Anisotropic conductive connector, framed anisotropic conductive connector and inspection device

Abstract

The objective of the present invention is to provide: an anisotropically conductive connector that is even capable of a narrow-pitch arrangement in which compact electric / electronic components are accommodated, has excellent connection stability to an electrode, hardly damages the electrode of an electric / electronic component to which to connect, is capable of reducing the deposition of oxidized foreign matter so as to suppress an increase in a resistance value, and is easy to replace even if a conduction failure occurs during use; an anisotropically conductive connector having a frame; and an inspection apparatus. This anisotropically conductive connector is provided with: a strip-shaped insulating part that comprises an elastic material having insulation properties; and a plurality of silver wires that penetrate from the first surface to the second surface of the insulating part by extending in the thickness direction thereof, and that are arranged at a constant pitch in the length direction of the insulating part. Each among the plurality of silver wires is provided so as to be inclined with respect to the thickness direction of the insulating part.

Description

[Technical field]

[0001] The present invention relates to an anisotropic conductive connector, a framed anisotropic conductive connector, and an inspection device. [Background technology]

[0002] Conventionally, a socket equipped with a probe pin (pogo pin) or the like has been used as an inspection device for electrical inspection of electronic device components and module components, including semiconductor devices such as BGA (Ball Grid Array), QFN (Quad Flat No Lead), SOP (Small Outline Package), QFP (Quad Flat Package), and CSP (Chip Size Package) (Patent Document 1). Furthermore, as a conductive connector for establishing electrical continuity between a liquid crystal panel and a circuit board, a conductive connector containing silver wire is known (Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-125421 A [Patent Document 2] Japanese Utility Model Application Publication No. 61-184283 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, in order to reduce the space required for electrical and electronic components, not only the external dimensions of electronic device components and module components but also the electrode size (width x length) and pitch have become smaller, making it difficult to arrange probe pins in inspection equipment accordingly.

[0005] In addition, the surfaces of the solder ball electrodes of BGA, CSP, etc., and the flat electrodes of QFN, etc., are tin-plated, and it is known that an oxide film forms on the surface of the electrodes over time, causing an increase in resistance. Therefore, in the inspection of such semiconductor devices, a probe pin with a crown-shaped tip is used, and the tip is pressed against the electrode to be inspected so as to pierce it, destroying the oxide film and ensuring continuity. However, with this inspection method, oxidized foreign matter such as solder chips and tin plating chips generated from the electrode may accumulate on the tip of the probe pin, causing an increase in resistance.

[0006] In addition, in an inspection device equipped with probe pins, multiple probe pins are generally held in a resin holder, and when a conduction failure occurs in only a specific probe pin, it is difficult to replace only the probe pin in which the conduction failure occurs. In addition, since probe pins are expensive, replacing all the probe pins in the holder is a major disadvantage in terms of cost.

[0007] The present invention aims to provide an anisotropic conductive connector, a framed anisotropic conductive connector, and an inspection device which are capable of being arranged at a narrow pitch to match compact electric and electronic components, have excellent connection stability to electrodes, are less likely to scratch the electrodes to be connected, can reduce the accumulation of oxidized foreign matter and suppress increases in resistance, and are easy to replace even if poor conductivity occurs during use. [Means for solving the problem]

[0008] The present invention includes the following configurations. [1] A belt-shaped insulating part made of an elastic material having insulating properties, and a plurality of silver wires penetrating the insulating part from a first surface to a second surface in a thickness direction and arranged at a constant pitch in the longitudinal direction of the insulating part, An anisotropic conductive connector, wherein the multiple silver wires are each arranged perpendicular or at an angle to the second surface of the insulating portion. [2] The tensile strength of the silver wire measured in accordance with JIS Z 2241 is 200 N / mm 2 More than 380N / mm2 The anisotropic conductive connector according to [1], [3] The anisotropic conductive connector according to [1] or [2], wherein a gold plating film is formed on the side of the silver wire. [4] The anisotropic conductive connector according to any one of [1] to [3], wherein the insulating part has a compression set of 20% or less. [5] An anisotropic conductive connector with a frame, comprising the anisotropic conductive connector according to any one of [1] to [4], and a positioning frame attached to at least a portion of the periphery of the anisotropic conductive connector. [6] An inspection device for electric and electronic components, comprising: a circuit board having electrode terminals; the anisotropic conductive connector according to any one of [1] to [4]; and a holder, At least a part of an outer periphery of the anisotropic conductive connector is fixed onto the circuit board by the holder; the electrode terminal is in contact with an end of the silver wire in the anisotropic conductive connector on the circuit board side, During inspection, the electrical / electronic component is pressed against an area of ​​the anisotropic conductive connector opposite the circuit board that is not in contact with the holder, and an electrode of the electrical / electronic component is brought into contact with an end of the silver wire in the anisotropic conductive connector opposite the circuit board. [7] An inspection device for electrical and electronic components, comprising: a circuit board having electrode terminals; the framed anisotropic conductive connector according to [5]; and a holder, At least a part of a frame portion of the framed anisotropic conductive connector is fixed onto the circuit board by the holder; the electrode terminal is in contact with an end of the silver wire in the frame-attached anisotropic conductive connector on the circuit board side, During inspection, the electrical / electronic component is pressed against an area of ​​the framed anisotropic conductive connector on the side opposite the circuit board that is not in contact with the holder, and an electrode of the electrical / electronic component is brought into contact with an end of the silver wire in the framed anisotropic conductive connector on the side opposite the circuit board. Effect of the Invention

