Wavelength measurement chip and wavelength measurement system

Abstract

A wavelength measurement chip (11) is provided. The wavelength measurement chip (11) includes an optical splitter (112) configured to receive a first electromagnetic wave signal and split the first electromagnetic wave signal into two electromagnetic wave signals for output, and a first interferometer (113) and a second interferometer (114), where the optical splitter (112), the first interferometer (113), and the second interferometer (114) are sequentially coupled, and the first interferometer (113) and the second interferometer (114) are configured to receive one of the two electromagnetic wave signals, so that one electromagnetic wave signal is interfered twice to output a plurality of second electromagnetic wave signals. The other of the two electromagnetic wave signals is output as a third electromagnetic wave signal, and the second electromagnetic wave signal and the third electromagnetic wave signal can be used to obtain wavelength information of the first electromagnetic wave signal by optical-electrical conversion. A wavelength measurement system (10) is further provided.

Description

[Technical field]

[0001] The present invention relates to the field of optical chips, and more particularly to a wavelength measurement chip and a wavelength measurement system to which the same is applied. [Background technology]

[0002] A wavemeter is a measurement tool commonly used in microwave measurements and is configured to measure the wavelength or frequency of a microwave signal source (e.g., an electromagnetic wave).

[0003] Conventional wavemeters are stand-alone instruments that include an optical path structure that is made up of multiple separate components such as lenses, curved mirrors, optical fibers, gratings, etc. In one aspect, the multiple separate components cause the conventional wavemeters to have a large size and high space occupation. In another aspect, the multiple separate components cause the conventional wavemeters to have an overall low level of integration and poor device reliability. Summary of the Invention [Means for solving the problem]

[0004] One aspect of the present application is an optical splitter configured to receive a first electromagnetic wave signal and split the first electromagnetic wave signal into two electromagnetic wave signals for output; a first interferometer and a second interferometer, the first interferometer and the second interferometer being sequentially coupled to each other, the first interferometer and the second interferometer being configured to receive one of two electromagnetic wave signals, such that the one electromagnetic wave signal is interfered with twice to output a plurality of second electromagnetic wave signals; The present invention provides a wavelength measurement chip including:

[0005] The other of the two electromagnetic wave signals is output as a third electromagnetic wave signal, and the second electromagnetic wave signal and the third electromagnetic wave signal can be used to obtain wavelength information of the first electromagnetic wave signal by optical-to-electrical conversion.

[0006] The wavelength measuring chip includes a substrate, an optical splitter, a first interferometer, and a second interferometer disposed on the substrate. The wavelength measuring chip is configured to receive a first electromagnetic signal, output a plurality of second electromagnetic signals and a third electromagnetic signal based on the first electromagnetic signal, convert the second electromagnetic signal and the third electromagnetic signal into an electrical signal, and obtain wavelength information of the first electromagnetic signal based on the electrical signal. The wavelength measuring chip does not need to establish a complex optical system. Compared with the wavelength meter of the prior art, the wavelength measuring chip has a simpler structure, which is conducive to reducing the size and the occupied space. In addition, the components in the wavelength measuring chip have a compact structure, which is further conducive to improving the reliability of the wavelength measuring chip.

[0007] In some embodiments, the wavelength measurement chip defines a first path and a second path, two electromagnetic wave signals are transmitted in the first path and the second path, respectively, and a loss of the electromagnetic wave propagated in the first path is greater than a loss of the electromagnetic wave propagated in the second path.

[0008] The optical splitter splits the first electromagnetic wave signal into two electromagnetic wave signals according to a preset ratio for output, where the ratio of the electromagnetic wave signal propagating in the first path in the first electromagnetic wave is greater than the ratio of the electromagnetic wave signal propagating in the second path in the first electromagnetic wave.

