotation axis Q3 with respect to the base 714. The rotating mechanism 715 has, for example, a motor, and rotates the rotating member 713 about the rotation axis Q3 by 90 degrees with respect to the base 714. The rotation axis Q3 is an axis along the X-axis direction.

[0118] The pair of holding members 711 and the pair of holding members 712 have an elongated shape, and their base ends are attached to the rotating member 713. The holding members 711 and the holding members 712 are provided parallel to each other. Furthermore, the two holding members 711 are provided side by side in the X-axis direction, and the two holding members 712 are provided side by side in the X-axis direction.

[0119] Since the rotating member 713 rotates relative to the base 714, the postures of the holding members 711 and 712 change according to the rotational position of the rotating member 713. More specifically, the rotating member 713 rotates relative to the base 714 between an upright rotational position (see FIG. 7(a)) in which the longitudinal directions of the holding members 711 and 712 are aligned along the Y-axis direction, and a horizontal rotational position (see FIG. 8(b)) in which the longitudinal directions are aligned along the Z-axis direction.

[0120] With the rotating member 713 positioned at the upright rotation position, the pair of holding members 711 are positioned on the -Z side relative to the pair of holding members 712. Each holding member 711 has a plurality of grooves 711a formed side by side in the longitudinal direction of the holding member 711. The pitch of the grooves 711a is equal to the pitch of the plurality of substrates W. By inserting the ends of the substrates W into each groove 711a of the pair of holding members 711, the pair of holding members 711 support each substrate W in an upright position at two points.

[0121] A plurality of grooves 712a are formed on the opposing surfaces of the holding members 712 in the longitudinal direction of the holding members 712. The pitch of the grooves 712a is also equal to the pitch of the plurality of substrates W. By inserting the ends of the substrates W into each groove 712a of the pair of holding members 712, the pair of holding members 712 sandwich each substrate W in its thickness direction. This more reliably maintains the upright posture of each substrate W.

[0122] When the rotating member 713 rotates from the upright rotation position to the horizontal rotation position, the posture of the substrate W changes from the upright posture to a horizontal posture, and each substrate W is supported at four points by a pair of holding members 711 and a pair of holding members 712.

[0123] 7, the lifter 42 raises the multiple substrates W to the +Z side of the attitude changing unit 71, and the rotating member 713 is stopped at the upright rotation position. At this upright rotation position, the holding members 711 and 712 are located directly below the lifter 42.

[0124] When the lifter 42 descends, the holding member 421 passes between the pair of holding members 712 and between the pair of holding members 711. As a result, as shown in FIG. 8(a), each of the multiple substrates W is inserted into the groove 711a of the holding member 711 and the groove 712a of the holding member 712. That is, the multiple substrates W are delivered to the attitude conversion unit 71. Next, as shown in FIG. 8(b), the rotation mechanism 715 rotates the rotation member 713 90 degrees around the rotation axis Q3 relative to the base 714, thereby converting the attitude of the multiple substrates W from the upright attitude to a horizontal attitude. Note that here, since the attitude conversion unit 71 receives the multiple substrates W in the upright attitude with the front surface facing the +Y side from the lifter 42, it converts the attitude of the substrates W to a horizontal attitude with the front surface facing the +Y side.

[0125] 1, multiple buffer units 40 are arranged along the X-axis direction. Therefore, the attitude changing unit 71 is provided so as to be movable along the X-axis direction by a moving mechanism 716. The attitude changing unit 71 can stop at a position facing each buffer unit 40, receives multiple substrates W from each buffer unit 40, and changes the attitudes of the substrates W to a horizontal attitude.

[0126] The transport robot 72 is provided on the -Y side of the attitude changing unit 71, and is movable along the X-axis direction by a moving mechanism 722. The transport robot 72 has a hand 721 and a hand moving mechanism (not shown). The hand moving mechanism has, for example, an arm mechanism including a motor and a lifting mechanism, and moves the hand 721 in the Y-axis and Z-axis directions. The hand moving mechanism moves the hand 721 to remove the substrate W from the attitude changing unit 71 and transport the substrate W to the transport robot 73.

[0127] The transport robot 73 is provided on the -Y side of the transport robot 72, and is provided so as to be movable along the Y-axis direction by a moving mechanism 732. In the example of Fig. 1, two second processing units 50 are arranged in a row along the Y-axis direction on the +X side of the movement path of the transport robot 73, and two second processing units 50 are arranged in a row along the Y-axis direction on the -X side of the movement path of the transport robot 73. In other words, on each of both sides of the movement path of the transport robot 73, a plurality of second processing units 50 are arranged in a row along the movement path.

[0128] The transfer robot 73 receives the substrate W from the transfer robot 72 at the +Y end of its movement path. Like the transfer robot 72, the transfer robot 73 includes a hand 731 and a hand moving mechanism (not shown). The hand moving mechanism receives the substrate W from the transfer robot 72 by moving the hand 731. The transfer robot 73, while holding the substrate W on the hand 731, moves to a position facing the second processing apparatus 50, and transfers the substrate W to the second processing apparatus 50 by moving the hand 731.

[0129] Furthermore, the transport robot 73 moves the hand 731 to take out the dried substrate W from the second processing section 50 and transport the substrate W to the transport robot 72 , which then transports the substrate W to the relay unit 12 .

[0130] <Hand> The transport robot 72 may be provided with two or more hands 721, and the transport robot 73 may be provided with two or more hands 731. In this case, the transport robot 72 may transport two or more substrates collectively to the transport robot 73, and the transport robot 73 may receive two or more substrates W from the transport robot 72 and transport the substrates W one by one to each second processing apparatus 50.

[0131] Furthermore, the transport robot 72 may include a hand 721 for the outgoing path and a hand 721 for the returning path. The transport robot 72 may transport the wet substrate W from the attitude conversion unit 71 to the transport robot 73 with the hand 721 for the outgoing path, and transport the dry substrate W from the second processing unit 50 to the relay unit 12 with the hand 721 for the returning path. With this, even if liquid from the substrate W adheres to the hand 721 for the outgoing path, it is possible to suppress or avoid the liquid from adhering to the dried substrate W via the hand 721 of the transport robot 72. The transport robot 73 may also include a hand 731 for the outgoing path and a hand 731 for the returning path.

[0132] <Relay unit> 1, the relay unit 12 is provided at a position on the -Y side of the transfer robot 21 and on the -X side of the transfer robot 72, adjacent to the transfer robot 21 in the Y-axis direction and adjacent to the transfer robot 72 in the X-axis direction. The transfer robot 72 transports the dried substrates W to the relay unit 12 while being located at the end of the -X side of its movement path. Each time the transfer robot 72 transports a substrate, the number of substrates W stored in the relay unit 12 increases. The transfer robot 21, while being located at the end of the -Y side of its movement path, takes out a plurality of substrates W from the relay unit 12 all at once, and transports the plurality of substrates W to the carrier C1.

[0133] <Second embodiment> The configuration of the substrate processing apparatus 10 according to the second embodiment is similar to that of the substrate processing apparatus 10 according to the first embodiment. However, the specific configuration of the buffer unit 40 differs from that of the first embodiment. Hereinafter, the buffer unit 40 according to the second embodiment will be referred to as a buffer unit 40A.

[0134] FIG. 9 is a diagram showing an example of the configuration of the buffer unit 40A. The buffer unit 40A includes a vat 41A, a lifter 42A, an opening / closing member 43A, and a nozzle 44A. The vat 41A has a box shape, and its internal space corresponds to a waiting space H1 where a plurality of substrates W are kept waiting. The vat 41A can also be said to be a waiting space forming member (or a chamber) that forms the waiting space H1. The opening / closing member 43A is provided in the vat 41A and switches the state of the waiting space H1 between a sealed state and an open state. In the example of FIG. 9, the vat 41A opens to the +Z side, and the opening / closing member 43A is provided at the end of the vat 41A on the +Z side. The opening / closing member 43A is a lid or a shutter. When the opening / closing member 43A is opened, the waiting space H1 is connected to the outside space, and when the opening / closing member 43A is closed, the waiting space H1 is sealed.

[0135] The lifter 42A has a structure similar to that of the lifter 42, and raises and lowers the multiple substrates W between a transfer position and a waiting position. The transfer position is a position on the +Z side of the vat 41A, and is a position where the multiple substrates W are transferred to and from the transport robot 61. The waiting position is a position where the multiple substrates W are stored in the waiting space H1. With the lifter 42A lowering the multiple substrates W to the waiting position, the opening and closing member 43A is closed, whereby the multiple substrates W are stored in the sealed waiting space H1.

[0136] The nozzle 44A is provided in the vat 41A, and supplies liquid to the multiple substrates W positioned at the standby position. The nozzle 44A may be a shower nozzle that ejects a shower of liquid onto the multiple substrates W, or a mist nozzle that ejects a mist of liquid onto the multiple substrates W.