[0009] According to the present invention, it is possible to provide an anisotropic conductive connector, a framed anisotropic conductive connector, and an inspection device which enable a narrow pitch arrangement to be matched with compact electrical and electronic components, have excellent connection stability to electrodes, are less likely to damage the electrodes to be connected, can reduce the accumulation of oxidized foreign matter and suppress increases in resistance values, and are easy to replace even if poor conductivity occurs during use. [Brief description of the drawings]

[0010] [Figure 1] 1 is a plan view showing a schematic configuration of an anisotropic conductive connector according to an embodiment; [Diagram 2] 2 is a cross-sectional view of the anisotropic conductive connector shown in FIG. 1 along the line AA. [Diagram 3] 4A to 4C are perspective views showing an example of a manufacturing process for an anisotropic conductive connector according to an embodiment. [Figure 4] 4A to 4C are perspective views showing an example of a manufacturing process for an anisotropic conductive connector according to an embodiment. [Diagram 5] 4A to 4C are perspective views showing an example of a manufacturing process for an anisotropic conductive connector according to an embodiment. [Figure 6] FIG. 11 is a plan view showing a schematic configuration of an anisotropic conductive connector according to another example of an embodiment. [Figure 7] FIG. 11 is a plan view showing a schematic configuration of an anisotropic conductive connector according to another example of an embodiment. [Figure 8] 1 is a plan view showing a schematic configuration of a framed anisotropic conductive connector according to an embodiment; [Figure 9] 1 is a perspective view showing a schematic configuration of an inspection device according to an embodiment; [Figure 10] FIG. 13 is a perspective view showing a schematic configuration of an inspection device according to another embodiment. [Figure 11] 1 is a graph showing the results of an evaluation test of the initial contact performance for the anisotropic conductive connector of Experimental Example 1. [Figure 12] 13 is a graph showing the results of an evaluation test of the initial contact property for the anisotropic conductive connector of Experimental Example 2. [Figure 13]13 is a graph showing the results of an evaluation test of the repeated compression characteristics (durability) of the anisotropic conductive connector of Experimental Example 3. [Figure 14] 13 is a graph showing the results of an evaluation test of the repeated compression characteristics (durability) of the anisotropic conductive connector of Experimental Example 4. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings. In addition, the dimensions of the figures illustrated in the following description are merely examples, and the present invention is not necessarily limited to them, and can be implemented with appropriate modifications within the scope that does not change the gist of the present invention. In addition, in this specification and claims, the lower limit and upper limit of a numerical range indicated with "to" are included in the numerical range.

[0012] [Anisotropic conductive connector] As shown in Figures 1 and 2, an anisotropic conductive connector 1 according to an example of the embodiment includes a sheet-like conductive section 10 including multiple rows of conductive strip sections 12. In the conductive section 10, multiple rows of conductive strip sections 12 are arranged in parallel, and adjacent conductive strip sections 12 are bonded to each other via adhesive sections 14. Here, the direction in which the multiple rows of conductive strip sections 12 extend in parallel is the length direction (X direction in Figures 1 and 2), the stacking direction of the multiple rows of conductive strip sections 12 via the adhesive sections 14 is the width direction (Y direction in Figures 1 and 2), and the direction perpendicular to both the length direction and the width direction is the thickness direction (Z direction in Figures 1 and 2).

[0013] The conductive band portion 12 includes a band-shaped insulating portion 16 made of an elastic material having insulating properties, and a plurality of silver wires 18 that penetrate the insulating portion 16 from a first surface 16a to a second surface 16b in the thickness direction (Z direction) of the insulating portion 16 and are arranged at a constant pitch in the length direction (X direction) of the insulating portion 16. The silver wires also include conductive wires made of a silver alloy.

[0014] The thickness of the insulating part 16 may be appropriately set depending on the application, and may be, for example, 0.07 mm or more and 2.0 mm or less. The thickness of the insulating part 16 is obtained as the average value of thickness measurements taken at 10 points arbitrarily selected from a cross section of the insulating part 16 in the thickness direction using a magnifying observation means such as a measuring microscope.

[0015] The length and width of the strip-shaped insulating portion 16 are not particularly limited and can be set appropriately. The length of the insulating portion 16 can be, for example, 2 mm or more and 50 mm or less. The width of the insulating portion 16 can be, for example, 0.03 mm or more and 0.25 mm or less. The length and width of the insulating portion 16 are both calculated as the average values ​​of values ​​measured at 10 arbitrarily selected points.

[0016] The material constituting the insulating portion 16 is an elastic material having insulating properties, and examples of such materials include elastomers such as urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, styrene butadiene rubber, and silicone rubber. Among these, silicone rubber is preferred because of its small compression set. The silicone rubber may be a condensation type silicone rubber or an addition type silicone rubber. The elastic material constituting the insulating portion 16 may contain additives such as a silane coupling agent, an adhesive aid, an antioxidant, a dye, a pigment, a filler, and a leveling agent.

[0017] The compression set of the insulating part 16 is preferably 20% or less, more preferably 18% or less. If the compression set of the insulating part 16 is equal to or less than the upper limit, it can easily follow the compression caused by pressure welding of electric and electronic components during inspection, and the expansion and contraction caused by changes in environmental conditions such as temperature and humidity, ensuring a more stable connection. In addition, the amount of compression in the thickness direction of the anisotropic conductive connector 1 during use can be set in a wide range. There is no particular lower limit for the compression set of the insulating part 16, and the smaller the better. The compression set of the insulating portion 16 is measured in accordance with JIS K 6262 (85° C.×24 hr, 25% compression).

[0018] In the conductive band portion 12, a plurality of silver wires 18 are arranged at a constant pitch in the length direction (X direction) of the band-shaped insulating portion 16. The pitch of the silver wires 18, i.e., the center-to-center distance of the silver wires 18 as viewed from the first surface 16a side of the insulating portion 16, is not particularly limited and can be set arbitrarily according to, for example, the results of impedance simulation. For example, the pitch of the silver wires 18 can be 5 μm or more and 100 μm or less. The pitch of the silver wires 18 is calculated as the average value of the measured center-to-center distances of 10 arbitrarily selected pairs of adjacent silver wires 18.