[0009] The specific value of the preset ratio is determined based on the optical losses of the first and second paths. Compared with the electromagnetic wave propagation in the second path, the electromagnetic wave propagation in the first path has a higher intensity loss. Therefore, in this embodiment, the optical splitter makes the intensity ratio of the electromagnetic wave signal output to the first path in the first electromagnetic wave greater than the intensity ratio of the electromagnetic wave signal output to the second path in the first electromagnetic wave, so as to balance the difference between the intensity loss of the electromagnetic wave signal in the first path and the intensity loss of the electromagnetic wave signal in the second path.

[0010] In some embodiments, the first path includes a first interferometer and a second interferometer.

[0011] The first path includes a first interferometer and a second interferometer. When propagating in the first path, the electromagnetic wave signal needs to pass through more components than the electromagnetic wave signal passes through when propagating in the second path. Therefore, compared with the propagation of the electromagnetic wave in the first path, the propagation of the electromagnetic wave in the second path has a higher intensity loss. By the optical splitter, the intensity ratio of the electromagnetic wave signal outputted to the first path of the first electromagnetic wave is set to be higher than the intensity ratio of the electromagnetic wave signal outputted to the second path of the first electromagnetic wave, so as to balance the difference between the intensity loss of the electromagnetic wave signal in the first path and the intensity loss of the electromagnetic wave signal in the second path.

[0012] In some embodiments, the first interferometer is a Mach-Zehnder interferometer and the second interferometer is a multimode interferometer.

[0013] In some embodiments, there is a preset phase shift between the multiple second electromagnetic wave signals output by the second interferometer, and the preset phase shift between the multiple second electromagnetic wave signals can be adjusted by adjusting the amount of the second electromagnetic waves output by the second interferometer.

[0014] The preset phase shift between the multiple second electromagnetic wave signals can be adjusted by adjusting the amount of the second electromagnetic wave output by the second interferometer, and the more the amount of the second electromagnetic wave, the more accurate the wavelength measurement.

[0015] In some embodiments, the second interferometer outputs four second electromagnetic wave signals, and the preset phase shift between the four electromagnetic wave signals is π / 2.

[0016] In some embodiments, a coupler is further included, the coupler configured to receive the first electromagnetic wave and transmit the first electromagnetic wave to the optical splitter.

[0017] The manner in which the coupler is arranged to receive the first electromagnetic wave signal and send the first electromagnetic wave signal to the optical splitter is more suitable for reducing the input loss of the first electromagnetic wave signal, thereby improving the accuracy of the wavelength information measured by the wavelength measuring chip.

[0018] In some embodiments, a higher order mode filter is further included, the higher order mode filter being coupled between the optical splitter and the first interferometer.

[0019] The high-order mode filter can reduce the high-order modes of the electromagnetic wave transmitted in the first path. The placement of the high-order mode filter helps to improve the extinction ratio of the interferometer in the first path, thereby further improving the accuracy of the wavelength information measured by the wavelength-measuring chip.

[0020] In some embodiments, the optical splitter, the first interferometer, and the second interferometer form a substrate.

[0021] Another aspect of the present application is a method for producing a method for manufacturing a semiconductor device comprising the steps of: A wavelength-measuring chip, the wavelength-measuring chip being the wavelength-measuring chip according to any one of the preceding items; and a photoelectric detector coupled to the wavelength-measuring chip, configured to receive the second electromagnetic wave signal and the third electromagnetic wave signal, and convert the second electromagnetic wave signal and the third electromagnetic wave signal into an electrical signal. a processor electrically connected to the photoelectric detector and configured to obtain wavelength information of the first electromagnetic wave signal based on the electrical signal; A wavelength measurement system is provided, comprising:

[0022] The wavelength measurement system provided in this embodiment of the present application includes a wavelength measurement chip. The wavelength measurement chip includes a substrate, an optical splitter, a first interferometer, and a second interferometer disposed on the substrate. The wavelength measurement chip is configured to receive a first electromagnetic wave signal, and output a plurality of second electromagnetic wave signals and a third electromagnetic wave signal based on the first electromagnetic wave signal. The wavelength measurement system further includes a photoelectric detector and a processor electrically connected to each other, the second electromagnetic wave signal and the third electromagnetic wave signal are converted into an electrical signal by the photoelectric detector, and the wavelength information of the first electromagnetic wave signal is obtained by the processor based on the electrical signal. The wavelength measurement system does not need to establish a complex optical system. Compared with the prior art wavemeter, the wavelength measurement system has a simpler structure, which is conducive to reducing the size and the occupied space. In addition, the components in the wavelength measurement chip 11 have a compact structure, which is further conducive to improving the reliability of the wavelength measurement system.

