High entropy alloy-based composites as temperature-stable conductors
The high entropy alloy composite conductor addresses the issue of high TCR in conventional materials by combining high entropy alloys with conductive carbon and metals, achieving low resistivity and TCR for improved device performance.
Patent Information
- Application Number
- PCT/CN2024/078524
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-09-04
AI Technical Summary
Conventional highly conducting materials used in electrical and electronic devices exhibit significant increases in electrical resistance due to large positive temperature coefficients of resistivity (TCRs), compromising device efficiency, stability, and lifetime.
A high entropy alloy composite conductor is developed, combining electrically conductive high entropy alloys, carbon materials like carbon nanotubes or graphene, and metals such as copper or aluminum, to achieve low electric resistivity and temperature coefficient of resistivity (TCR).
The composite conductor maintains low electric resistivity and TCR, enhancing device efficiency, stability, and lifetime by synergizing the beneficial electron transport characteristics of high entropy alloys and conductive carbon materials.
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Figure CN2024078524_04092025_PF_FP_ABST
Abstract
Description
HIGH ENTROPY ALLOY-BASED COMPOSITES AS TEMPERATURE-STABLE CONDUCTORSTECHNICAL FIELD
[0001] The present disclosure relates to high entropy alloy-based composites as temperature-stable conductors. More specifically, the present disclosure relates to a high entropy alloy composite conductor having an electric resistivity at room temperature of less than 200 μΩ ·cm as measured by the norm ASTM B0193-20, the high entropy alloy composite conductor having a temperature coefficient of resistivity (TCR) of less than 4000 ppm / K as measured by the norm ASTM B0070-90R19.BACKGROUND
[0002] In conventionally used electrical or electronic devices, the trend toward device miniaturization and high power typically leads to local or global temperature increases in such electrical or electronic devices. Highly conducting materials based on metals, such as Cu, Al, or the like, or alloys thereof, which have been conventionally used in such electrical or electronic devices, for example as windings in motors and / or transformers or as interconnects in electronics, show an increased electrical resistance in dependence of a rise in temperature. Therefore such conventionally used metals show large and positive temperature coefficients of resistivity (TCRs) , which is the metric for such resistivity-change in dependence of a change in temperature.
[0003] Such an increase in electric resistivity in dependence of temperature, which is characterized by large positive TCRs, of conventionally used highly conducting materials is known to compromise device efficiency, stability and lifetime. For example, in DC motors, the maximum power of the motor drops when the temperature is increased in such an extent that the motor power at 125 ℃ is only 70%of the motor power at room temperature. Such increase in electric resistivity leads to disadvantageous additional joule heating and heat generation, thereby worsening performance metrics.
[0004] Therefore a need exists to provide new materials for conductors having a low temperature coefficient of resistivity (TCR) together with a lower electric resistance compared to conventional materials, such as copper or aluminum, to enable higher efficiencies, performances, stabilities and lifetimes of electric devices and electronic devices manufactured from such new materials.
[0005] In document EP 3 519 352 B1 metal-graphene composites are disclosed as a potential replacement for commonly known copper conductors.
[0006] In document US 2013 / 0323116 A1 an alloy material with a constant electrical resistivity is disclosed.
[0007] Existing materials with potential to address the need for temperature-stable electrical conductors, such as nanocarbon-based materials or their composites with metals and / or alloys have limitations in terms of processing and / or achieving low resistivities in combination with TCR.
[0008] Therefore, it would be desirable to have a conductor that alleviates the problems of the prior art.SUMMARY
[0009] It is an objective of the present disclosure to provide a conductor, that combines both a low electric resistivity and a low temperature coefficient of resistivity (TCR) within the same material.
[0010] The foregoing and other objectives are achieved by the subject matter of the independent claims. Further implementation forms are apparent from the dependent claims, the description, and the figures.
[0011] According to a first aspect a high entropy alloy composite conductor is provided, having an electric resistivity at room temperature of less than 200 μΩ ·cm as measured by the norm ASTM B0193-20, the high entropy alloy composite conductor having a temperature coefficient of resistivity (TCR) of less than 4000 ppm / K as measured by the norm ASTM B0070-90R19, and the high entropy alloy composite conductor comprising at least one of the following selections (a) , and / or (b) and / or (c) : wherein selection (a) comprises a matrix comprising at least one electrically conductive high entropy alloy, and a filler comprising at least one electrically conductive carbon material; wherein selection (b) comprises a matrix comprising at least one electrically conductive metal, and a filler comprising at least one electrically conductive high entropy alloy or the filler comprising at least one electrically conductive high entropy alloy and an electrically conductive carbon material; and wherein selection (c) comprises a composite comprising a core comprising at least one electrically conductive carbon material and an outer shell disposed radially outwards of the core, the outer shell comprising at least one electrically conductive metal and at least one electrically conductive high entropy alloy.
[0012] Therefore, the technical advantage of providing a conductor having both a low electric resistivity and a low temperature coefficient of resistivity (TCR) is achieved by novel combinations of materials comprising electrically conductive high entropy alloys (HEAs) , electrically conductive carbon materials, such as carbon nanotubes or graphene sheets, and / or at least one electrically conductive metal, such as copper or aluminum.
[0013] Every component of the composite conductor according to the first aspect contributes to the resulting low electric resistivity and the resulting low temperature coefficient of resistivity (TCR) of the composite conductor.
[0014] The at least one electrically conductive metal, such as copper or aluminum, can be used as a matrix, which due to the high carrier densities provides free electrons, which lead to a low electrical resistivity of the composite conductor comprising such electrically conductive metal. While such electrically conductive metal, such as copper or aluminum, is cheap and easy to process, the electron mean free path, i.e. with an electron scattering distance from 40 to 60 nm can result in a high temperature coefficient of resistivity (TCR) of such electrically conductive metals, when such electrically conductive metals are used by themselves.
[0015] The at least one electrically conductive carbon material, such as carbon nanotubes or graphene sheets, comprises a moderate number of free electrons, which lead to a low electrical resistivity of said material, depending on the specific structure, doping, and the like. However, the long electron mean free path of said electrically conductive carbon material results in a particularly low temperature coefficient of resistivity (TCR) of such electrically conductive carbon material, when such electrically conductive carbon material is used by itself.
[0016] The at least one electrically conductive high entropy alloy (HEA) shows a high disorder, typically resulting in a higher electrical resistance, and a low electron mean free path, as well as a weak localisation effect, a magnetic disorder, the occurrence of Kondo scattering, and low phonon coupling, resulting in a lower temperature coefficient of resistivity (TCR) .
[0017] Therefore, by efficiently combining the electrically conductive high entropy alloy, the electrically conductive carbon material and / or at least one electrically conductive metal, a high entropy alloy composite conductor according to the first aspect can be provided, having a low electric resistivity and a low temperature coefficient of resistivity (TCR) .
[0018] According to the first selection (a) of the first aspect, a matrix comprising at least one electrically conductive high entropy alloy, and a filler comprising at least one electrically conductive carbon material is provided in the composite conductor. In particular, the matrix exclusively consists of the at least one electrically conductive high entropy alloy and the filler exclusively consists of the at least one electrically conductive carbon material, which means that according to selection (a) no electrically conductive metal is present.
[0019] According to the second selection (b) of the first aspect, a matrix comprising at least one electrically conductive metal, and a filler comprising at least one electrically conductive high entropy alloy or the filler comprising at least one electrically conductive high entropy alloy and an electrically conductive carbon material is provided in the composite conductor. In particular, the filler exclusively consists of the at least one electrically conductive high entropy alloy or the filler exclusively consists of the at least one electrically conductive carbon material and the at least one electrically conductive high entropy alloy.
[0020] According to the third selection (c) of the first aspect, the compound comprises a composite comprising a core comprising at least one electrically conductive carbon material and an outer shell disposed radially outwards of the core, the outer shell comprising at least one electrically conductive metal and at least one electrically conductive high entropy alloy.