[0137] In the example of Fig. 9, the nozzle 44A is provided on the +Z side of the multiple substrates W positioned at the standby position. Also, in the example of Fig. 9, a pair of nozzles 44A is provided. Each nozzle 44A is provided on the opposite side to the substrate W in the X-axis direction. That is, one nozzle 44A is provided on the -X side of the substrate W, and the other nozzle 44A is provided on the +X side of the substrate W. Also, multiple nozzles 44A may be arranged along the Y-axis direction on each of the -X side and +X side of the substrate W.

[0138] The nozzle 44A is connected to a supply source through a supply pipe 441A. The supply source has a tank for storing liquid. A valve 442A is provided in the supply pipe 441A. When the valve 442A is opened, the liquid is supplied from the supply source to the nozzle 44A through the supply pipe 441A and is discharged from an outlet 44Aa of the nozzle 44A toward the multiple substrates W. As a result, the liquid adheres to the multiple substrates W.

[0139] The liquid flowing down from the substrates W is discharged to the outside through a discharge section 45A connected to the bottom of the vat 41A. The discharge section 45A includes a discharge pipe and a valve, not shown.

[0140] As described above, the nozzle 44A supplies liquid to the multiple substrates W, so that the liquid can be easily applied to the multiple substrates W. Therefore, the buffer unit 40A can keep the multiple substrates W on standby in a wet state. This makes it possible to suppress or avoid drying of the substrates W during standby, and to suppress or avoid collapse of the three-dimensional structure of the substrates W caused by this drying.

[0141] In the above example, the waiting space H1 is sealed by closing the opening / closing member 43A. This makes it possible to suppress evaporation of the liquid on the substrate W in the waiting space H1. Therefore, the amount of liquid required to suppress drying of the substrate W can be reduced.

[0142] The nozzle 44A may continuously or intermittently discharge the liquid during the entire standby period of the substrate W. In other words, the valve 442A may continuously or intermittently open during the entire standby period.

[0143] Furthermore, in the above example, the nozzle 44A ejects liquid, but it may eject vapor of the liquid. In this case, the supply source may heat the liquid to generate vapor and supply it to the supply pipe 441A. When the vapor of the liquid is supplied to the substrate W in the waiting space H1, the vapor may condense on the surface of the substrate W, so that the liquid can be attached to the substrate W. Furthermore, by supplying the vapor, the partial pressure of the vapor in the waiting space H1 can be brought close to the saturated vapor pressure, so that the evaporation of the liquid on the substrate W can also be suppressed. Therefore, the drying of the substrate W during standby can be suppressed.

[0144] 9, the buffer unit 40A is provided with a relative displacement mechanism 46A. The relative displacement mechanism 46A changes the relative positional relationship between the outlet 44Aa of the nozzle 44A and the multiple substrates W on standby. For example, the relative displacement mechanism 46A raises and lowers the nozzle 44A relative to the multiple substrates W. In this case, the relative displacement mechanism 46A has a lifting mechanism such as a ball screw mechanism including a motor, a cam mechanism, or a cylinder mechanism. The relative displacement mechanism 46A raises and lowers the nozzle 44A, thereby changing the position where the liquid adheres to the surface of the substrate W. This allows the liquid to be supplied to a wider range of the surface of the substrate W. Therefore, the drying of the substrate W can be more uniformly suppressed.

[0145] The relative displacement mechanism 46A may move the nozzle 44A along at least one of the X-axis direction and the Y-axis direction, or may rotate the nozzle 44A around a rotation axis along the Y-axis direction.

[0146] The lifter 42A is also a type of relative displacement mechanism 46A because the positional relationship between the nozzle 44A and the waiting substrates W can be changed by the lifter 42A raising and lowering the substrates W. The relative displacement mechanism 46A may displace only the nozzle 44A, may displace only the substrates W, or may displace both.

[0147] FIG. 10 is a diagram showing an example of another configuration of the buffer section 40A. In the example of FIG. 10, a plurality of sets of substrates W are waiting in a single waiting space H1, which is an internal space of the vat 41A. Here, one set includes a plurality of (for example, 25) substrates W transported by the transport robot 61. In the example of FIG. 10, two sets of substrates W are waiting side by side in the X-axis direction. In addition, in the example of FIG. 10, a pair of nozzles 44A is provided corresponding to each set. In addition, in the example of FIG. 10, in order to avoid complication of the figure, the illustration of the piping system connected to the nozzle 44A is omitted. By providing a pair of nozzles 44A corresponding to each set, liquid or steam can be more appropriately supplied to each set of substrates W. In addition, although the illustration of the opening and closing member 43A is omitted in the example of FIG. 10, it is preferable to provide the opening and closing member 43A.

[0148] <Third embodiment> The configuration of the substrate processing apparatus 10 according to the third embodiment is similar to that of the substrate processing apparatus 10 according to the first embodiment. However, the specific configuration of the buffer unit 40 differs from that of the first embodiment. Hereinafter, the buffer unit 40 according to the third embodiment will be referred to as the buffer unit 40B. The buffer unit 40B cools the substrate W to suppress evaporation of the liquid, and keeps the substrate W waiting in a wet state.

[0149] 11 is a diagram illustrating an example of the configuration of the buffer unit 40B. The buffer unit 40B includes a vat 41B, a lifter 42B, an opening / closing member 43B, and a cooling unit 44B. The vat 41B, the lifter 42B, and the opening / closing member 43B are similar to the vat 41A, the lifter 42A, and the opening / closing member 43A, respectively.

[0150] The cooling unit 44B cools the substrates W in the waiting space H1. In the example of FIG. 11, the cooling unit 44B includes a refrigerant pipe 441B and a refrigerant supply unit 442B. An upstream end and a downstream end of the refrigerant pipe 441B are connected to the refrigerant supply unit 442B. The refrigerant pipe 441B is routed along the side wall 411B of the vat 41B so as to surround the waiting space H1. The refrigerant pipe 441B may be embedded in the side wall 411B of the vat 41B, or may be provided on the outer circumferential surface of the side wall 411B, or may be provided on the inner circumferential surface of the side wall 411B.

[0151] The coolant supply unit 442B includes a cooling means (not shown) for cooling the coolant and a liquid sending means (not shown) for sending the coolant. The coolant supply unit 442B cools the coolant that flows in from the downstream end of the coolant pipe 441B, and supplies the cooled coolant to the upstream end of the coolant pipe 441B again. As a result, the coolant that has been warmed by heat exchange with the vat 41B is cooled by the coolant supply unit 442B, and the low-temperature coolant exchanges heat with the vat 41B again. As a result, the vat 41B, the standby space H1, and the multiple substrates W are cooled.

[0152] In this manner, the cooling unit 44B cools the multiple substrates W, and thus the temperature of the liquid adhering to each substrate W is also reduced. This makes it possible to suppress evaporation of the liquid. Therefore, the buffer unit 40B can also hold the multiple substrates W in a wet state. In other words, the buffer unit 40B can also suppress or prevent drying of the substrates W, and suppress or prevent collapse of the three-dimensional structure of the substrates W due to drying.

[0153] In the above example, an opening / closing member 43B is provided. By closing the opening / closing member 43B, the waiting space H1 can be sealed, so that evaporation of the liquid on each substrate W in the waiting space H1 can be further suppressed. The opening / closing member 43B and the tray 41B may be covered with a heat insulating material. The heat insulating material is, for example, a material having a thermal conductivity lower than that of air. This allows the waiting space H1 and the substrates W to be cooled efficiently.

[0154] Furthermore, the cooling section 44B may lower the temperature of the substrate W to below the freezing point of the liquid adhering to the substrate W. As a result, the liquid adhering to the substrate W solidifies (freezes), and a solid adheres to the substrate W. In this manner, the wet state includes a state in which the solidified liquid adheres to the substrate W. This also makes it possible to suppress or avoid drying of the substrate W, and therefore to suppress or avoid collapse of the three-dimensional structure of the substrate W due to drying.

[0155] It should be noted that the cooling unit 44B does not necessarily have to include the refrigerant pipe 441B and the refrigerant supply unit 442B. For example, the cooling unit 44B may include a cooling element such as a Peltier element, or may include a nozzle that supplies a freezing liquid (e.g., liquid nitrogen) to the substrate W to solidify the liquid adhering to the substrate W.

[0156] As described above, in the first to third embodiments, different configurations of the buffer unit 40 have been described. In the other embodiments described below, unless otherwise specified, the buffer unit 40 may immerse the multiple substrates W in liquid as in the first embodiment, may supply liquid or steam to the multiple substrates W by the nozzle 44A as in the second embodiment, or may cool the multiple substrates W by the cooling unit 44B as in the third embodiment.