[0023] In some embodiments, the processor is configured to obtain a plurality of wavelength values ​​based on the plurality of second electromagnetic wave signals output by the second interferometer, and to determine a wavelength value as the wavelength value of the first electromagnetic wave signal from the plurality of wavelength values ​​based on the third electromagnetic wave signal output by the optical splitter.

[0024] The spectral images are regularly and periodically arranged, and the determined signal intensities can correspond to a plurality of wavelength values, and the wavelength values ​​can be uniquely determined based on the third electromagnetic wave signal output by the optical splitter.

[0025] In some embodiments, the photodetector has a sensing area and the wavelength measuring chip has a coupling surface for outputting the second electromagnetic wave signal and the third electromagnetic wave signal, the coupling surface being parallel to a plane in which the sensing area is located.

[0026] In this way, the transmission direction of the second electromagnetic wave signal and the third electromagnetic wave signal is perpendicular to the coupling plane, i.e. perpendicular to the sensing area. In this case, the second electromagnetic wave signal and the third electromagnetic wave signal can be directly incident on the photoelectric detector after being output from the coupling plane, and the transmission direction of the second electromagnetic wave signal and the third electromagnetic wave signal does not need to be specially changed.

[0027] In some embodiments, the photodetector has a sensing area, and a plane in which the sensing area is located is parallel to a plane in which the second electromagnetic wave and the third electromagnetic wave signal propagate on the wavelength measuring tip.

[0028] In this way, the wavelength-measuring chip, the photodetector, and the processor are stacked in sequence, and there is no protruding structure perpendicular to the direction of the wavelength-measuring chip, which helps to simplify the subsequent packaging process. [Brief description of the drawings]

[0029] [Figure 1] FIG. 2 is a schematic diagram showing the propagation process of an electromagnetic wave. [Diagram 2] FIG. 2 is a schematic diagram of a modular structure of a wavelength measurement system according to an embodiment of the present application. [Diagram 3] 3 is a schematic diagram showing a planar structure of the wavelength measuring chip of FIG. 2. [Figure 4] 4 is a schematic diagram of the spectrum of the electromagnetic wave output by the first interferometer of FIG. 3. [Diagram 5] FIG. 1 is a schematic diagram of a structure of a wavelength measurement system according to an embodiment of the present application. [Figure 6] FIG. 2 is a schematic diagram of a structure of a wavelength measurement system according to a modified embodiment of the present application. [Figure 7] FIG. 2 is a schematic diagram of a structure of a wavelength measurement system according to another modified embodiment of the present application. [Figure 8] 4 is a schematic diagram of the spectrum of the electromagnetic wave output by the second interferometer of FIG. 3. [Figure 9] 3 is a schematic diagram of another planar structure of the wavelength measuring chip of FIG. 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] The following describes embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application.

[0031] As shown in FIG. 1, the horizontal axis indicates the propagation direction of the electromagnetic wave, and the vertical axis indicates the vibration direction of the electromagnetic wave. The wavelength λ of the electromagnetic wave is defined as the propagation distance of the electromagnetic wave in an oscillation period. In other words, the wavelength λ of the electromagnetic wave is the distance between two adjacent points whose oscillation phase difference along the propagation direction of the electromagnetic wave is 2π. For example, as shown in FIG. 1, the distance between two adjacent peaks is one wavelength, and the distance between two adjacent troughs is one wavelength.

[0032] As shown in FIG. 2, a wavelength measurement system 10 provided in an embodiment is configured to measure the wavelength of an electromagnetic wave, and can be applied to scenarios such as ultra-dense wavelength division multiplexing systems, wavelength selective switches, and lasers.