[0019] In the example shown in FIG. 2, the silver wire 18 is provided at an angle with respect to the second surface 16b of the insulating portion 16. The anisotropic conductive connector 1 in which the silver wire 18 is inclined relative to the second surface 16b of the insulating portion 16 has superior resistance to repeated compression in the thickness direction compared to a configuration in which the silver wire 18 is perpendicular to the second surface 16b of the insulating portion 16, and is therefore particularly useful for inspecting electrical and electronic components such as electronic device components and module components. The use of the anisotropic conductive connector 1 is not limited to the inspection of electrical and electronic components, but may also be used for mounting on so-called electrical and electronic components, such as electrically connecting electrodes between substrates of electronic device components, module components, etc.

[0020] The inclination angle θ of the silver wire 18 with respect to the second surface 16b of the insulating part 16 is preferably 50 degrees or more, more preferably 55 degrees or more, and even more preferably 60 degrees or more. If the inclination angle θ of the silver wire 18 is equal to or more than the lower limit, buckling (plastic deformation) of the silver wire during compression is easily suppressed. The inclination angle θ of the silver wire 18 is preferably 75 degrees or less, more preferably 70 degrees or less, and even more preferably 65 degrees or less. If the inclination angle θ of the silver wire 18 is equal to or less than the upper limit, the initial contact property during compression is improved. The preferable lower limit and upper limit of the inclination angle θ of the silver wire 18 can be arbitrarily combined, and for example, 50 to 75 degrees are preferable, 55 to 70 degrees are more preferable, and 60 to 65 degrees are more preferable. The inclination angle θ of the silver wire 18 is calculated as the average value of the inclination angles of 10 arbitrarily selected silver wires 18. The inclination angle θ of the silver wire 18 with respect to the second surface 16b of the insulating portion 16 means the minor angle (0<θ<90) between the second surface 16b of the insulating portion 16 and the central axis of the silver wire 18.

[0021] The silver wire 18 is more flexible than conventional conductive wires such as copper alloy wires and brass wires. By using the flexible silver wire 18 as a conductive wire, it is possible to connect the silver wire to the electrodes of the electrical and electronic components with low resistance and low load when inspecting the electrical and electronic components or when mounting the electrical and electronic components. This makes it difficult for the electrodes to be inspected to be scratched and minimizes the accumulation of oxidized foreign matter, so that it is possible to suppress the resistance value from increasing over time. In addition, when the anisotropic conductive connector 1 is compressed, the silver wire 18 is less likely to buckle and easily follows the deformation of the insulating part 16, so that the tip of the silver wire 18 in contact with the electrode is less likely to penetrate into the insulating part 16, and the electrical connection between the electrodes is stable. Furthermore, by using the silver wire 18, the silver wires 18 can be easily arranged at a narrow pitch according to the electrode shape and pitch even for compact electrical and electronic components, and multiple silver wires 18 can be contacted with one electrode, so that the connection stability is further improved.

[0022] The tensile strength of silver wire 18 is 200N / mm 2 More than 220N / mm is preferable. 2 If the tensile strength of the silver wire 18 is equal to or greater than the lower limit of the above range, the silver wire 18 can easily follow the deformation of the surrounding insulating portion 16. In addition, the tensile strength of the silver wire 18 is 380 N / mm 2 Less than 360N / mm is preferable. 2 If the tensile strength of the silver wire 18 is equal to or less than the upper limit of the above range, the silver wire 18 is less likely to buckle and penetrate into the insulating portion 16, and the connection is stable. The lower and upper limits of the tensile strength of the silver wire 18 can be arbitrarily combined, for example, 200 N / mm 2 More than 380N / mm 2 The following is preferred: The tensile strength of the silver wire 18 is determined by performing a tensile test using, for example, a tensile testing machine conforming to JIS Z 2241, specifically, a Tensilon universal material testing machine RTI-1225 (manufactured by A&D Co., Ltd.) using a UR-10N-D load cell, with a sample length (distance between the upper and lower chucks) of 100 mm and a tensile speed of 20 mm / min, and dividing the maximum test force applied to the sample by the cross section of the sample.

[0023] The breaking elongation of the silver wire 18 is preferably 0.90% or more, more preferably 1.00% or more, and even more preferably 1.10% or more. The breaking elongation of the silver wire 18 is preferably 1.30% or less, more preferably 1.25% or less, and even more preferably 1.20% or less. If the breaking elongation of the silver wire 18 is within the range indicated by the above lower and upper limits, deformation of the silver wire during the product cutting process described below is easily suppressed. The preferable lower and upper limits of the breaking elongation of the silver wire 18 can be arbitrarily combined, and for example, 0.90 to 1.30% is preferable, 1.00 to 1.25% is more preferable, and 1.10 to 1.20% is even more preferable. The elongation at break is a value measured in accordance with JIS Z 2241.

[0024] The maximum point load of the silver wire 18 is preferably 0.14 N or more, more preferably 0.15 N or more, and even more preferably 0.16 N or more. load is preferably 0.20 N or less, more preferably 0.18 N or less, and even more preferably 0.17 N or less. load Within the range of the above-mentioned lower and upper limits, damage to the electrodes of the electric / electronic components to be inspected is easily suppressed. The preferable lower and upper limits of the maximum point load of the silver wire 18 can be arbitrarily combined, and are, for example, preferably 0.14 to 0.20 N, more preferably 0.15 to 0.18 N, and further preferably 0.16 to 0.17 N. The maximum point load is a value measured in accordance with JIS Z 2241.