[0021] The high entropy alloy composite conductor according to the first aspect may exclusively consist of one of the material selections (a) , (b) or (c) . Alternatively, the high entropy alloy composite conductor according to the first aspect may consist of at least two of the material selections (a) , (b) and (c) , which in particular means a combination of material selections (a) and (b) , or selections (b) and (c) or selections (a) , (b) and (c) .
[0022] In a possible implementation form of the first aspect, the high entropy alloy composite conductor has an electric resistivity at room temperature of less than 100 μΩ ·cm as measured by the norm ASTM B0193-20, preferably less than 50 μΩ ·cm, more preferably less than 10 μΩ ·cm, even more preferably less than 5 μΩ ·cm, even further more preferably less than 3 μΩ ·cm, most preferably less than 2 μΩ ·cm, and even most preferably less than 1 μΩ ·cm.
[0023] By employing such low electric resistivity values, the high entropy alloy composite conductor can be efficiently used in a wider variety of electronics applications. In particular, the high entropy alloy composite conductor has a minimal electric resistivity at room temperature as measured by the norm ASTM B0193-20 of 0.5 μΩ ·cm.
[0024] In a further possible implementation form of the first aspect, the high entropy alloy composite conductor has an electric conductivity at room temperature of more than 0.005 MS / cm as measured by the norm ASTM B0193-20, preferably more than 0.01 MS / cm, more preferably more than 0.1 MS / cm, even more preferably more than 0.25 MS / cm, even further more preferably more than 0.4 MS / cm, most preferably more than 0.5 MS / cm, and even most preferably more than 0.6 MS / cm, and even further most preferably more than 1.0 MS / cm.
[0025] In particular, the electric conductivity as measured by the norm ASTM B0193-20 is the inverse of the electric resistivity as measured by the norm ASTM B0193-20.
[0026] By employing such high electric conductivity values, the high entropy alloy composite conductor can be efficiently used in a wider variety of electronics applications. In particular, the high entropy alloy composite conductor has a maximal electric conductivity at room temperature as measured by the norm ASTM B0193-20 of 2.0 MS / cm.
[0027] In a further possible implementation form of the first aspect, the high entropy alloy composite conductor has a temperature coefficient of resistivity (TCR) of less than 3000 ppm / K as measured by the norm ASTM B0070-90R19, preferably less than 2000 ppm / K, more preferably less than 1000 ppm / K, even more preferably less than 500 ppm / K, even further more preferably less than 100 ppm / K, most preferably less than 10 ppm / K, even most preferably less than 5 ppm / K, and even further most preferably less than 1 ppm / K.
[0028] By employing such low TCR values, the high entropy alloy composite conductor can be efficiently used in a wider variety of electronics applications. In particular, the high entropy composite alloy conductor has a minium TCR value at room temperature as measured by the norm ASTM B0070-90R19 of 0 ppm / K.
[0029] In a further possible implementation form of the first aspect, the electrically conductive high entropy alloy is a multicomponent material comprising dual or multiple phases including at least one intermetallic phase, wherein the multicomponent material in particular comprises at least four different chemical elements, preferably at least five different chemical elements.
[0030] The presence of the at least one intermetallic phase and the at least four different chemical elements within the high entropy alloy allow for superior physical properties of the electrically conductive high entropy alloy present in the composite conductor according to the present disclosure.
[0031] In a further possible implementation form of the first aspect, the electrically conductive high entropy alloy comprises at least four, preferably at least five, of the following chemical elements comprising copper, aluminum, cobalt, nickel, manganese, chromium, titanium, iron, silicon, tantalum, zirconium, niobium, hafnium, and vanadium.
[0032] By selecting at least four of the above-mentioned chemical elements, the superior physical properties of the electrically conductive high entropy alloy can be ensured.
[0033] In a further possible implementation form of the first aspect, the electrically conductive high entropy alloy comprises the following materials AlxCoFeNi, wherein x is selected from 0.1 to 2.1, CoFeNiSiy, wherein y is selected from 0.1 to 1.1, AluCoCrFeNi, wherein u is selected from 0.1 to 4.1, FeCoNi (MnAl) v, wherein v is selected from 0.1 to 2.1, CuwCrFeTiV, wherein w is selected from 0.1 to 1.1, (TaNb) 2z (HfZrTi) z, wherein z is selected from 0.1 to 2.1, AlCoCrCuaFeNi, wherein a is selected from 0.1 to 2.1.
[0034] The above-mentioned specific compounds allow for particularly superior physical properties of the electrically conductive high entropy alloy composite conductor according to the present disclosure.
[0035] In a further possible implementation form of the first aspect, the electrically conductive high entropy alloy is present in the high entropy alloy composite conductor from 0.1 wt. -%to 50 wt. -%based on the total weight of the high entropy alloy composite conductor, preferably from 0.1 to 25 wt. -%, more preferably from 0.1 to 10 wt. -%.
[0036] By selecting the above-mentioned weight ranges, it is ensured that a sufficient amount of the electrically conductive high entropy alloy is present in the high entropy alloy composite conductor.
[0037] In a further possible implementation form of the first aspect, the electrically conductive high entropy alloy is adapted to facilitate electron transport through the electrically conductive carbon material, in particular by formation of a carbide compound.
[0038] When combining the electrically conductive high entropy alloy and the electrically conductive carbon material within the composite conductor, the facilitated electron transport through the electrically conductive carbon material allows for a low temperature coefficient of resistivity (TCR) of the overall high entropy alloy composite conductor.
[0039] In a further possible implementation form of the first aspect, the electrically conductive carbon material comprises single, bi, tri or multilayer graphene, graphene oxide, reduced graphene oxide, nanographene, wherein for nanographene it is preferred that at least one lateral dimension of nanographene is smaller than 100 nm, functionalized forms of graphene, intercalated graphite, graphite oxide, carbon nanotubes, preferably single wall, double wall, triple wall, or multi wall carbon nanotubes, and / or carbons with doping, intra-lattice functionalization and extra-lattice functionalization.
[0040] By using the specifically selected electrically conductive carbon materials a low temperature coefficient of resistivity (TCR) of the overall high entropy alloy composite conductor can be achieved.
[0041] In a further possible implementation form of the first aspect, the electrically conductive carbon material is present as ensembles, preferably as carbon nanotube bundles or graphene stacks, which more preferably form ribbons, sheets, platelets and / or wires.
[0042] By using ensembles for the electrically conductive carbon material, an advantageous composite conductor can be provided.
[0043] In a further possible implementation form of the first aspect, the electrically conductive carbon material is present as individual entities, preferably as individual carbon nanotubes or individual graphene sheets, wherein more preferably the individual entities being selected as carbon nanotubes have diameters ranging from 0.1 nm to 500 nm and lengths from 1 nm to 10 cm, and / or wherein more preferably the individual entities being selected as graphene sheets have lateral dimensions from 10 nm to 10 cm and a thickness in the range 0.335 nm to 10 nm.
[0044] By using individual entities for the electrically conductive carbon material, an advantageous composite conductor can be provided.
[0045] In a further possible implementation form of the first aspect, the electrically conductive carbon material is adapted as a functionalized electrically conductive carbon material, which is adapted to bind to the electrically conductive high entropy alloy and / or to the electrically conductive metal, wherein preferably the functionalization adaptation is selected as intra and / or extra-lattice covalent or non-covalent functionalization with O-, N-, containing groups comprising hydroxy, amine, amide, ether, carboxyl, ester groups, and / or wherein preferably the functionalization adaptation comprises doping with acids, superacids, halogen-based and / or polymeric molecules.
[0046] By using functionalized electrically conductive carbon material, the interaction between the electrically conductive carbon material and the matrix can be improved.
[0047] In a further possible implementation form of the first aspect, the at least one electrically conductive carbon material is present in the high entropy alloy composite conductor from 0.1 wt. -%to 50 wt. -%based on the total weight of the high entropy alloy composite conductor, preferably from 0.1 to 25 wt. -%, more preferably from 0.1 to 10 wt. -%.