[0033] The wavelength measurement system 10 includes a wavelength measurement chip 11, a plurality of photoelectric detectors 12, and a processor 13. The photoelectric detectors 12 are connected to the wavelength measurement chip 11 and are electrically connected to the processor 13. The wavelength measurement chip 11 is configured to receive a first electromagnetic wave signal and output a plurality (in this application, "plurality" means two or more) of second and third electromagnetic wave signals based on the first electromagnetic wave signal. The photoelectric detectors 12 are configured to receive the plurality of second and third electromagnetic wave signals and generate an electrical signal based on the plurality of second and third electromagnetic wave signals. The processor 13 is configured to obtain wavelength information of the first electromagnetic wave signal based on the electrical signal.

[0034] The wavelength-measuring chip 11 is a wavelength-measuring chip based on a planar optical waveguide. As shown in FIG. 3, the wavelength-measuring chip 11 includes an optical splitter 112, a first interferometer 113, and a second interferometer 114.

[0035] According to various propagation paths of the first electromagnetic wave signal, the wavelength measuring chip 11 defines a first path and a second path. In this embodiment, the first path includes a first interferometer 113 and a second interferometer 114. The first path further includes a waveguide structure (not shown in FIG. 3) coupled between adjacent components (e.g., between the optical splitter 112 and the first interferometer 113, and between the first interferometer 113 and the second interferometer 114) for guiding the electromagnetic wave signal. In this embodiment, the second path includes a waveguide structure (not shown in FIG. 3) for guiding the electromagnetic wave signal. The above-mentioned waveguide structure is a waveguide structure having a high refractive index difference. Specifically, the above-mentioned waveguide structure includes a waveguide core layer and a cladding layer covering the waveguide core layer separately. Both the core layer and the cladding layer are made of silicon oxide material, but the core layer is doped, so that the refractive index of the core layer is higher than that of the cladding layer. Thus, the waveguide structure is capable of guiding electromagnetic waves.

[0036] The optical splitter 112 is a Y-shaped optical splitter configured to receive a first electromagnetic wave signal and split the first electromagnetic wave signal into two electromagnetic wave signals for output, one of which is directed to a first path and the other of which is directed to a second path.

[0037] The optical splitter 112 performs splitting according to a preset ratio to obtain two electromagnetic wave signals. In other words, the intensities of the two electromagnetic wave signals are in a preset ratio. For example, the ratio of the intensity of the electromagnetic wave signal output by the optical splitter 112 to the first path to the intensity of the electromagnetic wave signal output by the optical splitter 112 to the second path is equal to 9:1 or 5:5. In the present application, the specific preset ratio is not limited.

[0038] The specific value of the preset ratio is determined based on the optical losses of the first path and the second path. In this embodiment, the first path includes the first interferometer 113, the second interferometer 114, and the waveguide structure 115, and the second path includes only the waveguide structure 116. Therefore, when propagating in the first path, the electromagnetic wave signal needs to pass through more components than the electromagnetic wave signal passes through when propagating in the second path, and compared with the propagation of the electromagnetic wave in the first path, the propagation of the electromagnetic wave in the second path has a higher intensity loss. Therefore, in this embodiment, the optical splitter 112 makes the intensity of the electromagnetic wave signal output to the first path greater than the intensity of the electromagnetic wave signal output to the second path; in other words, the optical splitter 112 makes the intensity proportion of the electromagnetic wave signal output to the first path greater than the intensity proportion of the electromagnetic wave signal output to the second path in the first electromagnetic wave, thereby balancing the difference between the intensity loss of the electromagnetic wave signal on the first path and the intensity loss of the electromagnetic wave signal on the second path.