[0025] The 0.2% proof stress load of the silver wire 18 is preferably 0.12 N or more, more preferably 0.13 N or more, and even more preferably 0.14 N or more. The 0.2% proof stress load of the silver wire 18 is preferably 0.18 N or less, more preferably 0.17 N or less, and even more preferably 0.16 N or less. The preferred lower and upper limits of the 0.2% proof stress load of the silver wire 18 can be arbitrarily combined, and for example, is preferably 0.12 to 0.18 N, more preferably 0.13 to 0.17 N, and even more preferably 0.14 to 0.16 N. The 0.2% proof load is a value measured in accordance with JIS Z 2241.

[0026] The maximum point load and 0.2% proof load of the silver wire depend on the wire diameter. Therefore, the maximum point load and 0.2% proof load of the silver wire can be adjusted by adjusting the wire diameter of the silver wire.

[0027] A coating layer may be formed on the side surface of the silver wire 18. Examples of the material for the coating layer include gold, nickel, copper, etc. The coating layer may be one layer or two or more layers. Unlike copper alloy wires such as brass wire and beryllium copper wire, silver wire does not form an oxide film on its own, is a stable material, and has excellent adhesion to the insulating portion 16 surrounding the silver wire 18. For these reasons, a single layer of gold-plated silver wire is used in the experimental example described below.

[0028] The shape of the cross section of the silver wire 18 in a direction perpendicular to the longitudinal direction is not particularly limited, and may be, for example, substantially circular, substantially elliptical, or substantially rectangular. The wire diameter of the silver wire 18 can be, for example, 5 μm or more and 50 μm or less. The wire diameter of the silver wire 18 is the diameter of the smallest circle including a cross section perpendicular to the longitudinal direction of the silver wire 18. When the silver wire 18 has a coating layer on the side surface, the wire diameter of the silver wire 18 also includes the coating layer. The cross-sectional shapes and wire diameters of the multiple silver wires 18 included in the anisotropic conductive connector 1 may be the same as or different from each other.

[0029] An end of the silver wire 18 on the first surface 16a side of the insulating portion 16 may protrude from the first surface 16a of the insulating portion 16. Similarly, an end of the silver wire 18 on the second surface 16b side of the insulating portion 16 may protrude from the second surface 16b of the insulating portion 16. The length of the portion of the silver wire 18 protruding from the first surface 16a or the second surface 16b of the insulating portion 16 can be, for example, 1 μm or more and 60 μm or less.

[0030] There are no particular limitations on the adhesive that forms the adhesive portion 14, and examples of the adhesive that can be used include known curing adhesives. The adhesive that forms the adhesive portion 14 may be of one type or two or more types. The length and thickness of the adhesive portion 14 may be set within a range that allows the adjacent conductive band portions 12 to be sufficiently bonded to each other, and may be, for example, the same as the length and thickness of the insulating portion. The width of the adhesive portion 14 is not particularly limited, and may be, for example, 0.01 mm or more and 0.05 mm or less. The thickness, length, and width of the adhesive portion 14 are each calculated as the average value of values ​​measured at 10 arbitrarily selected points.

[0031] The shape of the anisotropic conductive connector 1 in a plan view is rectangular in this example, but is not limited to rectangular and may be circular, elliptical, rectangular, polygonal, etc. The dimensions of the anisotropic conductive connector 1 may be appropriately set depending on the application, and may be, for example, a rectangle with a length of 5 mm to 50 mm and a width of 5 mm to 100 mm.

[0032] The arrangement pattern of the silver wires 18 when the anisotropic conductive connector 1 is viewed from the thickness direction (Z direction) is not particularly limited, and can be, for example, a two-dimensional array arrangement in which the multiple silver wires 18 arranged in the length direction (X direction) of each strip-shaped insulating part 16 are also linearly arranged in the width direction (Y direction) of each insulating part 16. In this case, the pitch of the silver wires 18 arranged in the width direction (Y direction) of the insulating part 16 can be the same as the pitch of the silver wires 18 arranged in the length direction (X direction) of the strip-shaped insulating part 16. The arrangement pattern of the silver wires 18 may also be a staggered pattern, etc.

[0033] The wiring density of the silver wires 18 in the conductive portion 10 when the anisotropic conductive connector 1 is viewed in the thickness direction can be appropriately set according to the application. For example, 2 More than 1,100 pieces / mm 2 The wiring density of the silver wires 18 can be adjusted by adjusting the pitch of the silver wires 18 in the length direction of the insulating portion 16, the width of the insulating portion 16, the width of the adhesive portion 14, and the like.

[0034] [Manufacturing method of anisotropic conductive connectors] A method for manufacturing the anisotropic conductive connector 1 will now be described. The manufacturing method of the anisotropic conductive connector 1 is not particularly limited, and any known method can be adopted except for using silver wire as the conductive wire. The manufacturing method of the anisotropic conductive connector 1 of this embodiment includes, for example, a core sheet forming step, a lamination step, and a cutting step, which will be described later.

[0035] (Core sheet forming process) 3, a first insulating layer 110 is formed on the surface of a base material 100 using an elastic material having insulating properties for forming an insulating portion 16, and a plurality of silver wires 18 are arranged in parallel at regular intervals on an upper surface 110a of the first insulating layer 110. The base material 100 is not particularly limited as long as it is capable of forming the first insulating layer 110 on its surface, and examples of the base material 100 include members having a flat surface such as a resin sheet, a metal plate, and a glass plate.

[0036] As shown in FIG. 4, a second insulating layer 112 is formed on the surface of the first insulating layer 110 using an insulating elastic material for forming the insulating portion 16 so as to cover the silver wires 18, thereby obtaining a core sheet 114.