[0048] The above-mentioned weight ranges allow for an efficient deposition of the at least one electrically conductive carbon material within the composite conductor.
[0049] The use of such electrically conductive carbon material, such as carbon nanotubes and / or graphene, of the high entropy alloy composite conductor according to the first aspect allows for a low temperature coefficient of resistivity (TCR) and for a low electrical resistivity of the overall high entropy alloy composite conductor.
[0050] In a further possible implementation form of the first aspect, the electrically conductive metal comprises copper, aluminium, silver, gold, iron, and alloys thereof.
[0051] By using such electrically conductive metal a matrix in the composite conductor can be provided, which allows for a free flow of electrons within the material, thereby allowing for a minimal electrical resistivity of the overall high entropy alloy composite conductor.
[0052] In a further possible implementation form of the first aspect, the high entropy alloy composite conductor further comprises an interlinking agent.
[0053] Preferably, within the high entropy alloy composite conductor, the interlinking agent provides a chemical linkage between the at least one electrically conductive carbon material and the electrically conductive high entropy alloy.
[0054] In a further possible implementation form of the first aspect, the at least one electrically conductive carbon comprises an interlinking agent to connect with the at least one electrically conductive high entropy alloy and / or the at least one electrically conductive metal.
[0055] The interlinking agents may comprise polymeric and / or polyaromatic groups, such as polyvinyl alcohol, polyvinyl pyrrolidone, and / or biopolymers. The interlinking agents may comprise surfactants, such as sodium dodecyl sulfate (SDS) , sodium dodecylbenzen sulfonate (SDBS) , cetyltrimethylammonium p-toluenesulfonate (CTAT) , cetyltrimethylammonium bromide (CTAB) , and / or sodium cholate. The interlinking agents may comprise entities with special groups, such as thiols, hydroxy, and / or carboxy groups that are covalently or non-covalently grafted to the at least one electrically conductive carbon material.
[0056] Such interlinking agents allow for an improvement in the interactions between the carbon materials and the electrically conductive metal, thereby facilitating a stable interaction between said components.
[0057] In a further possible implementation form of the first aspect, for selection (b) the filler, which is selected as at least one electrically conductive high entropy alloy, is present as nanoparticles, wherein one dimension of the nanoparticles preferably is between 0.1 nm and 1000 nm or as microparticles, wherein one of the dimensions of the microparticles is preferably between 1 μm to 1000 μm.
[0058] By providing the electrically conductive high entropy alloy as nanoparticles or microparticles within the composite conductor, a particularly low TCR in the composite conductor can be achieved.
[0059] In a further possible implementation form of the first aspect, for selection (b) the filler is selected as at least one electrically conductive high entropy alloy and as at least one electrically conductive carbon material, wherein the electrically conductive high entropy alloy is coated on the electrically conductive carbon material.
[0060] The coating of the electrically conductive high entropy alloy on the electrically conductive carbon material allows for an effective bonding between both materials with the composite conductor.
[0061] In a further possible implementation form of the first aspect, for selection (c) the outer shell comprises an interface region, which is in contact with the core of electrically conductive carbon material, and wherein the outer shell comprises an outer region, which is separated from the core, wherein the interface region and / or the outer region comprise the at least one electrically conductive metal, and / or the at least one electrically conductive high entropy alloy.
[0062] The layered core-shell structure is very advantageous in respect to fabrication capabilities, such as electrodeposition, physical vapor deposition, and the like, towards microscale applications, such as interconnects, vias, and the like.
[0063] In a further possible implementation form of the first aspect, according to selection (c1) the interface region exclusively consists of the at least one electrically conductive high entropy alloy and the outer region exclusively consists of the at least one electrically conductive metal; or according to selection (c2) the interface region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal, and the outer region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal; or according to selection (c3) the interface region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal, and the outer region exclusively consists of the at least one electrically conductive metal; or according to selection (c4) the interface region exclusively consists of the at least one electrically conductive high entropy alloy, and the outer region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal; or according to selection (c5) the interface region exclusively consists of the at least one electrically conductive metal, and the outer region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal.
[0064] The respective structures allow for the provision of a high entropy alloy composite conductor with a low electrical resistivity and a low TCR.
[0065] In a further possible implementation form of the first aspect, for selection (c) the outer shell is in direct contact with the core and comprises at least one electrically conductive metal and the at least one electrically conductive high entropy alloy.
[0066] By providing said composite, a particularly advantageous high entropy alloy composite conductor can be provided.
[0067] In a further possible implementation form of the first aspect, for selection (c) the high entropy alloy composite conductor comprises at least two cores, which are separated from each other by an innermost layer, which is comprised of at least one electrically conductive metal, wherein the innermost layer is separated from the respective core by an intermediate layer, which is comprised of at least one electrically conductive high entropy alloy, wherein radially outwards of each of the two (or more) cores an respective additional intermediate layer is formed, which is comprised of at least one electrically conductive high entropy alloy, and wherein radially outwards of each of the additional intermediate layer the outer shell is formed, which is comprised of at least one electrically conductive metal.
[0068] Said composite allows for the provision of a particularly advantageous high entropy alloy composite conductor.
[0069] In a further possible implementation form of the first aspect, for selection (c) the outer shell comprises an interface region, which is in contact with the core, and wherein the outer shell comprises an outer region, which is separated from the core, wherein the interface region and / or outer region comprise the at least one electrically conductive metal and / or the at least one electrically conductive high entropy alloy.
[0070] Said implementation allows for the provision of a particularly efficient high entropy alloy composite conductor.
[0071] In a further possible implementation form of the first aspect, the high entropy alloy composite conductor comprises a composite according to selection (c) comprising a core comprised of an electrically conductive carbon material, preferably graphene, and an outer shell disposed radially outwards of the core, the outer shell comprising at least one electrically conductive metal, preferably copper, and from 0.01 wt. -%to 25 wt. -%of at least one electrically conductive high entropy alloy, preferably AlxCoCrFeNi.
[0072] Said specific implementation of the composite allows for the provision of an advantageous high entropy alloy composite conductor.
[0073] In a further possible implementation form of the first aspect, the high entropy alloy composite conductor is formed as a conductive bar, a conductive rod, a conductive wire, a conductive sheet, or a conductive microscale structure, in particular as conductive vias, conductive planar and / or vertical interconnects.
[0074] By choosing these specific geometric forms of the high entropy alloy composite conductor a variety of electronics can be manufactured.
[0075] According to a second aspect a use of the high entropy alloy composite conductor of the first aspect is provided for the manufacturing of a winding in an electric device, in particular an electric motor, or an electric transformer or an electric generator, in electrical and electronic circuitry such as vias and / or planar or vertical interconnects, in power devices to carry electrical current, such as busbars in switchgear, distribution boards, bus ducts, battery banks, and the like.
[0076] As shown for the second aspect, the high entropy alloy composite conductor can be used in a variety of electronics to be manufactured.
[0077] For the first and second aspect, the respective high entropy alloy composite conductors can be manufactured by vacuum arc melting, induction melting, solid state synthesis, preparation of alloy powders by gas atomization and / or thermal spray processing, mixing of powders of all components by ball milling or other mechanical alloying and / or physical mixing processes followed by compaction methods such as spark plasma sintering, physical vapor deposition processes, (co-) sputtering, electrodeposition, and the like.
[0078] For the first and second aspect, to enhance incorporation, the conductive carbon materials may be mixed or dispersed and / or individualized as may be needed. To achieve this, the above processes may be used in conjunction with methods such as stirring, ultrasonication, application of high currents with mixing, especially during melting processes, and the like.
[0079] For the first and second aspect, to achieve filler alignment and to bring about high entropy alloy synthesis with predesigned crystallographic registry, additional processing steps can be applied, with the methods including but not limited to extrusion, high pressure torsion, cold and / or hot drawing, thermal and / or electric current treatments, such as annealing, and the like in sequence or in tandem with the rest of the processing.