[0039] The electromagnetic wave signal output to the first path is sequentially guided to the first interferometer 113 and the second interferometer 114 by the waveguide structure 115. In one embodiment, the first interferometer 113 is a Mach-Zehnder interferometer (MZI). The first interferometer 113 is configured to receive an electromagnetic wave signal and generate interference on the electromagnetic wave signal to output two electromagnetic wave signals based on the electromagnetic wave signal. The spectra of the two electromagnetic wave signals output by the first interferometer 113 are shown in FIG. 4. In FIG. 4, the abscissa indicates the wavelength and the ordinate indicates the signal intensity.

[0040] Also, as shown in Fig. 3, the two electromagnetic wave signals output by the first interferometer 113 are transmitted to the second interferometer 114. In one embodiment, the second interferometer 114 is a multimode interferometer (MMI). The second interferometer 114 is configured to receive two electromagnetic wave signals and cause interference between the two electromagnetic wave signals to output four electromagnetic wave signals. The electromagnetic wave signal output by the second interferometer 114 is defined as the above-mentioned second electromagnetic wave signal.

[0041] In other embodiments, the amount of input signals of the second interferometer 114 need not be two, and the amount of output signals of the second interferometer 114 need not be four. For example, in one embodiment, the second interferometer 114 may have four inputs and six outputs, in another embodiment, the second interferometer 114 has two inputs and two outputs, and in yet another embodiment, the second interferometer 114 has four inputs and four outputs.

[0042] There is a preset phase shift between the multiple second electromagnetic wave signals output by the second interferometer 114. Specifically, the multiple second electromagnetic wave signals output by the second interferometer 114 are numbered sequentially as 1, 2, 3, ..., and there is a preset phase shift between two second electromagnetic wave signals whose numbers are adjacent (for example, number 1 is adjacent to number 2, and number 2 is adjacent to number 3). Also, in this embodiment, the preset phase shift between two second electromagnetic wave signals whose numbers are adjacent is the same.

[0043] In this embodiment, the second interferometer 114 outputs four second electromagnetic wave signals, and there is a preset phase shift of π / 2 between the four second electromagnetic wave signals in sequence. If the second interferometer 114 has two outputs, there is a preset phase shift of π between the two second electromagnetic wave signals. If the second interferometer 114 has six outputs, there is a preset phase shift of π / 3 between the six second electromagnetic wave signals in sequence. Specifically, in the second electromagnetic wave signals output by the second interferometer 114, the maximum phase shift is 2π. Therefore, the preset phase shift between the second electromagnetic wave signals can be adjusted by adjusting the amount of the second electromagnetic wave signals output by the second interferometer 114. When the maximum phase shift between the multiple second electromagnetic wave signals output by the second interferometer 114 is fixed, the greater the amount of the second electromagnetic wave signals output by the second interferometer 114, the smaller the preset phase shift between two adjacent second electromagnetic wave signals.

[0044] The second interferometer 114 outputs at least two second electromagnetic wave signals. The more second electromagnetic wave signals the second interferometer 114 outputs, the more accurate the wavelength information of the first electromagnetic wave signal measured by the wavelength measurement system 10.

[0045] In this embodiment, the four second electromagnetic wave signals may be transmitted to the photoelectric detector 12. The electromagnetic wave signals of the second path are propagated using the waveguide structure 116 and transmitted as third electromagnetic wave signals to the photoelectric detector 12. The photoelectric detector 12 is configured to convert the received second and third electromagnetic wave signals separately into electrical signals by photoelectric conversion.

[0046] 5, in this embodiment, the processor 13 is disposed on a printed circuit board (PCB) 20. Conductive wires (not shown) are formed on the PCB 20, and the multiple photoelectric detectors 12 are electrically connected to the processor 13 via the conductive wires. The processor 13 is configured to receive the electrical signals generated by the photoelectric detectors 12, and is configured to obtain the wavelength of the first electromagnetic wave signal based on the electrical signals using a preset algorithm.