[0037] (Lamination process) A plurality of core sheets 114 are prepared in the same manner, and unnecessary base material 100 is removed to obtain a sheet laminate 118 in which the plurality of core sheets 114 are laminated via adhesive layers 116, as shown in Fig. 5. The adhesive used in the adhesive layers 116 is the adhesive that forms the adhesive parts 14. In the sheet laminate 118, the length directions of the silver wires 18 of the respective core sheets 114 are aligned.

[0038] (cutting process) The sheet laminate 118 is cut with a blade from the upper surface 118a side of the sheet laminate 118 in a direction inclined with respect to the longitudinal direction of each silver wire 18, to obtain a sheet-like anisotropic conductive connector 1 of a desired thickness.

[0039] As described above, in the anisotropic conductive connector of the present invention, the flexible silver wire is provided at an angle to the thickness direction of the insulating part, so that even when the electrical and electronic components are repeatedly compressed during inspection, or when the mounted electrical and electronic components repeatedly expand and contract due to changes in environmental conditions such as temperature and humidity, the electrodes in contact with the silver wire are unlikely to suffer from wear marks, and the accumulation of oxidized foreign matter is reduced, so that the increase in resistance over time can be suppressed.

[0040] Furthermore, the anisotropic conductive connector of the present invention using silver wires can easily have its thickness changed in accordance with the coplanarity of the electrodes to be connected. In addition, if silver wires are used, they can be arranged at a narrow pitch according to the results of impedance simulations for high frequency applications, etc. Furthermore, in the case of electronic devices and module components for high frequency applications, the thickness of the anisotropic conductive connector can be reduced to make the conductive path as thin as that of solder mounting, so that inspection can be performed with the same characteristics as when mounted.

[0041] The anisotropic conductive connector of the present invention is not limited to the anisotropic conductive connector 1 described above. For example, the present invention is not limited to a configuration in which the multiple silver wires are each provided at an angle to the second surface of the insulating portion, and the multiple silver wires may each be provided perpendicular to the second surface of the insulating portion. When the silver wire is perpendicular to the second surface of the insulating part, the repeated compression characteristics (durability) are inferior to when it is inclined, but since the conductive path can be formed in the shortest possible time by the thin film, there is a tendency for the attenuation of high frequency characteristics to be significantly suppressed compared to probe pins with long conductive paths. Also, in applications such as LGA (Land Grid Array) and other high frequency devices and module components, replacement in the event of a device malfunction is easier compared to ACF (Anisotropic Conductive Film) and solder mounting.

[0042] The anisotropic conductive connector of the present invention may further include a conductive part including an insulating part not provided with a silver wire. Specifically, it may be, for example, the anisotropic conductive connector 2 illustrated in Fig. 6. The same parts in Fig. 6 as those in Fig. 1 are denoted by the same reference numerals and the description thereof will be omitted.

[0043] The anisotropic conductive connector 2 includes a conductive portion 10A in which conductive band portions 12 having a plurality of silver wires 18 provided on a band-shaped insulating portion 16 and band-shaped insulating portions 20 having no silver wires 18 are arranged alternately in parallel in the width direction (Y direction) and are bonded via adhesive portions 14. In this manner, the conductive portion may include a conductive band portion having a plurality of silver wires provided on an insulating portion, and an insulating portion having no silver wires provided.

[0044] The thickness and length of the insulating part 20 may be set appropriately depending on the application, and may be, for example, the same as the thickness and length of the insulating part 16. The width of the insulating part 20 may be set appropriately depending on the wiring density of the silver wires 18, and may be, for example, 0.1 mm or more and 0.5 mm or less. The material constituting the insulating part 20 may be, for example, an elastic material having the same insulating properties as the material constituting the insulating part 16, and the preferred aspects are also the same. For the same reasons as those for the compression set of the insulating part 16, the compression set of the insulating part 20 is preferably 20% or less, and more preferably 18% or less.

[0045] The anisotropic conductive connector of the present invention may be, for example, the anisotropic conductive connector 3 illustrated in Fig. 7. In Fig. 7, the same parts as those in Figs. 1 and 6 are given the same reference numerals and their explanation will be omitted. The anisotropic conductive connector 3 has the same configuration as the anisotropic conductive connector 2, except that in addition to the conductive portion 10A, the anisotropic conductive connector 3 further includes an attachment portion 22 that is adhered via an adhesive portion 14 to the conductive portion 10A adjacent to the insulating portion 16 in the width direction (Y direction).

[0046] The attachment portion 22 includes an insulating portion 24 having a rectangular shape in a plan view, and an adhesive layer 26 provided on a first surface 24a side of the insulating portion 24 in the thickness direction. The anisotropic conductive connector 3 includes the attachment portion 22, and thus can be directly attached via the adhesive layer 26 to the side of a circuit board in an inspection device where electrode terminals are provided, or to the side of a circuit board in an electric and electronic component such as an electronic device component or a module component where electrodes are provided. In addition, since the anisotropic conductive connector 3 can be attached to the circuit board and handled as a single unit, electric and electronic components and inspection devices can be easily applied to automated manufacturing using machines.

[0047] In recent years, electronic device components and module components have become more compact in line with the need to save space in electronic devices. In addition, dummy electrodes (hold downs) are used to increase mounting strength, resulting in a large number of electrodes, making it difficult to position the electrodes relative to one another. Furthermore, in electrical and electronic components and inspection devices that require multiple electrodes, repair work is extremely difficult if there is a defect. However, with the anisotropic conductive connector 3 that is attached via the adhesive layer 26, positioning is easier than with solder mounting, and replacement during repair work is also easier.