[0080] For the first and second aspect, the final composites of high entropy alloy composite conductors may be produced as bars, rods, wires, sheets, microscale structures, such as vias or interconnects, and the like.
[0081] Details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description, drawings, and claims.BRIEF DESCRIPTION OF THE DRAWINGS
[0082] In the following, examples of the present disclosure are described in more detail with reference to the attached figures and drawings, in which:
[0083] FIGS. 1A, 1B and 1C depict schematic diagrams of high entropy alloy composite conductors comprising high entropy alloys as matrix and conductive carbons as fillers according to examples;
[0084] FIGS. 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I and 2J depict schematic diagrams of high entropy alloy composite conductors comprising a least one electrically conductive metal and a filler comprising at least one electrically conductive high entropy alloy or the filler comprising at least one electrically conductive high entropy alloy and an electrically conductive carbon material according to examples; and
[0085] FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L and 3M depict schematic diagrams of high entropy alloy composite conductors comprising core-shell composites having a least one electrically conductive metal, at least one electrically conductive high entropy alloy and at least one electrically conductive carbon material according to examples.
[0086] In the following, identical reference signs refer to identical or at least functionally equivalent features.
[0087] DETAILED DESCRIPTION OF THE EXAMPLES
[0088] In the following description, reference is made to the accompanying figures, which form part of the disclosure, and which show, by way of illustration, specific aspects of examples of the present disclosure or specific aspects in which examples of the present disclosure may be used. It is understood that examples of the present disclosure may be used in other aspects and comprise structural or logical changes not depicted in the figures. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.
[0089] For instance, it is to be understood that a disclosure in connection with a described method may also hold true for a corresponding device or system configured to perform the method and vice versa. For example, if one or a plurality of specific method steps are described, a corresponding device may include one or a plurality of units, e.g. functional units, to perform the described one or plurality of method steps (e.g. one unit performing the one or plurality of steps, or a plurality of units each performing one or more of the plurality of steps) , even if such one or more units are not explicitly described or illustrated in the figures. On the other hand, for example, if a specific apparatus is described based on one or a plurality of units, e.g. functional units, a corresponding method may include one step to perform the functionality of the one or plurality of units (e.g. one step performing the functionality of the one or plurality of units, or a plurality of steps each performing the functionality of one or more of the plurality of units) , even if such one or plurality of steps are not explicitly described or illustrated in the figures. Further, it is understood that the features of the various examples and / or aspects described herein may be combined with each other, unless specifically noted otherwise.
[0090] FIGS. 1A, 1B and 1C depict schematic diagrams of high entropy alloy composite conductors comprising high entropy alloys as matrix and conductive carbons as fillers according to examples.
[0091] In conventionally used electrical or electronic devices, the trend toward device miniaturization and high power inevitably leads to local or global temperature increases in such electrical or electronic devices. Highly conducting materials based on metals, such as Cu, Al, and the like, or alloys thereof, which have been conventionally used in such electrical devices, for example as windings in motors and / or transformers or as interconnects in electronics, show an increased electrical resistance in dependence of a rise in temperature. Therefore such conventionally used metals show large and positive temperature coefficients of resistivity (TCRs) , which is the metric for such resistivity-change in dependence of a change in temperature.
[0092] Such an increase in electric resistivity in dependence of temperature, which is characterized by large positive TCRs, of conventionally used highly conducting materials is known to compromise device efficiency, stability and lifetime. For example, in DC motors, the maximum power of the motor drops when the temperature is increased in such an extent that the motor power at 125 ℃ is only 70%of the motor power at room temperature.
[0093] Therefore, a goal of the present invention is to provide new materials for conductors having a low temperature coefficient of resistivity (TCR) together with a lower electric resistance compared to conventional materials, such as copper or aluminum, to enable higher efficiencies, performances, stabilities and lifetimes of electric devices and electronic devices manufactured from such new materials.
[0094] To achieve this goal, the present invention uses high entropy alloys (HEAs) as additives, coatings or matrix materials to design low electrical resistivity composite materials with low TCRs together with conductive carbon materials, such as carbon nano tubes (CNTs) , graphene and the like, and / or low resistivity conventional conductor metals, such as copper or aluminum. These new materials synergize beneficial special electron transport characteristics of high entropy alloys together with conductive carbon materials and / or conventional conductor metals, while incorporating ease of processability and scalability of conventionally used conductive materials.
[0095] In FIGS. 1A, 1B and 1C three different embodiments of high entropy alloy composite conductors 100 according to the present invention are shown, wherein all high entropy alloy composite conductors 100 comprise a matrix comprising at least one electrically conductive high entropy alloy 101, and a filler comprising at least one electrically conductive carbon material 103.
[0096] The different embodiments according to FIGS. 1A, 1B and 1C differ solely in the nature of at least one electrically conductive carbon material 103 of the filler.
[0097] In FIG. 1A the at least one electrically conductive carbon material 103 of the filler is selected as individual entities, which in particular extend of the entire length of the electrically conductive carbon material 103 and / or are unidirectionally aligned. Said individual entities preferably are individual carbon nanotubes and / or individual graphene sheets, wherein more preferably the individual entities are carbon nanotubes. When selected as individual carbon nanotubes, said individual carbon nanotubes preferably have diameters ranging from 0.1 nm to 500 nm and / or lengths from 1 nm to 10 cm or even more than 10 cm. When selected as individual graphene sheets, said individual graphene sheets preferably have lateral dimensions from 10 nm to 10 cm and / or a thickness in the range 0.335 nm to 10 nm.
[0098] In FIG. 1B, similar to FIG. 1A, the at least one electrically conductive carbon material 103 of the filler is selected as individual entities, preferably as individual carbon nanotubes and / or individual graphene sheets. However, in the example of FIG. 1B, the individual carbon nanotubes and / or individual graphene sheets are shorter compared to FIG. 1A, thereby in particular not extending over the entire length of the electrically conductive carbon material, but only over a partial distance within the electrically conductive carbon material. Therefore, the length of such individual carbon nanotubes according to FIG. 1B is only from 0.1 nm to 1 mm, and the length of such individual graphene sheets according to FIG. 1B is only from 0.1 nm to 1 mm.
[0099] In FIG. 1C, the at least one electrically conductive carbon material 103 of the filler is selected as ensembles, preferably as carbon nanotube bundles or graphene stacks, which more preferably form ribbons, sheets, platelets and / or wires. As can be seen from FIG. 1C such carbon material ensembles form a network structure and / or have an overall unidirectional alignment.
[0100] According to the examples of FIGS. 1A, 1B and 1C the at least one electrically conductive high entropy alloy 101 of the matrix provides the base electric resistivity of the high entropy alloy composite conductor 100 and also serves to reduce the temperature coefficient of resistivity (TCR) of the high entropy alloy composite conductor 100.
[0101] The electrically conductive high entropy alloy 101 according to the present invention is a multicomponent material comprising dual or multiple phases including at least one intermetallic phase, wherein the multicomponent material in particular comprises at least four different chemical elements, preferably at least five different chemical elements.
[0102] In particular, the electrically conductive high entropy alloy 101 comprises at least four, preferably at least five, of the following chemical elements comprising copper, aluminum, cobalt, nickel, manganese, chromium, titanium, iron, silicon, tantalum, zirconium, niobium, hafnium, and vanadium.
[0103] In particular, the electrically conductive high entropy alloy 101 comprises the following materials AlxCoFeNi, wherein x is selected from 0.1 to 1.1, CoFeNiSiy, wherein y is selected from 0.1 to 1.1, AluCoCrFeNi, wherein u is selected from 1.9 to 2.1, FeCoNi (MnAl) v, wherein v is selected from 0.1 to 2.1, and CuwCrFeTiV, wherein w is selected from 0.1 to 1.1, (TaNb) 2z (HfZrTi) z, wherein z is selected from 0.1 to 2.1, AlCoCrCuaFeNi, wherein a is selected from 0.1 to 2.1.