[0047] An end face on the wavelength measurement chip 11 that is coupled to the multiple photoelectric detectors 12 (i.e., the end face for outputting the second electromagnetic wave signal and the third electromagnetic wave signal) is defined as a coupling surface S1. Each photoelectric detector 12 has a sensing region S2. The sensing region S2 is a region on the photoelectric detector 12 that can effectively receive the electromagnetic wave signal for photoelectric conversion. In order to effectively utilize the area of ​​the sensing region S2, it is necessary to align the region where the coupling surface S1 outputs the second electromagnetic wave signal and the third electromagnetic wave signal with the sensing region S2 as much as possible.

[0048] In this embodiment, based on meeting the above matching requirements, the coupling manner between the photoelectric detector 12 and the wavelength-measuring chip 11 is further set to adjust the packaging difficulty of the wavelength-measuring chip 11.

[0049] 5, in this embodiment, the photoelectric detector 12 is disposed on the PCB 20, and the plane on which the sensing region S2 of the photoelectric detector 12 is located is parallel to the plane on which the second electromagnetic wave and the third electromagnetic wave signal propagate on the wavelength-measuring chip 11. The transmission direction of the second electromagnetic wave signal and the third electromagnetic wave signal output by the wavelength-measuring chip 11 needs to be changed on the coupling surface S1 so that the second electromagnetic wave signal and the third electromagnetic wave signal are incident on the photoelectric detector 12 in a direction facing the sensing region S2 of the photoelectric detector 12. In this case, the coupling surface S1 is an inclined surface.

[0050] Figure 6 shows another structure of the binding surface S1. The structure of the binding surface S1 shown in Figure 6 is similar to the structure of the binding surface S1 shown in Figure 5. The difference is that the inclination direction of the binding surface S1 is different. The details will not be described again.

[0051] 7 shows yet another structure of the coupling surface S1. In FIG. 7, the coupling surface S1 is arranged parallel to the plane on which the sensing region S2 of the photoelectric detector 12 is located. The transmission directions of the second electromagnetic wave signal and the third electromagnetic wave signal are perpendicular to the coupling surface S1, i.e., perpendicular to the sensing region S2. In this case, the second electromagnetic wave signal and the third electromagnetic wave signal can be directly incident on the photoelectric detector 12 after being output from the coupling surface S1, and the transmission directions of the second electromagnetic wave signal and the third electromagnetic wave signal do not need to be changed.

[0052] 5 and 6, the positional relationship between the coupling surface S1 and the photoelectric detector 12 shown in Fig. 7 does not require changing the transmission direction of the second electromagnetic wave signal and the third electromagnetic wave signal on the coupling surface S1, which is helpful in simplifying the manufacturing process of the wavelength measuring chip 11.

[0053] In the structure shown in Figures 5 and 6, the wavelength-measuring chip 11, the photoelectric detector 12, and the PCB 20 are stacked in order, and there is no protruding structure perpendicular to the direction of the wavelength-measuring chip 11. However, in the structure shown in Figure 7, the height of the photoelectric detector 12 is higher than the height of the wavelength-measuring chip 11. Therefore, when the chip is packaged, there is a protruding structure perpendicular to the direction of the wavelength-measuring chip 11 at the position where the photoelectric detector 12 is located. Therefore, compared with the structure shown in Figure 7, the structures in Figures 5 and 6 are more suitable for packaging.

[0054] 7, the photoelectric detector 12 may be disposed at the same height as the packaged wavelength-measuring chip 11, usually by disposing a riser layer. In another embodiment, the photoelectric detector 12 and the packaged wavelength-measuring chip 11 are disposed at the same height, so that the second electromagnetic wave signal and the third electromagnetic wave signal are output to the sensing area S2 of the photoelectric detector 12 to maximize the use of the sensing area S2 of the photoelectric detector 12.

[0055] In this embodiment, the four second electromagnetic wave signals output by the second interferometer 114 may form a spectral image as shown in Fig. 8. In Fig. 8, the abscissa indicates wavelength and the ordinate indicates signal intensity. The spectral images of the four second electromagnetic wave signals are respectively displayed using four different lines.