[0157] <Fourth embodiment> 12 is a plan view illustrating an example of a configuration of a substrate processing apparatus 10A according to a fourth embodiment. The substrate processing apparatus 10A differs from the substrate processing apparatus 10 in that the inter-batch transport unit 60 has a function of changing the attitude of the substrate W and that the buffer unit 40 keeps the substrate W waiting in a horizontal attitude.

[0158] In the example of FIG. 12, the inter-batch transfer section 60 includes a transfer robot 61 , a carrier storage section 62 , and a carrier transfer section 63 .

[0159] Figure 13 is a diagram illustrating an example of the configuration of the carrier storage unit 62. Figure 13(a) shows an example of how the carrier storage unit 62 receives multiple substrates W from the transport robot 61, and Figure 13(b) shows an example of how the carrier storage unit 62 stores multiple substrates W in a carrier C2.

[0160] 13, the carrier storage unit 62 is a device that stores a plurality of substrates W transported from the transport robot 61 in a carrier C2. In the example of Fig. 12, the carrier storage unit 62 is provided alongside the buffer unit 40 on the +X side of the buffer unit 40. That is, the multiple buffer units 40 and the carrier storage unit 62 are arranged in a row in the X-axis direction.

[0161] In the example of FIG. 13, the carrier storage section 62 includes a mounting table 621, a pusher 622, and a lifting mechanism 623. A carrier C2 is mounted on the +Z main surface (i.e., the upper surface) of the mounting table 621. The internal space of the carrier C2 corresponds to a storage space that stores multiple substrates W, and the storage space opens to the +Z side and the -Z side. Hereinafter, the opening on the +Z side of the carrier C2 is also called an opening OP1, and the opening on the -Z side is also called an opening OP2. Multiple substrates W are inserted into the carrier C2 or taken out of the carrier C2 through the opening OP1. Note that the width of the opening OP2 in the X-axis direction is smaller than the diameter of the substrate W, so the substrate W cannot pass through the opening OP2. Thus, the substrate W is supported by the carrier C2.

[0162] The pusher 622 is provided inside the placement table 621 so as to be movable along the Z-axis direction. The pusher 622 is provided at a position facing the opening OP2 of the carrier C2 in the Z-axis direction. The lifting mechanism 623 raises and lowers the pusher 622 between a delivery position on the +Z side and a storage position on the -Z side. The delivery position is a position where the pusher 622 receives multiple substrates W from the transport robot 61. FIG. 13(a) shows the pusher 622 stopped at the delivery position. When the pusher 622 is located at the delivery position, the pusher 622 penetrates the storage space in the carrier C2 in the Z-axis direction, and the end (i.e., the upper end) of the pusher 622 on the +Z side is located on the +Z side of the carrier C2. In this state, the pusher 622 receives multiple substrates W from the transport robot 61. At the upper end of the pusher 622, multiple grooves (not shown) are formed side by side in the Y-axis direction. The pitch of the grooves is equal to the pitch of the multiple substrates W. The end of each substrate W on the -Z side is inserted into the groove, whereby the multiple substrates W are held by the pusher 622 in an upright position.

[0163] When the pusher 622 receives the substrates W from the transport robot 61, the lifting mechanism 623 lowers the pusher 622 to a storage position. The storage position is a position where the upper end of the pusher 622 is located on the -Z side of the opening OP2 of the carrier C2, and Fig. 13(b) shows the pusher 622 stopped at the storage position. By this lowering of the pusher 622, the substrates W are stored in the carrier C2 in an upright position.

[0164] Fig. 14 is a diagram showing a schematic example of the configuration of the carrier transport section 63. The carrier transport section 63 receives a carrier C2 storing a plurality of substrates W from the carrier storage section 62, and rotates the carrier C2 to convert the orientation of the substrates W from an upright orientation to a horizontal orientation. Fig. 14(a) shows the carrier transport section 63 when the orientation of the substrate W is in an upright orientation, and Fig. 14(b) shows the carrier transport section 63 when the carrier C2 has been rotated so that the orientation of the substrate W is in a horizontal orientation.

[0165] The carrier transport section 63 includes a pair of holding members 631, a base 632, an opening / closing mechanism 633, and a rotation mechanism 634. The holding members 631 are members that hold the carrier C2. Each holding member 631 includes a support member 6311 and a contact member 6312. Each support member 6311 has an elongated shape extending along the Y-axis direction, for example, and its base end is attached to the base 632 so as to be displaceable. The two support members 6311 are provided side by side in the X-axis direction.

[0166] Each abutment member 6312 is attached to the support member 6311 so as to be rotatable around a rotation axis Q4. The rotation axis Q4 is an axis along the X-axis direction. The two abutment members 6312 are provided coaxially. In the example of Fig. 14, each abutment member 6312 penetrates the corresponding support member 6311 in the X-axis direction.

[0167] The opening / closing mechanism 633 displaces the support members 6311 between their respective open and closed positions. The closed position is a position where the distance between the two support members 6311 is narrow, and the holding member 631 holds the carrier C2. Specifically, in this closed position, the -X side abutting member 6312 abuts against the abutment area of ​​the -X side sidewall of the carrier C2, and the +X side abutting member 6312 abuts against the abutment area of ​​the +X side sidewall of the carrier C2. The abutting member 6312 and the abutting area of ​​the carrier C2 may be provided with a locking structure that detachably locks them to each other. In the example of FIG. 14(a), the support members 6311 are shown in the closed position. The open position is a position where the distance between the two support members 6311 is wide, and the holding member 631 releases the holding of the carrier C2. In this closed position, each abutting member 6312 moves away from the carrier C1. The opening / closing mechanism 633 has, for example, a ball screw mechanism including a motor or a mechanism such as an air cylinder.

[0168] The rotation mechanism 634 rotates the abutment member 6312 90 degrees around the rotation axis Q4 relative to the support member 6311. As a result, the carrier C2 held by the abutment member 6312 also rotates 90 degrees around the rotation axis Q4. Therefore, the posture of the substrate W in the carrier C2 can be converted from an upright posture to a horizontal posture. More specifically, the rotation mechanism 634 rotates the abutment member 6312 90 degrees around the rotation axis Q4 relative to the support member 6311 so that the opening OP1 of the carrier C2 faces the -Y side (see FIG. 14(b)).

[0169] The base 632 of the carrier transport unit 63 is provided so as to be movable along the X-axis direction. Specifically, the moving mechanism 635 moves the base 632 along the X-axis direction. This allows the carrier C2 held by the holding member 631 to be moved to a delivery position directly above each buffer unit 40.

[0170] Fig. 15 is a diagram that shows a schematic example of the configuration of the buffer section 40. In the example of Fig. 15, the buffer section 40 includes a standby tank 41, a carrier holding section 47, and a lifting mechanism 48. Although not shown in Fig. 15, the buffer section 40 is provided with the supply section 44 and the discharge section 46 described in the first embodiment, and is provided with a circulation section 45 as necessary. In the example of Fig. 15, the opening / closing member 43 is not shown, but it is preferable that the opening / closing member 43 be provided.

[0171] 15, the carrier holding part 47 includes a plate-shaped part 471 and a protruding part 472 protruding from the periphery of the plate-shaped part 471 to the +Z side, and a carrier C2 in a horizontal position is placed on the main surface on the +Z side of the plate-shaped part 471. The carrier holding part 47 holds the carrier C2 so as not to block an opening OP1 on the -Y side of the carrier C2. In this way, the carrier holding part 47 does not prevent the transfer robot 72 from removing the substrate W through the opening OP1, as described below.

[0172] The carrier holding part 47 is provided so as to be able to rise and fall. A lifting mechanism 48 raises and lowers the carrier holding part 47 between a transfer position on the +Z side of the waiting tank 41 and a waiting position in the waiting tank 41. The transfer position is a position where the carrier holding part 47 transfers the carrier C2 between the carrier transport part 63 and the waiting position. The waiting position is a position where the carrier C2 and the multiple substrates W are immersed in the liquid in the waiting tank 41. In the example of Figure 15, the carrier holding part 47 located at the transfer position, the carrier C2 held by the carrier holding part 47, and the multiple substrates W in the carrier C2 are indicated by two-dot chain lines.

[0173] With the carrier holding section 47 located at the transfer position, the carrier holding section 47 receives the carrier C2 from the carrier transport section 63. Specifically, with the carrier holding section 47 and the carrier transport section 63 located at the transfer position, the opening / closing mechanism 633 of the carrier transport section 63 positions the holding member 631 in the open position. As a result, the carrier C2 is handed over to the carrier holding section 47. Next, the lifting mechanism 48 lowers the carrier holding section 47 from the transfer position to the standby position. As a result, the carrier C2 is immersed in the liquid in the standby tank 41. As a result, the buffer section 40 can hold multiple substrates W on standby while maintaining a wet state.