[0104] In particular, the electrically conductive high entropy alloy 101 is present in the high entropy alloy composite conductor 100 from 0.1 wt. -%to 50 wt. -%based on the total weight of the high entropy alloy composite conductor 100, preferably from 0.1 to 25 wt. -%, more preferably from 0.1 to 10 wt. -%.
[0105] In particular, the electrically conductive high entropy alloy 101 is adapted to facilitate electron transport through the electrically conductive carbon material 103, in particular by formation of a carbide compound.
[0106] The filler selected as at least one electrically conductive carbon material 103 also serves to reduce the temperature coefficient of resistivity (TCR) and / or the base electric resistivity of the high entropy alloy composite conductor 100.
[0107] In particular, the electrically conductive carbon material 103 is present in the high entropy alloy composite conductor 100 from 0.1 wt. -%to 50 wt. -%based on the total weight of the high entropy alloy composite conductor 100, preferably from 0.1 to 25 wt. -%, more preferably from 0.1 to 10 wt. -%.
[0108] In particular, the electrically conductive carbon material 103 comprises single, bi, tri or multilayer graphene, graphene oxide, reduced graphene oxide, nanographene, wherein for nanographene it is preferred that at least one lateral dimension of nanographene is smaller than 100 nm, functionalized forms of graphene, intercalated graphite, graphite oxide, carbon nanotubes, preferably single wall, double wall, triple wall, or multi wall carbon nanotubes, and / or carbons with doping, intra-lattice functionalization and extra-lattice functionalization.
[0109] In particular, the electrically conductive carbon material 103 is adapted as a functionalized electrically conductive carbon material 103, which is adapted to bind to the electrically conductive high entropy alloy 101 and / or to the electrically conductive metal, wherein preferably the functionalization adaptation is selected as intra-and / or extra-lattice covalent or non-covalent functionalization with O-, N-, containing groups comprising hydroxy, amine, amide, ether, carboxyl, ester groups, and / or wherein preferably the functionalization adaptation comprises doping with acids, superacids, halogen-based and / or polymeric molecules.
[0110] By combining the electrically conductive high entropy alloy 101 as matrix together with the at least one electrically conductive carbon material 103 as filler, the high entropy alloy composite conductors 100 according to FIGS. 1A, 1B and 1C have a low electric resistivity at room temperature of less than 200 μΩ ·cm as measured by the norm ASTM B0193-20, preferably less than 100 μΩ ·cm, preferably less than 50 μΩ ·cm, more preferably less than 10 μΩ ·cm, even more preferably less than 5 μΩ ·cm, even further more preferably less than 3 μΩ ·cm, most preferably less than 2 μΩ ·cm, and even most preferably less than 1 μΩ ·cm.
[0111] In particular, the high entropy alloy composite conductor 100 has an electric conductivity at room temperature of more than 0.005 MS / cm as measured by the norm ASTM B0193-20, preferably more than 0.01 MS / cm, more preferably more than 0.1 MS / cm, even more preferably more than 0.25 MS / cm, even further more preferably more than 0.4 MS / cm, most preferably more than 0.5 MS / cm, and even most preferably more than 0.6 MS / cm, and even further most preferably more than 1.0 MS / cm.
[0112] Also, the high entropy alloy composite conductors 100 according to FIGS. 1A, 1B and 1C have a low temperature coefficient of resistivity (TCR) of less than 4000 ppm / K as measured by the norm ASTM B0070-90R19, preferably less than 3000 ppm / K as measured by the norm ASTM B0070-90R19, preferably less than 2000 ppm / K, more preferably less than 1000 ppm / K, even more preferably less than 500 ppm / K, even further more preferably less than 100 ppm / K, most preferably less than 10 ppm / K, even most preferably less than 5 ppm / K, and even most preferably less than 1 ppm / K.
[0113] Therefore, examples of FIGS. 1A, 1B and 1C combine the low TCR of the high entropy alloy 101 matrix and the contribution of conductive carbon materials 103 as fillers to lower the electric resistivity as well as to lower the TCR of the high entropy alloy composite conductors 100.
[0114] Further, a synergy between the conductive carbon material 103 and the high entropy alloy 101 matrix is used by employing chemical elements with affinity to carbon in the high entropy alloy 101 composition, thereby enhancing beneficial effects of the two components to the overall electron transport mechanism to achieve the desired low TCR and electric resistivity of the high entropy alloy composite conductors 100. Further, due to the aforementioned improved affinity, the processability of the high entropy alloy composite conductors 100 is enhanced by applying scalable metallurgical methods, such as vacuum arc melting, induction melting, thermal spray processing, mechanical alloying, and the like.
[0115] FIGS. 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I and 2J depict schematic diagrams of high entropy alloy composite conductors comprising a least one electrically conductive metal and a filler comprising at least one electrically conductive high entropy alloy or the filler comprising at least one electrically conductive high entropy alloy and an electrically conductive carbon material according to examples.
[0116] In all FIGS. 2A to 2J, the matrix of the high entropy alloy composite conductors 100 is formed from at least one electrically conductive metal 105 providing base resistivity to the composite conductors 100.
[0117] In particular, the electrically conductive metal 105 comprises copper, aluminium, silver, gold, iron, and alloys thereof.
[0118] In the example according to FIG. 2A, the high entropy alloy composite conductor 100 comprises a filler, which is solely selected as at least one electrically conductive high entropy alloy 101.
[0119] Using the least one electrically conductive high entropy alloy 101 as filler allows to reduce the TCR of the respective high entropy alloy composite conductor 100.
[0120] In the examples according to FIGS. 2B to 2J, the high entropy alloy composite conductor 100 comprises a filler, which is selected as at least one electrically conductive high entropy alloy 101 and as at least one electrically conductive carbon material 103.
[0121] Using the at least one electrically conductive carbon material 103 as filler allows to reduce the electric resistivity and the TCR of the respective high entropy alloy composite conductor 100.
[0122] In respect to the combination of the at least one electrically conductive high entropy alloy 101 and the at least one electrically conductive carbon material 103 in the high entropy alloy composite conductors 100 as shown in FIGS. 2B to 2J, the high entropy alloys 101 act as interfacial agents to enhance interaction of electrically conductive carbon material 103 with the matrix or amongst the electrically conductive carbon material 103, thereby enhancing electron transfer and electrical performances by lowering the electric resistivity at room temperature and / or the temperature coefficient of resistivity.
[0123] The high entropy alloys 101 act as agents to improve processability of the electrically conductive carbon material 103 and their incorporation into the matrix formed by the electrically conductive metal 105 by improving interaction with the matrix physically and / or chemically and / or by increasing the density of the electrically conductive carbon material 103, especially when used as a coating on the electrically conductive carbon material 103.
[0124] As for example shown in FIGS. 2B, 2E and 2H, in the composite conductors 100 the high entropy alloys 101 may be coated onto the respective conductive carbon material 103 or their ensembles as a continuous coating, in particular with a thickness in the nm-micron range or as nano or micro particulate decorations.
[0125] As shown for example in FIGS. 2A, 2C, 2F and 2I, in the composite conductors 100 the high entropy alloys 101 may be present as fillers selected as nano-or microparticles, such as spheres, rods, and the like, with one dimension in the range of less than 1 nm to several 100 nm and other dimensions in the nm-micrometer range.
[0126] The examples of FIGS. 2D, 2G and 2J show a combination of high entropy alloy 101 coatings on the respective conductive carbon material 103 and the presence of high entropy alloy 101 as nano-or microparticles.
[0127] In respect to the conductive carbon material 103 used as filler in the examples of FIGS. 2B, 2C and 2D, the conductive carbon material 103 is selected as individualized entities running from end-to-end (similar to FIG. 1A) .