[0048] The shape and dimensions of the insulating portion 24 may be set appropriately, and may be, for example, a rectangle with a length of 2 mm to 50 mm and a width of 5 mm to 100 mm. The material constituting the insulating portion 24 can be, for example, an elastic material having the same insulating properties as the material constituting the insulating portion 16, and the preferred embodiments are also the same.

[0049] There are no particular limitations on the adhesive that forms the adhesive layer 26, and examples of the adhesive that can be used include known curing adhesives. The adhesive that forms the adhesive layer 26 may be of one type or two or more types. The thickness of the adhesive layer 26 may be set within a range that allows the anisotropic conductive connector 3 to be stably attached to the substrate, and may be, for example, 0.01 mm to 0.04 mm. The thickness of the adhesive layer 26 is calculated as the average value of values ​​measured at 10 arbitrarily selected points.

[0050] [Framed anisotropic conductive connector] The anisotropic conductive connector of the present invention may have a frame bonded to its periphery for positioning. FIG. 8 shows a schematic configuration of one example of a framed anisotropic conductive connector. The framed anisotropically conductive connector 4 has an annular frame 30 joined to the entire periphery of the anisotropically conductive connector 1.

[0051] The central area of ​​the frame 30 is punched out into a rectangle, and the anisotropic conductive connector 1 is bonded to this area via an adhesive 32. The top surface of the anisotropic conductive connector 1 and the top surface of the frame 30 are substantially parallel to each other. The frame 30 is provided with a plurality of through holes 34. When mounting the framed anisotropic conductive connector 4 on a substrate or the like, for example, by passing a positioning pin through the through holes 34 of the frame 30 and fixing it, mounting on the substrate or the like can be easily performed.

[0052] 8, the shape of the frame 30 in plan view is rectangular, but is not limited to this. The frame 30 is not limited to an annular shape surrounding the entire periphery of the anisotropic conductive connector 1, and may be partially joined to one or more points on the periphery of the anisotropic conductive connector 1. The size of the frame 30 may be appropriately designed depending on the object on which the anisotropic conductive connector 1 is to be mounted. The material of the frame 30 is not particularly limited, and may be, for example, a resin frame, a metal frame, or the like.

[0053] The adhesive 32 is a cured product of an adhesive, and is selected from those having heat resistance and cold resistance that allow the cured state to be kept stable in the operating temperature range of the anisotropic conductive connector 1. Specific examples include acrylic resin, silicone, acrylic-modified silicone, and cyanoacrylate resin. The adhesive surface of the frame 30 to which the adhesive 32 is to be applied may be preliminarily treated with a primer to enhance adhesive strength.

[0054] The method for producing the framed anisotropically conductive connector is not particularly limited, and any known method can be used as long as the anisotropically conductive connector of the present invention is used. In addition, the frame-equipped anisotropic conductive connector of the present invention is not limited to the frame-equipped anisotropic conductive connector 4 described above, as long as it is equipped with the anisotropic conductive connector of the present invention, and the design can be appropriately changed depending on the inspection device, electrical and electronic components, etc. to be applied.

[0055] [Inspection equipment] The anisotropic conductive connector of the present invention can be used in an inspection apparatus for inspecting electric and electronic components such as electronic device components and module components. FIG. 9 is a perspective view showing an example of an inspection device equipped with the anisotropic conductive connector of the present invention.

[0056] The inspection device 5 of the example shown in FIG. 9 includes a circuit board 50 having electrode terminals, an anisotropic conductive connector 1, a holder 52, and a plate .

[0057] The circuit board 50 may be any circuit board equipped with electrode terminals, such as a printed wiring board. In this example, the circuit board 50 is disposed on a plate 54, but is not limited to this embodiment. The material of the plate 54 is not particularly limited, and may be made of resin or metal.

[0058] The holder 52 is a member for fixing the outer peripheral portion of the anisotropic conductive connector 1 onto the circuit board 50. The holder 52 in this example is C-shaped with a missing portion 52a on one side of a rectangular frame. The shape of the holder 52 is not limited to the shape in this example, and may be, for example, a frame shape without the missing portion. The material of the holder 52 is not particularly limited, and may be made of resin or metal.

[0059] In the inspection device 5, the anisotropic conductive connector 1 is placed on the circuit board 50, and with a holder 52 further placed on top of that, a bolt 53 is screwed into a bolt hole of the holder 52. As a result, the outer periphery of the anisotropic conductive connector 1 is sandwiched between the circuit board 50 and the holder 52, and the anisotropic conductive connector 1 is fixed onto the circuit board 50. In this state, the electrode terminal provided on the circuit board 50 contacts the end of the silver wire 18 in the anisotropic conductive connector 1 on the circuit board 50 side.

[0060] For example, when inspecting an electric / electronic component 200 including a flexible printed wiring board 210 as a circuit board to be inspected, the flexible printed wiring board 210 is fitted and pressed into a T-shaped region on the opposite side of the anisotropic conductive connector 1 from the circuit board 50 side, where the holder 52 is not in contact. Then, an electrode provided on the flexible printed wiring board 210 of the electric / electronic component 200 is brought into contact with an end of the silver wire 18 in the anisotropic conductive connector 1 of the inspection device 5 on the opposite side from the circuit board 50 side. As a result, the electrode terminals of the circuit board 50 in the inspection device 5 and the electrodes of the flexible printed wiring board 210 to be inspected are electrically connected via the silver wires 18 of the anisotropic conductive connector 1, allowing inspection to be performed.

[0061] The method for producing the inspection device 5 is not particularly limited, and any known method can be used except for using the anisotropic conductive connector of the present invention.

[0062] The inspection device of the present invention is not limited to the inspection device 5 described above, so long as it is equipped with the anisotropic conductive connector of the present invention, and the design can be appropriately changed depending on the electronic device components, module components, etc. to which it is applied.