[0056] As shown in FIG. 8, when a value λ1 is taken on the horizontal coordinate, the value λ1 on the horizontal coordinate corresponds to multiple vertical coordinates (i.e., one wavelength value corresponds to multiple intensity values). When the horizontal coordinate λ1 is determined, the multiple intensity values ​​corresponding to the horizontal coordinate λ1 are determined. However, it can be seen from FIG. 8 that the spectral image is regularly and periodically arranged, and λ1 corresponding to multiple intensity values ​​appears repeatedly once in each subsequent period. For example, the multiple intensity values ​​corresponding to λ2 in the next period are the same as the multiple intensity values ​​corresponding to λ1. Therefore, when determining a group of intensity values, the wavelength value cannot be uniquely determined.

[0057] In this embodiment, the wavelength value is uniquely determined based on the third electromagnetic wave signal output from the second path. The intensity of the third electromagnetic wave signal output from the second path is inversely proportional to the wavelength of the third electromagnetic wave signal, and there is a unique correspondence between the intensity and the wavelength value. When the photoelectric detector 12 acquires the signal intensity, the processor 13 can acquire a plurality of wavelength values ​​based on the spectrum shown in FIG. 8, and the processor 13 can acquire a unique wavelength value based on the intensity of the third electromagnetic wave signal output from the second path. Among the plurality of acquired wavelength values, the wavelength value closest to the acquired unique wavelength value is calibrated as the wavelength value of the first electromagnetic wave.

[0058] 9, the wavelength measurement chip 11 of this embodiment includes a substrate 111. The substrate 111 is made of a semiconductor material, for example, silicon oxide. The substrate 111 is configured to support an optical splitter 112, a first interferometer 113, a second interferometer 114, and waveguide structures 115 and 116.

[0059] The wavelength measuring chip 11 further includes a coupler 117 disposed on the substrate 111. The coupler 117 is a spot size converter grating (SSC grating). The coupler 117 is coupled to the optical splitter 112 using a waveguide structure. The coupler 117 is disposed close to the end face where the wavelength measuring chip 11 receives the first electromagnetic wave signal, and is configured to couple the first electromagnetic wave signal to the optical splitter 112. Compared with the manner in which the optical splitter 112 directly receives the first electromagnetic wave signal, the manner in which the coupler 117 receives the first electromagnetic wave signal and transmits the first electromagnetic wave signal to the optical splitter 112 is more suitable for reducing the input loss of the first electromagnetic wave signal, thereby improving the accuracy of the wavelength information measured by the wavelength measuring chip 11.

[0060] The wavelength measuring chip 11 of this embodiment further includes a high-order mode filter 118 disposed on the substrate 111. The high-order mode filter 118 is coupled between the optical splitter 112 and the first interferometer 113, and configured to reduce the high-order mode of the electromagnetic wave transmitted in the first path. The disposition of the high-order mode filter 118 helps to increase the extinction ratio of the interferometers in the first path (i.e., the first interferometer 113 and the second interferometer 114), thereby further improving the accuracy of the wavelength information measured by the wavelength measuring chip 11.

[0061] The wavelength measurement system 10 provided in this embodiment of the present application includes a wavelength measurement chip 11. The wavelength measurement chip 11 includes a substrate 111, an optical splitter 112, a first interferometer 113, and a second interferometer 114 arranged on the substrate 111. The wavelength measurement chip 11 is configured to receive a first electromagnetic wave signal, and output a plurality of second electromagnetic wave signals and a third electromagnetic wave signal based on the first electromagnetic wave signal. The wavelength measurement system 10 further includes a photoelectric detector 12 and a processor 13 electrically connected to each other, the second electromagnetic wave signal and the third electromagnetic wave signal are converted into an electrical signal by the photoelectric detector 12, and the wavelength information of the first electromagnetic wave signal is obtained by the processor 13 based on the electrical signal. The wavelength measurement chip 11 does not need to establish a complex optical system. Compared with the prior art wavemeter, the present wavelength measurement system has a simpler structure, which is conducive to reducing the size and the occupied space. In addition, the components in the wavelength-measuring chip 11 have a compact structure, which further helps to improve the reliability of the wavelength-measuring chip 11 and the wavelength-measuring system 10.