[0128] In respect to the conductive carbon material 103 used as filler in the examples of FIGS. 2E, 2F and 2G, the conductive carbon material 103 is selected as shorter individual entities distributed in the matrix (similar to FIG. 1A) .
[0129] In respect to the conductive carbon material 103 used as filler in the examples of FIGS. 2E, 2F and 2G, the conductive carbon material 103 is preferably unidirectionally aligned or is selected as ensembles, such as bundles of nanotubes, stacks of graphene sheets, and the like with networked structure and / or overall, unidirectional alignment (similar to FIG. 1C) .
[0130] In respect to the specific selections for the electrically conductive high entropy alloy 101 and the electrically conductive carbon material 103 reference to the detailed description in respect to FIGS. 1A, 1B and 1C is provided.
[0131] The examples according to FIGS. 2A to 2J disclose high entropy alloy composite conductors 100 comprising at least one electrically conductive metal 105, such as aluminum, copper or their alloys, as the matrix, and either the HEAs 101 as exclusive filler or the combination of HEAs 101 and the electrically conductive carbon materials 103 as filler. The use of HEAs 101 as fillers allows for the reduction of the TCR of conventional electrically conductive metals 105. The use of HEA-carbon-conventional metal tricomponent systems allows for synergistic benefits of HEAs 101, in respect to lowering the TCR, of conductive carbon materials 103, in respect to reducing the TCR and the electrical resistivity, and of conventional metals 105, in respect to an intrinsically low electrical resistivity.
[0132] In particular, the HEAs 101 enable better interaction between the conductive carbon material 103 and the electrically conductive metal 105 as well as the conductive carbon materials 103 by the use of chemical elements with affinity to carbon in the HEA 101 composition. This enhances the beneficial effects of all the components to the overall electron transport mechanism to achieve the aimed low TCR and electrical resistivity.
[0133] Further, due to the aforementioned improved affinity, the composite of the high entropy alloy composite conductors 100 allow for an enhanced processability by scalable metallurgical methods including vacuum arc melting, induction melting, thermal spray processing, mechanical alloying, and the like. For example, coating the conductive carbon materials 103 with HEAs 101 increases their density. In melt processing, the coated higher density carbon materials 103 mix better with the melt, having a reduced propensity to float to the top, to form homogeneous composites and are less likely to burn and oxidize at the melt-processing temperatures.
[0134] In respect to the specific selections for the electrically conductive high entropy alloy 101 and the electrically conductive carbon material 103 reference to the detailed description in respect to FIGS. 1A, 1B and 1C is provided.
[0135] FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L and 3M depict schematic diagrams of high entropy alloy composite conductors comprising core-shell composites having a least one electrically conductive metal 105, at least one electrically conductive high entropy alloy and at least one electrically conductive carbon material according to examples.
[0136] In all examples depicted in FIGS. 3A to 3M, the outer shell of the respective high entropy alloy composite conductor 100 is comprised of at least one electrically conductive metal 105, such as for example copper, aluminum, or alloys thereof.
[0137] As can be seen in the examples depicted in FIGS. 3A to 3K, the respective high entropy alloy composite conductor 100 may be comprised as the individual units, or as shown in the examples of FIGS. 3L and 3M, the respective high entropy alloy composite conductor 100 may be stacked or replicated in any combination to further reduce the TCR and / or electrical resistivity of the respective high entropy alloy composite conductor 100.
[0138] The high entropy alloy 101 may be added as a filler in the outer shell, as for example shown in FIGS. 3B, 3D, 3E, 3G, 3I, and 3J, or the high entropy alloy 101 may be added as an interface region either as nanoparticles or as a continous layer with a thickness in the nm-to μm range, as for example shown in FIGS. 3A, 3D, 3F, 3H, 3I, 3K, 3L, and 3M.
[0139] As shown in FIGS. 3A, 3D, 3F, 3G, 3H, and 3I, the interface region is in contact both with the core, which comprises the carbon material 103, and the outer shell, which comprises an outer region, which is separated from the core, and which comprises at least one electrically conductive metal 105.
[0140] In the examples depicted in FIGS. 3A, 3B, 3C, 3D, 3E and 3M, the respective high entropy alloy composite conductor 100 comprises a core, which is composed of at least one electrically conductive carbon material 103 being selected as ensembles, preferably selected as carbon nanotube bundles or graphene stacks, which more preferably form ribbons, sheets, platelets and / or wires.
[0141] In the examples depicted in FIGS. 3F, 3G, 3H, 3I, 3J, 3K and 3L, the respective high entropy alloy composite conductor 100 comprises a core, which is composed of at least one electrically conductive carbon material 103 being selected as individual entities, preferably as individual carbon nanotubes or individual graphene sheets.
[0142] In the examples depicted in FIGS. 3A and 3H, the interface region exclusively consists of the at least one electrically conductive high entropy alloy 101 and the outer region exclusively consists of the at least one electrically conductive metal 105.
[0143] In the examples depicted in FIGS. 3B and 3G, the interface region comprises the at least one electrically conductive high entropy alloy 101 and the at least one electrically conductive metal 105, and the outer region comprises the at least one electrically conductive high entropy alloy and the at least one electrically conductive metal 105.
[0144] In the examples depicted in FIGS. 3C and 3F, the interface region comprises the at least one electrically conductive high entropy alloy 101 and the at least one electrically conductive metal 105, and the outer region exclusively consists of the at least one electrically conductive metal 105.
[0145] In the examples depicted in FIGS. 3D and 3I, the interface region exclusively consists of the at least one electrically conductive high entropy alloy 101, and the outer region comprises the at least one electrically conductive high entropy alloy 101 and the at least one electrically conductive metal 105.
[0146] In the examples depicted in FIGS. 3E, 3J and 3K, the interface region exclusively consists of the at least one electrically conductive metal 105, and the outer region comprises the at least one electrically conductive high entropy alloy 101 and the at least one electrically conductive metal 105.
[0147] As shown in the examples depicted in FIGS. 3L and 3M, the high entropy alloy composite conductor 100 comprises at least two cores, which are separated from each other by an innermost layer, which is comprised of at least one electrically conductive metal 105, wherein the innermost layer is separated from the respective core by an intermediate layer, which is comprised of at least one electrically conductive high entropy alloy 101, wherein radially outwards of each of the at least two cores an respective additional intermediate layer is formed, which is comprised of at least one electrically conductive high entropy alloy 101, and wherein radially outwards of each of the additional intermediate layer the outer shell is formed, which is comprised of at least one electrically conductive metal 105.
[0148] In respect to the specific selections for the electrically conductive high entropy alloy 101 and the electrically conductive carbon material 103 reference to the detailed description in respect to FIGS. 1A, 1B and 1C is provided.
[0149] The examples according to FIGS. 3A to 3M show composite high entropy alloy composite conductors 100 comprising HEAs 101, conductive carbon materials 103 and electrically conductive metals 105 to achieve a low TCR and a low electric resistivity. The layered / core-shell structured architectures proposed are advantageous from the viewpoint of fabrication capabilities, such as electrodeposition, physical vapor deposition, and the like, towards microscale applications, such as interconnects, vias, and the like. Further, the examples according to FIGS. 3A to 3M are expressly designed to directly exploit conductive carbon materials 103 as either individual structures or ensembles as is, without further processing such as mixing that could alter the conductive carbon materials 103, retaining the conductive carbon materials 103 without changes.
[0150] Additionally, the production of the proposed composites of high entropy alloy composite conductors 100 may involve methods including but are not limited to vacuum arc melting, induction melting, solid state synthesis, preparation of alloy powders by gas atomization and / or thermal spray processing, mixing of powders of all components by ball milling or other mechanical alloying and / or physical mixing processes followed by compaction methods such as spark plasma sintering, physical vapor deposition processes, (co-) sputtering, electrodeposition, and the like.
[0151] To enhance incorporation, the conductive carbon materials 103 may be mixed or dispersed and / or individualized as may be needed. To achieve this, the above processes may be used in conjunction with methods such as stirring, ultrasonication, application of high currents with mixing, especially during melting processes, and the like.