[0174] In the example of FIG. 15, the carrier holding part 47 includes a support member 473 that extends from the lower surface of the plate-shaped part 471 to the -Z side and penetrates the bottom of the standby tank 41, and the lifting mechanism 48 lifts and lowers the support member 473 to lift and lower the carrier holding part 47. A slidable seal may be provided between the support member 473 and the standby tank 41. Alternatively, a bellows may be provided that surrounds the support member 473 while connecting the lower surface of the plate-shaped part 471 and the bottom of the standby tank 41. Alternatively, the support member 473 may not be provided. For example, the carrier holding part 47 may have a base similar to the base 422 of the lifter 42. In this case, the carrier holding part 47 does not need to penetrate the bottom of the standby tank 41, so that the structures of the standby tank 41 and the carrier holding part 47 can be simplified.

[0175] The substrate W is transported from the buffer unit 40 to the batch inter-substrate transport unit 70. With reference to Fig. 12, the batch inter-substrate transport unit 70 does not include a posture conversion unit 71, but includes a transport robot 72 and a transport robot 73. The transport robot 72 is provided so as to be movable in, for example, the X-axis and Y-axis directions, and can be stopped at a position facing each buffer unit 40 in the Y-axis direction.

[0176] The transport robot 72 moves the hand 721 to remove the substrates W one by one from the buffer unit 40. As an example of a specific procedure, first, the lifting mechanism 48 of the buffer unit 40 moves the carrier holding unit 47 to the delivery position (see also FIG. 15). Next, the transport robot 72 moves the hand 721 into the inside of the carrier C2 through the opening OP1 and positions it directly below the substrate W to be removed. Then, the transport robot 72 raises the hand 721 to lift up the substrate W to be removed. Then, the transport robot 72 retracts the hand 721 to the -Y side and removes the substrate W to be removed from the carrier C2.

[0177] The substrate W is transported to the second processing unit 50 via the transport robot 73, as in the first embodiment. When all of the substrates W are removed from the buffer unit 40 by the transport robot 72, the carrier transport unit 63 takes out the empty carrier C2 from the buffer unit 40, changes the orientation of the carrier C2 so that the opening OP1 faces the +Z side, and then transports the carrier C2 to the carrier storage unit 62.

[0178] The substrate transported to second processing section 50 is subjected to a drying process. After the drying process, substrate W is transported from second processing section 50 via transport robot 73, transport robot 72, relay unit 12 and transport robot 21, and then stored in carrier C1.

[0179] As described above, in the fourth embodiment, the inter-batch transport section 60 upstream of the buffer section 40 converts the posture of the substrate W to a horizontal posture, and the buffer section 40 keeps the substrates W waiting in the horizontal posture. Therefore, the inter-batch transport section 70 downstream of the buffer section 40 does not need to be provided with a posture conversion function.

[0180] Meanwhile, the batch sheet-to-sheet transport section 70 transports substrates W one by one, whereas the batch inter-batch transport section 60 transports multiple substrates W together. Therefore, the transport time required to transport all of the multiple substrates W is longer for the batch sheet-to-sheet transport section 70 than for the batch inter-batch transport section 60.

[0181] Therefore, as in the first embodiment, when the batch inter-sheet transport section 70, which has a long transport time, is provided with a posture changing function, the transport time becomes even longer by the time required for posture changing, and the substrate W is likely to dry out during transport by the batch inter-sheet transport section 70. In contrast, in the fourth embodiment, the inter-batch transport section 60, which has a shorter transport time, is provided with a posture changing function. Therefore, even if the transport time in the inter-batch transport section 60 becomes longer by the time required for posture changing, the transport time is shorter than the transport time of the batch inter-sheet transport section 70, and therefore the substrate W is unlikely to dry out during transport.

[0182] Furthermore, in the fourth embodiment, since the attitude of the substrate W is changed and the substrate W is transported using the carrier C2, the attitude of the substrate W can be changed and the substrate W can be transported easily.

[0183] <Removing the substrate from the buffer> In the above example, when removing the substrate W from the buffer unit 40, the lifting mechanism 48 raises the carrier holding unit 47 to the delivery position (see FIG. 15). In this case, since the carrier C2 is located on the +Z side of the standby tank 41, the substrates W in the carrier C2 are not immersed in liquid. In other words, not only the substrates W to be removed but also the substrates W not to be removed are not immersed in liquid.

[0184] However, this is not necessarily limited to this. Fig. 16 shows an example of the manner in which the transport robot 72 takes out the substrate W from the buffer unit 40. In the example of Fig. 16, the lifting mechanism 48 raises the carrier holding unit 47 to a position (hereinafter referred to as the take-out position) where the substrate W to be taken out is located on the +Z side of the standby tank 41 and at least one substrate W located on the -Z side of the substrate to be taken out is immersed in the liquid in the standby tank 41. In the example of Fig. 16, the substrate W to be taken out on the furthest +Z side in the carrier C2 is located on the +Z side of the standby tank 41, and some of the substrates W on the -Z side of the substrate to be taken out are immersed in the liquid in the standby tank 41.

[0185] The transfer robot 72 moves the hand 721 to take out the substrate W to be taken out that is located on the +Z side of the standby tank 41. Then, the transfer robot 72 transfers the substrate W to the transfer robot 73, and the transfer robot 73 transfers the substrate W to the second processing unit 50.

[0186] When the transfer robot 72 takes out the next substrate W from the carrier C2, the lifting mechanism 48 raises the carrier holding part 47 so that the substrate W to be taken out, which is located furthest on the +Z side in the carrier C2 at that time, is located on the +Z side of the standby tank 41, and at least one other substrate W is immersed in the liquid in the standby tank 41. Then, the transfer robot 72 moves the hand 721 to take out the substrate W to be taken out from the carrier C2, and transfers the substrate W to the transfer robot 73. Thereafter, the above-mentioned operation is repeated until all the substrates W in the carrier C2 have been taken out.

[0187] As described above, when the substrates W are removed from the carrier C2, the substrates W to be removed are located on the +Z side of the standby tank 41, but at least one of the substrates W not to be removed is immersed in liquid. This makes it possible to more reliably prevent at least one of the substrates W not to be removed from drying out, even when the substrates W are removed.

[0188] In the above example, the transport robot 72 sequentially removes the substrates W from the carrier C2 starting from the +Z side. This allows more substrates W not to be removed to be immersed in the liquid in the standby tank 41 when removing the substrates W to be removed. This makes it possible to more reliably prevent more substrates W not to be removed from drying out.

[0189] When the number of substrates W in the carrier C2 decreases, it may become impossible to immerse the substrates W that are not to be removed in the standby tank 41. For example, when the last substrate W is to be removed, there are no substrates W that are not to be removed, so that it is natural that the substrates W that are not to be removed cannot be immersed in the standby tank 41.

[0190] <Buffer section> 17 is a diagram illustrating another example of the configuration of the buffer unit 40. The buffer unit 40 includes a vat 41A, an opening / closing member 43A, a nozzle 44A, a carrier holding unit 47, and a lifting mechanism .

[0191] When the opening / closing member 43A is open, the waiting space H1 in the vat 41A is connected to the external space on the +Z side. When the opening / closing member 43A is open, the lifting mechanism 48 raises and lowers the carrier holding part 47 between the delivery position and the waiting position. The delivery position is a position on the +Z side of the vat 41A, where the carrier holding part 47 delivers the carrier C2 to and from the carrier transport part 63. The waiting position is a position where the carrier C2 is stored in the waiting space H1 in the vat 41A.

[0192] The nozzle 44A is provided in the vat 41A and supplies liquid or its vapor to the multiple substrates W in the carrier C2. Although a piping system similar to that in the second embodiment is connected to the nozzle 44A, it is omitted from FIG. 17 to avoid cluttering the drawing. In the example of FIG. 17, the multiple nozzles 44A are arranged side by side along the Z-axis direction in an area facing the opening OP1 of the carrier C2 in the Y-axis direction. The liquid or vapor discharged from the multiple nozzles 44A is supplied to the multiple substrates W in the carrier C2 through the opening OP1. This allows the multiple substrates W to wait in a wet state.

[0193] When the transport robot 72 removes the substrate W, the opening / closing member 43A opens. The lifting mechanism 48 may raise the carrier holding part 47 to a transfer position where the carrier C2 is on the +Z side of the vat 41A. Alternatively, the lifting mechanism 48 may raise the carrier holding part 47 so that the substrate W to be removed is located on the +Z side of the vat 41A and at least one of the substrates W not to be removed is located in the waiting space H1. This position is a position where liquid or steam can be supplied from the nozzle 44A to at least one of the substrates W not to be removed. With this, even when the transport robot 72 removes the substrate W, the nozzle 44A can supply liquid or steam to at least one of the substrates W not to be removed. Therefore, the transport robot 72 can remove the substrate W to be removed while suppressing drying of at least one of the substrates W not to be removed.