[0062] Those skilled in the art should realize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. Appropriate modifications and variations made to the above embodiments shall fall within the scope of protection of the present invention as long as they fall within the substantial scope of the present invention. [Explanation of symbols]

[0063] 10 Wavelength measurement system 11 Wavelength measurement chip 12 Photoelectric detector 13 Processors 20 Printed Circuit Board (PCB) 111 Substrate 112 Optical splitter 113 The First Interferometer 114 Second Interferometer 115 Waveguide structure 116 Waveguide structure 117 Coupler 118 Higher-order mode filter

Claims

1. an optical splitter configured to receive a first electromagnetic wave signal and split the first electromagnetic wave signal into two electromagnetic wave signals for output; a first interferometer and a second interferometer, the optical splitter, the first interferometer, and the second interferometer being sequentially coupled, the first interferometer and the second interferometer being configured to receive one of the two electromagnetic wave signals, such that the one electromagnetic wave signal is interfered with twice to output a plurality of second electromagnetic wave signals; a higher order mode filter coupled between the optical splitter and the first interferometer; Equipped with an optical chip defining a first path including the first interferometer and the second interferometer, and a second path, the two electromagnetic wave signals being transmitted in the first path and the second path, respectively; The other of the two electromagnetic wave signals is output as a third electromagnetic wave signal; the optical splitter splits the first electromagnetic wave signal into the two electromagnetic wave signals propagating through the first path and the second path according to a preset ratio for output, and the ratio of the electromagnetic wave signal propagating through the first path is greater than the ratio of the electromagnetic wave signal propagating through the second path so that an intensity loss of the electromagnetic wave signal propagating through the first path and an intensity loss of the electromagnetic wave signal propagating through the second path are balanced; Optical chip.

2. The optical chip of claim 1 , wherein the first interferometer is a Mach-Zehnder interferometer and the second interferometer is a multimode interferometer.

3. The optical chip of claim 2, wherein there is a preset phase shift between the plurality of second electromagnetic wave signals output by the second interferometer, and the preset phase shift between the plurality of second electromagnetic wave signals can be adjusted by adjusting the amount of the plurality of second electromagnetic wave signals output by the second interferometer.

4. The optical chip of claim 3 , wherein the second interferometer outputs four second electromagnetic wave signals, and a preset phase shift between the four electromagnetic wave signals is π / 2.

5. The optical chip of claim 1 , further comprising a coupler configured to receive the first electromagnetic wave signal and to transmit the first electromagnetic wave signal to the optical splitter.

6. The optical chip of claim 1 , wherein the optical splitter, the first interferometer, and the second interferometer form a substrate.

7. An optical chip according to any one of claims 1 to 6; a photoelectric detector coupled to the optical chip and configured to receive a second electromagnetic wave signal and a third electromagnetic wave signal and convert the second electromagnetic wave signal and the third electromagnetic wave signal into an electrical signal; a processor electrically connected to the photoelectric detector and configured to obtain wavelength information of the first electromagnetic signal based on the electrical signal; A wavelength measurement system comprising:

8. 8. The wavelength measurement system of claim 7, wherein the processor is configured to obtain a plurality of wavelength values ​​based on a plurality of second electromagnetic wave signals output by a second interferometer, and to determine a wavelength value as the wavelength value of the first electromagnetic wave signal from the plurality of wavelength values ​​based on a third electromagnetic wave signal output by an optical splitter.

9. 8. The wavelength measurement system of claim 7, wherein the photoelectric detector has a sensing area, and the optical chip has a coupling surface for outputting the second electromagnetic wave signal and the third electromagnetic wave signal, the coupling surface being parallel to a plane in which the sensing area is located.

10. 8. The wavelength measurement system of claim 7, wherein the photoelectric detector has a sensing area, and a plane in which the sensing area is located is parallel to a plane in which the second electromagnetic wave signal and the third electromagnetic wave signal propagate on the optical chip.

Images