[0152] To achieve filler alignment and to bring about HEA 101 alloy synthesis with predesigned crystallographic registry, additional processing steps can be applied, with the methods including but not limited to extrusion, high pressure torsion, cold and / or hot drawing, thermal and / or electric current treatments, such as annealing, and the like in sequence or in tandem with the rest of the processing.
[0153] The final composites of high entropy alloy composite conductors 100 may be produced as bars, rods, wires, sheets, microscale structures, such as vias or interconnects, and the like.
[0154] The invention uses existing materials families, such as HEAs 101 and conductive carbon materials 103, with the ability to be tailored specifically in combination with a variety of conventionally used materials in a novel way to reach the required performances. These processing routes in particular include established metallurgical and / or ceramic processing techniques and are scalable.
[0155] Similar materials can be expected to show superior mechanical performances, superior current carrying capabilities and thermal performances in terms of coefficients of thermal expansion and thermal conductivities. Therefore, the temperature-stable electrical conductivity along with superior current carrying, thermal and mechanical performances can be utilized for associated applications, such as for scaled down connectors and / or bonding wires, spacers, heat sink and other thermal management components.
[0156] Application example
[0157] The materials proposed according to the present invention can be directly applied as replacement for commonly used highly conductive materials, such as copper or aluminum, in electrical device windings, such as in motors, transformers, and the like, as well as in microelectronic applications, such as interconnects, vias, and the like.
[0158] In the following application example, a structure of the high entropy alloy composite conductor 100 according to the example of FIG. 2F has been employed. As materials graphene was used as electrically conductive carbon material 103, copper was used as an electrically conductive metal 105, and AlCoCrFeNi was used as a high entropy alloy (HEA) 101. As can been in the following table, the content of AlCoCrFeNi in the material was varied between 0 wt. -%and 40 wt. -%, while the concentration of graphene in the material was varied between 0 wt. -%and 40 wt. -%, such that the sum of the concentration of HEA and graphene is less than 50 wt. -%.
[0159] From rule of mixtures, Voigt model, calculations, 5 wt. -%to 8 wt. -%graphene and 1 wt. -%to 11 wt. -%of AlCoCrFeNi is predicted to lead to up to 17%reduction in resistivity and 20-25%reduction in TCR compared to the neat metal, which is copper in this example. Higher wt. -%of graphene can lead to further improvements –for example, 34%reduction in resistivity and 47%reduction in TCR. Application of these materials according to the present invention in an induction motor winding is predicted to increase the efficiency by up to 8%.
[0160] Table
[0161] Summarizing, the proposed idea is a new materials concept using HEA-conductive carbon material-metal composites for achieving temperature-stable composite conductors, which have a low electric resistivity in combination with low TCR.
[0162] Materials according to the present invention can be applied as a replacement to conventional metal conductors for improved reliability, performance and efficiencies in electrical and electronic devices.
[0163] The new material according to the present invention employs small amounts of HEA 101 and nanocarbons and minimizes the use of novel materials as additives, and can be advantageous to the cost-performance ratio.
[0164] The processing methods of the present invention are in tune with established techniques for macroscale applications, such as metallurgical techniques, for example melt processing, milling, and the like and microscale applications, such as physical vapor deposition, sputtering, electrodeposition, and the like.
[0165] The present invention enhances processability and interaction of conductive carbon materials 103 with metals 105 hitherto considered a major challenge due to surface energy, density and chemical affinity differences between the conductive carbon materials 103 and conventional metals.
[0166] The present invention uses HEAs 101 as an interfacial enhancer to improve processability, such as industrially relevant processing like melt casting, and the like, by coating low density conductive carbon materials 103 with higher density HEAs 101, in particular with a density of more than 7 g / cm3.
[0167] According to the present invention, HEAs 101 can be crystallographically designed to match neat metal and conductive carbon lattices.
[0168] According to the present invention, HEAs 101 usually contain at least one chemical element, such as manganese, titanium, cobalt, chromium, iron, nickel, and the like, with affinity to carbon.
[0169] The present invention also provides superior mechanical, thermal, and current carrying capacities, thereby expanding the application capability of the materials.
[0170] In the several examples provided in the present invention, it should be understood that the disclosed apparatus, and method may be implemented in other manners.
[0171] REFERENCE SIGNS
[0172] 100 High entropy alloy composite conductor
[0173] 101 Electrically conductive high entropy alloy
[0174] 103 Electrically conductive carbon material
[0175] 105 Electrically conductive metal
Claims
1.A high entropy alloy composite conductor (100) having an electric resistivity at room temperature of less than 200 ·cm as measured by the norm ASTM B0193-20, the high entropy alloy composite conductor (100) having a temperature coefficient of resistivity (TCR) of less than 4000 ppm / K as measured by the norm ASTM B0070-90R19, and the high entropy alloy composite conductor (100) comprising at least one of the following selections (a) , and / or (b) and / or (c) :(a) a matrix comprising at least one electrically conductive high entropy alloy (101) , and a filler comprising at least one electrically conductive carbon material (103) ;(b) a matrix comprising at least one electrically conductive metal (105) , and a filler comprising at least one electrically conductive high entropy alloy (101) or the filler comprising at least one electrically conductive high entropy alloy (101) and an electrically conductive carbon material (103) ;(c) a composite comprising a core comprising at least one electrically conductive carbon material (103) and an outer shell disposed radially outwards of the core, the outer shell comprising at least one electrically conductive metal (105) and at least one electrically conductive high entropy alloy (101) .2.The high entropy alloy composite conductor (100) of claim 1, the high entropy alloy composite conductor (100) having an electric resistivity at room temperature of less than 100 μΩ ·cm as measured by the norm ASTM B0193-20, preferably less than 50 μΩ ·cm, more preferably less than 10 μΩ ·cm, even more preferably less than 5 μΩ ·cm, even further more preferably less than 3 μΩ ·cm, most preferably less than 2 μΩ ·cm, and even most preferably less than 1 μΩ ·cm.3.The high entropy alloy composite conductor (100) of claim 1 or 2, the high entropy alloy composite conductor (100) having an electric conductivity at room temperature of more than 0.005 MS / cm as measured by the norm ASTM B0193-20, preferably more than 0.01 MS / cm, more preferably more than 0.1 MS / cm, even more preferably more than 0.25 MS / cm, even further more preferably more than 0.4 MS / cm, most preferably more than 0.5 MS / cm, and even most preferably more than 0.6 MS / cm, and even further most preferably more than 1.0 MS / cm.4.The high entropy alloy composite conductor (100) of any of claims 1 to 3, the high entropy alloy composite conductor (100) having a temperature coefficient of resistivity (TCR) of less than 3000 ppm / K as measured by the norm ASTM B0070-90R19, preferably less than 2000 ppm / K, more preferably less than 1000 ppm / K, even more preferably less than 500 ppm / K, even further more preferably less than 100 ppm / K, most preferably less than 10 ppm / K, even most preferably less than 5 ppm / K, and even further most preferably less than 1 ppm / K.5.The high entropy alloy composite conductor (100) of any of claims 1 to 4, wherein the electrically conductive high entropy alloy (101) is a multicomponent material comprising dual or multiple phases including at least one intermetallic phase, wherein the multicomponent material in particular comprises at least four different chemical elements, preferably at least five different chemical elements.6.The high entropy alloy composite conductor (100) of any of claims 1 to 5, wherein the electrically conductive high entropy alloy (101) comprises at least four, preferably at least five, of the following chemical elements comprising copper, aluminum, cobalt, nickel, manganese, chromium, titanium, iron, silicon, tantalum, zirconium, niobium, hafnium, and vanadium.7.The high entropy alloy composite conductor (100) of any of claims 1 to 6, wherein the electrically conductive high entropy alloy (101) comprises the following materials AlxCoFeNi, wherein x is selected from 0.1 to 