[0194] FIG. 18 is a diagram showing another example of the configuration of the buffer section 40. The buffer section 40 includes a vat 41B, an opening / closing member 43B, a cooling section 44B, a carrier holding section 47, and a lifting mechanism 48. The lifting mechanism 48 lifts and lowers the carrier holding section 47 while the opening / closing member 43B is open. Specifically, the lifting mechanism 48 lifts and lowers the carrier holding section 47 between a transfer position and a standby position. The transfer position is a position on the +Z side of the vat 41B, where the carrier holding section 47 transfers the carrier C2 to and from the carrier transport section 63. The standby position is a position where the carrier C2 is stored in the standby space H1 in the vat 41B.

[0195] In the buffer unit 40 as described above, similarly to the third embodiment, a plurality of substrates W can be kept waiting in a wet state.

[0196] When the transport robot 72 removes the substrate W, the opening / closing member 43B opens. The lifting mechanism 48 may raise the carrier holding part 47 to a transfer position where the carrier C2 is on the +Z side of the vat 41B. Alternatively, the lifting mechanism 48 may raise the carrier holding part 47 so that the substrate W to be removed is located on the +Z side of the vat 41B and at least one of the substrates W not to be removed is located in the waiting space H1. This allows at least one of the substrates W not to be removed to continue to be effectively cooled even when the transport robot 72 removes the substrate W. Therefore, the transport robot 72 can remove the substrate W to be removed while suppressing drying of at least one of the substrates W not to be removed.

[0197] <Tilt posture> FIG. 19 is a diagram showing a schematic diagram of another example of the configuration of the buffer section 40. The buffer section 40 shown in FIG. 19 is similar to the buffer section 40 shown in FIG. 15, except for the carrier holding section 47. In the example shown in FIG. 19, the carrier holding section 47 holds the carrier C2 in an inclined position. More specifically, the carrier holding section 47 holds the carrier C2 in an inclined position in which a first end portion of the substrate W on the opening OP1 side (i.e., the batch inter-substrate transport section 70 side) is located on the +Z side with respect to a second end portion on the opposite side. The inclination angle in the inclined position is several degrees or less. The inclination angle here is the angle between a virtual line parallel to the main surface of the substrate W and a horizontal plane.

[0198] According to this, a force acts on each substrate W in the opposite direction to the opening OP1 (i.e., the opening OP2 side) due to gravity. Therefore, each substrate W is likely to move toward the opening OP2 side in the carrier C2 and is likely to abut against the support surface in the carrier C2. By abutting the multiple substrates W on the opening OP2 side against the carrier C2, the multiple substrates W can be aligned. In particular, in the example of FIG. 19, each substrate W is likely to move due to pressure from the liquid when the carrier C2 is raised and lowered. Even in such a buffer section 40, each substrate W moves toward the opening OP2 side due to gravity, so that the multiple substrates W can be aligned in the carrier C2.

[0199] This allows the transport robot 72 to remove the substrate W at a more appropriate position relative to the hand 721. Furthermore, the transport robot 73 can carry the substrate W into the second processing section 50 at an appropriate position.

[0200] Fig. 20 is a diagram illustrating another example of the configuration of the buffer unit 40. The buffer unit 40 illustrated in Fig. 20 is similar to the buffer unit 40 illustrated in Fig. 17, except for the carrier holding unit 47. The carrier holding unit 47 holds the carrier C2 in an inclined position, similar to Fig. 19.

[0201] According to this, as described above, it is possible to easily align a plurality of substrates W in the carrier C2. Moreover, since the liquid supplied from the nozzle 44A through the opening OP1 flows toward the opening OP2 along the surface of the substrate W, it is possible to attach the liquid to a wider area of ​​the surface of the substrate W. Therefore, it is possible to suppress or avoid drying of the substrate W over a wider surface area.

[0202] In the buffer unit 40 of FIG. 18, the carrier holding portion 47 may also hold the carrier C2 in an inclined position.

[0203] <Fifth embodiment> 21 is a plan view illustrating an example of a configuration of the substrate processing apparatus 10B. The substrate processing apparatus 10B differs from the substrate processing apparatus 10 in the position of the buffer unit 40, the inter-batch transfer unit 60, and the inter-batch wafer transfer unit 70.

[0204] In the substrate processing apparatus 10B, a plurality of first processing units 30 and a plurality of buffer units 40 are arranged in a line along the X-axis direction. In the example of Fig. 21, a set of buffer units 40 is provided on the +X side of a set of first processing units 30. Also, in the example of Fig. 21, a first processing unit 30b is provided on the +X side of first processing unit 30a and is adjacent to the buffer unit 40.

[0205] The inter-batch transport section 60 includes a transport robot 65 and a transport robot 66. The transport robot 65 has the same configuration as the transport robot 61, except for the presence or absence of a turning mechanism 616. The transport robot 65 is provided so as to be movable in the X-axis direction directly above the first processing section 30. A moving mechanism 654 of the transport robot 65 is provided on the +Y side of the first processing section 30. The transport robot 65 receives a plurality of substrates W in an upright position from the indexer transport section 20 (e.g., the transport robot 21) at the end of the -X side of its movement path. Here, the transport robot 65 receives a plurality of substrates W in an upright position with the surfaces of the substrates W facing the +Y side. Then, the transport robot 65 transports the plurality of substrates W to the first processing section 30a and the first processing section 30b in this order.

[0206] The transport robot 66 is provided so as to be movable along the X-axis direction directly above the first processing section 30b and directly above the buffer section 40. A movement mechanism 665 of the transport robot 66 is also provided on the +Y side of the first processing section 30. The transport robot 66 receives a plurality of substrates W from the first processing section 30b, and transports the plurality of substrates W to the buffer section 40. The buffer section 40 is similar to the buffer section 40 described in any one of the first to third embodiments, for example. That is, the buffer section 40 keeps the plurality of substrates W in an upright position waiting in a wet state.

[0207] Furthermore, the transfer robot 66 receives a plurality of substrates W in an upright position from the buffer unit 40, and converts the position of the plurality of substrates W from the upright position to a horizontal position.

[0208] Fig. 22 is a diagram showing an example of the configuration of the transport robot 66. Fig. 22(a) shows the transport robot 66 when viewed along the Y-axis direction, and Fig. 22(b) shows the transport robot 66 when viewed along the Z-axis direction.

[0209] The transfer robot 66 includes a pair of holding members 661, a base 662, an opening / closing mechanism 663, and a rotating mechanism 664. The holding members 661 are members that hold a plurality of substrates W. Each holding member 661 includes a contact member 6611, a support member 6612, and a rotating member 6613. Each support member 6612 has an elongated shape extending along the Y-axis direction, for example, and its base end on the +Y side is attached displaceably with respect to the base 662. The two support members 6412 are provided side by side in the X-axis direction.

[0210] Each rotating member 6613 is attached to the support member 6612 so as to be rotatable around a rotation axis Q5. The rotation axis Q5 is an axis along the X-axis direction. The two rotating members 6613 are provided coaxially. In the example of Fig. 22, the rotating member 6613 passes through the support member 6612 in the X-axis direction.

[0211] Abutment members 6611 are attached to ends of the rotating members 6613 that are closer to each other. That is, the -X side abutment member 6611 is provided at the +X side end of the -X side rotating member 6613, and the +X side abutment member 6611 is provided at the -X side end of the +X side rotating member 6613.

[0212] The opening / closing mechanism 663 displaces the support members 6612 between their respective open and closed positions. The closed position is a position where the distance between the two support members 6612 is narrow, and the holding member 661 supports multiple substrates W. Specifically, it is a position where the two abutment members 6611 support multiple substrates W. The open position is a position where the distance between the two support members 6612 is wide, and the holding member 661 releases its hold on the multiple substrates W. Specifically, it is a position where the two abutment members 6611 move away from the multiple substrates W. The opening / closing mechanism 663 has, for example, a motor or an air cylinder.

[0213] In the example of FIG. 22(a), each abutting member 6611 has an arc shape in which the interval between the abutting members 6611 narrows toward the -Z side. In the closed position, the -Z side portion of each abutting member 6611 abuts against the side surface of the substrates W to support the substrates W. In addition, a plurality of grooves 6611a are formed in the mutually facing surfaces of the abutting members 6611 side by side in the Y-axis direction. The pitch of the grooves 6611a is equal to the pitch of the substrates W. The upright posture of the substrate W is maintained by inserting the end of the substrate W into each groove 6611a. In addition, each groove 6611a of the abutting member 6611 has a shape that allows each substrate W to be pulled out from the abutting member 6611 to the +Z side. Hereinafter, the end of the abutting member 6611 on the +Z side in the upright posture is referred to as the access side end.