[0063] For example, it may be an inspection device (socket) 6 illustrated in Fig. 10. The inspection device 6 includes a circuit board 60 having electrode terminals, an anisotropic conductive connector 1, a holder 62, and a plate 64.

[0064] The circuit board 60 may be any circuit board having electrode terminals, such as a printed wiring board. In this example, the circuit board 60 is disposed on a plate 64, but is not limited to this embodiment. The material of the plate 64 is not particularly limited, and may be made of resin or metal.

[0065] The holder 62 is a member for fixing the outer periphery of the anisotropic conductive connector 1 onto the circuit board 50, and has a rectangular frame shape. The material of the holder 62 is not particularly limited, and may be made of resin or metal.

[0066] In the inspection device 6, the anisotropic conductive connector 1 is placed on the circuit board 60, and with a holder 62 further placed on top of that, a bolt 63 is screwed into a bolt hole of the holder 62. As a result, the entire outer periphery of the anisotropic conductive connector 1 is sandwiched between the circuit board 60 and the holder 62, and the anisotropic conductive connector 1 is fixed onto the circuit board 60. In this state, the electrode terminal provided on the circuit board 60 is in contact with the end of the silver wire 18 in the anisotropic conductive connector 1 on the circuit board 60 side.

[0067] During inspection, a semiconductor device such as BGA, QFN, SOP, QFP, CSP, etc. is fitted inside the holder 62 and pressed against the side of the anisotropic conductive connector 1 opposite to the circuit board 60. Then, the electrode of the semiconductor device is brought into contact with the end of the silver wire 18 in the anisotropic conductive connector 1 of the inspection device 6 opposite to the circuit board 60. As a result, the electrode terminals of the circuit board 60 in the inspection device 6 and the electrodes of the semiconductor device are electrically connected via the silver wires 18 of the anisotropic conductive connector 1, allowing inspection to be performed.

[0068] The method for producing the inspection device 6 is not particularly limited, and any known method can be used except for using the anisotropic conductive connector of the present invention.

[0069] The inspection device of the present invention may include a framed anisotropic conductive connector. More specifically, the inspection device may be one in which the framed anisotropic conductive connector is fixed to a circuit board by a positioning pin, a holder, or the like, and a circuit board of an electric / electronic component to be inspected is pressed against the side of the framed anisotropic conductive connector opposite to the circuit board side.

[0070] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the following description.

[0071] [Evaluation test of initial contact properties] Using the test equipment described below, the anisotropic conductive connector was placed on a gold-plated solid electrode, and the load and resistance values ​​were measured when the anisotropic conductive connector was compressed by a gold-plated pin electrode attached to the tip of a load cell. (Testing equipment) Testing machine: Automatic load testing machine (MAX-1KN-M, manufactured by Japan Measurement Systems Co., Ltd.) Load cell: JLC-M50N (50N) Measurement electrodes: Φ0.14mm gold-plated pin electrodes, gold-plated solid electrodes Resistance meter: RM3545-02 (manufactured by Hioki Electric Co., Ltd.) Measurement conditions: Compression amount control (50% of the thickness of the anisotropic conductive connector) Test speed: 1mm / min

[0072] [Experimental Example 1] A coating film (first insulating layer) of about 0.025 mm thick made of uncured silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd.) was formed on a polyester film (substrate), and gold-plated beryllium copper wires (wire diameter 23 μm, elongation at break: 1.29%, maximum point load: 0.58 N, 0.2% yield load: 0.35 N) were placed on this coating film as conductive wires, each parallel to the other at intervals of about 0.05 mm. A coating film (second insulating layer) of about 0.025 mm thick covering these conductive wires was formed using silicone rubber, and the core sheet was obtained by heating and curing. Similarly, multiple core sheets were prepared and laminated with an adhesive so that the length directions of the conductive wires were aligned parallel to each other to obtain a sheet laminate. By slicing the sheet laminate, an anisotropic conductive connector was obtained in which the pitch of the conductive wires in the length direction (X direction) and width direction (Y direction) of the insulating part was both 0.05 mm, the inclination angle θ of the conductive wires was 63.4 degrees, and the thickness was 0.15 mm. The anisotropic conductive connector thus obtained was subjected to an evaluation test for initial contact properties, and the results are shown in Figure 11.

[0073] [Experimental Example 2] An anisotropic conductive connector was manufactured in the same manner as in Experimental Example 1, except that a gold-plated silver wire (wire diameter 25 μm, elongation at break: 1.17%, maximum point load: 0.17 N, 0.2% yield load: 0.15 N) was used as the conductive wire, and an evaluation test of the initial contact property was performed. The results are shown in FIG.

[0074] 11 and 12, the anisotropic conductive connector of Experimental Example 2 using silver wire had a smaller resistance value even with a small compression amount of about 0.005 mm compared to the anisotropic conductive connector of Experimental Example 1 using brass wire. Thus, the anisotropic conductive connector of Experimental Example 2 using silver wire was able to connect the silver wire to the electrode with low resistance and low load.