2.1, CoFeNiSiy, wherein y is selected from 0.1 to 1.1, AluCoCrFeNi, wherein u is selected from 0.1 to 4.1, FeCoNi (MnAl) v, wherein v is selected from 0.1 to 2.1, CuwCrFeTiV, wherein w is selected from 0.1 to 1.1, (TaNb) 2z (HfZrTi) z, wherein z is selected from 0.1 to 2.1, AlCoCrCuaFeNi, wherein a is selected from 0.1 to 2.1.8.The high entropy alloy composite conductor (100) of any of claims 1 to 7, wherein the electrically conductive high entropy alloy (101) is present in the high entropy alloy composite conductor (100) from 0.1 wt. -%to 50 wt. -%based on the total weight of the high entropy alloy composite conductor (100) , preferably from 0.1 to 25 wt. -%, more preferably from 0.1 to 10 wt. -%.9.The high entropy alloy composite conductor (100) of any of claims 1 to 8, wherein the electrically conductive high entropy alloy (101) is adapted to facilitate electron transport through the electrically conductive carbon material (103) , in particular by formation of a carbide compound.10.The high entropy alloy composite conductor (100) of any of claims 1 to 9, wherein the electrically conductive carbon material (103) comprises single, bi, tri or multilayer graphene, graphene oxide, reduced graphene oxide, nanographene, wherein for nanographene it is preferred that at least one lateral dimension of nanographene is smaller than 100 nm, functionalized forms of graphene, intercalated graphite, graphite oxide, carbon nanotubes, preferably single wall, double wall, triple wall, or multi wall carbon nanotubes, and / or carbons with doping, intra-lattice functionalization and extra-lattice functionalization.11.The high entropy alloy composite conductor (100) of any of claims 1 to 10, wherein the electrically conductive carbon material (103) is present as ensembles, preferably as carbon nanotube bundles or graphene stacks, which more preferably form ribbons, sheets, platelets and / or wires.12.The high entropy alloy composite conductor (100) of any of claims 1 to 11, wherein the electrically conductive carbon material (103) is present as individual entities, preferably as individual carbon nanotubes or individual graphene sheets, wherein more preferably the individual entities being selected as carbon nanotubes have diameters ranging from 0.1 nm to 500 nm and lengths from 1 nm to 10 cm, and / or wherein more preferably the individual entities being selected as graphene sheets have lateral dimensions from 10 nm to 10 cm and a thickness in the range 0.335 nm to 10 nm.13.The high entropy alloy composite conductor (100) of any of claims 1 to 12, wherein the electrically conductive carbon material (103) is adapted as a functionalized electrically conductive carbon material (103) , which is adapted to bind to the electrically conductive high entropy alloy (101) and / or to the electrically conductive metal (105) , wherein preferably the functionalization adaptation is selected as intra and / or extra-lattice covalent or non-covalent functionalization with O-, N-, containing groups comprising hydroxy, amine, amide, ether, carboxyl, ester groups, and / or wherein preferably the functionalization adaptation comprises doping with acids, superacids, halogen-based and / or polymeric molecules.14.The high entropy alloy composite conductor (100) of any of claims 1 to 13, wherein the electrically conductive metal (105) comprises copper, aluminium, silver, gold, iron, and alloys thereof.15.The high entropy alloy composite conductor (100) of any of claims 1 to 14, the high entropy alloy composite conductor (100) further comprising an interlinking agent.16.The high entropy alloy composite conductor (100) of any of claims 1 to 15, wherein for selection (b) the filler, which is selected as at least one electrically conductive high entropy alloy (101) , is present as nanoparticles wherein one dimension of the nanoparticles preferably is between 0.1 nm and 1000 nm or as microparticles wherein one of the dimensions of the microparticles is preferably between 1 μm to 1000 μm.17.The high entropy alloy composite conductor (100) of any of claims 1 to 16, wherein for selection (b) the filler is selected as at least one electrically conductive high entropy alloy (101) and as at least one electrically conductive carbon material (103) , wherein the electrically conductive high entropy alloy (101) is coated on the electrically conductive carbon material (103) .18.The high entropy alloy composite conductor (100) of any of claims 1 to 17, wherein for selection (c) the outer shell comprises an interface region, which is in contact with the core of electrically conductive carbon material (103) , and wherein the outer shell comprises an outer region, which is separated from the core, wherein the interface region and / or the outer region comprise the at least one electrically conductive metal (105) , and / or the at least one electrically conductive high entropy alloy (101) .19.The high entropy alloy composite conductor (100) of claim 18, wherein according to selection(c1) the interface region exclusively consists of the at least one electrically conductive high entropy alloy (101) and the outer region exclusively consists of the at least one electrically conductive metal (105) ; or(c2) the interface region comprises the at least one electrically conductive high entropy alloy (101) and the at least one electrically conductive metal (105) , and the outer region comprises the at least one electrically conductive high entropy alloy (101) and the at least one electrically conductive metal (105) ; or(c3) the interface region comprises the at least one electrically conductive high entropy alloy (101) and the at least one electrically conductive metal (105) , and the outer region exclusively consists of the at least one electrically conductive metal (105) ; or(c4) the interface region exclusively consists of the at least one electrically conductive high entropy alloy (101) , and the outer region comprises the at least one electrically conductive high entropy alloy (101) and the at least one electrically conductive metal (105) ; or(c5) the interface region exclusively consists of the at least one electrically conductive metal (105) , and the outer region comprises the at least one electrically conductive high entropy alloy (101) and the at least one electrically conductive metal (105) .20.The high entropy alloy composite conductor (100) of any of claims 1 to 17, wherein for selection (c) the outer shell is in direct contact with the core and comprises at least one electrically conductive metal (105) and the at least one electrically conductive high entropy alloy (101) .21.The high entropy alloy composite conductor (100) of any of claims 1 to 17, wherein for selection (c) the high entropy alloy composite conductor (100) comprises at least two cores, which are separated from each other by an innermost layer, which is comprised of at least one electrically conductive metal (105) , wherein the innermost layer is separated from the respective core by an intermediate layer, which is comprised of at least one electrically conductive high entropy alloy (101) , wherein radially outwards of each of the two (or more) cores an respective additional intermediate layer is formed, which is comprised of at least one electrically conductive high entropy alloy (101) , and wherein radially outwards of each of the additional intermediate layer the outer shell is formed, which is comprised of at least one electrically conductive metal (105) .22.The high entropy alloy composite conductor (100) of any of claims 1 to 17, wherein for selection (c) the outer shell comprises an interface region, which is in contact with the core, and wherein the outer shell comprises an outer region, which is separated from the core, wherein the interface region and / or outer region comprise the at least one electrically conductive metal (105) and / or the at least one electrically conductive high entropy alloy (101) .23.The high entropy alloy composite conductor (100) of any of claims 1 to 17, wherein the high entropy alloy composite conductor (100) comprises a composite according to selection (c) comprising a core comprised of an electrically conductive carbon material (103) , preferably graphene, and an outer shell disposed radially outwards of the core, the outer shell comprising at least one electrically conductive metal (105) , preferably copper, and from 0.01 wt. -%to 25 wt. -%of at least one electrically conductive high entropy alloy (101) , preferably AlxCoCrFeNi.24.The high entropy alloy composite conductor (100) of any of claims 1 to 23, wherein the high entropy alloy composite conductor (100) is formed as a conductive bar, a conductive rod, a conductive wire, a conductive sheet, or a conductive microscale structure, in particular as conductive vias, conductive planar and / or vertical interconnects.25.Use of the high entropy alloy composite conductor (100) of any of claims 1 to 24 for the manufacturing of a winding in an electric device, in particular an electric motor, or an electric transformer or an electric generator, in electrical and electronic circuitry such as vias and / or planar or vertical interconnects, in power devices to carry electrical current, such as busbars in switchgear, distribution boards, bus ducts, battery banks, and the like.
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