[0214] The rotation mechanism 664 rotates the rotation member 6613 90 degrees around the rotation axis Q5 relative to the support member 6612. As a result, the multiple substrates W held by the abutment member 6611 are also rotated 90 degrees around the rotation axis Q5, and the posture of the substrates W is converted from an upright posture to a horizontal posture. Specifically, the rotation mechanism 664 rotates the multiple substrates W 90 degrees so that the access side end of the abutment member 6611 faces the -Y side. Note that here, since the substrates W wait in the buffer unit 40 in an upright posture with their surfaces facing the +Y side, the posture conversion of the transport robot 66 causes the surfaces of the substrates W to face the +Z side.

[0215] The moving mechanism 665 moves the base 662 along the X-axis direction, thereby making it possible to move the multiple substrates W held by the holding members 661 along the X-axis direction.

[0216] Next, the procedure of transport from the buffer unit 40 to the batch inter-wafer transport unit 70 will be described. First, the moving mechanism 665 moves the transport robot 66 to a transfer position with the buffer unit 40. Next, the opening / closing mechanism 663 moves the holding member 661 to the open position, and the lifter 42 of the buffer unit 40 raises the multiple substrates W. As a result, the multiple substrates W are positioned between the two holding members 661. Next, the opening / closing mechanism 663 moves the holding member 661 to the closed position. As a result, the holding member 661 holds the multiple substrates W. Next, the lifter 42 descends to the standby position, and the rotating mechanism 664 rotates the rotating member 6613 by 90 degrees. As a result, the surfaces of the multiple substrates W face the +Z side, and the access side end of the holding member 661 faces the -Y side.

[0217] 21 , the batch inter-single-wafer transfer section 70 is provided on the −Y side of the buffer section 40. The batch inter-single-wafer transfer section 70 takes out substrates W from the transport robot 66 which holds a plurality of substrates W in a horizontal position directly above the buffer section 40. Specifically, the batch inter-single-wafer transfer section 70 includes a transport robot 74 and a transport robot 73, and the transport robot 74 takes out substrates W in a horizontal position from the transport robot 66.

[0218] The transport robot 74 is provided on the -Y side of the buffer units 40, and is movable along the X-axis direction by a moving mechanism 742. The transport robot 74 is movable to a position facing each buffer unit 40. The transport robot 74 includes a hand 741 and a hand moving mechanism (not shown), and the hand moving mechanism moves the hand 741 to take out the substrate W in a horizontal position from the transport robot 66.

[0219] The transport robot 74 may include two or more hands 741. In this case, the transport robot 74 may take out two or more substrates W by the hands 741. When the number of hands 741 provided is greater than the number of substrates W held by the transport robot 66, the transport robot 74 may take out all of the substrates W held by the transport robot 66.

[0220] Although the transport robot 73 may directly take out the substrate W from the transport robot 74, in the example of Fig. 21, an intermediary unit 75 is provided. The intermediary unit 75 is provided on the -Y side of the transport robot 74. The intermediary unit 75 includes a stationary storage container (not shown) that stores multiple horizontally oriented substrates W lined up in the Z-axis direction. The transport robot 74 stores the multiple horizontally oriented substrates W in the storage container of the intermediary unit 75.

[0221] The transport robot 73 is provided on the -Y side of the relay unit 75. The transport robot 73 is provided so as to be movable along the Y-axis direction by a moving mechanism 732, and sequentially takes out substrates W from the relay unit 75 at the end on the +Y side of its movement path, and transports the substrates W to each second processing apparatus 50. In the example of Fig. 21, a plurality of second processing apparatuses 50 are arranged in a line along the Y-axis direction on each side of the movement path of the transport robot 73.

[0222] The transport robot 73 sequentially takes out the dried substrates W from each second processing unit 50, and transports them sequentially to the relay unit 75. The transport robot 74 takes out the dried substrates W from the relay unit 75, and transports the substrates W to the relay unit 12. In the example of Fig. 21, the relay unit 12 is provided between the -Y side end of the movement path of the transport robot 74 and midway along the movement path of the transport robot 21. The transport robot 21 takes out a plurality of substrates W from the relay unit 12, and transports them to the carrier C1.

[0223] As described above, in the fifth embodiment, a plurality of first processing units 30 and a plurality of buffer units 40 are arranged in a row. Therefore, the transfer robot 65 and the transfer robot 66 do not need to be provided with the turning mechanism 616 in the first embodiment. In addition, since the transfer robot 66 has a posture changing function, the batch inter-wafer transfer unit 70 does not need to be provided with the posture changing unit 71. Therefore, the space occupied by the inter-batch transfer unit 60 and the batch inter-wafer transfer unit 70 can be reduced, and the footprint of the substrate processing apparatus 10B can be reduced.

[0224] Sixth embodiment 23 is a plan view illustrating an example of the configuration of a substrate processing apparatus 10C. In the substrate processing apparatus 10C, similarly to the substrate processing apparatus 10, a plurality of first processing units 30 are arranged in a line along the X-axis direction, and a plurality of buffer units 40 are arranged in a line along the X-axis direction in a different row from the first processing units 30.

[0225] The inter-batch transport section 60 includes a transport robot 66 and a transport robot 67. The transport robot 66 is provided so as to be movable along the X-axis direction directly above the first processing section 30 by a moving mechanism 665. In the example of FIG. 23, the moving mechanism 665 of the transport robot 66 is provided on the +Y side of the first processing section 30. The transport robot 66 receives a plurality of substrates W in an upright position from the indexer transport section 20 at the end on the -Y side of its movement path. Here, the transport robot 66 receives a plurality of substrates W in an upright position with the surfaces of the substrates W facing the +Y side. Then, the transport robot 66 transports the plurality of substrates W to the first processing section 30a and the first processing section 30b in this order.

[0226] The transfer robot 66 takes out the multiple substrates W in an upright position from the first processing section 30b, and converts the position of the substrates W from the upright position to a horizontal position. Specifically, the transfer robot 66 rotates the rotating member 6613 so that the access side end of the abutting member 6611 faces the -Y side. This converts the position of the substrates W to a horizontal position in which the surface of the substrate W faces the +Z side.

[0227] The transport robot 67 is provided between the first processing unit 30 and the buffer unit 40, and is movable along the X-axis direction by a moving mechanism 672. The transport robot 67 can be stopped at a position facing the first processing unit 30b in the Y-axis direction. The transport robot 67 collectively removes multiple substrates W in a horizontal position from the transport robot 66. In the example of FIG. 23, the transport robot 67 includes multiple (e.g., 25) hands 671 and a hand moving mechanism (not shown). The multiple hands 671 are arranged side by side along the Z-axis direction. The transport robot 67 moves the multiple hands 671 to remove multiple substrates W in a horizontal position from the transport robot 66, and transport the multiple substrates W to the buffer unit 40.

[0228] The buffer section 40 keeps a plurality of horizontally oriented substrates W waiting in a wet state. FIG. 24 is a diagram showing an example of the configuration of the buffer section 40. The buffer section 40 includes a standby tank 41 and a substrate holding section 49. A liquid is stored in the standby tank 41. The buffer section 40 is provided with the supply section 44 and the discharge section 46 described in the first embodiment, and is also provided with a circulation section 45 as necessary. Although the opening / closing member 43 is not shown in the example of FIG. 24, it is preferable that an opening / closing member 43 be provided.

[0229] The substrate holding unit 49 holds a plurality of substrates W in a horizontal position aligned in the Z-axis direction. In the example of Fig. 24, the substrate holding unit 49 includes a pair of first support members 491, a pair of open / close second support members 492, an open / close mechanism 493, and a lifting mechanism 494. The two first support members 491 are arranged side by side in the X-axis direction, and the two second support members 492 are also arranged side by side in the X-axis direction. The second support members 492 are arranged on the +Y side of the first support members 491 (i.e., on the inter-batch transport unit 60 side).

[0230] The first support member 491 and the second support member 492 have an elongated shape extending in the Z-axis direction. Furthermore, a plurality of grooves 491a are formed in each of the first support members 491 in a line in the Z-axis direction, and a plurality of grooves 492a are formed in each of the second support members 492 in a line in the Z-axis direction. The pitch of the grooves 491a and the pitch of the grooves 492a are equal to the pitch of the plurality of substrates W. By inserting the end of the substrate W into each groove 491a of the first support member 491 and the groove 492a of the second support member 492, each substrate W is supported at four points by the first support member 491 and the second support member 492.

[0231] The first support member 491 supports both ends of each of the multiple substrates W while the multiple substrates W are lined up in the Z-axis direction. Furthermore, each groove 491a of the first support member 491 has a shape that allows the substrate W to pass along the Y-axis direction. In other words, the distance between the bottom surface of the groove 491a of the first support member 491 on the -X side and the bottom surface of the groove 491a of the first support member 491 on the +X side is equal to or greater than the diameter of the substrate W.