[0075] [Evaluation test of repeated compression characteristics (durability)] Using the test equipment below, an evaluation jig consisting of a backup plate was placed on a load tester, and the evaluation board, anisotropic conductive connector, and PKG guide (where "PKG" means package) were placed on top of it in that order. A gold-plated pin electrode with a commercially available dummy PKG attached to its tip was placed on the tip of a load cell, and the dummy PKG was repeatedly pressed against the anisotropic conductive connector so that the load value for each press was 20 N, and the resistance was measured. (Testing equipment) Testing machine: Automatic load testing machine (MAX-1KN-M, manufactured by Japan Measurement Systems Co., Ltd.) Load cell: JLC-M50N (50N) Dummy PKG: WLP64T.3C-DC088D (pitch: 0.3 mm, solder ball: Φ0.2 mm) Measurement electrode: Φ1mm gold-plated pin electrode, evaluation board for WLP64 (daisy chain connection) Resistance meter: RM3545-02 (manufactured by Hioki Electric Co., Ltd.) Measurement conditions: Load control (20N) Test speed: 6mm / min Measurement interval: Every 25 times (1 second pause during measurement) Dummy PKG replacement frequency: Every 5,000 times (repeated compression characteristics only)

[0076] [Experimental Example 3] An anisotropic conductive connector was manufactured in the same manner as in Experimental Example 1, except that a gold-plated beryllium copper wire (wire diameter 23 μm, elongation at break: 1.29%, maximum point load: 0.58 N, 0.2% yield load: 0.35 N) was used as the conductive wire, and an evaluation test of the repeated compression characteristics (durability) was performed. The results are shown in FIG.

[0077] [Experimental Example 4] An anisotropic conductive connector was manufactured in the same manner as in Experimental Example 1, except that a gold-plated silver wire (wire diameter 25 μm, elongation at break: 1.17%, maximum point load: 0.17 N, 0.2% yield load: 0.15 N) was used as the conductive wire, and an evaluation test of the repeated compression characteristics (durability) was performed. The results are shown in FIG. 13 and 14 show a summary of data from the first compression immediately after replacing the dummy package every 5000 compressions.

[0078] As shown in Figures 13 and 14, the anisotropic conductive connector of Experimental Example 4 using silver wire showed almost no increase in resistance up to approximately 45,000 compressions, and it was found that the increase in resistance during continuous use could be sufficiently suppressed compared to the anisotropic conductive connector of Experimental Example 3 using beryllium copper wire.

[0079] [Experimental Example 5] An anisotropic conductive connector was manufactured in the same manner as in Experimental Example 1, except that a gold-plated silver wire (wire diameter 25 μm, elongation at break: 1.17%, maximum point load: 0.17 N, 0.2% yield load: 0.15 N, gold-plated layer formed directly on the silver wire) was used as the conductive wire and the inclination angle was 90 degrees, i.e., the silver wire was arranged perpendicular to the second surface, and an evaluation test of the initial contact property was performed. As a result, the initial contact property and repeated compression characteristics (durability) are slightly inferior to the evaluation test results shown in FIGS. 12 and 14 because buckling of the conductive wire occurs. [Explanation of symbols]

[0080] 1~3...Anisotropic conductive connector 4…Framed anisotropic conductive connector 5,6…Inspection equipment 10, 10A…Conductive part 12...Conductive band section 14...Adhesive part 16…Insulation section 18...Silver wire 20…Insulation section 22…Attachment section 24…Insulation section 26...adhesive layer 30…Frame 32…Adhesive material 34...Through hole 50,60…Circuit board 52,62…Holder 54,64…Plate

Claims

1. The insulating member includes a belt-shaped insulating portion made of an elastic material having insulating properties, and a plurality of silver wires that penetrate the insulating portion from a first surface to a second surface in a thickness direction and are arranged at a constant pitch in a longitudinal direction of the insulating portion, the tensile strength of the silver wire measured in accordance with JIS Z 2241 is 200 N / mm 2 or more and 380 N / mm 2 or less; An anisotropic conductive connector, wherein the plurality of silver wires are each arranged perpendicular or inclined to the second surface of the insulating portion.

2. The silver wire has a breaking elongation of 0.90% or more and 1.30% or less, as measured in accordance with JIS Z 2241.

2. The anisotropic conductive connector according to claim 1.

3. The maximum point load of the silver wire measured in accordance with JIS Z 2241 is 0.14 N or more and 0.20 N or less.

2. The anisotropic conductive connector according to claim 1.

4. The 0.2% proof load of the silver wire measured in accordance with JIS Z 2241 is 0.12 N or more and 0.18 N or less.

2. The anisotropic conductive connector according to claim 1.

5. 2. The anisotropic conductive connector according to claim 1, wherein a gold plating film is formed on a side surface of the silver wire.

6. 2. The anisotropic conductive connector according to claim 1, wherein the insulating portion has a compression set of 20% or less.

7. 7. An anisotropically conductive connector with a frame, comprising: the anisotropically conductive connector according to claim 1; and a positioning frame coupled to at least a portion of the periphery of the anisotropically conductive connector.

8. An inspection device for electric and electronic components, comprising: a circuit board having electrode terminals; the anisotropic conductive connector according to any one of claims 1 to 6; and a holder, At least a part of an outer periphery of the anisotropic conductive connector is fixed onto the circuit board by the holder; the electrode terminal is in contact with an end of the silver wire in the anisotropic conductive connector on the circuit board side, During inspection, the electrical / electronic component is pressed against an area of ​​the anisotropic conductive connector opposite the circuit board that is not in contact with the holder, and an electrode of the electrical / electronic component is brought into contact with an end of the silver wire in the anisotropic conductive connector opposite the circuit board.

9. An inspection device for electric and electronic components, comprising: a circuit board having electrode terminals; the framed anisotropic conductive connector according to claim 7; and a holder, At least a part of a frame portion of the framed anisotropic conductive connector is fixed onto the circuit board by the holder; the electrode terminal is in contact with an end of the silver wire in the frame-attached anisotropic conductive connector on the circuit board side, During inspection, the electrical / electronic component is pressed against an area of ​​the framed anisotropic conductive connector on the side opposite the circuit board that is not in contact with the holder, and an electrode of the electrical / electronic component is brought into contact with an end of the silver wire in the framed anisotropic conductive connector on the side opposite the circuit board.

Images