[0232] The second support members 492 are provided so as to be displaceable between an open position and a closed position. The open position is a position where the distance between the two second support members 492 is wider than the diameter of the substrate W. In the example of FIG. 24, the second support members 492 located in the open position are indicated by two-dot chain lines. When the second support members 492 are located in the open position, multiple substrates W in a horizontal position can pass between the two second support members 492 along the Y-axis direction. The closed position is a position where the distance between the two second support members 492 is narrow and an end of the substrate W is inserted into each groove 492a of each second support member 492.

[0233] The opening / closing mechanism 493 moves the second support member 492 between an open position and a closed position. The opening / closing mechanism 493 includes, for example, a motor or an air cylinder.

[0234] The substrate holding part 49 is provided so as to be able to be raised and lowered by a lifting mechanism 494. The lifting mechanism 494 raises and lowers the substrate holding part 49 as a unit between a transfer position and a standby position. The transfer position is a position on the +Z side of the standby tank 41, and is a position where multiple substrates W are received from the transport robot 67. The standby position is a position where the multiple substrates W are immersed in the liquid in the standby tank 41.

[0235] Next, an example of a procedure in which the transport robot 67 transports a plurality of substrates W to the buffer unit 40 will be described. First, the transport robot 67 moves to a position facing the buffer unit 40 in the Y-axis direction with the hand 671 holding the substrate W in a horizontal position. The lifting mechanism 494 raises the substrate holder 49 to the delivery position, and the opening / closing mechanism 493 moves the second support member 492 to the open position. In this state, the hand 671 of the transport robot 67 is located on the +Y side of the pair of support members 492, and each substrate W is located at the same height as each groove 492a of the second support member 492. Next, the transport robot 67 moves the hand 671 to the -Y side to insert the end of each substrate W into the groove 491a of the first support member 491.

[0236] Next, the opening / closing mechanism 493 moves the second support member 492 to the closed position, and inserts the end of the substrate W into each groove 492a of the second support member 492. Next, the transport robot 67 moves the hand 671 to the -Z side, and supports the multiple substrates W by the first support member 491 and the second support member 492, and retracts the hand 671 to the +Y side. In this manner, the first support member 491 and the second support member 492 can support each substrate W at four points, and therefore the substrates W can be stably supported. When the second support member 492 is in the closed position, it may abut against the side surface of the substrate W in the horizontal direction. This allows the position of the substrate W in the Y-axis direction to be determined, and the substrates W can be aligned.

[0237] Next, the lifting mechanism 494 lowers the substrate holder 49 to the standby position, so as to immerse the plurality of substrates W in the liquid in the standby tank 41. In this way, the buffer unit 40 holds the plurality of substrates W in a horizontal position in a wet state.

[0238] The substrate holding unit 49 may support the multiple substrates W in an inclined position. Specifically, the substrate holding unit 49 may support the multiple substrates W in an inclined position in which a first end on the -Y side of the substrate W is located on the +Z side relative to a second end on the +Y side. In this manner, gravity causes each substrate W to easily move toward the second support member 492, and each substrate W abuts against the second support member 492 in the horizontal direction. This makes it easier to align the substrates W.

[0239] The substrates W in the buffer unit 40 are removed by a batch inter-substrate transport unit 70. In the example of Fig. 23, the batch inter-substrate transport unit 70 includes a transport robot 72. The transport robot 72 is provided on the -Y side of the multiple buffer units 40, and is movable along the X-axis direction by a movement mechanism 722. The transport robot 72 can be stopped at a position facing each buffer unit 40.

[0240] 23, a plurality of second processing units 50 are provided on each of the +Y side and the -Y side of the movement path of the transport robot 72. Specifically, two second processing units 50 are arranged in a row along the X-axis direction on the +Y side of the movement path of the transport robot 72 and on the +X side of the buffer unit 40, and four second processing units 50, which is more than the number on the +Y side, are arranged in a row along the X-axis direction on the -Y side of the movement path of the transport robot 72.

[0241] The transfer robot 72 includes a hand 721 and a hand moving mechanism (not shown), and takes out the horizontally oriented substrates W from the buffer unit 40, and transfers the substrates W to each of the second processing units 50 one by one.

[0242] When removing the substrates W from the buffer unit 40, the lifting mechanism 494 may adjust the position of the substrate holder 49 so that the substrate W to be removed is located on the +Z side of the waiting space H1 and at least one of the substrates W not to be removed is located within the waiting space H1, as in the fourth embodiment. This makes it possible to suppress or avoid drying of at least one of the substrates W not to be removed, even when the transfer robot 72 removes the substrates W.

[0243] The transport robot 72 takes out the dried substrates W from the second processing section 50, and transports them to the relay unit 12. In the example of Fig. 23, the relay unit 12 is provided between the middle of the movement path of the transport robot 21 and the -Y side end of the movement path of the transport robot 72. When a plurality of substrates W are stored in the relay unit 12, the transport robot 21 takes out the plurality of substrates W collectively from the relay unit 12, and transports the plurality of substrates W to the carrier C1.

[0244] In the sixth embodiment, the transport robot 72 is movable along the Y-axis direction, and a plurality of second processing units 50 are arranged along the X-axis direction on both sides of the movement path of the transport robot 72. This makes it possible to reduce the size of the substrate processing apparatus 10C in the Y-axis direction.

[0245] Furthermore, in the sixth embodiment, the carrier C2 is not used, so there is no need to provide a carrier storage section 62 for storing a plurality of substrates W in the carrier C2.

[0246] <Seventh embodiment> In the substrate processing apparatus 10 according to the seventh embodiment, a fan filter unit 80 (see also FIG. 25) is provided. The fan filter unit 80 is provided, for example, in the ceiling of the housing 100. The fan filter unit 80 includes a fan and a filter (not shown). The fan supplies gas into the substrate processing apparatus 10 through the filter to form a downflow. The filter captures impurities contained in the gas. This allows clean gas to be supplied into the apparatus. This downflow allows floating matter such as mist and particles of the processing liquid to move to the bottom of the apparatus and can be discharged to the outside from an exhaust section (not shown) provided at the bottom of the apparatus.

[0247] On the other hand, if this air current acts on the substrate W, it promotes drying of the substrate W. Therefore, the seventh embodiment aims to suppress drying of the substrate W caused by the air current.

[0248] 25 is a diagram illustrating an example of a schematic configuration of a portion of the substrate processing apparatus 10. As illustrated in FIG. 25, a shielding plate 81 is provided on the +Z side of the attitude changing unit 71 and on the -Z side of the fan filter unit 80. The shielding plate 81 is provided at a position facing the substrates W held by the attitude changing unit 71 in the Z axis direction, and covers the substrates W held by the attitude changing unit 71 in a plan view. That is, the outline of the shielding plate 81 in a plan view surrounds both the substrates W immediately before and after the attitude change. The distance between the substrates W held by the attitude changing unit 71 and the shielding plate 81 is, for example, about several hundred mm or less.

[0249] According to this, the airflow from the fan filter unit 80 is blocked by the shielding plate 81, so that it is possible to prevent the airflow from acting on the plurality of substrates W held by the attitude changing section 71. Therefore, it is possible to prevent the substrates W from drying due to the airflow, and to prevent the collapse of the three-dimensional structure of the substrates W due to drying.

[0250] The shielding plate 81 may be movable integrally with the attitude changing unit 71. For example, the shielding plate 81 may be attached to the base 714 of the attitude changing unit 71 via a fixing member (not shown). In this way, regardless of the position of the attitude changing unit 71, the shielding plate 81 is located directly above the multiple substrates W held by the attitude changing unit 71, so that it is possible to more reliably prevent the airflow from acting on the multiple substrates W.

[0251] Alternatively, the shielding plate 81 may be fixed so as to be immovable relative to the housing 100 of the substrate processing apparatus 10. In this case, the shielding plate 81 may be provided over the entire movement area of ​​the attitude changing unit 71.

[0252] In the fourth embodiment, the function of the attitude changing section is provided in the carrier transport section 63 (see Figs. 12 and 14). Specifically, the carrier transport section 63 receives the carrier C2 from the carrier storage section 62, and rotates the carrier C2 by 90 degrees to change the attitude of the substrate W. Therefore, in this case, the shielding plate 81 is provided on the +Z side of the carrier C2 held by the carrier transport section 63 and on the -Z side of the fan filter unit 80. More specifically, the shielding plate 81 is provided at a position facing the carrier C2 held by the carrier transport section 63 in the Z axis direction, and covers the multiple substrates W held by the carrier transport section 63 in a plan view. That is, the outline of the shielding plate 81 in a plan view surrounds both the multiple substrates W immediately before and immediately after the attitude change. This makes it possible to suppress the airflow from the fan filter unit 80 from acting on the multiple substrates W.

[0253] The shielding plate 81 may be attached to the base 632 of the carrier transport part 63 via, for example, a fixing member (not shown). In this case, the shielding plate 81 can move integrally with the carrier transport part 63, so that it is possible to prevent the airflow from acting on the multiple substrates W held by the carrier transport part 63, regardless of the position of the carrier transport part 63.

[0254] Alternatively, the shielding plate 81 may be fixed so as to be immovable relative to the housing 100 of the substrate processing apparatus 10A. In this case, the shielding plate 81 may be provided over the entire movement area of ​​the carrier transport part 63.

[0255] In the fifth and sixth embodiments, the function of the posture change unit is provided in the transport robot 66 (see FIGS. 21 to 23). In this case, the shielding plate 81 is provided on the +Z side of the multiple substrates W held by the pair of holding members 661 of the transport robot 66 and on the -Z side of the fan filter unit 80. In plan view, the shielding plate 81 covers the multiple substrates W held by the pair of holding members 661. That is, in plan view, the outline of the shielding plate 81 surrounds both the multiple substrates W immediately before and after posture change. This makes it possible to suppress the airflow from the fan filter unit 80 from acting on the multiple substrates W.

[0256] The shielding plate 81 may be attached to the base 662 of the transport robot 66 via, for example, a fixing member (not shown). In this case, the shielding plate 81 moves integrally with the transport robot 66, and therefore, regardless of the position of the transport robot 66, it is possible to prevent the airflow from acting on the multiple substrates W held by the transport robot 66.

[0257] Alternatively, the shielding plate 81 may be fixed immovably to the housing 100 of the substrate processing apparatus 10B or 10C. In this case, the shielding plate 81 may be provided over the entire movement area of ​​the transfer robot 66.

[0258] As described above, the substrate processing apparatus 10, 10A to 10C has been described in detail, but the above description is merely an example in all respects, and the substrate processing apparatus 10, 10A to 10C is not limited thereto. It is understood that countless modified examples not illustrated can be imagined without departing from the scope of this disclosure. The configurations described in the above embodiments and modified examples can be appropriately combined or omitted as long as they are not mutually contradictory.

[0259] For example, in the above example, the batch-type first processing section 30, the buffer section 40, the single-wafer-type second processing section 50, the inter-batch transport section 60 and the inter-batch transport section 70 are provided in the same housing 100. However, at least one of the components in the substrate processing apparatus 10 may be provided in another housing. In short, the components in the substrate processing apparatus 10 may be provided in a plurality of different housings in a dispersed manner, and a transport section for transporting a plurality of substrates W between the housings may be provided.

[0260] In the above example, the substrate W is provided with the laminated structure 90 as a three-dimensional structure, but this is not necessarily limited to this. The three-dimensional structure includes at least one of a wiring pattern, an insulating film pattern, and a semiconductor pattern. For example, when the aspect ratio of the pattern is 10 or more and the pattern width is 50 nm or less, the pattern is likely to collapse. Therefore, in this case, the substrate processing apparatus 10 is particularly effective. [Explanation of symbols]

[0261] 10 Substrate processing equipment 11 Loading Port 12 Relay unit 20 Indexer transport section 30 First Processing Section 40 Buffer section 41 Waiting tank 42 Lifter (relative displacement mechanism) 43, 43A, 43B Opening and closing members 44A Nozzle 44B Cooling section 45 Circulation section 46A Relative Displacement Mechanism 48 Lifting mechanism 491 First support member 492 Second Support Member 494 Lifting Mechanism 50 Second Processing Section 60 Batch transfer section 63 Carrier transport unit (posture conversion unit) 615 Linear motion mechanism 616 Swivel Mechanism 66 Transport robot (posture conversion unit) 70 batch inter-sheet transfer section 71 Posture conversion unit 81 Shielding plate

Claims

1. a batch-type first processing section for processing a plurality of substrates by immersing the substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: a nozzle provided in the waiting space and configured to eject a fluid, the fluid being at least one of the liquid and vapor of the liquid, toward the plurality of substrates; The nozzle is provided in a position to the side of the plurality of substrates in the waiting space in a plan view.

2. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: a nozzle provided in the waiting space and configured to eject a fluid, the fluid being at least one of the liquid and vapor of the liquid, toward the plurality of substrates; The nozzle intermittently ejects the fluid.

3. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: a nozzle provided in the waiting space and configured to eject a fluid, the fluid being at least one of the liquid and vapor of the liquid, toward the plurality of substrates; The buffer unit includes: The substrate processing apparatus further includes a relative displacement mechanism that changes a relative positional relationship between the discharge port of the nozzle and the plurality of substrates to change positions at which the fluid hits the plurality of substrates.

4. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: a nozzle provided in the waiting space and configured to eject a fluid, the fluid being at least one of the liquid and vapor of the liquid, toward the plurality of substrates; The buffer unit includes: a substrate processing apparatus that causes the plurality of substrates to wait in an inclined position inclined from a horizontal position so that a first end of each of the plurality of substrates on the nozzle side is positioned vertically above a second end opposite the first end.

5. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: The substrate processing apparatus further includes a cooling unit that cools the plurality of substrates waiting in the waiting space.

6. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer section includes an opening / closing member that opens and closes an opening of the waiting space through which the plurality of substrates pass when being loaded or unloaded.

7. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The first processing units are arranged in a first row along a predetermined direction, The buffer units are arranged in a second row along the predetermined direction, The inter-batch conveying unit includes: A holding member for holding the plurality of substrates; a rotation mechanism that rotates the holding member between a position directly above the first row and a position directly above the second row; a linear motion mechanism that moves the holding member along the predetermined direction; A substrate processing apparatus comprising:

8. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with the inter-batch transfer unit receives the plurality of substrates in an upright position from the first processing unit, converts a position of the plurality of substrates from the upright position to a horizontal position, and transfers the plurality of substrates in the horizontal position to the buffer unit; The buffer unit includes: a pair of first support members that support both ends of each of the plurality of substrates in a state in which the plurality of substrates are aligned in a vertical direction; a pair of second support members provided on the inter-batch conveying section side of the pair of first support members so as to be displaceable between an open position and a closed position; Including, the open position is a position in which a distance between the second support members is greater than a diameter of the plurality of substrates; The closed position is a position where the second support member supports edges of each of the plurality of substrates.

9. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with the inter-batch transfer unit receives the plurality of substrates in an upright position from the first processing unit, converts a position of the plurality of substrates from the upright position to a horizontal position, and transfers the plurality of substrates in the horizontal position to the buffer unit; the buffer unit includes a lifting mechanism that lifts and lowers the plurality of substrates, The batch sheet-to-sheet transport section of the substrate processing apparatus removes the substrate to be removed while the lifting mechanism raises the substrates so that the substrate to be removed is located vertically above the waiting space and at least one substrate not to be removed is located within the waiting space.

10. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with The buffer unit includes: A substrate processing apparatus in which the plurality of substrates are kept waiting in a position inclined from a horizontal position so that a first end of each of the plurality of substrates on the side of the batch inter-substrate transport section is positioned vertically above a second end opposite the first end.

11. A substrate processing apparatus comprising: a batch-type first processing section for processing a plurality of substrates by immersing the substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with At least one of the inter-batch transport unit and the inter-batch wafer transport unit includes a posture changing unit that changes postures of the plurality of substrates between an upright posture and a horizontal posture, The substrate processing apparatus includes: The substrate processing apparatus further comprises a shielding plate provided directly above the plurality of substrates held by the position changing unit to block air currents from vertically above.

12. A batch-type first processing unit that processes a plurality of substrates by immersing the plurality of substrates in a processing solution; a buffer unit having a waiting space, in which the plurality of substrates are kept waiting while a wet state in which at least one of the liquid and a solidified form of the liquid is adhered to the plurality of substrates in the waiting space; an inter-batch transfer unit that transfers the plurality of substrates from the first processing unit to the buffer unit; a second processing section for drying the substrates one by one; a batch inter-substrate transfer unit that transfers the plurality of substrates one by one from the buffer unit to the second processing unit; Equipped with a load port into which the plurality of substrates are carried in from outside the substrate processing apparatus; an intermediate unit that vertically supports the substrates that are sequentially transferred one by one from the second processing unit by the batch inter-substrate transfer unit; an indexer transport section that transports the plurality of substrates collectively from the load port to the inter-batch transport section and transports the plurality of substrates collectively from the relay unit to the load port; The substrate processing apparatus further comprises:

13. A substrate processing apparatus according to any one of claims 3 to 12, comprising: The buffer unit includes: a standby tank provided in the standby space and configured to store the liquid; a circulation unit that returns the liquid overflowing from the standby tank to the standby tank; A substrate processing apparatus comprising:

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